Temperature control device, detection equipment and detection system

Abstract

The invention relates to the field of photoelectric technology thermal management, in particular to a temperature control device, detection equipment and a detection system.The temperature control device comprises a heat conduction structure which conducts heat with a temperature control object in a non-connection mode; the cold end of the refrigeration structure is in welded connection with the heat conduction structure; and the heat dissipation component is connected with the hot end of the refrigeration structure. The heat conduction structure and the temperature control object are not connected for heat conduction, so that the limitation of a narrow space at the back of the CCD can be bypassed, and the heat generated by the CCD can be efficiently led out. Seamless connection is achieved between the heat conduction structure and the cold end of the refrigeration structure through welding, a heat conduction path with ultra-low thermal resistance from the CCD to the cold end of the refrigeration structure is established, and efficient refrigeration of the high-power-consumption CCD in a compact space is achieved. Due to the fact that thermal coupling of the heat conduction structure and the temperature control object is achieved in a non-connection mode, a rigid path for transmitting micro-vibration generated when the temperature control device operates to the CCD is cut off, and the effect of vibration isolation is achieved.

Description

Technical Field

[0001] This application relates to the field of thermal management in optoelectronic technology, and more particularly to a temperature control device, detection equipment and detection system. Background Technology

[0002] Charge-coupled devices (CCDs), as highly sensitive photoelectric sensors, have wide applications in aerospace remote sensing, astronomical observation, and other fields. However, CCDs generate a large amount of heat during operation, and their signal-to-noise ratio and image quality are extremely sensitive to temperature. Therefore, effective cooling methods must be used to maintain them at an extremely low and stable operating temperature.

[0003] Currently, for large-size, especially multi-chip, high-power CCDs, particularly high-line-frequency CCDs, due to their massive data transmission volume, the CCD, socket, and printed circuit board (PCB) are typically clamped together to achieve high-speed data transmission. This mechanical structure results in extremely limited space on the back of the CCD where the cooling surface is located. The thermoelectric cooler (TEC), due to size and shape limitations, cannot be directly installed in this narrow area for effective cooling. If heat-conducting components are used to transfer the CCD's heat to the TEC's cold end in a more spacious location away from the CCD, the heat conduction path is long and the thermal resistance is high, often failing to meet the heat dissipation requirements of high-power CCDs. Furthermore, due to the clamping method, the micro-vibrations generated by the cooler during operation are easily transmitted to the CCD through rigid pressing, causing relative displacement between the CCD and the target object during exposure. This results in the light spot moving on the sensor, i.e., pixel jitter, affecting the imaging results and reducing the quality of optical detection. Summary of the Invention

[0004] This application discloses a temperature control device, a detection equipment, and a detection system to solve the problems of efficient cooling and vibration isolation, effectively improving the temperature uniformity of large-size, high-power, multi-chip CCDs, thereby ensuring the detection quality of the detection equipment.

[0005] In a first aspect, this application provides a temperature control device, comprising:

[0006] The heat-conducting structure conducts heat to the temperature-controlled object in a non-contact manner.

[0007] A refrigeration structure, wherein the cold end of the refrigeration structure is welded to the heat-conducting structure, and the refrigeration structure is controlled by a control unit;

[0008] The heat dissipation component is connected to the hot end of the cooling structure.

[0009] By employing a non-connected heat conduction method between the heat-conducting structure and the temperature-controlled object, heat is efficiently extracted. A seamless connection between the heat-conducting structure and the cold end of the cooling structure is achieved through welding, establishing an ultra-low thermal resistance heat conduction path from the temperature-controlled object to the cold end of the cooling structure. This enables efficient cooling of high-power temperature-controlled objects, such as CCDs, within a compact space. Simultaneously, the non-connected thermal coupling between the heat-conducting structure and the temperature-controlled object ensures effective heat conduction while cutting off the rigid path for the transmission of micro-vibrations generated during the operation of the temperature control device to the temperature-controlled object, achieving vibration isolation. This ensures the stability of the temperature-controlled object, especially high-precision multi-chip CCDs, thereby improving image clarity and guaranteeing the optical inspection quality of the testing equipment.

[0010] In one possible implementation, the heat-conducting structure includes multiple bosses, each of which passes through the temperature-controlled object and corresponds to the surface of the temperature-controlled object to be cooled. There is a preset gap between the bosses and the surface to be cooled for filling a flexible heat-conducting layer.

[0011] The thermally conductive structure incorporates multiple protrusions that precisely correspond to the surface to be cooled. A pre-defined gap is maintained between the protrusions and the surface, and a flexible thermally conductive layer is filled within this gap. Together, the pre-defined gap and the flexible thermally conductive layer form a mechanical impedance mismatch layer. Vibrations from the cooling structure are significantly attenuated and absorbed when passing through this flexible interface, thus eliminating the interference of micro-vibrations on image quality. Under the action of assembly clamping force, the flexible thermally conductive layer is fully compressed, forming a large-area close contact, thereby ensuring extremely low contact thermal resistance and high thermal conductivity.

