A polishing apparatus and a polishing method for a silicon carbide wafer

Abstract

This invention relates to the field of silicon carbide wafer polishing technology, and discloses a silicon carbide wafer polishing apparatus and method, including a control cabinet. A transparent glass panel is fixedly connected to the surface of the control cabinet, and a cabinet door is hinged to the surface of the control cabinet. A drain valve is connected to the lower surface of the control cabinet, and a fixing component is installed inside the control cabinet. The fixing component includes a precision cylinder, the top of which is fixedly connected to the inner wall of the control cabinet, and a fixing ring is fixedly connected to the lower surface of the precision cylinder. The invention utilizes an electric actuator to push a protective frame upwards. As the protective frame moves, it pushes the polishing ring upwards, providing sufficient space between the polishing ring and the polishing disc for the operator to load and unload the silicon carbide wafer. The operator can then install the silicon carbide wafer inside the fixing component, using the fixing component to secure the silicon carbide wafer and improving the convenience of loading and unloading the silicon carbide wafer.

Description

Technical Field

[0001] This invention relates to the field of silicon carbide wafer polishing technology, specifically to a silicon carbide wafer polishing apparatus and polishing method. Background Technology

[0002] Silicon carbide wafers are a wide bandgap semiconductor material. The main application areas of silicon carbide wafers are LED solid-state lighting and high-frequency devices. This material has excellent properties such as bandgap, drift velocity, breakdown voltage, thermal conductivity and high temperature resistance that are several times higher than those of traditional silicon. It has irreplaceable advantages in electronic applications such as high temperature, high pressure, high frequency, high power, optoelectronics, radiation resistance, and microwave, as well as in extreme environments such as aerospace, military, and nuclear energy.

[0003] Silicon carbide wafers require polishing during production to prevent burrs and other surface defects from affecting their quality. During polishing, the wafers need to be fixed to improve stability. Traditionally, the wafer is fixed above the polishing device, which means the device can only polish the bottom surface. Operators need to rotate the wafer during polishing, making the process time-consuming and inconvenient. Summary of the Invention

[0004] The purpose of this invention is to provide a polishing apparatus and polishing method for silicon carbide wafers to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0006] The present invention relates to a silicon carbide wafer polishing device and polishing method, comprising a control cabinet, wherein a transparent glass is fixedly connected to the surface of the control cabinet, a cabinet door is hinged to the surface of the control cabinet, a drain valve is connected to the lower surface of the control cabinet, and a fixing component is provided inside the control cabinet;

[0007] The fixing component includes:

[0008] Support components, installed inside the control cabinet, are used to support the silicon carbide wafers;

[0009] The clamping assembly is installed inside the support assembly and is limited by the support assembly. The clamping assembly is used to clamp and fix the silicon carbide wafer.

[0010] The support assembly includes a fixed ring, a bidirectional telescopic frame, a precision cylinder, and a bidirectional electric actuator. The top of the precision cylinder is fixedly connected to the inner wall of the control cabinet, and the bottom of the precision cylinder is fixedly connected to the surface of the fixed ring. The precision cylinder is used to adjust the fixed ring. The inner wall of the fixed ring is fixedly connected to the center surface of the bidirectional telescopic frame, and the inner wall of the fixed ring is fixedly connected to the center surface of the bidirectional electric actuator.

[0011] The clamping assembly includes a positioning plate, a connecting plate, a clamping plate, an anti-slip pad, a circular groove, an elastic frame, and a rubber rod. The surface of the positioning plate is fixedly connected to the end of the bidirectional telescopic frame. The end of the positioning plate near the bidirectional telescopic frame is fixedly connected to the surface of the clamping plate. The end of the clamping plate away from the positioning plate is fixedly connected to the surface of the anti-slip pad. The circular groove is formed inside the clamping plate. The inner wall of the circular groove is fixedly connected to the end of the elastic frame. The end of the elastic frame away from the circular groove is rotatably connected to the surface of the rubber rod. The telescopic end of the bidirectional electric actuator is fixedly connected to the surface of the connecting plate. The end of the connecting plate is fixedly connected to the surface of the positioning plate. The surface of the anti-slip pad is provided with a silicon carbide wafer, and the end of the anti-slip pad away from the clamping plate is in contact with the surface of the silicon carbide wafer.

[0012] The clamping plates move away from each other as the bidirectional telescopic frame extends, and the distance they move away is the same as the thickness of the silicon carbide wafer. When the silicon carbide wafer is placed on the surface of the anti-slip pad, the anti-slip pads located at the upper and lower ends of the silicon carbide wafer will pre-clamp and fix it. At this time, the operator can fix the silicon carbide wafer by placing it on the surface of the anti-slip pad. The operator only needs to insert the silicon carbide wafer into the surface of the anti-slip pad to complete the loading, thereby improving the convenience of loading the silicon carbide wafer during polishing. The surface of the bidirectional telescopic frame is provided with stabilizing components, and the inside of the fixing ring is provided with a displacement component.

