Movable small high-voltage switch combined voltage applying device

Abstract

The invention discloses a movable small high-voltage switch combined voltage applying device which comprises a box body and an external assembly, the external assembly is fixedly installed at the bottom of the box body, a side plate is installed on the side wall of the box body, a frame body is fixedly installed on the upper side of an inner cavity of the box body, and voltage doubling rectifying assemblies are horizontally and vertically assembled in the frame body. A high-voltage transformer is fixedly installed on the lower surface of the interior of the box body, a groove body is formed in the lower surface of the middle of the frame body, and a multi-bending PC connecting plate and an L-shaped PC connecting plate are fixedly installed in the groove body. Through the design of a concentric-square-shaped insulation link and in cooperation with insulation barriers such as the multi-bending PC connecting plate and the L-shaped PC connecting plate, electric field distribution is optimized, high-voltage output is achieved in a small size, and the high-voltage output is achieved; the miniaturization of the equipment is realized, so that the equipment can be easily moved to a laboratory or a site, and the testing flexibility and the space utilization rate are improved.

Description

Technical Field

[0001] This invention belongs to the field of high-voltage electrical testing technology, and specifically provides a portable miniature high-voltage switch combined with a voltage application device. Background Technology

[0002] Traditional high-voltage switchgear testing equipment is typically bulky, difficult to move, and lacks sufficient voltage regulation accuracy, making it difficult to achieve rapid and stable high-voltage output. Furthermore, it lacks intelligent control, failing to adjust the voltage rise rate in real time, thus impacting testing efficiency and safety. The voltage boosting of the insulation structure also employs a vertical stacking method, combined with air insulation, often resulting in equipment several meters in height.

[0003] In recent years, with the development of power systems towards higher voltage and larger capacity, significant progress has been made in the research and development of high-voltage switchgear, and gas-insulated switchgear (GIS) technology has also been continuously upgraded. However, many technical bottlenecks still exist in the production, manufacturing, and testing of high-voltage equipment, such as: Limited testing resources: Traditional high-voltage testing equipment is bulky, expensive, and has a long testing cycle, making it difficult to meet the growing demand for high-voltage equipment research and development and production. Low space utilization: Existing experimental equipment is often fixed in place, occupying a lot of factory space and cannot be flexibly adapted to different production scenarios; Insufficient testing efficiency: Conventional insulation testing methods rely on large-scale testing equipment, making it difficult to achieve rapid and efficient on-site testing, which restricts the research and development and production process of high-voltage switchgear.

[0004] To address the aforementioned issues, there is an urgent need to design a portable, miniature high-voltage switch combined with a voltage application device. Summary of the Invention

[0005] To address the aforementioned issues, enhance testing flexibility, optimize space utilization, and meet the rapid iteration needs of high-voltage equipment development, this invention provides a portable miniature high-voltage switch combined with voltage application device.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a portable small high-voltage switch combined voltage application device, comprising a housing and an external component, wherein the external component is fixedly installed at the bottom of the housing, a side plate is installed on the side wall of the housing, a frame is fixedly installed on the upper side of the inner cavity of the housing, a voltage multiplier rectifier assembly is horizontally and vertically assembled in the frame, a high-voltage transformer is fixedly installed on the lower surface inside the housing, and a groove is opened on the lower surface of the middle part of the frame, wherein a multi-bend PC connecting plate and an L-shaped PC connecting plate are fixedly installed in the groove; The multi-bend PC connecting plate includes a mounting plate, a support plate, an upper shielding plate, and a side shielding plate. The support plate and the upper shielding plate are fixedly installed inside the voltage multiplier rectifier assembly. The support plate is a vertical plate, and the upper shielding plate is horizontally integrally formed on the upper end of the support plate. The mounting plate is horizontally integrally formed on the lower end of the support plate. The side shielding plate is vertically integrally formed on the right end of the upper shielding plate. The support plate, the upper shielding plate, and the side shielding plate form an n-shaped cavity. The L-shaped PC connecting plate is located inside the n-shaped cavity of the multi-bend PC connecting plate. The L-shaped PC connecting plate includes a fixing plate and a lower shielding plate. The lower shielding plate is fixedly installed inside the upper shielding plate, and the fixing plate is vertically integrally formed on the left end of the lower shielding plate. The three sets of voltage multiplier rectifier assemblies are parallel to the support plate, the upper shielding plate, and the side shielding plate, respectively. The high-voltage transformer is located on the lower side of the inner cavity of the n-shaped cavity and at the lowest end of the voltage multiplier rectifier assembly.

