UV protective film for packaging substrate cutting and preparation method thereof

Abstract

The invention belongs to the technical field of adhesive tapes, and particularly relates to a UV protective film for packaging substrate cutting and a preparation method thereof.The UV protective film comprises a PO base material layer, a non-solvent type UV viscosity-reducing adhesive layer and a PET release layer, and the non-solvent type UV viscosity-reducing adhesive layer is located between the PO base material layer and the PET release layer; the non-solvent type UV viscosity-reducing adhesive layer comprises the following components: an acrylate soft monomer, an acrylate hydroxyl monomer, an acrylate hard monomer, an acrylate monomer with a space crosslinking site, n-dodecanethiol, a photoinitiator and a photosensitive multifunctional group acrylate monomer. The non-solvent type UV viscosity-reducing adhesive layer is introduced, so that the preparation process is environment-friendly and free of solvent volatilization, the UV protective adhesive is high in viscosity and excellent in impact resistance before UV irradiation, the adhesive layer is stably attached before cutting, and the UV protective film is stripped at low stress and free of residual adhesive after irradiation.

Description

TECHNICAL FIELD

[0001] The application particularly relates to a UV protective film for cutting a packaging substrate and a preparation method thereof, and belongs to the technical field of adhesive tapes. BACKGROUND

[0002] Semiconductors play a crucial role in today's technology society, and their technical level and development scale have become key indicators for measuring the technological strength of a country. With the continuous popularization of electronic products and the increasing demand for high-performance, low-power chips, the semiconductor industry presents a broad application prospect and continuous technical iteration demand. Under this background, packaging substrates, as the core materials in the semiconductor packaging process, are of great importance. They not only provide electrical connections and mechanical support for electronic components such as chips, but also directly affect the performance, reliability, and lifespan of integrated circuits. The UV protective film currently used for cutting packaging substrates on the market has the following problems: the production process of traditional UV protective films mainly uses solvent-based glue, which is dried and cured by evaporation of solvent in an oven. The evaporation of solvent can easily cause environmental pollution or cost loss during waste gas treatment. In addition, the UV film on the market has the following problems in the application of packaging substrates: (1) the adhesion between the UV protective film and the packaging substrate material is not enough, which can easily cause flying material and displacement of the packaging substrate material; (2) the UV protective film has poor cohesion, and the film has poor heat resistance and impact resistance; (3) after UV irradiation, the adhesion between the UV protective film and the packaging substrate material is too strong or the cohesion is poor, which makes it difficult to remove the material, and can easily cause residue and other situations.

[0003] In the patent application with the publication number CN116042109A, a UV protective film is disclosed, which has strong initial adhesion before UV irradiation, so that flying material and displacement phenomena do not occur during chip cutting. After UV irradiation, the adhesion is reduced, making it easy to peel off the chip without residue. However, it contains a lot of diluent, i.e. solvent, which can easily cause environmental pollution or cost loss during waste gas treatment.

[0004] In summary, the existing technology has obvious deficiencies, and it is very important to develop a UV protective film that does not produce waste gas during production, reduces the cost of treating waste gas, is environmentally friendly, has high peel strength before UV irradiation, low peel strength after UV irradiation, no residue, and excellent impact resistance. SUMMARY

[0005] The present application provides a UV protective film for packaging substrate cutting and a preparation method thereof, which introduces a non-solvent type UV tack-reducing adhesive layer to realize an environmentally friendly preparation process without solvent volatilization, high viscosity of the UV protective adhesive before UV irradiation at a wavelength of 300 nm, excellent impact resistance, stable adhesion of the adhesive layer before cutting, and low-stress peeling of the UV protective film after irradiation without adhesive residue.

[0006] The technical scheme for solving the above technical problems is as follows: a UV protective film for packaging substrate cutting, the UV protective film comprising a PO substrate layer, a non-solvent type UV tack-reducing adhesive layer, and a PET release layer, wherein the non-solvent type UV tack-reducing adhesive layer is between the PO substrate layer and the PET release layer.

[0007] Further, the thickness of the PO substrate layer is 90-100 mu m, the thickness of the non-solvent type UV tack-reducing adhesive layer is 8-12 mu m, the thickness of the PET release layer is 36-40 mu m, and the total thickness of the PO substrate layer, the non-solvent type UV tack-reducing adhesive layer, and the PET release layer after being sequentially adhered is 134-158 mu m.

[0008] Further, the PET release layer is a single-sided release layer, which is any one of a silicone release layer, a non-silicone release layer, and a fluorine release layer, wherein the release force is 10-20 gf / inch.

[0009] Further, according to the mass content, the non-solvent type UV tack-reducing adhesive layer contains the following components: 40-65% of acrylic ester soft monomer, 15-30% of acrylic ester hydroxyl monomer, 10-25% of acrylic ester hard monomer, 5-10% of acrylic ester monomer with a spatial crosslinking site, 0.1-0.5% of n-dodecanethiol, 0.1-2.0% of photoinitiator, and 0.1-1.0% of photosensitive multifunctional acrylic ester monomer.

