Semiconductor glass substrate laser cutting equipment

Abstract

The invention discloses semiconductor glass substrate laser cutting equipment, and relates to the field of laser cutting, the semiconductor glass substrate laser cutting equipment comprises a table body and a laser cutting machine mounted above the table body and used for cutting a semiconductor glass substrate, and the laser cutting machine is mounted above the table body through a cutting machine control mechanism; a material carrying disc frame used for fixing a semiconductor glass substrate is arranged above the table body, clamping assemblies used for clamping the semiconductor glass substrate are arranged above the two ends of the material carrying disc frame, and a plurality of bearing assemblies are arranged in the material carrying disc frame. According to the semiconductor glass substrate cutting device, the multiple bearing assemblies are installed in the material carrying disc frame in an array mode, and each bearing assembly can generate upward supporting force on a semiconductor glass substrate, so that the internal stress of the semiconductor glass substrate in the cutting process can be effectively balanced; and the bearing assembly is matched with the clamping assembly, so that a supporting structure with the end pressed downwards for clamping and the bottom face pressed and fixed in the reverse direction can be formed, and therefore the cutting quality of the semiconductor glass substrate is improved.

Description

Technical Field

[0001] This invention relates to the field of laser cutting, and more particularly to a laser cutting device for semiconductor glass substrates. Background Technology

[0002] As is well known, in the fields of semiconductor manufacturing and microelectronic packaging, glass substrates are widely used in key areas such as advanced packaging, MEMS sensors, radio frequency devices, and display drivers due to their excellent insulation, flatness, chemical stability, and optical properties. As device size continues to shrink and integration density continues to increase, the requirements for processing precision, cutting quality, and mechanical integrity of glass substrates after processing are becoming increasingly stringent. Laser cutting technology, due to its advantages such as non-contact operation, high precision, and small heat-affected zone, has become one of the mainstream processes for precision processing of glass substrates.

[0003] However, in actual laser cutting processes, common substrate fixing methods mainly include an overall vacuum adsorption platform combined with peripheral mechanical pressure strips, or a local vacuum suction array combined with a top pressure plate. While these traditional solutions can provide basic fixation under normal circumstances, when facing the precision cutting of large-size, ultra-thin semiconductor glass substrates, existing clamping methods often focus on pressing the overall plane of the substrate or only providing simple rigid constraints on the edges. This constraint method is difficult to effectively intervene in the dynamic and non-uniformly distributed stress generated inside the substrate during the cutting process, especially under the coupling effect of laser thermal effect and mechanical vibration. Without refined bottom support, the central area of ​​the substrate is prone to the initiation and uncontrollable propagation of microcracks due to local deflection or stress concentration, directly affecting the perpendicularity and roughness of the cutting edge and the overall strength of the substrate. Moreover, the traditional vacuum adsorption or pressure plate fixing usually has a single vertical downward force direction, which is intended to prevent the substrate from moving during processing. However, this unidirectional pressing structure is consistent with the direction of the substrate's own gravity and cannot effectively balance the local thermal stress and mechanical stress introduced by laser processing. In some cases, it may even exacerbate the deformation trend of the substrate. Especially for brittle glass materials, this stress imbalance is the main cause of edge chipping, micro-cracks, and even hidden damage to the substrate in the cutting path, which seriously affects the yield and reliability of the product. Summary of the Invention

[0004] (a) Purpose of the invention In view of this, the purpose of the present invention is to provide a laser cutting device for semiconductor glass substrates. This device has several support components arranged in an array inside the material tray frame. Each support component can generate an upward supporting force on the semiconductor glass substrate, which can effectively balance the internal stress of the semiconductor glass substrate during the cutting process. Furthermore, the support components, together with the clamping components, can form a support structure with end downward clamping and bottom reverse upward pressing and fixing, thereby improving the cutting quality of the semiconductor glass substrate.

