Shielded connection structure, shielded flexible circuit board and manufacturing method thereof

Abstract

A shielding type flexible circuit board comprises a first lamination structure, a second lamination structure and an adhesive layer. The first lamination structure comprises a first part and a second part. The second part is connected with the first part and is provided with an element arrangement area. The second lamination structure is arranged on the first lamination structure and comprises a third part and a groove body. The third part is attached to the first part, and the groove body is connected with the third part and used for covering the element arrangement area. When the groove body covers the element arrangement area, the adhesive layer is attached between the notch edge of the groove body and the second part. Therefore, the electromagnetic shielding effect is achieved by covering the element arrangement area, and the elements in the element arrangement area are more convenient to maintain or replace by arranging the adhesive layer.

Description

Technical Field

[0001] This application relates to a connection device for a basic electrical component and a method for manufacturing the same, and more particularly to a shielded connection structure, a flexible circuit board, and a method for manufacturing the same. Background Technology

[0002] Shielding principles are widely used in various electronic fields to prevent interference between transmitted signals or the influence of external signal disturbances. However, with the increasing complexity, miniaturization, and precision of electronic products, common shielding methods are gradually becoming insufficient to cope with the changing application scenarios.

[0003] Among common shielding methods, one approach is to use a metal shielding cover, which is directly placed over the electronic component to be shielded and soldered onto the circuit board to achieve electromagnetic shielding. However, this method not only occupies design space but also makes component repair and replacement difficult. Another approach is to use shielding films or conductive silver paste, but this method has poor shielding effectiveness; it cannot shield three-dimensional components, nor can it comprehensively cover electromagnetic signals, resulting in electromagnetic signal leakage. Summary of the Invention

[0004] Therefore, this application provides a shielded flexible circuit board, which includes a first laminated structure, a second laminated structure, and an adhesive layer. The first laminated structure includes a first portion and a second portion. The second portion is connected to the first portion and has a component placement area. The second laminated structure is disposed on the first laminated structure and includes a third portion and a groove. The third portion is attached to the first portion, and the groove is connected to the third portion and is used to cover the component placement area. When the groove covers the component placement area, the adhesive layer is attached between the groove edge and the second portion.

[0005] According to the shielded flexible circuit board of this application, the third part includes a first shielding layer, and the groove includes a second shielding layer, and the first shielding layer is connected to the second shielding layer.

[0006] According to the shielded flexible circuit board of this application, the groove includes a polymer layer. The polymer layer covers a second shielding layer, and the second shielding layer is located between the polymer layer and the second portion.

[0007] According to the shielded flexible circuit board of this application, the second shielding layer includes a first metal layer and a second metal layer. The first metal layer is connected to the second metal layer, the thickness of the second metal layer is greater than the thickness of the first metal layer, and when the slot covers the component placement area, the second metal layer overlaps with the component assembly area.

[0008] According to the shielded flexible circuit board of this application, the second metal layer has multiple holes.

[0009] According to the shielded flexible circuit board of this application, the adhesive layer is a re-peelable adhesive.

[0010] The shielded flexible circuit board according to this application further includes a support layer. The support layer is attached to a first multilayer structure, and the first multilayer structure is located between a second multilayer structure and the support layer.

[0011] This application provides a shielded connection structure, comprising a first flexible circuit board, a second flexible circuit board, and an adhesive layer. The first flexible circuit board is provided with a first connector. The second flexible circuit board includes a main body, a first laminated structure, and a second laminated structure. The main body is provided with a second connector, which is configured to connect to the first connector. The first laminated structure is disposed above the main body and includes a first portion and a first groove, wherein the first portion is attached to the main body, the first groove connects to the first portion, and is used to cover the first connector and the second connector. The second laminated structure is disposed below the main body and includes a second portion and a second groove, wherein the second portion is attached to the lower part of the main body, and the second groove connects to the second portion, and is used to cover the first connector and the second connector. When both the first groove and the second groove cover the first connector and the second connector, an accommodating space is formed between the first groove and the second groove, and both the first connector and the second connector are located within the accommodating space. When both the first and second grooves cover the first and second connectors, the adhesive layer adheres between the end of the first groove and the upper surface of the first flexible circuit board, and between the end of the second groove and the lower surface of the first flexible circuit board.

