Automobile chip overvoltage test system and method

Abstract

The invention discloses an automobile chip overvoltage test system and method, and belongs to the technical field of chip test.According to the automobile chip overvoltage test system, a power supply module is used for providing an adjustable direct-current power supply for a chip to be tested; the test master control module controls the output voltage of the power supply module and adjusts the output voltage according to a preset test program; testing data of the to-be-tested chip under different voltage conditions are measured by using the testing instrument module; a to-be-tested chip is installed through the test board card module; the test master control module obtains test data of the power supply module and the test instrument module, processes and analyzes the test data and generates a test report, and the output voltage range of the power supply module covers the upper and lower limits of the normal working voltage of the automobile chip and can exceed a certain range so as to simulate overvoltage and undervoltage conditions. Performance and functions of the automobile chip under different overvoltage and undervoltage conditions can be tested comprehensively and accurately.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to an automobile chip overvoltage testing system and system. BACKGROUND

[0002] With the rapid development of automobile electronic technology, automobile chips play an increasingly important role in various systems of vehicles, especially in new energy driving systems. In order to ensure that automobile chips can work stably and reliably under various complex power supply environments, overvoltage and undervoltage tests need to be performed on them. At present, there is no testing system for overvoltage and undervoltage tests of automobile chips. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides an automobile chip overvoltage testing system, which can accurately test the performance and function of automobile chips under different voltage conditions.

[0004] The present application also provides an automobile chip overvoltage testing method, a control device and a computer readable storage medium.

[0005] According to the automobile chip overvoltage testing system of the first aspect of the embodiment of the present application, the system comprises: a power supply module for providing an adjustable direct current power supply to a chip to be tested; a test main control module connected to the power supply module, for controlling the output voltage of the power supply module and adjusting the output voltage according to a preset test program; a test instrument module connected to the test main control module, for measuring test data of the chip to be tested under different voltage conditions; a test board card module connected to the power supply module and the test instrument module, the test board card module being used for installing the chip to be tested; The test main control module acquires the test data of the power supply module and the test instrument module, processes and analyzes the test data, and generates a test report.

[0006] According to the automobile chip overvoltage testing system of the embodiment of the present application, at least the following beneficial effects are achieved: The automobile chip overvoltage test system of the embodiment of the application utilizes a power supply module to provide adjustable direct current power to a chip to be tested; a test main control module controls the output voltage of the power supply module and adjusts the output voltage according to a preset test procedure; and a test instrument module is utilized to measure the test data of the chip to be tested under different voltage conditions; a test board card module is utilized to install the chip to be tested; the test main control module acquires the test data of the power supply module and the test instrument module, processes and analyzes the test data, and generates a test report; the output voltage range of the power supply module covers the upper and lower limits of the normal working voltage of the automobile chip and can exceed a certain range to simulate overvoltage and undervoltage conditions, and the performance and functions of the automobile chip under different overvoltage and undervoltage conditions are comprehensively and accurately tested.

[0007] According to some embodiments of the application, the power supply module comprises at least two programmable power supplies, each of which has an output port for supplying power to the chip to be tested, and the programmable power supplies are in communication connection with the test main control module.

[0008] According to some embodiments of the application, the test data comprises electrical parameters, signal waveforms and logic states; the test instrument module comprises an oscilloscope, a logic analyzer and a multimeter; the oscilloscope is used to collect the signal waveforms of the chip to be tested, the logic analyzer is used to collect the logic states of the chip to be tested, and the multimeter is used to collect the electrical parameters of the chip to be tested.

[0009] According to some embodiments of the application, the test board card module comprises a mother board card, a daughter board card and a base, the mother board card is in matching connection with the base, the daughter board card is connected with the base, and the daughter board card is used to adapt to different chips to be tested.