[0005] (II) Technical Solution To achieve the above-mentioned technical objectives, the present invention provides a semiconductor glass substrate laser cutting equipment, which includes a platform and a laser cutting machine installed above the platform for cutting semiconductor glass substrates. The laser cutting machine is installed above the platform through a cutting machine control mechanism, enabling the laser cutting machine to move along the X, Y, and Z axes above the platform to perform cutting operations. A material tray frame for fixing semiconductor glass substrates is provided above the platform. The material tray frame is installed on the platform through a material rack conveying mechanism, enabling the material tray frame to move along the length of the platform to the cutting area below the laser cutting machine. The material tray frame has clamping components for holding semiconductor glass substrates at both ends. The material tray frame has several support components inside, which are arranged in a rectangular array. Each support component includes a base and a lifting column installed inside the base. The top of the lifting column is provided with a ball head, and a pressure sensor is installed on the top of the ball head. The lifting column can move vertically up and down inside the base.

[0006] As a further description of the above technical solution: a pneumatic telescopic rod is installed inside the base below the lifting column, a main air pipeline is provided inside the material tray frame below the base, the pneumatic telescopic rod is connected to the main air pipeline through branch air pipelines, and each branch air pipeline is equipped with an electromagnetic control valve. A pressure controller is installed outside the material tray frame, and one end of the main air pipeline is connected to the pressure controller.

[0007] As a further description of the above technical solution: a guide rib is provided on the side of the lifting column in the vertical direction, and a guide groove adapted to the guide rib is opened on the inner wall of the base in the vertical direction, and the guide rib is slidably engaged in the guide groove.

[0008] As a further description of the above technical solution: all the bases in each column are fixedly installed inside the material tray frame by two parallel support rods.

[0009] As a further description of the above technical solution: a slag receiving device is installed on one side of the material tray frame. Insertion holes are opened at both ends of the upper surface of the material tray frame on the connecting side of the slag receiving device. Insertion parts are installed at both ends of the slag receiving device. The insertion parts are inserted into the insertion holes from top to bottom. A slag receiving groove is opened inside the slag receiving device. The internal bottom plate of the material tray frame adopts an inclined slope structure with the height gradually decreasing from the side away from the slag receiving device to the side closer to the slag receiving device in the horizontal direction. The slag receiving groove adopts a structure with an opening on the side that fits against the material tray frame, and communicates with the interior of the material tray frame through the opening structure.

[0010] As a further description of the above technical solution: the clamping assembly includes a rotating plate frame and upright plates. The rotating plate frame is arranged above the material tray frame along the width direction of the material tray frame. A clamping plate is installed below the rotating plate frame. There are two upright plates, which are symmetrically installed above both ends of the material tray frame. A rotating shaft is rotatably installed between the two upright plates. A fourth motor is installed on the outer side of one of the upright plates. The output shaft of the fourth motor is connected to one end of the rotating shaft. One side of the rotating plate frame is connected to the rotating shaft through an arc rod.

[0011] As a further description of the above technical solution: the material rack conveying mechanism includes a conveying track, a first bearing seat, and a first linkage shaft. Two conveying tracks are provided, symmetrically installed on both sides of the platform along its length. A second slide is provided at both ends of the material tray frame, and the two second slides are slidably mounted on the two conveying tracks. Two sets of first bearing seats are provided, with two in each set. The two first bearing seats in the same set are respectively installed on the outer sides of both ends of the conveying track. The first linkage shaft is perpendicular to the length of the platform, and its two ends are rotatably mounted on the two first bearing seats in the same set. A rotating shaft is rotatably mounted on the two first bearing seats in the other set. A transmission belt is wound between the rotating shaft and the two ends of the first linkage shaft. One end of the second slide is connected to the upper part of the transmission belt. A first motor for driving the first linkage shaft to rotate is installed above the platform via a bracket.

[0012] As a further description of the above technical solution: the cutting machine control mechanism includes a frame, a Z-axis control cylinder is installed on the top of the frame, the laser cutting machine is slidably mounted below the frame, and the piston rod of the Z-axis control cylinder is connected to the top of the laser cutting machine. Based on this, when the Z-axis control cylinder is running, it can push the laser cutting machine to move in the vertical direction, thereby realizing the Z-axis movement control of the laser cutting machine.

[0013] As a further description of the above technical solution: the cutting machine control mechanism also includes a first slide, which is mounted along the width direction of the platform. A third bearing is installed above both ends of the first slide, and a Y-axis transmission belt is rotatably mounted between the two third bearings. A Y-axis track is installed above the first slide along the length direction. A Y-axis slide is slidably mounted on the Y-axis transmission belt. The Y-axis slide is connected to the frame and simultaneously connected to the upper part of the Y-axis transmission belt. A third motor for driving the Y-axis transmission belt is installed above one end of the first slide.

