Display device

Abstract

A display device according to an embodiment of the present disclosure may include a substrate including a display area and a non-display area outside the display area, a thin film transistor on the substrate, a sub-pixel connected to the thin film transistor, an encapsulation layer disposed on the sub-pixel, a first sensor electrode disposed on the encapsulation layer, a touch sensor includes a first sensor electrode, a touch interlayer insulating layer disposed on the first sensor electrode, and a second sensor electrode disposed on the touch interlayer insulating layer and electrically connected with the first sensor electrode through a contact hole in the touch interlayer insulating layer.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0117946, filed on August 30, 2024, which is incorporated herein by reference for all purposes as if fully stated herein. Technical Field

[0003] This disclosure relates to a display device. Background Technology

[0004] The advent of the information age has led to rapid development in the field of displays that visually display electrical information signals, as well as stable research efforts to develop compact and lightweight low-power displays while improving display performance.

[0005] Exemplary display devices include liquid crystal displays (LCDs), electrowetting displays (EWDs), and organic light-emitting displays (OLEDs).

[0006] Unlike liquid crystal displays (LCDs), electroluminescent displays, being self-emissive, do not require a separate light source and can be manufactured in a thin and lightweight form. Furthermore, electroluminescent displays not only offer advantages in power consumption due to their low-voltage operation, but also boast excellent color performance, response speed, viewing angle, and contrast ratio (CR), thus making them suitable for a wide range of applications. Summary of the Invention

[0007] The embodiments of this disclosure can provide a display device with increased freedom in the arrangement of touch electrodes.

[0008] Embodiments of this disclosure may provide a display device with enhanced touch sensing capabilities.

[0009] A display device according to an embodiment of the present disclosure may include: a substrate including a display area and a non-display area outside the display area; a thin-film transistor on the substrate; a sub-pixel connected to the thin-film transistor; an encapsulation layer disposed on the sub-pixel; a first sensor electrode formed of the same layer as a first sensor electrode layer on the encapsulation layer; a touch interlayer insulating layer disposed on the first sensor electrode layer; and a second sensor electrode formed of the same layer as a second sensor electrode layer on the touch interlayer insulating layer, and electrically connected to the first sensor electrode through a contact hole in the touch interlayer insulating layer.

[0010] A display device according to embodiments of the present disclosure may include a substrate, a plurality of sensor electrodes, and a black matrix on the plurality of sensor electrodes. The black matrix may include a first portion having a first width and a second portion having a second width greater than the first width. The plurality of sensor electrodes may include a first sensor electrode overlapping the first portion and a second sensor electrode overlapping the second portion. The first sensor electrode may be positioned closer to the substrate than the second sensor electrode.

[0011] According to embodiments of the present disclosure, a display device can be provided that can minimize light-induced defects by including different touch sensor layers in the display area.

[0012] According to embodiments of this disclosure, a display device can be provided that has freedom in the design of the upper black matrix by applying an insulating layer capable of planarizing the upper touch electrodes between touch sensor layers.

[0013] The purpose of this disclosure is not limited to the foregoing, and other purposes not mentioned will be apparent to those skilled in the art from the following description. Attached Figure Description

[0014] The above and other objects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0015] Figure 1 This is a plan view illustrating a display device according to an embodiment of the present disclosure;

[0016] Figure 2 This is an exploded perspective view showing the arrangement structure of touch electrodes in a display device according to an embodiment of the present disclosure;

[0017] Figure 3 This is a plan view illustrating the structure of touch electrodes disposed on a touch sensor layer according to an embodiment of the present disclosure;

[0018] Figure 4 This is a plan view showing the touch sensor, where Figure 3 Part of X1 is magnified;

[0019] Figure 5 It is along Figure 4 A cross-sectional view taken by line A-A';

[0020] Figure 6 It is along Figure 4 A cross-sectional view taken from line C-C';

[0021] Figure 7 It is along Figure 4 A cross-sectional view taken from line B-B';

[0022] Figure 8 This is a plan view illustrating a display device according to an embodiment of the present disclosure;

[0023] Figure 9 This is a plan view illustrating a display device according to an embodiment of the present disclosure;

[0024] Figure 10 It is along Figure 8 A cross-sectional view taken from line D-D';

[0025] Figure 11 It is along Figure 8 A cross-sectional view taken from line E-E'; and

[0026] Figure 12 It is along Figure 8 The cross-sectional view taken by line F-F'. Detailed Implementation

[0027] Some embodiments of this disclosure are described in detail below with reference to the exemplary accompanying drawings. When assigning reference numerals to components in each drawing, the same components may be assigned the same reference numerals, even if they are shown in different drawings. Detailed descriptions of known techniques or functions may be omitted when it is determined that this would obscure the subject matter of the disclosure. As used herein, when a component “comprises,” “has,” or “is composed of another component,” that component may include other components, unless that component “only” includes, has, or is composed of another component. As used herein, the singular forms “a,” “an,” and “described” are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0028] Furthermore, in describing the components of this disclosure, terms such as first, second, A, B, (a), and (b) may be used. These designations are used only to distinguish one component from another, and the nature, order, or number of components is not limited by these designations.

[0029] When describing the positional relationship between components, when two or more components are described as “connected,” “coupled,” or “linked,” the two or more components may be directly “connected,” “coupled,” or “linked,” or another component may intervene. Here, other components may be included in one or more of the two or more components that are “connected,” “coupled,” or “linked” to each other.

[0030] When terms such as “after,” “next,” and “before” are used to describe time-flow relationships related to components, operating methods, and manufacturing methods, they may include discontinuous relationships unless the terms “immediately” or “directly” are used.

[0031] When a component is specified with a value or its corresponding information (e.g., level), the value or corresponding information can be interpreted to include tolerances that may occur due to various factors (e.g., process factors, internal or external influences, or noise).

[0032] Various embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0033] Figure 1 This is a plan view illustrating a display device according to an embodiment of the present disclosure.

[0034] refer to Figure 1 The display device 100 according to the embodiments of the present disclosure may include a substrate 110.

[0035] The substrate 110 can be configured to support various components included in the display device 100. The substrate 110 can be formed of an insulating material. Alternatively, the substrate 110 can be formed of a transparent material. Furthermore, the substrate 110 can be a rigid substrate or a flexible substrate capable of being bent, folded, and rolled. Additionally, the substrate 110 can be formed of a flexible glass or plastic material. For example, if the substrate 110 is formed of polyimide (PI) as a plastic material, the manufacturing process of the display device 100 can be performed with a support substrate formed of glass disposed below the substrate 110, and the support substrate can be released after the manufacturing process of the display device 100 is completed. When the substrate 110 is formed of a double layer of polyimide (PI) as a plastic material, an insulating layer can be formed between the two layers of the substrate 110. The insulating layer between the substrates 110 can include an inorganic material. For example, the insulating layer between the substrates 110 can include silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0036] like Figure 1 As shown, the substrate 110 of the display device 100 can be defined as a display area DA and a non-display area NA. The non-display area NA is outside the display area DA and does not contain multiple pixels P. The non-display area NA can be adjacent to the display area DA, or it can be located outside the display area DA.

[0037] The display area DA of the substrate 110 can be an area in which pixels P are disposed to display images. Multiple sub-pixels SP1, SP2 and SP3 can be disposed in the display area DA, and multiple sub-pixels SP1, SP2 and SP3 can constitute a pixel P.

[0038] For example, a pixel P may include three or more sub-pixels SP that emit light of different wavelengths to achieve different colors. For example, in the display device 100 according to an embodiment of the present disclosure, a pixel P may include sub-pixels SP that emit red light, green light, and blue light. However, the number of sub-pixels SP included in a pixel P is not limited; for example, in addition to sub-pixels SP that emit red light, green light, and blue light, it may further include sub-pixels SP that emit white light.

[0039] The non-display area NA of substrate 110 can be defined as the peripheral area surrounding the display area DA, the curved area BA extending and bending from one side of the peripheral area, and the pad area PA extending from the curved area BA. Figure 2 The state of the substrate 110 before bending is shown.

