Apparatus and method for manufacturing display apparatus

Abstract

An apparatus and a method for manufacturing a display apparatus are provided. The apparatus for manufacturing a display apparatus includes: a stage on which a base substrate is disposed; a discharge unit on the stage and configured to spray the first coating liquid onto the base substrate; a first sensor unit configured to detect a height of the first coating liquid applied to the first region of the base substrate; and a first temperature adjusting unit configured to adjust a temperature of the first coating liquid applied to the first region of the base substrate.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0119558, filed on September 3, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of this disclosure relate to apparatus and methods for manufacturing a display device. Background Technology

[0004] Mobile electronic devices are widely used. Recently, in addition to small electronic devices such as mobile phones, tablet PCs have been widely used as mobile electronic devices.

[0005] Mobile electronic devices include display devices for providing users with visual information such as images to support various functions. Recently, as the various components used to drive the display device have been miniaturized, the proportion of electronic devices occupied by the display device has gradually increased, and structures that can be bent from a flat state (e.g., bent to a certain degree or angle) have been developed. Summary of the Invention

[0006] Embodiments of this disclosure relate to apparatus and methods for manufacturing display devices that ensure the coating liquid applied to a substrate is flat.

[0007] The aspects and features of this disclosure are not limited to those described above.

[0008] Additional aspects and features will be set forth in part in the description which follows and will be apparent in part from the description, or may be learned by practice of the described embodiments.

[0009] According to embodiments of this disclosure, an apparatus for manufacturing a display device includes: a platform configured to receive (or support) a substrate; an emission unit on the platform and configured to spray a first coating liquid onto the substrate; a first sensor unit configured to detect the height of the first coating liquid coated onto a first region of the substrate; and a first temperature regulating unit configured to regulate the temperature of the first coating liquid coated onto the first region of the substrate. The first temperature regulating unit includes: a first temperature regulating module comprising a 1-1 conduction unit, a 1-2 conduction unit farther from the center of the platform than the 1-1 conduction unit, and a first element unit configured to transfer a temperature above room temperature to the 1-1 conduction unit and a temperature below room temperature to the 1-2 conduction unit; and a first position regulating unit configured to regulate the position of the first temperature regulating module.

[0010] The first position adjusting unit can be configured to adjust the position of the first temperature adjusting module such that the center between the 1-1 conductive unit and the 1-2 conductive unit overlaps with a high point of the first coating liquid coated to the first area of the base substrate.

[0011] The first position adjusting unit can be configured to adjust the position of the first temperature adjusting module such that the center between the 1-1 conductive unit and the 1-2 conductive unit is farther from the center of the platform than a position of a high point of the first coating liquid coated to the first area of the base substrate.

[0012] The 1-2 conductive unit can be farther from the center of the platform than the 1-1 conductive unit along the first direction, and the first position adjusting unit can be configured to linearly move the first temperature adjusting module along the first direction.

[0013] The 1-1 conductive unit and the 1-2 conductive unit can be spaced apart from each other along the first direction.

[0014] Each of the 1-1 conductive unit and the 1-2 conductive unit can be in contact with the base substrate.

[0015] The platform can have a first platform opening overlapping with the first area of the base substrate, and at least a portion of the first temperature adjusting module can be accommodated in the first platform opening.

[0016] The apparatus for manufacturing a display device can further include a second sensor unit configured to detect a height of the first coating liquid coated to a second area of the base substrate, and a second temperature adjusting unit configured to adjust a temperature of the first coating liquid coated to the second area of the base substrate. The second temperature adjusting unit can include a second temperature adjusting module including a 2-1 conductive unit, a 2-2 conductive unit farther from the center of the platform than the 2-1 conductive unit, and a second element unit configured to transfer a temperature higher than room temperature to the 2-1 conductive unit and a temperature lower than room temperature to the 2-2 conductive unit, and a second position adjusting unit configured to adjust a position of the second temperature adjusting module.

[0017] In a plan view, the first area and the second area can face each other with respect to the center of the platform.

[0018] The first element unit can include a Peltier element.

[0019] According to another embodiment of the disclosure, a method for manufacturing a display device includes: disposing a base substrate on a platform; spraying a first coating liquid onto the base substrate by a discharging unit; detecting a height of the first coating liquid coated to a first area of the base substrate by a first sensor unit; and adjusting a temperature of the first coating liquid coated to the first area of the base substrate by a first temperature adjusting unit. The first temperature adjusting unit includes: a first temperature adjusting module including a 1-1 conduction unit, a 1-2 conduction unit farther from a center of the platform than the 1-1 conduction unit, and a first element unit configured to transfer a temperature higher than room temperature to the 1-1 conduction unit and a temperature lower than room temperature to the 1-2 conduction unit; and a first position adjusting unit configured to adjust a position of the first temperature adjusting module.

[0020] The adjusting of the temperature of the first coating liquid can include adjusting the position of the first temperature adjusting module by the first position adjusting unit such that the center between the 1-1 conduction unit and the 1-2 conduction unit overlaps with a high point of the first coating liquid coated to the first area of the base substrate.

[0021] The adjusting of the temperature of the first coating liquid can include adjusting the position of the first temperature adjusting module by the first position adjusting unit such that the center between the 1-1 conduction unit and the 1-2 conduction unit is farther from the center of the platform than a position of the high point of the first coating liquid coated to the first area of the base substrate.

[0022] The 1-2 conduction unit can be farther from the center of the platform than the 1-1 conduction unit along a first direction, and the first position adjusting unit can be configured to linearly move the first temperature adjusting module along the first direction.

[0023] The 1-1 conduction unit and the 1-2 conduction unit can be spaced apart from each other along the first direction.

[0024] Each of the 1-1 conduction unit and the 1-2 conduction unit can be in contact with the base substrate.

[0025] The platform can have a first platform opening overlapping with the first area of the base substrate, and at least a portion of the first temperature adjusting module can be accommodated in the first platform opening.

[0026] The method for manufacturing a display device may further include: detecting the height of a first coating liquid coated on a second region of a substrate using a second sensor unit; and adjusting the temperature of the first coating liquid coated on the second region of the substrate using a second temperature adjustment unit. The second temperature adjustment unit may include: a second temperature adjustment module comprising a 2-1 conduction unit, a 2-2 conduction unit farther from the center of the platform than the 2-1 conduction unit, and a second element unit configured to transfer temperatures above room temperature to the 2-1 conduction unit and temperatures below room temperature to the 2-2 conduction unit; and a second position adjustment unit configured to adjust the position of the second temperature adjustment module.

[0027] In the plan view, the first area and the second area can face each other relative to the center of the platform.

[0028] The first element unit may include a Peltier element.

[0029] Other aspects, features, and embodiments of this disclosure will become more apparent from the accompanying drawings, claims, and the following detailed description. Attached Figure Description

[0030] The above and other aspects and features of embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0031] Figure 1 This is a perspective view schematically illustrating an apparatus for manufacturing a display device according to an embodiment;

[0032] Figure 2 This is a schematic cross-sectional view of an apparatus for manufacturing a display device according to an embodiment;

[0033] Figure 3 This is a flowchart describing a method for manufacturing a display device according to an embodiment;

[0034] Figure 4 This is a schematic cross-sectional view of an apparatus for manufacturing a display device according to an embodiment;

[0035] Figure 5 This is a schematic plan view of a substrate to be coated with a first coating liquid according to an embodiment;

[0036] Figures 6 to 9 This is a schematic cross-sectional view of an apparatus for manufacturing a display device according to an embodiment;

[0037] Figure 10 This is a schematic cross-sectional view showing the 11th and 12th coating liquids applied to the substrate according to an embodiment;

[0038] Figure 11 and Figure 12 This is a perspective view schematically showing a portion of a display device according to an embodiment;

[0039] Figure 13 This is a schematic cross-sectional view of a portion of a display device according to an embodiment; and

[0040] Figure 14 This is an equivalent circuit diagram showing a pixel of a display device according to an embodiment. Detailed Implementation

[0041] Reference will now be made in detail to embodiments illustrated in the accompanying drawings. At this point, the described embodiments may take different forms and should not be construed as limited to the description set forth herein. Accordingly, only embodiments are described below with reference to the accompanying drawings to explain aspects and features currently described. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0042] Because this disclosure allows for various modifications and numerous embodiments, specific embodiments will be shown in the accompanying drawings and described in the detailed description. Aspects and features of this disclosure, as well as methods of implementing them, will be elucidated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments described below and may be embodied in various forms.

