Power management module packaging method integrating dynamic thermal management and electromagnetic compatibility

Abstract

The invention discloses a power management module packaging method integrating dynamic thermal management and electromagnetic compatibility, and the method comprises the steps: preparing a packaging substrate which integrates a grounding plane, a power transmission line and an embedded filtering structure; a power management chip, a dynamic thermal management unit comprising a micro-channel heat dissipation assembly and a temperature sensing assembly, and an electromagnetic compatibility auxiliary element are fixed on a substrate, electrical connection is realized through a bonding wire or flip-chip bonding, an electromagnetic shielding layer with a hollow heat dissipation structure is covered, and a packaging shell with a heat conduction insulating layer on the inner wall is assembled to complete packaging. According to the invention, integration of thermal management and electromagnetic compatibility is realized, the heat dissipation requirement is dynamically adapted, electromagnetic interference is doubly suppressed, the heat dissipation efficiency and the shielding effect are considered, the working stability and the integration degree of the power management module are remarkably improved, the size is reduced, and the requirements of high-end electronic equipment are adapted.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of power management module packaging technology, and particularly relates to a power management module packaging method integrating dynamic thermal management and electromagnetic compatibility. BACKGROUND

[0002] In the existing power management module packaging technology, thermal management and electromagnetic compatibility are often designed and processed separately, lacking systematic integration consideration.

[0003] On the one hand, if the heat generated by the power management chip during operation cannot be dissipated in time, the performance of the chip will be attenuated, the service life will be shortened, and even the chip will be directly disabled. Traditional heat dissipation structures are mostly fixed designs and cannot dynamically adjust the heat dissipation capacity according to the real-time heat generation of the chip. Therefore, there is a waste of energy due to insufficient heat dissipation.

[0004] On the other hand, during the operation of the module, the power transmission line and the chip itself will generate electromagnetic interference, and the external electromagnetic environment will also interfere with the module. The existing electromagnetic compatibility solutions mostly use single shielding or external filtering elements, which not only occupy a large space and have low integration, but also are prone to layout conflicts with the heat dissipation structure, resulting in poor shielding effect or blocked heat dissipation channels.

[0005] In addition, the selection of the material and process design of the packaging substrate lacks comprehensive optimization of the thermal conductivity, electrical conductivity and insulation performance. Improper matching of electrical connection process parameters can easily lead to problems such as excessive contact resistance and unstable connection, which further affects the stability and overall performance of the module, and cannot meet the needs of high-end electronic devices for high integration, high stability and miniaturization of power management modules. SUMMARY

[0006] The purpose of the present application is to provide a power management module packaging method integrating dynamic thermal management and electromagnetic compatibility, in order to solve the technical problems of separate design, poor coordination and low integration of thermal management and electromagnetic compatibility in the existing power management module packaging.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0008] A power management module packaging method integrating dynamic thermal management and electromagnetic compatibility, comprising the following steps:

[0009] Step 1: preparing a packaging substrate, the packaging substrate internally integrating a ground plane, a power transmission line and an embedded filter structure, the embedded filter structure comprising at least two LC filter units coupled to each other;

[0010] Step 2: fixing the power management chip, the dynamic thermal management unit and the electromagnetic compatibility auxiliary element in the preset area of the packaging substrate, the dynamic thermal management unit comprising a micro-channel heat dissipation assembly and a temperature sensing assembly, the temperature sensing assembly being signal connected with the power management chip;

[0011] Step 3: realizing the electrical connection between the power management chip, the dynamic thermal management unit, the electromagnetic compatibility auxiliary element and the packaging substrate through a bonding lead or a flip-chip process;

[0012] Step 4: covering the electromagnetic shielding layer on the surface of the packaging substrate, the electromagnetic shielding layer being electrically connected with the ground plane of the packaging substrate, and the electromagnetic shielding layer being provided with a hollow heat dissipation structure corresponding to the area of the dynamic thermal management unit;

[0013] Step 5: assembling the packaging shell, the inner wall of the packaging shell being provided with a heat-conducting insulation layer, the heat-conducting insulation layer being closely attached to the micro-channel heat dissipation assembly of the dynamic thermal management unit, and the packaging of the power management module being completed.