[0040] The non-display area NA of the substrate 110 is the area in which various lines, circuits, etc., for driving sub-pixels SP1, SP2, and SP3 disposed in the display area DA are provided. Since the non-display area NA is not an area for displaying an image, it does not need to be visually identified from the front of the display device 100. Therefore, a portion of the non-display area NA of the substrate 110 can be bent toward the rear surface of the display device 100, for example, bent in the direction of the rear surface of the display device 100, such that one edge of the substrate 110 has a predetermined curvature. In this case, the pad area PA can be positioned to overlap with the display area DA on the rear surface of the display device 100. Therefore, the non-display area NA can be reduced while ensuring sufficient area for lines and driving circuits.

[0041] When the substrate 110 includes an insulating layer formed of polyimide (PI) as a plastic material, the polyimide (PI) insulating layer may not be provided in the bending region BA. For example, in the bending region BA, the substrate 110 may not include an insulating layer formed of polyimide (PI), or the insulating layer may be patterned. For example, if an insulating layer comprising inorganic materials is included in the bending region BA, stress may concentrate in the insulating layer comprising inorganic materials, thereby leading to cracking.

[0042] The pad portion 114 can be disposed in the pad area PA of the substrate 110. The pad portion 114 can be a metal pattern that bonds to an external module (e.g., a flexible printed circuit board (FPCB), a chip-on-film (COF), etc.). Although Figure 2 The pad portion 114 is shown to be located on one side of the non-display area NA, but its shape and arrangement are not limited thereto.

[0043] Furthermore, the connecting line 116 may be disposed in a portion of the non-display area NA of the substrate 110. For example, the connecting line 116 may be disposed in a region adjacent to the curved region BA in the peripheral region of the substrate 110.

[0044] The connection line 116 can transmit signals (e.g., voltage) from an external module bonded to the pad portion 114 to a circuit unit, such as a gate driving unit 112 or gate driver included in the display area DA. The gate driving unit 112 provides gate signals to the thin-film transistors of the pixel driving circuitry and includes various gate driving circuits. In a display device 100 according to an embodiment of the present disclosure, the gate driving unit 112 may be an in-board gate (GIP) in which the gate driving circuitry is directly formed on the substrate 110.

[0045] Various signals and voltages, such as gate signals, data signals, high-potential voltages, and low-potential voltages, can be transmitted via connection line 116. Connection line 116 can be classified as power connection line and / or signal connection line according to the voltage and / or signal transmitted. In this case, the power connection line can transmit voltage supplied from an external module to the display area DA. The power connection line can be connected to, but is not limited to, the low-potential voltage line VSS, the high-potential voltage line VDD, and the gate low-voltage line and / or gate high-voltage line included in the gate drive unit 112. Furthermore, the signal connection line can send signals for image display provided from an external module to the display area DA. The signal connection line can be connected to gate lines and / or data lines, but is not limited to.

[0046] Furthermore, the dam 117 can be disposed in the non-display area NA of the substrate 110 to surround all or part of the display area DA. In this case, the dam 117 can be disposed adjacent to the display area DA, or it can be disposed outside the display area DA. The dam 117 can be disposed along the periphery of the display area DA to control the flow of the layer including organic material in the encapsulation layer disposed on the light-emitting element. The number of dams 117 can be one or more.

[0047] Furthermore, a crack detection line (panel crack detector) 118 may be further disposed in the non-display area NA of the substrate 110. The crack detection line 118 may be disposed between the endpoint (or end) of the substrate 110 and the dam 117. Additionally, the crack detection line 118 may be disposed below the dam 117 to at least partially overlap with the dam 117. The crack detection line 118 may be disposed outside the display device 100 to detect defects (e.g., cracks) that may occur outside the display device 100.

[0048] Furthermore, the display device 100 according to the embodiments of the present disclosure may further include a touch detection unit and a touch sensing circuit. The touch detection unit includes a plurality of touch electrodes, and the touch sensing circuit provides a touch driving signal to the touch detection unit and senses whether the user's touch is present and the touch position (or coordinates) by detecting the touch sensing signal from the touch detection unit.

[0049] For example, a touch sensing circuit may include, for instance, a touch driving circuit and a touch controller. The touch driving circuit provides a touch driving signal to a touch detection unit and detects touch sensing signals from the touch detection unit. The touch controller senses the presence and / or location of a user's touch based on the touch sensing signals detected by the touch driving circuit. The touch driving circuit and the touch controller may be implemented as separate components, or in some cases, they may be integrated into a single component.

[0050] One or more of the circuit components for touch sensing and one or more of the components for display driving can be functionally integrated to be implemented as one or more components. For example, data drivers and touch driving circuitry can be implemented by integrating them into one or more integrated circuit chips. When data drivers and touch driving circuitry are implemented as integrated into two or more integrated circuit chips, each of the two or more integrated circuit chips can have both data driving and touch driving functions.

[0051] Figure 2 This is an exploded perspective view showing the arrangement structure of touch electrodes in a display device according to an embodiment of the present disclosure.

[0052] refer to Figure 2 The display device 100 according to embodiments of the present disclosure may include a substrate 110 and a touch electrode layer TSL. On the substrate 110, a plurality of sub-pixels SP are disposed in a display area DA. The touch electrode layer TSL is disposed on the substrate 110 and includes a plurality of touch electrodes TE. Furthermore, the display device 100 may include a color filter layer CFL disposed on the touch electrode layer TSL and including a plurality of color filters and a black matrix located between the color filters in a plane.

[0053] The display area DA of the substrate 110 is an area provided with multiple pixels to realize an image, and a pixel may include multiple sub-pixels SP. Each sub-pixel SP includes a light-emitting element 200 and a pixel driving circuit for controlling the amount of current flowing to the light-emitting element 200. The pixel driving circuit may include multiple thin-film transistors (TFTs).

[0054] In the embodiments of this disclosure, it is assumed that the display device 100 is an organic light-emitting display device, but this disclosure is not limited thereto. For example, when the display device 100 is an organic light-emitting display device, the sub-pixel may include a light-emitting element 200, which includes an anode electrode, a light-emitting layer on the anode electrode, and a cathode electrode on the light-emitting layer. In this case, the light-emitting element 200 may include an organic light-emitting layer as the light-emitting layer, and may further include a hole transport layer, a hole injection layer, an electron injection layer, an electron transport layer, and the organic light-emitting layer. Meanwhile, as another example, when the display device 100 is a liquid crystal display device, it may be configured to include a liquid crystal layer as a display unit.

[0055] refer to Figure 2 The pixel driving circuit of the sub-pixel SP according to embodiments of the present disclosure may include a driving transistor DT, a switching transistor ST, a capacitor Cst, a gate line GL, a data line DL, and lines connected to power supplies VDD and VSS for pixel driving.

[0056] The light-emitting element 200 can operate to emit light according to the drive current generated by the driving transistor DT. The switching transistor ST can perform a switching operation in response to the gate signal supplied through the gate line GL, so that the data signal supplied through the data line DL is stored as a data voltage in the capacitor Cst. The driving transistor DT can operate in response to the data voltage stored in the capacitor Cst, so that a predetermined drive current flows between the high-potential power supply VDD and the low-potential power supply VSS.

[0057] The above has described an example of a 2T (transistor) 1C (capacitor) structure in a display device 100 according to an embodiment of the present disclosure, in which a sub-pixel SP is configured to include a switching transistor ST, a driving transistor DT and a capacitor Cst.

[0058] As another example, such as Figure 2 As shown, the sub-pixel may further include a compensation circuit 135.

[0059] The compensation circuit 135 is a circuit used to compensate the threshold voltage of the driving transistor DT, and the compensation circuit 135 may include one or more thin-film transistors and capacitors. In this case, the configuration and structure of the compensation thin-film transistors and compensation capacitors are not limited, but can vary depending on the compensation method. For example, when the compensation circuit 135 is added to a sub-pixel, it can have various structures such as 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, 7T2C, etc.