[0014] As a further description of the above technical solution: the cutting machine control mechanism also includes an X-axis track, a second bearing seat, and a second linkage shaft. The X-axis track is symmetrically installed on both sides of the platform along the length direction of the platform. An X-axis slide is provided below both ends of the first slide, and the two X-axis slides are slidably mounted on the two X-axis tracks respectively. There are two sets of second bearing seats, two in each set. The two second bearing seats in the same set are respectively installed on the outer sides of both ends of the X-axis track. The second linkage shaft is perpendicular to the length direction of the platform. The two ends of the second linkage shaft are respectively rotatably mounted on the two second bearing seats in the same set. A rotating shaft is rotatably mounted on the two second bearing seats in the other set. An X-axis transmission belt is wound between the rotating shaft and the two ends of the second linkage shaft. One end of the X-axis slide is connected to the upper part of the X-axis transmission belt. A second motor for driving the rotation of the second linkage shaft is installed on the top of the platform through a bracket.

[0015] In the above technical solution, the present invention provides a laser cutting device for semiconductor glass substrates. In this device, the semiconductor glass substrate is mounted on a material tray for cutting. The two ends of the material tray are equipped with clamping components for fixing the edge of the semiconductor glass substrate, which can ensure the stability of the semiconductor glass substrate during the cutting process. The inside of the material tray is arranged in an array of several support components, each of which can generate an upward supporting force on the semiconductor glass substrate. This can effectively balance the internal stress of the semiconductor glass substrate during the cutting process. Furthermore, the support components and clamping components can form a support structure with end downward clamping and bottom reverse upward pressing and fixing, thereby improving the cutting quality of the semiconductor glass substrate. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0017] Figure 1 A schematic diagram of the overall structure of a semiconductor glass substrate laser cutting device provided by the present invention; Figure 2 Another structural schematic diagram of a semiconductor glass substrate laser cutting device provided by the present invention; Figure 3 This invention provides a schematic diagram of the structure of a material tray frame moving to the laser cutting area in a semiconductor glass substrate laser cutting equipment. Figure 4 A schematic diagram of the cutting machine control mechanism in a semiconductor glass substrate laser cutting equipment provided by the present invention; Figure 5 A schematic diagram of the structure of a material tray frame in a semiconductor glass substrate laser cutting equipment provided by the present invention; Figure 6 A partial cross-sectional view of a material tray frame in a semiconductor glass substrate laser cutting equipment provided by the present invention; Figure 7 A schematic diagram of a clamping component structure in a semiconductor glass substrate laser cutting equipment provided by the present invention; Figure 8 This invention provides a schematic diagram of another perspective of the clamping component in a semiconductor glass substrate laser cutting device; Figure 9 A schematic diagram of a support component structure in a semiconductor glass substrate laser cutting equipment provided by the present invention; Figure 10 This invention provides a cross-sectional view of the base in a laser cutting device for semiconductor glass substrates.

[0018] Figure Descriptions: 1. Platform; 2. Material rack conveying mechanism; 20. Conveyor belt; 21. First motor; 22. First shaft seat; 23. Conveying track; 24. First linkage shaft; 3. Cutting machine control mechanism; 300. X-axis track; 301. First slide; 302. X-axis slide; 303. X-axis conveyor belt; 304. Second shaft seat; 305. Second motor; 306. Second linkage shaft; 307. Y-axis track; 308. Y-axis slide; 309. Y-axis conveyor belt; 310. Third motor; 311. Frame; 312. Z-axis control cylinder; 313. Third shaft seat; 4. Laser cutting machine; 5. Material carrier. 50. Plate frame; 51. Second slide; 52. Clamping assembly; 53. Rotating plate frame; 54. Arc rod; 55. Rotating shaft; 56. Vertical plate; 57. Fourth motor; 58. Clamping plate; 59. Support assembly; 50. Air pressure controller; 50. Base; 51. Guide groove; 52. Lifting column; 52. Guide rib; 52. Ball head; 52. Pressure sensor; 52. Main air pipeline; 52. Support rod; 52. Branch air pipeline; 52. Pneumatic telescopic rod; 52. Electromagnetic control valve; 53. Insertion hole; 54. Slag receiving device; 55. Insertion part; 56. Slag receiving groove. Detailed Implementation

[0019] The following description is exemplary in nature and is not intended to limit the scope, application, or use of this disclosure. It should be understood that in all these figures, the same or similar reference numerals indicate the same or similar parts and features. The figures are merely schematic representations of the concept and principles of embodiments of this disclosure and do not necessarily show the specific dimensions and scale of the various embodiments of this disclosure. Certain details or structures of embodiments of this disclosure may be exaggerated in particular portions of certain figures.

