Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate, a planarization layer, a first electrode layer, a protection layer and an isolation structure. The planarization layer is provided with a via hole, the first electrode of the first electrode layer is electrically connected with the conductive part of the lower conductive layer through the via hole of the planarization layer, and the first electrode is exposed out of the isolation opening to serve as the first electrode of the light-emitting unit. The protection layer comprises a protection part, the orthographic projection of at least part of the via holes on the substrate is located in the orthographic projection of the protection part on the substrate, and the protection part can cover part of the area where the via holes are located, so that the first electrodes in the via holes are protected, and the phenomenon that the first electrodes are damaged in the isolation opening preparation process is avoided. The problem that wet etching liquid medicine damages the first electrode in the through hole is solved, the structural integrity of the first electrode in the through hole is guaranteed, stable electric signals are provided for the first electrode, the dark spot problem of the display panel is solved, and therefore the display reliability and the use performance of the display panel are improved.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing the display panel, aiming to improve the performance of the display panel.

[0005] The first aspect of this application provides a display panel, which includes: a substrate; a planarization layer located on the substrate, wherein through holes are formed in the planarization layer; a first electrode layer located on the side of the planarization layer away from the substrate, the first electrode layer including a plurality of mutually spaced first electrodes, portions of which are located within the through holes; a protective layer located on the side of the first electrode layer away from the substrate, the protective layer including a protective portion, wherein at least a portion of the through holes are located within the orthographic projection of the protective portion onto the substrate; and an isolation structure located on the side of the protective layer away from the substrate, the isolation structure enclosing an isolation opening, wherein at least a portion of the first electrodes are exposed through the isolation opening.

[0006] According to an embodiment of the first aspect of this application, the orthographic projection of the protective portion onto the substrate and the orthographic projection of the first electrode onto the substrate at least partially overlap.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the protective part on the substrate is located within the orthographic projection of the first electrode on the substrate.

[0008] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the protective portion is located within the via.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the first electrode is recessed in the via to form a first groove, and at least a portion of the protective portion is located in the first groove.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the protective portion is located on the side of the first electrode away from the substrate and is in contact with the first electrode; and / or, the orthographic projection of the first groove on the substrate is located within the orthographic projection of the protective portion on the substrate.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the distance between the surface of the protective part away from the substrate and the substrate is a first distance, the distance between the surface of the first electrode away from the substrate and the substrate is a second distance, and the first distance is greater than or equal to the maximum value of the second distance.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the via on the substrate is located within the orthographic projection of the protective portion on the substrate.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the via on the substrate is located within the orthographic projection of the isolation structure on the substrate.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the via on the substrate is located outside the orthographic projection of the isolation opening on the substrate.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a pixel definition layer located between the first electrode layer and the isolation structure, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel opening being connected to a corresponding isolation opening.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure is located on the side of the pixel limiting portion away from the substrate.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the material of the pixel definition layer is an inorganic insulating material.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the protective layer is located between the pixel definition layer and the first electrode layer.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the material of the protective part is an organic insulating material; or, the material of the protective part is an organic conductive material, and the protective part is electrically connected to the first electrode.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the protective layer is located between the pixel definition layer and the isolation structure.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the material of the protective part is an organic insulating material; or, the material of the protective part is an organic conductive material, and the protective part is electrically connected to the isolation structure.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the pixel defining portion is recessed in the via to form a second groove, and at least a portion of the protective portion is located in the second groove.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the second groove onto the substrate is located within the orthographic projection of the protective portion onto the substrate.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the distance between the surface of the protective portion away from the substrate and the substrate is a third distance, the distance between the surface of the pixel limiting portion away from the substrate and the substrate is a fourth distance, and the third distance is greater than or equal to the maximum value of the fourth distance.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the material of the protective part includes at least one of organic material, inorganic material, or metallic material.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the material of the protective part is an organic material.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the material of the protective part is an organic conductive material or an organic insulating material.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the material of the protective part is the same as the material of the planarization layer.

[0029] According to any of the foregoing embodiments of the first aspect of this application, the surface of the protective portion away from the substrate has a planar region and an arcuate region located on the periphery of the planar region.

[0030] According to any of the foregoing embodiments of the first aspect of this application, the planar region and the arcuate region are tangent.

[0031] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a light-emitting layer located on the side of the first electrode layer away from the substrate, the light-emitting layer including a plurality of spaced light-emitting units, the light-emitting units being located within an isolation opening.

[0032] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a second electrode layer located on the side of the light-emitting layer away from the substrate, the second electrode layer including a second electrode located in the isolation opening, the second electrode being electrically connected to the isolation structure.

[0033] According to any of the foregoing embodiments of the first aspect of this application, the orthogonal projection of the light-emitting unit onto the substrate is located within the orthogonal projection of the second electrode onto the substrate.

[0034] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a first encapsulation layer located on the side of the second electrode layer away from the substrate, the first encapsulation layer including a plurality of encapsulation portions spaced apart.

[0035] According to any of the foregoing embodiments of the first aspect of this application, the encapsulation portion extends through the isolation structure toward the sidewall of the isolation opening to the side of the isolation structure away from the substrate.

[0036] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the package portion on the substrate is located outside the orthographic projection of the via on the substrate.

[0037] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the packaging portion on the substrate is located outside the orthographic projection of the protective portion on the substrate.

[0038] According to any of the foregoing embodiments of the first aspect of this application, the first encapsulation layer is an inorganic layer.

[0039] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a second encapsulation layer located on the side of the first encapsulation layer away from the substrate.

[0040] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a third encapsulation layer located on the side of the second encapsulation layer away from the substrate.

[0041] According to any of the foregoing embodiments of the first aspect of this application, the second encapsulation layer is an organic layer, and / or the third encapsulation layer is an inorganic layer.

[0042] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the protective portion is located within a via; and / or, the display panel further includes a conductive layer located between the substrate and the planarization layer and including a conductive portion, the conductive portion being electrically connected to the first electrode through a via; and / or, the material of the planarization layer is an organic insulating material; and / or, the display panel further includes a light-emitting device, at least a portion of which is located within a corresponding isolation opening, the light-emitting device including a first electrode, a light-emitting unit, and a second electrode sequentially stacked along a direction away from the substrate; and / or, the display panel further includes a driving circuit layer located between the substrate and the planarization layer, the driving circuit layer including a pixel circuit, the pixel circuit being electrically connected to the first electrode through a via.

[0043] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first sublayer and a second sublayer, the second sublayer being located on the side of the first sublayer away from the substrate, and the orthographic projection of the side of the first sublayer away from the substrate onto the substrate being located within the orthographic projection of the second sublayer onto the substrate.

[0044] According to any of the foregoing embodiments of the first aspect of this application, the first sublayer includes a conductive material.

[0045] According to any of the foregoing embodiments of the first aspect of this application, the second sublayer includes a conductive material or an insulating material.

[0046] According to any of the foregoing embodiments of the first aspect of this application, both the first sublayer and the second sublayer comprise metallic materials, and the materials of the first sublayer and the second sublayer are different.

[0047] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third sublayer located on the side of the first sublayer facing the substrate, wherein the orthographic projection of the first sublayer onto the substrate is located within the orthographic projection of the third sublayer onto the substrate.

[0048] An embodiment of the second aspect of this application provides a display device that includes a display panel of any of the above embodiments.

[0049] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, the method comprising:

[0050] A planarization layer is prepared on the substrate, and vias are formed in the planarization layer;

[0051] A first electrode layer is prepared on the side of the planarization layer away from the substrate. The first electrode layer includes a plurality of first electrodes spaced apart from each other, and a portion of the first electrodes is located in a via.

[0052] A protective layer is prepared on the side of the first electrode layer away from the substrate. The protective layer includes a protective portion, and at least a portion of the vias are located within the orthogonal projection of the protective portion onto the substrate.

[0053] An isolation structure is prepared on the side of the protective layer away from the substrate. The isolation structure encloses and forms an isolation opening, through which at least part of the first electrode is exposed.

[0054] According to an embodiment of the third aspect of this application, before the step of preparing a protective layer on the side of the first electrode layer away from the substrate, the method further includes:

[0055] A pixel definition material layer is fabricated on the side of the first electrode layer that faces away from the substrate.

