Intelligent regulation and control method, device and equipment for etching bath solution and storage medium

Abstract

The invention discloses an etching bath solution intelligent regulation and control method, device and equipment and a storage medium. The method comprises the following steps: acquiring real-time data of an etching bath solution through an industrial sensor; performing deviation analysis on the real-time data of the etching bath solution based on the trained intelligent regulation and control model to obtain a corresponding real-time analysis result of the etching bath solution; a corresponding strategy generation mode is adapted according to the real-time analysis result of the etching bath solution, and an intelligent regulation and control strategy is obtained; and driving corresponding regulation and control equipment to carry out production regulation and control on the etching bath solution according to the intelligent regulation and control strategy. Through real-time and automatic monitoring and intelligent regulation and control of the etching bath solution, the problems of high subjectivity, lack of quantitative standards, regulation and control lag and the like caused by a traditional manual regulation and control mode are effectively solved, so that the etching yield of products and the controllability of the production process are greatly improved.

Description

Technical Field

[0001] This application relates to the technical field of metal electrochemical etching, and in particular to a method, apparatus, equipment and storage medium for intelligent control of etching bath solution. Background Technology

[0002] Etching is a core process in manufacturing, and the etching solution, as the most important element in this process, directly determines the etching precision, linewidth uniformity, and final yield of the product. Currently, the industry generally relies on the operator's experience to monitor and maintain the state of the etching solution. This method is highly subjective, lacks quantitative standards, and the slow control process can easily lead to a decrease in product yield.

[0003] To overcome the above limitations, there is an urgent need for an intelligent control method for etching bath solutions that can operate autonomously, so as to achieve real-time monitoring and precise control of the etching bath solutions, thereby improving production yield and efficiency. Summary of the Invention

[0004] This application provides a method, apparatus, device, and storage medium for intelligent control of etching bath solution, in order to solve the technical problems of lag in the control of etching ion concentration and fluctuation in the yield of etched products caused by reliance on manual experience.

[0005] The first aspect of this application provides a method for intelligent control of etching bath solution, including: Real-time data of the etching bath solution is acquired through industrial sensors; Based on the trained intelligent control model, deviation analysis is performed on the real-time data of the etching bath solution to obtain the corresponding real-time analysis results of the etching bath solution. Based on the real-time analysis results of the etching bath solution, an intelligent control strategy is obtained by adapting the corresponding strategy generation method. The intelligent control strategy drives the corresponding control equipment to regulate the production of the etching bath solution.

[0006] In some embodiments, deviation analysis is performed on the real-time data of the etching bath based on the trained intelligent control model to obtain the corresponding real-time analysis results of the etching bath, including: The real-time deviation results are obtained by calculating the deviation of the etching bath solution based on the trained intelligent control model. The real-time deviation results are compared and analyzed with the preset deviation values, and the real-time analysis results of the first type of etching bath solution are obtained when the real-time deviation results exceed the preset deviation values. When the real-time deviation result does not exceed the preset deviation value, the real-time analysis result of the second type of etching bath solution is obtained; When the real-time deviation results do not meet the deviation value data standard, the real-time analysis results of the third type of etching bath solution are obtained.

[0007] In some embodiments, an intelligent control strategy is obtained by adapting the corresponding strategy generation method based on the real-time analysis results of the etching bath solution, including: When the real-time analysis result of the etching bath solution is the first type of real-time analysis result of the etching bath solution, the control parameters are obtained, and the strategy is generated based on the control parameters and the real-time deviation result to obtain the intelligent control strategy. When the real-time analysis result of the etching bath solution is the second type of real-time analysis result of the etching bath solution, a strategy is generated based on the real-time data of the etching bath solution to obtain an intelligent control strategy. When the real-time analysis result of the etching bath solution is the third type of real-time analysis result of the etching bath solution, an abnormal alarm is issued, and a strategy is generated based on the real-time data of the etching bath solution to obtain an intelligent control strategy.

[0008] In some embodiments, when the real-time analysis result of the etching bath solution is the first type of real-time analysis result of the etching bath solution, control parameters are obtained, and a strategy is generated based on the control parameters and the real-time deviation result to obtain an intelligent control strategy, including: When the real-time analysis result of the etching bath solution is the first type of real-time analysis result of the etching bath solution, the control parameters are obtained; A strategy is generated based on real-time deviation results to obtain an intelligent control strategy. When the real-time deviation result is positive, the intelligent control strategy is to first calculate the water replenishment amount based on the control parameters, then dilute the etching bath solution according to the calculated water replenishment amount, and finally update the trained intelligent control model parameters according to the diluted etching bath solution data. When the real-time deviation result is negative, the intelligent control strategy is to first calculate the replenishment amount based on the control parameters, then replenish the etching tank solution according to the calculated replenishment amount, and finally update the trained intelligent control model parameters based on the etching tank solution data after replenishment.

