Preparation method of RFID antenna

Abstract

The invention discloses a preparation method of an RFID (Radio Frequency Identification) antenna, which comprises the following steps: S1, gluing: coating an adhesive on a base material according to a preset RFID antenna pattern, and setting one or more marker sites in an edge area of the RFID antenna pattern; s2, conducting layer compounding: integrally compounding a conducting foil to the surface of the base material treated in the step S1, and enabling the conducting foil to be adhered to the region of the RFID antenna pattern through an adhesive; s3, compounding and removing a positioning layer: integrally compounding the positioning film to the area where the marking site is located, and tearing off the positioning film which is not bonded with the marking site; and S4, cutting: cutting along the contour of the RFID antenna pattern according to the positioning information provided by the mark site, and separating out an independent RFID antenna. According to the method, the mark sites are integrally arranged in the gluing step, the traditional independent process of additionally printing the optical Mark points is avoided, so that the production steps are reduced, the positioning precision and the production efficiency are improved, and the method has the advantages that the manufacturing cost is reduced, and the positioning precision and the production efficiency are improved.

Description

Technical Field

[0001] This application relates to the field of RFID tag manufacturing technology, and more specifically, to a method for preparing an RFID antenna. Background Technology

[0002] As a core functional component of RFID tags, the precision and efficiency of the manufacturing process of RFID antennas directly impact the tag's communication performance. In traditional production processes, to ensure accurate identification of the antenna unit's cutting boundary during the die-cutting process, an additional optical mark point printing operation must be performed on the substrate surface. This separate printing step not only introduces redundant production steps, significantly increasing equipment purchase costs and energy consumption, but also presents multiple technical challenges.

[0003] For example, the adhesion of ink during the printing process is easily affected by the ambient temperature and humidity, resulting in blurred, missing or burred Mark points; slight vibrations or uneven tension generated during continuous transport of the substrate can cause Mark point position shifts, which in turn leads to systematic deviations in subsequent cutting; such problems often occur frequently in mass production, causing a large number of antenna units to be scrapped due to positioning errors.

[0004] Furthermore, the curing time of the printing process limits the overall operating speed of the production line, making it difficult to meet the demands of modern high-speed manufacturing. There is a long-standing problem of how to eliminate additional printing steps while maintaining or even optimizing positioning accuracy, necessitating a solution that can integrate positioning marks into the basic process.

[0005] To address the aforementioned issues, existing technologies urgently need improvement. Summary of the Invention

[0006] The purpose of this application is to provide a method for preparing an RFID antenna, an RFID antenna, and an RFID tag, which has the advantages of reducing production steps, lowering manufacturing costs, and improving positioning accuracy and production efficiency.

[0007] The above-mentioned technical objective of the present invention is achieved through the following technical solution:

[0008] A method for manufacturing an RFID antenna includes the following steps:

[0009] S1. Applying adhesive: Applying adhesive to the substrate according to a preset RFID antenna pattern, and setting one or more marking points in the edge area of ​​the RFID antenna pattern;

[0010] S2. Conductive layer lamination: The conductive foil is integrally laminated onto the surface of the substrate treated in step S1, so that the conductive foil is bonded to the area of ​​the RFID antenna pattern by an adhesive.

[0011] S3. Positioning layer lamination and removal: The positioning film is laminated to the area where the marking site is located, and the positioning film that is not adhered to the marking site is removed;

[0012] S4. Cutting: Based on the positioning information provided by the marked point, cut along the outline of the RFID antenna pattern to separate the individual RFID antennas.

[0013] Furthermore, the specific method for step S1 is as follows:

[0014] Coated paper is selected as the substrate. Adhesive is applied to the substrate according to the preset RFID antenna pattern using a CNC gluing equipment. Adhesive dots or lines are applied to the outer area of ​​the RFID antenna pattern as marking points. The marking points are used as alignment references for subsequent steps.

[0015] Furthermore, the specific method for step S2 is as follows:

[0016] Aluminum foil is selected as the conductive foil. The conductive foil and the adhesive-coated substrate are simultaneously fed to the composite rollers. The conductive foil is then laminated onto the substrate surface by hot pressing or rolling. The aluminum foil is firmly bonded to the substrate only in the area coated with the RFID antenna pattern and marking points, forming the conductive part of the RFID antenna.

[0017] Furthermore, the specific method for step S3 is as follows:

[0018] The positioning film is a hot stamping film. During lamination, the hot stamping film roll is laminated to the surface of the conductive foil to ensure that all marking positions are covered. The hot stamping film has a release layer, and its adhesion to the conductive foil is weaker than its adhesion to the marking positions. After lamination, the hot stamping film that is not adhered to the marking positions is removed by a winding device, leaving only the high-contrast hot stamping film markings in the marking position area.

[0019] Furthermore, the specific method for step S4 is as follows:

[0020] The laser cutting machine's vision positioning system automatically identifies the hot stamping film markings retained on the substrate and drives the die-cutting blade according to a preset program to precisely cut along the outline of the RFID antenna pattern, separating the RFID antenna pattern from the substrate to obtain the finished RFID antenna.

[0021] An RFID antenna is prepared by the above-described method for preparing an RFID antenna.

[0022] An RFID tag comprising the aforementioned RFID antenna.