[0020] like Figure 1 - Figure 10As shown: This embodiment provides a technical solution: a laser cutting device for semiconductor glass substrates, including a platform 1 and a laser cutter 4 mounted above the platform 1 for cutting semiconductor glass substrates. The laser cutter 4 is mounted above the platform 1 via a cutting machine control mechanism 3, enabling the laser cutter 4 to move along the X, Y, and Z axes above the platform 1 to perform cutting operations. A material tray frame 5 for fixing the semiconductor glass substrate is provided above the platform 1. The material tray frame 5 is mounted on the platform 1 via a material rack conveying mechanism 2, enabling the material tray frame 5 to move along the platform 1. The material tray frame 5 is moved along the length direction to the cutting area below the laser cutting machine 4; clamping components 51 for clamping semiconductor glass substrates are provided above both ends of the material tray frame 5; several support components 52 are provided inside the material tray frame 5; the several support components 52 are distributed in a rectangular array; the support component 52 includes a base 521 and a lifting column 522 installed inside and above the base 521; a ball head 523 is provided at the top of the lifting column 522; a pressure sensor 524 is installed at the top of the ball head 523; the lifting column 522 can move vertically up and down inside the base 521. Working principle: When using this device, the robotic arm first picks up the semiconductor glass substrate to be cut and places it above the material tray frame 5. At this time, the clamping components 51 at both ends of the material tray frame 5 clamp and fix the two ends of the semiconductor glass substrate. Then, the support components 52 distributed in an array inside the material tray frame 5 provide array support for the bottom of the semiconductor glass substrate. That is, the lifting column 522 in the support component 52 rises, so that the ball head 523 at the top gradually presses against the bottom of the semiconductor glass substrate. The pressure sensor 524 senses the real-time top pressure. After fixing, the material tray frame 5 is moved to the cutting area below the laser cutting machine 4 by the material rack conveying mechanism 2. Finally, the laser cutting machine 4 is moved by the cutting machine control mechanism 3 to perform laser cutting on the semiconductor glass substrate installed on the material tray frame 5. In summary: In this device, the semiconductor glass substrate is mounted on the material tray 5 for cutting. The two ends of the material tray 5 are equipped with clamping components 51 for fixing the edge of the semiconductor glass substrate, which ensures the stability of the semiconductor glass substrate during the cutting process. The material tray 5 has several support components 52 arranged in an array inside, and each support component 52 can generate an upward supporting force on the semiconductor glass substrate. This can effectively balance the internal stress of the semiconductor glass substrate during the cutting process. Furthermore, the support components 52 and the clamping components 51 can form a support structure with downward clamping at the end and reverse upward pressing and fixing at the bottom, thereby improving the cutting quality of the semiconductor glass substrate.

[0021] Specifically, such as Figure 9 - Figure 10As shown, in order to achieve the vertical movement of the lifting column 522, in this embodiment, a pneumatic telescopic rod 528 is installed inside the base 521 below the lifting column 522. A main air pipeline 525 is provided inside the material tray frame 5 below the base 521. The pneumatic telescopic rod 528 is connected to the main air pipeline 525 through branch air pipelines 527, and each branch air pipeline 527 is equipped with an electromagnetic control valve 529. A second slide 50 is installed on the outside of the material tray frame 5. One end of the main air pipeline 525 is connected to the air pressure controller 520. Based on this, when the air pressure controller 520 is running, it can control the air pressure inside each pneumatic telescopic rod 528 through the main air pipeline 525 and the branch air pipelines 527, in conjunction with the electromagnetic control valve 529, thereby controlling the lifting and lowering of the lifting column 522. This can make the top pressure of each ball head 523 on the semiconductor glass substrate balanced, thereby improving the cutting effect. It should also be noted that the base 521 adopts a frustum-shaped structure, which makes it easy for the cut impurities to fall into the interior of the material tray 5.