[0043] It will be understood that when an element or layer is referred to as being "on," "connected to," or "attached to" another element or layer, the element or layer may be directly on, directly connected to, or attached to the other element or layer, or one or more intermediary elements or layers may be present. When an element or layer is referred to as being "directly on," "directly connected to," or "directly attached to" another element or layer, no intermediary element or layer is present. For example, when a first element is described as being "attached" or "connected to" a second element, the first element may be directly attached to or connected to the second element, or the first element may be indirectly attached to or connected to the second element via one or more intermediary elements.

[0044] Furthermore, when describing embodiments of this disclosure, the use of "may" refers to "one or more embodiments of this disclosure." When following a list of elements, expressions such as "at least one of" and "any one of" modify the entire list of elements and not individual elements of the list. As used herein, the terms "use" and "be used" may be considered synonymous with the terms "utilize" and "be exploited," respectively. As used herein, the terms "substantially," "approximately," and similar terms are used as approximate terms and not as terms of degree, and are intended to take into account the inherent biases of measurements or calculations that will be recognized by one of ordinary skill in the art.

[0045] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” may be used herein to describe the relationship of one element or feature to another element(s) as shown in the accompanying drawings. It will be understood that, in addition to the orientation depicted in the drawings, spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, then an element described as “below” or “under” other elements or features will be oriented “above” or “above” other elements or features. Thus, the term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0046] Although terms such as "first," "second," etc., can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0047] As used herein, the singular form “one” is intended to include the plural form as well, unless the context explicitly indicates otherwise.

[0048] It will be understood that the terms “comprising,” “including,” “containing,” and “having” are intended to indicate the presence of a feature or element described in the specification and are not intended to exclude the possibility that one or more other features or elements may be present or may be added.

[0049] It will be further understood that when a layer, area, or component is referred to as being "on" another layer, area, or component, the layer, area, or component may be directly on that other layer, area, or component, or may be indirectly on that other layer, area, or component, wherein the intermediary layer, area, or component is between the layer, area, or component and the other layer, area, or component.

[0050] For ease of explanation, the dimensions of the components in the accompanying drawings may be exaggerated or reduced. For example, because the dimensions and thicknesses of the components in the drawings are arbitrarily shown for ease of explanation, this disclosure is not limited thereto.

[0051] In the following embodiments, the x-axis, y-axis, and z-axis directions are not limited to directions corresponding to the three axes of a Cartesian coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis directions can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0052] When embodiments can be implemented differently, the specific process sequence may differ from the described sequence. For example, two consecutively described processes may be performed substantially simultaneously (e.g., concurrently) or in the reverse order of the described sequence.

[0053] In this specification, "plan view" refers to a view perpendicular to the substrate BS (e.g., see [reference]). Figure 1 The two-dimensional view seen in the direction perpendicular to the substrate BS. That is, "A and B spaced apart from each other in the plan view" means "A and B spaced apart from each other when viewed in the direction perpendicular to the substrate BS".

[0054] In this specification, "cross-sectional view" refers to a view perpendicular to the substrate BS (e.g., see [reference]). Figure 1 A two-dimensional view cut in the direction perpendicular to the substrate BS. Furthermore, "A and B spaced apart from each other in the cross-sectional view" means "A and B spaced apart from each other in a two-dimensional view cut in the direction perpendicular to the substrate BS".

[0055] The controller and / or any other related devices or components according to embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, and / or suitable combinations of software, firmware, and hardware. For example, various components of the controller can be formed on a single integrated circuit (IC) chip or on a separate IC chip. Furthermore, various components of the controller can be implemented on a flexible printed circuit film, a tape-on-a-package (TCP), a printed circuit board (PCB), or can be formed on the same substrate. Additionally, various components of the controller can be processes or threads that run on one or more processors in one or more computing devices, execute computer program instructions, and interact with other system components to perform the various functions described herein. The computer program instructions are stored in memory that can be implemented using standard memory devices (such as, for example, random access memory (RAM)) in the computing device. The computer program instructions can also be stored in other non-transitory computer-readable media (such as, for example, CD-ROMs or flash drives). Furthermore, those skilled in the art will recognize that the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed across one or more other computing devices without departing from the scope of exemplary embodiments of the present disclosure.

[0056] Those skilled in the art will understand that, in view of the whole of this disclosure, each suitable feature of the various embodiments of this disclosure may be combined or integrated with each other in part or in whole and may be technically linked and operated in various suitable ways, and each embodiment may be implemented independently or in combination with each other in any suitable way, unless otherwise stated or implied.

[0057] Figure 1 This is a perspective view schematically showing an apparatus 1 for manufacturing a display device according to an embodiment. Figure 2 This is a schematic cross-sectional view of the apparatus 1 used to manufacture the display device.

[0058] Figure 2 It shows along Figure 1 The cross-sectional view of device 1 used for manufacturing a display device is taken from line II-II' in the figure.

[0059] The apparatus 1 for manufacturing a display device may include a support portion 11, a platform 12, an emission unit 13, a moving unit 14, a first sensor unit 15, a second sensor unit 16, a first temperature regulating unit 17, a second temperature regulating unit 18, and a controller.

[0060] The support portion 11 can support the platform 12, the emission unit 13, the moving unit 14, the first sensor unit 15, the second sensor unit 16, the first temperature regulating unit 17, and the second temperature regulating unit 18. The support portion 11 can have a plane defined by a first direction (e.g., the x-axis direction) and a second direction (e.g., the y-axis direction) that intersects (e.g., intersects) the first direction (e.g., the x-axis direction). A guide unit 113 can be further provided on the support portion 11.

[0061] Platform 12 can be disposed on support portion 11 and can form a plane defined by a first direction (e.g., x-axis direction) and a second direction (e.g., y-axis direction) (or can be on a plane defined by a first direction (e.g., x-axis direction) and a second direction (e.g., y-axis direction)). Substrate BS can be placed on platform 12, and platform 12 can support substrate BS. Platform 12 can form a working area for inkjet printing processes (e.g., printing or deposition targets).

[0062] The substrate BS can have a thin plate shape. For example, the substrate BS can have a quadrilateral planar shape. The substrate BS can have a plane defined by a first direction (e.g., the x-axis direction) and a second direction (e.g., the y-axis direction). However, this is just an example, and the substrate BS can have various shapes.

[0063] The substrate BS may have a first region ARE1, a second region ARE2, and a third region ARE3. The third region ARE3 may be disposed between the first region ARE1 and the second region ARE2. For example, the first region ARE1, the third region ARE3, and the second region ARE2 may be arranged sequentially along a first direction (e.g., the x-axis direction). The first region ARE1 and the second region ARE2 may be spaced apart from each other. The first region ARE1 and the second region ARE2 may face each other with respect to the center CN of the platform 12. The first region ARE1 and the second region ARE2 may be symmetrical with respect to the center CN of the platform 12. For example, each of the first region ARE1 and the second region ARE2 may be disposed on an outer portion of the substrate BS, and the third region ARE3 may be disposed at the center of the substrate BS.

[0064] Guide units 113 may be disposed on the support portion 11 and may be disposed on both sides spaced apart from each other, with the platform 12 between the guide units 113. For example, two guide units 113 may be provided to be spaced apart from each other in a second direction (e.g., the y-axis direction). Each guide unit 113 may extend in a first direction (e.g., the x-axis direction), and the extension length of the guide unit 113 in the first direction (e.g., the x-axis direction) may be at least greater than the length of the edge of the substrate BS in the first direction (e.g., the x-axis direction).

[0065] The guide unit 113 can guide the first moving unit 141 to move linearly along the extension direction of the guide unit 113. Each of the guide units 113 may include, for example, a linear motion track.

