Multi-laser confocal processing mechanism, processing method and processing equipment
By using a multi-laser confocal processing mechanism, which combines lens combinations for focusing and independently controls the lasers, the problems of low efficiency and large size caused by tilted laser installation in existing technologies are solved, achieving uniform laser energy and efficient processing of complex processes.
Patent Information
- Application Number
- CN202411266492.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2026-03-13
AI Technical Summary
In existing laser processing technologies, the tilted installation of multi-fiber lasers leads to cumbersome angle adjustments, affecting processing efficiency and structural size. Furthermore, the complex optical path results in high costs and makes it impossible to achieve complex processing techniques.
The multi-laser confocal processing mechanism uses a combination of the first and second lens groups to focus the light, ensuring that the laser incident directions are consistent. This eliminates the need for tilted installation, simplifies the laser optical path, and allows the lens groups to independently control the laser's switching and power, thus enabling multifocal processing.
It reduces the size of the processing mechanism, improves the uniformity of laser energy distribution and processing power, enables complex processes, simplifies the control process, and improves processing efficiency and quality.
Smart Images

Figure CN121649560A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of laser processing, specifically to a multi-laser confocal processing mechanism, a processing method using the processing mechanism, and processing equipment employing the processing mechanism. Background Technology
[0002] Laser processing technology utilizes the interaction between laser beams and matter to perform cutting, welding, additive manufacturing, surface treatment, drilling, and micromachining on materials (including metals and non-metals). As an advanced manufacturing technology, laser processing has been widely applied in important sectors of the national economy such as automobiles, electronics, electrical appliances, aerospace, metallurgy, and machinery manufacturing, playing an increasingly important role in improving product quality, labor productivity, automation, pollution reduction, and reducing material consumption.
[0003] Laser processing is widely used in additive manufacturing and welding. Currently, most direct laser processing methods employ either tilted fiber lasers or ring lasers formed by optical path shaping. The former, to improve laser uniformity and processing power, typically involves arranging multiple fiber lasers around the material being processed and tilting them inwards. Since the lasers must be tilted to direct the laser to the same cladding point, adjusting the angles of each laser is crucial. The more tilted lasers there are, the more cumbersome the adjustment becomes, significantly impacting the efficiency of the processing mechanism. Inaccurate laser angle adjustment can even lead to cladding project failure. The tilted laser structure also results in a larger processing mechanism and is prone to interference during processing. The latter method involves a complex optical path and high manufacturing costs. Although it produces a relatively uniform laser spot, it cannot adjust the non-uniformity of the spot, making it unsuitable for some complex processing techniques. Summary of the Invention
[0004] In view of the shortcomings of the prior art, the present invention provides a multi-laser confocal processing mechanism, a processing method using the processing mechanism, and a processing equipment using the processing mechanism.
[0005] The specific technical solution of the present invention is as follows: a multi-laser confocal processing mechanism, including a laser source, and a first lens group and a second lens group arranged sequentially along the laser emission direction of the laser source; the laser source is composed of multiple lasers, the first lens group is composed of multiple lens groups, and the lens groups perform a first focusing of the laser emitted by the lasers; the laser emitted after being focused by the lens groups is entirely within the coverage area of the second lens group, and the workpiece is processed after being focused a second time by the second lens group.
[0006] As a preferred embodiment of the present invention, it further includes a processing material, which is conveyed to the focusing portion of the second lens group by a material conveying mechanism for processing.
[0007] As a preferred embodiment of the present invention, a material conveying hole is provided at the middle position of the laser light source, the first lens group and the second lens group, and the processing material is conveyed through the material conveying hole.
[0008] As a preferred embodiment of the present invention, the laser within the laser source can be independently controlled to switch on and off.
[0009] As a preferred embodiment of the present invention, the laser within the laser source can have its power independently controlled.
[0010] As a preferred embodiment of the present invention, a plurality of lasers within the laser source form a laser group, and the laser group can be independently controlled to switch on and off.
[0011] As a preferred embodiment of the present invention, the power of the laser array within the laser source can be independently controlled.
[0012] As a preferred embodiment of the present invention, the laser is a fiber laser or a semiconductor laser.
[0013] As a preferred embodiment of the present invention, the lens group includes at least one condenser lens.
[0014] As a preferred embodiment of the present invention, the lens group includes a first auxiliary lens.
[0015] As a preferred embodiment of the present invention, the second lens group includes at least one condenser lens.
[0016] As a preferred embodiment of the present invention, the second lens group includes a second auxiliary lens, which is located on the laser path of the laser within the laser source.
[0017] As a preferred embodiment of the present invention, the second lens group comprises multiple radially nested annular lenses.
[0018] As a preferred embodiment of the present invention, the second lens group can be laterally displaced relative to the laser light source.
[0019] As a preferred embodiment of the present invention, the second lens group can be longitudinally displaced relative to the laser light source.
[0020] As a preferred embodiment of the present invention, a mounting base is also included, on which the laser light source is mounted.
[0021] As a preferred embodiment of the present invention, the mounting base includes a horizontal mounting portion, and the laser light source is mounted on the horizontal mounting portion.
[0022] As a preferred embodiment of the present invention, the mounting base includes a vertical mounting portion, and the laser light source is mounted on the vertical mounting portion.
[0023] As a preferred embodiment of the present invention, the first lens group is mounted on the mounting base, and the lens group within the first lens group is positioned opposite to the laser within the laser source.
[0024] As a preferred embodiment of the present invention, the second lens group is mounted on the mounting base.
[0025] As a preferred embodiment of the present invention, it includes a plurality of mounting bases of different sizes, which can be nested and combined for installation.
[0026] As a preferred embodiment of the present invention, the second lens group includes multiple sets of annular lenses of different sizes, which are respectively mounted on the bottom of the mounting bases of different sizes nested inside and outside.
[0027] As a preferred embodiment of the present invention, a first protective mirror is installed between the first lens group and the second lens group.
[0028] As a preferred embodiment of the present invention, a second protective mirror is installed at the bottom of the second lens group.
[0029] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the lasers within the laser source to generate at least one graphic region, and controls the laser source within the graphic region to be turned on during the processing.
[0030] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the lasers within the laser source to generate at least one graphic region, and controls the position change of the graphic region at a certain frequency; the control system dynamically controls the lasers within the graphic region to turn on, and controls the lasers outside the graphic region to turn off.
[0031] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the lasers within the laser source to generate at least one graphic region, and controls the generation or elimination of part or all of the graphic region during the processing; the control system dynamically controls the lasers within the graphic region to turn on, and controls the lasers outside the graphic region to turn off.
[0032] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the lasers within the laser source to generate at least one graphic region, and controls the power change of the laser source within the graphic region during the processing.
[0033] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the lasers within the laser source to generate at least one graphic region, and controls the position change of the graphic region at a certain frequency; the control system dynamically controls the power change of the lasers within the graphic region.
[0034] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the lasers within the laser source to generate at least one graphic region, and controls the generation or elimination of a portion of the graphic region during the processing; the control system dynamically controls the power change of the lasers within the graphic region.
[0035] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the laser group within the laser source to generate at least one graphic region, and controls the laser source within the graphic region to be turned on during the processing.
[0036] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the laser group within the laser source to generate at least one graphic region, and controls the position change of the graphic region at a certain frequency; the control system dynamically controls the laser group within the graphic region to turn on, and controls the laser group outside the graphic region to turn off.
[0037] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the laser group within the laser source to generate at least one graphic region, and controls the generation or elimination of a portion of the graphic region during the processing; the control system dynamically controls the laser group within the graphic region to turn on, and controls the laser group outside the graphic region to turn off.
[0038] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the laser group within the laser source to generate at least one graphic region, and controls the power change of the laser source within the graphic region during the processing.
[0039] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the laser group within the laser source to generate at least one graphic region, and controls the position change of the graphic region at a certain frequency; the control system dynamically controls the power change of the laser group within the graphic region.
[0040] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the laser group within the laser source to generate at least one graphic region, and controls the generation or elimination of a portion of the graphic region during the processing; the control system dynamically controls the power change of the laser group within the graphic region.