[0010] Further, the mass ratio of the acrylic ester monomer with a spatial crosslinking site, the acrylic ester hard monomer, the acrylic ester hydroxyl monomer, and the acrylic ester soft monomer is 1:(1-5):(1.5-5):(4-12).

[0011] Further, the acrylic ester soft monomer is at least one of isooctyl acrylate, lauryl acrylate, and n-butyl acrylate.

[0012] Further, the acrylic ester hydroxyl monomer is at least one of hydroxyethyl acrylate, hydroxypropyl acrylate, and hydroxybutyl acrylate.

[0013] Further, the acrylic ester hard monomer is at least one of isobornyl acrylate and furan acrylate.

[0014] Further, the acrylate monomer with a spatial crosslinking site is at least one of 4-acryloyl hydroxybenzoic acid phenone and glycidyl acrylate.

[0015] Further, the photosensitive multifunctional acrylate monomer is at least one of 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, and pentaerythritol tetraacrylate, wherein the number of contained functional groups is any one of 2-6.

[0016] Further, the photoinitiator is a long-wavelength light-absorbing photoinitiator and an ionic photoinitiator.

[0017] Further, the long-wavelength light-absorbing photoinitiator is phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide (819 type photoinitiator) or TPO type photoinitiator, and the ionic photoinitiator is 6990 type photoinitiator.

[0018] The application also discloses a preparation method of the UV protective film for cutting the packaging substrate, and the preparation method comprises the following steps: S1, preparation stage: weighing acrylate soft monomer, acrylate hydroxyl monomer, acrylate hard monomer, acrylate monomer with a spatial crosslinking site, n-dodecanethiol, and long-wavelength light-absorbing photoinitiator; S2, preparation of acrylate resin prepolymer: under inert conditions, the raw materials in step S1 are added into a reaction kettle, mixed and stirred uniformly, and then reacted under the irradiation of an ultraviolet lamp; and after the reaction is completed, the acrylate resin prepolymer is obtained; S3, preparation of non-solvent type UV adhesion-reducing glue: the acrylate resin prepolymer, photosensitive multifunctional acrylate monomer and ionic photoinitiator in step S2 are weighed, mixed and stirred uniformly, and then deaerated to obtain the non-solvent type UV adhesion-reducing glue, wherein the ionic photoinitiator accounts for 0.1%-0.5% of the total mass of the non-solvent type UV adhesion-reducing glue; S4, the non-solvent type UV adhesion-reducing glue obtained in step S3 is coated on the upper surface of the PO substrate layer, then the PET release layer is attached to the non-solvent type UV adhesion-reducing glue layer, and then the obtained PET release layer / non-solvent type UV adhesion-reducing glue layer / PO substrate layer is exposed to the radiation of an ultraviolet lamp, so that the UV protective film is obtained.

[0019] Further, in step S2, the wavelength of the ultraviolet lamp is 395 nm, the setting power is 15 W-25 W, and the reaction time is 2-3 min.

[0020] Further, in step S2, the 25℃ viscosity of the obtained acrylate resin prepolymer is 380 cps-500 cps.

[0021] Further, in step S4, the wavelength of the ultraviolet lamp is 395 nm, and the total energy irradiation amount is 800-1200 mJ / cm 2 .

[0022] The beneficial effects of the present application are: (1) The UV protective film provided by the present application introduces a non-solvent type UV adhesion-reducing glue layer, which not only realizes an environmentally friendly preparation process without solvent volatilization, but also avoids the irreversible damage to the performance of the thick glue layer caused by the volatilization of the solvent in the traditional solvent type UV adhesion-reducing glue.

[0023] (2) In the non-solvent type UV adhesion-reducing glue layer provided by the present application, different types of photoinitiators are designed, and the long-wavelength absorbing photoinitiator and the ionic photoinitiator work together with other components in the adhesion-reducing glue. Under long-wavelength irradiation, the long-wavelength absorbing photoinitiator absorbs long-wavelength energy, so that the acrylate soft monomer in the acrylate hydroxyl monomer provides initial adhesion, and the acrylate hard monomer enhances the cohesion with the acrylate hydroxyl monomer. The components work together to make the UV protective glue have high viscosity and excellent impact resistance, so that the glue layer is stable before cutting.

[0024] (3) The UV protective film provided by the present application, when irradiated by UV light with a wavelength of 300 nm or less, the ionic photoinitiator absorbs the energy of UV light with a wavelength of 300 nm or less, exciting the multifunctional monomer and the spatial crosslinking monomer to quickly build a high crosslinking network, and at the same time the polarity of the glue layer changes, realizing a cliff-like drop in adhesion, which is beneficial for peeling; realizing low-stress peeling of the UV protective film without residual glue. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a schematic diagram of the UV protective film for cutting the packaging substrate of the present application; Figure 2 is a substrate cutting verification test diagram of the UV protective film obtained in Example 1; Figure 3 is a substrate cutting verification test diagram of the UV protective film obtained in Comparative Example 1. DETAILED DESCRIPTION

[0026] The specific embodiments of the present application will be described in detail below. The present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited by the specific embodiments disclosed.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used are only for describing specific embodiments and are not intended to limit the present application.

