Adsorption positioning rotating platform for chip substrate processing

Abstract

The invention relates to the technical field of chip substrate processing, in particular to an adsorption positioning rotating platform for chip substrate processing, which comprises a base and a rotating table rotationally mounted at the top of the base, and an adsorption mechanism for fixing the middle of a chip substrate is arranged on the rotating table. The abdicating type positioning mechanism is linked with the adsorption mechanism to perform self-positioning on the chip substrate and support and fix each edge part; by means of the movement of the piston plate, the four sets of clamping plates are firstly promoted to achieve centering positioning of chip substrates of different sizes, so that it is guaranteed that the initial positions of the chip substrates are accurate; and the clamping plate is linked to deflect, the adsorption action is automatically triggered, synchronous supporting type adsorption is performed on the middle part and the edge part of the chip substrate, multi-area stable fixation is formed, and then the clamping plate is reversely pushed to further deflect, so that stable anti-shielding type adsorption fixing treatment is achieved, and the high-precision and comprehensive processing requirements are met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip substrate processing, and particularly relates to an adsorption positioning rotary platform for chip substrate processing. BACKGROUND

[0002] The chip substrate is a core basic component for carrying a chip, realizing electrical connection between the chip and an external circuit, providing physical support and thermal management function, and is usually made of ceramic, organic polymer material or metal as a base material. In the processing process, a composite structure is often formed through a multi-layer base material interlayer bonding process to meet performance requirements. However, the process is prone to interlayer bonding glue overflow due to glue coating amount control deviation or pressure effect, and the adsorption platform is needed to fix the substrate in combination with the laser cleaning technology to remove the overflow glue to ensure the flatness of the substrate surface and the precision of subsequent line etching, chip mounting and other processes.

[0003] The existing adsorption platform has the problems of positioning clamping and self-adaptive adsorption range adjustment of different sizes of substrates: the positioning structure is mostly fixed spacing or equidistant synchronous adjustment, lacks self-adaptive positioning for chip substrates with different aspect ratios, and is prone to failure conditions such as partial clamping pieces contacting the substrate first and then overall limiting, which causes the remaining components to fail to complete full edge positioning. Moreover, the adsorption range is fixed, the edge adsorption position cannot be adjusted synchronously with the change of the substrate size, targeted multi-region adsorption support cannot be formed for different sizes of substrates, and there is a contradiction between insufficient fixed stability and clamping shielding of the processing area. At the same time, it is difficult to adapt to the processing needs of multiple specifications of substrates, resulting in limited positioning accuracy, adsorption reliability and size adaptability.

[0004] In view of the above technical defects, the present application provides a solution. By moving the piston plate, four clamping plates are first prompted to realize the center positioning of chip substrates of different sizes to ensure the accuracy of the initial position of the chip substrate. The clamping plates are then deflected in linkage to automatically trigger the adsorption action, and the chip substrate is synchronously supported and adsorbed at the middle and edge parts to form multi-region stable fixation. The clamping plates are further deflected in reverse to achieve stable and anti-shielding adsorption fixation processing, and meet the processing needs of high precision and fullness. SUMMARY

[0005] The present application aims to provide an adsorption positioning rotary platform for chip substrate processing to solve the above technical defects.

[0006] The chip substrate processing adsorption positioning rotary platform can realize the following technical scheme: a chip substrate processing adsorption positioning rotary platform, comprising a base, a rotary table rotatably installed on the top of the base, an adsorption mechanism for fixing the middle part of the chip substrate, a let-go positioning mechanism for self-positioning and supporting and fixing the edge part of the chip substrate through linkage with the adsorption mechanism, a plurality of adsorption holes formed in the top of the rotary table, and a piston plate slidably connected in the rotary table, four groups of movable columns slidably connected with the rotary table, clamping plates arranged on the movable columns for abutting against the edge part of the chip substrate, and adsorption seats for adsorbing and supporting the edge part of the chip substrate.

