Wafer degassing device

Abstract

The application provides a wafer degassing device, and belongs to the technical field of wafer processing. The device comprises a support, a first box, a water-cooled flange assembly, a heating assembly, a water-cooled table assembly, an interconnection neck pipe and a molecular pump. The first box is placed on the support. The water-cooled flange assembly is detachably connected to the first box. The heating assembly abuts against the water-cooled flange assembly and is used for transmitting the generated heat to the internal cavity of the first box through the water-cooled flange assembly. The water-cooled table assembly is detachably connected to the first box and is used for supporting and cooling the wafer in the internal cavity of the first box. The interconnection neck pipe communicates with the internal cavity of the first box. The molecular pump communicates with the internal cavity of the first box through the interconnection neck pipe and is used for maintaining the internal cavity of the first box in a vacuum state. The device can improve the uniformity of the ambient temperature of the wafer and the temperature change speed, so as to enhance the wafer degassing and cooling effect.

Description

Technical Field

[0001] This invention belongs to the field of wafer processing technology, and particularly relates to a wafer degassing device. Background Technology

[0002] A wafer degassing system is a pretreatment device used in semiconductor manufacturing. Its main function is to remove adsorbed moisture, organic matter, and gases from the wafer surface and material layers using high vacuum and heating before the wafer enters critical processes (such as PVD, CVD, and ALD), thereby improving the adhesion of subsequent film layers and process stability. This system typically supports 200mm or 300mm wafers, has batch processing capabilities (e.g., 25 wafers / batch), and uses hot plates or infrared lamps for heating, with a temperature range of 300°C to 400°C and a vacuum level of up to 10. -5 pa, supports inert gas protection (such as nitrogen or argon) to prevent material oxidation.

[0003] Current wafer degassing systems still have some significant drawbacks in practical applications, especially in terms of the limited controllability of the degassing process: due to differences in temperature uniformity and response speed of some equipment heating methods (such as hot plates or infrared lamps), the temperature distribution of wafers is inconsistent during batch processing, resulting in unstable degassing effects. Summary of the Invention

[0004] This invention addresses the problem of unstable wafer degassing effect in existing technologies by providing a wafer degassing device.

[0005] This invention provides a wafer degassing device, comprising a support, a first housing, a water-cooled flange assembly, a heating assembly, a water-cooled stage assembly, an interconnect neck tube, and a molecular pump;

[0006] The first box is placed on the support;

[0007] The water-cooled flange assembly is detachably connected to the first housing;

[0008] The heating component abuts against the water-cooled flange assembly, and is used to transfer the generated heat to the internal cavity of the first housing through the water-cooled flange assembly.

[0009] The water-cooled stage assembly is detachably connected to the first housing and is used to support and cool the wafers in the internal cavity of the first housing.

[0010] The interconnecting neck tube connects to the internal cavity of the first housing;

[0011] The molecular pump is connected to the internal cavity of the first housing through the interconnected neck tube, and is used to maintain the internal cavity of the first housing in a vacuum state.

[0012] Optionally, the wafer degassing device provided by the present invention further includes an ionization vacuum gauge and an isolation valve;

[0013] The ionization vacuum gauge is connected to the internal cavity of the first housing through the interconnecting neck tube, and is used to detect the vacuum level of the internal cavity of the first housing;

[0014] The isolation valve is located on the interconnecting neck between the first housing and the molecular pump, and is used to open or close the communication between the molecular pump and the internal cavity of the first housing.

[0015] Optionally, the water-cooled flange assembly includes an end cap, quartz glass, and a water-cooled flange;

[0016] The end cap is sealed to the top opening of the first housing;

[0017] The quartz glass is embedded in the end cap and contacts the internal cavity of the first housing; the heating component abuts against the quartz glass to transfer the generated heat through the quartz glass to the internal cavity of the first housing.

[0018] The water-cooled flange is fixedly connected to the end cap and is used to fix the quartz glass onto the end cap.

[0019] Optionally, the heating assembly includes a second housing, a support arm, a heating mechanism, and a fan assembly;

[0020] The bottom of the second housing abuts against the quartz glass;

[0021] The support arm is fixedly connected to the second box and its end away from the second box is hinged to the first box;

[0022] The heating mechanism is located inside the second housing and is used to heat the bottom of the second housing;

[0023] The fan assembly is mounted on the second housing and is used to exhaust the internal gas of the second housing.

