Electronic device

Abstract

An electronic device is provided. The electronic device includes: a sensor layer including a plurality of electrodes arranged in n rows and m columns; and a sensor driver configured to drive the sensor layer, and wherein the electrodes, positioned within one of the m columns, of the plurality of electrodes include: a plurality of electrodes configured to receive a drive pulse signal; and a plurality of inverted electrodes configured to receive an inverted pulse signal different from the driving pulse signal, and wherein the sensor driver is configured to determine a number of the plurality of inverted electrodes based on positions of the plurality of electrodes configured to receive the driving pulse signal, and wherein n and m are natural numbers greater than or equal to 2.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2024-0118568, filed on September 2, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] Some aspects of embodiments of this disclosure described herein relate to an electronic device having a variable number of electrodes in an antiphase region. Background Technology

[0003] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles can display images and, in addition to general input mechanisms such as buttons, keyboards, and mice, can provide touch-based input methods that allow users to input information or commands relatively easily and intuitively.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section need not constitute prior art. Summary of the Invention

[0005] Some aspects of embodiments of this disclosure include an electronic device having a variable number of electrodes in an antiphase region.

[0006] According to some embodiments of this disclosure, an electronic device includes a sensor layer and a sensor driver, the sensor layer including a plurality of electrodes arranged in n rows and m columns, and the sensor driver driving the sensor layer.

[0007] According to some embodiments, the sensor driver provides a drive pulse signal to an electrode in a sensing region, an electrode in a first adjacent region before the sensing region in a first direction, and an electrode in a second adjacent region after the sensing region in a direction opposite to the first direction; provides a ground signal to an electrode in the first ground region before the first adjacent region in a first direction and an electrode in the second ground region after the second adjacent region in a direction opposite to the first direction; and provides an inverted pulse signal to an electrode in the first inverted region before the first ground region in a first direction and an electrode in the second inverted region after the second ground region in a direction opposite to the first direction.

[0008] According to some embodiments, the electrodes in the sensing region, the electrodes in the first adjacent region and the electrodes in the second adjacent region, the electrodes in the first ground region and the electrodes in the second ground region, and the electrodes in the first inverted region and the electrodes in the second inverted region are located in one column of m columns, where n and m are natural numbers greater than or equal to 2.

[0009] According to some embodiments of the disclosure, an electronic device includes a sensor layer including a plurality of electrodes arranged as n rows m columns and a sensor driver driving the sensor layer.

[0010] According to some embodiments, the electrodes among the plurality of electrodes positioned in one of the m columns include electrodes in a sensing region, electrodes in a first adjacent region before the sensing region in a first direction, electrodes in a second adjacent region after the sensing region in a direction opposite to the first direction, electrodes in a first inversion region before the first adjacent region in the first direction, and electrodes in a second inversion region after the second adjacent region in the direction opposite to the first direction.

[0011] According to some embodiments, the first inversion region and the second inversion region each include electrodes arranged in consecutive rows among the n rows.

[0012] According to some embodiments, the sensor driver determines a number of the electrodes in the first inversion region and a number of the electrodes in the second inversion region, wherein n and m are natural numbers greater than or equal to 2.

[0013] According to some embodiments of the disclosure, an electronic device includes a sensor layer including a plurality of electrodes arranged as n rows m columns and a sensor driver driving the sensor layer.

[0014] According to some embodiments, the electrodes among the plurality of electrodes positioned in one of the m columns include a plurality of electrodes receiving a driving pulse signal and a plurality of inversion electrodes receiving an inversion pulse signal different from the driving pulse signal.

[0015] According to some embodiments, the sensor driver determines a number of the plurality of inversion electrodes based on positions of the plurality of electrodes receiving the driving pulse signal, wherein n and m are natural numbers greater than or equal to 2. BRIEF DESCRIPTION OF DRAWINGS

[0016] Aspects of some embodiments of the disclosure are described in greater detail by referring to the drawings, which are in no way intended to limit the scope of the disclosure, and the above and other aspects and features of some embodiments of the disclosure will become more apparent.

[0017] Figure 1 FIG. 1 is a diagram illustrating an interior of a vehicle in which an electronic device according to some embodiments of the disclosure is placed.

[0018] Figure 2 FIG. 2 is a plan view of an electronic device according to some embodiments of the disclosure.

[0019] Figure 3 FIG. 3 is a diagram for describing an operation of an electronic device according to some embodiments of the disclosure.

[0020] Figure 4A This is a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0021] Figure 4B This is a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0022] Figure 5 This is a block diagram of a display layer and a display driver according to some embodiments of the present disclosure.

[0023] Figure 6 This is a block diagram of a sensor layer and a sensor driver according to some embodiments of the present disclosure.

[0024] Figure 7 This is a diagram used to describe the mesh structure of a sensor layer according to some embodiments of the present disclosure.

[0025] Figure 8 This is a cross-sectional view of an electronic device according to some embodiments of the present disclosure.

[0026] Figure 9 This is a diagram used to describe a sensor layer according to some embodiments of the present disclosure.

[0027] Figure 10A This is a diagram used to describe the number of electrodes in the first and second antiphase regions determined when the sensing region is located in the second segment according to some embodiments of the present disclosure.

[0028] Figure 10B This is a diagram used to describe the number of electrodes in a first and second antiphase region determined when the sensing region is located in a first segment according to some embodiments of the present disclosure.

[0029] Figure 10C This is a diagram used to describe the number of electrodes in the first and second antiphase regions determined when the sensing region is located in the third segment according to some embodiments of the present disclosure.

[0030] Figure 11A This is a diagram used to describe a comparative example that differs from embodiments of this disclosure, in which the number of electrodes in the antiphase region is fixed and independent of the position of the sensing region.

[0031] Figure 11B This is a graph used to describe the EMI generated when the number of electrodes in the inverting region is fixed and independent of the position of the sensing region, which differs from the embodiments of this disclosure.

[0032] Figure 12A This is a diagram illustrating aspects of embodiments according to some embodiments of the present disclosure in which the number of electrodes in the antiphase region is determined (variable, respectively) based on the location of the sensing region.

[0033] Figure 12B It is a graph used to describe the EMI generated when the number of electrodes in the inverting region is determined (variable) based on the location of the sensing region according to some embodiments of the present disclosure. Detailed Implementation

[0034] In the specification, when a component (or region, layer, part, etc.) is referred to as being "on", "connected to", or "integrated into" another component, it should be understood that the former may be directly on, directly connected to, or directly integrated into the latter, and may also be on, connected to, or integrated into the latter via a third intermediary component.

