Manufacturing method of wire damper for controlling spacing of wire combination

Abstract

The invention discloses a manufacturing method of a wire damper capable of controlling the spacing of wire combinations. The manufacturing method comprises the following steps: arranging a plurality of warp yarns and a plurality of wire combinations at intervals; a plurality of weft yarns are interwoven in the warp yarns and combined with the conducting wires to weave the base material; soaking the base material in the resin solution; drying the base material; placing the base material between the pressing surface and the forming surface, and simultaneously pressing the base material on the inner side and the outer side of the wire combination by a plurality of first pressing pieces outside the two ends of the wire damper forming block; and performing hot press molding on the wire damper molding block of the base material by the pressing surface and the molding surface together to form the wire damper. And separating the wire damper from the base material. Therefore, during the hot press molding period, the method can control the distance between the lead combinations, and the lead combinations are prevented from being dislocated.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a conductor spring, and more particularly to a method for manufacturing a conductor spring that controls the spacing of conductor assemblies. Background Technology

[0002] A typical moving-coil loudspeaker produces sound by utilizing the principle that the reaction force of a fixed magnetic field causes another magnetic field to move in the opposite direction (i.e., opposite poles attract, like poles repel). More specifically, the alternating current from the power amplifier is transmitted to the voice coil via wires to change the polarity of the magnetic field, causing the voice coil to generate a reaction force relative to the fixed magnetic field created by the magnet. A positive pulse causes the diaphragm to move outward relative to the magnet, while a negative pulse causes the diaphragm to move inward relative to the magnet. As the voice coil pushes the diaphragm in this reciprocating motion, the diaphragm pushes air, changing the air pressure and creating sound waves. A spider is used to hold the voice coil in the correct position within the gap in the magnet's core, ensuring that the voice coil reciprocates along its axis when under force. A suspension is placed between the diaphragm and the outer frame to support the diaphragm.

[0003] Existing methods for manufacturing conductive wave springs include the following steps: combining multiple warp yarns, multiple weft yarns, and multiple conductive wires to form a substrate; immersing the substrate in a resin solution; drying the substrate; heating and pressing a conductive wave spring forming block on the substrate to form a conductive wave spring; and separating the conductive wave spring from the substrate.

[0004] However, since the two ends of these wire assemblies are not fixed, the substrate and the wire assemblies will shrink during the heating and pressurization process, causing the wire assemblies to misalign.

[0005] Furthermore, since the conductor assembly is made of multiple twisted or braided metal yarns, the pressing surface of the pressing mold and the forming surface of the forming mold will heat and pressurize the conductor assembly during the heating and pressing process, causing damage to the conductor assembly. In particular, the damage to the two ends of the conductor assembly is especially severe. Summary of the Invention

[0006] The main objective of this invention is to provide a method for manufacturing a conductor spring that controls the spacing of conductor assemblies, thereby preventing misalignment of the conductor assemblies.

[0007] Another object of the present invention is to provide a method for manufacturing a conductor spring that controls the spacing of the conductor assembly, thereby preventing the conductor assembly from being damaged by pressure.

[0008] To achieve the aforementioned objective, the present invention provides a method for manufacturing a wire elastic wave that controls the spacing of wire assemblies, comprising the following steps: (a) spaced together multiple warp yarns and multiple wire assemblies, the warp yarns and wire assemblies extending in a straight line along a first direction and parallel to each other, wherein each wire assembly is composed of multiple wires, and each wire is a monofilament; (b) weaving multiple weft yarns along a second direction into the warp yarns and wire assemblies to weave a substrate, wherein the first direction is perpendicular to the second direction, and the substrate has a wire elastic wave forming block; (c) immersing the substrate in... (d) Drying the substrate in a resin solution to form a solid resin layer on the substrate; (e) placing the substrate between a pressing surface of a pressing mold of a thermoforming apparatus and a forming surface of a forming mold of the thermoforming apparatus, while a plurality of first pressing members press the substrate on the inner and outer sides of the conductor assembly outside the two ends of the conductor spring forming block; and heating and pressing an upper conductor spring forming portion of the pressing surface and a lower conductor spring forming portion of the forming surface together on the conductor spring forming block to form a conductor spring; and (f) separating the conductor spring from the substrate.

