Display device and electronic device including the same

Abstract

A display device and an electronic device including the same are provided. The display device includes: a display panel including: a display area in which a plurality of pixels are disposed; and a peripheral area surrounding at least a portion of the display area and including a pad area spaced apart from one side of the display area in the first direction; a circuit board disposed under the display panel and including: a first region including a stepped portion; and a second region spaced apart from the first region in a second direction intersecting the first direction and including a ground portion; a cover member covering the first region and the second region of the circuit board; and a fingerprint sensing module disposed under the cover member, attached to the cover member, and including a shield cover overlapping the first region of the circuit board in a plan view.

Description

Technical Field

[0001] This disclosure relates to display devices and electronic devices including display devices. More specifically, this disclosure relates to display devices that provide visual information and electronic devices including display devices. Background Technology

[0002] For circuit boards, which are essential for rapidly miniaturizing and improving the performance of electronic devices (such as mobile phones, digital cameras, and laptops), a large number of complex electronic components are crammed into a compact space. In other words, in rapidly miniaturizing and improving the performance of electronic devices (such as mobile phones, digital cameras, and laptops), circuit boards (including flexible circuit boards) are essential for mounting complex mechanisms and circuits in confined spaces.

[0003] When such electronic or communication devices are used, electromagnetic waves are generated from various components mounted on a circuit board. Since such electromagnetic waves may cause noise to the communication function of the electronic device, a shield made of metal that can shield electromagnetic waves can be provided on the upper surface of the component when the component is mounted on the circuit board.

[0004] However, when an impact is applied to a product including a shield, a problem arises where the shield detaches from the surface to which it is attached. Various solutions are being sought to address this issue. Summary of the Invention

[0005] One aspect of this disclosure is that it can provide a display device with improved reliability and stability.

[0006] Another aspect of this disclosure is to provide an electronic device including a display device.

[0007] A display device according to an embodiment of the present disclosure includes: a display panel, including: a display area, wherein a plurality of pixels are disposed in the display area; and a peripheral area surrounding at least a portion of the display area and including a pad area spaced apart from one side of the display area in a first direction; a circuit board disposed below the display panel and including: a first area including a stepped portion; and a second area spaced apart from the first area in a second direction intersecting the first direction and including a ground portion; a cover member covering the first area and the second area of ​​the circuit board; and a fingerprint sensing module disposed below the cover member, attached to the cover member, and including a shielding cover overlapping the first area of ​​the circuit board in a plan view.

[0008] In an embodiment, the covering member may include: a main body portion; a first protrusion protruding from the main body portion in a direction opposite to the first direction; and a second protrusion protruding from the main body portion in a direction opposite to the first direction and spaced apart from the first protrusion in a second direction.

[0009] In one embodiment, the first protrusion of the covering member may overlap with the first region in a plan view, and the second protrusion of the covering member may overlap with the second region in a plan view.

[0010] In an embodiment, the fingerprint sensing module may further include: a fingerprint sensing portion configured to detect a user's fingerprint; a sensing driving element configured to transmit a signal transmitted from the fingerprint sensing portion to a circuit board; and a sensing circuit film configured to connect the fingerprint sensing portion and the sensing driving element.

[0011] In one embodiment, the display area of ​​the display panel may include a fingerprint sensing area for contact with the user's fingerprint.

[0012] In one embodiment, the fingerprint sensing portion may overlap with the fingerprint sensing area of ​​the display panel in a plan view.

[0013] In one embodiment, the display device may further include a cover panel disposed below the display panel.

[0014] In one embodiment, the fingerprint sensing module may be located under the cover panel.

[0015] In one embodiment, the opening may be defined in the cover panel and may at least partially overlap with the fingerprint sensing area in a plan view.

[0016] In one embodiment, the fingerprint sensing portion of the fingerprint sensing module may overlap with the opening of the cover panel in a plan view.

[0017] In one embodiment, the sensing drive element may overlap with a first region of the circuit board in a plan view.

[0018] In one embodiment, the shield may cover the sensing drive element of the fingerprint sensing module.

[0019] In one embodiment, the display device may further include an adhesive member disposed between a first protrusion of the cover member and a sensing drive element of the fingerprint sensing module.

[0020] In an embodiment, the display device may further include a driver chip disposed in the pad area of ​​the display panel, and a covering member may cover the driver chip.

[0021] In one embodiment, the circuit board may be electrically connected to the cover member.

[0022] In an embodiment, the display device may further include a connection circuit board disposed in the pad area of ​​the display panel, and the connection circuit board may connect the display panel and the circuit board.

[0023] In one embodiment, the connecting circuit board can be bent around a bending axis extending parallel to the second direction.

[0024] In an embodiment, the covering member may include: a first insulating layer; a conductive layer disposed on the first insulating layer; and a second insulating layer disposed on the conductive layer.

[0025] A display device according to another embodiment of the present disclosure includes: a display panel, including: a display area, wherein a plurality of pixels are disposed in the display area; and a peripheral area surrounding at least a portion of the display area and including a pad area spaced apart from one side of the display area in a first direction; a circuit board disposed below the display panel and including: a first area including a stepped portion; a second area spaced apart from the first area in a second direction intersecting the first direction and including a ground portion; and a covering member covering the first area and the second area and including: a main body portion; a first protrusion protruding from the main body portion in a direction opposite to the first direction; and a second protrusion protruding from the main body portion in a direction opposite to the first direction and spaced apart from the first area in the second direction.

