Connecting piece, processing method thereof and electronic equipment

Abstract

The invention provides a connecting piece, a processing method thereof and electronic equipment, relates to the technical field of electronic products, and is used for solving the problem of how to enable the connecting piece in the electronic equipment to give consideration to structural strength and lightness and thinness at the same time. The invention discloses a connecting piece. The connecting piece comprises a fixing part and a connecting convex part. The fixing part comprises a first surface, and the first surface is provided with a concave part. The connecting protruding part is arranged on the first surface, and the connecting protruding part and the fixing part are of an integrated structural part. And the connecting convex part is connected with the concave part. The connecting piece provided by the invention is used for connecting parts.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic products, and in particular to a connecting piece, a processing method thereof, and an electronic device. BACKGROUND

[0002] In electronic devices such as mobile phones, tablet computers, etc., a connecting piece such as a middle frame is usually provided, which is used to support internal components. On the one hand, it is required to have a relatively optimal structural strength, and on the other hand, it is required to be light and thin. However, the prior art often cannot simultaneously meet these two requirements. SUMMARY

[0003] Embodiments of the present application provide a connecting piece, a processing method thereof, and an electronic device, which are used to solve the problem of how to make the connecting piece in the electronic device simultaneously consider structural strength and thinness.

[0004] To achieve the above-mentioned purpose, embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, a connecting piece is provided, comprising: a fixed part and a connecting protrusion. The fixed part comprises a first surface, and the first surface is provided with a recessed part. The connecting protrusion is arranged on the first surface, and the connecting protrusion and the fixed part are an integral structure. The connecting protrusion is connected with the recessed part.

[0006] With the above technical solution, the connecting protrusion and the fixed part are an integral structure. Compared with the prior art, the connecting protrusion can be connected with the fixed part without the help of a plastic piece, the structure of the connection is more stable, the connection structural strength of the connecting piece can be enhanced, and the risk of deformation and misalignment caused by loose connection is reduced. At the same time, the integral structure can reduce the number of components required in the assembly process, thereby simplifying the production process, improving the production efficiency, and reducing the assembly cost. The integral structure of the connecting protrusion and the fixed part can also make the position of the connecting protrusion more accurate, reduce the parameter deviation generated in the process of connecting and cooperating the components with the connecting protrusion, and improve the overall performance of the electronic device. In the present application, the recessed part is connected with the connecting protrusion, that is, the material of the recessed part is extruded to form the connecting protrusion. In this way, the connecting protrusion can be formed without using additional materials, effectively reducing material waste and improving material utilization. Since no additional materials are used, the overall weight of the connecting piece can be reduced without sacrificing the connection strength, which is conducive to the realization of the lightness and thinness of the electronic device.

[0007] In one possible implementation of the first aspect, the crystal structure of the connecting protrusion is a first crystal structure, which is elongated and its length direction is aligned with the height direction of the connecting protrusion. The crystal structure of the partial fixing portion where the recess is located is a second crystal structure, which is also elongated and its length direction is aligned with the direction from the recess to the connecting protrusion. That is, during processing, such as forging, stretching, or extrusion, the partial fixing portion where the connecting protrusion and recess are located is subjected to plastic deformation, resulting in a refinement of the internal crystal structure. A smaller crystal structure can hinder dislocation movement; thus, the smaller the crystal structure, the higher the yield strength of the material. Therefore, the elongated crystal structure of the partial fixing portion where the connecting protrusion and recess are located can improve the strength and hardness of the partial fixing portion, contributing to increased tensile strength and yield strength. Furthermore, a finer crystal structure can more evenly distribute externally applied stress, reducing local stress concentration and improving the mechanical properties of the partial fixing portion where the connecting protrusion and recess are located.

[0008] In one possible implementation of the first aspect, the recess is arranged around the periphery of the connecting protrusion. This facilitates material flow during the machining of the connecting protrusion, improving machining efficiency. Furthermore, it allows for more uniform plastic deformation, enhancing the overall quality of the connector.

[0009] In one possible implementation of the first aspect, the recess includes a bottom surface, with one end of the bottom surface facing the connecting protrusion designated as a first end and the other end of the bottom surface away from the connecting protrusion designated as a second end. From the second end to the first end, the bottom surface extends towards the bottom end of the connecting protrusion and slopes towards the top end of the connecting protrusion. This configuration allows for a smoother overall shape of the recess, reducing friction between the bottom surface and the mold, thereby reducing resistance during demolding and facilitating separation of the mold from the bottom surface. Simultaneously, this also allows for a more uniform distribution of pressure within the mold, reducing the risk of bottom surface deformation due to abrupt stress during demolding and facilitating separation of the mold from the bottom surface. Furthermore, during the processing of the connecting protrusion, it facilitates material flow, better promoting material convergence towards the center of the recess to form the connecting protrusion, ensuring uniform material distribution during the forming of the recess and connecting protrusion, and improving the yield rate.

[0010] In one possible implementation of the first aspect, the angle of inclination of the bottom surface relative to the first surface is greater than or equal to 5° and less than or equal to 10°. Setting an appropriate angle on the bottom surface can effectively reduce the friction between the part of the fixing portion where the recess is located and the mold, reduce the force required for demolding, and make it easier to remove the part of the fixing portion where the recess is located from the mold.

[0011] In one possible implementation of the first aspect, the recess further includes a first side surface located on the side of the bottom surface opposite to the connecting protrusion. One end of the first side surface connecting to the bottom surface is designated as a third end, and the other end connecting to the first surface is designated as a fourth end. From the third end to the fourth end, the first side surface slopes away from the connecting protrusion. This arrangement allows for a smoother overall shape of the recess, further reducing friction between the first side surface and the mold, thereby reducing resistance during demolding. It also allows for a more even distribution of pressure within the mold, reducing the risk of deformation of the first side surface due to abrupt stress during demolding and facilitating separation between the mold and the first side surface.

