Computing chip, laser radar, controller, optical communication system and vehicle

Abstract

The invention discloses a computing chip, a laser radar, a controller, an optical communication system and a vehicle, relates to the technical field of vehicles, and aims to solve the problems of low computing power and high power consumption of a whole vehicle in related technologies. The computing chip comprises an electric computing sub-chip and an optical computing sub-chip which is in communication connection with the electric computing sub-chip, the optical calculation sub-chip is used for receiving an optical signal carrying to-be-calculated data; obtaining a calculation result based on the optical signal carrying the to-be-calculated data; and a calculation result is output to the electric calculation sub-chip in the form of an electric signal.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicles, in particular to a computing chip, a laser radar, a controller, an optical communication system and a vehicle. BACKGROUND

[0002] With the development of automobile electrification and intelligentization, the number of sensors and actuators inside the vehicle gradually increases. Higher requirements are put forward for the perception ability, communication ability and computing ability of the vehicle. SUMMARY

[0003] The purpose of the present application is to provide a computing chip, a laser radar, a controller, an optical communication system and a vehicle.

[0004] To achieve the above purpose, the present application adopts the following technical solutions:

[0005] In a first aspect, the present application provides a computing chip, comprising: an electrical computing sub-chip and an optical computing sub-chip in communication connection with the electrical computing sub-chip; the optical computing sub-chip is configured to receive an optical signal carrying to-be-computed data; based on the optical signal carrying to-be-computed data, a computing result is obtained; and the computing result is output to the electrical computing sub-chip in the form of an electrical signal.

[0006] It can be understood that, compared with the technical solution in the related art which relies on an electrical chip, resulting in low computing power and high power consumption, the computing chip provided by the present application embodiment includes an electrical computing sub-chip and an optical computing sub-chip, which can perform optical computing, and then output the computing result to the electrical computing chip in the form of an electrical signal, so that the computing power of the whole vehicle can be improved.

[0007] In a second aspect, the present application provides a laser radar, comprising: an optical detection assembly and an optical feedback assembly in communication connection with the optical detection assembly; the optical detection assembly is configured to perform phase modulation on a first optical signal from an optical fiber to obtain a first phase-modulated optical signal and a second phase-modulated optical signal; emit the first phase-modulated optical signal to the outside world, and output the second phase-modulated optical signal to the optical feedback assembly; the first phase-modulated optical signal and the second phase-modulated optical signal are orthogonal; and the optical feedback assembly is configured to receive a laser echo signal carrying sensing information; couple the laser echo signal and the second phase-modulated optical signal to obtain a coupled optical signal; and send the coupled optical signal through the optical fiber.

[0008] It can be understood that the laser radar provided by the embodiment of the present application can utilize the light detection assembly to perform phase modulation on the initial light signal from the optical fiber to obtain a first phase-modulated light signal and a second phase-modulated light signal, wherein the first phase-modulated light signal is used for perception detection, and the second phase-modulated light signal is used for laser echo signal coupling and communication to feed back perception information. It can be seen that the laser radar provided by the embodiment of the present application can realize the integration of communication and perception, improve resource utilization, and reduce power consumption; at the same time, the laser radar can send the light signal carrying the perception information through the optical fiber, improve the data transmission rate, and accordingly, the receiving end can also perform optical calculation on the received light signal carrying the perception information, and improve the computing power.

[0009] In a third aspect, the present application provides a controller, comprising a plurality of chips, the plurality of chips comprising a first chip and a second chip, and the first chip and the second chip transmit information or data through optical signals; or an optical communication transmission path is established between the first chip and the second chip.

[0010] It can be understood that the transmission of information or data between the plurality of chips included in the controller through optical signals or through an optical communication transmission path can improve the data transmission efficiency.

[0011] In a fourth aspect, the present application provides an application device, comprising: an application device body; an optical communication assembly, the optical communication assembly being configured to send data generated by the application device body in the form of an optical signal; and the optical communication assembly being configured to convert the received optical signal into an electrical signal and output the electrical signal to the application device body in a signal receiving time period in a communication period.

[0012] It can be understood that the application device provided by the embodiment of the present application can utilize the optical communication assembly to send the data generated by the application device body in the form of an optical signal, thereby improving the data transmission efficiency.

[0013] Optionally, the optical communication assembly can also send the data generated by the application device body in the form of an optical signal in a signal sending time period of the application device, and convert the received optical signal into an electrical signal and send the electrical signal to the application device body in the signal receiving time period, thereby improving the clarity and accuracy of signal transmission.

[0014] In a fifth aspect, the present application provides an optical communication system, comprising: an optical source module, an optical fiber network, at least one application device, and a controller; the optical source module, the at least one application device, and the controller being communicatively connected through the optical fiber network.

[0015] The optical source module is configured to send a plurality of optical carriers.

[0016] The first application device in the at least one application device is configured to receive the first optical carrier transmitted by the light source module through the optical fiber network, modulate the first optical carrier to generate an uplink optical signal, and transmit the uplink optical signal to the controller through the optical fiber network.

[0017] The controller is configured to receive the second optical carrier transmitted by the light source module, modulate the second optical carrier to obtain a downlink optical signal, and transmit the downlink optical signal to the controller through the optical fiber network.

[0018] The optical communication system provided by the embodiment of the present application replaces the traditional vehicle-mounted Ethernet with the optical fiber network, thereby avoiding the time delay problem of the Ethernet, and significantly improving the real-time performance of data transmission, and further ensuring the timeliness and accuracy of vehicle control. The light source module of the uplink signal and the downlink signal facilitates centralized protection and cooling of the light source.

[0019] The present application provides a vehicle, comprising a vehicle frame, and the computing chip provided in the first aspect, the laser radar provided in the second aspect, the controller provided in the third aspect, the application device provided in the fourth aspect, and the optical communication system provided in the fifth aspect. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0021] Figure 1 An architectural diagram of a vehicle provided by the embodiment of the present application;

[0022] Figure 2 An architectural diagram of an optical communication system provided by the embodiment of the present application;

[0023] Figure 3 An architectural diagram of a controller provided by the embodiment of the present application Figure 1 ;

[0024] Figure 4 An architectural diagram of a controller provided by the embodiment of the present application Figure 2 ;

[0025] Figure 5 An architectural diagram of a chip unit provided by the embodiment of the present application;

[0026] Figure 6 An architectural diagram of a controller provided by the embodiment of the present application Figure 3 ;

[0027] Figure 7A schematic diagram of an optical interface integrated chip is provided for embodiments of the present application.

[0028] Figure 8 An architecture of a computing chip is provided for embodiments of the present application Figure 1 ;

[0029] Figure 9 An architecture of a computing chip is provided for embodiments of the present application Figure 2 ;

[0030] Figure 10 An architecture of an application device is provided for embodiments of the present application Figure 1 ;

[0031] Figure 11 An architecture of an application device is provided for embodiments of the present application Figure 2 ;

[0032] Figure 12 An architecture of a lidar is provided for embodiments of the present application Figure 1 ;

[0033] Figure 13 An architecture of a lidar is provided for embodiments of the present application Figure 2 ;

[0034] Figure 14 An architecture of a lidar is provided for embodiments of the present application Figure 3 ;

[0035] Figure 15 An architecture of a fiber optic network is provided for embodiments of the present application Figure 1 ;

[0036] Figure 16 An architecture of a fiber optic network is provided for embodiments of the present application Figure 2 ;

[0037] Figure 17 An architecture of a fiber optic network is provided for embodiments of the present application Figure 3 .

[0038] Fig. 1 is a schematic diagram of a vehicle, wherein the vehicle is 100, the chassis is 110, the body is 120, the wheel is 130, the optical communication system is 140; the light source module is 210, the optical fiber network is 220, the application device is 230, the controller is 240, the light receiving device is 260, the laser radar is 270; the chip unit is 300, the control chip is 310, the computing chip is 320, the storage chip is 330; the photoelectric conversion unit is 400; the electrical computing sub-chip is 3201, the optical computing sub-chip is 3202, the control unit is 3201-1, the optical drive module is 3201-2, the optical computing unit is 3202-1, the photoelectric conversion unit is 3202-2, the optical emission unit is 3202-3, the electrical-optical conversion unit is 3202-4; the optical drive unit is 3201-2-1, the TIA is 3201-2-2; the application device body is 2301, the optical communication assembly is 2302; the photonic integrated circuit is 2302-1, the electronic integrated circuit is 2302-2; the light detection assembly is 2701, the light feedback assembly is 2702; the phase modulation unit is 2701-1, the light splitting unit is 2701-2, the light emitting unit is 2701-3, the coupling unit is 2702-1, the light receiving unit is 2702-2; the optical transmitting device is 280, the optical fiber main line is 221; the optical fiber branch line is 222, the wavelength division demultiplexer is 223, the wavelength division multiplexer is 224. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0040] In the description of the present application, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or relative position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise specified, the above orientation description can be flexibly arranged in the process of actual application, under the condition of meeting the relative position relationship shown in the drawings.

[0041] The terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "multiple" is two or more.

[0042] In describing some embodiments, the use of "communication connection" and "connection," and variations thereof are used to indicate either a direct physical or electrical connection between two or more elements, or to indicate that two or more elements are in communication, directly or indirectly, with one another. In some embodiments, the use of "communication connection" and "connection" can also mean that two or more elements are in communication with one another, directly or indirectly, through one or more wires, wireless links, optical links, or other types of links, whether or not the other types of links are implemented with communication protocols similar to the protocols used with the wires, wireless links, optical links, or other types of links. Embodiments disclosed herein are not necessarily limited to any specific such connection - types.

