Spindle inclination angle adjusting structure of wafer grinding equipment

Abstract

The invention provides a spindle inclination angle adjusting structure of wafer grinding equipment. The spindle inclination angle adjusting structure comprises a spindle seat; the main shaft unit is provided with a flange connected to the outer circumferential surface of the body; each inclination angle adjusting group is provided with a plurality of combination assemblies and a fine adjustment device, the combination assemblies are combined with the flange and the main shaft seat, the fine adjustment device is provided with a seat body, an adjusting piece and a linkage piece, the seat body is provided with a through hole, the adjusting piece is arranged in the through hole, a screwing part of the adjusting piece is screwed with the seat body, and the linkage piece is arranged on the adjusting piece. The linkage piece can be in linkage with the spindle seat to be arranged in the through hole in a displaceable mode, the first stress face of the adjusting piece faces the second stress face of the linkage piece, the area of the first stress face is different from that of the second stress face, and a hydraulic cavity is formed between the first stress face and the second stress face. The main shaft inclination angle adjusting structure of the wafer grinding equipment is easy to operate, high in reproducibility and good in stability, and has the effects of reducing the manufacturing cost, improving the assembling convenience and efficiency and reducing the maintenance cost.

Description

TECHNICAL FIELD

[0001] The present invention relates to an apparatus for processing a wafer, and more particularly to a tilt angle adjustment structure of a spindle of a wafer polishing apparatus. BACKGROUND

[0002] Generally, before stacking wafers vertically, it is necessary to minimize the contact area of the wafers when they are stacked. Therefore, there is a need for processing wafers by polishing the surface of the wafers to a specified pattern using a wafer polishing apparatus.

[0003] Most existing wafer polishing apparatuses have a polishing disc mounted on a spindle via a spindle holder, so that the polishing disc is rotated by the spindle. In addition, a chuck table is mounted on a rotating table and is located below the polishing disc. The wafer to be polished can be fixed to the chuck table. In this way, when the chuck table and the polishing disc rotate relative to each other, the wafer placed on the chuck table can be polished by the polishing disc. By adjusting the relative tilt angle of the polishing disc and the chuck table, the surface of the wafer can be polished to a specified pattern.

[0004] Among them, since the polishing disc is detachably combined with the lower end of the spindle, most existing wafer polishing apparatuses adjust the tilt angle of the spindle to simultaneously change the tilt angle of the polishing disc relative to the chuck table. SUMMARY

[0005] However, the existing wafer grinding equipment has a complicated structure for adjusting the inclination angle of the main shaft. For example, the existing angle adjustment module disclosed in Taiwan Patent No. TWI757177B includes an angle adjustment assembly combined with a shaft seat and a main shaft, and the angle adjustment assembly is provided with a fixing unit and at least two adjustment units. The fixing unit is provided with a locking member, a combined shaft sleeve, a bearing seat and a first disc spring. The locking member extends into the shaft seat from the outer side of the bottom of the shaft seat through one of the combined holes. The combined shaft sleeve is combined with the end of the locking member extending into the shaft seat. The bearing seat is abutted with the combined shaft sleeve and is fixedly combined with the flange surface to be located in the through hole opposite to the combined hole. The disc spring is sleeved on the locking member and is abutted with the outer side of the bottom of the shaft seat. Each adjustment unit is provided with a fixing shaft sleeve, a locking piece, an adjustment seat and an adjustment member. The fixing shaft sleeve is provided in one of the combined holes of the shaft seat other than the combined shaft sleeve through the opening of the shaft seat and is abutted with the inner side of the bottom of the shaft seat. The locking piece is fixedly combined with the part of the fixing shaft sleeve extending out of the bottom of the shaft seat and is fixedly combined with the shaft seat. The adjustment seat is combined with the adjustment member. The fixing shaft sleeve is axially provided with a locking hole. The adjustment member is provided with a locking segment, an operation segment and a rotating segment. The locking segment is located in the lower half of the adjustment member and is combined with the locking hole of the fixing shaft sleeve. The operation segment is combined with the locking segment and is located outside the fixing shaft sleeve through the locking hole. The rotating segment is located at the end of the adjustment member away from the locking segment and is located above the top of the fixing shaft sleeve. The adjustment seat of the adjustment unit is axially provided with an adjustment hole combined with the rotating segment of the adjustment member, so that the adjustment seat can move relative to the rotating segment with the rotation of the adjustment member, thereby changing the distance and angle of the main shaft relative to the shaft seat by pushing against the flange surface.