[0012] In one possible implementation of the first aspect, the recess further includes a second side surface located between the bottom surface and the connecting protrusion. One end of the second side surface connecting to the bottom surface is designated as the fifth end, and the other end connecting to the connecting protrusion is designated as the sixth end. From the fifth end to the sixth end, the second side surface slopes away from the first side surface. This arrangement allows for a smoother overall shape of the recess, reducing friction between the second side surface and the mold, thereby reducing resistance during demolding. It also ensures a more even distribution of pressure within the mold, reducing the risk of deformation of the second side surface due to abrupt stress during demolding and facilitating separation between the mold and the second side surface.

[0013] In one possible implementation of the first aspect, the connecting protrusion includes a third side surface located on the side of the connecting protrusion facing the recess. One end of the third side surface connecting to the second side surface is designated as the seventh end, and the end of the third side surface facing away from the second side surface is designated as the eighth end. From the seventh end to the eighth end, the third side surface slopes away from the recess. This arrangement allows for a smoother shape of the connecting protrusion, reducing friction between the connecting protrusion and the mold, thereby reducing resistance during demolding. It also allows for a more uniform distribution of pressure within the mold, reducing the risk of deformation due to abrupt stress during protrusion removal and facilitating separation between the mold and the connecting protrusion. Furthermore, this arrangement facilitates material flow during processing, better promoting material formation of the connecting protrusion, ensuring uniform material distribution during protrusion forming, and improving yield.

[0014] In one possible implementation of the first aspect, the inclination angle of the third side relative to the first surface is greater than or equal to 80° and less than or equal to 85°. Setting an appropriate angle for the third side of the connecting protrusion can effectively reduce the friction between the connecting protrusion and the mold, reduce the force required for demolding, and make it easier to remove the connecting protrusion from the mold.

[0015] In one possible implementation of the first aspect, the connecting protrusion is annular. The annular structure provides better positioning support, ensuring the parts maintain the correct position during operation and reducing errors. Compared to planar contact, the annular structure increases the contact area, thereby improving the joint strength. The annular design can be used with components of various shapes and functions, enhancing the flexibility of the connector.

[0016] In one possible implementation of the first aspect, the annular connecting protrusion includes an inner surface with threads. The threads provide a mechanical locking effect, making the connection between the connector and other components more secure and effectively resisting separation or loosening. Furthermore, the threaded structure helps distribute the load, reducing stress concentration at individual connection points and preventing damage to those points, thereby extending the service life of the connector.

[0017] In one possible implementation of the first aspect, the thickness of the fixing part is less than or equal to 2 mm. A smaller thickness of the fixing part can reduce the weight of the electronic device, help improve product performance, and achieve structural lightweighting.

[0018] In one possible implementation of the first aspect, the materials for both the fixing part and the connecting protrusion are metals. Metals typically possess excellent mechanical properties, such as high strength and stiffness, enabling them to withstand large loads and pressures, ensuring the stability of the connection. Metals are also easily processed into various shapes, allowing for complex designs.

[0019] In one possible implementation of the first aspect, the fixing part and the connecting protrusion are made of aluminum alloy, or the fixing part and the connecting protrusion are made of magnesium alloy. Aluminum alloy has a low density, which significantly reduces the weight of the connector, making it suitable for applications with high lightweight requirements. Aluminum alloy is easy to process and meets various design needs. Magnesium alloy is one of the lightest of all metals, possessing excellent lightweight properties, further reducing the overall weight of the connector. While maintaining lightweight properties, magnesium alloy can provide high strength and stiffness, making it suitable for high-performance applications.

[0020] In one possible implementation of the first aspect, the first surface is provided with an insulating portion that covers the recessed portion and is located on the periphery of the protrusion. By providing the insulating portion, the recessed portion can be covered, effectively protecting the internal structure from damage by the external environment. Simultaneously, the insulating portion reduces direct contact between the fixing portion and other components, reducing the risk of short circuits. Furthermore, since the insulating portion is located on the periphery of the protrusion, it does not affect the connection between the protrusion and other components.

[0021] In one possible implementation of the first aspect, the connector is a mid-frame. As the structural skeleton of the electronic device, the mid-frame needs to be fixed and connected to multiple components. Using this connector as a mid-frame increases the connection strength of the mid-frame, making the connection with other components more stable, thereby improving the overall performance of the electronic device.

[0022] Secondly, an electronic device is also provided, including components and connectors, wherein the components are connected to the connectors, and the connectors are the connectors described in any of the above technical solutions.

[0023] Since the electronic device provided in this application includes a connector, and the connector is the connector of any of the above technical solutions, both can solve the same problem and achieve the same effect.

[0024] Thirdly, a method for processing a connector is also provided, including:

[0025] A substrate is provided, the substrate including a first surface, the first surface having a first region and a second region adjoining each other, the substrate including a first portion of material forming the first region;

[0026] The first portion of material is pressed into the second region to form a connecting protrusion in the second region and a recess in the first region. Pressing the first portion of material into the second region causes plastic deformation in both regions, resulting in a refinement of the metallographic unit structure within those regions. This improves the material's strength and toughness, making the connection between the connecting protrusion and the fixing part more stable. This enhances the strength of the connector structure and reduces the risk of deformation and misalignment due to loosening at the connection point. Furthermore, since the connecting protrusion is formed by pressing the first portion of material into the second region, no additional material is needed, effectively reducing material waste and contributing to a lighter and thinner overall weight for electronic devices.

[0027] In one possible implementation of the third aspect, pressing the first portion of material into the second region includes:

[0028] The first part of the material is extruded into the second region using a forging process.

[0029] The connecting protrusion is formed by forging, making it an integral structural component with the fixing part. This results in a more stable connection structure, enhancing the strength of the connection and further strengthening the connection area. Simultaneously, forging allows for higher machining precision, ensuring more accurate shape and dimensions of the connecting protrusion. This reduces parameter deviations during the mating and fitting of components with the connecting protrusion, ultimately improving the overall performance of the electronic equipment.

[0030] In one possible implementation of the third aspect, the forging process is hot forging. At high temperatures, the plasticity of metallic materials increases significantly, making it easier to process them into various complex shapes with less susceptibility to cracking or fracture. Because the strength of the material decreases at high temperatures, the pressure and force required for hot forging are relatively smaller, reducing the load on forging equipment and energy consumption. Furthermore, hot-forged connecting protrusions exhibit better fatigue performance, making them suitable for high-load, repetitive-stress applications.

