Eutectic table capable of rapidly changing materials

Abstract

The invention discloses a fast material changing eutectic table, which comprises a carrier platform, the carrier platform comprises a first area and a second area, the first area is used for placing a chip carrier, the second area is used for placing a substrate carrier, and the substrate carrier is provided with a substrate groove for placing a substrate; first moving mechanisms are arranged on the two sides of the second area, pressing blocks are arranged at the output ends of the first moving mechanisms, and the first moving mechanisms are used for driving the pressing blocks to tightly press or loosen the substrate carrier located in the second area; a second moving mechanism is further arranged on the machine table base, a moving seat is arranged at the output end of the second moving mechanism, and the moving seat is provided with a dispensing cylinder and a suction nozzle. According to the invention, the substrate is fixed by the substrate carrier, so that the substrate can be accurately positioned, and the chip can be ensured to be fixed at an accurate position. The substrate carrier is tightly pressed on the second area through the pressing block, so that the substrate carrier is fixed on the carrier platform, it is guaranteed that the substrate carrier does not move in the chip fixing process, and it is further guaranteed that the chip can be fixed at the accurate position.

Description

[0001] This application claims priority to Chinese Patent Application No. 2024112655578, filed on September 10, 2024, entitled "A Eutectic Stage for Rapid Material Change", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of eutectic welding technology, and in particular to a eutectic stage for rapid material change. Background Technology

[0003] The eutectic stage is a key piece of equipment in the chip packaging process, used to achieve eutectic bonding between the chip and the substrate. The typical working process of the eutectic stage is as follows: first, the substrate is placed on the base of the machine, then the chip is picked up and placed onto the substrate, and finally, it is fixed to the substrate by spot welding or other adhesives.

[0004] For example, Chinese Patent Publication No. CN117855140A discloses a dual-station eutectic bonding device, including a left eutectic stage and a right eutectic stage, both with identical bonding processes. The left eutectic stage uses negative pressure to adsorb the carrier plate. The left eutectic stage uses feedback information from a third CCD 6 to correct the carrier plate to a set threshold range. Then, a left heating system heats the left eutectic stage to the bonding temperature. Once the left eutectic stage reaches the set bonding temperature, a fourth robotic arm places the chip from the standby position onto the current carrier plate with a set pressure, completing the chip bonding process. This bonding process involves placing the carrier plate on the left eutectic stage and then correcting it. Typically, only one carrier plate is placed on the left eutectic stage at a time, making simultaneous correction of two carrier plates difficult. Furthermore, during the bonding process, continuous negative pressure adsorption is required to fix the carrier plate, resulting in significant energy consumption. Therefore, this invention proposes a fast-change eutectic stage to solve these problems. Summary of the Invention

[0005] This invention overcomes the shortcomings of the above-mentioned technologies and provides a eutectic stage for rapid material change.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A rapid material change eutectic stage includes a base, on which a carrier platform is mounted. The carrier platform includes a first region and a second region. The first region is used to place a chip carrier, and the second region is used to place a substrate carrier. The substrate carrier has at least one substrate slot for placing a substrate, and the chip carrier has multiple chip slots for placing chips. First moving mechanisms are provided on both sides of the second region. The output end of each first moving mechanism has a pressure block, and the first moving mechanism is used to drive the pressure block to press or release the substrate carrier located in the second region. The base also includes a second moving mechanism, the output end of which has a moving seat located above the carrier platform. The second moving mechanism is used to drive the moving seat to move between the first and second regions. The moving seat includes a dispensing cylinder, a pick-up nozzle for picking up chips, and a first vision inspection mechanism.

[0007] Preferably, the first moving mechanism includes a first X-axis linear module, and the output end of the first X-axis linear module is provided with a first Z-axis linear module. The first Z-axis linear module is driven by the first X-axis linear module to move along the X-axis direction. The output end of the first Z-axis linear module is connected to the pressure block through a connector, and the pressure block is driven by the first Z-axis linear module to move along the Z-axis direction.

[0008] Preferably, the second region is provided with a first positioning protrusion, and the substrate carrier is provided with a first positioning hole for the first positioning protrusion to pass through.

[0009] Preferably, the first region is provided with a second positioning protrusion, and the chip carrier is provided with a second positioning hole for the second positioning protrusion to pass through.

[0010] Preferably, the machine base is provided with a substrate calibration stage, which is used to rotate the substrate with the Z-axis as the rotation axis.

