Wafer clamping device and wafer center adjusting method

Abstract

The embodiment of the invention discloses a wafer clamping device and a related method. The wafer clamping device comprises: a substrate having a plurality of mounting plates extending outward from the center; a plurality of clamping mechanisms, wherein each clamping mechanism is correspondingly mounted on one mounting plate; the clamping mechanism comprises a driving assembly and a clamping assembly; the driving assembly is configured to drive the clamping assembly to move towards the center direction of the substrate so as to clamp the wafer; wherein the driving assembly of each clamping mechanism is further configured to independently drive the movement distance of the corresponding clamping assembly so as to adjust the circle center position of the clamped wafer. According to the embodiment of the invention, the technical effect of accurately adjusting the circle center position of the wafer in the wafer carrying process can be realized.

Description

Technical Field

[0001] This application relates to the field of semiconductor wafer processing technology, and in particular to a wafer clamping device and a wafer center adjustment method. Background Technology

[0002] In semiconductor manufacturing equipment, wafer clamping devices are key components for wafer handling, positioning, and transfer. Because wafers are thin, fragile, and require frequent movement between various process steps, a stable and reliable clamping mechanism is needed to ensure safe gripping and smooth transfer, while also ensuring high-precision positioning when the wafer enters the processing position. This guarantees the repeatability of subsequent processes and product yield.

[0003] However, existing wafer clamping devices still have certain limitations in practical applications. Current designs often focus on basic handling functions, but struggle to achieve high positioning accuracy when transferring wafers to their target locations. Furthermore, some clamping structures are too large overall, hindering flexible arrangement within compact equipment spaces and limiting their fine-tuning capabilities. Especially when performing precise adjustments to the wafer's center position, existing devices generally suffer from low adjustment efficiency and limited accuracy, resulting in suboptimal performance in processes requiring precise wafer transfer to designated locations, failing to meet increasingly demanding process requirements. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a wafer clamping device and a wafer center adjustment method to achieve the technical effect of accurately adjusting the wafer center position during wafer handling.

[0005] In a first aspect, this application provides a wafer clamping device, comprising: The substrate has multiple mounting plates extending outward from the center; Multiple clamping mechanisms are provided, each clamping mechanism being mounted on one of the mounting plates; each clamping mechanism includes a driving component and a clamping component; the driving component is configured to drive the clamping component to move toward the center of the substrate to clamp the wafer; Each of the clamping mechanisms is further configured to individually drive the movement distance of the corresponding clamping component in order to adjust the center position of the clamped wafer.

[0006] In at least some embodiments of this application, The drive assembly includes a drive component, a first linear guide rail, and a first connecting plate; The first linear guide rail is disposed on the mounting plate; the first connecting plate is slidably mounted on the first linear guide rail; the clamping assembly is mounted on the first connecting plate; The driving element is configured to drive the first connecting plate to move along the first linear guide rail, thereby causing the clamping assembly to move toward the center of the substrate.

[0007] In at least some embodiments of this application, The central axis of each mounting plate passes through the center of the substrate; The first linear guide rail is arranged along the central axis of the corresponding mounting plate; or, The first linear guide rail has at least two rails, which are arranged symmetrically and parallel about the central axis of the corresponding mounting plate.

[0008] In at least some embodiments of this application, A first limiting block is provided on the mounting plate near one end of the first linear guide rail. The first limiting block is configured to abut against the first connecting plate to limit the maximum distance that the clamping assembly can move away from the center of the substrate. The drive component is mounted on the mounting plate via a fixing seat; a second limiting block is provided on the end of the first connecting plate away from the clamping assembly, and the second limiting block is configured to abut against the fixing seat to limit the closest distance that the clamping assembly can move toward the center of the substrate.

[0009] In at least some embodiments of this application, The clamping assembly includes a fixing plate and a gripper; one end of the fixing plate is mounted on the first connecting plate, and the other end extends to the underside of the corresponding mounting plate and is fitted with the gripper.

[0010] In at least some embodiments of this application, The clamping assembly further includes a guide assembly; the guide assembly includes a sliding assembly and a chuck; the chuck is mounted on the sliding assembly, and the sliding assembly is slidably mounted on the first connecting plate; The chuck is disposed on both sides of the jaws, and a support rod is connected to the chuck corresponding to the jaws. A first elastic element is disposed on the support rod.