[0013] Furthermore, an electric rod is fixedly connected to the top of the inner wall of the control cabinet, and a protective frame is fixedly connected to the telescopic end of the electric rod. A power unit is fixedly connected to the inner wall of the protective frame, and a cross is fixedly connected to the output end of the power unit. A polishing ring is fixedly connected to the end of the cross. A second protective frame is fixedly connected to the bottom of the inner wall of the control cabinet, and a second power unit is fixedly connected to the inner wall of the second protective frame. A polishing disc is fixedly connected to the output end of the power unit. A sieve storage groove is opened at the bottom of the inner wall of the control cabinet, and a recycling groove is opened inside the control cabinet. A spraying device is installed at the top of the inner wall of the control cabinet, and a telescopic rod is fixedly connected to the top of the inner wall of the control cabinet. The bottom of the telescopic rod is fixedly connected to the surface of the protective frame. When the electric rod pushes the protective frame downward, the protective frame will pull the telescopic rod to extend. The telescopic rod limits the lifting and lowering movement of the protective frame, improving the stability of the protective frame during operation.

[0014] Furthermore, there are two transparent glass panes, which are symmetrically arranged with the cabinet door as the center. The polishing ring is located above the polishing disc, and there is a gap between the polishing ring and the polishing disc. The top of the second protective frame extends into the interior of the control cabinet. The sieve storage tank and the recycling tank are interconnected. The recycling tank and the discharge valve are interconnected. The spraying end of the spraying device is located above the cross.

[0015] Furthermore, there are two precision cylinders, which are symmetrically arranged around the protective frame. There are four bidirectional telescopic frames, which are arranged circumferentially around the fixed ring. The telescopic ends of the bidirectional telescopic frames are symmetrically arranged around the silicon carbide wafer.

[0016] Furthermore, the end of the polishing ring that is close to the polishing disc is in contact with the surface of the silicon carbide wafer, the end of the elastic frame that is close to the rubber rod is slidably connected to the inner wall of the circular groove, and the end of the rubber rod that is away from the elastic frame passes through the anti-slip pad.

[0017] Furthermore, the stabilizing component includes a fixed plate, the lower surface of which is fixedly connected to the center surface of the bidirectional telescopic frame. An electric extension rod is fixedly connected to the upper surface of the fixed plate. An arc-shaped plate is fixedly connected to the telescopic end of the electric extension rod. A limiting plate is fixedly connected to the end of the arc-shaped plate. A bidirectional clamping rod is fixedly connected to the surface of the limiting plate. A bent plate is fixedly connected to the telescopic end of the bidirectional clamping rod. A pressing plate is fixedly connected to the end of the bent plate away from the bidirectional clamping rod. A rubber block is fixedly connected to the end of the pressing plate away from the bent plate. When the bidirectional clamping rod is activated, the end of the bidirectional clamping rod pushes the pressing plate to move closer to each other. When the pressing plate moves, it pushes the rubber block to clamp and fix the silicon carbide wafer. The silicon carbide wafer remains stable under the limiting of the pressing plate and the limiting plate, thereby improving its stability during polishing.

[0018] Furthermore, the end of the limiting plate away from the bidirectional clamping rod is in contact with the surface of the silicon carbide wafer. Two extrusion plates are provided on the surface of the limiting plate, and the two extrusion plates are respectively located at the upper and lower ends of the silicon carbide wafer. The end of the rubber block away from the extrusion plates is in contact with the surface of the silicon carbide wafer. The arc-shaped plate is symmetrically arranged with the electric extension rod as the center.

[0019] Furthermore, the switching component includes a bracket, the top of which is fixedly connected to the bottom of a precision cylinder. A drive device is fixedly connected to the end of the bracket away from the precision cylinder. A meshing disc is fixedly connected to the output end of the drive device. A grooved ring meshes with the surface of the meshing disc. A rubber ring is fixedly connected to the inner wall of the grooved ring. A stabilizing groove is formed on the surface of the grooved ring. When the meshing disc rotates, it drives the grooved ring to rotate through meshing. When the grooved ring rotates, it drives the silicon carbide wafer to rotate through the friction between the rubber ring and the silicon carbide wafer. The silicon carbide wafer will rotate around the rubber rod as the center, thereby changing the polishing position of the silicon carbide wafer and further improving the convenience of polishing the silicon carbide wafer.

[0020] Furthermore, the number of rubber rings is set to two, and the two rubber rings are symmetrically arranged with the grooved ring as the center. The end of the rubber ring away from the grooved ring is set as an inclined surface, and the inner wall of the stabilizing groove is rotatably connected to the central surface of the bidirectional telescopic frame.

[0021] Furthermore, a polishing method for a silicon carbide wafer polishing apparatus includes the following steps:

[0022] S1: The clamping plates move away from each other as the bidirectional telescopic frame extends. The distance they move away from each other is the same as the thickness of the silicon carbide wafer. When the silicon carbide wafer is placed on the surface of the anti-slip pad, the anti-slip pads at the top and bottom of the silicon carbide wafer will pre-clamp and fix it. At this time, the operator can fix the silicon carbide wafer by placing it on the surface of the anti-slip pad. The operator only needs to insert the silicon carbide wafer into the surface of the anti-slip pad to complete the feeding.