[0009] In some embodiments, each of the first pressure members is a roller.

[0010] In some embodiments, the spacing between two adjacent first pressure members is equal to the diameter of each wire assembly.

[0011] In some embodiments, step (b) further includes: the substrate has a force-balancing portion forming block, the force-balancing portion forming block being located around the conductor elastic forming block; wherein, step (e) further includes: a force-balancing portion forming protrusion located around the upper conductor elastic forming portion on the pressing surface and a force-balancing portion forming groove located around the lower conductor elastic forming portion on the forming surface are heated and pressurized together on the force-balancing portion forming block to form a force-balancing portion; wherein, step (f) further includes: the force-balancing portion being retained on the substrate.

[0012] In some embodiments, step (e) further includes: two blocks of a force-balancing portion forming protrusion around the upper conductor elastic forming portion on the pressing surface and two grooves of a force-balancing portion forming groove around the lower conductor elastic forming portion on the forming surface are heated and pressed together on the force-balancing portion forming block to form two eaves of a force-balancing portion, wherein the blocks, the grooves and the eaves are all U-shaped or semi-circular, and two connecting blocks are formed between the eaves, and the conductor assembly extends through the connecting blocks; wherein step (f) further includes: the eaves are retained on the substrate.

[0013] In some embodiments, step (b) further includes: the conductor elastic forming block has a central lead-out block, the central lead-out block including four conductor lead-out positions; wherein, step (e) further includes: the upper conductor elastic forming portion includes a pressed wave portion, a pressed middle portion and two conductor protection grooves, the pressed wave portion surrounds the outside of the pressed middle portion, the pressed middle portion has a positioning protrusion, the positioning protrusion is elongated elliptical, the positioning protrusion extends from one side of the pressed middle portion to the other side of the pressed middle portion. On one side and through the axis of the pressing surface, a limiting insertion hole is recessed at the axis of the pressing surface. The wire protection grooves extend through the pressing wave portion and the pressing middle portion, respectively disposed on both sides of the positioning protrusion, and their length direction is parallel to the length direction of the positioning protrusion; the lower wire elastic wave forming portion includes a forming wave portion, a forming middle portion and two wire positioning grooves. The forming wave portion surrounds the outside of the forming middle portion. The forming middle portion is recessed with a positioning groove, which is elongated elliptical in shape. The positioning groove extends from... One side of the molded middle portion extends to the other side of the molded middle portion and passes through the axis of the molded surface. A central protrusion is provided at the axis of the molded surface. The conductor positioning grooves extend through the molded wave portion and the molded middle portion, respectively disposed on both sides of the positioning groove, and their length direction is parallel to the length direction of the positioning groove. The pressing wave portion and the molded wave portion together form a wave portion of the conductor wave on the conductor wave forming block. The pressing middle portion and the molded middle portion together form a central hole of the conductor wave on the conductor wave forming block. The positioning protrusion presses down the portion from one side of the center wire exit block to the other side of the center wire exit block into the positioning groove. The central protrusion presses up the axis of the center wire exit block further into the limiting insertion hole. The conductor protection grooves and the conductor positioning grooves together form two conductor limiting channels to restrict the deformation and shrinkage of the conductor wave forming block, so that the conductor assembly is adjusted to the conductor exit position and located in the conductor limiting channels.

[0014] In some embodiments, step (f) further includes: moving the substrate between an upper cutter and a lower cutter of a cutting device, while a plurality of second clamping members press against the substrate on the inner and outer sides of the conductor assembly outside the two ends of the conductor spring; and the upper cutter and the lower cutter cut the conductor spring from the substrate, such that the conductor spring is separated from the substrate.

