Processing method and processing device

Abstract

The invention discloses a processing method and a processing device, and relates to the technical field of equipment heat dissipation. The processing method comprises the steps that first target data of a heat dissipation component in a target state is obtained, the first target data represents temperature information of a first area of the heat dissipation component, and the target state represents the heat dissipation state of the heat dissipation component on a heating component; based on the first target data, second target data of the heating component is determined, and the second target data represents temperature information of a second area of the heating component.

Description

Technical Field

[0001] This application relates to the field of equipment heat dissipation technology, and in particular to a processing method and processing device. Background Technology

[0002] Traditional technologies typically rely on simulation images of heat sources provided by manufacturers of heat-generating components such as chips for heat dissipation design. However, they lack temperature data for these components. Furthermore, simulation data (such as simulation images of chip heat sources) has low reliability and lacks practical verification. Experiments and design corrections are required later, which affects the accuracy of heat dissipation design and increases time and cost. Summary of the Invention

[0003] Therefore, this application discloses the following technical solution:

[0004] A processing method includes:

[0005] Obtain first target data of the heat dissipation component in the target state, wherein the first target data represents the temperature information of a first region of the heat dissipation component, and the target state represents the state of heat dissipation of the heat dissipation component to the heat-generating component;

[0006] Based on the first target data, second target data for the heating element is determined, wherein the second target data characterizes the temperature information of the second region of the heating element.

[0007] Optionally, based on the first target data, second target data for the heating component is determined, including:

[0008] Based on the first target data, the second target data of the heating component is determined through a target calculation strategy;

[0009] The target calculation strategy is based on the thermal diffusion characteristics and / or heat flow conservation characteristics during the process of heat transfer from the heat-generating component to the heat-dissipating component.

[0010] Optionally, the first target data further represents the positional information of each position in the first region of the heat dissipation component, and the second target data further represents the positional information of each position in the second region of the heat-generating component;

[0011] Based on the first target data, a second target data for the heating component is determined using a target calculation strategy, including:

[0012] Based on the first target data, at least one first target sub-region with temperature information and location information is determined in the first region;

[0013] Based on the temperature and location information of the first target sub-region, the temperature and location information of the second target sub-region corresponding to the first target sub-region on the heating component are determined through the target calculation strategy;

[0014] Based on the temperature and location information of the second target sub-region, the temperature information of other locations outside the second target sub-region in the second region of the heating component is determined.

[0015] Optionally, based on the temperature and location information of the first target sub-region, the temperature and location information of the corresponding second target sub-region on the heating component are determined through the target calculation strategy, including:

[0016] Based on the temperature information of the first target sub-region, the temperature information of the second target sub-region is determined through a first calculation strategy;

[0017] Based on the first size of the first target sub-region, the second size of the second target sub-region is determined by a second calculation strategy;

[0018] The first calculation strategy is based on the heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component, and the second calculation strategy is based on the heat diffusion characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component; the location information of the first target sub-region includes the first size, and the location information of the second target sub-region includes the second size.

[0019] Optionally, based on the temperature information of the first target sub-region, the temperature information of the second target sub-region is determined using a first calculation strategy, including:

[0020] Determine the first increment;

[0021] Based on the temperature information of the first target sub-region and the first increment, the temperature information of the second target sub-region is determined; the values ​​of the first increment, the temperature information of the first target sub-region, and the temperature information of the second target sub-region conform to the heat flow conservation characteristics during the process of heat transfer from the heat-generating component to the heat-dissipating component.

[0022] Optionally, the first increment may be determined, including one of the following:

[0023] The first increment is determined based on the thermal resistance of the target material in the heat dissipation component and the heat dissipation power per unit area of ​​the heat dissipation component; the target material is used to fill the gap between the heat dissipation component and the heat-generating component.

[0024] The first increment is determined based on one of the thermal resistance of the target material and the heat dissipation power per unit area of ​​the heat dissipation component;

[0025] The first increment is determined based on the attribute information of the heat dissipation component and the first mapping relationship information; the first mapping relationship information includes the mapping relationship between different attribute information of different heat dissipation components and different first increments.

[0026] Optionally, based on the first size of the first target sub-region, the second size of the second target sub-region is determined using a second calculation strategy, including:

[0027] Determine the second increment;

[0028] The radius of the second target sub-region is determined based on the radius of the first target sub-region and the second increment;

[0029] Based on the radius of the second target sub-region, the area of ​​the second target sub-region is determined; the values ​​of the second increment, the radius of the first target sub-region, and the radius of the second target sub-region conform to the thermal diffusion characteristics during the process of heat transfer from the heat-generating component to the heat-dissipating component.

[0030] Optionally, a second increment may be determined, including one of the following:

[0031] The second increment is determined based on the thickness and thermal diffusion angle of the target material in the heat dissipation component; the target material is used to fill the gap between the heat dissipation component and the heat generation component.

[0032] The second increment is determined based on one of the thickness of the target material and the thermal diffusivity angle;

[0033] The second increment is determined based on the attribute information of the heat dissipation component and the second mapping relationship information; the second mapping relationship information includes the mapping relationship between different attribute information of different heat dissipation components and different second increments.

[0034] Optionally, based on the temperature and location information of the second target sub-region, the temperature information of other locations outside the second target sub-region in the second region of the heating component is determined, including:

[0035] If there is only one second target sub-region, the temperature information of the other locations is determined based on the temperature information of the second target sub-region and the relative positional relationship between the other locations and the second target sub-region.

[0036] If there is more than one second target sub-region, the temperature information of each second target sub-region is superimposed based on the center position and size of each second target sub-region to obtain the superimposed temperature information of each second target sub-region; based on the superimposed temperature information of each second target sub-region and the relative positional relationship between the other positions and each second target sub-region, the temperature information of the other positions is determined.

