Photoelectric packaging structure and camera module
By employing a multi-layer circuit structure and rewiring layer technology in the camera module, the photosensitive chip and the circuit layer are directly connected, solving the problems of long signal paths in wire bonding packaging and high flatness of flip-chip packaging substrates, thus achieving high-quality signal transmission and miniaturized packaging.
Patent Information
- Application Number
- CN202411159134.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2026-03-03
AI Technical Summary
The existing wire bonding packaging of camera modules results in long signal conduction paths and low signal transmission quality. Furthermore, the flip-chip packaging process has high requirements for substrate flatness and is not widely applicable.
The substrate module employs a multi-layer circuit structure and redistribution layer process, directly connecting the photosensitive chip and the circuit layer through the first conductive channel, reducing signal transmission paths, and protecting the photosensitive chip through a plastic encapsulation module, avoiding the limitations of additional connection media and symmetrical distribution of solder joints.
It improves signal transmission quality, reduces the lateral dimensions of the package structure, facilitates miniaturization, reduces the requirements for substrate flatness, and enhances the robustness and reliability of the package structure.
Smart Images
Figure CN121604529A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor packaging technology, and in particular to an optoelectronic packaging structure and a camera module having the optoelectronic packaging structure. Background Technology
[0002] A camera module typically consists of a circuit board and a photosensitive chip mounted on the circuit board. The photosensitive chip is usually connected to the conductive pads of the circuit board using wire bonding or flip-chip packaging processes to achieve signal connection.
[0003] However, wire bonding, which connects the photosensitive chip to the circuit board via metal leads, results in a longer signal path, reducing signal transmission quality. Furthermore, the wire bonding process requires a certain amount of space between the photosensitive chip and the conductive pads on the circuit board, increasing the lateral dimension between them. Flip-chip packaging requires a high degree of flatness and symmetrically distributed solder joints on the circuit board, limiting its versatility. Summary of the Invention
[0004] In view of this, it is necessary to provide an optoelectronic packaging structure and a camera module having the optoelectronic packaging structure.
[0005] This application provides a first aspect of an optoelectronic packaging structure, including a substrate module, a photosensitive chip, and a molding compound module. The substrate module includes a dielectric layer and a first multilayer circuit structure disposed within the dielectric layer. The dielectric layer includes a first surface and a second surface disposed opposite to each other. The first multilayer circuit structure includes a first circuit layer and a second circuit layer stacked in the thickness direction of the substrate module. The first circuit layer includes a first conductive pad and a first conductive portion connected together. The second circuit layer includes a second conductive pad and a second conductive portion. The second conductive pad and the second conductive portion are exposed on the second surface, and the first conductive portion and the second conductive portion are electrically connected in the thickness direction of the substrate module to form a first conductive channel. The photosensitive chip is disposed on the second surface and includes a photosensitive region and a non-photosensitive region connected together. The non-photosensitive region has a connecting pad facing the second surface, and the second conductive portion connects to the connecting pad, so that the photosensitive chip is electrically connected to the first circuit layer through the first conductive channel. The molding compound module is disposed on the second surface and encapsulates the photosensitive chip.
[0006] A second aspect of this application provides a camera module, including a lens assembly. The camera module also includes the aforementioned optoelectronic packaging structure. The lens assembly is disposed on the side of the substrate module of the optoelectronic packaging structure opposite to the plastic-encapsulated module.
[0007] In this application, the connecting pad directly contacts the second conductive portion of the second circuit layer and is electrically connected to the first conductive pad of the first circuit layer through the first conductive channel. Through a redistribution layer process, the first conductive pad redistributes the connecting pad to transmit the electrical signals of the photosensitive chip to external components via the first multilayer circuit structure. Since the connecting pad and the first conductive channel are in direct contact, no additional connection medium is required between them. Compared to wire bonding packaging, the signal conduction path of the first conductive channel in this application is shorter, which is beneficial for improving signal transmission quality. Furthermore, it eliminates the need for reserved working space for wire bonding tools, which helps reduce the lateral dimensions of the optoelectronic packaging structure, thus facilitating the miniaturization of optoelectronic packaging structures. Simultaneously, compared to flip-chip packaging, this application is not limited to photosensitive chips with symmetrically distributed solder joints, nor is it limited by the size of the metal balls, thus avoiding excessively high requirements for substrate flatness. Attached Figure Description
[0008] Figure 1 This is a module architecture diagram of a camera module provided in one embodiment of this application.
[0009] Figure 2 for Figure 1 The diagram shows the optoelectronic packaging structure of the camera module in some embodiments.
