Semiconductor equipment transmission control method and device, equipment and storage medium

Abstract

The embodiment of the invention discloses a semiconductor equipment transmission control method and device, equipment and a storage medium, and the method comprises the steps: determining a plurality of corresponding target transmission control atomic actions based on a transmission control request instruction under the condition of receiving the transmission control request instruction, and determining a target transmission control action sequence based on the target transmission control atomic actions; a corresponding target transmission control component is matched based on the target transmission control action sequence, and a target transmission control link is determined based on the target transmission control action sequence and the target transmission control component; and determining a corresponding target standardized interface based on the target transmission control link, and calling the target standardized interface to control and execute an action corresponding to the target transmission control link. According to the technical scheme provided by the embodiment of the invention, multiplexing of transmission control logic in various types of equipment and rapid adaptation of different subject matters and bearing devices can be realized through a four-layer architecture of'demand input decomposition atomic action-flexible component combination-standardized interface calling ', and cost reduction, efficiency improvement and accelerated iteration of semiconductor previous process equipment are assisted.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor device control method, apparatus, equipment and storage medium. Background Technology

[0002] In the front-end semiconductor manufacturing process, wafer transport and alignment are crucial steps across multiple core equipment types, directly determining production accuracy and efficiency. This involves equipment such as wafer inspection equipment, EFEM lithography machines, coating and developing machines, thin film deposition equipment (e.g., CVD, PVD), etching equipment, ion implantation equipment, and cleaning equipment. Currently, the industry generally adopts a "customized development" model for transport and control requirements of different equipment and different targets (multi-size wafers / different photomasks). However, the existing "customized development" model for transport and control systems struggles to meet the demands of multi-equipment, multi-scenario, and high-iteration processes in semiconductor front-end manufacturing. The core shortcomings are as follows:

[0003] The same transmission and control logic (such as object picking and placing, workstation alignment, and vacuum adsorption) needs to be repeatedly designed and coded in different devices; the transmission and control system is strongly coupled with specific devices and objects, and no universal adaptation interface is reserved - there is no automatic motion stroke calibration algorithm or clamping force adaptive adjustment module, and it is impossible to dynamically match objects of different sizes. Summary of the Invention

[0004] This invention provides a semiconductor device control method, apparatus, equipment, and storage medium. The technical solutions of this invention can fill the gaps in the flexibility and standardization of existing technologies, and help reduce costs, increase efficiency, and accelerate iteration of semiconductor front-end process equipment.

[0005] In a first aspect, embodiments of the present invention provide a semiconductor device control method, the method comprising:

[0006] Upon receiving a transmission and control request instruction, multiple target transmission and control atomic actions are determined based on the instruction, and a target transmission and control action sequence is determined based on these atomic actions. A corresponding target transmission and control component is adapted to the target transmission and control action sequence, and a target transmission and control link is determined based on the sequence and the component. A corresponding target standardized interface is determined based on the target transmission and control link, and the standardized interface is invoked to control the execution of the actions corresponding to the link.

[0007] In a second aspect, embodiments of the present invention provide a semiconductor device control apparatus, the apparatus comprising:

[0008] The transmission and control action sequence determination module is used to determine multiple corresponding target transmission and control atomic actions based on the transmission and control request instruction upon receiving the transmission and control request instruction, and to determine a target transmission and control action sequence based on the target transmission and control atomic actions; the transmission and control link determination module is used to adapt the corresponding target transmission and control component based on the target transmission and control action sequence, and to determine the target transmission and control link based on the target transmission and control action sequence and the target transmission and control component; the interface invocation module is used to determine the corresponding target standardized interface based on the target transmission and control link, and to invoke the target standardized interface to control the execution of the action corresponding to the target transmission and control link.

[0009] Thirdly, embodiments of the present invention provide a computer device, the computer device comprising:

[0010] One or more processors;

[0011] Memory, used to store one or more programs;

[0012] When the one or more programs are executed by the one or more processors, the one or more processors implement the semiconductor device control method described in any embodiment.

[0013] Fourthly, embodiments of the present invention provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the semiconductor device control method described in any embodiment.

[0014] The technical solution provided by this invention, upon receiving a control request instruction, determines multiple target control atomic actions based on the instruction, and determines a target control action sequence based on the target control atomic actions; adapts the target control action sequence to the corresponding target control component, and determines the target control link based on the target control action sequence and the target control component; determines the corresponding target standardized interface based on the target control link, and calls the target standardized interface to control and execute the actions corresponding to the target control link. This technical solution solves the problem that the existing "customized development" model is insufficient to meet the production needs of multiple devices, multiple scenarios, and high iteration in semiconductor front-end processes. It achieves the reuse of control logic in various equipment such as thin film deposition, etching, ion implantation, and lithography machines through a four-layer architecture of "demand input - automatic decomposition of atomic actions - flexible combination of components - standardized interface call," as well as rapid adaptation to different sized objects and different carrier devices. This fills the gap in flexibility and standardization in existing technologies, helping to reduce costs, increase efficiency, and accelerate iteration in semiconductor front-end process equipment. Attached Figure Description

[0015] Figure 1This is a flowchart of a semiconductor device control method provided in an embodiment of the present invention;

[0016] Figure 2 This is a flowchart of another semiconductor device control method provided in an embodiment of the present invention;

[0017] Figure 3 This is a classification and parameter table of transmission and control atomic actions provided in an embodiment of the present invention;

[0018] Figure 4 This is a candidate component library classification structure provided in an embodiment of the present invention;

[0019] Figure 5 This is a semiconductor device icon design correspondence table provided in an embodiment of the present invention;

[0020] Figure 6 This is an optional standardized interface parameter table provided in an embodiment of the present invention;

[0021] Figure 7 This is a flowchart illustrating a process for controlling semiconductor devices according to an embodiment of the present invention.

[0022] Figure 8 This is a schematic diagram of the structure of a semiconductor device control device provided in an embodiment of the present invention;

[0023] Figure 9 This is a schematic diagram of the structure of a computer device provided in an embodiment of the present invention. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. The acquisition, storage, use, and processing of data in the technical solutions of the embodiments of the present invention all comply with the relevant provisions of national laws and regulations.

[0025] Figure 1 This is a flowchart of a semiconductor equipment control method provided by an embodiment of the present invention. The embodiment of the present invention can be applied to scenarios in which control actions are executed according to demand instructions in the front-end process of semiconductor manufacturing. The method can be executed by a semiconductor equipment control device, which can be implemented by software and / or hardware.

[0026] like Figure 1 As shown, the semiconductor device control method includes the following steps:

[0027] S110. Upon receiving a transmission and control request instruction, determine multiple corresponding target transmission and control atomic actions based on the transmission and control request instruction, and determine a target transmission and control action sequence based on the target transmission and control atomic actions.