[0009] In some embodiments, when the real-time analysis result of the etching bath solution is the first type of real-time analysis result of the etching bath solution, the control parameters are obtained, including: When the real-time analysis result of the etching bath solution is the first type of real-time analysis result of the etching bath solution, feature extraction is performed on the real-time data of the etching bath solution to obtain the real-time feature data of the etching bath solution. The data matching results are obtained by matching the real-time characteristic data of the etching bath solution with the matching database. When the data matching judgment result is qualified, the pre-stored coefficient is called according to the real-time characteristic data of the etching bath solution, and the control parameters are generated according to the pre-stored coefficient. When the data matching judgment result is unqualified, a new drug model is obtained, and control parameters are generated based on the new drug model.

[0010] In some embodiments, when the data matching judgment result is unqualified, a new drug model is obtained, and control parameters are generated based on the new drug model. The method is characterized by including: When the data matching judgment result is unqualified, the monitoring data of the etching bath solution within a preset time period is obtained; A new reagent model is constructed based on the monitoring data of the etching bath solution within a preset time period; Control parameters are generated based on the newly established drug model.

[0011] In some embodiments, when the real-time analysis result of the etching bath solution is a third-class etching bath solution real-time analysis result, an abnormal alarm is issued, and a strategy is generated based on the real-time data of the etching bath solution to obtain an intelligent control strategy, including: When the real-time analysis result of the etching bath solution is the third type of real-time analysis result of the etching bath solution, an abnormal alarm is issued and an abnormality judgment is made based on the real-time data of the etching bath solution to obtain the real-time abnormal result of the etching bath solution. Based on the real-time abnormal results of the etching bath solution, a strategy is generated to obtain the corresponding intelligent control strategy. When the real-time abnormal result of the etching bath solution is a first-class real-time abnormal result, the intelligent control strategy is to dilute and cool the etching bath solution, record the data in the log, and then perform the corresponding production operation based on the state of the etching bath solution after the treatment. When the real-time abnormal result of the etching bath solution is a second type of real-time abnormal result, the intelligent control strategy is to replenish the etching bath solution and shut down the machine, record the log, and then perform the corresponding production operation based on the status of the etching bath solution after the treatment. When the real-time abnormal result of the etching bath solution is a third type of real-time abnormal result, the intelligent control strategy is to switch the probe of the intelligent control equipment to the backup probe, record the log, and then perform the corresponding production operation based on the intelligent control equipment after the probe switch.

[0012] A second aspect of this application discloses an intelligent control device for etching bath solution, wherein the device is connected to at least one sensor and at least one control actuator on the etching bath, and the device comprises: The data acquisition module has its input end connected to the sensor for communication, and is used to acquire real-time monitoring data of the etching bath solution; The data processing module, whose input end is connected to the output end of the data acquisition module, is used to compare real-time monitoring data with preset target values ​​and calculate real-time deviation data. The intelligent analysis module has its input end connected to the output end of the data processing module. The intelligent analysis module has a built-in trained intelligent control model, which is used to receive real-time deviation data and output control commands. The control signal output module has its input end connected to the output end of the intelligent analysis module, and its output end is used to connect to the control actuator to convert the control command into a control signal that drives the control actuator.

[0013] A third aspect of this application provides an electronic device comprising: a memory; a processor; and one or more computer programs stored in the memory, the one or more computer programs including instructions that, when executed by the processor, enable the intelligent control method for etching bath solution as described above.

[0014] A fourth aspect of this application provides a computer-readable storage medium storing a computer program, wherein the storage medium stores an intelligent control program for etching bath solution, and when the intelligent control program for etching bath solution is executed by a processor, it implements the steps of the intelligent control method for etching bath solution as described above.

[0015] The intelligent control method, apparatus, equipment, and storage medium for etching bath solutions provided in this application acquire real-time data of the etching bath solution through industrial sensors; perform deviation analysis on the real-time data of the etching bath solution based on a trained intelligent control model to obtain corresponding real-time analysis results; adapt the corresponding strategy generation method according to the real-time analysis results of the etching bath solution to obtain an intelligent control strategy; and drive the corresponding control equipment to control the production of the etching bath solution according to the intelligent control strategy. This application effectively overcomes the problems of strong subjectivity, lack of quantitative standards, and control lag caused by traditional manual control methods through real-time, automated monitoring and intelligent control of the etching bath solution, thereby significantly improving the product etching yield and the controllability of the production process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the intelligent control device for etching bath solution provided in the embodiments of this application.

[0017] Figure 2 This is a schematic flowchart of the intelligent control method for etching bath solution provided in the embodiments of this application.

[0018] Figure 3 yes Figure 2 A schematic diagram of the sub-process of step S20.

[0019] Figure 4 yes Figure 2 A schematic diagram of the sub-process of step S30.

[0020] Figure 5 yes Figure 4 A schematic diagram of the sub-process of step S31.

[0021] Figure 6 yesFigure 4 A schematic diagram of the sub-process of step S33.

[0022] Figure 7 This is a structural block diagram of the intelligent control device for etching bath solution provided in the embodiments of this application.

[0023] Figure 8 This is another structural block diagram of the intelligent control device for etching bath provided in the embodiments of this application. Detailed Implementation

[0024] It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application.

