PCB processing equipment and PCB processing method

Abstract

The invention discloses a PCB processing device and a PCB processing method, and relates to the field of PCB processing equipment.The PCB processing device comprises an air static pressure electric spindle; the air static pressure electric spindle is used for driving the machining tool rotating at a high speed to vibrate in the first direction at the set amplitude and frequency in the machining process, so that periodic contact and separation are formed between the machining tool and the PCB, and machining of the PCB is achieved. In the embodiment, the air static pressure electric spindle drives the machining tool rotating at a high speed to vibrate in the first direction according to the set amplitude and frequency, so that the machining tool and the PCB are in periodic contact and separation, the axial force and torque borne by the machining tool are reduced, the friction factor between the machining tool and cuttings is reduced, the machining precision is improved, and the machining efficiency is improved. In addition, timely discharge of cutting chippings is promoted, abrasion of a machining cutter is reduced, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB processing equipment, and particularly relates to a PCB processing equipment and a PCB processing method. BACKGROUND

[0002] With the rapid development of science and technology, the miniaturization and integration trend of electronic equipment is increasingly evident, which puts forward higher requirements on the line density and aperture density of printed circuit boards (PCB boards). In the manufacturing process of the PCB board, the processing procedures of the PCB board include multiple procedures, such as drilling, milling, milling and cutting, and the processing quality directly affects the electrical performance of the PCB.

[0003] In order to improve the processing precision and efficiency of the PCB board, the existing PCB processing equipment mainly adjusts the rotation speed and feeding speed of the electric spindle. However, when processing special PCB boards such as high-density PCB boards or high-thickness-diameter ratio PCB boards, the processing precision and efficiency are still low. SUMMARY

[0004] Based on this, the embodiments of the present application provide a PCB processing equipment and a PCB processing method to solve the technical problem of low processing precision and efficiency of the existing PCB processing equipment.

[0005] To solve the above problems, the technical scheme adopted by the present application is as follows: In a first aspect, a PCB processing equipment is provided, comprising a gas static pressure electric spindle. The gas static pressure electric spindle is used to drive a high-speed rotating processing tool to vibrate in a first direction with a set amplitude and frequency during processing, so that periodic contact and separation between the processing tool and the PCB board is formed to realize processing of the PCB board.

[0006] Optionally, the gas static pressure electric spindle comprises a gas static pressure ultrasonic electric spindle; the gas static pressure ultrasonic electric spindle comprises an electric spindle that realizes preset direction vibration and rotation of a rotating shaft core arranged inside the electric spindle in a gas cyclone floating state by using air dynamics principle.

[0007] Optionally, the gas static pressure electric spindle comprises a gas static pressure ultrasonic electric spindle; the gas static pressure ultrasonic electric spindle comprises a spindle body, a gas path structure, a gas floating vibration plate, and a rotating shaft core arranged inside the spindle body. The gas floating vibration plate is connected to the rotating shaft core. The gas path structure is arranged at the front end or inside of the spindle body, and is used to guide gas flow to act on both sides of the gas floating vibration plate, so as to drive the gas floating vibration plate to drive the rotating shaft core to vibrate in the first direction, and further drive the processing tool to vibrate in the first direction synchronously.

[0008] Optionally, the PCB processing equipment further comprises a gantry system, a bed body, a workbench, a first movement assembly, a second movement assembly, a third movement assembly and a main shaft fixing assembly; The bed body and the gantry system form a channel; The aerostatic ultrasonic electric spindle is connected to one side of the main shaft fixing assembly, the other side of the main shaft fixing assembly is connected to one end of the first movement assembly, the other end of the first movement assembly is connected to one end of the second movement assembly, and the other end of the second movement assembly is connected to the gantry system; One end of the third movement assembly is connected to the bed body, and the other end is detachably connected to the workbench; The first movement assembly can drive the main shaft fixing assembly to move in the first direction, so that the main shaft fixing assembly drives the aerostatic ultrasonic electric spindle to move in the first direction; The second movement assembly can drive the first movement assembly to move in the second direction, so as to drive the aerostatic ultrasonic electric spindle to move in the second direction; The third movement assembly can drive the workbench to move in the third direction, so that the workbench moves in or out of the channel; The first direction, the second direction and the third direction are perpendicular to each other.

[0009] Optionally, the main shaft fixing assembly comprises a main shaft mounting plate, a main shaft mounting seat and a flange plate; The main shaft mounting seat is provided with a through hole; The flange plate is fixedly sleeved on the main shaft body; One end of the first movement assembly is detachably connected to one side of the main shaft mounting plate; The other side of the main shaft mounting plate is fixedly connected to the main shaft mounting seat; The lower end of the main shaft body passes through the through hole of the main shaft mounting seat, and the flange plate and the main shaft mounting seat are fixedly connected to each other.

[0010] Optionally, the main shaft fixing assembly further comprises a main shaft positioning sleeve; The main shaft positioning sleeve is sleeved on the main shaft body and is arranged between the flange plate and the main shaft mounting seat, and is used for adjusting the vertical installation degree of the main shaft body.

[0011] Optionally, the main shaft fixing assembly comprises a main shaft clamp rear seat, a main shaft clamp front cover, a main shaft clamp rear seat rubber ring, a main shaft clamp front cover rubber ring and a main shaft gasket; One end of the first movement assembly is detachably connected to one side of the main shaft clamp rear seat; The main shaft clamping rear seat rubber ring is installed on the other side contact surface of the main shaft clamping rear seat, and the main shaft clamping front cover rubber ring is installed on the side contact surface of the main shaft clamping front cover and corresponds to the other side contact surface of the main shaft clamping rear seat. The lower end of the main shaft body is fixedly installed between the main shaft clamping rear seat rubber ring and the main shaft clamping front cover rubber ring. The main shaft gasket is arranged between the upper end of the main shaft body and the main shaft clamping front cover.

[0012] Optionally, the processing type of the PCB board includes drilling, milling, milling or cutting, and / or the PCB board includes a high thickness-diameter ratio PCB board, a multi-layer PCB board or a high-density interconnection PCB board.

[0013] In a second aspect, a PCB processing method is provided, which is applied to the PCB processing device of the first aspect, and the method comprises: obtaining a processing parameter of a PCB board; determining a target vibration parameter corresponding to the processing of the PCB board according to the processing parameter; controlling the gas static pressure electric spindle to drive the high-speed rotating processing tool to vibrate in the first direction according to the target vibration parameter, so that the processing tool and the PCB board form periodic contact and separation, thereby realizing the processing of the PCB board.

[0014] Optionally, the gas static pressure electric spindle includes a gas static pressure ultrasonic electric spindle; and the controlling the gas static pressure electric spindle to drive the high-speed rotating processing tool to vibrate in the first direction according to the target vibration parameter comprises: outputting a corresponding current signal according to the target vibration parameter; converting the current signal into a gas signal, and controlling the input gas pressure of the gas static pressure ultrasonic electric spindle according to the gas signal, so that the gas static pressure ultrasonic electric spindle drives the high-speed rotating processing tool to vibrate in the first direction according to the input gas pressure.

[0015] Optionally, the gas static pressure electric spindle includes a gas static pressure ultrasonic electric spindle; and after the controlling the gas static pressure ultrasonic electric spindle to drive the high-speed rotating processing tool to vibrate in the first direction according to the target vibration parameter, the method further comprises: obtaining an actual vibration parameter of the gas static pressure ultrasonic electric spindle; comparing the actual vibration parameter with the target vibration parameter to obtain a comparison result; if the comparison result is matched, starting to process the PCB board; if the comparison result is not matched, adjusting the input gas pressure of the gas static pressure ultrasonic electric spindle until the actual vibration parameter matches the target vibration parameter.

