Thermal management system for multiple dies

Abstract

The invention relates to a thermal management system in an electronic device. Specifically, the systems described herein provide a microfluidic channel between a first die and a second die that acts as an insulating layer between the first die and the second die to prevent heat transfer between the two dies. The system described herein also provides a first inlet for a first die configured to receive a first working fluid at a first temperature; and a second inlet for a second die configured to receive a second working fluid at a second temperature to provide heterogeneous cooling for each die in the integrated chip package.

Description

Background Technology

[0001] Thermal management of integrated chips in high-performance computing devices removes a relatively large amount of heat from a small volume area. Conventional thermal management systems connect the working fluid to the integrated chip via metal heat sinks or other interface layers. Providing heterogeneous cooling for each die within the integrated chip package can improve thermal management performance. Summary of the Invention

[0002] In some embodiments, a thermal management system for an electronic device is provided. The system includes a circuit board, a first die and a second die in an integrated chip, wherein the first die and the second die are laterally adjacent to each other and connected to the circuit board. The system also includes a microfluidic channel located between the first die and the second die, wherein the microfluidic channel acts as an insulating layer.

[0003] In other embodiments, a thermal management system for an electronic device is provided. The system includes a circuit board, a first die, and a second die, wherein the first die and the second die are laterally adjacent to each other and connected to the circuit board. The system also includes a side channel located between the first die and the second die, wherein the side channel acts as an insulating layer. The system further includes one or more thermal elements located on top of the first die and the second die.

[0004] In other embodiments, a thermal management system for an electronic device is provided. The system includes a circuit board, a first die, and a second die, wherein the first die and the second die are laterally adjacent to each other and connected to the circuit board. The system further includes: a first inlet for the first die, configured to receive a first working fluid at a first temperature; and a second inlet for the second die, configured to receive a second working fluid at a second temperature, wherein the first temperature and the second temperature are different.

[0005] This synopsis is provided to introduce concepts that will also be described in the following detailed description. This synopsis is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help limit the scope of the claimed subject matter.

[0006] Additional features and advantages of embodiments of this disclosure will be set forth in the following description, and some features and advantages will be apparent from the description or may be learned by practice of such embodiments. Features and advantages of such embodiments may be implemented and obtained by means and combinations particularly pointed out in the appended claims. These and other features of this disclosure will become more apparent from the following description and appended claims, or may be learned by practice of the embodiments described below. Attached Figure Description

[0007] To describe how the foregoing and other features of this disclosure can be obtained, a more specific description will be provided by referring to the specific implementations shown in the accompanying drawings. For better understanding, the same elements are designated with the same reference numerals throughout all the drawings. While some of the drawings may be schematic or exaggerated representations of concepts, at least some of the drawings are drawn to scale. Given that the drawings depict some example implementations, these implementations will be described and explained with additional features and details using the drawings, in which:

[0008] Figure 1A and Figure 1B The illustration depicts a thermal management system located between two dies, which are laterally adjacent to each other and connected to a circuit board, according to one or more embodiments.

[0009] Figure 2 The illustration shows a cross-sectional side view of a thermal management system located between two dies, which are laterally adjacent to each other and connected to a circuit board, according to one or more embodiments.

[0010] Figure 3A and Figure 3B The illustration shows a thermal management system for an electronic device according to one or more embodiments, the thermal management system having two dies, a side channel located between the two dies, and one or more thermal elements located on top of the two dies.

[0011] Figure 4A and Figure 4B The illustration shows a thermal management system for an electronic device according to one or more embodiments, the thermal management system having two dies, a side channel located between the two dies, and one or more thermal elements located on top of the two dies.

[0012] Figure 5A The illustration shows a cross-sectional side view of two dies (which are laterally adjacent to each other and connected to a circuit board) and a side channel (which acts as an insulating layer) located between the two dies, according to one or more embodiments.

[0013] Figure 5B The illustration shows a cross-sectional top view of one or more thermal elements located on top of a first die and a second die according to one or more embodiments.

[0014] Figure 6A The illustration shows a cross-sectional side view of two dies according to one or more embodiments, the dies being laterally adjacent to each other and configured to receive separate working fluids.

[0015] Figure 6BThe illustration shows a cross-sectional top view of one or more thermal elements located on top of a first die and a second die according to one or more embodiments.

[0016] Figure 7A The illustration shows a thermal management system for an electronic device according to at least one or more embodiments, the thermal management system having two separate fluid reservoirs.

[0017] Figure 7B The illustration depicts a thermal management system for an electronic device according to at least one or more embodiments, the thermal management system having a single fluid reservoir for two or more inlets and two or more outlets.

[0018] Figure 8 The illustration depicts a series of actions for preventing heat transfer between a first die and a second die according to at least one or more embodiments. Detailed Implementation

[0019] This disclosure generally relates to thermal management systems on integrated chips, including two or more laterally adjacent dies. An integrated chip comprises a combination of multiple dies, each attached to a general-purpose printed circuit board (PCB). Generally, a die is a small block of semiconductor material on which a given functional circuit is fabricated. Different dies can have different functions, such as memory, processors, etc. Each different die with different functions can generate different amounts of heat based on the power consumed and / or the die size. When dies are close to each other, a portion of the heat generated by the more powerful die can be transferred to the adjacent die. In some cases, heat transfer between two dies can reach 40% of the total heat generated by a single die. This type of heat transfer between dies is undesirable.

[0020] Traditionally, cooling is provided to the integrated chip as a whole. Each die in an integrated chip package typically includes a first thermal interface layer on top of the die, a vapor chamber package on top of the first thermal interface layer, and a second thermal interface layer on top of the vapor chamber package. Furthermore, when two dies have different vertical heights from the circuit board, the lower die is typically made to have the same vertical height as the higher die by adding another layer of thermal (or other) material (such as silicon) on top of it. When all dies are at the same level, a heat sink can be mounted on top of the entire package to cool the entire package.

