Electronic device

Abstract

The invention discloses an electronic device. The electronic equipment comprises a shell and a sensor, the shell is provided with a containing space and a side wall defining the containing space, and the side wall is provided with a first through hole communicating the inner side and the outer side of the shell; the sensor comprises a substrate, an interaction structure and a functional device, the interaction structure and the functional device are arranged on the substrate, the substrate is embedded in the first through hole, the functional device is located in the containing space, and the interaction structure can receive environment signals on the outer side of the shell. The electronic equipment provided by the invention has a good use experience feeling.

Description

Technical Field

[0001] This application relates to the field of smart device technology, and more specifically, to an electronic device. Background Technology

[0002] To meet users' diverse needs for electronic devices, existing electronic devices not only perform basic functions but also automatically collect human physiological data or other environmental data. These functions are achieved through the integration of multiple sensors within the electronic device, which can interact with the external environment to obtain desired environmental information.

[0003] Existing sensors typically interact with the external environment from a considerable distance, resulting in longer response times, reduced sensor performance, and negatively impacting the user experience of electronic devices. Summary of the Invention

[0004] One objective of this application is to provide a new technical solution for an electronic device.

[0005] According to a first aspect of this application, an electronic device is provided, comprising:

[0006] A housing having a receiving space and a sidewall surrounding the receiving space, the sidewall having a first through hole communicating between the inner and outer sides of the housing;

[0007] The sensor includes a substrate, an interactive structure and a functional device respectively disposed on the substrate, the substrate being embedded in the first through hole, the functional device being located in the receiving space, and the interactive structure being able to receive environmental signals from outside the housing.

[0008] Optionally, the substrate has a first surface and a second surface, the functional device is disposed on the first surface, and the interaction structure is a second through hole penetrating the first surface and the second surface.

[0009] Optionally, the second surface and the outer surface of the sidewall are on the same horizontal plane.

[0010] Optionally, the diameter of the second through hole is 0.2 mm to 0.4 mm.

[0011] Optionally, it also includes a waterproof component located within the receiving space and disposed at the second through hole.

[0012] Optionally, the outer periphery of the substrate is bonded to the first through hole with adhesive.

[0013] Optionally, the outer periphery of the substrate is snapped into the first through hole by a snap-fit ​​structure.

[0014] Optionally, the system also includes an FPC board located in the receiving space, the substrate being a PCB board, the first surface of the PCB board having pads, and the FPC board being soldered to the PCB board via the pads.

[0015] Optionally, the sensor further includes a package housing disposed on the PCB board and located in the receiving space, the functional device being located inside the package housing, and the pads being located outside the package housing.

[0016] Optionally, multiple sensors are provided, and each of the multiple sensors is embedded in one of the multiple first through holes.

[0017] One technical effect of this application is:

[0018] According to one embodiment of this application, by embedding the sensor substrate on the side wall of the electronic device housing, the interaction structure on the substrate can interact with the external environment of the housing at a shorter distance, thereby shortening the response time of the sensor to external environmental signals to a certain extent, improving the transmission performance of the sensor, and optimizing the user experience of the electronic device.

[0019] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0021] Figure 1 This is a schematic diagram of the structure of an electronic device provided by existing technology.

[0022] Figure 2 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Housing; 11. Sidewall; 2. Sensor; 21. Substrate; 22. Second through hole; 23. Encapsulation shell; 3. Waterproof component; 4. FPC board. Detailed Implementation

[0025] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0026] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0027] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0028] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0030] like Figure 2 As shown, according to a first aspect of this application, an electronic device is provided, including a housing 1 and a sensor 2. The housing 1 has a receiving space and a side wall 11 surrounding the receiving space. The side wall 11 is provided with a first through hole communicating between the inner side and the outer side of the housing 1. The sensor 2 includes a substrate and interactive structural functional devices respectively disposed on the substrate. The substrate is embedded in the first through hole so that the functional devices are located in the receiving space. The interactive structure is capable of receiving environmental signals from outside the housing 1.

[0031] In practical applications, most electronic devices have sensors 2 installed inside their housing 1 to automatically collect physiological data (such as heart rate, exercise data, or sleep patterns) or to enable functions like voice calls. These sensors 2 can interact with the external environment, transmitting the data generated during the interaction to the electronic device for processing and to obtain the desired information. However, in existing electronic device designs, the sensors 2 are typically placed directly inside the housing 1, as shown in the reference... Figure 1 The sensor 2 has holes in its own structure, and the housing 1 of the electronic device has channels, so that the sensor 2 can pick up external environmental signals through the holes in its own structure and the structural channels on the electronic device.

[0032] However, in the above structure, the design of two or more channels will increase the interaction distance between the sensor 2 and the external environment, prolong the response time of the sensor 2, and reduce the performance of the sensor 2.