[0028] The control request instruction can be a trigger instruction that requests the execution of a control action. Specifically, the control request instruction can be entered by the user or automatically generated according to task requirements; no limitation is made here. The target control atomic action can be the smallest-level control action used to implement the control request instruction. Specifically, the scene parameters of the control requirement can be parsed from the control request instruction, and then, based on the mapping relationship between the scene parameters and the control atomic actions, multiple target control atomic actions corresponding to the control atomic actions can be determined.

[0029] Furthermore, the target control action sequence can be a complete control action obtained by combining multiple target control atomic actions according to logical relationships. Specifically, the execution logic relationship between target control atomic actions can be determined based on the control request instruction, and then multiple target control atomic actions can be arranged and combined based on the execution logic relationship to obtain the target control action sequence.

[0030] S120. Adapt the corresponding target transmission and control component based on the target transmission and control action sequence, and determine the target transmission and control link based on the target transmission and control action sequence and the target transmission and control component.

[0031] The target control component can be any control component used to execute the target control atomic action. Specifically, the requirement information for control components for executing the control action can be parsed from the control request instruction, and then the control component that meets the requirement information can be selected from the available control components as the target control component. The target control link can be a link in which control components participate in the execution of the target control action sequence. Specifically, the determined target control components can be filled into the corresponding atomic actions in the target control action sequence to obtain the target control link.

[0032] S130. Determine the corresponding target standardized interface based on the target transmission and control link, and call the target standardized interface to control and execute the action corresponding to the target transmission and control link.

[0033] The target standardized interface can be a standardized interface used to control and execute the target transmission and control link. Specifically, it can also be determined based on the target transmission and control scenario parameters, and the specific interface that meets the transmission and control scenario requirements can be selected from the available standardized interfaces as the target standardized interface. Furthermore, relevant parameters in the target transmission and control link can be input into the target standardized interface, so that the target standardized interface controls the corresponding transmission and control equipment to execute the actions corresponding to the target transmission and control link, ensuring the complete execution of each transmission and control action.

[0034] The technical solution provided by this invention, upon receiving a control request instruction, determines multiple target control atomic actions based on the instruction, and determines a target control action sequence based on the target control atomic actions; adapts the target control action sequence to the corresponding target control component, and determines the target control link based on the target control action sequence and the target control component; determines the corresponding target standardized interface based on the target control link, and calls the target standardized interface to control and execute the actions corresponding to the target control link. This technical solution solves the problem that the existing "customized development" model is insufficient to meet the production needs of multiple devices, multiple scenarios, and high iteration in semiconductor front-end processes. It achieves the reuse of control logic in various equipment such as thin film deposition, etching, ion implantation, and lithography machines through a four-layer architecture of "demand input - automatic decomposition of atomic actions - flexible combination of components - standardized interface call," as well as rapid adaptation to different sized objects and different carrier devices. This fills the gap in flexibility and standardization in existing technologies, helping to reduce costs, increase efficiency, and accelerate iteration in semiconductor front-end process equipment.

[0035] Figure 2 This is a flowchart of another semiconductor device control method provided by an embodiment of the present invention. This embodiment is applicable to scenarios where control actions are executed according to demand instructions in the front-end process of semiconductor manufacturing. Based on the above embodiments, this embodiment further explains how to determine the corresponding target standardized interface based on the target control link and call the target standardized interface to control the execution of the actions corresponding to the target control link; how to adapt the corresponding target control component based on the target control action sequence and determine the target control link based on the target control action sequence and the target control component; and how to determine the corresponding target standardized interface based on the target control link and call the target standardized interface to control the execution of the actions corresponding to the target control link. This device can be implemented by software and / or hardware and integrated into a computer device with application development capabilities.

[0036] like Figure 2 As shown, the semiconductor device control method includes the following steps:

[0037] S210. Upon receiving a transmission and control request instruction, parse out the corresponding target transmission and control scenario parameters based on the transmission and control request instruction.

[0038] The control request instruction can be a trigger instruction requesting the execution of a control action. Specifically, the control request instruction can be input by the user or automatically generated according to task requirements; no limitation is made here. The target control scenario parameters can be parameters representing the required scenario corresponding to the execution of the control action. Specifically, the target control scenario parameters include at least one of the following: equipment type, target object information, and workstation requirement parameters. Equipment type includes wafer inspection equipment, lithography machine, EFEM, thin film deposition equipment, or etching equipment, etc. Target object information includes: 4-inch wafer, 6-inch wafer, 8-inch wafer, or 12-inch wafer. Workstation requirement parameters include: wafer loading, wafer unloading, alignment, or transfer. By parsing the control request instruction, the corresponding target control scenario parameters can be determined. Subsequently, corresponding control action instructions can be automatically generated based on the target control scenario parameters, and the corresponding control equipment can be controlled to execute control actions based on the control action control instructions to meet the control requirements of the control request instruction.

[0039] S220. Based on the target transmission and control scenario parameters and the preset mapping table, determine the target transmission and control atomic actions and the corresponding target atomic action parameters, and adjust and sort the action parameters of the target transmission and control atomic actions based on the target atomic action parameters to obtain the target transmission and control action sequence.

[0040] The target control atomic action can be the smallest level control action used to implement the control request instruction. Specifically, the control atomic actions corresponding to the target control scenario parameters can be matched based on a preset mapping table, and the matched control atomic actions are used as the target control atomic actions. The preset mapping table is used to represent the correspondence between control scenario parameters and control atomic actions, and can decompose the input standardized requirement data into standardized control atomic actions (such as "Robot pick up / place wafer", "vacuum on / off", "MoveTo station", "LoadPort load / unload wafer", and "ESD protection on / off", etc.).

[0041] For example, Figure 3 This is a classification and parameter table of transmission and control atomic actions provided in an embodiment of the present invention. For example... Figure 3 As shown, the transmission and control atomic actions are divided into five categories according to function. Each category of actions has a preset standardized parameter template, which can be adjusted as needed:

[0042] Grasping actions: including Robot gripping (parameters: gripping force, gripping range, anti-static mode) and vacuum adsorption (parameters: vacuum level, adsorption delay);

[0043] Motion-related actions: including MoveTo workstation (parameters: target coordinates, motion speed, acceleration, accuracy requirements) and path planning (parameters: avoidance area, motion priority);

[0044] Workstation interaction actions: including LoadPort start / stop (parameters: sealing pressure, door lock status) and alignment detection (parameters: alignment mark type, detection accuracy);

[0045] Carrier device adaptation actions: including FOUP / SMIF / Cassette identification (parameters: device model, positioning reference) and tray switching (parameters: switching delay, positioning calibration).

[0046] Status reset actions include Home reset (parameters: component type, reset precision) and fault reset (parameters: fault code, recovery strategy).