[0043] In some embodiments of the application, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0044] In some embodiments of the application, the words "exemplary" and / or "example" are used herein to mean an instance of the general case, for clear and consistent description. Any embodiment or design described as "exemplary" and / or "example" is not necessarily to be construed as preferred or advantageous over other embodiments or designs.

[0045] In the description of the specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0046] With the development of automobile electrification, intelligence and networking, and the improvement of the level of assisted driving, the perception, network communication and computing power of the automobile bring great challenges and opportunities. Mainly reflected in the following two aspects:

[0047] (1) The level of assisted driving and multi-sensor fusion. With the continuous improvement of the level of assisted driving, the vehicle needs to obtain information from multiple sensors and perform efficient data fusion. Multiple sensors include cameras, ultrasonic radars, laser radars and millimeter wave radars, etc., each sensor has its unique perception ability and limitation.

[0048] In particular, the development direction of vehicle-mounted cameras has two aspects: first, the number of vehicle-mounted cameras has increased to more than 10; second, the resolution of vehicle-mounted cameras has reached 8 million pixels, and the transmission bandwidth of data without compression has reached nearly 10 Gbps. With the increase in data transmission bandwidth, the requirements for vehicle control systems are also increasing, and the future bandwidth demand may reach 50 Gbps or even 100 Gbps. The fusion of these data requires strong communication and computing capabilities.

[0049] (2) Development of intelligent cockpit. The intelligent cockpit not only provides a more comfortable and convenient driving experience, but also integrates more interactive and entertainment devices. These devices require higher bandwidth for vehicle communication to ensure smooth user experience and high-quality content transmission. To meet these needs, vehicle network architecture is also evolving. From traditional CAN bus to more efficient Ethernet technology, to the application of future 5G and 6G communication technology, vehicle networks will become more intelligent and efficient.

[0050] In summary, the development challenges of new energy vehicle intelligent networking are multi-sensor fusion + high-bandwidth network + high-computing power concentration.

[0051] Currently, the fusion perception of vehicles mainly relies on ultrasonic radar, LiDAR, millimeter wave radar, and cameras, each of which has different advantages and limitations. Cameras can provide high-resolution images, including color information and depth perception (through stereo vision or structured light technology), which helps accurately identify objects (such as traffic signs, pedestrians, vehicles, etc.) and judge distances. In addition, cameras have relatively low cost and are easy to integrate into vehicle systems. However, camera performance may be affected in low light or adverse weather conditions (such as heavy rain, snow, fog, etc.). At the same time, the camera has a limited field of view and range, which may have blind spots. And for fast-moving objects or high-speed vehicles, the camera's frame rate may not be sufficient to provide real-time and accurate perception information.

[0052] Radar sensors can accurately detect the distance and speed of objects. Since radar is an active sensor, it does not rely on ambient light and can penetrate obstacles such as rain, snow, and fog, providing stable perception data, so it performs more reliably in adverse weather conditions such as rain and snow. However, compared to cameras, radar sensors may be weaker in detail and depth perception, and cannot provide high-resolution image information, so the fusion of high-precision radar and high-resolution cameras is a development trend.

[0053] In particular, high-precision lidar, such as frequency-modulated continuous wave radar (FMCW), can achieve higher detection sensitivity and accuracy based on coherent lidar technology, and the power of the FMCW radar is lower and more sensitive than the pulsed ToF lidar. In addition, each pixel of the FMCW radar contains velocity information (4D perception), providing autonomous driving systems with clearer and safer environmental perception capabilities. FMCW measurements can return the radial velocity of each pixel, effectively providing a 4D image. Therefore, developing high-integration FMCW lidar to achieve high precision is a very competitive solution, and thus fusing the complementary information of high-precision sensors and high-precision radar helps to improve the overall vehicle perception capability. However, the lidar used is a pulsed ToF lidar, and its high cost is the main pain point restricting its large-scale application.

[0054] Currently, the transmission bandwidth of traditional vehicle-mounted buses, such as the controller area network bus (CAN), the local interconnect network bus (LIN), the media-oriented systems transport bus (MOST), and the FlexRay bus, is within 150 Mbps, while high-speed vehicle communication is mainly based on Ethernet. Vehicle Ethernet can achieve a transmission rate of up to 100 Mbit / s or even 1 Gbit / s on a single pair of unshielded twisted pair.

[0055] And for the future demand of vehicle-mounted high-bandwidth 50Gbps+, and with the development of autonomous driving, intelligent networking and other technologies, the amount of data transmitted in the vehicle increases dramatically, and the demand for bandwidth also increases. When the bandwidth demand exceeds 40Gbps, optical fiber becomes the preferred transmission medium, and the electromagnetic environment in the vehicle field is more complex, especially in electric vehicles, which integrate high-voltage battery packs and low-voltage electronic components. Therefore, optical fiber is a better choice as a transmission medium to replace cables and twisted pairs. Optical fiber as a transmission medium not only meets the bandwidth demand of future vehicle development, but also better solves the interference of the electromagnetic environment.

[0056] With the rapid development of intelligent networked vehicle technology, especially the improvement of vehicle perception fusion capability and the application of high-bandwidth transmission technology, the electronic and electrical architecture and computing capability of vehicles are facing new challenges and requirements. In related technologies, the electronic and electrical architecture of the vehicle is mostly a network architecture of multi-domain controllers, and the computing power of the vehicle is distributed among different domain controllers and relies on electric chips, resulting in low computing power and high power consumption.

[0057] In addition, as AI large models gradually become a reality, the demand for computing power of intelligent and connected vehicles is growing explosively, and traditional methods of relying on advanced processes to improve computing power have gradually failed to meet this demand.

[0058] To meet the demand for computing power of intelligent and connected vehicles, new computing methods and architectures can be developed, such as memory computing technology and optical computing technology. Among them, memory computing technology integrates computing power and storage capacity on the same chip, effectively avoiding the "memory wall" problem in traditional von Neumann architecture, achieving higher energy efficiency and lower power consumption.

[0059] Optical computing has significant advantages in building large-scale matrix-matrix parallel computing systems with high parallelism, high energy efficiency, and high speed, effectively meeting the demand for high computing power of intelligent and connected vehicles.

[0060] At the same time, the combination of optical computing and optical interconnection not only solves the power wall problem in traditional von Neumann architecture, but also provides high-bandwidth transmission capabilities to meet the demand for data transmission of intelligent and connected vehicles. Through optical computing and optical interconnection, the contradiction between the demand for computing power and low power consumption of intelligent and connected vehicles and the failure of Moore's Law can be effectively solved.

[0061] For high-precision FMCW lidar optical sensing, high-bandwidth optical communication, high-computing optical computing, and low-power optical interconnection, silicon optical platforms and processes indeed provide the possibility of realizing high-integration optical and electronic devices. However, silicon optical technology does indeed face some challenges and limitations in large-scale applications, mainly in the following aspects:

[0062] 1. The core of silicon optical technology is to integrate photonic devices and electronic devices on the same silicon-based platform to achieve optical and electrical signal conversion and processing. However, there are significant differences in lattice constants, thermal expansion coefficients, and other material properties between III-V light emitters (such as InP lasers) and silicon-based platforms, making high-quality epitaxial growth and low-defect-density integration challenging. That is, the bottleneck of large-scale application of silicon optical technology is the compatibility of III-V light emitters and silicon-based platforms.

[0063] 2. In the complex working environment of vehicles, especially in the temperature range of -40°C to 105°C, optical and electrical devices need to maintain high reliability. However, the optical power attenuation and reliability decline of light emitting modules in high-temperature environments are major problems that limit the application of silicon optical technology in vehicles.

[0064] Optical power attenuation is mainly due to changes in carrier concentration and material properties inside semiconductor optical devices at high temperatures, which will affect the quality and performance of optical sensing, optical communication, optical computing, and optical interconnection.

[0065] At the same time, due to the shortening of the service life and the instability of the optical emission device at high temperature, the reliability of the optical emission device also decreases sharply, which will affect the stability and reliability of the entire system, increase the failure rate and maintenance cost.

[0066] In summary, due to the complex vehicle environment, it is difficult to meet the temperature requirements of semiconductor optical devices in optoelectronic technology, which affects the performance stability and reliability of semiconductor optical devices, ultimately leading to inaccurate control of the vehicle and affecting driving safety.

[0067] In this context, in order to solve the problem of low vehicle computing power and high power consumption in the related art, the embodiments of the present application use a combination of optical sensing, optical fiber communication, optical computing and optical interconnection to improve the vehicle computing power and reduce the power consumption. At the same time, due to the complexity of the vehicle environment, there may be a problem of inaccurate control of the vehicle and affecting driving safety, and the embodiments of the present application provide an optical communication system that uses a centralized architecture to facilitate centralized temperature control to accurately control the vehicle and improve driving safety.

[0068] The present application provides a computing chip, a laser radar, a controller, an optical communication system and a vehicle, and the embodiments of the present application will be described in detail below in conjunction with the drawings of the specification.