[0056] The steps for preparing the protective layer include: preparing a protective layer on the side of the pixel definition material layer that faces away from the substrate;

[0057] Alternatively, between the step of preparing a protective layer on the side of the first electrode layer facing away from the substrate and the step of preparing an isolation structure on the side of the protective layer facing away from the substrate, the method further includes:

[0058] A pixel definition material layer is prepared on the side of the protective layer away from the substrate;

[0059] The steps for fabricating the isolation structure include: fabricating the isolation structure on the side of the pixel definition material layer that faces away from the substrate.

[0060] According to any of the foregoing embodiments of the third aspect of this application, the method further includes:

[0061] The pixel definition material layer is patterned to form a pixel definition layer. The pixel definition layer includes a pixel defining part and a pixel opening formed by the pixel defining part. The pixel opening is connected to the corresponding isolation opening.

[0062] According to any of the foregoing embodiments of the third aspect of this application, the isolation opening includes a first isolation opening and a second isolation opening. In the step of fabricating the isolation structure on the side of the protective layer away from the substrate, the method further includes:

[0063] An isolation material layer is prepared on the side of the protective layer away from the substrate, and the isolation material layer is patterned to form an isolation material layer with a first isolation opening.

[0064] Prepare at least a portion of the film layer of the first light-emitting device located within the first isolation opening, and prepare an encapsulation portion of the first light-emitting device away from the substrate;

[0065] The isolation material layer with the first isolation opening is patterned to form an isolation material layer with the second isolation opening;

[0066] Prepare at least a portion of the film layer of the second light-emitting device located within the second isolation opening, and prepare an encapsulation portion of the second light-emitting device on the side away from the substrate.

[0067] According to any of the foregoing embodiments of the third aspect of this application, the isolation opening further includes a third isolation opening, and the method further includes:

[0068] The isolation material layer with the second isolation opening is patterned to form an isolation material layer with the third isolation opening;

[0069] Prepare at least a portion of the film layer of the third light-emitting device located within the third isolation opening, and prepare an encapsulation portion of the third light-emitting device on the side away from the substrate.

[0070] According to an embodiment of this application, the display panel includes a substrate, a planarization layer, a first electrode layer, a protective layer, and an isolation structure. The isolation structure can isolate the light-emitting layers to form mutually disconnected light-emitting units, thereby reducing the development and use of precision photomasks and lowering manufacturing costs. Through-holes are formed in the planarization layer. The first electrode of the first electrode layer is electrically connected to the conductive portion of the underlying conductive layer through the through-holes in the planarization layer, enabling the supply of electrical signals to the first electrode. The first electrode is exposed through the isolation opening to serve as the first electrode of the light-emitting unit. The portion of the isolation structure within the through-hole is relatively thin, making it easily over-etched away by subsequent etching processes, exposing the first electrode and causing damage to the first electrode by subsequent etching processes (e.g., wet etching and / or dry etching). Therefore, a protective layer is provided, which includes a protective portion. At least a portion of the via's orthogonal projection onto the substrate is located within the orthogonal projection of the protective portion onto the substrate. The protective portion can cover a portion of the area where the via is located, thereby protecting the first electrode within the via. This avoids damage to the first electrode within the via caused by the wet etching solution during the fabrication of the isolation opening, ensuring the structural integrity of the first electrode within the via, providing a stable electrical signal to the first electrode, improving the dark spot problem of the display panel, and thus enhancing the display reliability and performance of the display panel. Attached Figure Description

[0071] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0072] Figure 1 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0073] Figure 2 This is a partial cross-sectional view of the display panel in another embodiment;

[0074] Figure 3 This is a partial cross-sectional view of the display panel in yet another embodiment;

[0075] Figure 4 This is a partial cross-sectional view of the display panel in another embodiment;

[0076] Figure 5 This is a partial cross-sectional view of the display panel in another embodiment;

[0077] Figure 6 This is a partial cross-sectional view of the display panel in another embodiment;

[0078] Figure 7 This is a partial cross-sectional view of the display panel in another embodiment;

[0079] Figure 8This is a partial cross-sectional view of the display panel in another embodiment;

[0080] Figure 9 This is a partial cross-sectional view of the display panel in another embodiment;

[0081] Figure 10 This is a partial cross-sectional view of the display panel in another embodiment;

[0082] Figure 11 This is a partial cross-sectional view of the display panel in another embodiment;

[0083] Figure 12 This is a schematic flowchart of a method for manufacturing a display panel provided in an embodiment of this application;

[0084] Figure 13 This is a process diagram of the fabrication of a display panel provided in an embodiment of this application.

[0085] Explanation of reference numerals in the attached figures:

[0086] 10. Display panel;

[0087] 100. Substrate;

[0088] 200, Isolation structure; 210, First sublayer; 220, Second sublayer; 230, Third sublayer; 240, Isolation opening;

[0089] 300. Light-emitting layer; 310. Light-emitting unit;

[0090] 400, First electrode layer; 410, First electrode; 420, First groove;

[0091] 500, Pixel definition layer; 510, Pixel limiting part; 520, Pixel opening; 530, Second groove;

[0092] 600, Second electrode layer; 610, Second electrode; 620, Encapsulation section;

[0093] 700. Protective layer; 710. Protective part; 711. Planar area; 712. Curved area;

[0094] 800, planarization layer; 810, via;

[0095] 900. Conductive layer; 910. Conductive part;

[0096] D1, first distance; D2, second distance; D3, third distance; D4, fourth distance;

[0097] Z, thickness direction. Detailed Implementation

[0098] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0099] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0100] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0101] In some display panels, due to the presence of an isolation structure, precision photomasks are not required when fabricating light-emitting units. The light-emitting material is separated into light-emitting units by the isolation structure. When fabricating light-emitting units of different colors, the first color light-emitting material is first vapor-deposited across the entire surface, allowing it to fall into the isolation opening and be encapsulated. Then, a portion of the encapsulation material, the first color light-emitting material, and the electrode material are etched away, leaving the first color light-emitting material, the electrode material, and the encapsulation material covering the isolation opening, forming a light-emitting unit with the first color and a second electrode. This process is repeated to form light-emitting units with the second and third colors. However, during the etching process, the etching material may over-etch the isolation structure and the pixel definition layer, exposing the underlying film layers, such as the anode. When subsequently etching the isolation structure to form the isolation openings corresponding to other color light-emitting units, the wet etching solution may come into contact with the anode, potentially damaging the anode beneath the isolation structure. Especially in the recessed area formed by the downward indentation of the isolation structure, the film of the isolation structure itself is relatively thin. The light-emitting material and encapsulation material covering the recess before etching are also relatively thin, or even missing. As a result, the isolation structure and pixel definition layer are easily etched through, exposing and damaging the anode, thus affecting the performance of the display panel.

[0102] To address the aforementioned issues, this application provides a display panel, a display device, and a method for manufacturing the display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, display device, and method for manufacturing the display panel.

[0103] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel.

[0104] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 2 This is a partial cross-sectional view of the display panel in another embodiment.

[0105] like Figure 1 and Figure 2 As shown, a first aspect of this application provides a display panel 10, which includes: a substrate 100, a planarization layer 800, a first electrode layer 400, a protective layer 700, and an isolation structure 200.

[0106] A planarization layer 800 is located on the substrate 100, and a via 810 is formed on the planarization layer 800; a first electrode layer 400 is located on the side of the planarization layer 800 away from the substrate 100, and the first electrode layer 400 includes a plurality of mutually spaced first electrodes 410, a portion of the first electrodes 410 being located within the via 810; a protective layer 700 is located on the side of the first electrode layer 400 away from the substrate 100, and the protective layer 700 includes a protective portion 710, at least a portion of the via 810 being within the orthogonal projection of the protective portion 710 onto the substrate 100; an isolation structure 200 is located on the side of the protective layer 700 away from the substrate 100, and the isolation structure 200 encloses and forms an isolation opening 240, at least a portion of the first electrodes 410 being exposed through the isolation opening 240.