[0047] Cache interaction actions: including Buffer loading / unloading (parameters: Buffer slot number, retrieval priority) and MoveTo Buffer station (parameters: target buffer slot coordinates, buffer slot occupancy status);

[0048] Furthermore, the target atomic action parameters can be specific execution parameters of the target transmission and control atomic actions. For example, target atomic action parameters can include parameters such as grasping force, movement speed, and alignment accuracy threshold. Specifically, the action parameters corresponding to the target atomic action parameters can be matched using a "parameter matching engine" as the target atomic action parameters. The target transmission and control action sequence can be a complete transmission and control action obtained by combining multiple target transmission and control atomic actions according to logical relationships. Specifically, target atomic action parameters can be added to the corresponding target transmission and control atomic actions, and then the execution logical relationship between the target transmission and control atomic actions can be determined based on the target transmission and control scene parameters. Based on the execution logical relationship, the added target transmission and control atomic actions can be arranged and combined to obtain the target transmission and control action sequence.

[0049] Optionally, the target transmission and control equipment can be determined based on the equipment type in the target transmission and control scenario parameters; the target transmission and control atomic actions corresponding to the target transmission and control equipment and the target object information can be matched from the preset mapping table; the target atomic action parameters can be determined based on the target object information and workstation requirement parameters in the target transmission and control scenario parameters; and the target transmission and control atomic actions can be adjusted and sorted based on the target atomic action parameters to obtain the target transmission and control action sequence.

[0050] The target control device can be any control device used to perform control actions. Specifically, the control device corresponding to the device type can be considered the target control device. Taking etching equipment as an example, such equipment often needs to meet special requirements such as "high-temperature chamber avoidance" and "micron-level transmission accuracy." Simultaneously, the size of the target object must be clearly defined. If it is an 8-inch wafer (approximately 200 mm in diameter), the corresponding atomic actions need to consider the clamping and transmission characteristics adapted to this size; if it is a 12-inch wafer (approximately 300 mm in diameter), the atomic actions must have matching clamping and transmission capabilities to adapt to its size. Furthermore, the workstation process should be streamlined, such as the common "mounting → alignment → transfer" steps, to provide basic information for subsequent action matching.

[0051] Furthermore, a preset mapping table can be used to match the target control device and object information for control atomic actions, and the matched control atomic actions can be used as the target control atomic actions. For example, based on the parsed information, the preset mapping table can be quickly invoked to accurately match the corresponding atomic action combination. Taking the etching equipment on-chip process as an example, for an 8-inch wafer, the possible atomic action combination is: "FOUP recognition → Robot adapts to the clamping range of the 8-inch wafer for gripping → High-temperature area avoidance path planning → MoveTo alignment stage → Vacuum adsorption → Alignment detection → MoveTo etching cavity"; while for a 12-inch wafer, the atomic action combination is: "FOUP recognition → Robot adapts to the clamping range of the 12-inch wafer for gripping → High-temperature area avoidance path planning → MoveTo alignment stage → Vacuum adsorption → Alignment detection → MoveTo etching cavity". Different wafer sizes require different Robot clamping ranges during the gripping process due to size differences, reflecting the targeted nature of the action matching.

[0052] Finally, based on the target object information and workstation requirements in the target control scenario parameters, the equipment precision requirements for executing the control actions can be determined, and then the corresponding target atom action parameters can be determined based on the equipment precision requirements. For example, for an 8-inch wafer, since its size is relatively smaller than that of a 12-inch wafer, the gripping force may be set to 25N (this is just an example; the actual force will depend on the wafer characteristics) to ensure stable gripping without damaging the wafer; the transmission precision of the etching equipment for the 8-inch wafer is set to ±4μm. For a 12-inch wafer, the gripping force is set to 40N, and the transmission precision of the etching equipment is set to ±3μm to meet its precision requirements.

[0053] S230. Extract the component requirement label corresponding to each atomic action in the target transmission and control action sequence.

[0054] The component requirement tag can be used to record the conditions that a component must meet to execute a target control atomic action. Specifically, the component requirement tag for each control atomic action can be preset by the user.

[0055] S240. For each component requirement label, select the target transmission and control component from the candidate transmission and control components that can meet the component requirement label.

[0056] The candidate control components can be any selectable control components. Specifically, the candidate control components include at least one of the following: core actuator, load-bearing component, auxiliary detection component, and environmental control and electrostatic protection component.

[0057] For example, Figure 4 This is a candidate component library classification structure provided in an embodiment of the present invention; Figure 5 This is a semiconductor device icon design correspondence table provided in an embodiment of the present invention. The library stores model information, functional parameters, and adaptation action lists for various control components, specifically including:

[0058] Core execution components: Robot (classified by precision: micron / nano; by application: ambient temperature / high temperature / anti-static), LoadPort (classified by carrier device: FOUP-specific / SMIF-specific / general purpose), Aligner (classified by alignment precision: ±0.05μm high precision / ±0.1μm standard precision; by alignment object: wafer-specific / photomask-specific), Ionizer (classified by static elimination method: wind-type ionization / contact-type ionization; by applicable environment: ambient temperature cleanroom / high temperature resistant), FFU fan filter unit (classified by filtration level: Class 1 ultra-clean / Class 10 high clean / Class 100 standard clean; by airflow rate: 0.3m / s low-speed stable / 0.5m / s high-efficiency purification).

[0059] Supporting devices: Cassette (suitable for 4 / 6 / 8 / 12-inch wafers), SMIF (suitable for cleanroom environments), FOUP (suitable for automated production lines).

[0060] Auxiliary detection components include position detection sensors (such as grating rulers with an accuracy of ±0.1μm adapted to lithography machines EFEM and wafer inspection equipment, and eddy current sensors with a range of 0-20mm adapted to etching equipment and thin film deposition equipment), and status detection sensors (such as vacuum sensors with a range of -0.1~0MPa adapted to vacuum adsorption monitoring in multiple scenarios, electrostatic detection sensors with a detection range of 0-100V adapted to ion implantation and lithography scenarios, and temperature sensors with a range of -20~500℃ adapted to high-temperature process equipment).

[0061] Environmental control and electrostatic discharge (ESD) protection components: These include FFU fan filter units (such as Class 1 ultra-clean +0.3m / s wind speed type for lithography machines EFEM and wafer inspection equipment, and Class 10 high clean +0.5m / s wind speed type for etching equipment, coating and developing machines, etc.) and ion generators (wind-type ion generators for lithography machines EFEM and wafer inspection equipment in ambient temperature cleanroom environments, and contact-type ion generators for thin film deposition equipment and etching equipment in high temperature environments), providing clean environment and ESD protection for the equipment.

[0062] The target control component can be any control component used to execute the target control atomic action. Specifically, control components that meet the component requirement tags can be selected from the candidate control components to be the target control component.

[0063] S250. Perform inter-component compatibility testing on each target transmission and control component, and fill the target transmission and control components that meet the compatibility requirements into the corresponding atomic actions in the target transmission and control action sequence to obtain the target transmission and control link.

[0064] To ensure compatibility issues between target control components, inter-component compatibility checks can be performed (e.g., whether target control components support the same channel protocol). If incompatibility exists, the component can be replaced with a compatible one. A target control link can be a link in which control components participate in executing a target control action sequence. Specifically, target control components that meet compatibility requirements can be inserted into the corresponding atomic actions in the target control action sequence to obtain the target control link.

