Magnetic polishing device and method

Abstract

The invention provides a magnetic polishing device and method.The magnetic polishing device is used for polishing at least one to-be-polished workpiece and comprises a polishing cavity, a magnetic assembly and a plurality of clamps; the polishing chamber is used for containing a polishing solution; the magnetic assembly is arranged on the outer wall of the polishing cavity and is configured to move in the circumferential direction around the outer wall of the polishing cavity so as to drive the polishing solution. The clamp is provided with a first end extending into the polishing cavity in the first direction, and the first end is used for installing a to-be-polished workpiece and immersing at least part of the to-be-polished workpiece into the polishing solution; the movable magnetic assembly is arranged outside the polishing cavity to drive the polishing liquid, and polishing treatment on the workpiece to be polished is achieved; according to the magnetic polishing device, the multiple clamps are arranged to fix the multiple to-be-polished workpieces, and the polishing efficiency of the magnetic polishing device can be improved; and the clamp is arranged to rotate to drive the to-be-polished workpiece to rotate, and the to-be-polished workpiece rotates in the polishing solution, so that the polishing effect of the to-be-polished workpiece is improved.

Description

Technical Field

[0001] This application belongs to the field of polishing technology, and particularly relates to a magnetic polishing apparatus and method. Background Technology

[0002] Currently, in some high-end fields, such as aerospace, biomedicine, optics, and jewelry, some products require nanoscale surface roughness to achieve specific functional performance.

[0003] In related technologies, magnetic polishing is often used to polish products, achieving nanoscale surface roughness. However, current magnetic polishing devices can only polish a single workpiece, resulting in low polishing efficiency.

[0004] Therefore, how to improve the polishing efficiency of magnetic polishing devices is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a magnetic polishing apparatus and method, which aims to improve the polishing efficiency of the magnetic polishing apparatus.

[0006] A first aspect of this application provides a magnetic polishing apparatus for polishing at least one workpiece to be polished, the magnetic polishing apparatus comprising:

[0007] A polishing chamber for holding polishing fluid;

[0008] A magnetic component is disposed on the outer wall of the polishing chamber and configured to move circumferentially around the outer wall of the polishing chamber to drive the polishing fluid;

[0009] A plurality of clamps, each clamp having a first end extending into the polishing chamber along a first direction, the first end being used to mount a workpiece to be polished and to immerse at least partially the workpiece to be polished in the polishing liquid; wherein the clamp is configured to rotate circumferentially along the clamp to drive the workpiece to be polished to rotate, the circumferential direction of the clamp being perpendicular to the first direction.

[0010] In some embodiments of this application, the fixture has a second end exposed outside the polishing chamber, and the magnetic polishing device further includes a first transmission assembly for forming a transmission structure with the second end to drive the second end and the fixture to rotate.

[0011] In some embodiments of this application, the first transmission assembly includes:

[0012] The first motor has a rotatable first output shaft;

[0013] The first gear is mounted on the first output shaft and rotates with the first output shaft;

[0014] Multiple second gears are arranged around the first gear and mesh with the first gear;

[0015] The plurality of second gears correspond one-to-one with the plurality of clamps, and the second gears are sleeved on the second end.

[0016] In some embodiments of this application, the polishing chamber includes a cover with a through hole, and the clamp is a rod-shaped structure that passes through the through hole.

[0017] In some embodiments of this application, the magnetic polishing device further includes a lifting mechanism, which includes a lifting screw and a lifting platform. The lifting platform and the cover are connected to the lifting platform. The lifting screw is used to drive the lifting platform to lift, thereby driving the cover, the fixture, the workpiece to be polished, and the first motor to lift.

[0018] In some embodiments of this application, the fixture is configured to rotate continuously along the circumference of the fixture; or the fixture is configured to rotate along the circumference of the fixture until the workpiece to be processed rotates to the processing position.

[0019] In some embodiments of this application, the magnetic polishing device further includes a second transmission component, which is disposed below the polishing chamber and is connected to the magnetic component in a transmission manner. The second transmission component is used to drive the magnetic component to rotate circumferentially around the polishing chamber.

[0020] In some embodiments of this application, the second transmission component includes:

[0021] The second motor has a rotatable second output shaft;

[0022] A rotary table, wherein the second motor is plugged into the rotary table and is used to drive the rotary table to rotate;

[0023] A fixed base is mounted on the rotating platform;

[0024] The magnetic component is mounted on the fixed base and rotates with the rotary table and the fixed base.