[0041] The processing method is used in the aforementioned multi-laser confocal processing mechanism. The lens group includes a melting lens group and a preheating lens group. The laser emitted from the laser source is focused by the melting lens group and the second lens group to form a molten spot in the molten pool region. The laser emitted from the laser source is focused by the preheating lens group and the second lens group to form a preheating spot in the molten pool region. The area of the preheating spot is larger than the area of the molten spot. The processing method includes: dynamically acquiring the movement direction of the processing mechanism relative to the molten substrate, and the control system dynamically controlling the laser corresponding to the preheating mirror group on one side of the movement direction to turn on or increase its power.
[0042] The processing method is used in the aforementioned multi-laser confocal processing mechanism. The second auxiliary lens is a concave lens or a convex lens. The laser emitted from the laser source does not pass through the second auxiliary lens to focus the laser light and form a molten spot in the molten pool region. The laser emitted from the laser source passes through the second auxiliary lens to focus the laser light and form a preheating spot in the molten pool region. The area of the preheating spot is larger than the area of the molten spot. The processing method includes: dynamically acquiring the movement direction of the multi-laser confocal processing mechanism relative to the molten substrate, and the control system dynamically controlling the activation or power increase of a portion of the lasers on one side of the movement direction corresponding to the second auxiliary lens.
[0043] The processing method is used in the aforementioned multi-laser confocal processing mechanism. The annular lens includes a molten annular lens and a preheated annular lens. The laser emitted from the laser source is focused by the first lens group and the molten annular lens to form a molten spot in the molten pool region. The laser emitted from the laser source is focused by the first lens group and the preheated annular lens to form a preheated spot in the molten pool region. The area of the preheated spot is larger than the area of the molten spot. The processing method includes: dynamically acquiring the movement direction of the multi-laser confocal processing mechanism relative to the molten substrate, and the control system dynamically controlling the activation or power increase of a portion of the lasers on one side of the movement direction corresponding to the preheating annular lens.
[0044] Processing equipment, including the aforementioned multi-laser confocal processing mechanism.
[0045] In summary, the present invention has the following beneficial effects: The multi-laser confocal processing mechanism of this invention uses an array of lasers to form a laser source. The lasers are focused by a first condenser lens group to narrow the divergence angle of the emitted laser, and then a second condenser lens group confocalizes all the lasers in the array. This focusing method ensures that the lasers are installed in the same direction, eliminating the need for adjustment. The laser path and focusing point are more consistent and precise. Furthermore, the identical installation direction of the lasers allows for a reduction in the size of the processing mechanism, particularly in the width direction, making it more compact. The laser array can be arranged very densely, with the number of lasers far exceeding that of a direct-fire laser, enabling a very high overall processing power. The densely distributed lasers result in a more uniform energy distribution of the laser spot, approaching or even achieving a ring-shaped laser beam. The uniformity of light and the fact that array lasers do not require optical path shaping make them structurally simpler than ring lasers. The first and second lens groups can use different focusing degrees on different areas of the laser source to form multi-focal processing, or divide the laser beam into a melting beam and a preheating beam to achieve melting and preheating functions respectively. The laser power of the array laser can be independently controlled, or divided into several groups, with the power of each group independently controlled. This allows the laser power to be controlled to have a non-Gaussian distribution, or to have a non-uniform state in different directions. The processing power can also dynamically change with the movement direction of the processing mechanism, thereby enhancing the process effect and completing some more complex processing techniques. Attached Figure Description
[0046] Figure 1 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, which uses a linear array of lasers within a square region. Figure 2 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, showing the laser array within a regular polygonal region; Figure 3 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which the lasers are arrayed within a circular region; Figure 4 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, which uses a laser in a linear array within a square area when processing materials; Figure 5 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which the lasers are arrayed in a regular polygonal region when processing materials. Figure 6 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which the lasers are arrayed in a circular area when processing materials; Figure 7 For the present invention Figure 4Top view; Figure 8 For the present invention Figure 5 Top view; Figure 9 For the present invention Figure 6 Top view; Figure 10 For the present invention Figure 4 The main view; Figure 11 For the present invention Figure 5 The main view; Figure 12 For the present invention Figure 6 The main view; Figure 13 For the present invention Figure 10 , Figure 11 , Figure 12 One embodiment of the enlarged view of a portion at point A in the middle; Figure 14 For the present invention Figure 10 , Figure 11 , Figure 12 One embodiment of the enlarged view of a portion at point A in the middle; Figure 15 This is a schematic diagram of the structure of the first lens group of the multi-laser confocal processing mechanism of the present invention when a microlens array is used; Figure 16 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which the laser cladding part is in a negative defocus state when the entire mechanism is lowered. Figure 17 This is a schematic diagram of the laser activation structure within the graphic area of the multi-laser confocal processing mechanism of the present invention; Figure 18 For the present invention Figure 17 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 19 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism for moving the graphic region according to the present invention; Figure 20 For the present invention Figure 19 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 21 This is a schematic diagram of the rotating graphic region of the multi-laser confocal processing mechanism of the present invention; Figure 22 For the present invention Figure 21 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 23This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention forming two graphic regions; Figure 24 For the present invention Figure 23 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 25 This is a schematic diagram of the multi-laser confocal processing mechanism of the present invention, which forms two graphic regions, one of which can be opened or closed. Figure 26 For the present invention Figure 25 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 27 This is a schematic diagram of the high-power laser forming the patterned area of the multi-laser confocal processing mechanism of the present invention; Figure 28 For the present invention Figure 27 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 29 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, showing the movement of a graphic region composed of high-power lasers. Figure 30 For the present invention Figure 29 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 31 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, showing the rotation of a graphic region composed of high-power lasers. Figure 32 For the present invention Figure 31 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 33 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, which forms a graphic region for two high-power lasers. Figure 34 For the present invention Figure 33 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 35 This is a schematic diagram of the multi-laser confocal processing mechanism of the present invention, which forms patterned regions of two high-power lasers with different power densities. Figure 36 For the present invention Figure 35 The corresponding laser in Figure 16 A magnified top view of the graphic light spot formed at point B; Figure 37 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which adjacent lasers form a laser group; Figure 38 This is a schematic diagram of the structure of a laser group composed of lasers in a specific area of the multi-laser confocal processing mechanism of the present invention; Figure 39 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention when the cladding material is wire and the laser is a semiconductor laser that emits light from the end face; Figure 40 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention when the cladding material is powder. Figure 41 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention when the cladding material is simultaneously conveyed as wire or powder. Figure 42 This is a schematic diagram of the multi-laser confocal processing mechanism of the present invention when the laser is a fiber laser; Figure 43 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention when the laser is a side-emitting semiconductor laser; Figure 44 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, which forms a preheated spot when the distance between the laser lens group and the laser is adjusted. Figure 45 This is a schematic diagram of the multi-laser confocal processing mechanism of the present invention, in which the laser lens group is a non-collimating lens to diverge the laser and form a preheated spot. Figure 46 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which the laser lens group includes a first auxiliary lens with a concave lens to form a preheated spot through laser divergence. Figure 47 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which the laser lens group includes a first auxiliary lens with a convex lens to form a preheated spot by laser divergence. Figure 48 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, which uses a convex lens to generate spherical aberration; Figure 49 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, which uses a convex lens to generate chromatic aberration; Figure 50 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, which uses a plano-convex lens to generate chromatic aberration; Figure 51 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, which uses double cemented lenses to eliminate chromatic and spherical aberrations; Figure 52 This is a schematic diagram of the Fresnel lens structure used in the second lens group of the multi-laser confocal processing mechanism of the present invention; Figure 53 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, including the second auxiliary lens located in the innermost circle; Figure 54 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, including the second auxiliary lens located in the outermost ring. Figure 55 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, which includes multiple nested ring lenses; Figure 56 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, which includes multiple nested annular lenses with different heights to cancel out aberrations. Figure 57 