High-energy photon track detector structure in space environment

Abstract

The invention discloses a high-energy photon track detector structure in a space environment, and belongs to the field of high-energy physics. The high-energy photon track detector structure comprises a cesium iodide module and a silicon micro-strip detection module, the cesium iodide module comprises a cesium iodide crystal; the silicon micro-strip detection module comprises a plurality of detection layers; the detection layer comprises two detection surfaces formed by a plurality of silicon micro-strip detectors which are arranged in parallel; the silicon micro-strip detector comprises a plurality of silicon wafers which are arranged in a strip shape; in the detection layer, the two detection surfaces are arranged in parallel, and the arrangement directions of the silicon micro-strip detectors of the two detection surfaces are perpendicular to each other; the plurality of detection layers are arranged in parallel and are vertically distributed; and the cesium iodide crystal is arranged above the plurality of detection layers. The track detector provided by the invention has high position resolution and can stably operate in a space environment.

Description

Technical Field

[0001] This invention belongs to the field of high-energy physics and relates to a detector structure, particularly a high-energy photon track detector structure in a space environment. Background Technology

[0002] Track detectors play an irreplaceable core role in high-energy physics. By collecting and processing detector signals, they can accurately reconstruct the trajectories of charged particles, offering advantages such as high spatial resolution and strong temporal resolution. Furthermore, track detectors, combined with anti-coincidence detectors, electromagnetic calorimeters, and other detectors, form a detection spectrometer, which can effectively distinguish between electrons, protons, and heavy ions, and measure the energy carried by charged particles.

[0003] In the fields of astronomy and space science, the demand for track detection technology is also increasing. For example, high-performance track detectors can provide technical support and data guidance for searching for evidence of dark matter, detecting high-energy radiation bursts, and detecting cosmic ray sources. However, in the space environment, the types of high-energy particles are more diverse, and the environmental conditions for detectors are much harsher, placing higher technical and performance requirements on the detectors themselves compared to ground-based detection. Therefore, there is an urgent need to design high-performance, highly stable track detectors that can be applied in the space environment to promote the development of related fields. Summary of the Invention

[0004] This invention provides a high-energy photon track detector structure for a space environment to overcome the shortcomings of existing technologies.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: This invention provides a high-energy photon track detector structure for a space environment, comprising a cesium iodide module and a silicon microstrip detector module; the cesium iodide module includes a cesium iodide crystal; the silicon microstrip detector module includes several detector layers; each detector layer includes two detector surfaces composed of several parallel-arranged silicon microstrip detectors; each silicon microstrip detector includes several silicon wafers arranged in strips on the same plane; in each detector layer, the two detector surfaces are arranged in parallel, and the arrangement direction of the silicon microstrip detectors on the two detector surfaces is perpendicular; the several detector layers are arranged in parallel and vertically distributed; the cesium iodide crystal is disposed above the several detector layers.

[0006] To optimize the above technical solution, the specific measures also include: Furthermore, the cesium iodide module also includes several photodetectors; each side of the cesium iodide crystal has several windows, and each of the photodetectors corresponds one-to-one with a window in the cesium iodide crystal. The window is coupled to the photosensitive region of its corresponding photodetector to collect the light signal. By reading out and analyzing the photoelectric signal from the cesium iodide crystal, the conversion of photons within the crystal can be determined.

[0007] Furthermore, the cesium iodide module also includes an encapsulation cover plate, an electromagnetic shielding plate, a readout electronics board, and a bottom support structure; the cesium iodide crystal is fixed to the lower side of the encapsulation cover plate; the electromagnetic shielding plate, the readout electronics board, and the bottom support structure are all arranged in a U-shape, sequentially arranged around the cesium iodide crystal from top to bottom, and fixed to the upper encapsulation cover plate and the lower silicon microstrip detection module; several photodetectors are connected to the readout electronics board, and several photodetectors read simultaneously.

[0008] Furthermore, the encapsulation cover is a carbon fiber honeycomb structure with an internal aluminum alloy honeycomb structure, an external carbon fiber frame, and carbon fiber skin covering the top and bottom; the electromagnetic shielding plate and the bottom support structure are made of aluminum alloy.

[0009] Furthermore, the surface of the cesium iodide crystal is coated with a TiO2 coating for light shielding and moisture protection. The thickness of the TiO2 coating is less than 1 mm, preferably 0.6 mm. No TiO2 coating is applied at the window opening, thus forming a window.

[0010] Furthermore, the cesium iodide crystal is composed of several sub-crystals arranged in the same plane, and the sub-crystals are fixed together by a carbon fiber frame fixed to the underside of the encapsulation cover.