[0025] In some embodiments of this application, the fixed base is made of magnetic shielding material.

[0026] In some embodiments of this application, the magnetic assembly includes a first portion disposed on the outer sidewall of the polishing chamber and a second portion disposed on the outer bottom wall of the polishing chamber, wherein the first portion and the second portion are perpendicular to each other.

[0027] In some embodiments of this application, the first portion and the second portion have opposite polarities.

[0028] In some embodiments of this application, the first portion has a first magnetic pole disposed near the polishing chamber and a second magnetic pole disposed away from the polishing chamber, wherein the polarities of the first magnetic pole and the second magnetic pole are opposite.

[0029] The second part has a third magnetic pole disposed near the polishing chamber and a fourth magnetic pole disposed away from the polishing chamber, the polarities of the third magnetic pole and the fourth magnetic pole being opposite;

[0030] The first magnetic pole has the opposite polarity to the third magnetic pole.

[0031] In some embodiments of this application, the number of magnetic components is at least two, and at least two magnetic components are arranged at circumferential intervals along the polishing chamber.

[0032] In some embodiments of this application, the number of magnetic components is multiple, and the multiple magnetic components are evenly spaced along the circumference of the polishing chamber.

[0033] In some embodiments of this application, a gap is provided between the magnetic component and the outer wall of the polishing chamber.

[0034] Secondly, this application provides a magnetic polishing method applied to the aforementioned magnetic polishing apparatus for polishing at least one workpiece to be polished.

[0035] In some embodiments of this application, a polishing fluid is added to the polishing chamber of the magnetic polishing device. The polishing fluid includes magnetic particles and polishing abrasive. The magnetic particles move under the magnetic force of the magnetic component and drive the polishing abrasive to polish the workpiece to be polished.

[0036] In some embodiments of this application, the polishing abrasive is one or more of diamond, silicon carbide, aluminum oxide, silicon oxide, and cerium oxide.

[0037] In some embodiments of this application, the magnetic particles are hydroxyl iron powder.

[0038] In some embodiments of this application, the magnetic particles are in a solid and / or free state;

[0039] And / or, the polishing abrasive is in a solid and / or free state.

[0040] The beneficial effects of the embodiments of the present invention compared with the prior art are as follows: In the above-mentioned magnetic polishing device and method, the magnetic polishing device is used to polish at least one workpiece to be polished. The magnetic polishing device includes a polishing chamber, a magnetic component, and multiple clamps. The polishing chamber is used to hold polishing liquid. The magnetic component is disposed on the outer wall of the polishing chamber and is configured to move circumferentially around the outer wall of the polishing chamber to drive the polishing liquid. The clamps have a first end extending into the polishing chamber along a first direction. The first end is used to mount the workpiece to be polished and to immerse at least part of the workpiece to be polished in the polishing liquid. By setting a movable magnetic component outside the polishing chamber to drive the polishing liquid, the polishing treatment of the workpiece to be polished is realized. On the one hand, the present application also provides multiple clamps to realize the simultaneous polishing of multiple workpieces to be polished, which is beneficial to improving the polishing efficiency of the magnetic polishing device. On the other hand, by setting the clamps to be circumferentially rotated to drive the workpiece to be polished to rotate, the polishing effect can be improved during the rotation of the workpiece to be polished, and the workpiece to be polished can also be rotated to a specific position, which is beneficial to improving the polishing effect of a specific area of ​​the workpiece to be polished. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the structure of a magnetic polishing apparatus provided in an embodiment of this application;

[0042] Figure 2 This is a schematic diagram of the structure of a magnetic polishing apparatus provided in another embodiment of this application;

[0043] Figure 3 For this application Figure 1 A magnified structural diagram of part A;

[0044] Figure 4 This is a schematic diagram of the structure of a magnetic polishing apparatus provided in another embodiment of this application;

[0045] Figure 5 Provided for an embodiment of this application Figure 4 A schematic diagram of the AA-direction cross-sectional structure;

[0046] Figure 6 This is a schematic diagram of the structure of a magnetic polishing apparatus provided in another embodiment of this application;

[0047] Figure 7 This is a schematic diagram of the structure of a magnetic polishing apparatus provided in yet another embodiment of this application;

[0048] Figure 8 This is a schematic diagram of the structure of a magnetic polishing apparatus provided in another embodiment of this application.