[0107] According to an embodiment of this application, the display panel 10 includes a substrate 100, a planarization layer 800, a first electrode layer 400, a protective layer 700, and an isolation structure 200. The isolation structure 200 can isolate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the development and use of precision photomasks and lowering manufacturing costs. A via 810 is formed on the planarization layer 800. The first electrode 410 of the first electrode layer 400 is electrically connected to the conductive portion 910 of the underlying conductive layer 900 through the via 810 of the planarization layer 800, thereby providing an electrical signal to the first electrode 410. The first electrode 410 is exposed through the isolation opening 240 to serve as the first electrode 410 of the light-emitting unit 310. The portion of the isolation structure 200 within the via 810 is relatively thin and easily over-etched by subsequent etching processes, exposing the first electrode 410 and causing damage to it during subsequent wet etching processes. Therefore, a protective layer 700 is provided, which includes a protective portion 710. At least a portion of the via 810 is projected onto the substrate 100 within the projection of the protective portion 710 onto the substrate 100. The protective portion 710 can cover a portion of the area where the via 810 is located, thereby protecting the first electrode 410 within the via 810. This avoids damage to the first electrode 410 within the via 810 caused by the wet etching solution during the fabrication of the isolation opening 240, ensuring the structural integrity of the first electrode 410 within the via 810, providing a stable electrical signal to the first electrode 410, improving the dark spot problem of the display panel 10, and thus improving the display reliability and performance of the display panel 10.

[0108] By providing a protective portion 710 covering the via 810, the isolation structure 200 can be raised, thereby increasing the film thickness of the isolation structure 200 at the via 810 and preventing it from becoming too thin, thus reducing the risk of damage during subsequent etching processes.

[0109] There are many other ways to arrange the substrate 100. For example, the substrate 100 may include a substrate and an array substrate disposed on the substrate. Alternatively, the substrate 100 may be the substrate itself. Or the substrate 100 may include a buffer layer and a support plate on the side facing away from the substrate.

[0110] Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 describe the relevant content of the isolation structure 200 (or partition structure or isolation column), for reference.

[0111] In some alternative embodiments, the orthographic projection of the protective portion 710 onto the substrate 100 and the orthographic projection of the first electrode 410 onto the substrate 100 at least partially overlap.

[0112] In these optional embodiments, a portion of the area where the first electrode 410 is located is covered by the protective portion 710, thereby protecting the first electrode 410 and preventing damage to the first electrode 410 within the via 810 caused by the wet etching solution during the fabrication of the isolation opening 240. This ensures the structural integrity of the first electrode 410 within the via 810, provides a stable electrical signal to the first electrode 410, improves the dark spot problem of the display panel 10, and thus enhances the display reliability and performance of the display panel 10.

[0113] In some alternative embodiments, the orthographic projection of the protective portion 710 onto the substrate 100 is located within the orthographic projection of the first electrode 410 onto the substrate 100.

[0114] In these optional embodiments, the area where the protective part 710 is located covers the first electrode 410, thereby achieving greater protection for the first electrode 410. This further avoids the problem of the wet etching solution damaging the first electrode 410 inside the via 810 during the preparation of the isolation opening 240, ensuring the structural integrity of the first electrode 410 inside the via 810, providing a stable electrical signal to the first electrode 410, improving the dark spot problem of the display panel 10, and thus improving the display reliability and performance of the display panel 10.

[0115] Optionally, at least a portion of the protective part 710 is located within the via 810, thereby protecting the first electrode 410 within the via 810. This prevents damage to the first electrode 410 within the via 810 caused by the wet etching solution during the fabrication of the isolation opening 240, ensuring the structural integrity of the first electrode 410 within the via 810, providing a stable electrical signal to the first electrode 410, improving the dark spot problem of the display panel 10, and thus enhancing the display reliability and performance of the display panel 10.

[0116] Please refer to the following: Figures 1 to 3 , Figure 3 This is a partial cross-sectional view of the display panel in yet another embodiment.

[0117] like Figures 1 to 3 As shown, in some optional embodiments, the protective part 710 is located on the side of the first electrode 410 away from the substrate 100 and is in contact with the first electrode 410.

[0118] In some alternative embodiments, the first electrode 410 is recessed within the via 810 to form a first groove 420, and at least a portion of the protective portion 710 is located within the first groove 420. For example, the orthographic projection of the first groove 420 onto the substrate 100 is located within the orthographic projection of the protective portion 710 onto the substrate 100.

[0119] In these optional embodiments, the first electrode 410 forms a first groove 420 within the via 810, and the area where the first groove 420 is located is covered by the protective portion 710. This protects the weak portion of the recessed first electrode 410 from damage caused by subsequent wet etching solution to the first electrode 410 within the via 810, ensuring the structural integrity of the first electrode 410 within the via 810. This provides a stable electrical signal to the first electrode 410, improves the dark spot problem of the display panel 10, and thus enhances the display reliability and performance of the display panel 10.

[0120] Please see Figure 4 , Figure 4 This is a partial cross-sectional view of the display panel in another embodiment.

[0121] like Figure 4As shown, in some optional embodiments, the distance between the surface of the protective portion 710 facing away from the substrate 100 and the substrate 100 is a first distance D1, and the distance between the surface of the first electrode 410 facing away from the substrate 100 and the substrate 100 is a second distance D2. The first distance D1 is less than, greater than, or equal to the maximum value of the second distance D2. For example, the maximum value of the second distance D2 is the distance between the surface of the first electrode 410 outside the via 810 facing away from the substrate 100 and the substrate 100. For example, the surface of the protective portion 710 facing away from the substrate 100 is flush with the surface of the first electrode 410 outside the via 810 facing away from the substrate 100.

[0122] In these optional embodiments, the first distance D1 is greater than or equal to the maximum value of the second distance D2, that is, the distance between the surface of the protective part 710 away from the substrate 100 and the substrate 100 is greater than or equal to the distance between the surface of the first electrode 410 located outside the via 810 away from the substrate 100 and the substrate 100. The protective part 710 fills the first groove 420 or fills it and extends above the first groove 420 to completely cover the portion of the first electrode 410 located inside the via 810, thereby protecting the first electrode 410 inside the via 810 and preventing damage to the first electrode 410 inside the via 810 by the subsequent wet etching solution. This ensures the structural integrity of the first electrode 410 inside the via 810, provides a stable electrical signal to the first electrode 410, improves the dark spot problem of the display panel 10, and thus improves the display reliability and performance of the display panel 10. Furthermore, the protective portion 710 has a relatively large thickness, providing strong resistance to etching and effectively protecting the first electrode 410, thus preventing etching damage to the first electrode 410. When the protective portion 710 fills the via 810, the isolation structure 200 and the pixel defining portion 510 will not be recessed downwards, preventing thin, weak areas. The enhanced etching resistance of the isolation structure 200 and the pixel defining portion 510 results in better structural integrity, making it difficult for the etching process to penetrate them. The isolation structure 200 and the pixel defining portion 510 effectively protect the first electrode 410 within the via 810, further reducing the possibility of damage to the first electrode 410 from the wet etching solution.

[0123] In some alternative embodiments, the orthographic projection of the via 810 onto the substrate 100 lies within the orthographic projection of the protective portion 710 onto the substrate 100.

[0124] In these optional embodiments, the protective portion 710 completely covers the portion of the first electrode 410 located within the via 810, thereby protecting the first electrode 410 within the via 810 and preventing damage to the first electrode 410 by subsequent wet etching solution. This ensures the structural integrity of the first electrode 410 within the via 810, provides a stable electrical signal to the first electrode 410, improves the dark spot problem of the display panel 10, and thus enhances the display reliability and performance of the display panel 10.

[0125] In some alternative embodiments, the orthographic projection of the via 810 onto the substrate 100 lies within the orthographic projection of the isolation structure 200 onto the substrate 100. For example, the orthographic projection of the via 810 onto the substrate 100 lies outside the orthographic projection of the isolation opening 240 onto the substrate 100.

[0126] In these alternative embodiments, the via 810 is disposed below the isolation structure 200, which can prevent the via 810 from being disposed in an area outside the isolation structure 200. This would cause the pixel limiting portion 510 to be recessed downward in the area outside the isolation structure 200. Furthermore, when fabricating the light-emitting unit 310 and the second electrode 610, the light-emitting unit 310 and the second electrode 610 would also be recessed downward, resulting in poor flatness of the light-emitting unit 310 and the second electrode 610, which would affect the overlap between the second electrode 610 and the isolation structure 200.