[0011] Furthermore, the silicon microstrip detection module also includes several parallel and vertically distributed support packaging plates; the silicon microstrip detector is fixed to the surface of the support packaging plate; several silicon microstrip detectors of the detection surface are fixed to the same surface of the support packaging plate; the two detection surfaces of the detection layer are fixed to two opposite surfaces of adjacent support packaging plates.

[0012] Furthermore, two adjacent detection surfaces belonging to different detection layers are respectively fixed on two surfaces of the same support packaging plate; and the arrangement direction of the silicon microstrip detectors of the two adjacent detection surfaces belonging to different detection layers is perpendicular; the cesium iodide crystal package is fixed on the upper surface of the uppermost support packaging plate.

[0013] Furthermore, the supporting encapsulation plate is a carbon fiber honeycomb structure with an internal aluminum alloy honeycomb structure, an external carbon fiber frame, and carbon fiber skins covering the top and bottom; the outer side of the supporting encapsulation plate is covered with copper foil.

[0014] Furthermore, the cesium iodide module also includes a cesium iodide enclosure, which is connected to the readout electronics board and is used to process the signals of the photodetector device; the silicon microstrip detection module also includes two silicon microstrip enclosures, which are respectively used to process the signals of the silicon microstrip detectors with different orientations; specifically, the silicon microstrip detector also includes an electronics board and a connector, the connector and several silicon wafers are fixed on the electronics board, and the connector is connected to the silicon microstrip enclosure; the cesium iodide enclosure and the silicon microstrip enclosure are both located on the side of several supporting packaging plates.

[0015] Furthermore, it also includes several main load-bearing structures; the main load-bearing structures are columnar; the several main load-bearing structures are evenly distributed on the sides of the cesium iodide module and the silicon microstrip detection module, and are fixed to the several supporting encapsulation plates; the cesium iodide chassis and the silicon microstrip chassis are fixed to the main load-bearing structures. Specifically, both the cesium iodide module and the silicon microstrip detection module are square, and there are four main load-bearing structures, which are respectively arranged at the four apex corners of the cesium iodide module and the silicon microstrip detection module.

[0016] The beneficial effects of this invention are as follows: This invention provides a high-energy photon track detector structure for space environments, employing a combination of a cesium iodide crystal and a silicon microstrip detector. High-energy photons are converted into electron-positron pairs within the cesium iodide crystal, leaving track position information in the silicon microstrip detector. Based on the track information of the electron-positron pairs, the direction of primordial photons can be further detected. This detector structure is stable, meeting the requirements of mechanical, temperature control, and vacuum conditions in space environments, while ensuring that detector performance is not affected or lost; that is, it possesses high position resolution while operating stably in space.

[0017] Specifically, silicon microstrip detectors can only measure charged particles, while photons are uncharged. Therefore, this invention uses a cesium iodide crystal as a converter to first convert high-energy photons into electron pairs, which are then detected by the silicon microstrip detector. The cesium iodide crystal has multiple windows on each side and is read out using photodetectors, enabling the determination of whether high-energy photons have undergone electron-pair conversion. This invention uses a multi-layered stack of silicon microstrip detectors to detect particle tracks. The invention employs a carbon fiber honeycomb structure, which has a low carbon atom mass, making it less likely to interfere with particle trajectories. While ensuring structural strength, it reduces the mass of the track, preventing particle scattering and enabling effective application in space environments. This invention uses a TiO2 coating to protect and shield the cesium iodide crystal, and encapsulates it with a cover plate and a carbon fiber frame. The sides are protected with an aluminum alloy structure, which also provides electromagnetic shielding for the photodetectors. The chassis is located on the side of the detector, and the silicon microstrip detectors on each detection surface are connected to the electronics board in the readout box via connectors through the gaps in the supporting encapsulation plate. The overall structure is compact, with good electromagnetic shielding, facilitating application in space environments. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the track detector structure; Figure 2 This is an exploded view of the track detector structure; Figure 3 This is an exploded view of part of the cesium iodide module; Figure 4 This is a schematic diagram of the structure of a partial silicon microstrip detection module; Figure 5 This is a schematic diagram of a track detector; The labels in the attached diagram are as follows: 1. Cesium iodide module; 11. Cesium iodide crystal; 111. Window; 12. Photodetector; 13. Encapsulation cover; 131. Carbon fiber frame; 14. Electromagnetic shielding plate; 15. Readout electronics board; 16. Bottom support structure; 17. Cesium iodide chassis; 2. Silicon microstrip detection module; 21. Detection layer; 211. Detection surface; 2111. Silicon microstrip detector; 22. Supporting encapsulation plate; 221. Copper sheet; 23. Silicon microstrip chassis; 3. Main load-bearing structure. Detailed Implementation

[0019] The specific embodiments of the present invention will be described below with reference to the accompanying drawings.