[0028] The inert conditions mentioned in the embodiments of the present application are provided by high-purity nitrogen (99.99%).

[0029] 395nm UV lamp from BFDUV, model BFDUV-ST240w395.

[0030] The present application provides a UV protective film for cutting packaging substrate, the UV protective film comprises a PO substrate layer, a non-solvent type UV adhesion-reducing glue layer and a PET release layer, wherein the non-solvent type UV adhesion-reducing glue layer is between the PO substrate layer and the PET release layer, as shown in Figure 1

[0031] The preparation process of the non-solvent type UV adhesion-reducing glue layer is environmentally friendly, without solvent volatilization, and after cutting is completed, the glue layer is irradiated by a UV lamp with a wavelength of 300nm or below, the ionic photoinitiator in the glue layer absorbs ultraviolet rays, initiates polymerization and crosslinking curing, resulting in a significant decrease in the adhesive force of the glue layer, realizing low-stress peeling of the UV protective film without residual glue.

[0032] Specifically, the thickness of the PO substrate layer is preferably 90-100μm, the thickness of the non-solvent type UV adhesion-reducing glue layer is 8-12μm, the thickness of the PET release layer is 36-40μm, and the total thickness of the PO substrate layer, the non-solvent type UV adhesion-reducing glue layer and the PET release layer after being sequentially attached is 134-158μm.

[0033] In the embodiments and comparative examples of the present application, the thickness of the PO substrate layer is preferably 100μm, the thickness of the non-solvent type UV adhesion-reducing glue layer is 10μm, and the thickness of the PET release layer is 40μm. However, this does not limit the present application, but is only for the convenience of obtaining consistent sample characteristics of the UV protective film and obtaining more accurate performance test data.

[0034] Specifically, the PET release layer is a single-sided release layer, which is any one of an organic silicon release layer, a non-silicon release layer and a fluorine release layer, wherein the release force is 10-20gf / inch.

[0035] ​The thicknesses of the PO substrate layer, the non-solvent-based UV adhesive layer, and the PET release layer mentioned herein are not limitations of this invention and can be adjusted according to actual application needs. The non-solvent-based UV adhesive layer designed in this invention can theoretically achieve a single-layer coating thickness of up to 1000 μm, representing a significant breakthrough in thickness. The appropriate coating thickness can be selected based on the specific application scenario. In contrast, traditional solvent-based UV adhesives are inherently limited to a thickness of 70-80 μm due to the influence of solvent evaporation mechanisms on adhesive layer performance. This thickness limitation stems fundamentally from the irreversible damage to the performance of thick adhesive layers caused by solvent evaporation, primarily manifested in internal stress and structural defects caused by solvent evaporation, and performance degradation and reliability risks caused by solvent residue.

[0036] Specifically, based on mass content, the non-solvent-based UV anti-adhesive layer contains the following components: 40%~65% acrylate soft monomers; 15%~30% acrylate hydroxy monomers; 10%~25% acrylate hard monomers; 5%~10% acrylate monomers with spatial crosslinking sites; 0.1%~0.5% n-dodecyl mercaptan; 0.1%~2.0% photoinitiator; and 0.1%~1.0% photosensitive multifunctional acrylate monomers.

[0037] Soft acrylate monomers provide the basic adhesion of the adhesive layer, enabling the protective film to adhere tightly to the surface of the encapsulation substrate and preventing displacement during cutting. They absorb mechanical stress during cutting, buffer vibration and impact, and protect the substrate edges from microcrack damage. Excessive concentration leads to insufficient cohesive strength of the adhesive layer, resulting in easy residue; insufficient concentration reduces adhesion and bonding reliability. The polar hydroxyl groups in the acrylate hydroxyl monomers form hydrogen bonds or chemical interactions with the substrate surface, improving the adhesion strength of the adhesive layer to various materials (such as metals and resins). After UV irradiation, they can react with functional monomers to assist in the formation of a controllable cross-linking network, balancing peel strength and cohesion. Excessive concentration leads to an overly hard adhesive layer and increased peel strength; insufficient concentration results in insufficient adhesion and easy delamination before cutting. Hard acrylate monomers impart a rigid structure to the adhesive layer, preventing excessive deformation or breakage during cutting under heat or stress. This improves the stability of the adhesive layer under the heat generated by cutting friction, reducing high-temperature softening and fluidity. Too high a temperature will make the adhesive layer brittle and reduce its adhesion; too low a temperature will result in insufficient adhesive strength, making it easy to be lifted or torn by a knife.

[0038] Specifically, the mass ratio of acrylate monomers, hard acrylate monomers, hydroxy acrylate monomers, and soft acrylate monomers with spatial crosslinking sites is 1:(1~5):(1.5~5):(4~12).

[0039] Specifically, the photosensitive multifunctional acrylate monomer is at least one of 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, and pentaerythritol tetraacrylate, wherein the number of functional groups contained is any number from 2 to 6.

[0040] Specifically, photoinitiators include photoinitiators with long absorption wavelengths and ionic photoinitiators.