[0025] In existing technologies, etching is a core process in manufacturing fields such as microelectronics, printed circuit boards, and precision metal processing. Its quality directly determines the pattern accuracy, linewidth consistency, and final yield of the product. The etching bath, as the most important element in the etching process, has a concentration that is a key parameter affecting the etching rate and uniformity. Currently, the industry generally relies on operators periodically sampling and offline analysis of the etching bath, combined with personal experience for manual replenishment or adjustment. This approach has significant limitations: firstly, it is highly subjective, lacks reliable and reproducible quantitative standards, and is prone to human error; secondly, due to the significant time delay between detection and control, it is difficult to respond to dynamic changes in the bath in real time, often causing the etching process to deviate from the optimal process window, resulting in insufficient or over-etching, increased linewidth deviation, and consequently, batch-to-batch quality fluctuations and decreased yield.

[0026] Therefore, in order to solve the above-mentioned technical bottlenecks, this application provides an intelligent control method, device, equipment and storage medium for etching bath solution. It can overcome the problems of strong subjectivity, lack of quantitative standards and control lag caused by traditional manual control methods by real-time, automated monitoring and intelligent control of etching bath solution, thereby greatly improving product yield and controllability of production process.

[0027] Please refer to Figure 1 , Figure 1 This is a schematic flowchart illustrating the intelligent control method for etching bath solution provided in an embodiment of this application. In some embodiments, the intelligent control method for etching bath solution may be... Figure 1 The electronic device 1000 in the system performs this operation. Specifically, for example... Figure 1 As shown, the intelligent control method for etching bath solution includes the following steps: Step S10: Obtain real-time data of the etching bath solution using industrial sensors.

[0028] It is understood that, in some embodiments, the process of acquiring real-time data of the etching bath solution through industrial sensors is achieved by installing a series of dedicated industrial sensors inside the etching tank or on the circulation pipeline. These sensors can convert the chemical (such as ion concentration in the etching bath solution, pH value, etc.) and physical parameters (such as the aging degree of the etching bath solution detection probe, etc.) monitored in the etching bath solution into measurable electrical signals, i.e., real-time data of the etching bath solution. These sensors include, but are not limited to, four-electrode sensors, ORP sensors, pH sensors, ion-selective electrode sensors, temperature sensors, and liquid level sensors.

[0029] It should be noted that, in some embodiments, the real-time data of the etching bath includes, but is not limited to, the etching bath temperature, the ion concentration in the etching bath, the aging degree of the etching bath detection probe, and the pH value of the etching bath.

[0030] Step S20: Based on the trained intelligent control model, perform deviation analysis on the real-time data of the etching bath solution to obtain the corresponding real-time analysis results of the etching bath solution.

[0031] It is understood that, in some embodiments, the trained intelligent control model is an algorithm engine that learns and internalizes the complex nonlinear relationship between etching process parameters and optimal control strategies through historical production data. This engine can be used for real-time analysis and decision-making based on real-time data from the etching bath. Historical production data is a multi-dimensional, timestamped dataset, including but not limited to: status data (readings from various industrial sensors describing the process status), such as etching bath temperature and pH value; operational data (recording control actions), such as the type and dosage of added reagents and adjustments to temperature setpoints; and result data (quality indicators reflecting the control effect), such as etching rate and yield. The trained intelligent control model acquires, analyzes, and controls the real-time data of the etching bath in a cyclical manner, with the cycle time set by the user according to requirements, such as 5 seconds or 10 seconds.

[0032] It should also be noted that, in some embodiments, the trained intelligent control model includes, but is not limited to, a decision tree-PID hybrid algorithm model or an LSTM (Long Short-Term Memory) model.

[0033] refer to Figure 2 , Figure 2 yes Figure 1 A schematic diagram of the sub-process of step S20. In some embodiments, the corresponding real-time analysis results of the etching bath solution can be obtained based on steps S21 to S23.

[0034] Step S21: Calculate the deviation of the etching bath solution based on the real-time data of the trained intelligent control model to obtain the real-time deviation result.

[0035] It is understood that, in some embodiments, the process of calculating the deviation based on the real-time data of the etching bath solution using the trained intelligent control model includes, but is not limited to, reading real-time temperature data, concentration data of each ion component, and aging degree data of the detection probe from the real-time data of the etching bath solution, and then calculating the deviation based on these read data. The deviation calculation formula is as follows: △k=|k-k0|;k=Σ(a i *C i )+β*T+γ*η; Where △k is the deviation calculation result, k0 is the historical conductivity value calculated during the previous test, k is the real-time conductivity value during this test, T is the real-time temperature, and C is the temperature. i For each ionic component, a i β and γ are the control parameters that the trained intelligent control model matches and reads based on the real-time data of the etching bath solution.

[0036] Step S22: Compare and analyze the real-time deviation results with the preset deviation values, and obtain the real-time analysis results of the first type of etching solution when the real-time deviation results exceed the preset deviation values.

[0037] It is understood that in some embodiments, the preset deviation value is a user-defined, acceptable maximum allowable deviation range, such as 2%, 5%, or 10%, serving as a quantified tolerance standard. This standard can be used to determine whether the real-time data of the etching bath is in a normal and controllable state and to determine which intelligent control strategy to employ for subsequent processing. For example, in some embodiments, the preset deviation value can be set to 2%. That is, when the real-time deviation result exceeds 2%, the first type of real-time analysis result of the etching bath is obtained, indicating that the ion concentration gradient in the etching bath has become unbalanced, and corresponding ion concentration control measures need to be taken for subsequent processing.

