Intelligent card-based double-interface strip and packaging process thereof

Abstract

The invention relates to the technical field of intelligent cards, and discloses a double-interface strip based on an intelligent card and a packaging technology thereof.The double-interface strip comprises a copper layer and a substrate layer, the copper layer and the substrate layer are fixedly connected in an attached mode, the copper layer comprises a copper layer A and a copper layer B, the copper layer A is provided with non-contact type induction packaging points, the copper layer B is provided with contact type induction packaging points, and the non-contact type induction packaging points are arranged on the substrate layer. A blind hole is formed in the substrate layer, the position of the blind hole corresponds to a non-contact type induction packaging point, a packaging element is fixedly arranged on the outer wall of the substrate layer, the packaging element is connected with a lead, and the lead is connected with the contact type induction packaging point or the non-contact type induction packaging point. According to the double-interface strip, the single-sided board layered structure in which the copper layer and the substrate layer are attached is adopted, the copper layer is divided into non-contact induction packaging points and contact induction packaging points through function partition, the complex working procedures of etching and electroplating of the double-layer copper surface of a traditional double-sided board are avoided, the production efficiency is improved, and the manufacturing cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of smart card technology, specifically to a dual-interface strip based on a smart card and its packaging process. Background Technology

[0002] With the widespread adoption of smart terminals and digital payment technologies, smart cards are finding increasingly diverse applications. Among these, dual-interface cards (such as credit cards and bank cards) that combine contact and contactless sensing capabilities have become a core product type in the smart card field due to their ability to meet diverse interactive needs. The key difference between dual-interface cards and traditional SIM cards lies in the addition of contactless sensing functionality. This functionality places special demands on the card's structural design and manufacturing process.

[0003] In existing technologies, dual-interface cards commonly employ a double-sided PCB design, typically with copper layers bonded to both sides of a substrate. These two copper layers are functionally assigned to correspond to contact-based and contactless inductive packaging, respectively. To achieve the functional molding of the two copper layers, current manufacturing processes require multiple complex steps: first, the epoxy glass cloth substrate undergoes a stamping pretreatment; then, a series of operations are performed, including bonding the two copper layers, mask preparation, film drying, exposure, development, etching, film removal, and gold / nickel plating. The independent etching and plating processes for the two copper layers are cumbersome and highly interconnected; deviations in any step can affect product yield, leading to a lengthy production process, low efficiency, and significantly increased manufacturing costs. Furthermore, the layered layout of the two copper layers results in a less compact card structure and a lack of targeted solder area expansion design, making it prone to signal interference or insufficient transmission stability, failing to meet the high requirements of smart cards for structural stability and signal transmission performance. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a smart card-based dual-interface strip and its packaging process, which solves the problems of complex processes and high costs associated with dual-interface strips using a double-sided panel design.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A dual-interface strip based on a smart card includes a copper layer and a substrate layer, which are bonded and fixedly connected. The copper layer includes copper layer A and copper layer B. Copper layer A is provided with a non-contact sensing encapsulation point, and copper layer B is provided with a contact sensing encapsulation point. A blind hole is formed inside the substrate layer, and the blind hole is located corresponding to the non-contact sensing encapsulation point. An encapsulation element is fixedly disposed on the outer wall of the substrate layer. The encapsulation element is connected to a lead wire, which connects to either the contact sensing encapsulation point or the non-contact sensing encapsulation point.

[0007] Preferably, the substrate layer is an FR laminate or a PI flexible board.

[0008] Preferably, the lead wire is a gold wire or an alloy wire.

[0009] Preferably, the non-contact sensing encapsulation point includes at least one of structure one or structure two.

[0010] Preferably, the first structure is configured such that a gap is added between the sensing point and the lead wire.

[0011] Preferably, the second structure is configured such that an FR composite material is disposed between the sensing point and the lead wire.

