Universal pre-bonding structure for multi-size slide wafers and use method of universal pre-bonding structure

Abstract

The invention relates to the field of wafer packaging, in particular to a multi-size slide wafer universal pre-bonding structure and a using method thereof.The multi-size slide wafer universal pre-bonding structure comprises a pre-bonding cavity, a carrying table support is fixed in the pre-bonding cavity, a carrying table is fixed to the top of the carrying table support, and measuring, clamping and centering mechanisms are arranged on the periphery of the carrying table; a supporting rod is arranged in the inner wall of the carrying table in a sliding mode, a supporting rod power part penetrating through the pre-bonding cavity is arranged at the bottom of the supporting rod, an upper pressing rod is arranged at the top of the pre-bonding cavity in a sealed and penetrating mode, and an upper pressing rod power part is installed on the outer portion of the upper pressing rod in a matched mode; according to the pre-bonding device, the pre-bonding device composed of the pre-bonding cavity, the carrying table, the measuring, clamping and centering mechanism and the like is arranged, accurate measurement positioning and centering positioning can be carried out on the sizes of the wafer and the slide glass respectively, and the purpose of improving the fitting precision of the wafer and the slide glass is achieved.

Description

Technical Field

[0001] This invention relates to the field of wafer packaging technology, specifically to a universal pre-bonding structure for multi-size wafer carriers and its usage method. Background Technology

[0002] During processing, the wafer is bonded to a carrier to form an integrated structure, which improves the structural rigidity of the wafer and facilitates stable subsequent processing. The specific bonding method is as follows: in a vacuum environment, temporary bonding adhesive is spin-coated onto the wafer, and then the carrier is placed on top of the wafer to achieve bonding and fixation.

[0003] Before the carrier and wafer are formally bonded, pre-bonding is required for alignment to ensure that the wafer and carrier are aligned. The drawbacks of the existing process are: 1. Most of the alignment is done manually, which is not only inefficient but also inaccurate, thus reducing production efficiency; 2. When manually bonding wafers and carriers, air bubbles are easily generated in the adhesive, which is not conducive to the high-curing bonding between the wafers and carriers during bonding. 3. Existing equipment is usually only suitable for one size of wafer and carrier during pre-bonding, and a separate device must be purchased for each size; 4. The alignment effect is poor when there is a large difference between the diameter of the wafer and the carrier. Summary of the Invention

[0004] The purpose of this invention is to provide a universal pre-bonding structure for multi-size wafer carriers and its usage method in order to solve the above-mentioned problems. This invention, by setting up a pre-bonding device composed of components such as a pre-bonding cavity, a stage, and a measuring clamping and centering mechanism, can achieve precise measurement and positioning of the dimensions of the wafer and the carrier, as well as centering and positioning, thereby improving the accuracy of the wafer and the carrier during bonding. Details are described below.

[0005] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a universal pre-bonding structure for multi-size wafer carriers, including a pre-bonding cavity, a stage support fixed inside the pre-bonding cavity, a stage fixed at the top of the stage support, a measuring clamping and centering mechanism arranged around the stage, a support rod slidably arranged in the inner wall of the stage, a support rod power unit penetrating the pre-bonding cavity at the bottom of the support rod, an upper pressure rod sealingly penetrating the top of the pre-bonding cavity, and an upper pressure rod power unit fitted to the outside of the upper pressure rod; The measuring clamping and centering mechanism includes a first push rod, a second push rod, and a third push rod, with a measuring centering section provided on the telescopic joint end of the third push rod.

[0006] Preferably, the pre-bonding cavity has a feed gate and a discharge gate symmetrically slidably connected on its outer wall. A feeding robot is provided on the outside of the feed gate, and a discharging robot is provided on the outside of the discharge gate.

[0007] Preferably, a vacuum machine is provided on one side of the upper pressure rod power unit, which is connected to the pre-bonding cavity valve.

[0008] Preferably, the support rod has a wafer at its top and a carrier at its top. Both the wafer and the carrier have marking notches for marking and positioning.

[0009] Preferably, the first push rod, the second push rod, and the third push rod are all fixed with mounting bases on their periphery, and the mounting bases are fixed to the top of the platform.

[0010] Preferably, the first push rod, the second push rod, and the third push rod are all equipped with grating rulers, and the end of the third push rod is also equipped with a pressure sensor.