[0016] Optionally, if the comparison result is not matched, the input air pressure of the aerostatic ultrasonic motorized spindle is adjusted until the actual vibration parameter matches the target vibration parameter, including: acquiring the input air pressure; determining whether the input air pressure is out of a preset range; if the input air pressure is out of the preset range, triggering an alarm and / or controlling the aerostatic ultrasonic motorized spindle to stop working; if the input air pressure is not out of the preset range, adjusting the input air pressure until the actual vibration parameter matches the target vibration parameter.

[0017] Optionally, the input air pressure range is 0.2MPa~0.8MPa.

[0018] Optionally, the target vibration parameter includes amplitude and frequency, the amplitude range is 1µm~20µm, and the frequency range is 2KHz~40KHz.

[0019] Optionally, the processing parameter at least includes any one or more of the following parameters: PCB board parameter, including PCB board type and PCB board inherent parameter;processing type parameter, including drilling parameter, milling parameter, or cutting parameter.

[0020] In one scheme provided by the embodiment of the application, the PCB processing device includes an aerostatic motorized spindle; the aerostatic motorized spindle is used to drive a high-speed rotating processing tool to vibrate in a first direction with a set amplitude and frequency during processing, so that periodic contact and separation between the processing tool and the PCB board is formed to realize processing of the PCB board. In this embodiment, the high-speed rotating processing tool is driven by the aerostatic motorized spindle to vibrate in the first direction with a set amplitude and frequency, and the vibration causes the displacement of the processing tool in each vibration period to change slightly. This change promotes the contact point between the processing tool and the PCB board to be fine-tuned in each period. Therefore, when the processing tool has errors due to deviation or inaccurate positioning, these errors can be automatically corrected in the next vibration period, effectively reducing the deviation of the processing tool and improving the accurate positioning ability of processing, thereby improving the processing precision and efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without any creative effort.

[0022] Figure 1 is a schematic diagram of a PCB processing equipment in an embodiment of the present application; Figure 2 is a processing schematic diagram of an aerostatic pressure electric spindle in an embodiment of the present application; Figure 3 is a mounting schematic diagram of an aerostatic pressure electric spindle in an embodiment of the present application; Figure 4 is a plan view of a mounting of an aerostatic pressure electric spindle in an embodiment of the present application; Figure 5 is a side view of a mounting of an aerostatic pressure electric spindle in an embodiment of the present application; Figure 6 is a schematic diagram of a spindle positioning sleeve in an embodiment of the present application; Figure 7 is another side view of a mounting of an aerostatic pressure electric spindle in an embodiment of the present application; Figure 8 is another plan view of a mounting of an aerostatic pressure electric spindle in an embodiment of the present application; Figure 9 is a system schematic diagram of a PCB processing equipment in an embodiment of the present application; Figure 10 is a flow chart of a PCB processing method in an embodiment of the present application; Figure 11 is another flow chart of a PCB processing method in an embodiment of the present application; Figure 12 is another flow chart of a PCB processing method in an embodiment of the present application; Figure 13 is another flow chart of a PCB processing method in an embodiment of the present application.

[0023] In the drawings, the reference signs are as follows: 1, aerostatic pressure electric spindle; 2, worktable; 3, cross beam base; 31, first base; 32, second base; 4, cross beam; 5, bed; 6, first movement assembly; 7, second movement assembly; 8, third movement assembly; 9, main shaft fixing assembly; 91, main shaft mounting plate; 92, main shaft mounting seat; 921, threaded hole; 93, flange plate; 931, counterbore; 94, main shaft positioning sleeve; 941, positioning hole; 95, main shaft mounting insulating sleeve; 96, main shaft clamping rear seat; 97, main shaft clamping front cover; 98, main shaft clamping rear seat rubber ring; 99, main shaft clamping front cover rubber ring; 910, main shaft washer; 10, screw; 11, machining tool; 12, PCB board. DETAILED DESCRIPTION

[0024] In order to make the technical problems solved by the present application, the technical solutions and beneficial effects clearer, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application.

[0025] In the description of the present application, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0026] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] It should be noted that the processing object PCB board claimed in the present application can not be limited to the PCB board itself, and structures similar to the PCB board such as IC carrier board and glass substrate are also within the protection scope claimed by the present application. In order to avoid redundancy, the following will be mainly illustrated by taking the PCB board as an example.

[0028] In an embodiment, the first aspect provides a PCB processing device, please refer to Figure 1 and Figure 2The PCB processing equipment comprises an aerostatic electric spindle 1, which is used to drive a high-speed rotating processing tool 11 to vibrate in a first direction with a set amplitude and frequency during processing, so that the processing tool 11 and the PCB board 12 form periodic contact and separation, thereby achieving processing of the PCB board 12.

[0029] In this embodiment, the high-speed rotating processing tool 11 can be a processing tool 11 with a rotating speed of 50,000 rpm to 300,000 rpm, preferably, the rotating speed of the processing tool 11 can be 100,000 rpm, 150,000 rpm, 200,000 rpm or 250,000 rpm, which is not limited herein, and of course, the aerostatic electric spindle 1 drives the processing tool 11 to vibrate for processing the PCB board 12 at other rotating speeds, which is also within the protection scope of the present application. In addition, the preset amplitude range of the aerostatic electric spindle 1 can be 1 µm to 20 µm, and the preset frequency range can be 100 Hz to 80 KHz.

[0030] As an example, by setting the aerostatic electric spindle 1 on the PCB processing equipment, the aerostatic electric spindle 1 drives the processing tool 11 to vibrate in a first direction with a set amplitude and frequency during processing, and this pulse type non-continuous drilling process makes the processing tool 11 and the PCB board 12 appear periodic contact and separation, so that the displacement of the processing tool 11 in each vibration period changes slightly, and this change promotes the contact point between the processing tool 11 and the PCB board 12 to be fine-tuned in each period. Therefore, when the processing tool 11 has errors due to deviation or inaccurate positioning, these errors can be automatically corrected in the next vibration period, effectively reducing the deviation of the processing tool 11, improving the accurate positioning ability of processing, and thereby improving the processing precision and efficiency.

[0031] For example, in the vibration drilling process, when the drill bit encounters deviation during drilling, the vibration action makes the drill bit temporarily exit and reposition, thereby automatically eliminating the deviation and ensuring that the drill bit can accurately re-drill into the target position, thereby improving the positioning accuracy of drilling, and making the vibration drilling exhibit higher precision and efficiency than ordinary drilling in PCB processing. Especially when processing difficult-to-process materials such as high aspect ratio PCB boards, multi-layer PCB boards and high-density interconnection PCB boards, great advantages are shown.

[0032] In addition, the good chip breaking performance caused by vibration makes the chip removal more smooth during the machining process, reduces the scratching of the cutting chip on the hole surface, and the reciprocating pressing effect of the machining tool 11 on the inner hole surface during the vibration machining process further reduces the surface roughness of the PCB 12 and the surface quality of the hole wall, and improves the machining quality of the PCB 12. And because of the intermittent action between the machining tool 11 and the PCB 12, the friction is greatly reduced, so that the machining tool 11 is always in a stable and normal wear stage, the cutting temperature is low, the drill performance is stable, the wear speed is slow, and the service life of the machining tool 11 is prolonged.

[0033] For example, when machining a 2.5mm high thickness ratio PCB (for example, FR-4 PCB), the frequency can be set to 30KHz, and the amplitude can be set to 1.5pm, so that the machining tool 11 vibrates slightly at a frequency of 30000 times per second when in contact with the PCB 12. This vibration causes the cutting edge of the machining tool 11 to form periodic contact and separation with the PCB 12, the cutting force changes from continuous force to pulse force, continuous cutting changes to intermittent cutting, so that the cutting thickness of the machining tool 11 changes periodically with time. Therefore, the average cutting thickness of the machining tool 11 is smaller than the cutting thickness of high-speed drilling under the same machining parameters, effectively reducing the cutting force borne by the machining tool 11, not only improving the chip removal effect, reducing the cutting chip blockage and the machining instability caused by material hardness and machining tool 11 wear, but also improving the machining precision and efficiency, and prolonging the service life of the machining tool 11.