[0127] Optionally, the display panel 10 further includes a pixel definition layer 500 located between the first electrode layer 400 and the isolation structure 200. The pixel definition layer 500 includes a pixel defining portion 510 and a pixel opening 520 formed by the pixel defining portion 510, used to define the light-emitting area of ​​the display panel 10. The pixel opening 520 is connected to the isolation opening 240, reducing the occlusion of the pixel opening 520 by the isolation structure 200 and ensuring the light-emitting effect of the display panel 10. For example, the orthographic projection of the via 810 on the substrate 100 is outside the orthographic projection of the pixel opening 520 on the substrate 100. For example, the orthographic projection of the pixel opening 520 on the substrate 100 is inside the orthographic projection of the isolation opening 240 on the substrate 100.

[0128] Optionally, the isolation structure 200 is located on the side of the pixel limiting portion 510 away from the substrate 100, so that there is a large step difference between the isolation structure 200 and the pixel opening 520. When fabricating the light-emitting unit 310 and the second electrode 610, the light-emitting unit 310 and the second electrode 610 are more easily disconnected at the edge of the isolation structure 200, which facilitates the fabrication of the light-emitting unit 310 and the second electrode 610.

[0129] In some alternative embodiments, the protective layer 700 is located between the pixel definition layer 500 and the first electrode layer 400.

[0130] In these optional embodiments, the protective layer 700 is located between the pixel definition layer 500 and the first electrode layer 400, protecting the weak portion of the recessed first electrode 410 from damage caused by subsequent wet etching solution to the first electrode 410 within the via 810. This ensures the structural integrity of the first electrode 410 within the via 810, provides a stable electrical signal to the first electrode 410, improves the dark spot problem of the display panel 10, and thus enhances the display reliability and performance of the display panel 10. For example, the material of the protective layer 710 is an organic conductive material, and the protective layer 710 is electrically connected to the first electrode 410; this helps reduce the line impedance of the first electrode 40. Alternatively, the material of the protective layer 710 is an organic insulating material.

[0131] Please see Figure 5 and Figure 6 , Figure 5 This is a partial cross-sectional view of the display panel in another embodiment; Figure 6 This is a partial cross-sectional view of the display panel in another embodiment.

[0132] like Figure 5 and Figure 6 As shown, in some optional embodiments, the protective layer 700 is located between the pixel definition layer 500 and the isolation structure 200.

[0133] In these optional embodiments, the protective layer 700 is located on the side of the pixel definition layer 500 opposite to the first electrode 410. The pixel definition layer 500 is recessed within the via 810, forming a thin, weak region. The etching process can easily over-etch this thin portion of the pixel definition layer 500, causing the first electrode 410 to be exposed and exposed to the wet etching solution, resulting in etching damage. Therefore, the protective layer 700, disposed on the pixel definition layer 500, also protects the pixel definition layer 500 within the via 810, preventing over-etching of the pixel definition layer 500 and exposure of the first electrode 410, thereby further improving the protection of the first electrode 410. For example, the protective layer 710 may be made of an organic conductive material and electrically connected to the isolation structure 200, which helps reduce the line impedance of the second electrode 610. Alternatively, the pixel definition layer may be made of an inorganic insulating material.

[0134] Please refer to the following: Figures 5 to 7 , Figure 7 This is a partial cross-sectional view of the display panel in another embodiment.

[0135] like Figures 5 to 7 As shown, in some alternative embodiments, the pixel defining portion 510 is recessed within the via 810 to form a second groove 530, and at least a portion of the protective portion 710 is located within the second groove 530.

[0136] Optionally, the second groove 530 is projected onto the substrate 100 within the projection of the protective portion 710 onto the substrate 100.

[0137] In these optional embodiments, the pixel defining portion 510 forms a second groove 530 within the via 810. The area where the second groove 530 is located is covered by the protective portion 710, thereby protecting the weak portion of the recessed pixel defining portion 510. This prevents over-etching of the pixel defining portion 510 within the via 810, which could expose the first electrode 410 and cause damage to the first electrode 410 by subsequent wet etching solution. This ensures the structural integrity of the first electrode 410 within the via 810, provides a stable electrical signal to the first electrode 410, improves the dark spot problem of the display panel 10, and thus enhances the display reliability and performance of the display panel 10.

[0138] Please see Figure 8 , Figure 8 This is a partial cross-sectional view of the display panel in another embodiment.

[0139] like Figure 8 As shown, in some optional embodiments, the distance between the surface of the protective portion 710 away from the substrate 100 and the substrate 100 is a third distance D3, and the distance between the surface of the pixel defining portion 510 away from the substrate 100 and the substrate 100 is a fourth distance D4. The third distance D3 is less than, greater than, or equal to the maximum value of the fourth distance D4. For example, the maximum value of the fourth distance D4 is the distance between the surface of the pixel defining portion 510 outside the via 810 away from the substrate 100 and the substrate 100. For example, the surface of the protective portion 710 away from the substrate 100 is flush with the surface of the pixel defining portion 510 outside the via 810 away from the substrate 100.

[0140] In these optional embodiments, the third distance D3 is greater than or equal to the maximum value of the fourth distance D4, that is, the distance between the surface of the protective portion 710 away from the substrate 100 and the substrate 100 is greater than or equal to the distance between the portion of the pixel limiting portion 510 located outside the via 810 away from the substrate 100 and the substrate 100. The protective portion 710 fills the second groove 530 or fills and extends above the second groove 530 to completely cover the portion of the pixel limiting portion 510 located inside the via 810, thereby protecting the pixel limiting portion 510 inside the via 810 from over-etching, which would expose the first electrode 410 and cause damage to the first electrode 410 by the subsequent wet etching solution. This ensures the structural integrity of the first electrode 410 inside the via 810, provides a stable electrical signal to the first electrode 410, improves the dark spot problem of the display panel 10, and thus improves the display reliability and performance of the display panel 10. Furthermore, the protective portion 710 has a relatively large thickness, providing strong resistance to etching and effectively protecting the pixel limiting portion 510 and the first electrode 410, thereby preventing etching damage to the first electrode 410. When the protective portion 710 fills the via 810, the isolation structure 200 will not be recessed downwards, thus avoiding thin, weak areas. The isolation structure 200's enhanced resistance to etching provides good structural integrity, making it difficult for the etching process to penetrate it. The isolation structure 200 effectively protects the first electrode 410 within the via 810, further reducing the possibility of damage to the first electrode 410 from wet etching solutions.

[0141] Optionally, the material of the protective part 710 includes at least one of organic material, inorganic material, or metallic material. Organic material has good fluidity and can fill the via 810 well. Inorganic material has good density and has a good barrier effect against water and oxygen. Metallic material has both good etching resistance and good water and oxygen barrier performance.

[0142] Optionally, the material of the protective part 710 is an organic material, such as OC optical adhesive, MLA adhesive, inkjet printing material (IJP) planarization material, negative planarization material, or PR photoresist (PR for short).

[0143] Optionally, the material of the protective part 710 can be an organic conductive material or an organic insulating material, both of which can effectively fill the via 810 and protect the first electrode 410.

[0144] Optionally, the material of the protective part 710 is the same as that of the planarization layer 800, and the protective part 710 and the planarization layer 800 can be prepared using the same process, simplifying the preparation process.

[0145] Please see Figure 9 and Figure 10 , Figure 9 This is a partial cross-sectional view of the display panel in another embodiment; Figure 10 This is a partial cross-sectional view of the display panel in another embodiment.

[0146] like Figure 9 and Figure 10 As shown, in some optional embodiments, the surface of the protective portion 710 facing away from the substrate 100 has a planar region 711 and an arcuate region 712 located around the planar region 711.

[0147] In these optional embodiments, the planar region 711 of the protective portion 710 makes the pixel defining portion 510 or the isolation structure 200 relatively flat on the protective portion 710, and the pixel defining portion 510 or the isolation structure 200 can have a larger thickness on the planar region 711, thereby having better etching resistance. The periphery of the planar region 711 is set as an arc-shaped region 712. The smooth curved surface makes the slope of the pixel defining portion 510 or the isolation structure 200 more gradual, reduces the degree of thinning of the pixel defining portion 510 or the isolation structure 200 due to the slope, increases the thickness of the pixel defining portion 510 or the isolation structure 200, and thus improves the etching resistance of the pixel defining portion 510 or the isolation structure 200.