[0022] Specifically, such as Figure 9 As shown, in order to keep the lifting column 522 stable during lifting, in this embodiment, a guide rib 5220 is provided on the side of the lifting column 522 along the vertical direction, and a guide groove 5210 adapted to the guide rib 5220 is provided on the inner wall of the base 521 along the vertical direction. The guide rib 5220 is slidably engaged in the guide groove 5210. Based on this, when the lifting column 522 is lifting, the movement of the guide rib 5220 is more stable due to the limiting effect of the guide rib 5220 and the guide groove 5210.

[0023] Specifically, such as Figure 6 , Figure 9 As shown, in order to ensure that the height of the several bases 521 inside the material tray frame 5 is consistent, and to facilitate the collection and processing of impurities generated during cutting, in this embodiment, all bases 521 in each column are fixedly installed inside the material tray frame 5 by two parallel support rods 526.

[0024] Specifically, such as Figure 6As shown, in order to facilitate the collection and processing of impurities in the material tray frame 5, in this embodiment, a slag receiving device 54 is installed on one side of the material tray frame 5. Insertion holes 53 are opened at both ends of the upper surface of the material tray frame 5 on the connecting side of the slag receiving device 54. Insertion parts 540 are installed at both ends of the slag receiving device 54. The insertion parts 540 are inserted into the insertion holes 53 from top to bottom. A slag receiving groove 541 is opened in the slag receiving device 54. The inner bottom plate of the material tray frame 5 adopts an inclined slope structure with the height gradually decreasing from the side away from the slag receiving device 54 to the side closer to the slag receiving device 54 in the horizontal direction. The slag receiving groove 541 adopts a structure with an opening on the side that is in contact with the material tray frame 5. It communicates with the interior of the material tray frame 5 through the opening structure. Based on this, when cutting impurities fall into the interior of the material tray frame 5, they can gradually slide into the slag receiving groove 541 under the action of the slope structure, thereby achieving the effect of convenient material collection and processing.

[0025] Specifically, such as Figure 5 , Figure 7 - Figure 8As shown, in order to achieve clamping and fixing of both ends of the semiconductor glass substrate, in this embodiment, the clamping assembly 51 includes a rotating plate frame 510 and a vertical plate 513. The rotating plate frame 510 is positioned above the material tray frame 5 along the width direction of the tray frame 5. A clamping plate 515 is installed below the rotating plate frame 510. Two vertical plates 513 are provided, symmetrically installed above both ends of the material tray frame 5. A rotating shaft 512 is rotatably mounted between the two vertical plates 513. A fourth motor 514 is installed on the outer side of one of the vertical plates 513. The output shaft of the fourth motor 514 is connected to one end of the rotating shaft 512. One side of the rotating plate frame 510 is connected to the rotating shaft 512 via an arc rod 511. Therefore, when the fourth motor 514 operates, it can drive the rotating shaft 512 to rotate, thereby causing the rotating plate frame 510 and the clamping plate 515 to flip, thus clamping and fixing the ends of the semiconductor glass substrate positioned above the material tray frame 5. It should also be noted that: due to the semiconductor... Since the thickness of the semiconductor glass substrate varies, in order to ensure the clamping effect of the clamping plate 515 on semiconductor glass substrates of different thicknesses, both ends of the clamping plate 515 are rotatably connected to the inner wall of the rotating frame 510 through a pivot. Based on this, when the rotating frame 510 flips to make the clamping plate 515 press against the semiconductor glass substrate, the clamping plate 515 can rotate autonomously and always be in contact with the surface edge of the semiconductor glass substrate, thereby ensuring its clamping effect on the semiconductor glass substrate. In addition, in order to prevent the clamping plate 515 from rotating excessively due to other external forces, which would affect subsequent clamping, a tension spring is provided between the clamping plate 515 and the inner wall of the rotating frame 510. This tension spring can provide a pulling force to the clamping plate 515 to rotate inward towards the rotating frame 510, so that the clamping plate 515 can maintain the downward orientation of its outer end when there is no external interference. Therefore, when clamping different semiconductor glass substrates, the lower surface of the outer end of the clamping plate 515 always contacts the upper surface of the semiconductor glass substrate first, thereby facilitating clamping.

