Photoelectric packaging structure, preparation method thereof and camera module
By embedding the photosensitive chip within a plastic package and forming a conductive structure within the package, combined with a cover plate module to achieve system-level packaging, the problems of space required for connection between the photosensitive chip and the circuit board and warping deformation are solved, thus realizing the miniaturization and quality improvement of the camera module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2026-03-03
AI Technical Summary
In existing camera modules, the connection between the photosensitive chip and the circuit board requires reserved space, which increases the lateral size. Furthermore, the circuit board is prone to warping and deformation at high temperatures, affecting the miniaturization and quality of the camera module.
By adopting an optoelectronic packaging structure, the photosensitive chip is embedded in a plastic package. A conductive structure is formed by creating a hollow channel in the plastic package and filling it with conductive material. A cover module is set on the plastic package to achieve system-level packaging, eliminating the need for metal wire connections. The cover module is used as a carrier for some circuit layers, increasing the freedom of rewiring.
Reducing the lateral dimensions of the optoelectronic packaging structure facilitates miniaturization, lowers the risk of warpage and deformation, and improves the quality of the packaging structure.
Smart Images
Figure CN121604530A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor packaging technology, and in particular to an optoelectronic packaging structure, a method for preparing the optoelectronic packaging structure, and a camera module having the optoelectronic packaging structure. Background Technology
[0002] A camera module typically consists of a circuit board and a photosensitive chip mounted on the circuit board. The photosensitive chip is usually wire-bonded to the conductive pads of the circuit board to achieve signal connection.
[0003] However, wire bonding requires a certain amount of space between the photosensitive chip and the conductive pads on the circuit board, increasing the lateral dimensions between them. Furthermore, due to manufacturing limitations, the line width and spacing of the circuit board cannot be further reduced, hindering the miniaturization of camera modules. In addition, both the circuit board manufacturing process and wire bonding involve heat treatment, and the circuit board is prone to warping and deformation at high temperatures, reducing the quality of the camera module. Summary of the Invention
[0004] In view of this, it is necessary to provide an optoelectronic packaging structure, a method for preparing the optoelectronic packaging structure, and a camera module having the optoelectronic packaging structure.
[0005] This application provides a first aspect of an optoelectronic packaging structure, including a substrate module, a photosensitive chip, and a cover module. The substrate module includes a molding compound and a first conductive structure. The molding compound includes a first surface and a second surface disposed opposite to each other. The first conductive structure includes a first conductive channel, a second conductive channel, a first conductive pad, a second conductive pad, and a third conductive pad. The first and second conductive channels are respectively disposed within the molding compound, the first conductive pad is exposed on the first surface, and the second and third conductive pads are exposed on the second surface. The two ends of the first conductive channel are respectively connected to the first conductive pad and the second conductive pad. The photosensitive chip is disposed within the molding compound. The photosensitive chip includes a photosensitive area and a non-photosensitive area connected together. The two ends of the second conductive channel are respectively connected to the non-photosensitive area and the third conductive pad. The cover module is disposed on the second surface. The cover module includes a cover body and a second conductive structure. The cover body includes a third surface facing the second surface. The second conductive structure includes a fourth conductive pad exposed on the third surface, and the fourth conductive pad is respectively connected to the second conductive pad and the third conductive pad.
[0006] A second aspect of this application provides a method for fabricating an optoelectronic packaging structure, comprising: encapsulating a photosensitive chip with a molding compound, the photosensitive chip including a photosensitive region and a non-photosensitive region connected together, the molding compound including a first surface and a second surface disposed opposite to each other, the photosensitive region being exposed on the second surface; forming a first hollow channel and a second hollow channel within the molding compound using a laser, the first hollow channel penetrating the first surface from the second surface and the second hollow channel extending from the second surface to the non-photosensitive region; filling the first hollow channel with a conductive material and curing it to obtain a first conductive pad, a second conductive pad, and a first conductive channel, the first conductive pad being exposed on the first surface. On the surface, a second conductive pad is exposed on the second surface, and the two ends of the first conductive channel are respectively connected to the first conductive pad and the second conductive pad; a conductive material is filled into the second hollow channel and cured to obtain a second conductive channel and a third conductive pad, the third conductive pad being exposed on the second surface, and the two ends of the second conductive channel being respectively connected to the non-photosensitive area and the third conductive pad; a cover plate module is disposed on the second surface, the cover plate module including a cover plate body and a second conductive structure, the cover plate body including a third surface facing the second surface, the second conductive structure including a fourth conductive pad exposed on the third surface, and the fourth conductive pad being respectively connected to the second conductive pad and the third conductive pad.
[0007] A third aspect of this application provides a camera module, including a lens assembly. The camera module also includes the optoelectronic packaging structure as described above. The lens assembly is disposed on the cover plate module of the optoelectronic packaging structure.