[0065] For example, the process for determining the target control link is as follows: 1) Traverse the target control action sequence and extract the "component requirement tag" for each target control atomic action (e.g., "High Temperature Environment MoveTo" requires "High Temperature Robot" and "High Temperature Resistant Position Sensor"); 2) Filter components with matching tags from the component library (e.g., "High Temperature Robot" model R-800H, "High Temperature Resistant Position Sensor" model S-T200); 3) Verify the compatibility between components (e.g., whether Robot R-800H and LoadPort L-F500 support the same communication protocol). If there is a conflict, automatically replace it with a compatible component; 4) Based on the "component-action" association table, determine which component performs each atomic action (e.g., "Vacuum Adsorption" is performed by the vacuum module of Robot R-800H, "Vacuum Degree Detection" is performed by the sensor S-V300), and generate the target control link.

[0066] S260, Match the corresponding target standardized interface from the optional standardized interface based on the target transmission and control link.

[0067] The optional standardized interface can be a selectable standardized interface. For example, Figure 6 This is an optional standardized interface parameter table provided in an embodiment of the present invention. For example... Figure 6 As shown, the optional standardized interfaces are divided into four categories according to business scenarios, with unified parameter formats, input parameter details and return value specifications, including: carrier device interaction interface, motion control interface, status detection interface and system configuration interface.

[0068] The interface for interaction with the carrier device includes:

[0069] Load: Input parameters are DeviceType (str, e.g., "FOUP" / "SMIF" / "Cassette"), TargetID (str, unique identifier of the target), and WaferSize (str, e.g., "12 inches"); return values ​​are Status (bool, execution status) and Msg (str, result description). Function: Controls LoadPort to receive a specified type of carrier device, completes the loading of the target, and returns the execution status.

[0070] Unload: Input parameter is StationID (str, target station ID); return value is Status (bool, execution status) or Msg (str, result description). Function: Unloads the target object from the carrier to the target station and returns the execution status.

[0071] The motion control interface includes:

[0072] MoveTo: Input parameters are StationCoord (tuple, target coordinates) and Precision (float, precision requirement); return values ​​are ActualCoord (tuple, actual position) and Error (float, error value). Function: Controls the Robot to move the target object to the specified coordinates and returns the actual position and error.

[0073] Home: Input parameter is Component (str, component type, such as "Robot" / "LoadPort"); return value is Status (bool, execution status) and HomeCoord (tuple, origin coordinates). Function: Controls the specified component to reset to the origin, and returns the reset status and origin coordinates.

[0074] The status detection interface includes:

[0075] GetComponentStatus: Input parameter is Component (str, component type, such as "Robot-R-N200"); return value is Status (dict, component status, including position, vacuum level, etc.). Function: Get the real-time operating status of a specified component (such as Robot position, vacuum level).

[0076] GetTargetStatus: Input parameter is TargetID (str, target ID); return value is Position (tuple, target position) and FixStatus (bool, fixed status). Function: Gets the position and fixed status of the target in real time.

[0077] The system configuration interfaces include:

[0078] UpdateActionParam: Input parameters are ActionType (str, action type, such as "Robot.Grab") and Params (dict, parameter dictionary, such as {"GripForce": 50}); return value is Status (bool, execution status). Function: Updates atomic action parameters (such as adjusting gripping force).

[0079] AddComponent: The input parameter is ComponentModel (str, component model, such as "Robot-R-H400"); the return value is Status (bool, execution status). Function: Adds a new component model to the configurable component library (e.g., adding a high-temperature Robot).

[0080] The target standardized interface can be a standardized interface used to control the execution of the target transmission and control link. Specifically, it can also be determined based on the target transmission and control scenario parameters, and the specific interface that meets the transmission and control scenario requirements can be selected from the available standardized interfaces as the target standardized interface.

[0081] S270. Input the target atomic action parameters in the target transmission and control link to the target standardization interface so that the target standardization interface controls and executes the corresponding action of the target transmission and control link.

[0082] Specifically, the target atomic action parameters in the target transmission and control link can be input to the target standardization interface, so that the target standardization interface controls the corresponding transmission and control equipment to execute the actions corresponding to the target transmission and control link, ensuring the complete execution of each transmission and control action.

[0083] Taking the process of calling "wafer loading to etching cavity" from the upper-layer etching equipment as an example, the procedure is as follows:

[0084] 1) The etching equipment calls the Load interface (DeviceType: "FOUP", TargetID: "Wafer-12001") to control the LoadPort to receive the FOUP loaded with the 12-inch wafer;

[0085] 2) Call the MoveTo interface (StationCoord: (100, 200, 50), Precision: 0.002) to control the Robot to grab the wafer from the FOUP and move it to the alignment stage;

[0086] 3) Call the GetTargetStatus interface (TargetID: "Wafer-12001") to confirm that the wafer is fixed on the alignment stage;

[0087] 4) Call the MoveTo interface (StationCoord: (300, 400, 80), Precision: 0.001) to control the Robot to move the aligned wafer to the etching chamber;

[0088] 5) Call the Unload interface (StationID: "Etch-Chamber-01") to unload the wafer into the etching cavity and complete the wafer loading process;

[0089] 6) Monitor the Robot and LoadPort status in real time through the GetComponentStatus interface throughout the process to ensure that there are no abnormalities in the process.

[0090] Taking the EFEM lithography machine's call for "wafer transfer from FOUP to lithography cavity" as an example, the process is as follows:

[0091] 1) The EFEM lithography machine calls the Load interface (DeviceType: "FOUP", TargetID: "Wafer-12002") to control the LoadPort to receive the FOUP loaded with the 12-inch wafer;

[0092] 2) Call the MoveTo interface (StationCoord: (80, 180, 45), Precision: 0.0005) to control the high-precision robot to pick up the wafer from the FOUP and move it to the pre-alignment stage;

[0093] 3) Call the GetTargetStatus interface (TargetID: "Wafer-12002") to confirm that the wafer is fixed on the pre-alignment stage;

[0094] 4) Trigger the pre-alignment logic through the system configuration interface: Call the UpdateActionParam interface (ActionType: "Align", Params: {"AlignType": "Nanoscale", "TargetID": "Wafer-12002"}) to start the nanoscale pre-alignment process;

[0095] 5) Call the GetComponentStatus interface (Component: "Aligner") to obtain the status of the pre-alignment mechanism and confirm that there are no exceptions during the pre-alignment process;

[0096] 6) Call the GetTargetStatus interface (TargetID: "Wafer-12002") to confirm that the wafer pre-alignment accuracy meets the requirements;

[0097] 7) Call the MoveTo interface (StationCoord: (250, 350, 75), Precision: 0.0001) to control the Robot to move the pre-aligned wafer to the photolithography cavity;

[0098] 8) Call the Unload interface (StationID: "Litho-Chamber-01") to unload the wafer into the photolithography cavity and complete the transfer process;

[0099] 9) The status of Robot, LoadPort, and pre-alignment mechanism is monitored in real time throughout the process via the GetComponentStatus interface to ensure that there are no abnormalities in the process.