[0024] Optionally, the heating assembly may be rotatably connected to one end with a gas spring;

[0025] The end of the gas spring furthest from the heating component is rotatably connected to the first housing.

[0026] Optionally, the heating mechanism includes a water-cooled base, a heating plate, and multiple heating tubes;

[0027] The water-cooled substrate is fixedly connected to the bottom of the second housing;

[0028] The heating plate is located on top of the water-cooled substrate and is fixedly connected to the water-cooled substrate;

[0029] Multiple heating elements are evenly embedded in the heating plate;

[0030] The heating plate is equipped with multiple thermocouples; each thermocouple is used to detect the temperature of the corresponding heating tube.

[0031] Optionally, the upper surface of the water-cooled substrate is provided with a plurality of interconnected air guide grooves that penetrate the water-cooled substrate.

[0032] Optionally, the water-cooled stage assembly includes a base flange, a wafer water-cooling tray, a lifting mechanism, and a wafer support.

[0033] The base flange is sealed to the bottom of the first housing;

[0034] The wafer water cooling plate is located inside the first housing and is fixedly connected to the top of the base flange;

[0035] The lifting mechanism is fixedly connected to the base flange and the wafer tray, and is used to move the wafer tray away from or closer to the wafer water cooling tray.

[0036] The wafer tray is used to hold wafers.

[0037] Optionally, the lifting mechanism includes a guide sleeve, a T-shaped guide shaft, a welded metal bellows, a lead screw, a lead screw nut, and a motor;

[0038] The guide sleeve penetrates and seals the base flange;

[0039] The outer wall of the T-shaped guide shaft is slidably connected to the inner wall of the guide sleeve;

[0040] The top of the T-shaped guide shaft is fixedly connected to the wafer carrier;

[0041] The welded metal corrugated pipe is sleeved on the T-shaped guide shaft and its two ends are respectively sealed and connected to the T-shaped guide shaft and the guide sleeve;

[0042] The T-shaped guide shaft has a blind hole along its axial direction for accommodating the lead screw;

[0043] The lead screw is threadedly connected to the lead screw nut; the lead screw nut is fixedly connected to the end of the T-shaped guide shaft away from the wafer carrier;

[0044] The motor is fixedly connected to the base flange via a connector, and its output shaft is driven by the lead screw.

[0045] Optionally, the bottom of the bracket is evenly provided with multiple casters and multiple adjustable feet.

[0046] This invention provides a wafer degassing device, comprising a support, a first housing, a water-cooled flange assembly, a heating assembly, a water-cooled stage assembly, an interconnect neck tube, and a molecular pump. The first housing is placed on the support. The water-cooled flange assembly is detachably connected to the first housing. The heating assembly abuts against the water-cooled flange assembly to transfer generated heat to the internal cavity of the first housing through the water-cooled flange assembly. The water-cooled stage assembly is detachably connected to the first housing to support and cool the wafer in the internal cavity of the first housing. The interconnect neck tube communicates with the internal cavity of the first housing. The molecular pump communicates with the internal cavity of the first housing through the interconnect neck tube to maintain the internal cavity of the first housing in a vacuum state. Using this device, this invention can improve the temperature uniformity and temperature change rate of the wafer environment, thereby enhancing the wafer degassing and cooling effect. Attached Figure Description

[0047] To more clearly illustrate the technical solution of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 This is a schematic diagram of the front-end structure of a wafer degassing device provided in an embodiment of the present invention;

[0049] Figure 2 This is a schematic diagram of the back-end structure of a wafer degassing device provided in an embodiment of the present invention;

[0050] Figure 3 This is a schematic diagram of the structure of the water-cooled flange assembly provided in an embodiment of the present invention;

[0051] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0052] Figure 5 This is a schematic diagram of the structure of the heating assembly provided in an embodiment of the present invention;

[0053] Figure 6 This is a schematic diagram of the heating mechanism provided in an embodiment of the present invention;

[0054] Figure 7 This is a schematic diagram of the structure of the water-cooled stage assembly provided in an embodiment of the present invention;

[0055] Figure 8 This is a structural schematic diagram of the lifting mechanism provided in an embodiment of the present invention.