[0021] The features and functionalities described in this paper offer numerous advantages and benefits compared to conventional methods and systems. For example, the system described in this paper provides features and functionalities related to cooling integrated chips. In fact, the system described in this paper provides a system for preventing heat transfer between two adjacent dies by providing a microfluidic channel between them.

[0022] In addition to limiting and / or preventing heat transfer between two adjacent dies, one or more embodiments of the systems described herein also include features involving providing individual cooling for adjacent dies in an integrated chip. For example, two different temperatures of working fluid can be provided to two adjacent dies. One potential advantage of providing different temperatures of working fluid to different dies is that higher-performance dies (those that generate more heat) can be cooled more efficiently compared to providing uniform cooling to all dies together. For example, efficiency can be improved by providing 20°C cooling to the first die and 40°C cooling to the second die.

[0023] In addition to providing individual cooling for adjacent dies, one or more embodiments of the systems described herein allow for direct cooling on the die by removing the thermal material and heat sink between the die and the heat sink, or by fabricating the heat sink directly on the die. For example, cooling can be provided directly on the surface of the die (e.g., on the silicon surface) without including an additional thermal layer on top of the die. By reducing the thermal resistance stack, higher-temperature working fluids can be used for cooling compared to conventional methods.

[0024] Figure 1A and Figure 1B A thermal management system 100 is illustrated according to one or more embodiments, located between two dies that are laterally adjacent to each other and connected to a circuit board 110. Figure 1A A cross-sectional side view of the first die 102 and the second die 104 (which are connected to the circuit board 110) is shown, and Figure 1BA cross-sectional top view of the two dies is shown. In one or more embodiments, circuit board 110 is a printed circuit board (PCB). In one or more embodiments, the first die 102 and the second die 104 may be different. For example, the first die 102 may be a high-bandwidth memory (HBM), and the second die 104 may be a central processing unit (CPU). In another example, the first die 102 may be a graphics processing unit (GPU), and the second die 104 may be a field-programmable gate array (FPGA). In one or more embodiments, the first die 102 and / or the second die 104 may be an integrated circuit containing many different components. For example, the first die 102 may be a photonic integrated circuit (PIC), and the second die 104 may be a system-on-a-chip (SoC). In one or more embodiments, one or more of the first die 102 and / or the second die 104 may be one or more of the following: a logic chip, a memory chip, an application-specific integrated circuit (ASIC), and a system-on-a-chip (SoC). In one or more embodiments, the first die 102 and the second die 104 are configured to operate at temperatures below a first junction temperature and below a second junction temperature, respectively. For example, the first die 102 may be configured to operate at 40 degrees Celsius (C), while the second die 104 may be configured to operate at 20 degrees Celsius. In one or more embodiments, the first junction temperature and the second junction temperature may be the same temperature.

[0025] like Figure 1A and Figure 1B As shown, the first die 102 and the second die 104 are laterally adjacent to each other on the circuit board 110. A microfluidic channel 106 is located between the first die 102 and the second die 104, wherein the microfluidic channel 106 acts as an insulating layer. For example, when the first die 102 generates 50 W per cm... 2 The heat flux and the second bare sheet 104 produced 800 W per cm 2When the heat flow rate is low, the higher heat generated by the second die 104 will not be transferred to the lower heated die (first die 102) because the microfluidic channel 106 acts as an insulating layer between the first die 102 and the second die 104. In one or more embodiments, the microfluidic channel width 124 is between 10 micrometers and 25 micrometers. In one or more embodiments, the system includes more than one microfluidic channel 106 between the first die 102 and the second die 104. For example, there may be two adjacent channels between the first die 102 and the second die 104. In another example, there may be three or more adjacent channels between the first die 102 and the second die 104. In one or more embodiments, the microfluidic channel 106 is configured to deliver a working fluid. In one or more embodiments, the working fluid is a liquid working fluid. For example, deionized water, aqueous ethylene glycol solution, dielectric fluid (such as fluorocarbons), other working fluids, or combinations thereof. In one or more embodiments, the working fluid is a gaseous working fluid (e.g., helium and carbon dioxide). In one or more embodiments, the working fluid is substantially a single-phase working fluid. For example, throughout the operation of the thermal management system 100, the single-phase working fluid remains in a single physical phase (e.g., liquid). In one or more embodiments, the working fluid is a two-phase working fluid. For example, the two-phase working fluid transitions between physical phases (e.g., liquid to gas, gas to liquid) because heat is received or dissipated from the working fluid during the presence of the thermal management system 100.

[0026] In one or more embodiments, the top of the microfluidic channel is covered by a manifold 108. For example, the manifold 108 can provide a closed volume for the microfluidic channel 106, and the manifold 108 can provide an inlet 212 and an outlet 214 for working fluid to flow into and out of the microfluidic channel 206, as further combined. Figure 2 As discussed. In one or more embodiments, inlet 112 and / or outlet 114 are provided via the side of manifold 108, as Figure 1B As can be shown optionally. In one or more embodiments, inlet 212 and outlet 214 are provided through the top of manifold 208, as further combined Figure 2 As discussed. In one or more embodiments, a plurality of inlets 312-1, 312-2 and / or a plurality of outlets 314-1, 314-2 are provided (e.g., in combination). Figure 3B As described.

