Touch ultrasonic equipment

Abstract

The invention discloses a touch control type ultrasonic device which comprises a touch control type ultrasonic host, the touch control type ultrasonic host comprises a host shell, a main control board, a radiator and a cooling fan, the host shell is internally provided with a containing cavity, the main control board, the radiator and the cooling fan are contained in the containing cavity, and the main control board, the radiator and the cooling fan are sequentially arranged in the thickness direction of the host shell; a first air inlet and a first air outlet are formed in the main machine shell, and the air outlet direction of the first air outlet is arranged in the thickness direction of the main machine shell; the radiator is used for radiating the main control board, and the radiator is located on a radiating air duct between the first air inlet and the first air outlet; the cooling fan corresponds to the first air outlet in position, and the air outlet direction of the cooling fan is arranged in the thickness direction of the host shell. By changing the relative positions of the cooling fan and the radiator and the air outlet direction of the cooling fan, the heat dissipation performance of the touch ultrasonic host is improved, the size of the touch ultrasonic host in the width direction can be reduced, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of medical devices, in particular to a touch ultrasonic device. BACKGROUND

[0002] The conventional ultrasonic device includes a machine body and an ultrasonic host, a display support arm, a display, a probe cup holder and the like installed on the machine body, and the ultrasonic host and the display screen are usually two independent devices, the integration degree of the whole ultrasonic device is not high, and the quality is heavy, and the operation of the medical staff to push the ultrasonic device to move is not convenient.

[0003] To solve the above problems, the ultrasonic host and the display screen are integrated into a touch ultrasonic host. The touch ultrasonic host includes a host shell and a main control board arranged in the host shell; the host shell is spliced by a front shell and a rear shell, the front shell is provided with a touch screen for realizing touch display function, and the main control board is integrated with various functional modules such as digital processing module, power module, signal processing controller and front-end analog signal processing circuit module.

[0004] Because the heat generation of each functional module on the main control board is relatively large, a radiator and a cooling fan are needed to cool the main control board. In the related technology, the cooling fan is generally installed at the end of the main control board, and the air outlet direction of the cooling fan is opposite to the heat dissipation channel on the radiator. When the cooling fan blows against the heat dissipation channel on the radiator for a long time, dust is easily accumulated on the fins, which reduces the heat dissipation efficiency of the device and finally reduces the product reliability. SUMMARY

[0005] Therefore, the technical problem to be solved by the present application is to overcome the defects of low heat dissipation efficiency and poor product reliability of the touch ultrasonic host in the prior art, so as to provide a touch ultrasonic device.

[0006] To solve the above technical problems, the technical scheme of the present application is as follows:

[0007] A touch ultrasonic device includes a touch ultrasonic host, the touch ultrasonic host includes a host shell with a containing cavity inside and a main control board, a radiator and a cooling fan received in the containing cavity, the main control board, the radiator and the cooling fan are arranged in sequence along the thickness direction of the host shell;

[0008] A first air inlet and a first air outlet are formed on the host shell;

[0009] The radiator is used for cooling the main control board, and the radiator is located on the cooling air duct between the first air inlet and the first air outlet;

[0010] The heat dissipation fan is arranged corresponding to the first air outlet position, and the air outlet direction of the heat dissipation fan is arranged along the thickness direction of the main shell.

[0011] Further, the air inlet direction of the first air inlet is arranged along the length direction or the width direction of the main shell, and the air outlet direction of the first air outlet (12b) is arranged along the thickness direction of the main shell.

[0012] Further, the main shell is provided with a main board shielding cover, the main control board and the heat sink are located in the space covered by the main board shielding cover; one end of the main board shielding cover close to the first air inlet is provided with a first vent hole, the side surface of the main board shielding cover opposite to the main control board is provided with a second vent hole, and the heat dissipation fan is installed outside the main board shielding cover and arranged opposite to the second vent hole.

[0013] Further, the main control board is provided with a plurality of heating areas, the inside of the main board shielding cover is provided with a plurality of wind blocking strips for separating adjacent two heating areas, and the wind blocking strips separate the heat dissipation air duct into a plurality of independent area heat dissipation air ducts.