[0011] Preferably, the measuring centering part includes a diameter measuring arc surface and a centering boss that are fixed in layers with the pressure sensor.

[0012] Preferably, the diameter measuring arc surface has the same curvature as the outer wall of the carrier and the wafer, and the centering boss is fitted into the marking notch.

[0013] Preferably, the top of the stage is also slidably provided with three sets of spacers.

[0014] The method of using the pre-bonded structure includes the following steps: a. When the feed door opens, the support rod is lifted to the receiving height by the support rod power unit. The loading robot moves the wafer into the pre-bonding cavity and places it on top of the support rod. The loading robot then retracts, the feed door closes, and the vacuum machine evacuates the inside of the pre-bonding cavity. b. The support rod drives the wafer to the measuring height position of the measuring clamping and centering mechanism. The first push rod, the second push rod, and the third push rod simultaneously clamp the wafer. When the diameter measuring arc surface at the end of the third push rod contacts the outer wall of the wafer, the force is fed back to the pressure sensor, which then stops the controller and stops the three sets of push rods. At this time, the position data of the three grating rulers can be obtained. The controller then calculates the diameter of the wafer, fits the center of the wafer, and also obtains the center coordinates of the stage and the advancing action data of the first and second push rods.

[0015] c. The support rod continues to drive the wafer to the centering height position of the measuring clamping centering mechanism. The third push rod is activated first (the operating data is based on the dimensional data collected in step b). The centering boss on the third push rod is pre-push into the marked notch on the wafer. The first and second push rods are then pushed to the target position according to the wafer size. The third push rod is finally pushed forward until the pressure sensor provides feedback, thus completing the centering operation. d. The first push rod, the second push rod, and the third push rod retract, the support rod drives the wafer to fall onto the stage, the spacer rises to the receiving height, the loading robot moves the wafer into the pre-bonding cavity and falls onto the spacer, the spacer, like the support rod, drives the wafer to fall and performs diameter measurement and centering operations respectively. e. After the carrier is aligned, the spacer falls to the pre-bonding height. The upper pressure rod is driven by the upper pressure rod power unit to press the center of the carrier for a period of time. After the spacer is retracted, it continues to be held for a period of time. Then the upper pressure rod returns to its original position, the pre-bonding is completed, the support rod lifts the bonded piece, the discharge door opens, and the unloading robot takes away the bonded piece.

[0016] The beneficial effects are as follows: 1. By setting up a pre-bonding device composed of components such as a pre-bonding cavity, a stage, and a measuring clamping and centering mechanism, the present invention can achieve precise measurement and positioning of the dimensions of the wafer and the carrier, as well as centering and positioning, thereby improving the accuracy of the wafer and the carrier during bonding. 2. By setting up spacers and upper pressure rods, the present invention can achieve center alignment before the glass carrier is bonded to the wafer after the carrier enters, without the periphery being bonded to the wafer. The pushing action of the upper pressure rods then achieves complete bonding between the glass carrier and the wafer through diffusion. This method can effectively avoid the generation of internal air bubbles and avoid secondary operations. 3. By changing the length of the spacer and the three push rods, pre-bonding of wafers and carriers of different sizes can be achieved, such as 12-inch and 8-inch wafers; 4. This facility can not only perform pre-bonding with wafer and wafer center alignment, but also perform pre-bonding with specific intentional orientation offset as required. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the main structure of the present invention; Figure 2 This is a top view of the structure of the wafer when it is located on the stage in this invention; Figure 3 This is a top view of the structure when the carrier plate and the third push rod are in contact with the measuring arc surface in this invention; Figure 4 This is a top view of the structure when the carrier plate and the centering boss of the third push rod are in contact in this invention; Figure 5 This is a front view structural diagram showing the positional relationship between the third push rod, pressure sensor, diameter measuring arc surface, and centering boss in this invention.