[0034] It should be understood that the above-mentioned periodic contact and separation is manifested as the number of contacts and separations between the machining tool 11 and the PCB 12 during the machining process, which is determined by the vibration frequency of the aerostatic pressure electric spindle 1, for example, once every 50pm (1s / 20000 times) to complete a cycle of contact and separation. The amplitude determines the pressure exerted by the machining tool 11 on the PCB 12 during each contact, and the greater the amplitude, the stronger the contact force.

[0035] In an embodiment, the aerostatic pressure electric spindle 1 includes an aerostatic pressure ultrasonic electric spindle, which includes an electric spindle that uses aerodynamic principles to make the rotating shaft core arranged inside the electric spindle vibrate and rotate in a preset direction in a cyclone floating state.

[0036] In some embodiments, the pneumatic electrostatic spindle 1 can be an electrostatic spindle that integrates aerodynamic principles and ultrasonic technology. Specifically, a rotating shaft core can be set inside the electrostatic spindle, and under ultrasonic drive, the rotating shaft core vibrates at high frequency in a preset direction. At the same time, by introducing high-pressure air into the electrostatic spindle, the introduced high-pressure air forms a static pressure air film around the rotating shaft core, thereby isolating the rotating shaft core from direct contact with the inner wall of the electrostatic spindle. Thus, under the action of air vortex buoyancy, the rotating shaft core can simultaneously achieve vibration and rotation.

[0037] In one embodiment, the pneumatic electro-hydraulic spindle 1 includes a pneumatic ultrasonic electro-hydraulic spindle with a frequency range of 20 kHz or higher. Further, the frequency range of the pneumatic ultrasonic electro-hydraulic spindle can be configured within the range of 20 kHz to 60 kHz, preferably 20 kHz, 30 kHz, or 40 kHz. The pneumatic ultrasonic electro-hydraulic spindle includes a spindle body, an air path structure, an air-bearing vibrating plate, and a rotating shaft core disposed inside the spindle body. One end of the machining tool 11 is detachably connected to the output end of the rotating shaft core. The air-bearing vibrating plate is connected to the rotating shaft core. The air path structure is disposed at the front end or inside the spindle body to guide airflow to act on both sides of the air-bearing vibrating plate, thereby driving the air-bearing vibrating plate to drive the rotating shaft core to vibrate along a first direction, and thus driving the machining tool 11 to vibrate synchronously along the first direction.

[0038] In some embodiments, a rotating shaft is installed inside the spindle body of the pneumatic ultrasonic electric spindle. This rotating shaft is detachably connected to one end of the machining tool 11 via its output end, enabling it to transmit ultrasonic vibrations while rotating at high speed, causing the machining tool 11 to vibrate synchronously along a preset first direction. An air-bearing vibrating plate can be fixedly connected to the rotating shaft, its main function being to drive the rotating shaft to achieve ultrasonic vibration. As an example, an air passage structure located at the front end or inside the spindle body can guide airflow to both sides of the air-bearing vibrating plate, thereby forming an air film on both sides of the air-bearing vibrating plate, generating a pressure difference. This pressure difference drives the air-bearing vibrating plate to vibrate along the first direction, and the vibration of the air-bearing vibrating plate is transmitted to the machining tool 11 through the rotating shaft, causing the machining tool 11 to form a periodic contact force on the surface of the PCB board 12.

[0039] In one embodiment, the PCB processing equipment further includes a gantry system, a bed 5, a worktable 2, a first motion component 6, a second motion component 7, a third motion component 8, and a spindle fixing component 9; In some embodiments, the gantry system includes a beam base 3 and a beam 4 disposed on the beam base 3. Specifically, the beam base 3 includes a first base 31 and a second base 32 spaced apart. One end of the first base 31 and the second base 32 are connected to the beam 4 by fasteners or other means, thereby forming the gantry system. This connection method allows the PCB processing equipment to be quickly disassembled and reassembled when it needs to be moved or adjusted, improving the operating efficiency and flexibility of the PCB processing equipment. The beam 4 can also be made of a rigid material, such as marble, steel, or aluminum alloy, to ensure that it can withstand the weight of the piezoelectric spindle 1 and the load caused by its movement during processing, preventing deformation. The length and strength of the beam 4 can be customized according to the processing area and processing requirements; however, this invention does not limit the specific dimensions.

[0040] Furthermore, the worktable 2 can be positioned below the piezoelectric spindle 1, serving as the main support platform for the PCB board 12. It should be noted that the surface of the worktable 2 can also be designed as a height-adjustable plane to accommodate the processing needs of PCB boards of different thicknesses; however, this invention does not impose any limitations on this.

[0041] Furthermore, the pneumatic piezoelectric spindle 1 is detachably connected to one side of the spindle fixing assembly 9, the other side of the spindle fixing assembly 9 is detachably connected to one end of the first motion assembly 6, the other end of the first motion assembly 6 is detachably connected to one end of the second motion assembly 7, and the other end of the second motion assembly 7 is detachably connected to the gantry system; the first motion assembly 6 can drive the spindle fixing assembly 9 to move along a first direction, so that the spindle fixing assembly 9 drives the pneumatic piezoelectric spindle 1 to move along the first direction; the second motion assembly 7 can drive the first motion assembly 6 to move along a second direction, so that the pneumatic piezoelectric spindle 1 moves along the second direction.

[0042] In some embodiments, one side of the spindle fixing assembly 9 can be connected to the pneumatic piezoelectric spindle 1 via a detachable connection device (such as bolts or clamps). This connection allows the pneumatic piezoelectric spindle 1 to be easily installed and removed as needed. The other side of the spindle fixing assembly 9 is connected to one end of the first motion assembly 6 via a similar detachable connection device, ensuring that the first motion assembly 6 can drive the spindle fixing assembly 9 to move in a first direction, thereby driving the pneumatic piezoelectric spindle 1 to move in the first direction. The other end of the first motion assembly 6 is connected to one end of the second motion assembly 7 via a detachable connection device, and the other end of the second motion assembly 7 is connected to the crossbeam 4 via a similar detachable connection device. In this way, while the first motion assembly 6 drives the spindle fixing assembly 9 to move in the first direction, the second motion assembly 7 can drive the first motion assembly 6 to move in a second direction, thereby driving the pneumatic piezoelectric spindle 1 to move synchronously in the first and second directions. This improves processing flexibility, meets the requirements of different processing techniques, and simplifies the installation and maintenance process of PCB processing equipment.

[0043] In one embodiment, the first motion component 6 includes a first linear motor, a first rolling guide rail, a first slider, and a base plate. The first linear motor and the first rolling guide rail are fixed to the front side of the base plate. The first slider is disposed on the first rolling guide rail and connected to one side of the first linear motor and the spindle fixing component 9, while the pneumatic piezoelectric spindle 1 is fixed to the other side of the spindle fixing component 9. During operation, by controlling the first linear motor, it drives the first slider to move along the first rolling guide rail in a first direction, thereby driving the spindle fixing component 9 to move in the first direction, for example, the Z-axis direction, thus driving the pneumatic piezoelectric spindle 1 to move in the first direction. The first motion component 6 can use a high-precision and low-friction material (e.g., steel or aluminum alloy) to ensure smooth movement of the first slider on the first guide rail and avoid affecting machining accuracy due to vibration or friction.

[0044] In one embodiment, the second motion component 7 includes a second linear motor, a second rolling guide rail, and a second slider. The second linear motor and the second rolling guide rail are mounted on the crossbeam 4, and the second slider is disposed on the second rolling guide rail and connected to the back of the base plate and the second linear motor. During operation, by controlling the second linear motor, it drives the second slider to move along the second rolling guide rail in a second direction, for example, the X-axis direction, thereby driving the first motion component 6 to move in the second direction. This, in turn, drives the pneumatic piezoelectric spindle 1 on the spindle fixing component 9 to move in the second direction, enabling the pneumatic piezoelectric spindle 1 to move in both directions, forming a complete two-dimensional motion plane, for example, the ZX plane. This achieves comprehensive control of the pneumatic piezoelectric spindle 1 and meets the precision requirements of different PCB board processing.