[0010] Figure 3 for Figure 1 The diagram shows the optoelectronic packaging structure of the camera module in some other embodiments.
[0011] Figure 4 This is a schematic diagram of an optoelectronic packaging structure provided in another embodiment of this application.
[0012] Figure 5 This is a schematic diagram of the optoelectronic packaging structure in some other embodiments.
[0013] Figure 6 This is a schematic diagram of an optoelectronic packaging structure provided in another embodiment of this application.
[0014] Explanation of main component symbols
[0015] Camera Module 1
[0016] Lens Component 2
[0017] Baseboard Module 10
[0018] Dielectric layer 11
[0019] First surface 11A
[0020] Second surface 11B
[0021] First multi-layer circuit structure 12
[0022] First conductive channel 13
[0023] Through hole 14
[0024] Second multi-layer circuit structure 15
[0025] Image sensor 20
[0026] Photosensitive area 21
[0027] Non-photosensitive area 22
[0028] Molded module 30
[0029] 31 Molded body
[0030] Third surface 31A
[0031] Fourth surface 31B
[0032] Second conductive channel 32
[0033] First solder pad 33
[0034] First electronic component 40
[0035] Optoelectronic packaging structures 100, 200, 300
[0036] First substrate region 111
[0037] Second substrate region 112
[0038] First line layer 121
[0039] Second line layer 122
[0040] Third line layer 123
[0041] Connecting pad 220
[0042] Solder ball 330
[0043] First conductive part 1210
[0044] First conductive pad 1211
[0045] Second solder pad 1212
[0046] Second conductive part 1220
[0047] Second conductive pad 1221
[0048] Third conductive part 1230
[0049] Third conductive pad 1231
[0050] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0051] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0052] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.
[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0054] Implementation Method 1
[0055] Please see Figure 1 This application provides a camera module 1, which includes a lens assembly 2 and an optoelectronic packaging structure 100. The lens assembly 2 has a light broadcasting path for allowing external light to pass through. The optoelectronic packaging structure 100 is used to receive external light passing through the lens assembly 2 to form an optical signal, and convert the optical signal into a corresponding electrical signal, that is, to realize photoelectric conversion.
[0056] Please see Figure 2The optoelectronic packaging structure 100 includes a substrate module 10, a photosensitive chip 20, and a molding module 30. The substrate module 10 includes a dielectric layer 11 and a first multilayer circuit structure 12. The dielectric layer 11 includes a first surface 11A and a second surface 11B disposed opposite to each other; the lens assembly 2 may be disposed on the first surface 11A. The first multilayer circuit structure 12 is disposed within the dielectric layer 11 and includes a first circuit layer 121, a second circuit layer 122, and a third circuit layer 123. The first circuit layer 121, the second circuit layer 122, and the third circuit layer 123 are stacked in the thickness direction of the substrate module 10, and are electrically connected to each other. The first circuit layer 121 and the second circuit layer 122 may be outer circuit layers, and the third circuit layer 123 is at least one and located between the first circuit layer 121 and the second circuit layer 122. That is, the first multilayer circuit structure 12 may include at least three circuit layers. It is understood that in other embodiments, the first multilayer circuit structure 12 may also include only two circuit layers, and the two circuit layers are stacked in the thickness direction of the substrate module 10. The first circuit layer 121 includes a first conductive pad 1211 and a first conductive portion 1210, the first conductive pad 1211 and the first conductive portion 1210 are interconnected, and the first conductive pad 1211 and the first conductive portion 1210 are exposed on the first surface 11A.
[0057] The second circuit layer 122 includes a second conductive pad 1221 and a second conductive portion 1220. The second conductive pad 1221 and the second conductive portion 1220 are exposed on the second surface 11B. The first conductive portion 1210 and the second conductive portion 1220 are electrically connected in the thickness direction of the substrate module 10 to form a first conductive channel 13. The first conductive channel 13 is disposed within the dielectric layer 11 and extends through the first surface 11A and the second surface 11B. The first conductive channel 13 may extend along the thickness direction of the substrate module 10. The substrate module 10 may also include a through-hole 14 disposed within the dielectric layer 11. The through-hole 14 extends through the first surface 11A and the second surface 11B, and the position of the through-hole 14 avoids the first multilayer circuit structure 12. In some embodiments, the first multilayer circuit structure 12 and the first conductive channel 13 respectively contain conductive materials, which may be conductive ink or metal materials. The conductive ink may contain at least one element selected from silver, platinum, gold, copper, nickel, and aluminum. The metal material may be silver, copper, or gold. Each conductive portion (i.e., the first conductive portion 1210, the second conductive portion 1220, and the third conductive portion 1230) of the first conductive channel 13 can be obtained by forming a hollow channel in the dielectric layer 11 and filling the hollow channel with conductive material. In some embodiments, the material of the dielectric layer 11 can be selected from resins such as epoxy resin, polyphenylene ether, polyimide, polyethylene terephthalate, and polyethylene naphthalate.