[0012] In one possible implementation, the cooling structure includes multiple cooling chips symmetrically arranged on both sides of the heat-conducting structure. The heat dissipation component includes two components symmetrically arranged on both sides of the heat-conducting structure and connected to the hot end of the cooling chip on the corresponding side, respectively. The cold end of the cooling chip is welded to the heat-conducting structure.

[0013] Multiple cooling elements arranged on both sides work together to cool the central heat-conducting structure, optimizing the heat flow path and enabling faster cooling of the temperature-controlled object to the target temperature. The symmetrical cooling method ensures that heat is evenly extracted from both sides of the heat-conducting structure, effectively avoiding uneven thermal stress caused by unilateral cooling, thus guaranteeing the overall image quality and accuracy. Simultaneously, two symmetrical heat dissipation components ensure that the hot end of each cooling element is cooled promptly, maintaining it within a high-efficiency operating range, enhancing the long-term operational stability and reliability of the system.

[0014] In one possible implementation, the heat dissipation component is fixedly connected to the heat-conducting structure via a connector.

[0015] By using connectors to fasten the heat-conducting structure, cooling pads, and heat dissipation components into a single unit, the structural strength of the module and its stability under complex mechanical environments are improved.

[0016] In one possible implementation, a heat-insulating gasket is fitted on the outside of the connector, with one side of the heat-conducting structure abutting against the heat dissipation component and the other side abutting against the heat dissipation component.

[0017] The connector will form a thermal bridge that connects the high-temperature heat dissipation component directly to the low-temperature heat conduction structure. This effect is eliminated by the heat insulation gasket, and the temperature distribution of the heat conduction structure will be more uniform and stable, which will help to achieve a high degree of consistency in the temperature field of multiple spliced ​​CCDs or high-performance sensors.

[0018] In one possible implementation, the temperature control device further includes a heat insulation structure disposed on the outer surface of the heat-conducting structure that does not overlap with the first region and the second region.

[0019] The first area is for welding with the refrigeration structure, and the second area is for conducting heat with the temperature-controlled object.

[0020] By covering the surface with an insulating structure, heat from the environment is blocked from entering, thus significantly reducing the system's total power consumption.

[0021] In one possible implementation, a flexible thermally conductive layer is provided between the heat dissipation component and the hot end of the cooling structure.

[0022] There may be a flatness tolerance between the base of the heat dissipation component and the hot end surface of the cooling chip. The flexible thermal conductive layer will deform under pressure, which can effectively fill the interface gap, ensure sufficient contact, and thus significantly reduce the contact thermal resistance.

[0023] In one possible implementation, the heat dissipation component includes a three-dimensional heat spreader and multiple fins, wherein the three-dimensional heat spreader is connected to the hot end of the cooling structure, and the fins are connected to the three-dimensional heat spreader.

[0024] The three-dimensional heat spreader evenly diffuses the heat generated at the hot end of the cooling element, enabling the cooling element to operate continuously and stably. The excellent heat diffusion capability of the three-dimensional heat spreader prevents a rapid temperature rise.

[0025] In one possible implementation, the three-dimensional heat spreader includes a heat spreader plate and multiple anti-gravity heat pipes. One side of the heat spreader plate is connected to the hot end of the refrigeration structure, and the other side of the heat spreader plate is connected to and interconnected with the multiple anti-gravity heat pipes. Multiple fins are parallel to the heat spreader plate and are respectively connected to the multiple anti-gravity heat pipes.

[0026] By vertically connecting multiple anti-gravity heat pipes to the vapor chamber, the heat dissipation body is extended from a two-dimensional plane to a three-dimensional space. The vapor chamber is responsible for receiving and horizontally diffusing the concentrated heat from the hot end of the cooling chip; while the multiple anti-gravity heat pipes extract heat from each area of ​​the vapor chamber and transport it to areas far away from the heat source, so that heat can be transferred efficiently.

[0027] Secondly, this application provides a testing device, including the aforementioned temperature control device.

[0028] Thirdly, this application provides a detection system, including the aforementioned detection equipment. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of the temperature control device provided in the embodiment of this application, installed in a detection device;

[0031] Figure 2 for Figure 1 The diagram shows the structure of the temperature control device.

[0032] Figure 3 for Figure 2 A partially exploded structural diagram of the temperature control device shown.

[0033] Figure 4 This is a schematic diagram of the structure of the detection device provided in the embodiment of this application within an optical quantity detection system.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100-Temperature control device;

[0036] 10- Thermally conductive structure;

[0037] 11-Boss; 12-Ear;

[0038] 20-Refrigeration structure;

[0039] 21-Refrigeration element;

[0040] 30 - Heat dissipation components;

[0041] 31-Three-dimensional heat spreader; 311-Heat spreader plate; 312-Anti-gravity heat pipe; 32-Fin;

[0042] 40 - Connector;

[0043] 41 - Thermal insulation gasket;

[0044] 50 - Thermal insulation structure;

[0045] 60 - Temperature sensor;

[0046] 70 - Control Unit;

[0047] 200 - Testing equipment;

[0048] 201-Drive board; 202-Fixing plate; 203-Socket; 204-Mounting device;