[0015] In some embodiments, each of the second pressure members is a roller.

[0016] In some embodiments, the spacing between two adjacent second pressure members is equal to the diameter of each wire assembly.

[0017] The advantage of this invention is that, during hot pressing, the method of this invention can control the spacing of the wire assemblies and prevent misalignment of the wire assemblies.

[0018] Furthermore, during hot pressing, these wire protection grooves can protect the wire assemblies and prevent them from being damaged by the pressing mold. Attached Figure Description

[0019] Figure 1A and Figure 1B and Figure 1C This is a flowchart of the method of the present invention.

[0020] Figure 2 This is a schematic diagram of steps S10 and S20 of the first embodiment of the method of the present invention.

[0021] Figure 3 This is a perspective view of steps S30 and S40 of the first embodiment of the method of the present invention.

[0022] Figure 4 This is a perspective view of step S50 of the first embodiment of the method of the present invention.

[0023] Figure 5 yes Figure 4 A cross-sectional view of line VV.

[0024] Figure 6 This is a three-dimensional cross-sectional view of the pressing mold of the present invention.

[0025] Figure 7 This is a three-dimensional cross-sectional view of the molding die of the present invention.

[0026] Figure 8A This is a cross-sectional view of the hot pressing molding apparatus of the present invention heating and pressing a substrate to form a wire elastic wave and a force-balanced part.

[0027] Figure 8B yes Figure 8A A schematic diagram of region A.

[0028] Figure 8C yes Figure 8A A schematic diagram of region B.

[0029] Figure 8D yes Figure 8A A schematic diagram of region C.

[0030] Figure 9 This is a perspective view of the hot pressing molding apparatus of the present invention heating and pressing a substrate to form a wire elastic wave and a force-balanced part.

[0031] Figure 10 This is a perspective view of step S60 of the first embodiment of the method of the present invention.

[0032] Figure 11 This is a schematic diagram of steps S10 and S20 of the second embodiment of the method of the present invention.

[0033] Figure 12 This is a schematic diagram of steps S10 and S20 of the third embodiment of the method of the present invention.

[0034] [Symbol Explanation]

[0035] 10: Warp yarn

[0036] 20, 20A, 20B: Conductor Combinations

[0037] 21: Conductor

[0038] 30: Weft yarn

[0039] 40: Substrate

[0040] 41: Conductor bouncy forming block

[0041] 411: Central Outgoing Block

[0042] 4111: Wire exit position

[0043] 42: Force balance section forming block

[0044] 43: Connecting Blocks

[0045] 50: Resin tank

[0046] 51: Resin solution

[0047] 60: Drying device

[0048] 61: Upper baking plate

[0049] 62: Lower baking plate

[0050] 70: Hot pressing forming device

[0051] 71: Pressing mold

[0052] 711: Pressed Surface

[0053] 7111: Upper guide wire elastic wave forming part

[0054] 71111: Pressed wave section

[0055] 71112: Pressing Intermediate Section

[0056] 71113: Wire protection groove

[0057] 71114: Positioning bump

[0058] 71115: Limiting socket

[0059] 7112: Forming protrusion for force balance section

[0060] 71121: Block

[0061] 72: Molding mold

[0062] 721: Molded Surface

[0063] 7211: Lower guide wire elastic wave forming part

[0064] 72111: Molded wave section

[0065] 72112: Molding Intermediate Section

[0066] 72113: Wire positioning groove

[0067] 72114: Positioning Groove

[0068] 72115: Central convex column

[0069] 7212: Groove for forming the force balance part

[0070] 72121: Groove

[0071] 73: Conductor limiting channel

[0072] 80: First pressing component

[0073] 81: Second pressing component

[0074] 90: Cutting device

[0075] 91: Upgrade the cutting tool

[0076] 92: Lowering the cutting tool

[0077] 100: Wire bounce

[0078] 200: Force balance section

[0079] 201: Eaves

[0080] S10~S60: Steps Detailed Implementation

[0081] The embodiments of the present invention will be described in more detail below with reference to the accompanying drawings and component symbols, so that those skilled in the art can implement them after studying this specification.