[0019] The annotations in the attached figures are explained as follows: 1. Pre-bonding cavity; 2. Upper pressure rod; 201. Upper pressure rod power unit; 3. Feed gate; 4. Carrier; 5. Wafer; 6. Stage; 7. Stage support; 8. Discharge gate; 9. Support rod; 901. Support rod power unit; 10. Measuring clamping and centering mechanism; 1001. Mounting base; 1002. First push rod; 1003. Second push rod; 1004. Grating ruler; 1005. Third push rod; 1005a. Diameter measuring arc surface; 1005b. Centering boss; 1006. Pressure sensor; 11. Vacuum machine; 12. Spacer; 13. Loading robot; 14. Unloading robot; 15. Marking notch. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0021] See Figures 1-5 As shown, the present invention provides a universal pre-bonding structure for multi-size wafer carriers, including a pre-bonding cavity 1, a stage support 7 fixed inside the pre-bonding cavity 1, a stage 6 fixed on the top of the stage support 7, a measuring clamping and centering mechanism 10 arranged around the stage 6, a support rod 9 slidably arranged in the inner wall of the stage 6, a support rod power part 901 penetrating the pre-bonding cavity 1 at the bottom of the support rod 9, an upper pressure rod 2 sealingly penetrating the top of the pre-bonding cavity 1, and an upper pressure rod power part 201 fitted to the outside of the upper pressure rod 2; the measuring clamping and centering mechanism 10 includes a first push rod 1002, a second push rod 1003 and a third push rod 1005, and a measuring centering part is provided on the telescopic joint end of the third push rod 1005.

[0022] In the above structure, the first push rod 1002, the second push rod 1003 and the third push rod 1005 are all independently controlled to realize clamping measurement and centering operation.

[0023] The pre-bonding cavity 1 is symmetrically slidably connected to an inlet gate 3 and an outlet gate 8. An inlet manipulator 13 is provided on the outside of the inlet gate 3, and an outlet manipulator 14 is provided on the outside of the outlet gate 8. Both the inlet gate 3 and the outlet gate 8 are sealed to the pre-bonding cavity 1 so that the vacuum pumping device can draw a vacuum, so that the pre-bonding operation is performed under vacuum.

[0024] A vacuum pump 11 is provided on one side of the upper pressure rod power unit 201 and is connected to the pre-bonding cavity 1.

[0025] The support rod 9 has a wafer 5 on its top and a carrier 4 on its top. Both the wafer 5 and the carrier 4 have marking notches 15 for marking and positioning. The marking notches 15 are used to facilitate the positioning and identification of the carrier 4 and the wafer 5 during processing. Bonding adhesive is provided on the contact surfaces of the wafer 5 and the carrier 4.

[0026] The first push rod 1002, the second push rod 1003 and the third push rod 1005 are all fixed with mounting bases 1001. The mounting bases 1001 are fixed to the top of the platform 6 and are used to fix the three sets of push rods on the platform 6.

[0027] The first push rod 1002, the second push rod 1003, and the third push rod 1005 are all equipped with a grating ruler 1004. The end of the third push rod 1005 is also equipped with a pressure sensor 1006. The pressure sensor 1006 is used to identify the carrier 4 and the wafer 5 when the third push rod 1005 is measuring dimensions and aligning. The feedback data is processed by the processor of the external controller, which then controls the first push rod 1002 and the second push rod 1003 to perform positioning and alignment operations.

[0028] The measurement centering section includes a diameter measuring arc surface 1005a and a centering boss 1005b, which are fixed in layers with the pressure sensor 1006. When the wafer 5 and the carrier 4 descend to the height of the diameter measuring arc surface 1005a, the wafer 5 and the carrier 4 are in the position for measuring dimensions. At this time, after the three sets of push rods are pushed forward, they cooperate with the diameter measuring arc surface 1005a to perform measurement dimension positioning. The arc surface is set to avoid dimensional deviation caused by the contact mark notch 15. When descending to the position of the centering boss 1005b, the wafer 5 and the carrier 4 are in the centering position.

[0029] The diameter measuring arc surface 1005a has the same curvature as the outer wall of the carrier 4 and the wafer 5, and the centering boss 1005b is fitted into the marking notch 15.

[0030] The top of the stage 6 is also slidably provided with three sets of spacers 12. The spacers 12 are used to support the bottom of the substrate 4, so that when the substrate 4 is bonded to the wafer 5, the center part is bonded by the upper pressure rod 2, thereby avoiding the generation of air bubbles. The spacers 12 can also slide vertically up and down when sliding horizontally.