[0026] In an embodiment, the display device may further include a fingerprint sensing module disposed under the display panel. The fingerprint sensing module includes: a fingerprint sensing portion configured to detect a user's fingerprint; a sensing driving element configured to transmit a signal transmitted from the fingerprint sensing portion to a circuit board; a sensing circuit film configured to connect the fingerprint sensing portion and the sensing driving element; and a shield disposed under a covering member, attached to the covering member, overlapping a first area of ​​the circuit board in a plan view, and covering the sensing driving element.

[0027] An electronic device according to an embodiment of the present disclosure includes a display device and a processor configured to drive the display device. The display device includes: a display panel including: a display area having a plurality of pixels disposed in the display area; and a peripheral area surrounding at least a portion of the display area and including a pad area spaced apart from one side of the display area in a first direction; a circuit board disposed below the display panel and including: a first area including a stepped portion; and a second area spaced apart from the first area in a second direction intersecting the first direction and including a ground portion; a cover member covering the first area and the second area of ​​the circuit board; and a fingerprint sensing module disposed below the cover member, attached to the cover member, and including a shielding cover overlapping the first area of ​​the circuit board in a plan view.

[0028] The display device according to embodiments of the present disclosure may include: a display panel, including: a display area, wherein a plurality of pixels are disposed in the display area; and a peripheral area, surrounding at least a portion of the display area and including a pad area spaced apart from one side of the display area in a first direction; a circuit board, disposed below the display panel and including: a first area, including a stepped portion; and a second area, spaced apart from the first area in a second direction intersecting the first direction and including a ground portion; a cover member, covering the first area and the second area of ​​the circuit board; and a fingerprint sensing module, disposed below the cover member, attached to the cover member, and including a shielding cover that overlaps with the first area of ​​the circuit board in a plan view.

[0029] Accordingly, the shielding cover can be attached to the first protrusion of the cover member with a flat surface, rather than directly to the stepped portion of the circuit board. In other words, the shielding cover can have greater adhesive force when attached to the cover member with a flat surface than when attached to the stepped portion. As a result, even in the event of external impacts, the shielding cover can remain bonded and not detach from the cover member, effectively improving the reliability and stability of the display device. Attached Figure Description

[0030] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and form part of this specification, together with the description, explain embodiments of the invention.

[0031] Figure 1 This is a perspective view showing a display device according to an embodiment of the present disclosure.

[0032] Figure 2 yes Figure 1 An exploded perspective view of the display device.

[0033] Figure 3 yes Figure 2 An exploded perspective view of the window module and the display module.

[0034] Figure 4 It is shown Figure 3 A perspective view of the display module and overlay components.

[0035] Figure 5 It is shown Figure 3 A cross-sectional view of the side of the display device.

[0036] Figure 6 It is shown Figure 3 A cross-sectional view of an embodiment of the display panel.

[0037] Figure 7 and Figure 8 It is shown Figure 3 Rear view of an embodiment of a portion of the rear surface.

[0038] Figure 9 It is along Figure 7 The cross-sectional view taken from line I-I'.

[0039] Figure 10 It is shown Figure 7 A cross-sectional view of an embodiment of the fingerprint sensing portion.

[0040] Figure 11 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0041] Figure 12 It is based on Figure 11 Schematic diagrams of electronic devices in various embodiments. Detailed Implementation

[0042] Regarding the embodiments of this disclosure disclosed herein, the specific structural and functional descriptions are merely illustrative for explaining the embodiments of this disclosure, and the embodiments of this disclosure may be implemented in various forms and should not be construed as limited to the embodiments described herein.

[0043] Because this disclosure can be varied and taken in various forms, specific embodiments will be shown in the accompanying drawings and described in detail in the text. However, this is not intended to limit this disclosure to the particular form, and it should be understood to include all variations, equivalents, and substitutions that fall within the spirit and technical scope of this disclosure.

[0044] Terms such as "first," "second," etc., may be used to describe various components, but components should not be limited by these terms. The aforementioned terms may be used for the purpose of distinguishing one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of this disclosure.

[0045] It will be understood that when an element is referred to as “connected” or “linked” to another element, the element may be directly connected to or linked to that other element, or there may be (some) intermediary elements. Conversely, when an element is referred to as “directly connected” or “directly linked” to another element, there are no intermediary elements. Other terms used to describe the relationship between elements (e.g., “between” and “directly between”, “adjacent to” and “directly adjacent to”, etc.) should be interpreted in a similar manner.

[0046] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprising” and / or “including” indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0047] Terms such as “below,” “at the bottom,” “under,” “below,” “above,” “at the top,” “on top of,” “on top of,” etc., are used to explain the relationships between the parts shown in the accompanying drawings. These terms are relative concepts and are interpreted based on the directions indicated in the drawings.

[0048] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in common dictionaries shall be interpreted as having meanings consistent with their meanings in the context of the relevant art, and unless expressly defined herein, these terms shall not be interpreted in an idealized or overly formal sense.

[0049] In the following description, embodiments will be illustrated in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used for the same parts, and redundant descriptions of the same parts will be omitted.

[0050] In this specification, a plane may be defined by a first direction D1 and a second direction D2 intersecting the first direction D1. For example, the second direction D2 may be perpendicular to the first direction D1. Additionally, a third direction D3 may be the normal direction of the plane. That is, the third direction D3 may be perpendicular to the plane defined by the first direction D1 and the second direction D2.

[0051] Figure 1 This is a perspective view showing a display device according to an embodiment of the present disclosure.

[0052] refer to Figure 1 The display device DD can display an image IM on a display surface IS parallel to each of the first direction D1 and the second direction D2, facing a third direction D3. The display surface IS of the display device DD may include a display area DA and a peripheral area SA.