[0012] This application provides a method for manufacturing a shielded flexible circuit board, comprising providing a first laminated structure, wherein the first laminated structure includes a first portion and a second portion, and the second portion has a component placement area; providing a second laminated structure, wherein the second laminated structure includes a third portion and a fourth portion; attaching the third portion to the first portion; deforming the fourth portion to make the fourth portion into a groove; and disposing an adhesive layer on at least one of the second portion and the fourth portion, wherein the adhesive layer is used to bond the second portion and the groove.

[0013] According to the manufacturing method of the shielded flexible circuit board of this application, the step of forming the second multilayer structure further includes disposing a metal layer on the substrate, wherein the metal layer includes a first metal layer and a second metal layer, and the second metal layer overlaps with the component placement area; forming a plurality of holes on the second metal layer; covering the first metal layer and the second metal layer with a polymer layer; and covering the third portion and the polymer layer with a cover layer.

[0014] According to the shielded connection structure, shielded flexible circuit board, and manufacturing method of this application, the component placement area to be shielded is covered in space by forming a groove-shaped laminated structure to achieve the effect of electromagnetic shielding. In addition, the groove-shaped laminated structure is bonded to another laminated structure by a re-peelable adhesive layer, making the components placed in the component placement area easier to repair or replace. Attached Figure Description

[0015] To make the above and other features, advantages and embodiments of the present invention more readily understood, the accompanying drawings are described below:

[0016] Figure 1A This is a schematic diagram of a shielded flexible circuit board according to an embodiment of this application;

[0017] Figure 1B This is a schematic diagram illustrating the component placement area of ​​a shielded flexible circuit board in an unshielded state, according to an embodiment of this application.

[0018] Figure 1C This is a schematic diagram of the layout of a second layered structure according to an embodiment of this application;

[0019] Figure 1D This is a schematic diagram of the layout of a first layered structure according to an embodiment of this application;

[0020] Figure 2A This is a schematic diagram illustrating a shielded connection structure according to an embodiment of this application;

[0021] Figure 2B This is a schematic diagram illustrating the shielded connection structure in an unshielded state according to an embodiment of this application;

[0022] Figures 3A to 3I This is a schematic diagram illustrating a method for manufacturing a shielded flexible circuit board according to an embodiment of this application. Detailed Implementation

[0023] The following application provides numerous different embodiments or examples for implementing various features of the provided subject matter. Specific examples of components and configurations are described below to simplify this application. The following descriptions are merely examples and are not intended to be limiting. For example, a first feature may be formed on or above a second feature, which may include embodiments where the first and second features are in direct contact, and may also include embodiments where an additional feature is formed between the first and second features such that the first and second features are not in direct contact. Furthermore, reference numerals and / or words may be repeated in various examples within this application. This repetition is for simplicity and clarity and does not in itself limit the relationship between the various embodiments and / or components discussed.

[0024] Please refer to Figure 1A , Figure 1A This is a schematic diagram of a shielded flexible circuit board 100 according to an embodiment of this application. The shielded flexible circuit board 100 includes a first laminated structure 110, a second laminated structure 120, and an adhesive layer 130. For the sake of brevity, descriptions of some non-essential layers or components may be omitted below. Figure 1A , Figure 1B , Figure 2A and Figure 2B The layer filled with diagonal lines is a metal layer, such as a copper layer.

[0025] The first laminated structure 110 has a first portion 111 and a second portion 112. The second portion 112 is connected to the first portion 111, and the second portion 112 has a component placement area R for placing electronic components E or circuits that need to be shielded. In the embodiments of this application, the first laminated structure 110 can be divided into a first portion 111 and a second portion 112, and the first portion 111 and the second portion 112 of the first laminated structure 110 are integrally formed structures, and the two do not require additional connecting elements or adhesive elements to connect them.

[0026] The second laminated structure 120 is disposed on the first laminated structure 110 and includes a third portion 121 and a groove 122. The third portion 121 is attached to the first portion 111 of the first laminated structure 110. The groove 122 connects to the third portion 121 and is used to cover the component placement area R of the first laminated structure 110. In the embodiments of this application, the third portion 121 and the groove 122 of the second laminated structure 120 are integrally formed structures, and no additional connecting elements or adhesive elements are required to connect them.

[0027] In this embodiment, the first portion 111 of the first laminated structure 110 and the third portion 121 of the second laminated structure 120 can be bonded together by the adhesion layer 203. The adhesion layer 203 enables the first laminated structure 110 and the second laminated structure 120 to be bonded together; in other words, the first portion 111 of the first laminated structure 110 and the third portion 121 of the second laminated structure 120 are fixedly bonded to each other.