[0023] S2: The ends of the bidirectional clamping rods push the extrusion plates to move closer to each other. When the extrusion plates move, they push the rubber blocks to clamp and fix the silicon carbide wafer. The silicon carbide wafer will remain stable under the limitation of the extrusion plates and the limiting plates.

[0024] S3: When the arc plate moves, it pulls the silicon carbide wafer to move through the extrusion plate. The silicon carbide wafer will move to the inner wall of the groove ring. After the position of the silicon carbide wafer is adjusted, the bidirectional electric push rod pushes the clamping plate to move closer to each other. When the clamping plate moves, it squeezes the rubber rod through the elastic frame, thereby increasing the squeezing force of the rubber rod on the silicon carbide wafer.

[0025] S4: When the groove ring rotates, it drives the silicon carbide wafer to rotate through the friction between the rubber ring and the silicon carbide wafer. The silicon carbide wafer will rotate around the rubber rod as the center, thereby changing the polishing position of the silicon carbide wafer and further improving the convenience of polishing the silicon carbide wafer.

[0026] The present invention has the following beneficial effects:

[0027] After the operator opens the cabinet door, they activate the electric lever to move the protective frame upwards. As the protective frame moves, it pushes the polishing ring upwards, creating sufficient space between the polishing ring and the polishing disc for the operator to load and unload the silicon carbide wafers. The operator can then install the silicon carbide wafers inside the fixing component, which secures the wafers and improves the ease of loading and unloading. After the wafers are secured, the operator closes the cabinet door and activates the electric lever to move the protective frame downwards. As the protective frame moves, it pushes the polishing ring into contact with the silicon carbide wafers, activating the electric lever... When the first and second power devices are in operation, they drive the polishing ring and polishing disc to rotate and polish the top and bottom surfaces of the silicon carbide wafer simultaneously, improving the polishing efficiency of the silicon carbide wafer. Both sides of the silicon carbide wafer can be polished without flipping it over. During the polishing process, the spraying device sprays polishing liquid onto the surface of the silicon carbide wafer. The sprayed polishing liquid flows into the sieve storage tank, where it is filtered. The filtered polishing liquid then enters the recycling tank, while the waste in the polishing liquid is separated inside the sieve storage tank for recycling by the operator.

[0028] When the silicon carbide wafer of the present invention is installed inside the fixed component, the stabilizing component will contact the circumferential surface of the silicon carbide wafer. The stabilizing component will limit the silicon carbide wafer, improve the stability of the silicon carbide wafer during polishing, and prevent the silicon carbide wafer from shifting due to friction during polishing.

[0029] When the polishing position of the silicon carbide wafer needs to be changed, the fixing component becomes loose between itself and the silicon carbide wafer. At this time, the stabilizing component will pull the silicon carbide wafer to move. When the center of the silicon carbide wafer contacts the end of the rubber rod, the surface of the silicon carbide wafer will move into the interior of the repositioning component. When the repositioning component starts to rotate, it will push the silicon carbide wafer to rotate through friction, thereby changing the polishing position of the silicon carbide wafer, improving the overall polishing of the silicon carbide wafer and avoiding uneven polishing.

[0030] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a cross-sectional view of one corner of the control cabinet of the present invention;

[0033] Figure 2 This is a cross-sectional view of the control cabinet of the present invention;

[0034] Figure 3 This is a schematic diagram showing the positions of the fixing component, stabilizing component, and repositioning component of the present invention;

[0035] Figure 4 This is an exploded structural diagram of the fixing component, stabilizing component, and repositioning component of the present invention;

[0036] Figure 5 This is a schematic diagram of the polishing ring structure of the present invention;

[0037] Figure 6 This is a schematic diagram of the overall structure of the fixing component of the present invention;

[0038] Figure 7 This is a schematic diagram of another structure of the fixing component of the present invention;

[0039] Figure 8 For the present invention Figure 7 Enlarged diagram of part A in the diagram;

[0040] Figure 9 This is a schematic diagram of the overall structure of the stabilizing component of the present invention;

[0041] Figure 10 For the present invention Figure 9 Enlarged schematic diagram of part B in the diagram;

[0042] Figure 11 This is a schematic diagram of the overall structure of the transposition component of the present invention;

[0043] Figure 12 This is another structural schematic diagram of the transposition component of the present invention;

[0044] Figure 13 This is a schematic diagram of the groove ring cross-sectional structure of the present invention;

[0045] Figure 14 This is a schematic diagram of the connection structure between the grooved ring and the bidirectional telescopic frame of the present invention;

[0046] Figure 15 This is a schematic diagram of the connection structure between the meshing disc and the grooved ring of the present invention;

[0047] Figure 16 This is a schematic diagram of the process structure of the present invention.