[0069] As shown in Figure 1 , it is an architecture diagram of a vehicle provided by the embodiments of the present application. The vehicle 100 can include a chassis 110, a vehicle body 120 and vehicle wheels 130. It can be understood that the vehicle 100 can be a fuel car, an electric car, a hybrid car, a gas car, a methanol car, a solar car, etc.

[0070] For example, the vehicle 100 can be a passenger car, a sport utility vehicle (SUV), a multi-purpose vehicle (MPV), etc. It can also be a passenger car, a cargo truck, a semi-trailer, etc. The present application does not make specific limitations.

[0071] It can be understood that the above components are only examples of part of the components of the vehicle 100 and are not a limitation on the specific structure of the vehicle 100.

[0072] In some optional embodiments, the vehicle 100 can also include an optical communication system 140. The optical communication system 140 can realize data transmission of the vehicle 100.

[0073] As shown in Figure 2As shown, an architecture diagram of an optical communication system provided by an embodiment of the present application is shown. The optical communication system 140 can include an optical source module 210, an optical fiber network 220, at least one application device 230, and a controller 240. The controller 240 can be a central controller or a domain controller. The following takes the controller 240 as a central controller as an example to illustrate the communication system of the present application.

[0074] Among them, the at least one application device 230 and the controller 240 are connected in communication through the optical fiber network 220. It can be understood that the optical communication realized through the connection of the optical fiber network 220 can improve the data transmission capability and meet the demand of intelligent connected vehicles for data transmission.

[0075] In some optional embodiments, the optical fiber can be a single-mode optical fiber or a multi-mode optical fiber.

[0076] In some optional embodiments, the optical communication system 140 is deployed on a vehicle, such as Figure 2 As shown, the controller 240 and the optical source module 210 are deployed in the same area of the vehicle. For example, the optical source module 210 can be integrated on the controller 240.

[0077] It can be understood that the optical communication system 140 provided by the embodiment of the present application adopts a centralized architecture, and the controller 240 and the optical source module 210 are deployed in the same area of the vehicle, which facilitates centralized temperature control, avoids the problem that the performance stability and reliability of the semiconductor optical device are affected by the vehicle temperature, so that the vehicle cannot be accurately controlled, and the driving safety is affected, and the vehicle can be accurately controlled, and the driving safety is improved.

[0078] In some optional embodiments, the optical source module 210 is configured to transmit a plurality of optical carriers.

[0079] For example, the optical source module 210 can be a laser diode (LD), for example, the optical source module can be at least one of the following: a III-V semiconductor laser, a positive-intrinsic-negative (PIN) semiconductor, and an avalanche photo diode (APD).

[0080] In some optional embodiments, the optical source module 210 can include one or more optical source modules, which are not limited by the embodiments of the present application.

[0081] As a possible implementation, the optical carrier transmitted by the optical source module 210 can be used for communication. For example, the application device 230 and the controller 240 can use optical signals for data transmission. For example, the application device 230 generates an uplink optical signal by modulating the optical carrier, and the controller 240 generates a downlink optical signal by modulating the optical carrier.

[0082] As another possible implementation, the optical signal can be used for sensing. For example, in the case that the optical communication system 140 includes a sensing device, the sensing device can use the optical signal for sensing detection.

[0083] In some optional embodiments, the first application device 230 of the plurality of application devices 230 is configured to receive a first optical carrier transmitted by the optical source module 210 through the optical fiber network 220, modulate the first optical carrier to generate an uplink optical signal, and transmit the uplink optical signal to the controller 240 through the optical fiber network 220.

[0084] In some optional embodiments, the controller 240 is configured to receive a second optical carrier transmitted by the optical source module 210, modulate the second optical carrier to generate a downlink optical signal, and transmit the downlink optical signal to the controller through the optical fiber network 220.

[0085] It can be understood that the optical source module 210 provided by the embodiments of the present application can provide optical carriers for the optical communication system 140. In this way, the devices (such as the application device 230, the controller 240, or the sensing device) connected by the optical fiber network 220 can receive the optical carriers to generate optical signals. For example, the application device 230 can modulate the received first optical carrier to generate an uplink optical signal, and the controller 240 can modulate the received second optical carrier to generate a downlink optical signal. In this way, the devices in the optical communication system 140 do not need to additionally configure optical source modules to generate optical carriers, thereby improving resource utilization and reducing costs.

[0086] In some optional embodiments, the first application device 230 is specifically configured to receive an optical carrier transmitted by the optical source module 210 during a signal transmission period of the first application device, modulate the received first optical carrier to generate an uplink optical signal, and transmit the uplink optical signal to the controller 240 through the optical fiber network 220; and / or receive a downlink optical signal through the optical fiber network 220 during a signal reception period of the first application device 230.

[0087] In some optional embodiments, the first optical carrier and the second optical carrier are transmitted by the same optical transmitting unit; or, the first optical carrier and the second optical carrier are transmitted by different optical transmitting units; for example, the optical source module includes a first optical transmitting unit and a second optical transmitting unit, the first optical transmitting unit is configured to transmit the first optical carrier, and the second optical transmitting unit is configured to transmit the second optical carrier, and the first optical transmitting unit and the second optical transmitting unit are centrally arranged.

[0088] It can be understood that the optical source module 210 can include a plurality of optical transmitting units, and different optical transmitting units are configured to transmit different optical carriers, so that the optical source module 210 can simultaneously provide a plurality of different optical carriers. At the same time, the optical transmitting units for transmitting the uplink optical signal and the optical transmitting units for transmitting the downlink signal are centrally arranged, so as to facilitate centralized protection and centralized temperature control of the optical source module, for example, facilitating centralized cooling.

[0089] In some optional embodiments, as shown in FIG. 2B, the optical communication system 140 further includes an optical receiving device 260 configured to receive the uplink optical signal. For example, the optical receiving device 260 can be in signal communication connection and exchange with the application device 230 through the optical fiber network 220, for example, receiving the uplink signal generated by the application device 230. Figure 2

[0090] It should be noted that the optical source module 210 and the optical receiving device 260 can be collectively referred to as an optical communication assembly.

[0091] In some optional embodiments, in the case that the optical communication system 140 includes the optical receiving device 260, the controller 240, the optical source module 210 and the optical receiving device 260 are arranged in the same region of the vehicle, so as to facilitate centralized temperature control.

[0092] In some optional embodiments, the application device 230 is configured to transmit data to the controller 240 by using the optical signal in a signal transmission period of the application device 230, and receive data transmitted by the controller 240 by using the optical signal in a signal receiving period of the application device 230.

[0093] For example, the application device 230 described above can include at least one of a camera, a sensor, an actuator, etc.

[0094] In some optional embodiments, the optical communication system 140 further includes a laser radar 270; the laser radar 270 is configured to receive a third optical carrier from the optical source module 210 through the optical fiber network 220, and detect by using the third optical carrier, and output an optical signal carrying the detected sensing information to the controller 240 through the optical fiber network 220.

[0095] ​Exemplarily, the laser radar 270 can be the laser radar 270 shown in Figure 12 or Figure 13 Specifically, refer to the specific introduction of the laser radar 270 below.

[0096] Exemplarily, Figure 12 The first optical signal shown in the first optical signal shown in the third optical carrier is obtained, and the optical signal carrying the sensing information is Figure 12 The coupling optical signal shown in the coupling optical signal.

[0097] In some optional embodiments, the controller 240 includes a plurality of computing chips (not shown in the figure), and the plurality of computing chips are connected through optical fiber communication. It can be understood that the plurality of computing chips are connected through optical fiber communication, realizing optical interconnection, which can improve the data transmission capacity and meet the demand of intelligent networked vehicles for data transmission. Figure 2

[0098] For ease of understanding, the various components of the optical communication system 140 provided by the embodiments of the present application are specifically described below.

[0099] I. Controller

[0100] It can be understood that the controller of the embodiments of the present application can be a central controller or a domain controller.

[0101] In some optional embodiments, the controller 240 is configured to perform computing control on the vehicle. For example, the controller 240 can have at least one of the following functions: a control function on a vehicle control domain, a control function on a cabin domain, a control function on an intelligent driving domain, and a control function on an auxiliary driving domain.

[0102] In some optional embodiments, the controller 240 includes a plurality of chips, and the plurality of chips include a first chip and a second chip. The first chip and the second chip transmit information or data through optical signals, or an optical communication transmission path is established between the first chip and the second chip.

[0103] It can be understood that transmitting information or data through optical signals or transmitting information or data through an optical communication transmission path can improve the data transmission efficiency.

[0104] In some optional embodiments, the first chip is one of an MCU, a GPU, a CPU, an NPU, an FPGA, an ASIC, and an ISP, or the first chip is a computing chip as shown in Figure 8 or Figure 9 Specifically, refer to the specific introduction of the computing chip below.

[0105] In some embodiments, as shown in Figure 3 ​As shown, the controller 240 includes at least one chip of the following: a microcontroller unit (MCU), a central processing unit (CPU), a graphics processing unit (GPU), a neural processing unit (NPU), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC).

[0106] Optionally, the controller 240 can also include a special non-computing type of pre-processing chip for image processing, etc., such as an image signal processor (ISP).

[0107] Optionally, the controller 240 can also include a memory unit for storing data.

[0108] In some optional embodiments, as shown in Figure 4 The controller 240 includes at least one photoelectric conversion interface (or optical interface). In the case of electrical calculation, the controller 240 will perform photoelectric conversion operation on the optical signal received by the optical receiving device 260 to convert it into an electrical signal for electrical calculation.