[0028] An adhesive layer 130 is disposed between the first laminated structure 110 and the second laminated structure 120, and is configured to adhere the groove edge of the groove 122 to the second portion 112 of the first laminated structure 110. When the groove 122 is adhered to the second portion 112 through the adhesive layer 130, the groove 122 covers the entire component placement area R. At this time, the electronic components E in the component placement area R are in a shielded state and are surrounded in the accommodating space S formed by the groove 122 and the second portion 112.

[0029] It should be understood that, without departing from the scope of this application, the shape of the shielding space (i.e., the accommodating space S) formed between the trough 122 and the second part 112 can be a semi-ellipsoid, a hemispherical or a disk.

[0030] The adhesive layer 130 may be a re-peelable adhesive, which can be repeatedly peeled from and repeatedly bonded to a target object (e.g., the first laminate structure 110). The adhesive layer 130 may be, for example, a pressure-sensitive adhesive (PSA), including but not limited to rubber-based PSA, acrylic PSA, silicone PSA, or polyurethane PSA, and other re-adhesive adhesives.

[0031] The third portion 121 of the second stacked structure 120 includes a first shielding layer 121a, and the groove 122 includes a second shielding layer 122a, with the first shielding layer 121a connected to the second shielding layer 122a. In embodiments of this application, the first shielding layer 121a and the second shielding layer 122a are copper layers, and they can be integrally formed, meaning that they do not require additional connecting or adhesive elements for connection. For example, in circuit layout, both the first shielding layer 121a and the second shielding layer 122a are circuit layers or metal pattern layers.

[0032] The second shielding layer 122a includes a first metal layer L1 and a second metal layer L2, with the first metal layer L1 connected to the second metal layer L2. In embodiments of this application, the range of the second metal layer L2 can be roughly considered as the region overlapping the component placement area R in the Z direction, and the thickness of the second metal layer L2 is greater than the thickness of the first metal layer L1 to increase the heat conduction velocity of the region overlapping the component placement area R. Thus, when the groove 122 covers the component placement area R, the heat dissipation efficiency of the component placement area R can be improved. In some embodiments, the second metal layer L2 also has a plurality of holes ( Figure 1A (Not shown) This increases the heat dissipation area and is more conducive to the dissipation of heat in the accommodating space S, preventing the heat generated by the electronic component E from accumulating in the accommodating space S.

[0033] The groove 122 of the second laminated structure 120 further includes a polymer layer 122b. The polymer layer 122b covers the second shielding layer 122a, and the second shielding layer 122a is located between the polymer layer 122b and the second portion 112 of the first laminated structure 110. In this embodiment, only the groove 122 of the second laminated structure 120 includes the polymer layer 122b, while the third portion 121 of the second laminated structure 120 does not include a polymer layer. In some embodiments, the third portion 121 of the second laminated structure 120 also includes a polymer layer.

[0034] The second laminated structure 120 further includes a cover layer 121c covering the first shielding layer 121a and a cover layer 122c covering the polymer layer 122b. The cover layer 121c is connected to the cover layer 122c and can be an integrally molded structure. The materials of the cover layers 121c and 122c include, but are not limited to, phenolic resin, epoxy resin (EP), polyphenylene oxide (PPO), polyimide (PI), polyester (PET), cyanate ester (CE), polytetrafluoroethylene (PTFE), or bismaleimide triazine (BT), etc.

[0035] In this embodiment, the first multilayer structure 110 further includes a front metal layer 102 and a back metal layer 103. The front metal layer 102 and the back metal layer 103 are, for example, copper layers, and copper circuits can be formed on each of them.

[0036] The shielded flexible circuit board 100 further includes a support layer 140. The support layer 140 is attached to a first laminated structure 110, and the first laminated structure 110 is located between a second laminated structure 120 and the support layer 140. The support layer 140 is configured to provide additional support force, thereby enhancing the mechanical strength of the shielded flexible circuit board 100 and preventing the shielded flexible circuit board 100 from breaking or severely deforming during application. In embodiments of this application, the support layer 140 is a steel sheet.