[0012] A dual-interface stripe packaging process based on smart cards includes the following steps:

[0013] S1. The epoxy glass cloth is stamped, and during the stamping process, pre-formed positioning holes are formed in the edge area of ​​the epoxy glass cloth in a circumferentially evenly distributed manner.

[0014] S2. Perform copper bonding on the surface of the stamped epoxy glass cloth. When bonding copper, use vacuum adsorption to bond the copper layer to the surface of the epoxy glass cloth. After bonding, maintain pressure.

[0015] S3. The copper layer is exposed, developed and etched in one process. Ultraviolet light is used for exposure, alkaline developer is used for development, and the edges of the substrate are deburred after etching.

[0016] S4. Perform gold / nickel electroplating on the etched substrate layer.

[0017] Preferably, the packaging process uses a single-sided substrate layer, which is formed by hot-pressing epoxy glass cloth and a copper layer together.

[0018] Preferably, the single-sided substrate layer is provided with non-contact inductive encapsulation points and contact inductive encapsulation points, which are spaced apart along the length of the substrate layer; the non-contact inductive encapsulation points are provided with circular soldering points, and the contact inductive encapsulation points are provided with rectangular soldering points, and the soldering points are all integrally formed metallized bosses.

[0019] Preferably, the single-sided board substrate layer is provided with blind holes, which are provided in the bonding wire area of ​​the non-contact induction packaging point, and the inner wall of the blind hole is formed with a nickel layer by electroplating.

[0020] This invention provides a dual-interface strip based on a smart card and its packaging process. It has the following advantages:

[0021] 1. This invention's dual-interface strip adopts a single-sided layered structure with a copper layer bonded to a substrate layer. Functional partitioning divides the copper layer into non-contact and contact sensing encapsulation points, avoiding the complex processes of etching and electroplating on the double-layered copper surface of traditional dual-sided boards, thus improving production efficiency and reducing manufacturing costs. Simultaneously, the design of blind vias within the substrate layer not only increases the bonding area but also optimizes the signal transmission path for non-contact sensing, making the overall structure more compact and stable.

[0022] 2. This invention effectively reduces signal interference between contact and non-contact communication through clearly defined functional partitions and blind vias, improving communication stability and reliability. The leads connect directly to the encapsulation point, resulting in a short path and low transmission loss, further ensuring signal transmission quality. The non-contact sensing encapsulation point uses a gap or FR4 material isolation design, reducing the shielding of the sensing signal by the metal leads, enhancing the sensing distance and performance of non-contact communication. Simultaneously, the soldering process is easier to control, reducing the risk of short circuits.

[0023] 3. The substrate layer of this invention uses FR4 laminate or PI flexible board, which provides good mechanical strength, insulation or flexibility to meet the needs of different application scenarios; the lead wires use gold wire or alloy wire to ensure high conductivity, welding reliability and corrosion resistance, balancing performance and cost.

[0024] 4. This invention integrates the exposure, development, and etching steps into a continuous, unified process, combined with gold / nickel electroplating, improving the precision and consistency of pattern formation. The electroplated layer enhances the conductivity, oxidation resistance, and solderability of the encapsulation points, ensuring strong wire bonding and long-term durability, further improving product quality and reliability. Attached Figure Description

[0025] Figure 1 This is a perspective view of the invention.

[0026] Figure 2 This is a bottom-view schematic diagram of the invention.

[0027] Figure 3 This is a schematic cross-sectional view of the substrate layer of the present invention;

[0028] Figure 4 This is a schematic diagram of the process flow of the present invention.