[0014] Further, the inside of the main board shielding cover is further provided with a wind blocking block located in one of the area heat dissipation air ducts.

[0015] Further, the inside of the main board shielding cover is provided with a plurality of marking lines, and the wind blocking strips and the wind blocking block are adhered and fixed on the corresponding marking lines.

[0016] Further, each heating area is provided with a group of heat sinks and a group of heat dissipation fans corresponding to the heating area.

[0017] Further, the heating area is provided with a heating device, one side of the heat sink facing the heating device is provided with a heat pipe, and the other side of the heat sink away from the heating device is provided with a fin; the side of the heat sink provided with the heat pipe is adhered to the heating device through heat-conducting silica gel.

[0018] Furthermore, the heat-generating areas include a first heat-generating area, a second heat-generating area, and a third heat-generating area arranged side-by-side along the length of the main control board; the first heat-generating area is provided with a transmitting chip and a receiving chip, the second heat-generating area is provided with an FPGA chip, and the third heat-generating area is provided with a CPU chip and a PCH chip; the heat sink includes a first heat sink for dissipating heat from the first heat-generating area, a second heat sink for dissipating heat from the second heat-generating area, and a third heat sink for dissipating heat from the third heat-generating area; the cooling fans include a first cooling fan for dissipating heat from the first heat sink, a second cooling fan for dissipating heat from the second heat sink, and a third cooling fan for dissipating heat from the third heat sink.

[0019] Furthermore, it also includes a body and a support arm; the support arm is connected above the body, and the touch-screen ultrasound host is connected to the support arm.

[0020] The technical solution of this invention has the following advantages: By changing the relative positions of the cooling fan and the radiator, as well as the airflow direction of the cooling fan, it avoids the cooling fan blowing directly on the radiator for extended periods, preventing dust accumulation on the radiator and allowing it to maintain excellent heat dissipation performance for longer periods, thereby improving the long-term reliability of the touch-sensitive ultrasonic host. Furthermore, compared to the traditional arrangement of the cooling fan and radiator side-by-side along the width of the touch-sensitive ultrasonic host, the cooling fan does not require installation space in the width direction of the host housing, reducing the size of the host housing in that direction. Moreover, changing the cooling fan's installation from vertical to horizontal relative to the host housing does not increase the thickness of the host housing. In addition, this touch-sensitive ultrasonic host has simple parts processing, convenient assembly, low production costs, and significantly improves the product's competitiveness. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of the touch-screen ultrasound device in an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the overall structure of the touch-sensitive ultrasound device in an embodiment of the present invention, wherein the touch-sensitive ultrasound host is shown in an exploded view.

[0024] Figure 3 This is a schematic diagram of the overall structure of the touch-screen ultrasound host in an embodiment of the present invention;

[0025] Figure 4 This is an exploded view of the internal structure of the touch-screen ultrasound host in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the mounting structure of the cooling fan on the motherboard shield in an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the main control board in an embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of the structure of the outer side of the motherboard shielding cover in an embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the structure of the inner side of the motherboard shielding cover in an embodiment of the present invention;

[0030] Figure 9 This is a schematic diagram of the front of the first heat sink in an embodiment of the present invention;

[0031] Figure 10 This is a schematic diagram of the structure of the back of the first heat sink in an embodiment of the present invention;

[0032] Figure 11 This is a schematic diagram of the front structure of the second heat sink in an embodiment of the present invention;

[0033] Figure 12 This is a schematic diagram of the structure of the back of the second heat sink in an embodiment of the present invention;

[0034] Figure 13 This is a schematic diagram of the front structure of the third heat sink in an embodiment of the present invention;

[0035] Figure 14 This is a schematic diagram of the structure on the back of the third heat sink in an embodiment of the present invention.