[0037] Please refer to Figure 1B , Figure 1BThis is a schematic diagram illustrating the unshielded state of the component placement area R of a shielded flexible circuit board 100 according to an embodiment of this application. Since the adhesive layer 130 can be a re-peelable adhesive, the groove 122 of the second laminated structure 120 can be opened to expose the second portion 112 of the first laminated structure 110 due to the re-peelable characteristic of the adhesive layer 130. This makes it easier for technicians to repair or replace electronic components E when they need to be soldered onto the component placement area R, or when electronic components E in the component placement area R are damaged. Furthermore, the groove 122 can be pivotally connected to the third portion 121 so that the groove 122 can rotate relative to the third portion 121, thereby exposing the second portion 112, such as... Figure 1B As shown.

[0038] After the electronic component E is installed or replaced, the edge of the slot 122 can be re-attached to the second part 112, achieving the effect of shielding the electronic component E again. Although Figure 1B The adhesive layer 130 shown is disposed on the second laminated structure 120, but it may also be disposed on the first laminated structure 110, or both may have an adhesive layer 130. This application is not limited to this.

[0039] Please refer to Figure 1C , Figure 1C This is a schematic diagram of the layout of the second layered structure 120 according to an embodiment of this application, wherein... Figure 1C Equivalent to Figure 1A The bottom view of the second layered structure 120 shows that the first shielding layer 121a and the second shielding layer 122a are arranged on the base plate LB1. The first shielding layer 121a of the third part 121 has copper lines C, and the first shielding layer 121a is interconnected with the second shielding layer 122a of the tank 122 through the copper lines C.

[0040] As previously described, the second shielding layer 122a includes a first metal layer L1 and a second metal layer L2, and the extent of the second metal layer L2 substantially overlaps with the underlying component placement area R. In this embodiment, the copper thickness on the second metal layer L2 is greater than the copper thickness on the first metal layer L1, and the second metal layer L2 also has multiple holes h1 to accelerate heat dissipation. In this embodiment, the first shielding layer 121a also has multiple blind vias h2, which can be used for electrical connection with the inner ground layer (not shown).

[0041] Please refer to Figure 1D , Figure 1D This is a schematic diagram of the layout of the first layered structure 110 according to an embodiment of this application, wherein... Figure 1D Equivalent to Figure 1AThe diagram shows a top view of the first layered structure 110, in which the pins or pads of electronic components E are laid out on the base plate LB2. The grid area is the default bonding location of the adhesive layer 130, and the area surrounded by the adhesive layer 130 is the component placement area R. The pins or pads of the electronic components E that need to be shielded can be placed in the component placement area R.

[0042] Please refer to Figure 2A , Figure 2A This is a schematic diagram of a shielded connection structure 200 according to an embodiment of this application. The shielded connection structure 200 includes a first flexible circuit board B1, a second flexible circuit board B2, and an adhesive layer 210. The first flexible circuit board B1 is provided with a first connector T1. The second flexible circuit board B2 includes a main body 220, a first laminated structure 230, and a second laminated structure 240, wherein the structures of the first laminated structure 230 and the second laminated structure 240 are similar. Figure 1A The second layered structure 120 shown is so detailed that related features will be omitted in the following text.

[0043] The main body 220 of the second flexible circuit board B2 is provided with a second connector T2, and the second connector T2 is configured to connect to the first connector T1. The first connector T1 and the second connector T2 may have corresponding structures, for example, one is a female connector structure and the other is a male connector structure. It should be understood that this application can also be applied to fields such as connectors or board-to-board connectors to achieve the function of shielding connecting elements, and those skilled in the art can understand and implement the first connector T1 and the second connector T2 based on the content of this application.

[0044] The first laminated structure 230 of the second flexible circuit board B2 is disposed above the main body 220 and includes a first portion 231 and a first groove 232. The first portion 231 of the first laminated structure 230 is attached to the upper part of the main body 220, while the first groove 232 connects to the first portion 231 and is used to cover the upper part of the first connector T1 and the second connector T2.

[0045] The second laminated structure 240 of the second flexible circuit board B2 is disposed below the main body 220 and includes a second portion 241 and a second groove 242. The second portion 241 of the second laminated structure 240 is attached to the lower part of the main body 220, and the second groove 242 is connected to the second portion 241 and is used to cover the lower part of the first connector T1 and the second connector T2.

[0046] When both the first groove 232 and the second groove 242 cover the first connector T1 and the second connector T2, a receiving space S' is formed between the first groove 232 and the second groove 242, so that the first connector T1 and the second connector T2 are both located within the receiving space S', thereby achieving a shielding effect. At this time, the adhesive layer 210 is attached between the end of the first groove 232 and the upper surface of the first flexible circuit board B1, and between the end of the second groove 242 and the lower surface of the first flexible circuit board B1.