[0053] The display area DA can be the area where the image IM is displayed. A user can identify the image IM through the display area DA. In the current embodiment, the display area DA can have a square shape with rounded corners. However, embodiments of this disclosure are not necessarily limited to this. In a plan view, the display area DA can have various shapes. As used herein, a "plan view" is a view viewed in the thickness direction (i.e., third direction DR3) of the display device DD.

[0054] The peripheral region SA may surround the display region DA. The peripheral region SA may be positioned to be adjacent to only one side of the display region DA, or it may be omitted. However, embodiments of this disclosure are not necessarily limited to this. In a plan view, the peripheral region SA may have various shapes.

[0055] The display device DD can detect a user's fingerprint FNG transmitted from an external source. Accordingly, the display device DD may include a fingerprint sensing area FRA on the display surface IS for sensing the user's fingerprint FNG. The user of the display device DD can contact the fingerprint FNG with the fingerprint sensing area FRA. However, embodiments of this disclosure are not necessarily limited thereto. The fingerprint sensing area FRA may be provided in the peripheral area SA, the entire area of ​​the display area DA, or the entire area of ​​the display surface IS.

[0056] A user's fingerprint FNG can include the surface condition of the user's hand (e.g., surface uniformity, surface curvature shape, shape of the user's blood vessels, etc.). However, embodiments of this disclosure are not necessarily limited thereto.

[0057] Figure 2 yes Figure 1 An exploded perspective view of the display device.

[0058] refer to Figure 1 and Figure 2 The display device DD may include a window module WM, a display module DM, an electronic module EM, a power module PM, a bracket BRK, and a housing EDC.

[0059] The window module WM can be disposed on the upper surface of the display device DD. In embodiments, the window module WM can be ultra-thin glass (UTG). For example, the window module WM may include soda-lime glass, alkali aluminosilicate glass, borosilicate glass, lithium aluminosilicate glass, etc. These can be used individually or in combination with each other. However, the window module WM of this disclosure is not necessarily limited to these and may include various materials such as plastic.

[0060] The display module DM can be positioned below the window module WM. The display module DM provides visual information to the user of the display device DD. Light from the display module DM passes through the window module WM and can provide images such as IM to the user of the display device DD. See later. Figure 3 and Figure 6 The display module DM is described in detail.

[0061] The bracket BRK can be installed below the display module DM. The bracket BRK can be combined with the housing EDC to divide the internal space of the display device DD. The bracket BRK provides space for other components to be installed. Additionally, the bracket BRK supports the display module DM, fixing it in place and preventing it from moving. For example, the bracket BRK can be made of metal or plastic. Figure 2 In the example shown, a bracket BRK is shown, but the display device DD may include multiple brackets.

[0062] The electronic module EM can be installed below the bracket BRK. The electronic module EM can be electrically connected to the display module DM. The display module DM can receive information about the image IM to be displayed through the electronic module EM, or it can provide information about the detected fingerprint FNG to the electronic module EM and provide the processed information based on this information to the user.

[0063] The power module PM can be located below the bracket BRK. The power module PM can be located on the same layer as the electronics module EM. The power module PM supplies power for the overall operation of the display device DD. The power module PM may include a conventional battery module.

[0064] The housing EDC can cover the display module DM, bracket BRK, electronics module EM, and power module PM. The housing EDC can be connected to the bracket BRK, display module DM, and / or window module WM. In other words, the housing EDC, together with the window module WM, forms the appearance of the display device DD. Figure 2 In this specification, the housing EDC is exemplarily shown as consisting of a single body, but the housing EDC may include multiple bodies assembled together. The housing EDC may include multiple frames and / or panels made of glass, plastic, and / or metal. These may be used individually or in combination with each other. However, embodiments of this disclosure are not necessarily limited thereto.

[0065] Figure 3 yes Figure 2 An exploded perspective view of the window module and the display module.

[0066] refer to Figure 2 and Figure 3 The display module DM may include a display panel DP, a cover panel CP, and a fingerprint sensing module FSM.

[0067] The peripheral region SA of the display device DD may include a pad region PDA. Specifically, the pad region PDA may be disposed on one side of the peripheral region SA and may be spaced apart from the display region DA in the first direction D1. However, the embodiments of this disclosure are not necessarily limited thereto.

[0068] Multiple pixels PX can be set within the display area DA of the display panel DP. Pixels PX can be set along a first direction D1 and / or a second direction D2. The display panel DP can provide visual information, etc., to the user of the display device DD via input signals. (See later...) Figure 6 Describes a cross-sectional view of the display panel (DP).

[0069] The connecting circuit board (CCB) can be mounted on the pad area of ​​the display panel (DP) on the PDA. One side of the CCB can be attached to the DP to send and receive signals with it. The other side of the CCB can be connected to the circuit board (MPC) that drives the DP. Accordingly, the MPC can send and receive signals with the DP via the CCB.

[0070] The circuit board MPC can be electrically connected to electronic components (e.g., a timing control unit). The circuit board MPC can generate scan control signals, data control signals, and image data using image signals and multiple timing signals received from the electronic components. The generated scan control signals, data control signals, and image data can be provided to a driver chip (e.g., a timing control unit) via the circuit board MPC. Figure 5 (DIC driver chip).

[0071] A cover panel (CP) can be positioned beneath the display panel (DP). In a plan view, the cover panel (CP) can have a shape substantially the same as the display panel (DP). The cover panel (CP) protects the display panel (DP) from external impacts or the ingress of foreign matter. Figure 3 As shown, the cover panel CP may include multiple layers. For example, the cover panel CP may include a first adhesive layer AL1, a functional layer FL, a second adhesive layer AL2, and a metal layer ML.

