Electronic device including self-healing protective layer

Abstract

The present disclosure relates to a protective layer having a self-repairing characteristic and a shape memory characteristic on one surface of a display panel. To this end, the protective layer may be manufactured from a product consisting of methyl methacrylate (MMA), hexyl methacrylate (HMA) and cinnamyl (Ci) mixed in a predetermined ratio that can ensure predetermined optical transparency, predetermined rigidity, or predetermined restorability against plastic deformation. Other various embodiments are possible.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to protective layers having self-healing (self-repairing) and shape memory properties, and electronic devices including the same. Background Technology

[0002] Electronic devices require small outlines for portability and large-area displays to provide users with large amounts of information. To achieve compatibility between small outlines and large-area displays in electronic devices, various shape factors such as rollable, slidable, or foldable shapes are emerging, moving away from rectangular strip shape factors. Electronic devices with such shape factors require flexible displays that can be bent or folded.

[0003] The display of an electronic device may include a protective layer to prevent foreign objects from entering from above the panel layer. The protective layer may have at least a portion formed of a flexible material corresponding to the flexibility of the flexible display.

[0004] As flexible displays are bent or folded at an increasing frequency or number of times, stresses exceeding the elastic limit (e.g., yield strength) of the protective layer can be applied, resulting in plastic deformation (deformation). In this case, flexible displays may experience distortion (distortion) or reduced transparency due to creases or scratches. Summary of the Invention

[0005] Technical issues

[0006] Various embodiments of this disclosure propose a protective layer formed of a material that is self-healing and shape-memory while having predetermined rigidity and transmittance, and an electronic device comprising the same.

[0007] Solution to the problem

[0008] A display device according to an embodiment of the present disclosure may include a display panel having a self-healing protective layer disposed on one of its exposed surfaces. The protective layer may be manufactured from a product composed of methyl methacrylate (MMA), hexyl methacrylate (HMA), and cinnamic acid (Ci) mixed in predetermined proportions that ensure predetermined optical transparency, predetermined rigidity, or predetermined resilience to plastic deformation.

[0009] An electronic device according to embodiments of this disclosure may include a first housing, a second housing foldably connected to the first housing via a hinge module, and a flexible display supported by the first and second housings. The flexible display may include a protective layer manufactured from a product composed of methyl methacrylate (MMA), hexyl methacrylate (HMA), and cinnamic acid (Ci) mixed in predetermined proportions capable of ensuring predetermined optical transparency, predetermined rigidity, or predetermined resilience to plastic deformation.

[0010] Beneficial effects

[0011] Electronic devices according to embodiments of this disclosure may provide a protective layer that self-recovers in response to plastic deformation caused by compression and stretching of the display.

[0012] Electronic devices according to embodiments of this disclosure can enhance the durability of the display appearance by providing a protective layer composed of a reversible, self-healing material. Attached Figure Description

[0013] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to various embodiments.

[0014] Figure 2A This is a perspective view showing a foldable electronic device in its unfolded state according to an embodiment of the present disclosure.

[0015] Figure 2B This is a perspective view showing a foldable electronic device in a folded state according to an embodiment of the present disclosure.

[0016] Figure 2B This is a perspective view showing an electronic device in an intermediate state according to an embodiment of the present disclosure.

[0017] Figure 3 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0018] Figure 4 This is a cross-sectional view showing a display according to an embodiment of the present disclosure.

[0019] Figure 5 This is a cross-sectional view showing a display according to an embodiment of the present disclosure.

[0020] Figure 6 This is a flowchart illustrating an embodiment of the present disclosure of a self-healing polymer for manufacturing a protective layer to be used as a display.

[0021] Figure 7 The bonding structure of a self-healing polymer according to an embodiment of the present disclosure is shown.

[0022] Figure 8 The deformation and corresponding recovery process of a protective layer made of a self-healing polymer according to an embodiment of the present disclosure are shown.

[0023] Figure 9A This is a diagram showing the unfolded state of an electronic device according to an embodiment of the present disclosure.

[0024] Figure 9B This is a diagram showing the folded state of an electronic device according to an embodiment of the present disclosure.

[0025] Figure 9C This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0026] Figure 10A This is a diagram showing the extended (extended, protruding) state of an electronic device according to an embodiment of the present disclosure.

[0027] Figure 10B This is a diagram showing the retracted state of an electronic device according to an embodiment of the present disclosure.

[0028] Regarding the description of the accompanying drawings, the same or similar reference numerals may be used for the same or similar parts. Detailed Implementation

[0029] In the following, embodiments of this disclosure will be described in detail with reference to the accompanying drawings, enabling those skilled in the art to readily practice this disclosure. However, this disclosure may be implemented in many other forms and is not limited to the embodiments set forth herein. Throughout the specification and drawings, the same or similar reference numerals may be used to refer to the same or similar elements. Furthermore, for clarity and brevity, well-known functions and configurations are not described in the drawings and related descriptions.

[0030] In the following description, the electronic device may include a flexible display, which is at least one of a foldable display, a rollable display, a sliding display, or a stretchable display. A flexible display can deform due to folding or bending. Folding or bending of a flexible display may be referred to as "deformation," which may mean all deformations occurring at a specific point according to the characteristics of the flexible display.

[0031] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0032] Reference Figure 1In network environment 100, electronic device 101 can communicate with at least one of electronic devices 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one of the components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. According to an implementation, some of the components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0033] Processor 120 can execute, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 coupled to processor 120, and can perform various data processing or calculations. According to embodiments, as at least part of data processing or calculation, processor 120 can store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, in the case where electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or may be adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0034] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited to these. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0035] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0036] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0037] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0038] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0039] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0040] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0041] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0042] Interface 177 may support one or more specific protocols used to enable direct (e.g., wired) or wireless connection between electronic device 101 and external electronic device (e.g., electronic device 102). Depending on the implementation, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0043] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The tactile module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0045] Camera module 180 can capture still or moving images. Depending on the implementation, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0046] The power management module 188 manages the power supply to the electronic device 101. According to embodiments, the power management module 188 may be implemented as at least a portion of, for example, a power management integrated circuit (PMIC).

[0047] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0048] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN)). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0049] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., mmWave band) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance on high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic device (e.g., electronic device 104), or network system (e.g., second network 199). According to the implementation, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane delay (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0050] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductor or conductive pattern formed in a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0051] According to various embodiments, antenna module 197 can form an mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., an mmWave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0052] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0053] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of the external electronic devices 102, 104, and 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0054] The electronic device according to various embodiments can be one of many types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0055] Figure 2A This illustrates an electronic device 200 in its unfolded state according to an embodiment of the present disclosure (e.g., Figure 1 A perspective view of the electronic device 101.

[0056] Figure 2B This is a perspective view showing an electronic device 200 in a folded state according to an embodiment.

[0057] Figure 2C This is a perspective view showing an electronic device 200 in an intermediate state according to an embodiment.

[0058] Figure 3 This is an exploded perspective view showing the electronic device 200 according to an embodiment.

[0059] Reference Figures 2A to 2C and Figure 3 The electronic device 200 may include a pair of housings 210 and 220 (e.g., foldable housings) rotatably coupled while facing each other to fold around a hinge module 240. According to an embodiment, the electronic device 200 may include a flexible display 260 (e.g., [missing information]) disposed in the area formed by the pair of housings 210 and 220. Figure 1 The display 160). According to an embodiment, the first housing 210 and the second housing 220 may be disposed on two opposite sides of the folding axis (axis F) and substantially symmetrical in shape with respect to the folding axis (e.g., axis F). According to an embodiment, the first housing 210 and the second housing 220 may be formed at different angles or distances depending on whether the foldable electronics 200 is in an unfolded (or flat) state, a folded state, or an intermediate state.

[0060] A pair of housings 210 and 220 may include a first housing 210 (e.g., a first housing structure) coupled to the hinge module 240 and a second housing 220 (e.g., a second housing structure) coupled to the hinge module 240. According to an embodiment, in the deployed state, the first housing 210 may include a first surface 211 facing a first direction (e.g., the forward direction) (z-axis direction) and a second surface 212 facing a second direction opposite to the first surface 211 (e.g., the rearward direction) (-z-axis direction).

[0061] According to an embodiment, in the unfolded state, the second housing 220 may include a third surface 221 facing a first direction (z-axis direction) and a surface facing a second direction (-z-axis direction). Hereinafter, the surface facing the second direction is referred to as a fourth surface (not shown). According to an embodiment, the electronic device 200 can operate in such a way that, in the unfolded state, the first surface 211 of the first housing 210 and the third surface 221 of the second housing 220 face substantially the same first direction (z-axis direction), and in the folded state, the first surface 211 and the third surface 221 face each other.

[0062] According to an embodiment, the electronic device 200 can operate in such a way that, in an unfolded state, the second surface 212 of the first housing 210 and the fourth surface located on the rear surface (e.g., the -z-axis direction) of the second housing 220 face substantially the same second direction (the -z-axis direction), and in a folded state, the second surface 212 and the fourth surface face opposite directions to each other. For example, in the folded state, the second surface 212 may face the first direction (the z-axis direction), and the fourth surface may face the second direction (the -z-axis direction).

[0063] According to one embodiment, the first housing 210 may include a first side frame 213 that at least partially forms the appearance of the electronic device 200, and a first rear cover 214 that is coupled to the first side frame 213 and forms at least a portion of the second surface 212 of the electronic device 200. According to one embodiment, the first side frame 213 may include a first side surface 213a, a second side surface 213b extending from one end of the first side surface 213a, and a third side surface 213c extending from the other end of the first side surface 213a. According to one embodiment, the first side frame 213 may be formed in a rectangular (or square) shape by means of the first side surface 213a, the second side surface 213b, and the third side surface 213c.

[0064] According to one embodiment, the second housing 220 may include a second side frame 223 that at least partially forms the appearance of the electronic device 200, and a second rear cover 224 that is coupled to the second side frame 223 and forms at least a portion of the fourth surface of the electronic device 200. According to one embodiment, the second side frame 223 may include a fourth side surface 223a, a fifth side surface 223b extending from one end of the fourth side surface 223a, and a sixth side surface 223c extending from the other end of the fourth side surface 223a. According to one embodiment, the second side frame 223 may be formed in a rectangular shape using the fourth side surface 223a, the fifth side surface 223b, and the sixth side surface 223c.

