Carrying device compatible with wafers of multiple sizes
By designing a transfer device compatible with multiple wafer sizes, and utilizing a detection module and a robot to achieve efficient transfer of multiple wafer sizes, the problem of low transfer efficiency of small wafers was solved, and efficient and compact wafer transfer was realized.
Patent Information
- Application Number
- CN202511722699.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-21
- Publication Date
- 2026-03-03
AI Technical Summary
Existing technologies are difficult to efficiently accommodate the transport of wafers of different sizes, resulting in low transport efficiency for small wafers. Furthermore, due to limitations imposed by the equipment, modifications to the equipment are necessary to improve transport efficiency.
Design a multi-size wafer transport device, including a worktable, multiple wafer cassettes, a robot, and a detection module. The detection module detects the size and status of the wafer cassettes, and the robot performs efficient transport, achieving compatibility and efficient transfer of multi-size wafers.
It enables efficient handling of wafers of various sizes, reduces equipment procurement costs, improves handling efficiency, and features a compact overall layout and small size.
Smart Images
Figure CN121604769A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor equipment technology, and more specifically to a transfer device compatible with multi-size wafers. Background Technology
[0002] The larger the wafer size, the higher the utilization rate, but the corresponding increase in manufacturing difficulty. Third-generation semiconductor materials, represented by silicon carbide, are mainly 6-inch and 8-inch in size, with some using even smaller sizes.
[0003] Silicon carbide (SiC) is suitable for manufacturing high-power devices, microwave radio frequency devices, and optoelectronic devices because it can withstand high voltage and high current. Key applications include new energy vehicles, photovoltaics, rail transportation, high-voltage power transmission and transformation, and smart grids. With the increasing demand for lightweight, high-efficiency, and low-heat-generating semiconductor power devices, SiC power devices have a clear advantage over traditional silicon-based power devices.
[0004] In the global wafer market, 12-inch wafers dominate due to their high production efficiency, and correspondingly, the equipment for handling 12-inch wafers is more mature and widespread. Handling 8-inch and smaller wafers requires modifications to the equipment, including grippers, wafer cassette stages, and alignment devices. Furthermore, layout limitations restrict improvements in handling efficiency. Moreover, due to equipment limitations, wafers in small-sized wafer cassettes lack dedicated scanning devices, requiring scanning by handling robots, which consumes robot handling time and reduces efficiency.
[0005] Therefore, improving the handling efficiency of small-sized wafers is a problem that needs to be solved. Summary of the Invention
[0006] The purpose of this invention is to provide a multi-size wafer transport device that can accommodate wafers of various sizes and improve the transport efficiency of small-size wafers.
[0007] To achieve the above objectives, the present invention provides a multi-size wafer transfer device, comprising: a worktable;
[0008] Multiple wafer cassette stages are embedded in the worktable surface and configured to accommodate wafer cassettes of various sizes.
[0009] The robot is mounted on the internal frame of the device via a lateral walking axis and is equipped with wafer handling fingers at its end.
[0010] The detection module, integrated into the wafer cassette stage, is used to detect the wafer cassette size and the state of the wafers inside the wafer cassette;
[0011] An operating console is used to control the operation of the detection module and the robot.
[0012] In an optional embodiment, the wafer cassette stage includes a positioning block, which is fixed to the surface of the stage and is used to guide and position the placed wafer cassette.
[0013] In an optional embodiment, the detection module includes:
[0014] A detection sensor is present and configured to detect the wafer cassette size and wafer center position.
[0015] The wafer scanning holder is height-adjustable and can be installed on both sides below the wafer tray stage;
[0016] A through-beam scanning sensor is installed on the top of the wafer scanning holder and is used to scan the placement status of the wafers in the wafer cassette layer by layer when the wafer scanning holder is raised.
[0017] A protrusion detection sensor is used to detect whether a wafer protrudes from the wafer cassette.
[0018] In an optional configuration, the front sides of the workbench are provided with vertical safety light curtain frames, and the safety light curtain frames are equipped with safety light curtains and emergency stop buttons.
[0019] In an optional configuration, the front side of the workbench is an open operating space, and each of the wafer cassette stages is arranged in a row on the workbench.
[0020] The inner side of the workbench is provided with a vertical cover, and the vertical cover is provided with an interface, each interface corresponding to one of the wafer cassette stages;
[0021] The robot and its lateral movement axis are located in an enclosed space at the rear of the device. The robot performs wafer handling operations through the interface.
[0022] An optional solution also includes an edge finder, installed on one side inside the device, for centering and angular alignment of the wafers picked up by the robot.
[0023] In an optional embodiment, the device includes an internal filter mounted on top of the device.
[0024] In an optional configuration, the wafer cassette stage is configured to be compatible with wafer cassettes of 2 inches, 3 inches, 4 inches, 6 inches, and 8 inches.