[0011] Preferably, the movable base is provided with a motor mounting bracket, on which a rotary motor is mounted. The output end of the rotary motor is connected to a lens bracket, on which a magnifying lens is mounted. A suction nozzle is connected below the lens bracket. The rotary motor is used to rotate the lens bracket and the suction nozzle around the Z-axis.

[0012] Preferably, the movable seat is provided with a second Z-axis linear module, the output end of the second Z-axis linear module is connected to a dispensing bracket, and the dispensing tube is mounted on the dispensing bracket.

[0013] Preferably, the carrier platform includes a loading plate, the bottom of which is connected to the machine base via a column, a second vision detection mechanism is provided below the loading plate, the loading plate has a first through hole corresponding to the second vision detection mechanism, and the chip carrier has a second through hole corresponding to the first through hole.

[0014] Preferably, the second moving mechanism includes a first Y-axis linear module disposed on the base of the machine tool, a second X-axis linear module mounted on the output end of the first Y-axis linear module, the second X-axis linear module being driven by the first Y-axis linear module to move along the Y-axis direction, a third Z-axis linear module mounted on the output end of the second X-axis linear module, the third Z-axis linear module being driven by the second X-axis linear module to move along the X-axis direction, and the moving seat being mounted on the output end of the third Z-axis linear module; the moving seat is driven by the second X-axis linear module to move along the X-axis direction.

[0015] Preferably, a lamp holder is mounted on the side surface of the motor mounting bracket, and a UV curing lamp is mounted on the lamp holder.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention, by fixing the substrate with a substrate carrier, can precisely position the substrate, ensuring that the chip can be fixed in the accurate position. Furthermore, when the substrate carrier has multiple substrate slots, multiple substrates can be positioned simultaneously, resulting in high efficiency. This invention also uses a clamping block to firmly press the substrate carrier onto the second region, thereby fixing the substrate carrier to the carrier platform and ensuring that the substrate carrier and substrate do not move during the chip fixing process, further ensuring that the chip can be fixed in the accurate position.

[0017] 2. The first moving mechanism can drive the pressure block to press or release the substrate carrier located in the second area, which facilitates the installation or removal of the substrate carrier and thus achieves the effect of rapid material change.

[0018] 3. The present invention uses a first positioning protrusion and a first positioning hole to cooperate, and a second positioning protrusion and a second positioning hole to cooperate, to ensure the accurate positioning of the substrate carrier and the chip carrier on the carrier platform, and reduce the processing error caused by position deviation.

[0019] This invention uses a first vision inspection mechanism to accurately position the chip and substrate, and a second vision inspection mechanism to accurately position the components on the moving base. This dual positioning further improves the accuracy of material handling. Attached Figure Description

[0020] Figure 1 This is an overall schematic diagram of the eutectic stage of the present invention; Figure 2 This is a first-view structural schematic diagram of the eutectic stage of the present invention; Figure 3 yes Figure 1 Enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the structure of the movable base of the present invention; Figure 5This is a second-view structural schematic diagram of the movable base of the present invention; Figure 6 This is a third-view structural schematic diagram of the movable base of the present invention. Detailed Implementation

[0021] The following examples further illustrate the features and other related characteristics of the present invention in detail, to facilitate understanding by those skilled in the art: Reference Figures 1-6 A rapid-change eutectic stage includes a base 1, on which a carrier platform 2 is mounted. The carrier platform 2 includes a first region 21 and a second region 22. The first region 21 is used to place a chip carrier 23, and the second region 22 is used to place a substrate carrier (not shown in the figures). The substrate carrier has at least one substrate slot for placing a substrate, and the chip carrier 23 has multiple chip slots 231 for placing chips. First moving mechanisms 3 are provided on both sides of the second region 22. The output end of the first moving mechanism 3 is provided with a pressure block 31, which is used to drive the pressure block 31 to press or release the substrate carrier located in the second region 22. The base 1 also has a second moving mechanism 4, the output end of which is provided with a moving seat 5 located above the carrier platform 2. The second moving mechanism 4 is used to drive the moving seat 5 to move between the first region 21 and the second region 22. The moving seat 5 is provided with a dispensing cylinder, a pick-up nozzle 61 for picking up chips, and a first vision inspection mechanism.