[0048] The attached diagram lists the components represented by each number as follows:

[0049] In the diagram: 1. Control cabinet; 2. Transparent glass; 3. Cabinet door; 4. Drain valve; 5. Telescopic rod; 6. Protective frame one; 7. Spraying device; 8. Polishing ring; 9. Power unit two; 10. Recovery tank; 11. Protective frame two; 12. Polishing disc; 13. Cross; 14. Screen storage tank; 15. Power unit one; 17. Electric rod; 18. Fixing component; 19. Stabilizing component; 20. Repositioning component; 30. Fixing ring; 31. Bidirectional telescopic frame; 32. Precision cylinder; 33. 34. Bidirectional electric actuator; 35. Positioning plate; 36. Linking plate; 37. Silicon carbide wafer; 38. Clamping plate; 39. Anti-slip pad; 40. Circular groove; 41. Elastic frame; 50. Rubber rod; 51. Fixing plate; 52. Electric extension rod; 53. Arc plate; 54. Limiting plate; 55. Bidirectional clamping rod; 56. Rubber block; 57. Bending plate; 68. Extrusion plate; 69. Engaging disc; 60. Groove ring; 61. Drive device; 62. Bracket; 63. Rubber ring; 64. Stabilizing groove. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Please see Figures 1-16 As shown, the present invention is a polishing device and polishing method for silicon carbide wafers, including a control cabinet 1, a transparent glass 2 fixedly connected to the surface of the control cabinet 1, a cabinet door 3 hinged to the surface of the control cabinet 1, a drain valve 4 connected to the lower surface of the control cabinet 1, and a fixing component 18 provided inside the control cabinet 1.

[0052] The fixing component 18 includes:

[0053] Support assembly, installed inside control cabinet 1, is used to support silicon carbide wafers;

[0054] The clamping assembly is installed inside the support assembly and is limited by the support assembly. The clamping assembly is used to clamp and fix the silicon carbide wafer.

[0055] The support assembly includes a fixed ring 30, a bidirectional telescopic frame 31, a precision cylinder 32, and a bidirectional electric actuator 33. The top of the precision cylinder 32 is fixedly connected to the inner wall of the control cabinet 1, and the bottom of the precision cylinder 32 is fixedly connected to the surface of the fixed ring 30. The precision cylinder 32 is used to adjust the fixed ring 30. The inner wall of the fixed ring 30 is fixedly connected to the center surface of the bidirectional telescopic frame 31, and the inner wall of the fixed ring 30 is fixedly connected to the center surface of the bidirectional electric actuator 33.

[0056] The clamping assembly includes a positioning plate 34, a connecting plate 35, a clamping plate 37, an anti-slip pad 38, a circular groove 39, an elastic frame 40, and a rubber rod 41. The surface of the positioning plate 34 is fixedly connected to the end of the bidirectional telescopic frame 31. The end of the positioning plate 34 near the bidirectional telescopic frame 31 is fixedly connected to the surface of the clamping plate 37. The end of the clamping plate 37 away from the positioning plate 34 is fixedly connected to the surface of the anti-slip pad 38. The circular groove 39 is formed inside the clamping plate 37. The inner wall of the circular groove 39 is fixedly connected to the end of the elastic frame 40. The end of the elastic frame 40 away from the circular groove 39 is rotatably connected to the surface of the rubber rod 41. The telescopic end of the bidirectional electric push rod 33 is fixedly connected to the surface of the connecting plate 35. The end of the connecting plate 35 is fixedly connected to the surface of the positioning plate 34. A silicon carbide wafer 36 is provided on the surface of the anti-slip pad 38, and the end of the anti-slip pad 38 away from the clamping plate 37 is in contact with the surface of the silicon carbide wafer 36.

[0057] The surface of the bidirectional telescopic frame 31 is provided with a stabilizing component 19, and the interior of the fixing ring 30 is provided with a displacement component 20.

[0058] An electric rod 17 is fixedly connected to the top of the inner wall of control cabinet 1. A protective frame 6 is fixedly connected to the telescopic end of the electric rod 17. A power unit 15 is fixedly connected to the inner wall of the protective frame 6. A cross 13 is fixedly connected to the output end of the power unit 15. A polishing ring 8 is fixedly connected to the end of the cross 13. A second protective frame 11 is fixedly connected to the bottom of the inner wall of control cabinet 1. A second power unit 9 is fixedly connected to the inner wall of the second protective frame 11. A polishing disc 12 is fixedly connected to the output end of the second power unit 9. A sieve storage tank 14 is opened at the bottom of the inner wall of control cabinet 1. A recycling tank 10 is opened inside the control cabinet 1. A spraying device 7 is installed at the top of the inner wall of control cabinet 1. A telescopic rod 5 is fixedly connected to the top of the inner wall of control cabinet 1. The bottom of the telescopic rod 5 is fixedly connected to the surface of the protective frame 6.

[0059] There are two transparent glass panes 2, which are symmetrically arranged with the cabinet door 3 as the center. The polishing ring 8 is located above the polishing disc 12, and there is a gap between the polishing ring 8 and the polishing disc 12. The top of the protective frame 11 extends into the interior of the control cabinet 1. The sieve storage tank 14 and the recycling tank 10 are interconnected. The recycling tank 10 is interconnected with the discharge valve 4. The spraying end of the spraying device 7 is located above the cross 13.

[0060] There are two precision cylinders 32, which are symmetrically arranged around the protective frame 6. There are four bidirectional telescopic frames 31, which are arranged circumferentially around the fixed ring 30. The telescopic ends of the bidirectional telescopic frames 31 are symmetrically arranged around the silicon carbide wafer 36.

