Liquid crystal screen heating method and system, medium and product

Abstract

The invention provides a liquid crystal screen heating method and system, a medium and a product, and relates to the technical field of automatic control, and the method comprises the steps: firstly, obtaining a heat influence coefficient matrix representing the heat conduction relation between heating areas, and measuring the initial temperature data of each heating area through a temperature sensor; when any temperature is lower than a preset temperature lower limit threshold value, the temperature rise amount of each heating area is calculated based on the target temperature, a temperature rise matrix is determined, the target heating power of each heating area is calculated in combination with the heat influence coefficient matrix and the temperature rise matrix, and the heating control module sends corresponding heating signals to each heating circuit according to the target heating power so as to heat the heating circuits. All the areas are heated at different powers, and finally synchronous rising of the temperature of all the heating areas is achieved. According to the scheme, the technical problem that in the prior art, a liquid crystal screen is heated unevenly is solved.

Description

Technical Field

[0001] This application relates to the field of automatic control technology, specifically to a method, system, medium, and product for heating an LCD screen. Background Technology

[0002] As a core component of modern electronic devices, liquid crystal displays (LCDs) have permeated various fields. However, the inherent physical properties of liquid crystal materials limit their performance in low-temperature environments, resulting in problems such as slow response and image ghosting, and in severe cases, even complete failure. Therefore, equipping LCDs with heating systems to ensure their normal operation in low-temperature environments has become a common and important technical requirement.

[0003] To meet this requirement, existing technologies typically employ a unified heating solution. This solution deploys a unified heating system, such as a single heating film or linked heating wires, on the LCD screen, and uses temperature sensors to monitor the screen temperature. The control system, based on the deviation between the temperature value reported by the sensors and the target value, applies uniform heating power to the entire heating system via a central controller. This approach, treating the entire screen as a single object for holistic control, is simple to implement and relatively low-cost, and has been deployed in many applications.

[0004] However, in practical applications, especially for larger displays or those requiring high temperature uniformity, the aforementioned overall heating solution reveals its inherent shortcomings. Because heat dissipation conditions naturally differ across different areas of the screen—for example, the central area dissipates heat slowly while the edge areas dissipate heat quickly—applying uniform heating power leads to an uneven distribution of heat across the screen surface. This uneven heat dissipation causes differences in the rate of temperature rise, ultimately resulting in an uneven temperature distribution on the screen surface. This not only reduces the efficiency of reaching a usable overall temperature but may also damage the screen due to localized overheating. Summary of the Invention

[0005] To address the technical problem of uneven heating in existing LCD screens, this application provides an LCD screen heating method, system, medium, and product.

[0006] In a first aspect, this application provides a method for heating a liquid crystal screen, which obtains a thermal influence coefficient matrix, the thermal influence coefficient matrix being used to represent the heat conduction relationship between each heating area within the liquid crystal screen; S1: Initial temperature data of each heating zone is obtained by measuring the temperature data of each heating zone using temperature sensors installed in each heating zone; S2: When any of the initial temperature data is lower than the preset lower limit threshold, calculate the temperature rise of each heating zone based on the target temperature and each of the initial temperature data, and determine the temperature rise matrix according to each of the temperature rises, wherein the temperature rise is the difference between the initial temperature data of the heating zone and the target temperature; S3: Based on the thermal influence coefficient matrix and the temperature rise matrix, the target heating power of each heating zone is calculated, and the target heating power is used to determine the heating power required to be applied to the heating zone; S4: Based on the target heating power, the heating control module sends corresponding heating signals to the heating circuits of each heating area, causing each heating circuit to heat at different power levels, so that the temperature of each heating area increases synergistically. By employing the above technical solution, this method first obtains a thermal influence coefficient matrix characterizing the heat conduction relationship between each heating region. This matrix pre-quantifies the temperature impact of heating any region on other regions. When calculating the target heating power for each region, it is not based solely on the temperature rise requirement of each region (determined by the temperature rise matrix), but rather by performing calculations on the thermal influence coefficient matrix and the temperature rise matrix. This calculation process can decouple a set of pre-compensated target heating powers allocated to each heating region based on known thermal coupling relationships. Therefore, when differentiating heating is applied to each region according to this set of target heating powers, the crosstalk between regions caused by heat conduction can be actively counteracted, avoiding the problem of some regions overheating while others underheat, thus achieving a synchronous and uniform temperature increase across all heating regions of the entire LCD screen.

[0007] Optionally, the step of sending corresponding heating signals to the heating circuits of each heating zone via the heating control module according to each target heating power further includes: The following steps are executed cyclically at a preset period until the difference between the current temperature of all heating zones and the target temperature is less than a preset stability threshold: Collect the current temperature of each heating zone; Within each preset period, the received current temperature is used as new initial temperature data, and steps S1-S4 are executed.

[0008] By adopting the above technical solution, a closed-loop feedback mechanism with periodic execution is introduced. This solution collects the current temperature of each region at a preset period and uses it as new initial temperature data, repeatedly calculating and controlling the target heating power until the temperature stabilizes. This iterative approach allows the control system to continuously and dynamically correct the deviation between the actual and target temperatures. This not only compensates for potential model errors in the thermal influence coefficient matrix but also responds in real time to external disturbances introduced by environmental changes during the heating process. Therefore, this solution combines feedforward prediction and feedback correction, enhancing the system's robustness and control accuracy, ensuring that the temperature of each heating region ultimately converges accurately and stably to the target value.

[0009] Optionally, the step of obtaining the thermal influence coefficient matrix specifically includes: The system receives physical characteristic structural parameters representing the liquid crystal display screen and physical characteristic structural parameters representing the heating glass in the heating circuit. The physical characteristic structural parameters of the heating glass include at least the material of the heating film of the heating glass, the size of the heating glass, and the partition layout of the heating glass. The physical characteristic structural parameters of the liquid crystal display screen include at least the layer structure information of the liquid crystal display screen. Based on the aforementioned physical property structural parameters, a finite element analysis thermodynamic simulation model is used to perform heat conduction simulation calculations to generate the aforementioned thermal influence coefficient matrix.

