An etching apparatus for thick copper PCB boards

Abstract

This invention belongs to the field of integrated circuit manufacturing technology and relates to an etching apparatus for thick copper PCB boards. It includes: a housing with material holes on both sides; a liquid delivery pipe on the upper side of the housing, connected to equidistantly distributed liquid distribution pipes; the liquid distribution pipes passing through the housing and connected to a spray pipe; equidistantly distributed nozzles on the lower side of the spray pipe; and an air delivery pipe on the upper side of the housing, connected to equidistantly distributed air distribution pipes; the air distribution pipes passing through the housing and connected to an air jet pipe, which guides the airflow downwards. This invention relies on the air jet pipe to apply a vertically downward airflow, utilizing the blowing of the airflow to exert a downward force on the PCB board. This eliminates the need for upper support rollers on the PCB board while maintaining the stability of the PCB board during the etching process, improving etching efficiency and etching uniformity.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to an etching apparatus for thick copper PCB boards. Background Technology

[0002] Thick copper PCBs refer to printed circuit boards with copper layer thicknesses significantly exceeding conventional standards. They are primarily used to carry high currents, reduce heat generation, and improve circuit reliability, making them suitable for high-power electronic devices. In the PCB manufacturing process, etching is a critical step. Its core is to use chemical reactions to selectively dissolve and remove the copper foil on the copper-clad laminate that is not protected by photoresist, thereby outlining a predetermined precision circuit pattern. In a typical etching operation, the etching solution is continuously applied to the conveyed board surface via a spray system, causing the exposed copper foil to be continuously chemically dissolved and removed. To ensure that the PCB board remains stable under the spray impact, the production line is often equipped with upper and lower double-layer support rollers to clamp and fix it. However, the upper support roller inevitably obstructs the complete coverage of the etching solution flow, creating etching blind spots in the area of ​​the board surface below. This results in uneven distribution of the etching solution and reduced contact efficiency, leading to low etching efficiency and uneven etching, which affects the geometric accuracy of the circuit and the overall yield of the product. Summary of the Invention

[0003] This invention provides an etching apparatus for thick copper PCB boards, which overcomes the shortcomings of the prior art, such as low etching efficiency and uneven etching caused by the obstruction of the support rollers during the etching process of the PCB board.

[0004] The technical solution is: an etching device for thick copper PCB boards, comprising: a housing, material holes on both sides of the housing, a liquid inlet pipe on the upper side of the housing, the liquid inlet pipe being connected to equally spaced distribution pipes, the distribution pipes passing through the housing and being connected to a spray pipe, the lower side of the spray pipe being connected to equally spaced nozzles, an air inlet pipe on the upper side of the housing, the air inlet pipe being connected to equally spaced air distribution pipes, the air distribution pipes passing through the housing and being connected to an air jet pipe, the air jet pipe being used to guide the airflow within it downwards, and multiple support mechanisms for supporting the circuit board being provided inside the housing.

[0005] Furthermore, all the spray pipes and all the jet pipes are staggered, and the horizontal height of the jet pipes is lower than that of the spray pipes.

[0006] Furthermore, the support mechanism includes: two symmetrically distributed mounting brackets, which are fixedly connected to the housing; and uniformly distributed support units between the two mounting brackets. Each support unit includes: a support shaft, which is disposed between the two mounting brackets; the support shaft is rotatably connected to multiple connecting sleeves, multiple connecting discs, and multiple support cylinders; all the connecting sleeves, all the connecting discs, and all the support cylinders are staggered on the support shaft; any two adjacent connecting sleeves, connecting discs, and support cylinders are fixedly connected to each other; the support cylinder is used to support the circuit board; both mounting brackets are provided with a power component for driving the rotation of the support cylinder; and the connecting discs and adjacent support cylinders are jointly provided with an adsorption component for adsorbing and fixing the circuit board.

[0007] Furthermore, the power assembly includes: a motor mounted on the mounting frame; a connecting sleeve near one end of the support shaft abutting against an adjacent support shaft; a sprocket is provided on the output shaft of the motor and the connecting sleeve near the other end of the support shaft; the sprocket is rotatably connected to an adjacent mounting frame; and a chain is wound around all the sprockets on the same mounting frame.