[0100] All interface calls in all steps match the four types of interfaces in the labeled interface definition: "carrier device interaction, motion control, status detection, and system configuration," which better conforms to the uniformity and standardization of interface design.

[0101] Optionally, to avoid adaptation deviations caused by component wear after long-term use, the system has built-in parameter self-calibration logic, which is adapted and linked with multiple device scenarios. During the execution of the target transmission and control link, the action execution parameters can be adjusted based on the current environmental parameters (for environmental changes such as temperature and humidity, parameters are adjusted in real time. For example, in the thin film deposition equipment scenario, the temperature sensor (S-T900) detects that the ambient temperature rises by 10°C and automatically reduces the robot's movement speed by 10 mm / s to avoid a decrease in motion accuracy caused by high temperature).

[0102] Upon receiving a periodic calibration command (triggered every 1000 atomic actions or when switching equipment scenarios), the system performs accuracy checks on the corresponding control equipment within the current equipment scenario and corrects the coordinate parameters of the control equipment based on the check results. For example, in the EFEM scenario of a lithography machine, the positioning accuracy of the Robot (R-N200) is calibrated using "Aligner (A-P800)". If a deviation exceeding ±0.05μm is detected, the coordinate parameters of the MoveTo station are automatically corrected.

[0103] Upon receiving a fault calibration command (triggered if a component (such as LoadPort) malfunctions and is replaced), the system matches the target calibration template corresponding to the replaced component from a preset database and performs parameter calibration steps on the replaced component based on the target calibration template. For example, after replacing the L-F500, it automatically performs "sealing pressure calibration" (gradually increasing from 0.3MPa to 0.5MPa to confirm airtightness) and "docking coordinate calibration" (aligning with the Robot transmission path) to ensure that the adaptation parameters are restored to standard values.

[0104] Optionally, the technical solution of this invention can also perform monitoring and fault handling. Through sensor network and interface status feedback, the following information can be monitored in real time: component status: Robot position, LoadPort sealing pressure, vacuum degree, sensor values; process progress: currently executed atomic actions, percentage of completed actions, and list of remaining actions; anomaly warning: parameter deviation from threshold (e.g., vacuum degree > -0.07MPa), component communication interruption, and action timeout (e.g., MoveTo action not completed within 10 seconds).

[0105] If an abnormality is detected in the execution of the transmission and control action, the corresponding target fault type is determined, the corresponding fault repair process is matched based on the target fault type, and the fault repair process is executed (for example, if the vacuum is insufficient, the vacuum pump needs to be checked; if the communication is interrupted, the communication module needs to be restarted). If the fault repair is successful, the atomic action continues to be executed from the paused current origin action. If the fault repair fails, a target fault report is generated based on the target fault type and pushed to the maintenance client.

[0106] For example, the handling steps in case of abnormal execution of transmission and control actions are as follows: 1) Immediately pause the current atomic action and save the component status and process progress at the time of the fault; 2) Analyze the fault type and retrieve the solution from the fault case library; 3) Automatically execute repair operations (such as restarting the vacuum pump and recalibrating the robot position). If the repair is successful, the process is resumed; if the repair fails, a fault report (including the cause of the fault, the affected actions, and manual repair instructions) is generated and pushed to the user; 4) Support "breakpoint resume". After the fault is repaired, execution can continue from the paused atomic action without restarting the entire process.

[0107] For example, in order to better understand the technical solution provided by the present invention, specific embodiments are described below: Figure 7 This is a flowchart illustrating a process for controlling semiconductor devices according to an embodiment of the present invention. Figure 7 As shown, the workflow of control transmission in a semiconductor device includes the following steps:

[0108] 1. Requirement Input Layer: Receives user-input scenario parameters (such as equipment type: wafer inspection equipment / lithography machine EFEM / thin film deposition equipment / etching equipment, etc.; target information: 4 / 6 / 8 / 12-inch wafers; workstation requirements: loading / unloading / alignment / transfer), supports visual interface configuration and parameter import (such as JSON / YAML format files); after processing by the "Requirement Validation Unit", it outputs standardized requirement data, which interacts with the action decomposition layer via JSON-RPC.

[0109] 2. Motion Decomposition Layer: Built-in "Requirement-Action" mapping algorithm automatically decomposes the input standardized requirement data into standardized transmission and control atomic actions (such as "Robot picks / places wafers", "vacuum turns on / off", "MoveTo workstation", "LoadPort loads / unloads wafers", "ESD protection starts / stops", etc.), and matches action parameters (such as gripping force, movement speed, alignment accuracy threshold) through a "parameter matching engine", ultimately generating an "atomic action sequence table (i.e., target transmission and control action sequence)", which interacts with the component assembly layer via JSON-RPC.

[0110] 3. Component Assembly Layer: Relying on a configurable component library (including Robot (normal temperature / high temperature / anti-static type), LoadPort (FOUP / SMIF / general type), Cassette / SMIF / FOUP carrier device, Ionizer (ion generator), Aligner (aligner), Buffer (buffer station), FFU (fan filter unit), sensor and other modules), the layer dynamically calls the appropriate components according to the atomic action sequence requirements. After the "compatibility verification unit" verifies the compatibility between components, the "transmission and control link generator" generates a complete transmission and control link (i.e., the target transmission and control link) (e.g., "LoadPort receives FOUP → Ionizer neutralizes static electricity → Robot grabs wafer → MoveTo Aligner (aligner) → vacuum adsorption fixation → Aligner performs alignment detection → Ionizer performs secondary static electricity removal → MoveTo reaction chamber"), and outputs the transmission and control link instructions, interacting with the interface encapsulation layer via JSON-RPC.

[0111] 4. Interface Encapsulation Layer: The underlying transmission and control functions are encapsulated into standardized interfaces (such as Load / Unload (carrying device type, target ID), MoveTo (station ID / station coordinates, accuracy requirements), Home (part type), loading / unloading (Buffer station), etc.), which support direct calls from upper-level devices without needing to pay attention to the underlying implementation logic.

[0112] The technical effects of the technical solution provided by this invention are as follows:

[0113] (i) Flexibility in cross-scenario adaptation

[0114] 1. Compatible with multiple devices and target objects

[0115] This invention, through its "demand input - atomic action decomposition - component dynamic combination" architecture, can directly adapt to various semiconductor front-end process equipment scenarios (wafer inspection equipment, EFEM lithography machines, thin film deposition, etching, ion implantation, etc.), and supports the transmission and control requirements of different targets such as 8 / 12 / 18-inch wafers and photomasks. Compared to the customized model of "one device, one transmission and control system" in existing technologies, it eliminates the need to redesign hardware and control logic; scenario switching can be completed simply through parameter configuration, improving adaptation efficiency by more than 80%.