[0010] Traditional methods for obtaining such parameters rely on complex physical experiments, which are costly. This solution, however, receives specific physical structural parameters such as the material, size, partition layout, and LCD panel stacking structure of the heated glass, and uses a finite element method (FEM) thermodynamic simulation model to simulate heat conduction. This physics-based simulation method can accurately simulate the conduction and diffusion of heat within a specific structure during the design phase. Its advantage lies in generating a thermal influence coefficient matrix that closely matches the actual system without the need for a physical prototype. This not only shortens the product development cycle and reduces R&D costs but also ensures the accuracy of this core parameter, providing a solid data foundation for the precise calculation of the target heating power in step S3, thereby improving the effectiveness of the entire heating control method from the outset.

[0011] Optionally, the step of sending corresponding heating signals to the heating circuits of each heating zone via the heating control module according to each target heating power specifically includes: For any of the target heating power, a corresponding target duty cycle value is generated based on the pre-stored heating power-duty cycle mapping table; Generate PWM heating signals for each of the heating regions, wherein the duty cycle of each PWM heating signal is the target duty cycle value corresponding to the target heating power of the heating region; Each of the PWM heating signals is sent to the heating circuit of each heating area through the heating control module according to different phase delays for heating.

[0012] By adopting the above technical solution, firstly, the theoretical target heating power is accurately converted into the target duty cycle value of the digital PWM signal through a pre-stored "heating power-duty cycle mapping table," ensuring the accuracy of power output. More importantly, this solution introduces a technical feature of applying different "phase delays" to the PWM heating signals of each heating zone. If the PWM signals of all heating circuits are turned on synchronously, a huge superimposed current will be generated at the beginning of the cycle, impacting the power supply system. By performing phase staggering on each signal, the conduction times of different circuits can be dispersed on the time axis. This method smooths the current demand of the total power supply throughout the entire PWM cycle, significantly reduces the peak current, thereby improving the electrical stability of the system and reducing the requirements for the power supply module and electromagnetic interference.

[0013] Optionally, the method further includes: Real-time monitoring of the temperature change rate of each heating zone; when the temperature change rate of any heating zone exceeds a first preset threshold, the temperature difference between the target heating zone with a temperature change rate greater than the first preset threshold and the adjacent heating zones of the target heating zone is calculated. Based on the temperature difference, adjust the thermal influence coefficient matrix; The target heating power is recalculated using the adjusted thermal influence coefficient matrix.

[0014] By adopting the above technical solution, and by monitoring the temperature change rate of each heating zone in real time and comparing it with a first preset threshold, the system can promptly detect deviations between the theoretical model and the actual heating effect. When an anomaly occurs, the specific impact of the deviation can be quantified by calculating the temperature difference between the problem area and adjacent areas. Crucially, this method uses this temperature difference to adjust the thermal influence coefficient matrix, which is equivalent to online correction of the system's core control model. This compensates for model inaccuracies caused by unforeseen factors such as sudden environmental changes or component aging. By recalculating using the adjusted thermal influence coefficient matrix, the control strategy is continuously optimized, thereby maintaining high-precision temperature control even in dynamically changing environments.

[0015] Optionally, the method further includes: Real-time monitoring of the temperature change rate of each heating zone; when the temperature change rate of any heating zone is detected to be greater than the second preset threshold, the sending of the corresponding heating signal to each heating zone is paused and heating is stopped, wherein the second preset threshold is greater than the first preset threshold. Send a warning message to the user.

[0016] By adopting the above technical solution and setting a second preset threshold greater than the first preset threshold, the system can distinguish between general control deviations and severe fault conditions. When the temperature change rate of any region exceeds this higher second preset threshold, it indicates that a serious problem may have occurred, such as a short circuit in the heating circuit or sensor failure. At this point, continuing heating or adjusting the model is meaningless and risky. Therefore, the solution decisively takes measures to suspend sending corresponding heating signals to each heating region, stop heating, and send a warning to the user. This effectively prevents irreversible physical damage to the LCD screen caused by thermal runaway and even safety accidents, thus improving the safety and reliability of the system.

[0017] In a second aspect, embodiments of this application provide a liquid crystal display (LCD) heating system, which is used to perform the method described in the first aspect and any possible implementation thereof. The system includes: a control chip, a plurality of heating control modules, a plurality of heating glasses, and a temperature sensor, wherein the temperature sensor is disposed in the LCD screen. The input terminal of each heating control module is electrically connected to one output terminal of the control chip, the output terminal of one heating control module is connected to the control terminal of one heating glass, the output terminal of each temperature sensor is electrically connected to one input terminal of the control chip, the plurality of heating glasses are adjacent to each other to form a heating layer, and the heating layer is attached to the liquid crystal screen. The control chip is used to measure the initial temperature data of each heating zone through temperature sensors installed in each heating zone; when any initial temperature data is lower than a preset lower temperature threshold, it calculates the temperature rise of each heating zone based on the target temperature and each initial temperature data, and determines a temperature rise matrix based on each temperature rise, wherein the temperature rise is the difference between the initial temperature data of the heating zone and the target temperature; it calculates the target heating power of each heating zone based on the thermal influence coefficient matrix and the temperature rise matrix, wherein the target heating power is used to determine the heating power required to be applied to the heating zone; and it sends corresponding heating signals to the heating glass of each heating zone through the heating control module according to each target heating power.

[0018] The heating control module is used to control the corresponding heating glass to heat according to the heating signal.

[0019] By adopting the above technical solution, the system clearly defines the functional components and their interconnections through a structured layout of "control chip," "heating control module," "heating glass," and "temperature sensor." The partitioning of several heating glasses and temperature sensors directly corresponds to the "heating areas" in the method, providing the physical premise for partitioned control. The control chip, as the central processing unit, centrally receives temperature data from all sensors and performs core matrix operations; the heating control module, as the execution unit, translates the chip's instructions into precise power drives for each heating glass. This closed-loop control architecture of "partitioned sensing, central decision-making, and partitioned execution" is clearly structured and highly scalable.

[0020] Optionally, any of the heating control modules includes: a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a first transistor, and a first MOSFET; The first end of the first resistor is connected to the output terminal of the control chip, and the first end of the first resistor is the input terminal of the heating control module. The second end of the first resistor is connected to the base of the first transistor. The first end of the second resistor is connected to the base of the first transistor. The second end of the second resistor is connected to the emitter of the first transistor. The emitter of the first transistor is grounded. The collector of the first transistor is connected to the first end of the third resistor. The second end of the third resistor is connected to the first end of the fifth resistor. The third resistor is a thermistor. The second end of the fifth resistor is connected to the gate of the first MOSFET. The first end of the fourth resistor is connected to the first end of the fifth resistor. The second end of the fourth resistor is connected to the source of the first MOSFET. The source of the first MOSFET is connected to the heating power supply. The drain of the first MOSFET is connected to the control terminal of the heating glass.