[0049] 300-Detection System. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0051] This application relates to a high-line-frequency, high-power, multi-CCD stitched TDI (Time Delay Integration) camera system, specifically applied to detectors in optical quantity inspection systems (such as semiconductor precision inspection systems). In the semiconductor manufacturing and inspection fields, high-line-frequency CCD cameras need to acquire image data at high rates to meet the high-sensitivity detection requirements for minute defects. However, high line frequency inevitably leads to high power consumption of the CCD chip (the power consumption of a single CCD can reach tens of watts), while low-noise operation requires the CCD to operate in low-temperature environments. In addition, the camera structure stitched with multiple CCDs places extremely stringent requirements on temperature uniformity to avoid imaging distortion or detection errors caused by temperature differences. In the prior art, the CCD and the TEC cold end are rigidly pressed together, and the micro-vibrations of heat dissipation components, such as airflow disturbances in the air-cooled fins, are easily transmitted directly to the CCD, affecting imaging stability.

[0052] To overcome the shortcomings of existing technologies, connecting the TEC (thermal conductive device) to the heat-conducting structure via eutectic bonding can significantly reduce the thermal resistance between the TEC cold end and the heat-conducting structure, facilitating heat transfer and achieving efficient cooling of the CCD. Simultaneously, by mounting the heat-conducting structure and the CCD on different structural components, controlling the gap between them through tolerance constraints, and filling the gap with a heat-conducting layer for contact heat transfer, the micro-vibrations of the temperature control device can be decoupled from the CCD assembly, ensuring the stability of the CCD, especially high-precision multi-chip CCDs, thereby improving image clarity and guaranteeing the detection quality of the testing equipment.

[0053] In view of this, this application provides a temperature control device, comprising:

[0054] The heat-conducting structure conducts heat to the temperature-controlled object in a non-contact manner.

[0055] A refrigeration structure, wherein the cold end of the refrigeration structure is connected to the heat-conducting structure by welding, and the refrigeration structure is controlled by a control unit;

[0056] The heat dissipation component is connected to the hot end of the cooling structure.

[0057] By conducting heat through a non-connected method between the heat-conducting structure and the temperature-controlled object, the limited space behind the temperature-controlled object, such as a CCD, can be bypassed, allowing for efficient heat dissipation. Seamless connection between the heat-conducting structure and the cold end of the cooling structure is achieved through welding, such as eutectic bonding, establishing an ultra-low thermal resistance heat conduction path from the temperature-controlled object to the cold end of the cooling structure. This overcomes the problems of long and inefficient heat conduction paths caused by space constraints in existing technologies, enabling efficient cooling of high-power temperature-controlled objects within a compact space. Simultaneously, the non-connected method of thermal coupling between the heat-conducting structure and the temperature-controlled object ensures effective heat conduction while cutting off the rigid path for the transmission of micro-vibrations generated during temperature control to the CCD, achieving vibration isolation. This resolves the contradiction between efficient cooling and the impact of vibration on image quality, ensuring the stability of high-power temperature-controlled objects, especially high-precision multi-chip CCDs, thereby improving image clarity. Furthermore, by connecting the heat dissipation components in the temperature control device to the hot end of the refrigeration structure, the waste heat generated by the refrigeration structure can be quickly and evenly dissipated into the surrounding environment, ensuring that the hot end of the refrigeration structure is always maintained at a low operating temperature, thereby improving the efficiency and long-term operational reliability of the entire temperature control device.

[0058] The contents of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can have a clearer and more detailed understanding of the contents of this application.

[0059] The following sections will provide a detailed description of the specific structure of the temperature control device and various possible implementation methods.

[0060] Figure 1 This is a schematic diagram of the structure of the temperature control device provided in the embodiment of this application, which is installed in the detection equipment. Figure 2 for Figure 1 The diagram shows the structure of the temperature control device. Figure 3 for Figure 2 A partial exploded view of the temperature control device shown.

[0061] like Figure 1 As shown in the embodiment of this application, the temperature control device 100 is used in the testing device 200. The temperature control device 100 is used to cool the heating element in the testing device 200 so that the testing device 200 can work normally.

[0062] The detection device 200 can be a detector, such as the detector in an optical quantity measurement system. The TDI camera in the optical quantity measurement system includes multiple CCD coupling sockets and a PCB board, and the temperature control device 100 can be used to cool the multiple CCDs. Figure 1 This is only a structural view of the part of the testing equipment 200 related to the temperature control device 100. It can be understood that the testing equipment 200 also includes other components, such as CCD, package, filter, etc.

[0063] Please also refer to Figure 2 and Figure 3 The temperature control device 100 includes a heat-conducting structure 10, a cooling structure 20, and a heat dissipation component 30. The cooling structure 20 is connected between the heat-conducting structure 10 and the heat dissipation component 30.

[0064] The heat-conducting structure 10 conducts heat to the temperature-controlled object in a non-connected manner.

[0065] The "non-connection method" means that there is no direct connection between the heat-conducting structure 10 and the temperature-controlled object, nor is there an indirect connection through intermediate connectors or connecting structures. Instead, the heat-conducting structure 10 and the temperature-controlled object are held together by tolerances during design and installation, thereby decoupling the vibration of the heat-conducting structure 10 from the temperature-controlled object. In other words, the vibration of the heat-conducting structure 10 will not directly act on the temperature-controlled object. It can be understood that the above tolerances can be designed according to the actual situation such as the installation location and size of the heat-conducting structure and the temperature-controlled object, and are not limited thereto.