[0007] Preferably, a servo motor for driving the rotary table to deflect is installed on the base by bolts, an electric push rod and a plurality of telescopic guide rods are fixedly installed between the bottom of the piston plate and the bottom in the rotary table, and a through groove is formed through the annular inner wall of the rotary table.

[0008] Preferably, a fixed shaft is fixedly connected to the top in the rotary table, two groups of rotary plates in cross distribution are rotatably connected to the fixed shaft, an installation plate is fixedly connected to one end of the movable column, a linkage plate is hingedly connected between the installation plate and the end of the corresponding rotary plate, and a tension spring is fixedly connected between the installation plate and the inner wall of the rotary table.

[0009] Preferably, a traction wheel is fixedly installed on each of the two groups of adjacent installation plates, a horizontal plate is fixedly connected to the fixed shaft, a guide wheel is rotatably connected to the horizontal plate, a fixed pulley is fixedly installed on the horizontal plate, a movable pulley is fixedly installed on the top of the piston plate, and a pull rope is guided through the traction wheel, the guide wheel, the fixed pulley and the movable pulley in sequence between the horizontal plate and the fixed shaft.

[0010] Preferably, an installation cavity is formed in the free end of the movable column, a rotating block fixedly connected with the clamping plate is rotatably connected in the installation cavity, and a V-shaped elastic plate is fixedly connected to the top of the clamping plate on one side of the adsorption seat.

[0011] Preferably, a communication cavity and a gas cavity in communication with the installation cavity are formed in the interior of the movable column, the communication cavity penetrates the installation plate, a through cavity is formed in the annular outer wall of the rotating block, a sealing gasket slidably abutting against the annular side wall of the rotating block is embedded and installed on the arc-shaped inner wall of the installation cavity, and the gas cavity and the adsorption seat are fixedly communicated through an air pipe.

[0012] Preferably, a convex groove is formed in the top of the movable column, a convex block slidably connected with the convex groove is fixedly connected to the bottom of the adsorption seat, a spring is fixedly connected between one side of the convex block and the inner wall of the convex groove, and rubber pads are installed on the top of the rotary table and the adsorption seat.

[0013] Preferably, the rotating block is fixedly connected with an L-shaped rod on the block shaft, and the bottom of the adsorption seat is fixedly connected with a U-shaped plate in sliding connection with the L-shaped rod.

[0014] The beneficial effects of the present application are as follows: (1) The present application uses the cooperative treatment of positioning and clamping combined with middle and adaptive edge adsorption fixation to improve the precision and surface processing comprehensiveness of chip substrate processing: with the movement of the piston plate, four groups of movable columns are first driven to make the clamping plate realize the central positioning of the chip substrate, so as to ensure the initial position precision of the chip substrate; then the clamping plate is in contact with the deflection of the chip substrate, and the adsorption action is automatically triggered to synchronously support the middle and edge of the chip substrate, forming a multi-region stable fixation, so as to avoid the error caused by the displacement of the substrate during processing; then the clamping plate is further deflected away from the edge of the chip substrate, eliminating the shielding of the edge of the chip substrate, achieving surface processing blind area, and meeting the high-precision and comprehensive processing requirements.

[0015] (2) For chip substrates with different length-width ratios, when the clamping plates on the two movable columns in the opposite direction first contact the chip substrate and complete the preliminary positioning, the clamping plate first contacting the chip substrate will realize force transmission through the traction wheel rotation, and then drive the other two movable columns in the opposite direction to continue to approach the chip substrate, until the four clamping plates complete the contact positioning, thereby avoiding the problem of positioning failure caused by the difference in length-width ratio of the chip substrate. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present application will be further described below with reference to the accompanying drawings; Figure 1 is a structural schematic diagram of the present application; Figure 2 is a structural schematic diagram of the present application located inside the rotating table; Figure 3 is a structural schematic diagram of the rotating table of the present application; Figure 4 is a linkage schematic diagram of the adsorption mechanism and the yield-type positioning mechanism of the present application; Figure 5 is a guide installation schematic diagram of the pull rope of the present application; Figure 6 is a structural schematic diagram of the multiple movable columns of the present application; Figure 7 is a cooperation schematic diagram of the movable column and the adsorption seat of the present application; Figure 8 is a structural schematic diagram of the internal cavity of the movable column of the present application; Figure 9 is a linkage schematic diagram of the adsorption seat and the clamping plate of the present application.