[0035] The same reference numerals refer to the same components. Furthermore, in the accompanying drawings, the thickness, scale, and dimensions of the components are exaggerated for the purpose of effectively describing the technical content. The term "and / or" includes one or more combinations that can be defined by the related components.

[0036] The terms “first,” “second,” etc., are used to describe various components, but the components are not limited by the terms. These terms are used only to distinguish one component from another. For example, a first component may be named a second component without departing from the spirit or scope of this disclosure, and vice versa. Unless otherwise stated, the singular form includes the plural form.

[0037] Furthermore, the terms "below," "under," "above," and "over" are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative and are described with reference to the directions indicated in the drawings.

[0038] It will be understood that the terms “comprising,” “including,” “having,” and variations thereof specify the presence of the features, quantities, steps, operations, elements, or components or combinations thereof described in the specification, without excluding the possibility of the presence or addition of one or more other features, quantities, steps, operations, elements, components or combinations thereof.

[0039] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Furthermore, terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context (background) of the relevant art and shall not be interpreted as having an idealized or overly formal meaning unless expressly defined in this disclosure.

[0040] The terms "component" and "unit" refer to software or hardware components that perform a specific function. Hardware components may include, for example, field-programmable gate arrays (FPGAs) or application-specific integrated circuits (ASICs). Software components may refer to executable code and / or data used by executable code in addressable storage media. Thus, software components can be, for example, object-oriented software components, class components, and working components, and may include processes, functions, attributes, programs, subroutines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, or variables.

[0041] In the following description, embodiments of the present disclosure will be illustrated with reference to the accompanying drawings.

[0042] Figure 1 This is a diagram showing the interior of a vehicle AM ​​in which an electronic device 1000 is placed, according to some embodiments of the present disclosure.

[0043] Reference Figure 1 The electronic device 1000 may be a device activated in response to an electrical signal. For example, the electronic device 1000 may display an image in a display area DA. The image may include still images (e.g., static images) and moving images (e.g., video images).

[0044] The display surface on which the image is displayed can correspond to the front surface of the electronic device 1000. The front surface of the electronic device 1000 can be a plane parallel to the first direction DR1 and the second direction DR2. However, embodiments according to this disclosure are not limited thereto. For example, the front surface of the electronic device 1000 can be a curved electronic device 1000 that is curved relative to a direction (e.g., a set direction or a predetermined direction). Optionally, the front surface of the electronic device 1000 can have various curved shapes corresponding to the shape of the mounting target surface of the vehicle AM.

[0045] The thickness direction of the electronic device 1000 can be parallel to the third direction DR3, which intersects the first direction DR1 and the second direction DR2. Therefore, the front surface (or top surface) and rear surface (or bottom surface) of the component forming the electronic device 1000 can be defined based on the third direction DR3.

[0046] According to some embodiments of this disclosure, the electronic device 1000 can be placed inside the vehicle's AM (Automotive Information Center). Therefore, the display area DA of the electronic device 1000 can include at least one of a cluster area CLS, a central information area CID, and a passenger area CDD. Figure 1 In the diagram, the display area DA is shown as including all of the cluster area CLS, the central information area CID, and the passenger area CDD, but at least one of them may be omitted.

[0047] Various alarm displays indicating vehicle speed, engine speed, distance traveled, fuel status, and whether the vehicle's AM (Autonomous Vehicle) system is operating normally can be shown in the Cluster Area (CLS). Various vehicle operation information, such as navigation information, audio, and heating / cooling, can be displayed in the Central Information Area (CID). The Passenger Area (CDD) is a display area for the front passenger seat, which can display not only information related to the driver's AM but also various information unrelated to the driver's AM.

[0048] Electronic device 1000 may include a sensor layer. For example, electronic device 1000 may include a sensor layer capable of receiving input signals from a user. In some embodiments, electronic device 1000 may include a sensor layer capable of receiving input signals from a user in a multi-capacitor manner or a self-dot manner.

[0049] Figure 2 This is a plan view of an electronic device 1000-1 according to some embodiments of the present disclosure.

[0050] Reference Figure 2 Electronic device 1000-1 can be applied to electronic devices such as mobile phones, tablets, smartwatches, laptops, computers, or smart TVs. Figure 2 The image shows a mobile phone as an example.

[0051] According to some embodiments of this disclosure, electronic device 1000-1 can display an image through a display area DA. The display area DA may include a surface defined by a first direction DR1 and a second direction DR2.

[0052] although Figure 2 A candybar-type electronic device 1000-1 is shown by way of example, but the embodiments according to this disclosure are not limited thereto. For example, the description described below can be applied to various electronic devices, such as foldable electronic device 1000-1, rollable electronic device 1000-1, or sliding electronic device 1000-1.

[0053] Figure 3 This is a diagram illustrating the operation of an electronic device 1000 according to some embodiments of the present disclosure.

[0054] Reference Figure 3 The electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C, a sensor driver 200C, and a main driver 1000C.

[0055] Display layer 100 can be a component that actually generates the image. Display layer 100 can be a light-emitting display layer; for example, display layer 100 can include an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer.

[0056] Sensor layer 200 may be positioned on display layer 100. Sensor layer 200 can sense external input applied from the outside (e.g., Figure 3 (2000). External input 2000 may include any input device capable of providing capacitance changes. For example, sensor layer 200 may sense not only passive input devices such as a user's body, but also active input devices that provide drive signals.

[0057] The main driver 1000C can control the overall operation of the electronic device 1000. For example, the main driver 1000C can control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0058] Display driver 100C can drive display layer 100. Display driver 100C can receive image data RGB and control signals D-CS from master driver 1000C. Control signals D-CS can include various signals. For example, control signals D-CS can include input vertical synchronization signals, input horizontal synchronization signals, master clock signals, data enable signals, etc. Display driver 100C can generate vertical and horizontal synchronization signals based on control signals D-CS to control the timing of signals provided to display layer 100.

[0059] Sensor driver 200C can drive sensor layer 200. Sensor driver 200C can receive control signal I-CS from main driver 1000C. Control signal I-CS may include a clock signal and a mode determination signal for determining the operating mode of sensor driver 200C.

[0060] The sensor driver 200C can calculate the input coordinate information based on the signal received from the sensor layer 200, and can provide a coordinate signal I-SS including the coordinate information to the main driver 1000C. The main driver 1000C allows the execution of an operation corresponding to the user input based on the coordinate signal I-SS. For example, the main driver 1000C can operate the display driver 100C to display a new application image on the display layer 100.

[0061] Figure 4AThis is a cross-sectional view of an electronic device 1000 according to some embodiments of the present disclosure.

[0062] Reference Figure 4A The electronic device 1000 may include a display layer 100, a sensor layer 200, an anti-reflective layer 300, and a window 400.