[0060] Figure 3 This is a plan view illustrating the structure of a touch electrode disposed on a touch electrode layer according to an embodiment of the present disclosure.

[0061] refer to Figure 3 The display device 100 may include a plurality of touch electrodes TE and bridge electrodes BE1 and BE2 electrically connected to the sensor electrodes of the plurality of touch electrodes TE.

[0062] For example, such as Figure 3 As shown, each of the plurality of touch electrodes TE may include a plurality of first touch electrodes TE1 extending in a first direction and a plurality of second touch electrodes TE2 extending in a second direction intersecting the first direction. In this case, a plurality of first touch routing lines respectively connected to the plurality of first touch electrodes TE1, a plurality of second touch routing lines respectively connected to the plurality of second touch electrodes TE2, and a plurality of touch pads respectively connected to the plurality of first touch routing lines and the plurality of second touch routing lines may be provided on the substrate 110.

[0063] Each of the plurality of first touch electrodes TE1 and the plurality of second touch electrodes TE2 may include a plurality of sensor electrodes SE1, SE2, SE3, and SE4. The plurality of sensor electrodes SE1, SE2, SE3, and SE4 may be electrically connected to form a mesh touch electrode. Although Figure 3 The first touch electrode TE1 and the second touch electrode TE2 are shown to have shapes in which sensor electrodes formed in a diamond grid pattern are continuously formed, but this disclosure is not limited thereto, and the sensor electrodes can have various shapes, such as triangles, squares, diamonds, and polygons. For example, each of the first touch electrode TE1 and the second touch electrode TE2 may include a plurality of sensor electrodes patterned in a grid shape.

[0064] Multiple sensor electrodes SE1, SE2, SE3, and SE4 can be formed in a grid pattern and may include an opening OA. The opening OA of the multiple sensor electrodes SE1, SE2, SE3, and SE4 may overlap with the sub-pixel SP.

[0065] Multiple sensor electrodes SE1, SE2, SE3, and SE4 can be formed on different sensor electrode layers SEL1 and SEL2. For example, multiple sensor electrodes SE1, SE2, SE3, and SE4 can be formed on the first sensor electrode layer SEL1 or the second sensor electrode layer SEL2. The relevant descriptions are as follows.

[0066] The display device 100 may include multiple touch electrodes TE, such as Figure 3 As shown in X, and each of the multiple touch electrodes TE may include multiple sensor electrodes SE, such as Figure 3 As shown in X1.

[0067] The display device 100 according to embodiments of the present disclosure can sense touch using a touch sensing method based on mutual capacitance, or it can sense touch using a touch sensing method based on self-capacitance.

[0068] In the case of a touch sensing method based on mutual capacitance, multiple touch electrodes TE can be classified as driving touch electrodes to which a touch driving signal is applied, and sensing touch electrodes to which a touch sensing signal is detected and forms a capacitance with the driving touch electrodes. For example, a first touch electrode TE1 can be a sensing touch electrode to which a touch sensing signal is sensed, and in this case, a second touch electrode TE2 can be a driving touch electrode to which a touch driving signal is applied, but is not limited thereto. In other words, the first touch electrode TE1 can be a driving touch electrode, and the second touch electrode TE2 can be a sensing touch electrode.

[0069] In a self-capacitance-based touch sensing method, multiple touch electrodes TE serve as both driving and sensing touch electrodes. In other words, the touch sensing circuit applies a touch driving signal to one or more touch electrodes TE, detects the touch sensing signal at the TE, and senses the presence or absence of a touch and / or touch coordinates by identifying, for example, a finger or pen pointer's capacitance change between the TE and the touch electrodes based on the detected touch sensing signal. In a self-capacitance-based touch sensing scheme, there is no distinction between driving and sensing touch electrodes. For example, multiple first touch electrodes TE1 and multiple second touch electrodes TE2 can both be used as driving and sensing touch electrodes.

[0070] Although an example of the structure of the sensor electrode of the first touch electrode TE1 has been described above, the sensor electrode of the second touch electrode TE2 can also have the same structure.

[0071] Figure 4 This is a plan view showing the sensor electrodes, where Figure 3 Part of X1 is magnified.

[0072] refer to Figure 4 The display device 100 may include sensor electrodes SE. The sensor electrodes SE may include a first sensor electrode SE1, a second sensor electrode SE2, a third sensor electrode SE3, and a fourth sensor electrode SE4. The first sensor electrode SE1, the second sensor electrode SE2, the third sensor electrode SE3, and the fourth sensor electrode SE4 may be formed on a sub-pixel SP and may be formed in a grid shape.

[0073] The first sensor electrode SE1 and the second sensor electrode SE2 can have the same shape. For example, the first sensor electrode SE1 and the second sensor electrode SE2 can have a rhomboid shape.

[0074] The size of the region of the first sensor electrode SE1 and the size of the region of the second sensor electrode SE2 can correspond to each other. The size of the first sensor electrode SE1 and the size of the second sensor electrode SE2 can correspond to the width of the opening of the first sensor electrode SE1 and the width of the opening of the second sensor electrode SE2, respectively.

[0075] Sub-pixel SP may include a first sub-pixel SP1, a second sub-pixel SP2, a third sub-pixel SP3, and a fourth sub-pixel SP4. For example, a first sensor electrode SE1 may correspond to the first sub-pixel SP1, a second sensor electrode SE2 may correspond to the second sub-pixel SP2, a third sensor electrode SE3 may correspond to the third sub-pixel SP3, and a fourth sensor electrode SE4 may correspond to the fourth sub-pixel SP4. For example, the first sub-pixel SP1 may be surrounded by the first sensor electrode SE1, the second sub-pixel SP2 may be surrounded by the second sensor electrode SE2, the third sub-pixel SP3 may be surrounded by the third sensor electrode SE3, and the fourth sub-pixel SP4 may be surrounded by the fourth sensor electrode SE4.

[0076] A black matrix BM can be formed on the sensor electrode SE. The black matrix BM can include multiple openings corresponding to the emission regions EA of multiple sub-pixels SP. For example, the opening of the black matrix BM corresponding to the first sub-pixel SP1 can be the first emission region EA1, the opening of the black matrix BM corresponding to the second sub-pixel SP2 can be the second emission region EA2, the opening of the black matrix BM corresponding to the third sub-pixel SP3 can be the third emission region EA3, and the opening of the black matrix BM corresponding to the fourth sub-pixel SP4 can be the fourth emission region EA4.

[0077] Multiple subpixels SP can have different pixel structures. For example, the first subpixel SP1 and the third subpixel SP3 can correspond to the blue (B) subpixel. For example, the second subpixel SP2 and the fourth subpixel SP4 can correspond to the red (R) subpixel.

[0078] The fifth sub-pixel SP5 can be configured into a shape surrounded by the first sub-pixel SP1, the second sub-pixel SP2, the third sub-pixel SP3, and the fourth sub-pixel SP4. For example, the fifth sub-pixel SP5 can be configured into a shape surrounded by the first sensor electrode SE1, the second sensor electrode SE2, the third sensor electrode SE3, and the fourth sensor electrode SE4. The opening of the black matrix BM corresponding to the fifth sub-pixel SP5 can be the fifth emission region EA5. The fifth emission region EA5 can be smaller than the first emission region EA1, the second emission region EA2, the third emission region EA3, and the fourth emission region EA4.

[0079] The first sensor electrode SE1 and the third sensor electrode SE3 can be formed from the first touch metal TM1, and the second sensor electrode SE2 and the fourth sensor electrode SE4 can be formed from the second touch metal TM2. The first touch metal TM1 can be formed from the same layer as the first sensor electrode layer SEL1, and the second touch metal TM2 can be formed from the same layer as the second sensor electrode layer SEL2.

[0080] Each of the first sub-pixel SP1, the second sub-pixel SP2, the third sub-pixel SP3, and the fourth sub-pixel SP4 can be surrounded by the same touch metal. For example, the first sub-pixel SP1 and the third sub-pixel SP3 can be surrounded by a first touch metal TM1 formed of the same layer as the first sensor electrode layer SEL1, and the second sub-pixel SP2 and the fourth sub-pixel SP4 can be surrounded by a second touch metal TM2 formed of the same layer as the second sensor electrode layer SEL2.