[0072] The first adhesive layer AL1 may be disposed beneath the display panel DP. The first adhesive layer AL1 may be attached to both the display panel DP and the functional layer FL. The first adhesive layer AL1 may include a transparent adhesive material. For example, the first adhesive layer AL1 may include at least one of optically clear resin (OCR), optically clear adhesive (OCA), double-sided tape, and pressure-sensitive adhesive (PSA). These may be used individually or in combination with each other. However, the embodiments disclosed herein are not necessarily limited thereto.

[0073] The functional layer FL can be disposed below the first adhesive layer AL1. The functional layer FL may include a padding layer. The functional layer FL can easily absorb shocks transmitted from the outside of the display device DD. That is, the functional layer FL can improve the impact resistance of the display device DD. For example, the functional layer FL may include a synthetic resin foam containing a matrix component and multiple pores. However, the embodiments disclosed herein are not necessarily limited to this. In addition to the padding layer, the functional layer FL may also include other functional layers such as a light-blocking layer.

[0074] The second adhesive layer AL2 may be disposed beneath the functional layer FL. The second adhesive layer AL2 can bond the metal layer ML and the functional layer FL. The second adhesive layer AL2 may comprise a material substantially the same as that of the first adhesive layer AL1. For example, the second adhesive layer AL2 may comprise at least one of optically clear resin (OCR), optically clear adhesive (OCA), double-sided tape, and pressure-sensitive adhesive (PSA).

[0075] The metal layer ML can be disposed below the second adhesive layer AL2. The metal layer ML can perform a heat dissipation function. That is, the metal layer ML can dissipate heat generated from the display panel DP, etc., to the outside. The metal layer ML can include a metal material with high thermal conductivity. For example, the metal layer ML can include copper, aluminum, etc. These can be used alone or in combination with each other. However, the embodiments disclosed herein are not necessarily limited thereto.

[0076] In an embodiment, the opening OP can be defined in each of the first adhesive layer AL1, the functional layer FL, the second adhesive layer AL2, and the metal layer ML. The opening OP can include first to fourth openings OP1, OP2, OP3, and OP4. Specifically, the first opening OP1 can be defined in the first adhesive layer AL1, the second opening OP2 can be defined in the functional layer FL, the third opening OP3 can be defined in the second adhesive layer AL2, and the fourth opening OP4 can be defined in the metal layer ML. In a plan view, the first to fourth openings OP1, OP2, OP3, and OP4 can overlap. In a plan view, the opening OP can at least partially overlap with the fingerprint sensing area FRA. Accordingly, the fingerprint sensing portion FS of the fingerprint sensing module FSM can be attached to the lower surface of the display panel DP through the opening OP.

[0077] The fingerprint sensing module (FSM) can be disposed under the cover panel (CP). The fingerprint sensing module (FSM) may include a fingerprint sensing section (FS) and a sensing circuit board (FPC). The fingerprint sensing module (FSM) can detect the fingerprint of the user on the display device (DD). Figure 1 The fingerprint sensor (FNG) can transmit the signal to the circuit board MPC. The display panel DP can transmit the fingerprint (e.g., fingerprint) from the fingerprint sensing module (FSM). Figure 1It is driven by the signal of the fingerprint FNG.

[0078] The sensing circuit board (FPC) of the fingerprint sensing module (FSM) may include a sensing circuit film (CB-F) and a sensing driving element (IC-F). The sensing circuit film (CB-F) can be connected to the fingerprint sensing section (FS). For example, the sensing circuit film (CB-F) can be connected to the fingerprint sensing section (FS) via an adhesive member such as an anisotropic conductive film, or it can be connected to the fingerprint sensing section (FS) via a separate connector. The sensing circuit film (CB-F) can be electrically connected to the circuit board (MPC).

[0079] The sensing driver IC-F can be mounted on the sensing circuit film CB-F. The sensing driver IC-F can be electrically connected to the fingerprint sensing section FS via signal lines connected to the sensing circuit film CB-F. The sensing driver IC-F can receive the user's fingerprint (e.g., ...) from the fingerprint sensing section FS. Figure 1 The fingerprint (FNG) generates an electrical signal, and this signal can be processed. (See later...) Figure 7 and Figure 8 Describe the layout of the fingerprint sensing module (FSM).

[0080] Figure 4 It is shown Figure 3 A perspective view of the display module and overlay components. Figure 5 It is shown Figure 3 A cross-sectional view of the side of the display device.

[0081] refer to Figure 3 and Figure 4 The cover element CVM can cover one side of the display module DM. Specifically, the cover element CVM can cover the peripheral area SA of the display module DM. Figure 4 and Figure 5 In the diagram, the cover member CVM is shown as having a "U" shape in cross-sectional view and covering the upper and lower surfaces of the display module DM; however, embodiments of this disclosure are not necessarily limited to this. The cover member CVM may cover only one of the upper and lower surfaces of the display module DM.

[0082] Further reference Figure 5 The display device DD may include a cover panel CP, a display panel DP, an optical functional layer OFL, a window module WM, a driver chip DIC, a connecting circuit board CCB, a circuit board MPC, and a cover member CVM. The display panel DP may include a substrate SUB, a display element layer DEL, and a packaging layer ENC. (Note: This information is already referenced.) Figure 2 and Figure 3 The cover panel CP, display panel DP, window module WM, connecting circuit board CCB, and circuit board MPC are described, so repeated content can be omitted or simplified.

[0083] The optical functional layer (OFL) can be disposed on the display panel (DP). In other words, the optical functional layer (OFL) can be a layer disposed on the display panel (DP) that performs optical functions to control the light emitted from the display panel (DP).