[0038] Step S23: When the real-time deviation result does not exceed the preset deviation value, the real-time analysis result of the second type of etching bath solution is obtained.

[0039] It is understood that in some embodiments, when the real-time deviation result does not exceed the preset deviation value, the real-time analysis result of the second type of etching bath solution can be obtained, which means that the ion concentration gradient in the etching bath solution is still in a balanced state and can normally meet the process environment requirements of the etching operation, and the etching process can continue.

[0040] Step S24: When the real-time deviation result does not meet the deviation value data standard, the real-time analysis result of the third type of etching bath solution is obtained.

[0041] It is understood that in some embodiments, when collecting real-time data of the etching bath solution, the accuracy of the collected data may decrease or become invalid due to damage to the sensor probe. This may result in the real-time deviation results not meeting the normal deviation value standard. In such cases, a third type of real-time analysis result for the etching bath solution can be obtained. The normal deviation value standard refers to the data difference between the real-time deviation result and its target deviation value being within an acceptable and expected range, meeting quality requirements. For example, the normal deviation value standard could be 1% to 10% or 1% to 15%.

[0042] Step S30: Based on the real-time analysis results of the etching bath solution, adapt the corresponding strategy generation method to obtain the intelligent control strategy.

[0043] It is understood that in some embodiments, different etching bath states correspond to different real-time analysis results of the etching bath, thereby generating corresponding intelligent control strategies to enable the etching bath to be restored to a state where it can perform normal etching operations. Here, the intelligent control strategy refers to a set of optimized control instructions automatically generated and executed by the control unit in the intelligent etching bath control device.

[0044] refer to Figure 3 , Figure 3 yes Figure 1 A schematic diagram of the sub-process of step S30. In some embodiments, an intelligent control strategy can be obtained based on steps S31 to S33.

[0045] Step S31: When the real-time analysis result of the etching bath solution is the first type of real-time analysis result of the etching bath solution, obtain the control parameters, and generate a strategy based on the control parameters and the real-time deviation result to obtain an intelligent control strategy.

[0046] It is understood that in some embodiments, when the real-time analysis result of the etching bath solution is the first type of real-time analysis result (i.e., the real-time deviation value is greater than the preset deviation value), it indicates that the ion balance in the etching bath solution has been broken. It is necessary to dilute the solution with pure water or inject a specific etching concentrate to increase the corresponding ion concentration in order to re-establish the ion balance in the etching bath solution. The preset deviation value can be set to 2%, meaning that when the real-time deviation value is greater than 2%, the real-time analysis result of the etching bath solution is the first type of real-time analysis result.

[0047] refer to Figure 4 , Figure 4 yes Figure 3 A schematic diagram of the sub-process of step S31. In some embodiments, an intelligent control strategy can be obtained based on steps S311 to S314.

[0048] Step S311: When the real-time analysis result of the etching bath solution is the same as that of the first type of etching bath solution, obtain the control parameters.

[0049] It is understood that in some embodiments, the process of obtaining control parameters is achieved through a multi-agent matching algorithm in a trained intelligent control model, which can generate corresponding control parameters based on the real-time data of the current etching bath solution.

[0050] Furthermore, when the real-time analysis result of the etching bath solution is the first type of etching bath solution real-time analysis result, control parameters are obtained, including: when the real-time analysis result of the etching bath solution is the first type of etching bath solution real-time analysis result, feature extraction is performed on the real-time data of the etching bath solution to obtain real-time feature data of the etching bath solution; matching judgment is performed between the real-time feature data of the etching bath solution and the matching database to obtain the corresponding data matching judgment result; when the data matching judgment result is qualified, pre-stored coefficients are called according to the real-time feature data of the etching bath solution, and control parameters are generated according to the pre-stored coefficients; when the data matching judgment result is unqualified, a new reagent model is obtained, and control parameters are generated based on the new reagent model.

[0051] It is understood that in some embodiments, the process of obtaining control parameters includes, but is not limited to, first obtaining the corresponding KT curve (conductivity-temperature curve) based on real-time data acquisition of the etching bath solution, then performing Fourier feature extraction based on the KT curve to obtain real-time feature data of the etching bath solution, and finally matching the real-time feature data of the etching bath solution with pre-stored etching solution ion migration fingerprint data in the matching database. When the real-time feature data of the etching bath solution can find the corresponding etching solution ion migration fingerprint data in the matching database, it indicates a successful match, and the corresponding pre-stored coefficients can be called to generate control parameters; when the real-time feature data of the etching bath solution cannot find the corresponding etching solution ion migration fingerprint data in the matching database, it indicates a failed match, and the corresponding control parameters need to be generated through the newly acquired reagent model. The etching solution ion migration fingerprint data is a dynamic identifier composed of various etching solution ion concentration change patterns and their derived features, used for matching and judging real-time feature data. Among them, the newly acquired reagent model is a machine-trained functional sub-module in the trained intelligent control model, responsible for refined decision-making. The newly established reagent model can construct a dose-effect mapping relationship based on historical etching bath state data over a certain period of time, and then generate corresponding control parameters based on the real-time characteristic data of the etching bath.