[0020] like Figures 1-4As shown, this invention provides a high-energy photon track detector structure for a space environment, including a cesium iodide module 1 and a silicon microstrip detector module 2. The cesium iodide module 1 includes a cesium iodide crystal 11. The silicon microstrip detector module 2 includes several detector layers 21. Each detector layer 21 includes two detector surfaces 211 composed of several parallel-arranged silicon microstrip detectors 2111. Each silicon microstrip detector 2111 comprises several silicon wafers arranged in strips on the same plane. In each detector layer 21, the two detector surfaces 211 are arranged in parallel, and the arrangement direction of the silicon microstrip detectors 2111 on the two detector surfaces 211 is perpendicular. The several detector layers 21 are arranged in parallel and vertically distributed. The cesium iodide crystal 11 is disposed above the several detector layers 21.

[0021] like Figure 5 As shown, high-energy photons pass through the cesium iodide crystal 11, depositing energy within it and converting into electron-positron pairs. These electron-positron pairs then pass through the silicon microstrip module, leaving positional information. Specifically, two orthogonal detector surfaces 211 form a detector layer 21, enabling the reading of two-dimensional position coordinates on a plane. Multiple detector layers 21, vertically distributed, allow for the acquisition of three-dimensional position coordinates. Furthermore, the stacking of multiple detector layers 21 effectively improves the angular resolution of the silicon microstrip detector module 2, enhancing the track detector's performance. By detecting the tracks of electron-positron pairs, the direction of primordial photons is detected.

[0022] Among them, such as Figure 3 As shown, the cesium iodide module 1 also includes several photodetectors 12. Several windows 111 are formed on each side of the cesium iodide crystal 11, and each photodetector 12 corresponds one-to-one with a window 111 of the cesium iodide crystal 11. Each window 111 is coupled to the photosensitive region of its corresponding photodetector 12 to collect light signals. By reading out and analyzing the photoelectric signals from the cesium iodide crystal 11, the conversion of photons within the crystal can be effectively determined. The photodetectors 12 can be avalanche photodiodes.

[0023] Specifically, such as Figure 3 As shown, the cesium iodide module 1 also includes an encapsulation cover plate 13, an electromagnetic shielding plate 14, a readout electronics board 15, and a bottom support structure 16. The cesium iodide crystal 11 is fixed to the underside of the encapsulation cover plate 13. The electromagnetic shielding plate 14, the readout electronics board 15, and the bottom support structure 16 are all arranged in a U-shape, sequentially positioned around the cesium iodide crystal 11 from top to bottom, and fixed to the upper encapsulation cover plate 13 and the lower silicon microstrip detection module 2. Several photodetectors 12 are connected to the readout electronics board 15, and the several photodetectors 12 read out simultaneously.

[0024] The encapsulation cover 13 is a carbon fiber honeycomb structure with an internal aluminum alloy honeycomb structure, an external carbon fiber frame, and carbon fiber skins covering the top and bottom. The electromagnetic shielding plate 14 and the bottom support structure 16 are made of aluminum alloy.

[0025] The surface of the cesium iodide crystal 11 is coated with a TiO2 coating for protection, preventing the cesium iodide crystal 11 from deliquescing. The thickness of the TiO2 coating is preferably 0.6 mm. There is no TiO2 coating at the window opening, thus forming window 111.

[0026] The cesium iodide crystal 11 is composed of several sub-crystals arranged in the same plane, and the sub-crystals are encapsulated and fixed together by a carbon fiber frame 131 fixed to the underside of the encapsulation cover 13. Figure 3 As shown, in this embodiment, the cesium iodide crystal 11 is composed of four sub-crystals. A cross-shaped carbon fiber frame 131 is fixed on the lower side of the encapsulation cover plate 13, and the four sub-crystals are encapsulated and fixed on the carbon fiber frame 131.

[0027] like Figure 1 , Figure 2 and Figure 4 As shown, the silicon microstrip detection module 2 also includes several parallel and vertically distributed support packaging plates 22. Silicon microstrip detectors 2111 are fixed to the surface of the support packaging plates 22. Several silicon microstrip detectors 2111 on the detection surface 211 are fixed to the same surface of the support packaging plate 22. The two detection surfaces 211 of the detection layer 21 are fixed to two opposite surfaces of adjacent support packaging plates 22.