[0011] In at least some embodiments of this application, The sliding assembly includes a second connecting plate, a connecting block, and a second linear guide rail; The second linear guide is mounted on the first connecting plate, and the setting direction of the second linear guide is the same as that of the first linear guide. The second connecting plate is slidably mounted on the second linear guide rail; the clamp and the connecting block are disposed on the second connecting plate; A third connecting plate is provided on the first connecting plate, and the driving end of the driving member is connected to the third connecting plate; the connecting block and the third connecting plate are arranged opposite to each other and connected by a second elastic member.

[0012] In at least some embodiments of this application, At least one position sensor is provided on the mounting plate, and the position sensor is configured to detect the position of the corresponding clamping component.

[0013] In at least some embodiments of this application, The substrate is provided with a waterproof cover covering the area where the clamping mechanism is located; each mounting plate is provided with an exhaust port connected to the outside on its corresponding waterproof cover.

[0014] In a second aspect, this application provides a wafer centering adjustment method based on the wafer clamping device as described in any one of the first aspects, the method comprising: Obtain the actual center position of the clamped wafer relative to the center of the substrate; Calculate the adjustment distance of each clamping component in its corresponding moving direction based on the actual center position; Each driving component is controlled to drive the corresponding clamping component to move by the adjustment distance so that the center of the clamped wafer is aligned with the center of the substrate.

[0015] The above-described one or more embodiments of this application have at least one or more of the following beneficial effects: In implementing the technical solution of this application, by setting clamping components with independently adjustable distances from the center of the substrate in multiple directions, this application can be compatible with wafer clamping of different sizes without replacing any components, thereby achieving rapid switching between multiple wafer processing sizes. Simultaneously, since the distance of the clamping components 21 is adjustable, different clamping forces can be adjusted, ensuring the load stability of the wafer clamping position. Furthermore, each clamping mechanism can have its movement distance adjusted independently in its respective direction via a drive component. When it is necessary to adjust the wafer center position, simply driving the clamping components to move different distances can efficiently and accurately achieve center position adjustment.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The disclosure of this application will become more readily understood with reference to the accompanying drawings. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the drawings are used to denote similar components, wherein: Figure 1This is a three-dimensional structural schematic diagram of a wafer clamping device according to one embodiment of this application; Figure 2 This is a three-dimensional structural schematic diagram of the clamping mechanism according to one embodiment of this application; Figure 3 This is a cross-sectional structural schematic diagram of the clamping assembly and the guiding assembly according to one embodiment of this application; Figure 4 This is a three-dimensional structural schematic diagram of a wafer clamping device according to another embodiment of this application; Figure 5 This is a schematic diagram of the overall structure of a wafer clamping device according to one embodiment of this application; Figure 6 This is a schematic diagram illustrating the principle of adjusting the initial setting of the center of the wafer clamping device according to one embodiment of this application; Figure 7 This is a schematic diagram illustrating the principle of adjusting the center coordinate calculation of a wafer clamping device according to one embodiment of this application.

[0018] Explanation of reference numerals in the attached figures: 1. Base plate; 10. Mounting plate; 101. Moving window; 102. Support column; 103. Top plate; 2. Clamping mechanism; 20. Drive assembly; 201. Drive component; 2011. Fixing base; 202. First linear guide rail; 203. First connecting plate; 204. Third connecting plate; 21. Clamping assembly; 211. Fixing plate; 212. Gripper; 22. Guide assembly; 221. Chuck; 222. Support rod; 223. First elastic element; 224. Second connecting plate; 225. Connecting block; 226. Second linear guide rail; 227. Second elastic element; 30. First limiting block; 40. Second limiting block; 50. Position sensor; 501. First brush plate; 502. Second brush plate; 60. Sensor; 3. Waterproof cover; 31. Ventilation connector; 4. Wafer. Detailed Implementation

[0019] Some embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application.