[0031] The technical effects of any of the design methods in the second to third aspects can be found in the technical effects of different design methods in the first aspect, and will not be repeated here. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0033] Figure 2 This is a partial structural diagram of a mid-frame provided in related technologies;

[0034] Figure 3 for Figure 2 A partial structural diagram of the insulating part of a middle frame is provided;

[0035] Figure 4 This is a schematic diagram of the structure of a middle frame provided in an embodiment of this application;

[0036] Figure 5 This is a partial structural comparison diagram of the mid-frame in related technologies and the mid-frame provided in the embodiments of this application;

[0037] Figure 6 for Figure 4 The provided section shows a partial cross-sectional view of the middle frame.

[0038] Figure 7 A schematic diagram of the crystal structure of the connecting convex and concave portions of a middle frame provided in an embodiment of this application;

[0039] Figure 8 A partial comparative structural diagram of the mid-frame provided in the embodiments of this application and the mid-frame machined by CNC technology;

[0040] Figure 9 A schematic diagram of the crystal structure of the mid-frame manufactured using CNC technology;

[0041] Figure 10 A cross-sectional schematic diagram of the recess provided in an embodiment of this application;

[0042] Figure 11 This is a cross-sectional schematic diagram of the connecting protrusion provided in an embodiment of this application;

[0043] Figure 12 This is a structural diagram of the first included angle and the second included angle provided in an embodiment of this application;

[0044] Figure 13 A partial structural diagram of the middle frame provided in an embodiment of this application;

[0045] Figure 14 A flowchart illustrating a method for processing a mid-frame, as provided in an embodiment of this application;

[0046] Figure 15 A schematic diagram illustrating a processing method for a mid-frame provided in an embodiment of this application;

[0047] Figure 16 A flowchart illustrating a forging method for a middle frame provided in this application embodiment;

[0048] Figure 17 A schematic diagram illustrating a forging method for a middle frame provided in an embodiment of this application;

[0049] Figure 18 This is a schematic diagram of the structure of an upper mold provided in an embodiment of this application;

[0050] Figure 19 This is a schematic diagram of the structure of a lower mold provided in an embodiment of this application;

[0051] Figure 20 A flowchart illustrating the engagement of the upper mold and lower mold with the substrate, as provided in the embodiments of this application;

[0052] Figure 21 A flowchart illustrating the separation of the upper mold and lower mold from the substrate, as provided in the embodiments of this application;

[0053] Figure 22 This is a flowchart illustrating the tapping of a middle frame according to an embodiment of this application. Detailed Implementation

[0054] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0055] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0056] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0057] This application provides an electronic device 100. The electronic device 100 includes, but is not limited to, mobile phones, electric toothbrushes, tablet computers, laptop computers, personal digital assistants (PDAs), augmented reality (AR) devices, virtual reality (VR) devices, artificial intelligence (AI) devices, personal computers, laptops, wearable devices, portable music players, and radios. Wearable devices include, but are not limited to, smartwatches, smart bracelets, smart clothing, smart glasses, and smart headphones. This application uses a mobile phone as an example for illustration, which should not be considered a specific limitation on the structural form of the electronic device 100.

[0058] The electronic device 100 can be in the shape of a rectangular plate. Therefore, for the convenience of the description of the embodiments below, an XYZ coordinate system is established. Specifically, the width direction of the electronic device 100 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and is not specifically limited here. Of course, in some other embodiments, the electronic device 100 can also be in the shape of a circular plate, column, block, etc. This application does not specifically limit the shape of the electronic device 100.

[0059] Please seeFigure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device 100 may include a screen 10, a middle frame 20, and a back cover 30. Along the Z-axis direction of the electronic device 100, the middle frame 20 is located between the screen 10 and the back cover 30, and both the screen 10 and the back cover 30 are fixed to the middle frame 20.

[0060] In some embodiments, the screen 10, the mid-frame 20, and the back cover 30 form a receiving space for the electronic device 100. The battery, circuit board, and functional components are all disposed within this receiving space and connected to the mid-frame 20. The battery provides power to the functional components and circuit board within the electronic device 100. The functional components are used to implement one or more functions of the electronic device 100. These functional components include, but are not limited to, a camera module, speaker, receiver, microphone, subscriber identification module (SIM) card interface, buttons, charging management module, power management module, application processor (AP), universal flash storage (UFS), antenna module, Bluetooth module, WiFi module, GPS module, universal serial bus (USB), and operation module, etc.

[0061] The mid-frame 20 forms a connector for the electronic device 100, used to connect at least one component of the electronic device 100. The screen 10, back cover 30, battery, circuit board, and functional devices all form components of the electronic device 100. To ensure the structural stability of the mid-frame 20 and the thinness and lightness of the electronic device, the mid-frame 20 needs to have sufficient strength to support and protect the internal structure of the electronic device 100, while its weight and size need to be controlled.

[0062] It is understood that when the electronic device 100 is another product, other structures of the electronic device 100 can also form the connector, and other structures of the electronic device 100 can also form components fixed to the connector. The embodiments described below are exemplified by the middle frame 20 of the electronic device 100 forming the connector, and the screen 10, back cover 30, battery, circuit board and functional devices forming the first component fixed to the connector. This should not be considered as a special limitation on the structural form of the connector and the components connected to the connector.

[0063] Please see Figure 2 , Figure 2 This is a partial structural diagram of a mid-frame provided in related technologies. Figure 2The diagram shows a structural schematic of the portion of the middle frame used to connect USB devices. The middle frame 20 includes a connecting protrusion 22 and a fixing part 21. To give the middle frame 20 a certain strength, the fixing part 21 is generally made of metal.

[0064] Thus, to avoid short circuits, USB devices cannot directly contact the fixing part 21 when plugged in. Therefore, the middle frame 20 needs to be provided with an insulating part 50 for insulation and protection, and the insulating part 50 covers the fixing part 21. In some other embodiments, to prevent the fixing part 21 from directly contacting the screen 10, back cover 30, battery, circuit board, and functional devices, an insulating part 50 is also needed for insulation and protection. For example, the insulating part 50 can be made of plastic, rubber, etc.