[0006] Therefore, the aforementioned existing angle adjustment module has problems of complicated components, high manufacturing cost, complicated assembly steps and high maintenance cost.

[0007] In addition, the aforementioned existing angle adjustment module sets the locking segment and the rotating segment of the adjustment member to different pitches to generate a tooth difference between the locking segment and the rotating segment when the adjustment member rotates, thereby providing a micron-level fine adjustment effect through the tooth difference. However, the pitch is formed by machining, so the pitch difference is quite limited. For example, assuming that the pitch difference between the locking segment and the rotating segment is 0.2 mm, about 5.5 μm of lifting effect will be generated for each 1-degree rotation adjustment, and the fine adjustment lifting capability is difficult to further improve.

[0008] In view of the defects of the aforementioned prior art, the applicant has a feeling that it is not perfect, and has successfully developed a main shaft inclination angle adjustment structure of a wafer grinding equipment, which can improve the fine adjustment capability of the main shaft inclination angle by a simple structure.

[0009] To achieve the above-mentioned object or other objects, the present application provides a spindle tilt angle adjustment structure of a wafer polishing apparatus, comprising: a spindle base adapted to be mounted on a column of a table; a spindle unit having a body adapted to support a polishing disc at a bottom end thereof and a flange connected to an outer circumferential surface of the body; and a plurality of tilt angle adjustment sets, each tilt angle adjustment set having a plurality of coupling components coupling the flange and the spindle base and a micrometer having a seat body, an adjustment member and a linkage member, the seat body having a through hole, the adjustment member being disposed in the through hole, a screwing portion of the adjustment member being screwed to the seat body, the linkage member being displaceably disposed in the through hole in linkage with the spindle base, a first force receiving surface of the adjustment member facing a second force receiving surface of the linkage member, an area of the first force receiving surface being different from an area of the second force receiving surface, and a hydraulic chamber being formed between the first force receiving surface and the second force receiving surface.

[0010] In the spindle tilt angle adjustment structure of the wafer polishing apparatus, the area of the first force receiving surface is smaller than the area of the second force receiving surface, and a ratio of a displacement amount of the first force receiving surface in the through hole to a displacement amount of the second force receiving surface in the through hole is about 4 to 25.

[0011] In the spindle tilt angle adjustment structure of the wafer polishing apparatus, the through hole can have coaxial first, second and third aperture sections, the second aperture section being located between the first and third aperture sections, an aperture of the second aperture section being smaller than apertures of the first and third aperture sections, an inner wall surface of the first aperture section can have an internal thread portion, the screwing portion of the adjustment member being screwed to the internal thread portion, the first force receiving surface being located in the second aperture section, and the second force receiving surface being located in the third aperture section.

[0012] In the spindle tilt angle adjustment structure of the wafer polishing apparatus, one end of the adjustment member can form an adjustment portion, the adjustment portion being located outside the seat body, the micrometer can have a stop member sleeved on the adjustment member and a coupling ring, the stop member can have a disc body and a protrusion, the disc body can abut against an end surface of the seat body, the protrusion can penetrate into a gap between the adjustment member and the first aperture section, and the coupling ring can abut against the disc body and be screwed to the adjustment member.

[0013] In the spindle tilt angle adjustment structure of the wafer polishing apparatus, the spindle base has a mounting surface, the spindle base can have a plurality of mounting slots communicating to the mounting surface, the flange can have a plurality of through holes respectively located in the plurality of mounting slots, the seat body can have a head portion and a body portion, the head portion can be located in the mounting slot, and the body portion can be disposed through the through hole.

[0014] The main shaft tilt angle adjustment structure of the wafer grinding device can be characterized in that the main shaft base can be provided with at least one assembly hole around each mounting groove and communicating with the mounting surface, and the flange can be provided with a plurality of through holes, and each coupling assembly can pass through the through hole and be coupled to the corresponding assembly hole.