[0081] The fifth sub-pixel SP5 can be surrounded by different touch metals. For example, the fifth sub-pixel SP5 can be surrounded by a first touch metal TM1 formed of the same layer as the first sensor electrode layer SEL1 and a second touch metal TM2 formed of the same layer as the second sensor electrode layer SEL2.

[0082] Since multiple sub-pixels SP can have different pixel structures, the opening of the black matrix BM can have different shapes depending on the emission regions of the blue, green, and red sub-pixels, but is not limited thereto. For example, the opening of the black matrix BM can have different shapes depending on the emission region EA. For example, the first sub-pixel SP1 can be larger than the second sub-pixel SP2. Therefore, the opening of the black matrix BM corresponding to the first sub-pixel SP1 can be larger than the opening of the black matrix BM corresponding to the second sub-pixel SP2, but this disclosure is not limited thereto.

[0083] The first sensor electrode SE1 and the second sensor electrode SE2 can be formed from different layers. For example, the first sensor electrode SE1 can be formed below the second sensor electrode SE2. For example, the first sensor electrode SE1 can be formed on the first sensor electrode layer SEL1, and the second sensor electrode SE2 can be formed on the second sensor electrode layer SEL2. Examples of sensor electrodes SE being formed from different layers are described below.

[0084] The first sensor electrode SE1 and the second sensor electrode SE2 can be connected to each other through the contact hole CNT. For example, the first sensor electrode SE1 and the second sensor electrode SE2 can be electrically connected to each other through the contact hole CNT.

[0085] Although the relationship between the first sensor electrode SE1 and the second sensor electrode SE2 has been described according to embodiments of this disclosure, the disclosure is not limited thereto. For example, the third sensor electrode SE3 and the fourth sensor electrode SE4 may be formed from different layers, and the third sensor electrode SE3 may be formed below the fourth sensor electrode SE4.

[0086] The effect of forming the first sensor electrode SE1 and the second sensor electrode SE2 with different layers is described below.

[0087] Figure 5 It is along Figure 4 A cross-sectional view taken from line A-A'. Figure 6 It is along Figure 4 The cross-sectional view taken from line C-C'. Figure 7 It is along Figure 4 The cross-sectional view taken by line B-B'.

[0088] refer to Figures 4 to 7 In the display device 100 according to an embodiment of the present disclosure, a substrate layer SUB, a transistor layer TRL on the substrate layer SUB, a planarization layer PLN on the transistor layer TRL, a light-emitting element layer EDL on the planarization layer PLN, an encapsulation layer ENCAP on the light-emitting element layer EDL, a touch sensor layer TSL on the encapsulation layer ENCAP, and a color filter layer CFL on the touch sensor layer TSL can be stacked sequentially. In this case, a protective layer, an organic material layer, a polarizing layer, a cover layer, etc., can be additionally provided on the color filter layer CFL of the display device 100.

[0089] exist Figure 5 and Figure 6 As an example, two sub-pixels emitting light of different wavelengths are shown among multiple sub-pixels SP in the display area DA. However, apart from the different light-emitting stacks constituting the light-emitting element 200, the overall structure of the sub-pixel emitting another wavelength of light can be the same.

[0090] The substrate layer SUB includes a substrate 110 for supporting and protecting components of a display device disposed thereon.

[0091] For example, when the substrate 110 is formed of polyimide (PI), moisture may permeate through the substrate 110 formed of polyimide (PI) and travel to the thin-film transistor or light-emitting element, thereby degrading the performance of the display device 100. In order to prevent the performance degradation of the display device 100 due to moisture penetration, the display device 100 according to the embodiments of the present disclosure may employ a double polyimide (PI) structure as the substrate 110.

[0092] For example, substrate 110 may include a first substrate and a second substrate each formed of polyimide (PI), and an inorganic insulating layer formed between the first substrate and the second substrate. The inorganic insulating layer may be formed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx), or multiple layers thereof. For example, silicon dioxide (SiO2) material can be used as the inorganic insulating layer, but is not limited thereto, and it may be formed of a bilayer of silicon dioxide (SiO2) and silicon nitride (SiNx). The inorganic insulating layer prevents moisture from penetrating to the upper part of the second substrate. Furthermore, when the first substrate is charged with charge, the inorganic insulating layer can prevent the charge from affecting the upper thin-film transistor 300 via the second substrate. As described above, by using an inorganic insulating layer to block the charge in the lower polyimide (PI), the reliability of the product can be improved, and the process of forming a separate metal layer for blocking the charge can be omitted, thereby simplifying the process and reducing production costs.

[0093] As mentioned above Figure 1 As described, the substrate 110 may have different structures in the display area DA and the bending area BA. For example, the inorganic insulating layer between the first substrate and the second substrate may be patterned or removed in the bending area BA. When the inorganic insulating layer is provided in the bending area BA, stress caused by bending may concentrate, and therefore cracks may appear in the display device 100.

[0094] In addition, the substrate layer SUB may include a buffer layer 120 disposed on the substrate 110.

[0095] For example, buffer layer 120 may include a multi-buffer layer disposed on substrate 110 and an active buffer layer disposed on the multi-buffer layer. A metal layer that can serve as a light-shielding layer may be additionally disposed between the multi-buffer layer and the active buffer layer. This metal layer may be referred to as a light-blocking layer.

[0096] A thin-film transistor 300 including a driving transistor and at least one switching transistor, various patterns for forming at least one capacitor, various insulating films and various metal patterns can be disposed on the transistor layer TRL.

[0097] refer to Figure 5 The thin-film transistor 300 can be disposed on the buffer layer 120, and the thin-film transistor 300 may include an active layer 310, a gate electrode 330, a source electrode 350, and a drain electrode 370. In this case, Figure 5 The drain electrode 370 of the thin-film transistor 300 is shown to be electrically connected to the anode electrode 210 of the light-emitting element 200, which will be described below, but this disclosure is not limited thereto. In other words, depending on the design of the pixel driving circuit, the source electrode 350 can be the drain electrode, and the drain electrode 370 can be the source electrode.

[0098] The active layer 310 of the thin-film transistor 300 may include a channel region forming a channel when the thin-film transistor 300 is driven, a source region on two opposite sides of the channel region, and a drain region. The source region of the active layer 310 is connected to the source electrode 350, and the drain region is connected to the drain electrode 370. For example, the source and drain regions can be configured by ion doping (impurity doping) of the active layer 310. In this case, the source and drain regions can be generated by ion doping of polysilicon material, and the channel region may refer to the portion of polysilicon material left undoped, but this disclosure is not limited thereto.

[0099] A gate insulating layer 130 is disposed on the active layer 310. The gate insulating layer 130 may be disposed on the entire substrate 110 including the active layer 310. For example, the gate insulating layer 130 may be composed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx), or multiple layers thereof. The gate insulating layer 130 may have contact holes for connecting the source electrode 350 and the drain electrode 370 of the thin-film transistor 300 to the source region and drain region of the active layer 310 of the thin-film transistor 300, respectively.

[0100] The gate electrode 330 of the thin-film transistor 300 is disposed on the gate insulating layer 130. For example, the gate electrode 330 may be formed as a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), and neodymium (Nd) or alloys thereof. The gate electrode 330 may be formed on the gate insulating layer 130 to overlap with the channel region of the active layer 310 of the thin-film transistor 300.

[0101] An interlayer insulating layer 140 is disposed on the gate electrode 330. For example, the interlayer insulating layer 140 may be composed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or multiple layers thereof. Contact holes for exposing the source and drain regions of the active layer 310 of the thin-film transistor 300 may be formed in the interlayer insulating layer 140.

[0102] The inorganic layer 150 may be disposed on the interlayer insulating layer 140. The inorganic layer 150 may be a passivation layer for protecting the thin-film transistor 300 and may be omitted. For example, the inorganic layer 150 may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof.