[0021] By adopting the above technical solution, the technical challenge of increased turn-on threshold voltage of the first MOSFET acting as a heating switch due to the physical characteristics of semiconductors at extreme low temperatures is solved. By designing the third resistor in the circuit as a thermistor, the circuit achieves hardware-level self-compensation: when the ambient temperature drops sharply, the thermistor's resistance automatically changes significantly, thereby adjusting the voltage divider network and actively increasing the absolute value of the voltage difference applied across the gate and source of the first MOSFET. This automatically increased voltage difference effectively offsets the increased turn-on threshold voltage caused by the low-temperature effect, ensuring that the heating switch can still be reliably and fully turned on by the control signal even under harsh low-temperature conditions and fluctuating supply voltage. This design improves the system's environmental adaptability and operational reliability.

[0022] Thirdly, embodiments of this application provide a computer program product containing instructions that, when the computer program product is run on a liquid crystal display heating system, cause the liquid crystal display heating system to perform the method described in the first aspect and any possible implementation thereof.

[0023] Fourthly, embodiments of this application provide a computer-readable storage medium including instructions that, when executed on a liquid crystal display heating system, cause the liquid crystal display heating system to perform the method described in the first aspect and any possible implementation thereof. Attached Figure Description

[0024] Figure 1 This is a schematic flowchart of a liquid crystal screen heating method according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a liquid crystal screen heating system according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a heating control module in an embodiment of this application. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0026] This application provides a method for heating an LCD screen, referencing... Figure 1 , Figure 1 This is a flowchart of a liquid crystal screen heating method provided in an embodiment of this application.

[0027] Specifically, the LCD screen heating method includes the following steps: Step S101: Obtain the thermal influence coefficient matrix, which is used to represent the heat conduction relationship between each heating area in the liquid crystal screen; The "thermal influence coefficient matrix" refers to an n×n numerical matrix used to quantitatively describe the degree of mutual influence of heat conduction between the independently controllable heating areas inside the LCD screen under steady-state conditions. Here, n represents the total number of heating areas, and the element H in the i-th row and j-th column of the matrix is... ij To represent the temperature change in the i-th heating region when a unit power is applied to the j-th heating region, the following example can be used as a reference: ; The thermal influence coefficient matrix is ​​represented as the thermal influence coefficient matrix of three heating regions, h 12This means that when a unit power is applied to the second heating zone, the amount of temperature change caused in the first heating zone.

[0028] "LCD screen" refers to the specific object to which this technical solution is applied, which is divided into multiple independently heatable areas; "heating area" refers to a physical unit on the LCD screen backlight module or panel that has an independent heating circuit and temperature sensor; "thermal conduction relationship" refers to the physical phenomenon of heat being transferred from a higher temperature object or area to a lower temperature object or area. In this step, it specifically refers to the effect of heat transfer and influence between heating areas due to physical proximity or through a common heat-conducting medium.

[0029] This step is typically performed during the calibration phase of the system's initial deployment or during the offline calibration stage of the production process. It is a one-time preparatory step that provides the basic physical model parameters for all subsequent online control calculations. Specifically, obtaining this matrix involves two typical methods: 1) Experimental calibration method: This method determines the matrix by actively stimulating and measuring the response of the physical system. The operation process is as follows: First, maintain a constant ambient temperature and record the initial reference temperature of all heating areas; second, select a heating area (e.g., area j), apply a known, constant heating power P_j (e.g., 10W) ​​to it, and continue heating until the entire LCD screen reaches thermal equilibrium (i.e., the temperature of each area no longer changes); then, measure the final stable temperature of all n heating areas (from area i=1 to n) and calculate the temperature rise ΔT_i of each area relative to the initial reference temperature; finally, use formula H... ij =ΔT_i / P_j calculates all elements in the j-th column of matrix H. Repeat this process, using each heating region as an excitation source, until all n regions are traversed, thus constructing a complete n×n thermal influence coefficient matrix. 2) Simulation Modeling Method: This method establishes an accurate three-dimensional thermal model of the LCD screen and uses numerical calculation software such as finite element analysis (FEA) for simulation. In the simulation environment, a unit power load is applied to the j-th heating region in the model, and the steady-state temperature field distribution of the entire model is solved. The temperature value of the i-th heating region is directly extracted, and this value is h. ij The simulation software automatically performs parameter scanning, efficiently calculating the complete matrix. This acquired matrix will then be permanently stored in the non-volatile memory of the heating control module.

[0030] Step S102: Initial temperature data of each heating zone is obtained by measuring the temperature data of each heating zone using temperature sensors installed in each heating zone; Among them, "temperature sensor" refers to an electronic component or device that can sense temperature and convert it into a usable output signal, such as a thermistor, thermocouple, or integrated circuit temperature sensor. They are physically arranged in each heating area to achieve accurate monitoring of the temperature of that area. "Initial temperature data" refers to a set of discrete temperature readings that represent the current thermodynamic state of each heating area, collected by all temperature sensors at a specific moment when the heating control logic is started.

[0031] This step is executed at the beginning of each heating control cycle. When the system is powered on or when specific trigger conditions are met (such as low ambient temperature), the system periodically or event-drivenly executes this step to obtain real-time field data needed for subsequent decision-making and calculations. Specifically, this step is initiated by the heating control module. The control module sends data acquisition commands to n temperature sensors deployed in n heating areas. Each temperature sensor measures the temperature at its location and converts this physical quantity into an electrical signal (such as voltage or resistance). This electrical signal is processed by signal conditioning circuits (such as amplification and filtering) and an analog-to-digital converter (ADC), and is finally read by the heating control module in the form of a digital value. For example, if the system has four heating areas, after this step is completed, a temperature data set containing four elements will be obtained, such as T_initial={T1,T2,T3,T4}, where T1 is the initial temperature of area 1, T2 is the initial temperature of area 2, and so on. This set of data constitutes an accurate snapshot of the current non-uniform temperature field of the LCD screen and is the direct input for subsequent calculations of the temperature rise.