[0023] In summary, the present invention has the following beneficial effects:

[0024] By integrating the marking points into the adhesive coating step, the traditional separate process of printing optical mark points is avoided, thereby reducing production steps, lowering manufacturing costs, and improving positioning accuracy and production efficiency. It has the advantages of reducing production steps, lowering manufacturing costs, and improving positioning accuracy and production efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the method for preparing the RFID antenna according to the present invention.

[0026] Figure 2 This is a flowchart of the RFID antenna fabrication method described in this invention. Detailed Implementation

[0027] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below with reference to the figures and specific embodiments.

[0028] like Figure 1 and Figure 2 As shown, the present invention proposes a method for manufacturing an RFID antenna, which includes the following steps:

[0029] S1. Applying adhesive: Apply adhesive to the substrate 10 according to the preset RFID antenna pattern 12, and set one or more marking points 11 in the edge area of ​​the RFID antenna pattern 12;

[0030] S2. Conductive layer lamination: The conductive foil 20 is integrally laminated onto the surface of the substrate 10 treated in step S1, so that the conductive foil 20 is bonded to the area of ​​the RFID antenna pattern 12 by adhesive.

[0031] S3. Positioning layer bonding and removal: The positioning film 30 is bonded to the area where the marking site 11 is located, and the positioning film 30 that is not bonded to the marking site 11 is removed;

[0032] S4. Cutting: Based on the positioning information provided by the marker point 11, cut along the outline of the RFID antenna pattern 12 to separate the independent RFID antenna.

[0033] For ease of understanding, the following explains some key terms in this embodiment:

[0034] Substrate 10 refers to the material used to carry the RFID antenna pattern, such as paper, plastic film, composite materials, etc. Its selection usually takes into account cost, flexibility, durability, and compatibility with subsequent processes.

[0035] The RFID antenna pattern 12 refers to the conductive pattern formed on the substrate 10 for transmitting and receiving RFID signals. The geometry and size of this pattern are designed according to the operating frequency and application requirements of the RFID tag.

[0036] An adhesive is a substance used to fix the conductive foil 20 to the substrate 10. Its characteristics include adhesive strength, curing method, temperature resistance, and effect on conductivity.

[0037] Marker site 11 refers to a visual or physical marker placed in the edge area of ​​the RFID antenna pattern 12 for subsequent positioning and alignment. These markers can be dots, lines, or specific shapes, and their placement and number are designed to provide positioning information.

[0038] Conductive foil 20 refers to a thin sheet material with conductive properties, used to form the conductive part of the RFID antenna pattern 12. Common materials include metal foils, such as aluminum foil and copper foil.

[0039] The positioning film 30 is a thin film material that can selectively adhere to the marking site 11 and is easily removed from the non-adhesive area. Its function is to form a visual mark at the marking site 11 to facilitate identification by automated equipment.

[0040] This embodiment provides a method for manufacturing an RFID antenna, which simplifies the traditional process by simultaneously setting positioning marks during the adhesive coating process.

[0041] Specifically, in step S1, an adhesive application operation is performed. This step includes applying adhesive to the substrate 10 according to a preset RFID antenna pattern 12, and setting one or more marking points 11 in the edge area of ​​the RFID antenna pattern 12. The substrate 10 can be made of various materials, such as ordinary paper, PET film, or PVC sheet. The adhesive application can be achieved by methods such as screen printing, inkjet printing, or roll coating to form the RFID antenna pattern 12 on the surface of the substrate 10. The setting of the marking points 11 can be performed simultaneously with the adhesive application, for example, by integrating additional nozzles or molds into the adhesive application equipment to form adhesive dots or lines as markers at specific edge positions of the RFID antenna pattern 12. The shape of these marking points 11 can be circular, square, or cross-shaped, and their number and distribution can be adjusted according to the size and positioning requirements of the RFID antenna pattern 12.

[0042] Further, in step S2, a conductive layer lamination operation is performed. This step involves laminating the conductive foil 20 integrally onto the surface of the substrate 10 treated in step S1, such that the conductive foil 20 is adhered to the area of ​​the RFID antenna pattern 12 by an adhesive. The conductive foil 20 can be, for example, copper foil, aluminum foil, or a conductive polymer film. The lamination process can be carried out by feeding the conductive foil 20 and the adhesive-coated substrate 10 between a pair of pressure rollers, applying appropriate pressure to bond the two together. During this process, the conductive foil 20 is firmly adhered to the substrate 10 only in the adhesive-coated RFID antenna pattern 12 area, while remaining loose or unadhesive in other uncoated areas.

[0043] In step S3, the positioning layer lamination and removal operation is performed. This step includes laminating the positioning film 30 entirely onto the area where the marking site 11 is located, and peeling off the portion of the positioning film 30 that is not adhered to the marking site 11. The positioning film 30 can be a film with a release layer, such as a common plastic film or a paper-based film with a special coating. During lamination, the positioning film 30 is completely covered on the surface of the conductive foil 20, ensuring that all marking sites 11 are covered. The positioning film 30 has adhesive strength to the adhesive at the marking site 11, but insufficient adhesive strength to other areas of the conductive foil 20. After lamination, the portion of the positioning film 30 that is not adhered to the marking site 11 can be peeled off using a winding or peeling device, thus leaving only a residue of the positioning film 30 at the marking site 11, forming a positioning mark.