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, which includes multiple nested annular lenses with different heights to produce different focal points. Figure 58 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which the second lens group is mounted on the mounting base and can be laterally adjusted relative to the laser source. Figure 59 This is a schematic diagram of the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, which allows for longitudinal displacement adjustment relative to the laser source; Figure 60 This is a schematic diagram of the multi-laser confocal processing mechanism of the present invention, in which the laser source and the first lens group are mounted on the mounting base and the laser source is mounted on the horizontal mounting part. Figure 61 This is a schematic diagram of the multi-laser confocal processing mechanism of the present invention, in which the laser source and the first lens group are mounted on the mounting base and the laser source is mounted in the longitudinal mounting part. Figure 62 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, showing the inner and outer nested combination of mounting bases of different sizes; Figure 63 This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, showing the inner and outer nested combination of mounting bases of different sizes; Figure 64 This is a schematic diagram showing the structure of the second lens group of the multi-laser confocal processing mechanism of the present invention, in which the annular lenses are respectively installed at the bottom of the corresponding nested mounting bases; Figure 65 This is a schematic diagram of the multi-laser confocal processing mechanism of the present invention, in which a first protective mirror is installed between the first lens group and the second lens group. Figure 66This is a schematic diagram of the structure of the multi-laser confocal processing mechanism of the present invention, in which a second protective mirror is installed at the bottom of the second lens group; In the figure, 1-laser source, 11-laser, 11a-laser group, 1a-pattern area, 1a1-first pattern area, 1a2-second pattern area, 1b-pattern spot, 1b1-first pattern spot, 1b2-second pattern spot, 1c-pattern outer spot, 2-first lens group, 21-lens group, 21a-first auxiliary lens, 21b-microlens array, 3-second lens group, 31-material conveying hole, 3a-second auxiliary lens, 3b-ring lens, 4-processing material, 5-mounting base, 51-horizontal mounting part, 52-vertical mounting part, 6-first protective mirror, 7-second protective mirror. Detailed Implementation
[0047] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0048] The multi-laser confocal processing mechanism includes a laser source 1, and a first lens group 2 and a second lens group 3 arranged sequentially along the laser emission direction of the laser source 1. The laser source 1 consists of multiple lasers 11, and the first lens group 2 consists of multiple lens groups 21. The lens groups 21 focus the laser emitted by the lasers 11 for the first time. After being focused by the lens groups 21, the laser emitted is entirely within the coverage area of the second lens group 3, and the workpiece is processed after being focused a second time by the second lens group 3.
[0049] like Figures 1-3 As shown, the laser source 1 is composed of multiple lasers 11 with the same incident direction. After the lasers 11 are focused by the first lens group 2 and co-focused by the second lens group 3, they form a laser energy convergence point for processing, which can heat up and melt the workpiece to achieve functions such as laser cutting, laser drilling, and laser heat treatment.
[0050] It also includes processing material 4, which is transported to the focusing part of the second lens group 3 by a material conveying mechanism for processing.
[0051] like Figures 4-12As shown, the laser source 1 is composed of multiple lasers 11 with the same incident direction. After the laser 11 is focused by the first lens group 2 and co-focused by the second lens group 3, it forms a laser energy convergence point for processing. After the processing material 4 is transported to the laser energy convergence point, it can be melted to realize functions such as laser additive manufacturing, laser welding, and laser cladding. Currently, most direct laser melting methods employ inclined installation of fiber lasers. To improve laser uniformity and melting power, multiple fiber lasers are typically arranged around the material and incident inwards at an angle. Since the lasers must be installed at an angle to direct the laser to the same melting area, the angle adjustment of each laser is crucial. The more inclined the lasers, the more cumbersome the adjustment becomes, significantly impacting the efficiency of the processing mechanism. Inaccurate laser angle adjustment can even lead to processing project failure. The inclined installation structure also results in a larger processing mechanism size. In contrast, in a confocal laser 11, the laser incident direction is usually consistent with the conveying direction of the processing material 4. The laser 11 is installed in the same direction, eliminating the need for inclined installation and angle adjustment. A second lens group 3 is used to change the laser path, directing the laser to the direction of the processing material 4. Therefore, the size of the processing mechanism can be reduced, especially in the lateral direction, making it more compact. The lasers 11 within the laser source 1 are arranged in a dense distribution. This can be a linear array within a planar area, an array within a regular polygonal area, an array within a circular area, or a combination of these arrangements. Even if the power of a single laser 11 is relatively small, the overall melting power of the processing mechanism can be significantly increased by superimposing the power of multiple arrayed lasers 11. Confocal lasers can use lasers 11 with relatively small power and volume arranged densely. Although the power of a single laser 11 is smaller than that of current direct-fire lasers, the array arrangement of lasers 11 can be very dense, and the number of lasers 11 can far exceed that of direct-fire lasers, resulting in an overall processing power exceeding that of direct-fire lasers. Furthermore, the dense arrangement of lasers 11 makes the energy distribution of the laser more uniform, approaching or even reaching the uniformity of a ring laser. Since confocal lasers 11 do not require the optical path shaping structure of a ring laser, their structure is simpler compared to ring lasers. Furthermore, unlike ring lasers, the power of the confocal laser 11 can be controlled independently, or the power of each group of lasers 11 can be controlled independently after being grouped. This allows the laser power to be controlled to be non-uniform within the melting range. For some processing operations, the laser power on the front side of the processing mechanism in the direction of movement is usually increased to enhance the melting effect. In order to ensure that the processing mechanism maintains a better melting effect during movement, the laser power must also change dynamically during the melting process. Obviously, the densely arranged lasers 11 can be easily achieved through independent control or independent group control, which is more advantageous in processing technology than ring lasers.
[0052] A material conveying hole 31 is provided at the middle position of the laser light source 1, the first lens group 2 and the second lens group 3, and the processing material 4 passes through the material conveying hole 31 for conveying.
[0053] like Figures 4-12 As shown, the material conveying hole 31 enables the coaxial conveying of the processed material 4 within the laser, thereby ensuring that the laser spot formed by the laser source 1 in the molten region is evenly distributed around the processed material 4, achieving a better melting effect. The material conveying hole 31 can either allow only the processed material 4 to pass through, or allow the material conveying mechanism to pass through and convey the processed material 4. Figure 39 , Figure 40 , Figure 41 As shown, the material conveying mechanism conveys the processing material 4 through the material conveying hole 31. The processing material 4 can be filament or powder, or a combination of filament and powder. The material conveying hole 31 can also convey protective gas. Generally speaking, in order to ensure the effect of the protective gas, the protective gas surrounds the processing material 4 and is conveyed together with the processing material 4 through the material conveying hole 31.
[0054] The laser 11 inside the laser source 1 can be independently controlled to switch on and off.
[0055] The independent control switch for laser 11 enables zoned processing of the laser source 1, allowing specific parts of the laser 11 to be activated according to different process requirements, such as... Figure 16 As shown, especially when the entire processing mechanism or the second lens group 3 descends, the laser melting area is in a negative defocus state, and the laser spot in the melting area presents a spot consistent with the laser source 1. Figure 17 As shown, taking a linearly arrayed laser source 1 arranged in a square pattern as an example, in order to reduce the heat input during processing, the lasers 11 within the elliptical region 1a are turned on, and the width along the major axis of the ellipse covers the melting width. This reduces the number of lasers 11 operating in the moving direction while satisfying the melting width requirement, thereby reducing heat input. Figure 18 As shown, the laser 11 within the patterned region 1a forms a laser-focused patterned spot 1b in the laser melting region. The patterned spot 1b is elliptical in shape, consistent with the image of the patterned region 1a, thus achieving the desired process effect. Figure 19 , Figure 20 As shown, in some applications, by dynamically changing the position of the graphic area 1a during processing, the movement of the graphic spot 1b can be controlled. In this scheme, the elliptical spot moves a certain displacement forward in the direction of movement of the processing mechanism, which allows the molten spot to have a certain lead time, thereby improving processing efficiency. Figure 21 , Figure 22As shown, in some applications, by dynamically changing the position of the patterned area 1a during processing, causing it to rotate around the material conveying hole 31, the rotation of the patterned spot 1b can be controlled. In this scheme, the elliptical spot is biased towards the processing material 4 and rotates around the processing material 4, which can play the role of stirring the molten pool, making the growth of material grains more conducive to the mechanical properties of the material and improving the processing quality. Figure 23 , Figure 24 As shown, in some applications, there are multiple graphic areas 1a. In this solution, graphic area 1a is presented as two annular rings of different sizes, and graphic spot 1b is also presented as two ring-shaped spots. This solution can achieve better melting effect, such as effectively reducing molten pool splashing. Figure 25 , Figure 26 As shown, in some applications, there are multiple graphic regions 1a. In this solution, there are two graphic regions 1a, one in the shape of a ring and the other located on the side of the processing material 4 that is offset. During the processing, the graphic spot 1b is also a combination of a ring spot and an offset spot. The ring spot is used to melt the processing material 4, and the offset spot is used to preheat the workpiece. The offset spot is turned on when preheating is required and turned off when preheating is not required. During the movement of the processing mechanism, the opening and closing of part of the graphic region 1a is continuously controlled.