[0032] Step S103: When any of the initial temperature data is lower than the preset lower limit threshold, calculate the temperature rise of each heating zone based on the target temperature and each of the initial temperature data, and determine the temperature rise matrix according to each of the temperature rises. Among them, "preset lower limit threshold" refers to a specific temperature value (e.g., 5°C) that is preset and stored in the controller. It serves as the criterion for starting the entire active heating process and is used to determine whether the LCD screen is in a low-temperature working state that requires temperature rise. "Target temperature" refers to the uniform and ideal working temperature value that the system expects all heating areas to eventually reach (e.g., 25°C). "Temperature rise" refers to the temperature difference required for a specific heating area to rise from its current initial temperature to the target temperature. Its calculation formula is: Temperature rise = Target temperature - Initial temperature. In this technical context, "temperature rise matrix" should more accurately refer to an n×1 column vector, i.e., "temperature rise vector", where each element corresponds to the temperature rise to be achieved for a heating area.

[0033] This step follows immediately after step S102 and is the decision-making and data processing stage of the control algorithm. It first determines whether heating needs to be initiated, and then quantifies the specific target for the heating task to be performed. Specifically, refer to the following example; this step includes a judgment process and a calculation process: 1) Judgment Process: The heating control module compares each initial temperature data T_initial_i obtained in step S102 with the "preset lower temperature threshold" T_threshold. If at least one initial temperature data T_initial_i is lower than T_threshold, it is determined that the system needs to initiate heating, and subsequent calculations continue. If all initial temperature data are higher than or equal to the threshold, the current control loop ends, and heating is not performed. For example, if the threshold is 5°C, and the measured initial temperatures are {6°C, 4°C, 7°C}, since 4°C < 5°C, the condition is met. 2) Calculation Process: After determining that heating is required, a unified "target temperature" T_target and "initial temperature data" T_initial_i for each region are used to calculate the independent "temperature rise" ΔT_i for each heating region. The calculation formula is ΔT_i = T_target - T_initial_i. For example, if the target temperature is 25°C and the initial temperature data is {10°C, 8°C, 12°C}, then the calculated temperature rises for each region are ΔT_1 = 15°C, ΔT_2 = 17°C, and ΔT_3 = 13°C, respectively. Finally, all the calculated temperature rises are organized into an n×1 column vector according to the region index, which is the "temperature rise matrix" ΔT. In the above example, the temperature rise matrix is ​​ΔT = [15, 17, 13]. This vector completely describes the temperature difference distribution that needs to be eliminated in this heating task.

[0034] Step S104: Calculate the target heating power for each heating region based on the thermal influence coefficient matrix and the temperature rise matrix. The target heating power is used to determine the heating power required to be applied to the heating region. The "target heating power" refers to the heating power value that needs to be precisely applied to a specific heating area after decoupling calculations, in order to enable a specific heating area to achieve its corresponding temperature rise and at the same time compensate for the thermal effects of heating other areas. The unit is watts (W).

[0035] Before issuing commands to the heating circuit, this step aims to solve the thermodynamic problem of multivariable coupling and calculate the optimal power distribution scheme to achieve synergistic heating. Specifically, this step is based on the "heat influence coefficient matrix" H and the "temperature rise matrix" ΔT obtained in steps S101 and S103, respectively. Its theoretical basis is the linear heat conduction model: ΔT = H × P, where P is a matrix composed of the "target heating power" to be solved. To solve for P from this matrix equation, the following calculation operations need to be performed: 1) Solving for the inverse matrix: First, it is necessary to calculate the inverse matrix H of the heat influence coefficient matrix H. -1 This calculation is typically performed offline after step S101, and the result H is then passed to the computer. -1 1) Pre-stored in the controller because H is an inherent property of the system and will not change during operation. 2) Matrix multiplication operation: The heating control module will perform the pre-stored inverse matrix H... -1 Perform matrix multiplication with the temperature rise vector ΔT calculated in real time during this cycle. The solution formula is P=H -1 ×ΔT. This operation transforms a coupled system of equations (ΔT=H×P) into a direct, decoupled computational process. For example, for a dual-zone system, i.e., a system with two heating zones, the calculation expands to: P_1=(H -1 )_11×ΔT_1+(H -1 )_12×ΔT_2;P_2=(H -1 )_21ΔT_1+(H -1 )_22×ΔT_2. Through this calculation, P_1,P_2,...,P_n are obtained as the "target heating power". Each target heating power has comprehensively considered the heat demand of all areas and the thermal coupling effect between them, and is the optimal power setting value to achieve the synchronous attainment of the target temperature in all areas.

[0036] Step S105: According to the target heating power, send a corresponding heating signal to each heating control module so that the heating circuit of each heating area heats with different power so that the temperature of each heating area increases in a coordinated manner. Here, "heating control module" refers to the device module used to control the heating circuit to perform heating; "heating signal" refers to the electrical signal sent by the heating control module to the heating circuit to control the heating power.

[0037] This step is the final execution stage of the control loop, where the calculation results are transformed into physical effects. It is executed after the target heating power is calculated in step S104. Specifically, the execution flow of this step is as follows: 1) Power to signal conversion: The system acquires the target heating power. For each target heating power, the system converts it into a specific "heating signal" based on the electrical characteristics of the heating circuit (e.g., rated voltage V and heating element resistance R). If PWM control is used, the required duty cycle D_i is calculated so that the average power equals P_i. For example, P_i = D_i × (V² / R), from which D_i = P_i × R / V² can be calculated. 2) Signal transmission: The system sends n independent heating signals (e.g., n PWM waves with different duty cycles) to n heating control modules through its I / O ports. 3) Power application: Each heating control module drives its corresponding heating circuit. For example, the PWM signal controls the on / off frequency and time ratio of the power switching element, thereby precisely adjusting the average current flowing through the heating element to generate heat that matches the target heating power P_i. Since the P vector is calculated in a decoupled manner, it already provides pre-compensation for thermal crosstalk. For instance, in a region with low temperature rise requirements, if a neighboring region requires significant heating and will have a substantial thermal impact, the calculated target power P_i for that region might be very low or even zero. Through this differentiated power application, the temperature of all regions can ultimately rise in a synchronized and coordinated manner, avoiding overshoot or lag in temperature rise in some regions, and ultimately achieving the set target temperature efficiently and uniformly.