[0056] The components include: 1. Bracket; 11. Casters; 12. Adjustable feet; 2. First housing; 21. Transmission valve; 3. Water-cooled flange assembly; 31. End cap; 311. Rubber ring; 32. Quartz glass; 321. Annular gasket; 33. Water-cooled flange; 331. Copper pipe; 332. Angle hole; 4. Heating assembly; 41. Second housing; 42. Support arm; 43. Heating mechanism; 431. Water-cooled base; 4311. Air guide groove; 432. Heating plate; 433. Heating tube; 434. Thermocouple; 4 4. Fan assembly; 45. Gas spring; 5. Water-cooled table assembly; 51. Base flange; 52. Wafer water-cooled plate; 53. Lifting mechanism; 531. Guide sleeve; 532. T-shaped guide shaft; 5321. Blind hole; 533. Welded metal bellows; 534. Lead screw; 535. Lead screw nut; 536. Motor; 537. Connector; 5371. First protective shell; 5372. Second protective shell; 54. Wafer tray; 6. Interconnect neck tube; 7. Molecular pump; 8. Ionization vacuum gauge; 9. Isolation valve. Detailed Implementation

[0057] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0058] In one embodiment, such as Figure 1 and Figure 2 As shown, this embodiment provides a wafer degassing device, including a support 1, a first housing 2, a water-cooled flange assembly 3, a heating assembly 4, a water-cooled stage assembly 5, an interconnect neck tube 6, and a molecular pump 7.

[0059] In this embodiment, the side of the first housing 2 has an opening for installing an observation window. The observation window is made of a light-transmitting material, allowing observation of the interior of the first housing 2 from the outside, while also providing vacuum isolation. The side of the first housing 2 has an opening for sealing connection to a residual gas analysis module (electrically connected to a host computer), used to obtain the gas composition inside the first housing 2.

[0060] The first box 2 is placed on the support 1; the support 1 is made of carbon steel square tubes welded together, and the top is supported and fixed by screws. The first box 2 is made of magnesium-aluminum alloy and is rectangular in shape, with the middle hollowed out to place the other parts.

[0061] like Figure 2 As shown, the first housing 2 has a transfer valve 21 (open / close) on one side, which is used to isolate the vacuum atmosphere between the degassing device and the TM cavity (not shown in the figure). This also serves as the wafer transfer port.

[0062] The water-cooled flange assembly 3 is detachably connected to the first housing 2.

[0063] The heating component 4 abuts against the water-cooled flange component 3, and is used to transfer the generated heat to the internal cavity of the first housing 2 through the water-cooled flange component 3.

[0064] For example, such as Figure 3 As shown, the water-cooled flange assembly 3 includes an end cap 31, a quartz glass 32, and a water-cooled flange 33.

[0065] End cap 31 seals the top opening of the first housing 2; end cap 31 is made of aluminum alloy and has a countersunk hole and rubber ring groove in the middle. Figure 4 As shown, a rubber ring 311 is installed in the rubber ring groove of the end cap 31, and a quartz glass 32 is concentrically installed in the countersunk hole.

[0066] Quartz glass 32 is embedded in end cap 31 and contacts the internal cavity of first housing 2; heating component 4 abuts against quartz glass 32 to transfer the generated heat through quartz glass 32 to the internal cavity of first housing 2.

[0067] The water-cooled flange 33 is fixedly connected to the end cover 31 to fix the quartz glass 32 onto the end cover 31. When the heat radiation generated by the heating component 4 passes through the quartz glass 32, some of the radiation will be absorbed by the quartz glass 32 and the water-cooled flange 33 and converted into heat energy, causing the quartz glass 32 to heat up, making it unstable and prone to failure and damage, affecting equipment safety. Therefore, the water-cooled flange 33 is provided with at least one annular cooling water passage (including water inlet and water outlet) and cooling air passage (including air inlet and air outlet) to cool the temperature of the quartz glass 32.

[0068] An annular gasket 321 is placed on the top of the quartz glass 32 along its edge. The top of the annular gasket 321 presses against the water-cooled flange 33. The water-cooled flange 33 is tightened by engaging the countersunk hole on the top of the end cover 31 with the threaded hole on the top, thus achieving a seal by pressing the rubber ring 311.