[0109] In some optional embodiments, as shown in Figure 5 The controller 240 includes a plurality of chip units 300 with different functions, such as a control chip 310, a computing chip 320, a storage chip 330, etc. Among them, the chip units 300 with different functions can be connected through optical fiber communication to realize optical signal transmission and inter-chip signal exchange. It can be understood that the connection between the chip units 300 with different functions through optical fiber communication realizes optical interconnection, which can improve the data transmission capacity and meet the demand of intelligent connected vehicles for data transmission.

[0110] For example, as shown in Figure 6 The MCU and / or CPU chip can be used as the control chip 310 (as shown in Figure 6 The MCU and CPU are used as the control chip), the CPU, GPU, NPU can be used as the computing chip 320, the FPGA, ASIC can also be used as the dedicated computing chip 320, and the memory unit can be used as the storage chip 330.

[0111] Among them, the storage chip 330 is connected with the CPU.

[0112] In some alternative embodiments, the controller 240 further includes an optical switch, through which multiple control chips are communicatively connected to at least one computing chip 320.

[0113] For example, such as Figure 6 As shown, signal exchange between multiple chip units 300 with different functions can be transmitted via optical fiber. The MCU or CPU can receive optical signals transmitted on the optical fiber network 220 through their respective optical interfaces and output them to the control pins of the optical switch. The optical switch can adjust its internal optical path according to the received control signals and forward the optical signals sent by the control chip 310 to the computing chip 320.

[0114] It should be noted that the embodiments of this application do not limit the interconnection method between chip units 300 with different functions, nor do they limit the interconnection method between multiple different computing chips 320. For example, it can be as follows: Figure 6 The Passive Optical Network (PON) shown can also be in other topologies, such as tree, star, bus, daisy chain, etc.

[0115] In some alternative embodiments, such as Figure 7 As shown, the chip unit 300 and the photoelectric conversion unit 400 can be integrated together to form an optical interface integrated chip.

[0116] In some optional embodiments, the photoelectric conversion unit 400 described above may include at least one of the following: a light emitting unit, a light driving unit (DRV), a transimpedance amplifier (TIA), and a light receiving unit. For example, the wavelength range emitted by the light emitting unit is between 850 and 1650 nm, and the light receiving unit may be a PIN or an APD, etc.

[0117] For example, the integration method between the chip unit 300 and the photoelectric conversion unit 400 can be one of the following: discrete integration, co-packaged optics (CPO) packaging, 2.5D packaging, or 3D packaging.

[0118] It can be understood that, since the signal exchange between multiple chip units with different functions can be transmitted by optical fibers, in the case that the chip unit 300 needs to perform electrical calculation, the received optical signal can be converted into an electrical signal by the optoelectronic conversion unit 400 for electrical calculation; or, in the case that the chip unit 300 needs to transmit a signal by an optical fiber, the electrical signal such as a control instruction or a calculation result can be converted into an optical signal by the optoelectronic conversion unit 400 for transmission by an optical fiber.

[0119] II. Computing Chip

[0120] In some optional embodiments, as shown in FIG. 3, the computing chip 320 includes an electrical computing sub-chip 3201 and an optical computing sub-chip 3202 in communication connection with the electrical computing sub-chip 3201. Figure 8

[0121] In some optional embodiments, the optical computing sub-chip 3202 is configured to receive an optical signal carrying data to be calculated, obtain a calculation result based on the optical signal carrying data to be calculated, and output the calculation result in the form of an electrical signal to the electrical computing sub-chip 3201.

[0122] It can be understood that, the computing chip 320 provided by the embodiments of the present application can perform optical calculation by means of the optical computing sub-chip 3202 to obtain a calculation result, and then output the calculation result in the form of an electrical signal to the electrical computing sub-chip 3201, so that the overall computing power of the vehicle can be improved and the power consumption can be reduced by complementing the optical computing sub-chip 3202 and the electrical computing sub-chip 3201.

[0123] In some optional embodiments, the electrical computing sub-chip 3201 can process the received calculation result.

[0124] For example, the optical computing sub-chip 3202 described above can be a silicon optical chip.

[0125] In some optional embodiments, the computing chip 320 can implement optical-electric analog calculation and digital optical calculation based on a silicon-based platform. The optical-electric analog calculation can be at least one or a combination of the following: on-chip integrated optical calculation based on a Mach–Zehnder interferometer (MZI) interference structure, a MicroRing Resonator (MRR), a Wavelength Division Multiplexing (WDM) system, a sub-wavelength diffraction structure, and other types of unit structure designs.

[0126] ​It should be understood that the Mach-Zehnder interferometer is a commonly used optical interferometer, and the Mach-Zehnder interferometer is used to realize modulation and processing of optical signals by using the interference phenomenon of light. On a silicon-based platform, specific MZI structures can be designed to realize optoelectronic analog computing.

[0127] The micro-ring resonator is an optical resonator with high quality factor (Q value), and the micro-ring resonator can enhance or suppress specific wavelength optical signals. When the micro-ring resonator is combined with a wavelength division system, simultaneous processing of multiple wavelength optical signals can be realized, thereby realizing more complex optoelectronic analog computing.

[0128] The sub-wavelength diffraction structure is an optical structure with special design, and the sub-wavelength diffraction structure can realize modulation and processing of optical signals at a sub-wavelength scale. This structure can be realized on a silicon-based platform through nanofabrication technology, providing new possibilities for optoelectronic analog computing.

[0129] In addition to the above several schemes, other types of unit structures can be designed according to specific needs to realize on-chip integrated optical computing. The unit structures can have different functions and characteristics to meet different computing needs.

[0130] In some optional embodiments, as shown in Figure 8 The optical computing sub-chip 3202 includes an optical computing unit 3202-1 and an optoelectronic conversion unit 3202-2 in communication connection with the optical computing unit 3202-1; the optical computing unit 3202-1 is configured to perform computing processing on an optical signal carrying to-be-computed data, obtain a computing result, and output an optical signal carrying the computing result; and the optoelectronic conversion unit 3202-2 is configured to convert the optical signal carrying the computing result into an electrical signal and output the electrical signal to the electronic computing sub-chip 3201.

[0131] It can be understood that the optical computing sub-chip 3202 provided by the embodiments of the present application uses the optical computing unit 3202-1 to perform computing processing on an optical signal carrying to-be-computed data and outputs an optical signal carrying a computing result, and then the optoelectronic conversion unit 3202-2 performs optoelectronic conversion to obtain an electrical signal carrying the computing result and outputs the electrical signal to the electronic computing sub-chip 3201. In this way, optical computing can be realized to improve computing power, and the transmission of the computing result to the electronic computing sub-chip 3201 can be realized, so that the electronic computing sub-chip 3201 can obtain the computing result.

[0132] In some optional embodiments, the optical signal carrying the data to be calculated can be a signal from an external device of the computing chip 320. It can be understood that the optical computing sub-chip 3202 provided in the embodiments of the present application can perform optical calculation on the signal from the external device of the computing chip 320, and transmit the calculation result to the electrical computing sub-chip 3201, so that the electrical computing sub-chip 3201 does not need to perform calculation again, thereby improving the computing power.

[0133] In some optional embodiments, as shown in Figure 8 The optical computing sub-chip 3202 further includes an optical emission unit 3202-3, which is in communication connection with the electro-optical conversion unit 3202-4; the optical emission unit 3202-3 is configured to emit an optical carrier, and the optical signal carrying the data to be calculated is obtained by modulating the optical carrier based on the optical signal carrying the data to be calculated by the electro-optical conversion unit 3202-4.

[0134] It can be understood that, in the case that the optical computing sub-chip 3202 receives the optical signal carrying the data to be calculated sent by the external device of the computing chip 320, the optical computing sub-chip 3202 can emit the optical carrier through the optical emission unit 3202-3, and then modulate the optical carrier based on the optical signal carrying the data to be calculated from the external device by the electro-optical conversion unit 3202-4, to obtain the optical signal carrying the data to be calculated that can be output to the optical computing unit 3202-1, so as to realize optical calculation and improve the computing power.

[0135] In some optional embodiments, as shown in Figure 8 The optical computing sub-chip 3202 further includes an electro-optical conversion unit 3202-4 in communication connection with the optical computing unit 3202-1, and the electro-optical conversion unit 3202-4 is configured to receive the electrical signal carrying the data to be calculated, and convert the electrical signal carrying the data to be calculated into the optical signal carrying the data to be calculated and transmit the optical signal carrying the data to be calculated to the optical computing unit 3202-1.

[0136] Optionally, the electrical signal carrying the data to be calculated is from the electrical computing sub-chip 3201 or from an external device of the computing chip 320.

[0137] It can be understood that the optical computing sub-chip 3202 provided in the embodiments of the present application can receive the electrical signal carrying the data to be calculated, and convert the electrical signal carrying the data to be calculated into the optical signal carrying the data to be calculated by the electro-optical conversion unit 3202-4, and then transmit the optical signal carrying the data to be calculated to the optical computing unit 3202-1 for optical calculation. Moreover, whether the electrical signal carrying the data to be calculated is from the electrical computing sub-chip 3201 or from an external device of the computing chip 320, the calculation result can be transmitted to the electrical computing sub-chip 3201. In this way, optical calculation can be realized, and the electrical computing sub-chip 3201 does not need to perform electrical calculation again, thereby improving the computing power.