[0066] For example, the temperature-controlled object can be a CCD. By conducting heat through the non-connected thermal structure 10 to the temperature-controlled object, the limited space behind the CCD can be bypassed, allowing the heat generated by the CCD to be efficiently dissipated. It is understood that the temperature control device 100 can be applied to the temperature control of any high-precision detection equipment, such as a camera detector, in a non-vacuum environment. The temperature-controlled object can be any electronic component other than a CCD that requires temperature control or cooling, such as a chip; this application does not limit this. The following description uses a CCD as the temperature-controlled object.

[0067] The cold end of the cooling structure 20 is welded to the heat-conducting structure 10. The heat dissipation component 30 is connected to the hot end of the cooling structure 20.

[0068] The refrigeration structure 20 is controlled by a control unit. Specifically, the control unit can be electrically connected to the refrigeration structure 20, and control the power of the refrigeration structure 20 by supplying power to it, thereby controlling the cooling effect of the refrigeration structure 20. For example, the control unit can be a component within the temperature control device 100, or it can be another component independent of the temperature control device 100, without limitation.

[0069] In one possible implementation, the cold end of the cooling structure 20 is connected to the heat-conducting structure 10 via eutectic bonding.

[0070] By seamlessly connecting the heat-conducting structure 10 and the cold end of the cooling structure 20 through eutectic bonding, an ultra-low thermal resistance heat conduction path is established from the CCD to the cold end of the cooling structure 20. This overcomes the problems of long heat conduction paths and low efficiency caused by space constraints in existing technologies, achieving efficient cooling of high-power CCDs in a compact space. Simultaneously, by using a non-connected method to achieve thermal coupling between the heat-conducting structure 10 and the temperature-controlled object, while ensuring effective heat conduction, the rigid path for the transmission of micro-vibrations generated during the operation of the temperature control device 100 to the CCD is cut off, achieving vibration isolation. This resolves the contradiction between efficient cooling and the impact of vibration on imaging quality, ensuring the stability of the CCD, especially high-precision multi-chip stitched CCDs, thereby improving imaging clarity and guaranteeing the detection quality of the detection equipment 200. Furthermore, by connecting the heat dissipation component 30 in the temperature control device 100 to the hot end of the refrigeration structure 20, the waste heat generated by the refrigeration structure 20 can be quickly and evenly dissipated to the surrounding environment, ensuring that the hot end of the refrigeration structure 20 is always maintained at a low operating temperature, thereby improving the efficiency and long-term operational reliability of the entire temperature control device 100.

[0071] In one possible implementation, the cold end of the cooling structure 20 is connected to the heat-conducting structure 10 by low-temperature eutectic bonding.

[0072] In one possible implementation, the heat-conducting structure 10 includes a plurality of protrusions 11. Each of the protrusions 11 passes through a temperature-controlled object and corresponds to the surface of the temperature-controlled object to be cooled. A predetermined gap exists between the protrusion 11 and the surface to be cooled, which is used to fill the gap with a flexible heat-conducting layer, thereby conducting heat.

[0073] The heat-conducting structure 10 includes multiple protrusions 11, through which temperature-controlled objects, such as CCD monitoring systems, are inserted and precisely correspond to multiple surfaces to be cooled, establishing the shortest and most direct directional heat conduction path from the local heat source to the heat-conducting structure 10. A preset gap is maintained between the protrusions 11 and the surfaces to be cooled, and a flexible heat-conducting layer is filled in the gap. The preset gap and the flexible heat-conducting layer together form a mechanical impedance mismatch layer. Vibrations from the cooling structure 20 are significantly attenuated and absorbed when passing through this flexible interface, thereby achieving efficient decoupling between the vibration source and the vibration-sensitive CCD chip, fundamentally eliminating the interference of micro-vibrations on imaging quality. Under the action of assembly clamping force, the flexible heat-conducting layer is fully compressed, filling uneven areas and forming a large-area close contact, thus achieving vibration isolation while ensuring extremely low contact thermal resistance and ensuring high heat conduction efficiency. The combination of the preset gap and the flexible thermal conductive layer allows for minor deformation or assembly errors in the stacked structure of the CCD monitoring system within tolerance limits, without causing hard interference or stress to the thermal conductive system, thus improving the product's assembly tolerance and assembly yield.

[0074] In one possible implementation, the number of bosses 11 is the same as the number of surfaces to be cooled of the temperature-controlled object, and they correspond one-to-one. However, it is not limited to this. The number of bosses 11 may be greater than the number of surfaces to be cooled of the temperature-controlled object, and multiple bosses 11 are used to cool one surface. Alternatively, the number of bosses 11 may be less than the number of surfaces to be cooled of the temperature-controlled object, and one boss 11 can be used to cool multiple surfaces simultaneously.

[0075] In one possible implementation, the heat-conducting structure 10 further includes a lug 12. The heat-conducting structure 10 is mounted in the detection device 200 via the lug 12, thereby controlling the gap between the boss 11 of the heat-conducting structure 10 and the surface to be cooled by the size of the lug 12 and the size of the mounting component in the detection device 200 that mounts the lug 12.