[0025] In an optional configuration, the control panel is mounted on the outer wall of the device via a bracket.
[0026] The beneficial effects of this invention are as follows:
[0027] This invention is compatible with wafer cassettes of various sizes, enabling the running of wafers of different sizes and reducing the need to purchase equipment for dedicated wafer sizes, thereby lowering costs. An inspection module is integrated into the wafer cassette platform, which performs wafer scanning and bump inspection within the cassette, improving wafer transfer efficiency compared to robot scanning and inspection. The overall layout is compact and small in size. Attached Figure Description
[0028] The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings, in which like reference numerals generally denote like parts.
[0029] Figure 1 This is a front view of a multi-size wafer transport device according to an embodiment of the present invention.
[0030] Figure 2 This is a top view of a multi-size wafer transport device according to an embodiment of the present invention.
[0031] Figure 3 This is a left view of a multi-size wafer transport device according to an embodiment of the present invention.
[0032] Figure 4 This is a detailed view of the wafer cassette stage in one embodiment of the present invention.
[0033] Figure 5 This is a schematic diagram showing the matching distribution of multiple wafer cassette stages and wafer cassettes in one embodiment of the present invention.
[0034] Figure 6 This is a schematic diagram of wafer handling in one embodiment of the present invention.
[0035] Explanation of reference numerals in the attached figures:
[0036] 1-Wafer box stage; 2-Workbench surface; 3-Interface; 4-Safety light curtain frame; 5-Safety light curtain; 6-Emergency stop button; 7-Operating panel; 8-Warning light; 9-Transverse travel axis; 10-Robot; 11-Finger; 12-Edge finder; 13-Filter; 14-Positioning block; 15-Presence detection sensor; 16-Wafer scanning bracket; 17-Through-beam scanning sensor; 8-Bump detection sensor; 19-Wafer box; 20-Wafer. Detailed Implementation
[0037] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and drawings. However, it should be noted that the concept of the technical solution of the present invention can be implemented in many different forms and is not limited to the specific embodiments described herein. The accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.
[0038] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.
[0039] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.
[0040] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.
[0041] Example
[0042] Reference Figures 1 to 6 This embodiment provides a multi-size wafer transfer device, including:
[0043] Work surface 2;
[0044] Multiple wafer cassette stages 1 are embedded in the worktable surface 2 and configured to accommodate wafer cassettes 19 of various sizes.
[0045] Robot 10 is mounted on the internal frame of the device via a transverse walking axis 9, and is equipped with wafer handling fingers 11 at its end;
[0046] The detection module is integrated into the wafer cassette stage 1 and is used to detect the size of the wafer cassette 19 and the state of the wafers 20 inside the wafer cassette 19.
[0047] The control panel 7 is used to control the operation of the detection module and the robot 10.
[0048] Specifically, the workbench 2 constitutes the main support structure of the device. The front of the workbench 2 is an open operating space, on which the wafer cassette stages 1 are arranged in a row. The inner side of the workbench 2 is provided with a vertical cover, on which an interface 3 is provided, each interface 3 corresponding to one wafer cassette stage 1. A transverse travel axis 9 is bolted to the internal frame at the rear of the device. A robot 10 is fixed to the slide of the transverse travel axis 9 via a bracket. The robot 10 and the transverse travel axis 9 are located within an enclosed space. The robot 10 performs wafer 20 handling operations through the interface 3. An edge finder 12 is also provided on one side of the enclosed space at the rear of the device for centering and aligning the wafers 20 picked up by the robot 10. A filter 13 is installed inside the device and mounted on the top.
[0049] In this embodiment, the wafer cassette stage 1 includes a positioning block 14, which is fixed to the surface of the stage by bolts and is used to guide and position the placed wafer cassette 19.
[0050] In this embodiment, the detection module includes: a presence detection sensor 15, configured to detect the wafer cassette size and wafer center position, and fixed to the wafer cassette stage by bolts; a wafer scanning bracket 16, which is vertically mounted on both sides below the wafer cassette stage 1; a through-beam scanning sensor 17, mounted on the top of the wafer scanning bracket 16, used to scan the placement status of the wafers 20 in the wafer cassette 19 layer by layer when the wafer scanning bracket 16 is raised; and a protrusion detection sensor 18, used to detect whether the wafers 20 protrude from the wafer cassette 19.
[0051] In this embodiment, vertical safety light curtain frames 4 are provided on both sides of the front of the worktable 2. Safety light curtain frames 4 are equipped with safety light curtains 5 and emergency stop buttons 6. Because the robot's fingers will extend from the interface 3 into the wafer cassette 19 to pick up the wafer 20, the safety light curtains 5 ensure the safety of the wafer cassette stage 1 area. In case of a problem requiring an emergency stop, the power can be disconnected by pressing the emergency stop button 6.