[0045] Furthermore, a channel is formed between the gantry system and the bed 5.

[0046] As an example, one end of the crossbeam base 3 can be connected to the bed 5, and the other end of the crossbeam base 3 can be connected to the crossbeam 4 to form a channel for the movement of the worktable 2. This allows the worktable 2 to move in the channel during processing to adapt to different processing needs, greatly improving the applicability and processing efficiency of the PCB processing equipment, while also reducing downtime caused by repositioning the PCB board 12.

[0047] Furthermore, one end of the third motion component 8 is detachably connected to the bed 5, and the other end is detachably connected to the worktable 2; the third motion component 8 can drive the worktable 2 to move along a third direction, so that the worktable 2 moves in or out of the channel.

[0048] In some embodiments, the third motion component 8 can be connected to the bed 5 and the worktable 2 respectively via threaded connection, pin connection, key connection or quick-locking device, so that the third motion component 8 can be easily disassembled or adjusted when needed, facilitating maintenance or replacement of parts. The main function of the third motion component 8 is to drive the worktable 2 to move in a third direction, such as the Y-axis direction, thereby causing the PCB board 12 on the worktable 2 to move flexibly in or out of the channel formed between the gantry system and the bed 5.

[0049] For example, when processing a large PCB board 12, the worktable 2 can move along a third direction via the third motion component 8, which makes it convenient to move the PCB board 12 from outside the PCB processing equipment into the processing area, or to move it out of the processing area after processing. This makes the operation of the PCB processing equipment more flexible, and can significantly improve production efficiency, especially in batch production or complex board processing.

[0050] In one embodiment, the third motion component 8 includes a third linear motor, a third rolling guide rail, and a third slider. The third linear motor and the third rolling guide rail are mounted on the bed 5, and the third slider is disposed on the third rolling guide rail and connected to the worktable 2 and the third linear motor. During operation, by controlling the third linear motor, it drives the third slider to move along the third rolling guide rail in a third direction, thereby driving the worktable 2 to move in a third direction. This causes the PCB board 12 on the worktable 2 to move in or out of the channel formed between the crossbeam base 3 and the crossbeam 4, forming a complete three-dimensional motion plane, such as the ZXY plane, which meets the accuracy requirements of different PCB board processing.

[0051] In summary, the first motion component 6 and the second motion component 7 drive the pneumatic-static-piezoelectric spindle 1 to perform precision machining in the first and second directions, respectively. After machining is completed, the third motion component 8 drives the worktable 2 to move out of the machining area in the third direction, allowing operators to easily unload and reload the PCB. This entire process improves the working efficiency and operational convenience of the PCB processing equipment.

[0052] In one embodiment, the first, second, and third directions are mutually perpendicular. Specifically, this perpendicularity ensures that the first motion component 6, the second motion component 7, and the third motion component 8 do not interfere with each other when operating independently in their respective directions, thereby achieving precise and stable motion control. For example, when the first motion component 6 drives the piezoelectric spindle 1 to move in the first direction, the second motion component 7 can simultaneously adjust its processing position in the second direction, while the third motion component 8 can flexibly adjust the movement of the worktable 2 in the third direction. Through this design, the PCB processing equipment can be precisely positioned and operated in three-dimensional space, thereby achieving complex processing tasks.

[0053] In one embodiment, such as Figure 3 , Figure 4 and Figure 5 As shown, the spindle fixing assembly 9 includes a spindle mounting plate 91, a spindle mounting base 92, and a flange 93; the spindle mounting base 92 has a through hole (not shown in the figure); the flange 93 is fixedly sleeved on the spindle body; one end of the first motion assembly 6 is detachably connected to one side of the spindle mounting plate 91; the other side of the spindle mounting plate 91 is fixedly connected to the spindle mounting base 92; the lower end of the spindle body passes through the through hole of the spindle mounting base 92, and the flange 93 and the spindle mounting base 92 are fixed to each other.

[0054] In some embodiments, one side of the spindle mounting plate 91 can be connected to one end of the first motion component 6 via a detachable connecting device (such as bolts or clamps). This connection method allows the spindle mounting plate 91 to be installed or removed as needed, while providing a stable support structure. The other side of the spindle mounting plate 91 is fixedly connected to the spindle mounting base 92. This fixed connection can be achieved by bolts, welding, or other suitable mechanical connection methods to ensure that the spindle mounting base 92 is stably fixed to the spindle mounting plate 91. Furthermore, a through hole can be provided on the spindle mounting base 92 for the lower end of the spindle body to pass through. The size and position of the through hole can be preset according to the shape of the spindle body to ensure that the spindle body is not disturbed during installation; however, this invention does not limit this. The flange 93 is fixedly sleeved on the middle end of the spindle body. The inner diameter of the flange 93 is tightly fitted with the outer diameter of the spindle body, thereby fixing it to the middle end of the spindle body. Then, the lower end of the spindle body passes through the through hole of the spindle mounting base 92 and is fixed to the spindle mounting base 92 by the flange 93 sleeved on the middle end of the spindle body, thereby ensuring the stability of the pneumatic piezoelectric spindle during the machining process and preventing displacement or shaking.

[0055] Furthermore, the flange 93 is provided with a countersunk hole 931, and the spindle mounting base 92 is provided with a threaded hole 921 corresponding to the countersunk hole 931. In some embodiments, the lower end of the spindle body can be aligned with the through hole on the spindle mounting base 92 and slowly passed through the through hole. The flange 93 is fixedly sleeved on the middle end of the spindle body, ensuring that the countersunk hole 931 on the flange 93 is aligned with the threaded hole 921 on the spindle mounting base 92. A screw 10 is then used to pass through the countersunk hole 931 of the flange 93 and connect it to the corresponding threaded hole 921 on the spindle mounting base 92. This fixing method helps to distribute the load and stress generated by the pneumatic piezoelectric spindle 1 during machining, extending the service life of the pneumatic piezoelectric spindle 1.

[0056] Furthermore, the spindle fixing assembly 9 may also include a spindle mounting insulating sleeve 95, the main function of which is to provide electrical isolation. As an example, when fixing the flange 93 to the spindle mounting base 92, the spindle mounting insulating sleeve 95 can first be placed in the countersunk hole 931 of the flange 93. Then, the screw 10 is passed through the spindle mounting insulating sleeve 95 and connected to the threaded hole 921, thereby preventing electrical contact between the spindle body and the mounting screw 10, thus avoiding electrical noise interference to surrounding components. It should be noted that when selecting the spindle mounting insulating sleeve 95, a suitable spindle mounting insulating sleeve 95 can be selected based on the relationship between the outer diameter of the countersunk hole 931 and the inner diameter of the spindle mounting insulating sleeve 95. This invention does not impose any limitations on this.

[0057] Furthermore, such asFigure 6 As shown, the spindle fixing assembly 9 also includes a spindle positioning sleeve 94; the spindle positioning sleeve 94 is sleeved on the spindle body and is disposed between the flange 93 and the spindle mounting base 92, and is used to adjust the vertical installation degree of the spindle body.

[0058] In some embodiments, by further adding a spindle positioning sleeve 94 to the spindle fixing assembly 9 and placing the spindle positioning sleeve 94 between the flange 93 and the spindle mounting base 92, it can be ensured that the piezoelectric spindle 1 remains vertical throughout the machining process, thereby improving machining accuracy and the operational stability of the PCB processing equipment. Specifically, the outer edge of the spindle positioning sleeve 94 is provided with a positioning hole 941 corresponding to the threaded hole 921, and multiple expansion and contraction grooves are formed on its outer surface. Specifically, the spindle positioning sleeve 94 can be fitted onto the spindle body below the flange 93, and a screw 10 is used to pass through the countersunk hole 931, the positioning hole 941, and the threaded hole 921. Furthermore, the deformation of the spindle positioning sleeve 94 can be adjusted by adjusting the tightening degree of the screw 10, thereby adjusting the vertical mounting of the spindle body.