[0020] See appendix Figure 1 In one or more embodiments, a wafer clamping device of this application includes: The substrate 1 has a plurality of mounting plates 10 extending outward from the center; Multiple clamping mechanisms 2 are mounted on a mounting plate 10. Each clamping mechanism 2 includes a driving component 20 and a clamping component 21. The driving component 20 is configured to drive the clamping component 21 to move toward the center of the substrate 1 to clamp the wafer. In this configuration, the drive component 20 of each clamping mechanism 2 is also configured to individually drive the movement distance of the corresponding clamping component 21 in order to adjust the center position of the clamped wafer.

[0021] It is understood that in this application, the wafer clamping device has multiple clamping mechanisms 2 extending outward from the center of the substrate 1. Each clamping mechanism 2 includes a separate driving component 20. Each driving component 20 can synchronously or asynchronously drive the clamping component 21 to move towards the center of the substrate 1, so that the clamping components 21 jointly clamp the wafer. Similarly, each driving component 20 can also drive the clamping component 21 to move away from the center of the substrate 1, so that the clamping component 21 releases the wafer. Since the distance of the clamping components 21 is adjustable, wafers of different sizes can be clamped. Furthermore, since each clamping mechanism 2 includes a separate driving component 20, each driving component 20 can individually adjust the moving distance of the corresponding clamping component 21, so that the clamped wafer moves in the corresponding direction. Each driving component 20 can enable the clamping component 21 to complete the adjustment of the moving distance in different directions, so that the center position of the wafer can move in the moving direction of each clamping component 21, thus completing the adjustment of the center position.

[0022] It should be understood that this application does not impose specific limitations on the number and orientation of the clamping mechanisms 2. In actual use, adjustments can be made according to requirements and available space. For example, in some specific embodiments, there can be at least three clamping mechanisms 2, and these at least three clamping mechanisms 2 are evenly distributed around the center of the substrate 1, which can ensure the uniformity of wafer clamping in all directions and the overall stability of the clamping. To facilitate the explanation of the specific structure, working principle, and technical effects of the wafer clamping device of this application, the following embodiments will use three clamping mechanisms 2 evenly distributed around the center of the substrate 1 as an example for detailed description.

[0023] Based on the above implementation methods, refer to Figure 1An optional operating process of the wafer clamping device in this embodiment is as follows: the wafer clamping device moves as a whole above the wafer, and each driving component 20 drives the clamping component 21 to be in an open state (i.e., away from the center of the substrate 1); the wafer clamping device moves down to a position where each clamping component 21 corresponds to the edge of the wafer and surrounds the wafer; each driving component 20 drives the corresponding clamping component 21 to move towards the center of the substrate 1, and each clamping component 21 tightens to clamp the wafer. Furthermore, when the wafer clamping device needs to adjust the wafer center position, each driving component 20 drives the corresponding clamping component 21 to move different distances, so that the wafer center is adjusted to the required position.

[0024] In the embodiments of this application, by providing clamping components 21 with independently adjustable distances from the center of substrate 1 in multiple directions, this application can be compatible with wafer clamping of different sizes without replacing any components, thereby achieving rapid switching between multiple wafer size processes. Simultaneously, since the distance of the clamping components 21 is adjustable, different clamping forces can be adjusted, ensuring the load stability of the wafer clamping position. Furthermore, each clamping mechanism 2 can have its movement distance individually adjusted in its corresponding direction via the drive component 20. When it is necessary to adjust the wafer center position, simply driving the clamping components 21 to move different distances can efficiently and accurately achieve center position adjustment.

[0025] In one embodiment, reference Figure 2 In a single clamping mechanism 2, the drive assembly 20 includes a drive element 201, a first linear guide rail 202, and a first connecting plate 203; The first linear guide rail 202 is mounted on the mounting plate 10; the first connecting plate 203 is slidably mounted on the first linear guide rail 202; the clamping assembly 21 is mounted on the first connecting plate 203; The drive unit 201 is configured to drive the first connecting plate 203 to move along the first linear guide rail 202, thereby causing the clamping assembly 21 to move toward the center of the substrate 1.

[0026] Specifically, the driving component 201 provides driving force to the first connecting plate 203, enabling the first connecting plate 203 to move on the first linear guide rail 202. Since the clamping assembly 21 is mounted on the first connecting plate 203, it can move relative to the center of the substrate 1. In this application, the driving component 201 can be a motor, cylinder, etc., which drives the first connecting plate 203 to move via its driving end.

