Electronic device and manufacturing method for display device

Abstract

The invention relates to a method for manufacturing a display device and an electronic device. In one embodiment, a method includes applying (e.g., depositing) a substrate on a stage, the substrate defining a first region and a second region surrounding (e.g., surrounding) the first region; and forming an adhesive member on the substrate, in which forming the adhesive member includes: applying a first resin composition onto the substrate to overlap the first region and the second region; providing first light to cure the first resin composition; applying a second resin composition onto the cured first resin composition to overlap the second region; and providing a second light to cure the second resin composition, and each of the first resin composition and the second resin composition has a viscosity of at least about 10 mPa.s (or more) and up to about 30 mPa.s (or less) at about 25 DEG C.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Japanese Patent Application No. 2024-159462, filed on September 13, 2024, and Japanese Patent Application No. 2025-005003, filed on January 14, 2025, the entire contents of each of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments of this disclosure relate to electronic devices including adhesive members and methods of manufacturing display devices. Background Technology

[0004] One or more suitable display devices for multimedia devices, such as televisions, mobile phones, tablets, navigation systems, and / or game consoles, are under continuous development. For example, flexible display components that allow folding, bending, or rolling are being actively developed to enhance portability and / or user convenience.

[0005] For each component used in such a flexible display device, reliability needs to be ensured, or even must be ensured, during folding and / or bending operations. In particular, the adhesive resin used to form the adhesive layer in these devices should exhibit enhanced (excellent) coating properties and be suitable for application to various components of the display device in different configurations. Summary of the Invention

[0006] One or more aspects of embodiments of this disclosure relate to a method for manufacturing an adhesive member comprising two or more sets of application processes, and a method for manufacturing a display device including the adhesive member. For example, this disclosure relates to a method for manufacturing an adhesive member comprising two or more sets of application processes. This disclosure also relates to a method for manufacturing a display device including the adhesive member.

[0007] One or more aspects of embodiments of this disclosure relate to an electronic device that includes an adhesive member formed by a manufacturing method for an adhesive member. For example, this disclosure relates to an electronic device that includes an adhesive member formed by the aforementioned manufacturing method for an adhesive member.

[0008] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practice of the embodiments presented in this disclosure.

[0009] One or more embodiments of this disclosure provide a method of manufacturing a display device, the method comprising applying (e.g., depositing) a substrate on a stage, the substrate defining a first region and a second region surrounding (e.g., around) the first region (e.g., applying or depositing the substrate on a stage, the substrate having a first region and a second region surrounding the first region). The method further comprises forming an adhesive member on the substrate, wherein forming the adhesive member comprises: applying a first resin composition to the substrate to overlap with the first and second regions; providing first light to cure the first resin composition (e.g., to provide a cured first resin composition); applying a second resin composition to the cured first resin composition to overlap with the second region; and providing second light to cure the second resin composition, and each of the first and second resin compositions having a viscosity of at least about 10 mPa·s (e.g., or higher) and at most about 30 mPa·s (e.g., or lower) at about 25°C.

[0010] In one or more embodiments, when applying the first resin composition, the first amount of the first resin composition to be applied to the first region may be greater than (larger than) the second amount of the first resin composition to be applied to the second region.

[0011] In one or more embodiments, the second region of the substrate may be divided into at least two (e.g., two or more) first unit regions, each having a different amount of the first resin composition applied.

[0012] In one or more embodiments, the second region of the substrate may be divided into: a first-1 unit region, adjacent to and surrounding (e.g., around) the first region; and a first-2 unit region, spaced apart from and / or separated (e.g., spaced apart or separated) from the first region, with the first-1 unit region between them, and surrounding (e.g., around) the first-1 unit region (e.g., the first-1 unit region is between the first region and the first-2 unit region).

[0013] In one or more embodiments, the amount of the first resin composition to be applied to the first-1 unit region may be less than (less than) the amount of the first resin composition to be applied to the first-2 unit region.

[0014] In one or more embodiments, forming the adhesive member prior to applying the first resin composition may further include: forming a substrate as a bitmap comprising m pixels in a first direction and g pixels in a second direction intersecting the first direction, wherein m and g are positive integers; dividing the second region into two or more first unit regions on the bitmap; and setting the amount of the first resin composition applied to each of the first region and the first unit regions.

[0015] In one or more embodiments, the average amount of the first resin composition applied in the first unit region is calculated by Formula 1 and may be at least about 50 (e.g., or greater) and at most about 85 (e.g., or less).

[0016] Formula 1

[0017] [(X1×A1)+···(Xn×An)]÷(A1+···An)

[0018] In Equation 1, for example, when the amount of the first resin composition to be applied to the first region is 100 (e.g., when the amount of the first resin composition to be applied to the first region is 100), X1 to Xn can each independently be the amount of the first resin composition applied to the first first unit region to the nth first unit region, and A1 to An can each independently be the number of pixels in the first first unit region to the nth first unit region, and n can be an integer of 2 or greater.

[0019] In one or more embodiments, forming the adhesive member prior to applying the second resin composition may further include: forming a substrate as a bitmap comprising p pixels in a first direction and q pixels in a second direction intersecting the first direction, wherein p and q are positive integers; dividing the second region into at least two (e.g., two or more) second unit regions on the bitmap; and setting an application amount to the second unit regions.

[0020] In one or more embodiments, the second unit region may include: a second-1 unit region adjacent to and surrounding (e.g., around) the first region; and a second-2 unit region spaced apart from and / or separated from the first region (e.g., spaced apart or separated) with the second-1 unit region between them, and surrounding (e.g., around) the second-1 unit region (e.g., the second-1 unit region is between the first region and the second-2 unit region), and the amount of the second resin composition to be applied to the second-1 unit region may be different from the amount of the second resin composition to be applied to the second-2 unit region.

[0021] In one or more embodiments, the amount of the second resin composition to be applied to the 2-1 unit region may be greater than the amount of the second resin composition to be applied to the 2-2 unit region.

[0022] In one or more embodiments, the adhesive member may include a peak portion that overlaps with the second region, and in the thickness direction, the height from the lower surface of the adhesive member to the upper surface of the adhesive member is greatest at the peak portion, and the horizontal distance from the edge of the adhesive member to the peak portion may be at least about 300 micrometers (μm) (or greater) and at most about 600 μm (or less).

[0023] In one or more embodiments, the temperature at the stage during the formation of the adhesive member can be at least about 20°C (or higher) and at most about 30°C (or lower).

[0024] In one or more embodiments, the first resin composition and the second resin composition can be applied by inkjet printing.

[0025] In one or more embodiments, the second region may have a width of up to about 3 millimeters (mm) (or less).

[0026] In one or more embodiments, when the second resin composition is applied, the second resin composition applied to the substrate may not overlap with the first region.

[0027] In one or more embodiments of this disclosure, a method of manufacturing a display device includes: preparing a display panel having a first region and a second region surrounding (e.g., around) the first region (e.g., the display panel includes a first region and a second region surrounding the first region); forming an adhesive member on the display panel using an inkjet process; and bonding a window to the display panel via the adhesive member, wherein forming the adhesive member includes: applying a first resin composition to the display panel; curing the first resin composition to form a preliminary adhesive member; applying a second resin composition along the edge of the preliminary adhesive member to the preliminary adhesive member; and curing the second resin composition, wherein each of the first resin composition and the second resin composition has a viscosity of at least about 10 mPa·s (or higher) and at most about 30 mPa·s (or lower) at about 25°C.

[0028] In one or more embodiments, when applying the first resin composition, the amount of the first resin composition ejected from the inkjet head can be controlled or selected, so that the first resin composition can be applied to a first area of ​​the display panel at a first application amount, and the first resin composition can be applied to a second area of ​​the display panel at a second application amount different from the first application amount.

[0029] In one or more embodiments, forming the adhesive member prior to applying the first resin composition may further include: dividing the second region into at least two (e.g., two or more) first unit regions, each having a different amount of the first resin composition applied; and setting the amount of the first resin composition applied to each of the first region and the first unit regions, and when applying the first resin composition (e.g., applying the first resin composition to a display panel), the first resin composition may be applied to the first region and the first unit regions according to the set amount of application.

[0030] In one or more embodiments, the edge of the initial adhesive member may correspond to a second area of ​​the display panel.

[0031] In one or more embodiments of this disclosure, the electronic device includes: a display panel defining a first region and a second region surrounding (e.g., around) the first region; a window disposed on the display panel; and an adhesive member disposed between the display panel and the window, comprising a resin composition (e.g., a polymer derived from the resin composition) having a viscosity of at least about 10 mPa·s (or higher) and at most about 30 mPa·s (or lower) at about 25°C, and the adhesive member including a peak portion overlapping the second region, and in the thickness direction, the height from the lower surface of the adhesive member to the upper surface of the adhesive member being greatest at the peak portion, and the horizontal distance from the edge of the adhesive member to the peak portion being at least about 300 μm (or greater) and at most about 600 μm (or less).

[0032] In one or more embodiments, the electronic device may be selected from large display devices and small-to-medium-sized display devices. Large display devices include televisions, monitors, and outdoor billboards, while small-to-medium-sized display devices include personal computers, laptop computers, personal digital assistants, display devices for vehicles, game consoles, portable electronic devices, cameras, and combinations thereof (e.g., any suitable combination).

[0033] In one or more embodiments, the electronic device may further include at least one of a processor, a memory, and a power module.