[0036] Explanation of reference numerals in the attached diagram: 1. Touch-sensitive ultrasound main unit; 2. Body; 21. Base; 22. Column; 3. Support arm; 11. Front shell; 12. Rear shell; 12a. First air inlet; 12b. First air outlet; 12c. Second air inlet; 13. Main control board; 131. Receiver chip; 132. Transmitter chip; 133. First set of through holes; 134. FPGA chip; 135. Second set of through holes; 136. CPU chip; 13 7. PCH chip; 138. First set of mounting holes; 139. Second set of mounting holes; 14. Touch screen; 15. Motherboard shield; 151. First ventilation hole; 152. Second ventilation hole; 153. Stud; 154. Positioning post; 155. Notch; 156. Wiring hole; 157. Rectangular opening; 1581. Long dashed line; 1582. Square dashed line; 1583. Short dashed line; 16. Motherboard mounting plate; 171. First diffuser Heat sink; 1711, First fin; 1712, First mounting hole; 1713, First heat pipe; 172, Second radiator; 1721, Second fin; 1722, Second screw; 1723, Second heat pipe; 1724, Second square copper block; 173, Third radiator; 1731, Third fin; 1732, Third screw; 1733, Third heat pipe; 1734, Third square copper block; 1735, Third rectangular copper block ; 1736, clearance hole; 181, first cooling fan; 182, second cooling fan; 183, third cooling fan; 191, first air baffle; 192, second air baffle; 193, third air baffle block; 201, first thermal conductive silicone; 202, second thermal conductive silicone; 203, third thermal conductive silicone; 204, fourth thermal conductive silicone; 205, fifth thermal conductive silicone; 21, cover plate; 22, upgrade and maintenance board; A, heat dissipation air duct. Detailed Implementation

[0037] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0039] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0040] like Figure 1 The illustrated touch-sensitive ultrasound device includes a touch-sensitive ultrasound host 1, a body 2, and a support arm 3. The body 2 includes a base 21 supported on the ground and a column 22 fixed above the base 21. The support arm 2 is connected to the end of the column 22 facing away from the base 21. The support arm 3 is connected above the column 22, and the touch-sensitive ultrasound host 1 is connected to the support arm 3. The touch-sensitive ultrasound host 1 can move up and down and translate relative to the body 2 through the movement of the support arm 3. The touch-sensitive ultrasound host 1 can also move up and down relative to the support arm 3. The touch-sensitive ultrasound host 1 can maintain its position and posture after movement.

[0041] like Figure 2 As shown, the touch-screen ultrasound host 1 includes a host housing, a touch screen 14, and a motherboard mounting plate 16. The host housing is generally flat and includes a front shell 11 and a rear shell 12 that are interconnected and enclose a mounting cavity. The touch screen 14 and the motherboard mounting plate 16 are both mounted on the rear shell 12. The front shell 11 refers to the side of the host housing facing the user, and the rear shell 12 refers to the side of the host housing facing away from the user. The front shell 11 has a square frame structure, and the touch screen 14 is a square structure slightly smaller than the front shell 11. The touch screen 14 is embedded in the front shell 11 and can display ultrasound images and virtual buttons. Users can input corresponding control commands by clicking the virtual buttons on the touch screen 14. It should be noted that, taking the square touch screen 14 as a reference, the thickness direction of the touch screen 14 is the thickness direction of the main body shell, the length direction of the touch screen 14 is the length direction of the main body shell, and the width direction of the touch screen 14 is the width direction of the main body shell; the thickness of the main body shell is less than the length and width of the main body shell.

[0042] like Figure 3As shown, the rear shell 12 is provided with a first air inlet 12a, a first air outlet 12b, and a second air inlet 12c. The first air inlet 12a and the second air inlet 12c are respectively located on the left and right sides of the rear shell 12, and the air intake direction of the first air inlet 12a and the second air inlet 12c is arranged along the width direction of the main body shell. The first air outlet 12b is located on the back side of the rear shell 12 parallel to the touch screen 14, and the first air outlet 12b is located away from the second air inlet 12c; the air outlet direction of the first air outlet 12b is arranged along the thickness direction of the main body shell. A cooling fan is provided inside the main body shell, which is directly opposite to the first air outlet 12b, and the air outlet direction of the cooling fan is arranged along the thickness direction of the rear shell 12. In an alternative embodiment, the second air inlet 12c on the rear shell 12 can be omitted, or the second air inlet 12c can be located at the bottom of the rear shell 12. External air mainly enters the main unit casing through the first air inlet 12a and the second air inlet 12c, and then flows out from the first air outlet 12b under the action of the cooling fan, so as to remove the heat inside the main unit casing.