[0026] Specifically, such as Figure 1As shown, to achieve movement control of the material tray frame 5, in this embodiment, the material tray conveying mechanism 2 includes a conveying track 23, a first bearing seat 22, and a first linkage shaft 24. Two conveying tracks 23 are provided, symmetrically installed on both sides of the platform 1 along its length. Second slides 50 are provided at both ends of the material tray frame 5, and the two second slides 50 are slidably mounted on the two conveying tracks 23. Two sets of first bearing seats 22 are provided, with two seats in each set. The two first bearing seats 22 in the same set are respectively installed on the outer sides of both ends of the conveying track 23. The first linkage shaft 24 is perpendicular to the length of the platform 1, and its two ends are rotatably mounted on the two first bearing seats 22 in the same set. A rotating shaft is rotatably mounted on two first shaft seats 22 in a set. A conveyor belt 20 is wound around the two ends of the rotating shaft and the first linkage shaft 24. One end of the second slide 50 is connected to the upper part of the conveyor belt 20. A first motor 21 for driving the first linkage shaft 24 to rotate is mounted on the top of the platform 1 through a bracket. Based on this, when the first motor 21 runs, it drives the first linkage shaft 24 to rotate, so that the conveyor belt 20 is driven. Since the material tray frame 5 is connected to the upper part of the conveyor belt 20 through the second slide 50, it drives the material tray frame 5 to move along the length direction of the platform 1, thereby realizing the movement control of the material tray frame 5. It should also be noted that the conveyor belt 20 can be a chain, and chain-compatible sprockets can be installed on the rotating shaft and the first linkage shaft 24.

[0027] Specifically, such as Figure 1 - Figure 4 As shown, in order to achieve Z-axis movement control of the laser cutting machine 4, in this embodiment, the cutting machine control mechanism 3 includes a frame 311, a Z-axis control cylinder 312 is installed on the top of the frame 311, the laser cutting machine 4 is slidably mounted on the bottom of the frame 311, and the piston rod of the Z-axis control cylinder 312 is connected to the top of the laser cutting machine 4. Based on this, when the Z-axis control cylinder 312 is running, it can push the laser cutting machine 4 to move in the vertical direction, thereby achieving Z-axis movement control of the laser cutting machine 4.

[0028] Specifically, such as Figure 1 - Figure 4As shown, in order to realize the Y-axis movement control of the laser cutting machine 4, in this embodiment, the cutting machine control mechanism 3 further includes a first slide 301. The first slide 301 is erected along the width direction of the platform 1. A third bearing 313 is installed above both ends of the first slide 301. A Y-axis transmission belt 309 is rotatably mounted between the two third bearings 313. A Y-axis track 307 is installed above the first slide 301 along the length direction. A Y-axis slide 308 is slidably mounted on the Y-axis transmission belt 309. The Y-axis slide 308 is connected to the frame 311. The first slide 301 is connected to the upper part of the Y-axis transmission belt 309. A third motor 310 for driving the Y-axis transmission belt 309 is installed above one end of the first slide 301. Based on this, when the third motor 310 runs, it drives the Y-axis transmission belt 309 to drive, causing the Y-axis slide 308 to slide along the length direction of the Y-axis track 307, thereby driving the frame 311 and the laser cutting machine 4 installed below the frame 311 to slide along the length direction of the Y-axis track 307, thus realizing the Y-axis movement control of the laser cutting machine 4.

[0029] Specifically, such as Figure 1 - Figure 4 As shown, in order to achieve X-axis movement control of the laser cutting machine 4, in this embodiment, the cutting machine control mechanism 3 further includes an X-axis track 300, a second bearing seat 304, and a second linkage shaft 306. The X-axis track 300 is symmetrically installed on both sides of the platform 1 along its length. X-axis slides 302 are provided below both ends of the first slide 301, and the two X-axis slides 302 are slidably mounted on the two X-axis tracks 300 respectively. Two sets of second bearing seats 304 are provided, with two seats in each set. The two second bearing seats 304 in the same set are respectively installed on the outer sides of both ends of the X-axis track 300. The second linkage shaft 306 is perpendicular to the length of the platform 1, and two bearing seats 304 in the same set are rotatably mounted on both ends of the second linkage shaft 306. On the second shaft seat 304, two other sets of second shaft seats 304 are rotatably mounted with rotating shafts. The two ends of the rotating shafts are connected to the two ends of the second linkage shaft 306 with an X-axis transmission belt 303. One end of the X-axis slide 302 is connected to the upper part of the X-axis transmission belt 303. A second motor 305 for driving the rotation of the second linkage shaft 306 is mounted on the top of the platform 1 through a bracket. Based on this, when the second motor 305 runs, it drives the second linkage shaft 306 to rotate, so that the X-axis transmission belt 303 is driven. Since the first slide 301 is connected to the upper part of the X-axis transmission belt 303 through the X-axis slide 302, the first slide 301 is driven to move along the length direction of the platform 1, thereby realizing the X-axis movement control of the laser cutting machine 4.