[0063] The display layer 100 may include a substrate layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0064] The substrate layer 110 may be a component providing a substrate surface on which the circuit layer 120 is positioned. The substrate layer 110 may be a glass substrate, a metal substrate, a polymer substrate, etc. However, embodiments according to this disclosure are not limited thereto, and the substrate layer 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0065] Circuit layer 120 can be positioned on substrate layer 110. Circuit layer 120 may include insulating layers, semiconductor patterns, conductive patterns, and signal lines. The insulating layer, semiconductor layer, and conductive layer can be formed on substrate layer 110 by coating or deposition processes, and then the insulating layer, semiconductor layer, and conductive layer can be selectively patterned by multiple photolithography processes. Subsequently, semiconductor patterns, conductive patterns, and signal lines included in circuit layer 120 can be formed.

[0066] The light-emitting element layer 130 may be positioned on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, microLEDs, or nanoLEDs.

[0067] The encapsulation layer 140 can be positioned on the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from moisture, oxygen and foreign matter such as dust particles.

[0068] Sensor layer 200 can be positioned on display layer 100. Sensor layer 200 can be formed on display layer 100 via a continuous process. In this case, sensor layer 200 can be described as being directly positioned on display layer 100. The phrase "~directly positioned~" indicates that no third component is placed between sensor layer 200 and display layer 100. In other words, no additional adhesive member may be placed between sensor layer 200 and display layer 100. Alternatively, sensor layer 200 can be bonded to display layer 100 by an adhesive member. The adhesive member may include a typical adhesive or bonding agent.

[0069] The anti-reflective layer 300 can be positioned on the sensor layer 200. The anti-reflective layer 300 can reduce the reflectivity of external light incident from the outside of the electronic device 1000. The anti-reflective layer 300 can be positioned directly on the sensor layer 200. However, it is not limited to this, and an adhesive material can be placed between the anti-reflective layer 300 and the sensor layer 200.

[0070] Window 400 may be positioned above antireflective layer 300. Window 400 may include an optically transparent insulating material. For example, window 400 may include glass or plastic. Window 400 may have a multilayer or single-layer structure. For example, window 400 may include multiple plastic films bonded to each other by an adhesive, or it may include a glass substrate and a plastic film bonded to each other by an adhesive.

[0071] Figure 4B This is a cross-sectional view of an electronic device 1000_1 according to some embodiments of the present disclosure.

[0072] Reference Figure 4B The electronic device 1000_1 may include a display layer 100_1, a sensor layer 200_1, an anti-reflective layer 300, and a window 400.

[0073] The display layer 100_1 may include a substrate 110_1, a circuit layer 120_1, a light-emitting element layer 130_1, a packaging substrate 140_1, and a bonding member 150_1.

[0074] Each of the substrate 110_1 and the encapsulation substrate 140_1 may be a glass substrate, a metal substrate or a polymer substrate, but is not particularly limited thereto.

[0075] The bonding member 150_1 can be positioned between the substrate 110_1 and the encapsulation substrate 140_1. The bonding member 150_1 can bond the encapsulation substrate 140_1 to the substrate 110_1 or the circuit layer 120_1. The bonding member 150_1 may include inorganic or organic materials. For example, inorganic materials may include glass-like sealants, and organic materials may include photocurable resins or photoplastic resins. However, the materials constituting the bonding member 150_1 are not limited to the examples described above.

[0076] The sensor layer 200_1 can be directly positioned on the encapsulation substrate 140_1. The phrase "~directly positioned~" indicates that no third component is placed between the sensor layer 200_1 and the encapsulation substrate 140_1. That is, a separate adhesive member may not be positioned between the sensor layer 200_1 and the display layer 100_1. However, embodiments according to this disclosure are not limited to this, and an adhesive layer may also be positioned between the sensor layer 200_1 and the encapsulation substrate 140_1.

[0077] Figure 5 This is a block diagram of a display layer 100 and a display driver 100C according to some embodiments of the present disclosure.

[0078] Reference Figure 5 The display layer 100 may include multiple scan lines SL1 to SLx, multiple data lines DL1 to DLy, and multiple pixels PX. Although Figure 5 A single pixel PX is shown, but as those skilled in the art will understand, the display layer 100 may include any suitable number of pixels PX, depending on the design and size of the display layer 100.

[0079] Each of the plurality of pixels PX is connected to a corresponding data line among the plurality of data lines DL1 to DLy, and to a corresponding scan line among the plurality of scan lines SL1 to SLx. Here, "x" can be an integer greater than or equal to 2, and "y" can be an integer greater than or equal to 2. According to some embodiments of this disclosure, the display layer 100 may further include a light emission control line, and the display driver 100C may further include a light emission driving circuit that provides control signals to the light emission control line. The construction of the display layer 100 is not particularly limited.

[0080] Each of the scan lines SL1 to SLx can extend in the second direction DR2, and the scan lines SL1 to SLx can be arranged to be spaced apart from each other in the first direction DR1. Each of the data lines DL1 to DLy can extend in the first direction DR1, and the data lines DL1 to DLy can be arranged to be spaced apart from each other in the second direction DR2.

[0081] The display driver 100C may include a signal control circuit 100C1, a scan drive circuit 100C2, and a data drive circuit 100C3.

[0082] The signal control circuit 100C1 can be controlled from the main driver 1000C (see reference). Figure 3 It receives image data (RGB) and control signals (D-CS). The control signals (D-CS) can include various signals. For example, the control signals (D-CS) can include input vertical synchronization signals, input horizontal synchronization signals, master clock signals, data enable signals, etc.

[0083] The signal control circuit 100C1 can generate a first control signal CONT1 and a vertical synchronization signal Vsync based on the control signal D-CS, and can output the first control signal CONT1 and the vertical synchronization signal Vsync to the scan drive circuit 100C2.

[0084] The signal control circuit 100C1 can generate a second control signal CONT2 and a horizontal synchronization signal Hsync based on the control signal D-CS, and can output the second control signal CONT2 and the horizontal synchronization signal Hsync to the data drive circuit 100C3.

[0085] Furthermore, the signal control circuit 100C1 can output a drive signal DS, obtained by processing the RGB image data to match the operating conditions of the display layer 100, to the data drive circuit 100C3. The first control signal CONT1 and the second control signal CONT2 are signals necessary for the operation of the scan drive circuit 100C2 and the data drive circuit 100C3, and are not particularly limited thereto.