[0076] In one possible implementation, the heat-conducting structure 10 is mounted on the base plate of the TDI (Time Delay Integration) camera via a lug 12. The tolerance of the support block between the base plate and the lug 12 is strictly controlled, that is, the size of the lug 12, the size of the support block, and the installation clamping force during installation are controlled, thereby controlling the distance between the boss 11 and the back of the CCD, that is, the surface to be cooled of the temperature-controlled object.

[0077] In one possible implementation, the cooling structure 20 includes a plurality of cooling elements 21. The plurality of cooling elements 21 are symmetrically arranged on both sides of the heat-conducting structure 10.

[0078] Multiple cooling elements 21 arranged on both sides work together to cool the central heat-conducting structure 10, achieving a superposition and multiplication of cooling capacity. This extracts heat bidirectionally and in parallel from the temperature-controlled object, optimizing the heat flow path and reducing the thermal resistance and temperature gradient of the core heat-conducting structure 10, thus enabling faster cooling of the temperature-controlled object to the target temperature. The symmetrical cooling method ensures that heat is uniformly extracted from both sides of the heat-conducting structure 10, effectively avoiding uneven thermal stress caused by unilateral cooling. For multi-chip CCDs that are extremely sensitive to temperature distribution, this ensures that all CCD chips operate at a highly consistent temperature, preventing misalignment or image distortion caused by uneven thermal expansion and contraction, thereby guaranteeing the overall quality and accuracy of the imaging.

[0079] Two heat dissipation components 30 are symmetrically arranged on both sides of the heat-conducting structure 10 and are respectively connected to the hot end of the cooling chip 21 on the corresponding side. The cold end of the cooling chip 21 is welded to the heat-conducting structure 10.

[0080] In one possible implementation, the heat dissipation component 30 is a three-dimensional heat dissipation structure, such as a 3D-VC heat sink.

[0081] The 3D-VC radiator (Three-Dimensional Vaper Chamber) is a three-dimensional heat dissipation device that combines a heat spreader and vertical heat pipes. It can achieve efficient heat conduction through its own three-dimensional structure and uniform heat dissipation through an integrated vacuum chamber.

[0082] In one possible implementation, the heat dissipation component 30 is a water-cooled plate, which dissipates heat from the hot end of the TEC, resulting in a smaller temperature difference between the hot and cold ends. This can effectively reduce the number of TECs and achieve a lightweight design of the heat conduction structure 10.

[0083] Corresponding to the dual-sided cooling elements 21, the two symmetrical heat dissipation components 30 provide independent and efficient heat dissipation channels for the waste heat generated at the hot end of the cooling elements 21, ensuring that the hot end of each cooling element 21 can be cooled in time and maintained within a high-efficiency operating range, thus enhancing the long-term operational stability and reliability of the system. Furthermore, the dual-sided symmetrical layout is an extremely compact structure, optimizing space utilization, and is particularly suitable for achieving high-power cooling in space-constrained devices, such as CCD monitoring systems. Simultaneously, this symmetrical structure is mechanically self-balancing, helping to counteract the internal stress caused by thermal expansion and contraction, and improving the mechanical stability of the entire module.

[0084] In one possible implementation, the cooling element 21 is a TEC.

[0085] In one possible implementation, the control unit 70 supplies electrical energy to each of the cooling chips 21 through parallel and series circuits, and achieves different cooling strategies by controlling the amount of electrical energy delivered.

[0086] In one possible implementation, the number of cooling elements 21 is greater than the number of CCDs.

[0087] In one possible implementation, the thermally conductive structure 10 is made of a high thermal conductivity alloy material, such as a molybdenum-copper alloy.

[0088] The core material of the cooling element 21 is ceramic (such as alumina or aluminum nitride), which has a very low coefficient of thermal expansion. The coefficient of thermal expansion of the molybdenum-copper alloy can be precisely designed by adjusting the molybdenum / copper ratio to make it very close to that of ceramic materials. This greatly reduces the interfacial thermal stress between the cooling element 21 and the heat-conducting structure 10 caused by uneven thermal expansion and contraction during severe temperature cycling, ensuring the long-term reliability of the low-temperature eutectic weld and avoiding the problem of weld layer cracking due to stress.

[0089] In one possible implementation, the heat dissipation component 30 is fixedly connected to the heat-conducting structure 10 via a connector 40.

[0090] The heat-conducting structure 10, the cooling chip 21, and the heat dissipation component 30 are fastened together as a whole by the connector 40, forming a highly integrated, compact, and extremely rigid independent cooling module. This avoids loosening and relative displacement of the components, greatly improving the structural strength and stability of the module under complex mechanical environments. Simultaneously, the uniform and continuous clamping force provided by the fastening connection ensures that the interface contact pressure between the cold end of the cooling chip 21 and the heat-conducting structure 10, and between the hot end of the cooling chip 21 and the heat dissipation component 30, is in a good state. This helps maintain the long-term reliability of the eutectic bonding interface and reduces the thermal resistance of the mechanical contact interface between the cooling chip 21 and the heat dissipation component 30, ensuring the efficiency and stability of the heat conduction path.