[0007] Furthermore, a connecting pole is fixedly installed on the upper shielding plate, and the multi-bend PC connecting plate and the L-shaped PC connecting plate are installed on the frame through the connecting pole.

[0008] Furthermore, the left end of the frame is a cable head connection port, and the frame is provided with mounting cavities on the left, upper and right sides of the groove, and the voltage multiplier rectifier assembly is installed in the mounting cavity.

[0009] Furthermore, the voltage doubler rectifier assembly uses high-voltage capacitors and high-voltage diodes to convert low-voltage AC power into high-voltage DC power through staged charging of the capacitors.

[0010] Furthermore, a bracket is fixedly installed inside the external component. The external component includes a feedback component, a PID control component, and a system control component. The feedback component is mounted on the lower surface of the housing, an inverter component is mounted on the upper surface of the bracket, and the PID control component and the system control component are mounted on the lower surface of the bracket.

[0011] Furthermore, the feedback component consists of a high-precision sampling resistor, a sampling capacitor, and an operational amplifier. The high-precision sampling resistor and the sampling capacitor are connected in parallel and then in series with the operational amplifier to transmit the collected signal to the system control component. The inverter component is used to convert the DC bus voltage into the primary voltage required for the input of the high-voltage transformer. The PID control component uses a hardware control circuit built with an operational amplifier to output a PWM signal to adjust the DC voltage waveform and change the voltage rise rate by adjusting the resistance or capacitance value. The system control component uses an FPGA chip and either an ARM chip or a DSP chip to write a control program, which enables real-time sampling of the output voltage and power-off to protect the equipment in the event of a discharge.

[0012] Furthermore, a sampling resistor is installed on the lower surface of the enclosure, a high-voltage resistor is installed on the voltage doubler rectifier assembly, and a sampling control assembly is connected between the sampling resistor and the high-voltage resistor. The sampling control assembly uses a shielded cable.

[0013] Furthermore, a sealing groove is provided on the outer periphery of the side wall of the box, and a sealing component is provided in the sealing groove.

[0014] The beneficial effects of using this invention are: This invention optimizes the electric field distribution through a loop-shaped insulated link design, combined with insulation barriers such as multi-bend PC connecting plates and L-shaped PC connecting plates, achieving high-voltage output in a small volume. This results in the miniaturization of the equipment, making it easy to move to the laboratory or field, improving testing flexibility and space utilization.

[0015] The insulation structure of this invention adopts a PC material frame, insulating oil filling and a sealed shell to form multiple barriers; through electric field simulation verification, the loop design effectively balances the electric field distribution, extends the creepage distance, withstands high voltage in a compact space and avoids breakdown; at the same time, the intelligent protection mechanism ensures rapid power cut-off in case of abnormality, ensuring the safety of equipment and operators.

[0016] Based on PID control and feedback components, this invention enables the device to support high-precision adjustment of output voltage and adjust the voltage rise rate in real time. Combined with ARM / FPGA intelligent control, it ensures waveform stability, meets diverse testing needs, and improves testing efficiency and reliability. Attached Figure Description

[0017] Figure 1 This is one of the three-dimensional schematic diagrams of the present invention.

[0018] Figure 2 This is a second three-dimensional schematic diagram of the present invention.

[0019] Figure 3 This is a front sectional view of the present invention.

[0020] Figure 4 This is a schematic diagram of the internal structure of the present invention.