[0086] The scan driving circuit 100C2 drives multiple scan lines SL1 to SLx in response to the first control signal CONT1 and the vertical synchronization signal Vsync. According to some embodiments of this disclosure, the scan driving circuit 100C2 can be integrated with the circuit layer 120 in the display layer 100 (see reference 120). Figure 4A The scan drive circuit 100C2 can be formed in the same process, but is not limited thereto. For example, the scan drive circuit 100C2 can be implemented as an integrated circuit (IC) and can be directly mounted on a region of the display layer 100 (e.g., a set region or a predetermined region), or mounted on a separate printed circuit board in a chip-on-film (COF) manner to be electrically connected to the display layer 100.

[0087] The data driving circuit 100C3 can output grayscale voltages to multiple data lines DL1 to DLy in response to the second control signal CONT2, the horizontal synchronization signal Hsync, and the drive signal DS from the signal control circuit 100C1. The data driving circuit 100C3 can be implemented as an integrated circuit and can be directly mounted on a region of the display layer 100 (e.g., a set area or a predetermined area), or mounted on a separate printed circuit board as a chip-on-film assembly for electrical connection to the display layer 100, but is not particularly limited thereto. For example, the data driving circuit 100C3 can be integrated with the circuit layer 120 (see reference 120) in the display layer 100. Figure 4A They are formed in the same process.

[0088] Figure 6 This is a block diagram of a sensor layer 200 and a sensor driver 200C according to some embodiments of the present disclosure.

[0089] Reference Figure 6The sensor layer 200 may include multiple electrodes TE11 to TEnm. The multiple electrodes TE11 to TEnm may be arranged in n rows and m columns. According to some embodiments, the sensor layer 200 may also include multiple signal lines connected to the multiple electrodes TE11 to TEnm. Here, n may be an integer greater than or equal to 2 (a natural number), and m may be an integer greater than or equal to 2.

[0090] A row can include multiple electrodes TE11 to TEnm arranged in the second direction DR2. For example, a row can include m electrodes. The m electrodes can form a row extending along the second direction DR2 together and can be arranged spaced apart from each other. Furthermore, a column can include multiple electrodes TE11 to TEnm arranged in the opposite direction to the first direction DR1. A column can include n electrodes. The n electrodes can form a column extending in the opposite direction to the first direction DR1 together and can be arranged spaced apart from each other. Figure 6 The diagram shows a rectangular sensor layer 200 comprising multiple electrodes TE11 to TEnm arranged in n rows and m columns as an example, but the shape of the sensor layer 200 is not limited to this. The sensor layer 200 can be applied in various shapes, such as circular, elliptical, and irregular shapes.

[0091] According to some embodiments of this disclosure, multiple electrodes TE11 to TEnm can operate in one of a variety of operating modes. For example, the multiple operating modes may include a sensing mode, a driving mode, a grounding mode, and an inversion mode. The multiple electrodes TE11 to TEnm can operate in one of these modes.

[0092] According to some embodiments of this disclosure, one of the plurality of electrodes TE11 to TEnm, operating in sensing mode, can detect external inputs applied from the outside (e.g., Figure 3 (2000). External input ( Figure 3 The 2000 can include all input devices capable of providing changes in electrostatic capacitance.

[0093] According to some embodiments of this disclosure, electrodes operating in sensing mode or driving mode can receive a driving pulse signal DPS. Furthermore, electrodes operating in ground mode can receive a ground signal GS and can be connected to a ground terminal in response to the ground signal GS. Finally, electrodes operating in inverted mode can receive an inverted pulse signal RPS. A more detailed description of several operating modes will follow.

[0094] According to some embodiments of this disclosure, the sensor driver 200C can be driven from the main driver 1000C (see reference 1000C). Figure 3The sensor driver 200C receives the control signal I-CS. In touch sensing mode, the sensor driver 200C can provide the coordinate signal I-SS to the main driver 1000C (see reference). Figure 3 ).

[0095] The sensor driver 200C is implemented as an integrated circuit (IC) and is directly mounted on a region (e.g., a set region or a predetermined region) of the sensor layer 200, or mounted on a separate printed circuit board in a chip-on-film (COF) manner to be electrically connected to the sensor layer 200.

[0096] The sensor driver 200C may include a sensor control circuit 200C1, a signal generation circuit 200C2, and an input detection circuit 200C3. The sensor control circuit 200C1 can control the operation of the signal generation circuit 200C2 and the input detection circuit 200C3 based on the control signal I-CS.

[0097] The signal generation circuit 200C2 can output the transmission signal TX to multiple electrodes TE11 to TEnm of the sensor layer 200. The input detection circuit 200C3 can receive the detection signal RX from the sensor layer 200. For example, the input detection circuit 200C3 can receive the detection signal RX from multiple electrodes TE11 to TEnm.

[0098] The signal generation circuit 200C2 can be positioned relative to one edge of the sensor layer 200 in a direction opposite to the first direction DR1. Specifically, the signal generation circuit 200C2 can be positioned at a different distance from each row of the plurality of electrodes TE11 to TEnm. For example, the signal generation circuit 200C2 can be positioned at a first distance from the electrodes TE11 to TE1m of the first row, and can be positioned at a second distance from the electrodes TEn1 to TEnm of the nth row. The first distance can be greater than the second distance.

[0099] The input detection circuit 200C3 can convert analog signals into digital signals. For example, the input detection circuit 200C3 can amplify and then filter the received analog signal. More specifically, the input detection circuit 200C3 can convert the filtered signal into a digital signal.

[0100] According to some embodiments of this disclosure, the signal generation circuit 200C2 can sequentially output a transmission signal TX to a plurality of electrodes TE11 to TEnm. Each time the transmission signal TX is provided to each of the corresponding plurality of electrodes TE11 to TEnm, the input detection circuit 200C3 can receive a detection signal RX from the corresponding electrode. Therefore, the sensor driver 200C can detect external input (2000, see reference 2000). Figure 3The coordinate information of the electrodes. For example, when one of the multiple electrodes TE11 to TEnm becomes a sensing electrode, a transmission signal TX (in particular, the drive pulse signal DPS, which will be described later) is provided to the corresponding sensing electrode, and then a detection signal RX can be received from the corresponding sensing electrode.

[0101] According to some embodiments of this disclosure, the strength of the transmitted signal TX received from the signal generation circuit 200C2 by each of the plurality of electrodes TE11 to TEnm can be varied based on the distance between the signal generation circuit 200C2 and the plurality of electrodes TE11 to TEnm. For example, the strength of the transmitted signal TX received by the electrodes TE11 to TE1m of the first row can be weaker than the strength of the transmitted signal TX received by the electrodes TEn1 to TEnm of the nth row. The strength of the transmitted signal TX can indicate the absolute value of the peak values ​​of the drive pulse signal DPS and the inverted pulse signal RPS.