[0008] This application embeds a photosensitive chip within a molding compound. A hollow channel is created within the molding compound and filled with conductive material to form a first conductive structure. A cover module is then placed on the molding compound to achieve system-in-package (SIP). The first conductive structure connects the non-photosensitive areas of the photosensitive chip, enabling electrical interconnection between the photosensitive chip and the substrate module. Furthermore, the second conductive structure of the cover module connects the second and third conductive pads of the first conductive structure, forming a more complete circuit layer. This constructs an electrical connection path consisting of the photosensitive chip, the second conductive channel, the third conductive pad, the fourth conductive pad, the second conductive pad, the first conductive channel, and the first conductive pad, allowing electrical interconnection between the photosensitive chip and the substrate module. This application eliminates the need for metal wires, thus eliminating the need for space for wire bonding tools, which helps reduce the lateral dimensions of the optoelectronic packaging structure and facilitates its miniaturization. Moreover, compared to existing circuit board wiring processes, the cover plate module in this application can also serve as a carrier for some circuit layers, increasing the freedom of rewiring. Furthermore, the first conductive structure can be formed by opening a hollow channel in the molding compound and filling it with conductive material, which helps to reduce the warping deformation of the carrier and thus improve the quality of the optoelectronic packaging structure. Attached Figure Description
[0009] Figure 1This is a module architecture diagram of a camera module provided in one embodiment of this application.
[0010] Figure 2 for Figure 1 The diagram shows the optoelectronic packaging structure of the camera module.
[0011] Figure 3 This is a schematic diagram of a structure in which a photosensitive chip and electronic components are placed on a first carrier plate according to one embodiment of this application.
[0012] Figure 4 In order to be in Figure 3 The diagram shows the structure after the first plastic sealant block is installed on the first carrier plate.
[0013] Figure 5A To remove Figure 4 The diagram shows the structure of the first carrier board after the circuit pattern is set at the bottom of the first encapsulated block.
[0014] Figure 5B for Figure 5A A top view of the first molding block, photosensitive chip, and electronic components.
[0015] Figure 6 To be Figure 5A The diagram shows the structure after the first molding block is placed on the second carrier plate and the second molding block is set on the first molding block.
[0016] Figure 7A In order to be in Figure 6 The diagram shows the structure of the first and second encapsulated blocks after hollow channels are opened and filled with conductive material.
[0017] Figure 7B for Figure 7A A top view of the second molding block, photosensitive chip, and electronic components.
[0018] Figure 8 In order to be in Figure 7A A schematic diagram of the substrate module obtained after solder is applied to the first conductive structure shown.
[0019] Figure 9 This is a schematic diagram of the structure of a cover plate body having a first film layer and a second film layer, provided in one embodiment of this application.
[0020] Figure 10 In order to be in Figure 9 The diagram shows the structure after an insulating protective layer is installed on the cover plate body.
[0021] Figure 11A In order to be in Figure 10 The diagram shows the structure of the cover plate module obtained after setting a second conductive structure on the insulating protective layer.
[0022] Figure 11B for Figure 11A Top view of the cover plate module.
[0023] Figure 12 To be Figure 11A The diagram shows the structure of the cover plate body after it is installed on the base plate module shown in the figure.
[0024] Figure 13 To Figure 12 The diagram shows the structure after the cover plate module has been processed and a sealing material has been placed between the cover plate module and the base plate module.
[0025] Figure 14 A schematic diagram of an optoelectronic packaging structure provided for another embodiment.
[0026] Figure 15 A schematic diagram of the cover plate body having a second conductive structure provided for another embodiment.
[0027] Figure 16 In order to be in Figure 15 The diagram shows the structure of the cover plate after the groove is made.
[0028] Figure 17 In order to be in Figure 16 The diagram shows the structure of the cover plate module obtained after the first and second membrane layers are applied to the cover plate body.
[0029] Explanation of main component symbols
[0030] Camera Module 1
[0031] Lens Component 2
[0032] First carrier plate 3
[0033] carrier substrate 3a
[0034] Peelable layer 3b
[0035] Second carrier plate 4
[0036] Baseboard Module 10
[0037] Molded body 11
[0038] First surface 11A
[0039] Second surface 11B
[0040] First conductive structure 12
[0041] Image sensor 20
[0042] Photosensitive area 21
[0043] Non-photosensitive area 22
[0044] Cover module 30
[0045] Cover body 31
[0046] Third surface 31A
[0047] Fourth surface 31B
[0048] Second conductive structure 32
[0049] First membrane layer 33
[0050] Second film layer 34
[0051] Electronic Components 40
[0052] Sealing material 50
[0053] Optoelectronic packaging structure 100
[0054] First plastic sealant block 111
[0055] Second plastic sealant block 112
[0056] First conductive channel 121
[0057] Second conductive channel 122
[0058] First conductive pad 123
[0059] Second conductive pad 124
[0060] Third conductive pad 125
[0061] Third conductive channel 126
[0062] Fifth conductive pad 127
[0063] Connecting pad 220
[0064] Groove 310
[0065] Matrix 311
[0066] Insulation protective layer 312
[0067] Fourth conductive pad 321
[0068] Solder balls 1230, 1240
[0069] First hollow passage P1
[0070] Second hollow passage P2
[0071] Third hollow passage P3
[0072] First graphic opening O1
[0073] Circuit pattern O2
[0074] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0075] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0076] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.