[0082] Figure 1A and Figure 1B and Figure 1C This is a flowchart of the method of the present invention. Figure 2 This is a schematic diagram of steps S10 and S20 of the first embodiment of the method of the present invention. Figure 3This is a perspective view of steps S30 and S40 of the first embodiment of the method of the present invention. Figure 4 This is a perspective view of step S50 of the first embodiment of the method of the present invention. Figure 5 yes Figure 4 A cross-sectional view of line VV. Figure 6 This is a three-dimensional cross-sectional view of the pressing mold 71 of the present invention. Figure 7 This is a three-dimensional cross-sectional view of the molding die 72 of the present invention. Figure 8A This is a cross-sectional view of the hot pressing molding apparatus 70 of the present invention heating and pressing a substrate 40 to form a wire elastic wave 100 and a force balancing part 200.

[0083] Figure 8B yes Figure 8A A schematic diagram of region A. Figure 8C yes Figure 8A A schematic diagram of region B. Figure 8D yes Figure 8A A schematic diagram of region C. Figure 9 This is a perspective view of the hot pressing molding apparatus 70 of the present invention heating and pressing a substrate 40 to form a wire elastic wave 100 and a force balancing part 200. Figure 10 This is a perspective view of step S60 of the first embodiment of the method of the present invention. The present invention provides a method for manufacturing a conductor spring wave that controls the spacing of a conductor assembly, comprising the following steps:

[0084] Step S10, as follows Figure 1A and Figure 2 As shown, multiple warp yarns 10 and multiple conductor combinations 20 are spaced apart. The warp yarns 10 and conductor combinations 20 extend in a straight line along a first direction and are parallel to each other. Each conductor combination 20 consists of multiple conductors 21, each conductor 21 being a monofilament, and the conductors 21 are spaced apart from each other. Preferably, the warp yarns 10 are bamboo fiber, cotton fiber, silk fiber, hemp fiber, wool fiber, polyester fiber, acrylic fiber, polyethylene naphthenic fiber, rayon fiber, rubber fiber, nylon fiber, elastic fiber, acetate fiber, or a combination thereof.

[0085] Step S20, as follows Figure 1A and Figure 2 As shown, multiple weft yarns 30 are interwoven along a second direction with the warp yarns 10 and the conductor assembly 20 to weave a substrate 40. The first direction is perpendicular to the second direction. Figure 3 and Figure 4 As shown, the substrate 40 has a conductive elasticated block 41. Preferably, the weft yarns 30 are bamboo fiber, cotton fiber, silk fiber, hemp fiber, wool fiber, polyester fiber, acrylic fiber, polyethylene naphthenic fiber, rayon fiber, rubber fiber, nylon fiber, elastic fiber, acetate fiber, or a combination thereof.

[0086] Step S30, as follows Figure 1A and Figure 3 As shown, the substrate 40 is immersed in a resin solution 51 within a resin tank 50, causing the warp yarns 10, the conductors 21, and the weft yarns 30 to absorb and adhere to the resin. The resin contains solids such as alcohol and water, with a content of more than 50% of the liquid resin. The resin components are selected from one or a combination of phenolic resin, epoxy resin, polyester resin, rubber, and silicone, or other resin materials with similar properties.

[0087] Step S40, as follows Figure 1A and Figure 3 As shown, the substrate 40 is moved between an upper baking plate 61 and a lower baking plate 62 of a drying device 60. The substrate 40 is dried by the drying temperature of the upper baking plate 61 and the lower baking plate 62, so that the moisture and volatile substances in the resin on the substrate 40 are removed, thereby drying the substrate 40. At the same time, the resin penetrates into the substrate 40 and adheres to the warp yarns 10, the conductors 21 and the weft yarns 30 to form a resin solidification layer (not shown). The resin solidification layer covers the surface of the warp yarns 10, the conductors 21 and the weft yarns 30, thereby giving the substrate 40 appropriate hardness, elasticity and toughness.