[0069] The water-cooled flange 33 has grooves machined on its side to accommodate copper pipes 331 (which are hollow inside and allow water flow to form a cooling water channel). The water flow carries away heat from the quartz glass 32. Because the installation and design leave space that prevents complete contact between the quartz glass 32 and the water-cooled flange 33, resulting in limited heat exchange efficiency, an angled hole 332 is provided on the annular center side inside the water-cooled flange 33, pointing towards the top of the quartz glass 32. The angled hole 332 connects to the internal air passage of the water-cooled flange 33, through which compressed air is introduced to accelerate the gas flow at the top of the quartz glass 32, continuously carrying away heat from the surface of the quartz glass 32 to improve heat exchange efficiency.

[0070] For example, such as Figure 5 As shown, the heating assembly 4 includes a second housing 41, a support arm 42, a heating mechanism 43, and a fan assembly 44.

[0071] The bottom of the second housing 41 abuts against the quartz glass 32; the bottom of the second housing 41 is made of heat-resistant metal and has protrusions to facilitate contact with the quartz glass 32; the side of the second housing 41 is provided with ventilation holes to facilitate the flow of air between the inside and outside of the second housing 41.

[0072] The support arm 42 is fixedly connected to the second housing 41, and its end away from the second housing 41 is hinged to the first housing 2; as shown Figure 1 As shown, two support arms 42 are symmetrically arranged and pass through the side of the second box 41 and are fixedly connected to the bottom of the second box 41; the ends of the two support arms 42 away from the second box 41 are respectively hinged to the first box 2; in order to ensure the stability and support rigidity of the two support arms 42, a connecting plate is provided between the two support arms 42 to fix the two support arms 42.

[0073] like Figure 2 As shown, since the heating component 4 has a certain weight, it is prone to dangerous situations when manually flipped (suddenly falling due to gravity). Therefore, the heating component 4 is rotatably connected to one end of the gas spring 45; the end of the gas spring 45 away from the heating component 4 is rotatably connected to the first housing 2; the two gas springs 45 are symmetrically arranged and one end is respectively hinged (that is, rotatably connected) to two support arms 42, and the end away from the support arms 42 is respectively hinged to both sides of the first housing 2.

[0074] Under the action of the gas spring 45, the heating component 4 generates a damping force when it flips, ensuring that the heating component 4 will not suddenly fall due to gravity during the flipping process from 0 to 90 degrees.

[0075] The heating mechanism 43 is located inside the second housing 41 and is used to heat the bottom of the second housing 41.

[0076] like Figure 5 As shown, the heating mechanism 43 is located between the two support arms 42 and is fixedly connected to the bottom of the internal cavity of the second housing 41.

[0077] A fan assembly 44 is disposed on the second housing 41 for discharging the internal gas of the second housing 41; exemplarily, the top of the second housing 41 is provided with a mounting position for the fan assembly 44 and an air outlet is provided to draw out the hot air inside the second housing 41 for auxiliary heat dissipation.

[0078] For example, such as Figure 6 As shown, the heating mechanism 43 includes a water-cooled base 431, a heating plate 432, and multiple heating tubes 433.

[0079] The water-cooled substrate 431 is fixedly connected to the bottom of the internal cavity of the second housing 41; the heating plate 432 is located on the top of the water-cooled substrate 431 and is fixedly connected to the water-cooled substrate 431; multiple heating tubes 433 are evenly embedded on the heating plate 432; multiple thermocouples 434 are provided on the heating plate 432; each thermocouple 434 is used to detect the temperature of the corresponding heating tube 433.

[0080] like Figure 6 As shown, the water-cooled substrate 431 has an overall cylindrical structure and is provided with at least one annular cooling water passage (including water inlet and water outlet) and cooling air passage (including air inlet and air outlet) inside, which are used to introduce cooling water and cold air to cool the water-cooled substrate 431.

[0081] The heating plate 432 has a cylindrical structure and is made of insulating, heat-resistant, and low-expansion materials, such as silicon carbide, alumina, pyrolytic boron nitride, and silicon nitride. The top of the heating plate 432 is provided with three sets of concentric arc grooves, and the outer ring is evenly provided with countersunk holes for mounting bolts to connect other components.