[0066] The discharge unit 13 can be disposed on the platform 12 and can spray (or discharge or coat) the first coating liquid CT1 onto the substrate BS. The discharge unit 13 can discharge the first coating liquid CT1 toward the substrate BS along a third direction (e.g., the z-axis direction).

[0067] The moving unit 14 can move the emission unit 13 relative to the platform 12. The moving unit 14 can move the emission unit 13 in a first direction (e.g., the x-axis direction), a second direction (e.g., the y-axis direction), and a third direction (e.g., the z-axis direction). The moving unit 14 may include a first moving unit 141, a second moving unit 142, and a third moving unit 143.

[0068] The moving unit 14 can move the discharge unit 13 relative to the platform 12 in a first direction (e.g., the x-axis direction). The first moving unit 141 can reciprocate linearly along the first direction (e.g., the x-axis direction). The first moving unit 141 may include a columnar member 141a and a horizontal member 141b. Although each of the columnar member 141a and the horizontal member 141b is in... Figure 1 The middle is shown as having a rectangular rod shape, but the shape of each of the columnar member 141a and the horizontal member 141b is not limited to this.

[0069] The columnar member 141a of the first moving unit 141 can extend in a third direction (e.g., the z-axis direction) that intersects (e.g., crosses) each of the second direction (e.g., the y-axis direction) and the first direction (e.g., the x-axis direction). For example, two columnar members 141a can be provided and can be arranged on both sides, with the platform 12 between the two columnar members 141a. The columnar member 141a can move along the extension direction of the guide unit 113 (i.e., the first direction (e.g., the x-axis direction)). In embodiments, the columnar member 141a can be moved manually linearly, or it can be moved automatically linearly by using a motor cylinder or the like. For example, the columnar member 141a can be moved automatically linearly by using a linear motion block that moves along a linear motion track of the guide unit 113.

[0070] The horizontal member 141b of the first moving unit 141 may extend between the columnar members 141a along a second direction (e.g., the y-axis direction). Both ends of the horizontal member 141b may be connected to the upper portions of the columnar members 141a. The horizontal member 141b may include a first recessed portion 1411 extending along the extension direction of the horizontal member 141b (i.e., the second direction (e.g., the y-axis direction)). The first recessed portion 1411 may be disposed on a side surface of the horizontal member 141b (or may be formed in the side surface of the horizontal member 141b). For example, the first recessed portion 1411 may be disposed on a side surface of the horizontal member 141b facing the first direction (e.g., the x-axis direction) (or may be formed in the side surface of the horizontal member 141b facing the first direction (e.g., the x-axis direction)). The first recessed portion 1411 may guide the second moving unit 142 to reciprocate linearly along the extension direction of the first recessed portion 1411.

[0071] The second moving unit 142 can move the discharge unit 13 relative to the platform 12 in a second direction (e.g., the y-axis direction). The second moving unit 142 can move linearly along the second direction (e.g., the y-axis direction). The second moving unit 142 can be movably connected to a side surface of the horizontal member 141b of the first moving unit 141. For example, the second moving unit 142 can be disposed on the side surface of the first moving unit 141 having a first recessed portion 1411. The second moving unit 142 can reciprocate linearly along the first recessed portion 1411 in the second direction (e.g., the y-axis direction). In embodiments, the second moving unit 142 may include a linear motor, etc.

[0072] The third moving unit 143 can move the discharge unit 13 relative to the platform 12 in a third direction (e.g., the z-axis direction). In an embodiment, the third moving unit 143 can be disposed on the surface of the second moving unit 142 and can reciprocate linearly along a third direction (e.g., the z-axis direction). For example, the third moving unit 143 can be disposed on the bottom surface of the second moving unit 142. The bottom surface of the second moving unit 142 can be the surface of the second moving unit 142 facing the platform 12. In an embodiment, the third moving unit 143 may include a pneumatic cylinder or the like. Furthermore, the third moving unit 143 can rotate about (or around) an axis extending in a third direction (e.g., the z-axis direction). For this purpose, the third moving unit 143 may include, for example, an electric motor or a pneumatic motor.

[0073] The discharge unit 13 can be disposed on the bottom surface of the third moving unit 143. The discharge unit 13 can move together with the first moving unit 141, the second moving unit 142, and the third moving unit 143. For example, the range of movement of the discharge unit 13 can be substantially the same as the area of ​​the support portion 11. The discharge unit 13 can also be rotated by the third moving unit 143 about an axis extending in a third direction (e.g., the z-axis direction).

[0074] As described above, the configuration for conveying the discharge unit 13 is not limited to this, and for example, the discharge unit 13 can be fixed and the platform 12 can be moved. However, for ease of explanation, the following will describe an embodiment in which the discharge unit 13 is moved in the manner described above.

[0075] The first sensor unit 15 may be disposed on the support portion 11. The first sensor unit 15 can detect the height of the first coating liquid CT1 coated on the first region ARE1 of the substrate BS. For example, the first sensor unit 15 can detect the height of the first coating liquid CT1 disposed on the outer portion of the substrate BS. For example, the first sensor unit 15 may include an optical sensor. The first sensor unit 15 can measure the height of the first coating liquid CT1 by measuring the time (or the time required) for light illuminating the first coating liquid CT1 to be reflected from the first coating liquid CT1 and return to the first sensor unit 15. For example, the first sensor unit 15 may include a camera. The first sensor unit 15 can measure the height of the first coating liquid CT1 by capturing an image of the first coating liquid CT1.

[0076] The second sensor unit 16 may be disposed on the support portion 11. The second sensor unit 16 may be spaced apart from the first sensor unit 15 along a first direction (e.g., the x-axis direction). The second sensor unit 16 may detect the height of the first coating liquid CT1 coated on the second region ARE2 of the substrate BS. For example, the second sensor unit 16 may detect the height of the first coating liquid CT1 disposed on the outer portion of the substrate BS. For example, the second sensor unit 16 may include an optical sensor. The second sensor unit 16 may measure the height of the first coating liquid CT1 by measuring the time (or the time required) for light illuminating the first coating liquid CT1 to be reflected from the first coating liquid CT1 and return to the second sensor unit 16. For example, the second sensor unit 16 may include a camera. The second sensor unit 16 may measure the height of the first coating liquid CT1 by capturing an image of the first coating liquid CT1.

[0077] The first temperature adjustment unit 17 can adjust the temperature of the first coating liquid CT1 coated on the first region ARE1 of the substrate BS. The first temperature adjustment unit 17 may include a first temperature adjustment module 171 and a first position adjustment unit 172. The first temperature adjustment module 171 may include a 1-1 conduction unit 1711, a 1-2 conduction unit 1712 and a first element unit 1713.

[0078] Each of the 1-1 conductive unit 1711 and the 1-2 conductive unit 1712 can contact the substrate BS. For example, each of the 1-1 conductive unit 1711 and the 1-2 conductive unit 1712 can contact the bottom surface of a first region ARE1 of the substrate BS. The 1-2 conductive unit 1712 can be configured to be farther from the center CN of the platform 12 along a first direction (e.g., the x-axis direction) than the 1-1 conductive unit 1711.

[0079] Conductive unit 1711 and conductive unit 1712 may be spaced apart from each other along a first direction (e.g., the x-axis direction). For example, the gap between conductive unit 1711 and conductive unit 1712 may be in the range of approximately 0.4 mm to approximately 1.0 mm. Each of conductive unit 1711 and conductive unit 1712 may include conductive material. The center between conductive unit 1711 and conductive unit 1712 is referred to as the first center CN1.

[0080] The first element unit 1713 can transfer (or send or output) a temperature above room temperature to the 1-1 conduction unit 1711. The first element unit 1713 can transfer a temperature below room temperature to the 1-2 conduction unit 1712. For example, the first element unit 1713 may include a Peltier element.