[0038] Optionally, this solution may also execute steps S106 and S107; Specifically: The following steps are executed cyclically at a preset period until the difference between the current temperature of all heating zones and the target temperature is less than a preset stabilization threshold: Step S106: Collect the current temperature of each heating zone; Step S107: In each preset period, the received current temperature is used as new initial temperature data, and steps S102-S105 are executed. Among them, "preset cycle" refers to a fixed, pre-set time interval, which defines the fixed frequency at which the entire closed-loop control system performs state sampling, calculation, and adjustment; "current temperature" refers to the instantaneous temperature value of each heating zone collected in real time by the temperature sensor at the beginning of each preset cycle; "preset stability threshold" refers to a small, pre-set temperature difference value, which is used to form the judgment standard for the completion of the heating task. That is, when the absolute value of the difference between the current temperature and the target temperature of all heating zones is less than this threshold, the system can be considered to have reached a stable state.

[0039] Specifically, the execution flow of this closed-loop feedback control is as follows: Cyclic Start-up and Cyclic Timing: After the initial power application is completed for the first time, timing begins with a "preset cycle" as the beat, marking the start of the continuous control process.

[0040] Step S106: Status Feedback Acquisition: When a "preset cycle" has elapsed, the heating control module immediately executes step S106. It sends instructions to the temperature sensors in all heating areas, acquires and receives a new set of "current temperature" readings that reflect the current thermodynamic state of the LCD screen.

[0041] Execution step S107: Iterative calculation and execution: Next, step S107 is executed, which is a periodic reuse and iteration of the previous control logic: Update the calculation starting point: Use the newly collected "current temperature" reading as the "new initial temperature data" for the calculation in this preset cycle. This means that subsequent calculations will be based on the latest actual state of the system, rather than an earlier state.

[0042] Recalculate the temperature rise requirement: Compare the "current temperature" of each region with the constant final "target temperature" to calculate the new remaining temperature rise that needs to be made up for for each region. This forms a set of temperature rise requirements describing the current pending heating tasks.

[0043] Recalculate the heating power: Retrieve the "thermal influence coefficient matrix" that was fixed during the system calibration phase and perform a core decoupling operation on it with the newly calculated set of temperature rise requirements. The purpose of this operation is to derive a completely new and revised "target heating power" scheme, which is tailored to the most efficient and coordinated completion of the remaining heating tasks under the current temperature conditions.

[0044] Adjusting heating output: The controller converts this new target heating power scheme into specific control commands and sends them to the heating circuits of each heating zone, thereby making a precise adjustment to the actual heating power of each zone.

[0045] Termination Condition Judgment and Loop: After completing a power adjustment, the heating control module will immediately perform a status check. It will determine whether the "current temperature" of each heating zone has entered the allowable error range centered on the "target temperature" and with the "preset stable threshold" as the radius.

[0046] If the temperature of all heating zones has met the stability condition, the entire heating task is considered to have been successfully completed, and all heating activities are stopped, exiting this loop control process.

[0047] If the temperature in any area has not yet reached a stable condition, the system will remain operational and wait for the next "preset cycle" to begin. At that time, a new round of the complete closed-loop operation of "collection-calculation-adjustment" will be started again, and so on, until the termination condition is finally met.

[0048] Optionally, steps S10101 and S10102 are more specific steps than step S101. Step S10101: Receive physical characteristic structural parameters representing the liquid crystal screen and the physical characteristic structural parameters representing the heating glass in the heating circuit. The physical characteristic structural parameters of the heating glass include at least the material of the heating film of the heating glass, the size of the heating glass, and the partition layout of the heating glass. The physical characteristic structural parameters of the liquid crystal screen include at least the layer structure information of the liquid crystal screen. Step S10102: Based on the physical property structural parameters, perform heat conduction simulation calculations using a finite element analysis thermodynamic simulation model to generate the thermal influence coefficient matrix. Among them, "physical property structural parameters" refers to a set of detailed data describing the inherent physical properties and geometric structure of the object to be heated—namely, the LCD screen and its integrated heating system. These parameters are the basic inputs for accurate thermodynamic simulation; "heating circuit" refers to the electronic circuitry responsible for applying electrical energy to the heating glass to generate heat; "heating glass" is a special type of glass with a transparent conductive film that can conduct electricity and generate heat, serving as the direct source of heat; "material of the heating film" specifically refers to the composition of the conductive film (such as indium tin oxide, ITO), whose physical properties such as conductivity, thermal conductivity, and specific heat capacity directly affect heating efficiency and heat transfer; "heating glass dimensions" include its length, width, thickness, and other geometric information; "partition layout of the heating glass" refers to the division of the heating film. The "multiple independent heating areas" are defined by their shape, area, and relative positions; the "layer structure information of the LCD screen" includes key information such as the material type, thickness, and interlayer contact thermal resistance of each functional layer (such as polarizer, glass substrate, liquid crystal layer, backlight module, etc.) that constitute the entire display module; the "finite element analysis thermodynamic simulation model" is a computer-aided engineering (CAE) model that uses numerical calculation methods to solve the partial differential equations of heat conduction in complex engineering problems; and the "heat conduction simulation calculation" uses this model to simulate the process of heat transfer, distribution, and change within the LCD screen and between it and the external environment.

[0049] Specifically, the process for generating this thermal influence coefficient matrix is ​​as follows: Execution step S10101: Parametric modeling input: Received parameters: The system receives a series of "physical property structural parameters" input by the operator or imported from the design file.

[0050] Parameter details: This set of parameters comprehensively defines the geometry and material properties of the simulation object. For example, it specifies whether the heating film is ITO or silver nanowires, and its sheet resistance; whether the heating glass is 20 inches or 30 inches, and its thickness in millimeters; the heating film is divided into a 3×4 matrix partition, and the specific coordinates and dimensions of each partition; and the material layers that make up the LCD screen from top to bottom, the thickness of each layer in micrometers, and their respective thermal conductivity, specific heat capacity, and density.

[0051] Execution step S10102: Simulation calculation and matrix generation: Constructing the geometric and mesh model: Based on the received dimensions and layout parameters, the finite element analysis software first constructs a precise three-dimensional geometric model of the LCD screen and heating glass. Subsequently, the software discretizes this continuous geometric model, dividing it into a large number of tiny, finite-number elements (i.e., a mesh), which is the foundation of the finite element method.

[0052] Assigning material properties and boundary conditions: The software assigns the received material parameters (such as thermal conductivity and specific heat capacity) to the corresponding geometric parts of the model. At the same time, it sets the boundary conditions for the simulation, such as simulating the natural convection and thermal radiation heat transfer coefficients between the surface of the display screen exposed to the air and the environment.