[0015] The main shaft tilt angle adjustment structure of the wafer grinding device can be characterized in that each coupling assembly can have an elastic member, a sleeve and a locking member, each assembly hole can have a penetrating section and a fixed section, the elastic member can be located in the through hole, the sleeve can abut against the elastic member and pass through the through hole and extend into the penetrating section of the assembly hole, the rod of the locking member can pass through the sleeve and be fixed to the fixed section of the assembly hole, and the head of the locking member can press against the sleeve to cause the elastic member to elastically deform to generate a pre-pressing force.

[0016] The main shaft tilt angle adjustment structure of the wafer grinding device can be characterized in that the main shaft base can be provided with a plurality of side grooves respectively located between the plurality of mounting grooves, and the main shaft base can have a locking platform located between the corresponding side groove and mounting groove, and each fine adjuster can have a locking member that passes through the locking platform from the side groove and is fixedly connected to the linkage member.

[0017] The main shaft tilt angle adjustment structure of the wafer grinding device can be characterized in that the main shaft base can have a ring seat located in front of the back plate, the lower end surface of the ring seat can form the mounting surface, the body of the main shaft unit can pass through the ring seat, and the flange can be coupled to the lower portion of the ring seat by the plurality of coupling assemblies.

[0018] The main shaft tilt angle adjustment structure of the wafer grinding device can be characterized in that the fine adjusters of the plurality of tilt angle adjustment groups can be distributed at equal angles.

[0019] Accordingly, the main shaft tilt angle adjustment structure of the wafer grinding device can control the different positions of the main shaft base to produce different lifting effects relative to the flange by means of the plurality of tilt angle adjustment groups with simple control structure, so as to adjust the relative tilt angle between the main shaft base and the main shaft unit to meet the expectation, and the operation is easy, reproducible, stable, and has the effects of reducing manufacturing cost, improving assembly convenience and efficiency, and reducing maintenance cost. The fine adjuster can be controlled by two controllable variables, i.e., the force receiving surfaces of different areas at both ends of the hydraulic chamber and the pitch of the screwing part of the adjustment member, which breaks through the limitation that the pitch difference is difficult to accurately control by machining, and further improves the fine adjustment ability of the lifting amplitude of the main shaft base. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed in the embodiments description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without creative labor.

[0021] Figure 1 is a perspective view of a preferred embodiment of the present application.

[0022] Figure 2 is a perspective view of a spindle seat of a preferred embodiment of the present application.

[0023] Figure 3 is a partial perspective exploded view of a preferred embodiment of the present application.

[0024] Figure 4 is a perspective exploded view of a micro-adjuster of a preferred embodiment of the present application.

[0025] Figure 5 is a bottom view of a preferred embodiment of the present application.

[0026] Figure 6 is a sectional view along the line A-A of Figure 5 .

[0027] Figure 7 is a partial enlarged view of Figure 6 .

[0028] Reference signs

[0029] 1 spindle seat

[0030] 11 ring seat

[0031] 12 back plate

[0032] 13 mounting surface

[0033] 14 mounting groove

[0034] 15 assembly hole

[0035] 151 threaded section

[0036] 152 fixed section

[0037] 16 side opening groove

[0038] 17 locking platform

[0039] 2 spindle unit

[0040] 21 body

[0041] 22 flange

[0042] 221 Through-hole

[0043] 222 Countersunk Hole

[0044] 3 Tilt Adjustment Group

[0045] 31 Combined Components

[0046] 311 Elastic component

[0047] 312 Sleeve

[0048] 313 Locking Firmware

[0049] 3131 Lock

[0050] 3132 rod

[0051] 32 Fine-tuning

[0052] 321 seat body

[0053] 321a Head

[0054] 321b Body

[0055] 3211 Through hole

[0056] 3211a First aperture section

[0057] 3211b Second Aperture Section

[0058] 3211c Third aperture section

[0059] 3212 Internal thread section

[0060] 322 Adjustment Part

[0061] 3221 screw joint

[0062] 3222 First stress surface

[0063] 3223 Adjustment Department

[0064] 323 Linkage Components

[0065] 3231 Second stress surface

[0066] 324 Stop

[0067] 3241 disk body

[0068] 3242 convex part

[0069] 325 coupling ring

[0070] 326 Locking connector

[0071] C Hydraulic chamber

[0072] C1 First District

[0073] C2 Second District

[0074] M grinding disc Detailed Implementation

[0075] The spindle tilt angle adjustment structure of the wafer grinding equipment according to an embodiment of the present invention will be further described below with reference to the accompanying drawings.