[0029] The components are: 1. Copper layer; 2. Substrate layer; 3. Contact induction packaging point; 4. Non-contact induction packaging point; 5. Packaged element; 6. Lead wire. Detailed Implementation

[0030] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Please see the appendix Figure 1 - Appendix Figure 3 This invention provides a dual-interface strip based on a smart card and its packaging process, including a copper layer 1 and a substrate layer 2, which are bonded and fixedly connected. The copper layer 1 includes a copper layer A and a copper layer B. The copper layer A is provided with a non-contact sensing packaging point 4, and the copper layer B is provided with a contact sensing packaging point 3. A blind hole is opened inside the substrate layer 2, and the blind hole position corresponds to the non-contact sensing packaging point 4. A packaging element 5 is fixedly disposed on the outer wall of the substrate layer 2. The packaging element 5 is connected to a lead wire 6, which is connected to either the contact sensing packaging point 3 or the non-contact sensing packaging point 4.

[0032] Specifically, this dual-interface strip adopts a stable layered structure formed by the fixed connection of copper layer 1 and substrate layer 2. Copper layer 1 is divided into two functional areas, copper layer A and copper layer B, which are respectively equipped with contactless sensing encapsulation points 4 and contact sensing encapsulation points 3 to realize the contactless sensing communication function of the smart card and the contact communication function with external devices. To accommodate the installation and function of the contactless sensing encapsulation points 4, blind holes with precise corresponding positions are opened inside the substrate layer 2, which effectively increases the bonding area and avoids the complex process of etching and electroplating the two copper surfaces separately in the traditional double-sided board structure, thereby simplifying the production process. In addition, the encapsulation element 5 fixedly set on the outer wall of the substrate layer 2 serves as the core functional element of the smart card, such as the chip, and is connected to the two types of encapsulation points through leads 6 to realize signal transmission and power conduction. This structural design enables the dual-interface strip to simultaneously meet the needs of both contact and contactless communication. It features a simple structure and high production efficiency. The functional partitions of copper layers A and B are clearly defined, avoiding signal interference and improving communication stability. The blind via design, combined with the single-sided copper layer structure, greatly simplifies the process, improves production efficiency, and reduces costs. The packaged components are directly connected via leads, resulting in short paths and low transmission loss, further ensuring communication performance.

[0033] The substrate layer 2 is an FR4 laminate or a PI flexible board.

[0034] Specifically, based on the dual-interface strip structure of claim 1, the substrate layer 2 in this embodiment is made of FR4 laminate or PI flexible board, both of which can meet the functional requirements of the dual-interface strip and are compatible with existing manufacturing processes. FR4 laminate, as an epoxy glass cloth substrate, has excellent mechanical strength, insulation, and high-temperature resistance, providing stable support for the copper layer 1 and the encapsulation element 5. It also matches well with processes such as copper plating, etching, and electroplating, making it suitable for dual-interface cards such as bank cards that require high structural stability. PI flexible board, with its flexibility, bend resistance, and thinness, is suitable for smart card applications requiring bending, and its insulation and environmental stability also meet the requirements for contactless sensing. Both materials ensure the structural stability and functional reliability of the dual-interface strip.

[0035] Lead 6 is made of gold wire or alloy wire.

[0036] Specifically, in this embodiment, the lead wire 6 is made of gold wire or alloy wire, used to realize the electrical connection between the packaged element 5 and the contact induction package point 3 and the non-contact induction package point 4. The specific connection method is welding, that is, welding and fixing both ends of the lead wire to the pins of the packaged element and the corresponding package point to form a conductive circuit. Gold wire, as a commonly used material for smart card packaging, has excellent conductivity, oxidation resistance and ductility. It is easy to form stable solder joints during welding and is not easily oxidized and corroded over long-term use, which can ensure the long-term stability of signal transmission. It is especially suitable for high-end dual-interface card products with high requirements for signal stability. Alloy wire (such as gold alloy, copper alloy, etc.) has the advantages of lower cost and higher mechanical strength while ensuring basic conductivity and connection stability. It not only helps to reduce production costs, but its bending resistance is also more suitable for dual-interface card products with cost control requirements or slight bending scenarios.

[0037] The non-contact sensing encapsulation point 4 includes at least one of structure one or structure two.