[0138] In some optional embodiments, as shown in Figure 8 The electrical computing sub-chip 3201 includes a control unit 3201-1 and an optical driving module 3201-2 connected with the control unit 3201-1. The control unit 3201-1 is configured to output an optical computing requirement including to-be-computed data, and the optical driving module 3201-2 is configured to send an electrical signal carrying the to-be-computed data to the electrical-optical conversion unit 3202-4 of the optical computing sub-chip 3202 according to the computing requirement.

[0139] It can be understood that the electrical computing sub-chip 3201 provided by the embodiments of the present application includes the control unit 3201-1 and the optical driving module 3201-2. The control unit 3201-1 can output an optical computing requirement including to-be-computed data when there is an optical computing requirement, and then the optical driving module 3201-2 sends an electrical signal carrying the to-be-computed data to the electrical-optical conversion unit 3202-4 of the optical computing sub-chip 3202 to trigger the optical computing sub-chip 3202 to perform optical computing on the to-be-computed data, thereby improving the computing power.

[0140] In some optional embodiments, the optical driving module 3201-2 is further configured to receive an electrical signal carrying a computing result sent by the photoelectric conversion unit 3202-2 and transmit the electrical signal to the control unit 3201-1. It can be understood that the optical driving module 3201-2 provided by the embodiments of the present application is further configured to receive an electrical signal carrying a computing result sent by the photoelectric conversion unit 3202-2 and transmit the electrical signal to the control unit 3201-1, so that the control unit 3201-1 can timely receive the computing result. In this way, the electrical computing sub-chip 3201 can obtain the computing result obtained by optical computing without performing electrical computing, thereby improving the computing power.

[0141] In some optional embodiments, as shown in Figure 9 The optical driving module 3201-2 includes an optical driving unit 3201-2-1 and a transimpedance amplifier 3201-2-2.

[0142] The optical driving unit 3201-2-1 is connected with the control unit 3201-1 and the electrical-optical conversion unit 3202-4 in communication. The optical driving unit 3201-2-1 is configured to send an electrical signal carrying to-be-computed data to the electrical-optical conversion unit 3202-4 based on the optical computing requirement output by the control unit 3201-1.

[0143] One end of the transimpedance amplifier 3201-2-2 is connected with the photoelectric conversion unit 3202-2 in communication, and the other end is connected with the control unit 3201-1 in communication. The transimpedance amplifier 3201-2-2 is configured to receive an electrical signal carrying a computing result sent by the photoelectric conversion unit 3202-2 and transmit the electrical signal carrying the computing result to the control unit 3201-1.

[0144] In some optional embodiments, the transimpedance amplifier 3201-2-2 is also used to amplify the received electrical signal carrying the calculation result and transmit the amplified electrical signal to the control unit 3201-1.

[0145] In some alternative embodiments, such as Figure 9 As shown, the electronic computing sub-chip also includes a storage unit 3201-3, which is communicatively connected to the control unit 3201-1. The storage unit 3201-3 is used to store data. It is understood that the electronic computing sub-chip 3201 provided in this embodiment also includes a storage unit 3201-3 for storing data, such as data received or generated by the control unit 3201-1. Thus, the combination of the storage unit 3201-3 and the control unit 3201-1 can improve the operating efficiency of the electronic computing sub-chip.

[0146] In some optional embodiments, the computing chip 320 provided in this application includes at least one of the following: CPU, GPU, and NPU. It is understood that this application does not limit the specific form of the computing chip 320.

[0147] The above is a detailed description of the computing chip 320 provided in the embodiments of this application.

[0148] It is understandable that, compared with related technologies that rely on electrical chips, resulting in low computing power and high power consumption, the computing chip 320 provided in this application embodiment includes an electrical computing sub-chip 3201 and an optical computing sub-chip 3202, which can perform optical computing and then output the computing results to the electrical computing sub-chip 3201 in the form of an electrical signal, thereby improving the computing power of the whole vehicle.

[0149] III. Application Equipment

[0150] like Figure 10 As shown, the application device 230 of this application includes: an application device body 2301 and an optical communication component 2302.

[0151] Optionally, the optical communication component 2302 is used to transmit the data generated by the application device body 2301 in the form of an optical signal during the signal transmission period of the communication cycle of the application device 230; and to convert the received optical signal into an electrical signal and output it to the application device body 2301 during the signal reception period of the communication cycle.

[0152] For example, the application device body 2301 may include at least one of the following: a shooting device, a sensor, and an actuator. For example, an actuator can be understood as a display or an instrument; correspondingly, if the actuator is a display, the application device body 2301 can be a display. A sensor can be understood as radar; correspondingly, if the sensor is radar, the application device body 2301 can be radar. A shooting device can be understood as a camera; correspondingly, if the shooting device is a camera, the application device body 2301 can be a camera. The above are various examples provided for ease of understanding of the application device body 2301, and the embodiments of this application do not limit it.

[0153] In some alternative embodiments, such as Figure 11 As shown, the optical communication component 2302 includes a photonics integrated circuit (PIC) 2302-1 and an electronic integrated circuit (EIC) 2302-2.

[0154] Specifically, during the signal reception period of the communication cycle of the application device 230, the photonic integrated circuit 2302-1 outputs the received optical signal to the electronic integrated circuit 2302-2, which then converts the optical signal into an electrical signal and outputs it to the application device body 2301. During the signal transmission period of the communication cycle of the application device 230, the electronic integrated circuit 2302-2 drives the photonic integrated circuit 2302-1 to transmit the data generated by the application device body 2301 in the form of an optical signal.

[0155] In some alternative embodiments, such as Figure 11 As shown, the photonic integrated circuit 2302-1 includes an optical switching unit, an optical receiving unit, and an optical modulation unit. For example, Figure 11 The optical receiver unit is shown as an optical receiver (PD) and the optical modulation unit is shown as an optical modulator (MOD).

[0156] The optical switch unit provided in this application embodiment can be a single-pole double-throw switch or a single-pole multi-throw switch. When the optical switch unit is a single-pole double-throw switch, it may include a first terminal, a second terminal, and a third terminal. For example, as shown... Figure 11 As shown, the first end of the optical switch unit is communicatively connected to the light source for receiving optical signals, the second end of the optical switch unit is communicatively connected to the optical receiving unit, and the third end of the optical switch unit is communicatively connected to the optical modulation unit.

[0157] The optical switch unit is used to conduct the optical path between the optical receiving unit and the light source during the signal receiving period; and to conduct the optical path between the optical modulation unit and the light source during the signal transmitting period; the optical receiving unit is used to receive the optical signal from the light source during the signal receiving period and output the optical signal to the electronic integrated circuit; the optical modulation unit is used to modulate the data generated by the application device body 2301 onto the optical signal of the light source and emit it during the signal transmitting period.

[0158] In some alternative embodiments, such as Figure 11 As shown, electronic integrated circuit 2302-2 includes an optical drive unit (DRV) and a transimpedance amplifier (TIA). The input port of the transimpedance amplifier unit is communicatively connected to photonic integrated circuit 2302-1, for example, to an optical receiving unit in photonic integrated circuit 2302-1. The output port of the optical drive unit is communicatively connected to photonic integrated circuit 2302-1, for example, to an optical modulation unit in photonic integrated circuit 2302-1.

[0159] Among them, the transimpedance amplifier is used to convert the optical signal from the photonic integrated circuit 2302-1 into an electrical signal and output it to the application device body 2301; the optical driving unit is used to drive the photonic integrated circuit 2302-1 to send the data generated by the application device body 2301 in the form of an optical signal.

[0160] In some optional embodiments, the electronic integrated circuit 2302-2 also includes a Media Access Control (MAC) chip. The input port of the MAC chip is communicatively connected to the output port of the transimpedance amplifier unit, the output port of the MAC chip is communicatively connected to the optical modulation unit, and the MAC chip is communicatively connected to the application device body 2301.

[0161] It should be noted that the MAC chip provided in this application embodiment can determine when a node sends data packets and control the sending and receiving of data through the MAC communication protocol.

[0162] In the downlink scenario, the second terminal of the optical switch unit is closed, and the optical receiver unit receives the first optical signal (i.e., the downlink signal) from the optical fiber network 220, and outputs the first optical signal to the transimpedance amplifier unit. Correspondingly, the transimpedance amplifier unit can receive the first optical signal output by the optical receiver unit and convert it into a first electrical signal. Then, the transimpedance amplifier unit outputs this first electrical signal to the application device body 2301 through the MAC chip.

[0163] In the uplink scenario, the second end of the optical switch unit is closed, and the second electrical signal collected by the application device body 2301 flows through the output port of the MAC chip into the optical drive unit. The optical drive unit outputs the second electrical signal to the optical modulation unit, and then the optical modulation unit superimposes the second electrical signal onto the optical signal, thereby achieving modulation of the optical signal and obtaining the second optical signal (i.e., the uplink signal).

[0164] The sum of the signal transmission time (e.g., uplink signal transmission time tup) and signal reception time (downlink signal reception time tdown) of the application device 230 should be less than or equal to the signal transmission time of the communication cycle of the application device 230.