[0014] As a preferred scheme of the present application, in step 1, the packaging substrate adopts a ceramic-metal composite substrate, the ceramic-metal composite substrate being composed of an alumina ceramic layer and a copper layer by active metal brazing process, the thickness of the ground plane being 0.3-0.8 mm, and the line width of the power transmission line being 0.5-2 mm.

[0015] As a preferred scheme of the present application, in step 2, the micro-channel heat dissipation assembly comprises a micro-channel substrate and a micro-pump body, the micro-channel substrate being internally provided with a serpentine micro-channel, the inner diameter of the serpentine micro-channel being 0.1-0.3 mm, the micro-pump body being signal connected with the control port of the power management chip and used for adjusting the flow rate of the heat dissipation medium in the micro-channel according to the detection signal of the temperature sensing assembly.

[0016] As a preferred scheme of the present application, in step 2, the temperature sensing assembly adopts a platinum resistance temperature sensor, the detection end of the platinum resistance temperature sensor being attached to the surface of the active area of the power management chip, the detection accuracy being ±0.1℃, and the response time being ≤10 ms.

[0017] As a preferred scheme of the present application, in step 2, the electromagnetic compatibility auxiliary element comprises a common mode choke and a multilayer chip capacitor, the common mode choke being connected in series at the input end of the power transmission line, and the multilayer chip capacitor being connected in parallel between the ground plane and the power transmission line to form a common mode interference suppression loop.

[0018] As a preferred scheme of the present application, in step 4, the electromagnetic shielding layer adopts a copper foil or a nickel-silver alloy foil, the thickness being 0.1-0.2 mm, the hollow heat dissipation structure being a honeycomb-shaped through hole, the hole diameter of the honeycomb-shaped through hole being 0.5-1 mm, and the porosity being 30%-50%.

[0019] As a preferred scheme of the present application, in step 3, the flip-chip process uses tin-lead solder or lead-free solder, the welding temperature is 220-260℃, the welding pressure is 0.1-0.3MPa, and the welding time is 3-8s.

[0020] As a further preferred scheme of the present application, the heat dissipation medium uses deionized water or ethylene glycol aqueous solution, the mass fraction of ethylene glycol in the ethylene glycol aqueous solution is 20%-40%, and the adjusting flow rate range of the micro pump body is 5-50mL / min.

[0021] As a preferred scheme of the present application, in step 4, the electromagnetic shielding layer is electrically connected to the ground plane of the packaging substrate through conductive adhesive, the volume resistivity of the conductive adhesive is ≤1×10 -4 Ω·cm, and the adhesion is ≥5N / cm.

[0022] As a preferred scheme of the present application, in step 5, the heat-conducting insulating layer uses aluminum nitride ceramic sheet or silicon carbide ceramic sheet, the thickness is 0.2-0.5mm, the thermal conductivity is ≥150W / (m·K), and the breakdown voltage is ≥10kV / mm.

[0023] Compared with the prior art, the present application has the following beneficial effects:

[0024] 1. The synergy problem of separate design of thermal management and electromagnetic compatibility in traditional technology is solved, the adaptive design of filtering, shielding layer and heat dissipation structure is integrated in the packaging substrate, high-efficiency heat dissipation and reliable electromagnetic compatibility are realized in the same packaging system, the working stability of the power management module is greatly improved, and the performance compromise caused by single function optimization is avoided.

[0025] 2. The dynamic thermal management mechanism realizes real-time matching of heat dissipation capacity and chip heat demand through precise temperature detection and flow rate adjustment of the heat dissipation medium, avoids heat dissipation deficiency or energy waste of fixed heat dissipation mode, stabilizes the chip temperature in the appropriate interval, effectively prolongs the service life of the chip, and improves the adaptability of the module under complex working conditions.

[0026] 3. In terms of electromagnetic compatibility, the combination design of embedded filtering structure, electromagnetic shielding layer and auxiliary elements forms double interference suppression, which can block external electromagnetic interference and suppress internal interference leakage, significantly improves the electromagnetic compatibility performance of the module, and guarantees the accuracy of power transmission and signal control.

[0027] 4. The details such as packaging substrate material, electrical connection process and heat-conducting insulating layer are optimized, which further improves the structural strength, electrical connection reliability and heat dissipation efficiency of the module, and the integrated design greatly reduces the overall volume of the module, improves the integration, and better meets the miniaturization and high-performance requirements of high-end electronic equipment. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described below are only individual cases of the embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0029] Figure 1 The flow chart of the embodiments of the present application. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the following will further describe the embodiments of the present application in combination with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not used to limit the present application.