[0027] It should be noted that even if the first nude film 102 and the second nude film 104 are in Figure 1A The text describes structures with different vertical heights 122-1 and 122-2 (e.g., thicknesses) (in...). Figure 5AAlso shown as 522-1, 522-2), in one or more embodiments, the dies may also have the same vertical height 322, 422, in which case the manifolds 308, 408 may simultaneously cover the first dies 302, 402 and the second dies 304, 404, as shown below. Figure 3A and Figure 4A As further illustrated below. In one or more embodiments, the manifold only covers the microfluidic channel and does not cover either the first die or the second die.

[0028] In one or more embodiments, the system includes a pump that delivers working fluid to the microfluidic channel 106, as further combined Figure 7A and Figure 7B As discussed. For example, a pump can supply pressurized water to microfluidic channel 106 through inlet 112.

[0029] Figure 2 The illustration shows a cross-sectional side view of a thermal management system 200 located between two dies, laterally adjacent to each other and connected to a circuit board 110, according to one or more embodiments. Figure 2 As shown, a first die 202 and a second die 204 are connected to a circuit board 210, and a microfluidic channel 206 is located between the first die 202 and the second die 204. In one or more embodiments, the first die 202 and the second die 204 have a connection with... Figure 1A and Figure 1B The first die 102 and the second die 104 described herein possess any or all of the same features and functions. Similarly, in one or more embodiments, the microfluidic channel 206 and the manifold 208 include a combination of Figure 1A and Figure 1B The functions and characteristics of the microfluidic channels 106 and manifolds 108 are described.

[0030] like Figure 2As shown, the microfluidic channel 206 may include one or more thermal elements 220 located on the surface of one or more of the first die 202 and the second die 204. In one or more embodiments, the thermal element 220 defines one or more channels on the outer surface of the first die 202, the second die 204, or a combination thereof. In one or more embodiments, the thermal element 220 includes needle-like, fin-like (e.g., long straight sections similar to standard heat sink fins), needle-fin structures (e.g., columnar structures), or combinations thereof. In one or more embodiments, the one or more thermal elements 220 are formed by removing die material from the outer surface of one of the first die 202 and the second die 204. For example, the die material may be removed by laser etching and / or ablation. In another example, the die material may be removed by chemical etching, photolithography, scraping, or a combination thereof. In one or more embodiments, the one or more thermal elements 220 are formed on the surface of one or more of the first die 202 and the second die 204 by an additive manufacturing process. For example, an additive manufacturing process can add the same material (e.g., silicon) to the outer surface of the die assembly. In another example, an additive manufacturing process can add a thermal material different from the material of the outer surface of the die assembly to the outer surface of the die. In one or more embodiments, the material is added by focusing an ion beam to deposit the material. In one or more embodiments, the material is added by selective laser melting or selective laser sintering. In one or more embodiments, the material is added by laminating the material. In one or more embodiments, the material is added by polymerization (such as photopolymerization). In one or more embodiments, the material is added by ion sputtering. In one or more embodiments, the material is extruded onto the outer surface of a first die and / or a second die or onto another surface covering the die material. In one or more embodiments, one or more portions of a thermal element are attached to the die. For example, the thermal element may be pre-formed and bonded to one or more dies.

[0031] like Figure 2 As shown, the thermal management system 200 may also include a manifold 208. For example, the manifold 208 may provide a closed volume for the microfluidic channel 206, and the manifold 208 may provide an inlet 212 and an outlet 214 for working fluid to flow into and out of the microfluidic channel 206. In one or more embodiments, the inlet 112 and / or outlet 114 are provided via the side of the manifold 108, as shown. Figure 1B As previously shown. In one or more embodiments, inlet 212 and outlet 214 are provided through the top of manifold 208, as... Figure 2 As shown.

[0032] Figure 3A and Figure 3B The illustration shows a thermal management system 300 for an electronic device according to one or more embodiments, the thermal management system having two dies (302, 304), a side channel 307 located between the two dies, and one or more thermal elements 320 located on top of the two dies. Figure 3A A cross-sectional side view is shown of a first die 302 and a second die 304 (the two dies are laterally adjacent to each other and connected to a circuit board 310) and a side channel 307 located between the first die 302 and the second die 304, wherein the side channel 307 acts as an insulating layer. Figure 3B A cross-sectional top view of one or more thermal elements 320 located on top of the first die 302 and the second die 304 is shown.

[0033] In one or more embodiments, circuit board 310 is a printed circuit board (PCB). In one or more embodiments, the first die 302 and the second die 304 have a bonding Figure 1A and Figure 1B The first die 102 and the second die 104 described herein. In one or more embodiments, the side channel 307 is a microfluidic channel, such as a combination of... Figures 1A to 1B as well as Figure 2 The microfluidic channels 106 and 206 are discussed. In one or more embodiments, the side channel 307 is an air channel. In one or more embodiments, the side channel width 324 is between 10 micrometers and 25 micrometers. In one or more embodiments, the system includes more than one side channel 307 between the first die 302 and the second die 304. For example, there may be two adjacent channels between the first die 302 and the second die 304.

[0034] exist Figure 3A In the illustrated embodiment, one or more thermal elements 320 are placed on an additional thermal layer 318, which is located on top of the first die 302, the second die 304, and the side channel 307. For example, the additional thermal layer 318 may be silicon. In one or more embodiments, the additional thermal layer 318 includes one or more thermal elements 320 located at an outer top surface 326, such as needle-like, fin-like, needle-fin-like structures, or combinations thereof. These one or more thermal elements 320 may define one or more channels 316 on the outer top surface 326 of the additional thermal layer 318. For example, the one or more channels 316 may be microfluidic channels. Figure 3B A top view of the additional thermal layer 318 is shown, one possible configuration of which includes one or more thermal elements 320 and one or more channels 316. Figure 3A and Figure 3B As shown, channel 316 is provided with inlet 312-2 and outlet 314-2 for outflow from channel 316.