[0028] Two adjacent detection surfaces 211 belonging to different detection layers 21 are respectively fixed on two surfaces of the same support package plate 22. Furthermore, the silicon microstrip detectors 2111 of the two adjacent detection surfaces 211 belonging to different detection layers 21 are arranged perpendicularly to facilitate signal readout. A cesium iodide crystal 11 is packaged and fixed on the upper surface of the uppermost support package plate 22.

[0029] The supporting encapsulation board 22 is a carbon fiber honeycomb structure with an internal aluminum alloy honeycomb structure, an external carbon fiber frame, and carbon fiber skin covering the top and bottom.

[0030] The outer surface of the supporting encapsulation board 22 is covered with copper foil 221.

[0031] like Figure 1 and Figure 2As shown, the cesium iodide module 1 also includes a cesium iodide enclosure 17, which is connected to the readout electronics board 15 and is used to process the signals of the photodetector device 12. The silicon microstrip detection module 2 also includes two silicon microstrip enclosures 23, which are used to process the signals of silicon microstrip detectors 2111 with different orientations. Specifically, the silicon microstrip detector 2111 also includes an electronics board and a connector. The connector and several silicon wafers are fixed on the electronics board, and the connector is connected to the silicon microstrip enclosure 23. Both the cesium iodide enclosure 17 and the silicon microstrip enclosure 23 are located on the sides of several supporting packaging plates 22.

[0032] like Figure 1 and Figure 2 As shown, the track detector also includes several main load-bearing structures 3. The main load-bearing structures 3 are columnar. These main load-bearing structures 3 are evenly distributed on the sides of the cesium iodide module 1 and the silicon microstrip detection module 2, and are fixed to several supporting encapsulation plates 22. The cesium iodide enclosure 17 and the silicon microstrip enclosure 23 are fixed to the main load-bearing structures 3. In this embodiment, both the cesium iodide module 1 and the silicon microstrip detection module 2 are square, and there are four main load-bearing structures 3, respectively arranged at the four apex corners of the cesium iodide module 1 and the silicon microstrip detection module 2.

[0033] Both the encapsulation cover plate 13 of the cesium iodide module 1 and the support encapsulation plate 22 of the silicon microstrip detector module 2 adopt a carbon fiber honeycomb structure. The carbon fiber frame around the perimeter can improve the structural strength, while the internal aluminum alloy honeycomb structure can increase the gap between particles, reduce the mass, and improve the structural strength. The carbon fiber skins attached to the upper and lower surfaces can ensure the flatness of the structure. This carbon fiber honeycomb structure can reduce the mass as much as possible in the trajectory of particles, thereby effectively ensuring the performance of the detector and improving the structural stability of the detector, ensuring its stable operation in the space environment.

[0034] The carbon fiber honeycomb structure is connected to the side chassis and fixed by the main load-bearing structure 3, forming a whole detector with high stability and structural rigidity, effectively coping with the complex mechanical conditions in the space environment. The cesium iodide crystal 11 and silicon microstrip detector 2111, along with other electronic components, are connected to the chassis and main load-bearing structure 3 via metal structures (electromagnetic shielding plate 14, bottom support structure 16, and copper foil 221 on the outer side of the support encapsulation plate 22). This provides electromagnetic shielding to prevent interference with the analog signal, while also transferring the heat generated by power consumption during operation to the outside, maintaining a constant detector temperature and ensuring detector performance, thus effectively coping with the complex temperature conditions in the space environment.

[0035] like Figure 5As shown, the track detector operates as follows: High-energy photons pass through the detector, first through the cesium iodide crystal 11, where energy is deposited, generating scintillation fluorescence, which is read out by the avalanche diode on the side, and simultaneously converted into electron-positron pairs. After passing through the crystal, the electron-positron pairs strike the silicon microstrip detector 2111, generating a current signal, leaving track information in the multi-layered stacked silicon microstrip detector 2111. By combining and analyzing the position information of the multi-layered detector layers 21, the direction of the high-energy photon incident can be determined.

[0036] In this invention, cesium iodide crystal 11 is used as a photon converter. This crystal is a scintillator light-emitting material that can be in an excited state when particles generate energy deposition. After de-excitation, it generates scintillating fluorescence to release energy. The fluorescence propagates to the surroundings, and some photons enter the photodetector device 12 coupled with the windowed area of ​​the crystal. They are received and read out by the photosensitive area to realize photoelectric information conversion, thereby realizing the reading of the deposited energy information.