[0031] In the description of the embodiments of the present application, it should be understood that the terms "upper", "lower", "front", "back", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0032] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, integral connection, or detachable connection; it can be the communication inside two elements; it can be direct connection, or indirect connection through intermediate medium; for those skilled in the art, the specific meaning of the above terms in the embodiments of the present application should be understood according to the specific circumstances.

[0033] As shown in the figure, the present application is a power management module packaging method integrating dynamic thermal management and electromagnetic compatibility, which comprises the following steps: Figure 1

[0034] Step 1: preparing a packaging substrate, the packaging substrate is internally integrated with a ground plane, a power transmission line and an embedded filter structure, the embedded filter structure comprises at least two LC filter units coupled with each other.

[0035] Step 2: fixing a power management chip, a dynamic thermal management unit and an electromagnetic compatibility auxiliary element in a preset area of the packaging substrate, the dynamic thermal management unit comprises a micro-channel heat dissipation assembly and a temperature sensing assembly, the temperature sensing assembly is signal connected with the power management chip.

[0036] ​Step 3: The electrical connection between the power management chip, the dynamic thermal management unit, the electromagnetic compatibility auxiliary element, and the packaging substrate is achieved through a bonding lead or flip-chip process.

[0037] Step 4: An electromagnetic shielding layer is covered on the surface of the packaging substrate, the electromagnetic shielding layer is electrically connected with the ground plane of the packaging substrate, and the electromagnetic shielding layer is provided with a hollow cooling structure corresponding to the region of the dynamic thermal management unit.

[0038] Step 5: The packaging shell is assembled, the inner wall of the packaging shell is provided with a heat-conducting insulation layer, the heat-conducting insulation layer is closely attached to the micro-channel cooling assembly of the dynamic thermal management unit, and the packaging of the power management module is completed.

[0039] The above technical solution integrates the filtering structure in the packaging substrate, synchronously fixes the dynamic thermal management unit and the electromagnetic compatibility auxiliary element, and is matched with the electromagnetic shielding layer with a hollow cooling structure and the heat-conducting insulation shell attached to the thermal management unit, thereby realizing the integrated design of thermal management and electromagnetic compatibility. This not only solves the poor coordination problem when dealing with the two separately, but also takes into account the electromagnetic shielding effect and cooling efficiency through the design of the shielding layer hollow and the heat-conducting insulation layer, thereby significantly improving the working stability and integration of the power management module and reducing the overall volume.

[0040] In step 1, the packaging substrate adopts a ceramic-metal composite substrate, which is composed of an alumina ceramic layer and a copper layer through active metal brazing process. The thickness of the ground plane is 0.3-0.8mm, and the line width of the power transmission line is 0.5-2mm. The ceramic-metal composite substrate is made by active metal brazing, which combines the specific structure of the ground plane and the power transmission line, fully utilizes the insulation of ceramic and the heat conduction and electrical conductivity of metal. The brazing process ensures the firmness of the substrate combination, the design of the ground plane and the power line optimizes the current transmission path, reduces the transmission loss, and at the same time improves the heat dissipation capacity and structural strength of the substrate, providing a reliable foundation for the subsequent integration and stable work of the elements.

[0041] In step 2, the micro-channel cooling assembly includes a micro-channel substrate and a micro-pump body. The micro-channel substrate has a serpentine micro-channel inside, and the inner diameter of the serpentine micro-channel is 0.1-0.3mm. The micro-pump body is signal connected with the control port of the power management chip, and is used to adjust the flow rate of the heat dissipation medium in the micro-channel according to the detection signal of the temperature sensing assembly. The serpentine micro-channel of the micro-channel cooling assembly increases the heat dissipation contact area, and the micro-pump body is signal connected with the chip control port, which can dynamically adjust the flow rate of the heat dissipation medium according to the temperature sensing signal. This design can accurately match the cooling capacity according to the heating situation of the power management chip in different working states, avoid the insufficient cooling or excessive energy consumption caused by fixed cooling method, ensure that the chip is always in the appropriate temperature range, improve the working reliability and prolong the service life.