[0081] For example, the temperature of the 1-1 conductive unit 1711 at the contact surface between the first element unit 1713 and the 1-1 conductive unit 1711 can be in the range of approximately 50°C to approximately 70°C. For example, the temperature of the 1-2 conductive unit 1712 at the contact surface between the first element unit 1713 and the 1-2 conductive unit 1712 can be in the range of approximately 10°C to approximately 20°C. For example, the temperature difference between the contact surface between the first element unit 1713 and the 1-1 conductive unit 1711 and the contact surface between the first element unit 1713 and the 1-2 conductive unit 1712 can be approximately 65°C. For example, the temperature difference between the contact surface between the substrate BS and the 1-1 conductive unit 1711 and the contact surface between the substrate BS and the 1-2 conductive unit 1712 can be approximately 45°C.

[0082] The first position adjustment unit 172 can adjust the position of the first temperature adjustment module 171. The first position adjustment unit 172 can move the first temperature adjustment module 171 linearly along a first direction (e.g., the x-axis direction). For example, the first position adjustment unit 172 can move automatically and linearly by including a linear motion block that moves along a linear motion track.

[0083] Platform 12 may have a first platform opening OP121 that overlaps with a first region ARE1 of the substrate BS (e.g., aligned with the first region ARE1 of the substrate BS in a third direction (e.g., the z-axis direction). Support portion 11 may have a first support opening OP111 that overlaps with the first region ARE1 of the substrate BS. The first platform opening OP121 and the first support opening OP111 may overlap each other.

[0084] One side of the first position adjustment unit 172 can be fixed to the support portion 11. At least a portion of the first position adjustment unit 172 can be accommodated in the first support opening OP111. At least a portion of the first temperature adjustment module 171 can be accommodated in the first platform opening OP121. The top surfaces of the 1-1 conduction unit 1711 and the 1-2 conduction unit 1712 can have the same plane as the top surface of the platform 12 (e.g., they can be arranged on the same plane as the top surface of the platform 12).

[0085] However, this is merely an example, and the location of the first temperature regulating unit 17 is not limited to this. For example, the first temperature regulating unit 17 may be located on the platform 12 to regulate the temperature of the first coating liquid CT1.

[0086] The second temperature adjustment unit 18 can adjust the temperature of the first coating liquid CT1 coated on the second region ARE2 of the substrate BS. The second temperature adjustment unit 18 may include a second temperature adjustment module 181 and a second position adjustment unit 182. The second temperature adjustment module 181 may include a 2-1 conduction unit 1811, a 2-2 conduction unit 1812, and a second element unit 1813.

[0087] Each of the 2-1 conducting unit 1811 and the 2-2 conducting unit 1812 can contact the substrate BS. For example, the 2-1 conducting unit 1811 and the 2-2 conducting unit 1812 can contact the bottom surface of the second region ARE2 of the substrate BS. The 2-2 conducting unit 1812 can be configured to be farther from the center CN of the platform 12 along a first direction (e.g., the x-axis direction) than the 2-1 conducting unit 1811.

[0088] Conductive unit 1811 and conductive unit 1812 (2-1) may be spaced apart from each other along a first direction (e.g., the x-axis direction). For example, the gap between conductive unit 1811 and conductive unit 1812 may be in the range of approximately 0.4 mm to approximately 1.0 mm. Each of conductive unit 1811 and conductive unit 1812 may include conductive material. The center between conductive unit 1811 and conductive unit 1812 is referred to as the second center CN2.

[0089] The second element unit 1813 can transfer temperatures above room temperature to the 2-1 conduction unit 1811. The second element unit 1813 can transfer temperatures below room temperature to the 2-2 conduction unit 1812. For example, the second element unit 1813 may include a Peltier element.

[0090] For example, the temperature of the 2-1 conductive unit 1811 at the contact surface between the second element unit 1813 and the 2-1 conductive unit 1811 can be in the range of approximately 50°C to approximately 70°C. For example, the temperature of the 2-2 conductive unit 1812 at the contact surface between the second element unit 1813 and the 2-2 conductive unit 1812 can be in the range of approximately 10°C to approximately 20°C. For example, the temperature difference between the contact surface between the second element unit 1813 and the 2-1 conductive unit 1811 and the contact surface between the second element unit 1813 and the 2-2 conductive unit 1812 can be approximately 65°C. For example, the temperature difference between the contact surface between the substrate BS and the 2-1 conductive unit 1811 and the contact surface between the substrate BS and the 2-2 conductive unit 1812 can be approximately 45°C.

[0091] The second position adjustment unit 182 can adjust the position of the second temperature adjustment module 181. The second position adjustment unit 182 can move the second temperature adjustment module 181 linearly along a first direction (e.g., the x-axis direction). For example, the second position adjustment unit 182 can move automatically and linearly by including a linear motion block that moves along a linear motion track.

[0092] Platform 12 may further have a second platform opening OP122 that overlaps with the second region ARE2 of the substrate BS. Support portion 11 may further have a second support opening OP112 that overlaps with the second region ARE2 of the substrate BS. The second platform opening OP122 and the second support opening OP112 may overlap each other.

[0093] One side of the second position adjustment unit 182 can be fixed to the support portion 11. At least a portion of the second position adjustment unit 182 can be accommodated in the second support opening OP112. At least a portion of the second temperature adjustment module 181 can be accommodated in the second platform opening OP122. The top surfaces of the 2-1 conduction unit 1811 and the 2-2 conduction unit 1812 can have the same plane as the top surface of the platform 12.

[0094] However, this is merely an example, and the location of the second temperature regulating unit 18 is not limited to this. For example, the second temperature regulating unit 18 may be located on the platform 12 to regulate the temperature of the first coating liquid CT1.

[0095] The controller can control the discharge unit 13, the moving unit 14, the first sensor unit 15, the second sensor unit 16, the first temperature regulating unit 17, and the second temperature regulating unit 18. The controller can be electrically connected to each of the discharge unit 13, the moving unit 14, the first sensor unit 15, the second sensor unit 16, the first temperature regulating unit 17, and the second temperature regulating unit 18. The controller can control the droplet discharge time, droplet discharge volume, droplet discharge location, etc., of the discharge unit 13. The controller can control the position and movement of the moving unit 14. The controller can control the first temperature regulating unit 17 and the second temperature regulating unit 18 based on information detected by the first sensor unit 15 and the second sensor unit 16.

[0096] Figure 3 This is a flowchart describing a method 2 for manufacturing a display device according to an embodiment. Figure 4 This is a schematic cross-sectional view of an apparatus 1 for manufacturing a display device according to an embodiment. Figure 5 This is a schematic plan view of a substrate BS to be coated with the first coating liquid CT1 according to an embodiment. Figures 6 to 9 This is a schematic cross-sectional view of an apparatus 1 for manufacturing a display device according to an embodiment.

[0097] exist Figures 3 to 9 In, with Figure 1 and Figure 2 The same components are represented by the same reference numerals, and therefore, repeated descriptions of them will be omitted or may be provided only briefly.

[0098] refer to Figures 3 to 6 The method 2 for manufacturing a display device includes step S1 of placing a substrate BS on a platform 12 and step S2 of spraying a first coating liquid CT1 onto the substrate BS through a discharge unit 13.

[0099] Platform 12 can contact the bottom surface of the substrate BS. The edge portion of the substrate BS can be supported by platform 12. Each of the first temperature regulation module 171 and the second temperature regulation module 181 can support the substrate BS. Each of the 1-1 conduction unit 1711 and the 1-2 conduction unit 1712 can contact the bottom surface of the substrate BS. Furthermore, each of the 2-1 conduction unit 1811 and the 2-2 conduction unit 1812 can contact the bottom surface of the substrate BS.

[0100] The discharge unit 13 may include a nozzle 131, through which the first coating liquid CT1 is discharged onto the substrate BS (e.g., onto the substrate BS). The nozzle 131 may be disposed on one side of the discharge unit 13 (e.g., the nozzle 131 may be disposed on the surface of the discharge unit 13 facing the substrate BS). A plurality of nozzles 131 may be provided, and the plurality of nozzles 131 may be spaced apart from each other to be arranged in multiple columns and rows in the discharge unit 13.