[0052] Furthermore, when the data matching judgment result is unqualified, a new reagent model is obtained, and the control parameters are generated based on the new reagent model, including: when the data matching judgment result is unqualified, obtaining the monitoring data of the etching bath solution within a preset time period; constructing a new reagent model based on the monitoring data of the etching bath solution within the preset time period; and generating control parameters based on the new reagent model.

[0053] It is understood that, in some embodiments, the monitoring data of the etching bath solution within a preset time period refers to the time-series data of the etching bath solution systematically collected within a complete production cycle or a preset process window, including but not limited to the chemical state data of the bath solution itself, process and performance data, external intervention and operation data, and environmental and equipment operation data within the preset time period.

[0054] Step S312: Generate a strategy based on the real-time deviation results to obtain an intelligent control strategy.

[0055] It is understood that in some embodiments, in order to determine the accuracy of subsequent control of the etching bath concentration, it is necessary to determine the corresponding intelligent control strategy based on different real-time deviation results.

[0056] Step S313: When the real-time deviation result is positive, the intelligent control strategy is to first calculate the water replenishment amount based on the control parameters, then dilute the etching bath solution according to the calculated water replenishment amount, and finally update the trained intelligent control model parameters according to the diluted etching bath solution data.

[0057] It is understood that in some embodiments, when the real-time deviation result is positive (K greater than K0), it indicates that the ion concentration in the etching bath is too high. The corresponding control objective of the intelligent control strategy is to reduce the ion concentration. Therefore, a certain amount of pure water can be injected into the etching bath for dilution. Furthermore, the amount of water required to replenish the etching bath at this time can be calculated using the formula: V1 = Δk * dk / dt, where V1 is the amount of water replenished and Δk is the real-time deviation value.

[0058] Step S314: When the real-time deviation result is negative, the intelligent control strategy is as follows: first, calculate the replenishment amount based on the control parameters, then replenish the etching tank solution according to the calculated replenishment amount, and finally update the trained intelligent control model parameters according to the etching tank solution data after replenishment.

[0059] It is understood that in some embodiments, when the real-time deviation result is negative (K < K0), it indicates that the concentration of etching ions in the etching bath is low. The purpose of the intelligent control strategy is to increase the concentration of etching ions. Therefore, a certain amount of etching concentrate can be injected into the etching bath for replenishment. Etching ions refer to various charged ions present in the bath. The types of etching ions corresponding to different etching purposes are not the same. For example, when etching copper foil, the corresponding etching bath contains copper ions, chloride ions, and hydrogen ions; when etching silicon dioxide, the corresponding etching bath contains fluoride ions and fluoride complex ions. Furthermore, the required replenishment amount of the etching bath can be calculated using the formula: V2 = Δk * T, where V2 is the replenishment amount, Δk is the real-time deviation value, and T is the real-time temperature of the etching bath.

[0060] Step S32: When the real-time analysis result of the etching bath solution is the second type of real-time analysis result of the etching bath solution, a strategy is generated based on the real-time data of the etching bath solution to obtain an intelligent control strategy.

[0061] It is understood that in some embodiments, when the real-time analysis result of the etching bath is the second type of real-time analysis result of the etching bath, that is, when the real-time deviation value is less than or equal to the preset deviation value, it indicates that the etching ion balance in the etching bath has not been broken at this time, and the etching bath can continue to complete the subsequent etching operation in the current state. Therefore, a control scheme for maintaining the current state of the etching bath can be generated based on the real-time data of the etching bath, thereby obtaining the corresponding intelligent control strategy.

[0062] Step S33: When the real-time analysis result of the etching bath solution is the third type of real-time analysis result of the etching bath solution, an abnormal alarm is issued, and a strategy is generated based on the real-time data of the etching bath solution to obtain an intelligent control strategy.

[0063] It is understood that in some embodiments, when the real-time analysis result of the etching bath solution is the third type of real-time analysis result of the etching bath solution, that is, when the real-time deviation value does not meet the normal data standard of the deviation value, it indicates that the monitoring equipment used to monitor the real-time status of the etching bath solution has malfunctioned, such as the sensor probe is damaged, or the status of the etching bath solution changes drastically, such as the conductivity of the etching bath solution increasing by 60% within three seconds. At this time, an abnormal alarm needs to be issued, and a corresponding intelligent control strategy is generated according to the specific abnormal status.

[0064] refer to Figure 5 , Figure 5 yes Figure 3 A schematic diagram of the sub-process of step S33. In some embodiments, an intelligent control strategy can be obtained based on steps S331 to S334.

[0065] Step S331: When the real-time analysis result of the etching bath solution is the third type of real-time analysis result of the etching bath solution, an abnormal alarm is issued and an abnormality judgment is made based on the real-time data of the etching bath solution to obtain the real-time abnormal result of the etching bath solution.