[0088] Step S50, as follows Figure 1A and Figure 1B and Figures 4 to 9 As shown, a substrate 40 is placed between a pressing surface 711 of a pressing mold 71 of a thermoforming apparatus 70 and a forming surface 721 of a forming mold 72 of a thermoforming apparatus 70. Simultaneously, multiple first pressing members 80 press against the inner and outer sides of the substrate 40 of the conductor assemblies 20 outside the two ends of the conductor spring forming block 41. An upper conductor spring forming portion 7111 of the pressing surface 711 and a lower conductor spring forming portion 7211 of the forming surface 721 are heated and pressurized together on the conductor spring forming block 41 to form a conductor spring 100. Therefore, during thermoforming, the first pressing members 80 can control the spacing of the conductor assemblies 20, preventing misalignment of the conductor assemblies 20.

[0089] Step S60, as follows Figure 1C and Figure 10 As shown, the substrate 40 is moved between an upper cutter 91 and a lower cutter 92 of a cutting device 90; the upper cutter 91 and the lower cutter 92 cut the wire spring 100 from the substrate 40, so that the wire spring 100 is separated from the substrate 40.

[0090] Better, such as Figure 4As shown, each of the first pressing elements 80 is a roller. Thus, during hot pressing, these first pressing elements 80 can provide excellent point contact pressure, improve the effect of these first pressing elements 80 in controlling the spacing of the wire assemblies 20, and prevent the wire assemblies 20 from misaligning.

[0091] Better, such as Figure 5 As shown, the spacing between two adjacent first pressing members 80 is equal to the diameter of each wire assembly 20. Therefore, during hot pressing, the first pressing members 80 can completely restrict the possibility of the wire assemblies 20 moving along the second direction, improving the effect of the first pressing members 80 in controlling the spacing of the wire assemblies 20 and preventing misalignment of the wire assemblies 20.

[0092] Preferably, step S20 further includes: such as Figure 1A , Figure 3 and Figure 4 As shown, the substrate 40 has a force-balancing forming area 42, which is located around the wire elastic forming area 41; step S50 further includes: as Figure 1A , Figure 4 , Figures 6 to 9 As shown, a force-balancing part forming protrusion 7112 around the upper wire elastic forming part 7111 on the pressing surface 711 and a force-balancing part forming groove 7212 around the lower wire elastic forming part 7211 on the forming surface 721 are heated and pressed on the force-balancing part forming block 42 to form a force-balancing part 200; step S60 further includes: as Figure 1C and Figure 10 As shown, the force balancing portion 200 remains on the substrate 40. Therefore, the force balancing portion 200 can evenly distribute the wrinkling force during heating and pressurization within the area of ​​the wire elastic forming block 41, ensuring that the wire elastic forming block 41 can evenly bear the wrinkling force and guaranteeing the integrity of the wire elastic 100's shape without deformation. It is worth mentioning that, because the wire elastic 100 does not deform during hot pressing, the spacing of the wire assemblies 20 can be further controlled, thereby preventing misalignment of the wire assemblies 20.