[0041] More specifically, the long-wavelength light source of this invention is a 395nm ultraviolet light source, which can deeply stimulate the internal reaction of the adhesive layer and ensure uniformity of tack reduction. The ionic photoinitiator absorbs ultraviolet light energy below 300nm, causing the adhesive layer to cross-link and cure as a whole, achieving rapid and thorough tack reduction. The combination of the two types of initiators ensures efficient utilization of UV energy and avoids over-reaction on the surface while leaving sticky residue on the bottom layer.

[0042] Under long-wavelength irradiation, photoinitiators with long absorption wavelengths absorb long-wavelength energy. The soft acrylate monomers in the acrylate hydroxy monomers provide initial tack, while the hard acrylate monomers and acrylate hydroxy monomers enhance cohesion. The combined effect of these components results in high viscosity and excellent impact resistance of the UV protective adhesive, ensuring stable adhesion of the adhesive layer before cutting. When ionic photoinitiators absorb UV light energy below 300nm, they excite multifunctional monomers and spatially crosslinked monomers to rapidly construct a highly crosslinked network. Simultaneously, the polarity of the adhesive layer changes, resulting in a sharp drop in adhesion, which facilitates peeling.

[0043] The mass ratio of acrylate monomers with spatial crosslinking sites, hard acrylate monomers, hydroxyl acrylate monomers, and soft acrylate monomers is 1:(1~5):(1.5~5):(4~12), ensuring that the adhesive layer performs well throughout the entire process of coating, bonding, cutting, UV irradiation, and peeling, ultimately achieving the core goals of "zero damage" and "efficient peeling" in the cutting of the encapsulation substrate.

[0044] Specifically, the acrylate soft monomer is at least one of isooctyl acrylate, lauryl acrylate, and n-butyl acrylate.

[0045] Specifically, the hydroxyl monomer of the acrylate is at least one of hydroxyethyl acrylate, hydroxypropyl acrylate, and hydroxybutyl acrylate.

[0046] Specifically, the acrylate hard monomer is at least one of isobornyl acrylate and furanyl acrylate; Specifically, the acrylate monomer with spatial crosslinking sites is at least one of 4-acryloylhydroxybenzoic acid benzophenone and glycidyl acrylate.

[0047] More specifically, the photoinitiators with long absorption wavelengths are phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide (819 type photoinitiator) or diphenyl-(2,4,6-trimethylbenzoyl)phosphine oxide (TPO type photoinitiator), and the ionic photoinitiator is 6990 type photoinitiator.

[0048] This invention also discloses a method for preparing a UV protective film for cutting a packaging substrate, the method comprising the following steps: S1. Preparation stage: Weigh the soft acrylate monomer, hydroxy acrylate monomer, hard acrylate monomer, acrylate monomer with spatial crosslinking sites, n-dodecyl mercaptan, and photoinitiator with a long absorption wavelength range. S2. Preparation of acrylic resin prepolymer: Under inert conditions, the raw materials in step S1 are added to the reaction vessel, mixed and stirred evenly, and reacted under ultraviolet light. After the reaction is completed, acrylic resin prepolymer is obtained. S3. Preparation of non-solvent-based UV anti-tack adhesive: Weigh the acrylic resin prepolymer, photosensitive multifunctional acrylate monomer, and ionic photoinitiator from step S2, mix and stir evenly, and degas to obtain a non-solvent-based UV anti-tack adhesive, wherein the ionic photoinitiator accounts for 0.1%-0.5% of the total mass of the non-solvent-based UV anti-tack adhesive; S4. Apply the non-solvent-based UV anti-tack adhesive obtained in step S3 to the upper surface of the PO substrate layer, then attach the PET release layer to the non-solvent-based UV anti-tack adhesive layer, and then expose the resulting PET release layer / non-solvent-based UV anti-tack adhesive layer / PO substrate layer to the radiation of a UV lamp to obtain a UV protective film.

[0049] In step S2, the 395nm UV lamp, power (15–25W), and reaction time (2–3min) affect the viscosity of the acrylic resin prepolymer at 25°C to be 380cps~500cps, which in turn determines the coating uniformity and the final adhesive layer performance. When the reaction time is insufficient, the viscosity is too low and the bonding effect is poor. When the reaction time is too long, the viscosity is too high, which affects the coating uniformity and thus the adhesive layer performance.

[0050] Specifically, in step S4, the wavelength of the ultraviolet lamp is 395nm, and the total energy irradiation is 800~1200mJ / cm². 2 .

[0051] The selection of a UV lamp wavelength of 395nm in the preparation of the UV protective film for packaging substrate cutting in this invention does not limit the technology of this invention. Under permissible conditions, wavelengths higher than 395nm are still possible, as long as a longer wavelength can be provided so that the photoinitiator added in this invention, which can absorb long wavelength energy, can be successfully initiated.