[0091] In one possible implementation, the connector 40 is a screw.

[0092] In one possible implementation, a heat-insulating gasket 41 is fitted on the outside of the connector 40. One side of the heat-insulating gasket 41 abuts against the heat-conducting structure 10, and the other side abuts against the heat dissipation component 30.

[0093] The connector 40, typically a metal screw, is itself a high thermal conductivity element. Without insulation, it forms a thermal bridge directly connecting the high-temperature heat dissipation component 30 to the low-temperature heat-conducting structure 10. This causes a significant amount of cooling energy generated by the cooling chip 21 to be short-circuited and wasted. The thermal insulation gasket 41 physically isolates the connector 40 from the structures on both sides, blocking this thermal bridge and significantly improving the overall cooling efficiency of the system. Simultaneously, the heat leakage caused by the thermal bridge of the connector 40 is localized and uneven, introducing hot spots into the heat-conducting structure 10 and disrupting its temperature uniformity. Eliminating this effect with the thermal insulation gasket 41 results in a more uniform and stable temperature distribution in the heat-conducting structure 10, contributing to a high degree of temperature consistency in multi-chip CCDs or high-performance sensors. Furthermore, if the connector 40 is directly connected to the heat-conducting structure 10, the temperature of its portion near the structure will be too low, causing water vapor in the air to condense on its surface, leading to electrical short circuits. The heat insulation gasket 41 ensures that the temperature of the connector 40 itself is closer to the ambient temperature, thereby eliminating this local cold spot and ensuring long-term reliable operation of the system in humid environments.

[0094] In one possible implementation, the temperature control device 100 further includes a heat insulation structure 50. The heat insulation structure 50 is disposed on the outer surface of the heat-conducting structure 10 that does not overlap with the first region and the second region.

[0095] The first region is for welding with the refrigeration structure 20, and the second region is for conducting heat with the temperature-controlled object.

[0096] In one possible implementation, a heat insulation structure 50 is provided on the outer surface of the heat-conducting structure 10 that does not overlap with the first region and the second region.

[0097] In non-vacuum environments, air convection and radiation are significant parasitic heat sources. Surfaces on the heat-conducting structure 10 that are not used for effective cooling and heat conduction continuously absorb heat from the environment. By covering these surfaces with the insulation structure 50, heat intrusion from the environment is blocked, allowing the power of the cooling element 21 to be entirely used to offset the CCD's operating heat dissipation, significantly reducing the system's total power consumption and enabling lower limit temperatures. Simultaneously, fluctuations in ambient temperature directly affect the temperature of the controlled object through the aforementioned parasitic heat flow. By adding the insulation structure 50, the temperature control device 100 becomes less sensitive to thermal interference from the external environment. This makes the control loop of the temperature control device 100 more stable and its response more precise, enabling it to maintain the CCD's temperature within a narrower fluctuation range, which is beneficial for precision optoelectronic equipment requiring ultra-high temperature stability. Moreover, the low-temperature heat-conducting structure 10 exposed to humid air can lead to condensation. The insulation structure 50 eliminates potential condensation problems by isolating the heat-conducting structure 10 from air, further improving the system's adaptability and long-term reliability in complex environments.

[0098] In one possible implementation, the thermal insulation structure 50 is made of nano-aerogel.

[0099] Due to its unique nanoporous network structure, nanoaerogel effectively suppresses air convection and heat conduction of gas molecules. Its thermal conductivity is significantly lower than that of static air even at normal pressure, and can be reduced to extremely low levels under vacuum or low-pressure environments, approaching the performance of vacuum insulation panels (VIPs). This allows for the use of thinner materials to achieve the same insulation effect, saving valuable space in the system. Simultaneously, nanoaerogel is one of the lightest solid materials in the world, providing insulation performance while adding negligible weight to the system. Nanoaerogel also exhibits anti-condensation and hydrophobic properties, and produces no powder or other particulate matter, making it suitable for use in semiconductor devices, effectively reducing condensation problems caused by TEC cooling in ambient temperatures.

[0100] In one possible implementation, a flexible thermally conductive layer is provided between the heat dissipation component 30 and the hot end of the cooling structure 20.

[0101] The flatness tolerance that may exist between the base of the heat dissipation component 30 and the hot end surface of the cooling chip 21 can be effectively filled by the deformation of the flexible thermal conductive layer under pressure, ensuring sufficient contact and significantly reducing contact thermal resistance. Simultaneously, the flexible thermal conductive layer can absorb and buffer the shear stress generated during thermal cycling due to differences in the thermal expansion coefficients of different materials, protecting the brittle cooling chip 21 from mechanical damage and improving the long-term reliability of the system. Furthermore, unlike the precision process requiring eutectic bonding at the cold end, the use of a flexible thermal conductive layer for connection at the hot end greatly simplifies the assembly process, allowing for a certain assembly tolerance between the heat dissipation component 30 and the cooling structure 20, reducing the requirements for processing and assembly precision, improving production yield and maintainability, and facilitating the assembly, disassembly, and replacement of the system.