[0103] In the planarization layer PLN, a planarization layer 160 comprising at least one layer is provided. The planarization layer 160 may be an organic layer used for planarizing and protecting the upper part of the thin-film transistor 300. For example, the planarization layer 160 may be formed of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0104] Although the planarization layer 160 shown in the embodiment of the present disclosure is formed as a single layer, the present disclosure is not limited thereto. For example, the planarization layer 160 may be formed as a double or triple layer. When the planarization layer 160 is formed as a double or triple layer, a metal layer may be formed between the planarization layers 160. The metal layer between the planarization layers 160 may electrically connect the lower transistor layer (TRL) and the upper light-emitting element layer (EDL) through contact holes. The metal layer between the planarization layers 160 may be a connection electrode, but is not limited thereto.

[0105] A light-emitting element 200, comprising an anode electrode 210, a light-emitting material layer 220, and a cathode electrode 230, is disposed on the light-emitting element layer EDL. Furthermore, a partition 400 for dividing the emission regions of multiple sub-pixels SP can be disposed on the light-emitting element layer EDL.

[0106] The anode electrode 210 of the light-emitting element 200 is disposed on the planarization layer 160. The anode electrode 210 may be formed of a metallic material and may be electrically connected to the thin-film transistor 300 through contact holes disposed in the planarization layer 160. For example, when the display device 100 according to an embodiment of the present disclosure is of the top-emitting type, light emitted from the light-emitting element 200 is emitted through the upper part of the substrate 110, and in this case, the anode electrode 210 may further include a transparent conductive layer and a reflective layer on the transparent conductive layer. For example, the transparent conductive layer may be formed of a transparent conductive oxide such as ITO or IZO, and the reflective layer may be formed of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof.

[0107] The barrier 400 is configured to cover the two opposite ends of the anode electrode 210, and a portion of the anode electrode 210 may be exposed. For example, the barrier 400 may be formed of an inorganic insulating material such as silicon nitride (SiNx) and silicon oxide (SiOx) or an organic insulating material such as benzocyclobutene resin, acrylic resin, or imide resin, but is not limited thereto. Furthermore, the barrier 400 may include a black pigment or a black organic material. For example, the barrier 400 may be a black barrier.

[0108] Spacers can be further installed on the 400-meter dike.

[0109] The light-emitting material layer 220 of the light-emitting element 200 can be disposed on the anode electrode 210. The light-emitting material layer 220 may include multiple organic layers. The cathode electrode 230 can be disposed on the light-emitting material layer 220 of the light-emitting element 200.

[0110] A single-layer or multi-layer encapsulation layer 500 is disposed on the encapsulation layer ENCAP above the light-emitting element layer EDL. For example, as Figure 5 As shown, the encapsulation layer may include a first encapsulation layer 510, a second encapsulation layer 520, and a third encapsulation layer 530. In this case, the first encapsulation layer 510 and the third encapsulation layer 530 may be formed of inorganic materials, and the second encapsulation layer 520 may be formed of organic materials. Among the first encapsulation layer 510, the second encapsulation layer 520, and the third encapsulation layer 530, the second encapsulation layer 520 may be the thickest and may be used as a planarization layer.

[0111] The first encapsulation layer 510 can be positioned closest to the light-emitting element 200. In other words, the first encapsulation layer 510 can be disposed on the cathode electrode 230 of the light-emitting material layer 220. The first encapsulation layer 510 can be formed of an inorganic insulating material capable of low-temperature deposition. For example, the first encapsulation layer 510 can be silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3). Since the first encapsulation layer 510 is deposited in a low-temperature atmosphere, it can prevent the light-emitting element 200, which includes organic materials susceptible to high-temperature atmospheres, from being damaged during the deposition process.

[0112] The second encapsulation layer 520 can be formed with a region smaller than that of the first encapsulation layer 510. In this case, the second encapsulation layer 520 can be formed to expose the two opposite ends of the first encapsulation layer 510. The second encapsulation layer 520 can serve as a buffer to alleviate interlayer stress caused by bending of the flexible display device, and can also be used to enhance planarization performance. For example, the second encapsulation layer 520 can be formed of an organic insulating material, such as acrylic resin, epoxy resin, polyimide, polyethylene, silicon carbide (SiOC), etc. For example, the second encapsulation layer 520 can be formed by an inkjet method, but is not limited thereto.

[0113] A third encapsulation layer 530 can be formed on a substrate 110, on which a second encapsulation layer 520 is formed to cover the upper and side surfaces of each of the second encapsulation layer 520 and the first encapsulation layer 510. In this case, the third encapsulation layer 530 can minimize or prevent external moisture or oxygen from penetrating into the first encapsulation layer 510 and the second encapsulation layer 520. For example, the third encapsulation layer 530 can be formed of an inorganic insulating material, such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3).

[0114] Although this disclosure shows that the first encapsulation layer 510 and the second encapsulation layer 520 are formed as a single layer, this disclosure is not limited thereto. For example, the first encapsulation layer 510 and the third encapsulation layer 530 may be formed as a multilayer comprising silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON). Furthermore, the first encapsulation layer 510 and the third encapsulation layer 530 may have different numbers of layers and may have different thicknesses. For example, the first encapsulation layer 510 may be thicker than the third encapsulation layer 530.

[0115] like Figure 1 As described herein, at least one dam 117 may be provided in the non-display area NA to block the flow of the second encapsulation layer 520 of the encapsulation layer 500.

[0116] At least one dam section 117 may be formed to include at least one of a dike 400 and a spacer. For example, at least one dam section 117 may include a dike 400, and the dike 400 may be a black dike including black pigment.

[0117] A touch insulating layer 600, including an insulating film for setting the touch detection unit, can be disposed on the encapsulation layer 500.

[0118] The touch buffer layer 610 prevents damage to the light-emitting material layer 220, which is susceptible to chemical liquids or moisture. When forming the touch sensor layer TSL, chemical liquids (such as developers or etchants) used in the process or moisture from the outside may be present. Therefore, by providing the touch buffer layer 610 and providing the touch detection unit thereon, chemical liquids or moisture can be prevented from penetrating into the light-emitting material layer 220, which includes organic materials, during the manufacturing process of the touch detection unit. Furthermore, the touch buffer layer 610 prevents damage to the light-emitting material layer 220, which includes organic materials susceptible to high temperatures. In this case, the touch buffer layer 610 can be formed at a low temperature below a predetermined temperature (e.g., 100°C) and can be formed from an organic insulating material having a low dielectric constant of 1 to 3. For example, the touch buffer layer 610 can be formed from an acrylic-based material, an epoxy-based material, or a siloxane-based material. As described above, the touch buffer layer 610 is formed from an organic insulating material to prevent damage to the encapsulation layer ENCAP due to bending of the flexible display device.

[0119] The interlayer insulating layer 620 may be formed on the touch buffer layer 610. The interlayer insulating layer 620 may include organic materials. For example, the interlayer insulating layer 620 may be an organic layer formed of organic materials, but is not limited thereto. For example, the interlayer insulating layer 620 may be an inorganic layer formed of inorganic materials. Because the interlayer insulating layer 620 is formed of organic materials, it may be thicker than the first encapsulation layer 510 or the third encapsulation layer 530.

[0120] A protective layer 630 may be formed on the interlayer insulating layer 620. For example, the protective layer 630 may be an inorganic layer formed of an inorganic material. The interlayer insulating layer 620 may be thicker than the protective layer 630.

[0121] The protective layer 630 prevents the electrodes of the touch detection unit from being damaged by chemical liquids (e.g., developers) or moisture used in the process used for the upper layer.

[0122] Multiple color filters 720 and a black matrix BM located between the multiple color filters 720 on a plane are provided in the color filter layer CFL on the touch sensor layer TSL.

[0123] Color filters 720_A and 720_B, as well as the black matrix BM, can be set on the protective layer 630.