[0093] Preferably, step S50 further includes: such as Figure 4 , Figures 6 to 9As shown, the two blocks 71121 of the force balancing part forming protrusion 7112 and the two grooves 72121 of the force balancing part forming groove 7212 are heated and pressed together on the force balancing part forming block 42 to form the two eaves 201 of the force balancing part 200. The blocks 71121, the grooves 72121 and the eaves 201 are all U-shaped, and two connecting blocks 43 are formed between the eaves 201. The wire assemblies 20 extend through the connecting blocks 43; step S60 further includes: as Figure 10 As shown, the eaves 201 remain on the substrate 40. Therefore, during hot pressing, the eaves 201 can disperse most of the shrinkage force during heating and pressing within the area of ​​the wire elastic forming blocks 41, with a small portion of the shrinkage force distributed to other blocks of the substrate 40 through the connecting blocks 43. This results in the wire elastic forming blocks 41 experiencing weaker shrinkage forces closer to the connecting blocks 43, while the remaining parts of the wire elastic forming blocks 41 experience stronger shrinkage forces. Consequently, the deformation of the wire elastic 100 near the connecting blocks 43 is greater than the deformation of the rest of the wire elastic 100. It is worth noting that because the connecting blocks 43 can completely confine the wire assemblies 20, the spacing of the wire assemblies 20 can be further controlled, thereby preventing misalignment of the wire assemblies 20.

[0094] In some embodiments, the U-shaped block can be modified into a semi-circular block, the U-shaped groove can be modified into a semi-circular groove, and the U-shaped eaves can be modified into semi-circular eaves, which can also achieve the same effect.

[0095] Preferably, step S20 further includes: such as Figure 1A , Figure 3 and Figure 4 As shown, the conductor bouncy forming block 41 has a central lead-out block 411, which includes four conductor lead-out positions 4111; step S50 further includes: as Figure 1B , Figure 4 and Figure 6As shown, the upper conductor wave forming part 7111 includes a pressing wave part 71111, a pressing middle part 71112, and two conductor protection grooves 71113. The pressing wave part 71111 surrounds the outside of the pressing middle part 71112. The pressing middle part 71112 has a protruding positioning protrusion 71114, which is elongated elliptical in shape. The positioning protrusion 71114 extends from one side of the pressing middle part 71112 to the other side and passes through the axis of the pressing surface 711. A limiting insertion hole 71115 is recessed at the axis of the pressing surface 711. The conductor protection grooves 71113 extend through the pressing wave part 71111 and the pressing middle part 71112, and are respectively disposed on both sides of the positioning protrusion 71114, with their length direction parallel to the length direction of the positioning protrusion 71114. Figure 1B , Figure 4 and Figure 7 As shown, the lower conductor wave forming part 7211 includes a forming wave part 72111, a forming intermediate part 72112, and two conductor positioning grooves 72113. The forming wave part 72111 surrounds the outside of the forming intermediate part 72112. The forming intermediate part 72112 has a positioning groove 72114 recessed therein. The positioning groove 72114 is elongated elliptical in shape and extends from one side of the forming intermediate part 72112 to the other side of the forming intermediate part 72112 and passes through the axis of the forming surface 721. A central protrusion 72115 protrudes from the axis of the forming surface 721. The conductor positioning grooves 72113 extend through the forming wave part 72111 and the forming intermediate part 72112, and are respectively arranged on both sides of the positioning groove 72114, and their length direction is parallel to the length direction of the positioning groove 72114. Figure 1B , Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 9 As shown, the pressing wave portion 71111 and the forming wave portion 72111 together form a wave portion of the wire spring 100 on the wire spring forming block 41, and the pressing intermediate portion 71112 and the forming intermediate portion 72112 together form a central hole of the wire spring 100 on the wire spring forming block 41; and as shown Figure 1B , Figure 8A , Figure 8B , Figure 8C and Figure 8DAs shown, the positioning protrusion 71114 presses the portion from one side to the other side of the center wire exiting block 411 downward into the positioning groove 72114, and the central protrusion 72115 presses the axis of the center wire exiting block 411 further into the limiting insertion hole 71115. The wire protection groove 71113 and the wire positioning groove 72113 together form a two-wire limiting channel 73 to restrict the deformation and shrinkage of the wire elastic forming block 41, so that the wire assembly 20 is adjusted to the wire exiting position 4111 and located in the wire limiting channel 73. Therefore, during hot pressing, the combination of the positioning protrusion 71114 and the positioning groove 72114, as well as the combination of the central protrusion 72115 and the limiting insertion hole 71115, can effectively balance the wrinkling forces of the wire elastic forming block 41 and the force balancing forming block 42, so that the spacing of the wire assemblies 20 can be further controlled and stably positioned in the wire limiting channels 73, thereby preventing the wire assemblies 20 from misaligning. Furthermore, during hot pressing, the wire protection grooves 71113 can protect the wire assemblies 20 and prevent them from being damaged by the pressing mold 71.