[0042] In step 2, the temperature sensing component adopts a platinum resistance temperature sensor, the detection end of the platinum resistance temperature sensor is attached to the surface of the active area of the power management chip, the detection accuracy is ±0.1℃, and the response time is ≤10ms. The detection end of the platinum resistance temperature sensor is directly attached to the active area of the chip, which can accurately capture the temperature change of the core heating part of the chip and respond quickly. This enables the dynamic thermal management unit to obtain accurate temperature feedback in a timely manner, providing a reliable basis for heat dissipation regulation, avoiding the problem of heat dissipation not in time or improper regulation caused by temperature detection deviation, and ensuring the accuracy and effectiveness of thermal management.

[0043] In step 2, the electromagnetic compatibility auxiliary element includes a common mode choke coil and a multilayer chip capacitor, the common mode choke coil is connected in series at the input end of the power transmission line, and the multilayer chip capacitor is connected in parallel between the ground plane and the power transmission line, forming a common mode interference suppression loop. By connecting the common mode choke coil in series at the input end of the power transmission line and connecting the multilayer chip capacitor in parallel between the ground plane and the power line, a specific common mode interference suppression loop is formed. It can effectively suppress the common mode interference generated during power transmission, reduce the influence of interference on the operation of the power management chip, prevent internal interference from leaking out, improve the electromagnetic compatibility of the module, and ensure the stability of power transmission and the accuracy of chip operation.

[0044] In step 4, the electromagnetic shielding layer adopts copper foil or nickel-silver alloy foil with a thickness of 0.1-0.2mm, and the hollow heat dissipation structure is a honeycomb-shaped through hole with a pore size of 0.5-1mm and a porosity of 30%-50%. The electromagnetic shielding layer adopts metal foil material, which can effectively block external electromagnetic interference and prevent internal electromagnetic signals from leaking out. The hollow heat dissipation structure corresponding to the thermal management unit area provides a channel for heat dissipation without damaging the integrity of the shielding. This design solves the mutual obstruction problem between electromagnetic shielding and heat dissipation, realizes the synergistic effect of the two, and meets the electromagnetic compatibility and heat dissipation requirements, avoiding heat accumulation caused by the shielding layer.

[0045] In step 3, the flip chip process adopts tin-lead solder or lead-free solder, the welding temperature is 220-260℃, the welding pressure is 0.1-0.3MPa, and the welding time is 3-8s. The flip chip process selects appropriate solder, controls reasonable welding temperature, pressure and time, and can realize reliable electrical connection between the power management chip, the thermal management unit and the packaging substrate. It not only ensures the firmness and conductivity of the welding place, reduces the contact resistance to reduce signal and power transmission loss, but also avoids damage to the components caused by improper welding parameters, improves the stability and durability of electrical connection, and ensures the overall electrical performance of the module.

[0046] The heat dissipation medium adopts deionized water or glycol water solution, the mass fraction of glycol in the glycol water solution is 20%-40%, and the flow rate adjusting range of the micro pump body is 5-50 mL / min. The deionized water or glycol water solution with excellent heat conduction performance is selected as the heat dissipation medium, and the flow rate adjusting function of the micro pump body is matched, so that the heat of the micro-channel heat dissipation assembly can be efficiently transferred. Through dynamic adjustment of the flow rate, the heat dissipation efficiency can be flexibly adjusted according to the heat generation intensity of the chip, so that the heat can be quickly removed under different working conditions, the stability of the heat dissipation effect is maintained, and the performance of the chip is prevented from being reduced due to excessive heat generation.

[0047] In step 4, the electromagnetic shielding layer is electrically connected to the ground plane of the packaging substrate through conductive glue, the volume resistivity of the conductive glue is ≤1*10 -4 Ω·cm, and the adhesion is ≥5 N / cm. The electromagnetic shielding layer is connected to the ground plane through conductive glue with low resistivity and high adhesion, so that good electrical conduction between the shielding layer and the ground plane is ensured, the shielding layer forms effective grounding, the electromagnetic shielding effect is improved, and the shielding layer is prevented from falling off or shifting during long-term operation of the module. The shielding performance attenuation or failure caused by poor connection is avoided, and the stability of the electromagnetic compatibility performance is ensured.