[0044] In step S4, a cutting operation is performed. This step involves cutting along the contour of the RFID antenna pattern 12 based on the positioning information provided by the marking point 11, separating the individual RFID antennas. The cutting equipment can be a mechanical die-cutting machine, a waterjet cutting machine, or a laser cutting machine. Before cutting, the marking point 11 retained on the substrate 10 is identified by the equipment's vision system or sensors to obtain its position information. Based on this positioning information, the cutting equipment can automatically adjust the cutting path to align it with the preset contour of the RFID antenna pattern 12, thereby achieving the separation of the RFID antenna pattern 12 and obtaining the finished RFID antenna.

[0045] This embodiment eliminates the need for a separate Mark point printing step in traditional processes by simultaneously setting the marking points during the adhesive coating process, thereby reducing production steps and equipment investment. Furthermore, since the marking points and antenna pattern are formed in the same adhesive coating process, it avoids alignment deviations and unclear Mark points that may occur with traditional printing, ensuring the accuracy of subsequent cutting and improving the efficiency and yield of RFID antenna manufacturing.

[0046] In some of the embodiments described above in this application, it is proposed to simultaneously set marking points in the adhesive coating step to eliminate the need for a separate printing step and achieve efficient positioning. However, in this process, if the substrate is not properly selected or the adhesive coating equipment is not precise enough, it may lead to uneven coating of the marking points, positional deviation, or poor adhesion, thereby affecting the positioning accuracy of subsequent lamination and cutting steps, and even causing batch defects.

[0047] In response, this application further proposes a specific method for step S1, aiming to optimize the adhesive coating process and ensure the accurate formation and reliability of the marking sites 11. Specifically, the method includes: selecting coated paper as the substrate 10, applying adhesive to the substrate 10 according to a preset RFID antenna pattern 12 using a CNC adhesive coating device, and coating adhesive dots or lines as marking sites 11 in the peripheral area of ​​the RFID antenna pattern 12. The marking sites 11 are used as alignment references for subsequent steps.

[0048] To ensure the effective implementation of the above solution, the key technical features involved are further elaborated. First, regarding the selection of the substrate 10, this application preferably uses coated paper as the substrate 10. Coated paper, with its high surface smoothness, good whiteness, and moderate ink absorption, can provide an ideal surface for the uniform coating of the adhesive and ensure good adhesion between the adhesive and the substrate 10, thereby effectively preventing the marking points 11 from falling off or deforming due to unevenness of the substrate. In addition to coated paper, in other embodiments, PET film with good dimensional stability, heat resistance, and surface smoothness, or PVC film with good flexibility and low cost can also be used as the substrate 10 to adapt to different application requirements and cost considerations.

[0049] In the adhesive application process, this application employs a CNC adhesive application device. Through a computer digital control system, the CNC adhesive application device can precisely control the adhesive application path, amount, and speed, thereby ensuring that the adhesive is applied to the substrate 10 with high precision and consistency according to the preset RFID antenna pattern 12. This automated and precise adhesive application method effectively avoids errors that may arise from manual operation or traditional mechanical adhesive application, ensuring the accurate formation of the RFID antenna pattern 12 and the marking points 11. Specifically, the CNC adhesive application device can be a spray-type CNC adhesive application device, which achieves non-contact, high-precision adhesive dot or line application by precisely controlling the opening and closing time and movement path of the nozzle; it can also be a scraper-type CNC adhesive application device, which achieves uniform adhesive application over large areas or specific regions by controlling the gap between the scraper and the substrate 10 and the scraping speed; or it can be a roller-type CNC adhesive application device, which achieves continuous and uniform adhesive application by precisely controlling the rotation speed and pressure of the adhesive roller.

[0050] Furthermore, this application applies an adhesive to the substrate 10 according to a preset RFID antenna pattern 12, and applies adhesive dots or lines as marking points 11 to the outer area of ​​the RFID antenna pattern 12. This design allows the formation of marking points 11 to be synchronized with the application of adhesive to the RFID antenna pattern 12, eliminating the need for a separate printing step and significantly simplifying the process. By precisely planning the adhesive application path and controlling the amount of adhesive using a CNC adhesive application device, it is ensured that the adhesive completely covers the area of ​​the RFID antenna pattern 12, forming clear marking points 11. The marking points 11 can be discrete circular or square adhesive dots, the size and spacing of which can be adjusted according to the recognition accuracy requirements of the subsequent vision system; they can also be continuous straight lines or curves, such as L-shaped lines, cross lines, or rectangular frames, to provide richer positioning information; or they can even be a combination of adhesive dots and lines, for example, applying adhesive dots at the four corners of the RFID antenna pattern 12 and short adhesive lines at the edges to provide multi-dimensional positioning references. Finally, the function of the marking points 11 is clarified, namely, their role as alignment references for subsequent steps. This means that in subsequent critical steps such as conductive layer lamination, positioning layer lamination and removal, and cutting, these precisely formed adhesive dots or lines will serve as stable reference points for the equipment to perform visual or mechanical alignment, ensuring the accurate execution of each step.