[0008] Furthermore, the adsorption assembly includes: an inner fixed cylinder rotatably connected to the adjacent support cylinder and splinedly connected to the adjacent support shaft; an elastic bladder is fixedly connected to the inner side of the inner fixed cylinder; several communicating holes are provided on the periphery of the support cylinder; suction holes and venting holes are respectively provided on the upper and lower sides of the inner fixed cylinder; a first through hole is provided on the elastic bladder near the adjacent suction hole and the adjacent venting hole; the elastic bladder communicates with the adjacent suction hole and the adjacent venting hole through two first through holes; the suction hole and the venting hole are used to communicate with the corresponding part of the communicating holes; and a ring-shaped extrusion column is rotatably connected to the side of the connecting plate near the adjacent support cylinder via a connecting rod; the extrusion column is used to extrude the adjacent elastic bladder.

[0009] Furthermore, the central angle corresponding to the center point of the projection of the suction hole and the exhaust hole on the same inner cylinder onto the end face of the adjacent inner cylinder is 180°, and the number of the corresponding extrusion columns on the connecting plate is not less than three.

[0010] Furthermore, a friction wheel is fixedly connected to the extrusion column near the adjacent connecting disc. The friction wheel contacts the inner side of the adjacent inner fixed cylinder and is used to drive the extrusion column to rotate during the revolution of the extrusion column through the friction between the inner fixed cylinder and the friction wheel.

[0011] Furthermore, the mounting bracket is equipped with a push rod, the telescopic end of which is slidably and rotatably connected to a connecting frame. One end of the support shaft that abuts against the adjacent connecting sleeve is fixedly connected to the adjacent connecting frame. A universal joint is installed between the connecting sleeve, which is away from the hinge position of the support shaft, and the adjacent sprocket.

[0012] Furthermore, the two adjacent support units are centrally symmetrically distributed.

[0013] Furthermore, an elastic sleeve is provided around the periphery of the support cylinder, and a second through hole is provided on each elastic sleeve near the communicating hole.

[0014] Those skilled in the art will understand that the present invention has at least the following beneficial effects: The present invention relies on the jet pipe to apply a vertically downward airflow, and uses the blowing of the airflow to apply a downward force to the PCB board, thereby eliminating the need for the upper support roller on the PCB board while maintaining the stability of the PCB board during the etching process, and improving etching efficiency and etching uniformity.

[0015] By relying on the relative rotation of the connecting plate and the inner fixed cylinder, the extrusion column is driven to squeeze the elastic bladder. With the elastic deformation of the elastic bladder, a suction force is generated on the circuit board that blocks the connecting hole above it. In this way, together with the vertical airflow, the stability of the circuit board on the support cylinder is improved, and the etching efficiency and etching uniformity are improved.

[0016] By using push rods and connecting frames to drive adjacent support shafts to swing, all support cylinders on the same support shaft are tilted, thereby causing the PCB board to be tilted during etching. This enhances the shear force generated by the airflow on the surface of the etching solution in the groove, and accelerates the discharge of the etching solution from the PCB board groove. On the one hand, this facilitates the entry of new etching solution into the PCB board groove for continued etching, and on the other hand, it reduces the contact time between the etching solution and the sidewall of the PCB board groove, thus reducing the impact of side etching on the PCB board etching effect. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a three-dimensional structural diagram of the infusion tube and gas delivery tube of the present invention;

[0019] Figure 3 This is a three-dimensional structural diagram of the mounting bracket and connecting sleeve of the present invention;

[0020] Figure 4 This is a three-dimensional structural diagram of the mounting bracket and connecting bracket of the present invention;

[0021] Figure 5 This is a three-dimensional structural diagram of the connecting sleeve and connecting disc of the present invention;

[0022] Figure 6 This is an exploded view of the connecting sleeve, connecting disc, and support cylinder of the present invention;

[0023] Figure 7 This is a three-dimensional structural diagram of the inner cylinder and elastic bladder of the present invention;

[0024] Figure 8 This is a three-dimensional structural cross-sectional view of the support cylinder and inner fixed cylinder of the present invention;

[0025] Figure 9 This is a three-dimensional structural diagram of the support shaft and connecting frame of the present invention.