[0065] In related technologies, screw posts 51 are typically provided on the insulating part 50, and the screw posts 51 are integrally formed with the insulating part 50. When the insulating part 50 is a plastic part, the screw posts 51 and the insulating part 50 can be integrally injection molded. The insulating part 50 is fixed to the fixing part 21 by insert injection molding, and the connecting protrusion 22 is connected to the screw posts 51 of the insulating part 50 by hot melt or direct molding technology, and thus fixed to the fixing part 21. USB devices can be connected to the middle frame 20 through the connecting protrusion 22. Such a structure often results in poor structural strength and poor impact resistance at the connection between the connecting protrusion 22 and the fixing part 21. When the electronic device 100 is dropped or bumped, the connection is prone to breakage, misalignment, and other problems. Therefore, it is necessary to increase the thickness of the insulating part 50 of the middle frame 20 to meet the structural strength requirements of the connection between the connecting protrusion 22 and the fixing part 21.

[0066] Please see Figure 3 , Figure 3 for Figure 2 The diagram shows a partial structural illustration of the insulating portion of the mid-frame. The Z-axis thickness of the insulating portion 50 increases at the connection point, leading to an increase in the weight and volume of the electronic device 100, which is detrimental to achieving a thinner and lighter electronic device 100. Furthermore, the connecting protrusion 22 is connected to the insulating portion 50 using either hot-melt or direct molding techniques. Since these two techniques are prone to processing deviations, the connecting protrusion 22 may exhibit dimensional inaccuracies such as skewing.

[0067] Based on the above description, the mid-frame 20 within the electronic device 100 in the related technology cannot simultaneously meet the requirements of structural strength and thinness.

[0068] To solve the above problems, refer to Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of a middle frame provided in an embodiment of this application. The middle frame 20 includes a fixing part 21 and a connecting protrusion 22.

[0069] Specifically, the fixing part 21 includes a first surface 211, which can be used to install or support circuit boards, functional devices, etc. A connecting protrusion 22 is disposed on the first surface 211, and the connecting protrusion 22 and the fixing part 21 are integral structural components.

[0070] Please see here. Figure 5 , Figure 5 This is a partial structural comparison diagram of the mid-frame in related technologies and the mid-frame provided in the embodiments of this application. Figure 5 (a) shows a schematic diagram of the structure of the middle frame in the prior art. In the prior art, the connecting protrusion 22 is connected to the fixing part 21 through the insulating part 50. Figure 5 (b) shows a schematic diagram of the structure of the middle frame in this application. Compared with the prior art, the connecting protrusion 22 in this application can be connected to the fixing part 21 without the aid of the insulating part 50. The structure of the connection is more stable, which can enhance the connection structure strength of the middle frame 20 and reduce the risk of deformation and misalignment caused by loosening of the connection.

[0071] Meanwhile, the fact that the connecting protrusion 22 and the fixing part 21 are integrated into one structure reduces the number of parts required during assembly, thereby simplifying the production process, improving production efficiency, and reducing assembly costs. The integrated structure of the connecting protrusion 22 and the fixing part 21 also allows for more precise positioning of the connecting protrusion 22, reducing parameter deviations during the docking and mating of the screen 10, back cover 30, battery, circuit board, and functional components with the connecting protrusion 22, thus improving the overall performance of the electronic device 100.

[0072] The first surface 211 has a recess 212, and the connecting protrusion 22 is connected to the recess 212. In this application, the recess 212 and the connecting protrusion 22 are connected by extruding the material of the fixing part 21 to form the recess 212 and the connecting protrusion 22, which facilitates processing. In this way, the connecting protrusion 22 can be formed without the use of additional material, effectively reducing material waste and improving material utilization. Since no additional material is needed and the connecting protrusion 22 and the fixing part 21 are an integral structural component, the connection has sufficient connection strength, and the insulation part 50 does not need to be thickened. The overall weight of the middle frame 20 can be reduced while ensuring connection strength, which is conducive to achieving the lightweight of the electronic device 100.

[0073] In some embodiments, please refer to Figure 6 , Figure 6 for Figure 4The partial cross-sectional view of the middle frame provided shows that the recess 212 is arranged around the periphery of the connecting protrusion 22. This facilitates material flow during the machining of the connecting protrusion 22, improving machining efficiency. Furthermore, it allows for more uniform plastic deformation, improving the overall quality of the middle frame 20. In some other embodiments, the recess 212 may also be located on one side of the connecting protrusion 22. In other embodiments, the recess 212 may also be located in the middle of the connecting protrusion 22.

[0074] In some embodiments, the fixing part 21 and the connecting protrusion 22 are made of metal. Metal materials generally have excellent mechanical properties, such as high strength and stiffness, and can withstand large loads and pressures, ensuring the stability of the connection. Metal materials are easy to process into various shapes, enabling complex designs.

[0075] In some embodiments, the fixing part 21 and the connecting protrusion 22 are made of aluminum alloy. Aluminum alloy has a low density, which can significantly reduce the weight of the middle frame 20, making it suitable for applications with high lightweight requirements. In addition, aluminum alloy has high plasticity and is easy to process, meeting various process and design needs.

[0076] In some other embodiments, the fixing part 21 and the connecting protrusion 22 are made of magnesium alloy. Magnesium alloy has good lightweight properties, which can further reduce the overall weight of the middle frame 20. In addition, magnesium alloy can provide high strength and rigidity while maintaining lightweight.

[0077] In some other embodiments, the middle frame 20 also includes a border 26, the material of which includes, but is not limited to, metal and plastic.

[0078] In some embodiments, please refer to Figure 7 , Figure 7 This is a schematic diagram of the crystal structure of the connecting protrusion and recess of a mid-frame according to an embodiment of this application. The crystal structure of the connecting protrusion 22 is a first crystal structure, which is elongated and its length direction is consistent with the height direction of the connecting protrusion 22. The crystal structure of the partial fixing part 21 where the recess 212 is located is a second crystal structure, which is also elongated and its length direction is consistent with the direction from the recess 212 to the connecting protrusion 22. During processing, such as forging, stretching, or extrusion, the partial fixing part 21 where the connecting protrusion 22 and the recess 212 are located is subjected to plastic deformation, resulting in a refinement of the internal crystal structure, that is, a refinement of the internal crystal structure of the partial fixing part 21 where the connecting protrusion 22 and the recess 212 are located.