[0065] According to the embodiments, the pair of housings 210 and 220 are not limited to the shape and connection shown, but may instead be implemented in other shapes or through combinations and / or connections of other components. For example, in the embodiments, the first side frame 213 may be integrally formed with the first rear cover 214, and the second side frame 223 may be integrally formed with the second rear cover 224.

[0066] According to an embodiment, in the unfolded state of the electronic device 200, the second side surface 213b of the first side frame 213 can be connected to the fifth side surface 223b of the second side frame 223 without gaps. According to an embodiment, in the unfolded state of the electronic device 200, the third side surface 213c of the first side frame 213 can be connected to the sixth side surface 223c of the second side frame 223 without gaps. According to an embodiment, in the unfolded state of the electronic device 200, the sum of the lengths of the second side surface 213b and the fifth side surface 223b can be configured to be greater than the lengths of the first side surface 213a and / or the fourth side surface 223a. Furthermore, the sum of the lengths of the third side surface 213c and the sixth surface 223c can be configured to be greater than the lengths of the first side surface 213a and / or the fourth side surface 223a.

[0067] According to an embodiment, the first side frame 213 and / or the second side frame 223 may be formed of metal, or may further comprise a polymer injected into the metal. According to an embodiment, the first side frame 213 and / or the second side frame 223 may include at least one conductive portion 216 and / or 226 electrically segmented by at least one segmented portion 2161, 2162 and / or 2261 or 2262 formed of polymer. In this case, the at least one conductive portion may be electrically connected to a wireless communication circuit included in the electronic device 200, and thus serve as an antenna operating in at least one designated band (e.g., a conventional band).

[0068] According to an embodiment, the first back cover 214 and / or the second back cover 224 may be formed of at least one or a combination of at least two of coated or colored glass, ceramic, polymer or metal (e.g., aluminum, stainless steel (STS) or magnesium).

[0069] According to one embodiment, the flexible display 260 may be disposed from a first surface 211 of the first housing 210 across the hinge module 240 to at least a portion of the third surface 221 of the second housing 220. For example, the flexible display 260 may include a first flat portion 260a substantially corresponding to the first surface 211, a second flat portion 260b corresponding to the third surface 221, and a flexible portion 260c connecting the first flat portion 260a and the second flat portion 260b and corresponding to the hinge module 240. According to one embodiment, the electronic device 200 may include a first protective cover 215 (e.g., a first protective frame or a first decorative member) coupled along the edge of the first housing 210. According to one embodiment, the electronic device 200 may include a second protective cover 225 (e.g., a second protective frame or a second decorative member) coupled along the edge of the second housing 220. According to one embodiment, the first protective cover 215 and / or the second protective cover 225 may be formed of a metal or polymer material. According to one embodiment, the first protective cover 215 and / or the second protective cover 225 may serve as decorative members. According to one embodiment, the flexible display 260 can be positioned such that the edge of the first flat portion 260a is between the first housing 210 and the first protective cover 215. According to another embodiment, the flexible display 260 can be positioned such that the edge of the second flat portion 260b is between the second housing 220 and the second protective cover 225. According to yet another embodiment, the flexible display 260 can be positioned such that the edge of the flexible display 260 corresponding to the protective cap 235 is protected by the protective cap 235 disposed in the region corresponding to the hinge module 240. Therefore, the edge of the flexible display 260 can be substantially protected from external influences.

[0070] According to an embodiment, the electronic device 200 may include a hinged housing 241 (e.g., a hinged cover) that supports the hinged module 240 and is configured to be exposed to the outside in the folded state of the electronic device 200 and introduced into a first space and a second space in the unfolded state of the electronic device 200 so that it is not visible from the outside.

[0071] According to one embodiment, the electronic device 200 may include a sub-display 231 disposed separately from the flexible display 260. According to another embodiment, when the sub-display 231 is disposed on the second surface 212 of the first housing 210 and at least partially exposed, in a folded state, the sub-display 231 may display status information about the electronic device 200, replacing the display function of the flexible display 260. According to another embodiment, the sub-display 231 may be configured to be visible from the outside through at least a portion of the first rear cover 214. In another embodiment, the sub-display 231 may be disposed on the fourth surface of the second housing 220. In this case, the sub-display 231 may be configured to be visible from the outside through at least a portion of the second rear cover 224.

[0072] According to an embodiment, the electronic device 200 may include an input device (e.g., a microphone), and audio output devices 201 and 202 (e.g., ...). Figure 1 The audio module 170), sensor module 204 (e.g., Figure 1 Sensor module 176), camera device (e.g., Figure 1 Input module 150, first camera device 205 and / or second camera device 208), key input device 206 (e.g., Figure 1 Input module 150) or connector port 207 (e.g., Figure 1 At least one of the interfaces 177. In the illustrated embodiment, input devices (e.g., microphones), sound output devices 201 and 202, sensor module 204, camera devices (e.g., first camera device 205 and / or second camera device 208), key input device 206, or connector port 207 refer to holes or shapes formed in the first housing 210 or the second housing 220, but can be defined as including substantial electronic components (e.g., input devices, sound output devices, sensor modules, or camera devices) disposed within the electronic device 200 and operated through holes or shapes.

[0073] According to one embodiment, the input device may include at least one microphone 203 disposed in the second housing 220. In another embodiment, the input device may include multiple microphones 203 configured to detect the direction of sound. In yet another embodiment, the multiple microphones 203 may be disposed at appropriate locations within the first housing 210 and / or the second housing 220. According to one embodiment, the sound output devices 201 and 202 may include speakers. According to one embodiment, the speakers may include a call receiver 201 disposed in the first housing 210 and a speaker 202 disposed in the second housing 220. In another embodiment, the input device, the sound output devices 201 and 202, and the connector port 207 may be disposed within the space provided in the first housing 210 and / or the second housing 220 of the electronic device 200, and may be exposed to the external environment through at least one opening formed in the first housing 210 and / or the second housing 220. According to one embodiment, at least one connector port 207 may be used to send power and / or data to and receive power and / or data from an external electronic device. In one embodiment, at least one connector port (e.g., a headphone jack) may receive a connector (e.g., a headphone jack) for transmitting and receiving audio signals from an external electronic device. In another embodiment, holes formed in the first housing 210 and / or the second housing 220 may be used jointly for the input device 201 and the sound output device 202. In yet another embodiment, the sound output devices 201 and 202 may include a loudspeaker (e.g., a piezoelectric loudspeaker) that operates without holes formed in the first housing 210 and / or the second housing 220.

[0074] According to embodiments, sensor module 204 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 200. Sensor module 204 can detect, for example, the external environment via a first surface 211 of first housing 210. In embodiments, electronic device 200 may further include at least one sensor module configured to detect the external environment via a second surface 212 of first housing 210. According to embodiments, sensor module 204 (e.g., illuminance sensor) can be disposed under flexible display 260 to detect the external environment via flexible display 260. According to embodiments, sensor module 204 may include at least one of gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, temperature sensor, humidity sensor, proximity sensor, biometric sensor, ultrasonic sensor, or illuminance sensor.

[0075] According to an embodiment, the camera device (e.g., first camera device 205 and / or second camera device 208) may include a first camera device 205 (e.g., a front camera device) disposed on a first surface 211 of the first housing 210 and a second camera device 208 disposed on a second surface 212 of the first housing 210. The electronic device 200 may further include a flash 209 disposed near the second camera device 208. According to an embodiment, the camera device (e.g., first camera device 205 and / or second camera device 208) may include one or more lenses, an image sensor, and / or an image signal processor. The flash 209 may include, for example, a light-emitting diode or a xenon lamp. According to an embodiment, the camera device (e.g., first camera device 205 and / or second camera device 208) may be configured such that two or more lenses (wide-angle lens, ultra-wide-angle lens, or telephoto lens) and an image sensor are located on a surface of the electronic device 200 (e.g., first surface 211, second surface 212, third surface 221, or fourth surface). In an implementation, the camera device (e.g., the first camera device 205 and / or the second camera device 208) may include a time-of-flight (TOF) lens and an image sensor.

[0076] According to an embodiment, a key input device 206 (e.g., a key button) may be disposed on a third side surface 213c of a first side frame 213 of the first housing 210. In another embodiment, the key input device 206 may be disposed on at least one of the other side surfaces 213a and 213b of the first housing 210 and / or the side surfaces 223a, 223b, and 223c of the second housing 220. In another embodiment, the electronic device 200 may not include some or all of the key input device 206, and the un-included key input device 206 may be implemented on the flexible display 260 in other forms (such as soft keys). In yet another embodiment, a pressure sensor included in the flexible display 260 may be used to implement the key input device 206.

[0077] According to one embodiment, some camera devices (e.g., first camera device 205 and / or second camera device 208) or sensor modules 204 may be configured to be exposed through the flexible display 260. For example, the first camera device 205 or sensor module 204 may be configured to contact the external environment through openings (e.g., through-holes) formed at least partially in the flexible display 260 within the internal space of the electronic device 200. In another embodiment, some sensor modules 204 may be configured to perform their functions without being visually exposed through the flexible display 260 within the internal space of the electronic device 200. For example, in this case, the area of ​​the flexible display 260 facing the sensor module may not require an opening.

[0078] refer to Figure 2CThe electronic device 200 can be operated to maintain an intermediate state via the hinge module 240. In this case, the electronic device 200 can control the flexible display 260 to display different content in the display area corresponding to the first surface 211 and the display area corresponding to the third surface 221. According to an embodiment, the electronic device 200 can be in a substantially unfolded state (e.g., the angle between the first housing 210 and the second housing 220 in the intermediate state) based on a predetermined bending angle via the hinge module 240. Figure 2A (the unfolded state) and / or the substantially folded state (e.g., Figure 2B In the folded state, the electronic device 200 can be operated. For example, when pressure is applied in the unfolded direction (direction B) by the hinge module 240 in the unfolded state at a predetermined bending angle, the electronic device 200 can be operated to switch to the unfolded state (e.g., in the folded state). Figure 2A (The unfolded state). For example, when the electronic device 200 is unfolded at a predetermined bending angle and pressure is applied in the folding direction (direction C), the electronic device 200 can be operated via the hinge module 240 to switch to the closed state (e.g., Figure 2B (The folded state). In an embodiment, the electronic device 200 can be operated to remain in an unfolded state at various angles via the hinge module 240.