[0102] The transmission signal TX can individually determine the operating modes of multiple electrodes TE11 to TEnm. The transmission signal TX can include a drive pulse signal DPS, a ground signal GS, and an inverted pulse signal RPS. The drive pulse signal DPS can include multiple pulses rising from the ground voltage to a positive drive voltage (or a logic high level). The ground signal GS can be a signal that allows the multiple electrodes TE11 to TEnm to connect to the ground electrode. The inverted pulse signal RPS can include multiple pulses falling from the ground voltage to a negative drive voltage (or a logic low level).

[0103] Figure 7 This is a diagram used to describe the mesh structure of the sensor layer 200 according to some embodiments of the present disclosure.

[0104] Reference Figure 6 and Figure 7 , Figure 7 It shows Figure 6 The image shows a magnified view of region XX', and sensor layer 200 may have a mesh structure. Openings OP-M may be defined within sensor layer 200. Sensor layer 200 may include multiple openings OP-M. However, this is merely an example, and sensor layer 200 may have one of various types of mesh structures.

[0105] Figure 8 This is a cross-sectional view showing an electronic device 1000 according to some embodiments of the present disclosure.

[0106] Reference Figure 8 An electronic device 1000 according to some embodiments of the present disclosure may include a display layer 100, a sensor layer 200, and a window 400.

[0107] The sensor layer 200 may include a first electrode TE11, a second electrode TE12, and a third electrode TE13 arranged in the first row. The first electrode TE11, the second electrode TE12, and the third electrode TE13 may each receive one of the transmitted signals TX (e.g., one of the drive pulse signal DPS, the ground signal GS, and the inverted pulse signal RPS).

[0108] According to some embodiments of this disclosure, the first electrode TE11, the second electrode TE12, and the third electrode TE13 can all receive the drive pulse signal DPS. When a drive voltage is applied to the first electrode TE11, the second electrode TE12, and the third electrode TE13 via the drive pulse signal DPS, a parasitic capacitance Cf can be generated between the sensor layer 200 and the external input 2000 (e.g., in window 400). Electromagnetic interference (EMI) may be generated by the wiring and electrodes (e.g., the first electrode TE11, the second electrode TE12, and the third electrode TE13) within the electronic device 1000 that are subject to the parasitic capacitance Cf and the drive pulse signal DPS. EMI can affect the operation of the electronic device 1000 and external electronic devices that can be driven together with the electronic device 1000.

[0109] To minimize or reduce EMI, an inverted pulse signal RPS can be provided to sensor layer 200. For example, to minimize or reduce EMI, the electrode receiving the inverted pulse signal RPS can be applied with a negative drive voltage to counteract the positive drive voltage of the drive pulse signal DPS. (See below for further details.) Figure 9 To describe the inverted pulse signal RPS in more detail.

[0110] Figure 9 This is a diagram used to describe a sensor layer 200 according to some embodiments of the present disclosure.

[0111] Reference Figure 9 The sensor layer 200 may include multiple electrodes TE. For example, the sensor layer 200 may include multiple electrodes TE arranged in n rows and m columns.

[0112] Some of the multiple electrodes TE can be in the sensing region SR, the first adjacent region AR1, the second adjacent region AR2, the first ground region GR1, the second ground region GR2, the first inverted region RR1, and the second inverted region RR2.

[0113] The electrode TE in the sensing area SR can operate in sensing mode. The electrode TE in the sensing area SR can detect... Figure 3 The external input is 2000, and the detection signal RX can be provided to... Figure 6 The input detection circuit 200C3. For example, the electrode TE in the sensing area SR can be detected based on the drive pulse signal DPS.Figure 3 The external input 2000 can be provided, and the detection signal RX indicating the result of detecting the external input 2000 can be provided to... Figure 6 The input detection circuit 200C3. The electrode TE in the sensing area SR is shown as one by way of example, but there can be two or more.

[0114] The electrodes TE in the first adjacent region AR1 and the second adjacent region AR2 can both receive the drive pulse signal DPS. Furthermore, the electrodes TE in the first adjacent region AR1 and the second adjacent region AR2 can operate in drive mode. For example, the electrodes TE in the first adjacent region AR1 and the second adjacent region AR2 can be given a positive drive voltage by the drive pulse signal DPS.

[0115] The first adjacent region AR1 may be ahead of the sensing region SR in the first direction DR1. Furthermore, the second adjacent region AR2 may be behind the sensing region SR in the opposite direction to the first direction DR1. Although the number of electrodes TE in each of the first adjacent region AR1 and the second adjacent region AR2 is shown as two by way of example, they may be one, three, or more.

[0116] According to some embodiments of this disclosure, a position can be specified in the (k-1)th row before the kth row on the first direction DR1. Here, k is any natural number greater than 0. However, when k is 1, a position can be specified in the nth row (i.e., the last row) before the first row on the first direction DR1.

[0117] Furthermore, in the direction opposite to the first direction DR1, a position can be specified in the (k+1)th row after the kth row. However, when k is n, a position can be specified in the first row after the nth row in the direction opposite to the first direction DR1.

[0118] The electrodes TE in the first grounding region GR1 and the second grounding region GR2 can both receive the grounding signal GS. Furthermore, the electrodes TE in the first grounding region GR1 and the second grounding region GR2 can operate in grounding mode. For example, the electrodes TE in the first grounding region GR1 and the second grounding region GR2 can be connected to grounding electrodes respectively based on the grounding signal GS.

[0119] According to some embodiments of this disclosure, the electrodes TE in the first grounding region GR1 and the second grounding region GR2 can be connected to grounding electrodes respectively, thereby distinguishing between water touch and finger touch. Therefore, the electrodes TE in the first grounding region GR1 and the second grounding region GR2 can minimize or reduce touch malfunctions caused by water.

[0120] The first grounding region GR1 may be located in the first direction DR1 before the first adjacent region AR1. Furthermore, the second grounding region GR2 may be located in the direction opposite to the first direction DR1 after the second adjacent region AR2. The electrode TE in each of the first grounding region GR1 and the second grounding region GR2 is shown as one by way of example, but there may be two or more.

[0121] The electrodes TE in both the first inverting region RR1 and the second inverting region RR2 can receive the inverted pulse signal RPS. Furthermore, the electrodes TE in both the first inverting region RR1 and the second inverting region RR2 can operate in inverted mode. For example, the electrodes TE in both the first inverting region RR1 and the second inverting region RR2 can be subjected to a negative drive voltage by the inverted pulse signal RPS. The electrodes TE in the first inverting region RR1 and the second inverting region RR2 can be referred to as inverting electrodes.