[0049] Specific element symbols: 100-Polishing chamber, 110-Cover, 120-Outer wall, 130-Outer bottom wall, 200-Magnetic assembly, 210-First part, 211-First magnetic pole, 212-Second magnetic pole, 220-Second part, 221-Third magnetic pole, 222-Fourth magnetic pole, 300-Clamp, 310-First end, 320-Second end, 400-Workpiece to be polished, 500-First transmission assembly, 510-First motor, 520-First gear, 530-Second gear, 600-Lifting mechanism, 610-Lifting screw, 620-Lifting platform, 700-Second transmission assembly, 710-Second motor, 720-Rotating platform, 730-Fixed base, 800-Frame. Detailed Implementation

[0050] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0051] It should be noted that when a component is referred to as being "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0052] It should be understood that the terms "length", "width", "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0054] It is important to understand that the importance of product surface polishing has increased significantly, especially in high-end products that require nanoscale surface roughness to achieve specific functional performance. These high-end products are widely used in fields such as biomedicine, optics, tool manufacturing, aerospace, and luxury jewelry. Therefore, exploring an efficient nanopolishing method is of great significance to various industrial sectors.

[0055] In related technologies, high-end polishing methods include valve cover polishing, magnetorheological polishing, ion beam polishing, and fluid jet polishing. However, most of these high-end polishing methods are costly and limited to polishing only a single workpiece at a time. For example, while magnetopolishing can achieve nanoscale surface roughness, current magnetopolishing devices can only polish a single workpiece, resulting in low polishing efficiency.

[0056] Therefore, this application improves the related magnetic polishing apparatus and method based on this.

[0057] Please see Figure 1 and Figure 2 , Figure 1 A schematic diagram of the magnetic polishing apparatus provided in this embodiment is shown. Figure 2 A schematic diagram of the magnetic polishing apparatus provided in this embodiment is shown. This embodiment provides a magnetic polishing apparatus for polishing at least one workpiece. The apparatus includes a polishing chamber 100, a magnetic component 200, and multiple clamps 300. The polishing chamber 100 holds polishing fluid. The magnetic component 200 is disposed on the outer wall of the polishing chamber 100 and configured to move circumferentially around the outer wall of the polishing chamber 100 to drive the polishing fluid. Each clamp 300 has a first end 310 extending into the polishing chamber 100 along a first direction. The first end 310 is used to mount the workpiece to be polished and to immerse at least partially the workpiece in the polishing fluid. The clamp 300 is configured to rotate circumferentially to drive the workpiece to be polished to rotate, and the circumferential direction of the clamp 300 is perpendicular to the first direction.

[0058] It should be explained that the polishing fluid in the polishing chamber 100 is the key medium for polishing operations. It typically contains tiny abrasive particles that can grind and polish the workpiece under the influence of a magnetic field. The magnetic component 200 moves along the outer wall of the polishing chamber 100, influencing the movement trajectory of the magnetic particles and abrasive particles in the polishing fluid, thereby effectively driving the polishing fluid and improving the polishing effect. The workpiece to be polished is mounted on the first end 310 of the fixture 300, allowing at least partial immersion in the polishing fluid. Under the stirring action of the magnetic component 200, the polishing fluid polishes the workpiece immersed in it.

[0059] Current magnetic polishing devices have low polishing efficiency and a small polishing area, which limits the size of the workpiece to be polished. However, this application addresses this issue by installing a movable magnetic component 200 outside the polishing chamber 100 to drive the polishing fluid, thereby achieving the polishing process on the workpiece. Furthermore, this application includes multiple clamps 300 to simultaneously polish multiple workpieces, improving the polishing efficiency of the magnetic polishing device. The clamps 300 can rotate circumferentially, causing the workpiece to rotate. This rotation improves polishing efficiency and quality, and allows the workpiece to be rotated to a specific position, enhancing the polishing effect in specific areas. Moreover, the polishing chamber 100 in this application can form a large magnetic field region, reducing the limitation on workpiece size and enabling the polishing of larger workpieces.

[0060] For example, the workpiece to be polished only needs to have its first side polished better. This can be achieved by rotating the workpiece to be polished so that its first side is in the position of maximum magnetic field by rotating the jig 300, which is beneficial to improving the polishing effect on the first side.