[0066] It is understood that, in some embodiments, when judging anomalies based on real-time data of the etching bath solution, the real-time anomaly results of the etching bath solution can be divided into three categories. The process includes, but is not limited to, first calculating the real-time conductivity of the etching bath solution based on the real-time data, and then classifying the anomaly based on the real-time conductivity. If the real-time conductivity of the etching bath solution exceeds a preset upper limit, such as greater than 120%, the real-time anomaly result is classified as a first-category real-time anomaly result. If the real-time conductivity of the etching bath solution is lower than a preset lower limit, such as less than 80%, the real-time anomaly result is classified as a second-category real-time anomaly result. If the real-time conductivity of the etching bath solution cannot be calculated, such as when the sensor probe is damaged and cannot normally detect the real-time data of the etching bath solution, the real-time anomaly result is classified as a third-category real-time anomaly result.

[0067] Step S332: Generate a strategy based on the real-time abnormal results of the etching bath solution to obtain the corresponding intelligent control strategy.

[0068] It is understood that in some embodiments, the causes of real-time abnormal results in different etching solutions and the corresponding intelligent control strategies are different. The causes of the first type of real-time abnormal results include, but are not limited to, the inevitable increase in concentration and temperature of the etching solution during the etching process due to water evaporation, continuous heat input, and exothermic chemical reactions. The causes of the second type of real-time abnormal results include, but are not limited to, the reduced activity of the etching solution due to abnormal dilution or excessive consumption during the etching process, rendering it unable to meet the requirements of subsequent etching processes. The causes of the third type of real-time abnormal results include, but are not limited to, sensor probe damage, preventing continued real-time monitoring of the etching solution.

[0069] Step S333: When the real-time abnormal result of the etching bath solution is the first type of real-time abnormal result, the intelligent control strategy is to dilute and cool the etching bath solution, record the log, and then perform the corresponding production operation based on the state of the processed etching bath solution.

[0070] It should be noted that, in some embodiments, the process of diluting and cooling the etching bath solution includes, but is not limited to, continuously injecting pure water into the etching bath solution until the temperature and etching ion concentration in the etching bath solution return to the normal process production standard range.

[0071] It is understood that in some embodiments, the process of performing corresponding production operations based on the state of the treated etching bath solution includes, but is not limited to, troubleshooting and detecting faults in the diluted and cooled etching bath solution. This involves detecting whether the etching bath solution concentration and temperature are within the normal range required for subsequent etching processes. Normal production resumes when the fault is successfully resolved, and switches to a safety mode when troubleshooting fails. The safety mode is a degradation control strategy automatically activated in abnormal situations. This mode replenishes the chemical solution quantitatively according to a preset ratio based on the production load, thereby providing basic protection in abnormal situations.

[0072] Step S334: When the real-time abnormal result of the etching bath solution is the second type of real-time abnormal result, the intelligent control strategy is to replenish the etching bath solution and shut down the machine, record the log, and then perform the corresponding production operation based on the status of the etching bath solution after the treatment.

[0073] It is understood that in some embodiments, the process of performing corresponding production operations based on the state of the processed etching bath solution includes, but is not limited to, calculating the conductivity of the etching bath solution after replenishment and shutdown, and performing fault troubleshooting detection based on the calculation results, that is, determining whether the conductivity of the current etching bath solution is within the normal range that can meet the requirements of subsequent etching processes, resuming normal production when the fault is successfully troubleshooted, and switching to safe mode when the fault is not troubleshooted.

[0074] Step S335: When the real-time abnormal result of the etching bath solution is a third type of real-time abnormal result, the intelligent control strategy is to switch the intelligent control device probe to the backup probe, record the log, and then perform the corresponding production operation based on the intelligent control device after the probe switch.

[0075] It is understood that in some embodiments, the process of the intelligent control device performing corresponding production operations based on the probe switching includes, but is not limited to, detecting the etching bath liquid based on the switched probe, obtaining the corresponding detection results, and then performing fault troubleshooting detection based on the detection results, that is, determining whether the detection results obtained based on the switched probe are within the normal range, resuming normal production when the fault is successfully troubleshooted, and switching to a safe mode when the fault troubleshooting fails.

[0076] Step S40: Drive the corresponding control equipment to control the production of the etching bath solution according to the intelligent control strategy.

[0077] It is understood that in some embodiments, the process of controlling the production of etching bath solution through intelligent control strategy includes, but is not limited to, first generating corresponding intelligent control instructions according to the intelligent control strategy, and then generating control according to the intelligent control instructions, including but not limited to, diluting and cooling the etching bath solution, replenishing the solution and stopping the machine, and switching probes.

[0078] Reference Figure 6 , Figure 6 This is a structural block diagram of the intelligent control device for etching bath solution provided in an embodiment of this application. Figure 6 As shown, the device is connected to at least one sensor and at least one control actuator on the etching tank, and the device includes: The data acquisition module 10 has its input end connected to the sensor for communication, and is used to acquire real-time monitoring data of the etching bath solution; The data processing module 20, whose input end is connected to the output end of the data acquisition module, is used to compare real-time monitoring data with preset target values ​​and calculate real-time deviation data. The intelligent analysis module 30 has its input end connected to the output end of the data processing module. The intelligent analysis module has a pre-trained intelligent control model built in, which is used to receive real-time deviation data and output control commands. The control signal output module 40 has its input end connected to the output end of the intelligent analysis module, and its output end is used to connect to the control actuator to convert the control command into a control signal that drives the control actuator.