[0053] Performing serialized single-point excitation simulations: To construct the thermal influence coefficient matrix, the simulation software executes a series of independent simulation calculations. The specific process is as follows: Excite the j-th region: In the j-th simulation, the model applies a known, constant unit heating power (e.g., 1 watt) only to the j-th heating region, while the power of all other heating regions is set to zero.

[0054] Simulated heat conduction: The software solves the heat conduction equations for the entire model, calculating the temperature change process from the application of power until the entire temperature field reaches a new thermal equilibrium state.

[0055] Record steady-state temperature rise: After the model reaches thermal equilibrium, the software records the steady-state temperature rise of all n heated regions (including the j-th region itself that was excited) relative to the initial ambient temperature.

[0056] Calculation coefficient: The steady-state temperature rise of the i-th heating region divided by the unit power applied to the j-th region, the result is the element H in the i-th row and j-th column of the thermal influence coefficient matrix. ij The element H ij The physical meaning is: when the j-th heating region is heated with unit power, the degree by which the temperature of the i-th heating region will eventually rise steadily.

[0057] Traversal and Matrix Construction: The software automatically repeats the above "excitation-simulation-recording" process n times (j from 1 to n), that is, it sequentially applies a unit power excitation to each heating region. After all regions have been excited once, n×n influence coefficient values ​​are obtained. These values ​​are arranged according to their row and column correspondences to finally generate a complete "thermal influence coefficient matrix" H. This matrix is ​​then stored for direct use by subsequent real-time control algorithms.

[0058] Optionally, steps S10501-S10503 are more specific steps than step S105. Step S10501: For any of the target heating power, convert it into a corresponding target duty cycle value according to the pre-stored heating power-duty cycle mapping table; The “Heating Power-Duty Cycle Mapping Table” refers to a pre-calibrated and stored data set that establishes the correspondence between the PWM signal duty cycle and the actual output power of the heating circuit. The “Target Duty Cycle Value” refers to the PWM duty cycle percentage obtained by consulting or calculating the mapping table based on the target heating power, which is used to directly configure the hardware.

[0059] This step is executed after the control algorithm derives the power requirement. Its function is to convert the power value in physical units into control parameters that the hardware can recognize. Specifically, the control module iterates through the target heating power value for each heating zone. For each power value, it queries a pre-stored mapping table and calculates the precisely matching target duty cycle using methods such as direct lookup or linear interpolation. This process provides accurate digital data for the subsequent generation of the actual electrical signal. The target duty cycle values ​​for all zones are then aggregated and passed to the next step.

[0060] Step S10502: Generate PWM heating signals for each heating region, wherein the duty cycle of each PWM heating signal is the target duty cycle value corresponding to the target heating power of the heating region; Among them, "PWM heating signal" refers to a pulse width modulation signal, which controls the average energy output to the load by adjusting the duration of the high level (i.e., duty cycle) within a fixed period; "generation" means that the dedicated hardware module (PWM generator) inside the controller autonomously generates the corresponding periodic digital square wave according to the set duty cycle parameters.

[0061] This step, following the calculation of the duty cycle value, is responsible for converting the digital instructions into actual electrical signals. Specifically, the controller's main processing unit writes the target duty cycle values ​​obtained in the previous step into the duty cycle register corresponding to their respective hardware PWM channels. After configuring the frequency and duty cycle, the PWM generator is activated. Subsequently, the hardware will automatically and in parallel generate multiple PWM signals with their own preset duty cycles on multiple output pins, ready to drive external power circuits.

[0062] Step S10503: Each of the PWM heating signals is sent to the heating circuit of each heating area through the heating control module according to different phase delays for heating. "Phase delay" refers to the intentional introduction of a small time difference between the start-up times of each PWM signal to avoid them entering the working cycle (high level) at the same time; "heating circuit" refers to the power electronic unit that receives the PWM control signal, which is responsible for amplifying the signal to drive a large current to flow through the heating element, thereby generating heat.

[0063] This step is the final stage of the heating process, and its core objective is to ensure the stability of the system power supply while driving heating. Specifically, to avoid a huge inrush current caused by all heating zones starting simultaneously, the controller employs a phase-staggered strategy when sending PWM signals. Through software delay or by utilizing the hardware phase control function of the PWM module, the rising edges of each PWM signal are dispersed along the time axis. These time-scheduled signals are sent to their respective heating circuits, smoothly initiating the heating process, thereby effectively reducing instantaneous current peaks and ensuring the electrical safety and stable operation of the entire system.

[0064] Optionally, this method may also include steps S108-S110; Step S108: Monitor the temperature change rate of each heating area in real time. When the temperature change rate of any heating area exceeds a first preset threshold, calculate the temperature difference between the target heating area with a temperature change rate greater than the first preset threshold and the adjacent heating areas of the target heating area. The core function of this step is anomaly detection. The system continuously monitors the heating rate (temperature change rate) of each heating zone. Once the heating rate of any zone exceeds the preset safety limit (first preset threshold), the system determines that the zone is at risk of thermal runaway. At this time, the system immediately records the temperature difference between this abnormal zone and all its physical neighbors at the current moment.

[0065] Step S109: Adjust the thermal influence coefficient matrix based on the temperature difference. Specifically, the adjustment process first addresses the mutual thermal influence between the anomalous region j and its multiple neighbors. The system iterates through each region m adjacent to region j and examines the temperature difference ΔT_jm = T_j - T_m between them. This temperature difference is a key indicator of the thermal imbalance. If the temperature difference ΔT_jm is a significantly positive value, it physically means that more heat flows from region j to region m than the model anticipates, i.e., the model underestimates the thermal influence of region j on region m. Therefore, it is necessary to increase the cross coefficient H in the matrix representing this influence. mj The specific adjustments can be achieved through an incremental update formula: H mj _new=H mj _old+α×ΔT_jm. Here, α is a preset adjustment gain that ensures the adjustment magnitude is proportional to the observed temperature difference. This operation is performed independently for each adjacent region of region j, thereby comprehensively correcting the heat diffusion model from region j to all its surrounding regions.

[0066] The dimensions of each parameter are defined as follows: H (thermal influence coefficient): ℃ / W (temperature / power), ΔT_jmᵢ (temperature difference): ℃ (temperature), α (adjustment gain): 1 / W (1 / power). α is a preset coefficient used to match the dimensions and control the adjustment range. α can be obtained in advance based on the analysis of a large number of ΔT_jm and H relationships.

