High-temperature strain measuring device

Abstract

The invention discloses a high-temperature strain measuring device, and relates to the technical field of ship power system monitoring, the high-temperature strain measuring device comprises a nickel substrate distributed high-temperature strain sensor, a high-temperature sealant packaging layer and a fixing mechanism, the nickel substrate distributed high-temperature strain sensor realizes strain distributed measurement based on an optical fiber Rayleigh scattering principle, and the high-temperature sealant packaging layer is used for sealing the high-temperature sealant packaging layer. The high-temperature sealant packaging layer is coated outside the nickel substrate distributed high-temperature strain sensor, and the fixing mechanism is used for fixing the sensor on the surface of a measured object. According to the invention, distributed strain measurement can be carried out, the measurement precision, sensitivity and stability are higher, and the strain measurement requirements in a high-temperature environment can be met.

Description

Technical Field

[0001] This invention relates to the field of marine power system monitoring technology, specifically to a high-temperature strain measurement device. Background Technology

[0002] Accurately measuring the strain of object surfaces in high-temperature environments is a crucial task in many industrial sectors, such as pipelines and equipment in power systems. However, existing strain measurement devices often face several key challenges in high-temperature environments. These include insufficient high-temperature resistance of sensors; for example, traditional metal resistance strain gauges are prone to oxidation at high temperatures, leading to performance degradation. Traditional fixing methods are also prone to failure at high temperatures, causing displacement or loosening between the sensor and the measured object, further reducing measurement accuracy. For instance, bolt fixing methods may create tiny gaps due to thermal expansion and contraction at high temperatures, resulting in unstable sensor output signals. Furthermore, sensor packaging technology is also ineffective in coping with high-temperature environments; commonly used packaging materials are prone to aging or decomposition at high temperatures, failing to provide adequate protection and causing rapid performance degradation of the sensor. These problems severely affect the accuracy, sensitivity, and stability of strain measurements, limiting their application in high-temperature scenarios. Summary of the Invention

[0003] This invention provides a high-temperature strain measurement device capable of distributed strain measurement, exhibiting higher measurement accuracy, sensitivity, and stability, and adaptable to strain measurement requirements in high-temperature environments.

[0004] This invention provides a high-temperature strain measurement device, comprising: a nickel-based distributed high-temperature strain sensor, a high-temperature sealant encapsulation layer, and a fixing mechanism. The nickel-based distributed high-temperature strain sensor realizes distributed strain measurement based on the fiber Rayleigh scattering principle. The high-temperature sealant encapsulation layer covers the outside of the sensor, and the fixing mechanism is used to fix the sensor to the surface of the object being measured.

[0005] In some instances, the substrate of the nickel-based distributed high-temperature strain sensor is a nickel metal strip with a thickness of 0.15 mm.

[0006] In some instances, the surface of the nickel metal base strip has a multi-point perforated structure.

[0007] In some instances, the width of the nickel metal base strip is 25 mm, and the multi-point hollow structure is evenly distributed on the surface of the nickel metal base strip to improve the coupling strength between the sensor and the object being measured.

[0008] In some instances, the high-temperature sealant encapsulation layer is a polyimide encapsulation layer.

[0009] In some instances, the polyimide encapsulation layer is formed by coating and curing polyimide adhesive, which completely covers the encapsulated portion of the nickel-based distributed high-temperature strain sensor, forming a uniform and dense protective layer.

[0010] In some instances, the fixing mechanism employs a combination of spot welding and polyimide adhesive bonding.

[0011] In some instances, the nickel-based distributed high-temperature strain sensor is first temporarily fixed with paper tape, then spot welded, and finally bonded to the surface of the object being measured with polyimide adhesive.

[0012] In summary, compared with the prior art, the above-described technical solutions conceived by this invention can achieve the following beneficial effects: 1. It adopts the principle of fiber optic measurement and is immune to electromagnetic interference.

[0013] 2. It is capable of performing distributed strain measurement and has the characteristics of small ultimate bending radius, allowing for flexible arrangement.

[0014] 3. High precision and high sensitivity: Through the nickel base and multi-point hollow design, the accuracy and sensitivity of strain measurement are improved, with a measurement accuracy of not less than 1με.

[0015] 4. High-temperature environment applicability: The sensor is encapsulated with polyimide glue and fixed by spot welding and adhesive bonding to ensure its stability in high-temperature environments.

[0016] 5. Wide range of applications: This device is suitable for high-temperature applications such as ships, power plants, aerospace, and chemical equipment, and can meet various high-temperature strain measurement needs. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the multi-point hollow design of the nickel-based distributed high-temperature strain sensor provided in an embodiment of the present invention. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] In the following description, specific embodiments of the invention will be illustrated with reference to steps and symbols performed by one or more computers, unless otherwise stated. Therefore, these steps and operations will be referred to several times as being performed by a computer, and computer execution as referred to herein includes operations by a computer processing unit representing electronic signals of data in a structured format. This operation transforms the data or maintains it at a location in the computer's memory system, which can be reconfigured or otherwise alter the operation of the computer in a manner well known to those skilled in the art. The data structure maintained by the data is the physical location of the memory, which has specific characteristics defined by the data format. However, the principles of the invention described above are not intended to be limiting, and those skilled in the art will understand that many of the following steps and operations can also be implemented in hardware.

[0021] The terms "module" or "unit" as used herein can be considered as software objects executing on the computing system. Different components, modules, engines, and services described herein can be considered as implementations on the computing system. The apparatus and methods described herein are preferably implemented in software, but can also be implemented in hardware, both of which are within the scope of this invention.