[0076] The foregoing and other technical contents, features and effects of the invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the accompanying drawings.

[0077] It is worth noting that the use of the quantifiers "a" or "an" for components and parts throughout this invention is merely for convenience and to provide the general meaning of the scope of the invention; in this invention, it should be interpreted as including one or at least one, and the concept of a single also includes the case of a plural, unless it clearly means otherwise.

[0078] The terms "combination," "integration," or "assembly" used throughout this invention mainly include those that can be separated without damaging the components after connection, or those that make the components inseparable after connection. These are terms that those skilled in the art can choose based on the material of the components to be connected or the assembly requirements.

[0079] Furthermore, in the following embodiments, the same or similar components will be labeled with the same or similar reference numerals.

[0080] Please refer to Figure 1 This is a preferred embodiment of the spindle tilt angle adjustment structure of the wafer polishing equipment of the present invention. The spindle tilt angle adjustment structure of the wafer polishing equipment includes a spindle seat 1, a spindle unit 2, and multiple tilt angle adjustment groups 3. The multiple tilt angle adjustment groups 3 are used to connect the spindle seat 1 and the spindle unit 2, and to adjust the relative tilt angle between the spindle seat 1 and the spindle unit 2.

[0081] The spindle seat 1 may have an annular seat 11 located in front of the back plate 12. The spindle seat 1 may be directly or indirectly assembled to the column on the wafer grinding table of the wafer grinding equipment from the back plate 12. The spindle unit 2 has a body 21 and a flange 22. The body 21 passes through the annular seat 11. The bottom end of the body 21 is adapted to support the grinding disc M and drive the grinding disc M to rotate. The flange 22 is connected to the outer circumferential surface of the body 21.

[0082] Please refer to Figure 2 and Figure 3 Each tilt adjustment group 3 has multiple connecting components 31 and fine adjusters 32. The multiple connecting components 31 connect the flange 22 to the ring seat 11 of the spindle seat 1.

[0083] Please refer to Figure 4 to Figure 7 The fine-tuning device 32 has a base 321, an adjusting member 322, and a connecting member 323. The base 321 has a through hole 3211, the adjusting member 322 is disposed in the through hole 3211, and the threaded portion 3221 of the adjusting member 322 is threaded into the base 321. The connecting member 323 is disposed in the through hole 3211, which can move the spindle seat 1. The first force-bearing surface 3222 of the adjusting member 322 faces the second force-bearing surface 3231 of the connecting member 323. The area of ​​the first force-bearing surface 3222 is different from the area of ​​the second force-bearing surface 3231, and a hydraulic chamber C is formed between the first force-bearing surface 3222 and the second force-bearing surface 3231. The hydraulic chamber C is filled with a liquid such as hydraulic oil. In other words, the hydraulic chamber C can be divided into a first region C1 and a second region C2. The first force-bearing surface 3222 is the end face of the first region C1, and the second force-bearing surface 3231 is the end face of the second region C2.

[0084] According to the aforementioned structure, when adjusting the relative tilt angle between the spindle seat 1 and the spindle unit 2, the adjusting member 322 can be rotated to cause the threaded portion 3221 of the adjusting member 322 to move axially up and down relative to the seat body 321. Taking the first force-bearing surface 3222 rising in the through hole 3211 as an example, since the amount of liquid reduced in the first region C1 of the hydraulic chamber C is equal to the amount of liquid increased in the second region C2 of the hydraulic chamber C, when the adjusting member 322 rises, according to the area ratio of the first force-bearing surface 3222 to the second force-bearing surface 3231, the liquid in the hydraulic chamber C pushes the linkage 323 to produce a different amplitude of rising effect, thereby causing the spindle seat 1 to rise relative to the flange 22; wherein, the amplitude of the rise and fall of the linkage 323 is inversely proportional to the area ratio of the first force-bearing surface 3222 and the second force-bearing surface 3231. Thus, by means of the adjusting component 322 of the fine-tuner 32 that controls the multiple tilt adjustment groups 3, the different positions of the spindle seat 1 relative to the flange 22 can be controlled to produce different degrees of upward lifting effect, thereby adjusting the relative tilt angle between the spindle seat 1 and the spindle unit 2 to meet the expectations. The operation is easy, highly reproducible and has good stability.