[0067] If the temperature difference ΔT_jm is a significantly negative value—for example, if the temperature T_m in region m is abnormally high and exceeds the temperature T_j in region j—it physically means that more heat is flowing from region m into region j than the model expects, or that less heat is flowing from region j to region m than expected, or even that heat backflow has occurred. This indicates that the model overestimates the thermal influence of region j on region m. Therefore, it is necessary to reduce the cross coefficient H in the matrix that represents this influence. mj The specific adjustments can be achieved using the same incremental update formula: H mj _new=H mj _old + α × ΔT_jm. Since ΔT_jm is negative at this point, this addition operation is actually a subtraction, thus H mj The value of decreases, ensuring that the adjustment range is proportional to the absolute value of the observed temperature difference.

[0068] After the comprehensive adjustments to the cross-influence coefficient and the self-influence coefficient, the system obtains a new, corrected thermal influence coefficient matrix H_new. This new matrix more accurately describes the thermal dynamic behavior of the system under the current operating conditions than the original matrix.

[0069] Step S110: Recalculate each of the target heating powers using the adjusted heat influence coefficient matrix; Specifically, this step utilizes the more accurate "thermal influence coefficient matrix H_new," optimized in S107, to perform a new core control calculation. This is done by solving the control equation P_target=(H_new). -1 With ×ΔT, the system can derive a new and more reasonable set of target heating power values. P_target is the new target heating power value. This new set of target heating power value instructions will be immediately sent to the heating hardware, aiming to quickly suppress the temperature anomalies that have occurred and guide the entire system temperature to re-converge stably towards the preset target value.

[0070] Optionally, this method may also perform steps S111-S112; Step S111: Monitor the temperature change rate of each heating zone in real time. When the temperature change rate of any heating zone exceeds the second preset threshold, pause sending the corresponding heating signal to each heating zone and stop heating. The second preset threshold is greater than the first preset threshold. Among them, the temperature change rate represents the temperature increment per unit time; the second preset threshold is a preset upper limit of the highest temperature change rate used to trigger an emergency shutdown, which is greater than the first preset threshold used for model adjustment; stopping heating means that the control system interrupts the sending of power commands to all heating areas, so that the power output of all heating elements returns to zero.

[0071] Specifically, this step serves as a final safety precaution. When the system detects that the temperature change rate in any heating zone exceeds the second preset threshold, it indicates that extreme thermal runaway has occurred. For example, if the temperature change rate in a certain area reaches 10°C / s, exceeding the second threshold of 5°C / s, the system will immediately execute a global shutdown, unconditionally ceasing the transmission of heating signals to all heating zones and forcibly cutting off all heating power to prevent equipment damage.

[0072] Step S112: Send a warning message to the user; Specifically, this step follows immediately after step S111. After the system shuts down due to an excessive temperature change rate, a warning message will be automatically generated, such as: "Warning: Temperature change rate in zone 7 exceeds limit, system has shut down." This message will be sent to the user through a preset channel, such as a pop-up window on the operating interface or by illuminating an alarm light, so that the user can be immediately aware of the serious fault and take appropriate action.

[0073] This solution also provides a liquid crystal screen heating system, for reference. Figure 2 The LCD screen heating system includes: a control chip 10, several heating control modules 20, several heating glass 30 and a temperature sensor 40, wherein the temperature sensor 40 is disposed in the LCD screen; The input terminal of each heating control module 20 is electrically connected to one output terminal of the control chip 10. The output terminal of one heating control module 20 is connected to the control terminal of one heating glass 30. The output terminal of each temperature sensor 40 is electrically connected to one input terminal of the control chip 10. Several heating glasses 30 are adjacent to each other to form a heating layer. The heating layer is attached to the LCD screen. The control chip 10 is used to measure the initial temperature data of each heating zone through temperature sensors installed in each heating zone; when any initial temperature data is lower than a preset lower limit threshold, it calculates the temperature rise of each heating zone based on the target temperature and each initial temperature data, determines the temperature rise matrix based on each temperature rise, and the temperature rise is the difference between the initial temperature data and the target temperature of the heating zone; it calculates the target heating power of each heating zone based on all thermal influence coefficient matrices and the temperature rise matrix, and the target heating power is used to determine the heating power required to be applied to the heating zone; according to each target heating power, it sends a corresponding heating signal to the heating glass of each heating zone through the heating control module 20.

[0074] The heating control module 20 is used to control the corresponding heating glass 30 to heat according to the heating signal.

[0075] For details, please refer to Figure 3 Each heating control module 20 includes: a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a first transistor Q1, and a first MOSFET Q2; The first end of the first resistor R1 is connected to the output terminal of the control chip 10. The first end of the first resistor R1 is the input terminal of the heating control module 20. The second end of the first resistor R1 is connected to the base of the first transistor Q1. The first end of the second resistor R2 is connected to the base of the first transistor Q1. The second end of the second resistor R2 is connected to the emitter of the first transistor Q1. The emitter of the first transistor Q1 is grounded. The collector of the first transistor Q1 is connected to the first end of the third resistor R3. The second end of the third resistor R3 is connected to the first end of the fifth resistor R5. The third resistor R3 is a thermistor. The second end of the fifth resistor R5 is connected to the gate of the first MOSFET Q2. The first end of the fourth resistor R4 is connected to the first end of the fifth resistor R5. The second end of the fourth resistor R4 is connected to the source of the first MOSFET Q2. The source of the first MOSFET Q2 is connected to the heating power supply. The drain of the first MOSFET Q2 is connected to the control terminal of the heating glass 30.

[0076] When the control signal input to the first terminal of the first resistor R1 is high, the first transistor Q1 turns on. At this time, the gate voltage of the first MOSFET Q2 is determined by the voltage division of resistors R4 and R3. The third resistor R3 is a thermistor with a positive temperature coefficient. In low-temperature environments, such as at -75°C, due to changes in the semiconductor physical characteristics of the P-MOS transistor, the absolute value of the threshold voltage Vgs(th) required for its turn-on increases, causing the original gate drive voltage to be insufficient to turn it on quickly and completely. This results in excessively high internal resistance of the MOSFET, low heating efficiency, or even failure to start.

[0077] The third resistor, R3, is a positive temperature coefficient thermistor. As the temperature decreases, the resistance of R3 also decreases, significantly increasing the gate-source voltage Vgs. The first MOSFET, Q2, is then strongly driven to conduct fully, ensuring normal heating of the system at low temperatures. As the ambient or glass temperature rises, the resistance of the third resistor R3 increases. Due to changes in the semiconductor physical characteristics of the P-MOS transistor, the absolute value of its threshold voltage Vgs(th) decreases, allowing the system to heat normally again.