[0077] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0078] Implementation Method 1
[0079] Please see Figure 1 This application provides a camera module 1, which includes a lens assembly 2 and an optoelectronic packaging structure 100. The lens assembly 2 has a light broadcasting path for allowing external light to pass through. The optoelectronic packaging structure 100 is used to receive external light passing through the lens assembly 2 to form an optical signal, and convert the optical signal into a corresponding electrical signal, that is, to realize photoelectric conversion.
[0080] Please see Figure 2The optoelectronic packaging structure 100 includes a substrate module 10, a photosensitive chip 20, and a cover plate module 30. The substrate module 10 includes a molding compound 11 and a first conductive structure 12 disposed on the molding compound 11. The molding compound 11 includes a first surface 11A and a second surface 11B disposed opposite to each other. The first conductive structure 12 includes a first conductive channel 121, a second conductive channel 122, a first conductive pad 123, a second conductive pad 124, and a third conductive pad 125. The first conductive channel 121 and the second conductive channel 122 are respectively disposed within the molding compound 11. The first conductive pad 123 is exposed on the first surface 11A, and the second conductive pad 124 and the third conductive pad 125 are exposed on the second surface 11B. The two ends of the first conductive channel 121 are respectively connected to the first conductive pad 123 and the second conductive pad 124. One end of the second conductive channel 122 is connected to the third conductive pad 125. In some embodiments, solder balls 1230 may be disposed on the first conductive pad 123, and other components (such as circuit boards or chips) may be connected to the solder balls 1230, so that the electrical signals transmitted to the first conductive pad 123 can be further transmitted out through the solder balls 1230. The solder balls 1230 may be made of solder balls.
[0081] In some embodiments, the first conductive structure 12 includes a conductive material, which may be conductive ink or a metallic material. The conductive ink may contain at least one element selected from silver, platinum, gold, copper, nickel, and aluminum. The metallic material may be copper, gold, or silver. The first conductive structure 12 can be obtained by creating a hollow channel in the encapsulation 11 and filling the hollow channel with conductive material. In some specific embodiments, filling the conductive material may be done by spraying conductive ink, electroplating copper, electroplating gold, or electroplating silver.
[0082] The photosensitive chip 20 is disposed within a molding compound 11, which improves the stability of the photosensitive chip 20. The photosensitive chip 20 includes a connected photosensitive area 21 and a non-photosensitive area 22, with the non-photosensitive area 22 surrounding the photosensitive area 21. The photosensitive area 21 of the photosensitive chip 20 is exposed within the molding compound 11. The photosensitive area 21 receives light signals generated by external light propagating from the lens assembly 2 and converts these light signals into electrical signals. One end of the second conductive channel 122, facing away from the third conductive pad 125, is connected to the non-photosensitive area 22. In some embodiments, a connecting pad 220 (such as an aluminum pad) may be provided on the non-photosensitive area 22, and the end of the second conductive channel 122, facing away from the third conductive pad 125, is connected to the aluminum pad of the non-photosensitive area 22.
[0083] The second conductive pad 124 and the third conductive pad 125 are formed into a circuit layer using a redistribution layer (RDL) process. The second conductive pad 124 and the third conductive pad 125 can redistribute the connection pads 220 in the non-photosensitive area 22 to transmit the electrical signals from the photosensitive chip 20 to the substrate module 10. The specific positions of the second conductive pad 124 and the third conductive pad 125 on the molding compound 11 can be adjusted. Thus, the electrical signals generated by the photosensitive chip 20 can be transmitted to the first conductive pad 123 via the second conductive channel 122, the third conductive pad 125, the second conductive pad 124, and the first conductive channel 121, thereby achieving an electrical connection between the photosensitive chip 20 and the substrate module 10.
[0084] In some embodiments, the molding compound 11 includes a first molding block 111 and a second molding block 112. The first molding block 111 is disposed on the second surface 11B and is at least attached to the side of the photosensitive chip 20. The first molding block 111 may also be attached to the side of the photosensitive chip 20 opposite to the photosensitive area 21. The second molding block 112 is disposed on the first molding block 111 and covers the non-photosensitive area 22 of the photosensitive chip 20. The surface of the first molding block 111 opposite to the second molding block 112 is the first surface 11A, and the surface of the second molding block 112 opposite to the first molding block 111 is the second surface 11B. At this time, a first conductive channel 121 is disposed within the first molding block 111 and the second molding block 112, and a second conductive channel 122 is disposed within the second molding block 112. In some embodiments, the material of the first molding block 111 is at least one of epoxy resin and phenolic resin, and the material of the second molding block 112 is polyimide adhesive or an insulating build-up film. In other embodiments, the encapsulation body 11 may also be a one-piece structure.