[0079] Reference Figure 3 The electronic device 200 may include a first side frame 213, a second side frame 223, and a hinge module 240 rotatably connecting the first side frame 213 and the second side frame 223. According to an embodiment, the electronic device 200 may include a first support plate 2131 extending at least partially from the first side frame 213 and a second support plate 2231 extending at least partially from the second side frame 223. According to an embodiment, the first support plate 2131 may be integrally formed with the first side frame 213, or may be structurally connected to the first side frame 213. Similarly, the second support plate 2231 may be integrally formed with the second side frame 223, or may be structurally connected to the second side frame 223.

[0080] According to one embodiment, the electronic device 200 may include a flexible display 260, which is configured to be supported by a first support plate 2131 and a second support plate 2231. According to one embodiment, the electronic device 200 may include a first rear cover 214 and a second rear cover 224, the first rear cover 214 being coupled to a first side frame 213 and providing a first space therebetween it and the first support plate 2131, and the second rear cover 224 being coupled to a second side frame 223 and providing a second space therebetween it and the second support plate 2231. In one embodiment, the first side frame 213 and the first rear cover 214 may be integrally formed. In one embodiment, the second side frame 223 and the second rear cover 224 may be integrally formed. According to one embodiment, the electronic device 200 may include a first housing 210 (e.g., a first housing structure) provided by the first side frame 213, the first support plate 2131, and the first rear cover 214. According to one embodiment, the electronic device 200 may include a second housing 220 (e.g., a second housing structure) provided by the second side frame 223, the second support plate 2231, and the second rear cover 224. According to an embodiment, the electronic device 200 may include a sub-display 231, which is configured to be visible from the outside through at least a portion of a first rear cover 214.

[0081] According to an embodiment, the electronic device 200 may include a first board assembly 261 (e.g., a main printed circuit board), a camera assembly 263, a first battery 271, or a first bracket 251 disposed in a first space between a first side frame 213 and a first rear cover 214.

[0082] According to an implementation, camera assembly 263 may include a plurality of camera devices (e.g., Figure 2A and Figure 2B The camera device (e.g., the first camera device 205 and / or the second camera device 208) is electrically connected to the first board assembly 261.

[0083] According to an embodiment, the first bracket 251 can provide a support structure and enhanced rigidity for supporting the first substrate assembly 261 and / or the camera assembly 263.

[0084] According to an embodiment, the electronic device 200 may include a second board assembly 262 (e.g., a sub-printed circuit board), an antenna 290 (e.g., a coil component), a second battery 272, or a second bracket 252 disposed in a second space between the second side frame 223 and the second rear cover 224.

[0085] According to one embodiment, the electronic device 200 may include a wiring member 280 (e.g., a flexible printed circuit board (FPCB)). The wiring member 280 according to one embodiment may be configured to extend from the first substrate assembly 261 across the hinge module 240 to a plurality of electronic components (e.g., the second substrate assembly 262, the second battery 272, or the antenna 290) disposed between the second side frame 223 and the second rear cover 224.

[0086] According to an embodiment, the first substrate assembly 261, the second substrate assembly 262, and the wiring member 280 may be electrically connected to each other, operatively connected, or integrally formed. According to an embodiment, since the first substrate assembly 261 and the second substrate assembly 262 are integrally formed to transmit and receive electrical signals or wavelengths, the wiring member 280 may be omitted.

[0087] According to an embodiment, the electronic device 200 may include one or more batteries (e.g., a first battery 271 and / or a second battery 272). For example, the one or more batteries may include at least one of a first battery 271 disposed in a region corresponding to the first housing 210 and a second battery 272 disposed in a region corresponding to the second housing 220. The electronic device 200 according to an embodiment may include either the first battery 271 and / or the second battery 272, or may include both the first battery 271 and / or the second battery 272.

[0088] According to one embodiment, the electronic device 200 may include a flexible battery. The flexible battery may be disposed above at least a portion of each of the first housing 210 and the second housing 220. The flexible battery may be configured to overlap with a portion corresponding to a region of the first housing 210 and a portion corresponding to a region of the second housing 220. The flexible battery may include a battery hinge portion at the boundary where the first housing 210 and the second housing 220 are separated from each other. The battery hinge portion may be formed to be physically thin. The battery hinge portion is provided at a point corresponding to a folding axis (e.g., Figures 2A to 2C The flexible battery is positioned at the axis F, allowing it to fold along with the electronic device 200.

[0089] According to one embodiment, the hinged portion of the flexible battery can be a physical or electrical connector. The flexible battery may include a first battery segment, a second battery segment, and a connector that electrically connects or operatively connects the first and second battery segments. The first and second battery segments can be electrically connected or operatively connected to each other via the connector. The connector can be a component constituting the flexible battery and can be provided externally or internally within the flexible battery. However, according to another embodiment, the connector can physically connect the first and second battery segments as a non-conductive wire connector.

[0090] According to an embodiment, antenna 290 may include a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. For example, antenna 290 may perform short-range communication with an external device, or may wirelessly send and receive power required for charging.

[0091] According to an embodiment, the electronic device 200 may include a hinge housing 241 (e.g., a hinge cover) supporting the hinge module 240, when the electronic device 200 is in a folded state (e.g., Figure 2B In the folded state, the hinged housing 241 is exposed to the outside, and when the electronic device 200 is in the unfolded state (e.g., ...), Figure 2A In the unfolded state, the hinged housing 241 is pulled into the first space and / or the second space so that it is not visible from the outside.

[0092] According to one embodiment, the electronic device 200 may include a first protective cover 215 attached along the edge of a first side frame 213. According to one embodiment, the electronic device 200 may include a second protective cover 225 attached along the edge of a second side frame 223. According to one embodiment, the first flat portion of the flexible display 260 (e.g., Figure 2A The edge of the first flat portion 260a) can be protected by the first protective cover 215. According to an embodiment, the second flat portion of the flexible display 260 (e.g., Figure 2A The edge of the second flat portion 260b can be protected by a second protective cover 225. According to an embodiment, the electronic device 200 may include a protective cap 235 configured to protect the flexible portion (e.g., the hinge module 240 corresponding to the flexible display 260) of the flexible display 260. Figure 2A The edge of the flexible part (260c).

[0093] The electronic device 200 according to the embodiment may be a bar-shaped (canvas-shaped) electronic device. The bar-shaped electronic device may include one or more housings that completely support the display 260. According to the embodiment, a pair of housings 210, 220 may be integrally formed into a bar-shaped housing. The bar-shaped housing can completely support the display 260.

[0094] According to one embodiment, a pair of housings 210, 220 includes a first housing 210 and a second housing 220, and the first housing 210 and the second housing 220 are fixedly connected to each other. The fixedly connected pair of housings 210, 220 can be configured not to rotate relative to a hinge axis (e.g., axis F). The fixedly connected pair of housings 210, 220 can fully support the display 260.

[0095] According to the embodiments, when the first housing 210 and the second housing 220 form an integral strip housing or are fixedly connected to each other, components such as the hinge module 240 and the hinge housing 241 can be omitted between the first housing 210 and the second housing 220.

[0096] According to the embodiment, the strip-shaped electronic device may not rotate relative to the folding axis (e.g., the F-axis) and may maintain a fixed shape corresponding to the initial shape of the housing. Therefore, even when an external force is applied to the electronic device, it will not be folded, rolled, slid, or twisted.

[0097] According to the embodiments, the positions of one or more electronic components and / or parts received in the housing of the electronic device are not limited to the exemplary forms shown, and the positional relationships and / or connection relationships between the components may vary.

[0098] According to the embodiment, the flexible display 260 can be compressed or stretched corresponding to the unfolded or folded state of the electronic device 200. Specifically, when the electronic device 200 is in the folded state, compressive stress may occur in the third region 260c of the flexible display 260. Furthermore, when the electronic device 200 is in the unfolded state, tensile stress may occur in the third region 260c of the flexible display 260. The area where compressive stress and / or tensile stress act is not limited to the third region 260c, but can occur throughout the entire region of the flexible display 260.

[0099] According to the embodiment, due to compressive stress and / or tensile stress acting on the flexible display 260, external forces exceeding the elastic limit of the flexible display 260 may occur. In this case, damage such as scratches and creases may occur on the exterior of the flexible display 260. This can lead to a deterioration in the performance of the flexible display 260.

[0100] The flexible display 260 proposed in this disclosure may include a protective layer provided with a material having self-healing properties and / or shape memory properties (hereinafter referred to as a self-healing polymer). Figure 4 Protective layer 310 or Figure 5 (Protective layer 410). Protective layers 310 and 410 may be disposed on one of the externally exposed surfaces of the flexible display 260.

[0101] Furthermore, the protective layers 310 and 410 proposed in this disclosure can be applied to various types of displays (e.g., Figure 1 Display module 160).

[0102] For example, protective layers 310 and 410 can be applied to displays included in bar-shaped electronic devices.

[0103] For example, protective layers 310 and 410 can be applied to electronic devices including those having a folding axis arranged vertically (y-axis direction). Figures 9A to 9C Flexible displays in electronic devices 900 (e.g., Figures 9A to 9C Flexible display 921).

[0104] For example, protective layers 310 and 410 can be applied to retract into electronic devices (e.g., Figure 10A and Figure 10B The flexible display (e.g., in or extending from the sliding structure 1060 of the electronic device 1000) is located in or extends from the sliding structure 1060. Figure 10A and Figure 10B Flexible display 1030).

[0105] For example, protective layers 310 and 410 can be applied to flexible displays included in electronic devices with multiple folding axes.

[0106] In addition, protective layers 310 and 410 can be applied to various types of flexible displays.

