Filtering device and vehicle-mounted electric control power generation system

Abstract

The invention relates to the technical field of new energy automobile electronics, in particular to a filtering device and a vehicle-mounted electric control power generation system. The filtering device comprises a DC-link integrated part, a positive electrode power supply access and a negative electrode power supply access. The DC-link integrated part comprises a shell, a heat dissipation structure and a DC-link capacitor, wherein the heat dissipation structure and the DC-link capacitor are arranged in the shell. A first filtering unit, a common mode inductor, a second filtering unit and a DC-link capacitor are sequentially bridged between the positive electrode power supply access and the negative electrode power supply access; the first filtering unit, the common-mode inductor and the second filtering unit are all integrated in the shell and are coupled with the heat dissipation structure, and the second filtering unit comprises a pair of first common-mode capacitors, a pair of second common-mode capacitors and a first differential-mode capacitor which are sequentially arranged along the positive electrode power supply path; wherein the first common-mode capacitor is electrically connected to the positive power supply circuit and grounded, the second common-mode capacitor is electrically connected to the negative power supply circuit and grounded, the first differential-mode capacitor and the DC-link capacitor are arranged in parallel, one end of the first differential-mode capacitor is electrically connected to the positive power supply circuit, and the other end of the first differential-mode capacitor is electrically connected to the negative power supply circuit.

Description

Technical Field

[0001] This invention relates to the field of new energy vehicle electronic technology, and in particular to a filter device and an on-board electronic control power generation system. Background Technology

[0002] In new energy vehicle products, the design of the power generation system, especially the internal filtering scheme, is particularly important. It directly affects the stability and reliability of various complex signal transmission systems in the vehicle and plays a crucial role in the high-speed and stable operation of the entire vehicle under extreme road conditions.

[0003] During operation, the power transistors of the high-voltage inverter module in a new energy vehicle's power generation system switch at high frequencies, reaching thousands or even tens of thousands of hertz. These high-frequency switching moments generate significant dv / dt values, resulting in substantial harmonics and electromagnetic interference (EMI). This EMI radiates outwards from the interference source in the form of spherical waves. During this period, the motor's distributed capacitance is the primary conduction path for the interference, while the heat sink or metal casing serves as a secondary path. The interference originates from the high-speed switching power devices and ultimately returns to the interference source itself.

[0004] If these interferences are not properly handled, they can seriously affect the safe and stable operation of the entire electrical system, such as reducing power quality, increasing system losses, and even damaging electrical equipment. Therefore, the filtering solutions of products play a crucial role in the power generation systems of new energy vehicles.

[0005] Currently, the most widely used solution in the industry is the passive LC (inductor-capacitor) filter. Its principle is to utilize the impedance characteristics of inductors and capacitors to signals of different frequencies, forming low-pass, high-pass, or band-pass networks to attenuate interference signals in specific frequency bands (especially high-frequency harmonics generated by switching devices), thus meeting EMC standard requirements.

[0006] However, in the harsh and space-constrained automotive application environment, traditional passive LC filter designs face the following key challenges: 1. Traditional single-stage or multi-stage passive LC filter designs are usually optimized for specific fundamental and harmonic frequencies. However, the operating conditions of on-board electronic control and power generation systems (especially drive motor controllers) are complex and variable. The switching frequency of power switching devices will be dynamically adjusted according to actual operating conditions (such as torque demand and speed). Using LC filters with fixed parameters makes it difficult to maintain the best broadband filtering effect under all operating conditions, which may lead to a decrease in filtering efficiency at certain frequency points.

[0007] 2. Filters generate a significant amount of heat during operation due to their own losses. However, traditional filter solutions typically lack integrated, efficient heat dissipation designs, making it difficult to guarantee stable performance and long-term reliability in the high-temperature, high-power-density environment inside automotive electronic control units.

[0008] 3. To manage the heat generated by the filters, traditional designs often require additional cooling solutions. For example, adding dedicated heat sinks and fans to the filter unit, or reserving independent liquid cooling channels. These measures not only significantly increase the bill of materials (BOM) cost, system weight, and physical volume, but also increase the system's assembly complexity. This runs counter to the automotive industry's pursuit of miniaturized, lightweight, and cost-effective components.

[0009] In view of this, the industry urgently needs an innovative filtering solution that can not only provide excellent wideband EMI suppression capabilities, but also solve the heat dissipation problem in a cost-effective and space-efficient integrated manner. Summary of the Invention

[0010] To address the aforementioned problems, this application provides a filtering device and an on-board electronically controlled power generation system.