[0116] 2. Seamless switching of load-bearing devices

[0117] The system incorporates standardized adaptation logic for carrier devices such as Cassette, SMIF, and FOUP, combined with a parameter self-calibration mechanism. When changing carrier devices (e.g., from Cassette to FOUP), the system can automatically identify the device model, adjust positioning parameters, and adjust the grasping logic, avoiding errors from manual calibration. This solves the problem of refactoring interface code when changing carrier devices in existing technologies, reducing switchover time from several hours to minutes.

[0118] (ii) Improved development and maintenance efficiency

[0119] 1. Prevent redundant development

[0120] The standardized atomic action library (grabbing, motion, station interaction, etc.) and configurable component library constructed by this invention enable the reuse of transmission and control logic—such as atomic actions like "vacuum adsorption" and "MoveTo station," which can be directly called in etching and thin film deposition equipment without repeated programming. Compared to the existing technology that develops separate transmission and control code for different equipment, the development cycle of the new equipment transmission and control system is shortened by 60% to 70%, significantly reducing the waste of development resources.

[0121] 2. Reduced maintenance costs

[0122] The system adopts a design of "standardized interface + automatic fault diagnosis + breakpoint resume": On the one hand, the underlying interface is unified (such as Load / Unload, MoveTo), eliminating the need for maintenance to be familiar with the customized code of different devices; on the other hand, when a fault occurs, the root cause can be automatically located (e.g., insufficient vacuum → pointing to a problem with the vacuum pump), and it supports resuming from paused atomic actions, avoiding a full process restart. Compared with the drawbacks of existing technologies where "fault troubleshooting relies on manual intervention and restarts require starting from scratch," maintenance efficiency is improved by 70%, and equipment downtime is reduced by more than 50%.

[0123] (III) System compatibility and scalability

[0124] 1. Seamless integration of upper-level equipment

[0125] This invention encapsulates the underlying control functions into standardized interfaces (such as Load (DeviceType, TargetID) and MoveTo (StationCoord, Precision)). Upper-layer devices (such as lithography machines and etching machines) do not need to concern themselves with the underlying component logic and can directly call the interfaces to fulfill their control requirements. This solves the problem in existing technologies where "control interfaces for different devices are not unified, and integration requires customized interface modules." The cross-device integration cycle is shortened from the traditional several weeks to 1-2 days, and it is compatible with the existing production line architecture of semiconductor factories.

[0126] 2. Components and functions are easily expandable.

[0127] The configurable component library supports adding new component models (such as new high-temperature robots and high-precision sensors). Only the component parameters and a list of compatible actions need to be entered to integrate them into the system. Simultaneously, the atomic action library allows for the addition of new action types (such as "wafer surface cleaning" and "multi-station synchronous transmission") without modifying the existing architecture. Compared to the limitations of existing technologies where "adding new components / functions requires reconstructing the overall control logic," the system's scalability is significantly improved, meeting the evolving needs of semiconductor equipment technology.

[0128] (iv) Ensuring operational accuracy and stability

[0129] 1. Controllable transmission and control precision

[0130] This invention utilizes a parameter self-calibration mechanism (such as automatically adjusting the robot's gripping range and force when replacing a 12-inch wafer), real-time status monitoring (such as position sensor feedback errors and vacuum monitoring), and combined with no-load simulation operation verification, to control transmission and control precision at the micrometer level (and even at the nanometer level in some scenarios), meeting the transmission and control requirements of high-precision equipment such as etching and photolithography. Compared to the errors easily introduced by manual calibration in existing technologies, the stability of transmission and control precision is improved by 90%, and the target damage rate is reduced to below 0.1%.

[0131] 2. Operational risks are controllable.

[0132] The real-time monitoring module can monitor component status (robot position, vacuum level), process progress, and anomaly warnings (such as action timeouts and parameter deviations from thresholds) throughout the entire process. When a fault occurs, the process is immediately paused and the status is saved to prevent the anomaly from escalating. At the same time, the fault case library can provide automatic repair solutions, reducing the risk of manual intervention. Compared with the existing technologies that suffer from "delayed anomaly detection and faults that can easily trigger cascading damage," the system reduces the failure rate by 60%, ensuring the continuity of semiconductor production.

[0133] (v) Cost and resource optimization

[0134] 1. Reduced hardware costs

[0135] This invention uses a dynamic component combination logic to flexibly call upon existing components according to scenario requirements (such as a single high-temperature robot that can be used in thin film deposition and ion implantation equipment), eliminating the need to configure dedicated transmission and control components for each device, thus reducing hardware procurement costs by 30% to 40%; at the same time, it reduces the need for customized hardware inventory and optimizes factory resource allocation.

[0136] 2. Optimization of labor costs

[0137] Standardized interfaces and processes reduce the technical requirements for operators—no need to master the control logic of different devices; simply inputting the required parameters through a visual interface is enough to start the process. Maintenance relies on automatic diagnostic and repair functions, reducing reliance on specialized engineers. Compared to the existing technology model that requires specialized personnel for operation and maintenance, labor costs are reduced by 50%, while also lowering the risk of human error.

[0138] The technical solution provided in this invention involves parsing the corresponding target control scenario parameters based on the control request instruction; determining the target control atomic actions and corresponding target atomic action parameters based on the target control scenario parameters and a preset mapping table; adjusting and sorting the target control atomic actions based on the target atomic action parameters to obtain a target control action sequence; extracting the component requirement tag corresponding to each atomic action in the target control action sequence; selecting control components that meet the component requirement tag from the candidate control components as target control components for each component requirement tag; performing component compatibility detection on each target control component and filling the target control components that meet the compatibility requirements into the corresponding atomic actions in the target control action sequence to obtain a target control link; matching the corresponding target standardized interface from the optional standardized interface based on the target control link; and inputting the target atomic action parameters in the target control link to the target standardized interface so that the target standardized interface controls the execution of the actions corresponding to the target control link.

[0139] The technical solution of this invention addresses the problem that the existing "customized development" model is insufficient to meet the production needs of multiple devices, multiple scenarios, and high iteration in semiconductor front-end processes. It can achieve the reuse of control logic in various types of equipment such as thin film deposition, etching, ion implantation, and lithography machines through a four-layer architecture of "demand input - automatic decomposition of atomic actions - flexible combination of components - standardized interface calls". It can also enable rapid adaptation to different sized objects and different carrier devices, filling the gaps in flexibility and standardization in the existing technology and helping to reduce costs, increase efficiency, and accelerate iteration of semiconductor front-end process equipment.

[0140] Figure 8 This is a schematic diagram of the structure of a semiconductor equipment transmission and control device provided in an embodiment of the present invention. The embodiment of the present invention can be applied to scenarios in which transmission and control actions are executed according to demand instructions in the front-end process of semiconductor manufacturing. The device can be implemented by software and / or hardware and integrated into a computer device with application development functions.