[0107] Figure 4 This illustrates a display 300 according to an embodiment (e.g., Figures 2A to 2C and Figure 3 A cross-sectional view of the flexible display 260. Specifically, Figure 4 This is a cross-sectional view showing the stacked structure of the layers constituting the flexible display 260, and can be understood as focusing on the protective layer exposed on the outer surface of the flexible display 260. The stacked structure of the display 300 shown may omit some layers or modules constituting the flexible display 260.

[0108] Reference Figure 4 The display 300 may include a protective layer 310, a glass layer 330, and a panel layer 350.

[0109] According to an embodiment, the protective layer 310 may be made of a polymer having self-healing properties and / or shape memory properties (e.g., Figure 7 The final target materials 710 and 710-1 are constituted. The polymer can be repeatable, reversible, and has self-healing properties.

[0110] According to an embodiment, the polymer may have predetermined recovery characteristics from plastic deformation. Based on the PV (peak-valley) value of plastic deformation, the polymer may have, for example, essentially 90% or higher recovery.

[0111] According to an embodiment, the polymer may have enhanced shape memory properties under predetermined temperature conditions. In response to the application of heat above a predetermined glass transition temperature, the polymer may exhibit, for example, an increased degree and / or speed of shape recovery.

[0112] According to an embodiment, the polymer may be an acrylic copolymer. The polymer may possess self-healing properties via dynamic bonds formed by hydrogen bonding and dynamic bonds formed by van der Waals bonding.

[0113] According to embodiments, the polymer may have predetermined optical transparency (e.g., transmittance) and / or predetermined mechanical properties (e.g., rigidity). Compared to a protective layer formed from PET, the polymer may achieve, for example, substantially 88% or higher transmittance. The Young's modulus of the polymer may be, for example, 1 GPa to 2 GPa.

[0114] According to an embodiment, the polymer can be combined with at least one or more materials in an optimized (best) composition ratio to have the mentioned self-healing properties, shape memory properties, transmittance, or rigidity.

[0115] For example, the polymer can be a combination of methyl methacrylate (hereinafter referred to as MMA), hexyl methacrylate (hereinafter referred to as HMA), and cinnamoyl (hereinafter referred to as Ci) in a predetermined ratio. The predetermined ratio can be, for example, a molar ratio of MMA:HMA:Ci of 37:12:1 to 37.5:25.5:1. As the proportion of MMA included in the polymer increases, the self-healing properties may decrease due to the increased mechanical stiffness and / or glass transition temperature. Therefore, the MMA, HMA, and Ci constituting the polymer can satisfy the predetermined ratio to possess self-healing properties.

[0116] According to an embodiment, the polymer can be synthesized from a precursor material (intermediate target material). The precursor material can be a combination of MMA, HMA, and hydroxyethyl methacrylate (hereinafter referred to as HEMA) in a predetermined ratio. The predetermined ratio can be achieved, for example, MMA:HMA:Ci = 37:12:1 to 37.5:12.5:1. Regarding the manufacture of the polymer, see below... Figure 6 As described in the text.

[0117] According to an embodiment, the protective layer 310 may have a predetermined thickness. The predetermined thickness may be, for example, 30 μm to 200 μm. The protective layer 310 may be implemented as a film-type membrane or a coating.

[0118] According to an embodiment, by providing a protective layer 310 formed of a polymer, the display 300 can provide self-repair and / or recovery against damage (e.g., creases and / or cracks) that occurs in response to folding and / or unfolding.

[0119] According to an embodiment, the glass layer 330 may be formed of a material that is at least partially transparent and flexible. For example, the glass layer 330 may be implemented as flexible thin glass (FTG) or ultra-thin glass (UTG). The glass layer 330 may be disposed on the front surface of the display 300. The glass layer 330 may primarily protect the display 300.

[0120] According to embodiments, the glass layer 330 may have various shapes corresponding to the characteristics of the display 300. For example, in the case where the display 300 deforms at a predetermined point, the thickness of the glass layer 330 at the predetermined point may differ from each other at points adjacent to the predetermined point. For example, increasing the thickness at the folding axis (e.g., Figures 2A to 2C The third region near axis F (e.g., Figure 2A The thickness of the glass layer 330 in the third region 260c can be greater than that in the first region (e.g., Figure 2A The first region 260a) or the second region (e.g., Figure 2A The glass layer 330 in the second region 260b) is thin.

[0121] According to an embodiment, a first adhesive member 320 may be provided to attach the protective layer 310 to one surface of the glass layer 330. A second adhesive member 340 may be provided to attach the other surface of the glass layer 330 to one surface of the panel layer 350. For example, the first adhesive member and the second adhesive members 320, 340 may be implemented as layers having a predetermined thickness.

[0122] According to an embodiment, the first adhesive member and the second adhesive member 320, 340 can be implemented as an optically transparent adhesive (OCA) or an optically transparent resin (OCR). The first adhesive member and the second adhesive member 320, 340 can be formed from acrylic-based, silicone-based, or urethane-based components.

[0123] According to an embodiment, panel layer 350 can be implemented as a display panel. For example, panel layer 350 may have a substrate, a light-emitting layer, a polarizing layer, a liquid crystal layer, a color filter, and a thin-film transistor (TFT) stacked in the height direction (e.g., the z-axis direction).

[0124] Figure 5 This illustrates a display 400 according to an embodiment (e.g., Figure 4 A cross-sectional view of the display (300). Figure 5 The display 400 shown may at least partially correspond to Figure 4 The display 300 is shown in the figure. Therefore, redundant descriptions are omitted, and the main focus is on the differences.

[0125] Reference Figure 5 The display 400 may include a protective layer 410 (e.g., Figure 4Protective layer 310), glass layer 430 (e.g., Figure 4 Glass layer 330) and panel layer 450 (e.g., Figure 4 Panel layer 350).

[0126] According to an embodiment, the protective layer 410 may include a first layer 4110 and a second layer 4130. The first layer 4110 may be composed of a polymer having self-healing properties and / or shape memory properties. The second layer 4130 may be composed of PET material. The polymer may be formed by combining MMA, HMA, and Ci in a predetermined ratio. The predetermined ratio may be, for example, a molar ratio of MMA:HMA:Ci = 37:12:1 to MMA:HMA:Ci = 37.5:12.5:1.

[0127] According to an embodiment, the protective layer 410 can be formed by laminating (delaminating) the first layer 4110 onto one surface of the second layer 4130. For example, the first layer 4110 can be attached to one surface of the second layer 4130 in the form of a film, or it can be formed by coating a polymer film onto one surface of the second layer 4130.

[0128] According to an embodiment, the first layer 4110 may have a predetermined thickness. The predetermined thickness may be, for example, 1 μm to 50 μm.

[0129] According to an embodiment, the adhesive member 4120 can be used to laminate (de-laminate) the first layer 4110 onto one surface of the second layer 4130. The adhesive member 4120 can be implemented as OCA or OCR. When the first layer 4110 and the second layer 4130 are integrally implemented, the adhesive member 4120 can be omitted. For example, when a protective layer 410 is formed by applying the material constituting the first layer 4110 to the upper side of the second layer 4130, the adhesive member 4120 can be omitted.

[0130] According to the embodiment, by configuring the protective layer 410 with the first layer 4110 and the second layer 4130, and... Figure 4 Compared to the protective layer 310, the optical transmittance can be increased by a predetermined d level. The protective layer 410 may have a structure in which three or more layers are stacked.

[0131] Figure 6 It is a self-healing polymer (e.g., according to an embodiment) used for manufacturing a protective layer to be used as a display. Figure 7 The flowchart of the self-healing polymers 710 and 710-1.

[0132] refer to Figure 6The diagram illustrates a flowchart of the steps for manufacturing a self-healing polymer, where some steps may be omitted or repeated as needed, and the order may be changed. Furthermore, unless otherwise stated, manufacturing conditions are understood to be room temperature or atmospheric pressure.

[0133] According to the implementation method, steps 610 to 650 can be understood as being used to obtain intermediate target material (M). x H y HE z The steps 660 to 680 can be understood as steps for obtaining intermediate target material (M) x H y HE z Obtain the final target material (M) x H y Ci z The steps are as follows.

[0134] According to an embodiment, in step 610, a first raw material may be introduced into the flask. The first raw material may include, for example, MMA, HMA, and HE. The amount of the first raw material introduced into the flask may be predetermined.

[0135] For example, the MMA, HMA, and HE included in the first raw material introduced into the flask may have a predetermined composition ratio. The flask may be a three-necked flask with a predetermined internal volume. The predetermined composition ratio can be understood as a molar ratio. The predetermined composition ratio may be, for example, 74.08 g (74 mol%) of MMA, 40.86 g (24 mol%) of HMA, and 2.6 g (2 mol%) of HE.

[0136] According to the embodiment, the first raw material introduced into the flask can be kept in a stirred state. Dissolved oxygen can be removed from the first raw material kept in a stirred state in the flask. For example, after sealing the flask, an inert gas (e.g., nitrogen (N2)) can be supplied to the solution mixed with the first raw material for a predetermined time (e.g., 15 minutes).

[0137] According to an embodiment, in step 620, an initiator may be introduced into a flask containing the first raw material. The initiator can be understood as a solution containing azobisisobutyronitrile (hereinafter referred to as AIBN). The initiator can initiate a free radical polymerization process.

[0138] For example, it can be understood that the initiator solution can be prepared by dissolving a predetermined volume (e.g., 20 ml) of AIBN at a predetermined concentration (e.g., 0.1 wt%) in a predetermined volume (e.g., 5 ml) of solvent. The solvent can be, for example, any of chloroform, tetrahydrofuran (hereinafter referred to as THF), or toluene.

[0139] According to the embodiments, dissolved oxygen present in the mixed solution can be removed by introducing an initiator into the flask and using an inert gas.

[0140] According to an embodiment, in step 630, a sealed flask comprising a reaction solution mixed with a first raw material and an initiator may be heated to a predetermined temperature to allow the first raw material included in the reaction solution to react for a predetermined time. The predetermined temperature may be, for example, 75°C. The predetermined time may be, for example, 3 to 4 hours. The material reacting for the predetermined time may be referred to as a reactant.

[0141] According to the embodiment, in step 640, the viscosity of the reactants can be adjusted. To adjust the viscosity of the reactants, a solvent can be separately introduced into the flask containing the reactants.