[0085] A cover plate module 30 is disposed on the second surface 11B, covering the photosensitive chip 20. The cover plate module 30 protects the photosensitive area 21 of the photosensitive chip 20, reducing the risk of damage to the photosensitive area 21 due to external forces. Additionally, the lens assembly 2 can be mounted on the cover plate module 30. The relatively flat surface of the cover plate module 30 facilitates the mounting of the lens assembly 2 on its surface. The cover plate module 30 includes a cover plate body 31 and a second conductive structure 32 disposed on the cover plate body 31. The cover plate body 31 may include glass or quartz. The cover plate body 31 includes a third surface 31A facing the second surface 11B and a fourth surface 31B opposite to the third surface 31A. The second conductive structure 32 includes a fourth conductive pad 321 exposed on the third surface 31A, and the fourth conductive pad 321 is connected to the second conductive pad 124 and the third conductive pad 125 respectively. The fourth conductive pad 321 forms a circuit layer using a redistribution layer (RDL) process, and its position on the cover plate body 31 can be adjusted. The fourth conductive pad 321 connects to the second conductive pad 124 and the third conductive pad 125, forming interlayer circuitry. In some embodiments, the fourth conductive pad 321 can be soldered to the second conductive pad 124 or the third conductive pad 125. The second conductive structure 32 includes a conductive material, which can be conductive ink or a metal material. In some specific embodiments, the second conductive material can be formed by spraying conductive ink, electroplating copper, or electroplating silver.
[0086] Furthermore, the third surface 31A of the cover plate body 31 may be provided with a groove 310. Viewed from the thickness direction of the cover plate body 31, the position of the groove 310 overlaps with the position of the photosensitive area 21. In some embodiments, the cover plate body 31 includes a substrate 311 and an insulating protective layer 312 disposed on a portion of the substrate 311. The substrate 311 may be a glass substrate or a quartz substrate. The groove 310 is disposed on the insulating protective layer 312 and is used to expose a portion of the substrate 311. That is, the bottom of the groove 310 is the substrate 311. The surface of the insulating protective layer 312 facing away from the substrate 311 is the third surface 31A. A fourth conductive pad 321 is disposed on the insulating protective layer 312. That is, the insulating protective layer 312 can provide insulation protection for the substrate 311 and can also provide a circuit pattern for molding the fourth conductive pad 321. At this time, the cover plate body 31 not only protects the photosensitive area 21 of the photosensitive chip 20, but also, by providing the groove 310, allows a portion of the cover plate body 31 to form a filter. The filter can absorb and filter out certain wavelengths of light while allowing other wavelengths of light to pass through. In some embodiments, the cover plate module 30 may further include a first film layer 33 and a second film layer 34. The first film layer 33 is disposed on the substrate 311 exposed in the groove 310, and the second film layer 34 is disposed on the side of the substrate 311 opposite to the first film layer 33. Viewed from the thickness direction, the position of the first film layer 33 overlaps with the position of the photosensitive area 21, and the position of the second film layer 34 also overlaps with the position of the photosensitive area 21. In this case, the first film layer 33, the second film layer 34, and the cover plate body 31 located between them together constitute a filter. In some embodiments, the materials of the first film layer 33 and the second film layer 34 are related to the function of the filter. For example, when the filter is an infrared cutoff filter that filters out infrared radiation, the first film layer 33 and the second film layer 34 can be made of indium tin oxide (ITO), silicon nitride (Si3N4), or titanium dioxide (TiO2). The insulating protective layer 312 can be an insulating build-up film.
[0087] The optoelectronic packaging structure 100 of this application embeds a photosensitive chip 20 within a molding compound 11. A first conductive structure 12 is formed by creating a hollow channel in the molding compound 11 and filling it with conductive material. A cover plate module 30 is then placed on the molding compound 11 to achieve CIS system-in-package. The first conductive structure 12 connects to the non-photosensitive area 22 of the photosensitive chip 20, allowing electrical interconnection between the photosensitive chip 20 and the substrate module 10. Furthermore, the second conductive structure 32 of the cover plate module 30 connects to the second conductive pad 124 and the third conductive pad 125 of the first conductive structure 12, thereby forming a more complete circuit layer. This application eliminates the need for metal wires, thus eliminating the need to reserve operating space for wire bonding tools. This helps reduce the lateral dimensions of the optoelectronic packaging structure 100, thereby facilitating its miniaturization. Moreover, compared to existing circuit board wiring processes, the cover plate module 30 in this application can also serve as a carrier for some circuit layers, increasing the freedom of rewiring. Furthermore, the first conductive structure 12 can be formed by opening a hollow channel in the molding compound 11 and filling it with conductive material, which helps to reduce the warping deformation of the carrier and thus improve the quality of the optoelectronic packaging structure 100.
[0088] In some embodiments, the optoelectronic packaging structure 100 further includes an electronic component 40, and the molding compound 11 further encapsulates the electronic component 40. The first conductive structure 12 further includes a third conductive channel 126 and a fifth conductive pad 127. The third conductive channel 126 is disposed within the molding compound 11, and the fifth conductive pad 127 is exposed on the second surface 11B. The two ends of the third conductive channel 126 are respectively connected to the electronic component 40 and the fifth conductive pad 127. Thus, the electrical signal generated by the photosensitive chip 20 can also be transmitted to the electronic component 40 via the second conductive channel 122, the third conductive pad 125, the fifth conductive pad 127, and the third conductive channel 126. The electronic component 40 can be a passive component or an active component. Passive components include resistors, capacitors, etc., while active components include transistors, integrated circuits, or image tubes, etc.