[0085] Since the pitch of the screw thread connecting the adjusting member 322 and the seat 321 is subject to machining limitations, it is preferable to make the area of ​​the first force-bearing surface 3222 smaller than the area of ​​the second force-bearing surface 3231. Furthermore, in one embodiment of the invention, the ratio of the movement of the first force-bearing surface 3222 in the through hole 3211 to the movement of the second force-bearing surface 3231 in the through hole 3211 can be approximately 4 to 25. For example, when the aforementioned ratio is 9, and the pitch of the screw thread of the adjusting member 322's engagement portion 3221 is 1 mm, when the adjusting member 322 rotates one revolution, the first force-bearing surface 3222 can be axially displaced by 1 mm, and the second force-bearing surface 3231 can be axially displaced in the same direction by one-ninth of 1 mm, approximately 0.11 mm; therefore, for every degree the adjusting member 322 rotates, the linkage 323 can cause the main spindle seat 1 to produce an axial displacement of only about 3 μm. If a smaller fine adjustment is needed, the aforementioned ratio can be increased. Therefore, the fine adjuster 32 can achieve the fine adjustment capability of the lifting range of the spindle seat 1 by two controllable variables: "the area of ​​the hydraulic chamber C acting in the first region C1 and the second region C2" and "the pitch of the screw portion 3221 of the adjusting member 322". Furthermore, the shapes of the first force-bearing surface 3222 and the second force-bearing surface 3231 can be, for example, easily machined circles, but are not limited thereto.

[0086] Please refer to Figure 7 In addition to the above embodiments, in one embodiment of the present invention, the through hole 3211 may have a coaxial first diameter section 3211a, a second diameter section 3211b, and a third diameter section 3211c. The second diameter section 3211b is located between the first diameter section 3211a and the third diameter section 3211c, and the diameter of the second diameter section 3211b may be smaller than the diameters of the first diameter section 3211a and the third diameter section 3211c. The first region C1 of the hydraulic chamber C is located in the second diameter section 3211b, and the second region C2 of the hydraulic chamber C is located in the third diameter section 3211c; that is, the first force-bearing surface 3222 is located in the second diameter section 3211b, and the second force-bearing surface 3231 is located in the third diameter section 3211c. Furthermore, an internal thread 3212 can be provided on the inner wall surface of the first bore section 3211a for the engagement portion 3221 of the adjusting member 322 to be screwed in. In this way, the seat 321 of this embodiment can be made of a simple and easy-to-form and assemble structure for the adjusting member 322 to be combined, which has the effects of reducing manufacturing costs and improving assembly convenience and efficiency.

[0087] Furthermore, in one embodiment of the present invention, one end of the adjusting member 322 has the first force-bearing surface 3222, and the other end of the adjusting member 322 can form an adjusting portion 3223, which can be located outside the base 321. The fine adjuster 32 may also have a stop member 324 and a connecting ring 325, which are respectively fitted onto the adjusting member 322 near the adjusting portion 3223. The stop member 324 has a disc body 3241 and a protrusion 3242. The disc body 3241 can abut against the end face of the base 321, and the protrusion 3242 can pass through the gap between the adjusting member 322 and the first aperture section 3211a. The connecting ring 325 can abut against the disc body 3241 and screw onto the adjusting member 322. Thus, the stop 324 can be used to limit the downward displacement of the adjusting member 322, preventing the threaded portion 3221 of the adjusting member 322 from disengaging from the internal thread portion 3212. The engagement ring 325 can assist the stop 324 in maintaining its position after the adjusting member 322 has been adjusted and rotated, thereby ensuring that the adjusting member 322 remains in position until the next adjustment. Therefore, the fine-tuning device 32 of this embodiment can have a simple structure, making it easier to maintain a stable adjusted tilt angle, thereby improving the quality of the processed wafer.