[0034] For example, embodiments of this disclosure provide a method for manufacturing a display device, the method comprising forming an adhesive member on a substrate or display panel having a defined first region and a surrounding second region. The method includes sequentially applying and curing a first resin composition and a second resin composition (each having a viscosity of about 10 to 30 mPa·s at 25°C) using inkjet printing. The first resin is applied to both the first and second regions, while the second resin is applied only to the second region, and the amount applied to each region and sub-region is controlled. The second region may be divided into multiple unit regions (e.g., unit region 1-1, unit region 1-2, unit region 2-1, unit region 2-2), each with a different amount of resin applied, determined using a bitmap mapping of a pixel array. The method may include calculating an average application amount using a weighted average and forming a peak portion in the adhesive member, the peak portion having a maximum height in the thickness direction and a horizontal distance of about 300-600 μm from the edge. The adhesive member may be used to bond a window to the display panel, and the edge of the initial adhesive member may correspond to the second region. The resulting electronic device includes a display panel, windows, and adhesive components, and may also include components such as a processor, memory, and / or power module. The device may be a large display (e.g., a television, monitor, or billboard) or a small to medium-sized device (e.g., a laptop computer, PDA, vehicle display, game console, camera, or portable electronic device). Attached Figure Description

[0035] The accompanying drawings are included to provide a further understanding of the foregoing and other aspects, features, and advantages of certain embodiments of this disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of this disclosure and, together with the description, serve to explain the principles of this disclosure. In the drawings: Figure 1 This is a perspective view of a display device according to one or more embodiments of the present disclosure; Figure 2 It is shown Figure 1 A diagram showing the folded state of the display device; Figure 3 This is a perspective view of a display device according to one or more embodiments of the present disclosure; Figure 4 It is shown Figure 3 A diagram showing the folded state of the display device; Figure 5 This is a perspective view of a display device according to one or more embodiments of the present disclosure; Figure 6 This is an exploded perspective view of a display device according to one or more embodiments of the present disclosure; Figure 7This is a cross-sectional view of a display device according to one or more embodiments of the present disclosure; Figure 8 This is a cross-sectional view of a display device according to one or more embodiments of the present disclosure; Figure 9 This is a cross-sectional view of a display device according to one or more embodiments of the present disclosure; Figure 10 It is a block diagram of an electronic device according to one or more embodiments; Figure 11 A schematic diagram of an electronic device according to one or more suitable embodiments is shown; Figure 12A This is a flowchart of a method for manufacturing a display device according to one or more embodiments of the present disclosure; Figure 12B It is a flowchart detailing the steps (e.g., actions or tasks) of forming an adhesive member in a method of manufacturing a display device according to one or more embodiments of the present disclosure; Figures 13A to 13K This is a diagram schematically illustrating the steps (e.g., actions or tasks) of forming an adhesive member according to one or more embodiments of this disclosure; and Figures 14A to 14C This is a diagram schematically illustrating the steps (e.g., actions or tasks) of forming an adhesive member according to one or more embodiments of this disclosure. Detailed Implementation

[0036] This disclosure may have one or more suitable modifications and forms, and its specific embodiments are shown in the accompanying drawings and described in more detail in this specification. However, this is not intended to limit this disclosure to a particular form, but should be understood to include all modifications, equivalents, or substitutions falling within the spirit and technical scope of this disclosure.

[0037] When placed after / before an element in a list, expressions such as "at least one of," "one of," "selected from," and "selected from..." modify the elements of the entire list rather than individual elements within it. For example, throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b (e.g., including both a and b), both a and c (e.g., including both a and c), both b and c (e.g., including both b and c), all of a, b, and c, or variations thereof.

[0038] In this specification, it should be understood that when an element (or region, layer, part, etc.) is referred to as being "on", "connected to", or "attached to" another element, it may be arranged directly on, directly connected to, or directly attached to another element, or may be arranged between them with other elements.

[0039] In this application, "direct arrangement" can mean that there is no additional layer, film, region, substrate, etc. between one part of a layer, film, region, substrate, etc. and another part. For example, "direct arrangement" can mean that it is arranged between two layers or two components without the use of additional components such as adhesive components.

[0040] Reference will be made in more detail to one or more embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals or symbols always denote the same elements and may not be described repeatedly. In this respect, the embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, one or more embodiments are described solely with reference to the accompanying drawings to explain aspects of this specification. In the drawings, the thickness, proportions, and dimensions of elements are exaggerated for the purpose of effectively describing the technical content. For example, since the dimensions and thicknesses of the components in the drawings are arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0041] As used herein, the term “and / or” includes any and all combinations of one or more of the related listed elements.

[0042] It will be understood that while the terms “first,” “second,” etc., may be used herein to describe one or more suitable elements, these elements are not limited by these terms. These terms are used only to distinguish one element from another. For example, the first element discussed may be referred to as the second element without departing from the scope of this disclosure. Similarly, the second element may be referred to as the first element. In this specification, the singular expressions “an,” “a,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0043] In some embodiments, the terms “below,” “under,” “on the lower side,” “above,” “on top,” “on the upper side,” etc., may be used to describe the relationship between the elements shown in the figures. These terms are relative concepts and are described based on the orientation indicated in the figures. In this specification, “arranged on” can mean not only on the upper part of a member but also on its lower part. For example, if the device in the figures is flipped, the element described as “below” or “under” other elements or features will be oriented as “above” or “on top” other elements or features. Thus, the term “below” can (e.g., simultaneously) include both upper and lower orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein should be interpreted accordingly.

[0044] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms, such as those defined in common dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0045] It will also be understood that, when used in this specification, the terms “comprise,” “include,” “have,” “comprises,” “includes,” “has,” and / or “comprising,” “including,” “having” specify the presence of the described features, numbers, steps, operations, elements, components, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof. Furthermore, the terms “comprise(s)” / “comprising,” “include(s)” / “including,” “have,” “has,” / “having,” or other similar terms include or support the terms “consisting of” and “substantially consisting of”, indicating the presence of the stated features, integrals, steps, operations, elements, and / or components, while other features, integrals, steps, operations, elements, components, and / or groups thereof are absent or substantially absent.

[0046] The term “may” will be understood to mean “one or more embodiments of this disclosure,” some of which include the described elements, and some of which exclude the element and / or include alternative elements. Similarly, alternative language such as “or” refers to “one or more embodiments of this disclosure,” each of which includes the corresponding listed items.

[0047] In this document, “consistent with…” means that any additional components will not substantially affect the chemical, physical, optical, or electrical properties of the semiconductor film.

[0048] As used herein, the phrase "in plan view" or "in plan view" refers to a top-down view of the target portion, as if viewed from directly above. The phrase "in section view" or "in sectional view" refers to a side view of the target portion as seen along a plane cutting through the structure. Hereinafter, with reference to the accompanying drawings, resin compositions and adhesive components according to one or more embodiments of the present disclosure, as well as display devices according to one or more embodiments, will be described.

[0049] Display device

[0050] Figure 1 This is a perspective view of a display device according to one or more embodiments. Figure 2 It is shown Figure 1 The diagram shows the folded state of the display device.

[0051] refer to Figure 1 The display device DD according to one or more embodiments may have a rectangular shape, having a long side extending in a first direction DR1 and a short side extending in a second direction DR2 intersecting the first direction DR1. However, one or more embodiments are not limited thereto, and the display device DD may have one or more suitable shapes on a plane, such as circular and polygonal shapes. The display device DD may be a flexible display device.

[0052] In a display device DD according to one or more embodiments, the display surface DS of the displayed image IM may be parallel to the surface defined by a first direction DR1 and a second direction DR2. The positive direction of the display surface DS, which is the thickness direction of the display device DD, is indicated by a third direction DR3. The front surface (or upper surface) and the rear surface (or lower surface) of each component are distinguished based on the third direction DR3. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be relative concepts and therefore may be changed to other directions.

[0053] A display device DD according to one or more embodiments may include at least one folded region FA. (Reference) Figure 1 and Figure 2 The display device DD may include a folded region FA and a plurality of non-folded regions NFA. The folded region FA may be arranged between the non-folded regions NFA, and the folded region FA and the non-folded regions NFA may be arranged adjacent to each other in a first direction DR1.

[0054] The folding region FA can be a portion that can deform into a folded state relative to a folding axis FX extending in a second direction DR2 as one direction. The folding region FA can have a radius of curvature RD of about 5 mm or less.

[0055] Figure 1 and Figure 2 One folded region FA and two non-folded regions NFA are shown as an example, but the number of each of the folded region FA and non-folded region NFA is not limited thereto. For example, the display device DD may include more than two non-folded regions NFA, and may include multiple folded regions FA arranged between the non-folded regions NFA.

[0056] In a display device DD according to one or more embodiments, the non-folding regions NFA can be arranged symmetrically with respect to the folding regions FA. However, one or more embodiments are not limited to this, and the folding regions FA can be arranged between the non-folding regions NFA, but the areas of two non-folding regions NFA that are opposite to each other (e.g., facing each other) with respect to the folding regions FA can be different from each other.

[0057] The display surface DS of the display device DD may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image, and the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and define the boundary of the display device DD.

[0058] refer to Figure 2 The display device DD can be a foldable display device DD that can be folded or unfolded. For example, the folding region FA can be bent relative to a folding axis FX parallel to the second direction DR2, so that the display device DD can be folded. The folding axis FX can be defined as a short axis parallel to the short side of the display device DD.

[0059] If (for example, when) the display device DD is folded, the non-folded regions NFA can face each other, and the display device DD can be folded inward so that the display surface DS is not exposed to the outside. However, one or more embodiments are not limited to this, and the display device DD can be folded outward so that the display surface DS is exposed to the outside.

[0060] Figure 3 This is a perspective view of a display device according to one or more embodiments. Figure 4 It is shown Figure 3 The diagram shows the folded state of the display device.

[0061] In addition to folding operations Figure 3 The display device DD-a shown has the same Figure 1 The configuration of the display device DD shown is basically the same. Therefore, in relation to... Figure 3 and Figure 4 The description of the display device DD-a shown primarily focuses on the folding operation.

[0062] refer to Figure 3 and Figure 4 The display device DD-a may include a folded region FA-a and multiple non-folded regions NFA-a. The folded region FA-a may be arranged between the non-folded regions NFA-a, and the folded region FA-a and the non-folded region NFA-a may be arranged adjacent to each other in the second direction DR2.

[0063] The folding region FA-a can be bent relative to a folding axis FX-a parallel to the first direction DR1, allowing the display device DD-a to be folded. The folding axis FX-a can be defined as a long axis parallel to the long side of the display device DD-a. Figure 1 The display device DD shown can be folded relative to the short axis, and conversely, Figure 3 The display device DD-a shown can be folded relative to its long axis. Figure 4 The display device DD-a is shown to be folded inward so that the display surface DS is not exposed to the outside, but one or more embodiments are not limited thereto, and the display device DD-a can be folded relative to the long axis and can also be folded outward.

[0064] Figure 5 This is a perspective view of a display device according to one or more embodiments. The display device DD-b according to one or more embodiments may include curved regions BA1 and / or BA2 and a non-curved region NBA, and the curved regions BA1 and / or BA2 may be curved from one side of the non-curved region NBA.

[0065] refer to Figure 5 The display device DD-b according to one or more embodiments may include an image IM displayed on a non-curved area NBA on a front surface and a first curved area BA1 and a second curved area BA2 displayed on a side surface. The first curved area BA1 and the second curved area BA2 may be curved from the corresponding side of the non-curved area NBA.

[0066] refer to Figure 5 In the non-curved area NBA, an image IM can be provided to DR3 (facing the front surface of the display device DD-b) via a third direction, and in the first curved area BA1, an image can be provided to DR5 via a fifth direction, and in the second curved area BA2, an image can be provided to DR4 via a fourth direction. The fourth direction DR4 and the fifth direction DR5 can each be a direction intersecting the first direction DR1, the second direction DR2, and the third direction DR3. However, the directions indicated by the first direction DR1 to the fifth direction DR5 can be relative concepts and are not limited to the directional relationships shown in the accompanying drawings.