[0082] Multiple heating tubes 433, including but not limited to a first heating tube, a second heating tube, and a third heating tube, are all C-shaped. The spacing between the heating tubes 433 is changed by setting the curvature (or the diameter of the circle in which they are located) of each heating tube 433, so that all heating tubes 433 can uniformly radiate and cover the wafer sample. The C-shaped first heating tube, second heating tube, and third heating tube are placed back to back, which greatly reduces the possibility of insufficient radiation temperature at the opening. The upper surface of the heating plate 432 has an arc-shaped groove to accommodate each heating tube 433, and each heating tube 433 is installed in a corresponding arc-shaped groove.

[0083] The outer ring of the water-cooled base 431 is also provided with countersunk holes. The countersunk holes on the outer ring of the water-cooled base 431 and the heating plate 432 are connected by bolts, so that the water-cooled base 431 and the heating plate 432 fit tightly together. Since the heat radiation generated by the first heating tube, the second heating tube and the third heating tube during operation will generate heat energy that is conducted to the heating plate 432, causing the heating plate 432 to overheat and damage the components, stable water cooling and / or air cooling are required to remove some of the heat.

[0084] The water-cooled substrate 431 is provided with multiple thermocouple mounting holes. The thermocouple mounting holes are tangent to the first heating tube, the second heating tube, and the third heating tube in a direction perpendicular to the upper surface of the heating plate 432. Three thermocouples are placed on the upper surface of the water-cooled substrate 431 through the mounting holes to measure the temperature near the three heating tubes 433 and provide feedback (each thermocouple is electrically connected to a host computer).

[0085] For example, multiple temperature sensors (e.g., infrared temperature sensors that uniformly irradiate the surface of the wafer, with each infrared temperature sensor electrically connected to a host computer) are uniformly arranged inside the first housing 2 to monitor the real-time temperature of the surface of the irradiated object (wafer).

[0086] like Figure 6 As shown, a plurality of interconnected and penetrating air guide grooves 4311 are uniformly provided on the upper surface of the water-cooled substrate 431; the top of the water-cooled substrate 431 is recessed by 2mm to allow inert gas to be introduced from the air inlet of the water-cooled substrate 431 and evenly distributed on the lower surface of the water-cooled substrate 431 through the plurality of air guide grooves 4311 for cooling the heating plate 432.

[0087] Because the contact surface between the heating plate 432 and the water-cooled substrate 431 is not a perfectly flat surface (i.e., not in complete contact), inert gas is filled at the uneven microscopic level to achieve higher cooling efficiency. At the same time, the inert gas flowing in from the air inlet of the water-cooled substrate 431 is eventually drawn away by the fan assembly 44, improving the cooling efficiency and effect of the heating plate 432 and the water-cooled substrate 431.

[0088] The water-cooled stage assembly 5 is detachably connected to the first housing 2 and is used to support and cool the wafers in the internal cavity of the first housing 2.

[0089] For example, such as Figure 7 As shown, the water-cooled stage assembly 5 includes a base flange 51, a wafer water-cooling plate 52, a lifting mechanism 53, and a wafer support 54.

[0090] The base flange 51 is designed in an annular stepped shape. The upper surface of the bottom step is connected to the bottom of the first housing 2 to achieve a vacuum seal, that is, the base flange 51 is sealed to the bottom of the first housing 2. The second and third steps are used to increase the installation height of the upper surface of the base flange 51.

[0091] The wafer water cooling plate 52 is located inside the first housing 2 and is fixedly connected to the top of the base flange 51. The wafer water cooling plate 52 (which has an annular water channel inside, including an inlet and an outlet, and maintains the surface of the wafer water cooling plate 52 at a certain temperature through heat exchange) is installed on the top of the base flange 51 via a sealing ring and is used for cooling the wafer after degassing.

[0092] The lifting mechanism 53 is fixedly connected to the base flange 51 and the wafer carrier 54, and is used to move the wafer carrier 54 away from or towards the wafer water-cooling tray 52. ​​The wafer carrier 54 is concentrically installed with the wafer water-cooling tray 52, and the wafer carrier 54 can be sleeved on the wafer water-cooling tray 52. ​​The wafer carrier 54 is used to place wafers. Exemplarily, the top of the wafer carrier 54 is provided with three legs for placing and positioning the wafers.