[0017] LEGEND: 1, base; 11, rotating table; 12, servo motor; 2, adsorption mechanism; 21, piston plate; 22, electric push rod; 23, telescopic guide rod; 3, let go of the positioning mechanism; 31, movable column; 32, clamping plate; 33, adsorption seat; 34, fixed shaft; 35, rotating plate; 36, mounting plate; 37, linkage plate; 38, tension spring; 39, traction wheel; 310, cross plate; 311, guide wheel; 312, fixed pulley; 313, movable pulley; 314, pull rope; 315, mounting cavity; 316, rotating block; 317, V-shaped elastic plate; 318, communication cavity; 319, air cavity; 320, conduction cavity; 321, spring; 322, L-shaped rod; 323, U-shaped plate. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0019] Embodiment one: please refer to Figures 1-4 With Figures 7-9 As shown in the prior art, the adsorption range is fixed, the edge adsorption position cannot be adjusted synchronously with the change of the substrate size, and there is a problem of insufficient fixed stability and contradiction between clamping and shielding the processing area, which can be solved by the following scheme. The adsorption positioning rotating platform for chip substrate processing in the embodiment includes a base 1, and a rotating table 11 rotatably mounted on the top of the base 1. The rotating table 11 is provided with an adsorption mechanism 2 for fixing the middle part of the chip substrate, and a let go positioning mechanism 3 connected with the adsorption mechanism 2 for self-positioning and fixing of each edge part of the chip substrate. The adsorption mechanism 2 includes a plurality of adsorption holes opened in the top of the rotating table 11, and a piston plate 21 slidably connected in the interior of the rotating table 11. An adsorption chamber is located in the interior of the rotating table 11 above the piston plate 21. By sliding the piston plate 21 downward, a negative pressure environment of the adsorption chamber is realized, and then the chip substrate placed on the top of the rotating table 11 is adsorbed and fixed through the plurality of adsorption holes. The let go positioning mechanism 3 includes four groups of movable columns 31 slidably connected with the rotating table 11. A sealing ring is embedded and mounted on the sliding area of the rotating table 11 and the movable column 31, for sealing the area between the movable column 31 and the rotating table 11. The four groups of movable columns 31 are distributed in a cross shape. The movable column 31 is provided with a clamping plate 32 for abutting against the edge of the chip substrate, and an adsorption seat 33 for adsorbing and supporting the edge of the chip substrate. Firstly, the four groups of movable columns 31 drive the clamping plates 32 to realize the center positioning of the chip substrate, so as to ensure the accuracy of the initial position of the chip substrate, and then the edge of the chip substrate is adsorbed and fixed by the adsorption seat 33, thereby realizing the automatic adjustment of the adsorption range according to the size of the chip substrate, achieving the synchronous support type adsorption of the middle and edge, forming a multi-region stable fixation, so as to avoid the error caused by the displacement of the substrate during processing.

[0020] The base 1 is provided with a servo motor 12 for driving the rotation table 11 to deflect through a bolt, the servo motor 12 drives the rotation table 11 to deflect to realize the switching processing of the processing edge of the chip substrate, the bottom of the piston plate 21 and the bottom in the rotation table 11 are fixedly provided with an electric push rod 22 and a plurality of telescopic guide rods 23, the electric push rod 22 drives the piston plate 21 to move up and down in the rotation table 11, and the telescopic guide rods 23 are used to assist the stability of the piston plate 21 in the sliding process, a through groove is formed in the annular inner wall of the rotation table 11, which is used to avoid the positive pressure or negative pressure in the lower part of the rotation table 11 to interfere with the movement of the piston plate 21 during the lifting movement of the piston plate 21.