[0051] Through the above technical solution, this application effectively solves the accuracy and reliability problems that may occur during the marking point coating process. Coated paper is selected as the substrate 10, utilizing its smooth surface and good adhesion properties to ensure uniform adhesive adhesion and avoid marking point detachment or deformation caused by uneven substrate. The application of CNC gluing equipment, with its high-precision control capabilities, ensures that the adhesive is coated strictly according to the preset RFID antenna pattern 12 and marking points 11, eliminating coating deviations caused by human error or equipment error. Integrating the marking points 11 directly into the gluing step and coating them on the outer area of ​​the RFID antenna pattern 12 not only eliminates the traditional independent printing of Mark points, reducing production costs and energy consumption, but also ensures the relative positional consistency of the marking points 11 and the RFID antenna pattern 12 by utilizing the easy identification of the outer area, facilitating rapid capture by the subsequent vision system. These precisely formed marking points 11 serve as stable alignment references, significantly improving the positioning accuracy and process continuity of subsequent conductive layer lamination, positioning layer lamination and removal, and cutting steps, thereby effectively avoiding batch defects and improving the manufacturing efficiency and product yield of RFID antennas.

[0052] In some of the solutions described above in this application, step S1 is proposed to coat the adhesive and set the marking sites. However, in the subsequent process of bonding the conductive layer, if an inaccurate bonding method is used, the conductive foil may bond in areas where it should not be bonded, resulting in material waste, positioning deviation or affecting the subsequent cutting accuracy. Therefore, an efficient and accurate conductive layer bonding method is needed.

[0053] In this regard, this application further proposes a specific method for step S2, which includes: selecting aluminum foil as conductive foil 20, synchronously conveying the conductive foil 20 and the adhesive-coated substrate 10 to the composite rollers, and bonding the conductive foil 20 to the surface of the substrate 10 by hot pressing or rolling; wherein, the aluminum foil is firmly bonded to the substrate 10 only in the area coated with RFID antenna pattern 12 and marking point 11 to form the conductive part of RFID antenna.

[0054] Specifically, aluminum foil was chosen as the conductive foil 20 because of its excellent conductivity, lightweight, flexibility, and cost-effectiveness, making it an ideal material for RFID antenna manufacturing. Besides aluminum foil, other conductive materials can be selected based on specific application requirements and cost considerations, such as copper foil, silver paste printing layers, or conductive polymer films. These materials can also provide the required conductivity and bond well with adhesives.

[0055] The conductive foil 20 and the adhesive-coated substrate 10 are synchronously conveyed between the laminating rollers. Synchronous conveying means that the conductive foil 20 and the substrate 10 enter the laminating area at the same linear speed and with precise alignment. This synchronous control ensures that during the lamination process, the conductive foil 20 accurately covers the RFID antenna pattern 12 and marking points 11 areas pre-coated with adhesive on the substrate 10. In addition to the servo motor-driven synchronous conveying system, auxiliary calibration can be performed using a tension control system or a visual feedback system to further improve the conveying accuracy and ensure that both remain precisely aligned before entering the laminating rollers.

[0056] The conductive foil 20 is integrally laminated to the surface of the substrate 10 by hot pressing or rolling. Hot pressing or rolling is an effective means of achieving a strong bond between the conductive foil 20 and the substrate 10. Rolling uses mechanical pressure to bring the conductive foil 20 into close contact with the substrate 10, promoting the adhesive's function. Hot pressing, on the other hand, applies pressure while providing appropriate temperature to accelerate the curing or activation of the adhesive, thereby forming a stronger bond. In addition to hot pressing or rolling, ultrasonic lamination, vacuum-assisted lamination, or UV-cured lamination can also be used. These methods can also achieve effective lamination between the conductive foil 20 and the substrate 10, and the choice can be made based on the characteristics of the adhesive used.

[0057] In this process, the aluminum foil is firmly bonded to the substrate 10 only in the areas coated with the RFID antenna pattern 12 and the marking points 11, forming the conductive portion of the RFID antenna. This technical feature describes a key result of the lamination process: the highly selective bonding of the conductive foil 20. Because the adhesive is applied only to the areas of the RFID antenna pattern 12 and the marking points 11, the conductive foil 20 forms a strong physical or chemical bond with the substrate 10 only in these coated areas during the overall lamination process. In uncoated areas, there is no adhesive medium between the conductive foil 20 and the substrate 10, and therefore no strong bond occurs. This selective bonding ensures that the conductive foil 20 can precisely form the conductive portion of the RFID antenna, while avoiding material waste and unnecessary adhesion in non-functional areas, providing clear boundaries for subsequent cutting steps.

[0058] Through the above technical solution, this application provides an efficient and precise conductive layer composite method. Specifically, by selecting aluminum foil as the conductive foil 20, its excellent conductivity and processing characteristics provide a reliable material basis for the conductive part of the RFID antenna. The conductive foil 20 and the adhesive-coated substrate 10 are simultaneously transported, ensuring precise alignment before composite formation and preventing composite deviations caused by misalignment. Subsequently, uniform and controllable pressure is applied through hot pressing or rolling to ensure full contact and firm adhesion between the conductive foil 20 and the pre-coated adhesive on the substrate 10. Since the adhesive is only applied to the RFID antenna pattern 12 and marking point 11 areas, the conductive foil 20 can achieve selective adhesion during the overall composite process, that is, it only firmly bonds to the substrate 10 in these functional areas to form the conductive part of the RFID antenna. This precise composite method effectively solves the problem of conductive foil bonding in areas where it should not be bonded, significantly reduces material waste, eliminates positioning deviations caused by inaccurate composite formation, and thus ensures the accuracy and yield of subsequent cutting.