[0052] In the comparative examples of this invention, the UV protective film prepared using solvent-based UV anti-adhesive adhesive includes the following steps: (1) Weigh the solvent-based acrylate resin, photosensitive multifunctional oligomer, isocyanate curing agent, photoinitiator, and ethyl acetate; (2) Add the raw materials from step (1) into the reaction vessel, mix and stir evenly, and the resulting product is a solvent-based UV anti-tack adhesive mixture; (3) Apply the solvent-based UV anti-tack adhesive from step (2) to the surface of a 40μm polyethylene terephthalate (PET) release liner, dry it in an oven, and then apply a 100μm polyolefin (PO) substrate layer onto the solvent-based UV anti-tack adhesive layer. The resulting PET release layer / solvent-based UV anti-tack adhesive layer / PO substrate layer is the UV protective film.

[0053] The solvent-based UV adhesive is composed of 60%~80% solvent-based acrylate resin, 5%~20% photosensitive multifunctional oligomer, 0.5%~2% isocyanate curing agent, 1%~5% photoinitiator, and 10%~30% ethyl acetate.

[0054] The solvent-based acrylate resin is at least one of HSD-600 resin provided by Guangzhou Huisheng Technology and AD81002 resin provided by Guangdong Ai Materials. The photosensitive multifunctional oligomer is at least one of aromatic polyurethane hexaacrylate and aliphatic polyurethane tetraacrylate. The isocyanate curing agent is at least one of L75, N75, 3360, and 3390 type curing agents. The photoinitiator is either type 819 photoinitiator or TPO type photoinitiator.

[0055] Example 1 The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 215g of isooctyl acrylate, 120g of hydroxyethyl acrylate, 120g of isobornyl acrylate, 25g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 2 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0056] Example 2 The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 275g of isooctyl acrylate, 100g of hydroxyethyl acrylate, 95g of isobornyl acrylate, 30g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 3 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 1g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0057] Example 3 The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 325g of isooctyl acrylate, 75g of hydroxyethyl acrylate, 50g of isobornyl acrylate, 50g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 3 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 2.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and obtain non-solvent-based UV anti-sticking adhesive after degassing. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0058] Comparative Example 1 Comparative Example 1 uses a solvent-based UV anti-adhesive to prepare a UV protective film, including the following steps: (1) Weigh 480g of solvent-based acrylate resin HSD-600, 32g of aromatic polyurethane hexaacrylate, 6.4g of isocyanate curing agent L75, 9.6g of diphenyl-(2,4,6-trimethylbenzoyl)phosphorus oxychloride, and 96g of ethyl acetate; (2) Add the raw materials from step (1) to a 1000mL three-necked reaction flask equipped with a stirrer, mix and stir evenly, and obtain a solvent-based UV anti-adhesive mixture after 1h. (3) Apply the solvent-based UV anti-tack adhesive from step (2) to the surface of a 40μm polyethylene terephthalate (PET) release liner, dry it in an oven, and then apply a 100μm polyolefin (PO) substrate layer onto the solvent-based UV anti-tack adhesive layer. The resulting PET release layer / solvent-based UV anti-tack adhesive layer / PO substrate layer is the UV protective film.

[0059] Comparative Example 2 Comparative Example 2 uses a solvent-based UV anti-adhesive to prepare a UV protective film, including the following steps: (1) Weigh 480g of solvent-based acrylate resin HSD-600, 80g of aromatic polyurethane hexaacrylate, 6.4g of isocyanate curing agent L75, 9.6g of diphenyl-(2,4,6-trimethylbenzoyl)phosphorus oxychloride, and 96g of ethyl acetate; (2) Add the raw materials from step (1) to a 1000mL three-necked reaction flask equipped with a stirrer, mix and stir evenly, and obtain a solvent-based UV anti-adhesive mixture after 1h. (3) Apply the solvent-based UV anti-tack adhesive from step (2) to the surface of a 40μm polyethylene terephthalate (PET) release liner, dry it in an oven, and then apply a 100μm polyolefin (PO) substrate layer onto the solvent-based UV anti-tack adhesive layer. The resulting PET release layer / solvent-based UV anti-tack adhesive layer / PO substrate layer is the UV protective film.

[0060] Comparative Example 3 Comparative Example 3 uses a solvent-based UV anti-adhesive to prepare a UV protective film, including the following steps: (1) Weigh 480g of solvent-based acrylate resin AD81002, 48g of aromatic polyurethane hexaacrylate, 4.8g of isocyanate curing agent L75, 9.6g of diphenyl-(2,4,6-trimethylbenzoyl)phosphorus oxychloride, and 96g of ethyl acetate; (2) Add the raw materials from step (1) to a 1000mL three-necked reaction flask equipped with a stirrer, mix and stir evenly, and obtain a solvent-based UV anti-adhesive mixture after 1h. (3) Apply the solvent-based UV anti-tack adhesive from step (2) to the surface of a 40μm polyethylene terephthalate (PET) release liner, dry it in an oven, and then apply a 100μm polyolefin (PO) substrate layer onto the solvent-based UV anti-tack adhesive layer. The resulting PET release layer / solvent-based UV anti-tack adhesive layer / PO substrate layer is the UV protective film.

[0061] Comparative Example 4 Comparative Example 4 uses the method of Example 1, except that: in step S2, after reacting under ultraviolet light for 10 minutes, an acrylic resin prepolymer with a viscosity of 3500 cps at 25°C is obtained; finally, a UV protective film with a non-solvent-type UV adhesive layer of 10 μm is obtained.