[0165] It is understood that the application device 230 provided in this application embodiment can use an optical communication component to transmit data generated by the application device body 2301 in the form of optical signals, thereby improving data transmission efficiency. Simultaneously, the optical communication component can also transmit data generated by the application device body 2301 in the form of optical signals during the signal transmission period of the application device 230, and convert the received optical signals into electrical signals and transmit them to the application device body 2301 during the signal reception period. This improves the clarity and accuracy of signal transmission.

[0166] IV. LiDAR

[0167] In some alternative embodiments, such as Figure 12 As shown, the lidar 270 includes: a photodetector 2701 and a photofeedback 2702 that is communicatively connected to the photodetector 2701.

[0168] The optical detection component 2701 is used to phase modulate the first optical signal from the optical fiber to obtain a first phase modulated optical signal and a second phase modulated optical signal; to transmit the first phase modulated optical signal to the outside world and to output the second phase modulated optical signal to the optical feedback component 2702; the optical feedback component 2702 is used to receive the laser echo signal carrying the sensing information; to couple the laser echo signal and the second phase modulated optical signal to obtain a coupled optical signal; and to transmit the coupled optical signal through the optical fiber.

[0169] It is understood that the lidar 270 provided in this application embodiment modulates the first optical signal from the optical fiber to obtain a first phase-modulated optical signal and a second phase-modulated optical signal through phase modulation. The first phase-modulated optical signal is used for sensing, and the second phase-modulated optical signal is coupled with the laser echo signal to obtain a coupled optical signal for communication, thereby providing sensing information to the controller 240. It can be seen that the lidar 270 provided in this application embodiment can integrate communication and sensing, improve resource utilization, and reduce power consumption; simultaneously, the lidar 270 can transmit optical signals carrying sensing information through the optical fiber, improving data transmission rate.

[0170] In some optional embodiments, the phase difference between the first phase modulated optical signal and the second phase modulated optical signal is a preset first phase difference; or, the first phase modulated optical signal and the second phase modulated optical signal are orthogonal.

[0171] It is understood that the lidar 270 provided in this application embodiment can modulate the first optical signal from the optical fiber into two modulated optical signals that satisfy a preset first phase difference, or two modulated optical signals that satisfy phase orthogonality, in order to achieve the integration of communication and sensing, improve resource utilization, and reduce power consumption.

[0172] In some alternative embodiments, such as Figure 13 As shown, the optical detection component 2701 includes: a phase modulation unit 2701-1, a beam splitting unit 2701-2, and a light output unit 2701-3; the beam splitting unit 2701-2 is communicatively connected to the phase modulation unit 2701-1, the light output unit 2701-3, and the optical feedback component 2702.

[0173] The phase modulation unit 2701-1 is used to perform phase modulation on the first optical signal to obtain a first phase-modulated optical signal and a second phase-modulated optical signal; and to output the first phase-modulated optical signal and the second phase-modulated optical signal to the beam splitting unit 2701-2; the beam splitting unit 2701-2 is used to output the first phase-modulated optical signal to the light output unit 2701-3, and to output the second phase-modulated optical signal to the optical feedback component 2702; the light output unit 2701-3 is used to emit the first phase-modulated optical signal to the outside.

[0174] It is understood that the optical detection component 2701 provided in this application embodiment can perform phase modulation on the first optical signal through the phase modulation unit 2701-1 to obtain a first phase modulated optical signal and a second phase modulated optical signal. Then, the first phase modulated optical signal is output to the light output unit 2701-3 for sensing through the beam splitting unit 2701-2, and the second phase modulated optical signal is output to the optical feedback component 2702 for feedback of sensing information. In this way, communication and sensing can be integrated, resource utilization can be improved, and power consumption can be reduced.

[0175] For example, the phase modulation unit 2701-1 can be an IQ modulator (IQ MOD), the beam splitting unit 2701-2 can be a beam splitter, and the light output unit 2701-3 can be a transmitter optical phased array (Tx OPA).

[0176] In some alternative embodiments, such as Figure 13 As shown, the optical feedback component 2702 includes a coupling unit 2702-1 and an optical receiving unit 2702-2. The coupling unit 2702-1 is communicatively connected to the optical receiving unit 2702-2 and the optical detection component 2701.

[0177] The optical receiving unit 2702-2 is used to receive the laser echo signal carrying sensing information; output the laser echo signal to the coupling unit 2702-1; the coupling unit 2702-1 is used to receive the second phase modulated optical signal from the beam splitting unit 2701-2; couple the laser echo signal and the second phase modulated optical signal to obtain a coupled optical signal; and transmit the coupled optical signal through an optical fiber.

[0178] It is understood that the optical feedback component 2702 provided in this application embodiment can receive the laser echo signal carrying the sensing information through the optical receiving unit 2702-2 and output it to the coupling unit 2702-1. Then, the coupling unit 2702-1 couples the laser echo signal and the second phase modulated optical signal from the beam splitting unit 2701-2 to obtain a coupled optical signal and transmits it. In this way, while realizing sensing, the sensing information carried by the laser echo signal can be transmitted through the coupled optical signal to realize communication, improve resource utilization, and reduce power consumption.

[0179] For example, the coupling unit 2702-1 can be a coupler, and the optical receiving unit 2702-2 can be a transmitter optical phased array (Rx OPA).

[0180] In some optional embodiments, the lidar 270 is connected to the computing chip 320 via optical fiber communication, and the computing chip 320 is used to acquire the sensing information based on the first optical signal and the coupled optical signal.

[0181] As can be seen, the lidar 270 provided in this application embodiment can realize the integration of communication and sensing, improve resource utilization, and reduce power consumption. At the same time, the lidar 270 can send the coupled optical signal carrying sensing information to the computing chip 320 through optical fiber. The computing chip 320 can obtain the sensing information based on the first light-year signal and the coupled optical signal. On the one hand, it improves the data transmission rate, and on the other hand, it also facilitates the computing chip 320 to calculate the sensing information.

[0182] Among them, computing chips can be such as Figure 8 or Figure 9 The provided computing chip 320. This computing chip 320 can use an optical computing sub-chip to realize optical computing, thereby improving computing power.

[0183] In some optional embodiments, the photodetector component 2701 and the photofeedback component 2702 in the aforementioned lidar 270 can be integrated on a silicon photonics platform. It is understood that the embodiments of this application can combine a silicon photonics platform to highly integrate the beam splitter unit 2701-2, the phase modulation unit 2701-1, the coupling unit 2702-1, the light receiver unit 2702-2, and the light transmitter unit, allowing more devices to be integrated within a limited chip space, reducing the size of the lidar system and lowering costs. Furthermore, it can optimize the optical path design, reducing signal loss and interference during transmission, which helps improve the lidar's ranging accuracy, detection range, and anti-interference capability.

[0184] For example, lidar 270 can be a frequency modulated continuous wave (FMCW) lidar.

[0185] In one scenario, such as Figure 14 A schematic diagram of an FMCW lidar application is provided, including: a phase modulator IQMOD, a beam splitter, an optical transmitting unit Tx OPA, a coupler, and an optical receiving unit Rx OPA. The light source module 210 sends a wavelength λi optical signal to the FMCW lidar, which enters the phase modulator IQMOD. The phase modulator IQMOD modulates the input wavelength λi optical signal into two optical signals λi(φ1) and λi(φ2) with different phases, and then sends the optical signals λi(φ1) and λi(φ2) to the beam splitter.

[0186] It should be understood that the optical signals λi(φ1) and λi(φ2) typically have a small phase difference to support subsequent coherent detection.

[0187] A beam splitter can split the modulated optical signal λi(φ1) and the optical signal λi(φ2) into two. One path is used for transmission, and the other path is used for coupling with the received laser echo signal.

[0188] The optical emitting unit emits an optical signal Tx OPA, which generates a laser echo signal after encountering an object. This laser echo signal is received by the optical receiving unit Rx OPA. The laser echo signal λi(φ1) can be optically coupled with the optical signal λi(φ2) through a coupler to form a coupled optical signal λi(φ1)+λi(φ2). This coupled optical signal is then output to the controller 240 through the coupler, allowing the controller 240 to provide computing power to analyze and extract the perceived information.

[0189] V. Fiber Optic Network

[0190] In some alternative embodiments, the fiber optic network 220 may be a ring optical network.

[0191] In some alternative embodiments, such as Figure 15 As shown, the fiber optic network 220 includes a fiber optic main line 221, which is communicatively connected to a controller 240. At least one application device 230 is connected to the fiber optic main line 221 to communicate with the controller 240. The fiber optic main line 221 and the controller 240 are communicatively connected through an optical transmitter 280 and an optical receiver 260. The controller 240 sends downlink optical signals to the application device 230 through the optical transmitter 280 to the fiber optic main line 221. The controller 240 is also used to receive uplink optical signals from the fiber optic main line 221 through the optical receiver.

[0192] In some optional embodiments, the optical emitting device 280 includes a light source module 210 and a downlink optical modulator for modulating a second optical carrier to obtain a downlink optical signal.

[0193] Understandably, compared to traditional vehicle Ethernet data transmission solutions, this embodiment uses a fiber optic network 220 for data transmission, which avoids the latency issues of Ethernet and significantly improves data transmission real-time performance. Specifically, the fiber optic network 220 provided in this embodiment includes a fiber optic main line 221, through which at least one application device 230 can connect and communicate with the controller 240 to transmit uplink and downlink optical signals, effectively improving real-time transmission performance.