[0021] The free end of the movable column 31 is provided with a mounting cavity 315, and a rotating block 316 fixedly connected with the clamping plate 32 is rotatably connected in the mounting cavity 315, after the four groups of clamping plates 32 are in contact with the chip substrate, the clamping plates 32 are deflected with the synchronous relative movement of the four groups of movable columns 31, so as to eliminate the shielding of the edge of the chip substrate, so as to realize the surface without processing blind area, and meet the high-precision and comprehensive processing requirements; The top of the clamping plate 32 on one side of the adsorption seat 33 is fixedly connected with a V-shaped elastic plate 317, the chip substrate is in contact with the clamping plate 32, so that the edge of the chip substrate is extruded by the V-shaped elastic plate 317 on the clamping plate 32 during the deflection of the clamping plate 32, and then the elastic deformation occurs, so as to maintain the state of the chip substrate adhering to the adsorption seat 33 and the rotation table 11, and extrude and adhere to the edge of the chip substrate, so as to further ensure the adsorption and fixation effect of the substrate.

[0022] The inside of the movable column 31 is provided with a communication cavity 318 and a gas cavity 319 which are communicated with the mounting cavity 315, and the communication cavity 318 penetrates the mounting plate 36, the annular outer wall of the rotating block 316 is provided with a through cavity 320, the clamping plate 32 is in the initial state when it is not deflected and adheres to the movable column 31, the through cavity 320 is communicated with the lower area of the arc-shaped side wall of the mounting cavity 315 and the communication cavity 318 at the same time, that is, the communication cavity 318 is communicated with the mounting cavity 315 through the through cavity 320, thereby realizing the communication between the adsorption cavity and the external environment, so that the negative pressure environment of the adsorption cavity will not be caused before the piston plate 21 is driven to descend by the electric push rod 22; An arc-shaped inner wall of the mounting cavity 315 is embedded with a sealing gasket in contact with the annular side wall of the rotating block 316, to increase the sealing between the annular outer wall of the rotating block 316 and the arc-shaped inner wall of the mounting cavity 315. The air cavity 319 is fixedly communicated with the adsorption seat 33 through the air pipe. When the clamping plate 32 is in contact with the chip substrate and deflects to carry the rotating block 316, the through cavity 320 on the rotating block 316 is completely rotated and attached to the sealing gasket area of the inner wall of the mounting cavity 315, so that the through cavity 320 is not in communication with the mounting cavity 315, and the through cavity 320 causes the communication cavity 318 and the air cavity 319 to be in communication. During this process, the piston plate 21 is lowered, the adsorption chamber is communicated with the air pipe and the plurality of adsorption seats 33 through the communication cavity 318, the through cavity 320, and the air cavity 319, and the chip substrate is placed on the adsorption seat 33 and the top of the rotating table 11, so that the adsorption seat 33 and the inside of the adsorption chamber form a negative pressure environment, and the middle and edge parts of the chip substrate are synchronously supported and adsorbed and fixed.

[0023] The top of the movable column 31 is provided with a convex groove, and the bottom of the adsorption seat 33 is fixedly connected with a convex block in sliding connection with the convex groove, so as to realize the sliding installation of the adsorption seat 33, so that the adsorption seat 33 does not interfere with the movement of the movable column 31 after being adsorbed and fixed with the chip substrate, and a spring 321 is fixedly connected between one side of the convex block and the inner wall of the convex groove, so as to maintain the initial position of the adsorption seat 33 before adsorbing the chip substrate, and reset after the adsorption and fixation is released. The top of the rotating table 11 and the adsorption seat 33 are both provided with rubber pads, which increase the contact sealing property of the chip substrate placed on the adsorption seat 33 and the top of the rotating table 11, and assist the adsorption and fixation effect.