[0059] In another embodiment, such as Figure 7 and Figure 8 As shown, the spindle fixing assembly 9 includes a spindle clamp rear seat 96, a spindle clamp front cover 97, a spindle clamp rear seat rubber ring 98, a spindle clamp front cover rubber ring 99, and a spindle washer 910; one end of the first moving assembly 6 is detachably connected to one side of the spindle clamp rear seat 96; the spindle clamp rear seat rubber ring 98 is installed on the other side contact surface of the spindle clamp rear seat 96, and the spindle clamp front cover rubber ring 99 is installed on the corresponding contact surface of the spindle clamp front cover 97 and the spindle clamp rear seat 96; the lower end of the spindle body is fixedly installed between the spindle clamp rear seat rubber ring 98 and the spindle clamp front cover rubber ring 99; the spindle washer 910 is disposed between the upper end of the spindle body and the spindle clamp front cover 97 to ensure that the upper end of the spindle body is in close contact with the spindle clamp front cover 97.

[0060] In some embodiments, the spindle clamp rear seat 96 and the spindle clamp front cover 97 constitute the main support components of the spindle body, while the spindle clamp rear seat rubber ring 98 and the spindle clamp front cover rubber ring 99 are used for radial insulation protection of the spindle body, and the spindle washer 910 is used to ensure the axial positioning of the spindle body. As an example, one side of the spindle clamp rear seat 96 can be connected to one end of the first motion component 6 by a detachable connecting device (such as bolts or clamps). This method allows the spindle clamp rear seat 96 to be flexibly connected and disassembled with the first motion component 6, facilitating the installation, adjustment, and maintenance of the spindle body. The other side contact surface of the spindle clamp rear seat 96 is provided with a spindle clamp rear seat rubber ring 98. This spindle clamp rear seat rubber ring 98 can be semi-circular, with the diameter of its inner arc surface being smaller than the outer diameter of the lower end of the spindle body, to achieve an interference fit with the spindle body. The function of the spindle clamp rear seat rubber ring 98 is to provide radial positioning support for the spindle body, ensuring its stable position within the spindle clamp assembly and preventing radial displacement. The design of the spindle clamp front cover 97 forms a relative support relationship with the spindle clamp rear seat 96. The spindle clamp front cover rubber ring 99 is installed on the corresponding contact surfaces of the spindle clamp front cover 97 and the spindle clamp rear seat 96, and its design is similar to that of the spindle clamp rear seat rubber ring 98. In this way, through the cooperation between the spindle clamp rear seat 96 and the spindle clamp front cover 97, the lower end of the spindle body is fixedly installed between the spindle clamp rear seat rubber ring 98 and the spindle clamp front cover rubber ring 99, achieving precise radial positioning of the spindle body.

[0061] To ensure precise axial positioning of the spindle body, a spindle washer 910 is disposed between the upper end of the spindle body and the spindle clamp front cover 97. In some embodiments, because the diameter of the upper end of the spindle body is larger than that of the lower end, placing the spindle washer 910 between the upper end of the spindle body and the upper end face of the spindle clamp front cover 97 ensures a tight axial contact surface between them. This guarantees the axial positioning accuracy of the spindle body, avoids axial displacement during machining, and thus ensures the stability and machining accuracy of the piezoelectric spindle 1. It should be noted that the thickness of the spindle washer 910 can be adjusted according to actual installation requirements to ensure tight contact between the upper end of the spindle body and the upper end face of the spindle clamp front cover 97.

[0062] In one embodiment, the processing types of the PCB board 12 include drilling, routing, milling, or cutting. During the processing of the PCB board 12, common processing types include drilling, routing, milling, and cutting, depending on different requirements and design specifications. Specifically: Drilling is a process that creates holes in a PCB board.

[0063] In some embodiments, when the piezoelectric spindle 1 drills into the PCB board 12, the drill bit is driven to vibrate at a high frequency in a first direction (e.g., perpendicular to the surface of the PCB board 12) with a set amplitude and frequency. This vibration causes periodic contact and separation between the drill bit and the PCB board 12, effectively reducing cutting force, reducing cutting heat, and promoting timely chip removal.

[0064] During the drilling process, the piezoelectric spindle 1 not only ensures the accuracy of the drilling, namely the position, diameter, and depth of the hole, but also protects the integrity of the PCB board 12 and its surrounding circuit structure by reducing cutting stress and thermal effects. Furthermore, ultrasonic vibration helps remove burrs and residues generated during drilling, improving the quality of the drilling.

[0065] A roulette wheel is a processing method that removes excess material from a PCB board 12 to form a specific shape or structure.

[0066] In some embodiments, when the pneumatic-static-piezoelectric spindle 1 performs a milling operation on the PCB board 12, a special tool is driven to precisely remove excess material from the PCB board 12 along a preset trajectory by vibrating at a set amplitude and frequency. During this process, ultrasonic vibration not only significantly reduces cutting resistance and thermal impact, ensuring the accuracy and integrity of the machining area, but also promotes smooth chip removal, effectively preventing clogging and wear.

[0067] Milling is a surface treatment and precision machining method for PCB boards.

[0068] In some embodiments, when the pneumatic-static piezoelectric spindle 1 performs milling operations on the PCB board 12, the milling cutter is driven with a set amplitude and frequency to make the cutting process more precise and delicate, which reduces the damage to the PCB board 12 caused by cutting heat and mechanical stress, and ensures the smoothness and accuracy of the processed edges.

[0069] Cutting is a processing method for forming a PCB board 12 into the desired shape and structure.

[0070] In some embodiments, when the piezoelectric spindle 1 performs a cutting operation on the PCB board 12, the cutting tool is driven with a set amplitude and frequency, causing the tool to vibrate and impact the PCB board 12 at a high frequency, thereby achieving precise and efficient cutting. This cutting method not only reduces damage to the PCB board 12 and ensures the smoothness and flatness of the processed edges, but also greatly improves processing accuracy and production efficiency.

[0071] Furthermore, PCB board 12 includes high aspect ratio PCB boards or multilayer PCB boards. Specifically, a high aspect ratio PCB board refers to a PCB board with a relatively large thickness, for example, a PCB board with a thickness of 1.0mm to 10.0mm. A multilayer PCB board refers to a circuit board composed of multiple PCB boards stacked together, with each layer having an independent circuit pattern and connection structure, for example, a PCB board with 4 to 20 layers and a thickness of 1.5mm to 10.0mm. High-density interconnect (HDI) PCB boards refer to PCB boards with a high wiring density.

[0072] The second aspect provides a PCB processing method applicable to the PCB processing equipment described in the first aspect embodiment, such as... Figure 9 and Figure 10 As shown, the PCB processing equipment includes a pneumatic-static-electric spindle 1, a control system 100, an air supply and pressure processing system 200, an air pressure control system 300, and a detection system 400. The PCB processing method of this PCB processing equipment includes: S10. Obtain the processing parameters of PCB board 12; In this embodiment, the processing parameters of PCB board 12 include PCB board parameters and processing type parameters. Specifically, the PCB board parameters include PCB board type and PCB board inherent parameters. Among them, the PCB board type includes high aspect ratio PCB board, multilayer PCB board or high density interconnect (HDI) PCB board, and the PCB board inherent parameters include high aspect ratio PCB board parameters, multilayer PCB board parameters or high density interconnect PCB board parameters.