[0038] Specifically, in this embodiment, the encapsulation point includes at least one of structure one or structure two. The two structures are designed for different application scenarios and performance requirements, and can be used alone or in combination to realize the contactless communication function of the dual interface card.

[0039] Structure 1 is designed to add a gap between the sensing point and lead wire 6.

[0040] Specifically, the implementation of Structure 1 involves creating a gap of a certain width between the sensing point 4 and the lead wire 6 in the non-contact induction packaging. This gap width is typically 0.1–0.5 mm and can be adjusted according to the actual product size. It needs to be rationally designed based on the wavelength of the non-contact sensing signal, the diameter of the lead wire 6, and the precision requirements of the packaging process. This achieves physical isolation between the sensing point and the lead wire 6, preventing the metal material of the lead wire from shielding or interfering with the non-contact sensing signal, thus ensuring smooth transmission of the sensing signal and improving the distance and stability of non-contact communication. Simultaneously, this gap also provides operating space for the soldering process, effectively preventing short circuits between the sensing point and the lead wire 6 caused by solder overflow, helping to reduce the production defect rate.

[0041] Structure 2 is configured such that FR4 composite material is placed between the sensing point and lead wire 6.

[0042] Specifically, in Structure 2, an FR4 laminate material is placed between the sensing point of the non-contact sensing encapsulation point 4 and the lead 6. This laminate uses the same material as the substrate layer 2, but its thickness is less than that of the substrate layer. Its position matches the blind via, and the use of the same FR4 material as the substrate layer ensures material compatibility, avoiding structural deformation caused by differences in the thermal expansion coefficients of different materials. This improves the long-term stability of the product and is compatible with existing manufacturing processes, requiring no additional special processing steps.

[0043] Please see the appendix Figure 4 A dual-interface strip packaging process based on smart cards includes the following steps:

[0044] S1. The epoxy glass cloth is stamped, and during the stamping process, pre-formed positioning holes are formed in the edge area of ​​the epoxy glass cloth in a circumferentially evenly distributed manner.

[0045] S2. Perform copper bonding on the surface of the stamped epoxy glass cloth. When bonding copper, use vacuum adsorption to bond copper layer 1 to the surface of epoxy glass cloth. After bonding, maintain pressure.

[0046] S3. Perform integrated exposure, development and etching on copper layer 1. Ultraviolet light is used for exposure, alkaline developer is used for development, and deburring is performed on the edge of substrate layer 2 after etching.

[0047] S4. Perform gold / nickel electroplating on the etched substrate layer 2.

[0048] Specifically, this embodiment discloses a complete packaging process for a dual-interface strip based on a smart card, which is based on a single-sided substrate layer 2 design.

[0049] S1: Epoxy glass cloth is selected as the substrate for substrate layer 2. It is first stamped using a stamping machine to ensure that the edges of the epoxy glass cloth are neat and undamaged after stamping. During the stamping process, pre-formed positioning holes are simultaneously formed in the edge area of ​​the epoxy glass cloth. The number of positioning holes is evenly distributed along the circumference of the epoxy glass cloth. The core function of the positioning holes is to provide a precise positioning reference for subsequent processes such as copper bonding, exposure, etching, and electroplating. In subsequent processes, positioning pins cooperate with the positioning holes to fix the epoxy glass cloth on the tooling fixture, avoiding problems such as misalignment of encapsulation points and deviation of blind hole positions caused by positional shifts of substrate layer 2 in each process.

[0050] S2: The core of the copper bonding operation is to achieve a tight, bubble-free bond between the copper layer 1 and the epoxy glass cloth. The specific process is as follows:

[0051] Pretreatment: The surface of the stamped epoxy glass cloth is subjected to plasma cleaning to remove surface oil, dust and other impurities, and improve surface adhesion;

[0052] Vacuum adsorption bonding: Using a vacuum adsorption copper bonding equipment, after aligning the copper layer 1 with the surface of the epoxy glass cloth, the vacuum adsorption system is activated. Through negative pressure, the copper layer 1 is completely bonded to the surface of the epoxy glass cloth, avoiding the generation of air bubbles.