[0062] The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 215g of isooctyl acrylate, 120g of hydroxyethyl acrylate, 120g of isobornyl acrylate, 25g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on, and the reaction was carried out for 10 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 3500cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0063] Comparative Example 5 Comparative Example 5 uses the method of Example 1, except that in step S1, 385g of isooctyl acrylate is weighed, at which point isooctyl acrylate accounts for 80% of the non-solvent UV anti-tack adhesive.

[0064] The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 385g of isooctyl acrylate, 40g of hydroxyethyl acrylate, 30g of isobornyl acrylate, 25g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 2 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0065] Comparative Example 6 Comparative Example 6 uses the method of Example 1, except that in step S1, 144g of isooctyl acrylate is weighed, at which point isooctyl acrylate accounts for 29.8% of the non-solvent-based UV anti-tack adhesive.

[0066] The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 144g of isooctyl acrylate, 160g of hydroxyethyl acrylate, 150g of isobornyl acrylate, 26g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 2 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0067] Comparative Example 7 Comparative Example 7 uses the method of Example 1, except that in step S1, 173.5g of hydroxyethyl acrylate is weighed, at which point hydroxyethyl acrylate accounts for 36% of the non-solvent-based UV anti-tack adhesive.

[0068] The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 156.5g of isooctyl acrylate, 173.5g of hydroxyethyl acrylate, 120g of isobornyl acrylate, 25g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 2 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0069] Comparative Example 8 Comparative Example 8 uses the method of Example 1, except that in step S1, 144.6g of isobornyl acrylate is weighed, at which point isobornyl acrylate accounts for 30% of the non-solvent-based UV anti-tack adhesive.

[0070] The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 190.4g of isooctyl acrylate, 120g of hydroxyethyl acrylate, 144.6g of isobornyl acrylate, 25g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 2 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0071] Comparative Example 9 Comparative Example 9 uses the method of Example 1, except that in step S1, 57.84g of glycidyl acrylate is weighed, at which point glycidyl acrylate accounts for 12% of the non-solvent-based UV anti-tack adhesive.

[0072] The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 182.16g of isooctyl acrylate, 120g of hydroxyethyl acrylate, 120g of isobornyl acrylate, 57.84g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 2 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0073] Comparative Example 10 Comparative Example 10 uses the method of Example 1, except that in step S1, 14.46g of glycidyl acrylate is weighed, at which point glycidyl acrylate accounts for 3% of the non-solvent-based UV anti-tack adhesive.

[0074] The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 225.54g of isooctyl acrylate, 120g of hydroxyethyl acrylate, 120g of isobornyl acrylate, 14.46g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 2 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0075] Comparative Example 11 Comparative Example 11 uses the method of Example 1, except that in step S1, 310g of isooctyl acrylate and 140g of hydroxyethyl acrylate are weighed. At this time, the mass ratio of glycidyl acrylate, isobornyl acrylate, hydroxyethyl acrylate, and isooctyl acrylate is 1:4.8:5.6:12.4.

[0076] The preparation of a UV protective film for cutting a packaging substrate includes the following steps: S1. Preparation stage: Weigh 310g of isooctyl acrylate, 140g of hydroxyethyl acrylate, 120g of isobornyl acrylate, 25g of glycidyl acrylate, 0.5g of n-dodecyl mercaptan, and 0.5g of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. S2. Preparation of acrylic resin prepolymer: Under nitrogen protection, the raw materials in step S1 were added to a 1000mL reactor equipped with a stirrer, and high-purity nitrogen was passed through for 1 hour. The mixture was stirred until homogeneous. An ultraviolet lamp with a power of 18W and a wavelength of 395nm was turned on and the reaction was carried out for 2 minutes. After the reaction was completed, an acrylic resin prepolymer with a viscosity of 400cps at 25℃ was obtained. S3. Preparation of non-solvent-based UV anti-sticking adhesive: Weigh the acrylic resin prepolymer from step S2, 0.5g of 1,6-hexanediol diacrylate, and 0.5g of 6990 type photoinitiator, mix and stir evenly, and degas to obtain non-solvent-based UV anti-sticking adhesive. S4. Apply the non-solvent-based UV anti-adhesive obtained in step S3 to the surface of a 100μm polyolefin (PO) substrate layer. Then, attach a 40μm polyethylene terephthalate (PET) release liner to the non-solvent-based UV anti-adhesive layer. Subsequently, expose the resulting PET release layer / non-solvent-based UV anti-adhesive layer / PO substrate layer to ultraviolet radiation with a wavelength of 395nm, with a total energy irradiation of 800~1200mJ / cm². 2 A non-solvent-based UV adhesive layer with a thickness of 10 μm was obtained as a UV protective film.

[0077] The performance tests involved in the UV protective film in the embodiments and comparative examples of this invention are as follows: (1) Adhesion test of UV protective film: According to GB / T2792-2014 standard, the UV film was cut into samples with a length of 15 cm and a width of 2.5 cm. After being attached to a glass plate and left to stand for 20 minutes, its adhesion was tested. A 180° peel test was performed using a computer-controlled tensile and compressive testing machine, model KJ-1065A. For UV de-adhesion test, a 300 nm wavelength ultraviolet lamp light source was used. After the sample was left to stand for 20 minutes, it was irradiated with an energy of about 1000 mJ / cm. 2 .