[0026] The meanings of the reference numerals in the figure are as follows: 1-shell, 101-material hole, 102-observation window, 2-infusion pipe, 3-distribution pipe, 4-spray pipe, 5-nozzle, 6-gas pipe, 7-gas distribution pipe, 8-air jet pipe, 9-mounting bracket, 10-support shaft, 11-connecting sleeve, 12-connecting plate, 13-support cylinder, 131-connecting hole, 14-motor, 15-sprocket, 16-chain, 17-inner cylinder, 171-suction hole, 172-vent hole, 18-elastic bladder, 19-squeezing column, 20-friction wheel, 21-push rod, 22-connecting bracket, 23-universal shaft, 24-elastic sleeve. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0028] Example 1: This example provides an etching apparatus for thick copper PCB boards to solve the problems of low etching efficiency and uneven etching caused by the obstruction of the support roller during the etching process of the PCB board in the prior art.

[0029] See Figure 1 and Figure 2An etching apparatus for thick copper PCB boards includes: a housing 1, with material holes 101 on both the left and right sides of the housing 1 for the PCB board to enter and exit the housing 1; observation windows 102 on both the front and rear sides of the housing 1; a liquid inlet pipe 2 on the upper side of the housing 1, which is connected to an etching solution supply device; the liquid inlet pipe 2 is connected to equally spaced distribution pipes 3, which pass through the housing 1 and are connected to a spray pipe 4; and equally spaced nozzles 5 are connected to the lower side of the spray pipe 4, allowing the etching solution sprayed from all the nozzles 5 to cover the housing 1. The cross-sectional area inside the body 1; a gas supply pipe 6 is provided on the upper side of the housing 1, which is connected to an external gas supply device; the gas supply pipe 6 is connected to equally spaced gas distribution pipes 7, which pass through the housing 1 and are connected to jet pipes 8. The number of jet pipes 8 is equal to that of spray pipes 4. The jet pipes 8 are used to guide the airflow inside to flow downward. The lower side of the housing 1 is provided with an exhaust hole for discharging etching liquid and gas; multiple support mechanisms for supporting the circuit board are provided inside the housing 1. The number of support mechanisms is determined according to the length of the housing 1. Here, there are three support mechanisms that are equally spaced.

[0030] The above setup enables the application of a vertically downward airflow through the jet pipe 8, which in turn applies a downward force to the PCB board. This eliminates the need for the upper support roller on the PCB board while maintaining its stability during the etching process, thereby improving etching efficiency and uniformity.

[0031] See Figure 2 All the spray pipes 4 and all the jet pipes 8 are staggered, and the horizontal height of the jet pipes 8 is lower than that of the spray pipes 4; this is to reduce the impact of airflow on the diffusion effect of the etching solution.

[0032] See Figures 2 to 6The support mechanism includes two symmetrically distributed mounting frames 9, which are fixedly connected to the housing 1. Evenly distributed support units are arranged between the two mounting frames 9 (the function of the support units in this paragraph is consistent with the function of support rollers in the prior art). Each support unit includes a support shaft 10, which is disposed between the two mounting frames 9. The support shaft 10 is rotatably connected to multiple connecting sleeves 11, multiple connecting discs 12, and multiple support cylinders 13. When the connecting sleeves 11, connecting discs 12, and support cylinders 13 are installed on the support shaft 10, the connecting sleeves 11, connecting discs 12, and support cylinders 13 are... Each component is fitted onto the support shaft 10. During this process, the connecting sleeve 11, connecting plate 12, and support cylinder 13 slide relative to the support shaft 10. All connecting sleeves 11, connecting plates 12, and support cylinders 13 are staggered on the support shaft 10. Any two adjacent connecting sleeves 11, connecting plates 12, and support cylinders 13 are fixed to each other. The support cylinder 13 is used to support the circuit board. Both mounting brackets 9 are equipped with power components for driving the rotation of the support cylinder 13. The connecting plate 12 and the adjacent support cylinder 13 are jointly equipped with adsorption components for adsorbing and fixing the circuit board.