[0021] Figure 5 This is a three-dimensional schematic diagram of the high-voltage transformer of the present invention.

[0022] Figure 6 This is a three-dimensional schematic diagram of the frame of the present invention.

[0023] Figure 7 This is a three-dimensional schematic diagram of the multi-bend PC connecting plate and the L-shaped PC connecting plate of the present invention.

[0024] Figure 8 This is a cross-sectional view of the voltage simulation rainbow diagram of the present invention.

[0025] Figure 9 For the voltage simulation rainbow of this invention Figure 3 Vito.

[0026] The reference numerals in the attached drawings include: 1. Housing, 2. Side panel, 3. Frame, 4. Multi-bend PC connecting plate, 401. Mounting plate, 402. Support plate, 403. Upper shielding plate, 404. Side shielding plate, 5. L-shaped PC connecting plate, 501. Fixing plate, 502. Lower shielding plate, 503. Connecting pole, 6. Voltage multiplier rectifier assembly, 7. High voltage transformer, 8. Sampling control assembly, 9. External assembly, 901. Feedback assembly, 902. PID control assembly, 903. System control assembly, 10. Sealing groove. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Reference Figures 1 to 7 A portable miniature high-voltage switch combined voltage application device includes a housing 1 and an external component 9, with the external component 9 fixedly installed at the bottom of the housing 1. A side plate 2 is installed on the side wall of the housing 1. A frame 3 is fixedly installed on the upper side of the inner cavity of the housing 1. A voltage multiplier rectifier assembly 6 is installed horizontally and vertically inside the frame 3. A high-voltage transformer 7 is fixedly installed on the lower surface inside the housing 1. A groove is opened on the lower surface of the middle part of the frame 3, and a multi-bend PC connecting plate 4 and an L-shaped PC connecting plate 5 are fixedly installed in the groove. A sealing groove 10 is opened on the outer periphery of the side wall of the housing 1, and a sealing assembly is provided in the sealing groove 10.

[0029] The enclosure 1 is made of aluminum or steel, and the interior is filled with insulating oil using a vacuum oil injection method. The frame 3 is made of PC board.

[0030] The high-voltage transformer 7 uses a magnetic core with high permeability such as ferrite or nanocrystal, and uses PC material to complete the insulation protection between the primary and secondary sides. It is fixed in the housing 1 by bolts. The primary winding is connected to the output terminal of the inverter component to receive high-frequency AC input, and the secondary winding outputs the boosted high-frequency AC power to the input terminal of the voltage multiplier rectifier component 6.

[0031] The sealing components can use sealing rings or O-rings to ensure the seal between the enclosure 1 and the side plate 2, isolate the outside air and pollutants, and ensure the purity and long-term stability of the insulating oil.

[0032] The multi-bend PC connecting plate 4 and the L-shaped PC connecting plate 5 form two layers of PC protection, making it difficult for electrons to flow directly from high potential to low potential and form through discharge.

[0033] The multi-bend PC connecting plate 4 includes a mounting plate 401, a support plate 402, an upper shielding plate 403, and a side shielding plate 404. The support plate 402 and the upper shielding plate 403 are fixedly installed inside the voltage multiplier rectifier assembly 6. The support plate 402 is a vertical plate, and the upper shielding plate 403 is horizontally integrally formed on the upper end of the support plate 402. The mounting plate 401 is horizontally integrally formed on the lower end of the support plate 402, and the side shielding plate 404 is vertically integrally formed on the right end of the upper shielding plate 403. The support plate 402, the upper shielding plate 403, and the side shielding plate 404 are all integrally formed. The shielding plate 404 forms an n-shaped cavity. The L-shaped PC connecting plate 5 is located inside the n-shaped cavity of the multi-bend PC connecting plate 4. The L-shaped PC connecting plate 5 includes a fixing plate 501 and a lower shielding plate 502. The lower shielding plate 502 is fixedly installed on the inner side of the upper shielding plate 403. The fixing plate 501 is vertically integrally formed on the left end of the lower shielding plate 502. The three sets of voltage multiplier rectifier components 6 are parallel to the support plate 402, the upper shielding plate 403, and the side shielding plate 404, respectively. The high-voltage transformer 7 is located on the lower side of the inner cavity of the n-shaped cavity and at the lowest end of the voltage multiplier rectifier component 6.