[0079] According to the Hoffmann-Lüde law, the yield strength of a material is inversely proportional to the square root of its grain diameter. Specifically, a smaller grain structure can hinder the movement of dislocations, thus the smaller the grain structure, the higher the yield strength of the material. Therefore, the elongated grain structure of the partial fixing portion 21 connecting the protrusion 22 and the recess 212 can improve the strength and hardness of the partial fixing portion 21, contributing to increased tensile strength and yield strength. Furthermore, finer grains can more evenly distribute externally applied stress, reducing local stress concentration and improving the mechanical properties of the partial fixing portion 21 connecting the protrusion 22 and the recess 212.

[0080] It should be noted that the elongated, strip-like structure of metallographic units can be achieved by controlling the metal processing technology, temperature conditions, and composition. Examples include forging, phase transformation strengthening, and the addition of chemical components. The specific method chosen depends on the required material properties and application area.

[0081] For example, the fixing part 21 where the protrusion 22 and the recess 212 are located is forged to make the first crystal structure and the second crystal structure into an elongated shape.

[0082] In some existing one-piece molding processes, such as CNC machine tools, it is also possible to connect the protrusion 22 and the fixed part 21 into a single structural component. First, modeling and programming are performed using computer-aided software. Then, settings and calibration are performed on the CNC machine tool. The program is imported into the CNC machine tool's control system, which in turn controls the CNC machine tool to perform machining processes, including cutting and drilling.

[0083] Please see Figure 8 , Figure 8 This is a partial structural comparison diagram of the mid-frame provided in the embodiments of this application and the mid-frame machined by CNC technology, wherein... Figure 8 Image (a) shows the middle frame provided in an embodiment of this application. Figure 8 Figure (b) shows the CNC-machined mid-frame. Compared to the connection protrusion 22 and fixing part 21 in this application, which are forged into an integral structural part, the CNC machining process can also produce the connection protrusion 22 and fixing part 21 as an integral part. However, since the connection protrusion 22 is obtained by cutting rather than by machining the material of the recess 212, the material waste is more serious and the processing is more complicated.

[0084] Please also see Figure 7 as well as Figure 9 , Figure 9This is a schematic diagram of the crystal structure of the CNC-machined mid-frame. Metallographic observation shows that the crystal structure of the CNC-machined connecting protrusion 22 is relatively uniform, with no obvious material flow. In contrast, the connecting protrusion 22 and the fixing part 21 in this application are forged into an integral structural component. This allows for a refined crystal structure in the fixing part 21 where the connecting protrusion 22 and the recess 212 are located, resulting in a long, strip-like structure. This improves the strength and hardness of the fixing part 21 where the connecting protrusion 22 and the recess 212 are located.

[0085] In some embodiments, please refer to Figure 10 , Figure 10 This is a cross-sectional schematic diagram of the recessed portion provided in an embodiment of this application. The recessed portion 212 includes a bottom surface 213. The end of the bottom surface 213 facing the connecting protrusion 22 is a first end 213a, and the end of the bottom surface 213 away from the connecting protrusion 22 is a second end 213b. From the second end 213b to the first end 213a, the bottom surface 213 extends toward the bottom end 221 of the connecting protrusion 22 and slopes toward the top end 222 of the connecting protrusion 22. The bottom end 221 of the connecting protrusion 22 refers to the end of the connecting protrusion 22 facing the fixing portion 21 along the Z-axis direction. The top end 222 of the connecting protrusion 22 refers to the end of the connecting protrusion 22 away from the fixing portion 21 along the Z-axis direction. Exemplarily, the bottom surface 213 can be a conical surface or a concave spherical surface.

[0086] This design allows for a smoother overall shape of the recess 212, reducing friction between the bottom surface 213 and the mold, thereby reducing resistance during demolding and facilitating separation of the mold from the bottom surface 213. Simultaneously, this design also evenly distributes pressure within the mold, reducing the risk of deformation of the bottom surface 213 due to sudden stress changes during demolding, further facilitating separation of the mold from the bottom surface 213.

[0087] In this way, when processing the connecting protrusion 22, the material can flow more easily and better promote the material to converge towards the center of the recess 212 to form the connecting protrusion 22. This allows the material to be evenly distributed when the recess 212 and the connecting protrusion 22 are formed, thus improving the yield.

[0088] In some embodiments, continue reading Figure 10The recess 212 also includes a first side surface 214, which is located on the side of the bottom surface 213 opposite to the connecting protrusion 22. One end of the first side surface 214 connecting to the bottom surface 213 is the third end 214a, and the other end of the first side surface 214 connecting to the first surface 211 is the fourth end 214b. From the third end 214a to the fourth end 214b, the first side surface 214 is inclined in the direction opposite to the connecting protrusion 22. Exemplarily, the first side surface 214 can be a conical surface or a concave spherical surface. This arrangement makes the overall shape of the recess 212 smoother, further reducing the friction between the first side surface 214 and the mold, thereby reducing the resistance during demolding. This also allows for a more uniform distribution of pressure in the mold, reducing the risk of deformation of the first side surface 214 due to sudden stress when demolding and removing the first side surface 214, facilitating the separation of the mold from the first side surface 214.

[0089] In some embodiments, continue reading Figure 10 The recess 212 also includes a second side surface 215, which is located between the bottom surface 213 and the connecting protrusion 22. One end of the second side surface 215 connecting to the bottom surface 213 is the fifth end 215a, and the other end of the second side surface 215 connecting to the connecting protrusion 22 is the sixth end 215b. From the fifth end 215a to the sixth end 215b, the second side surface 215 is inclined in a direction away from the first side surface 214. For example, the second side surface 215 can be a conical surface or a concave spherical surface. This arrangement makes the overall shape of the recess 212 smoother, reduces the friction between the second side surface 215 and the mold, and thus reduces the resistance during demolding. This also allows for a more uniform distribution of pressure in the mold, reducing the risk of deformation of the second side surface 215 due to sudden stress when demolding and removing the second side surface 215, and facilitating the separation of the mold from the second side surface 215.