[0022] like Figure 3 As shown, the first moving mechanism 3 includes a first X-axis linear module 32, and the output end of the first X-axis linear module 32 is provided with a first Z-axis linear module 33. The first Z-axis linear module 33 is driven by the first X-axis linear module 32 to move along the X-axis direction. The output end of the first Z-axis linear module 33 is connected to the pressure block 31 through a connector 34, and the pressure block 31 is driven by the first Z-axis linear module 33 to move along the Z-axis direction.

[0023] The first X-axis linear module 32 includes a first cylinder 321 mounted on the machine base 1, a first L-shaped connector 322 connected to the output end of the first cylinder 321, and a first connecting seat 323 mounted on the top of the first L-shaped connector 322. The first cylinder 321 drives the first L-shaped connector 322 and the first connecting seat 323 to move together along the X-axis direction.

[0024] The first Z-axis linear module 33 includes a second cylinder 331 mounted on top of the first connecting seat 323. The top of the connecting member 34 is connected to the pressure block 31, and the bottom of the connecting member 34 is connected to the output end of the second cylinder 331. The second cylinder 331 drives the connecting member 34 and the pressure block 31 to move together along the Z-axis direction.

[0025] like Figure 3 As shown, the second region 22 is provided with a first positioning protrusion 221, and the substrate carrier is provided with a first positioning hole for the first positioning protrusion 221 to pass through. Specifically, the substrate carrier is provided with a first positioning hole at both ends along the X-axis, and the second region 22 is provided with a first positioning protrusion 221 at both ends along the X-axis. The first positioning protrusion 221 and the first positioning hole cooperate to ensure the accurate positioning of the substrate carrier on the carrier platform 2.

[0026] The first region 21 is provided with a second positioning protrusion 211, and the chip carrier 23 is provided with a second positioning hole 232 for the second positioning protrusion 211 to pass through. Specifically, the chip carrier 23 has a second positioning hole 232 at both ends along the X-axis, and the first region 21 has a second positioning protrusion 211 at both ends along the X-axis. The second positioning protrusion 211 and the second positioning hole 232 cooperate to ensure the accurate positioning of the chip carrier 23 on the carrier platform 2.

[0027] like Figure 2 As shown, the machine base 1 is equipped with a substrate calibration platform 7. When the plane angle of the substrate is not aligned with the substrate groove, the substrate needs to be placed on the substrate calibration platform 7. The substrate calibration platform 7 rotates the substrate around the Z-axis to make the plane angle of the substrate match the substrate groove, and then the substrate is transferred into the substrate groove.

[0028] like Figure 4 As shown, the movable base 5 is equipped with a motor mounting bracket 68, on which a rotary motor 62 is mounted. The output end of the rotary motor 62 is connected to a lens bracket 63, on which a magnifying lens is mounted. A suction nozzle 61 is connected below the lens bracket 63. The rotary motor 62 is used to rotate the lens bracket 63 and the suction nozzle 61 around the Z-axis. This invention uses a magnifying lens to accurately detect the planar angle of the chip. When the planar angle of the chip deviates, the rotary motor 62 rotates the suction nozzle 61 around the Z-axis to adjust the chip angle, thereby improving the accuracy of chip mounting.

[0029] like Figure 4 As shown, a second Z-axis linear module is provided on the movable base 5. The output end of the second Z-axis linear module is connected to a dispensing bracket 64, and a dispensing cylinder (not shown in the attached figure) is mounted on the dispensing bracket 64. The second Z-axis linear module includes a third cylinder 65 mounted on the movable base 5. The output end of the third cylinder 65 is connected to a second L-shaped connector 651, and the dispensing bracket 64 is mounted on the second L-shaped connector 651. The third cylinder 65 drives the dispensing bracket 64 and the dispensing cylinder to move together along the Z-axis direction.

[0030] The first visual inspection mechanism includes a first camera bracket 66 and a first camera mounted on the first camera bracket 66 (not shown in the attached drawings).

[0031] The carrier platform 2 includes a loading plate 24, the bottom of which is connected to the machine base 1 via a column 25. A second vision inspection mechanism is located below the loading plate 24. The loading plate 24 has a first through hole 241 corresponding to the second vision inspection mechanism, and the chip carrier 23 has a second through hole 233 corresponding to the first through hole 241. The second vision inspection mechanism includes a second camera bracket 11 and a second camera (not shown in the accompanying drawings) mounted on the second camera bracket 11.

[0032] The present invention uses a first vision inspection mechanism to accurately locate the chip and substrate, and a second vision inspection mechanism to accurately locate the components on the moving seat 5. This dual positioning further improves the accuracy of material picking and placing.