[0073] As an example, high aspect ratio PCB board parameters include: Thickness: For example, 1.0mm to 10.0mm; Aperture: for example, 0.2mm to 1.0mm; Aspect ratio: for example, 5:1 to 10:1 or higher; Material type: For example, FR-4 material.

[0074] Parameters for multilayer PCBs include: Number of floors: For example, 4 to 20 floors or more; Total thickness: for example, 1.5mm to 10.0mm; Material type: For example, FR-4 material.

[0075] High-density interconnect PCB board parameters include: Thickness: for example, 0.5mm to 3.0mm; Aperture: for example, 0.1mm to 0.3mm; Line width and spacing: for example, 50µm to 150µm.

[0076] Material type: For example, low dielectric constant materials.

[0077] Machining type parameters include drilling parameters, milling parameters, milling parameters, or cutting parameters.

[0078] Specifically, drilling parameters include: drilling depth, spindle speed, and feed rate.

[0079] The parameters of the router include: cutting width, router cutter diameter, cutting speed, router cutter speed, and feed rate.

[0080] Milling parameters include: depth of cut, cutter diameter, spindle speed, and feed rate.

[0081] Cutting parameters include: cutting depth, cutting speed, and cutting accuracy.

[0082] S20. Determine the target vibration parameters corresponding to the processed PCB board 12 based on the processing parameters; In this embodiment, the target vibration parameters include amplitude and frequency. Specifically, the amplitude ranges from 1µm to 20µm, and the frequency ranges from 2kHz to 40kHz. Preferably, the amplitude can be configured as 5µm, 10µm, 15µm, or 18µm, and the frequency can be configured as 5kHz, 10kHz, 20kHz, 30kHz, or 35kHz; no specific limitation is imposed. The amplitude and frequency suitable for the PCB board 12 are determined based on its processing parameters to optimize the processing effect and ensure processing quality. Specifically, the corresponding amplitude and frequency can be preset according to the processing parameters of the PCB board 12. Furthermore, the corresponding amplitude and frequency can be automatically retrieved by inputting the processing parameters of the PCB board 12. Other methods can also be used to determine the amplitude and frequency; no limitation is imposed here.

[0083] As an example, a database of processing parameters for the PCB board 12 can be pre-established. This database covers the processing parameters of the PCB board 12, the corresponding amplitude and frequency of the PCB board 12, and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. This parameter prediction model is used to predict the amplitude and frequency corresponding to the processing parameters of the PCB board 12.

[0084] Specifically, when the user inputs the processing parameters of the PCB board 12, the control system 100 immediately initiates an automatic query and matching mechanism to quickly filter out similar or related cases from the historical database based on the input processing parameters of the PCB board 12. Then, using a parameter prediction model, the amplitude and frequency settings in these cases are intelligently analyzed, taking into account multiple dimensions such as processing accuracy, processing quality, and tool wear, and finally recommending the optimal amplitude and frequency.

[0085] For example, a user needs to process a batch of PCBs with a thickness of 1.6 mm, a hole diameter of 0.3 mm, and a material type of FR-4. After inputting these parameters, the control system 100 determines the corresponding amplitude and frequency through a pre-trained parameter prediction model; for example, the amplitude is set to 2.5 µm and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0086] As another example, a table relating the processing parameters of the PCB board 12 to amplitude and frequency can be pre-established. When the user inputs the processing parameters of the PCB board 12, the control system 100 determines the corresponding amplitude and frequency of the PCB board 12 by querying the pre-established table. For example, a 1.0mm thick high aspect ratio PCB board corresponds to a frequency of 30kHz and an amplitude of 1.5µm. A 2.0mm thick high aspect ratio PCB board corresponds to a frequency of 28kHz and an amplitude of 2µm. It should be noted that the above is only an example, and the processing parameters of the PCB board 12, and the corresponding amplitude and frequency, can be pre-set according to actual conditions, and are not limited here.

[0087] S30. According to the target vibration parameters, control the pneumatic-static-piezoelectric spindle 1 to drive the high-speed rotating machining tool 11 to vibrate in the first direction, so that the machining tool 11 and the PCB board 12 form periodic contact and separation, so as to realize the machining of the PCB board 12.

[0088] In this embodiment, after obtaining the corresponding amplitude and ultrasonic parameters, the pneumatic-static piezoelectric spindle 1 is controlled to drive the machining tool 11 to vibrate in the first direction with a set amplitude and frequency, so that the machining tool 11 and the PCB board 12 form periodic contact and separation, thereby realizing the machining of the PCB board 12. Through the periodic contact and separation machining method, not only is the machining accuracy improved, but also the material loss and heat impact are reduced, providing strong technical support for the fine machining of the PCB board 12.

[0089] For example, the following verification is performed using a 5.4mm high aspect ratio PCB with a 0.2mm through-hole drilled: Table 1 As shown in Table 1, regarding drilling accuracy, the experiment compared traditional drilling and ultrasonic drilling under the same rotational speed, feed rate, and drilling method. The results showed that traditional drilling resulted in drill bit breakage during processing, making it impossible to complete 400 holes, and its accuracy was low. Ultrasonic drilling, on the other hand, successfully completed 400 holes with an accuracy of CPK=1.895 (≥1.33), far exceeding the standard value. Furthermore, by adjusting the amplitude, the experiment revealed that increasing the amplitude significantly improved drilling accuracy, but also accompanied by a certain degree of decrease in drill bit life. Specifically, when the amplitude increased from 1µm to 2µm, the accuracy CPK increased from 1.539 to 1.895, and the drill bit life also increased slightly. However, when the amplitude continued to increase to 3µm, although the accuracy further improved to 1.995, the drill bit life decreased. Therefore, determining the amplitude and frequency corresponding to PCB board 12 ensured the optimal drilling state. Finally, regarding temperature control, the experiment used an infrared thermal imager to monitor the temperature of the PCB board 12 during the drilling process of conventional drilling and ultrasonic drilling. Under the same parameters, ultrasonic drilling technology can reduce the temperature of the PCB board 12 by about 20%, reduce friction and wear between the drill bit and the drilled PCB board 12, extend the service life of the drill bit, improve drilling speed and efficiency, and ensure the accuracy and shape of the drilled hole.

[0090] In summary, by acquiring the processing parameters of the PCB board 12, determining the corresponding amplitude and frequency based on the processing parameters, and using the determined amplitude and frequency to control the pneumatic-static-piezoelectric spindle 1 to drive the processing tool 11, a periodic contact and separation is formed between the tool and the PCB board 12, thereby achieving precise processing and ensuring that the processing tool 11 can work under optimal vibration conditions, effectively improving processing efficiency and processing quality.

[0091] In one embodiment, such as Figure 11 As shown, the pneumatic piezoelectric spindle 1 includes a pneumatic ultrasonic spindle. In step S30, that is, according to the amplitude and frequency corresponding to the PCB board 12, the pneumatic piezoelectric spindle 1 drives the machining tool 11 to vibrate in the first direction, including the following steps: S31. Output the corresponding current signal according to the target vibration parameters; S32. Convert the current signal into a gas signal, and control the input air pressure of the pneumatic ultrasonic electric spindle according to the gas signal, so that the pneumatic ultrasonic electric spindle drives the high-speed rotating machining tool 11 to vibrate in the first direction according to the input air pressure.

[0092] In this embodiment, after determining the amplitude and frequency, the further control system 100 outputs a corresponding current signal and sends it to the pneumatic control system 300. Based on the received current signal, the pneumatic control system 300 controls a dedicated signal conversion device to convert the current signal into a pneumatic signal. For example, firstly, the current signal is converted into a pneumatic signal via an electro-pneumatic converter (e.g., an E / P converter) or a proportional solenoid valve. Then, the converted pneumatic signal is amplified by a pneumatic-pneumatic positioner to precisely control the opening of the pressure regulating valve, thereby precisely controlling the input air pressure of the pneumatic ultrasonic electric spindle. This achieves precise control of the amplitude and frequency of the pneumatic ultrasonic electric spindle, enabling the pneumatic ultrasonic electric spindle to drive the high-speed rotating machining tool 11 to vibrate in the first direction according to the input air pressure. One end of the pressure regulating valve is connected to the air inlet of the pneumatic ultrasonic electric spindle, and the other end is connected to the air source pressure processing system 200, so that the air pressure control system 300 can adjust the input air pressure from the air source pressure processing system 200 to the pneumatic ultrasonic electric spindle by controlling the opening of the pressure regulating valve.