[0148] Optionally, the planar region 711 and the curved region 712 are tangent, and the adjacent positions of the planar region 711 and the curved region 712 are smooth, without forming sharp corners, so that the slope of the pixel limiting part 510 or the isolation structure 200 is further smoothed.

[0149] like Figures 1 to 10 As shown, in some optional embodiments, the isolation structure 200 includes a first sublayer 210 and a second sublayer 220 located on the side of the first sublayer 210 away from the substrate 100, wherein the orthographic projection of the side of the first sublayer 210 away from the substrate 100 onto the substrate 100 lies within the orthographic projection of the second sublayer 220 onto the substrate 100.

[0150] In these optional embodiments, the first sub-layer 210 and the second sub-layer 220 are stacked to form the isolation structure 200. The side of the first sub-layer 210 located near the substrate 100, away from the substrate 100, has its orthographic projection on the substrate 100 within the orthographic projection of the second sub-layer 220 on the substrate 100. The orthographic projection area of ​​the second sub-layer 220 is larger than the orthographic projection area of ​​the side of the first sub-layer 210 away from the substrate 100. The second sub-layer 220 covers the surface of the first sub-layer 210 near the substrate 100. At this time, the first sub-layer 210 is recessed relative to the second sub-layer 220 in a direction away from the isolation opening 240. When the light-emitting layer 300 is fabricated, a large drop occurs at the edge of the isolation structure 200, and the first sub-layer 210 is recessed relative to the second sub-layer 220. The light-emitting layer 300 is difficult to connect at the edge of the isolation structure 200, resulting in breakage. The breakage of the light-emitting layer 300 forms mutually disconnected light-emitting units 310. All embodiments of this application do not require the isolation structure 200 to be an inverted trapezoidal structure or a two-layer structure; any structure capable of achieving the isolation effect of the light-emitting layer 300 is acceptable. For example, the cross-section of the isolation structure 200 perpendicular to the substrate is T-shaped.

[0151] Optionally, the first sublayer 210 includes a conductive material, such as a non-metallic conductive material or a metallic conductive material, to achieve an electrical connection between the isolation structure 200 and the second electrode 610.

[0152] In some alternative embodiments, the second sublayer 220 includes a conductive material or an insulating material, wherein the insulating material may be at least one of silicon nitride or silicon oxide.

[0153] In these alternative embodiments, the second sublayer 220 comprises a conductive material, such as a non-metallic conductive material or a metallic conductive material. When the second sublayer 220 is a non-metallic conductive material or an insulating material, it is difficult to etch the second sublayer 220 during the wet etching process of the first sublayer 210 with an etching solution, thereby making it easier for the first sublayer 210 to be recessed relative to the second sublayer 220.

[0154] In some alternative embodiments, the first sublayer 210 and the second sublayer 220 comprise metallic materials, and the materials of the first sublayer 210 and the second sublayer 220 are different.

[0155] In these optional embodiments, when both the first sublayer 210 and the second sublayer 220 are made of metallic materials, the first sublayer 210 can be wet-etched using an etching solution. By adjusting the etching solution, the etching rate of the second sublayer 220 can be made lower than that of the first sublayer 210. Since the etching rate of the first sublayer 210 is higher, when wet-etching is performed using an etching solution, even if the second sublayer 220 is etched to some extent, the first sublayer 210 is etched faster, thereby making the first sublayer 210 recessed relative to the second sublayer 220.

[0156] Please see Figure 11 , Figure 11 This is a partial cross-sectional view of the display panel in another embodiment.

[0157] like Figure 11 As shown, in some optional embodiments, the isolation structure 200 further includes a third sublayer 230 located on the side of the first sublayer 210 facing the substrate 100, wherein the orthographic projection of the first sublayer 210 onto the substrate 100 lies within the orthographic projection of the third sublayer 230 onto the substrate 100.

[0158] In these optional embodiments, to obtain the recessed first sublayer 210, the first sublayer 210 has a faster etching rate than the second sublayer 220 and the third sublayer 230 during the etching process, thereby forming the recessed first sublayer 210. Because the first sublayer 210 has a faster etching rate, more etching waste is generated and can easily enter other parts of the display panel 10, causing adverse effects. After the third sublayer 230 is formed, the first sublayer 210 can adhere better to the third sublayer 230, and the generated etching waste falls onto the third sublayer 230, making it easier to clean. For example, the cross-section of the isolation structure 200 perpendicular to the substrate is I-shaped.

[0159] Optionally, the second sublayer 220 is made of titanium (Ti) or molybdenum (Mo), the first sublayer 210 is made of aluminum (Al), silver (Ag) or copper (Cu), and the third sublayer 230 is made of titanium (Ti) or molybdenum (Mo). For example, the isolation structure 200 is a Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum) three-layer metal composite material.

[0160] Optionally, the display panel 10 further includes a light-emitting layer 300 and / or a second electrode layer 600. The light-emitting layer 300 is located on the side of the first electrode layer 400 facing away from the substrate 100. The light-emitting layer 300 includes a plurality of spaced light-emitting units 310, which are used to realize the light emission display of the display panel 10. The light-emitting units 310 may be located within the isolation opening 240. The second electrode layer 600 is located on the side of the light-emitting layer 300 facing away from the substrate 100. The second electrode layer 600 includes a second electrode 610 located in the isolation opening 240, and the plurality of second electrodes 610 are spaced apart. At least a portion of the second electrode 610 may be located in the pixel opening 520. When the isolation structure 200 is present, the second electrode 610 and the isolation structure 200 are electrically connected, and the second electrodes 610 of the plurality of light-emitting devices are electrically connected to each other through the isolation structure 200 to form a full-surface electrode.

[0161] Optionally, at least a portion of the first electrode 410 is exposed through the pixel opening 520 to serve as an electrode of the light-emitting unit 310, thereby ensuring the light emission of the light-emitting unit 310. One of the first electrode 410 and the second electrode 610 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. This application embodiment illustrates this by using the first electrode 410 as the anode of the light-emitting unit 310 and the second electrode 610 as the cathode of the light-emitting unit 310.

[0162] Optionally, the material of the second electrode 610 may include MgAg alloy or ITO, etc. MgAg alloy or ITO and other materials have high transmittance, so that the light emitted by the light-emitting unit 310 can pass through the second electrode 610, thereby improving the light-emitting effect of the display panel 10.

[0163] In some optional embodiments, the orthographic projection of the light-emitting unit 310 onto the substrate 100 is located within the orthographic projection of the second electrode 610 onto the substrate 100, that is, the second electrode 610 is disposed covering the light-emitting unit 310 to serve as the electrode of the light-emitting unit 310, thereby ensuring the normal light emission of the light-emitting unit 310 and improving the display effect of the display panel 10.

[0164] Optionally, the light-emitting unit 310 and the isolation structure 200 are spaced apart, meaning that the light-emitting unit 310 and the isolation structure 200 are spaced apart with a certain distance, and the space between the light-emitting unit 310 and the isolation structure 200 is filled with a second electrode 610 to avoid direct contact between the light-emitting unit 310 and the isolation structure 200. In addition, each light-emitting unit 310 is spaced apart from each other to reduce crosstalk of charge carriers between each light-emitting unit 310 and improve the color crosstalk problem of the light-emitting unit 310.

[0165] Optionally, the display panel 10 further includes a conductive layer 900, which is located between the substrate 100 and the planarization layer 800 and includes a conductive portion 910. The conductive portion 910 is electrically connected to the first electrode 410 through a via 810 to provide an electrical signal to the first electrode 410.

[0166] Optionally, the planarization layer 800 can be made of an organic insulating material to prevent other film layers from coming into contact with the conductive layer 900 and causing a short circuit.

[0167] Optionally, the display panel 10 further includes a first encapsulation layer located on the side of the second electrode layer 600 facing away from the substrate 100. The first encapsulation layer includes a plurality of spaced-apart encapsulation portions 620, at least a portion of which is located within the isolation opening 240, thereby encapsulating the second electrode 610 and the light-emitting unit 310. For example, the encapsulation portions extend through the isolation structure toward the sidewall of the isolation opening to the side of the isolation structure away from the substrate.