[0194] In some alternative embodiments, such as Figure 16As shown, the optical fiber network 220 also includes N optical fiber branches 222, which are connected to the main optical fiber 221. The N optical fiber branches 222 are used to transmit light waves of N wavelengths from the main optical fiber 221. The light waves are sent by the optical transmitter 280 and are optical carriers and / or optical signals.

[0195] At least one application device 230 is connected to the main optical fiber 221 through an optical fiber branch 222 of N optical fiber branches 22 that matches the wavelength supported by the application device 230. The optical carrier i transmitted in the optical fiber branch i of the N optical fiber branches 222 is used to modulate the uplink optical signal of the application device i connected to the optical fiber branch i; and / or the optical signal i transmitted in the optical fiber branch i of the N optical fiber branches 222 is the downlink optical signal sent to the application device i connected to the optical fiber branch i.

[0196] N is an integer, N is greater than or equal to 2, and i is a positive integer, i ≤ N.

[0197] It can be understood that application device i is any one of at least one application device 230.

[0198] Optionally, both ends of fiber optic branch i are connected to fiber optic main branch 221.

[0199] It is understood that the optical fiber network 220 provided in this application embodiment includes N optical fiber mains 221, which are used to transmit optical carriers of N wavelengths and / or downlink optical signals of N wavelengths. At least one application device 230 can access the corresponding optical fiber branch 222 among the N optical fiber branches 222. In this way, the application device 230 can modulate the optical carriers transmitted on the optical fiber branch 222 to obtain uplink optical signals and downlink optical signals transmitted on the optical fiber branch 222, thereby realizing signal transmission with the controller 240 and effectively improving the real-time performance of transmission.

[0200] In some alternative embodiments, such as Figure 16 As shown, the fiber optic network 220 also includes a dewavelength division multiplexer 223 and a wavelength division multiplexer 224.

[0201] The wavelength division multiplexer 223 is connected between the light source module 210 and multiple optical fiber branches 222. It is used to decompose the various optical signals of different wavelengths output by the light source module 210 into multiple single-wavelength optical signals of different wavelengths, and output them to their respective optical fiber branches 222.

[0202] For example, the demultiplexer 223 decomposes multiple optical signals of different wavelengths into: an optical signal with wavelength λ1, an optical signal with wavelength λ2, and an optical signal with wavelength λ3. The wavelength λi can be in the range of 850–1650 nm.

[0203] The input of wavelength division multiplexer 224 is communicatively connected to multiple optical fiber branches 222, and is used to combine and output the single-wavelength optical signals transmitted in the multiple optical fiber branches 222.

[0204] In some optional embodiments, the fiber optic network 220 may also be in star, tree, or daisy-chain configurations, and this application does not limit this.

[0205] In one scenario, combined Figure 16 As shown, a time-sharing scheme is adopted between different application devices 230. For n (n≥1) application devices 230, the signal transmission time of each application device 230 is tn.

[0206] It should be understood that the signal transmission time may be the same or different for different application devices 230.

[0207] For a single application device 230, the total time is tn, where the time for the controller 240 to send a signal (i.e., downlink signal) to the application device 230 is tdown, and the time for the application device 230 to send a signal (i.e., uplink signal) to the controller 240 is tup. Then tdown + tup ≤ tn.

[0208] It should be understood that the signal sent by the controller 240 to the application device 230 can be a downlink signal, and the signal sent by the application device 230 to the controller 240 can be an uplink signal.

[0209] Understandably, when the nth application device 230 is operational, the optical signal emitted from the light source module 210 is divided into multiple single-wavelength optical signals with different wavelengths by the wavelength division multiplexer 223, such as λ1, λ2, and λ3 mentioned above. These multiple single-wavelength optical signals then pass through their respective application devices 230 (e.g., cameras / sensors / actuators) to complete the data transmission of uplink and downlink signals.

[0210] In some alternative embodiments, such as Figure 17 The fiber optic network 220 shown includes N fiber optic mains 221. An optical transmitter 280 is used to transmit N wavelength optical carriers and / or N wavelength downlink optical signals to the N fiber optic mains 221. The N fiber optic mains 221 are used to transmit N wavelength optical carriers and / or N wavelength downlink optical signals respectively. At least one application device 230 communicates with the controller 240 through a fiber optic main 221 of the N fiber optic mains 221 that matches the wavelength supported by the application device 230. N is an integer, N is greater than or equal to 2, and i is a positive integer, i ≤ N.

[0211] In some optional embodiments, the optical emitting device 280 includes N light source modules 210 for emitting optical carriers of N wavelengths or for emitting downlink optical signals of N wavelengths. For example, Figure 17 The light source module 210 is shown in the form of an LD.

[0212] In some optional embodiments, the N fiber optic mains 221 are communicatively connected to the controller 240 via N optical receivers 260. For example, Figure 17 The optical receiving device 260 is shown in the form of a PD.

[0213] It is understood that the optical fiber network 220 provided in this application embodiment includes N optical fiber mains 221, which are respectively used to transmit optical carriers of N wavelengths and / or downlink optical signals of N wavelengths emitted by the optical transmitter 280. At least one application device 230 can access the corresponding optical fiber main 221 based on the wavelength. In this way, the application device 230 can modulate the optical carriers transmitted on the optical fiber main 221 to obtain uplink optical signals and downlink optical signals transmitted on the optical fiber main 221, so as to realize communication with the controller 240 and effectively improve the real-time performance of transmission.

[0214] In some optional embodiments, at least one application device 230 includes a first application device and a second application device, wherein the first application device supports a first wavelength and the second application device supports a second wavelength, and the first application device and the second application device are of different types.

[0215] In some alternative embodiments, the fiber optic main 221 includes at least one loop.

[0216] In some alternative embodiments, the number of the above-mentioned loops is multiple.

[0217] In some optional embodiments, the fiber optic main path 221 includes a first ring loop and a second ring loop, the first ring loop and the second ring loop including a common transmitting segment and a common receiving segment; the first ring loop also includes a first loop segment connected to the transmitting segment and the receiving segment; the second ring loop also includes a second loop segment connected to the transmitting segment and the receiving segment, the transmitting segment being connected to the optical transmitting device 280, and the receiving segment being connected to the optical receiving device 260.

[0218] The first and second loop segments are connected to the transmitting segment via optical splitters; and / or, the first and second loop segments are connected to the receiving segment via optical splitters. This allows for the formation of a dual-ring network structure.

[0219] It is understood that the optical communication system provided in this application replaces the traditional vehicle Ethernet with a fiber optic network, thereby avoiding the time-consuming and delaying problems of Ethernet, and significantly improving the real-time performance of data transmission, further ensuring the timeliness and accuracy of vehicle control.

[0220] In the embodiments provided in this application, it should be understood that the disclosed systems and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0221] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0222] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0223] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A computing chip, comprising: Comprising: an electrical computing sub-chip and an optical computing sub-chip in communication connection with the electrical computing sub-chip; the optical computing sub-chip is configured to receive an optical signal carrying data to be computed; based on the optical signal carrying data to be computed, a computing result is obtained; and the computing result is output in the form of an electrical signal to the electrical computing sub-chip.

2. The compute chip of claim 1, wherein, The optical computing sub-chip comprises an optical computing unit and an optoelectronic conversion unit in communication connection with the optical computing unit, the optical computing unit performs computing processing on the optical signal carrying data to be computed and outputs an optical signal carrying a computing result, and the optoelectronic conversion unit is configured to convert the optical signal carrying the computing result into an electrical signal and output the electrical signal to the electrical computing sub-chip.

3. The compute chip of claim 2, wherein, The optical signal carrying data to be computed is a signal from an external device of the computing chip.

4. The compute chip of claim 2, wherein, The optical computing sub-chip further comprises an electro-optical conversion unit in communication connection with the optical computing unit, the electro-optical conversion unit is configured to receive an electrical signal carrying data to be computed, and convert the electrical signal carrying data to be computed into the optical signal carrying data to be computed and transmit the optical signal carrying data to be computed to the optical computing unit, the electrical signal carrying data to be computed is from the electrical computing sub-chip or from an external device of the computing chip.

5. The compute chip of claim 3, wherein, The optical computing sub-chip further comprises an optical emission unit in communication connection with the electro-optical conversion unit; The optical emission unit is configured to emit an optical carrier, and the optical signal carrying data to be computed is obtained by modulating the optical carrier based on the optical signal carrying data to be computed by the electro-optical conversion unit.

6. The compute chip of claim 4, wherein, The electrical computing sub-chip comprises a control unit and an optical driving module in communication connection with the control unit; The control unit is configured to output a light computing requirement, the light computing requirement comprising data to be computed, and the optical driving module is configured to send an electrical signal carrying data to be computed to the electro-optical conversion unit according to the computing requirement.

7. The compute chip of claim 6, wherein, The optical driving module is further configured to receive the electrical signal carrying a computing result sent by the optoelectronic conversion unit and transmit the electrical signal carrying the computing result to the control unit.

8. The compute chip of claim 6, wherein, The computing chip is a CPU, a GPU, or an NPU.

9. A lidar, comprising: Comprising: an optical detection assembly and an optical feedback assembly in communication connection with the optical detection assembly; The optical detection assembly is configured to perform phase modulation on a first optical signal from an optical fiber to obtain a first phase-modulated optical signal and a second phase-modulated optical signal; The first phase-modulated optical signal is emitted to the outside world, and the second phase-modulated optical signal is output to the optical feedback assembly; The optical feedback assembly is configured to receive a laser echo signal carrying sensing information, couple the laser echo signal and the second phase-modulated optical signal to obtain a coupled optical signal, and send the coupled optical signal through the optical fiber.