[0043] like Figure 4 and Figure 5 As shown, the main control board 13, heat sinks, motherboard shielding cover 15, and cooling fans are also housed within the receiving cavity of the main unit casing. The heat sinks include a first heat sink 171, a second heat sink 172, and a third heat sink 173 located on the same plane. All three heat sinks are flat finned heat sinks. The cooling fans include a first cooling fan 181, a second cooling fan 182, and a third cooling fan 183 located on the same plane. All three heat sinks are fixed to the outer surface of the motherboard shielding cover 15 facing away from the main control board 13.

[0044] The main control board 13, heat sink, and cooling fan are arranged sequentially along the thickness direction of the host casing. The main control board 13 is fixed to the side of the motherboard mounting plate 16 facing the rear shell 12. The first heat sink 171, the second heat sink 172, and the third heat sink 173 are fixed to the side of the main control board 13 facing the rear shell 12. The motherboard shielding cover 15 is fixed to the motherboard mounting plate 16, and the main control board 13, the first heat sink 171, the second heat sink 172, and the third heat sink 173 are all located within the space covered by the motherboard shielding cover 15. The first heat sink 171, the second heat sink 172, and the third heat sink 173 are located on the heat dissipation airflow channel A between the first air inlet 12a and the first air outlet 12b, and are used to dissipate heat from the main control board 13 and the chips on it. Figure 4The dotted arrows indicate the airflow direction in the heat dissipation duct A. The first cooling fan 181, the second cooling fan 182, and the third cooling fan 183 are all mounted outside the motherboard shield 15 and located between the motherboard shield 15 and the rear shell 12. Each set of cooling fans dissipates heat from its corresponding heatsink. The airflow direction of the cooling fans is set along the thickness direction of the motherboard casing; that is, the thickness direction of the cooling fans is the same as the thickness direction of the motherboard casing. The cooling fans are mounted horizontally on the outer surface of the motherboard shield 15. It can be understood that the number and position of the heatsinks and cooling fans can be adaptively adjusted according to the layout of the main heat-generating components on the main control board 13.

[0045] like Figure 4 As shown in Figure 6, the motherboard shield 15 is a cuboid with five sides. First ventilation holes 151 are provided on one side of the motherboard shield 15 near the first air inlet 12a and at one end of the top surface of the motherboard shield 15 near the first air inlet 12a. Multiple first ventilation holes 151 are arranged in an array. External air enters the host casing through the first air inlet 12a and then enters the motherboard shield 15 through the first ventilation holes 151. Three sets of second ventilation holes 152 are provided on the top surface of the motherboard shield 15. Multiple positioning posts 154 and multiple studs 153 are provided around the second ventilation holes 152. The cooling fan is positioned by the positioning posts 154, precisely covering the second ventilation holes 152, and then fixed by the studs 153. The air intake direction of the cooling fan faces the second ventilation holes 152, and the cooling fan draws air through the second ventilation holes 152 in a direction perpendicular to the top surface of the motherboard shield 15, drawing heat from the heatsink out through the second ventilation holes 152.

[0046] This touch-sensitive ultrasonic host 1, by changing the relative positions of the cooling fan and the heat sink, as well as the airflow direction of the cooling fan, can, on the one hand, avoid the cooling fan blowing directly on the heat sink for extended periods, preventing dust accumulation on the heat sink and allowing it to maintain excellent heat dissipation performance for longer periods, thereby improving the long-term operational reliability of the touch-sensitive ultrasonic host 1. On the other hand, compared to the traditional arrangement of the cooling fan and heat sink side-by-side along the width of the touch-sensitive ultrasonic host 1, the cooling fan does not need to occupy installation space in the width direction of the host housing, thus reducing the size of the host housing in the width direction. Moreover, changing the cooling fan from a vertical to a horizontal installation relative to the host housing does not increase the size of the host housing in the thickness direction. In addition, this touch-sensitive ultrasonic host 1 has simple parts processing, is relatively easy to assemble, has low production costs, and significantly improves the product's competitiveness.