[0061] In some embodiments, the fixture 300 is configured such that when the workpiece to be polished is mounted on the first end 310, the workpiece to be polished can be fully immersed in the polishing liquid.

[0062] In some embodiments, the polishing chamber 100 is configured to be a sealing device during the polishing operation to prevent polishing fluid from splashing out.

[0063] In some embodiments, the plurality of clamps 300 are arranged parallel to each other and spaced apart. This helps to reduce mutual interference between two adjacent workpieces to be polished. In a more specific embodiment, the plurality of clamps 300 are arranged parallel to each other and evenly spaced apart. In a further specific embodiment, the plurality of clamps 300 are arranged parallel to each other and spaced apart around the circumference of the polishing chamber 100.

[0064] In some embodiments, the number of clamps 300 is 10, and the 10 clamps 300 are arranged parallel to each other and spaced apart around the circumference of the polishing chamber 100.

[0065] Please refer to the embodiments described in this application. Figure 1 And see Figure 3 , Figure 3 It shows Figure 1A partial enlarged structural diagram of part A. The fixture 300 in this embodiment has a second end 320 exposed outside the polishing chamber 100. The magnetic polishing device also includes a first transmission assembly 500, which is used to form a transmission structure with the second end 320 to drive the second end 320 and the fixture 300 to rotate.

[0066] It is understandable that the rotation angle of the fixture 300 can be controlled by the first transmission component 500 to improve the control accuracy of the position of the workpiece to be polished.

[0067] In some embodiments, the clamp 300 has a rod-like structure, with its two ends along its length being a first end 310 and a second end 320, respectively. In some embodiments, the clamp 300 has a cylindrical structure.

[0068] Please refer to the embodiments described in this application. Figure 3 The first transmission assembly 500 in this embodiment includes a first motor 510, a first gear 520, and a plurality of second gears 530; the first motor 510 has a rotatable first output shaft; the first gear 520 is disposed on the first output shaft and rotates with the first output shaft; the plurality of second gears 530 are arranged around the first gear 520 and mesh with the first gear 520; wherein, the plurality of second gears 530 correspond one-to-one with the plurality of clamps 300, and the second gears 530 are sleeved on the second end 320.

[0069] It should be explained that the first motor 510 serves as the power source, and when the first motor 510 starts, the first output shaft also begins to rotate. When the output shaft rotates, it drives the first gear 520 to rotate. While the first gear 520 rotates, multiple second gears 530 rotate, thereby driving the clamp 300 to rotate.

[0070] In some embodiments, a plurality of second gears 530 are spaced apart around a first gear 520. In some embodiments, a plurality of second gears 530 are evenly spaced around a first gear 520.

[0071] Please refer to the embodiments described in this application. Figure 3 The polishing chamber 100 in this embodiment includes a cover 110, which has a through hole. The clamp 300 has a rod-shaped structure and is inserted into the through hole.

[0072] In some embodiments, a sealing structure is provided between the clamp 300 and the inner wall of the through hole to seal the polishing cavity.

[0073] In some embodiments, the polishing chamber 100 includes a chamber body, a cover 110 is disposed on the chamber body, and the cover 110 is fixed to the chamber body by bolts.

[0074] Please refer to the embodiments described in this application. Figure 1 And see Figure 4 and Figure 5 The magnetic polishing device also includes a lifting mechanism 600, which includes a lifting screw and a lifting platform 620. The lifting platform 620 and the cover 110 are connected to the lifting platform 620. The lifting screw is used to drive the lifting platform 620 to lift, so as to drive the cover 110, the fixture 300, the workpiece to be polished and the first motor 510 to lift.

[0075] Understandably, the lifting screw can drive the lifting platform 620 to rise and fall, which in turn drives the cover 110 and the fixture 300 to rise and fall, so that the workpiece to be polished is in the position of maximum magnetic field strength, which is beneficial to improving the polishing effect.

[0076] In some embodiments, the multiple clamps 300 have the same height.

[0077] In some embodiments of this application, the fixture 300 is configured to rotate continuously along the circumference of the fixture 300; or the fixture 300 is configured to rotate along the circumference of the fixture 300 until the workpiece to be processed rotates to the processing position.

[0078] It should be explained that the fixture 300, being a rotatable structure, can be adjusted to rotate continuously, causing the workpiece to be polished to rotate continuously. During the rotation of the workpiece, friction and collision occur between the workpiece and the abrasive grains in the polishing fluid, thereby enhancing the polishing effect. The fixture 300 can also be adjusted to rotate a certain angle and then remain stationary, which helps to rotate the side of the workpiece to be polished to the position of maximum magnetic field strength, thus improving the polishing effect.