[0122] The first inverting region RR1 may be located in the first direction DR1 before the first grounding region GR1. Furthermore, the second inverting region RR2 may be located in the direction opposite to the first direction DR1 after the second grounding region GR2. The number of electrodes TE in each of the first inverting region RR1 and the second inverting region RR2 is shown by way of example as three, but is not limited to as will be referred to later. Figure 10A to Figure 10C The three described.

[0123] According to some embodiments of this disclosure, depending on the location of the sensing region SR, the first inverting region RR1 or the second inverting region RR2 can be positioned away from the first adjacent region AR1 or the second adjacent region AR2. For example, when the first grounding region GR1 is located in the first row, the first inverting region RR1 preceding the first grounding region GR1 in the first direction DR1 can be located in the (n-2)th to the nth row (at this time, the number of electrodes TE in the first inverting region RR1 is three). Furthermore, when the first grounding region GR1 is located in the second row, the first inverting region RR1 can be located in the first row, the (n-1)th row, and the nth row (at this time, the number of electrodes TE in the first inverting region RR1 is three).

[0124] Furthermore, when the second grounding region GR2 is located in the nth row, the second inverting region RR2, following the second grounding region GR2 in the direction opposite to the first direction DR1, can be located in the first to third rows (at this time, the number of electrodes TE in the second inverting region RR2 is three). Furthermore, when the second grounding region GR2 is located in the (n-1)th row, the second inverting region RR2 can be located in the nth row, the first row, and the second row (at this time, the number of electrodes TE in the second inverting region RR2 is three).

[0125] When the number of electrodes TE in the sensing region SR, the number of electrodes TE in the first adjacent region AR1, and the number of electrodes TE in the first ground region GR1 are all fixed, the position of the first inverting region RR1 can be determined based on the position of the sensing region SR. Therefore, Figure 6 The sensor driver 200C can determine the number of electrodes TE in the first inverting region RR1 based on the rows in which sensing regions SR are located.

[0126] Although the number of electrodes TE in the first inverting region RR1 is described by way of example, the number of electrodes TE in the second inverting region RR2 can also be determined based on the rows in which sensing regions SR are located.

[0127] According to some embodiments of this disclosure, the n rows may include multiple segments (e.g., a first segment, a second segment, and a third segment). For example, when the sensing region SR is in the first segment, all or some of the electrodes TE in the first inverted region RR1 may be positioned away from the first adjacent region AR1 (e.g., positioned in the nth row). Furthermore, when the sensing region SR is in the second segment, the electrodes TE in each of the first inverted region RR1 and the second inverted region RR2 may be positioned adjacent to the electrodes TE in each of the first adjacent region AR1 and the second adjacent region AR2. Finally, when the sensing region SR is in the third segment, all or some of the electrodes TE in the second inverted region RR2 may be positioned away from the second adjacent region AR2 (e.g., positioned in the first row).

[0128] According to some embodiments of this disclosure Figure 6 The sensor driver 200C can determine the number of electrodes TE in each of the first inverting region RR1 and the second inverting region RR2 based on the segment where the sensing region SR is located among multiple segments. Although the number of segments is shown as three by way of example, the number of segments can be less than or greater than three.

[0129] Please refer to later Figure 10A to Figure 10C The number of electrodes TE in the first inverted region RR1 and the second inverted region RR2, which are determined based on the segments with sensing regions SR located in the first to third segments, is described in more detail.

[0130] Figure 10A to Figure 10C This is a diagram illustrating the number of electrodes TE in a first inverted region RR1 and a second inverted region RR2, determined based on a segment of a first to a third segment where a sensing region SR is located, according to some embodiments of the present disclosure.

[0131] Figure 10AThis is a diagram used to describe the number of electrodes TE in the first antiphase region RR1 and the second antiphase region RR2 determined when the sensing region SR is located in the second segment according to some embodiments of the present disclosure.

[0132] Reference Figure 10A When the sensing region SR is located in the 12th row of the second segment, the number of electrodes TE in the first inverted region RR1 and the second inverted region RR2 can be three respectively.

[0133] When the sensing region SR is positioned in the second segment, the first inverting region RR1 and the first adjacent region AR1 can be positioned adjacent to each other, and the second inverting region RR2 and the second adjacent region AR2 can be positioned adjacent to each other. Therefore, in order to cancel the EMI generated by the sensing region SR, the first adjacent region AR1, and the second adjacent region AR2 through the electrodes TE in the first inverting region RR1 and the second inverting region RR2, the number of electrodes TE in the first inverting region RR1 and the second inverting region RR2 may need to be three each.

[0134] Figure 10B This is a diagram illustrating the number of electrodes TE in a first inverted region RR1 and a second inverted region RR2 determined when the sensing region SR is positioned in a first segment according to some embodiments of the present disclosure.

[0135] Reference Figure 10B When the sensing region SR is located in the 6th row of the first segment, the number of electrodes TE in the first inverted region RR1 and the second inverted region RR2 can be two, respectively.

[0136] When the sensing region SR is located in the first segment and the number of electrodes TE in both the first inverted region RR1 and the second inverted region RR2 is three, some of the electrodes TE in the first inverted region RR1 will be located away from the first adjacent region AR1 (e.g., located in the nth row). (Refer to...) Figure 10B Since there are two electrodes TE in the first inverted region RR1, some of the electrodes TE in the first inverted region RR1 may not be located far from the first adjacent region AR1 (e.g., not located in the nth row).

[0137] Therefore, when the sensing region SR is located in the first segment and the number of electrodes TE in both the first inverting region RR1 and the second inverting region RR2 is three, since the first inverting region RR1 and the first adjacent region AR1 are located far apart from each other, the negative drive voltage applied to the electrode TE in the first inverting region RR1 may not effectively cancel the EMI caused by the positive drive voltage applied to the electrode TE in the first adjacent region AR1. Furthermore, EMI may be generated due to the negative drive voltage applied to the electrode TE in the first inverting region RR1.

[0138] For example, in order to prevent some of the electrodes TE in the first inverting region RR1 from being located far from the first adjacent region AR1, or in order to minimize or reduce the generation of EMI caused by the negative drive voltage, it is desirable to adjust the number of electrodes TE in the first inverting region RR1 to two.

[0139] Figure 10C This is a diagram used to describe the number of electrodes TE in the first antiphase region RR1 and the second antiphase region RR2 determined when the sensing region SR is located in the third segment according to some embodiments of the present disclosure.

[0140] Reference Figure 10C When the sensing region SR is located in the nth row of the third segment, the number of electrodes TE in the first inverted region RR1 and the second inverted region RR2 can be four, respectively.