[0090] In some embodiments, please refer to Figure 11 , Figure 11 This is a cross-sectional schematic diagram of the connecting protrusion 22 provided in an embodiment of this application. The connecting protrusion 22 includes a third side surface 223, which is located on the side of the connecting protrusion 22 facing the recess 212. One end of the third side surface 223 that connects to the second side surface 215 is the seventh end 223a, and the other end of the third side surface 223 that faces away from the second side surface 215 is the eighth end 223b. From the seventh end 223a to the eighth end 223b, the third side surface 223 is inclined in the direction away from the recess 212. Exemplarily, the third side surface 223 may be a conical surface.

[0091] This design allows for a smoother shape of the connecting protrusion 22, reducing friction between the connecting protrusion 22 and the mold, thereby lowering resistance during demolding. It also ensures a more even distribution of pressure within the mold, reducing the risk of deformation due to sudden stress changes when the connecting protrusion 22 is removed, and facilitating separation between the mold and the connecting protrusion 22. Furthermore, this design promotes material flow during processing, better facilitating the formation of the connecting protrusion 22, ensuring uniform material distribution during its formation, and improving yield.

[0092] In some embodiments, continue reading Figure 11 The connecting protrusion 22 is annular. This allows the screen 10, back cover 30, battery, circuit board, and functional components to be fixed within the annular structure of the connecting protrusion 22, providing better positioning and support. This ensures that the screen 10, back cover 30, battery, circuit board, and functional components maintain their correct position during operation, reducing errors. Compared to planar contact positioning and support methods, the annular connecting protrusion 22 increases the contact area between the middle frame 20 and the connecting parts of the screen 10, back cover 30, battery, circuit board, and functional components, thereby improving connection strength. Furthermore, the annular connecting protrusion 22 has a wider range of applications, allowing it to work with the screen 10, back cover 30, battery, circuit board, and functional components, enhancing the flexibility and adaptability of the middle frame 20.

[0093] In some embodiments, continue reading Figure 11 The connecting protrusion 22 includes an inner surface 224, which is threaded. That is, the inner surface of the annular connecting protrusion 22 is threaded. The thread provides a mechanical locking effect, making the connection between the mid-frame 20 and the screen 10, back cover 30, battery, circuit board, and functional components more secure, effectively resisting separation and loosening. In addition, the threaded structure helps distribute the load, reducing stress concentration at individual connection points and preventing damage to individual connection points, thereby extending the service life of the mid-frame 20.

[0094] In some other embodiments, the third side 223 of the connecting protrusion 22 may also be threaded. The specific configuration can be adjusted according to the actual situation.

[0095] In some embodiments, please refer to Figure 12 , Figure 12This is a schematic diagram of the structure of the first and second included angles provided in an embodiment of this application. The inclination angle of the bottom surface 213 relative to the first surface 211 is greater than or equal to 5° and less than or equal to 10°. That is, there is a first included angle A1 between the bottom surface 213 and the first surface 211, which is greater than or equal to 5° and less than or equal to 10°. For example, the degree of the first included angle A1 can be 5°, 6°, 7°, 8°, 9°, 10°, etc. This application does not limit this, and the specific setting is based on the actual needs. The first surface 211 is perpendicular to the extension direction of the connecting protrusion 22, that is, the first surface 211 is parallel to the XY plane. Setting an appropriate angle for the bottom surface 213 can effectively reduce the friction between the recessed part 212 and the mold, reduce the force required for demolding, and make it easier to remove the recessed part 212 from the mold.

[0096] In some embodiments, continue reading Figure 12 The third side surface 223 has an inclination angle relative to the first surface 211 that is greater than or equal to 80° and less than or equal to 85°. That is, the third side surface 223 and the first surface 211 have a second included angle A2, which is greater than or equal to 80° and less than or equal to 85°. For example, the degree of the second included angle A2 can be 80°, 81°, 82°, 83°, 84°, 85°, etc. This application does not impose any limitations on this; the specific setting depends on the actual needs. The axis of the connecting protrusion 22 is parallel to the Z-axis. Setting an appropriate angle for the third side surface 223 of the connecting protrusion 22 can effectively reduce the friction between the connecting protrusion 22 and the mold, reduce the force required for demolding, and make it easier to remove the connecting protrusion 22 from the mold.

[0097] In some embodiments, the thickness of the fixing part 21 is less than or equal to 2 mm. A smaller thickness of the fixing part 21 can reduce the weight of the electronic device 100, helping to improve product performance and achieve structural lightweighting.

[0098] For example, the thickness of the fixing part 21 can be 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0mm, etc. This application does not limit this, and the specific setting is made according to the actual needs.

[0099] It is understandable that when the thickness of the fixing part 21 is small, in order to improve the connection strength, it is more suitable to form the connecting protrusion 22 by forging, and then connect it with the screen 10, back cover 30, battery, circuit board and functional devices. If the thickness of the fixing part 21 is large, the connection structure can be formed by drilling holes directly in the fixing part 21, without the need to use the technical means in this application.

[0100] In some embodiments, please refer to Figure 13 , Figure 13 This is a partial structural diagram of the mid-frame provided in an embodiment of this application. The first surface 211 is provided with an insulating portion 50, which covers the recessed portion 212 and is located around the connecting protrusion 22. Exemplarily, the insulating portion 50 may completely cover the first surface 211 or partially cover the first surface 211, and this application does not limit this.

[0101] By providing the insulating part 50, the recessed part 212 can be covered, effectively protecting the internal structure from damage by the external environment. Simultaneously, the insulating part 50 reduces direct contact between the fixing part 21 and other components, decreasing the risk of short circuits. Furthermore, the insulating part 50 is located on the periphery of the protrusion, ensuring it does not affect the connection between the connecting protrusion 22 and the screen 10, back cover 30, battery, circuit board, and functional devices. The insulating part 50 possesses good toughness and elasticity, providing cushioning for the fixing part 21 and the connecting protrusion 22, absorbing impact forces, reducing the possibility of structural damage, and lowering the risk of failure.