[0037] A processing apparatus, comprising:

[0038] Memory, used to store at least one set of computer instructions;

[0039] A processor is configured to perform the following processing by executing the instruction set stored in the memory:

[0040] Obtain first target data of the heat dissipation component in the target state, wherein the first target data represents the temperature information of a first region of the heat dissipation component, and the target state represents the state of heat dissipation of the heat dissipation component to the heat-generating component;

[0041] Based on the first target data, second target data for the heating element is determined, wherein the second target data characterizes the temperature information of the second region of the heating element.

[0042] A storage medium carrying one or more computer instruction sets, which, when executed by a processing device, enable the processing device to perform any of the processing methods provided above. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0044] Figure 1 This is a flowchart of the processing method provided in this application;

[0045] Figure 2 This is a schematic diagram illustrating the radius calculation of the second target sub-region provided in this application;

[0046] Figure 3 This is an example provided in this application of temperature superposition processing of two second target sub-regions by location;

[0047] Figure 4 Here is an example of the hotspot and its central location provided in this application;

[0048] Figure 5 This is an example of improving the contrast of temperature field contour maps provided in this application;

[0049] Figure 6 This is an example of how the temperature field cloud map of the heat-generating component is obtained by inverting the temperature field cloud map of the heat-generating component based on the temperature field cloud map of the heat-generating component, and then restoring it to the style of the original image before preprocessing.

[0050] Figure 7This is a structural diagram of the processing apparatus provided in this application. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] This application provides a processing method and a processing apparatus. The processing method can be applied to a variety of general-purpose or special-purpose computing device environments or configurations, such as personal computers, handheld or portable devices, tablet devices, multiprocessor devices, heat dissipation testing processing apparatus (as shown in the figure), etc.

[0053] See Figure 1 The flowchart shown illustrates the processing method provided in this application embodiment, which may include the following steps 101 to 102, which are described in detail below.

[0054] Step 101: Obtain first target data of the heat dissipation component in the target state. The first target data represents the temperature information of the first region of the heat dissipation component, and the target state represents the state of heat dissipation of the heat dissipation component to the heat-generating component.

[0055] The heat-generating components can be, but are not limited to, chips that generate heat during operation, such as CPUs (Central Processing Units) and GPUs (Graphics Processing Units), or other related components that generate heat during operation, such as power supply units and lighting units. During operation, these components often generate heat due to the conversion between electrical and thermal energy, leading to a temperature rise. Correspondingly, the heat dissipation components can be, but are not limited to, heat dissipation modules for CPUs, GPUs, or other chips, or heat dissipation modules for power supply units, lighting units, and other components. The heat dissipation components have the ability to dissipate heat from the heat-generating components, and can conduct or convection heat dissipation mechanisms to conduct the heat generated by the heat-generating components and dissipate it to the external environment, thereby maintaining stable operation of the equipment. For example, the heat dissipation module may be a heat pipe, a vapor chamber, a thermal pad, thermal grease, heat sink fins, a liquid radiator, a radiator, a phase change material (PCM), a liquid metal thermal medium, etc., but this application is not limited to these, that is, those skilled in the art can adjust or set it according to specific needs.

[0056] Optionally, the first region of the heat dissipation component can be the region characterized by the surface of the heat dissipation component opposite to the contact surface of the heat dissipation component and the heat-generating component when the heat dissipation component is dissipating heat to the heat-generating component, but it is not limited to this, and can also be the surface of the heat dissipation component adjacent to the contact surface, etc.

[0057] The first target data of the heat dissipation component in the target state can be obtained, but is not limited to, by performing infrared temperature measurement, contact temperature measurement, etc., on the first area of ​​the heat dissipation component in the target state. For example, in step 101, a temperature field cloud map of the first area of ​​the heat dissipation component in the target state can be obtained first. This temperature field cloud map can be generated based on infrared temperature measurement of the first area of ​​the heat dissipation component in the target state and carries the temperature information of the position represented by each pixel. After obtaining the temperature field cloud map, the temperature information of each position in the first area of ​​the heat dissipation component can be extracted based on the temperature field cloud map to obtain the first target data.

[0058] Step 102: Based on the first target data, determine the second target data of the heating element, wherein the second target data characterizes the temperature information of the second region of the heating element.

[0059] The second region of the heating element may be, but is not limited to, the region characterized by the mating surface of the heating element and the heat dissipation element on the heating element, or the region characterized by the surface of the heating element adjacent to the mating surface, etc.

[0060] When the heat dissipation component is dissipating heat from the heat-generating component (i.e., the target state), the heat from the second region of the heat-generating component can be transferred to the first region of the heat dissipation component through heat transfer. This will make the temperature information of the first region of the heat dissipation component and the temperature of the second region of the heat-generating component have linkage and potential correlation in temperature values. The temperature of the first region of the heat dissipation component will change with the temperature of the second region of the heat-generating component. The higher the temperature of the second region, the higher the temperature of the first region will also be.

[0061] Based on this, after obtaining the first target data of the heat dissipation component in the target state, this embodiment uses the temperature information of the first region of the heat dissipation component represented by the first target data as a basis, and can perform inversion based on the thermal conduction characteristics between the heat-generating component and the heat dissipation component to calculate the temperature information of the second region of the heat-generating component in reverse, thereby obtaining the second target data of the heat-generating component.

[0062] Traditional technologies typically rely on simulation images of heat sources of heat-generating components provided by chip and other heat-generating component manufacturers for heat dissipation design. However, they lack temperature data of these components, and the simulation data has low reliability and lacks practical verification. This necessitates subsequent experiments and design corrections, which can affect the accuracy of the heat dissipation design and increase time and cost.

[0063] To address this issue, the processing method provided in this embodiment obtains first target data of the heat dissipation component in a target state, that is, the temperature information of the first region of the heat dissipation component when the heat dissipation component dissipates heat to the heat-generating component. Based on the potential temperature correlation between the heat-generating component and the heat dissipation component caused by the thermal conduction characteristics between them, the obtained data is used to invert the second target data of the heat-generating component. Therefore, reliable temperature information of the second region of the heat-generating component can be obtained, thereby overcoming the problem of affecting the accuracy of heat dissipation design in related technologies. This can provide better assistance for heat dissipation design and, compared with the traditional technology that requires experimental correction of the design in the later stages, also reduces time and cost consumption.