[0142] According to the embodiment, cooled methanol can be added dropwise to a flask in a predetermined volume so that the intermediate target material (M) included in the reactants in the flask is... x H y HE z Precipitation. Here, M can be understood as MMA, H as HMA, and the numbers represented by subscripts can be understood as the composition ratio of each material. x can be 74 to 75. y can be 24 to 25. z can be 2.

[0143] According to the implementation method, in step 650, the intermediate target material (M) can be obtained. x H y HE z The intermediate target material (M) was filtered and precipitated. x H y HE z The obtained product can be dried under reduced pressure at room temperature to obtain the intermediate target material (M). x H y HE z ).

[0144] According to the embodiment, in step 660, triethylamine (hereinafter referred to as TEA) may be introduced into the intermediate target material (M) and stirred. x H y HE z In a flask. For example, the intermediate target material (M) can be dissolved in a THF solvent by stirring in the flask at room temperature (e.g., about 25°C) or low temperature (e.g., about 0°C). x H y HE z TEA is introduced into the solution at the same time.

[0145] According to an embodiment, in step 670, a second raw material may be introduced to react with the solution contained in the flask. The second raw material can be generated by maintaining a solution in which Ci is dissolved at a predetermined concentration (e.g., 10 mol%) using 50 ml of THF as a solvent at a predetermined temperature (e.g., -2°C to 0°C). The second raw material containing Ci may be referred to as the Ci solution.

[0146] According to the implementation method, TEA-Cl salt can be generated by dropping the Ci solution into the flask.

[0147] According to the implementation method, the Ci solution is introduced into the intermediate target material (M) x H y HE z After stirring in a flask at room temperature or low temperature for 3 to 4 hours, the intermediate target material (M) is obtained. x H y HE z ) and Ci solution can react.

[0148] According to the implementation method, in step 680, as an intermediate target material (M) x H y HE z The result of the reaction between ) and Ci solution can yield the final target material (M) x H y Ci z ).

[0149] According to the implementation method, the intermediate target material (M) can be removed by vacuum filtration. x H y HE z The TEA-Cl salt produced by the reaction of Ci solution.

[0150] According to the embodiments, the viscosity of the solution obtained by vacuum filtration can be adjusted. For example, a rotary evaporator can remove at least a portion of the THF solvent.

[0151] According to the implementation method, the final target material (M) x H y Ci z It can precipitate by reacting with methanol added dropwise to a viscosity-adjusted solution. The final target material (M) x H y Ci z The final target material (M) can be obtained by filtering the precipitate and drying it under reduced pressure at room temperature. For example, if the precipitate undergoes yellowing due to Ci, the final target material can be obtained as follows: x H y Ci z Dissolve in a solvent such as chloroform or THF and wash and / or precipitate repeatedly.

[0152] According to the implementation method, it includes the final target material (M) x H y Ci z In the text, M, H, or Ci can be interpreted as MMA, HMA, or cinnamoyl (Ci), respectively, and the numbers indicated by subscripts can be understood as the composition ratios of the constituent materials. x can be 74 to 75. y can be 24 to 25. z can be 2.

[0153] Figure 7 The bonding structures of self-healing polymers 710, 710-1, and 730 according to embodiments are shown. (a) shows the bonding structures of polymers 710 and 710-1 before crosslinking, and (b) can be understood as showing the bonding structure of polymer 730 after crosslinking. The polymers in (a) before crosslinking are referred to as "first polymer 710" and "second polymer 710-1", respectively, and the polymer in (b) after crosslinking is referred to as "crosslinked polymer 730".

[0154] Reference Figure 7 The first polymer 710 and the second polymer 710-1 can each be free of molecular formula M x H y Ci z In other words, the first polymer 710 and the second polymer 710-1 can be understood as copolymers synthesized from multiple monomers. Here, M can be understood as MMA, H as HMA, Ci as cinnamoyl, and x, y, and z can be understood as composition ratios. x can be 74 to 75. y can be 24 to 25. z can be 2.

[0155] According to an embodiment, the first polymer 710 and the second polymer 710-1 can be realized as amorphous polymers. By realizing the first polymer 710 and the second polymer 710-1 as amorphous polymers, a high level of optical transparency can be provided. Compared with PET, the first polymer 710 and the second polymer 710-1 can provide approximately 88% transmittance.

[0156] According to an embodiment, the first polymer 710 and the second polymer 710-1 can form hydrogen bonds. The oxygen atoms (O) included in the first polymer 710 and the second polymer 710-1 can form hydrogen bonds with hydrogen, thereby forming relatively strong dynamic bonds.

[0157] According to an embodiment, the first polymer 710 and the second polymer 710-1 can form relatively weak dynamic bonds by forming van der Waals bonds. The photobonded derivative can be formed by bonding between cinnamonyl groups (Ci) included in the first polymer 710 and the second polymer 710-1. To enable the first polymer 710 and the second polymer 710-1 to form the photobonded derivative, electromagnetic waves (e.g., ultraviolet light) having a predetermined energy level can be radiated. Due to the photobonded derivative, the self-healing polymer can possess shape memory properties.

[0158] According to an embodiment, in (b), the first polymer 710 and the second polymer 710-1 can form a crosslinked polymer 730. A first cinnamoyl group 713 included in the first polymer 710 and a second cinnamoyl group 713-1 included in the second polymer 710-1 can be crosslinked to form the crosslinked polymer 730. Specifically, the double bond 713a included in the first cinnamoyl group 713 and the double bond 713a-1 included in the second cinnamoyl group 713-1 can be crosslinked.

[0159] According to embodiments, the crosslinked polymer 730 may have self-healing properties and / or shape memory properties. Optimal rigidity and self-healing properties can be provided by the composition ratio of MMA and HMA included in the crosslinked polymer 730, and shape memory properties can be provided by Ci included in the crosslinked polymer.

[0160] Figure 8 The following describes the use of self-healing polymers (e.g., according to embodiments) Figure 7 Protective layers made from self-healing polymers 710, 710-1 (e.g., Figure 3 Protective layer 310 or Figure 4 The deformation 820 and corresponding recovery 840 process of the protective layer 410).

[0161] refer to Figure 8 The diagram illustrates the process in which a protective layer 310 made of a self-healing polymer is deformed 820 and restored 840 by compressive or tensile stress. The state of the protective layer 310 in (a) is referred to as the first state 810, the state of the protective layer 310 in (b) is referred to as the second state 820, or the state of the protective layer 310 in (c) is referred to as the third state. The second state may be the state in which the protective layer 310 of the first state 810 is changed by deformation 820. The third state may be the state in which the protective layer of the second state 830 is changed by restoration 840.

[0162] According to an embodiment, the protective layer 310 in the first state 810 may undergo deformation 820 during the process of repeatedly folding and unfolding the display (e.g., the flexible display 260 of FIG. 2). This can lead to problems such as reduced transparency or damaged appearance of the display 260.

[0163] According to the embodiment, due to the self-healing properties and shape memory properties of the self-healing polymer, the protective layer 310 in the second state 830 may have the property of returning to the state corresponding to the first state 810. Therefore, the protective layer 310 in the second state 830 can be restored 840 to the third state 850 corresponding to the first state 810.

[0164] According to the implementation, the third state 850 can provide 90% or more of the recovery effect compared to the first state 810.

[0165] According to the embodiments, the protective layer 310 can provide higher and faster recovery characteristics under predetermined temperature conditions. For example, compared to room temperature, the protective layer 310 can have a shorter recovery time to its pre-deformation state and / or recovery time under high temperature conditions (e.g., above 75°C).

[0166] According to the embodiments, the recovery characteristics of the protective layer 310 made of the self-healing polymer can be identified through experimental examples. Table 1 below shows the recovery characteristics according to the materials constituting the protective layer 310.

[0167] [Table 1]

[0168]

[0169] Referring to Table 1, it shows the composition of PET(a), PU(b), and M respectively. 75 H 25 HE2(c), M 75 H 25 Ci2#1(d) and M 75 H 25 The degree of recovery of the protective layer 310 composed of Ci2#2(e) after damage. Here, depending on whether photocrosslinking is formed by ultraviolet irradiation, M 75 H 25 Ci2#1(d) and M 75 H 25 Ci2#2(e) can be understood as M without photocrosslinking. 75 H 25 Ci2#1(d) and M with photocrosslinking 75 H 25 Ci2#2(e).

[0170] According to the embodiment, the damage to the protective layer 310 is shown as the recovery rate after a 10 μm thick damage is caused to the protective layer 310, which has a predetermined thickness and a predetermined area (3 cm × 3 cm), by a pioneer (pioneering machine), through a physical recovery process at a temperature of 75°C. Here, the physical recovery process can be understood as rubbing the protective layer 310 to enhance the intermolecular bonding fluidity to promote self-healing properties.

[0171] According to the implementation method, it can be identified that PET(a) shows a recovery rate of 2.2%, while PU(b) is permanently damaged and does not recover after the damage. It can be identified that M... 75 H 25 HE2(c) shows a recovery rate of 75%.

[0172] According to the implementation method, it can be identified that, depending on whether photocrosslinking occurs, M 75 H 25 Ci2#1(d) and M 75 H 25 Ci2#2(e) shows recovery rates of 88.2% and 90.9%. Therefore, higher recovery properties can be provided depending on whether crosslinking of the cinnamic yl group occurs.

[0173] Figure 9A This illustrates an electronic device 900 according to an embodiment (e.g., Figure 1 A diagram showing the unfolded state of the electronic device 101.

[0174] Figure 9B This is a diagram showing the folded state of the electronic device 900 according to an embodiment.

[0175] Reference Figure 9A and Figure 9B In an embodiment, the electronic device 900 may include a foldable housing 910, a hinged cover 913 covering a foldable portion of the foldable housing 910, and a flexible or foldable display 921 disposed within the space formed by the foldable housing 910. In this disclosure, the surface on which the display 921 is disposed is defined as a first surface or front surface of the electronic device 900. The surface opposite the front surface is defined as a second surface or rear surface of the electronic device 900. The surface surrounding the space between the front and rear surfaces is defined as a third surface or side surface of the electronic device 900.