[0056] The laser 11 inside the laser source 1 can have its power controlled independently.
[0057] The independent power control of laser 11 enables zoned power adjustment of laser source 1, allowing for adjustment of the power of laser 11 in specific locations according to different process requirements. Figures 17-26 The schemes are similar, such as Figures 27-36 As shown, all lasers 11 can be turned on, and the power of the lasers 11 within the patterned region 1a can be controlled to be higher than that outside the patterned region 1a. This results in a higher power density per unit density within the patterned spot 1b than the power density per unit density per unit density of the spot 1c outside the patterned region at the molten site. Unlike the scheme of independently controlled switches, the patterned region 1a can include multiple regions, and the power of the lasers 11 in different regions can be different; for example... Figure 35 , Figure 36As shown, the patterned region 1a is divided into a first annular patterned region 1a1 for melting and a second biased patterned region 1a2 for preheating. Since the preheating power does not need to be too high, the power of the laser 11 in the first patterned region 1a1 is greater than that in the second patterned region 1a2. In the melting part, the unit density power in the first patterned spot 1b1 is higher than that in the second patterned spot 1b2. Furthermore, the unit density power in both the first patterned spot 1b1 and the second patterned spot 1b2 is greater than that in the outer patterned spot 1c. By adjusting the power levels of different patterned regions, more complex processes can be achieved.
[0058] Several lasers 11 within the laser source 1 form a laser group 11a, and the laser group 11a can be independently controlled to switch on and off.
[0059] When a large number of lasers 11 are installed in the laser source 1, the impact of a single laser 11 on the molten area is very small, and controlling each laser 11 individually is quite cumbersome. Connecting several lasers 11 in series simplifies the control circuit and process. For example... Figure 37 As shown, preferably, adjacent lasers 11 are grouped into laser group 11a. Laser group 11a is still arranged in an array, which is equivalent to increasing the power of a single laser source and reducing the number of laser sources. This enhances the effect of independent control and simplifies the control process. Figure 38 As shown, preferably, the lasers 11 in a specific area are grouped into laser group 11a. For example, the lasers 11 in the outer ring of the laser source 1 are grouped into laser group 11a to melt the processed material 4, and the lasers 11 in the inner ring of the laser source 1 are grouped into laser group 11a to melt the substrate, thereby simplifying the control process.
[0060] The laser group 11a within the laser source 1 can have its power independently controlled.
[0061] The independent power control of laser group 11a enables the adjustment of the power of laser source 1 in different zones, and the power of laser group 11a in specific parts can be adjusted according to different process requirements.
[0062] Laser 11 is a fiber laser or a semiconductor laser.
[0063] Laser source 1 utilizes a fiber laser to achieve higher melting power, while a semiconductor laser allows for a more uniform distribution of focused laser energy. To balance melting power and laser uniformity, fiber lasers and semiconductor lasers can be used in combination. Semiconductor lasers include TO series, COS series, BB series, BC series, VSL series, and VTOF series lasers. Due to differences in packaging and emission patterns among different series of semiconductor lasers, their installation locations also differ. For example, TO series, VSL series, and VTOF series lasers all emit light from the surface of the semiconductor device. Figure 39 , Figure 42 As shown, these semiconductor lasers are typically mounted on top of the processing mechanism, similar to fiber lasers; while COS series, BB series, and BC series lasers are emitted from the side of the semiconductor device, such as... Figure 43 As shown, this type of semiconductor laser is more suitable for mounting on the side of the processing mechanism.
[0064] Lens group 21 includes at least one condenser lens.
[0065] The first lens group 2 is used to initially focus the laser emitted from the laser source 1, so that the laser enters the second lens group 3 in a collimated or near-collimated state. For example... Figures 4-6 , Figures 10-12 As shown, the first lens group 2 is typically mounted at the bottom of the laser source 1, and each lens group 21 is positioned opposite the laser 11; as Figure 13 , Figure 14 As shown, the lens assembly 21 can be installed separately from the laser 11, or it can be integrated with the laser 11 as a laser focusing assembly; as Figure 15As shown, the first lens group 2 can also employ at least one microlens array 21b. The microlens array 21b pre-arranges the lens group 21 into an array. When the laser 11 and the lens group 21 are arranged in a linear array, using the microlens array 21b becomes more convenient. For different laser sources, the emitted laser shape and divergence angle are different, requiring different lenses for focusing. For example, when the laser source 1 is a fiber laser, its light source is a circular spot, and the divergence angle remains constant in the circumferential direction, i.e., it diverges in a conical shape. Focusing this type of laser source is relatively easy, and a spherical convex lens can achieve a good focusing effect. However, when the laser source 1 is some semiconductor lasers, its light source has different divergence angles in two perpendicular directions. Using a convex lens to focus its light will make the spot elongated or elliptical, although a single convex lens will not achieve the desired focusing effect. While the laser beam's spot shape isn't ideal, the overall spot formed around the processing material 4 after confocaling by densely distributed lasers is relatively uniform, achieving a good confocaling effect. Of course, a better focusing method for these semiconductor lasers is to first install a fast-axis cylindrical mirror near the light source to focus the beam in the direction of larger divergence, and then install a slow-axis cylindrical mirror at a certain distance from the light source to focus the beam in the direction of smaller divergence. Using both fast and slow-axis cylindrical mirrors in combination allows the laser shape to approach a circle, thus achieving a better focusing effect. In laser processing, sometimes larger laser spots are needed to improve processing efficiency or preheat the molten substrate; this can be easily achieved by making certain adjustments to the first lens group 2. Figure 44 As shown, in one embodiment, the size of the laser melting spot can be changed by adjusting the distance between the lens group 21 and the laser 11. According to the imaging principle, when the distance between the lens group 21 and the laser 11 decreases, the spot formed by the laser beam emitted from the laser 11 on the molten substrate becomes larger, thereby forming a larger melting area, which can improve processing efficiency or preheat the molten substrate. Figure 45 As shown, in one embodiment, the lens of the lens group 21 is a non-collimating lens, which causes the laser to be emitted at a certain divergence angle or a certain convergence angle. The converging laser crosses at the convergence point and becomes divergent. The divergent laser is focused by the second lens group 3 to form a larger laser melting spot.
[0066] The lens group 21 includes a first auxiliary lens 21a.
[0067] like Figure 46 , Figure 47As shown, the lens group 21 may include a first auxiliary lens 21a in addition to the collimating lens group. In one embodiment, the first auxiliary lens 21a is a concave or convex lens, causing the laser to be emitted at a certain divergence angle or a certain convergence angle. The converging laser crosses at the convergence point and then diverges. The diverging laser is then focused by the second lens group 3 to form a larger laser melting spot. In practical applications, some lasers can be selected from a densely distributed array of lasers and positioned opposite the first auxiliary lens 21a, or one or more regions of lasers can be selected to be positioned opposite the first auxiliary lens 21a. Because the laser generated by the inner laser 11 is more perpendicular to the surface of the molten substrate, and the substrate surface has a lower reflectivity to the laser, the inner laser 11 is more effective at preheating the molten substrate.