[0084] In embodiments, the optical functional layer (OFL) may include a polarizing layer. For example, the optical functional layer (OFL) may polarize light incident from the outside onto the display panel (DP). The optical functional layer (OFL) may extend in one direction. The direction of extension of the optical functional layer (OFL) may be the direction of the absorption axis, and the direction perpendicular to the direction of extension may be the direction of the transmission axis. However, the optical functional layer (OFL) according to embodiments of this disclosure is not necessarily limited to this, and the optical functional layer (OFL) may not include a polarizing layer and may include a color filter. In other words, the display device (DD) may have a structure that does not include a polarizing layer.

[0085] The cover member CVM can cover the circuit board MPC and the driver chip DIC. One end of the cover member CVM can be attached to the encapsulation layer ENC of the display panel DP, and the other end of the cover member CVM, which is opposite to this end, can be attached to the circuit board MPC or the cover panel CP. In other words, the cover member CVM can protect the circuit board MPC and the driver chip DIC from external impacts or foreign matter ingress.

[0086] In one embodiment, the cover member CVM may include three layers. For example, the cover member CVM may include a first insulating layer IL1, a conductive layer CVMC, and a second insulating layer IL2. The conductive layer CVMC may be disposed on the first insulating layer IL1, and the second insulating layer IL2 may be disposed on the conductive layer CVMC. However, the embodiments of this disclosure are not necessarily limited thereto. In another embodiment, the cover member CVM may have a single-layer structure including an insulating layer.

[0087] For example, the first insulating layer IL1 and the second insulating layer IL2 may comprise insulating materials containing polyimide (PI) or polyethylene terephthalate (PET).

[0088] The circuit board MPC can be electrically connected to the cover member CVM, and static electricity generated in the circuit board MPC can be released through the conductive layer CVMC of the cover member CVM. In other words, the cover member CVM not only physically protects the display panel DP, but also releases static electricity generated in the circuit board MPC to prevent damage to the circuit board MPC. The aforementioned conductive layer CVMC can include aluminum (Al), gold (Au), silver (Ag), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), alloys containing aluminum, alloys containing silver, alloys containing copper, alloys containing molybdenum, etc. These can be used individually or in combination. However, the embodiments disclosed herein are not necessarily limited thereto.

[0089] In an embodiment, such as Figure 5 As shown, the cover member CVM and the connecting circuit board CCB can be bent around a bending axis BX. The bending axis BX can be a virtual axis extending parallel to a second direction D2 intersecting the first direction D1. That is, the cover member CVM and the connecting circuit board CCB can be bent around a bending axis BX extending along the second direction D2. Accordingly, the cover member CVM can cover at least a portion of the upper and lower surfaces of the display module DM.

[0090] Figure 6 It is shown Figure 3 A cross-sectional view of an embodiment of the display panel.

[0091] refer to Figure 1 , Figure 3 , Figure 5 and Figure 6 The display panel DP may include a substrate SUB, a display element layer DEL, and a packaging layer ENC. The display element layer DEL may include a buffer layer BUF, a gate insulating layer GI, a transistor TR, an interlayer insulating layer ILD, a connection electrode CNE, a first via layer VIA1, a second via layer VIA2, a light-emitting diode LED, and a pixel defining layer PDL.

[0092] A transistor (TR) may include an active layer (ACT), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE). A light-emitting diode (LED) may include a pixel electrode (PE), an emissive layer (EL), and a common electrode (CE).

[0093] The substrate SUB may include a glass substrate, a metal substrate, a plastic substrate, etc. However, the embodiments disclosed herein are not necessarily limited to these, and the substrate SUB may be an inorganic layer, an organic layer, or a composite material layer.

[0094] A buffer layer (BUF) can be disposed on the substrate (SUB). The buffer layer (BUF) prevents impurities such as oxygen and moisture from penetrating through the substrate (SUB) into the upper part of the substrate (SUB). The buffer layer (BUF) may include an inorganic insulating material.

[0095] The active layer ACT can be disposed on the buffer layer BUF. The active layer ACT can include oxide semiconductors, silicon semiconductors, organic semiconductors, etc. For example, oxide semiconductors can include oxides of at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). Silicon semiconductors can include amorphous silicon, polycrystalline silicon, etc. The active layer ACT can include a source region, a drain region, and a channel region located between the source and drain regions.

[0096] A gate insulating layer GI can be disposed on a buffer layer BUF. Specifically, the gate insulating layer GI can cover the active layer ACT on the buffer layer BUF. The gate insulating layer GI can include an inorganic insulating material. In an embodiment, the gate insulating layer GI can be disposed completely covering the display area DA and the peripheral area SA. In an embodiment, the gate insulating layer GI can be disposed only below the gate electrode GE.

[0097] The gate electrode GE can be disposed on the gate insulating layer GI. In a planar view, the gate electrode GE can overlap at least a portion of the channel region of the active layer ACT. The gate electrode GE can include conductive materials such as metals, alloys, conductive metal nitrides, conductive metal oxides, or transparent conductive materials. Examples of conductive materials that can be used for the gate electrode GE include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), alloys containing aluminum, alloys containing silver, alloys containing copper, alloys containing molybdenum, and aluminum nitride (AlN). x ), Tungsten nitride (WN) x Titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO) x Gallium oxide (GaO) x Indium zinc oxide (IZO), etc. These can be used individually or in combination with each other. Optionally, the gate electrode GE can have a single-layer structure or a multilayer structure including multiple conductive layers.