[0067] The display device DD-b according to one or more embodiments may be a curved display device, including a non-curved region NBA and curved regions BA1 and BA2 arranged on corresponding sides of the non-curved region NBA. The display device according to one or more embodiments may be a curved display device including a non-curved region and a curved region. Therefore, the curved region may be curved only from one side of the non-curved region.

[0068] Refer to the previously described Figures 1 to 5This paper describes foldable display devices, flexible display devices, etc., but one or more embodiments are not limited thereto. The display device according to one or more embodiments may also be a rollable display device, a flat rigid display device, or a curved rigid display device.

[0069] In the following description of the display device according to one or more embodiments, the display device DD is folded relative to the short axis, but one or more embodiments are not limited thereto, and as will be described in more detail, not only the display device DD-a folded relative to the long axis and the display device DD-b including the curved region, but also one or more suitable forms of display devices may be applied.

[0070] Figure 6 This is an exploded perspective view of a display device according to one or more embodiments. Figure 7 It is a cross-sectional view of a display device according to one or more embodiments. Figure 7 It can correspond to Figure 1 A sectional view of the section along line I-I'.

[0071] A display device DD according to one or more embodiments may include a display module DM and a window WP disposed on the display module DM. In a display device DD according to one or more embodiments, the display module DM may include a display panel DP and an input sensing portion TP disposed on the display panel DP, the display panel DP including a display element layer DP-EL. A display device DD according to one or more embodiments may include an adhesive member AP disposed between the display panel DP and the window WP. For example, in a display device DD according to one or more embodiments, the adhesive member AP may be disposed between the input sensing portion TP and the window WP. The adhesive member AP may be an optically clear adhesive (OCA) film or an optically clear adhesive resin (OCR) layer.

[0072] According to one or more embodiments, which will be described in more detail, the adhesive member AP can be formed by a manufacturing method for adhesive members. The adhesive member AP can be formed from resin compositions RS1 and RS2, which will be described later (see...). Figure 13D and Figure 13G The adhesive component AP may be formed from resin compositions RS1 and RS2, which will be described in more detail (see [link to product description]). Figure 13D and Figure 13GThe polymer is a liquid resin composition. The liquid resin composition can be cured by UV irradiation, and after UV curing, the liquid resin composition can be set into the form of a film or thin film. If the viscosity is measured using the JIS K 2283 method (e.g., when the viscosity is measured using the JIS K 2283 method), the resin composition forming the adhesive component AP through polymerization by a photoinitiator can have a viscosity of at least about 10 mPa·s (or higher) and at most about 30 mPa·s (or lower) at about 20°C or higher and about 30°C or lower.

[0073] The display panel DP may include a base substrate BS, a circuit layer DP-CL disposed on the base substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and an encapsulation layer TFE covering the display element layer DP-EL. For example, the display panel DP may include multiple organic light-emitting elements or multiple quantum dot light-emitting elements on the display element layer DP-EL.

[0074] Figure 7 The display panel DP configuration shown is an example, and the display panel DP configuration is not limited to... Figure 7 The configuration shown in the figure. For example, the display panel DP may include liquid crystal display elements, and in this case, the encapsulation layer TFE may not be provided.

[0075] An input sensing portion TP can be disposed on a display panel DP. For example, the input sensing portion TP can be directly disposed on the encapsulation layer TFE of the display panel DP. The input sensing portion TP can detect external input, convert the external input into a set or predetermined input signal, and can provide the input signal to the display panel DP. For example, in a display device DD according to one or more embodiments, the input sensing portion TP can be a touch sensing portion for detecting touch. The input sensing portion TP can identify direct touch by a user, indirect touch by a user, direct touch by an object, indirect touch by an object, etc. The input sensing portion TP can detect at least one of the location of the touch applied from the outside and the intensity (pressure) of the touch. The input sensing portion TP according to one or more embodiments of this disclosure may have one or more suitable structures or may include one or more suitable materials, and is not limited to any one or more embodiments. The input sensing portion TP may include a plurality of sensing electrodes for detecting external input. The sensing electrodes may detect external input capacitively. The display panel DP can receive the input signal from the input sensing portion TP and can generate a screen corresponding to the input signal.

[0076] The window WP can protect the display panel DP, input sensing components TP, etc. The image IM generated in the display panel DP can pass through the window WP to be displayed to the user. The window WP can provide a touch surface for the display device DD. In a display device DD that includes a folding area FA, the window WP can be a flexible window.

[0077] The window WP may include a base layer BL and a printed layer BM. The window WP may include a transmissive area TA and a border area BZA. The front surface of the window WP, including the transmissive area TA and the border area BZA, corresponds to the front surface of the display device DD.

[0078] The transmissive region TA can be an optically transparent region. The border region BZA can be a region with relatively low light transmittance compared to the transmissive region TA. The border region BZA can have a set or predetermined color. The border region BZA can be adjacent to the transmissive region TA and can surround the transmissive region TA. The border region BZA can define the shape of the transmissive region TA. However, one or more embodiments are not limited to those shown in the figures, and the border region BZA may also be arranged adjacent to only one side of the transmissive region TA, or a portion of the border region BZA may not be provided.

[0079] The base layer BL can be a glass or plastic substrate. For example, a reinforced glass substrate can be used for the base layer BL. In one or more embodiments, the base layer BL can include a flexible polymer resin. For example, the base layer BL can be made of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene vinyl alcohol copolymer, or combinations thereof. However, one or more embodiments are not limited thereto, and any general form of base layer BL suitable in the relevant art as a window WP can be used without limitation.

[0080] The printed layer BM can be disposed on one surface of the base layer BL. In one or more embodiments, the printed layer BM can be disposed on the lower surface of the base layer BL adjacent to the display module DM. The printed layer BM can be disposed on the boundary region of the base layer BL. The printed layer BM can be an ink-printed layer. In some embodiments, the printed layer BM can be a layer comprising pigments or dyes. In the window WP, the border region BZA can be the portion where the printed layer BM is disposed.

[0081] The window WP may also include at least one functional layer disposed on the base layer BL. For example, the functional layer may be a hard coating, an anti-fingerprint coating, etc., but one or more embodiments are not limited thereto.

[0082] The adhesive member AP included in the display device DD according to one or more embodiments can be disposed on a surface of a window WP or a surface of a display module DM in the form of a liquid resin composition, and can be disposed by curing the disposed liquid resin composition with UV rays. In contrast, the adhesive member AP can be disposed by curing the liquid resin composition with UV rays in a separate process, laminating one surface of the adhesive member AP, cured into the form of an adhesive film, onto a surface of the window WP or a surface of the display module DM, and bonding the other surface of the adhesive member AP to an unbonded surface of the window WP or a surface of the display module DM. The adhesive member AP can have a thickness of at least about 50 micrometers (μm) (or greater) and at most about 200 μm (or less). For example, the adhesive member AP can have a thickness of at least about 50 μm (or greater) and at most about 150 μm (or less).

[0083] Figure 8 This is a cross-sectional view of a display device according to one or more embodiments. Figure 8 In the description of the display device according to one or more embodiments shown, the previously referenced [references] will no longer be described. Figures 1 to 7 The description repeats the same content, and the main focus will be on the differences.

[0084] Reference Figure 6 and Figure 7 Compared to the described display device DD, according to Figure 8 The display device DD-1 of the embodiment shown may further include a light control layer PP and an optical adhesive layer AP-a. The display device DD-1 according to one or more embodiments may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP.

[0085] A light control layer (PP) can be disposed on a display panel (DP) and can control the reflected light from external light onto the display panel (DP). The light control layer (PP) may include, for example, a polarizing layer or a color filter layer.

[0086] The optical adhesive layer AP-a can be an optically transparent adhesive (OCA) film or an optically transparent adhesive resin (OCR) layer. The optical adhesive layer AP-a can be provided by a method of manufacturing an adhesive component according to one or more embodiments, and is related to the adhesive component AP according to previously described embodiments (see...). Figure 7The manufacturing method is the same. If the viscosity is measured by the JIS K 2283 method (for example, when the viscosity is measured by the JIS K 2283 method), the resin composition that forms the optical adhesive layer AP-a by the polymerization reaction of the photoinitiator can have a viscosity of at least about 10 mPa·s (or higher) and at most about 30 mPa·s (or lower) at at least about 20°C (or higher) and at most about 30°C (or lower).

[0087] Figure 9 This is a cross-sectional view of a display device according to one or more embodiments. Figure 9 In the description of the display device according to one or more embodiments shown, the previously referenced [references] will no longer be described. Figures 1 to 7 The description repeats the same content, and the main focus will be on the differences.

[0088] Reference Figure 6 and Figure 7 Compared to the described display device DD, Figure 9 The display device DD-2 shown according to the embodiment may further include a light control layer PP, an optical adhesive layer AP-a, and an interlayer adhesive layer PIB. Figure 8 Similar to the display device DD-1 shown in the embodiment, the display device DD-2 according to one or more embodiments may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP.

[0089] In the display device DD-2 according to one or more embodiments, an adhesive member AP can be provided between the display panel DP and the input sensing portion TP. For example, the input sensing portion TP may not be directly disposed on the display panel DP, and the display panel DP and the input sensing portion TP can be connected to each other through the adhesive member AP. For example, the encapsulation layer TFE of the display panel DP (see...) Figure 7 An adhesive member AP is arranged between the input sensing part TP and the input sensing part TP.

[0090] An interlayer adhesive layer (PIB) can be disposed beneath the light control layer (PP). The PIB can be positioned between the input sensing portion (TP) and the light control layer (PP), and can be made of an adhesive material that is excellent or suitable for preventing moisture penetration. For example, the PIB may include polyisobutylene. The PIB can be disposed on the input sensing portion (TP) to prevent or reduce corrosion of the sensing electrodes of the TP.

[0091] The display device according to one or more embodiments can be applied to one or more suitable electronic devices. The electronic device according to one or more embodiments may include the aforementioned display device, and in addition to the display device, the electronic device may also include a module or device with another additional function.

[0092] The electronic device may include a display device comprising an adhesive member AP made of a resin composition and a control portion for controlling the display device. The electronic device according to one or more embodiments may be activated in response to an electrical signal. The electronic device may include a display device according to one or more suitable embodiments. For example, the electronic device may include large display devices comprising televisions, monitors, and / or outdoor billboards, as well as small and medium-sized display devices comprising personal computers, laptops, personal digital assistants, display devices for vehicles, game consoles, portable electronic devices, and / or cameras.