[0031] Using the above structure, the following steps are included in its application: a. The feed door 3 opens, and the support rod 9 is lifted to the receiving height by the support rod power unit 901. The loading robot 13 moves the wafer 5 into the pre-bonding cavity 1 and places it on top of the support rod 9. The loading robot 13 then retracts, the feed door closes, and the vacuum machine 11 evacuates the inside of the pre-bonding cavity 1. b. The support rod 9 drives the wafer 5 to the measuring height position of the measuring clamping and centering mechanism 10. The first push rod 1002, the second push rod 1003, and the third push rod 1005 simultaneously clamp the wafer 5. When the diameter measuring arc surface 1005a at the end of the third push rod 1005 contacts the outer wall of the wafer 5, the force is fed back to the pressure sensor 1006, which then stops the controller and stops the three sets of push rods. At this time, the position data of the three grating rulers 1004 can be obtained. Then, the diameter of the wafer 5 can be calculated by the controller, the center of the wafer 5 can be fitted, and the center coordinates of the stage 6 and the pushing action data of the first push rod 1002 and the second push rod 1003 can also be obtained.

[0032] c. The support rod 9 continues to drive the wafer 5 to the centering height position of the measuring clamping centering mechanism 10. The third push rod 1005 is activated first (the operating data is based on the dimensional data collected in step b). The centering boss 1005b on the third push rod 1005 is pre-push into the marked notch 15 of the wafer 5. The first push rod 1002 and the second push rod 1003 are then pushed to the target position according to the dimensions of the wafer 5. The third push rod 1005 is finally pushed forward until the pressure sensor 1006 provides feedback, thus completing the centering operation. d. The first push rod 1002, the second push rod 1003, and the third push rod 1005 are retracted. The support rod 9 drives the wafer 5 to fall onto the stage 6. The spacer 12 rises to the receiving height. The loading robot 13 moves the wafer 4 into the pre-bonding cavity 1 and drops it onto the spacer 12. The spacer 12, like the support rod 9, drives the wafer 5 to fall and performs diameter measurement and centering operations respectively. e. After the carrier 4 is aligned, the spacer 12 falls to the pre-bonding height. The upper pressure rod 2 is driven by the upper pressure rod power unit 201 to press the center of the carrier 4 and hold it for a period of time. After the spacer 12 is withdrawn, it continues to hold for a period of time. Then the upper pressure rod 2 returns to its original position, the pre-bonding is completed, the support rod 9 lifts up the bonded piece, the discharge door 8 opens, and the unloading robot 14 takes away the bonded piece.

[0033] When the above structure is adopted: 1. By setting up a pre-bonding device composed of components such as pre-bonding cavity 1, stage 6, and measuring clamping centering mechanism 10, the present invention can realize the precise measurement and positioning of the dimensions of wafer 5 and carrier 4, as well as the centering positioning, thereby improving the accuracy of wafer 5 and carrier 4 during bonding. 2. By setting the spacer 12 and the upper pressure rod 2, the present invention can achieve center alignment before the glass carrier 4 is bonded to the wafer 5 after it enters, without the periphery being bonded to the wafer 5. The upper pressure rod 2 pushes the carrier 4 in advance, and then the diffusion effect achieves complete bonding between the glass carrier 4 and the wafer 5. This method can effectively avoid the generation of internal air bubbles and avoid secondary operations. 3. By changing the length of the spacer and the three push rods, pre-bonding of wafers and carriers of different sizes can be achieved, such as 12-inch and 8-inch wafers; 4. This facility can not only perform pre-bonding with wafer and wafer center alignment, but also perform pre-bonding with specific intentional orientation offset as required.

[0034] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A universal pre-bonding structure for multi-size wafer carriers, characterized in that: The pre-bonding cavity (1) is provided with a platform support (7) fixed inside the pre-bonding cavity (1), a platform (6) is fixed on the top of the platform support (7), a measuring clamping and centering mechanism (10) is provided around the platform (6), a support rod (9) is slidably provided in the inner wall of the platform (6), a support rod power unit (901) is provided at the bottom of the support rod (9) through the pre-bonding cavity (1), an upper pressure rod (2) is sealed and provided through the top of the pre-bonding cavity (1), and an upper pressure rod power unit (201) is installed on the outside of the upper pressure rod (2). The measuring clamping centering mechanism (10) includes a first push rod (1002), a second push rod (1003) and a third push rod (1005), and the telescopic joint end of the third push rod (1005) is provided with a measuring centering part.

2. The universal pre-bonding structure for multi-size wafers according to claim 1, characterized in that: The pre-bonding cavity (1) is symmetrically slidably connected to a feed door (3) and a discharge door (8). A loading robot (13) is provided on the outside of the feed door (3), and a unloading robot (14) is provided on the outside of the discharge door (8).