10. The lidar of claim 9, wherein, The phase difference between the first phase-modulated optical signal and the second phase-modulated optical signal is a preset first phase difference, or The first phase-modulated optical signal and the second phase-modulated optical signal are orthogonal.

11. The lidar of claim 9 or 10, wherein, The optical detection assembly comprises a phase modulation unit, a light splitting unit, and a light output unit, and the light splitting unit is in communication connection with the phase modulation unit, the light output unit, and the optical feedback assembly; The phase modulation unit is configured to perform phase modulation on the first optical signal to obtain the first phase-modulated optical signal and the second phase-modulated optical signal, and configured to output the first phase-modulated optical signal and the second phase-modulated optical signal to the light splitting unit. The light splitting unit is configured to output the first phase-modulated optical signal to the light emitting unit, and configured to output the second phase-modulated optical signal to the optical feedback assembly. The light emitting unit is configured to emit the first phase-modulated optical signal to the outside world.

12. The lidar of claim 11, wherein, The optical feedback assembly comprises a coupling unit and an optical receiving unit, and the coupling unit is communicatively connected to the optical receiving unit and the optical detection assembly. The optical receiving unit is configured to receive a laser echo signal carrying sensing information. The laser echo signal is output to the coupling unit. The coupling unit is configured to receive the second phase-modulated optical signal from the light splitting unit, couple the laser echo signal and the second phase-modulated optical signal to obtain a coupled optical signal, and transmit the coupled optical signal through the optical fiber.

13. The lidar of claim 9, wherein, The laser radar is communicatively connected to a computing chip, and the computing chip is configured to obtain the sensing information according to the first optical signal and the coupled optical signal.

14. The lidar of claim 13, wherein, The computing chip is any one of the computing chips in claims 1-8.

15. A controller characterized by comprising: The controller comprises a plurality of chips, the plurality of chips comprising a first chip and a second chip, and the first chip and the second chip transmit information or data through optical signals, or an optical communication transmission path is established between the first chip and the second chip.

16. The controller of claim 15, wherein, The controller is a central controller.

17. The controller of claim 15, wherein, The first chip is one of an MCU, a GPU, a CPU, an NPU, an FPGA, an ASIC, and an ISP, or The first chip is any one of the computing chips in claims 1-8.

18. An optical communication system, characterized by It comprises: a light source module, an optical fiber network, at least one application device, and a controller; the light source module, the at least one application device, and the controller are communicatively connected through the optical fiber network; The light source module is configured to transmit a plurality of optical carriers. A first application device in the at least one application device is configured to receive a first optical carrier transmitted by the light source module through the optical fiber network, modulate the first optical carrier to generate an uplink optical signal, and transmit the uplink optical signal to the controller through the optical fiber network. The controller is configured to receive a second optical carrier transmitted by the light source module, modulate the second optical carrier to obtain a downlink optical signal, and transmit the downlink optical signal to the controller through the optical fiber network.

19. The optical communication system of claim 18, wherein the first application device is specifically configured to receive an optical carrier transmitted by the light source module in a signal transmission period of the first application device, modulate the received first optical carrier to generate an uplink optical signal, and transmit the uplink optical signal to the controller through the optical fiber network; and / or receive the downlink optical signal through the optical fiber network in a signal receiving period of the first application device.

20. The optical communication system of claim 18, wherein, The optical communication system further comprises a laser radar; The laser radar is configured to receive a third optical carrier from the light source module through the optical fiber network, and detect using the third optical carrier, and output an optical signal carrying the detected sensing information through the optical fiber network to provide transmission to the controller.

21. The optical communication system of claim 20, wherein, The laser radar is the laser radar of any one of claims 9-14, the first optical signal is obtained according to the third optical carrier, and the optical signal carrying the sensing information is the coupled optical signal.

22. The optical communication system of any of claims 18-21, wherein, The first optical carrier and the second optical carrier are transmitted by the same optical transmitting unit; or The first optical carrier and the second optical carrier are transmitted by different optical transmitting units, the light source module comprises a first optical transmitting unit and a second optical transmitting unit, the first optical transmitting unit is configured to transmit the first optical carrier, the second optical transmitting unit is configured to transmit the second optical carrier, and the first optical transmitting unit and the second optical transmitting unit are arranged in a centralized manner.

23. The optical communication system of any of claims 18-21, wherein, The controller and the light source module are arranged in the same region of the vehicle.

24. The optical communication system of claim 18, wherein, The light source module and the optical fiber network comprise a main optical fiber, the main optical fiber is in communication connection with the controller, and the at least one application device accesses the main optical fiber to realize communication with the controller. The main optical fiber and the controller are in communication connection through optical transmitting and receiving devices, the controller transmits downlink optical signals to the application device through the main optical fiber via the optical transmitting device, and the controller is further configured to receive the uplink optical signals from the main optical fiber via the optical receiving device. The optical transmitting device comprises the light source module, and further comprises a downlink optical modulator configured to modulate the second optical carrier to obtain downlink optical signals.

25. The optical communication system of claim 24, wherein, The optical fiber network further comprises N optical fiber branches, the N optical fiber branches are connected with the main optical fiber, and the N optical fiber branches are respectively configured to transmit N wavelengths of optical waves from the main optical fiber, the optical waves are transmitted by the optical transmitting device, and the optical waves are optical carriers and / or optical signals. An application device i in the at least one application device accesses the main optical fiber through an optical fiber branch in the N optical fiber branches that matches a wavelength supported by the application device i, an optical carrier i transmitted by an optical fiber branch i in the N optical fiber branches is configured to modulate an uplink optical signal of the application device i connected with the optical fiber branch i, and / or an optical signal i transmitted by the optical fiber branch i in the N optical fiber branches is a downlink optical signal transmitted to the application device i connected with the optical fiber branch i. N is an integer, N is greater than or equal to 2, and i is a positive integer, i≤N.

26. The optical communication system of claim 25, wherein, Two ends of the optical fiber branch i are respectively connected to the main optical fiber.

27. The optical communication system of claim 25 or 26, wherein, The optical fiber network further comprises a demultiplexer and a multiplexer. The demultiplexer is connected between the light source module and the plurality of optical fiber branches, and is configured to decompose the plurality of optical signals of different wavelengths output by the light source module into a plurality of single-wavelength optical signals of different wavelengths, and output the plurality of single-wavelength optical signals to respective corresponding optical fiber branches. The demultiplexer is connected between the light source module and the plurality of optical fiber branches, and is configured to decompose the plurality of optical signals of different wavelengths output by the light source module into a plurality of single-wavelength optical signals of different wavelengths, and output the plurality of single-wavelength optical signals to respective corresponding optical fiber branches. The input end of the wavelength division multiplexer is in communication connection with the plurality of optical fiber branches, and is configured to combine and output the single-wavelength optical signals transmitted by the plurality of optical fiber branches.

28. The optical communication system of claim 24, wherein, The optical fiber network comprises N optical fiber main paths, and the optical transmitting device is configured to transmit N wavelengths of optical carriers and / or N wavelengths of downlink optical signals to the N optical fiber main paths. The N optical fiber main paths are respectively configured to transmit the N wavelengths of optical carriers and / or the N wavelengths of downlink optical signals. An application device i in the at least one application device communicates with the controller through an optical fiber main path in the N optical fiber main paths that matches a wavelength supported by the application device i. N is an integer, N is greater than or equal to 2, and i is a positive integer, i≤N.

29. The optical communication system of any of claims 25-28, wherein, The optical transmitting device comprises the N optical transmitting units, and is configured to transmit the N wavelengths of optical carriers or to transmit the N wavelengths of downlink optical signals.

30. The optical communication system of any of claims 25-28, wherein, The at least one application device comprises a first application device and a second application device, the first application device supports a first wavelength, the second application device supports a second wavelength, and the first application device and the second application device are different in type.

31. The optical communication system of any of claims 24-30, wherein, The optical fiber main paths comprise at least one ring loop.

32. The optical communication system of claim 31, wherein, The number of the ring loops is a plurality.

33. The optical communication system of claim 32, wherein, The optical fiber main paths comprise a first ring loop and a second ring loop, the first ring loop and the second ring loop comprise a shared transmitting section and a shared receiving section, the first ring loop further comprises a first loop section connected to the transmitting section and the receiving section, the second ring loop further comprises a second loop section connected to the transmitting section and the receiving section, the transmitting section is connected to the optical transmitting device, and the receiving section is connected to the optical receiving device.

34. The optical communication system of claim 33, wherein, The first loop section and the second loop section are connected to the transmitting section through a splitter, and / or the first loop section and the second loop section are connected to the receiving section through a splitter.

35. The optical communication system of any of claims 18-34, wherein, The controller is the controller of any one of claims 15-17.

36. A vehicle characterized by The vehicle comprises a vehicle body. The vehicle further comprises the computing chip of any one of claims 1-8; or The vehicle further comprises the lidar of any one of claims 9-14; or The vehicle further comprises the controller of any one of claims 15-17; or The optical communication system of any one of claims 18-35.

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