[0035] like Figure 3A and Figure 3B As shown, a side channel 307 can be disposed between the first die 302 and the second die 304, wherein the side channel 307 is not connected to one or more channels 316. In one or more embodiments, an inlet 312-1 and an outlet 314-1 of the side channel 307 are provided via an additional thermal layer 318, as shown. Figure 3B As shown. In this way, the working fluid can be configured to flow into and / or through one or more channels 316 of the additional heat layer 318 without interfering with the cooling system of the side channel 307. In one or more embodiments, one or more channels 416 and the side channel 407 are interconnected, as in combination Figure 4A and Figure 4B As discussed further.

[0036] In one or more embodiments, one or more channels 316 and side channels 307 may be configured to receive working fluids in different physical phases. For example, one or more channels 316 may be configured to receive liquid working fluid, while side channels 307 may be configured to receive gaseous working fluid. In one or more embodiments, one or more channels 316 and side channels 307 are configured to receive working fluids at different temperatures. For example, one or more channels 316 may be configured to receive working fluid at 20 degrees Celsius, while side channels 307 may be configured to receive working fluid at 40 degrees Celsius. In one or more embodiments, one or more channels 316 and side channels 307 are configured to receive working fluids in the same physical phase and / or at the same temperature.

[0037] In one or more embodiments, one or more thermal elements 320 are formed by removing material from the outer top surface 326 of the additional thermal layer 318. In one or more embodiments, one or more thermal elements 320 are formed on the outer top surface 326 of the additional thermal layer 318 by an additive manufacturing process. In one or more embodiments, one or more thermal elements 520-3 are formed by removing die material from the outer surfaces of the first die and the second die, as in combination. Figure 5A and Figure 5B As discussed further. In one or more embodiments, one or more thermal elements 320 are formed on the outer top surface of the first die 302 and the second die 304 by an additive manufacturing process.

[0038] like Figure 3AAs shown, an additional heating layer 318, including one or more heating elements 320 and one or more channels 316, is topped by a manifold 308. For example, the manifold 308 can provide a closed volume for any working fluid to travel through, and wherein the manifold 308 also provides inlet 312-2 and outlet 314-2 for one or more channels 316, and inlet 312-1 and outlet 314-1 for side channels 307. Figure 3A and Figure 3B As shown, inlets 312-1, 312-2 and outlets 314-1, 314-2 are provided through the top of manifold 308. In one or more embodiments, one or more of inlets 512-2 and outlets 514-2 are provided through the side of the manifold, as in combination. Figure 5A and Figure 5B As discussed further. As... Figure 3B As shown, inlet 312-1 and outlet 314-1 are provided via manifold 308 and via additional heating layer 318. In one or more embodiments, inlet 312-1 and outlet 314-1 are provided via the side of manifold 308.

[0039] In one or more embodiments, the thermal management system has multiple inlets and / or multiple outlets. In one or more embodiments, the system also includes one or more pumps that deliver working fluid to one or more channels 316 and side channels 307, as combined Figure 7A and Figure 7B As further discussed. For example, one or more pumps may supply pressurized working fluid to one or more channels 316 through inlet 312-2 and to side channel 307 through inlet 312-1. In one or more embodiments, the system also includes one or more fans that deliver gaseous working fluid to one or more channels 316 and side channel 307.

[0040] Figure 4A and Figure 4B The illustration shows a thermal management system 400 for an electronic device according to one or more embodiments, the thermal management system having two dies (402, 404), a side channel 407 located between the two dies, and one or more thermal elements 420 located on top of the two dies. Figure 4A A cross-sectional side view is shown of a first die 402 and a second die 404 (the two dies are laterally adjacent to each other and connected to a circuit board 410) and a side channel 407 located between the first die 402 and the second die 404, wherein the side channel 407 acts as an insulating layer. Figure 4B A cross-sectional top view of one or more thermal elements 420 located on top of the first die 402, the second die 404, and the side channel 407 is shown.

[0041] In one or more embodiments, circuit board 410 is a printed circuit board (PCB). In one or more embodiments, the first die 402 and the second die 404 have a bonding Figure 1A and Figure 1B The first die 102 and the second die 104 described herein. In one or more embodiments, the side channel 407 is a microfluidic channel, such as... Figure 1A and Figure 1B The microfluidic channel 106 under discussion. In one or more embodiments, the side channel 407 is an air channel. In one or more embodiments, the side channel width 424 is between 10 micrometers and 25 micrometers. In one or more embodiments, the system includes more than one side channel 407 between the first die 402 and the second die 404. For example, there may be two adjacent channels between the first die 402 and the second die 404.

[0042] exist Figure 4A In the illustrated embodiment, one or more thermal elements 420 are placed on an additional thermal layer 418, which is located on top of the first die 402, the second die 404, and the side channel 407. For example, the additional thermal layer 418 may be silicon. In one or more embodiments, the additional thermal layer 418 includes one or more thermal elements 420 located at an outer top surface 426, such as needle-like, finned, needle-finned structures, or combinations thereof. These one or more thermal elements 420 may define one or more channels 416 on the outer top surface 426 of the additional thermal layer 418.

[0043] Figure 4B A top view of the additional thermal layer 418 is shown, one possible configuration of which includes one or more thermal elements 420 and one or more channels 416. Figure 4A and Figure 4B As shown, one or more channels 416 and side channels 407 are interconnected. A single inlet 412 is provided to the thermal system, and two outlets 414-1 and 414-2 are provided. In one or more embodiments, the one or more channels 416 and side channels 407 are microfluidic channels. In one or more embodiments, the inlet 412 is configured to provide working fluid to the one or more channels 416 and side channels 407.