[0102] In one possible implementation, the width of the heat insulation gasket 41 is the sum of the vacuum cavity thickness of the heat dissipation component 30's heat spreader 311, the thickness of the cooling chip 21, and the thickness of the compressed flexible heat-conducting layer between the heat dissipation component 30 and the hot end of the cooling structure 20.

[0103] In one possible implementation, the flexible thermal conductive layer may be a thermally conductive pad with a matching shape.

[0104] In one possible implementation, the heat dissipation component 30 includes a three-dimensional heat spreader 31 and a plurality of fins 32. The three-dimensional heat spreader 31 is connected to the hot end of the cooling structure 20. The fins 32 are connected to the three-dimensional heat spreader 31.

[0105] For example, the three-dimensional vapor chamber 31 is a three-dimensional vacuum cavity vapor chamber plate with extremely high axial and radial equivalent thermal conductivity. It instantly and uniformly diffuses the highly concentrated heat flow generated by the hot end of the cooling element 21 across the entire plate surface, enabling multiple cooling elements 21 to operate continuously and stably at their maximum design power, thus supporting the system to reach its maximum cooling capacity. When the CCD power consumption changes abruptly, the hot end of the cooling element 21 will experience a momentary thermal shock. The excellent heat diffusion capability of the three-dimensional vapor chamber 31 can quickly absorb this shock, preventing a sharp temperature rise and providing a solid buffer for the stable adjustment of the entire temperature control system, enhancing the system's robustness. Multiple fins 32 connected to the three-dimensional vapor chamber 31 increase the effective heat dissipation surface area in contact with the cooling medium. The three-dimensional vapor chamber 31 is responsible for efficiently transferring heat, while the fins 32 are responsible for efficiently dissipating heat, capable of handling the total heat dissipation generated by the high-power CCD and multiple TECs, ensuring the long-term thermal balance of the system in a non-vacuum environment. Meanwhile, the three-dimensional heat spreader 31 provides the same or even better temperature uniformity while being lighter, thus achieving lightweight and compact structure.

[0106] In one possible implementation, the three-dimensional heat spreader 31 is welded to the fins 32.

[0107] In one possible implementation, the three-dimensional heat spreader 31 includes a heat spreader plate 311 and a plurality of anti-gravity heat pipes 312. One side of the heat spreader plate 311 is connected to the hot end of the refrigeration structure 20, and the other side of the heat spreader plate 311 is connected to the plurality of anti-gravity heat pipes 312, and the heat spreader plate 311 and the anti-gravity heat pipes 312 are interconnected. A plurality of fins 32 are parallel to the heat spreader plate 311 and are respectively connected to the plurality of anti-gravity heat pipes 312.

[0108] By vertically connecting multiple anti-gravity heat pipes 312 to the vapor chamber 311, the three-dimensional vapor chamber 31 is extended from a two-dimensional plane to a three-dimensional space. Simultaneously, the anti-gravity heat pipes 312 overcome the effects of gravity, ensuring normal circulation of the working fluid regardless of how the temperature control device 100 is installed, achieving efficient heat dissipation in all orientations and solving the problem of decreased heat dissipation performance under complex orientations. The main vapor chamber 311 is responsible for receiving and horizontally dissipating concentrated heat from the hot end of the cooling chip 21; while the multiple anti-gravity heat pipes 312 act as independent, efficient heat conduction channels, extracting heat from various areas of the vapor chamber 311 and transporting it to the spacious finned areas 32, far from the heat source. This allows heat to be transferred in parallel and efficiently to every corner of the large finned array 32, multiplying the heat dissipation capacity and maximizing the utilization rate of the heat sink. Meanwhile, the anti-gravity heat pipes 312 are themselves robust metal components. They are connected between the heat spreader 311 and the fins 32, playing a structural support role and significantly enhancing the mechanical strength and rigidity of the heat dissipation component 30.

[0109] In one possible implementation, the fin 32 is made of aluminum alloy.

[0110] Aluminum alloys have extremely low density and excellent specific heat capacity and thermal conductivity. Therefore, using aluminum alloy fins 32 can increase the heat dissipation area of ​​the heat dissipation component while minimizing its weight.

[0111] In one possible implementation, a negative pressure heat extraction system is provided along the extension direction of the fin 32 to force convection heat dissipation of the fin 32.

[0112] In one possible implementation, the temperature control device 100 further includes a temperature sensor 60. The temperature sensor 60 is located on both sides of the heat-conducting structure 10 to detect temperature and control the temperature of the cooling element 21 on the same side via the control unit 70.

[0113] For devices such as multi-chip CCDs that are extremely sensitive to temperature distribution, even a tiny temperature gradient on the heat-conducting structure 10 can directly lead to temperature differences between chips, affecting image quality. Dual-sided independent temperature control can actively maintain the temperature in the central area of ​​the heat-conducting structure 10 in a highly uniform state, eliminating thermal stress and image quality degradation caused by uneven cooling from the source, thus facilitating ultra-high precision measurement.

[0114] In one possible implementation, the temperature sensor 60 is an NTC (Negative Temperature Coefficient) thermistor.