[0079] Please refer to the embodiments described in this application. Figure 1 and Figure 4 The magnetic polishing apparatus of this embodiment also includes a second transmission component 700. The second transmission component 700 is disposed below the polishing chamber 100 and is connected to the magnetic component 200 in a transmission manner. The second transmission component 700 is used to drive the magnetic component 200 to rotate circumferentially around the polishing chamber 100.

[0080] In other words, the magnetic component 200 can be driven to rotate circumferentially along the polishing chamber 100 by the second transmission component 700. On the one hand, the magnetic component 200 can be adjusted to rotate continuously to achieve uniform stirring of the polishing fluid; on the other hand, the magnetic component 200 can be adjusted to a certain position to move the magnetic field position, which is beneficial to place the workpiece to be polished in the position of the maximum magnetic field.

[0081] Please refer to the embodiments described in this application. Figure 1The second transmission assembly 700 in this embodiment includes a second motor 710, a rotary table 720, and a fixed base 730; the second motor 710 has a rotatable second output shaft; the second motor 710 is inserted into the rotary table 720 and is used to drive the rotary table 720 to rotate; the fixed base 730 is mounted on the rotary table 720; wherein, the magnetic assembly 200 is disposed on the fixed base 730 and rotates with the rotary table 720 and the fixed base 730.

[0082] It should be explained that the second motor 710 serves as the power source, and when the second motor 710 starts, the second output shaft also begins to rotate. When the second output shaft rotates, it drives the rotary table 720 to rotate. As the rotary table 720 rotates, the fixed base 730 drives the magnetic component 200 to rotate around the polishing chamber 100, thereby adjusting the magnetic field position of the magnetic component 200.

[0083] In some embodiments of this application, the fixing base 730 is made of magnetically shielding material, and an opening is provided on the side of the fixing base 730 near the polishing chamber 100 to expose the magnetic component 200. This helps to prevent magnetic leakage from the magnetic component 200 and allows a magnetic circuit to be formed along the fixing base 730, thereby improving the magnetic field strength inside the polishing chamber.

[0084] In some embodiments of this application, please refer to Figure 6 , Figure 6 A schematic diagram of the magnetic polishing apparatus provided in this embodiment is shown, wherein the dashed lines with arrows represent magnetic field lines; the magnetic component 200 of this embodiment includes a first part 210 disposed on the outer wall 120 of the polishing chamber 100 and a second part 220 disposed on the outer bottom wall 130 of the polishing chamber 100, wherein the first part 210 and the second part 220 are perpendicular to each other.

[0085] Understandably, the first part 210 can apply a magnetic field to the polishing fluid through the outer wall 120, and the second part 220 can apply a magnetic field to the polishing fluid through the outer bottom wall 130. When the polarities of the first part 210 and the second part 220 are the same, a magnetic force can be applied to move the magnetic particles in the polishing fluid away from the sidewalls and bottom wall of the polishing chamber 100. When the polarities of the first part 210 and the second part 220 are opposite, the first part 210 and the second part 220 can form a closed magnetic field in the polishing chamber 100, which is beneficial for forming a magnetic brush in the direction of the magnetic field lines of the closed magnetic field for material removal during the polishing process.

[0086] Please refer to the embodiments described in this application. Figure 6 The first portion 210 and the second portion 220 have opposite polarities. In some embodiments, the first portion 210 is the N pole (North Pole) and the second portion 220 is the S pole (South Pole).

[0087] In some embodiments of this application, please refer to Figure 7 , Figure 7 A schematic diagram of the magnetic polishing apparatus provided in this embodiment is shown, wherein the dashed lines with arrows represent magnetic field lines; the first part 210 of this embodiment has a first magnetic pole 211 disposed near the polishing chamber 100 and a second magnetic pole 212 disposed away from the polishing chamber 100, the polarities of the first magnetic pole 211 and the second magnetic pole 212 being opposite; the second part 220 has a third magnetic pole 221 disposed near the polishing chamber 100 and a fourth magnetic pole 222 disposed away from the polishing chamber 100, the polarities of the third magnetic pole 221 and the fourth magnetic pole 222 being opposite; wherein, the polarities of the first magnetic pole 211 and the third magnetic pole 221 are opposite.