[0093] Figure 10 This is a block diagram of an electronic device according to one or more embodiments. (Reference) Figure 10 An electronic device ED according to one or more embodiments may include a display module DM, a processor PR, a memory MR, and a power module PM.

[0094] The processor PR may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0095] The memory MR can store data information required for the operation of the processor PR or the display module DM. If the processor PR runs an application stored in the memory MR (e.g., when the processor PR runs an application stored in the memory MR), the movie data signals and / or input control signals can be sent to the display module DM, and the display module DM can process the received signals to output movie information through the display screen.

[0096] The power module PM may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device ED.

[0097] At least one of the components selected from the previously described electronic device ED may be included in the display device according to the previously described embodiments. In some embodiments, some of the individual modules included in a functional module may be included in the display device, and other modules may also be disposed separately from the display device. For example, the display device may include a display module DM, and the processor PR, memory MR, and power module PM may be disposed in the electronic device ED as devices other than the display device.

[0098] Figure 11 A schematic diagram of an electronic device according to one or more suitable embodiments is shown.

[0099] refer to Figure 11 According to one or more embodiments, one or more suitable electronic devices with display devices may include not only electronic devices for displaying images (such as smartphones ED_1a, tablet PCs ED_1b, laptop computers ED_1c, TVs ED_1d, and desktop displays ED_1e), but also wearable electronic devices containing display modules (such as smart glasses ED_2a, head-mounted displays ED_2b, and smartwatches ED_2c), and vehicle electronic devices ED_3 containing display modules (such as car dashboards, central instrument panels, central information displays (CIDs) arranged on dashboards, and interior mirror displays), etc.

[0100] Method for manufacturing a display device

[0101] In the following text, see references Figure 12A , Figure 12B and Figures 13A to 13K This describes a method for manufacturing a display device according to one or more embodiments. In the description of the method for manufacturing a display device according to one or more embodiments, the description of the display device according to the previously described embodiments can be applied to the display device itself. In the description of the method for manufacturing a display device according to one or more embodiments, the repetition of previous descriptions of the display device according to the embodiments is omitted, and the differences are mainly described.

[0102] A method for manufacturing a display device according to one or more embodiments may be used as a reference. Figures 1 to 9 Methods for manufacturing display devices DD, DD-a, and DD-b according to embodiments are described. In one or more embodiments, a method for manufacturing a display device including an adhesive member AP disposed on a display panel DP of the display devices DD, DD-a, and DD-b is provided.

[0103] Figure 12A This is a flowchart of a method for manufacturing a display device according to one or more embodiments. Figure 12B It is a flowchart detailing the steps (e.g., actions or tasks) of forming an adhesive member in a method for manufacturing a display device according to one or more embodiments. Figures 13A to 13K This is a diagram schematically illustrating the steps (e.g., actions or tasks) of forming an adhesive member according to one or more embodiments.

[0104] refer to Figure 12AA method for manufacturing a display device according to one or more embodiments includes applying (e.g., depositing) a substrate on a stage in which a first region is defined and a second region is surrounded (e.g., around) the first region (S100) and forming an adhesive member on the substrate (S200).

[0105] refer to Figure 12B The formation of an adhesive member according to one or more embodiments (S200) may include applying a first resin composition to a substrate to overlap with both a first region and a second region (S201), providing a first light to cure the first resin composition (S202), providing the cured first resin composition, applying a second resin composition to the cured first resin composition to overlap with the second region (S203), and providing a second light to cure the second resin composition (S204). In this specification, applying the first resin composition (S201) may be referred to as performing a first application, and applying the second resin composition (S203) may be referred to as performing a second application. For example, forming an adhesive member includes a two-step application process: applying a first resin composition to overlap with both a first region and a second region of the substrate, and then curing it with a first light source (referred to as the first application); subsequently, applying the second resin composition onto the cured first resin composition on the second region and curing it with a second light source (referred to as the second application).

[0106] A method of manufacturing a display device according to one or more embodiments may include applying (e.g., depositing) a substrate RP onto a stage ST. Applying (e.g., depositing) the substrate RP onto the stage ST may include or prepare a substrate RP for forming an adhesive member AP. Reference Figure 13A A method of manufacturing a display device according to one or more embodiments may include providing a substrate RP on which an adhesive member AP is formed. The substrate RP may provide a base surface on which the adhesive member AP is formed. For example, the substrate RP may be a reference surface. Figure 7 The description refers to the display panel DP or window WP.

[0107] A ST platform can provide space for the substrate (RP) to be deposited. ST platforms can be configured as plates. Figure 13A An example of a platform ST having a quadrilateral shape on a plane is shown, but one or more embodiments are not limited thereto, and the shape and size of the platform ST on the plane can be one or more suitable choices.

[0108] In the substrate RP, a first region AA1 and a second region AA2 may be defined. The first region AA1 and the second region AA2 may be randomly selected or defined regions on the substrate RP for the inkjet printing process, which will be described in more detail. The first region AA1 may correspond to the central portion of the substrate RP. Compared to the first region AA1, the second region AA2 may correspond to the boundary portion of the substrate RP. On the plane defined by the first direction DR1 and the second direction DR2, the second region AA2 may surround or encircle the first region AA1.

[0109] The area of ​​the first region AA1 on the plane may exceed or be larger than the area of ​​the second region AA2 on the plane. According to one or more embodiments, the first region AA1 of the substrate RP may correspond to the display area DA of the display device DD (see...). Figure 1 At least a portion of ). In some embodiments, the second region AA2 of the substrate RP may correspond to the non-display region NDA of the display device DD (see Figure 1 At least a part of ).

[0110] In one or more embodiments, the second region AA2 may have a width of up to about 3 mm (or less). Figure 13B As shown, the first width W1 of the second region AA2 in the first direction DR1 and the second width W2 of the second region AA2 in the second direction DR2 can each be at most about 3 mm (or less).

[0111] refer to Figure 13B and Figure 13C The method of manufacturing a display device according to one or more embodiments of the present disclosure may further include, before applying the first resin composition (S201), forming a substrate RP into a first pattern, dividing the second region AA2 into at least two (e.g., more) first unit regions (e.g., SUA1 and SUA2) on the first pattern, and setting a first resin composition RS1 to be provided to each of the first region AA1 and the first unit regions SUA1 and SUA2 (see [link to original text]). Figure 13D The amount of application of ). In the case where the manufacturing method for a display device according to one or more embodiments further includes forming a substrate RP as a first image, the first region AA1 and the second region AA2 of the substrate RP can be set based on the number of pixels PX included in the first image.

[0112] refer to Figure 13BThe substrate RP can be formed as a first-order image comprising a plurality of pixels PX arranged along a first direction DR1 and a second direction DR2. The substrate RP can be divided into "m" pixels PX arranged along the first direction DR1 and "g" pixels PX arranged along the second direction DR2. Therefore, the substrate RP can be divided into "m×g" pixels PX arranged along the first direction DR1 and the second direction DR2. Here, "m" and "g" can be positive integers.

[0113] Each of the “m” pixels PX arranged along the first direction DR1 may have the same width in the first direction DR1, and each of the “g” pixels PX arranged along the second direction DR2 may have the same width in the second direction DR2, but one or more embodiments are not limited thereto. The length of the substrate RP in the first direction DR1 may be approximately “m” times the length of the pixel PX in the first direction DR1. The length of the substrate RP in the second direction DR2 may be approximately “g” times the length of the pixel PX in the second direction DR2.

[0114] Figure 13B An example is shown where the substrate RP is divided into approximately 15 pixels PX in the first direction DR1 and approximately 23 pixels PX in the second direction DR2, but one or more embodiments are not limited thereto. For example, the number of pixels PX selected or set for forming the substrate RP into a first image and the length of the pixels PX in the first direction DR1 and the second direction DR2 can be appropriately or suitably adjusted according to processing conditions, the resolution of the inkjet printer, etc.

[0115] After forming the substrate RP into a first image comprising “m×g” pixels PX, the second region AA2 can be divided into at least two (e.g., two or more) first unit regions (e.g., SUA1 and SUA2). For example, the second region AA2 can be divided into a plurality of first unit regions SUA1 and SUA2, each of the plurality of first unit regions SUA1 and SUA2 having a different first resin composition RS1 (see [link to documentation]). Figure 13D The amount of application of the first unit regions SUA1 and SUA2. Each of the first unit regions SUA1 and SUA2 may be arranged on the boundary of the substrate RP and may each have a shape on the plane surrounding (e.g., around) the first region AA1.

[0116] After dividing the second region AA2 into multiple first unit regions SUA1 and SUA2 on the first diagram, the setting of the first resin composition RS1 for the first region AA1 and the multiple first unit regions SUA1 and SUA2 can be performed (see...). Figure 13DThe application amount of the first resin composition RS1 (see [reference]) can be set for each region, such that the application amount is determined for each of the multiple first unit regions SUA1 and SUA2. Figure 13D The amount of ) applied is less than or less than the amount of the first resin composition RS1 to be applied to the first region AA1 (see Figure 13D The amount of resin to be applied. Here, the first resin composition RS1 to be applied to the multiple first unit regions SUA1 and SUA2 (see Figure 13D The amount applied refers to the average amount of the first resin composition RS1 to be applied to each of the plurality of first unit regions SUA1 and SUA2.

[0117] As shown in Table 1, on the first diagram, the second region AA2 can be divided into at least two (e.g., two or more) first unit regions SUA1, ..., and SUAn, and a first resin composition RS1 can be set for each of the plurality of first unit regions SUA1, ..., and SUAn (see Table 1). Figure 13D The amount of application of the first unit regions SUA1, ..., SUAn. Therefore, the amount of application of the multiple first unit regions SUA1, ..., SUAn refers to the comparison amount of each of the multiple first unit regions SUA1, ..., SUAn when the amount of application of the first region AA1 is 100.

[0118] Table 1

[0119] Referring to Table 1, the second region AA2 can be divided into n first unit regions SUA1, ..., SUAan. In Table 1, n can be an integer of 2 or greater. In this specification, the phrase "first first unit region to nth first unit region (SUA1, ..., SUAan)" can be referred to as the phrase "unit region 1-1 to unit region 1-n". For example, when n is 2, "first first unit region SUA1" can refer to "unit region 1-1", and "second first unit region SUA2" can refer to "unit region 1-2". (See also...) Figure 13B According to Table 1, n first unit regions SUA1, ..., SUAan can be arranged sequentially in one direction from the edge portion of the first region AA1 toward the substrate RP. For example, as shown in Table 1... Figure 13BAs shown, when n is 2, the first-1 unit region SUA1 and the first-2 unit region SUA2 can be arranged sequentially in one direction from the first region AA1 toward the edge portion of the substrate RP. In one or more embodiments, when n is 3, the first-1 unit region SUA1, the first-2 unit region SUA2, and the first-3 unit region SUA3 can be arranged sequentially in one direction from the first region AA1 toward the edge portion of the substrate RP. The n first unit regions SUA1, ... and SUAN can each have a closed line shape on the plane surrounding (e.g., around) the first region AA1.