[0068] The second lens group 3 includes at least one condenser lens.
[0069] The second lens group 3 can use spherical convex lenses to confocate the densely arranged laser beam emitted from the first lens group 2, such as... Figure 48 As shown, since the actual focusing state of light cannot be the same as the ideal state of Gaussian optics, the presence of spherical convex lens aberrations will cause changes in the actual laser path, making it impossible to focus perfectly on a single point. Sometimes, the presence of spherical convex lens aberrations is beneficial to the melting of the processed material 4, which can improve processing efficiency; when the focusing requirements are high, the second lens group 3 can also use a compound lens or a combination of multiple lenses to eliminate the influence of aberrations on focusing.
[0070] In some cases, the aberrations of the convex lens in the second lens group 3 are more conducive to the melting of the processed material 4, especially when the laser 11 of the laser source 1 has a wide coverage area. The effect of spherical aberration will cause the laser emitted by the outer side of the laser 11, which is far from the processed material 4, to be more focused upwards than the laser emitted by the inner side of the laser 11, which is closer to the processed material 4. That is, the laser 11 forms multiple focal points within a certain height range of the bottom optical axis of the second lens group 3. By controlling the change in the height of the second lens group 3, the different focal points can be controlled to be located at different positions in the melting area. In particular, the upper laser focal point can be controlled to be located at the bottom of the processed material 4, and the lower laser focal point can be located below the surface of the molten substrate, so that both the processed material 4 and the molten substrate can be uniformly melted. Furthermore, since the outer laser is emitted to The incident angle of the processing material 4 is closer to 90° than the incident angle of the inner laser hitting the processing material 4, and the reflectivity of the processing material 4 to the outer laser is lower. The incident angle of the inner laser hitting the molten substrate is closer to 90° than the incident angle of the outer laser hitting the molten substrate, and the reflectivity of the molten substrate to the inner laser is lower. Therefore, the focal separation of the inner and outer lasers 11 can reduce the reflectivity of the processing material 4 and the molten substrate to the laser, and improve the overall processing efficiency. Furthermore, when the processing material 4 is made of materials such as aluminum or copper, the laser wavelength has a greater impact on the reflectivity of the processing material 4. The laser 11 outside the laser source 1 can be a blue laser, so that the processing material 4 passes through the focal point formed by the blue laser first during the transport process, thereby reducing the reflectivity of the material to the laser and improving the processing efficiency.
[0071] like Figure 49 , Figure 50 As shown, the spherical convex lens of the second lens group 3 is also affected by chromatic aberration. The presence of chromatic aberration causes the refraction angle of the shorter wavelength laser to be larger, that is, the focal point of the shorter wavelength laser is more biased upward compared to the longer wavelength laser. When the processing material 4 is a high reflectivity material such as aluminum or copper, the melting effect will be better. Therefore, the laser 11 of the laser source 1 can use a combination of light sources of different wavelengths, or a light source with a wide spectral range. The presence of chromatic aberration in the second lens group 3 allows the processing material 4 to be melted first by a shorter wavelength laser such as blue light as it moves towards the molten pool. When the material is melted or close to being melted, it is then melted by a longer wavelength laser such as red light. This sequential melting method can give full play to the advantages of both short-wavelength and long-wavelength lasers, making the overall processing efficiency higher.
[0072] Spherical aberration and chromatic aberration are the two main types of aberrations affecting light focusing in the second lens group 3. Other types of aberrations, such as coma and distortion, will have some impact on the shape of the laser source 1 after focusing, but the laser shape has little effect on the melting effect of the processed material 4.
[0073] In some cases, spherical aberration and chromatic aberration in the second lens group 3 can be beneficial for the melting of the processed material 4. However, in cases requiring high precision, spherical aberration and chromatic aberration are undesirable and need to be controlled within a certain range. For different process requirements, selecting appropriate lenses and lens combinations for the second lens group 3 is particularly important. When using a single lens in the second lens group 3, spherical aberration varies depending on the lens selection, while chromatic aberration is more difficult to eliminate. The condensing lens of the second lens group 3 can be a positive meniscus lens, a biconvex lens, a plano-convex lens, an optimally shaped lens, an aspherical lens, etc., each contributing a different degree of spherical aberration. Appropriate lenses can be selected according to different process requirements; for example... Figure 51 As shown, when the second lens group 3 has high requirements for both spherical aberration and chromatic aberration, a cemented doublet lens can be used. The cemented doublet lens can reduce the influence of chromatic aberration on laser light sources of different wavelengths, and at the same time, it can also improve spherical aberration. This allows laser light sources of different wavelengths and different regions to be focused to a point or close to a point, which greatly improves the melting accuracy.
[0074] like Figure 52 As shown, the second lens group 3 can also use Fresnel lenses for focusing, especially when the number of lasers 11 in the laser source 1 is large and the coverage area is wide, the thickness of the convex lens will become very thick, resulting in a large overall weight of the processing mechanism. The use of Fresnel lenses in the second lens group 3 can effectively reduce the weight of the processing mechanism.
[0075] The second lens group 3 includes a second auxiliary lens 3a, which is located on the laser path of the partial laser 11 inside the laser source 1.
[0076] The second auxiliary lens 3a is used to adjust the focusing path of a portion of the laser light passing through the second lens group 3 or before passing through the second lens group 3, especially when the laser source 1 has a large number of lasers 11 installed and a wide distribution range, to adjust the laser light emitted by some of the lasers 11. For example... Figure 53 , Figure 54 As shown, in one embodiment, a concave or convex lens is installed as a second auxiliary lens 3a in the innermost or outermost ring of the area where the second lens group 3 is located. This prevents the laser beam from the laser 11 passing through the second auxiliary lens 3a from focusing on the molten area, resulting in a larger laser melting spot at the molten area compared to a confocal laser melting spot. This improves processing efficiency or preheats the partially molten area. In particular, since the second auxiliary lens 3a can change the laser focal length, it can also eliminate some of the effects of laser aberrations.
[0077] The second lens group 3 includes multiple radially nested annular lenses 3b.
[0078] When the second lens group 3 uses a single lens for confocal focusing, the structure becomes very simple and reliable, but there are also some limitations in use. For example, the thicker central part of the lens makes the overall weight of the processing mechanism heavier, and the fact that all laser beams have the same focal length reduces the flexibility of the process. Figure 55 As shown, to eliminate the above limitations, the second lens group 3 can be composed of multiple radially nested annular lenses 3b. This scheme allows the inner annular lenses 3b to use thinner lenses, just like the outer layers, effectively reducing the overall weight of the processing mechanism. As one embodiment, the annular lenses 3b of different nested layers can be selected to use lenses with different focal lengths, thereby enabling the lasers of different layers to achieve different effects. For example, the outer laser can be used for focusing, while the inner laser can be used for preheating, improving the processing effect. Figure 56 As shown, in one embodiment, the annular lenses 3b with different nesting layers use different mounting heights, thereby compensating for the effects of aberrations; as Figure 57 As shown, adjusting the height of the annular lens 3b in some of the nested layers can more precisely control the focusing point of the laser in different layers to meet some processing requirements.
[0079] The second lens group 3 can be adjusted laterally relative to the laser source 1.
[0080] like Figure 58 As shown, in order to ensure that the processing material 4 can pass through the focusing part of the second lens group 3, or that the focusing point of the second lens group 3 is located on the processing material 4, the second lens group 3 is usually designed as a horizontally adjustable structure so that the focusing point can be adjusted horizontally. There is a certain gap between the material conveying hole 31 and the processing material 4, so that the second lens group 3 can be finely adjusted horizontally without interfering with the processing material 4. The fine adjustment range is determined by the size of the gap, thereby ensuring that the processing material 4 is aligned with the optical axis.
[0081] The second lens group 3 can be longitudinally adjusted relative to the laser source 1.