[0089] In some embodiments, the optoelectronic packaging structure 100 further includes a sealing material 50 disposed between the second surface 11B and the third surface 31A. The sealing material 50 is disposed around the second conductive pad 124, the third conductive pad 125, the fourth conductive pad 321, and the fifth conductive pad 127. The sealing material 50 can bond the cover plate module 30 and the substrate module 10 together to form a sealed cavity, thereby isolating external moisture or impurities and sealing and protecting the photosensitive area 21. In some embodiments, the sealing material 50 may be made of sealant.
[0090] This application also provides a method for preparing an optoelectronic packaging structure 100, comprising the following steps:
[0091] Step S1, please refer to Figures 3 to 6A molding compound 11 is used to encapsulate the photosensitive chip 20. The molding compound 11 includes a first surface 11A and a second surface 11B disposed opposite to each other, with the photosensitive area 21 of the photosensitive chip 20 exposed on the second surface 11B.
[0092] In some embodiments, the molding compound 11 can be obtained by first placing the photosensitive chip 20 on the first carrier plate 3 (e.g., ...). Figure 3 As shown), the photosensitive area 21 is positioned facing the first carrier plate 3, and then the first molding block 111 (as shown) is placed on the first carrier plate 3. Figure 4 As shown), the first molding compound 111 is at least attached to the side of the photosensitive chip 20, and then the first carrier plate 3 is removed (as shown). Figure 5A (As shown), then the first molding compound 111 with the photosensitive chip 20 is placed on the second carrier plate 4, so that the photosensitive area 21 is positioned away from the second carrier plate 4, and a second molding compound 112 (as shown) is placed on the first molding compound 111. Figure 6 As shown), this causes the second molding block 112 to also cover the non-photosensitive area 22. At this time, as... Figure 6 As shown, the first molding block 111 and the second molding block 112 together constitute the molding body 11. The surface of the first molding block 111 facing away from the second molding block 112 is the first surface 11A, and the surface of the second molding block 112 facing away from the first molding block 111 is the second surface 11B. The first carrier plate 3 and the second carrier plate 4 play a supporting role in the corresponding steps to facilitate the placement of the first molding block 111 and the second molding block 112. In some embodiments, the first molding block 111 and the second molding block 112 can be formed by a molding process.
[0093] In some embodiments, such as Figure 3 and Figure 4 As shown, the first carrier plate 3 includes a carrier substrate 3a and a peelable layer 3b stacked together, with the peelable layer 3b located between the photosensitive chip 20 and the carrier substrate 3a. The carrier substrate 3a has high strength, while the peelable layer 3b can decompose upon heating, facilitating the removal of the first carrier plate 3 after the first molding block 111 is installed. In some embodiments, the carrier substrate 3a can be a quartz substrate or a glass substrate. The peelable layer 3b can be made of the polymer LDF. The second carrier plate 4 has a similar structure to the first carrier plate 3, which will not be described in detail here.
[0094] In some embodiments, such as Figure 3 and Figure 4 As shown, when the photosensitive chip 20 is placed on the first carrier plate 3, the electronic component 40 can also be placed on the first carrier plate 3 simultaneously, so that the electronic component 40 is disposed within the first molding compound 111. Further, refer to... Figure 5BIn some embodiments, multiple photosensitive chips 20 and multiple electronic components 40 may be placed on a first carrier plate 3. The multiple photosensitive chips 20 are arranged in a matrix on the first carrier plate 3, and the multiple photosensitive chips 20 and the multiple electronic components 40 correspond one-to-one.
[0095] For step S2, please refer to [link / reference]. Figure 7A A first hollow channel P1 and a second hollow channel P2 are created within the encapsulated body 11 using a laser. The first hollow channel P1 extends from the second surface 11B through the first surface 11A, and the second hollow channel P2 extends from the second surface 11B to the non-photosensitive area 22.
[0096] In some embodiments, when the encapsulation 11 also encapsulates the electronic component 40, a third hollow channel P3 can be formed within the encapsulation 11 using a laser. The third hollow channel P3 extends from the second surface 11B to the electronic component 40. The ends of multiple first hollow channels P1 facing the second carrier plate 4 can collectively form a circuit pattern. The ends of multiple first hollow channels P1 facing away from the second carrier plate 4, the ends of multiple second hollow channels P2 facing away from the second carrier plate 4, and the ends of multiple third hollow channels P3 facing away from the second carrier plate 4 can collectively form a circuit pattern.
[0097] Step S3, please refer to Figure 7A Conductive material is filled into the first hollow channel P1 and the second hollow channel P2 and then cured. At this point, the substrate module 10 is obtained.