[0064] In an optional embodiment, step 102 of the processing method provided in this application, namely determining the second target data of the heating component based on the first target data, can be implemented as follows:

[0065] Based on the first target data, the second target data of the heating component can be determined through a target calculation strategy.

[0066] The target calculation strategy can be determined based on the thermal diffusion characteristics and / or heat flow conservation characteristics during the process of heat transfer from the heat-generating component to the heat-dissipating component.

[0067] The heat flow conservation characteristic refers to the property that heat flow (i.e., the transport of energy in space) follows the law of conservation of energy. This means that in a closed system, energy cannot be created or destroyed, but can only be transformed from one form to another or transferred from one object to another, so the total amount of heat flow remains constant.

[0068] Thermal diffusion characteristics typically refer to the core properties exhibited by thermal diffusion phenomena, which are essentially the process of heat transfer from high-temperature regions to low-temperature regions. This phenomenon depends on the interaction and kinetic energy transfer of particles (such as molecules, atoms, or electrons) within a substance.

[0069] For scenarios where a heat dissipation component cools a heat-generating component, this embodiment constructs a target calculation strategy based on the thermal diffusion characteristics and / or heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat dissipation component. This strategy can be used to inversely calculate the second target data of the heat-generating component based on the first target data of the heat dissipation component in a target state. Optionally, the target calculation strategy can be expressed in the form of a mathematical model, such as one or more calculation formulas, to determine the second target data of the heat-generating component based on the first target data using the target calculation strategy containing one or more calculation formulas.

[0070] For example, in one possible implementation, one or more calculation formulas can be formulated based on the heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component. These formulas can be used to inversely calculate the second target data of the heat-generating component based on the first target data of the heat-dissipating component in a target state, serving as the target calculation strategy. For instance, a calculation formula can be formulated to inversely calculate the temperature of the heat-generating component based on the temperature of the heat-dissipating component in the target state, serving as the target calculation strategy.

[0071] In another possible implementation, one or more calculation formulas can be formulated based on the thermal diffusion characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component. These formulas can be used to inversely calculate the second target data of the heat-generating component based on the first target data of the heat-dissipating component in the target state, serving as the target calculation strategy. For example, a calculation formula can be formulated to inversely calculate the size of the heat-generating region of the heat-generating component based on the size of the heat dissipation region of the heat-dissipating component in the target state, serving as the target calculation strategy.

[0072] However, this is not the only possible implementation. In other possible implementations, based on the heat flow conservation characteristics and heat diffusion characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component, a calculation formula can be formulated to inversely calculate the second target data of the heat-generating component based on the first target data of the heat-dissipating component in the target state, serving as the target calculation strategy. For example, based on the heat flow conservation characteristics, a calculation formula can be formulated to inversely calculate the temperature of the heat-generating component based on the temperature of the heat-dissipating component in the target state, and based on the heat diffusion characteristics, a calculation formula can be formulated to inversely calculate the size of the heat-dissipating region of the heat-dissipating component based on the size of the heat-dissipating region of the heat-dissipating component in the target state, etc., and each of these formulas can be used as the target calculation strategy.

[0073] To address the shortcomings of traditional technologies, such as the lack of temperature data for heat-generating components like chips, which affects the accuracy of heat dissipation design, this embodiment constructs a target calculation strategy based on the thermal diffusion characteristics and / or heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component. This strategy can be used to inversely calculate the second target data of the heat-generating component based on the first target data of the heat-dissipating component in a target state. Furthermore, based on the first target data of the heat-dissipating component in the target state, the second target data of the heat-generating component is determined through the target calculation strategy, thereby improving the accuracy of the inverted second target data of the heat-generating component and providing higher reference value for heat dissipation design.

[0074] In an optional embodiment, the first target data of the heat dissipation component in the target state can also characterize the position information of each position in the first region of the heat dissipation component, and the second target data of the heat-generating component can also characterize the position information of each position in the second region of the heat-generating component.

[0075] Optionally, based on the first target data, determining the second target data for the heating component through a target calculation strategy can be further implemented as follows: steps “1-1”-“1-3”:

[0076] 1-1. Based on the first target data, determine at least one first target sub-region in the first region that has temperature information and location information.

[0077] The first target sub-region is a sub-region within the first region of the heat dissipation component that possesses both temperature and location information. It may be, but is not limited to, a sub-region within the first region that possesses both temperature and location information and satisfies a preset temperature characteristic. The preset temperature characteristic may be, but is not limited to, being a sub-region whose temperature is higher than the temperatures of its neighboring regions (i.e., its neighborhood), or having a temperature that is among the top_k highest temperatures compared to its surrounding neighboring regions, where k is an integer greater than 1.

[0078] For example, the first target sub-region may be a hotspot sub-region in the first region of the heat dissipation component that has temperature information and location information and whose temperature is higher than that of the surrounding neighboring regions. In this embodiment of the application, the "hotspot sub-region" is simply referred to as "hotspot".

[0079] In one optional implementation, at least one first target sub-region can be identified from the first region based on a set identification rule. For example, in one possible case, the identification rule could be: "If the current local sub-region has temperature information and location information, and the temperature of the current local sub-region is higher than the temperature of the neighboring region, then the current local sub-region is identified as a hot spot." Based on this identification rule, at least one hot spot that conforms to the rule can be automatically identified from the first region of the heat dissipation component.

[0080] However, this is not the only approach. In other implementations, the user can also specify at least one first target sub-region in the temperature field cloud map of the first region of the heat dissipation component by selecting an area. For example, at least one hot spot can be selected from the temperature field cloud map by selecting an area. The RGB (Red-Green-Blue) color of the hot spot in the temperature field cloud map is usually red or other warm colors, and the darker these colors (such as deep red) indicate a higher temperature. Based on this, the user can select at least one hot spot as at least one target sub-region according to the RGB color characteristics of each position in the temperature field cloud map of the first region of the heat dissipation component.