[0078] In another aspect, the present invention also provides a computer-readable storage medium, which may be included in a liquid crystal display heating system described in the above embodiments; or it may exist independently and not assembled into the liquid crystal display heating system. The storage medium carries one or more computer programs, which, when executed by a processor of the liquid crystal display heating system, cause the liquid crystal display heating system to implement a liquid crystal display heating method provided in the above embodiments.

[0079] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A method for heating a liquid crystal display screen, characterized in that, The method includes the following steps: Obtain the thermal influence coefficient matrix, which is used to represent the heat conduction relationship between each heating area in the liquid crystal screen; S1: Initial temperature data of each heating zone is obtained by measuring the temperature data of each heating zone using temperature sensors installed in each heating zone; S2: When any of the initial temperature data is lower than the preset lower limit threshold, calculate the temperature rise of each heating zone based on the target temperature and each of the initial temperature data, and determine the temperature rise matrix according to each of the temperature rises, wherein the temperature rise is the difference between the initial temperature data of the heating zone and the target temperature; S3: Based on the thermal influence coefficient matrix and the temperature rise matrix, the target heating power of each heating zone is calculated, and the target heating power is used to determine the heating power required to be applied to the heating zone; S4: Based on the target heating power, send corresponding heating signals to each heating control module so that the heating circuits of each heating area heat with different power so that the temperature of each heating area increases in tandem.

2. The method according to claim 1, characterized in that, The step of sending corresponding heating signals to the heating circuits of each heating zone via the heating control module according to each target heating power, followed by: The following steps are executed cyclically at a preset period until the difference between the current temperature of all heating zones and the target temperature is less than a preset stability threshold: Collect the current temperature of each of the heating zones; Within each preset period, the received current temperature is used as new initial temperature data, and steps S1-S4 are executed.

3. The method according to claim 1, characterized in that, The step of obtaining the thermal influence coefficient matrix specifically includes: The system receives physical characteristic structural parameters representing the liquid crystal display screen and physical characteristic structural parameters representing the heating glass in the heating circuit. The physical characteristic structural parameters of the heating glass include at least the material of the heating film of the heating glass, the size of the heating glass, and the partition layout of the heating glass. The physical characteristic structural parameters of the liquid crystal display screen include at least the layer structure information of the liquid crystal display screen. Based on the aforementioned physical property structural parameters, a finite element analysis thermodynamic simulation model is used to perform heat conduction simulation calculations to generate the aforementioned thermal influence coefficient matrix.

4. The method according to claim 1, characterized in that, The step of sending corresponding heating signals to the heating circuits of each heating zone through the heating control module according to each target heating power specifically includes: For any of the target heating power, a corresponding target duty cycle value is generated based on the pre-stored heating power-duty cycle mapping table; Generate PWM heating signals for each of the heating regions, wherein the duty cycle of each PWM heating signal is the target duty cycle value corresponding to the target heating power of the heating region; Each of the PWM heating signals is sent to the heating circuit of each heating area through the heating control module according to different phase delays for heating.

5. The method according to claim 1, characterized in that, The method further includes: Real-time monitoring of the temperature change rate of each heating zone; when the temperature change rate of any heating zone is greater than a first preset threshold, the temperature difference between the target heating zone with a temperature change rate greater than the first preset threshold and the adjacent heating zones of the target heating zone is calculated. Based on the temperature difference, adjust the thermal influence coefficient matrix; The target heating power is recalculated using the adjusted thermal influence coefficient matrix.

6. The method according to claim 5, characterized in that, The method further includes: Real-time monitoring of the temperature change rate of each heating zone; when the temperature change rate of any heating zone is greater than a second preset threshold, pausing the sending of the corresponding heating signal to each heating zone and stopping heating, wherein the second preset threshold is greater than the first preset threshold. Send a warning message to the user.

7. A liquid crystal display heating system, performing the method as described in any one of claims 1-6, characterized in that, The system includes: a control chip, several heating control modules, several heating glass units, and a temperature sensor, wherein the temperature sensor is located in the LCD screen; The input terminal of each heating control module is electrically connected to one output terminal of the control chip, the output terminal of one heating control module is connected to the control terminal of one heating glass, the output terminal of each temperature sensor is electrically connected to one input terminal of the control chip, the plurality of heating glasses are adjacent to each other to form a heating layer, and the heating layer is attached to the liquid crystal screen. The control chip is used to measure the initial temperature data of each heating zone through temperature sensors installed in each heating zone; when any initial temperature data is lower than a preset lower temperature threshold, it calculates the temperature rise of each heating zone based on the target temperature and the initial temperature data, determines a temperature rise matrix based on the temperature rise, where the temperature rise is the difference between the initial temperature data and the target temperature of the heating zone; it calculates the target heating power of each heating zone based on the thermal influence coefficient matrix and the temperature rise matrix, where the target heating power is used to determine the heating power required to be applied to the heating zone; and it sends corresponding heating signals to the heating glass of each heating zone through the heating control module based on the target heating power. The heating control module is used to control the corresponding heating glass to heat according to the heating signal.

8. The system according to claim 7, characterized in that, Any of the heating control modules includes: a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a first transistor, and a first MOSFET; The first end of the first resistor is connected to the output terminal of the control chip, and the first end of the first resistor is the input terminal of the heating control module. The second end of the first resistor is connected to the base of the first transistor. The first end of the second resistor is connected to the base of the first transistor. The second end of the second resistor is connected to the emitter of the first transistor. The emitter of the first transistor is grounded. The collector of the first transistor is connected to the first end of the third resistor. The second end of the third resistor is connected to the first end of the fifth resistor. The third resistor is a thermistor. The second end of the fifth resistor is connected to the gate of the first MOSFET. The first end of the fourth resistor is connected to the first end of the fifth resistor. The second end of the fourth resistor is connected to the source of the first MOSFET. The source of the first MOSFET is connected to the heating power supply. The drain of the first MOSFET is connected to the control terminal of the heating glass.

9. A computer-readable storage medium comprising instructions, characterized in that, When the instruction is executed on the LCD screen heating device, the LCD screen heating device performs the method as described in any one of claims 1-6.

10. A computer program product, characterized in that, When the computer program product is run on the LCD screen heating device, the LCD screen heating device performs the method as described in any one of claims 1-6.

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