[0024] The block shaft of the rotating block 316 is fixedly connected with an L-shaped rod 322, and the bottom of the adsorption seat 33 is fixedly connected with a U-shaped plate 323 in sliding connection with the L-shaped rod 322. The clamping plate 32 is first in contact with the chip substrate, causing the clamping plate 32 to deflect and automatically trigger the adsorption action, and the middle and edge parts of the chip substrate are synchronously supported and adsorbed by the rotating table 11 and the adsorption seat 33. With the movement of the movable column 31 and the limiting of the adsorption seat 33 after adsorption, the relative sliding between the adsorption seat 33 and the movable column 31 is realized, and the L-shaped rod 322 and the U-shaped plate 323 are further reversely linked to the clamping plate 32, so that the clamping plate 32 is away from the edge of the chip substrate to avoid the problem of shielding the edge part of the chip substrate caused by the contact and deflection interference of the V-shaped elastic plate 317 with the top edge of the chip substrate.

[0025] Embodiment two: please refer to Figures 4-6 As shown, for positioning of chip substrates with different length-width ratios, it is easy to cause the problem that part of the clamping member contacts the substrate first and then the whole is limited. The following solutions can be used to solve the problem. The top of the rotating table 11 is fixedly connected with a fixed shaft 34, and two groups of rotating plates 35 distributed in cross shape are rotatably connected to the fixed shaft 34. One end of the movable column 31 is fixedly connected with a mounting plate 36, and a linkage plate 37 is hingedly connected between the mounting plate 36 and the end of the corresponding rotating plate 35. Through the fixed shaft 34, the rotating plate 35 and the linkage plate 37, when the two groups of movable columns 31 on the opposite sides move, the synchronous movement of approaching or moving away is forced, the movement distance is equal, and the effect of clamping the middle of the opposite sides is achieved. The mounting plate 36 and the inner wall of the rotating table 11 are fixedly connected with a tension spring 38, and the tension spring 38 is arranged to reset the relative movement of the movable column 31.

[0026] The two groups of adjacent mounting plates 36 are fixedly connected with traction wheels 39, the fixed shaft 34 is fixedly connected with a horizontal plate 310, the horizontal plate 310 is rotatably connected with a guide wheel 311 and fixedly connected with a fixed pulley 312, the top of the piston plate 21 is fixedly connected with a movable pulley 313, and the horizontal plate 310 and the fixed shaft 34 are fixedly connected with a pull rope 314 guided in sequence through the traction wheel 39, the guide wheel 311, the fixed pulley 312 and the movable pulley 313. The initial downward movement of the piston plate 21 does not produce a negative pressure environment, drives the top movable pulley 313 to descend and pull the pull rope 314, and the pull rope 314 is guided in sequence through the traction wheel 39, the guide wheel 311, the fixed pulley 312 and the movable pulley 313. The two groups of traction wheels 39 carry the corresponding movable columns 31 to move towards the fixed shaft 34, and the other two groups of movable columns 31 push the corresponding rotating plates 35 to deflect and move synchronously relative to each other in combination with the hinged linkage plate 37. The clamping plates 32 at the ends of the movable columns 31 are used to center and position the chip substrates of different sizes with the same length-width ratio; When clamping chip substrates of different sizes with different length-width ratios, if one group of clamping plates 32 on the opposite sides first contacts the edge of the chip substrate and completes the initial centering and clamping therebetween, the movable pulley 313 carried by the piston plate 21 continues to move downward to pull the pull rope 314, and in combination with the limiting of the clamping plate 32 that first contacts the substrate, the corresponding one traction wheel 39 is rotated to realize force transmission and transfer, and the other traction wheel 39 is further pulled towards the fixed shaft 34, so that the other group of clamping plates 32 on the opposite sides contacts the edge of the chip substrate to realize secondary centering and self-adaptive positioning and clamping.