[0027] In one specific embodiment, with the central axis of each mounting plate 10 passing through the center of the substrate 1 as a reference, the first linear guide 202 can be arranged along the central axis direction of the corresponding mounting plate 10. That is, there can be only one first linear guide 202, which is arranged along the central axis of the corresponding mounting plate 10, so that the first connecting plate 203 on it also moves along the central axis direction of the mounting plate 10, that is, moves along the line passing through the center of the substrate 1, thereby realizing the movement of the clamping component 21 on the first connecting plate 203 relative to the center direction of the substrate 1.

[0028] In one specific embodiment, with the central axis of each mounting plate 10 passing through the center of the substrate 1 as a reference, and referring to... Figure 2 The first linear guide rail 202 has at least two sections, and these at least two sections are symmetrically and parallelly arranged about the central axis of the corresponding mounting plate 10. That is, the first linear guide rails 202 are respectively located on both sides near the edge of the mounting plate 10, and the first connecting plate 203 spans over the first linear guide rails 202. The two sides of the first connecting plate 203 are slidably mounted on the first linear guide rails 202 on both sides via sliding seats or slots. The symmetrical and parallel arrangement of the two first linear guide rails 202 not only allows the clamping assembly 21 on the first connecting plate 203 to move relative to the center of the substrate 1, but also improves the stability of the movement and helps ensure the accuracy of the movement distance.

[0029] In one possible implementation, in order to prevent the first connecting plate 203 from detaching from the first linear guide 202 and from moving too far, the movement distance of the first connecting plate 203 can be limited within a certain range by setting a limit block.

[0030] For details, please refer to Figure 2A first limiting block 30 is provided on the mounting plate 10 near one end of the first linear guide 202. The first limiting block 30 is configured to abut against the first connecting plate 203 to limit the maximum distance that the clamping assembly 21 can move away from the center of the substrate 1. The driving member 201 is mounted on the mounting plate 10 via a fixing seat 2011. A second limiting block 40 is provided on the end of the first connecting plate 203 away from the clamping assembly 21. The second limiting block 40 is configured to abut against the fixing seat 2011 to limit the minimum distance that the clamping assembly 21 can move towards the center of the substrate 1. In other words, the first limiting block 30 is set at one end of the first linear guide 202 near the clamping assembly 21 to prevent the first connecting plate 203 from dislodging from the first linear guide 202 when the first connecting plate 203 drives the clamping assembly 21 to move away from the center of the substrate 1. Each mounting plate 10 is provided with an independent driving member 201. In order for the driving member 201 to provide driving force to the first connecting plate 203 normally, the minimum distance between the first connecting plate 203 and the driving member 201 when it is close to the center of the substrate 1 should not exceed the driving member 201. Therefore, by setting the second limiting block 40 on the first connecting plate 203, the second limiting block 40 can abut against the fixing seat 2011 used to fix the driving member 201, preventing the first connecting plate 203 from continuing to move towards the center of the substrate 1 when it is close to the driving member 201. It should be understood that this application does not specifically limit the range of movement distance of the clamping assembly 21 driven by the first connecting plate 203. In actual use, it can be adjusted according to the size of the wafer to be clamped, and the range of movement distance can also be set according to the size range of compatible wafers.

[0031] Furthermore, a movable window 101 may also be provided on the mounting plate 10; the clamping component 21 is configured to move within the movable window 101; that is, the movement range of the clamping component 21 can also be limited by the movable window 101 to prevent the clamping component 21 from moving excessively.

[0032] In one implementation, refer to Figure 2 The clamping assembly 21 includes a fixing plate 211 and grippers 212. One end of the fixing plate 211 is mounted on the first connecting plate 203, and the other end extends below the corresponding mounting plate 10 and is fitted with grippers 212. The grippers 212 are used to contact the edge of the wafer to clamp it. During movement, the first connecting plate 203 drives the fixing plate 211 to move, thereby causing the grippers 212 to move closer to or further away from the center of the substrate 1 to clamp or release the wafer.