[0047] In some implementations, such as Figure 5 and Figure 7As shown, the main control board 13 is a PCB circuit board. Functional components are mounted on both sides of the main control board 13, and some chips on the main control board 13 are individually shielded. Taking the main control board 13 in a vertical position as a reference, a set of receiving chips 131 and a set of transmitting chips 132 are integrated at the lower end of the main control board 13. The set of receiving chips 131 are arranged side by side at the lower end of the main control board 13, and the set of transmitting chips 132 is located on the main control board 13 above the set of receiving chips 131. The main control board 13 has a first set of through holes 133 located between the set of receiving chips 131 and the set of receiving chips 132. A first heat sink 171 is fixed on the first set of through holes 133. The first heat sink 171 is used to dissipate heat from the set of receiving chips 131 and the set of receiving chips 132. An FPGA chip 134 is integrated in the middle of the main control board 13. A second set of through holes 135 is provided diagonally opposite the FPGA chip 134. A second heat sink 172 is fixed to the second set of through holes 135 and is used to dissipate heat from the FPGA chip 134. A CPU chip 136 is provided at the upper right end of the main control board 13. A PCH chip 137 is provided above the CPU chip 136. A first set of mounting holes 138 is provided around the CPU chip 136. A third heat sink 173 is fixed to the first set of mounting holes 138 and is used to dissipate heat from the CPU chip 136 and the PCH chip 137. A second set of mounting holes 139 is provided around the main control board 13. The main control board 13 is fixed to the motherboard mounting plate 16 by multiple screws passing through the second set of mounting holes 139. The motherboard mounting plate 16 is provided with a third set of mounting holes. The motherboard shield 15 is fixed to the motherboard mounting plate 16 by multiple screws passing through the third set of mounting holes, and the motherboard shield 15 covers the outer periphery of the main control board 13.

[0048] Since the receiving chip 131, transmitting chip 132, FPGA chip 134, CPU chip 136, and PCH chip 137 on the main control board 13 are chips that generate a large amount of heat, targeted heat dissipation is needed for these chips based on their location and layout on the main control board 13. This is to avoid affecting the overall performance of the touch-sensitive ultrasound host 1 due to poor local heat dissipation. Based on the layout and heat generation of the chips on the main control board 13, the main control board 13 is divided into a first heat-generating area, a second heat-generating area, and a third heat-generating area arranged side-by-side along its length. For example... Figure 5 As shown, the motherboard shielding cover 15 has several baffles inside that separate two adjacent heat-generating areas. These baffles divide the heat dissipation airflow channel A into three independent heat dissipation airflow channels. Figure 4The three dashed arrows in the diagram represent three regional heat dissipation air ducts, with the direction of the dashed arrows indicating the airflow direction within the regional heat dissipation air ducts. The baffle strips are specifically long strips of foam. The baffle strips include three longer first baffle strips 191 and one shorter second baffle strip 192. The lengths of the three first baffle strips 191 and the one second baffle strip 192 extend along the width direction of the motherboard shielding cover 15. Two of the first baffle strips 191 are located at the upper and lower edges of the main control board 13; the other first baffle strip 191 and the second baffle strip 192 are located between the two first baffle strips 191, with the first baffle strip 191 positioned between the transmitter chip 132 and the FPGA chip 134, serving to separate the first and second heat-generating areas; the second baffle strip 192 is positioned between the FPGA chip 134 and the CPU chip 136, serving to separate the second and third heat-generating areas. These air deflectors can isolate heat transfer between different chips within the motherboard shield 15, creating an independent cooling airflow for each heat-generating area. Each cooling airflow is cooled by heat dissipation fins and a cooling fan, thus enhancing the cooling effect.