[0093] For example, such as Figure 8As shown, the lifting mechanism 53 includes a guide sleeve 531, a T-shaped guide shaft 532, a welded metal bellows 533, a lead screw 534, a lead screw nut 535, and a motor 536.

[0094] The guide sleeve 531 passes through and seals the base flange 51; the outer wall of the T-shaped guide shaft 532 is slidably connected to the inner wall of the guide sleeve 531; the T-shaped guide shaft 532 needs to move back and forth along its axial direction during operation, that is, it moves back and forth perpendicular to the upper surface of the base flange 51. The guide sleeve 531 is provided to avoid wear on the base flange 51 during the movement of the T-shaped guide shaft 532.

[0095] The top of the T-shaped guide shaft 532 is fixedly connected to the wafer carrier 54; the wafer carrier 54 moves upward or downward synchronously with the T-shaped guide shaft 532, thereby moving the wafer placed on the wafer carrier 54 away from or towards the wafer water cooling tray 52. ​​When the wafer is close to the wafer water cooling tray 52, the wafer is cooled.

[0096] The welded metal bellows 533 is sleeved on the T-shaped guide shaft 532 and its two ends are respectively sealed and connected to the T-shaped guide shaft 532 and the guide sleeve 531; the setting of the welded metal bellows 533 does not affect the sealing of the first housing 2 when the T-shaped guide shaft 532 moves.

[0097] The T-shaped guide shaft 532 has a blind hole 5321 along its axial direction for accommodating the lead screw 534; the lead screw 534 is threadedly connected to the lead screw nut 535; the lead screw nut 535 is fixedly connected to the end of the T-shaped guide shaft 532 away from the wafer carrier 54.

[0098] In this embodiment, the lead screw 534 rotates only around its axis, and the lead screw nut 535 is fixedly connected to the T-shaped guide shaft 532. The blind hole 5321 is provided to prevent the lead screw 534 from interfering with the downward movement of the T-shaped guide shaft 532, that is, to prevent the top of the lead screw 534 from abutting the bottom of the T-shaped guide shaft 532 (if the top of the lead screw 534 abuts the bottom of the T-shaped guide shaft 532, the T-shaped guide shaft 532 will not be able to move downward).

[0099] The motor 536 (electrically connected to the host computer) is fixedly connected to the base flange 51 via the connector 537, and the output shaft is connected to the lead screw 534 for transmission.

[0100] For example, such as Figure 8As shown, the connector 537 includes two protective shells, namely a first protective shell 5371 and a second protective shell 5372. The first protective shell 5371 is fixedly connected to the bottom of the base flange 51 (by means including but not limited to bolts). The bottom of the first protective shell 5371 is fixedly connected to the top of the second protective shell 5372 (by means including but not limited to bolts). A bearing is embedded in the bottom of the first protective shell 5371 or the top of the second protective shell 5372. The lead screw 534 passes through the inner ring of the bearing and is fixedly connected to the inner ring of the bearing. Optionally, two limit nuts are provided on the lead screw 534. The two limit nuts are located on both sides of the bearing along the axial direction of the lead screw 534 and abut against the inner ring of the bearing to prevent axial displacement of the lead screw 534.

[0101] The bottom of the second protective shell 5372 is fixedly connected to the motor 536, and the output shaft of the motor 536 can be connected to the lead screw 534 by means of coupling connection, gear meshing connection and pulley connection, among other things.

[0102] The interconnected neck tube 6 connects to the internal cavity of the first housing 2; the molecular pump 7 connects to the internal cavity of the first housing 2 through the interconnected neck tube 6, and is used to maintain the internal cavity of the first housing 2 in a vacuum state.

[0103] like Figure 1 As shown, the wafer degassing device provided in this embodiment also includes an ionization vacuum gauge 8 and an isolation valve 9.

[0104] The ionization vacuum gauge 8 is connected to the internal cavity of the first housing 2 via the interconnecting neck tube 6, and is used to detect the vacuum level of the internal cavity of the first housing 2.

[0105] An isolation valve 9 is installed on the interconnecting neck 6 between the first housing 2 and the molecular pump 7, and is used to open or close the communication between the molecular pump 7 and the internal cavity of the first housing 2.