[0033] In one possible implementation, refer to Figure 2 and Figure 3The clamping assembly 21 also includes a guide assembly 22; the guide assembly 22 includes a sliding assembly and a chuck 221; the chuck 221 is mounted on the sliding assembly, which is slidably mounted on the first connecting plate 203; the chuck 221 is disposed on both sides of the jaws 212, and a support rod 222 is connected to the chuck 221 corresponding to the jaws 212, and a first elastic element 223 is disposed on the support rod 222. The function of the guide assembly 22 is to ensure the initial position of the jaws 212 when clamping the wafer and to ensure the positional stability during the clamping and handling of the wafer, preventing the position of the wafer from changing during movement. Specifically, during use, the support rod 222 can abut against the platform on which the wafer is placed. The first elastic element 223 on the support rod 222 abuts against the edge of the wafer to determine the initial position of the wafer. After determining the initial position, the clamping jaws 212 move to clamp the wafer, which can prevent the clamping jaws 212 from directly clamping the wafer and causing damage due to inaccurate positioning. During the movement, since the first elastic element 223 also has an auxiliary clamping function for the wafer, it can prevent the wafer on both sides of the clamping jaws 212 from moving, thus providing stability of the clamping position.

[0034] The sliding assembly is mounted on the first connecting plate 203 and moves with it. However, to ensure the function of the guide assembly 22, the chuck 221 needs to move a certain range relative to the gripper 212 to determine the initial position and assist in clamping. Specifically, the sliding assembly includes a second connecting plate 224, a connecting block 225, and a second linear guide 226. The second linear guide 226 is mounted on the first connecting plate 203, and its orientation is the same as that of the first linear guide 202. The second connecting plate 224 is slidably mounted on the second linear guide 226. The chuck 221 and the connecting block 225 are mounted on the second connecting plate 224. A third connecting plate 204 is mounted on the first connecting plate 203, and the driving end of the drive member 201 is connected to the third connecting plate 204. The connecting block 225 and the third connecting plate 204 are positioned opposite each other and connected by a second elastic member 227. During the movement of the first connecting plate 203 driven by the drive component 201, the second connecting plate 224, which is mounted on the first connecting plate 203, and the clamps 221 on the second connecting plate 224 also move accordingly. To prevent the second connecting plate 224 from dislodging from the first connecting plate 203 during movement, a second elastic element 227 is connected between the third connecting plate 204 and the connecting block 225. The elasticity of the second elastic element 227 allows the second connecting plate 224 to move relative to the first connecting plate 203, while also holding the second connecting plate 224 in place to prevent it from moving too much and dislodging from the second linear guide 226.

[0035] Both the first elastic element 223 and the second elastic element 227 can be springs. Furthermore, at least the first elastic element 223 is also provided with a soft material wrapped around the outside of the spring, which can prevent damage to the edge of the wafer.

[0036] In one embodiment, at least one position sensor 50 is provided on the mounting plate 10, and the position sensor 50 is configured to detect the position of the corresponding clamping assembly 21.

[0037] Specifically, refer to Figure 2 Position sensors 50 can be installed on both sides of the drive unit 201 to detect different positions of the first connecting plate 203. For example, a first brush 501 can be installed on one side of the first connecting plate 203 and a second brush 502 can be installed on the other side. The first brush 501 and the second brush 502 each correspond to a position sensor, and the lengths of the first brush 501 and the second brush 502 are different, so that the different positions moved by the first connecting plate 203 can be detected. In some specific embodiments, the length of the first brush 501 can correspond to the detectable length when the first connecting plate 203 is closest to the center of the substrate 1. That is, when the first connecting plate 203 moves to its closest limit position to the center of the substrate 1, the first brush 501 is detected by the corresponding position sensor 50, thereby triggering a position signal and controlling the drive unit 201 to stop driving the first connecting plate 203 to move towards the center of the substrate 1. The length of the second brush 502 can correspond to the detectable length when the first connecting plate 203 is furthest away from the center of the substrate 1. That is, when the first connecting plate 203 moves to its furthest limit position away from the center of the substrate 1, the second brush 502 is detected by the corresponding position sensor, thereby triggering a position signal and controlling the drive unit 201 to stop driving the first connecting plate 203 to move away from the center of the substrate 1. In this embodiment, by setting two position sensors 50 and the first brush 501 and the second brush 502, the movement range of the first connecting plate 203 is limited by electrical signal control to prevent excessive movement.