[0033] See Figure 4 The power assembly includes: a motor 14, mounted on a mounting frame 9, a connecting sleeve 11 near one end of a support shaft 10 abutting against an adjacent support shaft 10, a sprocket 15 on the output shaft of the motor 14 and a sprocket 11 near the other end of the support shaft 10, the sprocket 15 being rotatably connected to an adjacent mounting frame 9, and a chain 16 wound around all the sprockets 15 on the same mounting frame 9, the output shaft of the motor 14 transmitting power to adjacent connecting sleeves 11 on the same mounting frame 9 through the sprockets 15 and the chain 16.

[0034] It should be noted that in this embodiment, the arrangement relationship between the support shaft 10 and the two adjacent mounting brackets 9 can be regarded as fixed connection; the arrangement relationship between the output shaft of the motor 14 and the connecting sleeve 11 near the other end of the support shaft 10 and the adjacent sprocket 15 can be regarded as fixed connection.

[0035] See Figures 6 to 8The adsorption assembly includes: an inner fixed cylinder 17, rotatably connected to an adjacent support cylinder 13 and splinedly connected to an adjacent support shaft 10; an elastic bladder 18 is fixedly connected to the inner side of the inner fixed cylinder 17, the elastic bladder 18 being arc-shaped; several connecting holes 131 are provided on the periphery of the support cylinder 13; suction holes 171 and exhaust holes 172 are respectively provided on the upper and lower sides of the inner fixed cylinder 17; a first through hole is provided on the elastic bladder 18 near the adjacent suction hole 171 and adjacent exhaust hole 172, allowing the suction hole 171 and exhaust hole 172 to respectively... The upper and lower sides of the elastic bladder 18 are connected; the suction hole 171 and the exhaust hole 172 are both used to connect with the corresponding partial connecting hole 131. The side of the connecting plate 12 near the adjacent support cylinder 13 is rotatably connected to the annularly distributed extrusion column 19 through the connecting rod. The extrusion column 19 is used to extrude the adjacent elastic bladder 18, and the minimum distance between the extrusion column 19 and the inner circumference of the inner fixed cylinder 17 is not greater than twice the wall thickness of the elastic bladder 18, so that when the extrusion column 19 contacts the elastic bladder 18, it can divide the interior of the elastic bladder 18 into two spaces.

[0036] The above setup enables the relative rotation of the connecting plate 12 and the inner fixed cylinder 17 to drive the extrusion column 19 to extrude the elastic bladder 18. The elastic deformation of the elastic bladder 18 generates suction on the circuit board that blocks the connecting hole 131 above it. This, together with the vertical airflow, improves the stability of the circuit board on the support cylinder 13, and improves etching efficiency and etching uniformity.

[0037] See Figure 6 The central angle corresponding to the center point of the projection of the suction hole 171 and the exhaust hole 172 on the end face of the adjacent inner fixed cylinder 17 is 180°. The number of corresponding extrusion columns 19 on the connecting plate 12 is not less than three. This ensures that the central angle formed by two adjacent extrusion columns 19 on the same connecting plate 12 with respect to the central axis of the connecting plate 12 is less than 180°, ensuring that at least one extrusion column 19 can extrude the working part of the adjacent elastic bladder 18 (the working part of the elastic bladder 18 refers to the part of the elastic bladder 18 located between the first through holes on the upper and lower sides. The extrusion column 19 can only divide the elastic bladder 18 into upper and lower parts during the process of moving on the working part).

[0038] Etching Process: The gas supply equipment and etching solution supply equipment are activated, allowing airflow to be injected into the housing 1 through the gas delivery pipe 6, gas distribution pipe 7, and jet pipe 8. Guided by the jet pipe 8, the airflow flows vertically downwards within the housing 1. The etching solution is sprayed into the housing 1 through the liquid delivery pipe 2, liquid distribution pipe 3, spray pipe 4, and nozzle 5. The etching solution and airflow entering the housing 1 are discharged through the exhaust holes on its lower side. All motors 14 are activated. The output shafts of motors 14 drive the corresponding connecting sleeves 11 to rotate via sprockets 15 and chains 16. The connecting sleeves 11 drive all connecting discs 12 and support cylinders 13 on the same support shaft 10 to rotate clockwise (see attached diagram). Figure 1The main view is a rotating perspective.