[0059] In some of the solutions described above in this application, positioning film lamination and removal are proposed to provide positioning information. However, in this process, problems such as inaccurate adhesion of the positioning film, incomplete removal, or unclear marking may occur, leading to insufficient cutting accuracy in the subsequent process. To address this, this application further proposes a specific method for step S3, including: the positioning film 30 is a hot stamping film; during lamination, the hot stamping film roll is laminated entirely onto the surface of the conductive foil 20, ensuring coverage of all marking points 11; the hot stamping film has a release layer, and its adhesion to the conductive foil 20 is weaker than its adhesion to the marking points 11; after lamination, the hot stamping film not adhered to the marking points 11 is removed using a winding device, leaving only the high-contrast hot stamping film markings in the marking point 11 area.

[0060] Specifically, the positioning film 30 is a hot stamping film. Hot stamping film is a multi-layered film, typically comprising a substrate layer, a release layer, a coloring layer (or a metal layer), and an adhesive layer. Its characteristic is that it can selectively transfer the coloring or metal layer to a specific surface through hot pressing or rolling, thereby forming a pattern with metallic luster or high contrast. As a carrier for the positioning mark, the hot stamping film provides a high-contrast visual effect, greatly facilitating the identification of the marking point 11 in subsequent steps.

[0061] During the lamination process, the entire roll of hot stamping film is laminated onto the surface of the conductive foil 20, ensuring that all marking points 11 are covered. This operation aims to ensure full contact between the hot stamping film and the conductive foil 20, thereby ensuring that all pre-set marking points 11 are effectively covered and bonded by the hot stamping film. For example, the entire roll of hot stamping film and the conductive foil 20 can be fed into the lamination equipment simultaneously through continuous rolling, and lamination can be performed under preset pressure and temperature conditions; alternatively, an intermittent or step lamination equipment can be used, where pre-cut hot stamping film sheets are precisely aligned and then laminated onto the surface of the conductive foil 20 through a pressing mechanism.

[0062] The hot stamping film has a release layer, and its adhesion to the conductive foil 20 is weaker than its adhesion to the marking site 11. The release layer is a key component of the hot stamping film structure, and its function is to allow the colored or metallic layer of the hot stamping film to be smoothly peeled off from its substrate during the transfer process. By carefully designing the characteristics of the hot stamping film's release layer, its adhesion to the conductive foil 20 is made significantly lower than its adhesion to the marking site 11 (i.e., the adhesive), thereby utilizing this difference in adhesion to achieve selective peeling of the hot stamping film. For example, the release layer formulation of the hot stamping film can be adjusted to make it mismatched with the surface characteristics of the conductive foil 20, resulting in weaker adhesion; at the same time, it can be ensured that it has a strong affinity with the adhesive at the marking site 11.

[0063] After lamination, the hot stamping film that is not bonded to the marking point 11 is peeled off using a winding device, leaving only the high-contrast hot stamping film markings in the marking point 11 area. This step aims to efficiently and automatically remove excess hot stamping film, leaving only clear, high-contrast positioning marks. For example, a tension-controlled winding roller can be used to peel and wind up the unbonded hot stamping film from the surface of the conductive foil 20 with constant or adjustable tension after lamination; alternatively, a pneumatic or vacuum-assisted peeling device can be used to assist peeling with airflow or suction while winding, ensuring thorough and smooth peeling.

[0064] Through the above technical solution, hot stamping film is used as the positioning film 30. Utilizing its inherent high-contrast characteristics, clear and easily identifiable visual marks are formed in the marking point 11 area, effectively avoiding the problem of blurred markings in traditional methods. Simultaneously, by integrally laminating the hot stamping film roll to the surface of the conductive foil 20, all marking points 11 are covered, ensuring the comprehensiveness and accuracy of the positioning marks. Furthermore, by utilizing the difference in adhesive strength between the hot stamping film release layer and the conductive foil 20 and marking points 11, only firmly adhered marking point 11 areas are retained during the tearing process, solving the problem of incomplete or accidental removal of excess material. Finally, the unadhesive hot stamping film is automatically torn off by a winding device, improving production efficiency and consistency. Furthermore, a high-contrast, high-precision hot stamping film mark is formed in the marking point 11 area, providing a reliable positioning reference for subsequent cutting steps, thereby ensuring the precise cutting and separation of the RFID antenna pattern 12.

[0065] In some of the embodiments described above in this application, it is proposed to retain hot stamping film marks in the marking site area to provide a high-contrast positioning reference. However, in the process of its implementation, how to ensure that the cutting process can automatically and accurately use these marks for efficient separation, and avoid the problems of cutting deviation, defective products and low efficiency caused by inaccurate positioning in traditional processes, is a problem that needs to be solved.

[0066] In this regard, this application further proposes a specific method for step S4, which includes: automatically identifying the hot stamping film mark retained on the substrate 10 through the vision positioning system of the laser cutting machine, and driving the die-cutting blade according to the preset program to accurately cut along the outline of the RFID antenna pattern 12, separating the RFID antenna pattern 12 from the substrate 10 to obtain the finished RFID antenna.