[0038] In another embodiment, different sensors can also be disposed at other locations on substrate 1 to assist the wafer clamping device in clamping the wafer. For example, refer to Figure 4 A sensor 60 is provided at the center of the substrate 1. The sensor 60 is used to sense whether there is a wafer under the wafer clamping device so that the wafer clamping device can clamp it.

[0039] In one embodiment, reference Figure 5 A waterproof cover 3 is provided on the substrate 1 to cover the area where the clamping mechanism 2 is located; each waterproof cover 3 corresponding to the mounting plate 10 is provided with an exhaust vent 31 connecting to the outside. Specifically, the waterproof cover 3 can be configured to cover the mounting plate 10 accordingly, such as... Figure 5 As shown, each clamping mechanism 2 is covered with a waterproof cover 3. The waterproof cover 3 can be integrated or installed separately to ensure that the inside of the wafer clamping device is not affected by moisture. Each area of ​​the waterproof cover 3 corresponding to each clamping mechanism 2 is provided with an exhaust vent 31, i.e., the exhaust vent 31 is installed in a zoned manner. This allows negative pressure to be created inside each zone, ensuring that no contaminants overflow when each clamping mechanism 2 moves, thus improving the cleanliness of the wafer fabrication process.

[0040] In one embodiment, reference Figure 5 The wafer clamping device also includes a support post 102 and a top plate 103. The support post 102 is disposed on the substrate 1, and the top plate 103 is mounted on the support post 102. The top plate 103 is used to mount the wafer clamping device on other equipment, such as a robotic arm, and to move the entire wafer clamping device. Furthermore, the support post 102 can be configured according to the structure and shape of the substrate 1 to ensure the overall stress stability of the wafer clamping device. For example, as... Figure 5 As shown, each adjacent clamping mechanism 2 is provided with a support column 102 at the angle between the centers of the base plate 1, and the three support columns 102 form a stable fixing structure.

[0041] Based on the above implementation methods, refer to Figures 1-5 Another optional working process of the wafer clamping device in this embodiment is as follows: The sensor 60 detects that there is a wafer 4 to be clamped below the wafer clamping device. Each driving component 201 drives the first connecting plate 203 to move, causing the clamping claws 212 to move away from the center of the substrate 1, that is, each clamping claw 212 is in an open state; the wafer clamping device moves down to a position where the first elastic element 223 of each guide component 22 corresponds to the edge of the wafer 4 and surrounds the wafer 4; the driving component 201 drives the first connecting plate 203 to move slightly towards the center of the substrate 1, so that the first elastic element 223 contacts the edge of the wafer 4 and positions the initial clamping position; the driving component 201 continues to drive the first connecting plate 203 to move the clamping claws 212 towards the center of the substrate 1, further clamping the wafer 4. For wafers 4 of different sizes, simply adjust the movement of the clamping claws 212 by different distances to achieve clamping of wafers 4 of different sizes. Furthermore, when the wafer clamping device needs to adjust the position of the wafer center, each driving component 201 drives the corresponding gripper 212 on the first connecting plate 203 to move a different distance, so that the center of the wafer 4 is adjusted to the required position.

[0042] Furthermore, this application provides a wafer centering adjustment method based on the wafer clamping device described above. The method specifically includes the following steps: Step S101: Obtain the actual center position of the clamped wafer relative to the center of substrate 1; Step S102: Calculate the adjustment distance of each clamping component 21 in its corresponding moving direction based on the actual center position; Step S103: Control each driving component 20 to drive the corresponding clamping component 21 to move and adjust the distance so that the center of the clamped wafer is aligned with the center of the substrate 1.

[0043] It is understandable that when it is necessary to adjust the position of the wafer center, the target can be set to adjust the center of the clamped wafer to the center of the substrate 1, thereby achieving precise positioning of the wafer center when the wafer is moved to the next position. In the process of adjusting the center of the clamped wafer to the center of the substrate 1, it is first necessary to obtain the actual center position of the wafer, and then calculate the distance from the actual center position of the wafer to the center of the substrate 1. Since the movement of the wafer can only be adjusted in the corresponding direction of each clamping component 21, it is actually necessary to calculate the adjustment distance of the actual center position in the direction in which the wafer can move. Based on the adjustment distance, each driving component 20 is controlled to drive the clamping component 21 to move a relative distance, thereby achieving the actual center position of the wafer reaching the center of the substrate 1 and completing the precise alignment of the wafer center.