[0044] In one or more embodiments, one or more thermal elements 420 are formed by removing material from the outer top surface 426 of the additional thermal layer 418. In one or more embodiments, one or more thermal elements 420 are formed on the outer top surface 426 of the additional thermal layer 418 by an additive manufacturing process. In one or more embodiments, one or more thermal elements 520-3 are formed by removing die material from the surfaces of a first die and a second die, as in combination. Figure 5A and Figure 5B As discussed further. In one or more embodiments, one or more thermal elements 420 are formed on the outer top surfaces of the first die 402 and the second die 404 by an additive manufacturing process.

[0045] like Figure 4A As shown, the top of the additional heating layer 418 (including one or more heating elements 420 and one or more channels 416) is covered by a manifold 408. For example, the manifold 408 can provide a closed volume for any working fluid to travel through, and the manifold 408 also provides inlets 412 and outlets 414-1 and 414-2 for one or more channels 416 and side channels 407. Figure 4A and Figure 4B As shown, inlet 412 and outlets 414-1 and 414-2 are provided through the top of manifold 408. In one or more embodiments, the inlet and outlet are provided through the sides of the manifold, as in combination. Figure 5A and Figure 5B As discussed further. It should be noted that even though the example here shows one inlet 412 and two outlets 414-1 and 414-2, in one or more embodiments, the thermal system may include any number of inlets and outlets.

[0046] In one or more embodiments, the system further includes one or more pumps that deliver working fluid to one or more channels 416 and side channels 407. For example, one or more pumps may supply pressurized working fluid to one or more channels 416 and side channels 407 via inlet 412. In one or more embodiments, the system further includes one or more fans that deliver gaseous working fluid to one or more channels 416 and side channels 407.

[0047] Figure 5A and Figure 5B The illustration shows a thermal management system 500 for an electronic device according to one or more embodiments, the thermal management system having: two bare plates (502, 504) with different vertical heights, a side channel 507 located between the two bare plates, and one or more thermal elements (520-2, 520-3) located on top of the two bare plates. Figure 5AA cross-sectional side view is shown of a first die 502 and a second die 504 (the two dies are laterally adjacent to each other and connected to a circuit board 510) and a side channel 507 located between the first die 502 and the second die 504, wherein the side channel 507 acts as an insulating layer. Figure 5B Cross-sectional top views of one or more thermal elements (520-2 and 520-3) located on top of the first die 502 and the second die 504 are shown respectively.

[0048] In one or more embodiments, circuit board 510 is a printed circuit board (PCB). In one or more embodiments, the first die 502 and the second die 504 have a bonding... Figure 1A and Figure 1B The first die 102 and the second die 104 described herein. In one or more embodiments, the side channel 507 is a microfluidic channel, such as a combination of... Figure 1A and Figure 1B The microfluidic channel 106 under discussion. In one or more embodiments, the side channel 507 is an air channel. In one or more embodiments, the side channel width 524 is between 10 micrometers and 25 micrometers. In one or more embodiments, the system includes more than one side channel 507 between the first die 502 and the second die 504. For example, there may be two adjacent channels between the first die 502 and the second die 504.

[0049] exist Figure 5A and Figure 5B In the illustrated embodiment, one or more thermal elements 520-2 are placed on an additional thermal layer 518, which is located on top of the first die 502. For example, the additional thermal layer 518 may be silicon. Figure 5B A top view of an additional thermal layer 518 located on top of a first bare die 502 is shown, one possible configuration of which includes one or more thermal elements 520-2 and one or more channels 516-2. In one or more embodiments, the additional thermal layer 518 includes one or more thermal elements 520-2 located on the outer top surface of the additional thermal layer 518, such as needle-like, fin-like, needle-fin-like structures or combinations thereof. These one or more thermal elements 520-2 may define one or more channels 516-2 on the outer top surface of the additional thermal layer 518. For example, the one or more channels 516-2 may be microfluidic channels.

[0050] exist Figure 5A and Figure 5BIn the illustrated embodiment, one or more thermal elements 520-3 are directly subtractively fabricated within the second die 504 without the need for an additional thermal layer 518 on top of the second die 504. These one or more thermal elements 520-3 may be needle-like, fin-like, needle-fin-like structures, or combinations thereof. In one or more embodiments, the one or more thermal elements 520-3 may define one or more channels 516-3 on the outer surface of the second die 504. For example, the one or more channels 516-3 may be microfluidic channels.

[0051] like Figure 5A and Figure 5B As shown, channel 516-2 is provided with an inlet 512-2 and an outlet 514-2 for outflow from channel 516-2. Similarly, one or more channels 516-3 are provided with an inlet 512-3 and an outlet 514-3 for outflow from one or more channels 516-3.

[0052] like Figure 5A and Figure 5B As shown, a side channel 507 may be disposed between the first die 502 and the second die 504, wherein the side channel 507 is not connected to one or more channels 516-2 and 516-3. In one or more embodiments, an inlet 512-1 and an outlet 514-1 for entering and / or exiting the side channel 507 are provided via a manifold 508-3 that covers the second die 104 and the side channel 507. In this way, the working fluid is configured to flow on one or more channels 516-2 of the additional heating layer 518 and / or without interfering with the cooling system of the side channel 507 or the cooling system of the second die 504. Similarly, the working fluid configured to flow on the side channel 507 does not interfere with the cooling system of the second die 504. In one or more embodiments, one or more channels 516-2 and the side channel 507 are interconnected. In one or more embodiments, one or more channels 516-3 and the side channel 507 are interconnected.