[0098] An interlayer insulating layer (ILD) can be disposed on the gate electrode GE. Specifically, the ILD can be disposed on the gate insulating layer GI and can cover the gate electrode GE on the gate insulating layer GI. The ILD may include an inorganic insulating material. In an embodiment, the ILD may be disposed completely covering the display area DA and the peripheral area SA.

[0099] The source electrode SE and drain electrode DE can be disposed on the interlayer insulating layer ILD. Each of the source electrode SE and drain electrode DE can be connected to the active layer ACT. For example, the source electrode SE can contact the source region of the active layer ACT, and the drain electrode DE can contact the drain region of the active layer ACT. Each of the source electrode SE and drain electrode DE can include a conductive material. The active layer ACT, the gate electrode GE, the source electrode SE, and the drain electrode DE can form a transistor TR.

[0100] The first via layer VIA1 can be disposed on the source electrode SE and the drain electrode DE. Specifically, the first via layer VIA1 can be disposed on the interlayer insulating layer ILD and can cover the source electrode SE and the drain electrode DE on the interlayer insulating layer ILD. The first via layer VIA1 may include an organic insulating material. In an embodiment, the first via layer VIA1 may be disposed only in the display area DA and in the portion of the peripheral area SA adjacent to the display area DA.

[0101] The connection electrode CNE can be disposed on the first via layer VIA1. The connection electrode CNE can transmit the signal from the transistor TR to the light-emitting diode (LED). The connection electrode CNE can include metals, alloys, conductive metal nitrides, conductive metal oxides, transparent conductive materials, etc. These can be used alone or in combination with each other. However, the embodiments disclosed herein are not necessarily limited thereto.

[0102] The second via layer VIA2 can be disposed on the connection electrode CNE. Specifically, the second via layer VIA2 can be disposed on the first via layer VIA1 and can cover the connection electrode CNE. The second via layer VIA2 can include a material substantially the same as that of the first via layer VIA1.

[0103] The pixel electrode PE can be disposed on the second via layer VIA2. The pixel electrode PE may include a conductive material. The pixel electrode PE can be connected to the drain electrode DE via the connection electrode CNE. Accordingly, the pixel electrode PE can be electrically connected to the transistor TR.

[0104] The pixel defining layer (PDL) can be disposed on the pixel electrode (PE). Specifically, the pixel defining layer (PDL) can be disposed on the second via layer (VIA2), and can expose at least a portion of the pixel electrode (PE) on the second via layer (VIA2). The pixel defining layer (PDL) can include inorganic insulating material or organic insulating material.

[0105] The light-emitting layer EL can be disposed on the pixel electrode PE. In an embodiment, the light-emitting layer EL can be disposed within an opening defined by the pixel defining layer PDL. That is, the light-emitting layer EL can be surrounded by the pixel defining layer PDL. In an embodiment, the light-emitting layer EL can also be disposed on the pixel defining layer PDL. The light-emitting layer EL can include at least one of organic light-emitting materials and quantum dots. However, the embodiments of this disclosure are not necessarily limited thereto.

[0106] The common electrode CE can be disposed on the light-emitting layer EL. The common electrode CE can also be disposed on the pixel-defining layer PDL. That is, the common electrode CE can be continuously disposed on the light-emitting layer EL and the pixel-defining layer PDL. The common electrode CE may include a conductive material. The light-emitting layer EL can emit light based on the voltage difference between the pixel electrode PE and the common electrode CE.

[0107] An encapsulation layer ENC can be disposed on the common electrode CE. The encapsulation layer ENC may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In embodiments, the inorganic and organic encapsulation layers may be disposed alternately. For example, the organic encapsulation layer may include a polymer-cured material such as polyacrylate, epoxy resin, or silicone resin. For example, the inorganic encapsulation layer may include silicon oxide, silicon nitride, silicon carbide, alumina, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc.

[0108] Figure 7 and Figure 8 It is shown Figure 3 A rear view of an embodiment of a portion of the rear surface. Specifically, Figure 8 It is shown Figure 7 Rear view of the fingerprint sensing module FSM and the cover component CVM, which are separated from the circuit board MPC.

[0109] refer to Figure 7 and Figure 8 The circuit board MPC, the cover component CVM, and the fingerprint sensing module FSM can be located on the rear surface of the display device DD.

[0110] The circuit board MPC may include a first region A1 containing a stepped portion ST and a second region A2 containing a ground portion CT. The first region A1 may be spaced apart from the second region A2 along a second direction D2.

[0111] Figure 8The stepped portion ST of the first region A1 shown can represent a recess in the circuit board MPC along the third direction D3. For example, the stepped portion ST of the first region A1 can be a recessed region defined in the circuit board MPC. However, embodiments of this disclosure are not necessarily limited to this. The stepped portion ST can also include a portion (i.e., a convex region) protruding in the circuit board MPC in the opposite direction to the third direction D3.

[0112] The grounding portion CT of the second area A2 can serve as a channel for the release and escape of static electricity generated from the circuit board MPC. Specifically, static electricity generated from the circuit board MPC can escape through the covering member CVM that contacts the grounding portion CT. Accordingly, damage to the circuit board MPC due to static electricity can be prevented or reduced.

[0113] In this embodiment, the grounding portion CT can be defined not only in the second region A2 but also in the first region A1. That is, the first region A1 can define an area not only for the step portion ST but also for grounding with the covering member CVM. Accordingly, static electricity generated from the circuit board MPC can be released not only through the grounding portion CT defined in the second region A2 but also through the first region A1. That is, as... Figure 8 As shown, the discharge performance of the covering member CVM can be improved because static electricity is released through the first region A1 and the second region A2.