[0053] Pressure holding and curing: Pressure holding is performed immediately after bonding to allow copper layer 1 to initially bond with the surface of epoxy glass cloth, laying the foundation for subsequent hot pressing and bonding.

[0054] Compared with traditional mechanical pressing, vacuum adsorption offers better bonding uniformity and reduces the bubble rate; the pretreatment and pressure holding processes further enhance interlayer bonding and prevent copper layer detachment in subsequent processes.

[0055] S3: The core of this step is to precisely form the metal structure of the non-contact sensing package point 4, the contact sensing package point 3, and the corresponding blind via area on the copper layer 1, using an integrated processing method to improve efficiency and accuracy.

[0056] Exposure: The copper-coated substrate layer 2 is fixed on the exposure machine table through positioning holes and ultraviolet light exposure process is adopted; during exposure, the exposure area is controlled by a mask. The pattern on the mask is consistent with the design shape of the encapsulation point and blind hole to ensure that the exposed copper layer 1 forms the photosensitive area of ​​the corresponding pattern.

[0057] Development: The exposed substrate layer 2 is placed in an alkaline developing solution; the unexposed photoresist is removed by the developing solution, exposing the copper layer area to be etched;

[0058] Etching: The developed copper layer 1 is etched using an acidic etching solution, which is a ferric chloride solution. During the etching process, the etching solution is sprayed to ensure that the copper layer is evenly contacted by the etching solution, so as to ensure that the shape of the encapsulation points and blind hole areas is accurate and the edges are neat after etching.

[0059] Deburring treatment: After etching, the edges of substrate layer 2 are treated by a combination of mechanical polishing and chemical deburring. Mechanical polishing and chemical deburring are carried out by immersion in acidic passivation solution to remove sharp burrs on the edges, so as to avoid scratching the copper layer or affecting the assembly in subsequent processes.

[0060] Integrating exposure, development, and etching into a continuous process reduces process changeover time and improves production efficiency; the combination of ultraviolet light exposure with alkaline developer and acidic etchant ensures high precision in copper layer pattern formation.

[0061] S4: The purpose of electroplating is to improve the conductivity, oxidation resistance, and solderability of the encapsulation points and the inner wall of the blind vias. The specific process is as follows:

[0062] Pretreatment: The etched substrate layer 2 is cleaned in degreasing solution to remove surface oil and dirt, and then activated by hydrochloric acid to remove the oxide film on the copper layer surface to ensure the adhesion of the electroplated layer.

[0063] Electroplating process: The substrate layer 2 is fixed on the rack through the positioning holes and placed in the gold / nickel electroplating solution using a rack plating method; nickel plating is performed first; then gold plating is performed.

[0064] Post-treatment: After electroplating, the electroplated layer is washed with water, passivated, and dried in sequence to ensure that the surface of the electroplated layer is clean and free of residue.

[0065] The gold / nickel double-layer electroplating has excellent conductivity and strong oxidation resistance, and can withstand environmental corrosion during long-term use of smart cards. The nickel layer serves as the bottom layer to enhance the adhesion with the copper layer, while the gold layer serves as the top layer to improve welding compatibility, ensuring stable and reliable solder joints after gold / alloy wire welding, and improving the wear resistance of contact induction packaging points.

[0066] The packaging process uses a single-sided substrate layer 2, which is formed by hot-pressing epoxy glass cloth and copper layer 1 together.