[0081] 1-2. Based on the temperature and location information of the first target sub-region, the temperature and location information of the second target sub-region corresponding to the first target sub-region on the heating component are determined by the target calculation strategy.

[0082] The first target sub-region in the first region of the heat dissipation component can have a corresponding second target sub-region in the second region of the heat-generating component. The temperature of the first target sub-region in the first region of the heat dissipation component is formed by the transfer of heat from the second target sub-region in the second region of the heat-generating component to the first target sub-region.

[0083] The second target sub-region may be, but is not limited to, the local highest temperature sub-region in the second region of the heating component, that is, it may be, but is not limited to, the hot spot in the second region.

[0084] The number of second target sub-regions in the second region of the heating component can also be one or more, without limitation, depending on the actual application.

[0085] After identifying at least one first target sub-region within the first region of the heat dissipation component, this embodiment first uses the target calculation strategy to inversely calculate the temperature and location information of the corresponding second target sub-region on the heat dissipation component based on the temperature and location information of the first target sub-region. For example, based on the hotspot temperature and location information in the first region of the heat dissipation component, the target calculation strategy can be used to inversely calculate the hotspot temperature and location information in the second region of the heat dissipation component.

[0086] 1-3. Based on the temperature and location information of the second target sub-region, determine the temperature information of other locations outside the second target sub-region in the second region of the heating component.

[0087] Manufacturers of heat-generating components such as CPU chips typically provide heat source simulation images of the heat-generating components. These heat source simulation images are usually presented as temperature field cloud maps. However, these temperature field cloud maps lack temperature data of the heat-generating components and only contain visual RGB color information of different locations obtained from the simulation of temperature distribution at different locations in the second region of the heat-generating components.

[0088] There is a certain correlation between the pixel color in the temperature field cloud map and the temperature of the location represented by that pixel (such as a certain location in the second region of the heating component). For example, low temperature is usually represented by cool color effects such as blue and white, while high temperature is usually represented by warm color effects such as red and yellow. Based on this, in an optional embodiment, the color difference between other locations in the second region of the heating component other than the second target sub-region and the corresponding RGB colors of the second target sub-region in the temperature field cloud map can be determined according to the RGB color information of different locations in the temperature field cloud map of the heating component. Based on the color difference and the temperature information of the second target sub-region, the temperature information of other locations in the second region other than the second target sub-region can be estimated, so that the temperature information of each location in the second region can be obtained, and the second target data of the second region of the heating component can be obtained accordingly.

[0089] For example, based on the RGB color information at different locations in the temperature field cloud map of the heating component, the color difference between the non-hot sub-regions and hot sub-regions in the second region of the heating component can be determined in the temperature field cloud map. Based on the color difference and the temperature information of the hot sub-regions, the temperature information of the non-hot sub-regions in the second region of the heating component can be estimated, thereby finally obtaining the second target data of the heating component formed by the temperature information of the hot and non-hot sub-regions in the second region.

[0090] However, not limited to the above-described embodiments, in other embodiments, the temperature change characteristics (such as temperature change trends) between other locations in the first region of the heat dissipation component and the first target sub-region can be determined based on the temperature information of each location in the first region of the heat dissipation component. Based on the temperature change characteristics and the temperature information of the second target sub-region in the second region of the heat dissipation component, the temperature information of other locations in the second region other than the second target sub-region can be estimated.

[0091] For example, the temperature change trend between the non-hot spot sub-region and the hot spot sub-region in the first region of the heat dissipation component can be determined based on the temperature information of each location in the first region of the heat dissipation component. Based on the temperature change trend and the temperature information of the hot spot sub-region in the second region of the heat dissipation component, the temperature information of the non-hot spot sub-region in the second region of the heat dissipation component can be estimated, thereby finally obtaining the second target data of the heat dissipation component formed by the temperature information of the hot spot sub-region and the non-hot spot sub-region in the second region.

[0092] To address the shortcomings of traditional technologies, such as the lack of temperature data for heat-generating components like chips, which affects the accuracy of heat dissipation design and increases time and cost, this embodiment can perform inversion only on a portion of the second region of the heat-generating component (i.e., the second target sub-region, such as a hot spot). By combining the relevant difference information between this portion of the sub-region and other sub-regions (such as color difference information in the temperature field cloud map), the temperature information of other sub-regions can be determined in batches. This avoids the need to invert the temperature information of all locations in the second region of the heat-generating component one by one, thereby further improving the efficiency of determining the temperature information of each location in the second region of the heat-generating component, while further reducing time and cost.

[0093] In an optional embodiment, based on the temperature and location information of the first target sub-region, the temperature and location information of the second target sub-region corresponding to the first target sub-region on the heating component are determined through the target calculation strategy, which can be implemented as follows: steps "2-1"-"2-2":

[0094] 2-1. Based on the temperature information of the first target sub-region, the temperature information of the second target sub-region is determined through a first calculation strategy.

[0095] The first calculation strategy can be determined based on the heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component.

[0096] Based on the heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component, a first conversion formula can be designed to convert the temperature information of the first target sub-region to the temperature information of the second target sub-region. This first conversion formula can be used as the first calculation strategy to calculate the temperature information of the second target sub-region based on the temperature information of the first target sub-region.

[0097] Optionally, the first conversion formula may include a first increment, and the values ​​of the first increment, the temperature information of the first target sub-region, and the temperature information of the second target sub-region corresponding to the first target sub-region on the heat-generating component conform to the heat flow conservation characteristics during the process of heat transfer from the heat-generating component to the heat-dissipating component.

[0098] For example, the first conversion formula can be expressed as:

[0099] Th = Tc + incr1.