[0079] The intelligent control method, apparatus, equipment, and storage medium for etching bath solutions provided in this embodiment acquire real-time data of the etching bath solution through industrial sensors; perform deviation analysis on the real-time data of the etching bath solution based on a trained intelligent control model to obtain corresponding real-time analysis results; adapt the corresponding strategy generation method according to the real-time analysis results of the etching bath solution to obtain an intelligent control strategy; and drive the corresponding control equipment according to the intelligent control strategy to control the production of the etching bath solution. This application effectively overcomes the problems of strong subjectivity, lack of quantitative standards, and control lag caused by traditional manual control methods through real-time, automated monitoring and intelligent control of the etching bath solution, thereby significantly improving the product etching yield and the controllability of the production process.

[0080] Reference Figure 7 , Figure 7 This is a schematic diagram of the electronic device structure according to an embodiment of this application. Figure 7As shown, the electronic device 1000 may include: a processor 1001, a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. The processor 1001 may be, for example, a Central Processing Unit (CPU). The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen or an input unit such as a keyboard. Optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wireless-Fidelity (Wi-Fi) interface). The memory 1005 may be high-speed random access memory (RAM) or stable non-volatile memory (NVM), such as a disk drive. Optionally, the memory 1005 may also be a storage device independent of the aforementioned processor 1001.

[0081] Those skilled in the art will understand that Figure 7 The structure shown does not constitute a limitation on the electronic device 1000, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0082] like Figure 7 As shown, the memory 1005, which serves as a storage medium, may include an operating system, a network communication module, a user interface module, and an intelligent control program for the etching bath solution.

[0083] Understandable, Figure 7 In the illustrated electronic device 1000, the network interface 1004 is mainly used for data communication with a network server. The user interface 1003 is mainly used for data interaction with the user. In this application, the electronic device 1000 uses the processor 1001 to call the control program stored in the memory 1005 to execute the intelligent control method for etching bath provided in the embodiments of this application.

[0084] In addition, refer to Figure 8 , Figure 8 This is another structural block diagram of the intelligent etching bath control device provided in this application embodiment. The intelligent etching bath control device 2000 includes a processor 1001 and a memory 1005. The memory 1005 stores programs, instructions, or code for executing the aforementioned intelligent etching bath control method. The processor 1001 executes the programs, instructions, or code stored in the memory 1005. The programs, instructions, or code stored in the memory 1005 are executable. Figures 2 to 6The embodiments shown include some or all of the steps of the intelligent control method for etching bath solution.

[0085] Since this storage medium adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0086] Furthermore, embodiments of this application also propose a computer-readable storage medium storing a computer program, wherein the storage medium stores an intelligent control program for etching bath solution, and when the intelligent control program for etching bath solution is executed by a processor, it implements the steps of the intelligent control method for etching bath solution as described above.

[0087] It should be understood that the above are merely illustrative examples and do not constitute any limitation on the technical solution of this application. In specific applications, those skilled in the art can make settings as needed, and this application does not impose any restrictions on this.

[0088] It should be noted that the workflow described above is merely illustrative and does not limit the scope of protection of this application. In practical applications, those skilled in the art can select some or all of it to achieve the purpose of this embodiment according to actual needs, and no restrictions are imposed here.

[0089] In addition, for technical details not described in detail in this embodiment, please refer to the intelligent control method of etching bath provided in any embodiment of this application, which will not be repeated here.

[0090] Furthermore, it should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0091] The sequence numbers of the embodiments in this application are for description only and do not represent the superiority or inferiority of the embodiments.

[0092] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as read-only memory (ROM) / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0093] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An intelligent control method for etching tank solution, characterized in that, The method comprises: obtaining real-time data of etching tank liquid through an industrial sensor; performing deviation analysis on the real-time data of the etching tank liquid based on a trained intelligent control model to obtain corresponding real-time analysis results of the etching tank liquid; adapting a corresponding strategy generation mode according to the real-time analysis results of the etching tank liquid to obtain an intelligent control strategy; driving a corresponding control device to perform production control on the etching tank liquid according to the intelligent control strategy.

2. The etching tank solution intelligent control method of claim 1, wherein, The deviation analysis on the real-time data of the etching tank liquid based on the trained intelligent control model to obtain corresponding real-time analysis results of the etching tank liquid comprises: performing deviation calculation on the real-time data of the etching tank liquid based on the trained intelligent control model to obtain real-time deviation results; comparing and analyzing the real-time deviation results with a preset deviation value, and obtaining first-type real-time analysis results of the etching tank liquid when the real-time deviation results exceed the preset deviation value; obtaining second-type real-time analysis results of the etching tank liquid when the real-time deviation results do not exceed the preset deviation value; obtaining third-type real-time analysis results of the etching tank liquid when the real-time deviation results do not conform to a deviation value data standard.