[0101] The discharge unit 13 can move over the substrate BS in a first direction (e.g., the x-axis direction) to spray the first coating liquid CT1 onto the substrate BS. Figure 5 In this embodiment, the length of the side of the discharge unit 13 in the second direction (e.g., the y-axis direction) corresponds to the length of the side of the substrate BS in the second direction (e.g., the y-axis direction). In such an embodiment, the discharge unit 13 can be sufficiently moved in the first direction (e.g., the x-axis direction) to coat the first coating liquid CT1 onto the entire surface (e.g., the entire upper surface) of the substrate BS. In another embodiment, the length of the side of the discharge unit 13 in the second direction (e.g., the y-axis direction) may be less than the length of the side of the substrate BS in the second direction (e.g., the y-axis direction), and in such an embodiment, the discharge unit 13 can be moved in both the first direction (e.g., the x-axis direction) and the second direction (e.g., the y-axis direction) to coat the first coating liquid CT1 onto one surface of the substrate BS.

[0102] The first coating liquid CT1 applied to the substrate BS may have a greater thickness at its outer portion than at its central portion CPT. The outer portion of the first coating liquid CT1 may also have a higher surface tension than the central portion CPT. Consequently, Marangoni convection may occur from the central portion CPT to the outer portion of the first coating liquid CT1, thereby forming edge beads.

[0103] Accordingly, the first coating liquid CT1 applied to the substrate BS can be divided into a central portion CPT, a first edge portion EPT1, and a second edge portion EPT2. In other words, the first coating liquid CT1 can have a central portion CPT, a first edge portion EPT1, and a second edge portion EPT2. The central portion CPT can be located at the center of the first coating liquid CT1, and the first edge portion EPT1 and the second edge portion EPT2 can be located on the outer side of the first coating liquid CT1. The central portion CPT can be located between the first edge portion EPT1 and the second edge portion EPT2. For example, the first edge portion EPT1, the central portion CPT, and the second edge portion EPT2 can be arranged sequentially along a first direction (e.g., the x-axis direction). The first edge portion EPT1 and the second edge portion EPT2 can be spaced apart from each other. The first edge portion EPT1 and the second edge portion EPT2 can face each other relative to the center CN of the platform 12.

[0104] In the cross-sectional view, each of the first edge portion EPT1 and the second edge portion EPT2 may have (or may be) a raised portion. In the cross-sectional view, the central portion CPT may be flat (or substantially flat) compared to the first edge portion EPT1 and the second edge portion EPT2. The portion of the first coating liquid CT1 having a top surface with a curvature lower than a reference (or specified) value may be defined as the central portion CPT. For example, the portion of the first coating liquid CT1 having a top surface with a curvature substantially zero (0) may be defined as the central portion CPT. The height of the central portion CPT of the first coating liquid CT1 may be relatively constant.

[0105] In the first coating liquid CT1, the portion outside the point where the curvature of the top surface is greater than or equal to a reference (or specified) value can be defined as a first edge portion EPT1 and a second edge portion EPT2. The height of the first edge portion EPT1 of the first coating liquid CT1 can gradually increase and decrease with distance from the center CN of the platform 12. The height of the second edge portion EPT2 of the first coating liquid CT1 can gradually increase and decrease with distance from the center CN of the platform 12. The height of the highest point of the first edge portion EPT1 can be greater than the height of the highest point of the central portion CPT. The height of the highest point of the second edge portion EPT2 can be greater than the height of the highest point of the central portion CPT.

[0106] refer to Figure 3 and Figure 7 The method 2 for manufacturing a display device may further include a detection step S3. Detection step S3 may include a first detection step S31 and a second detection step S32. The first detection step S31 and the second detection step S32 may be performed concurrently (or simultaneously).

[0107] The first detection step S31 may be a step in which the first sensor unit 15 detects the height of the first coating liquid CT1 coated on the first region ARE1 of the substrate BS. The first edge portion EPT1 of the first coating liquid CT1 may overlap with the first region ARE1 of the substrate BS. The first detection step S31 may be a step in which the first sensor unit 15 detects the height of the first edge portion EPT1 of the first coating liquid CT1.

[0108] The second detection step S32 may be a step in which the second sensor unit 16 detects the height of the first coating liquid CT1 coated on the second region ARE2 of the substrate BS. The second edge portion EPT2 of the first coating liquid CT1 may overlap with the second region ARE2 of the substrate BS. The second detection step S32 may be a step in which the second sensor unit 16 detects the height of the second edge portion EPT2 of the first coating liquid CT1.

[0109] refer to Figure 3 , Figure 8 and Figure 9 The method 2 for manufacturing a display device may further include a temperature adjustment step S4. The temperature adjustment step S4 may include a first temperature adjustment step S41 and a second temperature adjustment step S42. The first temperature adjustment step S41 and the second temperature adjustment step S42 may be performed concurrently (or simultaneously).

[0110] The first temperature adjustment step S41 may be a step in which the first temperature adjustment unit 17 adjusts the temperature of the first coating liquid CT1 coated on the first region ARE1 of the substrate BS.

[0111] refer to Figure 3 and Figure 8 The first temperature adjustment step S41 may include the step of the first position adjustment unit 172 adjusting the position of the first temperature adjustment module 171 such that the first central CN1 between the 1-1 conduction unit 1711 and the 1-2 conduction unit 1712 overlaps with the position of the high point of the first edge portion EPT1 of the first coating liquid CT1 formed on the substrate BS. The position of the high point of the first edge portion EPT1 of the first coating liquid CT1 is defined as the first position POS1. The first temperature adjustment step S41 may include the step of the first position adjustment unit 172 adjusting the position of the first temperature adjustment module 171 such that the first central CN1 overlaps with the first position POS1.

[0112] In another embodiment, the first temperature adjustment step S41 may include the step of the first position adjustment unit 172 adjusting the position of the first temperature adjustment module 171 such that the first central CN1 between the 1-1 conduction unit 1711 and the 1-2 conduction unit 1712 is set to be farther from the central CN of the platform 12 than the position of the high point of the first edge portion EPT1 of the first coating liquid CT1 formed on the substrate BS. The first temperature adjustment step S41 may include the step of the first position adjustment unit 172 adjusting the position of the first temperature adjustment module 171 such that the first central CN1 is set to be farther from the central CN of the platform 12 than the first position POS1.

[0113] The second temperature adjustment step S42 may be a step in which the second temperature adjustment unit 18 adjusts the temperature of the first coating liquid CT1 coated on the second region ARE2 of the substrate BS.

[0114] The second temperature adjustment step S42 may include the step of the second position adjustment unit 182 adjusting the position of the second temperature adjustment module 181 such that the second central CN2 between the 2-1 conduction unit 1811 and the 2-2 conduction unit 1812 overlaps with the position of the high point of the second edge portion EPT2 of the first coating liquid CT1 formed on the substrate BS. The position of the high point of the second edge portion EPT2 of the first coating liquid CT1 is defined as the second position POS2. The second temperature adjustment step S42 may include the step of the second position adjustment unit 182 adjusting the position of the second temperature adjustment module 181 such that the second central CN2 overlaps with the second position POS2.

[0115] In another embodiment, the second temperature adjustment step S42 may include the step of the second position adjustment unit 182 adjusting the position of the second temperature adjustment module 181 such that the second central CN2 between the 2-1 conduction unit 1811 and the 2-2 conduction unit 1812 is set further away from the central CN of the platform 12 than the position of the high point of the second edge portion EPT2 formed by the first coating liquid CT1 coated onto the substrate BS. The second temperature adjustment step S42 may also include the step of the second position adjustment unit 182 adjusting the position of the second temperature adjustment module 181 such that the second central CN2 is set further away from the central CN of the platform 12 than the second position POS2.

[0116] refer to Figure 3 and Figure 9The first element unit 1713 can transfer temperatures above room temperature to the 1-1 conduction unit 1711 and temperatures below room temperature to the 1-2 conduction unit 1712. For example, heat from the 1-2 conduction unit 1712 can be transferred to the 1-1 conduction unit 1711. Accordingly, the first edge portion EPT1 overlapping with the 1-1 conduction unit 1711 can be heated, and the first edge portion EPT1 overlapping with the 1-2 conduction unit 1712 can be cooled.