[0114] In an embodiment, the cover member CVM may include a main body portion BD, a first protrusion PT1, and a second protrusion PT2. For example, the first protrusion PT1 may protrude from the main body portion BD in a direction opposite to the first direction D1. The second protrusion PT2 may protrude from the main body portion BD in a direction opposite to the first direction D1, and may be spaced apart from the first protrusion PT1 in a direction opposite to the second direction D2. However, the embodiments of this disclosure are not necessarily limited thereto. The cover member CVM may include three or more protrusions.

[0115] In an embodiment, in a plan view, the first protrusion PT1 may overlap with the first region A1 of the circuit board MPC. The first protrusion PT1 may cover the stepped portion ST of the first region A1. In a plan view, the second protrusion PT2 may overlap with the second region A2 of the circuit board MPC. The second protrusion PT2 may cover the ground portion CT of the second region A2.

[0116] Accordingly, the shielding cover SH may not be directly attached to the stepped portion ST of the circuit board MPC, but may be directly attached to the first protrusion PT1 of the cover member CVM having a flat surface, or may be attached, for example, through the first adhesive member AD1 (see...). Figure 9The shield SH is attached to the first protrusion PT1 of the cover member CVM, which has a flat surface. In other words, the shield SH can have greater adhesive force when attached to the cover member CVM with a flat surface than when attached to the stepped portion ST. As a result, even in the event of an external impact, the shield SH can remain attached without detaching from the cover member CVM, thus effectively improving the reliability and stability of the display device DD.

[0117] In a plan view, the fingerprint sensing portion FS of the fingerprint sensing module FSM can overlap with the fingerprint sensing area FRA. That is, because the fingerprint sensing portion FS overlaps with the fingerprint sensing area FRA in the plan view, the fingerprint of the user of the display device DD can be recognized by the fingerprint sensing portion FS in the fingerprint sensing area FRA.

[0118] The fingerprint sensing component FS can be electrically connected to the sensing circuit film CB-F. That is, the wiring provided in the sensing circuit film CB-F and the fingerprint sensing component FS is connected, so that user signals detected by the fingerprint sensing component FS can be transmitted to the sensing drive element IC-F through the sensing circuit film CB-F.

[0119] In the plan view, the sensing drive element IC-F may overlap with the first region A1 of the circuit board MPC. User signals, etc., transmitted to the sensing drive element IC-F can be transmitted to the circuit board MPC. The circuit board MPC can analyze user signals, etc., and can transmit drive signals, etc., to the display panel (e.g., Figure 3 Display panel (DP), etc. For example, the drive signal can be used in response to a fingerprint (e.g., Figure 1 The fingerprint sensor (FNG) signals the power supply to the display device DD. However, embodiments of this disclosure are not necessarily limited thereto.

[0120] The sensing driver IC-F of the fingerprint sensing module FSM can be covered by the shielding cover SH. That is, as... Figure 7 As shown, the sensing drive element IC-F can be disposed on the covering member CVM, and the shield SH can cover the sensing drive element IC-F. (See later...) Figure 9 A cross-sectional view depicting the shield SH covering the sensing drive element IC-F.

[0121] The shield SH can reduce the transmission of electromagnetic waves generated from circuit boards such as the MPC to the sensing drive element IC-F. In addition, the shield SH can protect the sensing drive element IC-F from external impacts, foreign matter ingress, or static electricity. The shield SH can be integrally formed with the sensing drive element IC-F. That is, the shield SH can be included in the fingerprint sensing module FSM. However, the embodiments disclosed herein are not necessarily limited to this.

[0122] Information about the fingerprint sensing module (FSM) can be written on the upper surface of the shielding cover (SH). Product name, model name, manufacturer name, serial number, operating conditions, etc., can be written on the upper surface of the shielding cover (SH). However, the embodiments disclosed herein are not necessarily limited to this.

[0123] Figure 9 It is along Figure 7 The cross-sectional view taken from line I-I'.

[0124] refer to Figure 7 and Figure 9 In the cross-sectional view, the sensing drive element IC-F of the fingerprint sensing module FSM can be disposed on the first protrusion PT1 of the cover member CVM. Specifically, the first adhesive member AD1 can be disposed between the sensing drive element IC-F and the first protrusion PT1 to bond the sensing drive element IC-F and the first protrusion PT1. The signal transmitted to the sensing drive element IC-F can be transmitted to the circuit board MPC through the first protrusion PT1 of the cover member CVM. The first adhesive member AD1 can be conductive. Furthermore, the shield SH can not be directly attached to the stepped portion ST of the circuit board MPC, but can be directly attached to the first protrusion PT1 of the cover member CVM with a flat surface, or can be attached to the first protrusion PT1 of the cover member CVM with a flat surface through the first adhesive member AD1. That is, the shield SH can have a greater adhesive force when attached to the cover member CVM with a flat surface than when attached to the stepped portion ST.

[0125] In this embodiment, the shield SH of the fingerprint sensing module FSM can cover the sensing driving element IC-F. Since the shield SH covers the sensing driving element IC-F, it can protect the sensing driving element IC-F from external impacts, foreign matter ingress, or static electricity.

[0126] Figure 10 It is shown Figure 7 A cross-sectional view of an embodiment of the fingerprint sensing portion.

[0127] refer to Figure 7 and Figure 10 The fingerprint sensing portion FS can be disposed under the display panel DP. The fingerprint sensing portion FS can be attached to the display panel DP via a second adhesive member AD2. The second adhesive member AD2 can include at least one of optically clear resin (OCR), optically clear adhesive (OCA), double-sided tape, and pressure-sensitive adhesive (PSA). These can be used alone or in combination with each other. However, the embodiments disclosed herein are not necessarily limited thereto. Since the second adhesive member AD2 is transparent, the user's fingerprint (e.g., Figure 1The fingerprint (FNG) can be accurately transmitted to the fingerprint sensing part (FS).