[0088] Please refer to Figure 2 and Figure 3 In addition to the above embodiments, in one embodiment of the present invention, the spindle seat 1 has a mounting surface 13, which may be located on the axial end face of the ring seat 11; for example, but not limited to, the mounting surface may be formed on the lower end face of the ring seat 11, and the flange 22 may be coupled to the lower part of the ring seat 11 by the plurality of coupling components 31. The spindle seat 1 may also have a plurality of mounting grooves 14 communicating with the mounting surface 13, and the flange 22 may have a plurality of through holes 221 respectively corresponding to the plurality of mounting grooves 14. The seat 321 of each fine adjuster 32 may have a head 321a and a body 321b, the head 321a may pass through the mounting surface 13 into the mounting groove 14, and the body 321b may pass through the corresponding through hole 221. Furthermore, as Figure 6 As shown, it is preferable that the adjusting part 3223 of the adjusting member 322 and the connecting ring 325 both protrude from the through hole 221 for operation and adjustment. In this way, the spindle seat 1 and the flange 22 can be made of a simple structure that is easy to form, and the plurality of fine adjusters 32 can be securely clamped between the spindle seat 1 and the flange 22, which is very convenient for installation.

[0089] On the other hand, the spindle seat 1 may have at least one assembly hole 15 around each mounting groove 14, which also communicates with the mounting surface 13. The flange 22 is provided with a plurality of countersunk holes 222, through which each connecting component 31 can pass and engage with the corresponding assembly hole 15. In this way, the positioning structure on the flange 22 can be easily machined and formed, and the stability of the connection between the spindle seat 1 and the flange 22 is improved.

[0090] Each connecting component 31 enables a flexible connection between the flange 22 and the spindle seat 1 to accommodate adjustments in relative tilt angles. For details, please refer to... Figure 3 and Figure 6 In one embodiment of the invention, each connecting component 31 may have an elastic element 311, a sleeve 312, and a locking element 313. Each assembly hole 15 may have a through section 151 and a fixing section 152. The elastic element 311 is located in the countersunk hole 222, and the elastic element 311 may be, for example, a spring, preferably a disc spring with low axial height characteristics. The sleeve 312 abuts against the elastic element 311, passes through the countersunk hole 222, and extends into the through section 151 of the assembly hole 15. The locking device 313 has a locking head 3131 connected to a rod body 3132, which passes through the sleeve 312 and is fixed to the fixed section 152 of the assembly hole 15, for example, by threaded connection, and the locking head 3131 presses against the sleeve 312, causing the elastic member 311 to elastically deform and generate preload, so as to clamp the flange 22 to the mounting surface 13 of the spindle seat 1 in the initial state.

[0091] Accordingly, when the adjusting member 322 of the fine-tuning device 32 is raised, the spindle seat 1, which is lifted by the linkage member 323, can pull the locking member 313, thereby further compressing the elastic member 311, and the flange 22 and the mounting surface 13 of the spindle seat 1 can be partially opened. Conversely, when the adjusting member 322 of the fine-tuning device 32 is lowered and reset, the force compressing the elastic member 311 is reduced, allowing the elastic member 311 to elastically reset, so that the flange 22 and the mounting surface 13 of the spindle seat 1 can return to the aforementioned initial state.

[0092] Furthermore, in one embodiment of the present invention, the spindle seat 1 may also be provided with a plurality of side slots 16, which are respectively located opposite to the plurality of mounting slots 14. The spindle seat 1 may have a locking platform 17 located between the corresponding side slot 16 and the mounting slot 14. Each fine adjuster 32 may have a locking member 326, which passes through the locking platform 17 through the side slot 16 and is locked to the linkage 323. Thus, the fine adjuster 32 of this embodiment can have an easily assembled structure, so that the spindle seat 1 and the linkage 323 can maintain a linkage relationship, so that when the adjusting member 322 is adjusted and lowered, it helps the mounting surface 13 of the spindle seat 1 to move closer to the flange 22.

[0093] Please refer to Figure 4 In addition to the above embodiments, in one embodiment of the present invention, the fine-tuners 32 of the plurality of tilt adjustment groups 3 can be distributed at equal angles; for example, the number of tilt adjustment groups 3 can be three, and the center connection of the three fine-tuners 32 can form an equilateral triangle. In this way, the plurality of tilt adjustment groups 3 can securely lock the spindle unit 2 to the ring seat 11 of the spindle seat 1, and the tilt angle of the spindle unit 2 relative to the ring seat 11 can be easily adjusted and controlled.

[0094] The above description is merely an embodiment of the present invention and is not intended to limit the patent scope of the present invention.