[0067] Specifically, the vision positioning system of the laser cutting machine is an automated system that combines optical imaging, image processing, and pattern recognition technologies. Its core function is to provide high-precision position information as a reference for subsequent cutting operations. This system can employ an industrial vision system equipped with a high-resolution CCD (charge-coupled device) camera or a CMOS (complementary metal-oxide-semiconductor) camera to capture images of the substrate 10 surface and transmit them to an image processing unit for analysis. Alternatively, it can integrate a 3D vision system based on structured light or laser scanning to obtain more accurate depth and contour information, further improving the robustness of positioning.

[0068] This visual positioning system can automatically identify the hot stamping foil marks retained on the substrate 10. This step aims to accurately detect and locate the pre-formed hot stamping foil marks on the substrate 10, which serve as alignment references for cutting. The visual positioning system can automatically identify the geometry and position of the hot stamping foil marks using image processing algorithms such as edge detection, template matching, or feature point extraction. Due to the high contrast characteristics of the hot stamping foil marks, these algorithms can efficiently and accurately distinguish the marks from the background. Another approach is to employ a deep learning-based image recognition model. By pre-training a large amount of marked image data, the system can intelligently identify hot stamping foil marks under various lighting conditions or with slight deformation, further improving the accuracy and adaptability of the recognition.

[0069] After identifying and locating the mark, the system drives the die-cutting blade according to a preset program. This step ensures the automation and precise control of the cutting process, guiding the die-cutting blade to operate along a predetermined path and parameters through preset program instructions. The preset program is typically generated by CAD (Computer-Aided Design) software and contains precise geometric data of the RFID antenna pattern 12 and the cutting path. This program is transmitted to the die-cutting equipment via a numerical control (NC) system or a PLC (Programmable Logic Controller) to control the movement axes (such as X, Y, and Z axes) and cutting depth of the die-cutting blade. Alternatively, the program can integrate real-time path planning and error compensation functions, dynamically adjusting the cutting path based on the actual mark position fed back by the vision positioning system to correct any minor deviations and ensure cutting accuracy.

[0070] The die-cutting blade precisely cuts along the contour of the RFID antenna pattern 12. This step is crucial for separating the RFID antenna pattern 12 from the substrate 10, ensuring that the cutting line closely matches the edge of the antenna pattern to obtain a finished antenna with precise shape and consistent dimensions. Under the precise control of the CNC system, the die-cutting blade moves along the digital contour path of the RFID antenna pattern 12, identified and calibrated by the vision system, cutting the antenna pattern off the substrate 10 through mechanical pressure. Cutting parameters (such as pressure and speed) are optimized based on the material properties of the substrate 10 and the conductive foil 20. Alternatively, a high-precision mold can be used in conjunction with the die-cutting blade. The shape of the mold precisely matches the contour of the RFID antenna pattern 12, and the upper and lower molds work together to achieve a one-time punching, ensuring the accuracy and consistency of the cut.

[0071] Finally, the RFID antenna pattern 12 is separated from the substrate 10 to obtain the finished RFID antenna. This step aims to peel the cut RFID antenna pattern 12 from the remaining substrate 10 for subsequent collection, testing, or packaging. Separation can be performed using a robotic arm or suction cup device, which, guided by a preset program or vision system, precisely grasps or adsorbs the cut RFID antenna pattern 12 and transfers it to a designated location. Alternatively, a waste stripping mechanism can be used to peel off the waste substrate 10 after cutting, using differential winding or airflow blowing, leaving the RFID antenna pattern 12 on another carrier or directly falling into a collection container.

[0072] Through the above technical solution, the visual positioning system of the laser cutting machine automatically identifies the hot stamping film markings retained on the substrate 10, solving the identification error problem that may occur in traditional cutting relying on manual or mechanical alignment. Utilizing the characteristics of high-contrast markings, rapid and accurate visual positioning is achieved, providing a reliable benchmark for subsequent cutting. Driving the die-cutting blade according to a preset program ensures automated and programmed control of the cutting action, avoiding path deviations or speed inconsistencies caused by human intervention, and improving the stability and repeatability of the cutting process. Precise cutting along the contour of the RFID antenna pattern 12, directly executing the cutting operation based on the preset pattern design, ensures the accuracy and consistency of the antenna shape, preventing functional defects in the finished product caused by contour deviations. Separating the RFID antenna pattern 12 from the substrate 10 achieves an efficient and seamless separation process, optimizing overall manufacturing efficiency. Overall, this solution, through the synergistic effect of visual recognition and programmed cutting, effectively solves the potential problems of insufficient precision and efficiency bottlenecks in the cutting process, significantly improving the quality and automation level of antenna manufacturing.

[0073] In some of the above-mentioned solutions of this application, the preparation method is proposed to prepare RFID antennas efficiently and accurately. However, in this process, an RFID antenna product directly prepared by the method is needed to ensure that it has optimized performance and cost structure, and to avoid the problems of process redundancy, insufficient accuracy and limited production speed caused by traditional independent printing of marking points.

[0074] In response, this application proposes an RFID antenna, which is prepared using the method described above.