[0034] The three sets of voltage multiplier rectifier components 6 are in vertical, horizontal and vertical states respectively, and are located outside the support plate 402, the upper shielding plate 403 and the side shielding plate 404 respectively, and are parallel to each other, so that the support plate 402, the upper shielding plate 403 and the side shielding plate 404 can play the role of isolating the electric field.

[0035] Three sets of voltage multiplier rectifier components 6, together with the high-voltage transformer 7, form a loop-shaped insulated link structure. The high-voltage transformer 7, located at the lowest voltage end, is not far from the voltage multiplier rectifier component 6 at the highest potential. In conventional designs, the voltage multiplier rectifier components 6 are laid flat or stacked vertically to keep the high-voltage transformer 7 away from the highest potential. In contrast, the high-voltage transformer 7 is placed below the voltage multiplier rectifier component 6 at the highest potential, forming a loop-shaped insulated link. To ensure a compact structure and meet insulation requirements, the high-voltage electric field distribution is adjusted through the frame 3, the multi-bend PC connecting plate 4, and the L-shaped PC connecting plate 5, which act as a barrier in the breakdown path. The high-voltage transformer 7 is located on the lower side of the n-shaped cavity and, together with the three voltage multiplier rectifier components 6, forms a spatial fold in the insulated link, realizing the loop design.

[0036] The multi-bend PC connecting plate 4 and the L-shaped PC connecting plate 5 are nested to form a composite insulation barrier. The multi-bend PC connecting plate 4 serves as the main insulation barrier, wrapping the high-voltage area and achieving three-dimensional shielding of the electric field from multiple directions. It guides the electric field lines to distribute along the surface of the PC plate, optimizing the spatial electric field distribution. Its multi-bend structure optimizes the electric field concentration point through multiple bends and can effectively increase the creepage distance. The L-shaped PC connecting plate 5 serves as a supplementary design to the multi-bend PC connecting plate 4, forming a second protective barrier to prevent electric field leakage.

[0037] By adjusting the thickness of the PC board and the spatial arrangement of the voltage multiplier rectifier board devices, the electric field distribution and insulation distance can be effectively balanced; the function of outputting high voltage DC (10kV~140kV or -10kV~-140kV) can be completed within the length, width and height of no more than 500mm and no more than 300mm, thus realizing the miniaturization of the equipment.

[0038] Reference Figure 8 Red and yellow areas represent high-voltage areas, while blue and purple areas represent low-voltage areas. The red areas at cable head connections and the edges of the voltage multiplier rectifier assembly 6 indicate the highest potential point, where the maximum electric field strength typically occurs. The high-voltage transformer 7 is an area with lower electric field strength. At the multi-bend PC connecting plate 4 and the L-shaped PC connecting plate 5, the creepage distance is effectively extended, and the electric field strength transitions smoothly from high to low. The loop-shaped insulated link design balances the electric field distribution, preventing localized spikes that could cause discharge. (Refer to...) Figure 9 From a three-dimensional perspective, the color transition inside the entire device is smooth, and there are no voltage abrupt change areas. Therefore, the design of the loop insulation path is verified by electric field simulation. The electric field distribution is uniform, avoiding the risk of local breakdown and ensuring the rationality of the loop design and the design of frame 3, multi-bend PC connecting plate 4, and L-shaped PC connecting plate 5.

[0039] Specifically, a connecting pole 503 is fixedly installed on the upper shielding plate 403, and the multi-bend PC connecting plate 4 and L-shaped PC connecting plate 5 are installed on the frame 3 through the connecting pole 503.