[0176] According to an embodiment, the foldable housing 910 may include a first housing structure 911, a second housing structure 912 including a sensor region 9122, a first rear cover 914, and a second rear cover 915. The foldable housing 910 of the electronic device 900 is not limited to... Figure 9A and Figure 9BThe shapes and connections shown are not identical, but can be achieved in other shapes or through combinations and / or connections of other components. For example, in another embodiment, the first housing structure 911 and the first rear cover 914 may be integrally formed with each other, and the second housing structure 912 and the second rear cover 915 may be integrally formed with each other.

[0177] In one embodiment, the first housing structure 911 and the second housing structure 912 may be located on opposite sides of the folding axis (axis A), and they may be generally symmetrical in shape with respect to the folding axis A. As described below, depending on whether the electronic device 900 is in an unfolded state, a folded state, or an intermediate state, the first housing structure 911 and the second housing structure 912 may have different angles or distances formed therebetween. In one embodiment, the first housing structure 911 and the second housing structure 912 may be symmetrical in shape, except that the second housing structure 520 further includes a sensor region 9122 in which various sensors are arranged, which is different from the first housing structure 510. In another embodiment, the sensor region 9122 may be additionally provided in at least a portion of the first housing structure 911 or the second housing structure 912, or may be replaced by at least a portion of the first housing structure 911 or the second housing structure 912.

[0178] In one embodiment, the electronic device 900 can be operated in an inward folding and / or outward folding manner by rotating the first housing structure 911 relative to the second housing structure 912 within a range of 0 to 360 degrees via a hinge structure (not shown). According to various embodiments, when viewed from above, the hinge structure can be formed in a vertical or horizontal direction. According to various embodiments, multiple hinge structures may be present. For example, multiple hinge structures may all be arranged in the same direction. As another example, some of the multiple hinge structures may be arranged and folded in different directions.

[0179] According to the implementation method, such as Figure 9A As shown, the first housing structure 911 and the second housing structure 912 can together form a recess to accommodate the display 921. In an embodiment, due to the sensor region 9122, the recess can have two or more different widths in a direction perpendicular to the folding axis A.

[0180] For example, the recess may have (a) a first width w1 between a first portion 911a of the first housing structure 911 parallel to the folding axis A and a first portion 912a formed at the edge of the sensor region 9122 of the second housing structure 912, and (b) a second width w2 formed by a second portion 911b of the first housing structure 911 and a second portion 912b of the second housing structure 912 parallel to the folding axis A and not corresponding to the sensor region 9122. In this case, the second width w2 may be longer than the first width w1. In other words, the first portion 911a of the first housing structure 911 and the first portion 912a of the second housing structure 912, which are asymmetrical in shape, may form the first width w1 of the recess, and the second portion 912b of the first housing structure 911 and the second portion 912b of the second housing structure 912, which are symmetrical in shape, may form the second width w2 of the recess. In an embodiment, the first portion 912a and the second portion 912b of the second housing structure 912 may be at different distances from the folding axis A. The width of the recess is not limited to this. According to various embodiments, the recess may have multiple widths due to the shape of the sensor region 9122 or the asymmetrical portions of the first housing structure 911 and the second housing structure 912.

[0181] In an embodiment, the first housing structure 911 and the second housing structure 912 may be formed at least partially from a metallic or non-metallic material having rigidity selected to support the display 921.

[0182] In one embodiment, the sensor region 9122 may be formed adjacent to a corner of the second housing structure 912 and have a predetermined area. However, the placement, shape, or size of the sensor region 9122 is not limited to those shown. For example, in another embodiment, the sensor region 9122 may be provided in different corners of the second housing structure 912 or in any region between the top and bottom corners. In one embodiment, components embedded in the electronic device 900 for performing various functions may be exposed to the front surface of the electronic device 900 through the sensor region 9122 or through one or more openings in the sensor region 9122. In various embodiments, the components may include various sensors. The sensors may include at least one of, for example, a proximity sensor, an illumination sensor, an iris recognition sensor, an ultrasonic sensor, and an indicator.

[0183] In one embodiment, a first rear cover 914 may be disposed on one side of the folding axis on the rear surface of the electronic device and has a substantially rectangular outer periphery that can be surrounded by a first housing structure 911. Similarly, a second rear cover 915 may be disposed on the opposite side of the folding axis on the rear surface of the electronic device and its outer periphery may be surrounded by a second housing structure 912.

[0184] In one embodiment, the first rear cover 914 and the second rear cover 915 may be substantially symmetrical in shape with respect to the folding axis (axis A). However, the first rear cover 914 and the second rear cover 915 need not be symmetrical in shape. In another embodiment, the electronic device 900 may include a first rear cover 914 and a second rear cover 915 of various shapes. In another embodiment, the first rear cover 914 may be integrally formed with the first housing structure 911, and the second rear cover 915 may be integrally formed with the second housing structure 912.

[0185] In one embodiment, the combined structure of the first rear cover 914, the second rear cover 915, the first housing structure 911, and the second housing structure 912 can form a space in which various components of the electronic device 900 (e.g., printed circuit boards or batteries) can be disposed. According to one embodiment, one or more components may be arranged on or visually exposed / through the rear surface of the electronic device 900. For example, at least a portion of the sub-display 9215 may be visually exposed through the first rear surface region 9141 of the first rear cover 914. In another embodiment, one or more components or sensors may be visually exposed through the second rear surface region 9151 of the second rear cover 915. According to various embodiments, the sensors may include proximity sensors and / or a rear camera.

[0186] Reference Figure 9B The hinged cover 913 may be disposed between the first housing structure 911 and the second housing structure 912 to conceal internal components (e.g., the hinge structure). Depending on the state of the electronic device 900 (e.g., unfolded or folded), the hinged cover 913 may be concealed by a portion of the first housing structure 911 and the second housing structure 912 or exposed to the outside.

[0187] For example, such as Figure 9A As shown, in the unfolded state of the electronic device 900, the hinged cover 913 can be hidden by the first housing structure 911 and the second housing structure 912 and is therefore not exposed. For example, as Figure 9B As shown, in the folded state (e.g., fully folded state) of the electronic device 900, the hinge cover 913 may be exposed to the outside between the first housing structure 911 and the second housing structure 912. As an example, in an intermediate state where the first housing structure 911 and the second housing structure 912 are folded at an angle, the hinge cover 913 may be partially exposed to the outside between the first housing structure 911 and the second housing structure 912. However, in this case, the exposed area may be smaller than the exposed area in the fully folded state. In an embodiment, the hinge cover 913 may include a curved surface.

[0188] The display 921 may be disposed in the space formed by the foldable housing 910. For example, the display 921 may be disposed in a recess formed by the foldable housing 910 and may occupy most of the front surface of the electronic device 900.

[0189] Therefore, the front surface of the electronic device 900 may include a display 921 and a portion of a first housing structure 911 and a portion of a second housing structure 912 adjacent to the display 921. The rear surface of the electronic device 900 may include a first rear cover 914, a portion of the first housing structure 911 adjacent to the first rear cover 914, a second rear cover 915, and a portion of the second housing structure 912 adjacent to the second rear cover 915.

[0190] Display 921 may mean that at least a portion thereof can be transformed into a flat or curved display. According to an embodiment, display 921 may include a folding region 9211, and a location on one side of the folding region 9211 (e.g., Figure 9A The first region 9212 on the left side of the folded region 9211, and the region on the opposite side of the folded region 9211 (e.g., Figure 9A The second region 9213 is located on the right side of the folded region 9211.

[0191] like Figure 9A The segmentation of display 921 shown is merely an example, and depending on the structure or function of display 200, display 921 may be divided into multiple (e.g., four or more, or two) areas. For example, in Figure 9A In the embodiments shown, the display 921 can be divided into multiple regions by a folding axis (axis A) extending parallel to the y-axis or by a folding region 9211, or the display 921 can be divided into multiple regions relative to another folding region (e.g., a folding region parallel to the x-axis) or another folding axis (e.g., a folding axis parallel to the x-axis).

[0192] The first region 9212 and the second region 9213 may be generally symmetrical in shape with respect to the folded region 9211. However, unlike the first region 9212, depending on the presence of the sensor region 9122, the second region 9213 may include a notch, but the remaining portion may be symmetrical in shape with the first region 9212. In other words, the first region 9212 and the second region 9213 may include symmetrical and asymmetrical portions.

[0193] The operation of the first housing structure 911 and the second housing structure 912, as well as the various areas of the display 921, depends on the state of the electronic device 900 (e.g., unfolded state (flat state) and folded state).

[0194] According to the embodiment, when the electronic device 900 is in an unfolded state (flat state) (for example, Figure 9A In this case, the first housing structure 911 and the second housing structure 912 may be at a 180-degree angle between them and face the same direction. The surfaces of the first region 9212 and the second region 9213 of the display 921 may be at a 180-degree angle between them and face the same direction (e.g., the front of the front surface of the electronic device). The folding region 9211 may be coplanar with the first region 9212 and the second region 9213.

[0195] According to the embodiment, when the electronic device 900 is in a folded state (e.g., Figure 9B In the case of a first housing structure 911 and a second housing structure 912, the first housing structure 911 and the second housing structure 912 may be configured to face each other. The surfaces of the first region 9212 and the second region 9213 of the display 921 may form an angle of small angle (e.g., ranging from 0 degrees to 10 degrees) while facing each other. At least a portion of the folded region 9211 may be formed as a bend with a predetermined curvature.

[0196] According to the embodiment, when the electronic device 900 is in an intermediate state (folded state) (for example, ...), Figure 9B In the case of a folded display 921, the first housing structure 911 and the second housing structure 912 can be positioned at a certain angle therebetween. The surfaces of the first region 9212 and the second region 9213 of the display 921 can form an angle greater than that in the folded state and less than that in the unfolded state. The folded region 9211 can have at least partially a curved surface with a predetermined curvature, and in this case, the curvature can be less than that in its folded state.

[0197] Figure 9C This is an exploded perspective view showing an electronic device according to an embodiment.

[0198] Reference Figure 9C According to an embodiment, the electronic device 900 may include a display unit 920, a bracket assembly 930, a circuit board unit 940, a first housing structure 911, a second housing structure 912, a first rear cover 914, and a second rear cover 915. In this disclosure, the display unit 920 may be referred to as a display module or display component.