[0100] Where Tc represents the temperature information of the first target sub-region, such as the hot spot temperature in the first region of the heat dissipation component, incr1 represents the first increment, and Th represents the temperature information of the second target sub-region corresponding to the first target sub-region on the heat-generating component, such as the temperature of the hot spot corresponding to the hot spot in the first region of the heat dissipation component on the second region of the heat-generating component.

[0101] Based on this, optionally, in this step, a first increment can be determined first. The determination of the first increment, along with the temperature information of the first target sub-region and the temperature information of the corresponding second target sub-region on the heating component, is sufficient if they conform to the heat flow conservation characteristics during the heat transfer process from the heating component to the heat dissipation component. Then, based on the temperature information of the first target sub-region and the first increment, the temperature information of the corresponding second target sub-region on the heating component can be determined.

[0102] 2-2. Based on the first size of the first target sub-region, the second size of the second target sub-region is determined by the second calculation strategy.

[0103] The location information of the first target sub-region includes the first size, and the location information of the second target sub-region includes the second size.

[0104] The first dimension may include, but is not limited to, the radius, area, or perimeter of the first target sub-region, and the second dimension may include, but is not limited to, the radius, area, or perimeter of the second target sub-region corresponding to the first target sub-region in the second region of the heating component.

[0105] The second calculation strategy can be based on the thermal diffusion characteristics during the process of heat transfer from the heat-generating component to the heat-dissipating component.

[0106] Among them, but not limited to, a second conversion formula for the radius of the first target sub-region to the radius of the second target sub-region can be designed based on the thermal diffusion characteristics during the process of heat transfer from the heat-generating component to the heat-dissipating component.

[0107] The second calculation strategy includes the second conversion formula.

[0108] Furthermore, optionally, the second conversion formula may include a second increment, the values ​​of the second increment, the radius of the first target sub-region, and the radius of the second target sub-region corresponding to the first target sub-region in the second region of the heating component, which conform to the thermal diffusion characteristics during the process of heat transfer from the heating component to the heat dissipation component.

[0109] For example, the second conversion formula can be expressed as:

[0110] Rh = Rc - incr2.

[0111] Where Rc represents the radius of the first target sub-region, such as the radius of the hot spot in the first region of the heat dissipation component, incr2 represents the second increment, and Rh represents the radius of the second target sub-region corresponding to the first target sub-region in the second region of the heat dissipation component, such as the radius of the hot spot corresponding to the hot spot in the first region of the heat dissipation component in the second region of the heat dissipation component.

[0112] Based on this, optionally, in step 2-2, the second increment can be determined first, provided that the determined second increment, the radius of the first target sub-region, and the radius of the second target sub-region corresponding to the first target sub-region in the second region of the heating component conform to the thermal diffusion characteristics during the heat transfer process from the heating component to the heat dissipation component. Based on this, the radius of the second target sub-region can be determined based on the radius of the first target sub-region and the second increment, and then the area of ​​the second target sub-region can be determined based on the radius of the second target sub-region.

[0113] This embodiment is based on the thermal diffusion characteristics and heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component. It realizes the inversion of the temperature and location information of the corresponding second target sub-region on the heat-generating component based on the temperature and location information of the first target sub-region. This allows for the acquisition of reliable temperature and location information of the second target sub-region, thereby providing a reliable basis for determining the temperature of other sub-regions (such as non-hot spot sub-regions) in the second region of the heat-generating component. This facilitates the acquisition of accurate temperature information at each location in the second region of the heat-generating component, thus providing better assistance for heat dissipation design.

[0114] In an alternative embodiment, determining the first increment can be implemented as any one of the following "3-1"-"3-3":

[0115] 3-1. The first increment is determined based on the thermal resistance of the target material in the heat dissipation component and the heat dissipation power per unit area of ​​the heat dissipation component; the target material is used to fill the gap between the heat dissipation component and the heat-generating component.

[0116] The target material can be, but is not limited to, silicone grease, graphite, etc.

[0117] In this embodiment 3-1, optionally, based on the heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component, the first increment can be determined as the product of the thermal resistance of the target material and the heat dissipation power per unit area of ​​the heat-dissipating component, i.e. .

[0118] The first transformation formula Th=Tc+incr1 above can be transformed into:

[0119] .

[0120] Where Qc represents the heat dissipation power per unit area of ​​the heat dissipation component, and Rgrease represents the thermal resistance of the target material in the heat dissipation component, such as the thermal resistance of silicone grease.

[0121] Optionally, the entire heat dissipation component can be regarded as a cooling system that dissipates heat from the heat-generating component, and based on the premise of heat flow conservation, the heat dissipation power Qc per unit area of ​​the heat dissipation component can be calculated using the current TDP (Thermal Design Power) of the heat-generating component.

[0122] An example formula for calculating Qc is as follows: Qc = Htdp / s.

[0123] Where Htdp represents the current TDP of the heat-generating component, and s represents the area of ​​the contact surface between the heat-generating component and the heat-generating component.

[0124] The thermal resistance of target materials such as thermal grease can be provided by the heat dissipation component manufacturer or determined based on the material type of the target material.

[0125] 3-2. Determine the first increment based on one of the thermal resistance of the target material and the heat dissipation power per unit area of ​​the heat dissipation component.

[0126] In this embodiment 3-2, optionally, the first increment can be determined as the product of the thermal resistance of the target material and the first parameter, based on the heat flow conservation characteristics during the heat transfer process from the heat-generating component to the heat-dissipating component, or the first increment can be determined as the product of the second parameter and the heat dissipation power per unit area of ​​the heat-dissipating component.

[0127] The values ​​of the first and second parameters can be determined based on the model, size / specification and / or operating parameters of the heat dissipation component and can be combined with experiments. As long as the determined values ​​of the first and second parameters are such that the values ​​of the first increment and the temperature information of the first target sub-region and the temperature information of the second target sub-region corresponding to the first target sub-region on the heat dissipation component conform to the heat flow conservation characteristics during the heat transfer process from the heat dissipation component to the heat dissipation component.

