Bionic liquid cooling plate processing technology

Abstract

The invention relates to the technical field of liquid cooling heat dissipation, and discloses a bionic liquid cooling plate processing technology comprising the following steps: S1, bionic structure design and parameter optimization; s2, raw material pretreatment; s3, precision forming of the bionic channel; s4, laminating and sealing welding; s5, performing post-treatment and performance optimization on the material; and S6, inspecting and packaging a finished product. According to the bionic liquid cooling plate processing technology, the bionic graded channel structure realizes uniform distribution of fluid, heat dissipation efficiency is improved, the requirement of a high-heat-flux scene is met, the gradient diameter and graded angle design optimizes a fluid flowing path, the flow resistance is reduced, pump consumption of a heat dissipation system is reduced, and the endurance of new energy equipment is prolonged; the bionic channel can be designed in a customized mode according to the shape of a heating component and heat distribution and is attached to a special-shaped structure, and the space utilization rate is increased by 20% or above.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, specifically to a biomimetic liquid cooling plate processing technology. Background Technology

[0002] With the increasing power density of electronic devices and the growing range demands of new energy vehicles, liquid cooling has become the mainstream heat dissipation solution due to its high heat dissipation efficiency and compact size. Traditional liquid cooling plates often employ simple structural designs such as straight channels and serpentine channels, which have the following technical drawbacks: Poor heat dissipation uniformity: Uneven flow velocity distribution in the channel can easily lead to local hot spots, resulting in a bottleneck in heat dissipation efficiency; High flow resistance loss: High fluid flow resistance in straight channels or single-curvature channels increases pump consumption in the heat dissipation system, affecting battery life or energy consumption performance; Insufficient structural adaptability: Traditional channel designs are difficult to fit irregularly shaped heat-generating components, resulting in low space utilization. The manufacturing process is complex: complex biomimetic structures are difficult to form using traditional stamping and milling processes, or the formed channels have low precision and poor sealing, resulting in a yield rate of less than 80%. Existing biomimetic liquid cooling plate processing largely relies on 3D printing technology, which, while capable of achieving complex structures, suffers from high processing costs, low production efficiency, and poor material compatibility, failing to meet the demands of large-scale industrial production. Therefore, there is an urgent need for a liquid cooling plate processing technology that balances the advantages of biomimetic structures with processing efficiency and cost. This application proposes such a biomimetic liquid cooling plate processing technology. Summary of the Invention

[0003] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a biomimetic liquid cooling plate processing technology that overcomes the defects of traditional liquid cooling plates, such as uneven heat dissipation, high flow resistance, poor adaptability, and limited processing technology. It achieves the core requirements of liquid cooling plates, namely "high-efficiency heat dissipation, low flow resistance, high adaptability, and easy mass production," thereby reducing processing costs and improving product reliability.

[0004] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a biomimetic liquid-cooled plate processing technology, comprising the following steps: S1. Bionic structural design and parameter optimization; S2, Raw material pretreatment; S3, Bionic channel precision molding; S4, lamination and sealing welding; S5. Material post-processing and performance optimization; S6. Finished product inspection and packaging.

[0005] Preferably, the biomimetic structural design and parameter optimization selects biological prototypes such as leaf veins / human blood vessels, extracts hierarchical channel features, combines the heat flux density distribution of the heating component, and optimizes parameters such as channel size, spacing, and angle through CFD simulation to complete the overall structural design of the liquid cooling plate.

[0006] Preferably, the raw material pretreatment uses aluminum alloy or copper alloy substrates, which are degreased, pickled, and passivated to remove surface impurities and oxide layers, and then cut into blanks of each layer by laser cutting to control dimensional tolerances and edge quality.

[0007] Preferably, the bionic channel is precision formed by "SLM + precision milling" or "stamping + electrochemical etching" to process the bionic channel layer, and the integrity and accuracy of the channel are verified by industrial CT scanning after forming.

[0008] Preferably, the lamination and sealing welding involves stacking and fixing the upper cover plate, the biomimetic channel layer, and the lower substrate according to positioning requirements, using vacuum brazing to achieve interlayer metallurgical bonding, and using helium mass spectrometry leak detection and ultrasonic flaw detection to test the welding sealing performance and internal quality.