[0199] The display unit 920 may include a display 921 and one or more plates or layers 922 disposed thereon. According to an embodiment, the plate 922 may be disposed between the display 921 and the support assembly 930. The display 921 may be disposed on one surface of the plate 922 (e.g., ...). Figure 9CThe plate 922 may be formed in a shape corresponding to the display 921. For example, a portion of the plate 922 may be formed in a shape corresponding to the notch 9214 of the display 921.

[0200] The support assembly 930 may include a first support 931, a second support 932, a hinge structure (not shown) disposed between the first support 931 and the second support 932, a hinge cover 913 covering the hinge structure when viewed from the outside, and a wiring member 933 (e.g., a flexible printed circuit board (FPC)) intersecting the first support 931 and the second support 932.

[0201] In one embodiment, the bracket assembly 930 may be disposed between the board 922 and the circuit board unit 940. As an example, a first bracket 931 may be disposed between a first region 9212 of the display 921 and the first circuit board 941. A second bracket 932 may be disposed between a second region 9213 of the display 921 and the second circuit board 942.

[0202] According to an embodiment, the wiring member 933 and the hinge structure may be at least partially disposed inside the bracket assembly 930. The wiring member 933 may be disposed in a direction intersecting the first bracket 931 and the second bracket 932 (e.g., the x-axis direction). The wiring member 933 may be disposed perpendicular to the folding axis (e.g., perpendicular to the folding region 9211 of the electronic device 900) of the folding region 9211 of the electronic device 900. Figure 9A In the direction of the folding axis (A or y-axis) (e.g., the x-axis direction).

[0203] As described above, the circuit board unit 940 may include a first circuit board 941 disposed on the first bracket 931 and a second circuit board 942 disposed on the second bracket 932. The first circuit board 941 and the second circuit board 942 may be disposed within the space formed by the bracket assembly 930, the first housing structure 911, the second housing structure 912, the first rear cover 914, and the second rear cover 915. Components for implementing various functions of the electronic device 900 may be mounted on the first circuit board 941 and the second circuit board 942.

[0204] The first housing structure 911 and the second housing structure 912 can be assembled together to be connected to both sides of the bracket assembly 930, wherein the display unit 920 is connected to the bracket assembly 930. As described below, the first housing structure 911 and the second housing structure 912 can slide from both sides of the bracket assembly 930 and cooperate with the bracket assembly 930.

[0205] According to an embodiment, the first housing structure 911 may include a first rotary support surface 9111, and the second housing structure 912 may include a second rotary support surface 9121 corresponding to the first rotary support surface 9111. The first rotary support surface 9111 and the second rotary support surface 9121 may include curved surfaces corresponding to the curved surfaces included in the hinged cover 913.

[0206] According to an embodiment, in electronic device 900 (e.g., Figure 9A In the deployed state of the electronic device 900, the first rotary support surface 9111 and the second rotary support surface 9121 can cover the hinge cover 913, allowing the hinge cover 913 to be minimally exposed to or not exposed to the rear surface of the electronic device 900. In the electronic device 900 (e.g., Figure 9B In the folded state of the electronic device 900, the first rotating support surface 9111 and the second rotating support surface 9121 can rotate along the curved surface included in the hinge cover 913, allowing the hinge cover 913 to be exposed to the rear surface of the electronic device 900 to the greatest extent.

[0207] According to an embodiment, the electronic device 900 may have a flexible display 920 that can be folded or unfolded via a hinged cover 913. Therefore, damage may occur in the folded area 9211 due to tensile and compressive stresses. Therefore, the flexible display 920 may include a protective layer (e.g., ...) on one surface exposed to the outside. Figure 4 Protective layer 310 or Figure 5 Protective layer 410).

[0208] According to an embodiment, by including protective layers 310, 410 in the flexible display 920, recovery characteristics can be provided via reversible self-healing and / or shape memory in response to damage such as wrinkles or scratches caused by deformation.

[0209] Figure 10A This is a diagram showing the extended state of the electronic device according to an embodiment.

[0210] Figure 10B This is a diagram showing the retracted state of the electronic device according to an embodiment.

[0211] Reference Figure 10A and Figure 10B The electronic device 1000 may include a housing 1010 (e.g., a first housing or a base housing) and a sliding structure 1060 (e.g., a second housing or a sliding housing) which is at least partially movably coupled to the housing 1010 and supports at least a portion of the flexible display 1030.

[0212] According to an embodiment, the sliding structure 1060 may include a flexible member (not shown) (e.g., a multi-joint hinge or a multi-bar (multi-rod) assembly) connected to one end and supporting at least a portion of the flexible display 1030. When the sliding structure 1060 performs a sliding operation within the housing 1010, the flexible member may retract at least partially into the interior space of the housing 1010 while supporting the flexible display 1030.

[0213] According to an embodiment, the electronic device 1000 may include a side member 1040, the side member 1040 including a front surface 1010a facing a first direction (e.g., the +z axis direction), a rear surface 1010b facing a second direction opposite to the first direction (e.g., the -z axis direction), and a side surface 1010c surrounding the space between the front surface 1010a and the rear surface 1010b and at least partially exposed to the outside.

[0214] According to one embodiment, the rear surface 1010b may be formed by a rear cover 1021 attached to the housing 1010. According to another embodiment, the rear cover 1021 may be formed of a polymer, coated or colored glass, ceramic, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of these materials. In another embodiment, the rear cover 1021 may be integrally formed with the housing 1010.

[0215] According to an embodiment, at least a portion of the side surface 1010c may be configured to be exposed to the outside through the housing 1010.

[0216] According to an embodiment, the side member 1040 may include a first side surface 1041 having a first length, a second side surface 1042 extending from the first side surface 1041 in a vertical direction to have a second length longer than the first length, a third side surface 1043 extending from the second side surface 1042 parallel to the first side surface 1041 and having a first length, and a fourth side surface 1044 extending from the third side surface 1043 parallel to the second side surface 1042 and having a second length.

[0217] According to the embodiment, the sliding structure 1060 can support the flexible display 1030 and expand the display area of ​​the flexible display 1030 by sliding out from the second side surface 1042 toward the fourth side surface 1044 (e.g., in the +x axis direction), or reduce the display area of ​​the flexible display 1030 by sliding in from the fourth side surface 1044 toward the second side surface 1042 (e.g., in the -x axis direction).

[0218] According to an embodiment, the electronic device 1000 may include a first side cover 1040a and a second side cover 1040b for covering a first side surface 1041 and a third side surface 1043.

[0219] According to an embodiment, the first side surface 1041 and the third side surface 1043 may be configured not to be exposed to the outside through the first side cover 1040a and the second side cover 1040b.

[0220] According to an embodiment, the electronic device 1000 may include a flexible display 1030 and is configured to receive support from a sliding structure 1060.

[0221] According to an embodiment, the flexible display 1030 may include a first portion 1030a (e.g., a flat portion) supported by a sliding structure 1060 and a second portion 1030b (e.g., a curved portion or a flexible portion) extending from the first portion 1030a and supported at least partially by a flexible member.

[0222] According to an embodiment, at least a portion of the second portion 1030b is retractable into the interior space of the housing 1010 and is configured not to be exposed to the outside in the retracted state of the electronic device 1000 (e.g., where at least a portion of the sliding structure 1060 is retracted into the housing 1010). Furthermore, at least a portion of the second portion 1030b is at least partially exposed to the outside to extend from the first portion 1030a, while receiving support from at least a portion of the flexible member in the extended state of the electronic device 1000 (e.g., where at least a portion of the sliding structure 1060 extends from the housing 1010). Therefore, the electronic device 1000 may include a rollable or slidable electronic device, wherein the display area of ​​the flexible display 1030 changes according to the movement of the sliding structure 1060 from the housing 1010.

[0223] According to an embodiment, the slide structure 1060 can be slidably connected to retract or extend at least partially from the housing 1010. For example, the flexible display 1030 can be configured to have a display area corresponding to a first width W1 from the second side surface 1042 to the fourth side surface 1044 in the retracted state.

[0224] According to an embodiment, the flexible display 1030 can be deformed to have a display area corresponding to a third width w3 that is greater than the first width w1 by additionally moving at least a portion of the bendable member retracted inside the housing 1010 to the outside of the electronic device to have a second width w2 in the extended state of the sliding structure 1060. Therefore, the display area of ​​the flexible display 1030 can be variable according to the sliding operation of the sliding structure 1060, corresponding to the variable width of the electronic device.

[0225] According to an embodiment, the electronic device 1000 may include at least one of the following: an input device 1003, audio output devices 1006 and 1007, sensor modules 1004 and 1017, camera module 1005 and 1016, connector port 1008, key input device (not shown), or indicator (not shown). In an embodiment, the electronic device 600 may omit at least one of the above-mentioned components, or may additionally include other components.

[0226] According to one embodiment, the input device 1003 may include a microphone. In another embodiment, the input device 1003 may include a plurality of microphones configured to detect the direction of sound.

[0227] According to one embodiment, audio output devices 1006 and 1007 may include a speaker. Audio output devices 1006 and 1007 may include a receiver 1007 for making calls and an external speaker 1006. In another embodiment, audio output devices 1006 and 1007 may include a speaker (e.g., a piezoelectric speaker) that operates without a separate speaker hole.

[0228] According to the embodiments, sensor modules 1004 and 1017 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 1000. Sensor modules 1004 and 1017 may include, for example, a first sensor module 1004 (e.g., a proximity sensor or illuminance sensor) disposed on the front and / or a second sensor module 1017 (e.g., an HRM sensor) disposed on the rear.

[0229] According to an embodiment, the first sensor module 1004 may be disposed below the flexible display 1030 on the front surface 1010a of the electronic device 1000. The first sensor module 1004 may further include at least one of a proximity sensor, an illuminance sensor, a time-of-flight (ToF) sensor, an ultrasonic sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, or a humidity sensor.

