Micro-nano structure conformal transfer printing device

Abstract

The invention discloses a micro-nano structure conformal transfer printing device, and relates to the technical field of micro-nano manufacturing. Comprising a rack, the four corners of the top of the rack are each slidably connected with a first guide rod, the bottom ends of the four first guide rods are fixedly connected with the four corners of the top face of a bearing plate, the top face of the bearing plate is fixedly connected with a pressing handle, and the center of the bottom face of the bearing plate is detachably connected with a transfer printing head; the four corners of the bottom face of the bearing plate are fixedly connected with the top ends of the second guide rods respectively, the bottoms of the second guide rods are slidably connected with the film clamping units, the transfer printing film is detachably connected with the film clamping units, the substrate is arranged below the transfer printing film and installed on the supporting and positioning plate, the supporting and positioning plate is installed on the hot plate, and the hot plate is connected with the rack. According to the method, the defect-free and high-fidelity transfer printing of the micro-nano structure can be realized on the target substrates with different shapes and sizes.

Description

Technical Field

[0001] This invention belongs to the field of micro-nano manufacturing technology, and more specifically, relates to a conformal transfer device for micro-nano structures. Background Technology

[0002] With the increasing demand for micro-nano fabrication technology in non-planar devices (such as optical lenses, flexible electronics, and curved surface sensors), achieving high-precision, high-fidelity micro-nano patterned structures on complex three-dimensional curved substrates has become a key technological bottleneck that urgently needs to be overcome. Although traditional planar photolithography techniques (including ultraviolet lithography and electron beam lithography) can process high-precision micro-nano patterns, they are limited by their physical depth of field and focal plane requirements, making it difficult to directly complete high-quality patterning processes on non-planar or complex curved surfaces.

[0003] Transfer printing technology is an effective means to solve the above problems. It utilizes mature planar lithography to prepare high-precision micro-nano patterns on temporary substrates, and then transfers these patterns with high fidelity to flexible or complex curved target substrates through mechanical contact and interfacial force control. This technology not only inherits the precision advantages of planar lithography, but also overcomes its limitation of only being able to process on a plane, providing a feasible solution for the multifunctional integration of non-planar devices.

[0004] However, existing transfer technologies still have some problems in practical operation. For example, it is difficult to ensure uniform and gapless adhesion at the contact interface on a microscopic scale during the transfer process, resulting in the inability of gas to escape effectively between interfaces, forming microbubble defects, which destroy the integrity and continuity of the pattern. In addition, the transfer process also generally faces problems such as insufficient adhesion between the transferred pattern and the target substrate, and local wrinkling and detachment under curved surface stress, ultimately making it difficult to achieve high-fidelity, full-area transfer of high-precision micro-nano patterns on the target substrate. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a conformal transfer device for micro-nano structures, which can realize defect-free and high-fidelity transfer of micro-nano structures on target substrates of different shapes (planar, curved) and sizes.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a micro-nano structure conformal transfer device, including a frame, a first guide rod slidably connected to the four corners of the top of the frame, the bottom ends of the four first guide rods being fixedly connected to the four corners of the top surface of a support plate, a pressure handle being fixedly connected to the top surface of the support plate, and a transfer head being detachably connected to the center of the bottom surface of the support plate; the top ends of a second guide rod are fixedly connected to the four corners of the bottom surface of the support plate, a film clamping unit is slidably connected to the bottom of the second guide rod, a transfer film is detachably connected to the film clamping unit, a substrate is disposed below the transfer film and mounted on a support positioning plate, the support positioning plate is mounted on a hot plate, and the hot plate is connected to the frame.

[0007] Preferably, a first spring is provided between the frame and the support plate. The first spring is sleeved and connected to the outside of the first guide rod. One end of the first spring is connected to the frame and the other end is connected to the support plate.

[0008] Preferably, the second guide rod is a stepped shaft, and a second spring is sleeved on the outside of the second guide rod. One end of the second spring is fixedly connected to the film clamping unit, and the other end is fixedly connected to the stepped plane of the second guide rod.

[0009] Preferably, the film clamping unit includes an upper frame for clamping magnets, a lower frame for clamping magnets, a magnet, and an iron sheet frame. The upper frame for clamping magnets, the lower frame for clamping magnets, and the iron sheet frame are all annular hollow structures. The upper frame for clamping magnets and the lower frame for clamping magnets are stacked and fixedly connected. The magnet is embedded around the upper frame for clamping magnets and the lower frame for clamping magnets. The iron sheet frame is adsorbed onto the magnet and is attached to the lower frame for clamping magnets. The transfer film is clamped between the iron sheet frame and the lower frame for clamping magnets.

[0010] Preferably, grooves are provided around the upper frame of the magnet clamping and around the lower frame of the magnet clamping, and the grooves are aligned. The magnet is embedded in the groove, and the bottom surface of the magnet is flush with the bottom surface of the lower frame of the magnet clamping.

[0011] Preferably, a number of positioning grooves are provided around the lower frame of the magnet clamping, and a number of positioning protrusions are provided around the iron sheet frame, with the positioning grooves and positioning protrusions matching each other.