3. The universal pre-bonding structure for multi-size wafers according to claim 1, characterized in that: A vacuum machine (11) is provided on one side of the upper pressure rod power unit (201) and is connected to the pre-bonding cavity (1).

4. The universal pre-bonding structure for multi-size wafers according to claim 1, characterized in that: The top of the support rod (9) is provided with a wafer (5), and the top of the wafer (5) is provided with a carrier (4). Both the wafer (5) and the carrier (4) are provided with marking notches (15) for marking and positioning.

5. The universal pre-bonding structure for multi-size wafers according to claim 1, characterized in that: The first push rod (1002), the second push rod (1003) and the third push rod (1005) are all fixed with mounting bases (1001), and the mounting bases (1001) are fixed to the top of the platform (6).

6. The universal pre-bonding structure for multi-size wafers according to claim 1, characterized in that: The first push rod (1002), the second push rod (1003) and the third push rod (1005) are all equipped with grating rulers (1004), and the end of the third push rod (1005) is also equipped with a pressure sensor (1006).

7. The universal pre-bonding structure for multi-size wafers according to claim 1, characterized in that: The measuring center section includes a diameter measuring arc surface (1005a) and a centering boss (1005b) that are fixed in layers with the pressure sensor (1006).

8. The universal pre-bonding structure for multi-size wafers according to claim 7, characterized in that: The diameter measuring arc surface (1005a) has the same curvature as the outer wall of the carrier (4) and the wafer (5), and the centering boss (1005b) is fitted into the marking notch (15).

9. The universal pre-bonding structure for multi-size wafers according to claim 1, characterized in that: Three sets of spacers (12) are also slidably disposed on the top of the platform (6).

10. A method of using the multi-size wafer universal pre-bonding structure according to any one of claims 1-9, characterized in that, Includes the following steps: a. The feed door (3) opens, the support rod (9) is lifted to the receiving height by the support rod power unit (901), the loading robot (13) moves the wafer (5) into the pre-bonding cavity (1) and places it on top of the support rod (9), the loading robot (13) withdraws, the feed door closes, and the vacuum machine (11) evacuates the inside of the pre-bonding cavity (1); b. The support rod (9) drives the wafer (5) to the measurement height position of the measuring clamping centering mechanism (10). The first push rod (1002), the second push rod (1003), and the third push rod (1005) clamp the wafer (5) simultaneously. The diameter measuring arc surface (1005a) at the end of the third push rod (1005) contacts the outer wall of the wafer (5), and the force is fed back to the pressure sensor (1006). The controller then stops the three sets of push rods. At this time, the position data of the three grating rulers (1004) can be obtained. The diameter of the wafer (5) is calculated by the controller, the center of the wafer (5) is fitted, and the center coordinates of the stage (6) and the pushing action data of the first push rod (1002) and the second push rod (1003) are also obtained. c. The support rod (9) continues to drive the wafer (5) to the centering height position of the measuring clamping centering mechanism (10). The third push rod (1005) is started first (the running data is based on the size data collected in step b). The centering boss (1005b) on the third push rod (1005) is pre-push into the marking notch (15) of the wafer (5). The first push rod (1002) and the second push rod (1003) are then pushed to the target position according to the size of the wafer (5). The third push rod (1005) is finally pushed forward until the pressure sensor (1006) provides feedback, thus completing the centering operation. d. The first push rod (1002), the second push rod (1003), and the third push rod (1005) are retracted. The support rod (9) drives the wafer (5) to fall onto the stage (6). The spacer (12) rises to the receiving height. The loading robot (13) moves the wafer (4) into the pre-bonding cavity (1) and onto the spacer (12). The spacer (12) acts like the support rod (9) to drive the wafer (5) to fall and perform diameter measurement and centering operations respectively. e. After the carrier (4) is aligned, the spacer (12) falls to the pre-bonding height. The upper pressure rod (2) is driven by the upper pressure rod power unit (201) to press the center of the carrier (4) for a period of time. After the spacer (12) is withdrawn, it continues to be held for a period of time. Then the upper pressure rod (2) returns to its position, the pre-bonding is completed, the support rod (9) lifts up the bonded piece, the discharge door (8) opens, and the unloading robot (14) takes away the bonded piece.

Images