[0102] For example, the material of the insulating part 50 can be plastic, rubber, etc.

[0103] Please see Figure 14 as well as Figure 15 , Figure 14 A flowchart illustrating a processing method for a mid-frame provided in this application embodiment. Figure 15 This is a schematic diagram illustrating a method for processing a mid-frame according to an embodiment of this application. This application also provides a method for processing a mid-frame, including:

[0104] S101. A substrate is provided, the substrate including a first surface, the first surface having a first region and a second region adjacent to each other, the substrate including a first portion of material forming the first region.

[0105] In some embodiments, the first portion of the substrate may be made of metal, for example, aluminum alloy or magnesium alloy, etc.

[0106] It should be noted that the thickness of the substrate is less than or equal to 2 mm. For example, the substrate thickness can be 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, etc. This application does not impose any limitations on this. This application uses a substrate thickness of 1 mm as an example for illustration.

[0107] S102. Press the first part of the material into the second region to form a connecting protrusion in the second region and a recess in the first region.

[0108] In this way, the connecting protrusion 22 can be connected to the fixing part 21 without the need for other parts, resulting in a more stable connection structure. This strengthens the connection structure of the middle frame 20 and reduces the risk of deformation and misalignment caused by loosening at the connection. By pressing the first part of the material into the second area to form the connecting protrusion 22, the connecting protrusion 22 can be formed without the use of additional material, effectively reducing material waste and improving material utilization.

[0109] In some embodiments, extruding the first portion of material into the second region includes: extruding the first portion of material into the second region using a forging process.

[0110] In this way, the connecting protrusion 22 is formed by forging, and the connecting protrusion 22 and the fixing part 21 are integrated into a single structural component. This makes the connection structure between the connecting protrusion 22 and the fixing part 21 more stable, which can enhance the connection structure strength of the middle frame 20 and further enhance the strength of the connection area. At the same time, forging can achieve higher processing precision, making the shape and size of the connecting protrusion 22 more accurate, reducing parameter deviations during the docking and mating process between the screen 10, back cover 30, battery, circuit board, and functional components and the connecting protrusion 22, thereby improving the overall performance of the electronic device 100.

[0111] In addition, the connecting protrusion 22 produced by the forging process does not require additional material, which can effectively reduce material waste and improve material utilization.

[0112] In some embodiments, the forging process is a hot forging process. At high temperatures, the plasticity of metallic materials increases significantly, thus hot forging makes it easier to process metal materials into various complex shapes without easily causing cracks or fractures. Because the strength of the material decreases at high temperatures, the pressure and force required for hot forging are relatively small, which reduces the load on the forging equipment and energy consumption. Hot-forged connecting protrusions have better fatigue performance and are suitable for high-load, repetitive-stress applications.

[0113] In addition, hot forging is suitable for a variety of metal materials, including some high alloy steels and materials that are difficult to machine.

[0114] In some embodiments, continue reading Figure 15 After forging the connecting protrusion onto the first surface, the process includes: CNC machining the connecting protrusion.

[0115] Specifically, the process includes the following steps: milling the top surface, which involves using a milling machine and milling cutter to machine along the top surface of the workpiece to ensure that the top surface meets the design specifications; chamfering the outer corners and forging allowance, which involves processing the edges of the connecting protrusions by milling or grinding to obtain smooth outer corners; reducing the height, which involves using milling, grinding or other material removal methods to remove excess material from the connecting protrusions; and leveling the top surface, which usually involves using milling cutters, grinding wheels or other flat machining tools to level the top surface of the connecting protrusions.

[0116] To achieve higher precision in the connecting protrusion 22, it needs to be CNC machined after demolding to allow for the removal of excess material, for example, cutting a height of 0.2mm. This allows for further processing of the connecting protrusion 22's precision, dimensions, and appearance to meet usage standards.

[0117] In some embodiments, continue reading Figure 15 After forging the connecting protrusion on the first surface, the process includes: tapping threads on the connecting protrusion.

[0118] The threads provide a mechanical locking effect, making the connection between the mid-frame and the screen 10, back cover 30, battery, circuit board, and functional components more secure and effectively resisting separation and loosening. In addition, the threaded structure helps distribute the load, reduces stress concentration at individual connection points, prevents damage to individual connection points, and thus extends the lifespan of the mid-frame.

[0119] In some embodiments, please refer to Figure 16 as well as Figure 17 , Figure 16 A flowchart illustrating a forging method for a middle frame provided in this application embodiment. Figure 17 This is a schematic diagram of a forging method for a middle frame provided in an embodiment of this application. The forging process includes:

[0120] S1021. Fasten the substrate with the upper mold and the lower mold.

[0121] Design and manufacture a suitable forging die according to product requirements, ensuring the die can withstand high temperatures and high pressures. Please refer to [link / reference]. Figure 18 as well as Figure 19 , Figure 18 This is a schematic diagram of the structure of an upper mold provided in an embodiment of this application. Figure 19 This is a schematic diagram of the structure of a lower mold provided in an embodiment of this application, wherein, Figure 18 (a) shows the top view of the upper mold. Figure 18 (b) shows the bottom view of the upper mold. Figure 19 (a) shows the top view of the lower mold. Figure 19(b) shows the bottom view of the lower die. The upper die 60 and lower die 70 are designed for the forging area according to the dimensions of the connecting protrusion 22 and the recess 212. Then, the upper die 60 and lower die 70 with the designed forging area are fastened to the base material, that is, the upper die 60 and lower die 70 are fastened to the fixing part 21. In this way, the upper die 60 and lower die 70 can be accurately positioned during the forging process, effectively preventing the deformation of the fixing part 21 during the forging process, and ensuring that the shape and size of the final product meet the design requirements.

[0122] Please see Figure 20 , Figure 20 The flowchart illustrates the engagement of the upper mold and lower mold with the substrate provided in this application embodiment. The engagement of the upper mold 60 and lower mold 70 with the substrate includes the lower mold 70 closing upwards and the upper mold 60 closing downwards, thus ensuring the correct positioning of the fixing part 21.