3. The etching tank solution intelligent control method of claim 2, wherein, The adaptation of the corresponding strategy generation mode according to the real-time analysis results of the etching tank liquid to obtain the intelligent control strategy comprises: when the real-time analysis results of the etching tank liquid are the first-type real-time analysis results, obtaining control parameters and performing strategy generation according to the control parameters and the real-time deviation results to obtain the intelligent control strategy; when the real-time analysis results of the etching tank liquid are the second-type real-time analysis results, performing strategy generation based on the real-time data of the etching tank liquid to obtain the intelligent control strategy; when the real-time analysis results of the etching tank liquid are the third-type real-time analysis results, issuing an abnormality alarm and performing strategy generation based on the real-time data of the etching tank liquid to obtain the intelligent control strategy.

4. The etching tank solution intelligent control method of claim 3, wherein, The obtaining of the control parameters when the real-time analysis results of the etching tank liquid are the first-type real-time analysis results, and the performance of strategy generation according to the control parameters and the real-time deviation results to obtain the intelligent control strategy comprise: obtaining control parameters when the real-time analysis results of the etching tank liquid are the first-type real-time analysis results; performing strategy generation based on the real-time deviation results to obtain the intelligent control strategy; when the real-time deviation results are positive deviation, the intelligent control strategy is: performing water supplement amount calculation based on the control parameters, performing dilution operation on the etching tank liquid according to the calculated water supplement amount, and finally updating the parameters of the trained intelligent control model according to the data of the diluted etching tank liquid; when the real-time deviation results are negative deviation, the intelligent control strategy is: performing liquid supplement amount calculation based on the control parameters, performing liquid supplement operation on the etching tank liquid according to the calculated liquid supplement amount, and finally updating the parameters of the trained intelligent control model according to the data of the supplemented etching tank liquid.

5. The etching tank solution intelligent control method of claim 4, wherein, The obtaining of the control parameters when the real-time analysis results of the etching tank liquid are the first-type real-time analysis results comprises: When the real-time analysis result of the etching tank solution is a first type of etching tank solution real-time analysis result, real-time data of the etching tank solution is feature extracted to obtain real-time feature data of the etching tank solution; The real-time feature data of the etching tank solution is matched with a matching database to obtain a corresponding data matching judgment result; When the data matching judgment result is qualified, a pre-stored coefficient is called according to the real-time feature data of the etching tank solution, and the control parameter is generated according to the pre-stored coefficient; When the data matching judgment result is unqualified, a new drug model is obtained, and the control parameter is generated based on the new drug model.

6. The etching tank solution intelligent control method of claim 5, wherein, The method for generating the control parameter when the data matching judgment result is unqualified comprises: When the data matching judgment result is unqualified, monitoring data of the etching tank solution in a preset time period is obtained; A new drug model is constructed according to the monitoring data of the etching tank solution in the preset time period; The control parameter is generated based on the new drug model.

7. The etching tank solution intelligent control method of claim 3, wherein, When the real-time analysis result of the etching tank solution is a third type of etching tank solution real-time analysis result, an abnormal alarm is issued, and a strategy is generated based on the real-time data of the etching tank solution to obtain the intelligent control strategy, which comprises: When the real-time analysis result of the etching tank solution is a third type of etching tank solution real-time analysis result, an abnormal alarm is issued, and an abnormality is judged according to the real-time data of the etching tank solution to obtain a real-time abnormality result of the etching tank solution; A strategy is generated based on the real-time abnormality result of the etching tank solution to obtain the corresponding intelligent control strategy; When the real-time abnormality result of the etching tank solution is a first type of real-time abnormality result, the intelligent control strategy is to dilute and cool the etching tank solution, record a log, and then execute a corresponding production operation based on the state of the processed etching tank solution; When the real-time abnormality result of the etching tank solution is a second type of real-time abnormality result, the intelligent control strategy is to supplement the etching tank solution and shut down, record a log, and then execute a corresponding production operation based on the state of the processed etching tank solution; When the real-time abnormality result of the etching tank solution is a third type of real-time abnormality result, the intelligent control strategy is to switch a probe of an intelligent control device to a standby probe, record a log, and then execute a corresponding production operation based on the intelligent control device after the probe is switched.

8. An etching tank solution intelligent regulation device, characterized in that, The device is connected with at least one sensor and at least one control executor on the etching tank, and the device comprises: A data acquisition module, an input end of which is connected with the sensor in communication, for acquiring real-time monitoring data of the etching tank solution; A data processing module, an input end of which is connected with an output end of the data acquisition module, for comparing the real-time monitoring data with a preset target value and calculating real-time deviation data; An intelligent analysis module, an input end of which is connected with an output end of the data processing module, the intelligent analysis module being internally provided with a trained intelligent control model, for receiving the real-time deviation data and outputting a control instruction; A control signal output module, an input end of which is connected with an output end of the intelligent analysis module, and an output end of which is used for being connected with the regulation executor, for converting the regulation instruction into a control signal for driving the regulation executor to act.

9. An electronic device, comprising: The electronic device includes a memory, a processor, one or more computer programs stored in the memory, the one or more computer programs including instructions that, when executed by the processor, implement the etching tank liquid intelligent regulation method of any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium includes instructions that, when executed by a processor, implement the etching tank liquid intelligent regulation method of any one of claims 1 to 7.

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