[0061] The polishing ring 8 and the polishing disc 12 are close to each other at one end and contact the surface of the silicon carbide wafer 36. The end of the elastic frame 40 close to the rubber rod 41 is slidably connected to the inner wall of the circular groove 39. The end of the rubber rod 41 away from the elastic frame 40 passes through the anti-slip pad 38.

[0062] The stabilizing component 19 includes a fixed plate 50. The lower surface of the fixed plate 50 is fixedly connected to the center surface of the bidirectional telescopic frame 31. An electric extension rod 51 is fixedly connected to the upper surface of the fixed plate 50. An arc-shaped plate 52 is fixedly connected to the telescopic end of the electric extension rod 51. A limit plate 53 is fixedly connected to the end of the arc-shaped plate 52. A bidirectional clamping rod 54 is fixedly connected to the surface of the limit plate 53. A bent plate 56 is fixedly connected to the telescopic end of the bidirectional clamping rod 54. A compression plate 57 is fixedly connected to the end of the bent plate 56 away from the bidirectional clamping rod 54. A rubber block 55 is fixedly connected to the end of the compression plate 57 away from the bent plate 56.

[0063] The end of the limiting plate 53 away from the bidirectional clamping rod 54 is in contact with the surface of the silicon carbide wafer 36. Two extrusion plates 57 are provided on the surface of the limiting plate 53. The two extrusion plates 57 are located at the upper and lower ends of the silicon carbide wafer 36, respectively. The end of the rubber block 55 away from the extrusion plate 57 is in contact with the surface of the silicon carbide wafer 36. The arc plate 52 is symmetrically arranged with the electric extension rod 51 as the center.

[0064] The shifting component 20 includes a bracket 63. The top of the bracket 63 is fixedly connected to the bottom of the precision cylinder 32. A drive device 62 is fixedly connected to the end of the bracket 63 away from the precision cylinder 32. A meshing disc 60 is fixedly connected to the output end of the drive device 62. A grooved ring 61 meshes with the surface of the meshing disc 60. A rubber ring 64 is fixedly connected to the inner wall of the grooved ring 61. A stabilizing groove 65 is formed on the surface of the grooved ring 61.

[0065] There are two rubber rings 64, which are symmetrically arranged with the grooved ring 61 as the center. The end of the rubber ring 64 away from the grooved ring 61 is set as an inclined surface. The inner wall of the stabilizing groove 65 is rotatably connected to the central surface of the bidirectional telescopic frame 31.

[0066] A polishing method for a silicon carbide wafer polishing apparatus includes the following steps:

[0067] S1: The clamping plates 37 move away from each other as the bidirectional telescopic frame 31 extends. The distance they move away from each other is the same as the thickness of the silicon carbide wafer 36. When the silicon carbide wafer 36 is placed on the surface of the anti-slip pad 38, the anti-slip pads 38 located at the upper and lower ends of the silicon carbide wafer 36 will pre-clamp and fix it. At this time, the operator can fix the silicon carbide wafer 36 by placing it on the surface of the anti-slip pad 38. The operator only needs to insert the silicon carbide wafer 36 into the surface of the anti-slip pad 38 to complete the feeding.

[0068] S2: The end of the bidirectional clamping rod 54 pushes the extrusion plate 57 to move closer to each other. When the extrusion plate 57 moves, it pushes the rubber block 55 to clamp and fix the silicon carbide wafer 36. The silicon carbide wafer 36 will remain stable under the limitation of the extrusion plate 57 and the limiting plate 53.

[0069] S3: When the arc plate 52 moves, it pulls the silicon carbide wafer 36 to move through the extrusion plate 57. The silicon carbide wafer 36 will move to the inner wall of the groove ring 61. After the position adjustment of the silicon carbide wafer 36 is completed, the bidirectional electric push rod 33 pushes the clamping plate 37 to move closer to each other. When the clamping plate 37 moves, it squeezes the rubber rod 41 through the elastic frame 40, thereby increasing the squeezing force of the rubber rod 41 on the silicon carbide wafer 36.

[0070] S4: When the groove ring 61 rotates, it drives the silicon carbide wafer 36 to rotate through the friction between the rubber ring 64 and the silicon carbide wafer 36. The silicon carbide wafer 36 will rotate around the rubber rod 41 as the center, thereby changing the polishing position of the silicon carbide wafer 36 and further improving the convenience of polishing the silicon carbide wafer 36.