[0030] The exemplary implementation of the solution proposed in this disclosure has been described in detail above with reference to preferred embodiments. However, those skilled in the art will understand that various modifications and alterations can be made to the above specific embodiments without departing from the spirit of this disclosure, and various combinations can be made to the various technical features and structures proposed in this disclosure without exceeding the protection scope of this disclosure, which is determined by the appended claims.

Claims

1. A semiconductor glass substrate laser cutting apparatus comprising a table body (1) and a laser cutting machine (4) mounted above the table body (1) for cutting a semiconductor glass substrate, characterized in that, The laser cutting machine (4) is installed above the table body (1) through the cutting machine control mechanism (3), so that the laser cutting machine (4) can move in X, Y and Z axes above the table body (1) to perform cutting operation, and the upper side of the table body (1) is provided with a loading tray rack (5) for fixing the semiconductor glass substrate, the loading tray rack (5) is installed on the table body (1) through the tray conveying mechanism (2), so that the loading tray rack (5) can move along the length direction of the table body (1) to the cutting area below the laser cutting machine (4); The upper side of both ends of the loading tray rack (5) is provided with a clamping assembly (51) for clamping the semiconductor glass substrate, and the inside of the loading tray rack (5) is provided with a plurality of supporting assemblies (52), the plurality of supporting assemblies (52) are arranged in a rectangular array, the supporting assembly (52) comprises a base (521) and a lifting column (522) installed inside and above the base (521), the top of the lifting column (522) is provided with a ball head (523), the top of the ball head (523) is installed with a pressure sensor (524), and the lifting column (522) can move vertically in the inside of the base (521).

2. The apparatus according to claim 1, wherein The inside of the base (521) below the lifting column (522) is installed with a pneumatic telescopic rod (528), the inside of the loading tray rack (5) below the base (521) is provided with a main gas path pipeline (525), the pneumatic telescopic rod (528) and the main gas path pipeline (525) are connected through a branch gas path pipeline (527), and each branch gas path pipeline (527) is provided with an electromagnetic control valve (529), and the outside of the loading tray rack (5) is installed with a gas pressure controller (520), one end of the main gas path pipeline (525) is connected to the gas pressure controller (520).

3. The apparatus according to claim 2, wherein The side of the lifting column (522) is provided with a guide rib (5220) in the vertical direction, and the inner wall of the base (521) is provided with a guide groove (5210) matched with the guide rib (5220) in the vertical direction, and the guide rib (5220) is slidingly engaged in the guide groove (5210).

4. The apparatus according to claim 2, wherein All the bases (521) in each column are fixedly installed in the inside of the loading tray rack (5) through two parallel arranged supporting rods (526).

5. The apparatus according to claim 4, wherein The slag receiving device (54) is arranged on one side of the carrier tray frame (5), and the upper surface of the carrier tray frame (5) is provided with a jack (53) at both ends of the connection side of the slag receiving device (54), the slag receiving device (54) is provided with a plug-in part (540) at both ends, the plug-in part (540) is inserted into the jack (53) from top to bottom, the slag receiving groove (541) is arranged in the slag receiving device (54), and the internal bottom plate of the carrier tray frame (5) is arranged in a slope structure with a gradually decreasing height from the side away from the slag receiving device (54) to the side close to the slag receiving device (54) in the horizontal direction, and the slag receiving groove (541) is arranged in an open structure on the side close to the carrier tray frame (5), and is communicated with the inside of the carrier tray frame (5) through the open structure.