[0027] Embodiment three: please refer to Figures 1-9 The application also provides a use method of the adsorbing positioning rotary platform for chip substrate processing, which comprises the following steps: Step one: the chip substrate is placed on the top of the rotating table 11, the electric push rod 22 drives the piston plate 21 to move downward, the adsorption chamber in the rotating table 11 above the piston plate 21 is communicated with the outside through the communication cavity 318, the through cavity 320 and the installation cavity 315, and then the outside air is drawn into the adsorption chamber, the piston plate 21 drives the top movable pulley 313 to descend and pull the pull rope 314; Step two: the four groups of movable columns 31 are a movable column 31, b movable column 31, c movable column 31 and d movable column 31, wherein the traction wheel 39 is installed on the a movable column 31 and the b movable column 31, the a movable column 31 and the c movable column 31, and the b movable column 31 and the d movable column 31 are oppositely arranged, and the pull rope 314 is guided through the traction wheel 39, the guide wheel 311, the fixed pulley 312 and the movable pulley 313 in turn, the pull rope 314 pulls the a movable column 31 and the b movable column 31 to move towards the fixed shaft 34, in the relative movement process of the a movable column 31 and the b movable column 31, the corresponding linkage plate 37 is hinged, the corresponding rotating plate 35 is pushed to deflect, and then the linkage plate 37 between the other end of the rotating plate 35 and the corresponding movable column 31 is hinged, so as to drive the c movable column 31 and the d movable column 31 to move synchronously, and the chip substrate is centered and clamped by the clamping plates 32 at the ends of the movable columns 31; Step three: when the chip substrate with different length-width ratios is clamped, if the clamping plates 32 on the a movable column 31 and the c movable column 31 first contact the edge of the chip substrate and complete the preliminary centering and clamping therebetween, the movable pulley 313 carried by the piston plate 21 continues to move downward to pull the pull rope 314, and the clamping plates 32 on the a movable column 31 and the c movable column 31 limit the contact with the chip substrate, so that the traction wheel 39 on the a movable column 31 rotates, thereby continuously pulling the b movable column 31 to move towards the fixed shaft 34, and the rotating plate 35 and the linkage plate 37 between the b movable column 31 and the d movable column 31 cause the clamping plates 32 on the b movable column 31 and the d movable column 31 to contact the chip substrate, so as to perform secondary centering and self-adaptive positioning and clamping; Step four: after the four groups of clamping plates 32 contact the chip substrate, the synchronous relative movement of the four groups of movable columns 31 causes the clamping plates 32 to carry the rotating block 316 to deflect, and the V-shaped elastic plate 317 on the clamping plate 32 extrudes the edge top of the chip substrate, and then elastically deforms to maintain the state that the chip substrate is attached to the adsorption seat 33 and the rotating table 11, the through cavity 320 on the rotating block 316 is completely rotated and attached to the sealing pad area of the inner wall of the installation cavity 315, so that the through cavity 320 and the installation cavity 315 are not communicated, and the through cavity 320 causes the communication cavity 318 and the air cavity 319 to be communicated, the piston plate 21 continues to descend, the adsorption chamber is communicated with the air pipe and the plurality of adsorption seats 33 through the communication cavity 318, the through cavity 320, the air cavity 319, and the plurality of adsorption seats 33 are supported and fixed on the chip substrate through the adsorption holes on the top of the rotating table 11 and the plurality of adsorption seats 33. Step five: the piston plate 21 is lowered again, the adsorption fixed force is strengthened, and the plurality of movable columns 31 are continuously relatively moved, the adsorption seat 33 is slidably connected with the movable column 31, the adsorption seat 33 is adsorbed and fixed with the chip substrate, the relative sliding between the adsorption seat 33 and the movable column 31 is caused, the sliding connection between the L-shaped rod 322 and the U-shaped plate 323 is combined, and the clamping plate 32 is further deflected away from the chip substrate, so that the chip substrate is prevented from being shielded by the clamping plate 32.