[0033] The second moving mechanism 4 includes a first Y-axis linear module 41 disposed on the machine base 1. A second X-axis linear module 42 is mounted on the output end of the first Y-axis linear module 41. The second X-axis linear module 42 is driven by the first Y-axis linear module 41 to move along the Y-axis direction. A third Z-axis linear module 43 is mounted on the output end of the second X-axis linear module 42. The third Z-axis linear module 43 is driven by the second X-axis linear module 42 to move along the X-axis direction. The moving seat 5 is mounted on the output end of the third Z-axis linear module 43. The moving seat 5 is driven by the second X-axis linear module 42 to move along the X-axis direction.

[0034] like Figure 5 As shown, the first Y-axis linear module 41 includes two longitudinal beams 411 extending along the Y-axis direction and a first driving device (not shown in the figure). The two longitudinal beams 411 are arranged on both sides of the vehicle platform 2 along the X-axis direction. Each longitudinal beam 411 is provided with a longitudinal slide rail 412 extending along the Y-axis direction, and a slidable first slider 413 is connected to the longitudinal slide rail 412. The first driving device is used to drive either first slider 413 to slide along the Y-axis direction. The second X-axis linear module 42 includes a crossbeam 421 extending along the X-axis direction and a second driving device (not shown in the figure). The bottom of the crossbeam 421 is connected to the top of the first slider 413 through a third connecting seat 424. The crossbeam 421 is provided with a transverse slide rail 422 extending along the X-axis direction, and a slidable second slider 423 is connected to the transverse slide rail 422. The second driving device is used to drive the second slider 423 to slide along the X-axis direction. Figure 6 As shown, the third Z-axis linear module 43 includes a second connecting seat 431 connected to the second slider 423, and a fourth cylinder 432 is mounted on the second connecting seat 431. The output end of the fourth cylinder 432 is connected to a third L-shaped connector 433, and the movable seat 5 is mounted on the third L-shaped connector 433.

[0035] The present invention enables the movable seat 5 and the dispensing cylinder, suction nozzle 61, and first vision inspection mechanism on the movable seat 5 to move stably along the Y-axis by means of the first slider 413 cooperating with the longitudinal slide rail 412. The second slider 423 cooperating with the transverse slide rail 422 enables the movable seat 5 and the dispensing cylinder, suction nozzle 61, and first vision inspection mechanism on the movable seat 5 to move stably along the X-axis.

[0036] A lamp holder 67 is mounted on the side surface of the motor mounting bracket 68, and a UV curing lamp (not shown in the attached drawings) is mounted on the lamp holder 67. The dispensing tube, nozzle 61, and UV curing lamp on the movable base 5 can simultaneously perform dispensing, chip placement, and UV curing operations on different positions of the substrate, thereby improving chip fixation efficiency.

[0037] The chip fixing process of this invention is as follows: First, the substrate carrier is placed in the second region 22, the first positioning protrusion 221 passes through the first positioning hole, and the first moving mechanism 3 drives the pressure block 31 to press the substrate carrier tightly onto the carrier platform 2. Then, the chip carrier 23 containing multiple chips is placed in the first region 21, the second positioning protrusion 211 passes through the second positioning hole 232, and the substrate is placed into the substrate groove. Then, the second moving mechanism 4 drives the dispensing cylinder to the substrate, and the dispensing cylinder dispenses adhesive onto the substrate. After that, the second moving mechanism 4 drives the suction nozzle 61 to move above the chip carrier 23, and the suction nozzle 61 picks up the chip by negative pressure. The second moving mechanism 4 then moves the moving seat 5 above the substrate, and the suction nozzle 61 places the chip on the adhesive. At the same time, the dispensing cylinder dispenses adhesive to other places on the substrate where the chip needs to be fixed, and the UV curing lamp cures the adhesive with the chip attached by light. The above operation is repeated until the chips are fixed in the designated places on the substrate. Then, the substrate on the substrate carrier is removed and replaced with a substrate without fixed chips. During the process, if the chips on the chip carrier 23 run out, it can be replaced with a chip carrier 23 full of chips; the replacement operation is simple. If the plane angle of the substrate is not aligned with the substrate groove, the substrate needs to be placed on the substrate calibration stage 7. The substrate calibration stage 7 rotates the substrate around the Z-axis to make the plane angle of the substrate match the substrate groove, and then the substrate is transferred into the substrate groove. If the plane angle of the chip is deviated, the rotary motor 62 rotates the suction nozzle 61 around the Z-axis to adjust the chip angle.