[0053] like Figure 5A As shown, a manifold 508 covers the top of an additional heating layer 518 comprising one or more heating elements 520-2 and one or more channels 516-2. For example, the manifold 508-2 can provide a closed volume for any working fluid to travel through, and the manifold 508-3 also provides an inlet 512-2 and an outlet 514-2 for one or more channels 516-2. Figure 5A and Figure 5BAs shown, inlet 512-2 and outlet 514-2 are provided via the side of manifold 508-2. In one or more embodiments, the inlet and outlet may be provided via the top of manifold 508-2. It should be noted that even though the example here shows one inlet 512-2 and one outlet 514-2, in one or more embodiments, the thermal system may also include any number of inlets and / or outlets into and / or out of one or more passages 516-2.

[0054] like Figure 5A Further shown, the second bare plate 504 (including one or more thermal elements 520-3 and side passage 507) is covered by manifold 508-3. In one or more embodiments, the inlet 512-1 and outlet 514-1 of the side passage 507 are provided through the top of manifold 508-3. In one or more embodiments, the inlet and outlet are provided through the side of the manifold. It should be noted that even though the example shown herein shows one inlet 512-1 and one outlet 514-1, in one or more embodiments, the thermal system may include any number of inlets and outlets into and out of the side passage 507. In one or more embodiments, the inlet 512-3 and outlet 514-3 of one or more passages 516-3 are provided through the top of manifold 508-3. In one or more embodiments, the inlet and outlet are provided through the side of manifold 508-3. It should be noted that even though the example shown herein shows one inlet 512-3 and one outlet 514-3, in one or more embodiments, the thermal system may include any number of inlets and outlets into and out of one or more passages 516-3.

[0055] In one or more embodiments, the system further includes one or more pumps that deliver working fluid to one or more channels 516-2, 516-3 and side channel 507. For example, one or more pumps may supply pressurized working fluid to one or more channels 516-2, 516-3 through inlets 512-2, 512-3. Similarly, one or more pumps may supply pressurized working fluid to side channel 507 through inlet 512-1. In one or more embodiments, the system further includes one or more fans that deliver gaseous working fluid to one or more channels 516-2, 516-3, side channel 507, or a combination thereof.

[0056] Figure 6A and Figure 6B A thermal management system 600 for an electronic device is illustrated according to at least one or more embodiments, the thermal management system having two dies (602, 604) that are laterally adjacent to each other and configured to receive separate working fluids. Figure 6AA cross-sectional side view of a first die 602 and a second die 604 (the two dies are laterally adjacent to each other and configured to receive separate working fluids) is shown. Figure 6B A cross-sectional top view of one or more thermal elements (620-2 and 620-3) located on top of the first die 602 and the second die 604 is shown.

[0057] like Figure 6A As shown, the thermal management system 600 includes a circuit board 610, a first die 602, and a second die 604, wherein the first die 602 and the second die 604 are laterally adjacent to each other and connected to the circuit board 610. In one or more embodiments, the first die 602 and the second die 604 have a bonding... Figure 1A and Figure 1B Any or all of the features and functions of the first bare film 102 and the second bare film 104 described.

[0058] The thermal management system 600 further includes: a first inlet 612-2 for a first die 602, configured to receive a first working fluid at a first temperature; and a second inlet 612-3 for a second die 604, configured to receive a second working fluid at a second temperature. In one or more embodiments, the first temperature and the second temperature are different. For example, the first working fluid may be received at 15 degrees Celsius, and the second working fluid may be received at 45 degrees Celsius.

[0059] In one or more embodiments, one or more thermal elements (620-2, 620-3) are respectively placed on top of the first die 602 and the second die 604. Figure 6A and Figure 6B In the illustrated embodiment, one or more thermal elements 620-2 are placed on an additional thermal layer 618, which is located on top of the first die 602. For example, the additional thermal layer 618 may be made of silicon. In one or more embodiments, the additional thermal layer 618 includes one or more thermal elements 620-2 located on the outer top surface of the additional thermal layer 618. The one or more thermal elements 620-2 may be needle-like, fin-like, needle-fin-like structures, or combinations thereof. These one or more thermal elements 620-2 may define one or more channels 616-2 on the outer top surface of the additional thermal layer 618. For example, the one or more channels 616-2 may be microfluidic channels.

[0060] exist Figure 6A and Figure 6BIn the illustrated embodiment, one or more thermal elements 620-3 are directly etched onto the second die 604 without the need for an additional thermal layer on top of the second die 604. These one or more thermal elements 620-3 may be needle-like, fin-like, needle-fin-like structures, or combinations thereof. In one or more embodiments, the one or more thermal elements 620-3 define one or more channels 616-3 on the outer surface of the second die 604. For example, the one or more channels 616-3 may be microfluidic channels.

[0061] like Figure 6A As shown, a manifold 608-2 covers the top of an additional thermal layer 618 comprising one or more thermal elements 620-2 and one or more channels 616-2. For example, the manifold 608-2 provides a closed volume for any working fluid to travel through, and wherein the manifold 608-2 also provides inlets 612-2 and outlets 614-2 for one or more channels 616-2. Similarly, a manifold 608-3 covers the top of a second fin 604 comprising one or more thermal elements 620-3 and one or more channels 616-3. For example, the manifold 608-3 provides a closed volume for any working fluid to travel through, and wherein the manifold 608-3 also provides multiple inlets 612-3 and multiple outlets 614-3 for one or more channels 616-3.

[0062] also, Figure 6B A top view of the first die 602 and the second die 604 is shown, one possible configuration of which includes one or more thermal elements 620-2, 620-3 and one or more channels 616-2, 616-3. Figure 6A and Figure 6B As shown, one or more channels 616-3 are provided with one or more inlets 612-3 and one or more outlets 614-3 for outflow from one or more channels 616-3.