[0048] In step 5, the heat-conducting insulating layer adopts an aluminum nitride ceramic sheet or a silicon carbide ceramic sheet, the thickness is 0.2-0.5 mm, the thermal conductivity is ≥150 W / (m·K), and the breakdown voltage is ≥10 kV / mm. The heat-conducting insulating layer adopts a ceramic sheet with high thermal conductivity, which is matched with the dynamic thermal management unit, can quickly conduct the heat collected by the thermal management unit to the packaging shell, and at the same time, relies on the excellent insulation of the ceramic sheet to avoid electrical short circuit during heat conduction. The heat dissipation efficiency of the thermal management is improved, and the electrical safety of the module is ensured, so that the electrical performance stability of the elements is not affected during the heat dissipation process.

[0049] In summary, the overall flow and principle of the packaging method of the embodiment of the application are as follows:

[0050] 1. A packaging substrate integrated with a ground plane, a power transmission line and an embedded filter structure is prepared, and an electromagnetic compatibility basic framework is constructed in advance to provide a stable carrier for subsequent component integration and signal transmission.

[0051] 2. The power management chip, the dynamic thermal management unit with a temperature sensing component and the electromagnetic compatibility auxiliary component are fixed in the preset area of the substrate, the temperature sensing component monitors the temperature of the chip core area in real time and transmits a signal to the chip control end.

[0052] 3. Reliable electrical connection of each component and the substrate is completed through a bonding wire or flip-chip process to ensure efficient transmission of signals and power.

[0053] 4. Covering the electromagnetic shielding layer which is in communication with the ground plane on the surface of the substrate, the shielding layer is reserved with a hollow structure corresponding to the area of the thermal management unit, which realizes the electromagnetic shielding of the whole module and does not hinder the heat dissipation.

[0054] 5. Assembling the packaging shell with the heat-conducting insulation layer on the inner wall, the heat-conducting insulation layer is closely attached to the thermal management unit, so that the heat is quickly conducted to the shell for dissipation; at the same time, the chip controls the micro-pump body of the thermal management unit according to the temperature sensing signal, and dynamically adjusts the flow rate of the heat dissipation medium to match the real-time heat dissipation demand.

[0055] 6. During the whole process, the embedded filter, the electromagnetic shielding layer and the auxiliary element form double electromagnetic interference suppression, the dynamic thermal management unit adjusts the heat dissipation efficiency in real time according to the temperature of the chip, and the two work together and do not interfere with each other, and the integration design is realized through the optimization of the packaging structure.

[0056] The technical effects of the embodiments of the application are as follows:

[0057] 1. The synergy problem of thermal management and electromagnetic compatibility designed separately in the traditional technology is solved, the adaptive design of the filter, the shielding layer and the heat dissipation structure is integrated on the packaging substrate, the efficient heat dissipation and reliable electromagnetic compatibility are realized in the same packaging system, the working stability of the power management module is greatly improved, and the performance compromise caused by single function optimization is avoided.

[0058] 2. The dynamic thermal management mechanism realizes the real-time matching of the heat dissipation capacity and the chip heating demand through accurate temperature detection and heat dissipation medium flow rate adjustment, avoids the heat dissipation deficiency or energy waste of the fixed heat dissipation mode, stabilizes the chip temperature in the appropriate interval, effectively prolongs the service life of the chip, and improves the adaptability of the module under complex working conditions.

[0059] 3. In terms of electromagnetic compatibility, the combination design of the embedded filter structure, the electromagnetic shielding layer and the auxiliary element forms double interference suppression, which can block the invasion of external electromagnetic interference and suppress the external leakage of internal interference, significantly improves the electromagnetic compatibility performance of the module, and guarantees the accuracy of power transmission and signal control.

[0060] 4. The details such as the material of the packaging substrate, the electrical connection process and the heat-conducting insulation layer are optimized, which further improves the structural strength, the electrical connection reliability and the heat dissipation efficiency of the module, and the integrated design greatly reduces the overall volume of the module, improves the integration, and better meets the miniaturization and high-performance requirements of high-end electronic equipment.

[0061] The above shows and describes the basic principles of the present application, the above is only the preferred embodiment of the present application, and does not limit the present application, the above embodiment and the description in the specification only illustrate the principles of the present application, any modification, equivalent replacement and improvement within the scope of the present application, etc. should be included in the protection scope of the present application.