[0124] A black matrix BM can be disposed on the protective layer 630 to overlap with the barrier 400, and multiple color filters 720 can be configured to overlap with the openings of the black matrix BM. The color filters 720 reduce the likelihood of external light incident on, for example, the barrier 400 and being reflected and thus identified, without blocking light emitted from the light-emitting element 200, thereby maintaining luminous efficiency. The black matrix BM is positioned to overlap with the edge of the emitting region of the light-emitting element 200 to reduce external light incident on the emitting region by absorbing incident external light and to prevent reflected light from being visually identified. When the barrier 400 comprises a black material, reflection of external light incident from the outside can be reduced.

[0125] The touch sensor layer (TSL) can be disposed on the encapsulation layer (ENCAP). The touch sensor layer (TSL) may include a first sensor electrode layer (SEL1) and a second sensor electrode layer (SEL2) on the first sensor electrode layer (SEL1).

[0126] refer to Figure 5 The first sensor electrode SE1 can be formed from the same layer as the first sensor electrode layer SEL1. The first sensor electrode layer SEL1 can be formed between the touch buffer layer 610 and the touch layer insulating layer 620.

[0127] On the other hand, reference Figure 6 The second sensor electrode SE2 can be formed from the same layer as the second sensor electrode layer SEL2. The second sensor electrode layer SEL2 can be formed between the interlayer insulating layer 620 and the protective layer 630.

[0128] refer to Figure 5 and Figure 6 The black matrix BM can be formed on the first sensor electrode SE1 and the second sensor electrode SE2. The black matrix BM can be formed to overlap with the first sensor electrode SE1 and the second sensor electrode SE2.

[0129] For example, in Figure 6 In this process, when light from the outside is reflected through the second sensor electrode SE2, the black matrix BM may be damaged by the reflected external light. For example, during the patterning of the black matrix BM by exposure, if the black matrix BM does not include a margin in the area other than the area overlapping with the second sensor electrode SE2, the black matrix BM may be over-cured by the reflected external light, resulting in undercut.

[0130] The first sensor electrode SE1 can be formed from the same layer as the first sensor electrode layer SEL1, and the first sensor electrode SE1 can be configured to be spaced apart from the black matrix BM by a distance corresponding to the inter-touch layer insulating layer 620. On the other hand, the second sensor electrode SE2 can be formed from the same layer as the second sensor electrode layer SEL2, and the second sensor electrode SE2 can be formed on the inter-touch layer insulating layer 620, so that it is not spaced apart from the black matrix BM by a distance corresponding to the inter-touch layer insulating layer 620. For example, the black matrix BM can be formed on the second sensor electrode layer SEL2. The first sensor electrode SE1 can be closer to the substrate 110 than the second sensor electrode SE2.

[0131] Since the second sensor electrode SE2 is closer to the black matrix BM than the first sensor electrode SE1, when the touch electrode is formed using the second sensor electrode SE2 formed on the second sensor electrode layer SEL2, the edge area of ​​the black matrix BM should be larger than the edge area when the touch electrode is formed using the first sensor electrode SE1 formed on the first sensor electrode layer SEL1.

[0132] The display device according to this disclosure includes both a second sensor electrode SE2 in a second sensor electrode layer SEL2 forming a touch electrode and a first sensor electrode SE1 in a first sensor electrode layer SEL1, thereby increasing the design freedom of the black matrix BM.

[0133] Furthermore, the display device according to this disclosure includes sensor electrodes in the first sensor electrode layer SEL1, thereby minimizing the edge region of the black matrix BM and increasing the opening of the black matrix BM to improve luminous efficiency.

[0134] For example, the width of the black matrix corresponding to the first sensor electrode SE1 formed by the first sensor electrode layer SEL1 can be smaller than the width of the black matrix corresponding to the second sensor electrode SE2 formed by the second sensor electrode layer SEL2.

[0135] In other words, the overlap ratio between the black matrix corresponding to the first sensor electrode SE1 and the first sensor electrode SE1 can be greater than the overlap ratio between the black matrix corresponding to the second sensor electrode SE2 and the second sensor electrode SE2.

[0136] The overlap ratio between the black matrix corresponding to the sensor electrode and the sensor electrode can be defined as (width of the sensor electrode) / (width of the black matrix corresponding to the sensor electrode).

[0137] As another example, the black matrix BM may include a first portion overlapping with the first sensor electrode SE1 and the third sensor electrode SE3, and may include a second portion overlapping with the second sensor electrode SE2 and the fourth sensor electrode SE4.

[0138] The length of the first portion of the overlap between the first sensor electrode SE1 and the third sensor electrode SE3 and the black matrix BM can be referred to as the first width, and the length of the second portion of the overlap between the second sensor electrode SE2 and the fourth sensor electrode SE4 and the black matrix BM can be referred to as the second width.

[0139] In this case, for example, the first width can be smaller than the second width.

[0140] The overlap ratio of the black matrix in the first part / second part can be defined as (first width / second width of the first part / second part) / (width of the black matrix corresponding to the sensor electrode). In other words, the overlap ratio of the black matrix in the first part can be greater than the overlap ratio of the black matrix in the second part.

[0141] refer to Figure 7 The second sensor electrode SE2 and the fourth sensor electrode SE4 can be electrically connected through the third sensor electrode SE3. The third sensor electrode SE3 can be formed from the first touch metal TM1, and the second sensor electrode SE2 and the fourth sensor electrode SE4 can be formed from the second touch metal TM2.

[0142] refer to Figure 7 A touch interlayer insulating layer 620 can be formed between the second sensor electrode SE2 and the third sensor electrode SE3. The touch interlayer insulating layer 620 can also be formed between the fourth sensor electrode SE4 and the third sensor electrode SE3. The second sensor electrode SE2 and the third sensor electrode SE3 can be electrically connected to each other through contact holes formed in the touch interlayer insulating layer 620. The fourth sensor electrode SE4 and the third sensor electrode SE3 can also be electrically connected to each other through another contact hole formed in the touch interlayer insulating layer 620. The second sensor electrode SE2 and the fourth sensor electrode SE4 can be formed using a second sensor electrode layer SEL2 formed from a second touch metal TM2, and the third sensor electrode SE3 can be formed using a first sensor electrode layer SEL1 formed from a first touch metal TM1.

[0143] Figure 8 This is a plan view illustrating a display device according to an embodiment of the present disclosure.

[0144] Figure 9 This is a plan view illustrating a display device according to an embodiment of the present disclosure.

[0145] refer to Figure 8 and Figure 9The display device 100 may include touch routing wiring TL outside the display area DA. Touch routing wiring TL may be located in the non-display area NA. Touch routing wiring TL may include lower touch routing wiring TL1 and upper touch routing wiring TL2.

[0146] The lower touch routing wiring TL1 can be formed from the same layer as the first sensor electrode layer SEL1, and the upper touch routing wiring TL2 can be formed from the same layer as the second sensor electrode layer SEL2.

[0147] refer to Figure 8 The first sensor electrode SE1 and the third sensor electrode SE3, formed from the same layer as the first sensor electrode layer SEL1, can be respectively disposed in the first emission region EA1 corresponding to the first sub-pixel SP1 and the third emission region EA3 corresponding to the third sub-pixel SP3. The third sensor electrode SE3 can be spaced apart from the first sensor electrode SE1. Similarly, the second sensor electrode SE2 and the fourth sensor electrode SE4, formed from the same layer as the second sensor electrode layer SEL2, can be respectively disposed in the second emission region EA2 corresponding to the second sub-pixel SP2 and the fourth emission region EA4 corresponding to the fourth sub-pixel SP4. The fourth sensor electrode SE4 is spaced apart from the second sensor electrode SE2.

[0148] like Figure 3 As shown, the touch electrode TE may include multiple sensor electrodes SE. The first sensor electrode SE1 and the second sensor electrode SE2 may be electrically connected to the same touch routing wiring TL. For example, when the first sensor electrode SE1 is formed from the same layer as the first sensor electrode layer SEL1, and the second sensor electrode SE2 is formed from the same layer as the second sensor electrode layer SEL2, the touch routing wiring TL may be connected in the same layer as the first sensor electrode SE1 and the first sensor electrode layer SEL1, and may also be connected in the same layer as the second sensor electrode SE2 and the second sensor electrode layer SEL2. For example, the touch routing wiring TL may include a lower touch routing wiring TL1 and an upper touch routing wiring TL2. For example, the touch routing wiring TL may be a dual-routing wiring. The detailed connection structure between the touch routing wiring and the touch electrode is described below.