[0012] Preferably, guide holes are provided at the four corners of the upper frame holding the magnet, the four corners of the lower frame holding the magnet, and the four corners of the support positioning plate, and the guide holes of the three are adapted to the second guide rod.

[0013] Preferably, the transfer film has a micro / nano structure composed of photoresist or conductive material, and the transfer head is made of silicone.

[0014] The beneficial effects of adopting the above technical solution are as follows: 1. This transfer device achieves perfect conformal adhesion between the micro-nano structure on the transfer film and the target substrate through a transfer head with deformation and load-bearing capacity. Simultaneously, the size of the adjustable support positioning plate allows for precise positioning of the target substrate, ultimately achieving defect-free, high-fidelity transfer of high-precision micro-nano structures on target substrates of different shapes (planar, curved) and sizes. 2. The first and second springs enable rapid self-resetting of all components after transfer, reducing operation steps and improving processing efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the transfer device; Figure 2 This is a schematic diagram of the thin film clamping unit. Figure 3A schematic diagram of the transfer process when the substrate is a curved substrate; Figure 4 A schematic diagram of the transfer process when the substrate is a planar substrate; In the figure: 1. Frame; 2. Support positioning plate; 3. First spring; 4. Bearing plate; 5. First guide rod; 6. Pressure handle; 7. Transfer head; 8. Second guide rod; 9. Second spring; 10. Film clamping unit; 101. Upper frame for clamping magnet; 102. Lower frame for clamping magnet; 103. Magnet; 104. Iron sheet frame; 11. Transfer film; 12. Curved substrate; 13. Hot plate; 14. Planar substrate. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0017] like Figure 1 As shown, the transfer device includes a frame 1, with guide holes at the four corners of the top of the frame 1. A first guide rod 5 slides within the guide holes of the frame 1. The bottom end of the first guide rod 5 is fixedly connected to the top surface of the support plate 4. A first spring 3 is sleeved and connected to the outside of the first guide rod 5, with one end connected to the frame 1 and the other end connected to the support plate 4. A pressure handle 6 is fixedly connected to the center of the top surface of the support plate 4, and a transfer head 7 is detachably connected to the center of the bottom surface of the support plate 4. Moving the pressure handle 6 up and down causes the support plate 4 and the transfer head 7 to move up and down, while the first guide rod 5 moves up and down within the guide holes of the frame 1.

[0018] The bottom corners of the support plate 4 are each fixedly connected to the top of a second guide rod 8. The bottom of the second guide rod 8 is slidably connected to the thin film clamping unit 10. The transfer film 11 is detachably connected to the thin film clamping unit 10. The substrate is placed below the transfer film 11 and mounted on the support positioning plate 2. The support positioning plate 2 is mounted on the hot plate 13, which is connected to the frame 1. The support positioning plate 2 is made of a metal with good thermal conductivity, ensuring that the temperature of the substrate can be controlled by the hot plate 13. The transfer film 11 has a micro-nano structure composed of photoresist or conductive material. The transfer film 11 is a double-layer film composed of PDMS and a photoresist layer. The transfer head 7 is made of silicone.

[0019] like Figure 2As shown, the thin-film clamping unit 10 includes an upper magnet clamping frame 101, a lower magnet clamping frame 102, a magnet 103, and an iron sheet frame 104. The upper magnet clamping frame 101 and the lower magnet clamping frame 102 are stacked and fixedly connected, specifically, they can be bonded together with strong adhesive. Grooves are provided around both the upper magnet clamping frame 101 and the lower magnet clamping frame 102, and these grooves are aligned, fixing the magnet 103 within the grooves. The bottom surface of the magnet 103 is flush with the bottom surface of the lower magnet clamping frame 102, allowing the iron sheet frame 104 to contact the magnet 103. Four positioning grooves are provided around the lower magnet clamping frame 102, and four positioning protrusions are provided around the iron sheet frame 104. The positioning protrusions engage with the positioning grooves, enabling precise positioning of the iron sheet frame 104. The iron sheet frame 104 is attached to the magnet 103 and is in contact with the lower frame 102 that holds the magnet. Under the magnetic force of the magnet 103, the transfer film 11 is held between the iron sheet frame 104 and the lower frame 102 that holds the magnet.

[0020] A second spring 9 is fitted around the outside of the second guide rod 8. The second guide rod 8 is a stepped shaft. One end of the second spring 9 is fixedly connected to the film clamping unit 10, and the other end is fixedly connected to the stepped plane of the second guide rod 8. Guide holes are provided at the four corners of the upper frame 101 and the lower frame 102 of the magnet clamping unit, as well as the four corners of the support positioning plate 2. The guide holes of the three are aligned. The lower part of the second guide rod 8 slides up and down within the guide holes of the three components.