[0082] like Figure 59 As shown, in one embodiment, the second lens group 3 is adjusted up and down by rotating the mounting base, and the focusing point of the laser source 1 can move up and down with the second lens group 3. Moving the second lens group 3 upward can reduce the conveying distance of the processed material 4, and the processing mechanism is closer to the molten pool. Moving the second lens group 3 downward can increase the conveying distance of the processed material 4, and the processing mechanism is farther from the molten pool. Therefore, when the processed material 4 is a thinner wire, the second lens group 3 can be moved upward to reduce the impact of wire bending. When the processed material 4 is a thicker wire, it is not easy to bend, and the second lens group 3 can be moved downward to reduce the impact of the high temperature of the molten pool on the processing mechanism.
[0083] It also includes a mounting base 5, on which the laser light source 1 is mounted.
[0084] Mounting base 5 is usually made of materials with good thermal conductivity such as copper and aluminum, and water cooling channels can be opened near the laser source 1 and the first lens group 2 to ensure the cooling performance of the heat-generating parts.
[0085] Mounting base 5 includes a horizontal mounting part 51, on which laser light source 1 is mounted.
[0086] like Figure 60 As shown, taking the circular array installation of laser 11 as an example, when the laser 11 of the laser source 1 is a fiber laser or some semiconductor lasers such as TO series, VSL series, VTOF series, the laser is emitted from the end of the fiber laser or the surface of the semiconductor device. By installing the laser source 1 on the horizontal mounting part 51, the laser emission direction can be directed towards the first lens group 2, thus achieving initial focusing.
[0087] Mounting base 5 includes a vertical mounting part 52, on which laser light source 1 is mounted.
[0088] like Figure 61 As shown, taking the circular array installation of laser 11 as an example, when the laser 11 of the laser source 1 is a semiconductor laser such as COS series, BB series, BC series, etc., the laser is emitted from the side of the semiconductor device. By installing the laser source 1 on the vertical mounting part 52, the laser emission direction can be directed towards the first lens group 2, thus achieving initial focusing.
[0089] The first lens group 2 is mounted on the mounting base 5, and the lens group 21 in the first lens group 2 is positioned opposite to the laser 11 in the laser source 1.
[0090] like Figure 60 , Figure 61 As shown, mounting the laser 11 and the lens group 21 simultaneously on the mounting base 5 can ensure the stability of the optical path; preferably, the laser 11 and the lens group 21 are hermetically encapsulated on the mounting base 5, which can reduce the influence of the external processing environment.
[0091] The second lens group 3 is mounted on the mounting base 5.
[0092] like Figure 58 As shown, mounting the second lens group 3 on the mounting base 5 can ensure the coaxiality of the optical axis of the second lens group 3 and the center of the laser source 1, reduce the generation of laser coma, and keep the laser spot that hits the molten part uniform around the processed material 4.
[0093] It includes multiple mounting bases 5 of different sizes, which can be nested and combined for installation.
[0094] like Figure 62 , Figure 63As shown, the number of lasers 11 of the laser source 1 installed on a single mounting base 5 is limited. When the laser power requirement is high, the mounting base 5 can increase the number of lasers 11 installed by stacking and nesting, thereby increasing the melting power of the processing mechanism. The mounting base 5 can be nested from the inside out, from the outside in, or both simultaneously. The nesting from the inside out structure is simpler, but the innermost mounting base 5 in the initial state is usually limited in size, and the number of lasers 11 installed cannot be too large, resulting in a lower laser power of the processing mechanism in the initial state. Furthermore, the outermost nested mounting base 5 has more lasers 11 installed than the inner layer, resulting in a larger power transition after nesting. The nesting from the outside in structure allows the outermost mounting base 5 to install more lasers 11 in the initial state, resulting in a higher laser power of the processing mechanism in the initial state. The innermost nested mounting base 5 has fewer lasers 11 installed than the outer layer, resulting in a more stable power transition after nesting. However, this nesting structure will make the processing mechanism larger in the initial state and more complex in structure. Preferably, the initial mounting base 5 can be designed to install a structure with multiple rings of lasers 11 or a structure with lasers 11 installed on both sides, and then a mounting base 5 with a single ring of lasers 11 can be nested on the outside.
[0095] The second lens group 3 includes multiple ring lenses 3b of different sizes, which are respectively mounted on the bottom of mounting bases 5 of different sizes nested inside and outside.
[0096] like Figure 64 As shown, when the second lens group 3 is composed of multiple ring lenses 3b, the ring lenses 3b of different layers can be installed on the mounting bases 5 of different nested layers. This installation method allows each mounting base 5 to form an independent focusing module, eliminating the need for installation and adjustment of the second lens group 3. This modularizes the power expansion of the processing mechanism, making it more convenient to use.
[0097] A first protective mirror 6 is installed between the first lens group 2 and the second lens group 3.
[0098] like Figure 65 As shown, the first protective mirror 6 is used to protect the first lens group 2 from damage and extend its service life; preferably, the first protective mirror 6 is sealed to the mounting base 5, so that the laser source 1 and the first lens group 2 work in a closed environment to ensure their stability.
[0099] The second protective mirror 7 is installed at the bottom of the second lens group 3.
[0100] like Figure 66 As shown, the second protective mirror 7 is used to protect the second lens group 3 from contamination by splashes of molten slag and fumes generated during laser processing; preferably, the second protective mirror 7 is detachably connected to the mounting base 5, which facilitates frequent cleaning or replacement.
[0101] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects some lasers 11 within the laser source 1 to generate at least one graphic area, and controls the laser source 1 within the graphic area to be turned on during the processing.
[0102] like Figure 17 , Figure 18 As shown, in one embodiment, the graphic area generated by the control system is elliptical, with the center of the ellipse located at the optical axis. The major axis of the ellipse is along the melt width direction, and the minor axis is along the movement direction of the processing mechanism. Therefore, heat input can be reduced while ensuring the melt width, thus improving the workpiece processing quality. Figure 23 , Figure 24 As shown, in one embodiment, the graphic area generated by the control system is in the form of two rings, one inner and one outer. By using the two graphic areas simultaneously for melting, molten pool splashing can be reduced.
[0103] The processing method used in the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects some lasers 11 inside the laser source 1 to generate no less than one graphic area, and controls the position change of the graphic area at a certain frequency; the control system dynamically controls the lasers 11 inside the graphic area to turn on, and controls the lasers 11 outside the graphic area to turn off.
[0104] like Figure 19 , Figure 20 As shown, in one embodiment, the graphic area generated by the control system is elliptical, and the minor axis of the ellipse is dynamically controlled to move along the direction of movement of the processing mechanism, and the entire graphic is dynamically controlled to move along the direction of movement of the processing mechanism. As a result, the molten area can be biased towards the front of the molten direction, which can improve processing efficiency and processing quality.
[0105] like Figure 21 , Figure 22 As shown, in one embodiment, the centroid of the graphic area generated by the control system is biased to one side of the central optical axis, and the graphic area is dynamically controlled to rotate around the optical axis at a certain frequency. Thus, during the processing, the molten spot keeps rotating around the processing material 4, achieving the effect of stirring the molten pool.
[0106] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects some lasers 11 within the laser source 1 to generate at least one graphic area, and controls the generation or elimination of some or all of the graphic areas during the processing. The control system dynamically controls the lasers 11 within the graphic area to turn on and controls the lasers 11 outside the graphic area to turn off.
[0107] like Figure 25 , Figure 26As shown, in one embodiment, the graphic area generated by the control system is in the shape of a ring, and the other is located on one side of the processing material 4. The biased graphic area is located in front of the movement direction of the processing mechanism and is used to preheat the workpiece. During the processing, it is dynamically turned on or off according to the preheating requirements.
[0108] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects some lasers 11 within the laser source 1 to generate at least one graphic area, and controls the power change of the laser source 1 within the graphic area during the processing.