[0047] It should be understood that, without departing from the scope of this application, the shape of the shielding space (i.e., the accommodating space S') formed between the first groove 232 and the second groove 242 can be ellipsoidal or spherical.

[0048] Adhesive layer 210 and Figure 1A The adhesive layer 130 shown is also a re-peelable adhesive, allowing the first groove 232 to be repeatedly peeled and bonded from the upper surface of the first flexible circuit board B1, and the second groove 242 to be repeatedly peeled and bonded from the lower surface of the first flexible circuit board B1. The materials that can be used for the adhesive layer 210 are the same as those described in the description of the adhesive layer 130, and will not be repeated here.

[0049] The first portion 231 of the first laminated structure 230 includes a first shielding layer 231a, and the first groove 232 includes a second shielding layer 232a, with the first shielding layer 231a connected to the second shielding layer 232a. The second portion 241 of the second laminated structure 240 includes a third shielding layer 241a, and the second groove 242 includes a fourth shielding layer 242a, with the third shielding layer 241a connected to the fourth shielding layer 242a.

[0050] The second shielding layer 232a includes a first metal layer L1 and a second metal layer L2, wherein the extent of the second metal layer L2 overlaps with the connection area of ​​the first connector T1 and the second connector T2 in the Z direction, and the thickness of the second metal layer L2 is greater than the thickness of the first metal layer L1. In some embodiments, the second metal layer L2 further has a plurality of holes ( Figure 2A (Not shown) This design is more conducive to heat dissipation in the accommodating space S' and prevents heat from accumulating in the accommodating space S'.

[0051] The fourth shielding layer 242a includes a third metal layer L3 and a fourth metal layer L4, wherein the extent of the fourth metal layer L4 overlaps with the connection area of ​​the first connector T1 and the second connector T2 in the Z direction, and the thickness of the fourth metal layer L4 is greater than the thickness of the third metal layer L3. In some embodiments, the fourth metal layer L4 further has a plurality of holes ( Figure 2A (Not shown) This design is more conducive to heat dissipation in the accommodating space S' and prevents heat from accumulating in the accommodating space S'.

[0052] Please refer to Figure 2B , Figure 2B This is a schematic diagram illustrating the shielded connection structure 200 according to an embodiment of this application, showing the first connector T1 and the second connector T2 in an unshielded state. Due to the reusable peelable characteristic of the adhesive layer 210, the first groove 232 and the second groove 242 can be opened to expose the connection areas of the first connector T1 and the second connector T2. This facilitates maintenance or replacement of the first connector T1 or the second connector T2 by technicians. Furthermore, the first groove 232 can be pivotally connected to the first portion 231, allowing the first groove 232 to rotate relative to the first portion 231, and the second groove 242 can be pivotally connected to the second portion 241, allowing the second groove 242 to rotate relative to the second portion 241, thereby exposing the connection areas of the first connector T1 and the second connector T2, such as... Figure 2B As shown.

[0053] After the first connector T1 or the second connector T2 is installed or replaced, the groove edge of the first groove 232 can be re-bonded to the upper surface of the first flexible circuit board B1, and the groove edge of the second groove 242 can be re-bonded to the lower surface of the first flexible circuit board B1, so as to achieve the effect of the first connector T1 and the second connector T2 again. Although Figure 1B The adhesive layer 210 shown is disposed on the first laminated structure 230 and the second laminated structure 240, but it can also be disposed on the first flexible circuit board B1, or all three may have an adhesive layer 210. This application is not limited to this.

[0054] Please refer to Figures 3A to 3I , Figures 3A to 3I This is a schematic diagram illustrating a method for manufacturing a shielded flexible circuit board according to an embodiment of this application. It should be understood that although only some operations are briefly described below, the manufacturing process may actually include other additional operations, and the provided manufacturing sequence is not intended to be limiting. For example, some operations may be performed in a different order, and some additional operations may be appropriately modified.

[0055] exist Figure 3A Firstly, a first stacked structure 110' is provided. The first stacked structure 110' includes a first portion 111 and a second portion 112, and the second portion 112 has a component placement area R.