[0021] The following is combined Figure 3 The working process of this transfer device is described below: S1: Place the transfer film 11 on the iron frame 104, then bring the transfer film 11 and the iron frame 104 close to the magnet 103. The magnetic force of the magnet 103 tightly attracts the transfer film 11 and the iron frame 104. The positioning protrusion on the iron frame 104 is engaged in the positioning groove of the lower frame 102 of the clamping magnet, achieving precise positioning of the transfer film 11. Place the curved substrate 12 on a specific support positioning plate 2. The support positioning plate 2 cooperates with the lower end of the frame 1 to achieve precise positioning of the curved substrate 12. The material of the support positioning plate 2 is a metal with good thermal conductivity, and then the curved substrate 12 is heated to 120°C by the hot plate 13.

[0022] S2: Apply pressure to the pressure handle 6, and the transfer head 7 moves downward. At the same time, the film clamping unit 10 and the transfer film 11 move downward together. Pay attention to controlling the downward movement distance and speed of the transfer head 7, as well as the contact area with the curved substrate 12. During the downward pressure process, the first spring 3 is stretched.

[0023] S3: After the thin film clamping unit 10 comes into contact with the support positioning plate 2, since the transfer head 7 has not yet fully contacted the photoresist layer to be transferred, the transfer head 7 needs to continue to move downward. There is a corresponding guide hole. The second guide rod 8 continues to move downward along the guide hole of the thin film clamping unit 10 and the support positioning plate 2. At this time, the second spring 9 is compressed and the first spring 3 continues to be stretched until the transfer head 7 is fully in contact with the photoresist layer to be transferred.

[0024] S4: The force applied to the pressure handle 6 is released, the first spring 3 and the second spring 9 return to their initial state, driving the transfer head 7 and the support plate 4 back to their original positions, and the photoresist layer is transferred onto the curved substrate 12.

[0025] like Figure 4 As shown, this transfer device can transfer the photoresist layer on the planar substrate 14 to the flexible substrate. Its process flow is basically the same as the above process, and only the support positioning plate 2 suitable for the planar substrate 14 needs to be replaced.

[0026] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A micro / nano structure conformal transfer device, characterized in that, The machine includes a frame (1), with a first guide rod (5) slidably connected to each of the four top corners of the frame (1). The bottom ends of the four first guide rods (5) are fixedly connected to the four top corners of the support plate (4). The top surface of the support plate (4) is fixedly connected to the pressure handle (6). The center of the bottom surface of the support plate (4) is detachably connected to the transfer head (7). The top ends of a second guide rod (8) are fixedly connected to each of the four bottom corners of the support plate (4). The bottom of the second guide rod (8) is slidably connected to the film clamping unit (10). The transfer film (11) is detachably connected to the film clamping unit (10). The substrate is placed below the transfer film (11) and installed on the support positioning plate (2). The support positioning plate (2) is installed on the hot plate (13). The hot plate (13) is connected to the frame (1).

2. The micro / nano structure conformal transfer device according to claim 1, characterized in that, A first spring (3) is provided between the frame (1) and the bearing plate (4). The first spring (3) is sleeved and connected to the outside of the first guide rod (5). One end of the first spring (3) is connected to the frame (1), and the other end is connected to the bearing plate (4).

3. The micro / nano structure conformal transfer device according to claim 1, characterized in that, The second guide rod (8) is a stepped shaft. A second spring (9) is sleeved on the outside of the second guide rod (8). One end of the second spring (9) is fixedly connected to the film clamping unit (10), and the other end is fixedly connected to the stepped plane of the second guide rod (8).

4. A micro / nano structure conformal transfer device according to any one of claims 1-3, characterized in that, The film clamping unit (10) includes a magnet clamping upper frame (101), a magnet clamping lower frame (102), a magnet (103), and an iron plate frame (104). The magnet clamping upper frame (101), the magnet clamping lower frame (102), and the iron plate frame (104) are all annular hollow structures. The magnet clamping upper frame (101) and the magnet clamping lower frame (102) are stacked and fixedly connected. The magnet (103) is embedded around the magnet clamping upper frame (101) and the magnet clamping lower frame (102). The iron plate frame (104) is adsorbed on the magnet (103) and is attached to the magnet clamping lower frame (102). The transfer film (11) is clamped between the iron plate frame (104) and the magnet clamping lower frame (102).

5. The micro / nano structure conformal transfer device according to claim 4, characterized in that, Grooves are provided around the upper frame (101) and the lower frame (102) of the magnet clamping, and the grooves of the two are aligned. The magnet (103) is embedded in the groove, and the bottom surface of the magnet (103) is flush with the bottom surface of the lower frame (102) of the magnet clamping.

6. The micro / nano structure conformal transfer device according to claim 4, characterized in that, Several positioning grooves are provided around the lower frame (102) for holding the magnet, and several positioning protrusions are provided around the iron plate frame (104), with the positioning grooves and positioning protrusions matching each other.

7. The micro / nano structure conformal transfer device according to claim 4, characterized in that, Guide holes are provided at the four corners of the upper frame (101) holding the magnet, the four corners of the lower frame (102) holding the magnet, and the four corners of the support positioning plate (2). The guide holes of the three are adapted to the second guide rod (8).

8. The micro / nano structure conformal transfer device according to claim 1, characterized in that, The transfer film (11) has a micro-nano structure composed of photoresist or conductive material, and the transfer head (7) is made of silicone.

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