[0058] A photosensitive chip 20 is disposed on the second surface 11B. The photosensitive chip 20 includes a photosensitive area 21 and a non-photosensitive area 22 connected together. The photosensitive area 21 corresponds to the through-hole 14 and is used to receive the light signal formed by external light propagating from the lens assembly 2 and convert the light signal into an electrical signal. The non-photosensitive area 22 may be disposed around the photosensitive area 21. A connecting pad 220 facing the second surface 11B may be provided on the non-photosensitive area 22. A second conductive portion 1220 is connected to the connecting pad 220, so that the photosensitive chip 20 is electrically connected to the first circuit layer 121 through the first conductive channel 13. Through the redistribution layer (RDL) process, the first conductive pad 1211 redistributes the connecting pad 220 of the non-photosensitive area 22 to transmit the electrical signal of the photosensitive chip 20 to external components (such as system terminals, circuit boards, or chips) through the first multilayer circuit structure 12. The specific position of the first conductive pad 1211 in the dielectric layer 11 can be adjusted.
[0059] A molding compound module 30 is disposed on the second surface 11B. The molding compound module 30 includes a molding compound body 31. The molding compound body 31 covers at least the side surface of the photosensitive chip 20, and the molding compound body 31 can improve the stability and reliability of the photosensitive chip 20. The molding compound body 31 includes a third surface 31A facing the second surface 11B and a fourth surface 31B disposed opposite to the third surface 31A. In some embodiments, the fourth surface 31B may be located below the photosensitive chip 20, that is, the molding compound body 31 may also cover the bottom surface of the photosensitive chip 20. In some embodiments, the molding compound body 31 is made of at least one of epoxy resin and phenolic resin.
[0060] In the optoelectronic packaging structure 100 of this application, the connecting pad 220 is in direct contact with the second conductive portion 1220 of the second circuit layer 122, and is electrically connected to the first circuit layer 121 through the first conductive channel 13. That is, the connecting pad 220 and the first conductive channel 13 are in direct contact, and no additional connecting medium is required between them. Compared with the existing wire bonding packaging process, the signal conduction path of the first conductive channel 13 in this application is shorter, which is beneficial to improving signal transmission quality. Moreover, it does not require the operating space needed for the wire bonding tool, which is beneficial to reducing the lateral dimension of the optoelectronic packaging structure 100, and thus is beneficial to the miniaturization of the optoelectronic packaging structure 100. At the same time, compared with the flip-chip packaging process, this application is not limited to using photosensitive chips with symmetrically distributed solder joints, and is not limited by the size of the metal ball, which leads to excessively high requirements for substrate flatness. In addition, since the lens assembly 2 is disposed on the first surface 11A, the lens assembly 2 can also protect the photosensitive area 21 of the photosensitive chip 20, reducing the risk of damage to the photosensitive area 21 due to external forces. Since the first surface 11A is relatively flat, it is also beneficial to install the lens assembly 2 on the first surface 11A and increase the bonding area between the lens assembly 2 and the substrate module 10, thereby improving the bonding strength between the lens assembly 2 and the substrate module 10.
[0061] In some embodiments, the connection pad 220 and the first multilayer circuit structure 12 are made of the same conductive material. For example, both the connection pad 220 and the first multilayer circuit structure 12 may be made of silver. Using the same conductive material is beneficial for further improving signal transmission quality.