Claims

1. An integrated dynamic thermal management and electromagnetic compatibility power management module packaging method, characterized by The method comprises the following steps: Step 1: preparing a packaging substrate, which internally integrates a grounding plane, a power transmission line and an embedded filter structure, the embedded filter structure comprising at least two LC filter units coupled with each other; Step 2: fixing a power management chip, a dynamic thermal management unit and an electromagnetic compatibility auxiliary element in a preset area of the packaging substrate, the dynamic thermal management unit comprising a micro-channel heat dissipation component and a temperature sensing component, the temperature sensing component being signal-connected with the power management chip; Step 3: realizing electrical connection between the power management chip, the dynamic thermal management unit, the electromagnetic compatibility auxiliary element and the packaging substrate through a bonding lead or a flip-chip process; Step 4: covering an electromagnetic shielding layer on the surface of the packaging substrate, the electromagnetic shielding layer being electrically connected with the grounding plane of the packaging substrate, and a hollow heat dissipation structure being arranged in the area corresponding to the dynamic thermal management unit of the electromagnetic shielding layer; Step 5: assembling a packaging shell, an inner wall of the packaging shell being provided with a heat-conducting insulation layer, the heat-conducting insulation layer being closely attached to the micro-channel heat dissipation component of the dynamic thermal management unit, and the packaging of the power management module being completed.

2. The method of claim 1, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: In step 1, the packaging substrate adopts a ceramic-metal composite substrate, which is composed of an alumina ceramic layer and a copper layer through active metal brazing process, the thickness of the grounding plane is 0.3-0.8 mm, and the line width of the power transmission line is 0.5-2 mm.

3. The method of claim 1, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: In step 2, the micro-channel heat dissipation component comprises a micro-channel substrate and a micro pump body, a serpentine micro-channel is arranged in the micro-channel substrate, the inner diameter of the serpentine micro-channel is 0.1-0.3 mm, the micro pump body is signal-connected with the control port of the power management chip, and is used for adjusting the flow rate of the heat dissipation medium in the micro-channel according to the detection signal of the temperature sensing component.

4. The method of claim 1, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: In step 2, the temperature sensing component adopts a platinum resistance temperature sensor, the detection end of the platinum resistance temperature sensor is attached to the surface of the active area of the power management chip, the detection accuracy is ±0.1℃, and the response time is ≤10 ms.

5. The method of claim 1, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: In step 2, the electromagnetic compatibility auxiliary element comprises a common mode choke and a multilayer chip capacitor, the common mode choke is connected in series at the input end of the power transmission line, and the multilayer chip capacitor is connected in parallel between the grounding plane and the power transmission line, forming a common mode interference suppression loop.

6. The method of claim 1, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: In step 4, the electromagnetic shielding layer adopts a copper foil or a nickel-silver alloy foil, the thickness is 0.1-0.2 mm, the hollow heat dissipation structure is a honeycomb-shaped through hole, the hole diameter of the honeycomb-shaped through hole is 0.5-1 mm, and the porosity is 30%-50%.

7. The method of claim 1, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: In step 3, the flip-chip process adopts tin-lead solder or lead-free solder, the welding temperature is 220-260℃, the welding pressure is 0.1-0.3 MPa, and the welding time is 3-8 s.

8. The method of claim 3, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: The heat dissipation medium adopts deionized water or an ethylene glycol aqueous solution, the mass fraction of ethylene glycol in the ethylene glycol aqueous solution is 20%-40%, and the adjustment flow rate range of the micro pump body is 5-50 mL / min.

9. The method of claim 1, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: In step 4, the electromagnetic shielding layer is electrically connected to the ground plane of the packaging substrate through conductive adhesive, the volume resistivity of the conductive adhesive is ≤1×10 -4 Ω·cm, and the adhesion is ≥5 N / cm.

10. The method of claim 1, wherein the integrated dynamic thermal management and electromagnetic compatibility power management module package is characterized by: In step 5, the heat-conducting insulating layer is made of aluminum nitride ceramic sheet or silicon carbide ceramic sheet, with a thickness of 0.2-0.5 mm, a heat-conducting coefficient of ≥150 W / (m·K), and a breakdown voltage of ≥10 kV / mm.

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