[0149] refer to Figure 9The lower touch routing wiring TL1 can be formed from the same layer as the first sensor electrode layer SEL1. The lower touch routing wiring TL1 can be formed together with the first sensor electrode SE1 and the third sensor electrode SE3. The first sensor electrode SE1 can be connected to the touch routing wiring TL in the first sensor electrode layer SEL1. For example, the first sensor electrode SE1 can be connected to the lower touch routing wiring TL1 in the first sensor electrode layer SEL1, and the second sensor electrode SE2 can be connected to the upper touch routing wiring TL2 in the second sensor electrode layer SEL2. In other words, the first sensor electrode SE1 can be connected to the touch routing wiring TL in the first sensor electrode layer SEL1, and the second sensor electrode SE2 can be connected to the touch routing wiring TL in the second sensor electrode layer SEL2.

[0150] Figure 10 It is along Figure 8 The cross-sectional view taken by line D-D'. Figure 11 It is along Figure 8 The cross-sectional view taken from line E-E'. Figure 12 It is along Figure 8 The cross-sectional view taken by line F-F'.

[0151] refer to Figures 10 to 12 The touch sensor layer TSL may include a touch buffer layer 610, a first sensor electrode layer SEL1, a touch interlayer insulating layer 620, a second sensor electrode layer SEL2, and a protective layer 630.

[0152] refer to Figures 10 to 12 The touch routing cable TL can have a two-wire structure comprising a lower touch routing cable TL1 and an upper touch routing cable TL2. The lower touch routing cable TL1 and the upper touch routing cable TL2 can be electrically connected to each other.

[0153] refer to Figure 10 Line D-D' is a cut line in the area where the second sensor electrode SE2 and the upper touch routing wiring TL2 connect. For example, the second sensor electrode SE2 and the upper touch routing wiring TL2 can be connected to each other in the second sensor electrode layer SEL2. As another example, the second sensor electrode SE2 and the upper touch routing wiring TL2 can be integrally formed in the second sensor electrode layer SEL2. The second sensor electrode layer SEL2 can be located between the touch interlayer insulating layer 620 and the protective layer 630.

[0154] refer to Figure 11Line E-E' is the cutting line of the area where the first sensor electrode SE1 and the lower touch routing wiring TL1 are connected. For example, the first sensor electrode SE1 and the lower touch routing wiring TL1 can be connected to each other in the first sensor electrode layer SEL1. As another example, the first sensor electrode SE1 and the lower touch routing wiring TL1 can be integrally formed in the first sensor electrode layer SEL1. The first sensor electrode layer SEL1 can be located between the touch buffer layer 610 and the touch interlayer insulating layer 620. The upper touch routing wiring TL2 formed by the second sensor electrode layer SEL2 can be disposed on the lower touch routing wiring TL1 formed by the first sensor electrode layer SEL1. The lower touch routing wiring TL1 formed by the first sensor electrode layer SEL1 and the upper touch routing wiring TL2 formed by the second sensor electrode layer SEL2 can be electrically connected through holes in the touch interlayer insulating layer 620.

[0155] refer to Figure 12 Line F-F' is the cut line of the touch routing line TL. As described above, the touch routing line TL may include a lower touch routing line TL1 and an upper touch routing line TL2. The lower touch routing line TL1 and the upper touch routing line TL2 may have a touch interlayer insulating layer 620 inserted between them. The lower touch routing line TL1 and the upper touch routing line TL2 may be connected to each other through contact holes formed in the touch interlayer insulating layer 620. For example, the touch routing line TL may be double-layered.

[0156] The display device according to embodiments of the present disclosure may include: a substrate including a display area and a non-display area outside the display area, a thin film transistor on the substrate, a sub-pixel connected to the thin film transistor, an encapsulation layer disposed on the sub-pixel, a first sensor electrode disposed on the encapsulation layer, a touch interlayer insulating layer disposed on the first sensor electrode, and a second sensor electrode disposed on the touch interlayer insulating layer and electrically connected to the first sensor electrode through a contact hole in the touch interlayer insulating layer.

[0157] According to one or more embodiments of this disclosure, the size of the region of the first sensor electrode may correspond to the size of the region of the second sensor electrode. For example, the shape of the first sensor electrode may be the same as the shape of the second sensor electrode. As another example, the difference between the size of the region of the first sensor electrode and the size of the region of the second sensor electrode may be within a predetermined value. This means that even when the first sensor electrode and the second sensor electrode are disposed in different metal layers, the first sensor electrode and the second sensor electrode are still actual touch sensors in which capacitance for touch sensing is formed.

[0158] According to one or more embodiments of this disclosure, the shape of the first sensor electrode may be the same as the shape of the second sensor electrode.

[0159] According to one or more embodiments of this disclosure, the encapsulation layer may include a first encapsulation layer, a second encapsulation layer on the first encapsulation layer, and a third encapsulation layer on the second encapsulation layer. The first and third encapsulation layers may include inorganic materials. The thickness of the interlayer insulating layer may be greater than the thickness of the first and third encapsulation layers.

[0160] According to one or more embodiments of this disclosure, the interlayer insulation layer may include an organic material.

[0161] According to one or more embodiments of this disclosure, the display device may further include partitions that divide subpixels. The partitions may include black partitions.

[0162] According to one or more embodiments of this disclosure, the display device may further include a third sensor electrode spaced apart from the first sensor electrode and a fourth sensor electrode spaced apart from the second sensor electrode. The first and third sensor electrodes may be formed from a first sensor electrode layer. The second and fourth sensor electrodes may be formed from a second sensor electrode layer. In other words, the first and third sensor electrodes may be disposed in the first sensor electrode layer, and the second and fourth sensor electrodes may be disposed in the second sensor electrode layer.

[0163] According to one or more embodiments of this disclosure, the first to fourth sensor electrodes can be electrically connected to form a grid-shaped touch electrode.

[0164] According to one or more embodiments of this disclosure, a sub-pixel may include a first sub-pixel surrounded by a first sensor electrode, a second sub-pixel surrounded by a second sensor electrode, a third sub-pixel surrounded by a third sensor electrode, and a fourth sub-pixel surrounded by a fourth sensor electrode. The first to fourth sub-pixels may respectively correspond to the first to fourth emission regions.

[0165] According to one or more embodiments of this disclosure, the display device may further include a fifth sub-pixel surrounded by a first sensor electrode to a fourth sensor electrode. The fifth sub-pixel may correspond to a fifth emission region.

[0166] According to one or more embodiments of this disclosure, the size of the fifth transmission region may be smaller than the size of each of the first to fourth transmission regions.

[0167] According to one or more embodiments of this disclosure, the display device may further include a black matrix on a second sensor electrode layer.

[0168] According to one or more embodiments of this disclosure, the black matrix may have a first width in a first portion overlapping with the first and third sensor electrodes, and a second width in a second portion overlapping with the second and fourth sensor electrodes. The first width may be smaller than the second width.

[0169] According to one or more embodiments of this disclosure, the black matrix overlap ratio of the first part can be greater than the black matrix overlap ratio of the second part.

[0170] According to one or more embodiments of this disclosure, the display device may further include touch routing wiring electrically connected to the first sensor electrode and the second sensor electrode. The touch routing wiring may include at least one of the first sensor electrode layer and the second sensor electrode layer.

[0171] A display device according to embodiments of the present disclosure may include a substrate, a plurality of sensor electrodes, and a black matrix on the plurality of sensor electrodes. The black matrix may include a first portion having a first width and a second portion having a second width greater than the first width. The plurality of sensor electrodes may include a first sensor electrode overlapping the first portion and a second sensor electrode overlapping the second portion. The first sensor electrode may be positioned closer to the substrate than the second sensor electrode.