6. The apparatus according to claim 1, wherein The clamping assembly (51) comprises: a rotating plate frame (510) arranged above the carrier tray frame (5) in the width direction of the carrier tray frame (5), and a clamping plate (515) arranged below the rotating plate frame (510); two vertical plates (513) symmetrically arranged above both ends of the carrier tray frame (5), a rotating shaft (512) rotatably arranged between the two vertical plates (513), and a fourth motor (514) arranged on the outside of one of the vertical plates (513), with the output shaft of the fourth motor (514) connected with one end of the rotating shaft (512); wherein one side of the rotating plate frame (510) is connected with the rotating shaft (512) through an arc rod (511), so that when the fourth motor (514) operates, the rotating shaft (512) is driven to rotate, thereby causing the rotating plate frame (510) and the clamping plate (515) to overturn, and the semiconductor glass substrate arranged above the carrier tray frame (5) is fixed by being pressed at the end, and it should be noted that, due to the difference in thickness of the semiconductor glass substrate, in order to ensure the pressing effect of the clamping plate (515) on semiconductor glass substrates with different thicknesses, the two ends of the clamping plate (515) are rotatably connected with the inner wall of the rotating plate frame (510) through a rotating shaft.

7. The apparatus according to claim 1, wherein The carrier tray conveying mechanism (2) comprises: two conveying tracks (23) symmetrically arranged above both sides of the table body (1) in the length direction of the table body (1), and a second sliding frame (50) arranged at each end of the carrier tray frame (5) and slidingly arranged on the two conveying tracks (23); two groups of first shaft seats (22), each group comprising two first shaft seats (22), and the two first shaft seats (22) in the same group being arranged at the outer sides of both ends of the conveying track (23); a first linkage shaft (24) perpendicular to the length direction of the table body (1), and the two ends of the first linkage shaft (24) being rotatably arranged on the two first shaft seats (22) in the same group. Among them, two first shaft seats (22) of another group are rotatably installed with rotating shafts, the rotating shafts are connected with both ends of the first linkage shaft (24) through transmission belts (20), one end of the second sliding frame (50) is connected with the upper belt of the transmission belt (20), and the upper side of the table body (1) is installed with a first motor (21) for driving the first linkage shaft (24) to rotate through a support.

8. The apparatus according to claim 1, wherein The cutting machine control mechanism (3) comprises a rack (311), a Z-axis control cylinder (312) is installed above the rack (311), and the laser cutting machine (4) is slidably arranged below the rack (311), and the piston rod of the Z-axis control cylinder (312) is connected with the top of the laser cutting machine (4).

9. The apparatus according to claim 8, wherein The cutting machine control mechanism (3) further comprises a first sliding frame (301), the first sliding frame (301) is arranged along the width direction of the table body (1), third shaft seats (313) are installed above both ends of the first sliding frame (301), a Y-axis transmission belt (309) is rotatably installed between the two third shaft seats (313), a Y-axis rail (307) is installed above the first sliding frame (301) along the length direction, a Y-axis sliding table (308) is slidably installed on the Y-axis transmission belt (309), the Y-axis sliding table (308) is connected with the rack (311) and the upper belt of the Y-axis transmission belt (309) at the same time, and a third motor (310) for driving the Y-axis transmission belt (309) to drive is installed above one end of the first sliding frame (301).

10. The apparatus for laser cutting of a semiconductor glass substrate according to claim 9, wherein, The cutting machine control mechanism (3) further comprises: X-axis rails (300) are symmetrically installed above both sides of the table body (1) along the length direction of the table body (1), X-axis sliding tables (302) are arranged below both ends of the first sliding frame (301), and the two X-axis sliding tables (302) are slidably arranged on the two X-axis rails (300) respectively; Second shaft seats (304) are arranged in two groups, each group has two second shaft seats (304), and the two second shaft seats (304) of the same group are installed on the outer sides of both ends of the X-axis rail (300) respectively; Second linkage shafts (306) are perpendicular to the length direction of the table body (1), and the two ends of the second linkage shaft (306) are rotatably installed with the two second shaft seats (304) of the same group respectively; Among them, two second shaft seats (304) of another group are rotatably installed with rotating shafts, the rotating shafts are connected with both ends of the second linkage shaft (306) through X-axis transmission belts (303), one end of the X-axis sliding table (302) is connected with the upper belt of the X-axis transmission belt (303), and the upper side of the table body (1) is installed with a second motor (305) for driving the second linkage shaft (306) to rotate through a support.

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