[0088] It should be explained that the first magnetic pole 211 and the third magnetic pole 221 can form a closed magnetic field in the polishing chamber 100; the second magnetic pole 212, as the magnetic pole opposite to the first magnetic pole 211, can compress the magnetic field lines of the first magnetic pole 211 closer to the polishing chamber 100, so as to increase the density of the magnetic field lines of the first magnetic pole 211 in the polishing chamber 100, thereby increasing the magnetic field strength; similarly, the fourth magnetic pole 222, as the magnetic pole opposite to the third magnetic pole 221, can compress the magnetic field lines of the third magnetic pole 221 closer to the polishing chamber 100, so as to increase the density of the magnetic field lines of the third magnetic pole 221 in the polishing chamber 100, thereby increasing the magnetic field strength.

[0089] Please refer to the embodiments described in this application. Figure 1 In this embodiment, the number of magnetic components 200 is at least two, and the at least two magnetic components 200 are arranged at circumferential intervals along the polishing chamber 100. That is to say, providing at least two magnetic components 200 is beneficial to increasing the magnetic field strength in the polishing chamber 100, thereby improving the polishing effect.

[0090] Understandably, the angle between the two magnetic components 200 can be 180°, 90°, or other angles.

[0091] In some embodiments of this application, there are multiple magnetic components 200, which are evenly spaced along the circumference of the polishing chamber 100.

[0092] In some embodiments, please refer to Figure 8 , Figure 8 A schematic diagram of the magnetic polishing device provided in this embodiment is shown; the number of magnetic components 200 in this embodiment is 4, and the included angle between two adjacent magnetic components 200 is 90°.

[0093] In some embodiments, the magnetic component 200 is a permanent magnet.

[0094] Please refer to the embodiments described in this application. Figure 6and Figure 7 In this embodiment, a gap is provided between the magnetic component 200 and the outer wall of the polishing chamber 100. This ensures that the magnetic component 200 and the outer wall of the polishing chamber 100 do not directly contact each other, which helps to reduce wear and scratches caused by contact, and thus helps to reduce frictional heat generation. It should be noted that the width of the gap should not be too large, and the magnetic field strength within the polishing chamber 100 must be guaranteed.

[0095] In some embodiments, the magnetic polishing apparatus includes a frame 800, and a first transmission assembly 500, a second transmission assembly 700, and a polishing chamber 100 are all disposed on the frame 800.

[0096] Furthermore, in order to better implement the magnetic polishing apparatus in any of the above embodiments, this application provides a magnetic polishing method based on the above magnetic polishing apparatus, which is applied to the above magnetic polishing apparatus to polish at least one workpiece to be polished.

[0097] In a more specific embodiment, the magnetic polishing method involves fixing a batch of workpieces to be polished inside the polishing chamber 100 using a fixture 300, with the polishing liquid also inverted inside the chamber. A permanent magnet (corresponding to the magnetic component 200) rotates under the drive of a second motor 710, creating a rotating magnetic field. Under the influence of this magnetic field, the polishing liquid inside the polishing chamber 100 forms two pairs of magnetic brushes that continuously impact the surface of the workpieces, ultimately achieving material removal. The workpieces to be polished are placed near the side walls and bottom of the chamber, where the magnetic field strength is higher. Furthermore, the fixture 300 continuously rotates under the action of the second gear 530, achieving uniform polishing of the entire surface of the workpiece.

[0098] In some embodiments, the rotational speed of the permanent magnet is between 50 and 2000 rpm, and the rotational speed of the second gear 530 is between 50 and 200 rpm.

[0099] In some embodiments of this application, a polishing liquid is added to the polishing chamber 100 of the magnetic polishing device. The polishing liquid includes magnetic particles and polishing abrasive. The magnetic particles move under the magnetic force of the magnetic component 200 and drive the polishing abrasive to polish the workpiece to be polished.

[0100] In some embodiments of this application, the polishing abrasive is one or more of diamond, silicon carbide, alumina, silicon oxide, and cerium oxide. Specifically, the size of the polishing abrasive is at the hundred-nanometer level, and the appropriate material can be selected according to the requirements of the workpiece to be polished.

[0101] In some embodiments of this application, the magnetic particles are hydroxyl iron powder. Specifically, the particle size of the magnetic particles is on the micrometer scale.