[0106] For example, the bottom of the bracket 1 is evenly provided with a plurality of casters 11 and a plurality of adjustable feet 12 (the adjustable feet 12 are screwed to the bottom of the bracket 1). The casters 11 facilitate the overall movement of the wafer degassing device. When the wafer degassing device is moved to the target area, the adjustable feet 12 are adjusted (rotated) until they touch the ground. This prevents the wafer degassing device from moving and also adjusts its horizontal position to adapt to different ground conditions as much as possible.

[0107] In this embodiment, the wafer degassing device opens the isolation valve 9 during operation, and the molecular pump 7 reduces the vacuum atmosphere inside the first chamber 2 to 10. -5pa. Drive motor 536 moves wafer carrier 54 up and down to the wafer receiving position, opens transfer valve 21, drives TM cavity transfer robot to place wafer on positioning slot of wafer carrier 54, closes transfer valve 21, and then drives motor 536 to raise wafer carrier 54 to degassing position.

[0108] Cooling water and compressed air are respectively introduced into the water-cooled flange 33 and the water-cooled substrate 431 through the water and air channels. The fan assembly 44 is turned on, and all heating tubes 433 are turned on simultaneously. The temperature of each heating tube 433 is monitored by multiple thermocouples 434, and the real-time temperature of different locations on the wafer is measured using temperature sensors. If there is a temperature difference between different locations on the wafer surface, the input power of each heating tube 433 is adjusted to regulate the energy of heat radiation onto the wafer, thereby regulating the uniformity of the wafer surface temperature. If the wafer needs to be continuously heated to the target temperature, the power of each heating tube 433 is adjusted based on the feedback from the temperature sensors to maintain the wafer at the target temperature for the target time. At the same time, the residual gas analysis module detects the gas composition state inside the first enclosure 2. After the wafer is degassed, all heating tubes 433 are turned off and allowed to cool naturally for a preset time. The lifting mechanism 53 is then driven to move the wafer carrier 54 down to the cooling position, placing the wafer on the wafer water cooling tray 52. ​​At the same time, the temperature sensor monitors the surface temperature of the wafer. Once the wafer has cooled to a suitable temperature, the lifting mechanism 53 is driven to move up to the wafer transfer position, and the transfer valve 21 is opened. The TM cavity transfer robot then removes the wafer. After the wafer is removed, the transfer valve 21 is closed.

[0109] In summary, the wafer degassing device provided in this embodiment uses a multi-zone heating tube 433 combined with thermocouples and temperature sensors to achieve accurate measurement and dynamic compensation of wafer temperature, ensuring uniform and consistent temperature rise on the wafer surface; it integrates a water-cooled stage assembly 5 to achieve rapid cooling after wafer degassing, shortening the wafer processing cycle and improving wafer production efficiency.

[0110] The present invention has been described in detail above with reference to specific embodiments and exemplary examples; however, these descriptions should not be construed as limiting the present invention. Those skilled in the art will understand that various equivalent substitutions, modifications, or improvements can be made to the technical solutions and embodiments of the present invention without departing from the spirit and scope of the invention, and all such modifications and improvements fall within the scope of the present invention. The scope of protection of the present invention is defined by the appended claims.

Claims

1. A wafer degassing device, characterized in that, Includes a bracket (1), a first housing (2), a water-cooled flange assembly (3), a heating assembly (4), a water-cooled platform assembly (5), an interconnected neck tube (6), and a molecular pump (7); The first box (2) is placed on the support (1); The water-cooled flange assembly (3) is detachably connected to the first housing (2); The heating component (4) abuts against the water-cooled flange assembly (3) to transfer the generated heat to the internal cavity of the first housing (2) through the water-cooled flange assembly (3); The water-cooled stage assembly (5) is detachably connected to the first housing (2) and is used to support and cool the wafers in the internal cavity of the first housing (2); The interconnecting neck (6) connects to the internal cavity of the first housing (2); The molecular pump (7) is connected to the internal cavity of the first housing (2) through the interconnected neck tube (6) to maintain the internal cavity of the first housing (2) in a vacuum state.

2. The wafer degassing apparatus according to claim 1, characterized in that, It also includes an ionization vacuum gauge (8) and an isolation valve (9); The ionization vacuum gauge (8) is connected to the internal cavity of the first housing (2) through the interconnecting neck tube (6) and is used to detect the vacuum level of the internal cavity of the first housing (2); The isolation valve (9) is disposed on the interconnecting neck (6) between the first housing (2) and the molecular pump (7) for opening or closing the communication between the molecular pump (7) and the internal cavity of the first housing (2).