[0098] In this process, the first hollow channel P1 is filled with conductive material and cured to obtain a first conductive pad 123, a second conductive pad 124, and a first conductive channel 121. The first conductive pad 123 is exposed on the first surface 11A, the second conductive pad 124 is exposed on the second surface 11B, and the two ends of the first conductive channel 121 are connected to the first conductive pad 123 and the second conductive pad 124, respectively. The second hollow channel P2 is filled with conductive material and cured to obtain a second conductive channel 122 and a third conductive pad 125. The third conductive pad 125 is exposed on the second surface 11B, and the two ends of the second conductive channel 122 are connected to the non-photosensitive area 22 and the third conductive pad 125, respectively.
[0099] In some embodiments, conductive material can be filled and cured within the third hollow channel P3 to obtain a third conductive channel 126 and a fifth conductive pad 127. The fifth conductive pad 127 is exposed on the second surface 11B, and the two ends of the third conductive channel 126 are respectively connected to the electronic component 40 and the fifth conductive pad 127. The conductive material can be filled by printing conductive ink or by electroplating. Figure 7BAs shown, the second conductive pad 124, the third conductive pad 125, and the fifth conductive pad 127 form a circuit layer using a redistribution layer (RDL) process. The second conductive pad 124 and the third conductive pad 125 are interconnected. Multiple third conductive pads 125 are arranged around the photosensitive area 21. The third conductive pads 125 are also connected to the fifth conductive pad 127.
[0100] In some embodiments, the first conductive pad 123 can also be formed into a circuit layer through a rewiring process. To facilitate the formation of the first conductive pad 123, a circuit pattern O2 (such as...) can be pre-formed on the side of the first molding block 111 facing away from the photosensitive area 21 before placing the first molding block 111 with the photosensitive chip 20 onto the second carrier board 4. Figure 5A As shown). Thus, when a hollow channel is created within the encapsulation 11 using a laser (as shown). Figure 7A As shown), the hollow channel connects the partial circuit pattern O2 to form the first hollow channel P1.
[0101] In some embodiments, such as Figure 7B As shown, multiple substrate modules 10 can be formed on the second carrier board 4 at once. Figure 8 As shown, solder balls 1240 can be further disposed on the second conductive pad 124, the third conductive pad 125, and the fifth conductive pad 127 of the substrate module 10. The solder balls 1240 can specifically be solder balls.
[0102] For step S4, please refer to [link / reference]. Figures 9 to 11A , fabricate cover plate module 30.
[0103] The cover plate module 30 includes a cover plate body 31 and a second conductive structure 32. The cover plate body 31 may include glass or quartz, and the cover plate body 31 includes a third surface 31A and a fourth surface 31B disposed opposite to each other. The second conductive structure 32 includes a fourth conductive pad 321 exposed on the third surface 31A.
[0104] In some embodiments, the cover plate module 30 can be obtained by first providing an insulating protective layer 312 (e.g., ...) on a portion of the substrate 311. Figure 9 and Figure 10 As shown), the substrate 311 can be a glass substrate or a quartz substrate. The insulating protective layer 312 has a groove 310 for exposing part of the substrate 311. Then, a first patterned opening O1 is formed on the insulating protective layer 312. The first patterned opening O1 is then filled with conductive material and cured to obtain a fourth conductive pad 321 (as shown). Figure 11A (As shown). The substrate 311 and the insulating protective layer 312 together form the cover plate body 31, and the surface of the insulating protective layer 312 facing away from the substrate 311 is the third surface 31A. (See figure) Figure 11BAs shown, multiple fourth conductive pads 321 are formed into a circuit layer using a redistribution layer (RDL) process, and the multiple fourth conductive pads 321 are arranged around the groove 310. Figure 11B As shown, multiple cover plate modules 30 can be formed on the second carrier plate 4 in one step. In some embodiments, the insulating protective layer 312 can be an insulating build-up film.
[0105] Subsequently, a first film layer 33 can be further disposed on the substrate 311 exposed in the groove 310, and a second film layer 34 can be disposed on the side of the substrate 311 opposite to the first film layer 33. It can be understood that the second film layer 34 can be disposed before the first film layer 33, or it can be disposed simultaneously with the first film layer 33.
[0106] Step S5, please refer to Figure 12 A cover plate module 30 is provided on the second surface 11B so that the fourth conductive pad 321 is connected to the second conductive pad 124 and the third conductive pad 125 respectively.
[0107] The fourth conductive pad 321 can be welded to the second conductive pad 124 or the third conductive pad 125 via solder balls 1240. Viewed from the thickness direction of the cover plate body 31, the position of the groove 310 overlaps with the position of the photosensitive area 21. Viewed from the same thickness direction, the position of the first film layer 33 overlaps with the position of the photosensitive area 21, and the position of the second film layer 34 also overlaps with the position of the photosensitive area 21.
[0108] In some embodiments, such as Figure 12 As shown, solder balls 1230 can be further disposed on the first conductive pad 123. The solder balls 1230 can specifically be solder balls.
[0109] Step S6, please refer to Figure 13 and Figure 2 A sealing material 50 is disposed between the second surface 11B and the third surface 31A, and the sealing material 50 is disposed around the second conductive pad 124, the third conductive pad 125 and the fourth conductive pad 321. At this time, the optoelectronic packaging structure 100 is obtained.