[0071] In use, after the operator opens cabinet door 3, they activate electric lever 17 to push protective frame 6 upward. As protective frame 6 moves, it pushes polishing ring 8 upward, creating sufficient space between polishing ring 8 and polishing disc 12 for the operator to load and unload silicon carbide wafers 36. The operator can then install silicon carbide wafers 36 inside fixing component 18, using the fixing component 18 to secure the silicon carbide wafers 36, improving the ease of loading and unloading. After the silicon carbide wafers 36 are secured, the operator closes cabinet door 3 and activates electric lever 17. 7. The protective frame 6 is pushed downwards. As the protective frame 6 moves, it pushes the polishing ring 8 into contact with the silicon carbide wafer 36. When the power unit 15 and the power unit 2 9 are activated, they will drive the polishing ring 8 and the polishing disc 12 to rotate and polish the top and bottom surfaces of the silicon carbide wafer 36 simultaneously, improving the polishing efficiency of the silicon carbide wafer 36. Both sides of the silicon carbide wafer 36 can be polished without flipping it over. During the polishing process, the spraying device 7 sprays polishing liquid onto the surface of the silicon carbide wafer 36. After spraying, the polishing liquid flows into the interior of the sieve storage tank 14. The polishing slurry is filtered using the perforated storage tank 14. The filtered slurry then enters the recovery tank 10, while waste materials are separated within the perforated storage tank 14 for recycling by operators. When the silicon carbide wafer 36 is installed inside the fixing component 18, the stabilizing component 19 contacts the circumferential surface of the silicon carbide wafer 36. The stabilizing component 19 limits the position of the silicon carbide wafer 36, improving its stability during polishing and preventing it from shifting due to friction. The polishing position of the silicon carbide wafer 36 needs to be adjusted. During replacement, the fixing component 18 becomes loose between itself and the silicon carbide wafer 36. At this time, the stabilizing component 19 will pull the silicon carbide wafer 36 to move. When the center of the silicon carbide wafer 36 contacts the end of the rubber rod 41, the surface of the silicon carbide wafer 36 will move into the interior of the switching component 20. When the switching component 20 starts to rotate, it will push the silicon carbide wafer 36 to rotate through friction, thereby changing the polishing position of the silicon carbide wafer 36, improving the overall polishing of the silicon carbide wafer 36, and avoiding uneven polishing of the silicon carbide wafer 36.

[0072] When it is necessary to feed the silicon carbide wafer 36, the bidirectional electric push rod 33 is activated to push the upper and lower connecting plates 35 to move away from each other. As the connecting plates 35 move, they pull the bidirectional telescopic frame 31 to extend via the positioning plate 34. The clamping plates 37 move away from each other as the bidirectional telescopic frame 31 extends, and the distance they move away is the same as the thickness of the silicon carbide wafer 36. Thus, when the silicon carbide wafer 36 is placed on the surface of the anti-slip pad 38, the anti-slip pads 38 at the upper and lower ends of the silicon carbide wafer 36 will pre-clamp and fix it. At this time, the operator can fix the silicon carbide wafer 36 by placing it on the surface of the anti-slip pad 38. The operator only needs to insert the silicon carbide wafer 36 onto the surface of the anti-slip pad 38 to complete the loading, thereby improving the convenience of loading the silicon carbide wafer 36 during polishing. When the bidirectional electric push rod 33 is activated to push the connecting plates 35 at both ends to move closer to each other, the positioning plate 34 moves to push the clamping plate 37 to clamp and fix the silicon carbide wafer 36, thereby improving the stability of the silicon carbide wafer 36 during polishing. When it is necessary to unload the silicon carbide wafer 36 after polishing, the bidirectional electric push rod 33 moves away from each other to push the clamping plate 37 to separate. At this time, the operator can directly remove it, improving the convenience of unloading the silicon carbide wafer 36.

[0073] After the clamping plate 37 fixes the silicon carbide wafer 36, the surface of the silicon carbide wafer 36 will contact the surface of the limiting plate 53, thereby limiting the silicon carbide wafer 36 with the limiting plate 53. The limiting plate 53 limits the installation position of the silicon carbide wafer 36, improving the convenience of loading the silicon carbide wafer 36. The bidirectional clamping rod 54 is activated to start the operation. The end of the bidirectional clamping rod 54 pushes the extrusion plate 57 to move closer to each other. When the extrusion plate 57 moves, it pushes the rubber block 55 to clamp and fix the silicon carbide wafer 36. The silicon carbide wafer 36 will remain stable under the limitation of the extrusion plate 57 and the limiting plate 53, thereby improving its stability during the polishing operation and preventing the silicon carbide wafer 36 from shifting and falling off due to friction.

[0074] When the polishing position of the silicon carbide wafer 36 needs to be changed, the bidirectional electric actuator 33 pushes the clamping plates 37 to move away from each other. During this movement, the rubber rod 41 moves towards the outer end of the anti-slip pad 38 using the elasticity of the elastic frame 40, ensuring that the rubber rod 41 remains in contact with the silicon carbide wafer 36. After the clamping plates 37 are adjusted, the electric extension rod 51 is activated to pull the arc plate 52. As the arc plate 52 moves, it is pulled by the pressing plate 57. As the silicon carbide wafer 36 moves, it will move to the inner wall of the groove ring 61. After the position adjustment of the silicon carbide wafer 36 is completed, the bidirectional electric push rod 33 pushes the clamping plate 37 to move closer to each other. When the clamping plate 37 moves, it squeezes the rubber rod 41 through the elastic frame 40, thereby increasing the squeezing force of the rubber rod 41 on the silicon carbide wafer 36. However, a distance is maintained between the clamping plate 37 and the silicon carbide wafer 36 to avoid affecting the position adjustment of the silicon carbide wafer 36. After the silicon carbide wafer 36 is fixed, the bidirectional clamping rod 54 is activated to push the extrusion plate 57 to move away from each other and separate from the silicon carbide wafer 36. After the operation is completed, the drive device 62 is activated to drive the meshing disk 60 to rotate. When the meshing disk 60 rotates, it drives the groove ring 61 to rotate through meshing. When the groove ring 61 rotates, it drives the silicon carbide wafer 36 to rotate through the friction between the rubber ring 64 and the silicon carbide wafer 36. The silicon carbide wafer 36 will rotate around the rubber rod 41, thereby changing the polishing position of the silicon carbide wafer 36, further improving the convenience of polishing the silicon carbide wafer 36. After the adjustment is completed, the extrusion plate 57 clamps and fixes the silicon carbide wafer 36, and pushes the silicon carbide wafer 36 to the polishing position through the electric extension rod 51 for polishing operation. After the silicon carbide wafer 36 moves to the polishing position, it is clamped and fixed by the clamping plate 37, further improving the stability of the silicon carbide wafer 36 during polishing.