[0011] Firstly, this application provides a filtering device, which adopts the following scheme: A filtering device for an on-board electronically controlled power generation system, comprising: The DC-link integrated component includes a housing, a heat dissipation structure disposed within the housing, and a DC-link capacitor; A positive power supply path and a negative power supply path are connected in sequence between the positive power supply path and the negative power supply path, including a first filter unit, a common mode inductor, a second filter unit, and the DC-link capacitor. The first filter unit, the common-mode inductor, and the second filter unit are all integrated within the housing and coupled to the heat dissipation structure. The second filter unit includes a pair of first common-mode capacitors, a pair of second common-mode capacitors, and a first differential-mode capacitor arranged sequentially along the positive power supply path. The first common-mode capacitor is electrically connected to the positive power supply path and grounded, the second common-mode capacitor is electrically connected to the negative power supply path and grounded, and the first differential-mode capacitor is connected in parallel with the DC-link capacitor, with one end electrically connected to the positive power supply path and the other end electrically connected to the negative power supply path.

[0012] Furthermore, the capacitance values ​​of the pair of first common-mode capacitors and the pair of second common-mode capacitors are both set to decrease gradually along the positive power supply path direction.

[0013] Furthermore, along the positive power supply path, the capacitance values ​​of the first first common-mode capacitor and the first second common-mode capacitor are set to 1-10nF, and the capacitance values ​​of the second first common-mode capacitor and the second second common-mode capacitor are set to 100-500nF.

[0014] Furthermore, it also includes a first circuit board and a second circuit board that are electrically connected in sequence. The first circuit board integrates the first filter unit, and the second circuit board integrates the second filter unit and the DC-link capacitor. The heat dissipation structure includes a heat dissipation channel and a heat sink. The heat dissipation channel is disposed between the first circuit board and the second circuit board. The heat sink connects the housing and the second circuit board to dissipate heat from the housing.

[0015] Furthermore, the capacitance of the first differential mode capacitor is set to 100–500 nF.

[0016] Furthermore, the first filtering unit includes a third common-mode capacitor, a fourth common-mode capacitor, and a second differential-mode capacitor arranged sequentially along the positive power supply path. One end of the third common-mode capacitor is electrically connected to the positive power supply path, and the other end is grounded. The fourth common-mode capacitor is connected in parallel with the first common-differential-mode capacitor, with one end electrically connected to the negative power supply path and the other end grounded. The second differential capacitor is connected between the positive power supply path and the negative power supply path.

[0017] Furthermore, the capacitance values ​​of the third common-mode capacitor and the fourth common-mode capacitor are both set to 1-10nF, and the capacitance value of the second differential-mode capacitor is set to 10-100nF.

[0018] Furthermore, the capacitance of the DC-link capacitor is set to 200–500 nF.

[0019] Furthermore, the common-mode inductor is made of nickel-zinc amorphous alloy core material, and its inductance at 100kHz is set to 30-100μH.

[0020] Secondly, this application provides an on-board electronically controlled power generation system, including the aforementioned filtering device.

[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. High integration and space optimization: Integrating the two-stage filter unit into the housing of the DC-link integrated component greatly saves the internal space of the electronic control unit, which helps to achieve higher power density and more compact product design.

[0022] 2. Reduced costs and simplified assembly: By sharing the heat dissipation structure with the DC-link integrated components, the need to configure a dedicated heat sink or liquid cooling channel for the filter unit is eliminated, which significantly reduces material costs, weight and assembly complexity.

[0023] 3. Improved heat dissipation efficiency and reliability: By utilizing the powerful thermal management system of the DC-link integrated components, the heat generated by the filter components under high load is ensured to be efficiently dissipated and kept within the safe operating temperature range, thereby improving the stability of the filter performance and the long-term operational reliability of the components.

[0024] 4. Excellent filtering performance: Through a two-stage cascaded filtering design, especially the gradient configuration of the common-mode capacitor and the use of a high-performance common-mode inductor, excellent suppression of wideband common-mode and differential-mode noise is achieved. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a circuit diagram of the filtering device provided in this application.

[0027] Figure 2 This is a graph showing the test results of the high-voltage port using the high-voltage current method at a 50mm depth.

[0028] Figure 3 This is a diagram showing the test results of a rod antenna in a semi-anechoic chamber.