[0044] To facilitate explanation of the specific method and principle steps for adjusting the wafer center of the wafer clamping device in this application, please refer to... Figures 1-5 The structural setup is illustrated in detail with an example of three clamping mechanisms 2 evenly distributed around the center of the substrate 1.

[0045] Reference Figure 6 The wafer clamping device is placed in a Cartesian coordinate system from top view, with the center of substrate 1 as the origin (0,0). The clamping mechanisms are clamping mechanism A, clamping mechanism B, and clamping mechanism C. Clamping mechanism A and clamping mechanism B are placed in the fourth quadrant and the first quadrant, respectively, and the central axis La of clamping mechanism A corresponding to the origin is on the bisector line. Above, the central axis Lb of the clamping mechanism B corresponding to the origin is on the bisector line. Above, the central axis Lc of the corresponding origin of the clamping mechanism C is on the negative half axis of the Y-axis (the included angle between the central axes of the corresponding origins of adjacent clamping mechanisms is 120°). Let the actual center position of the wafer be (x, y), and the distance that clamping mechanisms A, B, and C need to be adjusted in their corresponding directions be δ. a δ b δ c By adjusting δ a δ b δ c This makes the center of the wafer reach the origin of the coordinate system (0,0).

[0046] 1)Reference Figure 7 When the actual center position (x1, y1) is in the first quadrant, the nearest bisector is... The actual center of the circle needs to move a distance δ along its direction of movement (in phase with the Y-axis) via the clamping mechanism C. c Then, through clamping mechanism B in its direction of movement (bisector) The distance δ moves in the direction of b No adjustment is needed in the clamping mechanism A direction; based on the geometric relationship in the diagram, we can obtain: , , ; 2) When the actual center of the circle is (x2, y2) in the second quadrant, the nearest bisector is: The actual center of the circle needs to move a distance δ along its direction of movement (in phase with the Y-axis) via the clamping mechanism C. c Then, the clamping mechanism A moves along its direction (bisectors). The distance δ moves in the direction of a No adjustment is needed in the direction of clamping mechanism B; based on the geometric relationship in the diagram, we can obtain: , , ; 3) When the actual center position (x3, y3) is in the third quadrant, the nearest bisector is... The actual center of the circle needs to move a distance δ along its direction of movement (in phase with the Y-axis) via the clamping mechanism C. c Then, through clamping mechanism B in its direction of movement (bisector) The distance δ moves in the direction of b No adjustment is needed in the clamping mechanism A direction; based on the geometric relationship in the diagram, we can obtain: , , ; 4) When the actual center of the circle is (x4, y4) in the fourth quadrant, the nearest bisector is: The actual center of the circle needs to move a distance δ along its direction of movement (in phase with the Y-axis) via the clamping mechanism C. c Then, the clamping mechanism A moves along its direction (bisectors). The distance δ moves in the direction of a No adjustment is needed in the direction of clamping mechanism B; based on the geometric relationship in the diagram, we can obtain: , , ; In summary, when the wafer clamping device of this application needs to adjust the center, the actual position of the wafer center and each clamping mechanism 2 can be placed in a Cartesian coordinate system. Using geometric relationships, the required movement distance of the wafer center in each direction of movement of the clamping mechanism 2 can be calculated. The movement of each clamping mechanism 2 is then controlled by controlling the corresponding distance, thereby aligning the center with the center of the substrate 1 and completing the positioning adjustment. The adjustment method of this application can achieve accurate and efficient adjustment of the wafer center.

[0047] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0048] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A wafer chucking device characterized by comprising: The utility model relates to a wafer clamping device and a wafer clamping method. The utility model discloses a substrate (1) has from the center to the outside extension a plurality of mounting plate (10); A plurality of clamping mechanisms (2) are correspondingly arranged on the mounting plate (10), and the clamping mechanism (2) includes a driving assembly (20) and a clamping assembly (21); the driving assembly (20) is configured to drive the clamping assembly (21) to move towards the center of the substrate (1) to clamp a wafer; Wherein the driving assembly (20) of each clamping mechanism (2) is further configured to individually drive the moving distance of the corresponding clamping assembly (21) to adjust the center position of the clamped wafer.