[0039] The PCB boards are placed one by one through the feed hole 101 on the support plane composed of all the support cylinders 13. The support cylinders 13 rotate clockwise and drive the PCB boards to move to the right. During the process of the PCB boards moving to the right in the housing 1, they are affected by the downward airflow, which increases the squeezing pressure between the PCB boards and the adjacent support cylinders 13, thereby improving the stability of the PCB boards during the etching process.

[0040] During the clockwise rotation of the connecting plate 12, the connecting plate 12 rotates relative to the adjacent inner fixed cylinder 17 (the inner fixed cylinder 17 and the support shaft 10 remain stationary). The connecting plate 12 drives the adjacent extrusion column 19 to rotate circumferentially. One of the extrusion columns 19 gradually approaches the upper part of the adjacent elastic bladder 18 until the extrusion column 19 contacts the upper part of the adjacent elastic bladder 18. As the extrusion column 19 continues to rotate circumferentially, it gradually presses clockwise downward from the upper part of the elastic bladder 18. The position where the extrusion column 19 contacts the adjacent elastic bladder 18 gradually passes the first through hole on the upper side of the elastic bladder 18. At this time, the extrusion column 19 contacts the working part of the adjacent elastic bladder 18 and separates the adjacent elastic bladder 18 into upper and lower parts. As the extrusion column 19 rotates circumferentially, the volume of the upper half of the elastic bladder 18 gradually increases and the volume of the lower half gradually decreases. Utilizing the elasticity of the elastic bladder 18, the upper half of the elastic bladder 18 continuously recovers and draws air inward, while the lower half of the elastic bladder 18 continuously exhausts air outward. During the process of supporting and driving the circuit board to move, the circuit board always blocks the connecting hole 131 on the upper side of the adjacent support cylinder 13, while the upper half of the elastic bladder 18 is always connected to the connecting hole 131 on the upper side of the support cylinder 13 through the suction hole 171. This creates a negative pressure inside the connecting hole 131 on the upper side of the support cylinder 13, thereby generating an adsorption force on the circuit board above it, further improving the stability of the circuit board during the etching process.

[0041] On the support cylinder 13 that is not in contact with the circuit board, as the extrusion column 19 gradually extrudes the elastic bladder 18, the upper part of the elastic bladder 18 draws gas and etching solution inward through the suction hole 171 and the corresponding connecting hole 131, while the lower part of the elastic bladder 18 discharges gas and etching solution outward through the exhaust hole 172 and the corresponding connecting hole 131.

[0042] After etching is completed, stop the gas supply equipment, etching solution supply equipment and motor 14.

[0043] Example 2: This example is a further optimization based on Example 1.

[0044] See Figure 6 and Figure 7A friction wheel 20 is fixedly connected to the extrusion column 19 near the adjacent connecting plate 12. The friction wheel 20 contacts the inner side of the adjacent inner fixed cylinder 17. During the revolution of the extrusion column 19, the friction between the inner fixed cylinder 17 and the friction wheel 20 drives the extrusion column 19 to rotate. Through the cooperation between the friction wheel 20 and the inner fixed cylinder 17, the extrusion column 19 rotates on its own during the revolution, so that the extrusion column 19 only exerts extrusion force on the adjacent elastic bladder 18, and does not exert tensile force on the elastic bladder 18 due to the difficulty of the extrusion column 19 rotating on its own. In this way, the deformable range of the two parts of the elastic bladder 18 is maintained.

[0045] Example 3: This example is a further optimization based on Example 2, in order to reduce the impact of the "pool effect" on the etching effect of the circuit board.

[0046] During the etching process, the circuit board is usually placed horizontally. As etching proceeds, the grooves etched on the surface of the circuit board gradually deepen. The etching solution accumulates in the grooves of the circuit board, which hinders the contact between new etching solution and the copper foil on the bottom side of the groove, affecting the etching rate. At the same time, the etching solution accumulated in the groove continues to contact the copper foil on the side wall of the groove, causing side etching and resulting in poor etching effect.