[0117] The second element unit 1813 can transfer temperatures above room temperature to the 2-1 conduction unit 1811 and temperatures below room temperature to the 2-2 conduction unit 1812. For example, heat from the 2-2 conduction unit 1812 can be transferred to the 2-1 conduction unit 1811. Accordingly, the second edge portion EPT2 overlapping with the 2-1 conduction unit 1811 can be heated, and the second edge portion EPT2 overlapping with the 2-2 conduction unit 1812 can be cooled.

[0118] The surface tension of the portion of the first coating liquid CT1 overlapping with the 1-1 conductive unit 1711 can be weakened (or reduced), and the surface tension of the portion of the first coating liquid CT1 overlapping with the 1-2 conductive unit 1712 can be strengthened (or increased). The first coating liquid CT1 can flow from a position with weaker surface tension to a position with stronger surface tension. The first coating liquid CT1 can flow from the central portion CPT to the first edge portion EPT1.

[0119] The surface tension of the portion of the first coating liquid CT1 overlapping with the 2-1 conductive unit 1811 can be weakened, and the surface tension of the portion of the first coating liquid CT1 overlapping with the 2-2 conductive unit 1812 can be strengthened. The first coating liquid CT1 can flow from a position with weaker surface tension to a position with stronger surface tension. The first coating liquid CT1 can flow from the central portion CPT to the second edge portion EPT2.

[0120] Figure 10 This is a schematic cross-sectional view of the 11th coating liquid CT11 and the 12th coating liquid CT12 coated onto the substrate BS according to an embodiment.

[0121] refer to Figure 3 , Figure 8 , Figure 9 and Figure 10 According to the temperature adjustment step S4, the shape of the first coating liquid CT1 coated on the substrate BS can be changed.

[0122] refer to Figure 8 The first coating liquid CT1 before the temperature conditioning step S4 is referred to as the 11th coating liquid CT11, and is referencedFigure 9 The first coating liquid CT1 after the temperature conditioning step S4 described is referred to as the 12th coating liquid CT12.

[0123] For example, the central portion CPT of the first coating liquid CT1 before the temperature conditioning step S4 is referred to as the first central portion CPT1 of the 11th coating liquid CT11. Furthermore, the central portion CPT of the first coating liquid CT1 after the temperature conditioning step S4 is referred to as the second central portion CPT2 of the 12th coating liquid CT12.

[0124] Figure 10 The schematic shapes of the 11th coating liquid CT11 and the 12th coating liquid CT12 are shown. Due to the temperature adjustment step S4, the width of the second central portion CPT2 of the 12th coating liquid CT12 can be increased to be greater than the width of the first central portion CPT1 of the 11th coating liquid CT11. For example, due to the temperature adjustment step S4, the width of the central portion CPT of the relatively flat first coating liquid CT1 can be increased.

[0125] The first edge portion EPT1 and the second edge portion EPT2, each having a raised portion, can be removed by an additional process, and the remaining central portion CPT can be used in the display device (or can be used to form the display device). For example, due to the temperature conditioning step S4, the width of the central portion CPT of the first coating liquid CT1 can be increased, thereby increasing the yield of the apparatus 1 used to manufacture the display device.

[0126] Figure 11 and Figure 12 This is a perspective view schematically showing a portion of the display device 3 according to an embodiment. Figure 11 The display device 3 is shown in its unfolded state. Figure 12 The display device 3 is shown in a folded state.

[0127] refer to Figure 11 and Figure 12 The display device 3 may be an electronic device including a display panel. The electronic device may be medical electronic equipment, a robot, vehicle electronic equipment including a dashboard, a central information display (CID) and / or a passenger display, wearable electronic equipment that can be worn on a user's body, electronic equipment for advertising or exhibitions, and / or electronic equipment for education. The display device 3 may include a lower cover LC, a display layer DL, and a cover window CW.

[0128] The lower cover LC may have a first portion P1 and a second portion P2 supporting the display layer DL. The lower cover LC may be folded around (or around) a folding axis FAX defined between the first portion P1 and the second portion P2. In an embodiment, the lower cover LC may have a hinge portion HP, and the hinge portion HP may be provided between the first portion P1 and the second portion P2.

[0129] The display layer DL may have a display area DA. The display layer DL can provide an image by means of an array of pixels PX arranged in the display area DA. Each of the pixels PX may be defined as an emitting area for emitting light by a light-emitting element electrically connected to the pixel circuitry. In one embodiment, each pixel PX may emit red, green, or blue light. In another embodiment, each pixel PX may emit red, green, blue, or white light.

[0130] The light-emitting elements included in the display layer DL may include organic light-emitting diodes, inorganic light-emitting diodes, micro light-emitting diodes, and / or quantum dot light-emitting diodes. Although the following embodiments are described in the case where the light-emitting element included in the display layer DL is an organic light-emitting diode for ease of explanation, the following description is not limited thereto and can be equivalently applied to other embodiments using another type of light-emitting element.

[0131] The display area DA may have a first display area DA1 and a second display area DA2 disposed on both sides of a folding axis FAX intersecting the display area DA. The first display area DA1 and the second display area DA2 may be disposed on a first portion P1 and a second portion P2 of the lower cover LC, respectively. The display layer DL may provide a first image and a second image by using light emitted from a plurality of pixels PX disposed in the first display area DA1 and the second display area DA2. In one embodiment, the first image and the second image may be portions of an image provided by the display area DA of the display layer DL. In another embodiment, the display layer DL may provide a first image and a second image that are independent of each other.

[0132] The display layer DL can be folded around (or around) the folding axis FAX. When the display layer DL is folded, the first display area DA1 and the second display area DA2 of the display layer DL can face each other.

[0133] Although the folding shaft FAX is Figure 11 and Figure 12 The folding axis FAX is shown extending in the y-axis direction, but this disclosure is not limited thereto. In one embodiment, the folding axis FAX may extend in the x-axis direction, intersecting (e.g., intersecting) the y-axis direction. In another embodiment, in the xy-plane, the folding axis FAX may extend in a direction intersecting (e.g., intersecting) both the x-axis and y-axis directions.

[0134] Furthermore, although a folding axis FAX is in Figure 11 and Figure 12 As shown, but this disclosure is not limited thereto. In embodiments, the display layer DL may be folded multiple times around (or around) multiple folding axes FAX that intersect with the display area DA (or may be folded in multiple different areas).

[0135] A cover window (CW) can be positioned on the display layer (DL) to cover it. The cover window (CW) can be folded or bent by external force without cracking (e.g., without breaking). The cover window (CW) can also be folded when the display layer (DL) is folded around the folding axis (FAX).

[0136] Figure 13 This is a schematic cross-sectional view of a portion of the display device 3 according to an embodiment. Figure 13 It can be shown along Figure 11 The cross-sectional view of display device 3 taken by line XIII-XIII' in the figure.

[0137] The display layer DL can be any of an organic light-emitting diode (OLED) display device, a liquid crystal display (LCD) device, and an electrophoretic display (EPD) device, but is not limited thereto. The following embodiments will be described assuming that the display layer DL is an organic light-emitting diode display device.

[0138] The display layer DL may include an organic light-emitting diode display device comprising a pixel electrode 82 disposed on a first substrate 10, a pixel defining film 84 disposed on the pixel electrode 82 and having an opening through which at least a portion of the pixel electrode 82 is exposed, an intermediate layer 86 disposed on the pixel electrode 82 and including an organic emitting layer, and a counter electrode 88 disposed on the intermediate layer 86.

[0139] refer to Figure 13 The reinforcing substrate RF can be disposed on the bottom surface of the first substrate 10. The reinforcing substrate RF is a substrate used to support the display device 3 from the first substrate 10 through the display layer DL to the cover window CW. The reinforcing substrate RF may include a reinforcing body and a reinforcing layer, which are described in more detail below. The reinforcing substrate RF can prevent the display layer DL from wrinkling in the folded area due to repeated folding.

[0140] A buffer layer 62, comprising an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride, may be disposed on the first substrate 10. The buffer layer 62 may improve the flatness of the top surface of the first substrate 10 (e.g., may planarize the top surface of the first substrate 10) and / or may prevent or minimize the penetration of impurities from the first substrate 10 into the active layer 64 of the thin-film transistor 70. In some embodiments, the buffer layer 62 may be omitted.