[0049] Furthermore, the motherboard shield 15 also has a third baffle block 193 located in the second heat-generating area. The third baffle block 193 is specifically a square piece of foam. The third baffle block 193 can lower the local ventilation height of the regional heat dissipation air duct. When the air flows through the lower part of the regional heat dissipation air duct, the air velocity will increase, thereby effectively and quickly removing the heat from the second heat sink 172.

[0050] Specifically, the transmitting chip 132 and the receiving chip 131 are located in the first heat-generating area, the FPGA chip 134 is located in the second heat-generating area, and the CPU chip 136 and the PCH chip 137 are located in the third heat-generating area. A first heat sink 171 dissipates heat from the first heat-generating area, a second heat sink 172 dissipates heat from the second heat-generating area, and a third heat sink 173 dissipates heat from the third heat-generating area. A first cooling fan 181 dissipates heat from the first heat sink 171, a second cooling fan 182 dissipates heat from the second heat sink 172, and a third cooling fan 183 dissipates heat from the third heat sink 173. Each heat-generating area uses an independent heat sink and cooling fan for targeted cooling, ensuring that all chips on the main control board 13 operate stably and stably under suitable temperatures for extended periods.

[0051] like Figure 4 and Figure 6As shown, the lower end of the motherboard shield 15 has a notch 155, and a cover plate 21 is installed on the notch 155. After the cover plate 21 covers the notch 155, it forms a wiring hole 156 between itself and the motherboard shield 15. Cables inside the main control board 13 can extend out of the motherboard shield 15 through the wiring hole 156. The top surface of the motherboard shield 15 also has a rectangular opening 157. The main control board 13 has a pluggable external module (such as a storage module) at the position corresponding to the rectangular opening. An upgrade and maintenance board 22 can be detachably installed on the rectangular opening.

[0052] like Figure 8 As shown, the motherboard shielding cover 15 has multiple marking lines inside, which are dashed lines, including a long dashed line 1581, a square dashed line 1582, and a short dashed line 1583. The first air deflector strip 191 is adhered to the long dashed line 1581 of the motherboard shielding cover 15, the second air deflector strip 192 is adhered to the short dashed line 1583 of the motherboard shielding cover 15, and the third air deflector block 193 is adhered to the square dashed line 1582 of the motherboard shielding cover 15. The first air deflector strip 191, the second air deflector strip 192, and the third air deflector block 193 are all coated with adhesive on one side for attaching to the motherboard shielding cover 15.

[0053] like Figure 5 , Figure 9 and Figure 10 As shown, the first heat sink 171 is elongated. First fins 1711 are provided on the front of the first heat sink 171, and multiple first mounting holes 1712 are provided in the middle of the first heat sink 171. A first heat pipe 1713 is provided on the bottom surface of the first heat sink 171. A first thermally conductive silicone 201 is attached to the receiving chip 131, and a second thermally conductive silicone 202 is attached to the transmitting chip 132. Both the first and second thermally conductive silicone 201 are made of silicone material with a thermal conductivity of 4. The first heat sink 171 is mounted on the chip with the first and second thermally conductive silicone 201 and 202 attached. The first heat pipe 1713 on the first heat sink 171 is aligned with the transmitting chip 132, and the first mounting holes 1712 on the first heat sink 171 are aligned with the first set of through holes 133 on the main control board 13. Four screws pass through these first set of through holes 133 to lock the first heat sink 171 onto the motherboard mounting plate 16.

[0054] like Figure 5 , Figure 11 and Figure 12As shown, the second heat sink 172 has second fins 1721 on its front side and multiple second screws 1721 in the middle for connection to the main control board 13. Two second heat pipes 1723 are located on the back of the second heat sink 172, which quickly transfer heat from the FPGA chip 134 to other areas. A second square copper block 1724 is mounted on the second heat pipe 1723, which quickly absorbs heat from the FPGA chip 134 and transfers it to the second heat pipe 1723. A third thermally conductive silicone 203 is attached to the FPGA chip 134, and the second square copper block 1724 of the second heat sink 172 is attached to the third thermally conductive silicone 203. The second screws 1721 on the second heat sink 172 pass through the second set of through holes 135 on the main control board 13 and are locked onto the motherboard mounting plate 16.