[0037] The silicon microstrip detector 2111 of this invention has a structure with multiple sets of microstrips arranged in parallel. Charged particles hitting different microstrips generate corresponding current signals. By recording these current signals, the position information of the charged particle in the plane can be determined. Multiple silicon microstrip detectors 2111 arranged in parallel form a larger detection surface 211, further increasing the detection area. Two detection surfaces 211 are orthogonally arranged along the X and Y axes, forming a large detection layer 21, enabling the detection of coordinates in the plane. Multiple sets of detection layers 21 are stacked to obtain three-dimensional coordinates and reconstruct the trajectory position of the incident particle.

[0038] In this invention, unless otherwise stated, scientific and technical terms used herein have the meanings commonly understood by those skilled in the art.

[0039] It should be noted that the terms such as "upper", "lower", "left", "right", "front", and "back" used in the invention are only for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0040] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-energy photon track detector structure in a space environment, comprising: a cesium iodide module and a silicon microstrip detection module; the cesium iodide module comprises a cesium iodide crystal; the silicon microstrip detection module comprises a plurality of detection layers; each detection layer comprises two detection surfaces formed by a plurality of parallel silicon microstrip detectors; each silicon microstrip detector comprises a plurality of silicon wafers arranged in a strip shape; in each detection layer, the two detection surfaces are arranged in parallel, and the arrangement directions of the silicon microstrip detectors of the two detection surfaces are perpendicular; a plurality of detection layers are arranged in parallel and vertically distributed; and the cesium iodide crystal is arranged above the plurality of detection layers. 2.The high-energy photon track detector structure in a space environment according to claim 1, wherein: the cesium iodide module further comprises a plurality of photodetector devices; each side of the cesium iodide crystal is provided with a plurality of windows; each photodetector device corresponds to one window of the cesium iodide crystal; the window and the photosensitive region of the corresponding photodetector device are coupled to collect light signals. 3.The high-energy photon track detector structure in a space environment according to claim 2, wherein: the cesium iodide module further comprises a packaging cover plate, an electromagnetic shielding plate, a readout electronics board and a bottom support structure; the cesium iodide crystal is fixed to the lower side of the packaging cover plate; the electromagnetic shielding plate, the readout electronics board and the bottom support structure are arranged in a back-to-back structure, and are sequentially arranged around the cesium iodide crystal from top to bottom, and are fixed to the packaging cover plate on the top and the silicon microstrip detection module on the bottom; each photodetector device is connected to the readout electronics board, and each photodetector device is read simultaneously. 4.The high-energy photon track detector structure in a space environment according to claim 3, wherein: the packaging cover plate is a carbon fiber honeycomb structure with an aluminum alloy honeycomb structure inside, a carbon fiber frame outside and carbon fiber skin on the top and bottom; the electromagnetic shielding plate and the bottom support structure are made of aluminum alloy. 5.The high-energy photon track detector structure in a space environment according to claim 1, wherein: the surface of the cesium iodide crystal is coated with a TiO2 coating. 6.The high-energy photon track detector structure in a space environment according to claim 2, wherein: the silicon microstrip detection module further comprises a plurality of support packaging plates arranged in parallel and vertically distributed; each silicon microstrip detector is fixed to the surface of a support packaging plate; and the silicon microstrip detectors of the two detection surfaces of each detection layer are fixed to the same surface of a support packaging plate, and the two detection surfaces of each detection layer are fixed to the opposite surfaces of two adjacent support packaging plates. 7.The high-energy photon track detector structure in a space environment according to claim 6, wherein: two adjacent detection surfaces of different detection layers are fixed to the two surfaces of the same support packaging plate, respectively; and the arrangement directions of the silicon microstrip detectors of the two adjacent detection surfaces of different detection layers are perpendicular. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The cesium iodide crystal is fixed on the upper surface of the uppermost support packaging plate.

8. The high-energy photon track detector structure in a space environment according to claim 6, characterized in that: The support packaging plate is a carbon fiber honeycomb structure with an aluminum alloy honeycomb structure inside, a carbon fiber frame outside, and carbon fiber skin on the top and bottom. The outer side of the support packaging plate is covered with copper.

9. The high-energy photon track detector structure in a space environment according to claim 6, characterized in that: The cesium iodide module further comprises a cesium iodide case for processing signals of the photoelectric detection device; The silicon microstrip detection module further comprises two silicon microstrip cases for processing signals of the silicon microstrip detectors arranged in different directions respectively; The cesium iodide case and the silicon microstrip case are located on the side of the support packaging plates.

10. The high-energy photon track detector structure in a space environment according to claim 9, characterized in that: Further comprising a plurality of main load-bearing structures; The main load-bearing structures are columnar; The main load-bearing structures are evenly distributed on the side of the cesium iodide module and the silicon microstrip detection module and are fixed with the support packaging plates; The cesium iodide case and the silicon microstrip case are fixed with the main load-bearing structures.

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