[0010] The automobile chip overvoltage test method according to the second aspect of the embodiment of the application is applied to the automobile chip overvoltage test system according to the first aspect of the embodiment of the application, and the test method comprises the following steps: installing the chip to be tested on the test board card module and connecting the test board card module with the power supply module and the test instrument module; controlling the power supply module to gradually increase the output voltage, increasing the output voltage by a first preset voltage step each time and keeping the output voltage for a first preset time until reaching an overvoltage threshold; at each of the first preset voltage steps, measuring the test data of the chip to be tested under different voltage conditions by using the test instrument module; controlling the power supply module to gradually decrease the output voltage, decreasing the output voltage by a second preset voltage step each time and keeping the output voltage for a second preset time until reaching an undervoltage threshold; measuring, by the test instrument module, test data of the chip under test under different voltage conditions at each of the second preset voltage step; controlling the test host module to analyze and process the collected test data, to calculate performance indexes of the chip under test under different overvoltage and undervoltage conditions, and to generate a test report according to the data analysis result.

[0011] The automobile chip overvoltage test method according to the embodiment of the present application has at least the following beneficial effects: The automobile chip overvoltage test method according to the embodiment of the present application first installs the chip under test on a test board card module, and connects the test board card module with a power supply module and a test instrument module; then controls the power supply module to gradually increase the output voltage, each time by a first preset voltage step, and to keep the first preset time, until the overvoltage threshold is reached; measures, by the test instrument module, test data of the chip under test under different voltage conditions at each of the first preset voltage step; controls the power supply module to gradually decrease the output voltage, each time by a second preset voltage step, and to keep the second preset time, until the undervoltage threshold is reached; measures, by the test instrument module, test data of the chip under test under different voltage conditions at each of the second preset voltage step; finally controls the test host module to analyze and process the collected test data, to calculate performance indexes of the chip under test under different overvoltage and undervoltage conditions, and to generate a test report according to the data analysis result. The output voltage range of the power supply module covers the upper and lower limits of the normal working voltage of the automobile chip, and can exceed a certain range to simulate overvoltage and undervoltage conditions, so that the performance and functions of the automobile chip under different overvoltage and undervoltage conditions can be comprehensively and accurately tested.

[0012] According to some embodiments of the present application, the test data includes electrical parameters, signal waveforms and logic states; the test instrument module includes an oscilloscope, a logic analyzer and a multimeter; The measuring, by the test instrument module, test data of the chip under test under different voltage conditions includes: collecting, by the oscilloscope, signal waveforms of the chip under test, and recording signal waveform data; collecting, by the logic analyzer, logic states of the chip under test, and recording logic state data; collecting, by the multimeter, electrical parameters of the chip under test, and recording electrical parameter data.

[0013] According to some embodiments of the present application, the test method further includes: Before the control of the power supply module gradually increasing the output voltage, the initial output voltage of the power supply module is set as the normal working voltage of the chip under test, and the measurement parameters and trigger conditions of the test instrument module are set to complete the initialization setting.

[0014] According to some embodiments of the present application, the test method further comprises: After the calculation of the performance indicators of the chip under test under different overvoltage and undervoltage conditions, the data analysis results are compared with the design requirements of the automotive chip to determine whether the chip passes the test.

[0015] The control device according to the third aspect of the embodiments of the present application comprises at least one processor; and a memory storing instructions which, when executed by the at least one processor, perform the automotive chip overvoltage test system according to the first aspect of the embodiments of the present application.

[0016] The computer readable storage medium according to the fourth aspect of the embodiments of the present application stores computer executable instructions for causing a computer to execute the automotive chip overvoltage test system according to the first aspect of the embodiments of the present application.

[0017] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or can be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a schematic diagram of an automotive chip overvoltage test system according to an embodiment of the present application; Figure 2 is a schematic diagram of a power supply module according to an embodiment of the present application; Figure 3 is a schematic diagram of a test master control module according to an embodiment of the present application; Figure 4 is a schematic diagram of a test board card module according to an embodiment of the present application; Figure 5 is a flowchart of an automotive chip overvoltage test according to an embodiment of the present application. DETAILED DESCRIPTION

[0019] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0020] In the description of the present application, it should be understood that the terms up, down, etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0021] In the description of the present application, the meaning of multiple is more than two, greater than, less than, more than, etc. is not included in the number, above, below, etc. is included in the number. If it is described that the first, second is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0022] In the description of the present application, it should be noted that the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0023] The technical solutions of the present application will be described below in conjunction with the drawings. Obviously, the following described embodiments are part of the embodiments of the present application, not all embodiments.