[0096] Preferably, step S60 further includes: such as Figure 1C and Figure 10 As shown, a plurality of second pressing members 81 press against the inner and outer substrates 40 of the conductor assemblies 20 outside the two ends of the conductor springs 100. Thus, during cutting, the second pressing members 81 can control the spacing of the conductor assemblies 20 and prevent the conductor assemblies 20 from misaligning.

[0097] Better, such as Figure 10 As shown, each of the second pressure members 81 is a roller. Thus, during the cutting process, the second pressure members 81 can provide excellent point contact pressure, improve the effect of the second pressure members 81 in controlling the spacing of the wire assemblies 20, and prevent the wire assemblies 20 from misaligning.

[0098] Better, such as Figure 10 As shown, the spacing between two adjacent second clamping members 81 is equal to the diameter of each conductor assembly 20. Therefore, during the cutting process, the second clamping members 81 can completely restrict the possibility of the conductor assemblies 20 moving along the second direction, improving the effectiveness of the second clamping members 81 in controlling the spacing of the conductor assemblies 20 and preventing misalignment of the conductor assemblies 20.

[0099] Figure 11 This is a schematic diagram of steps S10 and S20 of the second embodiment of the method of the present invention. Figure 11 As shown, the difference between the second embodiment and the first embodiment is that the conductors 21 are twisted together so that each conductor combination 20A forms a multifilament body with a circular cross-section.

[0100] Figure 12 This is a schematic diagram of steps S10 and S20 of the third embodiment of the method of the present invention. Figure 12 As shown, the difference between the third embodiment and the first embodiment is that the conductors 21 are interwoven with each other, so that each conductor combination 20B forms a multifilament body with a flat cross-section.

[0101] The above description is merely for explaining preferred embodiments of the present invention and is not intended to limit the present invention in any way. Therefore, any modifications or changes made to the present invention under the same inventive spirit should still be included within the scope of protection intended by the present invention.

Claims

1. A method for manufacturing a wire spring of a wire assembly, comprising the steps of: (a) combining and spacing a plurality of warp yarns and a plurality of conductive threads, the plurality of warp yarns and the plurality of conductive threads being linearly extended and parallel to each other along a first direction, wherein, each of the wire assemblies is composed of a plurality of wires, and each of the wires is a single wire body; (b) interlacing a plurality of weft yarns with the plurality of warp yarns and the plurality of wire assemblies along a second direction to weave a base material, wherein the first direction is perpendicular to the second direction, and the base material has a wire spring forming area; (c) immersing the base material in a resin solution; (d) drying the base material to form a resin solid layer on the base material; (e) placing the base material between a pressing surface of a pressing die of a hot press forming device and a forming surface of a forming die of the hot press forming device, while a plurality of first pressing members press the base material on the inner and outer sides of the plurality of wire assemblies outside the two ends of the wire spring forming area, and the upper wire spring forming portion of the pressing surface and the lower wire spring forming portion of the forming surface jointly heat and press the wire spring forming area to form a wire spring; and (f) separating the wire spring from the base material.

2. The method of manufacturing a wire-spring according to claim 1, wherein Each of the first pressing members is a roller.

3. The method of manufacturing a control wire combination spacing wire damper according to claim 1, wherein, The distance between two adjacent first pressing members is equal to the diameter of each of the wire assemblies.