[0009] Preferably, the post-processing and performance optimization utilizes high-pressure water jet to remove burrs, performs anodizing / nickel plating on the substrate, rinses the inside of the channel with deionized water, and finally calibrates the product performance through heat dissipation, flow resistance, and pressure resistance tests.

[0010] Preferably, the finished product inspection and packaging involves using a coordinate measuring machine to detect key dimensions. After passing the appearance inspection, the finished product is packaged with moisture-proof and cushioning materials and stored under specified environmental conditions for delivery.

[0011] Compared with the prior art, the present invention provides a biomimetic liquid cooling plate processing technology, which has the following beneficial effects: The biomimetic liquid cooling plate processing technology and biomimetic hierarchical channel structure achieve uniform fluid distribution, improve heat dissipation efficiency, and adapt to the needs of high heat flux density scenarios. The gradient diameter and hierarchical angle design optimize the fluid flow path, reduce flow resistance, reduce pump consumption of the heat dissipation system, and extend the battery life of new energy equipment. The biomimetic channel can be customized according to the shape and heat distribution of the heat-generating component, fit irregular structures, and improve space utilization by more than 20%. This biomimetic liquid cooling plate is manufactured using a combination of "SLM + milling" or "stamping + electrochemical corrosion" processes, which are compatible with mass production. This process balances the forming of complex structures with production efficiency, improves yield, reduces processing costs, and enables integrated sealing through vacuum brazing. The corrosion resistance and structural strength meet the requirements for long-term use, extending the service life. It is compatible with mainstream thermally conductive materials such as aluminum alloys and copper alloys, and can be flexibly selected according to cost and heat dissipation requirements, making it suitable for various industry applications. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the liquid cooling plate processing steps of the present invention. Detailed Implementation

[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0014] Please see Figure 1 A biomimetic liquid cooling plate processing technology includes the following steps: Furthermore, the biomimetic structural design and parameter optimization selects biological prototypes such as leaf veins / human blood vessels, extracts hierarchical channel features, and combines the heat flux density distribution of the heating components. CFD simulation is used to optimize parameters such as channel size, spacing, and angle to complete the overall structure design of the liquid cooling plate. The biomimetic structural design and parameter optimization involves: first, selecting a biological heat dissipation prototype and extracting core structural features through 3D scanning and image analysis; then, optimizing channel parameters based on the heat flux density distribution of the heating components using CFD (Computational Fluid Dynamics) simulation: densifying branch channels in high heat flux regions and increasing channel spacing in low heat flux regions; adopting a gradient diameter design for the main channel to reduce flow resistance; and designing the overall structure of the liquid cooling plate, including an upper cover plate, a lower substrate, and a biomimetic channel layer. The upper cover plate has a reserved liquid inlet / outlet interface, and the lower substrate's bonding surface uses a micro-protrusion structure to enhance thermal conductivity. The biomimetic channel layer is 3-5 mm thick, and the overall plate thickness is 8-12 mm.

[0015] Furthermore, the raw material pretreatment uses aluminum alloy or copper alloy substrates, which are degreased, pickled, and passivated to remove surface impurities and oxide layers. Then, each layer blank is cut out by laser cutting, controlling dimensional tolerances and edge quality. Raw material pretreatment: aluminum alloy or copper alloy is selected as the substrate, with a plate thickness of 10-15mm, ensuring a thermal conductivity ≥180W / (m・K) and tensile strength ≥200MPa. Substrate surface pretreatment: degreasing is performed sequentially using an alkaline degreasing agent at a temperature of 50-60℃ for 10-15min; pickling is performed using a nitric acid-hydrofluoric acid mixed solution at a concentration of 5%-8% for 3-5min; passivation is performed using chromate passivation at a temperature of 25-30℃ for 5-8min to remove surface oil and oxide layers, improving the bonding strength for subsequent forming and welding. The pretreated substrate is then cut by laser cutting to obtain the upper cover plate, lower substrate, and channel layer blanks, with dimensional tolerances controlled within ±0.1mm and no burrs on the edges.