[0075] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A polishing apparatus for silicon carbide wafers, comprising a control cabinet (1), a first power unit (15), and a second power unit (9), characterized in that, The control cabinet (1) is equipped with a fixing component (18) inside; The fixing component (18) includes: Support assembly, which is installed inside the control cabinet (1) for supporting silicon carbide wafers; The clamping assembly is installed inside the support assembly and is limited by the support assembly. The clamping assembly is used to clamp and fix the silicon carbide wafer. The support assembly includes a fixed ring (30), a bidirectional telescopic frame (31), a precision cylinder (32), and a bidirectional electric actuator (33). The top of the precision cylinder (32) is fixedly connected to the inner wall of the control cabinet (1), and the bottom of the precision cylinder (32) is fixedly connected to the surface of the fixed ring (30). The precision cylinder (32) is used to adjust the fixed ring (30). The inner wall of the fixed ring (30) is fixedly connected to the center surface of the bidirectional telescopic frame (31), and the inner wall of the fixed ring (30) is fixedly connected to the center surface of the bidirectional electric actuator (33). The number of bidirectional telescopic frames (31) is set to be multiple, and the multiple bidirectional telescopic frames (31) are symmetrically arranged with the fixed ring (30) as the center. The clamping assembly includes a positioning plate (34), a clamping plate (37), and an anti-slip pad (38). The surface of the positioning plate (34) is fixedly connected to the end of the bidirectional telescopic frame (31). The end of the positioning plate (34) near the bidirectional telescopic frame (31) is fixedly connected to the surface of the clamping plate (37), and the end of the clamping plate (37) away from the positioning plate (34) is fixedly connected to the surface of the anti-slip pad (38). The output end of the first power device (15) is fixedly connected to a cross (13), and the end of the cross (13) is fixedly connected to a polishing ring (8). The output end of the second power device (9) is fixedly connected to a polishing disc (12). The polishing ring (8) is located above the polishing disc (12), and there is a gap between the polishing ring (8) and the polishing disc (12). The end of the polishing ring (8) and the polishing disc (12) that are close to each other is in contact with the surface of the silicon carbide wafer (36). The surface of the bidirectional telescopic frame (31) is provided with a stabilizing component (19), and the interior of the fixing ring (30) is provided with a displacement component (20). The stabilizing component (19) includes a fixed plate (50), the lower surface of which is fixedly connected to the center surface of the bidirectional telescopic frame (31), an electric extension rod (51) is fixedly connected to the upper surface of the fixed plate (50), an arc plate (52) is fixedly connected to the telescopic end of the electric extension rod (51), a limit plate (53) is fixedly connected to the end of the arc plate (52), a bidirectional clamping rod (54) is fixedly connected to the surface of the limit plate (53), a bending plate (56) is fixedly connected to the telescopic end of the bidirectional clamping rod (54), a pressing plate (57) is fixedly connected to the end of the bending plate (56) away from the bidirectional clamping rod (54), and a rubber block (55) is fixedly connected to the end of the pressing plate (57) away from the bending plate (56). The shifting component (20) includes a bracket (63), the top of which is fixedly connected to the bottom of a precision cylinder (32). A drive device (62) is fixedly connected to one end of the bracket (63) away from the precision cylinder (32). A meshing disc (60) is fixedly connected to the output end of the drive device (62). A grooved ring (61) meshes with the surface of the meshing disc (60). A rubber ring (64) is fixedly connected to the inner wall of the grooved ring (61). A stabilizing groove (65) is opened on the surface of the grooved ring (61). The inner wall of the stabilizing groove (65) is rotatably connected to the center surface of the bidirectional telescopic frame (31).

2. The silicon carbide wafer polishing apparatus according to claim 1, characterized in that: The clamping assembly also includes a connecting plate (35), a circular groove (39), an elastic frame (40), and a rubber rod (41). The circular groove (39) is opened inside the clamping plate (37). The inner wall of the circular groove (39) is fixedly connected to the end of the elastic frame (40). The end of the elastic frame (40) away from the circular groove (39) is rotatably connected to the surface of the rubber rod (41). The telescopic end of the bidirectional electric push rod (33) is fixedly connected to the surface of the connecting plate (35). The end of the connecting plate (35) is fixedly connected to the surface of the positioning plate (34). The surface of the anti-slip pad (38) is provided with a silicon carbide wafer (36), and the end of the anti-slip pad (38) away from the clamping plate (37) is in contact with the surface of the silicon carbide wafer (36).