[0109] like Figure 27 , Figure 28 As shown, in one embodiment, the graphic area generated by the control system is elliptical, with the center of the ellipse located at the optical axis. The major axis of the ellipse is along the melt width direction, and the minor axis is along the movement direction of the processing mechanism. Furthermore, the control system controls the laser 11 within the ellipse to have a higher power than the laser 11 outside the ellipse. Therefore, heat input can be reduced while maintaining the melt width, thus improving the workpiece processing quality. Figure 33 , Figure 34 As shown, in one embodiment, the graphic area generated by the control system is in the form of two rings, one inner and one outer. The control system controls the laser 11 inside the ring to have a higher power than the laser 11 outside the ring. By using the two graphic areas for melting at the same time, the splashing of the molten pool can be reduced.
[0110] The processing method used for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects some lasers 11 within the laser source 1 to generate at least one graphic region, and controls the position change of the graphic region at a certain frequency; the control system dynamically controls the power change of the lasers 11 within the graphic region.
[0111] like Figure 29 , Figure 30 As shown, in one embodiment, the graphic area generated by the control system is elliptical, and the minor axis of the ellipse is dynamically controlled to move along the direction of the processing mechanism, and the entire graphic is dynamically controlled to move along the direction of the processing mechanism. The control system controls the power of the laser 11 inside the ellipse to be higher than the power of the laser 11 outside the ellipse. As a result, the molten area can be biased towards the front of the molten direction, which can improve processing efficiency and processing quality.
[0112] like Figure 31 , Figure 32As shown, in one embodiment, the centroid of the graphic area generated by the control system is biased to one side of the central optical axis, and the graphic area is dynamically controlled to rotate around the optical axis at a certain frequency. The control system also controls the power of the laser 11 inside the graphic to be higher than the power of the laser 11 outside the graphic. Thus, during the processing, the molten spot keeps rotating around the processing material 4, achieving the effect of stirring the molten pool.
[0113] The processing method used for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects some lasers 11 within the laser source 1 to generate at least one graphic region, and controls the generation or elimination of some graphic regions during the processing. The control system dynamically controls the power change of the lasers 11 within the graphic region.
[0114] like Figure 35 , Figure 36 As shown, in one embodiment, the graphic area generated by the control system is one ring-shaped area and the other is located on one side of the processing material 4. The biased graphic area is located in front of the movement direction of the processing mechanism and is used to preheat the workpiece. The control system controls the power change of the laser 11 in the ring and biased graphic areas, and controls the power of the laser 11 in the biased graphic area to be lower than the power of the laser 11 in the ring area. During the processing, the power is dynamically adjusted according to the melting and preheating requirements, which can achieve better melting and preheating effects.
[0115] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a group of lasers 11a within the laser source 1 to generate at least one graphic area, and controls the laser source 1 within the graphic area to be turned on during the processing.
[0116] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a group of lasers 11a inside the laser source 1 to generate at least one graphic area, and controls the position change of the graphic area at a certain frequency. The control system dynamically controls the laser group 11a inside the graphic area to turn on, and controls the laser group 11a outside the graphic area to turn off.
[0117] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the laser group 11a within the laser source 1 to generate at least one graphic region, and controls the generation or elimination of the graphic region during the processing. The control system dynamically controls the laser group 11a within the graphic region to turn on, and controls the laser group 11a outside the graphic region to turn off.
[0118] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a group of lasers 11a within the laser source 1 to generate at least one graphic area, and controls the power change of the laser source 1 within the graphic area during the processing.
[0119] The processing method used for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a group of lasers 11a within the laser source 1 to generate at least one graphic region, and controls the position change of the graphic region at a certain frequency; the control system dynamically controls the power change of the laser group 11a within the graphic region.
[0120] The processing method for the above-mentioned multi-laser confocal processing mechanism includes the following control method: the control system selects a portion of the laser group 11a within the laser source 1 to generate at least one graphic region, and controls the generation or elimination of the graphic region during the processing. The control system dynamically controls the power change of the laser group 11a within the graphic region.
[0121] The processing method is used in the aforementioned multi-laser confocal processing mechanism. Lens group 21 includes a melting mirror group and a preheating mirror group. The laser emitted from the laser source 1 is focused by the melting mirror group and the second lens group 3 to form a melting spot in the molten pool area. The laser emitted from the laser source 1 is focused by the preheating mirror group and the second lens group 3 to form a preheating spot in the molten pool area. The area of the preheating spot is larger than the area of the melting spot. The processing method includes: dynamically acquiring the movement direction of the processing mechanism relative to the molten substrate, and the control system dynamically controlling the laser 11 corresponding to the preheating mirror group on one side of the movement direction to turn on or increase its power.
[0122] The processing method is used in the aforementioned multi-laser confocal processing mechanism. The second auxiliary lens 3a is a concave lens or a convex lens. The laser emitted from the laser source 1 does not pass through the second auxiliary lens 3a to focus the light and form a molten spot in the molten pool area. The laser emitted from the laser source 1 passes through the second auxiliary lens 3a to focus the light and form a preheating spot in the molten pool area. The area of the preheating spot is larger than the area of the molten spot. The processing method includes: dynamically acquiring the movement direction of the multi-laser confocal processing mechanism relative to the molten substrate, and the control system dynamically controlling the activation or power increase of some lasers 11 on one side of the movement direction of the lasers 11 corresponding to the second auxiliary lens 3a.
[0123] The processing method is used in the aforementioned multi-laser confocal processing mechanism. The annular lens 3b includes a molten annular lens and a preheated annular lens. The laser emitted from the laser source 1 is focused by the first lens group 2 and the molten annular lens to form a molten spot in the molten pool area. The laser emitted from the laser source 1 is focused by the first lens group 2 and the preheated annular lens to form a preheated spot in the molten pool area. The area of the preheated spot is larger than the area of the molten spot. The processing method includes: dynamically acquiring the movement direction of the multi-laser confocal processing mechanism relative to the molten substrate, and the control system dynamically controlling the activation or power increase of some lasers 11 on one side of the movement direction corresponding to the preheating annular lens.
[0124] Processing equipment, including the aforementioned multi-laser confocal processing mechanism.
[0125] Processing equipment includes additive manufacturing equipment, laser welding equipment, laser cladding equipment, laser cutting equipment, laser drilling equipment, laser heat treatment equipment, etc.
[0126] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the concept and scope of the present invention. Various modifications and improvements made to the technical solutions of the present invention by those skilled in the art without departing from the design concept of the present invention should fall within the protection scope of the present invention. All technical contents for which protection is sought in this invention have been fully described in the claims.
Claims
1. A multi-laser confocal processing mechanism, characterized in that: It includes a laser source (1), and a first lens group (2) and a second lens group (3) arranged sequentially along the laser emission direction of the laser source (1); the laser source (1) is composed of multiple lasers (11), the first lens group (2) is composed of multiple lens groups (21), the lens group (21) performs the first focusing of the laser emitted by the laser (11); the laser emitted after being focused by the lens group (21) is all within the coverage area of the second lens group (3), and the workpiece is processed after being focused a second time by the second lens group (3).
2. The multi-laser confocal processing mechanism according to claim 1, characterized in that: It also includes processing material (4), which is transported to the focusing part of the second lens group (3) by a material conveying mechanism for processing.
3. The multi-laser confocal processing mechanism according to claim 2, characterized in that: The laser light source (1), the first lens group (2) and the second lens group (3) are provided with a material conveying hole (31) at the middle position, and the processing material (4) passes through the material conveying hole (31) for conveying.
4. The multi-laser confocal processing mechanism according to any one of claims 1-3, characterized in that: The laser (11) within the laser source (1) can be independently controlled to switch on and off.
5. The multi-laser confocal processing mechanism according to claim 4, characterized in that: The power of the laser (11) within the laser source (1) can be independently controlled.
6. The multi-laser confocal processing mechanism according to any one of claims 1-3, characterized in that: The laser source (1) contains several lasers (11) that form a laser group (11a), and the laser group (11a) can be independently controlled to switch on and off.
7. The multi-laser confocal processing mechanism according to claim 6, characterized in that: The power of the laser array (11a) within the laser source (1) can be independently controlled.