[0120] The n first unit regions SUA1, ..., SUAn can each include a set or predetermined number of pixels PX. In Table 1, A1, ..., An can refer to the number of pixels PX included in the first first unit region SUA1 to the nth first unit region SUAn, respectively.

[0121] First resin composition RS1 (see...) Figure 13D The application amounts X1, ..., Xn can be set separately for each of the n first unit regions SUA1, ..., and SUAn. At least one of the application amounts X1, ..., Xn selected from the n first unit regions SUA1, ..., and SUAn can have a value different from the other application amounts. When the second region AA2 includes two first unit regions (e.g., SUA1 and SUA2), the application amount X1 corresponding to the first first unit region SUA1 and the application amount X2 corresponding to the second first unit region SUA2 can be different from each other. In one or more embodiments, when the second region AA2 includes three first unit regions, at least one of the application amounts X1 corresponding to the first first unit region SUA1, the application amount X2 corresponding to the second first unit region SUA2, and the application amount X3 corresponding to the third first unit region SUA3 can have a value different from the other application amounts. For example, the application amount X1 of the first-1 unit region SUA1, the application amount X2 of the first-2 unit region SUA2, and the application amount X3 of the first-3 unit region SUA3 can be different from each other.

[0122] In one or more embodiments, when the first resin composition RS1 (see [reference]) is applied to the first region AA1... Figure 13D When the amount of ) applied is 100, the first resin composition RS1 (see) for multiple first unit regions SUA1 and SUA2 is applied. Figure 13D The average amount applied may be less than or less than that applied to the first resin composition RS1 in the first region AA1 (see [link]). Figure 13DThe amount of resin composition RS1 applied to the first region AA1 (see [reference]). Figure 13D When the application amount is 100, the first resin composition RS1 (see [reference] for n first unit regions SUA1, ... and SUAn) is applied. Figure 13D The average amount applied may be less than or less than that applied to the first resin composition RS1 in the first region AA1 (see [link]). Figure 13D The amount of resin applied. For the first resin composition RS1 (see [reference], which comprises multiple first unit regions SUA1 and SUA2) Figure 13D The average amount applied can be calculated using Formula 1. In one or more embodiments, the average amount applied to the first resin composition RS1 of the plurality of first unit regions SUA1 and SUA2 can be calculated using Formula 1 and can be at least about 50 (or greater) and at most about 85 (or less).

[0123] Formula 1

[0124] [(X1×A1)+···(Xn×An)]÷(A1+···An)

[0125] In Formula 1, X1 to Xn (e.g., X1, X2, ..., Xn) are each independently the first resin composition RS1 to be applied to the first region AA1 (see Formula 1). Figure 13D When the application amount of ) is 100, the first resin composition RS1 (see Figure 13D The amount of resin composition RS1 applied to each of the first first unit regions (SUA1, ..., and SUAN) is specified. Figure 13D The amount applied can refer to the amount of the first resin composition RS1 to be applied to the first region AA1 (see [reference]). Figure 13D The comparison value when the applied amount is 100.

[0126] In Equation 1, A1 to An (e.g., A1, A2, ..., An) can each independently refer to the number of pixels PX in the first first unit region SUA1 to the nth first unit region SUAan.

[0127] In Equation 1, n is an integer of 2 or greater. For example, n can be an integer of 2 or greater and 4 or less.

[0128] In the following text, see references Figure 13B and Figure 13CThe following describes in more detail a method of manufacturing a display device according to one or more embodiments, the method comprising dividing a second region AA2 into two first unit regions SUA1 and SUA2 and setting a first resin composition RS1 for each of the two first unit regions SUA1 and SUA2 (see [link to documentation]). Figure 13D The amount of ) applied. Figure 13B and Figure 13C An example is shown in which the second region AA2 is divided into two first unit regions SUA1 and SUA2, but one or more embodiments are not limited thereto, and the second region AA2 may also be divided into three or more first unit regions, as previously described.

[0129] like Figure 13B As shown, the second region AA2 can be divided into two first unit regions SUA1 and SUA2. For example, the second region AA2 can be divided into a first-1 unit region SUA1 and a first-2 unit region SUA2. The first-1 unit region SUA1 can be adjacent to the first region AA1. In the plane, the first-1 unit region SUA1 can surround the first region AA1. The first-2 unit region SUA2 can be separated from and / or isolated from the first region AA1 (e.g., spaced apart or separated), and the first-1 unit region SUA1 is located between the first-2 unit region SUA2 and the first region AA1. In the plane, the first-2 unit region SUA2 can surround the first-1 unit region SUA1.

[0130] In one or more embodiments, the first unit regions SUA1 and SUA2 can each be distinguished by a pixel distance. "Pixel distance" can refer to the number of pixels PX included in the width distance of each unit region. The width of each unit region can refer to its width in the first direction DR1 and its width in the second direction DR2. In each unit region, the number of pixels PX included in the width distance in the first direction DR1 and the number of pixels PX included in the width distance in the second direction DR2 can be equal to each other. For example, Figure 13B The first-1 unit region SUA1 shown can include one pixel PX in its width distance along the first direction DR1 and the second direction DR2, and in this case, the pixel distance of the first-1 unit region SUA1 can be 1. In some embodiments, Figure 13B The first-second unit region SUA2 shown can include one pixel PX in the width distance in the first direction DR1 and the second direction DR2 respectively, and in this case, the pixel distance of the first-second unit region SUA2 can be 1.

[0131] Figure 13C It randomly shows the application to be applied. Figure 13BThe first resin composition RS1 of each of the first region AA1 and the two first unit regions SUA1 and SUA2 of the substrate RP shown (see Figure 13D A graph showing the setting of the application amount. Figure 13C In the curve graph, the vertical axis represents the applied amount. Figure 13C In the graph, "X1" represents the first resin composition RS1 to be applied to the SUA1 region of unit 1-1 (see [reference]). Figure 13D The amount of resin to be applied, "X2" is the first resin composition RS1 to be applied to the first-second unit region SUA2 (see [reference]). Figure 13D The amount of resin to be applied, and "Z" is the first resin composition RS1 to be applied to the first region AA1 (see [reference]). Figure 13D The amount of resin to be applied. The first resin composition RS1 to be applied to each of the first-1 unit region SUA1 and the first-2 unit region SUA2 (see...) Figure 13D The amount applied can refer to the amount of the first resin composition RS1 to be applied to the first region AA1 (see [reference]). Figure 13D When the amount of resin to be applied is 100 (for example, when the first resin composition RS1 to be applied to the first region AA1 (see...) Figure 13D The comparison value when the applied amount is 100.

[0132] refer to Figure 13C The first resin composition RS1 to be applied to the first region AA1 (see Figure 13D The amount Z applied can be constant. The first resin composition RS1 (see [reference]) to be applied to the first region AA1... Figure 13D When the application amount Z is 100 (for example, when the first resin composition RS1 to be applied to the first region AA1 (see...) Figure 13D When the application amount Z is 100, the application amount for each of the first unit regions SUA1 and SUA2 can be set. For example, the first resin composition RS1 to be applied to the first unit region SUA1 can be set (see [reference]). Figure 13D The amount of resin to be applied and the first resin composition RS1 to be applied to the first-second unit region SUA2 (see [reference]). Figure 13D The amount of resin to be applied. The first resin composition RS1 to be applied to the two first unit regions SUA1 and SUA2 (see...) Figure 13D The average amount applied can be less than that of the first resin composition RS1 to be applied to the first region AA1 (see [link]). Figure 13D The amount of ) applied. Here, the average amount of application can be calculated using Equation 1 as described previously.

[0133] Figure 13D and Figure 13EThis is a diagram illustrating the application of a first resin composition RS1 onto a substrate RP (S201) during the formation of an adhesive member according to one or more embodiments of the present disclosure. Figure 13E It corresponds to Figure 13D A sectional view of the section of line II-II'.

[0134] For example, in one or more embodiments, before applying the first resin composition, the substrate is converted into a bitmap consisting of pixels arranged along two orthogonal directions (e.g., DR1 and DR2). A second region surrounding the first region is divided into n first unit regions (SUA1 to SUAn), each containing a defined number of pixels and arranged sequentially from the first region toward the edge of the substrate. In a planar view, these unit regions may form a concentric or surrounding shape around the first region. A specific amount of the first resin composition is assigned to each unit region; the amounts may differ from each other and are generally less than the amount applied to the first region. The amount applied to each unit region (X1 to Xn) and the pixel count (A1 to An) are used to calculate the average amount applied using the following weighted formula: Formula 1 [(X1×A1)+···(Xn×An)]÷(A1+···An) When the amount applied to the first region is set to 100, the average value is typically between 50 and 85. For example, when the second region is divided into two unit regions (unit region 1-1 adjacent to and surrounding the first region (e.g., SUA1) and unit region 1-2 surrounding SUA1 (e.g., SUA2)), the application amounts X1 and X2 can be set differently, and their average value will be less than the application amount Z applied to the first region. Unit regions can also be defined by pixel distance, which refers to the number of pixels across their width in both directions. Figures 13B to 13E As shown in Table 1, this bitmap-based method enables precise control of the resin composition distribution, thereby enhancing the adhesion of the display device.

[0135] refer to Figure 13D and Figure 13E The first resin composition RS1 can be applied to the substrate RP to overlap with the first region AA1 and the second region AA2. The first resin composition RS1 can be provided to the substrate RP by inkjet printing. The first resin composition RS1 can be ejected from the first inkjet head IHD1 and provided to the substrate RP.

[0136] The first inkjet head IHD1 can be arranged on the upper part of the stage ST. The first inkjet head IHD1 can be arranged at a set or predetermined distance from the upper surface of the stage ST, so that a discharge process of discharging the first resin composition RS1 from the first inkjet head IHD1 onto the substrate RP can be performed.

[0137] The first inkjet head IHD1 may include a plurality of first nozzles NZ1. The plurality of first nozzles NZ1 may be arranged apart from each other at regular intervals along a direction. The plurality of first nozzles NZ1 may be arranged in a row. However, one or more embodiments are not limited thereto, and the plurality of first nozzles NZ1 may also be arranged in two or more rows. Each of the plurality of first nozzles NZ1 may discharge the first resin composition RS1 described herein and / or (multiple) inks toward the substrate RP. For example, the discharge direction of each of the plurality of first nozzles NZ1 may be perpendicular to the substrate RP. However, one or more embodiments are not limited thereto.