[0168] Optionally, the orthographic projection of the encapsulation portion 620 onto the substrate 100 is located outside the orthographic projection of the via 810 onto the substrate 100. For example, the orthographic projection of the encapsulation portion onto the substrate 100 and the orthographic projection of the via 810 onto the substrate 100 are misaligned. This avoids the problem that after the protective portion 710 is placed inside the via 810, the isolation structure 200 is raised above the via 810, interfering with the encapsulation portion 620 and affecting the encapsulation effect of the encapsulation portion 620. The encapsulation portion 620 does not cover the via 810, but the protective portion 710 covers the via 810. This avoids the problem that the wet etching solution will damage the first electrode 410 inside the via 810 during the fabrication of the isolation opening 240, ensuring the structural integrity of the first electrode 410 inside the via 810, providing a stable electrical signal to the first electrode 410, improving the dark spot problem of the display panel 10, and thus improving the display reliability and performance of the display panel 10. For example, the orthographic projection of the encapsulation portion onto the substrate is located outside the orthographic projection of the protective portion onto the substrate.

[0169] In some alternative embodiments, the material of the first encapsulation layer includes inorganic materials.

[0170] In these alternative embodiments, the first encapsulation layer comprises an inorganic material with good density and good barrier properties against water vapor and oxygen.

[0171] Optionally, the display panel 10 further includes a second encapsulation layer 630 located on the side of the first encapsulation layer facing away from the substrate 100; optionally, the display panel 10 further includes a third encapsulation layer 640 located on the side of the second encapsulation layer facing away from the substrate 100. For example, the display panel 10 employs a three-layer encapsulation, which has better encapsulation performance and reduces the possibility of water and oxygen intrusion.

[0172] Optionally, the material of the second encapsulation layer may include organic materials.

[0173] Optionally, the material of the third encapsulation layer may include inorganic materials. The first, second, and third encapsulation layers are encapsulated using inorganic, organic, and inorganic materials, respectively, to form a TFE (Thin Film Encapsulation) encapsulation structure, further improving encapsulation performance.

[0174] Optionally, the display panel 10 also includes a light-emitting device, at least a portion of which is located in the corresponding isolation opening 240. The light-emitting device includes a first electrode 410, a light-emitting unit 310, and a second electrode 610 sequentially stacked along a direction away from the substrate 100.

[0175] Optionally, the display panel 10 further includes a driving circuit layer located between the substrate 100 and the planarization layer 800. The driving circuit layer includes pixel circuits, which are electrically connected to the first electrode 410 through vias 810 to drive the light-emitting unit 310 to emit light. The driving circuit layer may include conductive portions 910. The pixel circuits may also include conductive portions 910. Alternatively, the pixel circuits may be electrically connected to the protection portion 710 or the first electrode 410 through the conductive portions 910.

[0176] Optionally, the light-emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light-emitting material layer, a hole injection layer (HIL), and a hole transport layer (HTL).

[0177] The structural design in this embodiment can be applied to other display panels 10. The specific choice can be made according to the actual situation, and this application does not impose any specific restrictions on it.

[0178] The second aspect of this application also provides a display device including the display panel 10 of any of the above embodiments. Since the display device provided in the second aspect of this application includes the display panel 10 of any of the above embodiments, it has the beneficial effects of the display panel 10 of any of the above embodiments, which will not be elaborated further here.

[0179] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0180] Please see Figure 12 , Figure 12 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of this application.

[0181] The third aspect of this application also provides a method for manufacturing a display panel 10. The display panel 10 can be any of the display panels 10 provided in the above embodiments. Please refer to the embodiments for further details. Figures 1 to 12 The preparation methods include:

[0182] Step S01: A planarization layer 800 is prepared on the substrate 100, and a via 810 is formed on the planarization layer 800.

[0183] Step S02: A first electrode layer 400 is prepared on the side of the planarization layer 800 away from the substrate 100. The first electrode layer 400 includes a plurality of first electrodes 410 spaced apart from each other, and a portion of the first electrodes 410 is located in the via 810.

[0184] Step S03: A protective layer 700 is prepared on the side of the first electrode layer 400 away from the substrate 100. The protective layer 700 includes a protective portion 710, and at least a portion of the via 810 is located within the orthogonal projection of the protective portion 710 onto the substrate 100.

[0185] Step S04: An isolation structure 200 is prepared on the side of the protective layer 700 away from the substrate 100. The isolation structure 200 encloses and forms an isolation opening 240, and at least part of the first electrode 410 is exposed through the isolation opening 240.

[0186] According to the preparation method of the third aspect of this application, a planarization layer 800 with vias 810 is prepared in step S01. A first electrode layer 400 is prepared in step S02. The planarization layer 800 has vias 810, and the first electrode 410 of the first electrode layer 400 is electrically connected to the conductive portion 910 of the underlying conductive layer 900 through the vias 810 of the planarization layer 800, thereby providing an electrical signal to the first electrode 410. The first electrode 410 is exposed through the isolation opening 240 to serve as the first electrode of the light-emitting unit 310. A protective layer 700 is prepared in step S03. An isolation structure 200 is prepared in step S04. The isolation structure 200 can isolate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the development and use of precision photomasks and lowering the preparation cost. The portion of the isolation structure 200 within the vias 810 is relatively thin and easily over-etched by subsequent etching processes, exposing the first electrode 410 and causing damage to the first electrode 410 by subsequent wet etching processes. Therefore, a protective layer 700 is provided, which includes a protective portion 710. At least a portion of the via 810 is projected onto the substrate 100 within the projection of the protective portion 710 onto the substrate 100. The protective portion 710 can cover a portion of the area where the via 810 is located, thereby protecting the first electrode 410 within the via 810. This avoids damage to the first electrode 410 within the via 810 caused by the wet etching solution during the fabrication of the isolation opening 240, ensuring the structural integrity of the first electrode 410 within the via 810, providing a stable electrical signal to the first electrode 410, improving the dark spot problem of the display panel 10, and thus improving the display reliability and performance of the display panel 10.

[0187] In some optional embodiments, prior to step S03, the method further includes:

[0188] A pixel definition material layer is prepared on the side of the first electrode layer 400 facing away from the substrate 100.

[0189] The steps for preparing the protective layer 700 include: preparing the protective layer 700 on the side of the pixel definition material layer facing away from the substrate 100;

[0190] Alternatively, between the step of preparing the protective layer 700 on the side of the first electrode layer 400 facing away from the substrate 100 and the step of preparing the isolation structure 200 on the side of the protective layer 700 facing away from the substrate 100, the method further includes:

[0191] A pixel definition material layer is prepared on the side of the protective layer 700 facing away from the substrate 100;

[0192] The steps for fabricating the isolation structure 200 include: fabricating the isolation structure 200 on the side of the pixel definition material layer facing away from the substrate 100.

[0193] In these optional embodiments, the protective layer 700 is prepared before or after the pixel defining material layer. That is, the protective part 710 is located between the first electrode 410 and the pixel defining part 510 or between the pixel defining part 510 and the isolation structure 200. Both of these positions allow the protective part 710 to cover the area where the via 810 is located, thereby protecting the first electrode 410 within the via 810. This avoids damage to the first electrode 410 within the via 810 caused by the wet etching solution during the preparation of the isolation opening 240, ensuring the structural integrity of the first electrode 410 within the via 810, providing a stable electrical signal to the first electrode 410, improving the dark spot problem of the display panel 10, and thus improving the display reliability and performance of the display panel 10.

[0194] In some optional embodiments, the method for manufacturing the display panel 10 further includes:

[0195] The pixel definition material layer is patterned to form a pixel definition layer 500. The pixel definition layer 500 includes a pixel limiting part 510 and a pixel opening 520 formed by the pixel limiting part 510. The pixel opening 520 is connected to the isolation opening 240.

[0196] In these optional embodiments, the pixel definition layer 500 includes a pixel defining portion 510 and a pixel opening 520 formed by the pixel defining portion 510, used to define the light-emitting area of ​​the display panel 10. The pixel opening 520 is connected to the isolation opening 240 to reduce the occlusion of the pixel opening 520 by the isolation structure 200 and ensure the light-emitting effect of the display panel 10. The step of patterning the pixel definition material layer is performed after step S03.