[0141] A thin-film transistor 70 may be disposed on the first substrate 10 and may be electrically connected to a pixel electrode 82. The thin-film transistor 70 may include an active layer 64 comprising a semiconductor material such as amorphous silicon, polycrystalline silicon, oxide semiconductor, or organic semiconductor material, a gate electrode 70G insulated from the active layer 64, and a source electrode 70S and a drain electrode 70D electrically connected to the active layer 64. The gate electrode 70G may be disposed on the active layer 64, and the source electrode 70S and the drain electrode 70D are electrically connected (e.g., electrically connected or in a state of electrical connection) according to a signal applied to the gate electrode 70G. Considering adhesion to adjacent layers, surface flatness of stacked layers, and processability, the gate electrode 70G may include at least one of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), and may have a single-layer or multi-layer structure including the above materials.

[0142] To ensure insulation between the active layer 64 and the gate electrode 70G, a first insulating layer 66 comprising an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride may be disposed between the active layer 64 and the gate electrode 70G. A second insulating layer 68 comprising an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride may be disposed on the first insulating layer 66 and the gate electrode 70G, and a source electrode 70S and a drain electrode 70D may be disposed on the second insulating layer 68. The source electrode 70S and the drain electrode 70D are electrically connected to the active layer 64 through contact holes (e.g., contact openings) formed in the second insulating layer 68 and the first insulating layer 66.

[0143] A third insulating layer 72 covering the thin-film transistor 70 can be disposed on the second insulating layer 68 and the thin-film transistor 70. The third insulating layer 72 can have a flat top surface, such that the pixel electrode 82 is flat. The third insulating layer 72 can comprise organic materials such as acrylic acid, benzocyclobutene (BCB), polyimide, or hexamethyldisiloxane (HMDSO). Although the third insulating layer 72... Figure 13 The third insulating layer 72 is shown as having a single-layer structure, but in some embodiments, the third insulating layer 72 may have a multi-layer structure.

[0144] The third insulating layer 72 includes a via (e.g., a via hole or opening) through which either the source electrode 70S or the drain electrode 70D of the thin-film transistor 70 is exposed, and the pixel electrode 82 is electrically connected to the thin-film transistor 70 by contacting either the source electrode 70S or the drain electrode 70D via the via. Figure 13 In the middle, pixel electrode 82 is connected to drain electrode 70D.

[0145] An organic light-emitting diode (OLED) including a pixel electrode 82, a counter electrode 88, and an intermediate layer 86 including an organic emission layer disposed on the pixel electrode 82 is disposed on a third insulating layer 72.

[0146] Pixel electrode 82 can be formed as a reflective electrode. When pixel electrode 82 is formed as a reflective electrode, pixel electrode 82 may include a reflective film formed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof, and a transparent conductive layer disposed above / below the reflective film. The transparent conductive layer may include at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (e.g., In2O3), indium gallium oxide (IGO), and aluminum-doped zinc oxide (AZO). This disclosure is not limited thereto, and pixel electrode 82 may be formed of any of a variety of suitable materials and may have a single-layer or multi-layer structure.

[0147] A pixel defining film 84 covering the edge portion of the pixel electrode 82 may be disposed on the third insulating layer 72. The pixel defining film 84 has an opening through which at least a portion of the pixel electrode 82 is exposed, and defines a pixel PX. The pixel defining film 84 may be formed of an organic material such as polyimide (PI) or hexamethyldisiloxane (HMDSO). The pixel defining film 84 may have a single-layer or multi-layer structure.

[0148] An intermediate layer 86 is disposed on the pixel electrode 82 exposed by the pixel defining film 84. The intermediate layer 86 may include an organic emitter layer (EML) and may further include functional layers such as a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and / or an electron injection layer (EIL).

[0149] The structure of the intermediate layer 86 is not limited to this, and can be any of a variety of suitable structures. The intermediate layer 86 may include a layer integrally formed over the plurality of pixel electrodes 82, or may include a layer patterned to correspond to each of the plurality of pixel electrodes 82.

[0150] Counter electrode 88 is disposed on intermediate layer 86. Unlike pixel electrode 82, counter electrode 88 can be formed integrally across multiple pixels PX.

[0151] The counter electrode 88 can be formed as a (semi-)transparent electrode. When the counter electrode 88 is formed as a (semi-)transparent electrode, it can include at least one material selected from silver (Ag), aluminum (Al), magnesium (Mg), lithium (Li), calcium (Ca), copper (Cu), lithium fluoride (LiF), magnesium-silver alloy (MgAg), and calcium-silver alloy (CaAg), or a material having a multilayer structure such as lithium fluoride / calcium (LiF / Ca) or lithium fluoride / aluminum (LiF / Al), and can be formed as a thin film with a thickness in the range of several nanometers to tens of nanometers. The configuration and material of the counter electrode 88 are not limited thereto and can be modified in various ways.

[0152] A thin-film encapsulation layer 90 can be disposed on the counter electrode 88. The thin-film encapsulation layer 90 can seal the organic light-emitting diode (OLED), preventing the OLED from being exposed to external air and / or foreign matter. Because the thin-film encapsulation layer 90 has a very small thickness, it can be a flexible or bendable encapsulation element for a flexible display device that can be bent or folded.

[0153] The thin-film encapsulation layer 90 may include a first inorganic film 91, an organic film 92, and a second inorganic film 93 sequentially disposed on the counter electrode 88. The first inorganic film 91 may include silicon oxide, silicon nitride, and / or silicon oxynitride. Because the first inorganic film 91 is formed along the underlying structure, as... Figure 13 As shown, the top surface of the first inorganic membrane 91 is not flat. An organic membrane 92 may cover the first inorganic membrane 91 and may provide a flat top surface. The organic membrane 92 may comprise at least one material selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. A second inorganic membrane 93 may cover the organic membrane 92 and may comprise silicon oxide, silicon nitride, and / or silicon oxynitride. Although in Figure 13 In the embodiment shown, the thin film encapsulation layer 90 includes only one organic film 92, but this is only an example, and the thin film encapsulation layer 90 may have a structure in which multiple organic films and multiple inorganic films are stacked alternately.

[0154] A touch electrode layer (TEL) including touch electrodes can be disposed on the thin-film encapsulation layer 90, and an optical functional layer (OFL) can be disposed on the touch electrode layer TEL. The touch electrode layer TEL can obtain coordinate information based on external input (e.g., touch events). The optical functional layer OFL can reduce the reflectivity of light (e.g., external light) incident on the display device 3 and can improve the color purity of light emitted from the display device 3.

[0155] In embodiments, the optical functional layer (OFL) may include a phase retarder and / or a polarizer. The phase retarder may be a film-type phase retarder or a liquid crystal-coated phase retarder, and may include λ / 2 phase retarders and / or λ / 4 phase retarders. The polarizer may also be a film-type polarizer or a liquid crystal-coated polarizer. A film-type polarizer may include a stretched synthetic resin film, and a liquid crystal-coated polarizer may include liquid crystals arranged in a specific configuration. The phase retarder and polarizer may further include a protective film.

[0156] In an embodiment, the optical functional layer (OFL) may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, can interfere destructively with each other, thereby reducing the reflectivity of external light.

[0157] An adhesive component can be disposed between the touch electrode layer (TEL) and the optical functional layer (OFL). The adhesive component can be a general adhesive known in the art. For example, the adhesive component can be a pressure-sensitive adhesive (PSA).

[0158] The cover window (CW) can be positioned on the display layer (DL). The first coating liquid (CT1) can be positioned between the cover window (CW) and the display layer (DL). The cover window (CW) can be attached to the display layer (DL) via the first coating liquid (CT1). For example, the first coating liquid (CT1) can be PSA.

[0159] The cover window (CW) can have high transmittance to transmit light emitted from the display layer (DL). In embodiments, the transmittance of the cover window (CW) can be greater than approximately 85%, and the transmittance haze can be less than approximately 2%, but this disclosure is not limited thereto.