[0138] Each of the plurality of first nozzles NZ1 may include an outlet having a circular orifice shape. However, one or more embodiments are not limited thereto, and the shape of the outlet of each of the plurality of first nozzles NZ1 may vary. In some embodiments, the number and size of the plurality of first nozzles NZ1 included in the first inkjet head IHD1 may vary.

[0139] The plurality of first nozzles NZ1 included in the first inkjet head IHD1 can be independently controlled or selected by a control component or portion. By controlling the control component or portion, the discharge of the first resin composition RS1 by each of the first nozzles NZ1 is controlled or selected, thereby allowing the first resin composition RS1 and / or (multiple) inks to be applied to the substrate RP in a desired or suitable shape. In some embodiments, the first inkjet head IHD1 may also include a storage component or portion for storing the first resin composition RS1 to be discharged onto the substrate RP.

[0140] Let's refer to each other. Figures 13B to 13E The first resin composition RS1 can be applied to the first region AA1 and the second region AA2 according to a set application amount. When applying the first resin composition RS1, the first inkjet head IHD1 can discharge the first resin composition RS1 onto the first region AA1 and the second region AA2 while moving in the second direction DR2. However, one or more embodiments are not limited to this, and the first inkjet head IHD1 can also discharge the first resin composition RS1 while moving in the first direction DR1.

[0141] By controlling the amount of first resin composition RS1 ejected from the plurality of first nozzles NZ1 of the first inkjet head IHD1, the first resin composition RS1 can be applied to a first region AA1 of the substrate RP at a first application amount, and the first resin composition RS1 can be applied to a second region AA2 of the substrate RP at a second application amount. In one or more embodiments, the second application amount may be less than or less than the first application amount.

[0142] When the second region AA2 is divided into two or more first unit regions SUA1 and SUA2, the first resin composition RS1 can be applied according to a set application amount for each of the first unit regions SUA1 and SUA2. For example, the second region AA2 can be divided into a first-1 unit region SUA1 and a first-2 unit region SUA2, the first resin composition RS1 can be applied to the first-1 unit region SUA1 at the first-1 unit application amount, and the first resin composition RS1 can be applied to the first-2 unit region SUA2 at the first-2 unit application amount. In one or more embodiments, the first-1 unit application amount may be less than or less than the first-2 unit application amount. However, one or more embodiments are not limited thereto.

[0143] The first resin composition RS1 may have a viscosity of at least about 10 mPa·s (or higher) and at most about 30 mPa·s (or lower) at at least about 20°C (or higher) and at most about 30°C (or lower). For example, the first resin composition RS1 may have a viscosity of at least about 10 mPa·s (or higher) and at most about 30 mPa·s (or lower) at about 25°C. The viscosity of the first resin composition RS1 may be measured using the JIS K 2283 method. For example, in an embodiment, the temperature at stage ST may be at least about 20°C and at most about 30°C when forming the adhesive member.

[0144] If the viscosity of the first resin composition RS1 is less than about 10 mPa·s at a temperature ranging from about 20°C or higher to about 30°C or lower (e.g., when the viscosity of the first resin composition RS1 is less than about 10 mPa·s at a temperature ranging from about 20°C or higher to about 30°C or lower), the viscosity may be low, resulting in flow of the resin composition liquid provided for forming the adhesive member, and therefore, it may be difficult to form a coating film with a substantially uniform thickness using the first resin composition RS1. In some embodiments, if the viscosity of the first resin composition RS1 according to one or more embodiments is greater than about 30 mPa·s at a temperature ranging from about 20°C or higher to about 30°C or lower (e.g., when the viscosity of the first resin composition RS1 according to one or more embodiments is greater than about 30 mPa·s at a temperature ranging from about 20°C or higher to about 30°C or lower), it may be difficult to discharge the first resin composition RS1 from the application device for applying the first resin composition RS1 in an appropriate or suitable amount.

[0145] The first resin composition RS1 may also include at least one photoinitiator. In the case of multiple photoinitiators, the different photoinitiators can be activated by UV light in their respective different center wavelength ranges.

[0146] The photoinitiator may be selected from any one of 2,2-dimethoxy-1,2-diphenyl-1-ethyl ketone, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propanoyl)-benzyl]-phenyl}-2-methyl-1-propanone.

[0147] In some embodiments, the photoinitiator may be selected from 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholino-4-yl-phenyl)-but-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, etc. The resin composition according to one or more embodiments may include at least one of Omnirad TPO-H (IGM resin), Omnirad 819 (IGM resin), and Esacure 3644 (IGM resin) as a photoinitiator.

[0148] The first resin composition RS1 may also include additives as needed. General additives suitable for the relevant art may be appropriately or suitably selected as additives to control the desired or required properties of the first resin composition RS1. Examples may include light stabilizers, crosslinking agents, antioxidants, chain transfer agents, photosensitizers, polymerization inhibitors, leveling agents, surfactants, adhesives, plasticizers, UV absorbers, storage stabilizers, antistatic agents, inorganic fillers, pigments, dyes, etc., but this disclosure is not limited thereto. Additives may be used alone or as a mixture of two or more thereof.

[0149] Figure 13F This is a diagram illustrating the curing of a first resin composition RS1 during the formation of an adhesive member according to one or more embodiments of the present disclosure. Figure 13F It corresponds to Figure 13D A sectional view of the section of line II-II'.

[0150] refer to Figure 13FAfter the first resin composition RS1 is applied to the substrate RP, curing of the first resin composition RS1 can be performed. A first light L1 can be emitted onto the first resin composition RS1, which is provided to the substrate RP in liquid form. The first light L1 can be UV light, but this disclosure is not limited thereto. Because the first light L1 is provided to the first resin composition RS1, the first resin composition RS1 can be cured. In this specification, the first resin composition RS1 cured by the first light L1 can be referred to as the preliminary adhesive member P-AP (see [link to documentation]). Figure 13G For example, the first resin composition RS1 can be polymerized and then cured by a provided first light L1 to form a preliminary adhesive member P-AP (see...). Figure 13G ).

[0151] When curing the first resin composition RS1, the amount of the first light L1 emitted to the first resin composition RS1 can be sufficient to completely cure the first resin composition RS1. However, one or more embodiments are not limited to this, and then during the curing of the first resin composition RS1, the polymerization reaction of the first resin composition RS1 can be partially carried out, and then the unreacted first resin composition RS1 can undergo additional reaction in the step (e.g., action or task) of curing the second resin composition RS2, thereby forming the final adhesive member AP (see...). Figure 13J ).

[0152] The preliminary adhesive component P-AP (see [link]) is formed by curing the first resin composition RS1. Figure 13G The first resin composition RS1 provided to the first region AA1 and the second region AA2 may have different thicknesses. The first application amount of the first resin composition RS1 provided to the first region AA1 may be greater than the second application amount of the first resin composition RS1 provided to the second region AA2. Therefore, the average thickness of the preliminary adhesive member P-AP overlapping the first region AA1 may be greater than the average thickness of the preliminary adhesive member P-AP overlapping the second region AA2.

[0153] The first resin composition RS1 can be provided to the first region AA1 in a substantially uniform application amount. Therefore, the preliminary adhesive member P-AP overlapping the first region AA1 can have a substantially uniform thickness. If the preliminary adhesive member P-AP overlapping the first region AA1 is referred to as the first preliminary adhesive portion and the preliminary adhesive member P-AP overlapping the second region AA2 is referred to as the second preliminary adhesive portion (e.g., when the preliminary adhesive member P-AP overlapping the first region AA1 is referred to as the first preliminary adhesive portion and the preliminary adhesive member P-AP overlapping the second region AA2 is referred to as the second preliminary adhesive portion), the thickness deviation in the second preliminary adhesive portion can be greater than the thickness deviation in the first preliminary adhesive portion. The second region AA2 can be divided into a plurality of first unit regions SUA1 and SUA2, and the first resin composition RS1 can be applied in an application amount set for each of the plurality of first unit regions SUA1 and SUA2. Because the application amount to at least one of the plurality of first unit regions SUA1 and SUA2 differs from the application amount to the other first unit regions, it may result in a weight deviation in the provided liquid composition. Therefore, the thickness deviation on the second region AA2 may be greater than the thickness deviation on the first region AA1.

[0154] Figure 13G and Figure 13H This is a diagram illustrating the application of a second resin composition RS2 (S203) during the formation of an adhesive member according to one or more embodiments of the present disclosure. Figure 13H It corresponds to Figure 13G A sectional view of the section of line III-III'.

[0155] The second resin composition RS2 can be provided onto the substrate RP by inkjet printing. The second resin composition RS2 can be ejected from the second inkjet head IHD2 and provided onto the substrate RP.

[0156] The second inkjet head IHD2 can be arranged on the upper part of the stage ST. The second inkjet head IHD2 can be arranged at a set or predetermined distance from the upper surface of the stage ST, so that the discharge process of the second resin composition RS2 from the second inkjet head IHD2 onto the preliminary bonding member P-AP can be performed.

[0157] The second inkjet head IHD2 may include a plurality of second nozzles NZ2. The plurality of second nozzles NZ2 may be arranged apart from each other at regular intervals along a direction. The plurality of second nozzles NZ2 may be arranged in a row. However, one or more embodiments are not limited thereto, and the plurality of second nozzles NZ2 may also be arranged in about two or more rows. The plurality of second nozzles NZ2 may each discharge ink toward the substrate RP. For example, the discharge direction of each of the plurality of second nozzles NZ2 may be perpendicular to the substrate RP. However, one or more embodiments are not limited thereto.

[0158] Each of the plurality of second nozzles NZ2 may include an outlet having a circular orifice shape. However, one or more embodiments are not limited thereto, and the shape of the outlet of each of the plurality of second nozzles NZ2 may vary. In some embodiments, the number and size of each of the plurality of second nozzles NZ2 included in the second inkjet head IHD2 may vary.

[0159] The plurality of second nozzles NZ2 included in the second inkjet head IHD2 can be independently controlled or selected by a control component or portion. By controlling the control component or portion, the discharge of the second resin composition RS2 by each of the second nozzles NZ2 is controlled or selected, thereby allowing ink to be applied to the substrate RP in a desired or suitable shape. In some embodiments, although not shown in the figures, the second inkjet head IHD2 may also include a storage component or portion for storing the second resin composition RS2 to be discharged onto the substrate RP.

[0160] refer to Figure 13G and Figure 13H The second resin composition RS2 can be applied to the preliminary adhesive member P-AP to overlap with the second region AA2 of the substrate RP. The second resin composition RS2 can be applied to the preliminary adhesive member P-AP to overlap with the second region AA2 of the substrate RP. When applying the second resin composition RS2, it can be applied only to the second region AA2 and may not be applied to the first region AA1. That is, when applying the second resin composition RS2, the second resin composition RS2 applied to the substrate RP may not overlap with the first region AA1.