[0047] See Figure 4 , Figure 5 and Figure 9 The mounting bracket 9 is equipped with push rods 21, which can be electric push rods 21, and there can be multiple push rods 21 distributed at equal intervals to provide a stable thrust for the connecting bracket 22. Here, there are two push rods 21. The telescopic end of the push rod 21 is slidably and rotatably connected to the connecting bracket 22. One end of the support shaft 10 that abuts against the adjacent connecting sleeve 11 is fixedly connected to the adjacent connecting bracket 22. A universal joint 23 is installed between the connecting sleeve 11, which is away from the hinge position of the support shaft 10, and the adjacent sprocket 15.

[0048] The above setup enables the adjacent support shafts 10 to swing via the push rod 21 and the connecting frame 22, causing all the support cylinders 13 on the same support shaft 10 to tilt. This results in the PCB board being tilted during etching, enhancing the shear force generated by the airflow on the surface of the etching solution in the groove, and accelerating the discharge of the etching solution from the groove of the PCB board. On the one hand, this facilitates the entry of new etching solution into the groove of the PCB board for continued etching, and on the other hand, it reduces the contact time between the etching solution and the side wall of the groove of the PCB board, thus reducing the impact of side etching on the etching effect of the PCB board.

[0049] See Figure 3 and Figure 4The adjacent support units are centrally symmetrically distributed, which not only increases the arrangement density of the support cylinder 13 and improves the stability of the PCB board support, but also provides two tilting directions for the PCB board. For rigid circuit boards, the tilting direction can be switched during the etching process to improve the etching uniformity of the circuit board in the front and back directions. For flexible circuit boards, it can guide the circuit board to undergo three-dimensional deformation, which facilitates the discharge of etching solution from the groove and improves the etching uniformity, while reducing the operation of the equipment and reducing energy consumption.

[0050] For etching rigid circuit boards: After the PCB board enters the housing 1, the push rods 21 on the front and rear sides are activated in sequence to change the tilt state of the PCB board. After the push rods 21 are activated, the telescopic end of the push rods 21 extends and drives all the corresponding support shafts 10 to swing together through the connecting frame 22. The support shafts 10 drive the adjacent connecting sleeves 11, connecting plates 12 and support cylinders 13 to swing and twist the universal joint 23, so that the support cylinder 13 drives the PCB board on it to tilt. Combined with the airflow, the etching solution in the groove of the PCB board is discharged.

[0051] For etching of flexible circuit boards: After the PCB board enters the housing 1, all push rods 21 are activated at the same time, so that the two adjacent support cylinders 13 cross in the left and right directions, causing the PCB board moving on the support cylinder 13 to deform. In this way, the PCB board is always in a deformed state during the movement of the PCB board, which accelerates the flow rate of the etching solution on the PCB board, reduces the contact time between the etching solution and the side wall of the PCB board groove, and enhances the etching effect of the PCB board.

[0052] Example 4: This example is a further optimization based on Example 3.

[0053] See Figure 5 and Figure 6 The support cylinder 13 is fitted with an elastic sleeve 24 around its periphery. The elastic sleeve 24 is provided with a second through hole near the connecting hole 131. The elastic sleeve 24 is deformed by the PCB board and the sealing between the PCB board and the adjacent connecting hole 131 is enhanced, and the negative pressure in the connecting hole 131 is guaranteed to adsorb the PCB board.

[0054] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An etching apparatus for thick copper PCB boards, comprising: The housing (1) has material holes (101) on both sides. The upper side of the housing (1) is provided with a liquid inlet pipe (2). The liquid inlet pipe (2) is connected to a liquid distribution pipe (3) that is evenly distributed. The liquid distribution pipe (3) passes through the housing (1) and is connected to a spray pipe (4). The lower side of the spray pipe (4) is connected to an evenly distributed nozzle (5). The housing (1) is characterized by having an air inlet pipe (6) on the upper side. The air inlet pipe (6) is connected to an evenly distributed air distribution pipe (7). The air distribution pipe (7) passes through the housing (1) and is connected to an air jet pipe (8). The air jet pipe (8) is used to guide the airflow inside to flow downward. The airflow is used to apply a downward force to the PCB board to maintain the stability of the PCB board during the etching process. The housing (1) is provided with multiple support mechanisms for supporting the circuit board.

2. The etching apparatus for thick copper PCB boards according to claim 1, characterized in that: All of the spray pipes (4) are staggered with all of the jet pipes (8), and the horizontal height of the jet pipes (8) is lower than that of the spray pipes (4).