[0056] In detail, the formation process of the first multilayer structure 110' further includes providing a substrate 101, a front metal layer 102, and a back metal layer 103. The front metal layer 102 and the back metal layer 103 may be, for example, copper layers, and may each be formed as circuit layers 102' and 103'. The circuit layers 102' and 103' may be formed by a semi-additive method or by a subtractive method, that is, the circuit layers 102' and 103' may be formed by photolithography and etching.

[0057] Next, the pads on circuit layers 102' and 103' are surface-treated, and a cover layer 104 is attached to circuit layers 102' and 103'. Surface treatment, for example, involves depositing a gold or nickel-gold layer on the pads to prevent oxidation due to prolonged contact with air. The surface treatment process for the pads can be electroless plating, such as immersion gold plating, and this application is not limited to this.

[0058] exist Figure 3B First, another substrate 201 is provided. Then, a metal layer (e.g., a copper layer) is deposited on the substrate 201 and formed into shielding layers 121a' and 122a' by a semi-additive or subtractive process. Then, the substrate 201 and the shielding layer 121a' thereon are bonded to the first portion 111 of the first laminated structure 110' by an adhesion layer 203.

[0059] exist Figure 3C In this process, a polymer layer 122b is bonded to the substrate 201 and the shielding layer 122a'.

[0060] exist Figure 3D In the middle, a cover layer 105 is attached below the first laminated structure 110' to form Figure 1A The first laminated structure 110 shown; and a cover layer 122c is attached above the shielding layer 121a' not covered by the polymer layer 122b and above the polymer layer 122b to form a second laminated structure 120'.

[0061] exist Figure 3E In this process, a support layer 140 is attached below the first laminated structure 110, wherein the material used for the support layer 140 is, for example, steel.

[0062] exist Figure 3F In the middle, the second layered structure 120' is folded backward.

[0063] exist Figure 3G In this configuration, the second layered structure 120' is positioned between the upper module 310 and the lower module 320 of the hot pressing device 300. For example... Figure 3GAs shown in the top view of the second laminated structure 120' extending along the dotted line, the second laminated structure 120' may be provided with a plurality of positioning holes h3 for the positioning pins 330 of the hot pressing device 300 to pass through, and to define the hot pressing zone 122' of the second laminated structure 120'.

[0064] exist Figure 3H In the middle, the upper module 310 and the lower module 320 deform the hot-pressing zone 122' of the second laminated structure 120', so that the hot-pressing zone 122' is formed as Figure 1A The groove 122 is shown. At this point, the second layered structure 120' is formed as follows: Figure 1A The second layered structure 120 is shown.

[0065] exist Figure 3I In the middle, an adhesive layer 130 is placed on the second laminated structure 120. At this point, the shielded flexible circuit board 100 is basically completed. Finally, the electronic component E is placed in the component placement area R to achieve shielding of the electronic component E.

[0066] According to the shielded connection structure, shielded flexible circuit board, and manufacturing method of this application, an electromagnetic shielding effect is achieved by covering the component placement area to be shielded within a space through the formation of a groove-shaped laminated structure. Furthermore, the groove-shaped laminated structure is bonded to another laminated structure using a re-peelable adhesive layer, making the components placed in the component placement area easier to repair or replace. In summary, this application not only achieves electromagnetic shielding by covering the component placement area but also overcomes the shortcomings of existing shielding covers that are difficult to repair and replace.

[0067] Although this application has been disclosed above with various embodiments, it is not intended to limit this application. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the appended claims.

[0068] [Symbol Explanation]