[0128] 3-3. Based on the attribute information of the heat dissipation component and the first mapping relationship information, determine the first increment; the first mapping relationship information includes the mapping relationship between different attribute information of different heat dissipation components and different first increments.

[0129] In this embodiment 3-3, a mapping relationship between different attribute information of different heat dissipation components and different first increments can be established in advance based on the attributes of different heat dissipation components and in combination with experiments, thereby forming the first mapping relationship information.

[0130] Based on this, the attribute information of the current heat dissipation component can be used to query the first mapping relationship information to obtain the first increment corresponding to the current heat dissipation component. Subsequently, the temperature information of the second target sub-region corresponding to the first target sub-region on the heat-generating component can be determined based on the temperature information of the first target sub-region and the queried first increment.

[0131] The attribute information of heat dissipation components may include, but is not limited to, the model, size / specification and / or operating parameters of the heat dissipation components.

[0132] This embodiment can obtain an accurate and reliable first increment based on any of the provided implementation methods, thereby ensuring the accurate inversion of the temperature information of the second target sub-region in the second region of the heating component, and facilitating the final obtaining of accurate and reliable temperature field data of the second region of the heating component.

[0133] In an alternative embodiment, determining the second increment can be implemented as any one of the following implementations "4-1"-"4-3":

[0134] 4-1. The second increment is determined based on the thickness and thermal diffusion angle of the target material in the heat dissipation component; the target material is used to fill the gap between the heat dissipation component and the heat generation component.

[0135] As mentioned above, the target material can be, but is not limited to, silicone grease, graphite, etc.

[0136] In this embodiment 4-1, optionally, based on a thermal diffusion model of the heat transfer process from the heat-generating component to the heat-dissipating component, the second increment can be determined as the product between the thickness of the target material and the tangent of the thermal diffusion angle of the target material, i.e. .

[0137] See Figure 2 The second conversion formula Rh=Rc-incr2 mentioned above can be transformed into:

[0138] .

[0139] The area of ​​the second target sub-region can be represented as follows:

[0140] .

[0141] Wherein, dgrease represents the thickness of the target material in the heat dissipation component, such as the thickness of the thermal grease layer in the heat dissipation component. This information can be provided by the heat dissipation component manufacturer or determined based on the heat dissipation component model, size / specification, etc.; θ represents the thermal diffusion angle of the target material in the heat dissipation component, such as the thermal diffusion angle of the thermal grease.

[0142] Optionally, the thermal diffusivity of the target material, such as silicone grease, can be calculated using the following formula:

[0143] θ = k / (ρc).

[0144] Where k, ρ, and c represent the thermal conductivity, density, and specific heat capacity of the target material such as silicone grease, respectively.

[0145] 4-2. Determine the second increment based on one of the thickness of the target material and the thermal diffusion angle.

[0146] In this embodiment 4-2, optionally, the second increment can be determined as the product of the thickness of the target material in the heat dissipation component and the third parameter based on the thermal diffusion characteristics during the process of heat transfer from the heat-generating component to the heat dissipation component, or the second increment can be determined as the product of the fourth parameter and the tangent of the thermal diffusion angle of the target material in the heat dissipation component.

[0147] The values ​​of the third and fourth parameters can be determined based on the model, size / specification and / or operating parameters of the heat dissipation component, and can be combined with experiments. As long as the determined values ​​of the third and fourth parameters are such that the values ​​of the second increment and the radius of the first target sub-region and the radius of the second target sub-region corresponding to the first target sub-region on the heat-generating component conform to the thermal diffusion characteristics during the heat transfer process from the heat-generating component to the heat dissipation component.

[0148] 4-3. Based on the attribute information of the heat dissipation component and the second mapping relationship information, determine the second increment; the second mapping relationship information includes the mapping relationship between different attribute information of different heat dissipation components and different second increments.

[0149] In this embodiment 4-3, a mapping relationship between different attribute information of different heat dissipation components and different second increments can be established in advance based on the attributes of different heat dissipation components and in combination with experiments, thereby forming the second mapping relationship information.

[0150] Based on this, the attribute information of the current heat dissipation component can be used to query the second mapping relationship information to obtain the second increment corresponding to the current heat dissipation component. Subsequently, based on the radius of the first target sub-region and the queried second increment, the radius of the second target sub-region corresponding to the first target sub-region in the second region of the heat-generating component can be determined, and then the area of ​​the second target sub-region can be determined based on the radius of the second target sub-region. For example, based on the radius of the hot spot in the first region of the heat dissipation component and the queried second increment, the radius of the hot spot in the first region of the heat dissipation component corresponding to the hot spot in the second region of the heat-generating component can be determined, and then the area of ​​the hot spot in the second region of the heat-generating component can be determined based on the radius of the hot spot in the second region of the heat-generating component.

[0151] In this embodiment, the attribute information of the heat dissipation component may also include, but is not limited to, the model, size / specification and / or operating parameters of the heat dissipation component.

[0152] This embodiment can obtain an accurate and reliable second increment based on any of the provided implementation methods, thereby ensuring the accurate inversion of the area of ​​the second target sub-region of the second region of the heating component, and facilitating the final obtaining of accurate and reliable temperature field data of the second region of the heating component.

[0153] In an optional embodiment, based on the temperature and location information of the second target sub-region, the temperature information of other locations outside the second target sub-region in the second region of the heating component is determined, which can be implemented as one of the following embodiments "5-1"-"5-2":

[0154] 5-1. If there is only one second target sub-region, the temperature information of the other locations is determined based on the temperature information of the second target sub-region and the relative positional relationship between the other locations and the second target sub-region.

[0155] In one optional embodiment, the color difference between other locations outside the second target sub-region in the second region of the heating component and the corresponding RGB colors of the second target sub-region in the temperature field cloud map (lacking temperature data) can be determined based on the RGB color information of different locations in the temperature field cloud map. Based on the color difference and the temperature information of the second target sub-region, the temperature information of other locations outside the second target sub-region in the second region can be estimated to finally obtain the temperature information of each location in the second region, and thus obtain the second target data of the second region of the heating component.