[0078] (2) Tensile properties test of UV protective film: GB / T 30776-2014 standard was adopted, the effective sample size was 10mm×100mm, the tensile speed was 300mm / min, and a computer-controlled tensile and compressive testing machine, model KJ-1065A, was used.

[0079] (3) UV protective film holding force test: Cut the UV protective film into a sample with a length of 15 cm and a width of 2.5 cm, attach one end to the hanging rack, and hang a 1KG weight on the other end. Observe the time it takes for the sample to fall off at room temperature of 25℃.

[0080] (4) Substrate cutting verification test of UV protective film: The UV protective film was attached to the epoxy resin substrate and cut using a cutting machine (DAD3650) according to the substrate size. After completion, a 300nm wavelength ultraviolet lamp was used. The sample was left to stand for 20 minutes and then irradiated to de-adhede. The energy was about 1000mJ / cm. 2 The residual adhesive was observed under a microscope after the substrate was cut and picked up. The substrate cutting verification test image of the UV protective film obtained in Example 1 is shown below. Figure 2 As shown, the substrate cutting verification test diagram of the UV protective film obtained in Comparative Example 1 is as follows. Figure 3 As shown.

[0081] The performance test data of the UV protective film in the examples and comparative examples are shown in Table 1.

[0082] Table 1 Performance test data of UV protective films in the examples and comparative examples Based on the data in Table 1, a comparison of the experimental results of Examples 1-3 and Comparative Examples 1-3 shows that the UV protective film provided by this invention, through the introduction of a non-solvent-based UV anti-tack adhesive layer, achieves an environmentally friendly preparation process with no solvent evaporation. After UV irradiation at a wavelength of 300 nm, the UV protective film achieves low-stress peeling with no residue. The soft acrylate monomers in the acrylate hydroxy monomers provide initial tack, while the hard acrylate monomers and acrylate hydroxy monomers enhance cohesion. The combined effect of these components results in high viscosity and excellent impact resistance of the UV protective adhesive, ensuring stable adhesion of the adhesive layer before cutting.

[0083] According to the data in Table 1, a comparison of the experimental results of Comparative Example 4 and Example 1 shows that the UV protective film prepared in Comparative Example 4 exhibits residual adhesive after cutting compared to Example 1. This is because, in the preparation process of Comparative Example 4, the UV irradiation reaction time in step S2 is longer, resulting in higher viscosity of the acrylic resin prepolymer, which affects the uniformity of subsequent coating and thus the performance of the adhesive layer.

[0084] According to the data in Table 1, a comparison of the experimental results of Comparative Example 5 and Example 1 shows that before UV irradiation at a wavelength of 300nm, the UV protective film prepared in Comparative Example 5 exhibits significantly lower adhesion than that in Example 1, resulting in flyaways and residual adhesive after cutting. This is because the amount of isooctyl acrylate in Comparative Example 5 is too high, leading to insufficient cohesive strength of the adhesive layer and easy residue.

[0085] According to the data in Table 1, a comparison of the experimental results of Comparative Example 6 and Example 1 shows that the UV protective film prepared in Comparative Example 6 exhibits a flying material phenomenon after cutting compared to Example 1. This is because the amount of isooctyl acrylate in Comparative Example 6 is relatively low, resulting in decreased adhesion and reduced bonding performance.

[0086] According to the data in Table 1, a comparison of the experimental results of Comparative Example 7 and Example 1 shows that the UV protective film prepared in Comparative Example 7 exhibits a flying material phenomenon after cutting, which is because the amount of hydroxyethyl acrylate is too high, resulting in an overly hard adhesive layer and increased peel force.

[0087] According to the data in Table 1, a comparison of the experimental results of Comparative Example 8 and Example 1 shows that the UV protective film prepared in Comparative Example 8 exhibits a flying material phenomenon after cutting, which is because the amount of isoborneol acrylate is too high, causing the adhesive layer to become brittle and its adhesion to deteriorate.

[0088] According to the data in Table 1, a comparison of the experimental results of Comparative Example 9 and Example 1 shows that when the amount of glycidyl acrylate is too high, the UV protective film prepared in Comparative Example 9 has a significantly lower adhesion than that in Example 1 before UV irradiation at a wavelength of 300 nm.

[0089] According to the data in Table 1, a comparison of the experimental results of Comparative Example 10 and Example 1 shows that the UV protective film prepared in Comparative Example 10 exhibits less performance than that in Example 1. After cutting, residual adhesive was observed. This is because the amount of 4-acryloylhydroxybenzoic acid benzophenone was too low. When the ionic photoinitiator absorbs UV light energy below 300nm, the density of the highly cross-linked network rapidly constructed by the multifunctional monomer and spatially cross-linked monomer is relatively low, resulting in residue after peeling.