[0110] In some embodiments, in conjunction with reference Figure 11B and Figure 13 Multiple cover plate modules 30 can be separated first, and then a sealing material 50 (such as...) can be placed between the second surface 11B and the third surface 31A. Figure 13 (As shown), the multiple substrate modules 10 are then separated to obtain... Figure 2 The optoelectronic packaging structure 100 is shown.
[0111] Implementation Method 2
[0112] Please see Figure 14 This application also provides an optoelectronic packaging structure 200. The difference from the optoelectronic packaging structure 100 described above lies in the structure of the cover module 30. Specifically, the insulating protective layer 312 is omitted, and the groove 310 is directly provided on the third surface 31A of the cover body 31, causing a portion of the cover body 31 to be thinned to form a filter. The first conductive structure 12 is directly formed on the third surface 31A.
[0113] This application also provides a method for preparing an optoelectronic packaging structure 200, which differs from the preparation method in Embodiment 1 in the preparation steps of the cover module 30.
[0114] In this embodiment, the cover plate module 30 can be obtained in the following manner: First, as... Figure 15 As shown, a mask (not shown) is provided on the cover plate body 31. The mask has a second patterned opening. Then, conductive material is filled into the second patterned opening and cured to obtain a second conductive structure 32. Finally, the mask is removed. The conductive material can be filled by printing conductive ink or by electroplating copper, gold, or silver.
[0115] Then, as Figure 16 As shown, a groove 310 is provided on the third surface 31A of the cover plate body 31. Figure 17 As shown, a first film layer 33 is then provided on the bottom surface of the groove 310, and a second film layer 34 is provided on the side of the cover plate body 31 away from the first film layer 33.
[0116] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.
Claims
1. A photoelectric packaging structure, characterized in that, include: A substrate module includes a molding compound and a first conductive structure. The molding compound includes a first surface and a second surface disposed opposite to each other. The first conductive structure includes a first conductive channel, a second conductive channel, a first conductive pad, a second conductive pad, and a third conductive pad. The first conductive channel and the second conductive channel are respectively disposed within the molding compound. The first conductive pad is exposed on the first surface, and the second conductive pad and the third conductive pad are exposed on the second surface. The two ends of the first conductive channel are respectively connected to the first conductive pad and the second conductive pad. A photosensitive chip is disposed within the plastic package. The photosensitive chip includes a photosensitive area and a non-photosensitive area connected together. The two ends of the second conductive channel are respectively connected to the non-photosensitive area and the third conductive pad. as well as A cover plate module is disposed on the second surface. The cover plate module includes a cover plate body and a second conductive structure. The cover plate body includes a third surface facing the second surface. The second conductive structure includes a fourth conductive pad exposed on the third surface, and the fourth conductive pad is connected to the second conductive pad and the third conductive pad respectively.
2. The optoelectronic packaging structure as described in claim 1, characterized in that, The third surface is provided with a groove, and the position of the groove overlaps with the position of the photosensitive area.
3. The optoelectronic packaging structure as described in claim 2, characterized in that, The cover plate body includes a substrate and an insulating protective layer disposed on a portion of the substrate. The fourth conductive pad is disposed on the insulating protective layer on the third surface. The groove is disposed in the protective layer, and the bottom of the groove is the substrate.
4. The optoelectronic packaging structure as described in claim 2 or 3, characterized in that, The cover plate module further includes a first film layer and a second film layer. The first film layer is disposed on the substrate at the bottom of the groove, and the second film layer is disposed on the side of the substrate away from the first film layer. The position of the first film layer overlaps with the position of the photosensitive area, and the position of the second film layer overlaps with the position of the photosensitive area.
5. The optoelectronic packaging structure as described in claim 1, characterized in that, Also includes: A sealing material is disposed between the second surface and the third surface, the sealing material being disposed around the second conductive pad, the third conductive pad, and the fourth conductive pad.
6. The optoelectronic packaging structure as described in claim 1, characterized in that, The molding compound includes a first molding block and a second molding block. The first molding block is at least attached to the side of the photosensitive chip. The second molding block is disposed on the first molding block and covers the non-photosensitive area. The surface of the first molding block facing away from the second molding block is the first surface, and the surface of the second molding block facing away from the first molding block is the second surface. The first conductive channel is disposed within the first molding block and the second molding block, and the second conductive channel is disposed within the second molding block.
7. The optoelectronic packaging structure as described in claim 1, characterized in that, Also includes: An electronic component is disposed within the plastic encapsulation. The first conductive structure further includes a third conductive channel and a fifth conductive pad. The third conductive channel is disposed within the plastic encapsulation, and the fifth conductive pad is exposed on the second surface. The two ends of the third conductive channel are respectively connected to the electronic component and the fifth conductive pad.