[0024] Referring to Figures 1 to 4 The embodiment of the present application provides an automobile chip overvoltage test system, which comprises a power supply module, a test main control module, a test instrument module and a test board card module. The power supply module is used to provide adjustable DC power to the chip to be tested. The test main control module is connected with the power supply module, used to control the output voltage of the power supply module, and adjust the output voltage according to the preset test program. The test instrument module is connected with the test main control module, used to measure the test data of the chip to be tested under different voltage conditions. The test board card module is connected with the power supply module and the test instrument module, and the test board card module is used to install the chip to be tested. The test main control module acquires the test data of the power supply module and the test instrument module, processes and analyzes the test data, and generates a test report.

[0025] It can be understood that the power supply module can output a continuous adjustable DC voltage device, which can be realized in various ways, for example, using a linear voltage regulator or a switching power supply as the basic structure, and adjusting the output voltage value through a digital control interface, which is mainly to provide accurate and stable voltage input to the chip under test. The test control module can be realized by using an embedded processor or an industrial computer, which controls the output voltage change of the power supply module by running a preset test program. Specifically, the module can communicate with the power supply module through a serial port, USB interface or network interface to send control instructions and receive feedback information. The test instrument module can be composed of various measuring devices, such as signal generators, spectrum analyzers or multi-channel data acquisition cards, which are mainly used for multi-dimensional measurement of the response characteristics of the chip under test. The test board module can be designed as a circuit board containing various interface forms, such as PCIe interface, BGA package adapter or QFP package adapter, which mainly provides physical installation platform and electrical connection support for different types of chips under test.

[0026] In some embodiments, the data processing function of the test control module can be realized in various ways, such as using a rule-based algorithm to classify and filter test data, or calculating the trend of performance indicators through statistical analysis methods, which is mainly to realize the automatic analysis of test results and the generation of structured reports.

[0027] The embodiment of the present application solves the problem of lack of special equipment for overvoltage and undervoltage testing of automotive chips in complex power supply environment by constructing an integrated test system. Compared with the test method relying on manual operation and scattered equipment in the prior art, the embodiment realizes the automation and standardization of the test process by organically combining the power supply, test control, data measurement and chip installation function modules, thereby improving the test efficiency and data reliability.

[0028] Referring to Figure 3 The embodiment of the present application realizes overvoltage and undervoltage testing of automotive chips in complex power supply environment through the cooperative work of multiple modules. The power supply module provides adjustable DC power to the chip under test, which can accurately simulate the continuous change process from normal voltage to overvoltage or undervoltage, thereby covering various power supply abnormal scenarios that the chip may encounter in actual operation. The test control module is connected with the power supply module and adjusts the output voltage based on a preset test program to ensure the accuracy and repeatability of voltage change and avoid the deviation introduced by manual intervention. Further, the test instrument module is connected with the test control module and is used to measure the test data of the chip under test under different voltage conditions. Through real-time communication with the test control module, the test instrument module can automatically trigger measurement operation at the key nodes of voltage adjustment, ensuring the synchronization of data acquisition and voltage state and improving the accuracy and relevance of test data.

[0029] The test board module is connected with the power supply module and the test instrument module for installing the chip to be tested. The integrated connection design simplifies the test setup process, ensures the stability and reliability of signal transmission, and facilitates continuous monitoring of chip response during voltage changes. Therefore, the test main control module obtains test data of the power supply module and the test instrument module, and processes and analyzes them to finally generate a test report. By integrating multi-source data and performing automated analysis, the system can quickly identify the performance trend of the chip under overvoltage and undervoltage conditions, providing a reliable basis for comprehensive evaluation of chip stability. Specifically, the technical scheme solves the problem of lack of special test equipment for automotive chips in complex power supply environments by building an integrated test system, realizing automation and standardization of the test process. Referring to Figure 2 The power supply module includes at least two programmable power supplies, each programmable power supply having an output port for supplying power to the chip to be tested, and the programmable power supply is in communication connection with the test main control module.