[0093] It should be noted that the air supply pressure treatment system 200 may include an air dryer, a main pipeline filter, an oil mist separator, and an air tank. The air dryer removes most of the moisture from the compressed air; the main pipeline filter filters impurities from the air; the oil mist separator removes oil mist particles from the air; the air tank stabilizes the air pressure and reduces airflow fluctuations; and the ultra-fine oil mist separator deeply purifies the air, ensuring extremely dry and pure input air pressure. Furthermore, one end of the air dryer is connected to the air source, and the other end is connected to one end of the main pipeline filter, the other end of the main pipeline filter is connected to one end of the oil mist separator, the other end of the oil mist separator is connected to one end of the air tank, and the other end of the air tank is connected to one end of the pressure regulating valve. By setting up the air supply pressure treatment system 200, the high-pressure air input to the pneumatic ultrasonic electric spindle is dry and pure compressed air, ensuring the stable performance and reliable operation of the pneumatic ultrasonic electric spindle.

[0094] For example, when machining a PCB board with a thickness of 2.5mm and a high aspect ratio, the determined frequency is 25kHz and the amplitude is 2µm. Next, the control system 100 calculates the corresponding current signal, assuming it is 100mA, and converts this current signal into a pneumatic signal via an E / P converter. This signal is then further converted into a precise input air pressure, for example, 0.5MPa, by an air-to-air positioner. This precisely controls the opening of the pressure regulating valve, introducing compressed air into the spindle body, where it contacts an air-bearing vibrating plate fixed to the rotating shaft. The air-bearing vibrating plate drives the rotating shaft to vibrate in a first direction, which in turn drives the machining tool 11 to vibrate in the first direction. This precisely controls the vibration of the machining tool 11, effectively reducing stress accumulation and interlayer separation during machining, improving machining efficiency, and reducing defect rates and material waste. It should be noted that the working air pressure of the pneumatic ultrasonic vibration spindle is 0.55MPa to 0.65MPa, and the minimum working air pressure without ultrasound is 0.45MPa to 0.55MPa. The above embodiments, by controlling the input pressure within the range of 0.45MPa to 0.55MPa, solve the problem of continuous noise generated during or before processing, improve the comfort of the working environment, reduce the impact on the health of operators, effectively extend the service life of the pneumatic ultrasonic electric spindle, and improve the overall performance of PCB processing equipment.

[0095] In one embodiment, such as Figure 12 As shown, the piezoelectric spindle 1 includes a piezoelectric ultrasonic spindle. After step S30, that is, after controlling the piezoelectric spindle 1 to drive the high-speed rotating machining tool 11 to vibrate in the first direction according to the target vibration parameters, the following steps are included: S40. Obtain the actual vibration parameters of the pneumatic-static ultrasonic electric spindle. S50. Compare the actual vibration parameters with the target vibration parameters to obtain the comparison results; S60. If the comparison result is a match, then begin processing of PCB board 12. S70. If the comparison result is a mismatch, adjust the input air pressure of the pneumatic ultrasonic electric spindle until the actual vibration parameters match the target vibration parameters.

[0096] In this embodiment, to ensure that the pneumatic ultrasonic electric spindle achieves the expected ultrasonic parameters when driving the high-speed rotating machining tool 11 for efficient and precise machining, the control system 100 acquires the actual vibration parameters of the pneumatic ultrasonic electric spindle detected in real time by the detection system. These parameters include key data such as amplitude and frequency. The detection system may include high-precision sensors or detection devices. Specifically, high-precision sensors or detection devices can be installed inside the pneumatic ultrasonic electric spindle or at other locations to accurately measure the vibration of the pneumatic ultrasonic electric spindle and send the measured ultrasonic data to the control system 100.

[0097] Next, the control system 100 compares the acquired actual vibration parameters with the preset target vibration parameters and obtains the comparison result. If the actual vibration parameters match the target vibration parameters perfectly, the control system 100 will confirm that the ultrasonic vibration conditions have been met and allow the processing of the PCB board 12 to begin. In this case, the pneumatic ultrasonic electric spindle drives the processing tool 11 to work at the set frequency and amplitude, ensuring high quality and high efficiency in the processing.

[0098] If the comparison results show a difference between the actual vibration parameters and the target vibration parameters, the control system 100 will automatically make adjustments. For example, it will adjust the input air pressure of the pneumatic ultrasonic electric spindle to change its vibration characteristics until the actual vibration parameters match the target vibration parameters. This adjustment process may require multiple iterations. After each adjustment, the system will re-monitor the actual vibration parameters to ensure that the vibration state of the pneumatic ultrasonic electric spindle meets the requirements. Through this process, the pneumatic ultrasonic electric spindle maintains optimal vibration during processing, improving the processing quality and consistency of the PCB board 12. It should be noted that the above is merely an example and does not constitute a limitation of this application.

[0099] In one embodiment, such as Figure 13 As shown, in step S70, if the comparison result is a mismatch, the input air pressure of the pneumatic ultrasonic electric spindle is adjusted until the actual vibration parameters match the target vibration parameters. This includes the following steps: S71, Obtain the input air pressure; S72. Determine if the input air pressure exceeds the preset range; S73. If the input air pressure exceeds the preset range, an alarm will be triggered and / or the pneumatic ultrasonic electric spindle will be stopped. S74. If the input air pressure does not exceed the preset range, adjust the input air pressure until the actual vibration parameters match the target vibration parameters.

[0100] In this embodiment, to ensure that the pneumatic ultrasonic electric spindle achieves the expected vibration effect, if the actual vibration parameters do not match the target vibration parameters, the current input air pressure value will be obtained. This step can be achieved through a built-in air pressure sensor, ensuring that the control system 100 can monitor air pressure changes in real time. Next, it is determined whether the current input air pressure exceeds a preset range. The preset range is a safety range set based on equipment specifications and operating requirements, used to ensure that the pneumatic ultrasonic electric spindle operates under normal air pressure, for example, 0.2MPa to 0.8MPa. Preferably, the input air pressure range can be configured to 0.4MPa to 0.6MPa, but the specific range is not limited.

[0101] If the input air pressure exceeds the preset range, an alarm will be triggered immediately. This alarm can be an audible or visual warning, alerting the operator to abnormal air pressure and / or stopping the pneumatic ultrasonic spindle to prevent damage to the PCB processing equipment or a decrease in processing accuracy due to abnormal air pressure. If the input air pressure is within the preset range, the air pressure will continue to be adjusted until the actual vibration parameters match the target vibration parameters, ensuring that the pneumatic ultrasonic spindle operates under optimal conditions, thereby achieving high-precision processing results.

[0102] For example, the target vibration parameters are an amplitude of 3µm and a frequency of 25kHz. The initially measured actual vibration parameters are an amplitude of 2µm and a frequency of 22kHz. Comparing the actual vibration parameters with the target parameters reveals that the amplitude is lower than the target value, while the frequency is higher. At this point, the control system 100 acquires the current input air pressure, assuming it is measured to be 0.5MPa. Next, it determines whether this air pressure is within the preset safety range. Since 0.5MPa is within this range, no alarm will be triggered or operation will stop; instead, adjustments will continue.