[0063] like Figure 6A and Figure 6B As shown, one or more channels 616-2 and one or more channels 616-3 are not interconnected. In this way, the working fluid configured to flow on one or more channels 616-2 of the additional heating layer 618 will not interfere with the cooling system of the second die 604.

[0064] Figure 7A A thermal management system 700 for an electronic device is illustrated according to at least one or more embodiments, the thermal management system having two separate fluid reservoirs. Figure 7AAs shown, fluid reservoir 728-1 is connected to inlet 712-1 and outlet 714-1, while fluid reservoir 728-2 is connected to inlet 712-2 and outlet 714-2. Each system can operate with one or more of the following: liquid working fluid, gaseous working fluid, single-phase working fluid, and two-phase working fluid. Each system can also operate with the working fluid at different temperatures.

[0065] In one or more embodiments, one or more of the fluid reservoirs 728-1, 728-2 are used with any of the inlets (e.g., inlets 112, 212, 312-1, 312-2, 412, 412, 512-1, 512-2, 512-3, 612-2, 612-3) or outlets (e.g., 114, 214, 314-1, 314-2, 414-1, 414-2, 514-1, 514-2, 514-3, 614-2, 614-3) described herein. For example, inlet 712-1 or inlet 712-2 may be used with... Figure 3A The imported 312-1 and 312-2 shown are the same.

[0066] In one or more embodiments, three or more separate fluid reservoirs are connected to three or more inlets, such as Figure 5A The inlet numbers are 512-1, 512-2, and 512-3. In one or more embodiments, system 700 includes one or more pumps, one or more fans, one or more heat exchangers, or combinations thereof, such as... Figure 7B As discussed further.

[0067] Figure 7B The illustration depicts a thermal management system 750 for an electronic device according to at least one or more embodiments, the thermal management system having a single fluid reservoir for two inlets and two or more outlets. Figure 7B As shown, fluid reservoir 728-3 is connected to inlet 712-3, inlet 712-4, outlet 714-3, and outlet 714-4. System 750 also includes one or more pumps (or alternatively, a fan) 732 and one or more heat exchangers 730. One or more pumps 732 can deliver working fluid to one of the thermal management systems described in conjunction with the preceding figures. For example, pump 732 can supply pressurized water to the thermal management system through one or more inlets. Similarly, a fan can supply a pressurized airflow to the thermal management system through one or more inlets. Heat exchangers 730 can also cool or heat the working fluid received from fluid reservoir 728-3 before it is received by the thermal management system (e.g., thermal management systems 100, 200, 300, 400, 500, 600).

[0068] The thermal management system 750 can operate on one or more of liquid working fluids, gaseous working fluids, single-phase working fluids, and two-phase working fluids. In one or more embodiments, the fluid reservoir 728-3 is used with any of the inlets (e.g., inlets 112, 212, 312-1, 312-2, 412, 412, 512-1, 512-2, 512-3, 612-2, 612-3) or outlets (e.g., 114, 214, 314-1, 314-2, 414-1, 414-2, 514-1, 514-2, 514-3, 614-2, 614-3) described herein. In one or more embodiments, inlets 712-3 and 712-4 are used with... Figure 6A The imported 612-2 and 612-3 shown are the same.

[0069] In one or more embodiments, three or more inlets and / or three or more outlets are connected to the fluid reservoir 728-3, such as Figure 5A Imported 512-1, 512-2, and 512-3.

[0070] Figure 8 The illustration depicts a series of actions 800 according to at least one or more embodiments for preventing heat transfer between a first die and a second die. Although Figure 8 The illustrations depict actions according to one or more embodiments, but alternative embodiments may omit, add, rearrange, and / or modify them. Figure 8 Any of the actions shown. Figure 8 The action can be executed as part of a method. Alternatively, the system can execute... Figure 8 The action. In another embodiment, the device can perform... Figure 8 The action.

[0071] like Figure 8 As shown, a series of actions 800 may include action 850, namely receiving working fluid from the inlet. In one or more embodiments, the working fluid may be a liquid working fluid or a gaseous working fluid. In one or more embodiments, the working fluid may be cooled to a desired temperature before being delivered to the microfluidic channel.

[0072] The series of actions 800 may further include action 852, namely, allowing working fluid to flow through a microfluidic channel between the first and second dies, wherein the microfluidic channel acts as an insulating layer. In one or more embodiments, the width of the microfluidic channel is between 10 micrometers and 20 micrometers. In one or more embodiments, the top of the microfluidic channel may be covered by a manifold, wherein the manifold provides a closed volume for the microfluidic channel. In one or more embodiments, the manifold may provide inlet and outlet for the working fluid to flow into and out of the microfluidic channel.

[0073] This document describes one or more specific embodiments of the present disclosure. These described embodiments are examples of the technology currently disclosed. Additionally, to provide a concise description of these embodiments, not all features of actual embodiments are described in the specification. It should be understood that in the development of any such actual implementation (as in any engineering or design project), many embodiment-specific decisions will be made to achieve the developer's specific goals, such as complying with system-related and business-related constraints, which may vary from embodiment to embodiment. Furthermore, it should be understood that such development work can be complex and time-consuming, but nevertheless, it remains a routine task of design, fabrication, and manufacturing for those skilled in the art who benefit from this disclosure.