[0030] The programmable power supply refers to a power supply device that can control its output voltage and current through programming, which can be realized by using a digital control power supply or an analog control power supply. In practical applications, the programmable power supply usually has high-precision voltage regulation function to meet the needs of different test scenarios. Each programmable power supply has an output port for supplying power to the chip to be tested, ensuring that the power supply is directly connected to the chip, simplifying the power supply process and improving reliability. In addition, the programmable power supply is in communication connection with the test main control module, allowing the main control module to program and control the output of each power supply in real time, realizing accurate voltage adjustment and automated test process.

[0031] Specifically, the above technical scheme solves the shortcomings of single power supply system in the test process by enhancing the flexibility and control accuracy of the power supply module. The design of the power supply module including at least two programmable power supplies enables the system to provide multiple independent voltage outputs simultaneously, thereby supporting parallel testing or scenarios with different voltage requirements, avoiding the limitations of a single power supply. On this basis, the communication connection between the programmable power supply and the test main control module allows the main control module to adjust the output parameters of each power supply in real time, thereby realizing complex test programs and automated operations. This design not only improves test efficiency, but also enhances the adaptability of the system, enabling it to meet the needs of multi-chip testing or complex voltage scenarios.

[0032] Referring to Figure 3As shown, in some embodiments, the application further proposes that the test data includes electrical parameters, signal waveforms, and logic states; the test instrument module includes an oscilloscope, a logic analyzer, and a multimeter; the oscilloscope is used to collect the signal waveforms of the chip under test, the logic analyzer is used to collect the logic states of the chip under test, and the multimeter is used to collect the electrical parameters of the chip under test.

[0033] Specifically, the test data refers to the information set obtained by measuring the chip under test under different voltage conditions. In practical applications, the electrical parameters can be basic electrical quantities such as voltage and current, which can be accurately measured by a multimeter. The signal waveform refers to the graphical representation of the electrical signal generated by the chip under test during operation, which can be captured and recorded by an oscilloscope. The logic state refers to the output response of the chip under test under specific input conditions, which can be monitored and collected in real time by a logic analyzer.

[0034] It can be understood that the test instrument module realizes comprehensive coverage of different types of test data by integrating various special measurement devices. Among them, the oscilloscope as the core tool for signal waveform collection can accurately capture the dynamic response characteristics of the chip under test during voltage change, ensuring signal integrity. The logic analyzer focuses on the logic verification of digital circuits and can effectively monitor the functional correctness of the chip under overvoltage and undervoltage conditions. The multimeter provides measurement support for basic electrical parameters, laying a data foundation for performance evaluation. The combination of these instruments ensures the multifunctionality and reliability of the test system.

[0035] On this basis, the above-mentioned overvoltage test system for automotive chips establishes a complete test data collection system by clearly defining the specific types of test data and corresponding measurement devices. The test main control module can perform in-depth analysis based on these specific test data, thereby accurately evaluating the comprehensive performance of the chip under overvoltage and undervoltage conditions. This design not only solves the problem of incomplete test data, but also significantly improves the accuracy and reliability of the test results, providing a strong guarantee for the quality evaluation of automotive chips. Referring to Figure 4 As shown, in some embodiments, the application further proposes that the test board module includes a mother board, a daughter board, and a base, the mother board is connected to the base in a matching manner, the daughter board is connected to the base, and the daughter board is used to adapt to different chips under test.

[0036] Specifically, the motherboard card refers to the basic structural part in the test board card module, which can be implemented by using a multi-layer printed circuit board technology, aiming to provide stable electrical connection and mechanical support. Among them, the daughter card can be understood as a replaceable adaptive unit, which can be connected with the base through plug-in or bolted connection, aiming to flexibly adapt to the physical size and electrical interface of different chips to be tested. In practical application, the base is specifically an intermediate component for connecting the motherboard card and the daughter card, which can be made of conductive material, aiming to ensure the reliability and stability of signal transmission.