[0016] Furthermore, for the precision forming of the bionic channels, the bionic channel layer is processed by "SLM + precision milling" or "stamping + electrochemical etching". After forming, industrial CT scanning is used to verify the integrity and accuracy of the channels; Precision forming of bionic channels: The bionic channel layer is processed by the "selective laser melting (SLM) + precision milling composite process": First, the bionic channel skeleton is formed by the SLM technology. Metal powder of the same material as the substrate is selected, the laser power is 200 - 300W, the scanning speed is 800 - 1200mm / s, the layer thickness is 0.05 - 0.1mm, and the roughness Ra of the inner wall of the formed channel is ≤1.6μm; The channel layer formed by SLM is subjected to precision milling. A ball-end milling cutter is used to process the inner wall of the channel and the upper and lower mating surfaces to ensure that the channel size tolerance is ±0.05mm and the flatness of the mating surface is ≤0.02mm / m; Verification of channel structure: Industrial CT scanning is used to detect the integrity of the channel forming, and it is confirmed that there are no defects such as blockage and uneven wall thickness. Unqualified products are returned for re-milling or SLM forming; (Alternative solution: For large-scale production scenarios, the "stamping + electrochemical etching composite process" is adopted: First, the main channel is formed by stamping, and then the branch channels are processed by electrochemical etching to improve the forming efficiency.

[0017] Furthermore, for the lamination and seal welding, the upper cover plate, the bionic channel layer, and the lower substrate are stacked and fixed according to the positioning requirements, and vacuum brazing is used to achieve interlayer metallurgical bonding. Helium mass spectrometry leak detection and ultrasonic flaw detection are used to detect the welding tightness and internal quality; Lamination and seal welding: Lamination positioning: The upper cover plate, the bionic channel layer, and the lower substrate are stacked in sequence and fixed by positioning pins to ensure that the alignment deviation of the liquid inlet and outlet interfaces and the channels is ≤0.1mm and there is no gap between layers; Vacuum brazing seal: The stacked components are placed in a vacuum brazing furnace, and aluminum-silicon brazing filler metal or copper-phosphorus brazing filler metal is selected. The brazing temperature is: 600 - 620°C for aluminum alloy substrates and 680 - 700°C for copper alloy substrates, the holding time is 30 - 45min, and the vacuum degree is ≤5×10 -3 Pa, to achieve interlayer metallurgical bonding, and the weld strength is ≥80% of the substrate strength; Welding quality inspection: Helium mass spectrometry leak detection is used to detect the tightness to ensure no leakage; Ultrasonic flaw detection is used to detect internal defects in the welds, and the qualified rate is that the proportion of the defect area is ≤5%.

[0018] Furthermore, the post-processing and performance optimization utilizes high-pressure water jet to remove burrs, performs anodizing / nickel plating on the substrate, then rinses the inside of the channel with deionized water, and finally calibrates the product performance through heat dissipation, flow resistance, and pressure resistance tests; Post-processing and performance optimization: Deburring and surface treatment: High-pressure water jet is used to remove burrs from the weld edges, followed by anodizing or nickel plating to improve corrosion resistance and appearance quality; Channel cleaning: Deionized water is used to circulate and rinse the inside of the channel to remove brazing residue and impurities, with a rinsing flow rate of 5-10 L / min and a rinsing time of 15-20 min to ensure that the channel is not blocked; Performance testing and calibration: Heat dissipation performance testing, flow resistance testing, and pressure resistance testing are performed on the liquid cooling plate, and unqualified products are reworked by re-welding or channel cleaning.

[0019] Furthermore, the finished product inspection and packaging involves using a coordinate measuring machine to check key dimensions. After passing the appearance inspection, the finished product is packaged with moisture-proof and cushioning materials and stored under the specified environmental conditions until delivery. Finished product inspection and packaging: Finished product dimension inspection: The key dimensions of the liquid cooling plate are measured by a coordinate measuring machine, and the tolerances meet the design requirements; Appearance inspection: There are no obvious scratches, deformations, or weld defects, and the surface treatment is uniform; Packaging and storage: Moisture-proof packaging materials are used for sealing, and cushioning foam is placed in the individual packaging box to avoid collision damage during transportation. The storage environment temperature is 0-40℃, and the relative humidity is ≤60%.