[0075] Specifically, as a product, the physical characteristics, structural integrity, and electrical performance of this RFID antenna all stem directly from its unique manufacturing process. The phrase "prepared using a method" means that during the manufacturing process, one or more marking points 11 are simultaneously set on the substrate 10 while applying adhesive according to a pre-defined RFID antenna pattern 12. Subsequently, a conductive foil 20 is integrally laminated to the surface of the substrate 10, adhering to the area of ​​the RFID antenna pattern 12 with adhesive. Next, a positioning film 30 is integrally laminated to the area where the marking points 11 are located, and any portion of the positioning film 30 not adhered to the marking points 11 is removed. Finally, based on the positioning information provided by the marking points 11, the antenna is cut along the contour of the RFID antenna pattern 12, thereby separating the individual RFID antennas. This RFID antenna can be embodied as a finished product with precise geometric dimensions and consistent electrical performance, its conductive layer firmly adhered to the designated antenna pattern area, ensuring optimal performance. For example, the RFID antenna can be made of coated paper as the substrate 10 and aluminum foil as the conductive foil 20, wherein the conductive layer is precisely formed and cut, with clear edge contours and no burrs, and the conductive pattern has no glue overflow or misalignment.

[0076] Through the above technical solution, the RFID antenna provided in this application, by omitting the traditional independent printing of mark points in its manufacturing method, fundamentally solves the problems of redundant processes, insufficient precision, and limited production speed in traditional processes. During the manufacturing process, the marking points 11 are simultaneously set in the adhesive coating step, effectively reducing equipment investment and energy consumption, and lowering production costs. The conductive layer lamination ensures that the conductive foil 20 is firmly bonded to the substrate 10 only in the pre-defined RFID antenna pattern 12 area, thereby guaranteeing the electrical performance consistency of the antenna's conductive parts. The positioning layer lamination and removal steps, by forming high-contrast hot stamping film markings in the marking point 11 area, provide an extremely precise positioning reference for subsequent cutting, significantly reducing the cutting defect rate. Finally, the cutting step, based on these precise marking points 11, achieves accurate separation of the RFID antenna pattern 12 outline, ensuring the geometric accuracy and yield of the antenna unit. Therefore, this RFID antenna product not only possesses high reliability and excellent performance consistency, but its manufacturing process is also efficient and cost-controllable, greatly enhancing the overall competitiveness of RFID tags.

[0077] In some of the solutions mentioned above in this application, RFID antennas with specific fabrication methods are proposed to improve antenna manufacturing efficiency and accuracy. However, in the process of RFID tag construction, how to ensure that the advantages of such antennas are effectively inherited by the tag as a whole, so as to avoid performance instability and cost increase caused by the use of traditional antennas.

[0078] In response, this application proposes an RFID tag that includes an RFID antenna.

[0079] "Including an RFID antenna" refers to the core component of an RFID tag. This RFID antenna is responsible for receiving and transmitting radio frequency signals and is crucial for enabling wireless communication between the RFID tag and the reader. The design and material selection of the RFID antenna directly affect the tag's communication distance, sensitivity, and overall performance. For example, RFID antennas can be formed on a substrate using conductive materials (such as copper, aluminum, silver paste, or conductive ink) through printing, etching, or coating. Their structures are diverse and can be designed as dipole antennas, loop antennas, or patch antennas depending on the operating frequency (such as HF or UHF) and application requirements. Integrating an RFID antenna into an RFID tag is fundamental to building complete RFID functionality.

[0080] Through the above technical solution, the RFID tag includes an RFID antenna prepared using the above method, effectively solving the problem of how to ensure that the advantages of antenna manufacturing are effectively inherited by the tag as a whole during the RFID tag construction process. Specifically, the RFID antenna omits the traditional independent Mark point printing step during preparation. By simultaneously setting the marking points 11 in the adhesive coating step S1, and using these marking points 11 for precise positioning in the subsequent conductive layer lamination step S2, positioning layer lamination and removal step S3, and cutting step S4, efficient and high-precision antenna manufacturing is achieved. Therefore, when this RFID antenna is integrated into an RFID tag, the tag can directly benefit from its high-precision and low-cost manufacturing advantages, avoiding the positioning deviations, production speed limitations, and increased costs caused by additional processes due to manufacturing defects in traditional antennas. This not only ensures higher reliability and economy in RFID tag applications but also simplifies the tag assembly process, enhances the consistency of overall performance, and thus improves the overall performance of the RFID tag.

[0081] The following example will provide a more detailed explanation of the above technical solution:

[0082] In the manufacturing process of RFID antennas, to solve the problems of increased steps, limited positioning accuracy, and low production efficiency caused by the independent printing of positioning marks in traditional processes, this technical solution provides an integrated manufacturing method.

[0083] In step S1, coated paper is selected as the substrate 10. Using a CNC adhesive coating machine, a layer of adhesive is precisely coated onto the surface of the substrate 10 according to a preset RFID antenna pattern 12. Simultaneously, the CNC adhesive coating machine applies adhesive dots or lines as marking points 11 to the outer area of ​​the RFID antenna pattern 12. These marking points 11 are completed synchronously with the adhesive coating of the RFID antenna pattern 12, eliminating the need for additional printing processes and avoiding the problems of unclear markings or inaccurate positioning caused by ink adhesion or alignment deviations in traditional processes. These adhesive dots or lines, as marking points 11, will be used as alignment references in subsequent steps.

[0084] In step S2, aluminum foil is selected as the conductive foil 20. The substrate 10 coated with adhesive and the conductive foil 20 are simultaneously fed between the composite rollers. The conductive foil 20 is integrally laminated to the surface of the substrate 10 by hot pressing or rolling. During this process, the aluminum foil is firmly bonded to the substrate 10 only in the areas coated with the RFID antenna pattern 12 and the marking points 11, forming the conductive part of the RFID antenna. In the areas not coated with adhesive, the conductive foil 20 does not bond to the substrate 10 or the bonding force is very weak, laying the foundation for the subsequent positioning layer lamination and removal steps.