3. The etching apparatus for thick copper PCB boards according to claim 1, characterized in that: The supporting structure includes: Two symmetrically distributed mounting brackets (9) are fixedly connected to the housing (1). Evenly distributed support units are provided between the two mounting brackets (9). Each support unit includes: A support shaft (10) is disposed between two mounting brackets (9). The support shaft (10) is rotatably connected to multiple connecting sleeves (11), multiple connecting discs (12), and multiple support cylinders (13). All the connecting sleeves (11), all the connecting discs (12), and all the support cylinders (13) are staggered on the support shaft (10). Any two adjacent connecting sleeves (11), connecting discs (12), and support cylinders (13) are fixed to each other. The support cylinders (13) are used to support the circuit board. Both mounting brackets (9) are provided with a power component for driving the support cylinders (13) to rotate. The connecting discs (12) and the adjacent support cylinders (13) are jointly provided with an adsorption component for adsorbing and fixing the circuit board.

4. The etching apparatus for thick copper PCB boards according to claim 3, characterized in that: The power assembly includes: The motor (14) is mounted on the mounting frame (9). The connecting sleeve (11) near one end of the support shaft (10) abuts against the adjacent support shaft (10). The output shaft of the motor (14) and the connecting sleeve (11) near the other end of the support shaft (10) are both provided with sprockets (15). The sprockets (15) are rotatably connected to the adjacent mounting frame (9). All the sprockets (15) on the same mounting frame (9) are wound with a chain (16).

5. The etching apparatus for thick copper PCB boards according to claim 4, characterized in that: The adsorption component includes: An inner fixed cylinder (17) is rotatably connected to the adjacent support cylinder (13) and splinedly connected to the adjacent support shaft (10). An elastic bladder (18) is fixedly connected to the inner side of the inner fixed cylinder (17). Several connecting holes (131) are provided on the periphery of the support cylinder (13). Suction holes (171) and exhaust holes (172) are respectively provided on the upper and lower sides of the inner fixed cylinder (17). The elastic bladder (18) is positioned near the adjacent suction holes (171) and adjacent exhaust holes (172). The elastic bladder (18) has a first through hole, and the elastic bladder (18) is connected to the adjacent suction hole (171) and the adjacent exhaust hole (172) through two first through holes. The suction hole (171) and the exhaust hole (172) are both used to connect to the corresponding part of the connecting hole (131). The connecting plate (12) is rotatably connected to the side of the adjacent support cylinder (13) by a connecting rod with an annularly distributed extrusion column (19). The extrusion column (19) is used to extrude the adjacent elastic bladder (18).

6. The etching apparatus for thick copper PCB boards according to claim 5, characterized in that: The central angle corresponding to the center point of the projection of the suction hole (171) and the exhaust hole (172) on the end face of the adjacent inner cylinder (17) is 180°, and the number of the corresponding extrusion column (19) on the connecting plate (12) is not less than three.

7. The etching apparatus for thick copper PCB boards according to claim 5, characterized in that: A friction wheel (20) is fixedly connected to the extrusion column (19) near the adjacent connecting disc (12). The friction wheel (20) contacts the inner side of the adjacent inner cylinder (17) and is used to drive the extrusion column (19) to rotate by the friction between the inner cylinder (17) and the friction wheel (20) during the revolution of the extrusion column (19).

8. The etching apparatus for thick copper PCB boards according to claim 5, characterized in that: The mounting bracket (9) is equipped with a push rod (21). The telescopic end of the push rod (21) is slidably and rotatably connected to a connecting bracket (22). One end of the support shaft (10) that abuts against the adjacent connecting sleeve (11) is fixedly connected to the adjacent connecting bracket (22). A universal joint (23) is installed between the connecting sleeve (11) away from the hinge position of the support shaft (10) and the adjacent sprocket (15).

9. An etching apparatus for thick copper PCB boards according to claim 3, characterized in that: The two adjacent support units are centrally symmetrically distributed.

10. An etching apparatus for thick copper PCB boards according to claim 5, characterized in that: The support cylinder (13) is fitted with an elastic sleeve (24) around its periphery, and the elastic sleeve (24) is provided with a second through hole near the connecting hole (131).

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