[0102] In some embodiments of this application, the magnetic particles are in a solid and / or free state; and / or, the polishing abrasive is in a solid and / or free state. Specifically, the magnetic particles and polishing abrasive are selected as solid, consolidated particles for rough polishing of the workpiece to be polished; the magnetic particles and polishing abrasive are selected as free, liquid particles for fine polishing of the workpiece to be polished.

[0103] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0104] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0105] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0106] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0107] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A magnetic polishing device, characterized by, The magnetic polishing device is used for polishing at least one workpiece to be polished, and comprises: a polishing chamber for containing a polishing liquid; a magnetic assembly arranged on an outer wall of the polishing chamber and configured to move circumferentially around the outer wall of the polishing chamber to drive the polishing liquid; a plurality of clamps having first end portions extending into the polishing chamber along a first direction, the first end portions being used for mounting the workpiece to be polished and for at least partially immersing the workpiece to be polished into the polishing liquid; wherein the clamps are configured to rotate circumferentially around the clamps to rotate the workpiece to be polished, and the circumferential direction of the clamps is perpendicular to the first direction.

2. The magnetic polishing apparatus of claim 1, wherein, The clamps have second end portions exposed outside the polishing chamber, and the magnetic polishing device further comprises a first transmission assembly configured to form a transmission structure with the second end portions to drive the second end portions and the clamps to rotate; wherein the polishing chamber comprises a cover body provided with a through hole, and the clamps have a rod structure and are arranged in the through hole. The first transmission assembly comprises: a first motor having a rotatable first output shaft; a first gear arranged on the first output shaft and rotating with the first output shaft; a plurality of second gears arranged around the first gear and meshing with the first gear; wherein the plurality of second gears correspond to the plurality of clamps one by one, and the second gears are sleeved on the second end portions.

3. The magnetic polishing device of claim 1 or 2, wherein The clamps are configured to continuously rotate circumferentially around the clamps, or the clamps are configured to rotate circumferentially around the clamps until the workpiece to be processed is rotated to a position to be processed.

4. The magnetic polishing apparatus of claim 1, wherein The magnetic polishing device further comprises a second transmission assembly arranged below the polishing chamber and in transmission connection with the magnetic assembly, the second transmission assembly being used for driving the magnetic assembly to rotate circumferentially around the polishing chamber; wherein the second transmission assembly comprises: a second motor having a rotatable second output shaft; a rotating table on which the second motor is inserted and used for driving the rotating table to rotate; a fixed base mounted on the rotating table; 5. The magnetic polishing apparatus of claim 4, wherein, wherein the magnetic assembly is arranged on the fixed base and rotates with the rotating table and the fixed base.

6. The magnetic polishing apparatus of claim 5, wherein, The fixed base is made of a magnetic isolation material; the magnetic assembly comprises a first part arranged on an outer side wall of the polishing chamber and a second part arranged on an outer bottom wall of the polishing chamber, and the first part is perpendicular to the second part. The first part and the second part have opposite polarities; alternatively, the first part has a first magnetic pole close to the polishing chamber and a second magnetic pole away from the polishing chamber, and the first magnetic pole and the second magnetic pole have opposite polarities; the second part has a third magnetic pole close to the polishing chamber and a fourth magnetic pole away from the polishing chamber, and the third magnetic pole and the fourth magnetic pole have opposite polarities; wherein the first magnetic pole and the third magnetic pole have opposite polarities.

7. The magnetic polishing apparatus of claim 1 or 4, wherein The number of the magnetic assemblies is at least two, and the at least two magnetic assemblies are arranged at intervals along the circumference of the polishing chamber.

8. The magnetic polishing apparatus of claim 1 or 4, wherein A gap is arranged between the magnetic assembly and the outer wall of the polishing chamber.

9. A magnetic polishing method characterized by, The magnetic polishing device is applied to polish at least one workpiece to be polished according to any one of claims 1 to 8; the magnetic polishing method comprises: adding a polishing liquid into a polishing chamber of the magnetic polishing device, the polishing liquid comprising magnetic particles and polishing abrasive, the magnetic particles moving under the magnetic force of the magnetic assembly and driving the polishing abrasive to polish the workpiece to be polished.

10. The magnetic polishing method of claim 9, wherein, The polishing abrasive is one or more of diamond, silicon carbide, alumina, silica and ceria. And / or, the magnetic particles are hydroxyl iron powder or iron oxide powder.

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