[0020] Example 1: The processing steps of the biomimetic liquid cooling plate for new energy vehicle battery packs are as follows: Design: mimicking leaf vein structure, main channel diameter 10mm, branch channel diameter 3mm, grading angle 45°, high heat flow area (middle of battery module) channel spacing 3mm, low heat flow area spacing 6mm, liquid cooling plate size 300mm×200mm×10mm. Raw materials: 6061 aluminum alloy sheet, 12mm thick, pre-treated and cut into 310mm×210mm blanks; Forming: The process of "stamping + electrochemical etching" is adopted. The main channel is formed by stamping, and the branch channels are processed by electrochemical etching. The roughness of the inner wall of the channel is Ra=1.2μm. Welding: Al-Si brazing filler metal was used, vacuum brazing temperature was 610℃, heat treatment was performed for 35 minutes, and helium mass spectrometry leak detection showed no leakage; Post-treatment: Anodizing (oxide film thickness 12μm), rinsing the channels with deionized water, and heat dissipation testing at a heat flux density of 80W / cm². 2 Under these conditions, the temperature difference is 4.2℃ and the flow resistance is 3.8kPa; Inspection: Dimensional tolerance ±0.08mm, no defects in appearance, packaged and delivered to the battery pack manufacturer for assembly.

[0021] Example 2: Fabrication of a biomimetic liquid cooling plate for electronic chipsets Design: mimicking the human vascular network, the main channel diameter is 8mm, the branch channel diameter is 2mm, the hierarchical angle is 30°, the channel spacing in the core heat-generating area of ​​the chip is 3mm, the spacing in the peripheral area is 5mm, and the liquid cooling plate size is 150mm×100mm×8mm. Raw materials: T2 copper sheet, 10mm thick, pre-treated and cut into 160mm×110mm blanks; Forming: The process adopts "SLM + precision milling" with SLM laser power of 250W, scanning speed of 1000mm / s, and channel size tolerance of ±0.03mm after milling. Welding: Cu-P brazing filler metal was used, vacuum brazing temperature was 690℃, holding time was 40 min, and ultrasonic testing showed that the weld defect area accounted for 2.3%; Post-treatment: Nickel plating (plating thickness 6μm), performance testing after channel cleaning: heat flux density 100W / cm² 2 Under these conditions, the temperature difference is 3.8℃ and the flow resistance is 2.9kPa; Inspection: After passing inspection, the product is sealed and packaged for heat dissipation in high-end server chipsets.

[0022] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A biomimetic liquid-cooled plate processing technology, characterized in that: Includes the following steps: S1. Bionic structural design and parameter optimization; S2, Raw material pretreatment; S3, Bionic channel precision molding; S4, lamination and sealing welding; S5. Material post-processing and performance optimization; S6. Finished product inspection and packaging.

2. The biomimetic liquid-cooled plate processing technology according to claim 1, characterized in that: The biomimetic structural design and parameter optimization selects biological prototypes such as leaf veins / human blood vessels, extracts hierarchical channel features, and combines the heat flux density distribution of the heating component. Through CFD simulation, parameters such as channel size, spacing, and angle are optimized to complete the overall structural design of the liquid cooling plate.

3. The biomimetic liquid-cooled plate processing technology according to claim 1, characterized in that: The raw material pretreatment uses aluminum alloy and copper alloy substrates, which are degreased, pickled and passivated to remove surface impurities and oxide layers. Then, each layer of blank is cut out by laser cutting to control dimensional tolerances and edge quality.

4. The biomimetic liquid-cooled plate processing technology according to claim 1, characterized in that: The biomimetic channel is precision formed by processing the biomimetic channel layer using "SLM + precision milling" or "stamping + electrochemical etching". After forming, the integrity and accuracy of the channel are verified by industrial CT scanning.

5. The biomimetic liquid-cooled plate processing technology according to claim 1, characterized in that: The lamination and sealing welding process involves stacking and fixing the upper cover plate, biomimetic channel layer, and lower substrate according to positioning requirements. Vacuum brazing is used to achieve interlayer metallurgical bonding, and helium mass spectrometry leak detection and ultrasonic flaw detection are used to test the welding sealing performance and internal quality.

6. The biomimetic liquid-cooled plate processing technology according to claim 1, characterized in that: The post-processing and performance optimization utilizes high-pressure water jet to remove burrs, performs anodizing / nickel plating on the substrate, rinses the inside of the channels with deionized water, and finally calibrates the product performance through heat dissipation, flow resistance, and pressure resistance tests.

7. The biomimetic liquid-cooled plate processing technology according to claim 1, characterized in that: The finished product inspection and packaging process involves using a coordinate measuring machine to check key dimensions. After passing the appearance inspection, the finished product is packaged in moisture-proof and cushioned packaging and stored under the specified environmental conditions until delivery.

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