[0028] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. An adsorptive positioning rotary platform for chip substrate processing, comprising a base (1) and a rotating table (11) rotatably mounted on the top of the base (1), characterized in that, The rotating table (11) is provided with an adsorption mechanism (2) for fixing the middle part of the chip substrate, and a let-out positioning mechanism (3) for positioning and fixing the chip substrate from the edge part, the adsorption mechanism (2) comprises a plurality of adsorption holes opened in the top of the rotating table (11), and a piston plate (21) slidingly connected in the rotating table (11), the let-out positioning mechanism (3) comprises four groups of movable columns (31) slidingly connected with the rotating table (11), the movable column (31) is provided with a clamping plate (32) for abutting against the edge part of the chip substrate, and an adsorption seat (33) for adsorbing and supporting the edge part of the chip substrate.

2. The adsorptive positioning rotary platform for chip substrate processing according to claim 1, wherein, The base (1) is provided with a servo motor (12) for driving the rotating table (11) to deflect, the bottom of the piston plate (21) and the bottom of the rotating table (11) are fixedly provided with an electric push rod (22) and a plurality of telescopic guide rods (23), and the annular inner wall of the rotating table (11) is provided with a through groove.

3. The adsorptive positioning rotary platform for chip substrate processing according to claim 1, wherein, The top of the rotating table (11) is fixedly connected with a fixed shaft (34), and two groups of rotating plates (35) are rotatably connected with the fixed shaft (34), one end of the movable column (31) is fixedly connected with a mounting plate (36), and the mounting plate (36) and the end of the corresponding rotating plate (35) are hingedly connected with a linkage plate (37), and the mounting plate (36) and the inner wall of the rotating table (11) are fixedly connected with a tension spring (38).

4. The adsorptive positioning rotary platform for chip substrate processing according to claim 3, wherein, Two groups of adjacent mounting plates (36) are fixedly provided with traction wheels (39), the fixed shaft (34) is fixedly connected with a horizontal plate (310), the horizontal plate (310) is rotatably connected with a guide wheel (311) and fixedly connected with a fixed pulley (312), the top of the piston plate (21) is fixedly provided with a movable pulley (313), the horizontal plate (310) and the fixed shaft (34) are fixedly connected with a pull rope (314) guided through the traction wheel (39), the guide wheel (311), the fixed pulley (312) and the movable pulley (313) in sequence.

5. The adsorptive positioning rotary platform for chip substrate processing according to claim 1, wherein, The free end of the movable column (31) is provided with a mounting cavity (315), and the mounting cavity (315) is rotatably connected with a rotating block (316) fixedly connected with the clamping plate (32), and the top of the clamping plate (32) on one side of the adsorption seat (33) is fixedly connected with a V-shaped elastic plate (317).

6. The adsorptive positioning rotary platform for chip substrate processing according to claim 5, wherein, The inner part of the movable column (31) is provided with a communication cavity (318) and a gas cavity (319) in communication with the mounting cavity (315), and the communication cavity (318) penetrates the mounting plate (36), the annular outer wall of the rotating block (316) is provided with a through cavity (320), the arc-shaped inner wall of the mounting cavity (315) is embeddedly provided with a sealing gasket slidingly abutting against the annular side wall of the rotating block (316), and the gas cavity (319) and the adsorption seat (33) are fixedly communicated through a gas pipe.

7. The adsorptive positioning rotary platform for chip substrate processing according to claim 6, wherein, The top of the movable column (31) is provided with a convex groove, the bottom of the adsorption seat (33) is fixedly connected with a convex block in sliding connection with the convex groove, and a spring (321) is fixedly connected between one side of the convex block and the inner wall of the convex groove.

8. The adsorptive positioning rotary platform for chip substrate processing according to claim 7, wherein, The block shaft of the rotating block (316) is fixedly connected with an L-shaped rod (322), and the bottom of the adsorption seat (33) is fixedly connected with a U-shaped plate (323) in sliding connection with the L-shaped rod (322).

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