[0029] In the diagram, 100 is the DC-link integrated component; 110 is the DC-link capacitor; 200 is the positive power supply path; 300 is the negative power supply path; 400 is the first filter unit; 410 is the third common-mode capacitor; 420 is the fourth common-mode capacitor; 430 is the second differential-mode capacitor; 500 is the common-mode inductor; 600 is the second filter unit; 610 is the first common-mode capacitor; 620 is the second common-mode capacitor; and 630 is the first differential-mode capacitor. Detailed Implementation

[0030] The technical solution of this application will now be clearly and completely described with reference to the accompanying drawings. The following embodiments are exemplary and are only used to explain this application, and should not be construed as limiting this application. In the following description, the same reference numerals are used to denote the same or equivalent elements, and repeated descriptions are omitted.

[0031] In the description of this application, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this application and to simplify the description, and are not intended to indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0032] Furthermore, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] It should also be further understood that the term “and / or” as used in this application refers to any combination of one or more of the listed items, and all possible combinations thereof.

[0034] Example 1: This embodiment provides a filtering device for an on-board electronically controlled power generation system. (Refer to...) Figure 1 The filtering device includes a DC-link integrated component 100, a positive power supply path 200, a negative power supply path 300, a first filtering unit 400, a common-mode inductor 500, and a second filtering unit 600.

[0035] The DC-link integrated component 100 includes a housing, a heat dissipation structure disposed within the housing, and a DC-link capacitor 110. As a core component of the on-board electronic control power generation system, the DC-link capacitor 110 is used to carry high current and high ripple current to buffer charging and discharging energy, balance the instantaneous power difference between the rectifier and inverter, and ensure stable bus voltage. Simultaneously, the capacitor 110 effectively suppresses high-frequency ripple noise caused by the drive module, such as kHz-MHz level noise caused by PWM switching, and quickly absorbs high-frequency current through its low ESR characteristics, thereby smoothing the bus voltage and improving the overall efficiency and reliability of the system.

[0036] Based on the above characteristics, the DC-link capacitor 110 is also one of the key heat sources inside the housing, and the heat dissipation structure dissipates the heat generated by the DC-link capacitor 110 during operation.

[0037] Furthermore, the capacitance of the DC-link capacitor 110 is set to 200–500 nF.

[0038] For example, the capacitance of the DC-link capacitor 110 is set to 470nF. The DC-link capacitor 110 is a thin film capacitor 110 made of PP material, which has excellent high voltage resistance of up to 1000V and above, low equivalent series resistance (ESR) and long life characteristics, and is suitable for high frequency and high current applications.

[0039] Furthermore, the housing is made of metal, which provides mechanical protection while further shielding against electromagnetic interference (EMI) and isolating the noise effects of internal and external circuits.

[0040] Furthermore, the first filter unit 400, the common-mode inductor 500, and the second filter unit 600 are all integrated within the housing and coupled to the heat dissipation structure. The first filter unit 400, the second filter unit 600, and the DC-link capacitor 110 are sequentially connected across the positive power supply path 200 and the negative power supply path 300.

[0041] In other words, the first filter unit 400, common-mode inductor 500, second filter unit 600, and DC-link capacitor 110 are integrated onto the same circuit, allowing them to share a common heat dissipation strategy. This transforms the two filter units from independently generating heat into part of the DC-link assembly's thermal management system. The heat generated by the filter components, namely the first filter unit 400 and the second filter unit 600, is efficiently dissipated by the existing heat dissipation structure within the DC-link integrated component 100.

[0042] Furthermore, in terms of physical structure, the filtering device includes a first circuit board and a second circuit board that are electrically connected in sequence. The first circuit board integrates the first filtering unit 400, and the second circuit board integrates the second filtering unit 600 and the DC-link capacitor 110. The heat dissipation structure includes a heat dissipation channel and a heat sink. The heat dissipation channel is disposed between the first circuit board and the second circuit board. The heat sink connects the housing and the second circuit board to dissipate heat from the housing.

[0043] This approach greatly saves internal space in the vehicle-mounted electronic power generation system, increases power density, and eliminates the need for additional heat dissipation hardware such as independent radiators or fans for the filter components, significantly reducing BOM costs and assembly complexity.

[0044] For example, the first circuit board and the second circuit board are provided with capacitor 110 potting compound to fix and protect the first filter unit 400, common mode inductor 500, second filter unit 600 and DC-link capacitor 110, enhance mechanical strength and prevent vibration damage. At the same time, the first circuit board and the second circuit board can conduct heat through capacitor 110 potting compound.