[0123] S1022. Forging is performed on the substrate of the upper and lower molds.

[0124] The forging equipment is started, and pressure is applied to facilitate the forming of the fixture in the mold. This process can be carried out using equipment such as forging hammers, presses, or hydraulic presses, and this application does not limit the scope of application.

[0125] S1023. Separate the upper mold and lower mold from the substrate.

[0126] After forging, allow the base material to cool gradually, either naturally in the air or by using a cooling liquid. Then demold, separating the upper mold 60 and the lower mold 70 from the base material.

[0127] For details, please refer to Figure 21 , Figure 21 The flowchart for separating the upper mold and lower mold from the substrate provided in this application embodiment includes the separation of the upper mold 60 and the lower mold 70 from the substrate. This allows the forged substrate to be easily removed from the mold, avoiding damage to the forging.

[0128] In some other embodiments, after demolding, the forged frame needs to undergo quality checks on dimensions, appearance, and material properties to ensure it meets design requirements. If necessary, the frame 20 can be subjected to subsequent processes such as heat treatment, annealing, or surface treatment to further improve the mechanical properties and surface quality of the material. The frame 20 can also be cleaned to remove burrs and excess material generated during forging, ensuring the smoothness of the product.

[0129] In some other embodiments, please refer to Figure 22 , Figure 22A flowchart illustrating the tapping of a mid-frame according to an embodiment of this application, comprising tapping the connecting protrusion, including:

[0130] S201, scribing to determine the thread center.

[0131] By scribing, the center position of the thread can be ensured to be accurate, which helps to improve machining precision. Clear reference lines are provided to avoid deviations during machining and to help control the function and dimensions of the thread.

[0132] S202, Drilling.

[0133] Drilling provides a reference point for subsequent tapping, making the tapping process easier. By setting an appropriate hole depth, the depth of subsequent tapping can be effectively controlled. In addition, with an appropriate hole diameter, the stress can be better distributed, enhancing the load-bearing capacity of the thread.

[0134] S203, Tap threads on the inner wall of the hole.

[0135] The tapping process creates high-precision threads in specified holes, helping to ensure the stability of the fit. Proper thread machining can improve the fastening performance and tensile strength of joints. The tapping process also standardizes the process, facilitating mating and installation with other components.

[0136] The above steps not only improve the accuracy and efficiency of thread processing, but also ensure the reliability and stability of threaded connections in design and engineering.

[0137] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0138] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A connection, characterized in that The fixing part comprises a first surface provided with a recess; A connecting protrusion is arranged on the first surface, and the connecting protrusion and the fixing part are an integral structure; The crystal structure of the connecting protrusion is a first crystal structure, which is in a strip shape, and the length direction of the first crystal structure is consistent with the height direction of the connecting protrusion; 2. The connection of claim 1, wherein The crystal structure of the part of the fixing part where the recess is located is a second crystal structure, which is in a strip shape, and the length direction of the second crystal structure is consistent with the direction in which the recess points to the connecting protrusion. The recess is annularly arranged on the side of the connecting protrusion.

3. The connection of claim 1, wherein The recess comprises a bottom surface, one end of the bottom surface towards the connecting protrusion is a first end, and the other end of the bottom surface away from the connecting protrusion is a second end; 4. The connection of claim 1, wherein From the second end to the first end, the bottom surface extends towards the bottom end of the connecting protrusion and is inclined towards the top end of the connecting protrusion. The inclination angle of the bottom surface relative to the first surface is greater than or equal to 5° and less than or equal to 10°.

5. The connection of claim 4, wherein The recess further comprises a first side surface located on the side of the bottom surface away from the connecting protrusion; 6. The connection of claim 4, wherein One end of the first side surface connected to the bottom surface is a third end, and the other end of the first side surface connected to the first surface is a fourth end; From the third end to the fourth end, the first side surface is inclined away from the connecting protrusion. The recess further comprises a second side surface located between the bottom surface and the connecting protrusion; 7. The connection of claim 6, wherein One end of the second side surface connected to the bottom surface is a fifth end, and the other end of the second side surface connected to the connecting protrusion is a sixth end; From the fifth end to the sixth end, the second side surface is inclined away from the first side surface. The connecting protrusion comprises a third side surface located on the side of the connecting protrusion towards the recess; 8. The connection of claim 7, wherein One end of the third side surface connected to the second side surface is a seventh end, and the other end of the third side surface away from the second side surface is an eighth end; From the seventh end to the eighth end, the third side surface is inclined away from the recess. The inclination angle of the third side surface relative to the first surface is greater than or equal to 80° and less than or equal to 85°.

9. The connection of claim 8, wherein The connecting protrusion is in a ring shape.

10. The connection of claim 1, wherein The inner side surface of the ring-shaped connecting protrusion is provided with threads.

11. The connection of claim 10, wherein The thickness of the fixing part is less than or equal to 2 mm.

12. The connection of any of claims 1-11, wherein, The materials of the fixing part and the connecting protrusion are metal.

13. The connection of any of claims 1-12, wherein, The materials of the fixing part and the connecting protrusion are aluminum alloy, or the materials of the fixing part and the connecting protrusion are magnesium alloy.

14. The connection of claim 13, wherein The first surface is provided with an insulating part covering the recess, and the insulating part is located on the periphery of the connecting protrusion.

15. The connection of any of claims 1-14, wherein, The connecting piece is a middle frame.

16. The connection of any of claims 1-15, wherein, The connecting piece is any one of claims 1-16.

17. An electronic device, comprising: The connecting piece comprises 18. A method of processing a connector, characterized by, ​ A substrate is provided, the substrate including a first surface having an adjoining first region and a second region, the substrate including a first portion of material forming the first region; pressing the first portion of material into the second region to form a connecting protrusion in the second region, the first region forming a recess.

19. The method of claim 18, wherein, The pressing the first portion of material into the second region includes: extruding the first portion of material into the second region using a forging process.

20. The method of claim 19, wherein, The forging process is a hot forging process.

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