[0055] like Figure 5 , Figure 13 and Figure 14 As shown, the third heatsink 173 has a third fin 1731 on its front side and multiple third screws 1732 in the middle for connecting to the main control board 13. The third heatsink 173 has a third heat pipe 1733 on its back side, which is used to quickly transfer the heat from the CPU chip 136 to other areas. A third rectangular copper block 1734 and a third rectangular copper block 1735 are provided on the third heat pipe 1733, which are used to quickly absorb the heat from the PCH chip 137 and the CPU chip 136. The third heatsink 173 also has a clearance hole 1736 on one side of the third rectangular copper block 1735. The CPU chip 136 is covered with a fourth thermal conductive silicone 204, and the PCH chip 137 is covered with a fifth thermal conductive silicone 205. Both the fourth thermal conductive silicone 204 and the fifth thermal conductive silicone 205 are square in shape and are made of silicone material with a thermal conductivity of 6.

[0056] The assembly process of this touch-screen ultrasound host is as follows: The main control board 13 is installed onto the main board mounting plate 16, and secured with multiple screws passing through the mounting holes on the main control board 13. Multiple first thermally conductive silicone 201s are applied to the receiving chip 131 on the main control board 13; multiple second thermally conductive silicone 202s are applied to the transmitting chip 132 on the main control board 12; a first heat sink 171 is installed onto the chip with the first and second thermally conductive silicone 201s applied, with the first heat pipe 1711 on the first heat sink 171 aligned with the transmitting chip 132, and the mounting holes 1712 on the first heat sink 171 aligned with the first set of through holes 133 on the main control board 12. Four screws are then used to secure it to the main board mounting plate 16 through the first set of through holes 133. Apply the third thermal conductive silicone 203 to the FPGA chip 134 on the main control board 13. Install the second heat sink 172 onto the main control board 13. Apply the second square copper block 1724 to the third thermal conductive silicone 203. The second screw 1722 on the second heat sink 172 passes through the second set of through holes 135 on the main control board 13 and is locked to the motherboard mounting plate 16. Apply the fourth thermal conductive silicone 204 to the CPU chip 136 on the main control board 13. Apply the fifth thermal conductive silicone 205 to the PCH chip 137 on the main control board 13. Install the third heat sink 173 into the CPU chip 136 position, with the third square copper block 1734 applied to the fifth thermal conductive silicone 205 and the third rectangular copper block 1735 applied to the fourth thermal conductive silicone 204. Align the second screw 1732 on the third heat sink 173 with the mounting hole 138 on the main control board 13 and lock it in place. The main control board 13 and the three heat sinks are assembled. Remove the adhesive backing from the third air baffle 193 and attach the adhesive side of the third air baffle 193 to the square dotted line 1582 on the motherboard shielding cover 15. Remove the adhesive backing from the three first air baffle strips 191 and attach the adhesive side of the first air baffle strips 191 to the long dotted line 1581 on the motherboard shielding cover 15. Remove the adhesive backing from the second air baffle strip 192 and attach the adhesive side of the second air baffle strip 192 to the short dotted line 1583 on the motherboard shielding cover 15. Install the upgrade and maintenance board 22 onto the motherboard shielding cover 15 and secure it with screws. Install the motherboard shielding cover 15 with foam padding onto the motherboard mounting plate 16 and secure it with multiple screws. Then install the cover plate 21 into the notch 155 on the motherboard shielding cover 15 and secure it with screws. The assembly of this touch-sensitive ultrasonic host is now complete.