[0033] The electronic device provided in this application embeds the substrate 21 of the sensor 2 into the first through hole of the housing 1 of the electronic device, so that the substrate is located on the side wall 11 of the housing. The interactive structure for receiving or picking up external environmental signals is disposed on the substrate 21, so that the interactive structure can be closer to the outside of the housing 1, which shortens the response time of the sensor 2 to a certain extent. The functional device can usually obtain the environmental information or time zone received by the interactive structure, so that the functional device can transmit the environmental signal received by the interactive structure to other devices (such as the control module) of the electronic device in a timely manner without losing the environmental signal, in order to obtain the desired information, thereby improving the performance of the sensor 2 and enhancing the user experience of the electronic device.

[0034] In the above structure, the functional components can be structural components such as diaphragms and backplates, or other electronic components. The substrate 21 is embedded within the first through-hole, meaning that the outer periphery of the substrate 21 is connected to the first through-hole, such that at least a portion of the substrate 21 is located within the first through-hole in the thickness direction. Typically, the shape of the outer periphery of the substrate 21 matches the shape of the first through-hole to improve the sealing performance of their connection. The substrate can be a PCB board or a ceramic substrate, and the electronic device can be a wearable device such as a watch or a mobile phone.

[0035] In one embodiment, at least a portion of the interaction structure extends to the surface of the substrate 21 facing the outer side of the housing 1, thereby reducing the contact distance between the interaction structure and the external environment. The interaction structure can be a structural channel inherent in the substrate 21 itself, or it can be another detection device independent of the substrate 21, specifically selected and designed according to the type of sensor 2 and the actual needs of the electronic device. Furthermore, the thickness of the substrate 21 can be the same as or different from the thickness of the sidewall 11 of the housing 1, and the outer surface of the substrate 21 can be configured not to extend beyond the outer surface of the housing 1 to improve the aesthetics and safety of the device.

[0036] Optionally, such as Figure 2 As shown, the substrate 21 has a first surface and a second surface, the functional device is disposed on the first surface, and the interaction structure is a second through hole 22 that penetrates the first surface and the second surface.

[0037] Specifically, in this embodiment, a second through hole 22 is provided on the substrate 21, through which the sensor 2 can receive external environmental signals. When the substrate 21 is embedded in the first through hole of the side wall 11 of the housing 1, at least a portion of the second through hole 22 is fitted into the first through hole, making the distance between the second through hole 22 and the outside of the housing 1 shorter, thereby improving the response speed of the sensor 2.

[0038] In the above structure, the sensor 2 can be a type of sensor 2 capable of picking up or receiving external environmental signals through a through-hole structure, such as a barometric pressure sensor 2, microphone, gas sensor 2, or differential pressure sensor 2, to realize functions such as voice communication in electronic devices. The specific type can be selected according to actual needs, and this application does not impose any limitations on this. Preferably, the thickness of the substrate 21 is the same as the thickness of the sidewall 11 of the housing 1, so that the first and second surfaces of the substrate 21 are flush with the inner and outer surfaces of the sidewall 11, respectively, thereby improving the assembly stability of the sensor 2 and the assembly efficiency of the electronic device.

[0039] Optionally, such as Figure 2 As shown, the second surface is on the same horizontal plane as the outer surface of the sidewall 11.

[0040] Specifically, in this embodiment, the second surface and the outer surface of the sidewall 11 are on the same horizontal plane. On the one hand, this makes the distance between the interactive structure and the outside of the housing 1 shorter, further improving the response speed of the sensor 2. On the other hand, it also facilitates the assembly of the sensor 2 and improves the appearance and wearing comfort of the entire electronic device.

[0041] Optionally, such as Figure 2 As shown, the diameter of the second through hole 22 is 0.2mm to 0.4mm.

[0042] Specifically, in practical applications, if the aperture of the second through-hole 22 is too large, external dust, moisture, foreign objects, etc., will enter the sensor 2, affecting its structural performance. Conversely, if the aperture is too small, it will affect the reception quality of external environmental signals by the interactive structure. In this application, the aperture of the second through-hole 22 is selected to be 0.2mm to 0.4mm, which can both prevent dust and foreign objects from entering and ensure the reception effect of external environmental signals by the second through-hole 22, thereby improving the overall detection performance and accuracy of the sensor 2.

[0043] In practical applications, the diameter of the second through hole 22 can be appropriately enlarged or reduced within the above range according to actual needs, and the number of the second through holes 22 can also be adjusted according to actual needs to match the functional requirements of the electronic device.

[0044] Optionally, such as Figure 2 As shown, the electronic device also includes a waterproof component 3, which is located in the receiving space and disposed at the second through hole 22.

[0045] Specifically, in some sensors 2, the second through-hole 22 needs to be designed to be waterproof and dustproof to prevent external moisture or other liquids from entering the interior of the sensor 2. This application provides a waterproof component 3 at the location of the second through-hole in the accommodating space, which enables the sensor 2 to receive signals from the external environment while also being waterproof and dustproof, thereby improving its service life.

[0046] In one embodiment, the waterproof component 3 is a waterproof membrane and is disposed on the first surface, which will not affect the distance between the second through hole 22 and the external environment, and can further ensure the detection performance of the sensor 2.