[0141] Reference Figure 6 and Figure 10C According to some embodiments of this disclosure, the signal generation circuit 200C2 may be positioned relative to an edge of the sensor layer 200 in a direction opposite to the first direction DR1. For example, Figure 6 The signal generation circuit 200C2 can be compared to Figure 10C The electrode TE in the nth row is positioned in the opposite direction to the first direction DR1. Therefore, by Figure 6 The signal generation circuit 200C2 provides a transmission signal TX (e.g., drive pulse signal DPS, ground signal GS, or inverted pulse signal RPS) to multiple electrodes TE, the strength of which can vary for each row.

[0142] For example, the strength of the transmitted signal TX received by the electrode TE in the nth row can be stronger than the strength of the transmitted signal TX received by the electrode TE in the first row. In other words, the absolute value of the positive or negative driving voltage that can be applied to the electrode TE in the nth row can be greater than the absolute value of the positive or negative driving voltage that can be applied to the electrode TE in the first row.

[0143] As described above, when the sensing area SR is located in the third segment (located with... Figure 6When the signal generation circuit 200C2 is adjacent, since the positive drive voltage applied to the electrodes TE in the sensing region SR and the first adjacent region AR1 is relatively large, it may be necessary to have a relatively large number of electrodes TE with applied negative drive voltage to counteract the generation of EMI. Therefore, when the sensing region SR is located in the third segment, the number of electrodes TE in the first inverting region RR1 and the second inverting region RR2 can be four each.

[0144] Figure 11A and Figure 11B A comparative example is shown that differs from the embodiments of this disclosure in that the number of electrodes TE in the first inverted region RR1 and the second inverted region RR2 is fixed respectively and is independent of the position of the sensing region SR.

[0145] Figure 11A This is a diagram used to describe a comparative example that differs from embodiments of this disclosure, in which the number of electrodes TE in the inverting region RR is fixed and independent of the position of the sensing region SR.

[0146] Reference Figure 9 and Figure 11A Vertical axis indication Figure 9 The row number of the electrode TE, and the horizontal axis indicates the positioning. Figure 9 The row number of the sensing area SR. Figure 11A An example with 24 rows of electrodes TE is shown, but the number of rows can be more or less than 24 depending on the size of the display panel or the size of the electrodes TE. Regardless of the row or segment where the sensing area SR is located, the number of electrodes TE in the inverting area RR can be fixed at 3.

[0147] Figure 11B This is a graph used to describe the EMI generated when the number of electrodes TE in the inverting region RR is fixed and independent of the position of the sensing region SR, which differs from the embodiments disclosed herein.

[0148] Reference Figure 9 and Figure 11B The vertical axis indicates the EMI level, and the horizontal axis indicates... Figure 9 The operating frequency of the sensor layer 200. When the operating frequency of the sensor layer 200 is between the first frequency f1 and the fifth frequency f5, the EMI level can exceed the reference level Lref three times. For example, when the frequency is the second frequency f2, the first peak P1 can be a first level L1 higher than the reference level Lref; when the frequency is the third frequency f3, the second peak P2 can be a second level L2 higher than the reference level Lref; when the frequency is the fourth frequency f4, the third peak P3 can be a third level L3 higher than the reference level Lref.

[0149] For example, when the number of electrodes TE in both the first inverting region RR1 and the second inverting region RR2 is fixed, regardless of Figure 9 The location of the sensing area SR or Figure 9 Regardless of the positions of the first inverting region RR1 and the second inverting region RR2, the EMI value will be large.

[0150] Figure 12A and Figure 12B An embodiment according to some embodiments of the present disclosure is shown in which the number of electrodes TE in the first inverted region RR1 and the second inverted region RR2 is determined (both are variable) based on the position of the sensing region SR.

[0151] Figure 12A This is a diagram illustrating aspects of embodiments according to the present disclosure in which the number of electrodes TE in the inverted region RR is determined (variable, respectively) based on the location of the sensing region SR.

[0152] Reference Figure 9 and Figure 12A Vertical axis indication Figure 9 The row number of electrode TE, the horizontal axis indicator has positioning Figure 9 The row number of the sensing region SR. Based on the row or segment where the sensing region SR is located, the number of electrodes TE in the inverting region RR can be (variably) determined. Figure 12A An example with n (the number of rows of electrodes TE) of 24 is shown, but n can be greater than or less than 24 depending on the size of the display panel or the size of the electrodes TE.

[0153] According to some embodiments of this disclosure, the first segment may include rows 1, 2, 7 to 17, and 19 to 21. When the sensing region SR is located in the first segment, since the adjacent regions AR and the inverted regions RR can be located adjacent to each other, the number of electrodes TE in the inverted regions RR can both be three.

[0154] Furthermore, the second segment may include rows 3 through 6 and row 18. When the sensing region SR is located in the second segment, since the adjacent regions AR and the inverted region RR can be located far apart from each other, the number of electrodes TE in the inverted region RR can both be two.

[0155] Finally, the third segment may include rows 22 to 24. When the sensing region SR is located in the third segment, due to the drive pulse signal DPS applied to the sensing region SR and the adjacent region AR as described above (refer to...), Figure 6 The strength of the positive driving voltage or the intensity of the positive driving voltage can be relatively strong, so the number of electrodes TE in the inverting region RR can be four.

[0156] According to some embodiments of this disclosure, an array is arranged to receive drive pulse signal DPS (refer to...). Figure 6 The number of electrodes TE in the sensing region SR and the adjacent region AR can be fixed, while the number of electrodes TE in the inverted region RR can be variable. By variably determining the number of electrodes TE in the inverted region RR based on the position of the sensing region SR, EMI of various intensities can be counteracted, and EMI that may be generated by inverted pulse signals can be minimized or reduced.

[0157] Figure 12B This is a graph describing the EMI generated when the number of electrodes TE in the inverting region RR is determined (which are variable) based on the location of the sensing region SR according to some embodiments of the present disclosure.

[0158] Reference Figure 9 and Figure 12B The vertical axis indicates the EMI level, and the horizontal axis indicates... Figure 9 The operating frequency of the sensor layer 200. When the operating frequency of the sensor layer 200 is between the first frequency f1 and the second frequency f2, the EMI level may not exceed the reference level Lref. For example, when the operating frequency is between the first frequency f1 and the second frequency f2, the peak value of the EMI level may not exceed the reference level Lref.

[0159] For example, when the number of electrodes TE in the first antiphase region RR1 and the second antiphase region RR2 is based on Figure 9 The location of the sensing area SR or Figure 9 When the positions of the first inverted region RR1 and the second inverted region RR2 are determined (and are variable), the value of EMI can be minimized or reduced.

[0160] According to some embodiments of this disclosure, EMI (electromagnetic interference) may be generated by drive pulse signals applied to electrodes in the sensing region and adjacent regions. In this case, EMI can be canceled by applying an inverted pulse signal to electrodes in the inverted region. By variably determining the number of electrodes in the inverted region based on the position of the sensing region, EMI of various intensities can be canceled, and EMI that may be generated by the inverted pulse signal can be minimized or relatively reduced.