[0022] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in this specification means the presence of features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when we say an element is “connected” or “coupled” to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein can include wireless connections or wireless coupling. The term “and / or” as used herein includes all or any units and all combinations of one or more associated listed items.

[0023] In an embodiment of the present invention, a high-temperature strain measurement device is provided, such as... Figure 1As shown, it includes: a nickel-based distributed high-temperature strain sensor, a high-temperature sealant encapsulation layer, and a fixing mechanism. The nickel-based distributed high-temperature strain sensor realizes distributed strain measurement based on the fiber Rayleigh scattering principle. The high-temperature sealant encapsulation layer covers the outside of the sensor, and the fixing mechanism is used to fix the sensor to the surface of the object being measured.

[0024] As an alternative implementation, the sensor is based on the fiber Rayleigh scattering principle to perform distributed strain measurement and is immune to electromagnetic interference.

[0025] As an optional implementation, a 0.15mm thick nickel metal substrate is used as the substrate for the distributed high-temperature strain sensor. Nickel metal has good electrical conductivity and high-temperature stability, and can maintain the stability of its physical properties in high-temperature environments.

[0026] As an alternative implementation, a multi-point hollow design is adopted on the sensor substrate. This structural optimization improves the coupling strength between the sensor and the object being measured, thereby increasing the accuracy and sensitivity of the strain test.

[0027] As an optional implementation, a high-temperature sealant (polyimide adhesive) is used as the sensor's encapsulation material. Polyimide adhesive possesses excellent high-temperature resistance and adhesion properties, effectively protecting the sensor's stability in high-temperature environments while ensuring good contact between the sensor and the measured object. This encapsulation material provides an important technical foundation for the design of high-temperature strain sensors.

[0028] As an alternative implementation method, a sensor fixing method combining spot welding and polyimide adhesive bonding is adopted: Through experimental research, the fixing method of the distributed high-temperature strain sensor was optimized. Ultimately, the fixing method combining spot welding and polyimide adhesive bonding was determined to be the optimal choice. Spot welding ensures mechanical contact between the sensor and the measured object, while the polyimide adhesive bonding further enhances the fixing effect, reducing sensor displacement and signal interference caused by mechanical vibration or high-temperature environments. This fixing method effectively improves the stability of the sensor and ensures long-term reliable operation.

[0029] In another embodiment of the present invention, the implementation process of the high-temperature strain measurement device includes: 1) Sensor substrate preparation: A nickel metal base strip with a width of 25mm and a thickness of 0.15mm is used as the sensor substrate, and the surface of the nickel metal base strip is designed with multiple cutouts.

[0030] 2) Sensor encapsulation: The fiber optic sensor is temporarily fixed on a metal substrate. Polyimide adhesive is applied to the surface of the sensor substrate, covering the area of ​​the fiber optic sensor to be encapsulated. A curing process is then performed to ensure that the adhesive fully penetrates and cures, forming a uniform and dense protective layer, thus completing the encapsulation of the sensor and ensuring its stability in high-temperature environments.

[0031] 3) Sensor Fixation: Remove dust, water stains, and oil from the surface of the structure to be monitored. Deploy distributed high-temperature strain sensors along the route, temporarily fix them with paper tape, then weld them with a spot welding machine, and finally fix them to the surface of the object being measured with polyimide adhesive to ensure good contact and stability between the sensor and the object being measured.

[0032] 4) Sensor testing: Test the strain measurement accuracy and sensitivity of the sensor in a high-temperature environment to verify its superior performance.

[0033] 5) Long-term stability test: The stability of the sensor is tested over a long period of time in a high-temperature environment to ensure its reliability in practical applications.

[0034] The high-temperature strain measurement device provided by the embodiments of the present invention has been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A high-temperature strain measurement device, characterized in that, include: The invention comprises a nickel-based distributed high-temperature strain sensor, a high-temperature sealant encapsulation layer, and a fixing mechanism. The nickel-based distributed high-temperature strain sensor achieves distributed strain measurement based on the fiber Rayleigh scattering principle. The high-temperature sealant encapsulation layer covers the outside of the sensor, and the fixing mechanism is used to fix the sensor to the surface of the object being measured.

2. The apparatus according to claim 1, characterized in that, The substrate of the nickel-based distributed high-temperature strain sensor is a nickel metal base strip with a thickness of 0.15 mm.

3. The apparatus according to claim 2, characterized in that, The surface of the nickel metal base strip has a multi-point hollow structure.

4. The apparatus according to claim 3, characterized in that, The nickel metal base strip has a width of 25mm, and the multi-point hollow structure is evenly distributed on the surface of the nickel metal base strip to improve the coupling strength between the sensor and the object being measured.

5. The apparatus according to claim 4, characterized in that, The high-temperature sealant encapsulation layer is a polyimide encapsulation layer.

6. The apparatus according to claim 5, characterized in that, The polyimide encapsulation layer is formed by coating and curing polyimide adhesive, which completely covers the encapsulation area of ​​the nickel-based distributed high-temperature strain sensor, forming a uniform and dense protective layer.

7. The apparatus according to claim 6, characterized in that, The fixing mechanism adopts a fixing method that combines spot welding and polyimide adhesive bonding.

8. The apparatus according to claim 7, characterized in that, First, paper tape is used for temporary fixation, then spot welding is used, and finally polyimide adhesive is used to fix the nickel-based distributed high-temperature strain sensor to the surface of the object being measured.

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