[0040] The connecting post 503 is made of PC material and is insulated. It is used to install and support the multi-bend PC connecting plate 4 and the L-shaped PC connecting plate 5.

[0041] Specifically, the left end of the frame 3 is a cable head connection port, and there are mounting cavities inside the frame 3 located on the left, upper and right sides of the groove, and the voltage multiplier rectifier assembly 6 is installed in the mounting cavity.

[0042] The cable head connector is used to plug in the cable terminal and transmit high voltage to the corresponding test section. An O-ring is used to seal the interface.

[0043] Specifically, the voltage doubler rectifier component 6 uses high-voltage capacitors and high-voltage diodes, and charges the capacitors step by step to convert low-voltage AC power into high-voltage DC power.

[0044] Specifically, an internal bracket is fixedly installed in the external component 9. The external component 9 includes a feedback component 901, a PID control component 902, and a system control component 903. The feedback component 901 is mounted on the lower surface of the housing 1, the inverter component is mounted on the upper surface of the bracket, and the PID control component 902 and the system control component 903 are mounted on the lower surface of the bracket.

[0045] Circuit boards are installed on the lower surface of the housing 1 and the upper and lower surfaces of the bracket. The feedback component 901 is set on the circuit board on the housing 1, and the inverter component, PID control component 902, and system control component 903 are respectively set on the circuit boards on the upper and lower sides of the bracket.

[0046] A square rubber bladder is provided at the end of the lower surface inside the housing 1 to counteract the thermal expansion and contraction of the insulating oil.

[0047] Specifically, the feedback component 901 consists of a high-precision sampling resistor and a sampling capacitor. At the same time, an operational amplifier is used to build a sampling follower to ensure good impedance characteristics. The high-precision sampling resistor and the sampling capacitor are connected in parallel and then in series with the operational amplifier. A proportional conversion circuit is built according to actual needs to realize the sampling work of low-voltage equipment.

[0048] Feedback component 901 is used to acquire signals and transmit them to system control component 903; inverter component is used to convert DC bus voltage into the primary voltage required for high voltage transformer input.

[0049] The PID control component 902 uses a hardware control circuit built with an operational amplifier. It adjusts the output DC voltage waveform in real time by changing the output PWM. At the same time, it adjusts the resistance and capacitance values ​​to achieve the speed of PID regulation, thereby regulating the voltage rise rate.

[0050] The system control component 903 uses an FPGA chip in conjunction with either an ARM chip or a DSP chip to write a control program, enabling real-time sampling of the output voltage and power-off protection of the equipment in the event of a discharge.

[0051] Specifically, a sampling resistor is installed on the lower surface of the enclosure 1, a high-voltage resistor is installed on the voltage doubler rectifier assembly 6, and a sampling control assembly 8 is connected between the sampling resistor and the high-voltage resistor. The sampling control assembly 8 uses a shielded cable.

[0052] The shielded cable connects the sampling resistor and the high-voltage resistor, effectively preventing electromagnetic interference and ensuring the accuracy of the sampling signal. The voltage value of the sampling resistor is transmitted to the system control component 903 through the shielded cable to achieve high-precision feedback.

[0053] For portable miniature high-voltage switchgear combined with voltage application devices, the high-voltage output characteristics must meet the following requirements: Overshoot of high output voltage on the rising edge: V HV_ov <5kV; Output voltage ripple: V HV_ripple <150V(0 <f ripple <2.5kHz); V HV_ripple <750V (2.5kHz) <f ripple <30kHz); e HV_ripple <3%(f ripple >=30kHz); High output voltage accuracy: e HV <1.5%; Pulse repeatability accuracy within 1 hour: e HV_rep (1h) <0.10%, V HV_nom >=100kV; Pulse repeatability accuracy within 1 hour: e HV_rep (1h) <0.15%, V HV_nom <100kV; Accuracy of pulse repeatability within 24 hours: e HV_rep (24h) <0.25%; This means setting requirements for the error range of the output voltage.