[0037] It can be understood that the matching connection between the motherboard card and the base is realized through a standardized interface, which can effectively prevent test interruption or data error caused by loose connection. The connection mode of the daughter card and the base adopts a modular design, so that different types of daughter cards can be quickly replaced according to the needs of the chip to be tested, thereby significantly improving the test efficiency. On this basis, the design of the daughter card directly solves the adaptation problem caused by the diversity of chips, avoids the cumbersome operation of replacing the whole module through independent daughter card design, and reduces resource waste. In addition, the modular design can not only ensure the test accuracy, but also reduce the maintenance cost and complexity of the system.

[0038] In the embodiment, the above scheme forms a flexible and efficient test board card module through the organic combination of the motherboard card, the daughter card and the base, which not only improves the universality of the test system, but also optimizes the convenience and economy of the test process. Referring to Figure 5 The embodiment of the application also discloses a car chip overvoltage test method applied to a car chip overvoltage test system, and the test method comprises the following steps: Step S100, installing the chip to be tested on the test board card module, and connecting the test board card module with the power supply module and the test instrument module; Step S200, controlling the power supply module to gradually increase the output voltage, increasing the first preset voltage step each time and keeping the first preset time until the overvoltage threshold is reached; Step S300, under each first preset voltage step, measuring the test data of the chip to be tested under different voltage conditions by using the test instrument module; Step S400, controlling the power supply module to gradually reduce the output voltage, reducing the second preset voltage step each time and keeping the second preset time until the under-voltage threshold is reached; Step S500, under each second preset voltage step, measuring the test data of the chip to be tested under different voltage conditions by using the test instrument module; In step S600, the test master module analyzes and processes the collected test data, calculates the performance indicators of the to-be-tested chip under different overvoltage and undervoltage conditions, and generates a test report according to the data analysis result.

[0039] It can be understood that by the cooperative design of the test board module, the power supply module and the test instrument module, and the introduction of the mechanism of gradually adjusting the voltage and accurately collecting data, the problem of lack of targeted test method for the automobile chip under the complex power supply environment is solved, and the effect of comprehensively evaluating the performance of the chip under the overvoltage and undervoltage conditions is achieved. Specifically, the method simulates the actual power supply fluctuation scene through the systematic voltage scanning process, ensures the authenticity and reliability of the test data, and at the same time generates a structured report through automatic data analysis, significantly improves the test efficiency and evaluation accuracy.

[0040] The embodiment of the application solves the problem of lack of special equipment for overvoltage and undervoltage test of the automobile chip under the complex power supply environment by constructing an integrated test system. Compared with the test mode of relying on manual operation and scattered equipment in the prior art, the embodiment realizes the automation and standardization of the test process by organically combining the functions of power supply, test control, data measurement and chip installation, thereby improving the test efficiency and data reliability.

[0041] Through the cooperative work of multiple modules, overvoltage and undervoltage test of the automobile chip under the complex power supply environment is realized. The power supply module provides adjustable DC power to the to-be-tested chip, which can accurately simulate the continuous change process from normal voltage to overvoltage or undervoltage, thereby covering various abnormal power supply scenes that the chip may encounter in actual operation. The test master module is connected with the power supply module, adjusts the output voltage based on the preset test program, ensures the accuracy and repeatability of voltage change, and avoids the deviation introduced by manual intervention. Further, the test instrument module is connected with the test master module, and is used for measuring the test data of the to-be-tested chip under different voltage conditions. Through real-time communication with the test master module, the test instrument module can automatically trigger the measurement operation at the key node of voltage adjustment, ensure the synchronization of data collection and voltage state, and improve the accuracy and relevance of the test data.

[0042] The test board module is connected with the power supply module and the test instrument module, and is used for installing the chip to be tested. The integrated connection design simplifies the test setting process, ensures the stability and reliability of signal transmission, and facilitates continuous monitoring of chip response during voltage changes. Therefore, the test main control module obtains test data of the power supply module and the test instrument module, and processes and analyzes the test data, and finally generates a test report. By integrating multi-source data and performing automatic analysis, the system can quickly identify the performance trend of the chip under overvoltage and undervoltage conditions, and provide a reliable basis for comprehensive evaluation of chip stability. Specifically, the technical scheme solves the problem of lack of special test equipment for automobile chips in complex power supply environment by constructing an integrated test system, and realizes automation and standardization of the test process. The test data includes electrical parameters, signal waveforms, and logic states; the test instrument module includes an oscilloscope, a logic analyzer, and a multimeter; the test data of the chip to be tested under different voltage conditions is measured using the test instrument module, including: using the oscilloscope to collect the signal waveform of the chip to be tested, and recording the signal waveform data; using the logic analyzer to collect the logic state of the chip to be tested, and recording the logic state data; using the multimeter to collect the electrical parameters of the chip to be tested, and recording the electrical parameter data.