[0085] In step S3, the positioning film 30, specifically a hot stamping film, is integrally laminated onto the surface of the conductive foil 20, ensuring complete coverage of all marking points 11. This hot stamping film has a release layer, and its adhesion to the conductive foil 20 is weaker than its adhesion to the adhesive on the marking points 11. After lamination, the hot stamping film not adhered to the marking points 11 is removed using a winding device. Because the adhesion between the hot stamping film and the conductive foil 20 is weak, while its adhesion to the adhesive on the marking points 11 is strong, high-contrast hot stamping film markings are retained only in the areas of the marking points 11. These hot stamping film markings have clear outlines and good optical recognition characteristics, providing a precise positioning reference for subsequent cutting and effectively solving the problem of unclear markings that may exist with traditional printing.

[0086] In step S4, the vision positioning system of the laser cutting machine automatically identifies the hot stamping film markings retained on the substrate 10. According to the preset program, the vision system drives the die-cutting blade to precisely cut along the contour of the RFID antenna pattern 12. With the positioning information provided by these high-contrast hot stamping film markings, the cutting process can achieve high-precision alignment, separating the RFID antenna pattern 12 from the substrate 10, and finally obtaining an independent finished RFID antenna.

[0087] Using the above-described preparation method, the application of adhesive to the RFID antenna pattern 12 and the setting of the marking points 11 are carried out simultaneously, eliminating the need for a separate mark point printing step in traditional processes. This reduces production steps, equipment investment, and energy consumption. Simultaneously, by utilizing the selective adhesion characteristics of the adhesive and the hot stamping film, high-contrast, high-precision positioning marks are formed, effectively avoiding the blurring or inaccurate positioning problems that may exist with traditionally printed mark points, significantly improving the accuracy and production efficiency of subsequent cutting. The entire process achieves efficient and precise RFID antenna fabrication.

[0088] In this document, the terms "upper," "lower," "front," "back," "left," "right," "top," "bottom," "inner," "outer," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used for the clarity of expressing the technical solution and for the convenience of description, and therefore should not be construed as limiting the present invention.

[0089] In this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0090] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method of manufacturing an RFID antenna, characterized by, The method comprises the following steps: Step S1, gluing: applying adhesive on the substrate (10) according to the preset RFID antenna pattern (12), and setting one or more mark sites (11) in the edge area of the RFID antenna pattern (12); Step S2, conductive layer compounding: integrally compounding the conductive foil (20) to the surface of the substrate (10) treated in step S1, so that the conductive foil (20) is adhered to the area of the RFID antenna pattern (12) by the adhesive; Step S3, positioning layer compounding and removing: integrally compounding the positioning film (30) to the area where the mark site (11) is located, and tearing off the positioning film (30) not adhered to the mark site (11); Step S4, cutting: cutting along the contour of the RFID antenna pattern (12) according to the positioning information provided by the mark site (11), and separating the independent RFID antenna.

2. The method of claim 1, wherein the RFID antenna is prepared by the steps of: The specific method of step S1 is as follows: Copper plate paper is selected as the substrate (10), and the adhesive is applied on the substrate (10) according to the preset RFID antenna pattern (12) by numerical control gluing equipment, and the adhesive points or adhesive lines serving as the mark sites (11) are applied in the peripheral area of the RFID antenna pattern (12), which are used as the positioning reference in the subsequent steps.

3. The method of claim 2, wherein the RFID antenna is prepared by the steps of: The specific method of step S2 is as follows: Aluminum foil is selected as the conductive foil (20), and the conductive foil (20) and the glued substrate (10) are synchronously conveyed to the compounding roller, and the conductive foil (20) is integrally compounded to the surface of the substrate (10) by hot pressing or rolling; wherein the aluminum foil is firmly adhered to the substrate (10) only in the area where the RFID antenna pattern (12) and the mark site (11) are applied, forming the conductive part of the RFID antenna.

4. The method of claim 3, wherein the conductive layer is formed by a method selected from the group consisting of sputtering, vacuum deposition, and plating. The specific method of step S3 is as follows: The positioning film (30) is a gilded film, and when compounding, the gilded film roll is integrally compounded to the surface of the conductive foil (20), ensuring that all the mark sites (11) are covered; the gilded film has a release layer, and the adhesion between the release layer and the conductive foil (20) is weaker than that between the release layer and the mark site (11); after compounding, the gilded film not adhered to the mark site (11) is torn off by the winding device, and only the gilded film mark with high contrast is reserved in the area of the mark site (11).

5. The method of claim 4, wherein the RFID antenna is prepared by the steps of: The specific method of step S4 is as follows: The gilded film mark reserved on the substrate (10) is automatically recognized by the visual positioning system of the laser cutting machine, and the die cutting knife is driven according to the preset program to accurately cut along the contour of the RFID antenna pattern (12), so that the RFID antenna pattern (12) is separated from the substrate (10), and the finished product RFID antenna is obtained.

6. An RFID antenna, characterized by Prepared by the method of any one of claims 1 to 5.

7. An RFID tag, characterized by The RFID antenna of claim 6. The RFID antenna of claim 6.

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