[0161] When applying the second resin composition RS2, it may be applied to the second region AA2 in a third application amount. The third application amount may be appropriately or suitably set taking into account the desired or suitable thickness of the initial bonded member P-AP. In one or more embodiments, the third application amount may be less than the previously described first application amount. For example, if the application amount of the first resin composition RS1 to be applied to the first region AA1 when applying the first resin composition RS1 is 100 (e.g., when the application amount of the first resin composition RS1 to be applied to the first region AA1 when applying the first resin composition RS1 is 100), the application amount of the second resin composition RS2 to be applied to the second region AA2 when applying the second resin composition RS2 may be less than about 100.

[0162] As the second inkjet head IHD2 moves along the second direction DR2 on the substrate RP, the second resin composition RS2 can be applied to the second region AA2. If the second inkjet head IHD2 faces the first region AA1 and the second region AA2 as it moves along the second direction DR2 (e.g., when the second inkjet head IHD2 faces the first region AA1 and the second region AA2 as it moves along the second direction DR2), the second resin composition RS2 can be applied to the second region AA2 according to a previously set application amount. By applying the second resin composition RS2 to the second region AA2, thickness deviations in the initial bonding member P-AP can be reduced.

[0163] The second resin composition RS2 may have a viscosity of at least about 10 mPa·s (or higher) and at most about 30 mPa·s (or lower) at at least about 20°C (or higher) and at most about 30°C (or lower). For example, the second resin composition RS2 may have a viscosity of about 10 mPa·s or higher and about 30 mPa·s or lower at about 25°C. The viscosity of the second resin composition RS2 may be measured using the JIS K 2283 method.

[0164] If the viscosity of the second resin composition RS2 is less than about 10 mPa·s at a temperature ranging from about 20°C or higher to about 30°C or lower (e.g., when the viscosity of the second resin composition RS2 is less than about 10 mPa·s at a temperature ranging from about 20°C or higher to about 30°C or lower), the viscosity may be low, resulting in flow of the resin composition liquid provided for forming the adhesive member, and therefore, it may be difficult to form a coating film with a substantially uniform thickness using the second resin composition RS2. In some embodiments, if the viscosity of the second resin composition RS2 according to one or more embodiments is greater than about 30 mPa·s at a temperature ranging from about 20°C or higher to about 30°C or lower (e.g., when the viscosity of the second resin composition RS2 according to one or more embodiments is greater than about 30 mPa·s at a temperature ranging from about 20°C or higher to about 30°C or lower), it may be difficult to discharge the second resin composition RS2 from the application device for applying the second resin composition RS2 in an appropriate or suitable amount.

[0165] The second resin composition RS2 may further include at least one photoinitiator. In the case of multiple photoinitiators, the different photoinitiators can be activated by UV light in their respective different center wavelength ranges. The content (e.g., amount) previously described for the first resin composition RS1 can be applied equally to the photoinitiator. In some embodiments, the second resin composition RS2 may further include additives as needed. The content (e.g., amount) previously described for the first resin composition RS1 can be applied equally to the additives.

[0166] In one or more embodiments, the first resin composition RS1 and the second resin composition RS2 may be the same. In some embodiments, the first inkjet head IHD1 that discharges the first resin composition RS1 and the second inkjet head IHD2 that discharges the second resin composition RS2 may be the same. However, one or more embodiments are not limited thereto.

[0167] Figure 13I and Figure 13J This is a diagram illustrating the curing of a second resin composition RS2 to form an adhesive member AP during the formation of an adhesive member (S204) according to one or more embodiments of the present disclosure. Figure 13K It corresponds to Figure 13J A sectional view of the section along line IV-IV'.

[0168] refer to Figure 13I and Figure 13JAfter the second resin composition RS2 is applied, curing of the second resin composition RS2 can be performed. A second light L2 can be emitted onto the second resin composition RS2 provided to the substrate RP. The second light L2 can be UV light, but this disclosure is not limited thereto. Because the second light L2 is provided to the second resin composition RS2, the second resin composition RS2 can be cured. The second resin composition RS2 can be polymerized and then cured by the provided second light L2 to form an adhesive member AP together with the initial adhesive member P-AP (see...). Figure 13J ). Figure 13I An example is shown in which the second light L2 is emitted to both the first region AA1 and the second region AA2 (e.g., simultaneously to the first region AA1 and the second region AA2), but one or more embodiments are not limited thereto, and the second light L2 may be selectively emitted only to the second region AA2 depending on the degree of curing of the initial adhesive member P-AP.

[0169] refer to Figure 13J and Figure 13K The adhesive member AP may include a first adhesive portion overlapping a first region AA1 and a second adhesive portion overlapping a second region AA2. The adhesive member AP may have a flat upper surface on the first adhesive portion. The adhesive member AP may have a peak portion PK in the second adhesive portion, where the thickness on the third-direction DR3 towards the edge of the adhesive member AP becomes maximum at the peak portion PK. The peak portion PK may refer to the portion overlapping the second region AA2, and specifically to the portion from the lower surface AP-LF of the adhesive member AP adjacent to the substrate RP to the upper surface AP-UF of the adhesive member AP spaced apart from and / or separated from the substrate RP (e.g., spaced apart or separated) with a maximum height h. m In the adhesive member AP according to one or more embodiments, the thickness of the adhesive member AP on the third-direction DR3 gradually decreases from the peak portion PK towards the edge. In this specification, the portion of the second adhesive portion where the thickness decreases from the peak portion PK towards the edge can be referred to as a ramp.

[0170] The horizontal distance d from the edge of the adhesive component AP to the peak portion PK p It can be approximately 600 μm or smaller. For example, the horizontal distance d from the edge of the adhesive component AP to the peak portion PK. p It can be at least about 300 micrometers (μm) (or larger) and at most about 600 μm (or smaller). The horizontal distance d from the edge to the peak portion PK p This can refer to the shortest distance measured between the first dashed line LN extending from the peak portion PK towards DR3 on the third side and the edge of the adhesive member AP. If the horizontal distance d from the edge of the adhesive member AP to the peak portion PK is... pIncrease (e.g., when the horizontal distance d from the edge of the adhesive member AP to the peak portion PK) p When increased), the ramp may originate from display devices DD, DD-a, and DD-b (see...). Figure 1 , Figure 3 and Figure 5 The external visibility of the image reduces the quality of the film.

[0171] According to one or more embodiments of this disclosure, in a method of applying a resin composition by inkjet printing, two application processes are introduced, and the amount of resin composition applied is controlled or selected according to the region, thereby exhibiting the effect of reducing the length of the slope formed on the adhesive member (the horizontal distance dp from the edge of the adhesive member AP to the peak portion PK) to a certain range.

[0172] Figures 14A to 14C This is a diagram illustrating some steps of a method for manufacturing a display device according to one or more embodiments of the present disclosure. Figures 14A to 14C This diagram schematically illustrates the steps (e.g., actions or tasks) of forming an adhesive member according to one or more embodiments of the present disclosure. In the following description of a method of manufacturing a display device according to one or more embodiments of the present disclosure, reference will be made to... Figures 14A to 14C The same reference numerals or symbols are given to substantially the same parts as those previously described, and no detailed description of them is provided.

[0173] Figures 14A to 14C The manufacturing method and reference shown are for a display device. Figures 13A to 13K The difference in the described method of manufacturing a display device lies in the manner in which the second resin composition RS2 is applied to the second region AA2 during the application of the second resin composition RS2.

[0174] refer to Figures 14A to 14C Before applying the second resin composition RS2 to the initial adhesive member P-AP, the method may further include forming the substrate RP into a second bitmap, dividing the second region AA2 into two or more second unit regions SUB1 and SUB2 on the second bitmap, and setting the application amount of the second unit regions SUB1 and SUB2. In a method of manufacturing a display device according to one or more embodiments, where forming the substrate RP into a second bitmap is further included, the first region AA1 and the second region AA2 of the substrate RP may be reset based on the number of pixels PX included in the second bitmap.

[0175] refer to Figure 14AThe substrate RP can be formed into a second bitmap comprising a plurality of pixels PX arranged along a first direction DR1 and a second direction DR2. When forming the second bitmap, the substrate RP can be divided into "p" pixels PX arranged along the first direction DR1 and "q" pixels PX arranged along the second direction DR2. Therefore, the substrate RP can be divided into "p×q" pixels PX arranged along the first direction DR1 and the second direction DR2. Figure 14A In this context, "p" and "q" can be equal to the previous reference values, respectively. Figure 13B The terms “m” and “g” are described. “p” and “q” can be positive integers. For example, the total number of pixels PX on the second bitmap can be equal to the total number of pixels PX on the first bitmap described earlier. However, one or more implementations are not limited thereto.

[0176] The "p" pixels PX arranged along the first direction DR1 can have the same width in the first direction DR1, and the "q" pixels PX arranged along the second direction DR2 can have the same width in the second direction DR2, but one or more embodiments are not limited thereto. The length of the substrate RP in the first direction DR1 can be approximately p times the length of the pixel PX in the first direction DR1. The length of the substrate RP in the second direction DR2 can be approximately q times the length of the pixel PX in the second direction DR2.

[0177] Figure 14A The illustration shows that, when forming the second bitmap, the substrate RP is divided into approximately 15 pixels PX in the first direction DR1 and approximately 23 pixels PX in the second direction DR2, but one or more embodiments are not limited thereto. The number of pixels PX and the lengths of the pixels PX in the first direction DR1 and the second direction DR2, respectively, set for forming the substrate RP into the second bitmap can be appropriately or suitably adjusted according to processing conditions, the resolution of the inkjet printer, etc.

[0178] After forming the substrate RP into a second bitmap comprising "p×q" pixels PX, the second region AA2 can be divided into two or more second unit regions SUB1 and SUB2. The second region AA2 can be divided into multiple second unit regions SUB1 and SUB2 with different application amounts of the second resin composition RS2. The multiple second unit regions SUB1 and SUB2 can each be arranged on the boundary of the substrate RP and can each have a shape in a plane surrounding (e.g., around) the first region AA1. The multiple second unit regions SUB1 to SUB2 can each have a closed line shape in a plane surrounding (e.g., around) the first region AA1.

[0179] like Figure 14AAs shown, the second region AA2 can be divided into a second-first unit region SUB1 and a second-second unit region SUB2. The second-first unit region SUB1 can be adjacent to the first region AA1. In the plane, the second-first unit region SUB1 can surround the first region AA1. The second-second unit region SUB2 can be separated from and / or isolated from the first region AA1 (e.g., spaced apart or separated), and the second-first unit region SUB1 is located between the second-second unit region SUB2 and the first region AA1. In the plane, the second-second unit region SUB2 can surround the second-first unit region SUB1. Figure 14A The second region AA2 is shown to be divided into two second unit regions SUB1 and SUB2, but one or more embodiments are not limited thereto, and the second region AA2 may also be divided into three or more second unit regions.