[0043] Specifically, the test data refers to a set of key information used to evaluate the performance of the chip to be tested, which can cover electrical parameters, signal waveforms, and logic states, etc. dimensions, ensuring comprehensive and complete test coverage. Among them, the electrical parameters can be understood as the current, voltage or power characteristics of the chip to be tested under different voltage conditions, which can be obtained by high-precision measurement equipment. The signal waveform is the graphical representation of the output signal of the chip to be tested changing with time, which can reflect the integrity and stability of the signal, and usually needs to be captured by high-speed sampling equipment. The logic state is the digital logic value output by the chip to be tested under a certain voltage condition, which can reflect the correctness of the chip function, and needs to be collected by a special logic monitoring device.

[0044] The test instrument module can be a combination of various professional measurement devices, and its specific implementation can be flexibly adjusted according to test requirements. For example, the oscilloscope can use a digital storage oscilloscope with high bandwidth and high sampling rate to accurately capture rapidly changing signal waveforms. The logic analyzer can select a model that supports multi-channel parallel acquisition to monitor the state changes of multiple logic signals simultaneously. The multimeter can use a digital multimeter with automatic range switching function to adapt to the measurement needs of different electrical parameters. The purpose of introducing these devices is to improve the professionalism and efficiency of the test, and to ensure the accuracy and reliability of data acquisition.

[0045] Specifically, the above scheme achieves comprehensive collection of test data through clear division of labor. First, the oscilloscope is responsible for capturing the signal waveform of the chip under test, its high sampling rate and storage depth can effectively avoid distortion or omission of waveform data, thereby ensuring accurate evaluation of signal integrity. Second, the logic analyzer focuses on collecting the logic state of the chip under test, its multi-channel design and trigger function can reliably monitor complex logic behavior, avoiding state data errors caused by external interference. Finally, the multimeter is used to measure the electrical parameters of the chip under test, its high precision and stability can provide reliable electrical characteristic data, laying a foundation for subsequent performance analysis.

[0046] On this basis, the above scheme significantly improves test efficiency and data quality by assigning different types of data collection tasks to specialized instruments. For example, during the over-voltage test, the oscilloscope can capture the changes in signal waveform in real time, the logic analyzer can monitor the switching of logic state synchronously, and the multimeter can continuously record the fluctuations of electrical parameters. This division of labor and cooperation not only avoids data loss caused by the functional limitations of a single device, but also significantly shortens the test time and improves the systematicness of the overall test.

[0047] Through the above technical scheme, the collection process of test data is optimized, ensuring the accuracy and reliability of the test results. Especially in complex power supply environment, through comprehensive monitoring of electrical parameters, signal waveform and logic state, the performance of the chip under test can be more comprehensively evaluated, thereby providing strong support for the design verification and quality assurance of automotive chips. In some embodiments, before gradually increasing the output voltage of the power supply module, the initial output voltage of the power supply module is set as the normal working voltage of the chip under test, and the measurement parameters and trigger conditions of the test instrument module are set to complete the initialization setting.

[0048] The initial output voltage refers to a reference voltage value set by the power supply module before starting to gradually increase the output voltage, which can be realized by using the standard operating voltage of the chip under test, with the purpose of ensuring that the test starts from the normal working state of the chip and avoiding test deviation caused by abnormal voltage. The measurement parameters can be understood as specific indicators required by the test instrument module when collecting data, such as the time reference of the oscilloscope and the sampling rate of the logic analyzer, which can be realized by manual input or automatic loading of preset configuration files, with the purpose of enabling the instrument to accurately capture test data. The trigger condition refers to the condition under which the test instrument module starts data collection upon a specific event or signal change, which can be realized by voltage threshold, time interval or external signal trigger, with the purpose of ensuring the accuracy and consistency of test data.