[0103] The input air pressure is then adjusted. This is done by increasing the air pressure, for example, adjusting it to 0.6 MPa. During the adjustment process, the control system 100 continuously monitors the actual vibration parameters to verify the adjustment effect. If the actual vibration parameters after adjustment are an amplitude of 3 µm and a frequency of 25 kHz, these parameters match the target vibration parameters, confirming that the new actual vibration parameters have met the target standard, indicating successful adjustment. After confirming the match, the PCB board 12 processing is initiated. During processing, the control system 100 continues to monitor the actual vibration parameters to ensure they remain within the set range, guaranteeing processing quality and equipment stability. This process not only improves processing quality and efficiency but also optimizes the operational stability of the PCB processing equipment, making it suitable for various applications with stringent ultrasonic processing requirements. It should be noted that the above is merely an example and does not constitute a limitation.

[0104] The third aspect provides a PCB processing system, which includes at least one PCB processing device as described in the first aspect embodiment.

[0105] It should be noted that the PCB processing equipment provided in the first aspect embodiment of the present invention can also be configured as a PCB processing equipment with two pneumatic piezoelectric spindles 1 or six pneumatic piezoelectric spindles 1. Here, the present invention does not limit it.

[0106] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A PCB processing apparatus characterized by comprising: The gas static pressure electric spindle comprises a spindle body, a gas path structure, a gas floating vibration plate, and a rotating shaft core arranged in the spindle body. The gas static pressure electric spindle is used for driving a high-speed rotating machining tool to vibrate in a first direction with a set amplitude and frequency during machining, so that the machining tool and a PCB board form periodic contact and separation, thereby realizing machining of the PCB board.

2. The PCB processing apparatus according to claim 1, wherein The gas static pressure electric spindle comprises a gas static pressure ultrasonic electric spindle.

3. The PCB processing apparatus according to claim 1, wherein The gas static pressure ultrasonic electric spindle comprises a spindle body, a gas path structure, a gas floating vibration plate, and a rotating shaft core arranged in the spindle body. The gas floating vibration plate is connected to the rotating shaft core. The gas path structure is arranged at the front end or inside of the spindle body, and is used for guiding gas flow to act on both sides of the gas floating vibration plate, so as to drive the gas floating vibration plate to drive the rotating shaft core to vibrate in the first direction, and then drive the machining tool to vibrate in the first direction.

4. The PCB processing apparatus according to claim 1, wherein The PCB machining equipment further comprises a gantry system, a bed body, a workbench, a first movement assembly, a second movement assembly, a third movement assembly, and a spindle fixing assembly. The gas static pressure ultrasonic electric spindle is connected to one side of the spindle fixing assembly, the other side of the spindle fixing assembly is connected to one end of the first movement assembly, the other end of the first movement assembly is connected to one end of the second movement assembly, and the other end of the second movement assembly is connected to the gantry system. One end of the third movement assembly is connected to the bed body, and the other end is detachably connected to the workbench. The first movement assembly can drive the spindle fixing assembly to move in the first direction, so that the spindle fixing assembly drives the gas static pressure ultrasonic electric spindle to move in the first direction. The second movement assembly can drive the first movement assembly to move in a second direction, so as to drive the gas static pressure ultrasonic electric spindle to move in the second direction. The third movement assembly can drive the workbench to move in a third direction, so that the workbench moves in or out of the channel. The first direction, the second direction, and the third direction are perpendicular to each other. The spindle fixing assembly comprises a spindle mounting plate, a spindle mounting seat, and a flange plate.

5. The PCB processing apparatus according to claim 4, wherein The flange plate is fixedly sleeved on the spindle body. One end of the first movement assembly is detachably connected to one side of the spindle mounting plate. The other side of the spindle mounting plate is fixedly connected to the spindle mounting seat. The lower end of the spindle body passes through the through hole of the spindle mounting seat, and the flange plate and the spindle mounting seat are fixedly connected to each other. The spindle fixing assembly further comprises a spindle positioning sleeve. The spindle positioning sleeve is sleeved on the spindle body and arranged between the flange plate and the spindle mounting seat, and is used for adjusting the vertical installation degree of the spindle body.

6. The PCB processing apparatus according to claim 5, wherein ​ ​ 7. The PCB processing apparatus according to claim 4, wherein The main shaft fixing assembly comprises a main shaft clamp rear seat, a main shaft clamp front cover, a main shaft clamp rear seat rubber ring, a main shaft clamp front cover rubber ring and a main shaft washer; One end of the first movement assembly is detachably connected to one side of the main shaft clamp rear seat; The main shaft clamp rear seat rubber ring is installed on the other side contact surface of the main shaft clamp rear seat, and the main shaft clamp front cover rubber ring is installed on one side contact surface of the main shaft clamp front cover and corresponds to the other side contact surface of the main shaft clamp rear seat; The lower end of the main shaft body is fixedly installed between the main shaft clamp rear seat rubber ring and the main shaft clamp front cover rubber ring; The main shaft washer is arranged between the upper end of the main shaft body and the main shaft clamp front cover.

8. The PCB processing apparatus according to any one of claims 1 to 6, characterized by, The processing type of the PCB board includes drilling, milling, milling or cutting, and / or the PCB board includes a high thickness-diameter ratio PCB board, a multi-layer PCB board or a high-density interconnection PCB board.

9. A method of processing a PCB, characterized by, The method is applied to the PCB processing equipment of any one of claims 1-8, and the method comprises: obtaining processing parameters of a PCB board; determining target vibration parameters corresponding to processing the PCB board according to the processing parameters; controlling the gas static pressure electric spindle to drive the high-speed rotating processing tool to vibrate in a first direction according to the target vibration parameters, so that the processing tool and the PCB board form periodic contact and separation, thereby achieving processing of the PCB board.

10. The PCB processing method of claim 9, wherein, The gas static pressure electric spindle comprises a gas static pressure ultrasonic electric spindle; and the controlling the gas static pressure electric spindle to drive the high-speed rotating processing tool to vibrate in a first direction according to the target vibration parameters comprises: outputting corresponding current signals according to the target vibration parameters; converting the current signals into gas signals, and controlling input gas pressure of the gas static pressure ultrasonic electric spindle according to the gas signals, so that the gas static pressure ultrasonic electric spindle drives the high-speed rotating processing tool to vibrate in the first direction according to the input gas pressure.

11. The PCB processing method of claim 9, wherein, The gas static pressure electric spindle comprises a gas static pressure ultrasonic electric spindle; and after the controlling the gas static pressure electric spindle to drive the high-speed rotating processing tool to vibrate in a first direction according to the target vibration parameters, the method further comprises: obtaining actual vibration parameters of the gas static pressure ultrasonic electric spindle; comparing the actual vibration parameters with the target vibration parameters to obtain a comparison result; if the comparison result is matched, starting processing of the PCB board; if the comparison result is not matched, adjusting the input gas pressure of the gas static pressure ultrasonic electric spindle until the actual vibration parameters match the target vibration parameters.

12. The PCB processing method of claim 11, wherein, If the comparison result is not matched, the adjusting the input gas pressure of the gas static pressure ultrasonic electric spindle until the actual vibration parameters match the target vibration parameters comprises: obtaining the input gas pressure; determining whether the input gas pressure exceeds a preset range; if the input gas pressure exceeds the preset range, triggering an alarm and / or controlling the gas static pressure ultrasonic electric spindle to stop working; if the input gas pressure does not exceed the preset range, adjusting the input gas pressure until the actual vibration parameters match the target vibration parameters.

13. The PCB processing method of claim 10, wherein, The input gas pressure range is 0.2 MPa to 0.8 MPa.

14. The PCB processing method of claim 9, wherein, The target vibration parameters include amplitude and frequency, the amplitude ranges from 1 µm to 20 µm, and the frequency ranges from 2 KHz to 40 KHz.

15. The PCB processing method of claim 9, wherein, The processing parameters at least include any one or more of the following parameters: PCB board parameters, the PCB board parameters including PCB board type and PCB board inherent parameters; Processing type parameters, the processing type parameters including drilling parameters, milling parameters, milling parameters or cutting parameters.

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