3. The wafer degassing apparatus according to claim 1, characterized in that, The water-cooled flange assembly (3) includes an end cap (31), a quartz glass (32), and a water-cooled flange (33). The end cap (31) seals the top opening of the first housing (2); The quartz glass (32) is embedded in the end cap (31) and contacts the internal cavity of the first housing (2); the heating component (4) abuts against the quartz glass (32) to transfer the generated heat through the quartz glass (32) to the internal cavity of the first housing (2); The water-cooled flange (33) is fixedly connected to the end cap (31) for fixing the quartz glass (32) onto the end cap (31).

4. The wafer degassing apparatus according to claim 3, characterized in that, The heating assembly (4) includes a second housing (41), a support arm (42), a heating mechanism (43), and a fan assembly (44). The bottom of the second housing (41) abuts against the quartz glass (32); The support arm (42) is fixedly connected to the second box (41) and its end away from the second box (41) is hinged to the first box (2). The heating mechanism (43) is located inside the second housing (41) and is used to heat the bottom of the second housing (41); The fan assembly (44) is disposed on the second housing (41) for discharging the internal gas of the second housing (41).

5. The wafer degassing apparatus according to claim 4, characterized in that, The heating component (4) is rotatably connected to one end of a gas spring (45); The gas spring (45) is rotatably connected to the first housing (2) at the end away from the heating component (4).

6. The wafer degassing apparatus according to claim 4, characterized in that, The heating mechanism (43) includes a water-cooled base (431), a heating plate (432), and multiple heating tubes (433). The water-cooled substrate (431) is fixedly connected to the bottom of the second housing (41); The heating plate (432) is located on top of the water-cooled base (431) and is fixedly connected to the water-cooled base (431). Multiple heating tubes (433) are evenly embedded on the heating plate (432); The heating plate (432) is provided with a plurality of thermocouples (434); each thermocouple (434) is used to detect the temperature of the corresponding heating tube (433).

7. The wafer degassing apparatus according to claim 6, characterized in that, The upper surface of the water-cooled substrate (431) is uniformly provided with a plurality of interconnected air guide grooves (4311) that penetrate the water-cooled substrate (431).

8. The wafer degassing apparatus according to claim 1, characterized in that, The water-cooled stage assembly (5) includes a base flange (51), a wafer water-cooled plate (52), a lifting mechanism (53), and a wafer support (54). The base flange (51) is sealed to the bottom of the first housing (2); The wafer water cooling plate (52) is located inside the first housing (2) and is fixedly connected to the top of the base flange (51); The lifting mechanism (53) is fixedly connected to the base flange (51) and the wafer tray (54), and is used to move the wafer tray (54) away from or closer to the wafer water cooling plate (52). The wafer holder (54) is used to place the wafer.

9. The wafer degassing apparatus according to claim 8, characterized in that, The lifting mechanism (53) includes a guide sleeve (531), a T-shaped guide shaft (532), a welded metal bellows (533), a lead screw (534), a lead screw nut (535), and a motor (536). The guide sleeve (531) passes through and seals the base flange (51). The outer wall of the T-shaped guide shaft (532) is slidably connected to the inner wall of the guide sleeve (531); The top of the T-shaped guide shaft (532) is fixedly connected to the wafer carrier (54). The welded metal bellows (533) is sleeved on the T-shaped guide shaft (532) and its two ends are respectively sealed and connected to the T-shaped guide shaft (532) and the guide sleeve (531). The T-shaped guide shaft (532) has a blind hole (5321) along its axial direction for accommodating the lead screw (534). The lead screw (534) is threadedly connected to the lead screw nut (535); the lead screw nut (535) is fixedly connected to the end of the T-shaped guide shaft (532) away from the wafer carrier (54); The motor (536) is fixedly connected to the base flange (51) via a connector (537), and its output shaft is driven by the lead screw (534).

10. The wafer degassing apparatus according to claim 1, characterized in that, The bottom of the bracket (1) is evenly provided with multiple casters (11) and multiple adjustable feet (12).

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