[0052] The working process of this device is as follows:
[0053] The operator places the wafer cassette 19 on the wafer cassette stage 1. The positions of wafer cassettes 19 of different sizes on the wafer cassette stage 1 are as follows: Figure 5 As shown. Figure 4 As shown, the left side (1) is a top view, and the right side (2) is a side view. The positioning block 14 guides and positions the wafer cassette. The presence detection sensor 15 determines the size of the wafer cassette 19 and the center position of the wafer by detecting the trigger position. At the same time, the protrusion detection sensor 18 detects whether the wafer 20 in the wafer cassette 19 protrudes from the wafer cassette 19. The wafer scanning bracket 16 rises up to scan all the wafers 20 in the wafer cassette 19 to check for any abnormal placement. After confirming that there are no abnormalities, as shown... Figure 6 As shown, the process begins with the handling of wafer 20. Robot 10 moves laterally on the transverse axis 9 to align with wafer cassette stage 1. Robot 10 rotates and extends finger 11, which moves below wafer 20, lifts wafer 20 upward, and retracts. Robot 10 rotates again, aligning finger 11 and wafer 20 towards edge finder 12. Robot 10 extends finger 11 to move wafer 20 onto edge finder 12, and finger 11 descends and retracts. Edge finder 12 completes the centering and angle alignment. Robot 10 extends finger 11, lifts wafer 20 upward, and retracts. Robot 10 rotates back to align with wafer cassette stage 1 and places wafer 20 back into its original wafer cassette 19. Alternatively, the transverse axis 9 moves robot 10 laterally to place wafer 20 into another designated wafer cassette 19.
[0054] This device features a completely new design compatible with 2-inch, 3-inch, 4-inch, 6-inch, and 8-inch wafers. The robotic fingers and edge finder are designed to be compatible with multiple wafer sizes, and the wafer cassette stage is compatible with wafer cassettes of various sizes. This allows for the running of multiple wafers of different sizes, reducing the need to purchase dedicated wafer-sized equipment and thus lowering costs. Furthermore, the stage performs wafer scanning and bump inspection within the wafer cassette, saving robot transport time and improving wafer handling efficiency compared to traditional robot-based wafer scanning and inspection. The overall layout is more compact, transport efficiency is improved, and the overall device size is smaller for the same number of loading positions.
[0055] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.
Claims
1. A transfer device compatible with multi-size wafers, characterized in that, include: Work surface; Multiple wafer cassette stages are embedded in the worktable surface and configured to accommodate wafer cassettes of various sizes. The robot is mounted on the internal frame of the device via a lateral walking axis and is equipped with wafer handling fingers at its end. The detection module, integrated into the wafer cassette stage, is used to detect the wafer cassette size and the state of the wafers inside the wafer cassette; An operating console is used to control the operation of the detection module and the robot.
2. The multi-size wafer transport device as described in claim 1, characterized in that, The wafer cassette stage includes a positioning block, which is fixed to the surface of the stage and is used to guide and position the placed wafer cassette.
3. The multi-size wafer transport device as described in claim 1, characterized in that, The detection module includes: A detection sensor is present and configured to detect the wafer cassette size and wafer center position. The wafer scanning holder is height-adjustable and can be installed on both sides below the wafer tray stage; A through-beam scanning sensor is installed on the top of the wafer scanning holder and is used to scan the placement status of the wafers in the wafer cassette layer by layer when the wafer scanning holder is raised. A protrusion detection sensor is used to detect whether a wafer protrudes from the wafer cassette.
4. The multi-size wafer transport device as described in claim 1, characterized in that, The workbench surface is provided with vertical safety light curtain frames on both sides of the front, and safety light curtains and emergency stop buttons are installed on the safety light curtain frames.
5. The multi-size wafer transport device as described in claim 1, characterized in that, The front side of the workbench is an open operating space, and each of the wafer cassette stages is arranged in a row on the workbench. The inner side of the workbench is provided with a vertical cover, and the vertical cover is provided with an interface, each interface corresponding to one of the wafer cassette stages; The robot and its lateral movement axis are located in an enclosed space at the rear of the device. The robot performs wafer handling operations through the interface.
6. The multi-size wafer transport device as described in claim 5, characterized in that, It also includes an edge finder, installed on one side inside the device, used to perform centering and angle alignment operations on the wafers picked up by the robot.
7. The multi-size wafer transport device as described in claim 5, characterized in that, The device has an internal filter installed on top.
8. The multi-size wafer transport device as described in claim 1, characterized in that, The wafer cassette stage is configured to be compatible with 2-inch, 3-inch, 4-inch, 6-inch, and 8-inch wafer cassettes.
9. The multi-size wafer transport device as described in claim 1, characterized in that, The control panel is mounted on the outer wall of the device via a bracket.