[0049] In the above scheme, the initialization setting step is explicitly arranged before gradually increasing the output voltage, and the selection of this timing ensures the stability and reliability of the test process. By setting the initial output voltage of the power supply module to the normal operating voltage of the chip under test, it can effectively avoid the test errors that may be caused by starting from zero voltage or abnormal voltage. At the same time, the measurement parameters and trigger conditions of the test instrument module are configured, so that oscilloscopes, logic analyzers and multimeters and other devices can operate in the best state, thereby accurately recording key data such as signal waveforms, logic states and electrical parameters. These steps together constitute a complete initialization process, laying a solid foundation for subsequent step-by-step voltage increase and decrease tests.

[0050] On this basis, the above scheme is closely combined with the structural design of the aforementioned automotive chip overvoltage test system. By introducing the initialization setting step, not only does it solve the problem of incorrect configuration at the beginning of the test, but it also further improves the accuracy and repeatability of the test results. For example, when the power supply module includes at least two programmable power supplies, the initialization setting can ensure that each power supply outputs from the correct initial voltage, thereby avoiding test failures caused by improper power supply configuration. In addition, the initialization setting can also optimize the working state of the test instrument module, allowing it to efficiently collect data under different voltage conditions, thereby providing a guarantee for generating reliable test reports. In some embodiments, the test method further includes: after calculating the performance indicators of the chip under test under different overvoltage and undervoltage conditions, comparing the data analysis results with the design requirements of the automotive chip to determine whether the chip passes the test.

[0051] The data analysis results refer to the set of performance indicators obtained by processing the test data such as electrical parameters, signal waveforms and logic states collected by the test instrument module. It can include key parameters such as voltage tolerance, signal integrity and logic stability, with the purpose of comprehensively evaluating the performance of the chip under test under overvoltage and undervoltage conditions. Design requirements refer to technical specifications or performance standards that the automotive chip needs to meet in actual application, which can come from industry standards or user demand definitions. The comparison process can be achieved through a pre-set algorithm, such as a threshold comparison method or a statistical analysis method, with the purpose of ensuring the objectivity and accuracy of the evaluation results.

[0052] In the above-mentioned automobile chip overvoltage test system, the test main control module is responsible for calculating performance indicators and comparing the calculation results with preset design requirements. This process first relies on accurate measurement data provided by the test instrument module, including signal waveform data recorded by the oscilloscope, logic state data recorded by the logic analyzer, and electrical parameter data recorded by the multimeter. After processing by the test main control module, these data form performance indicators, which are then compared one by one with corresponding parameters in the design requirements. If all performance indicators meet the design requirements, the chip is determined to pass the test; otherwise, it is determined to fail. This automated judgment mechanism not only avoids delays and errors that may be caused by manual intervention, but also significantly improves test efficiency and reliability. In addition, this mechanism works closely with other modules of the test system, such as the output voltage adjustment function of the power supply module and the adaptation capability of the test board module, to form a complete test process closed loop, thereby achieving efficient and accurate chip qualification evaluation.

[0053] In addition, the embodiment of the present application also provides a control device, comprising: at least one processor; and a memory storing instructions that, when executed by the at least one processor, perform the automobile chip overvoltage test system of the above-mentioned embodiment.

[0054] For example, the processor and the memory in the control device can be connected through a bus. The memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory can include a high-speed random access memory and can also include a non-transitory memory, such as at least one disk memory, a flash memory device, or other non-transitory solid-state memory device. In some embodiments, the memory can optionally include a memory remotely located relative to the control processor, which can be connected to the controller through a network.

[0055] The non-transitory software programs and instructions required to implement the evaluation method of the above-mentioned embodiment are stored in the memory, and when executed by the processor, the evaluation method in the above-mentioned embodiment is executed, for example, the method steps S100 to S600 in the above-mentioned Figure 5 are executed.