[0197] In some optional embodiments, the isolation opening 240 includes a first isolation opening 241 and a second isolation opening 242. The step of fabricating the isolation structure 200 on the side of the protective layer 700 facing away from the substrate 100 further includes:

[0198] Step S41: Prepare an isolation material layer on the side of the protective layer 700 away from the substrate 100, and pattern the isolation material layer to form an isolation material layer with a first isolation opening;

[0199] Step S42: Prepare at least a portion of the film layer of the first light-emitting device located within the first isolation opening; this step may further include: preparing an encapsulation portion 620 on the side of the first light-emitting device away from the substrate 100. The at least portion of the film layer of the light-emitting device includes the light-emitting layer 300 corresponding to the light-emitting unit 310 and the second electrode 610. For example, between steps S41 and S42: pattern the pixel definition material layer to form a pixel opening 520 corresponding to the first light-emitting device.

[0200] Step S43: Pattern the isolation material layer with the first isolation opening 241 to form an isolation material layer with the second isolation opening 242;

[0201] Step S44: Prepare at least a portion of the film layer of the second light-emitting device located within the second isolation opening. This step may further include: preparing an encapsulation portion 620 on the side of the second light-emitting device away from the substrate 100. For example, the first light-emitting device and the second light-emitting device emit different colors. For example, between steps S43 and S44: pattern the pixel definition material layer to form a pixel opening 520 corresponding to the second light-emitting device. The light-emitting color of the first light-emitting device may be one of red, green, and blue. The light-emitting color of the second light-emitting device may be one of red, green, and blue.

[0202] In these optional embodiments, the first isolation opening 241 and the second isolation opening 242 are etched in stages, that is, the isolation material layer is wet-etched multiple times. Multiple wet etching makes it easier to etch and hollow out the isolation structure 200 at the via 810, resulting in the partial loss of the isolation structure 200 and the exposure of the pixel definition layer 500. Subsequent etching steps will cause over-etching of the pixel definition layer 500, making the first electrode 410 exposed and etched. Therefore, in the process of wet etching the isolation material layer multiple times, a protective part 710 is provided. The protective part 710 can cover part of the area where the via 810 is located, thereby protecting the first electrode 410 in the via 810 and avoiding the problem of the first electrode 410 being exposed and etched.

[0203] Optionally, step S42 can be performed before step S43. Alternatively, step S42 can be performed after step S43, with the first and second isolation openings in steps S43 and S41 being prepared simultaneously.

[0204] In some optional embodiments, the isolation opening 240 further includes a third isolation opening 243, and the method for manufacturing the display panel 10 further includes:

[0205] Step S45: Pattern the isolation material layer with the second isolation opening 242 to form an isolation material layer with the third isolation opening 243;

[0206] Step S46: Prepare at least a portion of the film layer of the third light-emitting device located within the third isolation opening 243. This step may further include: preparing an encapsulation portion 620 on the side of the third light-emitting device away from the substrate 100. For example, the first, second, and third light-emitting devices emit different colors. For example, between steps S45 and S46: pattern the pixel definition material layer to form a pixel opening 520 corresponding to the third light-emitting device. The emission color of the third light-emitting device may be one of red, green, or blue.

[0207] Optionally, the plurality of first isolation openings 241 include first sub-isolation openings and second sub-isolation openings. In the step of patterning the isolation material layer to form an isolation material layer with the first isolation openings, the method further includes:

[0208] Step S411: Pattern the isolation material layer to form an isolation material layer with a first sub-isolation opening;

[0209] Step S412: Pattern the insulating material layer with the first sub-isolation opening to form an insulating material layer with the first sub-isolation opening and the second sub-isolation opening;

[0210] The first light-emitting device includes a first sub-light-emitting device and a second sub-light-emitting device. The step of fabricating the first light-emitting device located within the first isolation opening 241 further includes:

[0211] Step S421: Prepare at least a portion of the film layer of the first sub-light-emitting device located within the first sub-isolation opening; this step may further include: preparing an encapsulation portion 620 of the first sub-light-emitting device on the side away from the substrate. Step S421 may be located between steps S411 and S412. For example, between steps S411 and S421: pattern the pixel definition material layer to form a pixel opening 520 corresponding to the first sub-light-emitting device.

[0212] Step S422: Prepare at least a portion of the film layer of the second sub-light-emitting device located within the second sub-isolation opening. This step may further include: preparing an encapsulation portion 620 on the side of the second sub-light-emitting device away from the substrate 100. For example, the first and second sub-light-emitting devices emit different colors. For example, between steps S412 and S422: pattern the pixel definition material layer to form a pixel opening 520 corresponding to the second sub-light-emitting device.

[0213] In these optional embodiments, the fabrication of the first isolation opening 241 is performed in two steps: multiple wet etching of the isolation material layer to form a first sub-isolation opening and a second sub-isolation opening. The first sub-isolation opening is used to set the first light-emitting unit corresponding to the first sub-light-emitting device, and the second sub-isolation opening is used to set the second light-emitting unit corresponding to the second sub-light-emitting device. Multiple wet etching makes it easier to etch and hollow out the isolation structure 200 at the via 810, resulting in partial loss of the isolation structure 200 and exposure of the pixel definition layer 500. Subsequent etching steps will cause over-etching of the pixel definition layer 500, exposing the first electrode 410 and causing etching damage. Therefore, in the process of multiple wet etching of the isolation material layer, a protective part 710 is provided. The protective part 710 can cover part of the area where the via 810 is located, thereby protecting the first electrode 410 within the via 810 and avoiding the problem of the first electrode 410 being exposed and damaged by etching. The first sub-light-emitting device and the second sub-light-emitting device emit different colors. The emission color of the first sub-light-emitting device can be one of red, green, or blue. The light-emitting color of the second sub-light-emitting device can be one of red, green, or blue.

[0214] Optionally, in the step of patterning the insulating material layer to form an insulating material layer with a first insulating opening 241, the method further includes:

[0215] The isolation material layer is patterned to form an isolation material layer with a first sub-isolation opening and a second sub-isolation opening;

[0216] The method further includes the following steps in fabricating the first light-emitting device located within the first isolation opening 241:

[0217] Prepare at least a portion of the film layer of the first sub-light-emitting device located within the first sub-isolation opening;

[0218] Prepare at least a portion of the film layer of the second sub-light-emitting device located within the second sub-isolation opening.

[0219] In these optional embodiments, the fabrication of the first sub-isolation opening and the second sub-isolation opening is performed simultaneously, i.e., the isolation material layer is etched once (e.g., wet etching) to form the first and second sub-isolation openings. The first sub-isolation opening is used to set the first light-emitting unit corresponding to the first sub-light-emitting device, and the second sub-isolation opening is used to set the second light-emitting unit corresponding to the second sub-light-emitting device. The first and second isolation openings are formed in two steps. Multiple wet etching steps are more likely to etch and hollow out the isolation structure 200 at the via 810, resulting in the partial loss of the isolation structure 200 and the exposure of the pixel definition layer 500. Subsequent etching steps will cause over-etching of the pixel definition layer 500, exposing the first electrode 410 and causing etching damage. Therefore, in the process of multiple etching (e.g., wet etching) of the isolation material layer, a protective part 710 is provided. The protective part 710 can cover the part of the area where the via 810 is located, thereby protecting the first electrode 410 within the via 810 and avoiding the problem of the first electrode 410 being exposed and damaged by etching.

[0220] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0221] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

[0222] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate; a planarization layer on the substrate, a via hole being formed in the planarization layer; a first electrode layer on a side of the planarization layer away from the substrate, the first electrode layer comprising a plurality of first electrodes spaced apart from each other, and a portion of the first electrodes being located in the via hole; a protection layer on a side of the first electrode layer away from the substrate, the protection layer comprising a protection portion, and at least a portion of the via hole being located in a projection of the protection portion on the substrate; an isolation structure on a side of the protection layer away from the substrate, the isolation structure enclosing an isolation opening, and at least a portion of the first electrodes being exposed by the isolation opening.

2. The display panel of claim 1, wherein, The projection of the protection portion on the substrate and the projection of the first electrodes on the substrate at least partially overlap; Preferably, the projection of the protection portion on the substrate is located within the projection of the first electrodes on the substrate.