[0054] This device can monitor its internal operating parameters and send error status signals to the system control component 903. It can also detect discharge events through a dedicated interface signal and send signals to the system control component 903.

[0055] The application process of this device is as follows: Phase 1: Pre-test preparation: Move the device to the test site, adjust its horizontal position, connect it to the high-voltage switch terminal under test through the cable head connector, connect the +350VDC (inverter bus) and +24VDC (control power supply) inputs, and perform a power-on self-test, including hardware diagnostics and parameter loading. Phase Two: Test Parameter Settings The host computer communicates with the system control component 903 via a serial port. The system checks the rationality of the parameters and starts after operator confirmation. The third stage, test execution and voltage establishment: The PID control component 902 outputs a PWM signal to drive the inverter component to work. After the high voltage transformer 7 boosts the voltage, the voltage doubler rectifier component 6 charges step by step. After the output voltage reaches the set value, it enters the steady-state test stage. The feedback component 901 samples the voltage, and the system control component 903 performs closed-loop regulation. Phase Four: Test Monitoring and Data Recording The system records output voltage, current, temperature, and discharge signals in real time. When the system detects an abnormality (such as discharge or over-temperature), it triggers protection and automatically generates a test report, including waveforms and key parameters. Phase 5: Test completion and equipment reset. The output voltage drops to zero within 2 seconds to avoid voltage backlash. The host computer monitors the output voltage in real time, uploads the test data to the host computer, generates a standardized report, disconnects the power supply, disassembles the connecting cable, and cleans the surface of the equipment.

[0056] Errors in the operation of this device can be handled by the device itself, as follows: (1) Watchdog reminder for software failure: The equipment provides a watchdog function to prevent unpredictable software failure behavior; when the watchdog is alerted, the system will shut down the high voltage output and report the error to the host computer; the operator can restart the control circuit through the host computer. (2) Feedback of unexpected information during equipment operation: The equipment detects unexpected information accompanied by unexpected parameters; In the event of unexpected information, the equipment sends the information to the system control component 903 so that the operator can understand the current operating status; (3) The equipment mutual transmission operation signal disappears: The mutual transmission operation signal starts to be transmitted between the system control component 903 and the host computer when the system control component 903 starts; if the system control component 903 does not receive the next mutual transmission signal 2s after receiving a mutual transmission signal, the system will report an error to the host computer and shut down the output voltage at the same time. (4) Output voltage exceeds the set error range: When the system control component 903 detects that the output voltage is outside the range of + / -5kV of the specified voltage, the system control component 903 will send a signal to the host computer to report an error and shut down the output voltage. (5) The bus voltage of the inverter component exceeds the set error range: The system control component 903 detects that the bus voltage of the inverter component exceeds the set error range. The system control component 903 will send a signal to the host computer to report the error and shut down the output voltage. (6) Input voltage disappears or suddenly decreases: When the system control component 903 detects that the input voltage has disappeared or suddenly decreased, the system control component 903 will send a signal to the host computer to report an error and at the same time shut down the output voltage; (7) Discharge signal detected: If the system control component 903 detects the discharge of the test sample or other unexpected discharge, the system control component 903 will send a signal to the host computer to report the error and shut down the output voltage. (8) The temperature inside the inverter component or the enclosure 1 is too high: The system control component 903 continuously detects the temperature inside the inverter component or the enclosure 1 through the temperature sensor; once the temperature is found to exceed 80 degrees Celsius, the system control component 903 will send a signal to the host computer to report an error and shut down the output voltage; a temperature switch can be set inside the enclosure 1 to ensure complete temperature control. (9) Fan fault detection: When the system control component 903 detects a fan fault, it will send a signal to the host computer to report the error and shut down the output voltage.

[0057] This device is adjusted using PWM or PFM, and requires an input power of ≤50W.

[0058] This device uses high-speed optocoupler isolation (1MHz) to isolate the high-voltage section from the control section.