[0161] Although aspects of some embodiments of this disclosure have been described above with reference to some examples of this disclosure, it will be understood by those skilled in the art or those with ordinary knowledge in the art that various modifications and substitutions can be made without departing from the spirit and scope of the embodiments of this disclosure as set forth in the claims and their equivalents. Therefore, the scope of the embodiments of this disclosure is not limited to the detailed description herein, but should be defined by the appended claims and their equivalents.

Claims

1.An electronic device comprising: a sensor layer including a plurality of electrodes arranged in n rows and m columns; and a sensor driver configured to drive the sensor layer, wherein the sensor driver is configured to: provide a driving pulse signal to electrodes in a sensing region, electrodes in a first adjacent region before the sensing region in a first direction, and electrodes in a second adjacent region after the sensing region in a direction opposite to the first direction among the plurality of electrodes; provide a ground signal to electrodes in a first ground region before the first adjacent region in the first direction and electrodes in a second ground region after the second adjacent region in the direction opposite to the first direction; and provide an inverted pulse signal to electrodes in a first inversion region before the first ground region in the first direction and electrodes in a second inversion region after the second ground region in the direction opposite to the first direction, wherein the electrodes in the sensing region, the electrodes in the first and second adjacent regions, the electrodes in the first and second ground regions, and the electrodes in the first and second inversion regions are positioned in one of the m columns, and wherein n and m are natural numbers greater than or equal to 2. 2.The electronic device of claim 1, wherein, the first and second inversion regions each include electrodes arranged in consecutive rows among the n rows, and wherein the sensor driver is configured to determine a number of electrodes in the first inversion region and a number of electrodes in the second inversion region. 3.The electronic device of claim 2, wherein, the n rows include a plurality of sections, and wherein the sensor driver is configured to determine a section in which a row in which the sensing region is positioned among the plurality of sections. 4.The electronic device of claim 3, wherein, the sensor driver is configured to determine the number of electrodes in the first inversion region and the number of electrodes in the second inversion region based on determining the section in which the row in which the sensing region is positioned among the plurality of sections. 5.The electronic device of claim 4, wherein, the plurality of sections include a first section and a second section, and wherein the sensor driver is configured to: based on determining that the sensing region is positioned in the first section, determine the number of electrodes in the first inversion region and the number of electrodes in the second inversion region as p, respectively; and based on determining that the sensing region is positioned in the second section, determine the number of electrodes in the first inversion region and the number of electrodes in the second inversion region as q, respectively, and wherein p and q are different natural numbers greater than or equal to 2. 6.The electronic device of claim 5, wherein, the plurality of sections further include a third section, wherein the sensor driver is further configured to determine the number of electrodes in the first inversion region and the number of electrodes in the second inversion region as k, respectively, based on determining that the sensing region is positioned in the third section, and wherein k is a natural number greater than or equal to 2 different from p and q. 7.The electronic device of claim 6, wherein p is 3, q is 2, and k is 4. 8.The electronic device of claim 1, wherein The sensor driver includes a signal generation circuit positioned in the direction opposite to the first direction with respect to one edge of the sensor layer, and The signal generation circuit is configured to provide at least one of the drive pulse signal, the ground signal, and the inverting pulse signal to at least some of the plurality of electrodes, respectively. 9.The electronic device of claim 1, wherein The drive pulse signal each includes a plurality of pulses rising from a ground voltage to a positive drive voltage, and The inverting pulse signal each includes a plurality of pulses falling from the ground voltage to a negative drive voltage. 10.The electronic device of claim 1, wherein The electrodes of the sensing region are configured to detect an external input based on the drive pulse signal, and generate a detection signal in response to detecting the external input. 11.The electronic device of claim 1, wherein The electrodes within the first adjacent region and the electrodes within the second adjacent region are each applied with a positive drive voltage based on the drive pulse signal. 12.The electronic device of claim 1, wherein, The electrodes within the first ground region and the electrodes within the second ground region are connected to a ground electrode based on the ground signal, respectively. 13.The electronic device of claim 1, wherein, The electrodes within the first inverting region and the electrodes within the second inverting region are each applied with a negative drive voltage based on the inverting pulse signal. 14.The electronic device of claim 1, wherein, The sensor driver further includes an input detection circuit configured to receive a detection signal from the plurality of electrodes. 15.The electronic device of claim 1, wherein, The plurality of electrodes are formed in a grid structure. 16.The electronic device of claim 1, wherein, The sensor layer is configured to receive the drive pulse signal, the ground signal, and the inverting pulse signal from the sensor driver in a self-pointing manner. 17.An electronic device, the electronic device comprising: a sensor layer including a plurality of electrodes arranged in n rows and m columns; and a sensor driver configured to drive the sensor layer, and wherein the electrodes of the plurality of electrodes positioned in one of the m columns include: electrodes in a sensing region; electrodes in a first adjacent region preceding the sensing region in a first direction; electrodes in a second adjacent region succeeding the sensing region in a direction opposite to the first direction; electrodes in a first inverting region preceding the first adjacent region in the first direction; and electrodes in a second inverting region succeeding the second adjacent region in the direction opposite to the first direction, and wherein the first inverting region and the second inverting region each include electrodes arranged in consecutive rows among the n rows, wherein the sensor driver is configured to determine a number of electrodes in the first inverting region and a number of electrodes in the second inverting region, and wherein n and m are natural numbers greater than or equal to 2. 18.The electronic device of claim 17, wherein, The n rows include a plurality of sections, and The sensor driver is configured to determine a section among the plurality of sections in which a row in which the sensing region is positioned is located, and determine the number of electrodes in the first inverting region and the number of electrodes in the second inverting region based on determining the section among the plurality of sections in which the row in which the sensing region is positioned is located. 19.An electronic device, the electronic device comprising: a sensor layer comprising a plurality of electrodes arranged in n rows and m columns; and a sensor driver configured to drive the sensor layer, and wherein the electrodes of the plurality of electrodes positioned within one of the m columns comprise: a plurality of electrodes configured to receive a driving pulse signal; and a plurality of counter electrodes configured to receive a counter pulse signal different from the driving pulse signal, and wherein the sensor driver is configured to determine the number of the plurality of counter electrodes based on a position of the plurality of electrodes configured to receive the driving pulse signal, and wherein n and m are natural numbers greater than or equal to 2. 20.The electronic device of claim 19, wherein, The number of the plurality of electrodes configured to receive the driving pulse signal is fixed, and the number of the plurality of counter electrodes is variable.

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