[0141] like Figure 8 As shown, the semiconductor equipment transmission and control device includes: a transmission and control action sequence determination module 310, a transmission and control link determination module 320, and an interface call module 330.

[0142] The transmission and control action sequence determination module 310 is used to determine multiple target transmission and control atomic actions based on the transmission and control request instruction upon receiving the transmission and control request instruction, and to determine a target transmission and control action sequence based on the target transmission and control atomic actions; the transmission and control link determination module 320 is used to adapt the corresponding target transmission and control component based on the target transmission and control action sequence, and to determine the target transmission and control link based on the target transmission and control action sequence and the target transmission and control component; the interface calling module 330 is used to determine the corresponding target standardized interface based on the target transmission and control link, and to call the target standardized interface to control the execution of the action corresponding to the target transmission and control link.

[0143] The technical solution provided by this invention, upon receiving a control request instruction, determines multiple target control atomic actions based on the instruction, and determines a target control action sequence based on the target control atomic actions; adapts the target control action sequence to the corresponding target control component, and determines the target control link based on the target control action sequence and the target control component; determines the corresponding target standardized interface based on the target control link, and calls the target standardized interface to control and execute the actions corresponding to the target control link. This technical solution solves the problem that the existing "customized development" model is insufficient to meet the production needs of multiple devices, multiple scenarios, and high iteration in semiconductor front-end processes. It achieves the reuse of control logic in various equipment such as thin film deposition, etching, ion implantation, and lithography machines through a four-layer architecture of "demand input - automatic decomposition of atomic actions - flexible combination of components - standardized interface call," as well as rapid adaptation to different sized objects and different carrier devices. This fills the gap in flexibility and standardization in existing technologies, helping to reduce costs, increase efficiency, and accelerate iteration in semiconductor front-end process equipment.

[0144] In an optional implementation, the control action sequence determination module 310 is specifically used to: parse the corresponding target control scenario parameters based on the control request instruction; wherein the target control scenario parameters include at least one of equipment type, target information, and workstation requirement parameters; determine the target control atomic actions and corresponding target atomic action parameters based on the target control scenario parameters and a preset mapping table, and adjust and sort the target control atomic actions based on the target atomic action parameters to obtain the target control action sequence; wherein the preset mapping table is used to represent the correspondence between control scenario parameters and control atomic actions.

[0145] In one optional implementation, the transmission and control action sequence determination module 310 includes: an atomic action determination unit, configured to: determine a target transmission and control device based on the device type in the target transmission and control scenario parameters; match the target transmission and control device and the target object information corresponding to the target transmission and control atomic actions from the preset mapping table; and determine the target atomic action parameters based on the target object information and workstation requirement parameters in the target transmission and control scenario parameters.

[0146] In an optional implementation, the control link determination module 320 is specifically used to: extract the component requirement label corresponding to each atomic action in the target control action sequence; for each component requirement label, select control components that can meet the component requirement label from the candidate control components as the target control components; wherein, the candidate control components include at least one of: core execution components, bearing components, auxiliary detection components, and environmental control and electrostatic protection components; perform component compatibility detection on each target control component, and fill the target control components that meet the compatibility requirements into the corresponding atomic actions in the target control action sequence to obtain the target control link.

[0147] In an optional implementation, the interface calling module 330 is specifically used to: match a corresponding target standardized interface from an optional standardized interface based on the target transmission and control link; wherein the optional standardized interface includes: a carrier device interaction interface, a motion control interface, a state detection interface, and a system configuration interface; input the target atomic action parameters in the target transmission and control link to the target standardized interface, so that the target standardized interface controls the execution of the action corresponding to the target transmission and control link.

[0148] In an optional embodiment, the semiconductor device transmission and control device further includes: a parameter calibration module, configured to: adjust the execution parameters of the action based on the current environmental parameters during the execution of the target transmission and control link; upon receiving a periodic calibration instruction, perform accuracy detection on the corresponding transmission and control equipment for the current device scenario, and correct the coordinate parameters of the transmission and control equipment based on the detection results; and upon receiving a fault calibration instruction, match the target calibration template corresponding to the replaced component from a preset database, and perform parameter calibration steps on the replaced component based on the target calibration template.

[0149] In one optional implementation, the semiconductor device transmission and control device further includes a fault repair module, configured to: determine the corresponding target fault type when an abnormality in the transmission and control action is detected; match the corresponding fault repair process based on the target fault type and execute the fault repair process; if the fault repair is successful, continue to execute the atomic action from the paused current origin action; if the fault repair fails, generate a target fault report based on the target fault type and push the target fault report to the maintenance client.

[0150] The semiconductor device transmission and control device provided in the embodiments of the present invention can execute the semiconductor device transmission and control method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the method execution.

[0151] Figure 9 This is a schematic diagram of the structure of a computer device provided in an embodiment of the present invention. Figure 9 A block diagram of an exemplary computer device 12 suitable for implementing embodiments of the present invention is shown. Figure 9 The computer device 12 shown is merely an example and should not be construed as limiting the functionality or scope of the embodiments of the present invention. The computer device 12 can be any terminal device with computing capabilities and can be configured in a semiconductor device control device.

[0152] like Figure 9 As shown, the computer device 12 is represented in the form of a general-purpose computing device. The components of the computer device 12 may include, but are not limited to: one or more processors or processing units 16, system memory 28, and bus 18 connecting different system components (including system memory 28 and processing unit 16).

[0153] Bus 18 can be one or more of several bus architectures, including a memory bus or memory controller, a peripheral bus, a graphics acceleration port, a processor, or a local bus using any of the various bus architectures. For example, these architectures include, but are not limited to, the Industry Standard Architecture (ISA) bus, the Micro Channel Architecture (MAC) bus, the Enhanced ISA bus, the Video Electronics Standards Association (VESA) local bus, and the Peripheral Component Interconnect (PCI) bus.

[0154] Computer device 12 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by computer device 12, including volatile and non-volatile media, removable and non-removable media.

[0155] System memory 28 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) 30 and / or cache 32. Computer device 12 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, storage system 34 may be used to read and write non-removable, non-volatile magnetic media (… Figure 9 Not shown; usually referred to as a "hard drive"). Although Figure 9 Not shown, a disk drive for reading and writing to a removable non-volatile disk (e.g., a "floppy disk") and an optical disk drive for reading and writing to a removable non-volatile optical disk (e.g., a CD-ROM, DVD-ROM, or other optical media) may be provided. In these cases, each drive may be connected to bus 18 via one or more data media interfaces. System memory 28 may include at least one program product having a set (e.g., at least one) of program modules configured to perform the functions of the embodiments of the present invention.

[0156] A program / utility 40 having a set (at least one) of program modules 42 may be stored, for example, in system memory 28. Such program modules 42 include, but are not limited to, an operating system, one or more application programs, other program modules, and program data. Each or some combination of these examples may include an implementation of a network environment. Program modules 42 typically perform the functions and / or methods described in the embodiments of the present invention.