[0045] For example, thermal grease is applied between the second circuit board and the heat sink to further optimize heat conduction and ensure temperature control.

[0046] Furthermore, the DC-link integration 100 also includes a current sensor to monitor the DC-Link current in real time, providing feedback to the control system to achieve overcurrent protection and energy management.

[0047] For example, the positive power supply path 200 and the negative power supply path 300 are configured as copper busbars, which are made of high-purity copper material and have a low impedance design to reduce parasitic inductance and reduce voltage spikes generated by switching devices, especially power module components, during high-speed switching.

[0048] Furthermore, referring to Figure 1 The first filter unit 400 includes a third common-mode capacitor 410, a fourth common-mode capacitor 420, and a second differential-mode capacitor 430 arranged sequentially along the positive power supply path 200. One end of the third common-mode capacitor 410 is electrically connected to the positive power supply path 200, and the other end is grounded. The fourth common-mode capacitor 420 is connected in parallel with the first common-mode capacitor 410, and one end is electrically connected to the negative power supply path 300, and the other end is grounded. The second differential-mode capacitor 430 is connected across the positive power supply path 200 and the negative power supply path 300.

[0049] The first filter unit 400 serves as the first line of defense against EMI entering the DC-link integrated component 100. The third common-mode capacitor 410 and the fourth common-mode capacitor 420 of this unit provide an initial low-impedance grounding path for externally introduced high-frequency common-mode interference; the second differential-mode capacitor 430 is used to attenuate differential-mode noise.

[0050] The capacitance values ​​of the third common-mode capacitor 410 and the fourth common-mode capacitor 420 are both set to 1-10nF. That is, the capacitance values ​​of the third common-mode capacitor 410 and the fourth common-mode capacitor 420 are set to decrease in a gradient, so that the third common-mode capacitor 410 suppresses common-mode noise in the high-frequency band, such as >10MHz, and the fourth common-mode capacitor 420 suppresses common-mode noise in the mid-to-high frequency band.

[0051] It should be noted that this embodiment does not limit the specific capacitance values ​​of the third common-mode capacitor 410 and the fourth common-mode capacitor 420, as long as they meet the above range.

[0052] Furthermore, the capacitance of the second differential mode capacitor 430 is set to 10–100 nF to suppress differential mode noise in the mid-to-high frequency range.

[0053] For example, the capacitance of the second differential mode capacitor 430 is set to 47nF, and the second differential mode capacitor 430 is set to a metallized film differential mode capacitor 110.

[0054] like Figure 2 As shown, the common-mode inductor 500 is made of nickel-zinc amorphous alloy magnetic core material, with an initial permeability μi≥60,000, saturation magnetic flux density Bs≈1.2T, and an inductance of 30-100μH at 100kHz.

[0055] For example, the initial permeability of the common-mode inductor 500 is set to 80000, the saturation flux density is set to 1.2T, and the inductance at 100kHz is set to 60μH.

[0056] Furthermore, the second filter unit 600 includes a pair of first common-mode capacitors 610, a pair of second common-mode capacitors 620, and a first differential-mode capacitor 630 arranged sequentially along the positive power supply path 200. The first common-mode capacitor 610 is electrically connected to the positive power supply path 200 and grounded, the second common-mode capacitor 620 is electrically connected to the negative power supply path 300 and grounded, and the first differential-mode capacitor 630 is connected in parallel with the DC-link capacitor 110, with one end electrically connected to the positive power supply path 200 and the other end electrically connected to the negative power supply path 300.

[0057] Furthermore, the capacitance values ​​of the pair of first common-mode capacitors 610 and the pair of second common-mode capacitors 620 are both set to decrease gradually along the positive power supply path 200.

[0058] Furthermore, along the positive power supply path 200, the capacitance values ​​of the first first common-mode capacitor 610 and the first second common-mode capacitor 620 are set to 1-10nF, and the capacitance values ​​of the second first common-mode capacitor 610 and the second second common-mode capacitor 620 are set to 100-500nF.

[0059] For example, the capacitance of the first common-mode capacitor 610 is set to 47nF.

[0060] Furthermore, the capacitance of the first differential mode capacitor 630 is set to 100–500 nF. The first differential mode capacitor 630 is used for deep attenuation of low-frequency differential mode interference; exemplarily, the capacitance of the first differential mode capacitor 630 is set to 470 nF.