[0115] In one possible implementation, the temperature control device 100 further includes a control unit 70. The control unit 70 is electrically connected to the cooling element 21 and the temperature sensor 60, respectively, to supply power to and control the cooling element 21 and the temperature sensor 60. The control unit 70 is used to control the power of the multiple cooling elements 21 separately according to the detected temperature of the temperature sensor 60 and the set parameters, thereby controlling the cooling effect of each cooling element 21.

[0116] In one possible implementation, the boss 11 penetrates the control unit 70.

[0117] This application embodiment also provides a detection device 200, including the temperature control device 100 described above.

[0118] Given that the detection device 200 in this embodiment includes the temperature control device 100 described in any of the above embodiments, the structure and beneficial effects of the temperature control device 100 in the detection device 200 will not be described in detail here.

[0119] In one possible implementation, the detection device 200 is a TDI camera detector.

[0120] In one possible implementation, the detection device 200 further includes a drive board 201, a fixing plate 202, a socket 203, and a mounting device 204.

[0121] In one possible implementation, the driver board 201 is a detector driver circuit board.

[0122] In one possible implementation, the fixing plate 202 is a detector reinforcing rib fixing plate.

[0123] In one possible implementation, the mounting device 204 is a detector mounting and adjustment device.

[0124] After the multiple protrusions 11 are respectively inserted through the control unit 70, the fixing plate 202, the drive plate 201 and the socket 203, the distance between them and the back of the CCD detector meets the compression installation requirements of the 1mm flexible heat-conducting layer.

[0125] like Figure 4 As shown in the figure, this application embodiment also provides a detection system 300, including the detection device 200 described above.

[0126] In one possible implementation, the detection system 300 is an optical quantity detection system, and the detection device 200 is a detector. The optical quantity detection system includes subsystems such as a light source, illumination, focusing, collection, detector, multi-axis displacement stage, environmental control, and control. The scattered light generated after the wafer is irradiated with ultraviolet light enters the detector through the collection subsystem for imaging. The performance of the detector directly reflects the performance and yield of the optical quantity detection system.

[0127] It is understood that the terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0128] It should be understood that the terms "first," "second," etc., used in this application are for distinguishing purposes only and should not be construed as indicating or implying relative importance or order.

[0129] The phrase "within the range" used in this application, unless otherwise specified, includes both endpoints of the range by default. For example, in the range of 1 to 5, it includes the values ​​1 and 5.

[0130] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0131] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can be fixed connections, detachable connections, mating connections or integral connections; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0132] It should be understood that "multiple" as used in this application means at least two, that is, two or more.

Claims

1. A temperature control device, characterized by, The temperature control device comprises: a heat conduction structure for conducting heat with the temperature control object in a non-connecting manner; a refrigeration structure, a cold end of which is welded to the heat conduction structure, and the refrigeration structure is controlled by a control unit; a heat dissipation component connected to a hot end of the refrigeration structure.

2. The temperature control device of claim 1, wherein The heat conduction structure comprises a plurality of bosses, each of which is arranged through the temperature control object and corresponds to a cooling surface of the temperature control object, and a predetermined gap exists between the boss and the cooling surface for filling a flexible heat conduction layer.

3. The temperature control device of claim 1, wherein, The refrigeration structure comprises a plurality of refrigeration fins arranged symmetrically on both sides of the heat conduction structure, and the heat dissipation component comprises two heat dissipation components arranged symmetrically on both sides of the heat conduction structure and connected to the hot end of the refrigeration fin on the corresponding side, and the cold end of the refrigeration fin is welded to the heat conduction structure.

4. Temperature control device according to any one of claims 1-3, characterized in that The heat dissipation component is fixedly connected to the heat conduction structure by a connecting piece.

5. The temperature control device of claim 4, wherein, An insulating gasket is sleeved outside the connecting piece, one side of the insulating gasket abuts against the heat conduction structure, and the other side abuts against the heat dissipation component.

6. The temperature control device according to any one of claims 1 to 3, wherein The temperature control device further comprises an insulating structure arranged on the outer surface of the heat conduction structure which does not overlap with the first region and the second region. The first region is a region for welding with the refrigeration structure, and the second region is a region for conducting heat with the temperature control object.

7. The temperature control device of claim 1, wherein A flexible heat conduction layer is arranged between the heat dissipation component and the hot end of the refrigeration structure.

8. The temperature control device according to any one of claims 1 to 3, wherein The heat dissipation component comprises a three-dimensional heat equalizing component and a plurality of fins, the three-dimensional heat equalizing component is connected to the hot end of the refrigeration structure, and the fins are connected to the three-dimensional heat equalizing component.

9. The temperature control device of claim 8, wherein, The three-dimensional heat equalizing component comprises a uniform temperature plate and a plurality of inverse gravity heat pipes, one side of the uniform temperature plate is connected to the hot end of the refrigeration structure, the other side of the uniform temperature plate is connected to a plurality of inverse gravity heat pipes and communicates with each other, a plurality of fins are parallel to the uniform temperature plate and are respectively connected to a plurality of inverse gravity heat pipes.

10. A detection device, characterized by The temperature control device comprises any one of claims 1-9.

11. A detection system characterized by, The detection device comprises claim 10.

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