3. The silicon carbide wafer polishing apparatus according to claim 2, characterized in that: The control cabinet (1) has a transparent glass (2) fixedly connected to its surface. The control cabinet (1) has a cabinet door (3) hinged to its surface. The lower surface of the control cabinet (1) is connected to a discharge valve (4). The top of the inner wall of the control cabinet (1) is fixedly connected to an electric rod (17). The telescopic end of the electric rod (17) is fixedly connected to a protective frame (6). The inner wall of the protective frame (6) is fixedly connected to a power device (15). The bottom of the inner wall of the control cabinet (1) is fixedly connected to a protective frame (11). The inner wall of the protective frame (11) is fixedly connected to a power device (9). The bottom of the inner wall of the control cabinet (1) is provided with a sieve storage tank (14). The inside of the control cabinet (1) is provided with a recycling tank (10). The top of the inner wall of the control cabinet (1) is equipped with a spraying device (7). The top of the inner wall of the control cabinet (1) is fixedly connected to a telescopic rod (5). The bottom of the telescopic rod (5) is fixedly connected to the surface of the protective frame (6).

4. The silicon carbide wafer polishing apparatus according to claim 3, characterized in that: There are two transparent glass (2) arranged symmetrically with the cabinet door (3) as the center. The top of the second protective frame (11) extends into the interior of the control cabinet (1). The sieve storage tank (14) and the recycling tank (10) are connected to each other. The recycling tank (10) and the discharge valve (4) are connected to each other. The spraying end of the spraying device (7) is located above the cross (13).

5. The silicon carbide wafer polishing apparatus according to claim 4, characterized in that: The precision cylinder (32) is provided in two quantities, and the two precision cylinders (32) are symmetrically arranged with the protective frame (6) as the center. The bidirectional telescopic frame (31) is provided in four quantities, and the four bidirectional telescopic frames (31) are arranged circumferentially with the fixed ring (30) as the center. The telescopic ends of the bidirectional telescopic frame (31) are symmetrically arranged with the silicon carbide wafer (36) as the center.

6. The silicon carbide wafer polishing apparatus according to claim 5, characterized in that: The end of the elastic frame (40) near the rubber rod (41) is slidably connected to the inner wall of the circular groove (39), and the end of the rubber rod (41) away from the elastic frame (40) passes through the anti-slip pad (38).

7. The apparatus for polishing silicon carbide wafers according to claim 6, characterized in that: The end of the limiting plate (53) away from the bidirectional clamping rod (54) is in contact with the surface of the silicon carbide wafer (36). Two extrusion plates (57) are provided on the surface of the limiting plate (53). The two extrusion plates (57) are located at the upper and lower ends of the silicon carbide wafer (36) respectively. The end of the rubber block (55) away from the extrusion plate (57) is in contact with the surface of the silicon carbide wafer (36). The arc plate (52) is symmetrically arranged with the electric extension rod (51) as the center.

8. The apparatus for polishing silicon carbide wafers according to claim 7, characterized in that: The number of rubber rings (64) is set to two, and the two rubber rings (64) are symmetrically arranged with the grooved ring (61) as the center. The end of the rubber ring (64) away from the grooved ring (61) is set as an inclined surface.

9. A polishing method for a silicon carbide wafer polishing apparatus according to claim 8, characterized in that, Includes the following steps: S1: The clamping plates (37) move away from each other as the bidirectional telescopic frame (31) extends. The distance they move away from each other is the same as the thickness of the silicon carbide wafer (36). When the silicon carbide wafer (36) is placed on the surface of the anti-slip pad (38), the anti-slip pad (38) located at the upper and lower ends of the silicon carbide wafer (36) will pre-clamp and fix it. At this time, the operator can fix the silicon carbide wafer (36) by placing it on the surface of the anti-slip pad (38). The operator only needs to insert the silicon carbide wafer (36) into the surface of the anti-slip pad (38) to complete the feeding. S2: The end of the bidirectional clamping rod (54) pushes the extrusion plate (57) to move closer to each other. When the extrusion plate (57) moves, it pushes the rubber block (55) to clamp and fix the silicon carbide wafer (36). The silicon carbide wafer (36) will remain stable under the limitation of the extrusion plate (57) and the limiting plate (53). S3: When the arc plate (52) moves, it pulls the silicon carbide wafer (36) to move through the extrusion plate (57). The silicon carbide wafer (36) will move to the inner wall of the groove ring (61). After the position adjustment of the silicon carbide wafer (36) is completed, the bidirectional electric push rod (33) pushes the clamping plate (37) to move closer to each other. When the clamping plate (37) moves, it squeezes the rubber rod (41) through the elastic frame (40), thereby increasing the squeezing force of the rubber rod (41) on the silicon carbide wafer (36). S4: When the groove ring (61) rotates, the friction between the rubber ring (64) and the silicon carbide wafer (36) drives the silicon carbide wafer (36) to rotate. The silicon carbide wafer (36) will rotate around the rubber rod (41) as the center, thereby changing the polishing position of the silicon carbide wafer (36) and further improving the convenience of polishing the silicon carbide wafer (36).

Images