[0056] The device embodiments described above are only schematic, and the units described as separate components can or can not be physically separated, i.e., they can be located in one place or distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the present embodiment scheme.

[0057] Since the control device adopts all the technical solutions of the evaluation method of the above-mentioned embodiment, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiment, which will not be repeated here.

[0058] The embodiments of the present application are described in detail above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application.

Claims

1. An automotive chip overvoltage test system, characterized by, include: The power supply module is used to provide adjustable DC power to the chip under test. The test main control module is connected to the power supply module and is used to control the output voltage of the power supply module and adjust the output voltage according to a preset test program; The test instrument module is connected to the test main control module and is used to measure the test data of the chip under test under different voltage conditions; The test board module is connected to the power supply module and the test instrument module, and the test board module is used to install the chip under test. The test control module acquires test data from the power supply module and the test instrument module, processes and analyzes the test data, and generates a test report.

2. The automotive chip overvoltage test system of claim 1, wherein, The power supply module includes at least two programmable power supplies, each of which has an output port for supplying power to the chip under test. The programmable power supplies are communicatively connected to the test main control module.

3. The automotive chip overvoltage test system of claim 1, wherein, The test data includes electrical parameters, signal waveforms, and logic states; the test instrument module includes an oscilloscope, a logic analyzer, and a multimeter; the oscilloscope is used to acquire the signal waveforms of the chip under test, the logic analyzer is used to acquire the logic states of the chip under test, and the multimeter is used to acquire the electrical parameters of the chip under test.

4. The automotive chip overvoltage test system of claim 1, wherein, The test board module includes a motherboard, a daughterboard, and a base. The motherboard is matched and connected to the base, and the daughterboard is connected to the base. The daughterboard is used to adapt to different chips under test.

5. The method of claim 1, wherein the method is applied to the system of any one of claims 1 to 4. The testing method includes: The chip under test is installed on the test board module, and the test board module is connected to the power supply module and the test instrument module. The power supply module is controlled to gradually increase the output voltage, each time increasing by a first preset voltage step and maintaining it for a first preset time, until the overvoltage threshold is reached; At each of the first preset voltage steps, the test instrument module is used to measure the test data of the chip under test under different voltage conditions; The power supply module is controlled to gradually reduce the output voltage, each time by a second preset voltage step, and held for a second preset time, until the undervoltage threshold is reached; At each second preset voltage step, the test instrument module is used to measure the test data of the chip under test under different voltage conditions; The main control module of the test system analyzes and processes the collected test data, calculates the performance indicators of the chip under test under different overvoltage and undervoltage conditions, and generates a test report based on the data analysis results.

6. The automotive chip overvoltage test method of claim 5, wherein, The test data includes electrical parameters, signal waveforms, and logic states; the test instrument module includes an oscilloscope, a logic analyzer, and a multimeter. The measurement of test data of the chip under test under different voltage conditions using the test instrument module includes: The oscilloscope is used to acquire the signal waveform of the chip under test and the signal waveform data is recorded. The logic analyzer is used to collect the logic state of the chip under test and record the logic state data; The electrical parameters of the chip under test are collected using the multimeter, and the electrical parameter data are recorded.

7. The automotive chip overvoltage test method of claim 5, wherein, The testing method also includes: Before the control of the power supply module gradually increases the output voltage, the initial output voltage of the power supply module is set as the normal working voltage of the chip under test, and the measurement parameters and trigger conditions of the test instrument module are set to complete the initialization setting.

8. The automotive chip overvoltage test method of claim 5, wherein, The test method further comprises: After the calculation of the performance indicators of the chip under test under different overvoltage and undervoltage conditions, the data analysis results are compared with the design requirements of the automotive chip to determine whether the chip passes the test.

9. A control device characterized by comprising: Comprise: At least one processor; And a memory storing instructions that, when executed by the at least one processor, perform the automotive chip overvoltage test system of any one of claims 5 to 8.

10. A computer-readable storage medium, characterized in that: The computer readable storage medium stores computer executable instructions for causing a computer to perform the automotive chip overvoltage test system of any one of claims 5 to 8.

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