[0061] Example 2: This application also provides an on-board electronic control power generation system, characterized in that it includes the filtering device described in Embodiment 1. By integrating the filtering unit into the DC-link integrated component 100, the electronic control system can effectively suppress EMI, while solving the heat dissipation problem of components, thus ensuring the electromagnetic compatibility performance and long-term operational reliability of the entire electronic control system and even the entire vehicle.

[0062] Testing and Verification: The following describes the EMC test of the electric power generation system in Example 2.

[0063] Reference Figure 2 In a semi-anechoic chamber, the vehicle-mounted electronic control power generation system operates under standard load conditions. The current loop probe is placed 50mm away from the high-voltage harness port. According to the CEC spectrum diagram of the high-voltage port, the average and peak margins of the high-voltage current method across the entire frequency band both exceed 8dB, indicating good test results.

[0064] Reference Figure 3 The spectrum diagram of the test results of the radiating field rod antenna in the semi-anechoic chamber shows that the mean and peak margins of the entire frequency band both exceed 13dB, indicating good test results.

[0065] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be included within the scope of protection of this application.

Claims

1. A filter device for an on-board electrically controlled power generation system, characterized by, The application relates to a DC-link integrated piece (100) comprising a shell, a heat dissipation structure arranged in the shell and a DC-link capacitor (110); a positive power supply path (200) and a negative power supply path (300), wherein a first filter unit (400), a common-mode inductor (500), a second filter unit (600) and the DC-link capacitor (110) are sequentially connected between the positive power supply path (200) and the negative power supply path (300); the first filter unit (400), the common-mode inductor (500) and the second filter unit (600) are integrated in the shell and coupled with the heat dissipation structure, and the second filter unit (600) comprises a pair of first common-mode capacitors (610), a pair of second common-mode capacitors (620) and a first differential-mode capacitor (630) which are sequentially arranged along the positive power supply path (200); wherein the first common-mode capacitors (610) are electrically connected to the positive power supply path (200) and grounded, the second common-mode capacitors (620) are electrically connected to the negative power supply path (300) and grounded, and the first differential-mode capacitor (630) is arranged in parallel with the DC-link capacitor (110), one end of the first differential-mode capacitor (630) is electrically connected to the positive power supply path (200), and the other end of the first differential-mode capacitor (630) is electrically connected to the negative power supply path (300). The capacitance of the first common-mode capacitors (610) and the second common-mode capacitors (620) gradually decreases along the positive power supply path (200). The capacitance of the first common-mode capacitors (610) and the second common-mode capacitors (620) gradually decreases along the positive power supply path (200). The first circuit board and the second circuit board are sequentially electrically connected, the first filter unit (400) is integrated on the first circuit board, and the second filter unit (600) and the DC-link capacitor (110) are integrated on the second circuit board. The heat dissipation structure comprises a heat dissipation channel and the heat dissipation fins, the heat dissipation channel is arranged between the first circuit board and the second circuit board, and the heat dissipation fins are connected between the shell and the second circuit board to dissipate heat out of the shell.

2. The filtering device of claim 1, wherein, The capacitance of the first differential-mode capacitor (630) is 100-500 nF.

3. The filter device of claim 2, wherein, The first filter unit (400) comprises a third common-mode capacitor (410), a fourth common-mode capacitor (420) and a second differential-mode capacitor (430) which are sequentially arranged along the positive power supply path (200).

4. The filtering device of claim 1, wherein, One end of the third common-mode capacitor (410) is electrically connected to the positive power supply path (200), and the other end of the third common-mode capacitor (410) is grounded. The fourth common-mode capacitor (420) is arranged in parallel with the DC-link capacitor (110), one end of the fourth common-mode capacitor (420) is electrically connected to the negative power supply path (300), and the other end of the fourth common-mode capacitor (420) is grounded.

5. The filtering device of claim 1, wherein, ​ 6. The filtering device of claim 1, wherein, ​ ​ ​ The second differential mode capacitor (430) is connected between the positive supply path (200) and the negative supply path (300).

7. The filter device of claim 6, wherein, The capacitance of the third common mode capacitor (410) and the fourth common mode capacitor (420) is set to 1-10nF, and the capacitance of the second differential mode capacitor (430) is set to 10-100nF.

8. The filtering device of claim 1, wherein, The capacitance of the DC-link capacitor (110) is set to 200-500nF.

9. The filtering device of claim 1, wherein, The common mode inductor (500) is made of a nickel-zinc amorphous alloy magnetic core material, and the inductance at 100kHz is set to 30-100μH.

10. An electrically controlled power generation system for a vehicle, characterized by comprising: The filter device of any one of claims 1-9.

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