[0128] Because the fingerprint sensor FS is located below the display panel DP, the fingerprint sensor FS can recognize the fingerprint of the user who is in contact with the display panel DP (e.g., Figure 1 (The fingerprint sensor FS). For example, in a plan view, the fingerprint sensing portion FS can overlap with the opening OP defined in the cover panel CP. That is, the fingerprint sensing portion FS can be positioned in the opening OP of the cover panel CP such that, in a plan view, the sides of the fingerprint sensing portion FS can be surrounded by the cover panel CP. As a result, the fingerprint sensing portion FS can be protected from external impacts, noise signals, etc.

[0129] Figure 11 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0130] refer to Figure 1 and Figure 11 The display device DD according to the embodiment can be applied to various electronic devices 10. The electronic device 10 according to the embodiment includes the above-described display device DD, and in addition to the display device DD, the electronic device 10 may further include modules or devices with additional functions.

[0131] The electronic device 10 may include a display module 11, a processor 12, a memory 13, and a power module 14.

[0132] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0133] The memory 13 can store data information for the operation of the processor 12 or the display module 11. When the processor 12 executes the application program stored in the memory 13, image data signals and / or input control signals can be transmitted to the display module 11, and the display module 11 can process the received signals and output image information through the display screen.

[0134] The power module 14 can convert power supplied by a power supply module such as a power adapter or battery device. Specifically, the power module 14 may include a power conversion module that generates power for the operation of the electronic device 10.

[0135] At least one of the components of the electronic device 10 described above may be included in the display device DD according to the above embodiment. Additionally, some functionally independent modules included in a single module may be included in the display device DD, while other modules may be provided separately from the display device DD. For example, the display device DD may include a display module 11, and the processor 12, memory 13, and power module 14 may be provided as other devices within the electronic device 10 besides the display device DD.

[0136] Figure 12 It is based on Figure 11 Schematic diagrams of electronic devices in various embodiments.

[0137] refer to Figure 11 and Figure 12 The various electronic devices 10 applying the display device DD according to the embodiments may include electronic devices for displaying images, such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d, and desktop monitors 10_1e. Additionally, the electronic devices 10 may include wearable electronic devices including display modules, such as smart glasses 10_2a, head-mounted displays 10_2b, and smartwatches 10_2c, as well as vehicle electronic devices 10_3 including display modules, such as in-vehicle mirror displays and central information displays (CIDs) installed on the dashboard, center console, and instrument panel of a vehicle.

[0138] However, this is exemplary, and the electronic device 10 according to embodiments of this disclosure is not necessarily limited thereto. For example, the electronic device 10 can be implemented as a mobile phone, video phone, smartboard, smartwatch, tablet PC, vehicle display, computer monitor, laptop computer, head-mounted display device, etc. Additionally, the electronic device 10 can be a television or monitor. Furthermore, the electronic device 10 can be a car.

[0139] Although this disclosure has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the claims.

Claims

1. A display apparatus comprising: a display panel including: a display area in which a plurality of pixels are disposed; and a peripheral area surrounding at least a portion of the display area and including a pad area spaced apart from a side of the display area in a first direction; a circuit board disposed under the display panel and including: a first area including a stepped portion; and a second area spaced apart from the first area in a second direction intersecting the first direction and including a ground portion; a cover member covering the first area and the second area of the circuit board; and a fingerprint sensing module disposed under the cover member, attached to the cover member, and including a shield can overlapping the first area of the circuit board in a plan view.

2. The display device according to claim 1, wherein The cover member includes: a body portion; a first protruding portion protruding from the body portion in a direction opposite to the first direction; and a second protruding portion protruding from the body portion in the direction opposite to the first direction and spaced apart from the first protruding portion in the second direction.

3. The display device according to claim 2, wherein The fingerprint sensing module further includes: a fingerprint sensing portion configured to detect a user fingerprint; a sensing driving element configured to transmit a signal transmitted from the fingerprint sensing portion to the circuit board; and a sensing circuit film configured to connect the fingerprint sensing portion and the sensing driving element.

4. The display device according to claim 3, wherein The display area of the display panel includes a fingerprint sensing area where the user fingerprint is contacted.

5. The display device of claim 4, wherein, The fingerprint sensing portion overlaps the fingerprint sensing area of the display panel in the plan view. 6.The display apparatus of claim 4, further comprising: a cover panel disposed under the display panel.

7. The display device of claim 6, wherein, The fingerprint sensing module is disposed under the cover panel.

8. The display device of claim 6, wherein, An opening is defined in the cover panel and at least partially overlaps the fingerprint sensing area in the plan view. 9.A display apparatus comprising: a display panel including: a display area in which a plurality of pixels are disposed; and a peripheral area surrounding at least a portion of the display area and including a pad area spaced apart from a side of the display area in a first direction; a circuit board disposed under the display panel and including: a first area including a stepped portion; and a second area spaced apart from the first area in a second direction intersecting the first direction and including a ground portion; and a cover member covering the first area and the second area and including: a body portion; a first protruding portion protruding from the body portion in a direction opposite to the first direction; and a second protruding portion protruding from the body portion in the direction opposite to the first direction and spaced apart from the first protruding portion in the second direction. 10.An electronic apparatus comprising: the display apparatus according to any one of claims 1 to 9; and a processor configured to drive the display apparatus.

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