8. The multi-laser confocal processing mechanism according to any one of claims 1-3, characterized in that: The laser (11) is a fiber laser or a semiconductor laser.
9. The multi-laser confocal processing mechanism according to any one of claims 1-3, characterized in that: The lens group (21) includes at least one condenser lens.
10. The multi-laser confocal processing mechanism according to claim 9, characterized in that: The lens group (21) includes a first auxiliary lens (21a).
11. The multi-laser confocal processing mechanism according to any one of claims 1-3, characterized in that: The second lens group (3) includes at least one condenser lens.
12. The multi-laser confocal processing mechanism according to claim 11, characterized in that: The second lens group (3) includes a second auxiliary lens (3a), which is located in the laser path of the laser (11) within the laser source (1).
13. The multi-laser confocal processing mechanism according to claim 11, characterized in that: The second lens group (3) includes multiple radially nested annular lenses (3b).
14. The multi-laser confocal processing mechanism according to claim 11, characterized in that: The second lens group (3) can be laterally displaced relative to the laser source (1).
15. The multi-laser confocal processing mechanism according to claim 11, characterized in that: The second lens group (3) can be longitudinally displaced relative to the laser source (1).
16. The multi-laser confocal processing mechanism according to any one of claims 1-3, characterized in that: It also includes a mounting base (5), on which the laser light source (1) is mounted.
17. The multi-laser confocal processing mechanism according to claim 16, characterized in that: The mounting base (5) includes a horizontal mounting part (51), and the laser light source (1) is mounted on the horizontal mounting part (51).
18. The multi-laser confocal processing mechanism according to claim 16, characterized in that: The mounting base (5) includes a vertical mounting part (52), and the laser light source (1) is mounted on the vertical mounting part (52).
19. The multi-laser confocal processing mechanism according to claim 16, characterized in that: The first lens group (2) is mounted on the mounting base (5), and the lens group (21) in the first lens group (2) is positioned opposite to the laser (11) in the laser source (1).
20. The multi-laser confocal processing mechanism according to claim 16, characterized in that: The second lens group (3) is mounted on the mounting base (5).
21. The multi-laser confocal processing mechanism according to claim 16, characterized in that: It includes multiple mounting bases (5) of different sizes, which can be nested and combined for installation.
22. The multi-laser confocal processing mechanism according to claim 21, characterized in that: The second lens group (3) includes multiple ring lenses (3b) of different sizes, which are respectively installed on the bottom of the mounting base (5) of different sizes nested inside and outside.
23. The multi-laser confocal processing mechanism according to claim 19, characterized in that: A first protective mirror (6) is installed between the first lens group (2) and the second lens group (3).
24. The multi-laser confocal processing mechanism according to claim 20, characterized in that: The second protective mirror (7) is installed at the bottom of the second lens group (3).
25. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 4 includes the following control method: the control system selects a portion of the lasers (11) within the laser source (1) to generate at least one graphic area, and controls the laser source (1) within the graphic area to be turned on during the processing.
26. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 4 includes the following control method: the control system selects the laser (11) inside the laser source (1) to generate at least one graphic area, and controls the position change of the graphic area at a certain frequency; the control system dynamically controls the laser (11) within the graphic area to turn on, and controls the laser (11) outside the graphic area to turn off.
27. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 4 includes the following control method: the control system selects a portion of the lasers (11) within the laser source (1) to generate at least one graphic region, and controls the generation or elimination of part or all of the graphic regions during the processing. The control system dynamically controls the lasers (11) within the graphic region to turn on, and controls the lasers (11) outside the graphic region to turn off.
28. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 5 includes the following control method: the control system selects a portion of the lasers (11) within the laser source (1) to generate at least one graphic region, and controls the power change of the laser source (1) within the graphic region during the processing.
29. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 5 includes the following control method: the control system selects a portion of the lasers (11) within the laser source (1) to generate at least one graphic region, and controls the position change of the graphic region at a certain frequency; the control system dynamically controls the power change of the lasers (11) within the graphic region.
30. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 5 includes the following control method: the control system selects a portion of the lasers (11) within the laser source (1) to generate at least one graphic region, and controls the generation or elimination of a portion of the graphic region during the processing, and the control system dynamically controls the power change of the lasers (11) within the graphic region.
31. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 6 includes the following control method: the control system selects a portion of the laser group (11a) within the laser source (1) to generate at least one graphic area, and controls the laser source (1) within the graphic area to be turned on during the processing.
32. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 6 includes the following control method: the control system selects the laser group (11a) inside the laser source (1) to generate not less than one graphic area, and controls the position change of the graphic area at a certain frequency; the control system dynamically controls the laser group (11a) inside the graphic area to turn on, and controls the laser group (11a) outside the graphic area to turn off.
33. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 6 includes the following control method: the control system selects a portion of the laser group (11a) within the laser source (1) to generate at least one graphic region, and controls the generation or elimination of a portion of the graphic region during the processing. The control system dynamically controls the laser group (11a) within the graphic region to turn on, and controls the laser group (11a) outside the graphic region to turn off.
34. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 7 includes the following control method: the control system selects a portion of the laser group (11a) within the laser source (1) to generate at least one graphic region, and controls the power change of the laser source (1) within the graphic region during the processing.
35. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 7 includes the following control method: the control system selects a portion of the laser group (11a) within the laser source (1) to generate at least one graphic region, and controls the position change of the graphic region at a certain frequency; the control system dynamically controls the power change of the laser group (11a) within the graphic region.
36. A processing method, characterized in that, The multi-laser confocal processing mechanism according to claim 7 includes the following control method: the control system selects a portion of the laser group (11a) within the laser source (1) to generate at least one graphic region, and controls the generation or elimination of a portion of the graphic region during the processing, and the control system dynamically controls the power change of the laser group (11a) within the graphic region.
37. A processing method, characterized in that, Used in the multi-laser confocal processing mechanism as described in claim 9 or 10 The lens group (21) includes a melting mirror group and a preheating mirror group. The laser emitted by the laser source (1) is focused by the melting mirror group and the second lens group (3) to form a melting spot in the molten pool area. The laser emitted by the laser source (1) is focused by the preheating mirror group and the second lens group (3) to form a preheating spot in the molten pool area. The area of the preheating spot is larger than the area of the melting spot. The processing method includes: dynamically acquiring the movement direction of the processing mechanism relative to the molten substrate, and the control system dynamically controlling the laser (11) corresponding to the preheating mirror group on one side of the movement direction to turn on or increase its power.
38. A processing method, characterized in that, Used in the multi-laser confocal processing mechanism of claim 12 The second auxiliary lens (3a) is a concave lens or a convex lens. The laser emitted by the laser source (1) does not pass through the second auxiliary lens (3a) to focus the light and form a molten spot in the molten pool area. The laser emitted by the laser source (1) passes through the second auxiliary lens (3a) to focus the light and form a preheating spot in the molten pool area. The area of the preheating spot is larger than the area of the molten spot. The processing method includes: dynamically acquiring the movement direction of the multi-laser confocal processing mechanism relative to the molten substrate, and the control system dynamically controlling the portion of the laser (11) on one side of the movement direction corresponding to the second auxiliary lens (3a) to turn on or increase the power.
39. A processing method, characterized in that, Used in the multi-laser confocal processing mechanism of claim 13 The annular lens (3b) includes a molten annular lens and a preheated annular lens. The laser emitted by the laser source (1) is focused by the first lens group (2) and the molten annular lens to form a molten spot in the molten pool area. The laser emitted by the laser source (1) is focused by the first lens group (2) and the preheated annular lens to form a preheated spot in the molten pool area. The area of the preheated spot is larger than the area of the molten spot. The processing method includes: dynamically acquiring the movement direction of the multi-laser confocal processing mechanism relative to the molten substrate, and the control system dynamically controlling the activation or power increase of a portion of the lasers (11) on one side of the movement direction corresponding to the preheating annular lens.
40. Processing equipment, characterized in that: Includes the multi-laser confocal processing mechanism as described in any one of claims 1-24.