[0062] In some embodiments, the third circuit layer 122 includes a third conductive pad 1231 and a third conductive portion 1230. The two sides of the third conductive portion 1230 are respectively connected to a first conductive portion 1210 and a second conductive portion 1220, and the first conductive portion 1210, the second conductive portion 1220, and the third conductive portion 1230 together form the aforementioned first conductive channel 13. The molding compound module 30 also includes a second conductive channel 32 and a first solder pad 33. The second conductive channel 32 is disposed within the molding compound 31 and a portion of the dielectric layer 11, and the second conductive channel 32 penetrates the third surface 31A and the fourth surface 31B of the molding compound 31. The first solder pad 33 is exposed on the fourth surface 31B. The two ends of the second conductive channel 32 are respectively connected to the third conductive pad 1231 and the first solder pad 33. By exposing the first solder pad 33 on the fourth surface 31B, it is convenient for the first solder pad 33 to connect with external components. Thus, the electrical signal generated by the photosensitive chip 20 can be sequentially transmitted to the external component via the first conductive channel 13, the first multilayer circuit structure 12, the second conductive channel 32, and the first solder pad 33. That is, the first conductive channel 13 and the second conductive channel 32 can cooperate to transmit the electrical signal from the lower fourth surface 31B. In some embodiments, the second conductive channel 32 and the first solder pad 33 each contain a conductive material, which can be conductive ink or a metal material. The conductive ink may contain at least one element selected from silver, platinum, gold, copper, nickel, and aluminum. The metal material may be silver, copper, or gold. In some embodiments, the connecting pad 220, the first multilayer circuit structure 12, the second conductive channel 32, and the first solder pad 33 are made of the same conductive material, thereby further improving the signal transmission quality.
[0063] Please see Figure 3 In some embodiments, solder balls 330 may also be disposed on the first solder pad 33. External components may be disposed on the solder balls 330, thereby allowing electrical signals transmitted to the photosensitive chip 20 on the first solder pad 33 to be further conducted to the external components via the solder balls 330. The solder balls 330 may be made of solder balls.
[0064] like Figure 2As shown, the optoelectronic packaging structure 100 may further include a first electronic component 40 connected to the second conductive pad 1221, and the molding compound 31 further covers the first electronic component 40. Thus, through a redistribution layer process, the first conductive pad 1211 redistributes the connecting pads 220 of the non-photosensitive area 22 to transmit the electrical signals of the photosensitive chip 20 to the first electronic component 40, and then to external components via the first electronic component 40. The first electronic component 40 can be an active component or a passive component. Active components include transistors, integrated circuits, or image tubes, while passive components include resistors, inductors, and capacitors. In some specific embodiments, the first electronic component 40 is an active component.
[0065] Implementation Method 2
[0066] Please see Figure 4 This application also provides an optoelectronic packaging structure 200. The difference between this and the optoelectronic packaging structure 100 lies in the position of the second conductive channel 32. Specifically, the second conductive channel 32 is disposed within the molding compound 31 and extends through the third surface 31A and the fourth surface 31B. The second conductive channel 32 does not extend into the dielectric layer 11. The first solder pad 33 is exposed on the fourth surface 31B, and the two ends of the second conductive channel 32 are respectively connected to the second conductive pad 1221 and the first solder pad 33.
[0067] like Figure 5 As shown, in some embodiments, solder balls 330 may also be provided on the first solder pad 33. The solder balls 330 may be made of solder balls.
[0068] In some embodiments, the substrate module 10 may further include a second multilayer circuit structure 15 disposed within the dielectric layer 11. The second multilayer circuit structure 15 is electrically connected to the first multilayer circuit structure 12. The second multilayer circuit structure 15 constitutes a second electronic component. The second electronic component can be an active component or a passive component. Active components include transistors, integrated circuits, or image tubes, while passive components include resistors, inductors, and capacitors. In some specific embodiments, the second electronic component is a passive component. In some embodiments, the second multilayer circuit structure 15, the first multilayer circuit structure 12, and the first conductive channel 13 each contain a conductive material, which can be conductive ink or a metallic material. The conductive ink may contain at least one element selected from silver, platinum, gold, copper, nickel, and aluminum. The metallic material may be silver, copper, or gold.
[0069] Implementation Method 3
[0070] Please see Figure 6This application also provides an optoelectronic packaging structure 300. The difference from the optoelectronic packaging structure 100 described above lies in the structure of the substrate module 10. Specifically, the substrate module 10 includes a first substrate region 111 and a second substrate region 112 connected together. Viewed from the thickness direction of the substrate module 10, the first substrate region 111 overlaps with the molding compound module 30, and the second substrate region 112 extends beyond the molding compound module 30; that is, the width of the substrate module 10 is greater than the width of the molding compound module 30. The first circuit layer 121 also includes a second solder pad 1212, with the first conductive pad 1211 and the second solder pad 1212 located in the first substrate region 111 and the second substrate region 112, respectively. The second solder pad 1212 is exposed on the first surface 11A, thus facilitating the connection of external components to the second solder pad 1212. At this time, the electrical signal generated by the photosensitive chip 20 can be exported from the uppermost first surface 11A.