[0069] 100: Shielded Flexible Circuit Board

[0070] 101: Substrate

[0071] 102: Front metal layer

[0072] 102', 103': Line layer

[0073] 103: Reverse metal layer

[0074] 104, 105: Covering layer

[0075] 110,110': First layered structure

[0076] 111: Part One

[0077] 112: Part Two

[0078] 120,120': Second layered structure

[0079] 121: Part Three

[0080] 121a: First shielding layer

[0081] 121a': Shielding layer

[0082] 121c, 122c: Overlay layer

[0083] 122: Tank

[0084] 122': Hot pressing zone

[0085] 122a: Second shielding layer

[0086] 122a': Shielding layer

[0087] 122b: Polymer layer

[0088] 130: Adhesive layer

[0089] 140: Support layer

[0090] 200: Shielded connection structure

[0091] 201: Substrate

[0092] 203: Adhesion layer

[0093] 210: Adhesive layer

[0094] 220: Main Body

[0095] 230: First layered structure

[0096] 231: Part One

[0097] 231a: First shielding layer

[0098] 232: First tank

[0099] 232a: Second shielding layer

[0100] 240: Second layered structure

[0101] 241: Part Two

[0102] 241a: Third shielding layer

[0103] 242: Second tank

[0104] 242a: Fourth shielding layer

[0105] 300: Hot pressing device

[0106] 310: Upper Module

[0107] 320: Next Module

[0108] 330: Positioning pin

[0109] B1: First Flexible Circuit Board

[0110] B2: Second flexible circuit board

[0111] C: Copper circuit

[0112] E: Electronic components

[0113] h1: Hole

[0114] h2: blind hole

[0115] h3: Positioning hole

[0116] L1: First metal layer

[0117] L2: Second metal layer

[0118] L3: Third metal layer

[0119] L4: Fourth Metal Layer

[0120] LB1, LB2: Base Plate

[0121] Pin: Foot position

[0122] R: Component Setting Area

[0123] S,S': Accommodation space

[0124] T1: First connector

[0125] T2: Second connector

[0126] Z: Direction.

Claims

1. A shielded flexible circuit board, characterized in that, Include: The first layered structure includes: Part One; and The second part is connected to the first part, and the second part has a component setting area; The second layered structure is disposed on the first layered structure and includes: The third part fits onto the first part; and A groove, connecting the third part and used to cover the component placement area; and an adhesive layer, wherein when the groove covers the component placement area, the adhesive layer adheres to the groove edge of the groove and the second part.

2. The shielded flexible circuit board according to claim 1, characterized in that, The third part includes a first shielding layer, while the groove includes a second shielding layer, and the first shielding layer is connected to the second shielding layer.

3. The shielded flexible circuit board according to claim 2, characterized in that, The tank includes a polymer layer that covers the second shielding layer, and the second shielding layer is located between the polymer layer and the second portion.

4. The shielded flexible circuit board according to claim 2, characterized in that, The second shielding layer includes a first metal layer and a second metal layer. The first metal layer is connected to the second metal layer. The thickness of the second metal layer is greater than the thickness of the first metal layer. When the tank covers the component placement area, the second metal layer overlaps with the component placement area.

5. The shielded flexible circuit board according to claim 4, characterized in that, The second metal layer has multiple pores.

6. The shielded flexible circuit board according to claim 1, characterized in that, The adhesive layer is a re-peelable adhesive.

7. The shielded flexible circuit board according to claim 1, characterized in that, Also includes: A support layer is attached to the first laminated structure, wherein the first laminated structure is located between the second laminated structure and the support layer.

8. A shielded connection structure, characterized in that, Include: A first flexible circuit board is provided with a first connector; The second flexible circuit board includes: The main body is provided with a second connector, wherein the second connector is configured to connect to the first connector; A first layered structure, disposed above the main body, includes: The first part is attached to the main body; as well as A first groove, connecting the first portion and serving to cover the first connector and the second connector; and The second layered structure is disposed below the main body and includes: The second part is attached to the underside of the main body; as well as The second groove connects to the second part and is used to cover the first connector and the second connector, wherein when both the first groove and the second groove cover the first connector and the second connector, an accommodating space is formed between the first groove and the second groove, and both the first connector and the second connector are located within the accommodating space; as well as An adhesive layer, wherein when both the first groove and the second groove cover the first connector and the second connector, the adhesive layer is adhered between the end of the first groove and the upper surface of the first flexible circuit board, and adhered between the end of the second groove and the lower surface of the first flexible circuit board.

9. A method for manufacturing a shielded flexible circuit board, characterized in that, Include: A first stacked structure is provided, wherein the first stacked structure includes a first portion and a second portion, and the second portion has a component placement area; A second layered structure is provided, wherein the second layered structure includes a third portion and a fourth portion; The third part is attached to the first part; The fourth part is deformed to transform it into a groove. as well as An adhesive layer is disposed on at least one of the second portion and the fourth portion, wherein the adhesive layer is used to bond the second portion to the tank.

10. The manufacturing method according to claim 9, characterized in that, The step of forming the second layered structure further includes: A metal layer is disposed on a substrate, wherein the metal layer comprises a first metal layer and a second metal layer, and the second metal layer overlaps with the component placement area; Multiple holes are formed in the second metal layer; A polymer layer is coated on the first metal layer and the second metal layer; as well as A cover layer is applied to the third part and the polymer layer.

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