Claims

1. A spindle tilt angle adjustment structure for a wafer grinding equipment, characterized in that, The application relates to a spindle unit, comprising: a spindle base adapted to be mounted on a column of a machine tool; a spindle unit having a body adapted to support a grinding disc at a bottom end thereof and a flange connected to an outer circumferential surface of the body; and a plurality of inclination adjustment assemblies, each of which has a plurality of coupling components and a fine adjustment device, the plurality of coupling components coupling the flange and the spindle base, the fine adjustment device having a seat body, an adjustment member and a connecting member, the seat body having a through hole, the adjustment member being arranged in the through hole, a screwing part of the adjustment member being screwed to the seat body, the connecting member being arranged in the through hole in a displaceable manner, a first stress surface of the adjustment member facing a second stress surface of the connecting member, an area of the first stress surface being different from that of the second stress surface, and a hydraulic chamber being formed between the first stress surface and the second stress surface.

2. The spindle tilt adjustment structure of a wafer polishing apparatus according to claim 1, wherein The area of the first stress surface is smaller than that of the second stress surface, and the ratio of the movement amount of the first stress surface in the through hole to that of the second stress surface in the through hole is 4-25.

3. The spindle tilt adjustment structure for a wafer polishing apparatus according to claim 1, wherein The through hole has coaxial first, second and third hole sections, the second hole section being located between the first and third hole sections, the second hole section having a smaller diameter than the first and third hole sections, an inner threaded part being arranged on an inner wall surface of the first hole section, the screwing part of the adjustment member being screwed to the inner threaded part, the first stress surface being located in the second hole section, and the second stress surface being located in the third hole section.

4. The spindle tilt adjustment structure of a wafer polishing apparatus according to claim 3, wherein One end of the adjustment member forms an adjustment part, the adjustment part being located outside the seat body, the fine adjustment device having a stop member and a coupling ring sleeved on the adjustment member, the stop member having a disc body and a protrusion, the disc body abutting against an end surface of the seat body, the protrusion penetrating into a gap between the adjustment member and the first hole section, and the coupling ring abutting against the disc body and being screwed to the adjustment member.

5. The spindle tilt adjustment structure of a wafer polishing apparatus according to claim 1, wherein The spindle base has a mounting surface, the spindle base has a plurality of mounting grooves communicated to the mounting surface, the flange has a plurality of penetrating holes respectively located in the plurality of mounting grooves, the seat body has a head part and a body part, the head part being located in the mounting groove, and the body part penetrating through the penetrating hole.

6. The spindle tilt adjustment structure of a wafer polishing apparatus according to claim 5, wherein The spindle base is provided with at least one assembly hole communicated to the mounting surface around each mounting groove, and the flange is provided with a plurality of counterbores, each coupling component penetrating through the counterbores and being coupled to a corresponding assembly hole.

7. The spindle tilt adjustment structure of a wafer polishing apparatus according to claim 6, wherein Each coupling component has an elastic member, a sleeve and a locking member, each assembly hole has a penetrating section and a fixed section, the elastic member being located in the counterbores, the sleeve abutting against the elastic member and penetrating through the counterbores and extending into the penetrating section of the assembly hole, the rod body of the locking member penetrating through the sleeve and being fixed to the fixed section of the assembly hole, and the lock head of the locking member pressing against the sleeve so that the elastic member is elastically deformed to generate a pre-pressure.

8. The spindle tilt adjustment structure for a wafer polishing apparatus according to claim 7, wherein The spindle base is provided with a plurality of side grooves respectively located in the plurality of mounting grooves, the spindle base has a locking platform located between corresponding side grooves and mounting grooves, each fine adjustment device has a locking member, the locking member penetrating through the locking platform from the side groove and being locked and connected to the connecting member.

9. The spindle tilt adjustment structure of a wafer polishing apparatus according to claim 5, wherein The spindle base has a ring seat located in front of a back plate, a lower end surface of the ring seat forming the mounting surface, the body of the spindle unit penetrating through the ring seat, and the flange being coupled to the lower side of the ring seat by the plurality of coupling components.

10. The spindle tilt adjustment structure for a wafer polishing apparatus according to claim 1, wherein The fine tuners of the plurality of tilt adjustment groups are equiangularly distributed. The fine tuners of the plurality of tilt adjustment groups are equiangularly distributed.

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