[0160] Figure 14 This is an equivalent circuit diagram showing a pixel PX of the display device 3 according to an embodiment.

[0161] Each pixel PX may include a pixel circuit PC and a light-emitting element (e.g., an organic light-emitting diode OLED) connected to the pixel circuit PC. The pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cst. Each pixel PX may emit, for example, red, green, blue, or white light through an organic light-emitting diode OLED.

[0162] A second thin-film transistor T2 (i.e., a switching thin-film transistor) can be connected to the scan line SL and the data line DTL, and can transfer the data voltage input from the data line DTL to the first thin-film transistor T1 based on the switching voltage input from the scan line SL. A storage capacitor Cst can be connected to the second thin-film transistor T2 and the drive voltage line PL, and can store a voltage corresponding to the difference between the voltage received from the second thin-film transistor T2 and the first power supply voltage ELVDD supplied to the drive voltage line PL.

[0163] A first thin-film transistor T1 (i.e., a driving thin-film transistor) can be connected to a driving voltage line PL and a storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL to the organic light-emitting diode (OLED) in response to the voltage stored in the storage capacitor Cst. Due to the driving current, the OLED can emit light with a certain brightness. The counter electrode (e.g., the cathode) of the OLED can receive a second power supply voltage ELVSS.

[0164] Despite Figure 14 In the embodiment shown, the pixel circuit PC includes two thin-film transistors and one storage capacitor, but this disclosure is not limited thereto. The number of thin-film transistors and the number of storage capacitors can be varied in various ways depending on the design of the pixel circuit PC. For example, in addition to the two thin-film transistors described above, the pixel circuit PC may include four, five, or more thin-film transistors.

[0165] Although this disclosure has been shown and described with reference to some embodiments thereof, those skilled in the art will understand that various modifications, as well as equivalent and other embodiments, can be made based on this disclosure. Accordingly, the technical scope of this disclosure is defined by the claims and their equivalents.

[0166] According to the embodiments, the output of devices used to manufacture display devices can be increased.

[0167] The aspects and features of this disclosure are not limited thereto, and other aspects and features not expressly mentioned will be clearly understood by those skilled in the art based on this disclosure and the claims.

[0168] It should be understood that the embodiments described herein are to be considered in a descriptive sense and are not intended to be limiting. The description of features or aspects in each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made thereto without departing from the spirit and scope as defined by the claims and their equivalents.

Claims

1. An apparatus for manufacturing a display device, the apparatus comprising: a stage configured to support a base substrate; a discharging unit on the stage and configured to spray a first coating liquid onto the base substrate; a first sensor unit configured to detect a height of the first coating liquid coated to a first area of the base substrate; and a first temperature adjustment unit configured to adjust a temperature of the first coating liquid coated to the first area of the base substrate, the first temperature adjustment unit comprising: a first temperature adjustment module including a 1-1 conduction unit, a 1-2 conduction unit farther from a center of the stage than the 1-1 conduction unit, and a first element unit configured to transfer a temperature higher than a room temperature to the 1-1 conduction unit and a temperature lower than the room temperature to the 1-2 conduction unit; and a first position adjustment unit configured to adjust a position of the first temperature adjustment module. The first position adjustment unit is configured to adjust the position of the first temperature adjustment module such that a center between the 1-1 conduction unit and the 1-2 conduction unit overlaps with a high point of the first coating liquid coated to the first area of the base substrate.

2. The apparatus of claim 1, wherein, The first position adjustment unit is configured to adjust the position of the first temperature adjustment module such that the center between the 1-1 conduction unit and the 1-2 conduction unit is farther from the center of the stage than a position of the high point of the first coating liquid coated to the first area of the base substrate.

3. The apparatus of claim 1, wherein, The 1-2 conduction unit is farther from the center of the stage than the 1-1 conduction unit along a first direction, and 4. The apparatus of claim 1, wherein, wherein the first position adjustment unit is configured to linearly move the first temperature adjustment module along the first direction. The 1-1 conduction unit and the 1-2 conduction unit are spaced apart from each other along the first direction.

5. The apparatus of claim 4, wherein, Each of the 1-1 conduction unit and the 1-2 conduction unit is in contact with the base substrate.

6. The apparatus of claim 1, wherein, The stage has a first stage opening overlapping with the first area of the base substrate, and 7. The apparatus of claim 1, wherein, wherein at least a portion of the first temperature adjustment module is accommodated in the first stage opening. 8.The apparatus of any one of claims 1 to 7, further comprising: a second sensor unit configured to detect a height of the first coating liquid coated to a second area of the base substrate; and a second temperature adjustment unit configured to adjust a temperature of the first coating liquid coated to the second area of the base substrate, the second temperature adjustment unit comprising: a second temperature adjustment module including a 2-1 conduction unit, a 2-2 conduction unit farther from the center of the stage than the 2-1 conduction unit, and a second element unit configured to transfer a temperature higher than the room temperature to the 2-1 conduction unit and a temperature lower than the room temperature to the 2-2 conduction unit; and a second position adjustment unit configured to adjust a position of the second temperature adjustment module. ​ ​ ​ 9. The apparatus of claim 8, wherein, In a plan view, the first area and the second area face each other with respect to the center of the platform.

10. The apparatus of any one of claims 1-7, wherein, The first element unit includes a Peltier element. 11.A method for manufacturing a display device, the method comprising: positioning a base substrate on a platform; spraying a first coating liquid onto the base substrate by a discharging unit; detecting a height of the first coating liquid coated to a first area of the base substrate by a first sensor unit; and adjusting a temperature of the first coating liquid coated to the first area of the base substrate by a first temperature adjustment unit, wherein the first temperature adjustment unit includes: a first temperature adjustment module including a 1-1 conduction unit, a 1-2 conduction unit farther from a center of the platform than the 1-1 conduction unit, and a first element unit configured to transfer a temperature higher than room temperature to the 1-1 conduction unit and a temperature lower than the room temperature to the 1-2 conduction unit; and a first position adjustment unit configured to adjust a position of the first temperature adjustment module.

12. The method of claim 11, wherein, The adjustment of the temperature of the first coating liquid includes adjusting the position of the first temperature adjustment module by the first position adjustment unit such that a center between the 1-1 conduction unit and the 1-2 conduction unit overlaps with a high point of the first coating liquid coated to the first area of the base substrate.

13. The method of claim 11, wherein, The adjustment of the temperature of the first coating liquid includes adjusting the position of the first temperature adjustment module by the first position adjustment unit such that a center between the 1-1 conduction unit and the 1-2 conduction unit is farther from the center of the platform than a position of a high point of the first coating liquid coated to the first area of the base substrate.

14. The method of claim 11, wherein, The 1-2 conduction unit is farther from the center of the platform than the 1-1 conduction unit along a first direction, and wherein the first position adjustment unit is configured to linearly move the first temperature adjustment module along the first direction.

15. The method of claim 14, wherein, The 1-1 conduction unit and the 1-2 conduction unit are spaced apart from each other along the first direction.

16. The method of claim 11, wherein, Each of the 1-1 conduction unit and the 1-2 conduction unit is in contact with the base substrate.

17. The method of claim 11, wherein, The platform has a first platform opening overlapping with the first area of the base substrate, and wherein at least a portion of the first temperature adjustment module is accommodated in the first platform opening. 18.The method of any one of claims 11 to 17, further comprising: detecting a height of the first coating liquid coated to a second area of the base substrate by a second sensor unit; and adjusting a temperature of the first coating liquid coated to the second area of the base substrate by a second temperature adjustment unit, the second temperature adjustment unit including: a second temperature adjustment module including a 2-1 conduction unit, a 2-2 conduction unit farther from the center of the platform than the 2-1 conduction unit, and a second element unit configured to transfer a temperature higher than the room temperature to the 2-1 conduction unit and to transfer a temperature lower than the room temperature to the 2-2 conduction unit; and and a second position adjustment unit configured to adjust a position of the second temperature adjustment module.

19. The method of claim 18, wherein, In a plan view, the first region and the second region face each other with respect to the center of the platform.

20. The method of any one of claims 11 to 17, wherein, The first element unit includes a Peltier element.

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