[0156] In other embodiments, the temperature change characteristics (such as temperature change trends) between other locations outside the first target sub-region in the first region of the heat dissipation component and the first target sub-region can be determined based on the temperature information of each location in the first region of the heat dissipation component. The temperature information of other locations outside the second target sub-region can be estimated based on the temperature change characteristics and the temperature information of a second target sub-region in the second region of the heat dissipation component.

[0157] 5-2. If there is more than one second target sub-region, the temperature information of each second target sub-region is superimposed based on the center position and size of each second target sub-region to obtain the superimposed temperature information of each second target sub-region; the temperature information of the other positions is determined based on the superimposed temperature information of each second target sub-region and the relative positional relationship between the other positions and each second target sub-region.

[0158] When there is more than one second target sub-region, optionally, the temperature information of each second target sub-region can be superimposed based on the center position and size of each second target sub-region. This includes, but is not limited to, determining whether there is an overlapping part between different second target sub-regions based on the center position and size (such as area) of each second target sub-region. If there is an overlapping part, the temperature of the same position (such as the same pixel) of different second target sub-regions in the overlapping part can be accumulated, and the accumulated value can be used as the temperature at the same position in the overlapping part, thereby obtaining the temperature information of each second target sub-region after superposition.

[0159] See Figure 3 This provides an example of performing temperature overlay processing on two second target sub-regions with overlapping areas based on their location. The x-axis represents location, and the y-axis represents temperature.

[0160] See Figure 4Examples of the provided second target sub-region (such as a hot spot) and its center position: The center position of the second target sub-region, such as the center position of the hot spot on the second region of the heating component, can be directly marked by the user in the temperature field cloud map of the second region of the heating component. For example, the darkest point in the local red area (representing the local highest temperature sub-region) in the temperature field cloud map can be marked as the center position of the hot spot; or, the center position of the second target sub-region, such as the hot spot, in the temperature field cloud map can be automatically identified based on pre-set recognition rules (such as the color features to be satisfied); or, the center position of the first target sub-region (such as a hot spot) in the first region of the heat dissipation component can be estimated based on the center position of the first target sub-region (such as a hot spot) in the first region of the heat dissipation component, combined with the heat diffusion material between the heating component and the heat dissipation component, the heat diffusion direction, etc.

[0161] After obtaining the temperature information of each superimposed second target sub-region, optionally, the color difference between other locations outside each second target sub-region in the second region of the heating component and the corresponding RGB colors of each second target sub-region in the temperature field cloud map can be determined based on the RGB color information of different locations in the temperature field cloud map of the heating component. The temperature information of other locations outside each second target sub-region in the second region can be estimated based on the color difference and the temperature information of each superimposed second target sub-region.

[0162] When estimating the temperature information at other locations, optionally, the temperature at corresponding other locations between different second target sub-regions can be estimated by using a method of uniform temperature transition between different second target sub-regions.

[0163] Based on this embodiment, the temperature information of other areas outside the second target sub-region in the second region of the heat-generating component can be accurately and reliably determined, thereby obtaining accurate and reliable temperature information of the entire second region of the heat-generating component. This can provide better assistance for heat dissipation design, and compared with the traditional technology that requires experimental correction of the design in the later stages, it also reduces time and cost consumption.

[0164] In an optional embodiment, before determining the color difference between other locations outside the second target sub-region in the second region of the heating component and the corresponding RGB colors of the second target sub-region in the temperature field cloud map based on the RGB color information of different locations in the temperature field cloud map of the heating component, optionally, preprocessing can be performed on the temperature field cloud map. The preprocessing is used to improve the contrast of the temperature field cloud map, such as... Figure 5 Example provided.

[0165] Subsequently, based on the temperature field cloud map after the contrast is improved, the color difference between other locations in the second region of the heating component other than the second target sub-region and the corresponding RGB color of the second target sub-region in the temperature field cloud map can be determined. Based on this color difference and the temperature of the second target sub-region, the temperature of other locations in the second region of the heating component other than the second target sub-region can be determined.

[0166] After retrieving the temperature information of the second region of the heat-generating component from the temperature information of the first region of the heat dissipation component, a mapping relationship can be established between each location in the temperature field cloud map of the second region of the heat-generating component and its corresponding temperature information. This yields a temperature field cloud map carrying temperature data for the second region of the heat-generating component. The contrast of this temperature field cloud map can be reduced to restore it to its original style before preprocessing. See also... Figure 6 This provides an example of inverting the temperature field cloud map of the first region of the heat dissipation component to obtain the temperature field cloud map of the second region of the heat dissipation component, and restoring it to the style of the original image before preprocessing.

[0167] This embodiment improves the temperature field cloud map of the heat-generating component by preprocessing, which helps to identify subtle color differences in the temperature field cloud map. This helps to more accurately determine the temperature information of other locations outside the second target sub-region in the second region of the heat-generating component, thus providing a more accurate overall temperature information of the second region of the heat-generating component and thus providing higher reference value for heat dissipation design.

[0168] This application also discloses a processing device, the composition and structure of which are as follows: Figure 7 As shown, it includes at least:

[0169] Memory 10 is used to store the computer instruction set;

[0170] Computer instruction sets can be implemented in the form of computer programs.

[0171] Processor 20 is configured to implement the processing method provided in any of the above method embodiments by executing a set of computer instructions in the memory.

[0172] The processor 20 can be a central processing unit (CPU), a graphics processor, an application-specific integrated circuit (ASIC), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a neural network processor (NPU), a deep learning processor (DPU), or other programmable logic devices.

[0173] Optionally, the processing device may also include storage resources such as memory and cache.

[0174] Optionally, the processing device may also include a camera assembly, and / or an external camera assembly connected thereto.

[0175] In addition, the processing device may also include components such as a communication interface and a communication bus. The memory, processor, and communication interface communicate with each other through the communication bus.