[0230] According to an embodiment, camera devices 1005 and 1016 may include a first camera device 1005 disposed on the front surface 1010a of the electronic device 1000 and a second camera device 1016 disposed on the rear surface 1010b. According to an embodiment, the electronic device 1000 may include a flash 1018 located near the second camera device 1016. According to an embodiment, camera devices 1005 and 1016 may include one or more lenses, an image sensor, and / or an image signal processor. According to an embodiment, the first camera device 1005 may be disposed below the flexible display 1030 and configured to capture an object (subject) through a portion of the active area of ​​the flexible display 1030. According to an embodiment, the flash 1018 may include, for example, a light-emitting diode or a xenon lamp. In an embodiment, two or more lenses (wide-angle and telephoto lenses) and an image sensor may be disposed on one surface of the electronic device 1000.

[0231] According to one embodiment, the electronic device 1000 may include at least one antenna (not shown). According to another embodiment, the at least one antenna may, for example, wirelessly communicate with an external electronic device or wirelessly send / receive power required for charging. In another embodiment, the antenna may include a conventional antenna, an mmWave antenna, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna.

[0232] According to an embodiment, the electronic device 1000 can repeatedly expand and retract into a retracted state via the sliding drive unit 1060, and the flexible display 1030 is deformable. Therefore, damage can occur in the flexible display 1030 due to tensile and compressive stresses. Therefore, the flexible display 1030 may include a protective layer (e.g., on one surface exposed to the outside) on one of its surfaces. Figure 4 Protective layer 310 or Figure 5 Protective layer 410).

[0233] According to an embodiment, by including protective layers 310, 410 in the flexible display 1030, recovery characteristics can be provided through reversible self-healing and / or shape memory in response to damage such as wrinkles or scratches caused by deformation.

[0234] According to the implementation, the protective layers 310 and 410 can be applied not only to one surface of the flexible display 1030 that slides along the x-axis based on the electronic device 1000, but also to one surface of the flexible display that slides along the y-axis.

[0235] Display devices according to embodiments of the present disclosure (e.g., Figure 1 Display module 160, Figure 2 and Figure 3 Flexible display 260 Figure 4 and Figure 5The displays 300, 400, 921 (Figure 9), and 1030 (Figure 10) may include display panels 350, 450 with self-healing protective layers 310, 410 disposed on a surface exposed to the outside. The protective layers 310, 410 may be manufactured from product 730, which is composed of methyl methacrylate (MMA), hexyl methacrylate (HMA), and cinnamic acid (Ci) mixed in predetermined proportions to ensure predetermined optical transparency, predetermined rigidity, or predetermined resilience to plastic deformation.

[0236] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, the molar ratio of MMA, HMA, and Ci constituting product 730 may be from 37:12:1 to 37.5:12.5:1.

[0237] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, product 730 may be generated from an intermediate consisting of MMA, HMA, and hydroxyethyl methacrylate (HEMA) mixed in a predetermined ratio.

[0238] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, the molar ratio of MMA, HMA, and HEMA may be from 37:12:1 to 37.5:12.5:1.

[0239] In display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, product 730 may form crosslink 733a.

[0240] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, crosslinking 733a can be formed by Ci.

[0241] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, the protective layers 310 and 410 may have a thickness of 30 μm to 200 μm.

[0242] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, the protective layer 410 may include a second protective layer 4130 formed of polyethylene terephthalate (PET) material.

[0243] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, a protective layer 4110 having a predetermined thickness may be provided on the front surface of the second protective layer 4130.

[0244] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, product 730 may be coated on the front surface of the second protective layer 4130 with a predetermined thickness.

[0245] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, the predetermined thickness may be from 1 μm to 50 μm.

[0246] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, the predetermined resilience of the protective layers 310 and 410 can be increased under predetermined temperature conditions.

[0247] In the display devices 160, 260, 300, 400, 921, and 1030 according to embodiments of the present disclosure, the predetermined resilience of the protective layers 310 and 410 may increase in response to an external temperature rise to 60°C to 75°C.

[0248] Electronic devices according to embodiments of this disclosure (e.g., Figure 1 Electronic device 101, Figure 2 to Figure 3 Electronic devices 200 (Figure 9), 900 (Figure 10), and 1000 (Figure 10) may include first housings 210 and 911, second housings 220 and 912 foldably connected to the first housings 210 and 911 via hinge modules 240 and 913, and flexible displays 160, 260, 300, 400, 921, and 1030 supported by the first housings 210 and 911 and the second housings 220 and 912. Flexible displays 160, 260, 300, 400, 921, and 1030 may include protective layers 310 and 410 manufactured by product 730, which is composed of methyl methacrylate (MMA), hexyl methacrylate (HMA), and cinnamic acid (Ci) mixed in predetermined proportions to ensure predetermined optical transparency, predetermined rigidity, or predetermined resilience to plastic deformation.

[0249] In the electronic devices 101, 200, 900, and 1000 according to embodiments of the present disclosure, the molar ratio of MMA, HMA, and Ci constituting product 730 may be from 37:12:1 to 37.5:12.5:1.

[0250] In the electronic devices 101, 200, 900, and 1000 according to embodiments of the present disclosure, the product may be generated from an intermediate consisting of MMA, HMA, and hydroxyethyl methacrylate (HEMA) mixed in a predetermined ratio.

[0251] In the electronic devices 101, 200, 900, and 1000 according to embodiments of the present disclosure, the molar ratio of MMA, HMA, and HEMA may be from 37:12:1 to 37.5:12.5:1.

[0252] In the electronic devices 101, 200, 900, and 1000 according to embodiments of the present disclosure, product 730 can be cross-linked 733a via Ci.

[0253] In the electronic devices 101, 200, 900, and 1000 according to embodiments of the present disclosure, the protective layers 310 and 410 may have a thickness of 30 μm to 200 μm.

[0254] In electronic devices 101, 200, 900, 1000 according to embodiments of the present disclosure, protective layer 410 may include a second protective layer 4130 formed of polyethylene terephthalate (PET) material.

[0255] In the electronic devices 101, 200, 900, and 1000 according to embodiments of the present disclosure, a protective layer 4110 having a predetermined thickness may be laminated on the front surface of the second protective layer 4130.

[0256] In the electronic devices 101, 200, 900, and 1000 according to embodiments of the present disclosure, product 730 may be coated on the front surface of the second protective layer 4130 with a predetermined thickness.

[0257] In the electronic devices 101, 200, 900, and 1000 according to embodiments of this disclosure, the predetermined thickness may be from 1 μm to 50 μm.

[0258] The electronic device according to various embodiments of this disclosure can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0259] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions for the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of a noun corresponding to an item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items listed together with the corresponding phrase in the phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0260] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an implementation, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0261] Various implementations as set forth herein may be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) may invoke and execute at least one of the one or more instructions stored in the storage medium, with or without one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0262] According to various implementations, methods according to this disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0263] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. Some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. A display device (160, 260, 300, 400, 921, 1030), comprising: The display panels (350, 450) have a self-healing protective layer (310, 410) on one of their exposed surfaces. The protective layers (310, 410) are manufactured by product (730), which is composed of methyl methacrylate (MMA), hexyl methacrylate (HMA) and cinnamic acid (Ci) mixed in a predetermined proportion that can ensure predetermined optical transparency, predetermined rigidity or predetermined resilience against plastic deformation.

2. The display device (160, 260, 300, 400, 921, 1030) according to claim 1, wherein the molar ratio of the MMA, the HMA and the Ci constituting the product (730) is from 37:12:1 to 37.5:12.5:

1.

3. The display device (160, 260, 300, 400, 921, 1030) according to claim 1 or 2, wherein the product (730) is generated from an intermediate consisting of the MMA, the HMA and hydroxyethyl methacrylate (HEMA) mixed in a predetermined ratio.

4. The display device (160, 260, 300, 400, 921, 1030) according to claim 3, wherein the molar ratio of the MMA, the HMA and the HEMA is from 37:12:1 to 37.5:12.5:

1.

5. The display device (160, 260, 300, 400, 921, 1030) according to any one of claims 1 to 4, wherein the product (730) forms a crosslink (733a).

6. The display device (160, 260, 300, 400, 921, 1030) according to claim 5, wherein the crosslinking (733a) is formed by the Ci.

7. The display device (160, 260, 300, 400, 921, 1030) according to any one of claims 1 to 6, wherein the protective layer (310, 410) has a thickness of 30 μm to 200 μm.

8. The display device (160, 260, 300, 400, 921, 1030) according to any one of claims 1 to 7, wherein the protective layer (410) comprises a second protective layer (4130) formed of polyethylene terephthalate (PET) material.

9. The display device (160, 260, 300, 400, 921, 1030) according to claim 8, wherein the protective layer (4110) having a predetermined thickness is provided on the front surface of the second protective layer (4130).

10. The display device (160, 260, 300, 400, 921, 1030) according to claim 8 or 9, wherein the product (730) is coated on the front surface of the second protective layer (4130) at a predetermined thickness.

11. The display device (160, 260, 300, 400, 921, 1030) according to claim 9 or 10, wherein the predetermined thickness is from 1 μm to 50 μm.

12. The display device (160, 260, 300, 400, 921, 1030) according to any one of claims 1 to 11, wherein the predetermined resilience of the protective layer (310, 410) increases under predetermined temperature conditions.

13. The display device (160, 260, 300, 400, 921, 1030) according to any one of claims 1 to 11, wherein the predetermined resilience of the protective layer (310, 410) increases as the external temperature rises to 60°C to 75°C.

14. Electronic devices (101, 200, 900, 1000), including: First shell (210, 911); A second housing (220, 912) is foldably connected to the first housing (210, 911) via a hinge module (240, 913); and Flexible displays (160, 260, 300, 400, 921, 1030) are supported by the first housing (210, 911) and the second housing (220, 912). The flexible display (160, 260, 300, 400, 921, 1030) includes a protective layer (310, 410) manufactured by a product (730) composed of methyl methacrylate (MMA), hexyl methacrylate (HMA), and cinnamic acid (Ci) mixed in predetermined proportions to ensure predetermined optical transparency, predetermined rigidity, or predetermined resilience to plastic deformation.

15. The electronic device (101, 200, 900, 1000) according to claim 14, wherein the molar ratio of the MMA, the HMA and the Ci constituting the product (730) is from 37:12:1 to 37.5:12.5:1.

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