[0071] The first multilayer circuit structure 12 is located within the first substrate region 111 and extends into the second substrate region 112. When the first multilayer circuit structure 12 includes a first circuit layer 121, at least one third circuit layer 123, and a second circuit layer 122, either the first circuit layer 121 or the third circuit layer 123 is partially located within the first substrate region 111, and the other part is located within the second substrate region 112; the second circuit layer 122 is located only within the first substrate region 111. The first circuit layer 121 within the first substrate region 111 can be fabricated simultaneously with the first circuit layer 121 within the second substrate region 112, and the third circuit layer 123 within the first substrate region 111 can be fabricated simultaneously with the third circuit layer 123 within the second substrate region 112.
[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.
Claims
1. A photoelectric packaging structure, characterized in that, include: A substrate module includes a dielectric layer and a first multilayer circuit structure disposed within the dielectric layer. The dielectric layer includes a first surface and a second surface disposed opposite to each other. The first multilayer circuit structure includes a first circuit layer and a second circuit layer stacked in the thickness direction of the substrate module. The first circuit layer includes a first conductive pad and a first conductive portion connected to each other. The second circuit layer includes a second conductive pad and a second conductive portion. The second conductive pad and the second conductive portion are exposed on the second surface. The first conductive portion and the second conductive portion are electrically connected in the thickness direction to form a first conductive channel. A photosensitive chip is disposed on the second surface. The photosensitive chip includes a photosensitive area and a non-photosensitive area connected together. The non-photosensitive area is provided with a connection pad facing the second surface. The second conductive part is connected to the connection pad, so that the photosensitive chip is electrically connected to the first circuit layer through the first conductive channel. as well as A plastic-encapsulated module is disposed on the second surface and covers the photosensitive chip.
2. The optoelectronic packaging structure as described in claim 1, characterized in that, The first multilayer circuit structure further includes a third circuit layer located between the first circuit layer and the second circuit layer. The third circuit layer includes a third conductive pad and a third conductive portion. The two sides of the third conductive portion are electrically connected to the first conductive portion and the second conductive portion respectively to jointly form the first conductive channel. The molding module includes a molding body, a second conductive channel, and a first solder pad. The molding body encapsulates the photosensitive chip. The molding body includes a third surface facing the second surface and a fourth surface opposite to the third surface. The second conductive channel is disposed within the molding body and a portion of the dielectric layer, and the second conductive channel penetrates the third surface and the fourth surface. The first solder pad is exposed on the fourth surface and configured to connect to external components. The two ends of the second conductive channel are respectively connected to the third conductive pad and the first solder pad.
3. The optoelectronic packaging structure as described in claim 2, characterized in that, The optoelectronic packaging structure further includes a first electronic component, and the molding compound further covers the first electronic component, with the first electronic component connected to the second conductive pad.
4. The optoelectronic packaging structure as described in claim 1, characterized in that, The molding module includes a molding body, a second conductive channel, and a first solder pad. The molding body covers the photosensitive chip. The molding body includes a third surface facing the second surface and a fourth surface opposite to the third surface. The second conductive channel is disposed within the molding body and extends through the third surface and the fourth surface. The first solder pad is exposed on the fourth surface and is configured to connect to external components. The two ends of the second conductive channel are respectively connected to the second conductive pad and the first solder pad.
5. The optoelectronic packaging structure as described in claim 4, characterized in that, The substrate module further includes a second multilayer circuit structure, which is disposed within the dielectric layer and electrically connected to the first multilayer circuit structure. The second multilayer circuit structure constitutes a second electronic component.
6. The optoelectronic packaging structure according to any one of claims 2 to 5, characterized in that, The first solder pad has solder balls.
7. The optoelectronic packaging structure according to any one of claims 2 to 5, characterized in that, The connecting pad, the first multilayer circuit structure, the second conductive channel, and the first solder pad are all made of the same conductive material.
8. The optoelectronic packaging structure as described in claim 1, characterized in that, The substrate module includes a first substrate region and a second substrate region connected to each other. The first substrate region overlaps with the molding module, and the second substrate region extends out of the molding module. The first multilayer circuit structure is located in the first substrate region and extends to the second substrate region. The first conductive pad and the second conductive pad are located in the first substrate region. The first circuit layer also includes a second solder pad, which is located in the second substrate region. The second solder pad is exposed on the first surface and is configured to connect to external components.
9. The optoelectronic packaging structure as described in claim 1, characterized in that, The substrate module is provided with a through hole, which is disposed away from the first multilayer circuit structure, and the photosensitive area is exposed in the through hole.
10. A camera module, comprising a lens assembly, characterized in that, The camera module further includes an optoelectronic packaging structure as described in any one of claims 1 to 9, wherein the lens assembly is disposed on the side of the substrate module of the optoelectronic packaging structure opposite to the plastic encapsulation module.