[0157] Computer device 12 can also communicate with one or more external devices 14 (e.g., keyboard, pointing device, display 24, etc.), and with one or more devices that enable a user to interact with the computer device 12, and / or with any device that enables the computer device 12 to communicate with one or more other computing devices (e.g., network card, modem, etc.). This communication can be performed through input / output (I / O) interface 22. Furthermore, computer device 12 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 20. Figure 9 As shown, network adapter 20 communicates with other modules of computer device 12 via bus 18. It should be understood that, although... Figure 9 As not shown, it can be used in conjunction with computer device 12 with other hardware and / or software modules, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0158] Processing unit 16 executes various functional applications and data processing by running programs stored in system memory 28, such as implementing the semiconductor device control method provided in this embodiment of the invention, which includes:

[0159] Upon receiving a transmission and control request instruction, multiple target transmission and control atomic actions are determined based on the instruction, and a target transmission and control action sequence is determined based on these atomic actions. A corresponding target transmission and control component is adapted to the target transmission and control action sequence, and a target transmission and control link is determined based on the sequence and the component. A corresponding target standardized interface is determined based on the target transmission and control link, and the standardized interface is invoked to control the execution of the actions corresponding to the link.

[0160] This embodiment provides a computer-readable storage medium storing a computer program thereon. When executed by a processor, the program implements the semiconductor device control method as provided in any embodiment of the present invention, including:

[0161] Upon receiving a transmission and control request instruction, multiple target transmission and control atomic actions are determined based on the instruction, and a target transmission and control action sequence is determined based on these atomic actions. A corresponding target transmission and control component is adapted to the target transmission and control action sequence, and a target transmission and control link is determined based on the sequence and the component. A corresponding target standardized interface is determined based on the target transmission and control link, and the standardized interface is invoked to control the execution of the actions corresponding to the link.

[0162] The computer storage medium of this invention can be any combination of one or more computer-readable media. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0163] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0164] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including but not limited to: wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0165] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof. Programming languages ​​include object-oriented programming languages ​​such as C, Java, Smalltalk, C++, C#, and Python, as well as conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0166] Those skilled in the art will understand that the modules or steps of the present invention described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby allowing them to be stored in a storage device for execution by a computing device, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the present invention is not limited to any particular combination of hardware and software.

[0167] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for controlling a semiconductor device, characterized in that, include: Upon receiving a transmission and control request instruction, multiple target transmission and control atomic actions are determined based on the transmission and control request instruction, and a target transmission and control action sequence is determined based on the target transmission and control atomic actions. Based on the target transmission and control action sequence, the corresponding target transmission and control component is adapted, and the target transmission and control link is determined based on the target transmission and control action sequence and the target transmission and control component. Based on the target transmission and control link, the corresponding target standardized interface is determined, and the target standardized interface is called to control and execute the actions corresponding to the target transmission and control link.

2. The method according to claim 1, characterized in that, The step of determining multiple target control atomic actions based on the control request instruction, and determining a target control action sequence based on the target control atomic actions, includes: Based on the control request instruction, the corresponding target control scenario parameters are parsed out; wherein, the target control scenario parameters include at least one of the following: equipment type, target information, and workstation requirement parameters; Based on the target transmission and control scenario parameters and the preset mapping table, the target transmission and control atomic actions and the corresponding target atomic action parameters are determined, and the action parameters of the target transmission and control atomic actions are adjusted and sorted based on the target atomic action parameters to obtain the target transmission and control action sequence. The preset mapping table is used to represent the correspondence between transmission and control scene parameters and transmission and control atomic actions.

3. The method according to claim 2, characterized in that, The step of determining the target control atomic action and the corresponding target atomic action parameters based on the target control scenario parameters and a preset mapping table includes: The target transmission and control device is determined based on the device type in the target transmission and control scenario parameters; Match the target control atomic actions corresponding to the target control device and the target object information from the preset mapping table; The target atomic action parameters are determined based on the target object information and workstation requirement parameters in the target transmission and control scenario parameters.

4. The method according to claim 1, characterized in that, The process of adapting the target control action sequence to the corresponding target control component, and determining the target control link based on the target control action sequence and the target control component, includes: Extract the component requirement tag corresponding to each atomic action in the target transmission and control action sequence; For each component requirement label, a control component that meets the component requirement label is selected from the candidate control components as the target control component; wherein, the candidate control components include at least one of the following: core execution component, load-bearing component, auxiliary detection component, and environmental control and electrostatic protection component; Each target transmission and control component undergoes inter-component compatibility testing, and the target transmission and control components that meet the compatibility requirements are filled into the corresponding atomic actions in the target transmission and control action sequence to obtain the target transmission and control link.

5. The method according to claim 1, characterized in that, The step of determining the corresponding target standardized interface based on the target transmission and control link, and calling the target standardized interface to control and execute the action corresponding to the target transmission and control link, includes: Based on the target transmission and control link, the corresponding target standardized interface is matched from the optional standardized interface; wherein, the optional standardized interface includes: carrier device interaction interface, motion control interface, status detection interface and system configuration interface; The target atomic action parameters in the target transmission and control link are input to the target standardization interface so that the target standardization interface controls the execution of the action corresponding to the target transmission and control link.

6. The method according to claim 1, characterized in that, The method further includes: During the execution of the target transmission and control link, the action execution parameters are adjusted based on the current environmental parameters. Upon receiving a periodic calibration instruction, the system performs accuracy testing on the corresponding transmission and control equipment for the current equipment scenario, and corrects the coordinate parameters of the transmission and control equipment based on the test results. Upon receiving a fault calibration instruction, a target calibration template corresponding to the replaced component is matched from a preset database, and a parameter calibration step is performed on the replaced component based on the target calibration template.

7. The method according to claim 1, characterized in that, The method further includes: If an abnormality is detected in the transmission and control action, the corresponding target fault type is determined, the corresponding fault repair process is matched based on the target fault type, and the fault repair process is executed. If the fault is successfully repaired, the atomic actions will resume from the current paused origin action. In the event that fault repair fails, a target fault report is generated based on the target fault type and the target fault report is pushed to the maintenance client.

8. A control device for semiconductor equipment, characterized in that, The device includes: The transmission and control action sequence determination module is used to determine multiple target transmission and control atomic actions based on the transmission and control request instruction when a transmission and control request instruction is received, and to determine the target transmission and control action sequence based on the target transmission and control atomic actions. The transmission and control link determination module is used to adapt the corresponding target transmission and control component based on the target transmission and control action sequence, and to determine the target transmission and control link based on the target transmission and control action sequence and the target transmission and control component. The interface calling module is used to determine the corresponding target standardized interface based on the target transmission and control link, and call the target standardized interface to control and execute the actions corresponding to the target transmission and control link.

9. A computer device, characterized in that, The computer device includes: One or more processors; Memory, used to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the semiconductor device control method as described in any one of claims 1-7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the semiconductor device control method as described in any one of claims 1-7.

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