[0038] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A fast exchange eutectic table, characterized in that, The machine base (1) is provided with a carrier platform (2), the carrier platform (2) comprises a first area (21) and a second area (22), the first area (21) is used for placing a chip carrier (23), the second area (22) is used for placing a substrate carrier, the substrate carrier is provided with at least one substrate slot for placing a substrate, the chip carrier (23) is provided with a plurality of chip slots (231) for placing chips; the second area (22) is provided with a first moving mechanism (3) on both sides, the output end of the first moving mechanism (3) is provided with a pressing block (31), the first moving mechanism (3) is used for driving the pressing block (31) to press or release the substrate carrier located in the second area (22); the machine base (1) is further provided with a second moving mechanism (4), the output end of the second moving mechanism (4) is provided with a moving seat (5) located above the carrier platform (2), the second moving mechanism (4) is used for driving the moving seat (5) to move between the first area (21) and the second area (22), the moving seat (5) is provided with a dispensing cylinder, a suction nozzle (61) for sucking chips, and a first visual detection mechanism.

2. A fast reloading eutectic table according to claim 1, characterized in that, The first moving mechanism (3) comprises a first X-axis linear module (32), the output end of the first X-axis linear module (32) is provided with a first Z-axis linear module (33), the first Z-axis linear module (33) is driven by the first X-axis linear module (32) to move along the X-axis direction, the output end of the first Z-axis linear module (33) is connected with the pressing block (31) through a connecting piece, and the pressing block (31) is driven by the first Z-axis linear module (33) to move along the Z-axis direction.

3. The fast refueling eutectic pad of claim 1, wherein, The second area (22) is provided with a first positioning protrusion (221), and the substrate carrier is provided with a first positioning hole for the first positioning protrusion (221) to pass through.

4. The fast refueling eutectic pad of claim 1, wherein, The first area (21) is provided with a second positioning protrusion (211), and the chip carrier (23) is provided with a second positioning hole (232) for the second positioning protrusion (211) to pass through.

5. The fast refueling eutectic pad of claim 1, wherein, The machine base (1) is provided with a substrate calibration table (7), and the substrate calibration table (7) is used for rotating the substrate around the Z-axis as the rotation shaft.

6. The fast refueling eutectic pad of claim 1, wherein, The moving seat (5) is provided with a motor mounting rack (68), a rotating motor (62) is installed on the motor mounting rack (68), a lens support (63) is connected to the output end of the rotating motor (62), a magnifying lens is installed on the lens support (63), and a suction nozzle (61) is connected below the lens support (63), and the rotating motor (62) is used for rotating the lens support (63) and the suction nozzle (61) around the Z-axis as the rotation shaft.

7. The fast refueling eutectic pad of claim 1, wherein, A second Z-axis linear module is arranged on the moving seat (5), the output end of the second Z-axis linear module is connected with a dispensing support (64), a dispensing cylinder is installed on the dispensing support (64), and the dispensing cylinder is driven by the second Z-axis linear module to move along the Z-axis direction.

8. The fast refueling eutectic pad of claim 1, wherein, The carrier platform (2) comprises a carrier plate (24), the bottom of the carrier plate (24) is connected with the machine base (1) through a stand (25), a second visual detection mechanism is arranged below the carrier plate (24), the carrier plate (24) is provided with a first through hole (241) corresponding to the second visual detection mechanism, and the chip carrier (23) is provided with a second through hole (233) corresponding to the first through hole (241).

9. The fast refueling eutectic pad of claim 1, wherein, The second moving mechanism (4) comprises a first Y-axis linear module (41) arranged on the machine base (1), a second X-axis linear module (42) is mounted on the output end of the first Y-axis linear module (41), the second X-axis linear module (42) is driven to move along the Y-axis direction by the first Y-axis linear module (41), a third Z-axis linear module (43) is mounted on the output end of the second X-axis linear module (42), the third Z-axis linear module (43) is driven to move along the X-axis direction by the second X-axis linear module (42), and the moving seat (5) is mounted on the output end of the third Z-axis linear module (43); the moving seat (5) is driven to move along the X-axis direction by the second X-axis linear module (42).

10. The fast refueling eutectic pad of claim 6, wherein, The side surface of the motor mounting frame (68) is mounted with a third Z-axis linear module (67), and the third Z-axis linear module (67) is mounted with a UV curing lamp.

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