[0067] Specifically, the single-sided substrate layer 2 uses epoxy glass cloth as the base material. The epoxy glass cloth is made of high-insulation glass fiber reinforced epoxy resin, which has excellent mechanical strength, high temperature resistance, and chemical stability, providing stable structural support for subsequent copper layer bonding, encapsulation point molding, and signal transmission. The copper layer 1 uses electrolytic copper foil to ensure conductivity and compatibility with etching processes. The two are fixedly connected through a hot-pressing composite process. During the hot-pressing process, the epoxy glass cloth and copper foil are aligned and placed in a hot press. The thermosetting properties of the epoxy glass cloth are used to achieve a tight bond with the copper layer 1, forming an integrated single-sided panel structure without bubbles or delamination. Traditional double-interface strips use a double-sided panel design, requiring copper to be bonded, etched, and electroplated on both sides of the substrate. The process is cumbersome and prone to signal interference due to misalignment of the double copper surfaces. However, the single-sided panel structure of this invention, through the functional partitioning design of the single-sided copper layer 1, can simultaneously support non-contact sensing encapsulation points 4 and contact sensing encapsulation points 3 without the need for double copper surfaces. The hot-pressing composite process ensures the bonding strength between the epoxy glass cloth and the copper layer 1, and can withstand the mechanical stress and chemical treatment during subsequent exposure, etching, electroplating and encapsulation processes, thus avoiding interlayer separation failure.

[0068] The single-sided substrate layer 2 is provided with non-contact induction packaging point 4 and contact induction packaging point 3. The non-contact induction packaging point 4 and the contact induction packaging point 3 are spaced apart along the length of the substrate layer 2. The non-contact induction packaging point 4 is provided with a circular soldering point, and the contact induction packaging point 3 is provided with a rectangular soldering point. The soldering points are all integrally formed metallized bosses.

[0069] Specifically, the non-contact sensing package point 4 and the contact sensing package point 3 are spaced apart along the length of the substrate layer 2. The core purpose of this layout design is to avoid mutual interference between the signals of the two types of package points: the high-frequency induced magnetic field generated by the non-contact sensing package point 4 during operation is spatially isolated from the contact conduction signal of the contact sensing package point 3, ensuring the signal strength of non-contact communication and the transmission stability of contact communication, and solving the signal crosstalk problem caused by the dense package points in traditional designs.

[0070] Non-contact induction packaging point 4: Configured with circular soldering points. This shape is adapted to the magnetic field distribution characteristics of non-contact induction signals, which can make the signal transmission uniform and without directional loss, and improve the distance and stability of non-contact communication.

[0071] Contact-type inductive encapsulation point 3: It is equipped with a rectangular soldering point. The rectangular structure increases the contact area with external contacts, reduces contact resistance, and improves wear resistance during insertion and removal, making it suitable for frequent insertion and removal scenarios in contact communication.

[0072] All welding points utilize a one-piece metallized boss structure, with its forming process integrated with the etching and electroplating processes of copper layer 1: during the exposure and development stage of copper layer 1, a metallized area for the welding points is reserved through mask design; after etching, this area undergoes a specialized gold / nickel electroplating thickening treatment to form the boss structure. The boss material is consistent with copper layer 1 and the electroplating layer, ensuring the continuity of conductivity, and the one-piece structure has no splicing gaps, avoiding the risk of detachment caused by subsequent welding or bonding.

[0073] Blind holes are provided on the single-sided board substrate layer 2. The blind holes are set in the bonding area of ​​the non-contact induction packaging point 4. The inner wall of the blind hole is formed with a nickel layer by electroplating.

[0074] Specifically, the blind vias are precisely positioned to correspond to the bonding wire area of ​​the non-contact induction packaging point 4, penetrating only the epoxy glass cloth portion of the substrate layer 2 without penetrating the copper layer 1, thus avoiding damage to the functional areas of the copper layer. After the substrate layer 2 is hot-pressed and composite-formed, blind vias are processed using CNC drilling equipment, with a drill bit used to achieve high-precision drilling. The substrate layer 2 with the drilled blind vias is then placed in a nickel plating solution, employing a symmetrical anode plating technique to ensure that the plating solution uniformly covers the inner wall of the blind vias, forming a uniform nickel layer. The nickel layer material is high-purity electrolytic nickel, which possesses excellent conductivity, oxidation resistance, and solder compatibility, enabling it to form a stable solder bond with gold or alloy wires. In traditional single-sided board designs, the bonding wire space for the non-contact induction packaging point is limited, requiring the expansion of the bonding wire area using the double-layer copper surface of a double-sided board, resulting in complex processes. In contrast, the blind vias of this invention directly expand the bonding wire space within the substrate layer 2, eliminating the need for additional copper layers and avoiding the cumbersome processes of etching and electroplating the double-layer copper surfaces of double-sided boards.