3. The display panel of claim 1, wherein, At least a portion of the protection portion is located in the via hole.

4. The display panel of claim 3, wherein, The first electrodes are recessed in the via hole to form a first recess, and at least a portion of the protection portion is located in the first recess; Preferably, the protection portion is located on a side of the first electrodes away from the substrate and is in contact with the first electrodes; and / or, the projection of the first recess on the substrate is located within the projection of the protection portion on the substrate.

5. The display panel of claim 4, wherein, A distance between a surface of the protection portion away from the substrate and the substrate is a first distance, a distance between a surface of the first electrodes away from the substrate and the substrate is a second distance, and the first distance is greater than or equal to a maximum value of the second distance.

6. The display panel of claim 1, wherein, The projection of the via hole on the substrate is located within the projection of the protection portion on the substrate; Preferably, the projection of the via hole on the substrate is located within the projection of the isolation structure on the substrate; Preferably, the projection of the via hole on the substrate is located outside the projection of the isolation opening on the substrate.

7. The display panel of claim 1, wherein, The display panel further comprises: a pixel definition layer between the first electrode layer and the isolation structure, the pixel definition layer comprising a pixel limiting portion and a pixel opening enclosed by the pixel limiting portion, and the pixel opening being in communication with the isolation opening; Preferably, the isolation structure is located on a side of the pixel limiting portion away from the substrate; Preferably, a material of the pixel definition layer is an inorganic insulating material.

8. The display panel of claim 7, wherein, The protection layer is between the pixel definition layer and the first electrode layer; Preferably, a material of the protection portion is an organic insulating material; or, a material of the protection portion is an organic conductive material, and the protection portion is electrically connected with the first electrodes.

9. The display panel of claim 7, wherein, The protection layer is between the pixel definition layer and the isolation structure; Preferably, a material of the protection portion is an organic insulating material; or, a material of the protection portion is an organic conductive material, and the protection portion is electrically connected with the isolation structure.

10. The display panel of claim 9, wherein, The pixel limiting portion is recessed in the via hole to form a second recess, and at least a portion of the protection portion is located in the second recess; Preferably, the projection of the second recess on the substrate is located within the projection of the protection portion on the substrate.

11. The display panel of claim 9, wherein, A distance between a surface of the protection portion facing away from the substrate and the substrate is a third distance, and a distance between a surface of the pixel defining portion facing away from the substrate and the substrate is a fourth distance, the third distance being greater than or equal to a maximum value of the fourth distance.

12. The display panel of claim 1, wherein, The material of the protection portion comprises at least one of an organic material, an inorganic material, or a metal material. Preferably, the material of the protection portion is an organic material. Preferably, the material of the protection portion is an organic conductive material or an organic insulating material. Preferably, the material of the protection portion is the same as the material of the planarization layer.

13. The display panel of claim 1, wherein, The surface of the protection portion facing away from the substrate has a planar region and an arc region located on a side of the planar region. Preferably, the planar region and the arc region are tangent to each other.

14. The display panel of claim 1, wherein, The display panel further comprises: A light-emitting layer located on a side of the first electrode layer facing away from the substrate, the light-emitting layer comprising a plurality of spaced light-emitting units, the light-emitting units being located in the isolation openings; Preferably, the display panel further comprises: A second electrode layer located on a side of the light-emitting layer facing away from the substrate, the second electrode layer comprising second electrodes located in the isolation openings, the second electrodes being electrically connected to the isolation structures; Preferably, a projection of the light-emitting units on the substrate is located within a projection of the second electrodes on the substrate. Preferably, the display panel further comprises: a first encapsulation layer located on a side of the second electrode layer facing away from the substrate, the first encapsulation layer comprising a plurality of spaced encapsulation portions; Preferably, a projection of the encapsulation portions on the substrate is located outside a projection of the via holes on the substrate. Preferably, a projection of the encapsulation portions on the substrate is located outside a projection of the protection portions on the substrate. Preferably, the encapsulation portions extend to a side of the isolation structures away from the substrate through the isolation structures towards sidewalls of the isolation openings. Preferably, the first encapsulation layer is an inorganic layer. Preferably, the display panel further comprises: a second encapsulation layer located on a side of the first encapsulation layer away from the substrate. Preferably, the display panel further comprises: a third encapsulation layer located on a side of the second encapsulation layer away from the substrate. Preferably, the second encapsulation layer is an organic layer, and / or the third encapsulation layer is an inorganic layer.

15. The display panel of claim 1, wherein, At least part of the protection portion is located in the via hole. And / or, the display panel further comprises a conductive layer located between the substrate and the planarization layer and comprising a conductive portion, the conductive portion being electrically connected to the first electrode through the via hole. And / or, the material of the planarization layer is an organic insulating material. And / or, the display panel further comprises a light-emitting device, at least part of the light-emitting device being located in a corresponding isolation opening, the light-emitting device comprising the first electrode, a light-emitting unit, and a second electrode stacked in sequence in a direction away from the substrate. And / or, the display panel further comprises a driving circuit layer located between the substrate and the planarization layer, the driving circuit layer comprising a pixel circuit, the pixel circuit being electrically connected to the first electrode through the via hole.

16. The display panel of claim 1, wherein, The isolation structure comprises a first sub-layer and a second sub-layer, the second sub-layer is located on the side of the first sub-layer away from the substrate, and the side of the first sub-layer away from the substrate is located within the projection of the second sub-layer on the substrate; Preferably, the first sub-layer comprises a conductive material; Preferably, the second sub-layer comprises a conductive material or an insulating material; Preferably, the first sub-layer and the second sub-layer both comprise a metal material, and the materials of the first sub-layer and the second sub-layer are different; Preferably, the isolation structure further comprises a third sub-layer located on the side of the first sub-layer facing the substrate, and the projection of the first sub-layer on the substrate is located within the projection of the third sub-layer on the substrate.

17. A display device comprising: The display panel comprises the display panel of any one of claims 1-16.

18. A method for manufacturing a display panel, characterized by, The method comprises: preparing a planarization layer on a substrate, the planarization layer being provided with a via hole; preparing a first electrode layer on the side of the planarization layer away from the substrate, the first electrode layer comprising a plurality of first electrodes spaced apart from each other, and part of the first electrodes being located in the via hole; preparing a protection layer on the side of the first electrode layer away from the substrate, the protection layer comprising a protection portion, and at least part of the via hole being located within the projection of the protection portion on the substrate; preparing an isolation structure on the side of the protection layer away from the substrate, the isolation structure enclosing an isolation opening, and at least part of the first electrode being exposed by the isolation opening.

19. The method of claim 18, wherein, Before the step of preparing the protection layer on the side of the first electrode layer away from the substrate, the method further comprises: preparing a pixel definition material layer on the side of the first electrode layer away from the substrate, the step of preparing the protection layer comprises: preparing the protection layer on the side of the pixel definition material layer away from the substrate; or, between the step of preparing the protection layer on the side of the first electrode layer away from the substrate and the step of preparing the isolation structure on the side of the protection layer away from the substrate, the method further comprises: preparing a pixel definition material layer on the side of the protection layer away from the substrate; the step of preparing the isolation structure comprises: preparing the isolation structure on the side of the pixel definition material layer away from the substrate; Preferably, the method further comprises: patterning the pixel definition material layer to form a pixel definition layer, the pixel definition layer comprising a pixel limiting portion and a pixel opening enclosed by the pixel limiting portion, and the pixel opening being in communication with the corresponding isolation opening.

20. The method of claim 18, wherein, The isolation opening comprises a first isolation opening and a second isolation opening, and in the step of preparing the isolation structure on the side of the protection layer away from the substrate, the method further comprises: preparing an isolation material layer on the side of the protection layer away from the substrate, and patterning the isolation material layer to form an isolation material layer with a first isolation opening; preparing at least part of a film layer of a first light emitting device located in the first isolation opening, and preparing an encapsulation portion of the first light emitting device away from the substrate; performing a patterning process on the isolation material layer with the first isolation openings to form an isolation material layer with second isolation openings; preparing at least part of a film layer of a second light emitting device in the second isolation openings, and preparing an encapsulation part of the second light emitting device away from the substrate side; Preferably, the isolation openings further comprise third isolation openings, and the method further comprises: performing a patterning process on the isolation material layer with the second isolation openings to form an isolation material layer with third isolation openings; preparing at least part of a film layer of a third light emitting device in the third isolation openings, and preparing an encapsulation part of the third light emitting device away from the substrate side.

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