[0090] Based on the data in Table 1, a comparison of the experimental results of Comparative Example 11 and Example 1 shows that the mass ratio of glycidyl acrylate, isobornyl acrylate, hydroxyethyl acrylate, and isooctyl acrylate in Comparative Example 11 is 1:4.8:5.6:12.4, which is not within the ratio designed in this invention. The synergistic effect between the components is affected, and the performance is reduced.

[0091] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are exhaustively listed. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] For those skilled in the art, various modifications and improvements can be made without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the appended claims.

Claims

1. A UV protective film for cutting of a package substrate, characterized by, The UV protective film comprises a PO substrate layer, a non-solvent type UV tack-reducing adhesive layer and a PET release layer, wherein the non-solvent type UV tack-reducing adhesive layer is between the PO substrate layer and the PET release layer.

2. The UV protective film for cutting a package substrate according to claim 1, characterized by, The thickness of the PO substrate layer is 90-100 μm. The thickness of the non-solvent type UV tack-reducing adhesive layer is 8-12 μm. The thickness of the PET release layer is 36-40 μm. The total thickness of the PO substrate layer, the non-solvent type UV tack-reducing adhesive layer and the PET release layer after being sequentially adhered is 134-158 μm.

3. The UV protective film for cutting a package substrate according to claim 1, characterized by, The PET release layer is single-sided release, which is any one of silicone release, non-silicone release, fluorine release, wherein the release force is 10-20 gf / inch.

4. The UV protective film for cutting a package substrate according to claim 1, wherein The non-solvent type UV tack-reducing adhesive layer contains the following components in terms of mass content: Acrylate soft monomer 40-65%; Acrylate hydroxyl monomer 15-30%; Acrylate hard monomer 10-25%; Acrylate monomer with spatial crosslinking site 5-10%; n-Dodecanethiol 0.1-0.5%; Photoinitiator 0.1-2.0%; Photosensitive multifunctional acrylate monomer 0.1-1.0%.

5. The UV protective film for cutting a package substrate according to claim 4, wherein The mass ratio of the acrylate monomer with spatial crosslinking site, the acrylate hard monomer, the acrylate hydroxyl monomer and the acrylate soft monomer is 1:(1-5):(1.5-5):(4-12).

6. The UV protective film for cutting packaging substrates according to claim 4, wherein the acrylate soft monomer is at least one of isooctyl acrylate, lauryl acrylate and n-butyl acrylate; the acrylate hydroxyl monomer is at least one of hydroxyethyl acrylate, hydroxypropyl acrylate and hydroxybutyl acrylate; and the acrylate hard monomer is at least one of isobornyl acrylate and furan acrylate.

7. The UV protective film for cutting packaging substrates according to claim 4, wherein the acrylate monomer with spatial crosslinking site is at least one of 4-acryloyl hydroxybenzoic acid phenone and glycidyl acrylate; and the photosensitive multifunctional acrylate monomer is at least one of 1,6-hexanediol diacrylate, trimethylolpropane triacrylate and pentaerythritol tetraacrylate, wherein the number of functional groups contained is any one of 2-6.

8. The UV protective film for cutting packaging substrates according to claim 4, wherein the photoinitiator is a photoinitiator absorbing light with a long wavelength in the wavelength range and an ionic photoinitiator. The preparation method comprises the following steps: S1, preparation stage: weighing acrylate soft monomer, acrylate hydroxyl monomer, acrylate hard monomer, acrylate monomer with spatial crosslinking site, n-dodecanethiol and photoinitiator absorbing light with a long wavelength in the wavelength range; S2, preparation of acrylate resin prepolymer: under inert conditions, the raw materials in step S1 are added to a reaction kettle, mixed and stirred uniformly, and then reacted under the irradiation of a UV lamp, to obtain acrylate resin prepolymer after the reaction is completed. ​ ​ ​ 9. A method for producing a UV protective film for cutting a package substrate according to any one of claims 1 to 8, characterized by, ​ ​ ​ S3, preparation of non-solvent type UV adhesion-reducing glue: the acrylic resin prepolymer, photosensitive multifunctional acrylate monomer and ionic photoinitiator of step S2 are weighed and mixed and stirred uniformly, and then deaerated to obtain non-solvent type UV adhesion-reducing glue, wherein the ionic photoinitiator accounts for 0.1%-0.5% of the total mass of the non-solvent type UV adhesion-reducing glue; S4, the non-solvent type UV adhesion-reducing glue obtained in step S3 is coated on the upper surface of the PO base material layer, then the PET release layer is attached to the non-solvent type UV adhesion-reducing glue layer, and then the obtained PET release layer / non-solvent type UV adhesion-reducing glue layer / PO base material layer is exposed to the radiation of a UV lamp to obtain a UV protective film.

10. The method of claim 9, wherein the UV protective film is prepared by coating a UV protective layer on a surface of a glass substrate, and cutting the glass substrate. In step S2, the wavelength of the UV lamp is 395 nm, the power is set to 15 W-25 W, and the reaction time is 2-3 min; In step S2, the 25℃ viscosity of the obtained acrylic resin prepolymer is 380 cps-500 cps; In step S4, the wavelength of the UV lamp is 395 nm, and the total energy irradiation amount is 800 to 1200 mJ / cm 2 .

Images