[0057] In summary, the touch-sensitive ultrasonic device provided in this embodiment of the invention, by changing the relative positions of the cooling fan and the radiator, as well as the airflow direction of the cooling fan, can, on the one hand, avoid the cooling fan blowing directly on the radiator for extended periods, preventing dust accumulation on the radiator and allowing it to maintain excellent heat dissipation performance for a longer time, thereby improving the long-term reliability of the touch-sensitive ultrasonic host 1. On the other hand, compared with the traditional arrangement of the cooling fan and radiator side by side along the width direction of the touch-sensitive ultrasonic host 1, the cooling fan does not need to occupy installation space in the width direction of the host housing, thus reducing the size of the host housing in the width direction. Moreover, changing the cooling fan from a vertical to a horizontal installation relative to the host housing does not increase the size of the host housing in the thickness direction. In addition, this touch-sensitive ultrasonic device has simple parts processing, convenient assembly, low production cost, and significantly improves the product's competitiveness.

[0058] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A touch ultrasonic device, comprising: The application relates to a touch ultrasonic host computer (1) which comprises a host computer shell with a containing cavity, a main control board (13), a radiator and a radiating fan which are arranged in the containing cavity in sequence along the thickness direction of the host computer shell. A first air inlet (12a) and a first air outlet (12b) are arranged on the host computer shell. The radiator is arranged on a radiating air duct (A) between the first air inlet (12a) and the first air outlet (12b) and is used for radiating the main control board (13). The radiating fan is arranged in position correspondence with the first air outlet (12b) and the air outlet direction of the radiating fan is arranged along the thickness direction of the host computer shell.

2. The touch ultrasonic device of claim 1, wherein, The air inlet direction of the first air inlet (12a) is arranged along the length direction or the width direction of the host computer shell and the air outlet direction of the first air outlet (12b) is arranged along the thickness direction of the host computer shell.

3. The touch ultrasonic device of claim 1, wherein, A main board shielding cover (15) is arranged in the host computer shell, the main control board (13) and the radiator are arranged in the space covered by the main board shielding cover (15), one end of the main board shielding cover (15) close to the first air inlet (12a) is provided with a first air vent (151), one side of the main board shielding cover (15) opposite to the main control board (13) is provided with a second air vent (152), and the radiating fan is arranged outside the main board shielding cover (15) and opposite to the second air vent (152).

4. The touch ultrasonic device of claim 3, wherein, A plurality of heating areas are arranged on the main control board (13), a plurality of wind blocking strips are arranged in the main board shielding cover (15) and separate adjacent two heating areas, and the radiating air duct (A) is separated into a plurality of independent area radiating air ducts.

5. The touch-enabled ultrasonic device of claim 4, wherein, A wind blocking block is arranged in one of the area radiating air ducts.

6. The touch ultrasonic device of claim 5, wherein, A plurality of mark lines are arranged in the main board shielding cover (15), and the wind blocking strips and the wind blocking block are fixed on the corresponding mark lines.

7. The touch-enabled ultrasonic device of claim 4, wherein, A group of radiators and a group of radiating fans are arranged on each heating area.

8. The touch-enabled ultrasonic device of claim 4, wherein, A heating device is arranged on the heating area, one side of the radiator facing the heating device is provided with a heat pipe, and the other side of the radiator away from the heating device is provided with fins, and the side of the radiator provided with the heat pipe is fixed on the heating device through heat conductive silica gel.

9. The touch ultrasonic device of claim 7, wherein, The heat generating area includes a first heat generating area, a second heat generating area and a third heat generating area arranged side by side along the length direction of the main control board (13); the first heat generating area is provided with a transmitting chip (132) and a receiving chip (131), the second heat generating area is provided with an FPGA chip (134), and the third heat generating area is provided with a CPU chip (136) and a PCH chip (137); the heat sink includes a first heat sink (171) for dissipating heat of the first heat generating area, a second heat sink (172) for dissipating heat of the second heat generating area, and a third heat sink (173) for dissipating heat of the third heat generating area; the heat dissipation fan includes a first heat dissipation fan (181) for dissipating heat of the first heat sink (171), a second heat dissipation fan (182) for dissipating heat of the second heat sink (172), and a third heat dissipation fan (183) for dissipating heat of the third heat sink (173).

10. The touch ultrasonic device of claim 1, wherein, Further comprising a machine body (2) and a support arm (3); the support arm (3) is connected above the machine body (2), and the touch ultrasonic host (1) is connected on the support arm (3).

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