[0075] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A dual-interface noodle strip based on a smart card, characterized in that, The system includes a copper layer (1) and a substrate layer (2), which are bonded and fixedly connected. The copper layer (1) includes a copper layer A and a copper layer B. The copper layer A is provided with a non-contact induction encapsulation point (4), and the copper layer B is provided with a contact induction encapsulation point (3). A blind hole is opened inside the substrate layer (2), and the blind hole is located corresponding to the non-contact induction encapsulation point (4). An encapsulation element (5) is fixedly provided on the outer wall of the substrate layer (2), and the encapsulation element (5) is connected to a lead wire (6). The lead wire (6) is connected to either the contact induction encapsulation point (3) or the non-contact induction encapsulation point (4).

2. The dual-interface strip based on a smart card according to claim 1, characterized in that, The substrate layer (2) is an FR4 laminate or a PI flexible board.

3. The dual-interface strip based on a smart card according to claim 1, characterized in that, The lead wire (6) is a gold wire or an alloy wire.

4. A dual-interface strip based on a smart card according to claim 1, characterized in that, The non-contact sensing encapsulation point (4) includes at least one of structure one or structure two.

5. A dual-interface strip based on a smart card according to claim 1, characterized in that, The structure is configured such that a gap is added between the sensing point and the lead wire (6).

6. A dual-interface strip based on a smart card according to claim 1, characterized in that, The second structure is configured such that FR4 composite material is placed between the sensing point and the lead wire (6).

7. A dual-interface strip packaging process based on a smart card, characterized in that, A dual-interface strip for use in a smart card based device as described in any one of claims 1-6, comprising the following steps: S1. The epoxy glass cloth is stamped, and during the stamping process, pre-formed positioning holes are formed in the edge area of ​​the epoxy glass cloth in a circumferentially evenly distributed manner. S2. Copper bonding is performed on the surface of the stamped epoxy glass cloth. When bonding copper, the copper layer (1) is bonded to the surface of the epoxy glass cloth by vacuum adsorption and pressure is maintained after bonding. S3. The copper layer (1) is exposed, developed and etched in one process. Ultraviolet light is used for exposure, alkaline developer is used for development, and the edges of the substrate layer (2) are deburred after etching. S4. Perform gold / nickel electroplating on the etched substrate layer (2).

8. The packaging process for a dual-interface strip based on a smart card according to claim 7, characterized in that, The packaging process uses a single-sided substrate layer (2), which is formed by hot pressing epoxy glass cloth and copper layer (1).

9. The packaging process for a dual-interface strip based on a smart card according to claim 7, characterized in that, The single-sided substrate layer (2) is provided with non-contact induction packaging points (4) and contact induction packaging points (3). The non-contact induction packaging points (4) and contact induction packaging points (3) are spaced apart along the length direction of the substrate layer (2). The non-contact induction packaging points (4) are provided with circular soldering points, and the contact induction packaging points (3) are provided with rectangular soldering points. The soldering points are all integrally formed metallized bosses.

10. The packaging process for a dual-interface strip based on a smart card according to claim 7, characterized in that, The single-sided board substrate layer (2) is provided with blind holes, which are set in the bonding area of ​​the non-contact induction packaging point (4), and the inner wall of the blind hole is formed with a nickel layer by electroplating.

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