[0074] The articles “a,” “an,” and “the” are intended to refer to one or more of the elements present in the foregoing description. The terms “comprising,” “including,” and “having” are intended to be inclusive and indicate that there may be other elements besides those listed. Additionally, it should be understood that references to “one embodiment” or “embodiment” in this disclosure are not intended to be construed as excluding the existence of additional embodiments that also include the features mentioned. For example, any element described with respect to embodiments herein may be combined with any element of any other embodiment described herein. Numbers, percentages, ratios, or other values ​​mentioned herein are intended to include such values ​​and also include other values ​​that are “close to” or “approximate” to said values, as would be understood by one of ordinary skill in the art covered by embodiments of this disclosure. Thus, the values ​​are to be interpreted broadly enough to cover values ​​that are at least sufficiently close to said values ​​to perform the desired function or achieve the desired result. The values ​​include at least the variations expected in a suitable manufacturing or production process and may include values ​​within a range of 5%, 1%, 0.1%, or 0.01% different from said values.

[0075] In view of this disclosure, those skilled in the art will recognize that equivalent constructions do not depart from the spirit and scope of this disclosure, and various changes, substitutions, and modifications can be made to the embodiments disclosed herein without departing from the spirit and scope of this disclosure. Equivalent constructions (including the functional "means-plus-function" clause) are intended to cover structures described herein that perform the functions described, including structural equivalents operating in the same manner and equivalent structures providing the same functionality. The applicant's explicit intention is that no means-plus-function or other functional limitations are applied to any claim except for those claims in which the phrase "means for..." appears with the associated function. All additions, deletions, and modifications to the embodiments within the meaning and scope of the claims should be covered by the claims.

[0076] The terms “approximately,” “about,” and “substantially” as used herein refer to quantities that are close to the stated quantity, while still performing the desired function or achieving the desired result. For example, the terms “approximately,” “about,” and “substantially” can mean a difference from the stated quantity within 5%, less than 1%, less than 0.1%, and less than 0.01%. Furthermore, it should be understood that any direction or frame of reference in the foregoing description is only relative direction or movement. For example, any references to “up” and “down,” or “above” or “below” are merely descriptions of the relative position or movement of the relevant element.

[0077] This disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments should be considered illustrative rather than restrictive. Therefore, the scope of this disclosure is indicated by the appended claims, not by the foregoing description. Changes within the meaning and scope of the equivalents of the claims should be included within their scope.

Claims

1. A thermal management system (100) for use in electronic devices, the thermal management system comprising: Circuit board (110); A first die (102) and a second die (104) located in an integrated chip, wherein the first die (102) and the second die (104) are laterally adjacent to each other and connected to the circuit board (110); and A microfluidic channel (106) is located between the first die (102) and the second die (104), wherein the microfluidic channel (106) acts as an insulating layer.

2. The thermal management system according to claim 1, wherein the top of the microfluidic channel (106) is covered by a manifold (108).

3. The thermal management system according to claim 2, wherein the manifold (108) includes an inlet (112) and an outlet (114) to the microfluidic channel (106).

4. The thermal management system according to claim 1, wherein the microfluidic channel (106) is configured to deliver working fluid.

5. The thermal management system according to claim 4, wherein the working fluid is a liquid working fluid.

6. The thermal management system according to claim 4, wherein the working fluid is a gaseous working fluid.

7. The thermal management system of claim 1, wherein the system further comprises a pump (732) that delivers working fluid to the microfluidic channel (106).

8. The thermal management system according to claim 1, wherein the first die (102) is configured to operate at a temperature below a first junction temperature, and the second die (104) is configured to operate at a second junction temperature, wherein the first junction temperature and the second junction temperature are different.

9. The thermal management system according to claim 1, wherein the first die (102) and the second die (104) are one or more of the following: logic chip, memory chip, application-specific chip, and system-on-a-chip.

10. The thermal management system according to claim 1, wherein the microfluidic channel (106) includes a thermal element (220).

11. The thermal management system according to claim 10, wherein the thermal element (220) is located on one or more of the first die (102) and the second die (104).

12. The thermal management system according to claim 10, wherein the thermal element (220) is located on the surface of one or more of the first die (102) and the second die (104).

13. The thermal management system according to claim 10, wherein the thermal element (220) is one or more of a needle-like, fin-like, and needle-fin-like structure.

14. The thermal management system of claim 10, wherein the thermal element (220) is formed by removing sheet material from the outer surface of one or more of the first sheet (102) and the second sheet (104).

15. The thermal management system of claim 14, wherein the removal of die material from the outer surface of the first die (102) or the second die (104) is performed by one or more of laser etching and ablation.

16. The thermal management system according to claim 10, wherein the thermal element (220) is formed on the top surface of the first die (102) or the second die (104) by an additive manufacturing process.

17. A thermal management system for use in electronic devices, comprising: Circuit board (310); A first die (302) and a second die (304), wherein the first die (302) and the second die (304) are laterally adjacent to each other and are connected to the circuit board (310). A side channel (307) is located between the first die (302) and the second die (304), wherein the side channel (307) acts as an insulating layer; as well as One or more thermal elements (320) are located on top of the first die (302) and the second die (304).

18. The thermal management system of claim 17, wherein one or more thermal elements (320) are placed on an additional thermal layer (318) on top of the first die (302), the second die (304), and the side channel (307).

19. The thermal management system according to claim 17, wherein the one or more thermal elements (320) are one or more of needle-like, fin-like, and needle-fin-like structures.

20. A thermal management system for use in electronic devices, comprising: Circuit board (610); A first die (602) and a second die (604), wherein the first die (602) and the second die (604) are laterally adjacent to each other and are connected to the circuit board (610). For the first inlet (612-2) of the first die (602), the first inlet is configured to receive a first working fluid at a first temperature; as well as For the second inlet (612-3) of the second die (604), the second inlet is configured to receive a second working fluid at a second temperature, wherein the first temperature and the second temperature are different.

Images