4. The method of manufacturing a control wire combination spacing wire damper according to claim 1, wherein, Step (b) further comprises that the base material has a stress balancing portion forming area located around the wire spring forming area; wherein step (e) further comprises that a stress balancing portion forming protrusion around the upper wire spring forming portion of the pressing surface and a stress balancing portion forming groove around the lower wire spring forming portion of the forming surface jointly heat and press the stress balancing portion forming area to form a stress balancing portion; wherein step (f) further comprises that the stress balancing portion remains on the base material.

5. The method of manufacturing a control wire combination spacing wire damper according to claim 4, wherein, Step (e) further comprises that two blocks of the stress balancing portion forming protrusion around the upper wire spring forming portion of the pressing surface and two grooves of the stress balancing portion forming groove around the lower wire spring forming portion of the forming surface jointly heat and press the stress balancing portion forming area to form two roof portions of the stress balancing portion, the blocks, the grooves and the roof portions are U-shaped or semi-circular, two connecting areas are formed between the roof portions, and the plurality of wire assemblies extend through the connecting areas; wherein step (f) further comprises that the roof portions remain on the base material.

6. The method of manufacturing a control wire combination spacing wire damper according to claim 1, wherein, Step (b) further comprises: the wire spring forming block has a center wire outlet block, the center wire outlet block comprises four wire outlet positions; wherein step (e) further comprises: the upper wire spring forming part comprises a pressing wave part, a pressing intermediate part, and two wire protection grooves, the pressing wave part surrounds the outside of the pressing intermediate part, the pressing intermediate part protrudes a positioning protrusion, the positioning protrusion is in an oblong shape, the positioning protrusion extends from one side of the pressing intermediate part to the other side of the pressing intermediate part and passes through the axis of the pressing surface, the axis of the pressing surface is recessed to form a limiting insertion hole, the plurality of wire protection grooves extend through the pressing wave part and the pressing intermediate part, are respectively arranged on both sides of the positioning protrusion, and the length direction of the plurality of wire protection grooves is parallel to the length direction of the positioning protrusion; the lower wire spring forming part comprises a forming wave part, a forming intermediate part, and two wire positioning grooves, the forming wave part surrounds the outside of the forming intermediate part, the forming intermediate part is recessed to form a positioning recess, the positioning recess is in an oblong shape, the positioning recess extends from one side of the forming intermediate part to the other side of the forming intermediate part and passes through the axis of the forming surface, the axis of the forming surface protrudes a center protrusion, the plurality of wire positioning grooves extend through the forming wave part and the forming intermediate part, are respectively arranged on both sides of the positioning recess, and the length direction of the plurality of wire positioning grooves is parallel to the length direction of the positioning recess; the pressing wave part and the forming wave part jointly form the wave part of the wire spring on the wire spring forming block, the pressing intermediate part and the forming intermediate part jointly form the center hole of the wire spring on the wire spring forming block; and the positioning protrusion presses the part of the center wire outlet block from one side of the center wire outlet block to the other side of the center wire outlet block into the positioning recess, the center protrusion further presses the axis of the center wire outlet block into the limiting insertion hole, and the plurality of wire protection grooves and the plurality of wire positioning grooves jointly form two wire limiting channels to limit the wire spring forming block from being deformed and wrinkled, so that the plurality of wire assemblies are adjusted to the plurality of wire outlet positions and are located in the plurality of wire limiting channels.

7. The method of manufacturing a control wire combination spacing wire damper according to claim 1, wherein, Step (f) further comprises: moving the substrate between the upper cutter of the cutting device and the lower cutter of the cutting device, while the plurality of second pressing members press the inner side and the outer side of the plurality of wire assemblies of the substrate outside the two ends of the wire spring; and the upper cutter and the lower cutter cut the wire spring from the substrate, so that the wire spring is separated from the substrate.

8. The method of manufacturing a wire spring of a control wire assembly according to claim 7, wherein Each of the second pressing members is a roller.

9. The method of manufacturing a control wire combination spacing wire damper according to claim 7, wherein, The distance between adjacent two second pressing members is equal to the diameter of each of the wire assemblies.

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