2. The wafer chucking apparatus according to claim 1, wherein The driving assembly (20) includes a driving member (201), a first linear guide (202) and a first connecting plate (203); The first linear guide (202) is arranged on the mounting plate (10), the first connecting plate (203) is slidably arranged on the first linear guide (202), and the clamping assembly (21) is arranged on the first connecting plate (203); The driving member (201) is configured to drive the first connecting plate (203) to move along the first linear guide (202) to drive the clamping assembly (21) to move towards the center of the substrate (1).

3. The wafer chucking apparatus according to claim 2, wherein The center axis of each mounting plate (10) passes through the center of the substrate (1); The first linear guide (202) is arranged along the center axis of the corresponding mounting plate (10) or, The first linear guide (202) has at least two first linear guides (202) which are symmetrically and parallelly arranged about the center axis of the corresponding mounting plate (10).

4. The wafer chucking apparatus according to claim 2 or 3, characterized by, A first limiting block (30) is arranged on the mounting plate (10) near one end of the first linear guide (202), and the first limiting block (30) is configured to abut against the first connecting plate (203) to limit the farthest distance of the clamping assembly (21) moving away from the center of the substrate (1); The driving member (201) is arranged on the mounting plate (10) through a fixing seat (2011), and a second limiting block (40) is arranged on the end of the first connecting plate (203) away from the clamping assembly (21), and the second limiting block (40) is configured to abut against the fixing seat (2011) to limit the closest distance of the clamping assembly (21) moving towards the center of the substrate (1).

5. The wafer chucking apparatus according to claim 2, wherein The clamping assembly (21) includes a fixed plate (211) and a clamping jaw (212), one end of the fixed plate (211) is arranged on the first connecting plate (203), and the other end extends to below the corresponding mounting plate (10) and is arranged with the clamping jaw (212).

6. The wafer chucking apparatus according to claim 5, wherein The clamping assembly (21) further includes a guide assembly (22), and the guide assembly (22) includes a sliding assembly and a chuck (221); the chuck (221) is arranged on the sliding assembly, and the sliding assembly is slidably arranged on the first connecting plate (203). The clamping head (221) is arranged on both sides of the clamping jaw (212), and a supporting rod (222) is connected to the clamping head (221) at a position corresponding to the clamping jaw (212), and a first elastic member (223) is arranged on the supporting rod (222).

7. The wafer chucking apparatus according to claim 6, wherein The sliding assembly comprises a second connecting plate (224), a connecting block (225) and a second linear guide rail (226). The second linear guide rail (226) is arranged on the first connecting plate (203), and the arrangement direction of the second linear guide rail (226) is consistent with the arrangement direction of the first linear guide rail (202). The second connecting plate (224) is slidingly installed on the second linear guide rail (226); the clamping head (221) and the connecting block (225) are arranged on the second connecting plate (224). A third connecting plate (204) is arranged on the first connecting plate (203), and the driving end of the driving member (201) is connected to the third connecting plate (204); the connecting block (225) and the third connecting plate (204) are oppositely arranged and connected by a second elastic member (227).

8. The wafer chucking apparatus of claim 1, wherein At least one position sensor (50) is arranged on the mounting plate (10), and the position sensor (50) is configured to detect the position of the clamping assembly (21).

9. The wafer chucking apparatus according to claim 1, wherein A waterproof cover (3) covering the area where the clamping mechanism (2) is arranged is arranged on the substrate (1); and a suction joint (31) communicating with the outside is arranged on the waterproof cover (3) corresponding to each mounting plate (10).

10. A wafer center adjustment method, characterized by, The method based on the wafer clamping device according to any one of claims 1-9, the method comprising: acquiring the actual center position of the clamped wafer relative to the center of the substrate (1); calculating the adjustment distance of each clamping assembly (21) in the corresponding moving direction according to the actual center position; controlling each driving assembly (20) to drive the corresponding clamping assembly (21) to move the adjustment distance, so that the center of the clamped wafer is aligned with the center of the substrate (1).

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