[0176] The communication interface is used to handle communication between the device and other devices. The communication bus can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc., and can be divided into address bus, data bus, control bus, etc.

[0177] This application also discloses a storage medium carrying one or more computer instruction sets, which, when executed by a processing device, enable the processing device to implement the processing method described in any of the above method embodiments.

[0178] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0179] For ease of description, the above systems or devices are described separately as various modules or units based on their functions. Of course, in implementing this application, the functions of each unit can be implemented in one or more software and / or hardware components.

[0180] As can be seen from the above description of the embodiments, those skilled in the art can clearly understand that this application can be implemented by means of software plus necessary general-purpose hardware platforms. Based on this understanding, the technical solution of this application, in essence or the part that makes a creative contribution, can be embodied in the form of a software product. This computer software product can be stored in a storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in various embodiments or some parts of the embodiments of this application.

[0181] Finally, it should be noted that in this document, relational terms such as first, second, third, and fourth are used to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0182] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A processing method, comprising: obtaining first target data of a heat-dissipating component in a target state, the first target data representing temperature information of a first region of the heat-dissipating component, the target state representing a state of heat dissipation of the heat-dissipating component to a heat-generating component; determining second target data of the heat-generating component based on the first target data, the second target data representing temperature information of a second region of the heat-generating component. 2.The processing method of claim 1, wherein determining the second target data of the heat-generating component based on the first target data comprises: determining the second target data of the heat-generating component based on the first target data by a target calculation strategy; wherein the target calculation strategy is based on heat diffusion characteristics and / or heat flow conservation characteristics in a process of heat transfer from the heat-generating component to the heat-dissipating component. 3.The processing method of claim 2, wherein the first target data further represents position information of each position in the first region of the heat-dissipating component, and the second target data further represents position information of each position in the second region of the heat-generating component; determining the second target data of the heat-generating component based on the first target data by the target calculation strategy comprises: determining at least one first target sub-region in the first region with temperature information and position information based on the first target data; determining temperature information and position information of a second target sub-region on the heat-generating component corresponding to the first target sub-region based on the temperature information and position information of the first target sub-region by the target calculation strategy; determining temperature information of other positions in the second region of the heat-generating component except the second target sub-region based on the temperature information and position information of the second target sub-region. 4.The processing method of claim 3, wherein determining temperature information and position information of the second target sub-region on the heat-generating component corresponding to the first target sub-region based on the temperature information and position information of the first target sub-region by the target calculation strategy comprises: determining temperature information of the second target sub-region based on temperature information of the first target sub-region by a first calculation strategy; determining a second size of the second target sub-region based on a first size of the first target sub-region by a second calculation strategy; wherein the first calculation strategy is based on heat flow conservation characteristics in the process of heat transfer from the heat-generating component to the heat-dissipating component, and the second calculation strategy is based on heat diffusion characteristics in the process of heat transfer from the heat-generating component to the heat-dissipating component; the position information of the first target sub-region comprises the first size, and the position information of the second target sub-region comprises the second size. 5.The processing method of claim 4, wherein determining temperature information of the second target sub-region based on temperature information of the first target sub-region by the first calculation strategy comprises: determining a first increment; determining temperature information of the second target sub-region according to the temperature information of the first target sub-region and the first increment. The values of the first increment, the temperature information of the first target sub-region, and the temperature information of the second target sub-region conform to heat flow conservation characteristics in the process of heat transfer from the heat generating component to the heat dissipating component.

6. The processing method of claim 5, wherein determining the first increment comprises one of the following: determining the first increment based on a thermal resistance of a target material in the heat dissipating component and a heat dissipation power per unit area of the heat dissipating component, the target material being used to fill a gap between the heat dissipating component and the heat generating component; determining the first increment based on one of the thermal resistance of the target material and the heat dissipation power per unit area of the heat dissipating component; determining the first increment based on attribute information of the heat dissipating component and first mapping relationship information, the first mapping relationship information comprising a mapping relationship between different attribute information of different heat dissipating components and different first increments.

7. The processing method of claim 4, wherein determining the second size of the second target sub-region based on the first size of the first target sub-region by using a second calculation strategy comprises: determining a second increment; determining a radius of the second target sub-region based on the radius of the first target sub-region and the second increment; determining an area of the second target sub-region based on the radius of the second target sub-region, the values of the second increment, the radius of the first target sub-region, and the radius of the second target sub-region conforming to heat diffusion characteristics in the process of heat transfer from the heat generating component to the heat dissipating component.

8. The processing method of claim 7, wherein determining the second increment comprises one of the following: determining the second increment based on a thickness of a target material in the heat dissipating component and a heat diffusion angle, the target material being used to fill a gap between the heat dissipating component and the heat generating component; determining the second increment based on one of the thickness of the target material and the heat diffusion angle; determining the second increment based on attribute information of the heat dissipating component and second mapping relationship information, the second mapping relationship information comprising a mapping relationship between different attribute information of different heat dissipating components and different second increments.

9. The processing method of claim 3, wherein determining temperature information of other positions in the second region of the heat generating component except for the second target sub-region based on the temperature information and position information of the second target sub-region comprises: if the second target sub-region is one, determining the temperature information of the other positions based on the temperature information of the second target sub-region and relative position relationships between the other positions and the second target sub-region; if the second target sub-region is more than one, superimposing temperature information of each second target sub-region to obtain superimposed temperature information of each second target sub-region based on respective center positions and sizes of each second target sub-region, and determining the temperature information of the other positions based on the superimposed temperature information of each second target sub-region and relative position relationships between the other positions and each second target sub-region.

10. A processing apparatus, comprising: a memory configured to store at least a set of computer instructions; A processor is configured to implement the following processes by executing the set of instructions stored in the memory: obtaining first target data of the heat dissipation component in a target state, the first target data representing temperature information of a first region of the heat dissipation component, the target state representing a state of heat dissipation of the heat dissipation component to the heat generating component; determining second target data of the heat generating component based on the first target data, the second target data representing temperature information of a second region of the heat generating component.

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