[0059] The power input of this device comes from the +350VDC and +24VDC of the switching power supply; the 350VDC is used as the DC bus voltage of the inverter component to provide energy for the high voltage output; the 24VDC provides power to the system control component 903.

[0060] The 350VDC input bus is monitored using differential sampling; the 24VDC generation control power supply is available in +12VDC (2A), -12VDC (500mA), and +5VDC (1A), with +5V powering the ARM chip (or DSP chip) and FPGA chip of the system control unit; the +12VDC and +5V are designed using LM2576 or similar buck chips, and can output a maximum current of 3A.

[0061] This device feeds back the detected kV voltage to the system control module for closed-loop control; it uses a dual closed-loop PID control method to simultaneously control the kV feedback and the resonant current of the inverter section; the kV feedback ratio is 1VDC = 20kV.

[0062] The above content is only a preferred embodiment of the present invention. For those skilled in the art, many changes can be made in the specific implementation and application scope based on the concept of the present invention. As long as these changes do not depart from the concept of the present invention, they all fall within the protection scope of the present invention.

Claims

1. A mobile small high voltage switch combined voltage application device, characterized by: The utility model provides box and external component, and external component fixed mounting is installed in the bottom of box, the side wall of box is installed with side plate, the inner chamber upside of box is fixedly installed with frame body, the frame body is respectively equipped with horizontal and vertical assembly in the frame body, the lower surface of the inside of box is fixedly installed with high voltage transformer, the middle lower surface of frame body is equipped with groove, and the groove is fixedly installed with multi -bending PC connecting plate and L type PC connecting plate; The utility model relates to a high -voltage transformer, and the high -voltage transformer is fixedly installed in the lower surface of the inside of box, and the high -voltage transformer is fixedly installed with high -voltage capacitor and high -voltage diode, and the low -voltage alternating -current is converted into high -voltage direct current through the step -by -step charging of capacitor.

2. A mobile small high voltage switch combined voltage application device according to claim 1, characterized in that: The utility model relates to a high -voltage transformer, and the high -voltage transformer is fixedly installed in the lower surface of the inside of box, and the high -voltage transformer is fixedly installed with high -voltage capacitor and high -voltage diode, and the low -voltage alternating -current is converted into high -voltage direct current through the step -by -step charging of capacitor.

3. A mobile small high voltage switch combined voltage application device according to claim 1, characterized in that: The utility model relates to a high -voltage transformer, and the high -voltage transformer is fixedly installed in the lower surface of the inside of box, and the high -voltage transformer is fixedly installed with high -voltage capacitor and high -voltage diode, and the low -voltage alternating -current is converted into high -voltage direct current through the step -by -step charging of capacitor.

4. A mobile small high voltage switch combined voltage application device according to claim 1, characterized in that: The utility model relates to a high -voltage transformer, and the high -voltage transformer is fixedly installed in the lower surface of the inside of box, and the high -voltage transformer is fixedly installed with high -voltage capacitor and high -voltage diode, and the low -voltage alternating -current is converted into high -voltage direct current through the step -by -step charging of capacitor.

5. A portable small high voltage switch combined voltage application device according to claim 1, characterized in that: The utility model relates to a high -voltage transformer, and the high -voltage transformer is fixedly installed in the lower surface of the inside of box, and the high -voltage transformer is fixedly installed with high -voltage capacitor and high -voltage diode, and the low -voltage alternating -current is converted into high -voltage direct current through the step -by -step charging of capacitor. The utility model relates to a high -voltage transformer, and the high -voltage transformer is fixedly installed in the lower surface of the inside of box, and the high -voltage transformer is fixedly installed with high -voltage capacitor and high -voltage diode, and the low -voltage alternating -current is converted into high -voltage direct current through the step -by -step charging of capacitor. ​ ​ ​ 6. A mobile small high voltage switch combined voltage application device according to claim 5, characterized in that: ​ 7. A mobile small high voltage switch combined voltage application device according to claim 1, characterized in that: The side wall of the box is provided with a sealing groove, and a sealing assembly is arranged in the sealing groove.

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