8. A method for fabricating an optoelectronic packaging structure, characterized in that, include: A plastic encapsulation is used to encapsulate a photosensitive chip. The photosensitive chip includes connected photosensitive and non-photosensitive areas. The plastic encapsulation includes a first surface and a second surface disposed opposite to each other. The photosensitive areas are exposed on the second surface. A first hollow channel and a second hollow channel are created within the encapsulation using a laser. The first hollow channel extends from the second surface through the first surface, and the second hollow channel extends from the second surface to the non-photosensitive area. A conductive material is filled into the first hollow channel and cured to obtain a first conductive pad, a second conductive pad, and a first conductive channel. The first conductive pad is exposed on the first surface, the second conductive pad is exposed on the second surface, and the two ends of the first conductive channel are respectively connected to the first conductive pad and the second conductive pad. The second hollow channel is filled with conductive material and cured to obtain a second conductive channel and a third conductive pad. The third conductive pad is exposed on the second surface. The two ends of the second conductive channel are respectively connected to the non-photosensitive area and the third conductive pad. as well as A cover plate module is disposed on the second surface. The cover plate module includes a cover plate body and a second conductive structure. The cover plate body includes a third surface facing the second surface. The second conductive structure includes a fourth conductive pad exposed on the third surface, and the fourth conductive pad is connected to the second conductive pad and the third conductive pad respectively.
9. The method for preparing the optoelectronic packaging structure as described in claim 8, characterized in that, The preparation of the cover plate module includes: An insulating protective layer is provided on a portion of the substrate, the insulating protective layer having a groove, the bottom of the groove being the substrate; A first patterned opening is provided on the insulating protective layer; and The first patterned opening is filled with conductive material and cured to obtain the fourth conductive pad; The substrate and the insulating protective layer together form the cover plate body. The fourth conductive pad is disposed on the protective layer of the third surface. After the cover plate module is disposed on the second surface, the position of the groove overlaps with the position of the photosensitive area.
10. The method for preparing the optoelectronic packaging structure as described in claim 9, characterized in that, The fabrication of the cover plate module further includes: A first film layer is disposed on the substrate of the groove; and A second film layer is disposed on the side of the substrate opposite to the first film layer; Wherein, after the cover plate module is disposed on the second surface, the position of the first film layer overlaps with the position of the photosensitive area, and the position of the second film layer overlaps with the position of the photosensitive area.
11. The method for preparing the optoelectronic packaging structure as described in claim 8, characterized in that, The preparation of the cover plate module includes: A mask is provided on the cover plate, the mask having a second patterned opening; Fill the second patterned opening with conductive material; and After removing the mask, the conductive material is cured to obtain the second conductive structure.
12. The method for preparing the optoelectronic packaging structure as described in claim 11, characterized in that, The fabrication of the cover plate module further includes: A groove is provided on the third surface of the cover plate body; A first film layer is disposed on the bottom surface of the groove; and A second film layer is provided on the side of the cover plate body opposite to the first film layer; Wherein, after the cover plate module is disposed on the second surface, the position of the first film layer overlaps with the position of the photosensitive area, and the position of the second film layer overlaps with the position of the photosensitive area.
13. The method for fabricating the optoelectronic packaging structure as described in claim 9 or 11, characterized in that, The conductive material is filled by printing conductive ink or electroplating metal.
14. The method for preparing the optoelectronic packaging structure according to claim 8, characterized in that, After the cover plate module is disposed on the second surface, the preparation method further includes: A sealing material is disposed between the second surface and the third surface, the sealing material being disposed around the second conductive pad, the third conductive pad, and the fourth conductive pad.
15. The method for preparing the optoelectronic packaging structure as described in claim 8, characterized in that, The encapsulation body covering the photosensitive chip includes: The photosensitive chip is placed on the first carrier plate, with the photosensitive area facing the first carrier plate; A first molding block is disposed on the carrier plate, and the first molding block is at least attached to the side of the photosensitive chip; Remove the first carrier plate and place the first encapsulated block with the photosensitive chip on the second carrier plate, such that the photosensitive area is positioned opposite to the second carrier plate; and A second molding block is disposed on the first molding block, and the second molding block also covers the non-photosensitive area. The first molding block and the second molding block together constitute the molding body. The surface of the first molding block facing away from the second molding block is the first surface, and the surface of the second molding block facing away from the first molding block is the second surface. After the cover plate module is disposed on the second surface, the preparation method further includes: Remove the second carrier board.
16. The method for preparing the optoelectronic packaging structure as described in claim 15, characterized in that, After placing the photosensitive chip on the first carrier plate, the fabrication method further includes: The electronic components are placed on the first carrier plate; Wherein, after the first molding block is disposed on the first carrier board, the electronic component is disposed within the first molding block, and the preparation method further includes: A third hollow channel is created within the encapsulation using a laser, the third hollow channel extending from the second surface to the electronic component; and The third hollow channel is filled with conductive material and cured to obtain a third conductive channel and a fifth conductive pad. The fifth conductive pad is exposed on the second surface. The two ends of the third conductive channel are respectively connected to the electronic component and the fifth conductive pad.
17. A camera module, comprising a lens assembly, characterized in that, The camera module further includes an optoelectronic packaging structure as described in any one of claims 1 to 7, wherein the lens assembly is disposed on the cover plate module of the optoelectronic packaging structure.