[0172] According to one or more embodiments of this disclosure, the size of the region of the first sensor electrode may correspond to the size of the region of the second sensor electrode.

[0173] According to one or more embodiments of this disclosure, the shape of the first sensor electrode may be the same as the shape of the second sensor electrode.

[0174] According to one or more embodiments of this disclosure, the display device may further include a touch interlayer insulating layer between the first sensor electrode and the second sensor electrode. The touch interlayer insulating layer may include an organic material.

[0175] According to one or more embodiments of this disclosure, the display device may further include a third sensor electrode spaced apart from the first sensor electrode and a fourth sensor electrode spaced apart from the second sensor electrode. The third sensor electrode may be disposed on the same layer as the first sensor electrode, and the fourth sensor electrode may be disposed on the same layer as the second sensor electrode.

[0176] According to one or more embodiments of this disclosure, the first to fourth sensor electrodes can be electrically connected to form a grid-shaped touch electrode.

[0177] According to one or more embodiments of this disclosure, the display device may further include sub-pixels between the substrate and the black matrix. The sub-pixels may include a first sub-pixel surrounded by a first sensor electrode, a second sub-pixel surrounded by a second sensor electrode, a third sub-pixel surrounded by a third sensor electrode, and a fourth sub-pixel surrounded by a fourth sensor electrode. The first to fourth sub-pixels may respectively correspond to the first to fourth emission regions.

[0178] According to one or more embodiments of this disclosure, the display device may further include a fifth sub-pixel surrounded by first to fourth sensor electrodes. The fifth sub-pixel may correspond to a fifth emission region.

[0179] According to one or more embodiments of this disclosure, the size of the fifth transmission region may be smaller than the size of each of the first to fourth transmission regions.

[0180] According to one or more embodiments of this disclosure, the black matrix overlap ratio of the first part can be greater than the black matrix overlap ratio of the second part.

[0181] According to one or more embodiments of this disclosure, the display device may further include touch routing wiring electrically connected to a first sensor electrode and a second sensor electrode. The touch routing wiring may be disposed on the same layer as at least one of the first sensor electrode and the second sensor electrode.

[0182] The above embodiments are merely examples, and those skilled in the art will understand that various changes can be made thereto without departing from the scope of this disclosure. Therefore, the embodiments set forth herein are provided for illustrative purposes and do not limit the scope of this disclosure, and it should be understood that the scope of this disclosure is not limited by the embodiments.

Claims

1. A display device comprising: a substrate including a display region and a non-display region outside the display region; a thin film transistor on the substrate; a sub-pixel connected to the thin film transistor; an encapsulation layer provided on the sub-pixel; a first sensor electrode provided on the encapsulation layer; a touch interlayer insulating layer provided on the first sensor electrode; and a second sensor electrode provided on the touch interlayer insulating layer and electrically connected to the first sensor electrode through a contact hole in the touch interlayer insulating layer.

2. The display device according to claim 1, wherein a size of a region of the first sensor electrode corresponds to a size of a region of the second sensor electrode.

3. The display device according to claim 1, wherein a shape of the first sensor electrode is the same as a shape of the second sensor electrode.

4. The display device according to claim 1, wherein the encapsulation layer includes: a first encapsulation layer; a second encapsulation layer on the first encapsulation layer; and a third encapsulation layer on the second encapsulation layer, wherein the first encapsulation layer and the third encapsulation layer include an inorganic material, and wherein a thickness of the touch interlayer insulating layer is greater than a thickness of the first encapsulation layer and a thickness of the third encapsulation layer.

5. The display device according to claim 4, wherein the touch interlayer insulating layer includes an organic material.

6. The display device according to claim 1, further comprising a bank dividing the sub-pixel, wherein the bank includes a black bank.

7. The display device according to claim 1, further comprising a third sensor electrode provided to be spaced apart from the first sensor electrode and a fourth sensor electrode provided to be spaced apart from the second sensor electrode, wherein the first sensor electrode and the third sensor electrode are formed by a first sensor electrode layer, and the second sensor electrode and the fourth sensor electrode are formed by a second sensor electrode layer.

8. The display device according to claim 7, wherein the first to fourth sensor electrodes are electrically connected to form one mesh-shaped touch electrode.

9. The display device according to claim 7, wherein the sub-pixel includes: a first sub-pixel surrounded by the first sensor electrode; a second sub-pixel surrounded by the second sensor electrode; a third sub-pixel surrounded by the third sensor electrode; and a fourth sub-pixel surrounded by the fourth sensor electrode, and wherein the first to fourth sub-pixels respectively correspond to first to fourth emission regions.

10. The display device according to claim 9, further comprising a fifth sub-pixel surrounded by the first to fourth sensor electrodes, wherein the fifth sub-pixel corresponds to a fifth emission region.

11. The display device according to claim 10, wherein a size of the fifth emission region is smaller than a size of each of the first to fourth emission regions.

12. The display device according to claim 7, further comprising a black matrix on the second sensor electrode layer. ​ ​ ​ 13.The display apparatus of claim 12, wherein the black matrix has a first width in a first portion overlapping the first and third sensor electrodes, and a second width in a second portion overlapping the second and fourth sensor electrodes, and wherein the first width is smaller than the second width. 14.The display apparatus of claim 13, wherein a black matrix overlap ratio of the first portion is greater than a black matrix overlap ratio of the second portion. 15.The display apparatus of claim 1, further comprising touch routing wires electrically connected to the first and second sensor electrodes, wherein the touch routing wires comprise a same layer as at least one of the first and second sensor electrode layers. 16.A display apparatus comprising: a substrate; a plurality of sensor electrodes; and a black matrix on the plurality of sensor electrodes, wherein the black matrix includes a first portion having a first width and a second portion having a second width greater than the first width, wherein the plurality of sensor electrodes includes a first sensor electrode overlapping the first portion and a second sensor electrode overlapping the second portion, and wherein the first sensor electrode is positioned closer to the substrate than the second sensor electrode. 17.The display apparatus of claim 16, wherein a size of an area of the first sensor electrode corresponds to a size of an area of the second sensor electrode. 18.The display apparatus of claim 16, wherein a shape of the first sensor electrode is identical to a shape of the second sensor electrode. 19.The display apparatus of claim 16, further comprising a touch interlayer insulating layer between the first and second sensor electrodes, wherein the touch interlayer insulating layer comprises an organic material. 20.The display apparatus of claim 16, further comprising a third sensor electrode disposed spaced apart from the first sensor electrode and a fourth sensor electrode disposed spaced apart from the second sensor electrode, wherein the third sensor electrode is disposed on a same layer as the first sensor electrode, and the fourth sensor electrode is disposed on a same layer as the second sensor electrode. 21.The display apparatus of claim 20, wherein the first through fourth sensor electrodes are electrically connected to form a mesh-shaped touch electrode. 22.The display apparatus of claim 20, further comprising sub-pixels between the substrate and the black matrix, wherein the sub-pixels include: a first sub-pixel surrounded by the first sensor electrode; a second sub-pixel surrounded by the second sensor electrode; a third sub-pixel surrounded by the third sensor electrode; and a fourth sub-pixel surrounded by the fourth sensor electrode, and wherein the first through fourth sub-pixels correspond to first through fourth emission areas, respectively. ​ ​ 23.The display apparatus of claim 22, further comprising a fifth sub-pixel surrounded by the first to fourth sensor electrodes, wherein the fifth sub-pixel corresponds to a fifth emission area. 24.The display apparatus of claim 23, wherein a size of the fifth emission area is smaller than a size of each of the first to fourth emission areas. 25.The display apparatus of claim 16, wherein a black matrix overlap ratio of the first portion is greater than a black matrix overlap ratio of the second portion. 26.The display apparatus of claim 16, further comprising a touch routing wire electrically connected to the first sensor electrode and the second sensor electrode, wherein the touch routing wire is disposed on a same layer as at least one of the first sensor electrode and the second sensor electrode.

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