[0047] Optionally, such as Figure 2 As shown, the outer periphery of the substrate 21 is bonded to the first through hole with adhesive.

[0048] Specifically, in one embodiment, the outer periphery of the substrate 21 can be bonded to the side wall 11 of the housing 1 with adhesive. The adhesive can be waterproof to improve the sealing performance of the bond and ensure the accuracy of the sensor 2 detection. For example, if the first through hole is circular, the substrate 21 can also be circular and can be interference-fitted into the first through hole. During the assembly process, waterproof adhesive can be applied to the assembly surface to achieve a sealed bond.

[0049] Optionally, such as Figure 2 As shown, the outer periphery of the substrate 21 is snapped into the first through hole by a snap-fit ​​structure.

[0050] Specifically, in practical applications, to facilitate disassembly and assembly, a snap-fit ​​structure can be correspondingly provided on the outer periphery of the substrate 21 and inside the first through hole, allowing the sensor 2 to be detachably assembled into the first through hole. In this connection structure, a waterproof seal can be provided near the snap-fit ​​location to ensure the sealing performance of the sensor 2. In addition, the connection between the substrate 21 and the sidewall 11 can also be achieved by welding or other processes, which are not limited in this application.

[0051] Optionally, such as Figure 2 As shown, the electronic device also includes an FPC board 4 (Flexible Printed Circuit), which is located in the receiving space. The substrate 21 is a PCB board (Printed Circuit Board), and the first surface of the PCB board is provided with pads. The FPC board 4 is soldered to the PCB board through the pads.

[0052] Specifically, in practical applications, the environmental signals collected by sensor 2 usually need to be transmitted to the control module or other devices of electronic devices for further processing to obtain the desired information. In this embodiment, by setting an FPC inside the housing 1 and setting pads on the PCB, the FPC can be soldered to the PCB through the pads, thereby realizing the transmission of environmental signals.

[0053] The placement of the pads allows signals from the PCB to be concentrated in one location, facilitating connection with the FPC and ensuring a robust solder joint, thus improving signal transmission reliability. Furthermore, the flexible circuit board can be positioned on one side of the PCB, making soldering to the pads easy without affecting the interaction structure's ability to receive or pick up signals from the external environment.

[0054] Optionally, such as Figure 2 As shown, the sensor 2 also includes a package shell 23, which is disposed on the PCB board and located in the accommodating space. The functional device is located inside the package shell 23, and the pads are located outside the package shell 23.

[0055] Specifically, in this embodiment, the encapsulation shell 23 is disposed on the PCB board, which can provide a certain degree of protection and sealing for the functional devices, thereby improving the reliability of the sensor 2. The solder pads are disposed on the outside of the encapsulation shell 23 to facilitate the soldering of the FPC board 4 to the PCB board.

[0056] Optionally, multiple sensors 2 are provided, and each of the multiple sensors 2 is embedded in a corresponding first through hole.

[0057] Specifically, in this embodiment, the number of sensors 2 can be set to multiple according to actual needs, and the number of first through holes can be the same as the number of sensors 2, that is, one sensor 2 is embedded in the side wall 11 of the housing 1 through the substrate 21. The multiple first through holes can be interconnected or separated from each other, and can be selected according to actual needs to meet the various functional requirements of electronic devices.

[0058] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0059] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. An electronic device, comprising: The application relates to a sensor, which comprises a shell having a containing space and a side wall enclosing the containing space, wherein a first through hole is arranged on the side wall and communicates the inner side and the outer side of the shell; a sensor comprises a substrate, an interactive structure and a functional device arranged on the substrate respectively, the substrate is embedded in the first through hole, the functional device is located in the containing space, and the interactive structure can receive environmental signals outside the shell. The substrate has a first surface and a second surface, the functional device is arranged on the first surface, and the interactive structure is a second through hole penetrating through the first surface and the second surface. The second surface is in the same horizontal plane as the outer surface of the side wall.

2. The electronic device of claim 1, wherein, The aperture of the second through hole is 0.2-0.4 mm.

3. The electronic device of claim 2, wherein, The sensor further comprises a waterproof part located in the containing space and arranged at the second through hole.

4. The electronic device of claim 2, wherein, The outer periphery of the substrate is bonded in the first through hole by glue.

5. The electronic device of claim 2, wherein, The outer periphery of the substrate is clamped in the first through hole by a clamping structure.

6. The electronic device of claim 1, wherein, The sensor further comprises an FPC plate located in the containing space, the substrate is a PCB plate, the first surface of the PCB plate is provided with a solder pad, and the FPC plate is soldered with the PCB plate through the solder pad.

7. The electronic device of claim 1, wherein, The sensor further comprises a packaging shell arranged on the PCB plate and located in the containing space, the functional device is located on the inner side of the packaging shell, and the solder pad is located on the outer side of the packaging shell.

8. The electronic device of claim 2, wherein, The sensor is provided with a plurality of sensors, and the plurality of sensors are embedded in a plurality of first through holes one by one.

9. The electronic device of claim 8, wherein, ​ 10. The electronic device of claim 1, wherein, ​

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