[0180] In one or more embodiments, the second unit regions SUB1 and SUB2 can each be distinguished by a pixel distance. "Pixel distance" can refer to the number of pixels PX included in the width distance of each unit region. The width of each unit region can refer to the width in the first direction DR1 and the width in the second direction DR2. In each unit region, the number of pixels PX included in the width distance in the first direction DR1 and the number of pixels PX included in the width distance in the second direction DR2 can be equal to each other. For example, Figure 14A The second-1 unit region SUB1 shown may include one pixel PX in its width distance along the first direction DR1 and the second direction DR2, and in this case, the pixel distance of the second-1 unit region SUB1 may be 1. In some embodiments, Figure 14A The second-2 unit region SUB2 shown can include one pixel PX in the width distance in the first direction DR1 and the second direction DR2 respectively, and in this case, the pixel distance of the second-2 unit region SUB2 can be 1.

[0181] refer to Figure 14A and Figure 14B After dividing the second region AA2 into two or more second unit regions SUB1 and SUB2 on the second bitmap, the application amount of the second resin composition RS2 on the first region AA1 and the second unit regions SUB1 and SUB2 can be set. The application amount for each of the second unit regions SUB1 and SUB2 can be set such that the application amount of the second resin composition RS2 to be applied to the second unit regions SUB1 and SUB2 is less than the application amount of the first resin composition RS1 to be applied to the first region AA1 (see [link to documentation]). Figure 13DThe amount of resin composition RS2 applied to the second unit regions SUB1 and SUB2 can be set to be less than the amount of resin composition RS1 applied to the first region AA1 (see [reference]). Figure 13D The amount of the second resin composition RS2 applied to each of the plurality of second unit regions SUB1 and SUB2 may refer to the amount applied when the first resin composition RS1 (see [reference]) is applied. Figure 13D When the first resin composition RS1 to be applied to the first region AA1 (see) Figure 13D When the amount of ) applied is 100 (for example, when the first resin composition RS1 (see) is applied), Figure 13D When the first resin composition RS1 to be applied to the first region AA1 (see) Figure 13D The comparison value when the applied amount is 100.

[0182] When the amount of the first resin composition RS1 to be applied to the first region AA1 is 100 when the first resin composition RS1 is applied (for example, when the amount of the first resin composition RS1 to be applied to the first region AA1 is 100 when the first resin composition RS1 is applied), the application amount for each of the plurality of second unit regions SUB1 and SUB2 can be set. For example, the application amount of the second resin composition RS2 to be applied to the second-1 unit region SUB1 and the application amount of the second resin composition RS2 to be applied to the second-2 unit region SUB2 can be set respectively.

[0183] As shown in Table 2, on the second bitmap, the second region AA2 can be divided into two or more second unit regions SUB1, ..., and SUBm, and the application amount of the second resin composition RS2 for each of the multiple second unit regions SUB1, ..., and SUBm can be set. Here, the application amount for each of the multiple second unit regions SUB1, ..., and SUBm refers to the amount applied to the first resin composition RS1 of the first region AA1 (see Table 2). Figure 13D When the amount of ) applied is 100 (for example, when the first resin composition RS1 of the first region AA1 is applied to the first region AA1 (see Figure 13D When the applied amount is 100, the comparison amount is applied to each of the multiple second unit regions SUB1, ... and SUBm.

[0184] Table 2

[0185] Referring to Table 2, the second region AA2 can be divided into m second unit regions SUB1, ..., SUBm. In Table 2, m can be an integer of 2 or greater. In this specification, the first second unit region SUB1 to the m-th second unit region SUBm can be referred to as the (2-1)-2-m unit regions, respectively. For example, if m is 2 (e.g., when m is 2), then the first second unit region SUB1 can refer to the (2-1)-2 unit region, and the second second unit region SUB2 can refer to the (2-2)-2 unit region. See also... Figure 14A According to Table 2, m second unit regions SUB1, ..., SUBm can be arranged sequentially in one direction from the first region AA1 toward the edge portion of the substrate RP. For example, if m is 2 (e.g., when m is 2), then the 2-1 unit region SUB1 and the 2-2 unit region SUB2 can be arranged sequentially in one direction from the first region AA1 toward the edge portion of the substrate RP. The m second unit regions SUB1, ..., SUBm can each have a closed line shape in the plane surrounding (e.g., around) the first region AA1.

[0186] Each of the m second unit regions SUB1, ..., SUBm can include a set or predetermined number of pixels PX. In Table 2, B1, ..., and Bm can refer to the number of pixels PX included in the m second unit regions SUB1, ..., and SUBm, respectively.

[0187] The application amounts Y1, ..., Ym of the second resin composition RS2 can be set separately for each of the m second unit regions SUB1, ..., SUBm. At least one of the application amounts Y1, ..., Ym of the m second unit regions SUB1, ..., SUBm can have a value different from the others. For example... Figure 14A As shown, in the case where the second region AA2 includes two second unit regions, the application amount Y1 of the second-1 unit region SUB1 corresponding to the first second unit region and the application amount Y2 of the second-2 unit region SUB2 corresponding to the second second unit region can be different from each other.

[0188] In one or more embodiments, if the first resin composition RS1 (see [reference]) is applied to the first region AA1... Figure 13D The amount of ) applied is 100 (for example, when the first resin composition RS1 (see) is applied to the first region AA1). Figure 13D When the application amount is 100), the average application amount of the second resin composition RS2 to the multiple second unit regions SUB1 and SUB2 can be less than that of the first resin composition RS1 to the first region AA1 (see...). Figure 13D The amount of resin composition RS1 applied to the first region AA1 (see [reference]). Figure 13D The amount of ) applied is 100 (for example, when the first resin composition RS1 (see) is applied to the first region AA1). Figure 13D When the application amount is 100), the average application amount of the second resin composition RS2 to the m second unit regions SUB1, ... and SUBm can be less than that of the first resin composition RS1 to the first region AA1 (see...). Figure 13D The amount of resin composition RS2 applied to the second unit regions SUB1, ... and SUBm can be calculated using Equation 2.

[0189] Formula 2

[0190] [(Y1×B1)+···(Yn×Bm)]÷(B1+···Bm)

[0191] In Equation 2, Y1...Yn are each independently the first resin composition RS1 to be applied to the first region AA1 (see Equation 2). Figure 13D When the amount of resin to be applied is 100 (for example, when the first resin composition RS1 to be applied to the first region AA1 (see...) Figure 13D When the application amount of ) is 100), it refers to the application amount of the second resin composition RS2 to the first second unit region SUB1 to the m-th second unit region SUBm. For example, the application amount of the second resin composition RS2 to each of the first second unit region SUB1 to the m-th second unit region SUBm may refer to the application amount of the first resin composition RS1 to be applied to the first region AA1 (see Figure 13D When the amount of resin to be applied is 100 (for example, when the first resin composition RS1 to be applied to the first region AA1 (see...) Figure 13D The comparison value when the applied amount is 100.

[0192] In Equation 2, B1... and Bm can each independently refer to the number of pixels PX in the first second unit region SUB1 to the m-th second unit region SUBm.

[0193] In Equation 2, m is an integer of 2 or greater.

[0194] Refer again Figure 14B and Figure 14CThe second resin composition RS2 can be applied to the initial bonding member P-AP to overlap with the second region AA2. When applying the second resin composition RS2, it can be applied to the second region AA2 according to a set application amount. While applying the second resin composition RS2, the second inkjet head IHD2 can discharge the second resin composition RS2 onto the second region AA2 while moving in the second direction DR2. However, one or more embodiments are not limited to this, and the second inkjet head IHD2 can also discharge the second resin composition RS2 while moving in the first direction DR1.

[0195] The second region AA2 can be divided into two or more second unit regions SUB1 and SUB2, and the second resin composition RS2 can be applied to each of the second unit regions SUB1 and SUB2 according to its set application amount. For example, the second region AA2 can be divided into a second-1 unit region SUB1 and a second-2 unit region SUB2, the second resin composition RS2 can be applied to the second-1 unit region SUB1 at the second-1 unit application amount, and the second resin composition RS2 can be applied to the second-2 unit region SUB2 at the second-2 unit application amount. In one or more embodiments, the second-1 unit application amount can be different from the second-2 unit application amount. For example, the second-1 unit application amount can be greater than the second-2 unit application amount.

[0196] Following this, in conjunction with previous references Figures 13H to 13K In essentially the same method described, the provided second resin composition RS2 can be cured to form the adhesive member AP (see...). Figure 13J ).

[0197] Terms such as “substantially,” “about,” and “approximately” are used as relative terms rather than as terms of degree, and are intended to explain the inherent bias in the measured or calculated values ​​that would be recognized by a person skilled in the art. Given the limitations and errors associated with the measurement of a quantity, they may include the value and an acceptable range of deviation as determined by a person skilled in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value.

[0198] The numerical ranges disclosed herein include, and are intended to include, all subranges containing the same numerical precision. For example, the range “1.0 to 10.0” includes all subranges having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Therefore, the applicant reserves the right to amend this specification (including the claims) to expressly describe any subranges contained within the ranges expressly recited herein.

[0199] The display device, electronic device, means of manufacture thereof, and / or any other related device or component described herein according to embodiments of this disclosure can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuit), software, or a combination of software, firmware, and hardware. For example, one or more suitable components of the display device and / or electronic device can be formed on an integrated circuit (IC) chip or on a separate IC chip. Furthermore, one or more suitable components of the device(s) can be implemented on a flexible printed circuit film, tape-on-a-carrier (TCP), printed circuit board (PCB), or formed on a substrate. Additionally, one or more suitable components of the device(s) can be processes or threads that run on one or more processors in one or more computing devices, execute computer program instructions, and interact with other system components for performing one or more suitable functions described herein. The computer program instructions are stored in memory implemented in the computing device using standard memory devices, such as, for example, random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media such as, for example, CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that, without departing from the scope of the embodiments of this disclosure, the functions of one or more suitable computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices.

[0200] In the following description, with reference to examples and comparative examples, an adhesive member according to one or more embodiments and a display device according to one or more embodiments of the present disclosure are described in more detail. In some embodiments, the following examples are intended to aid in understanding the present disclosure, and the scope of the present disclosure is not limited thereto.

[0201] Example

[0202] 1. Preparation of curable liquid resin compositions

[0203] Resin compositions for each of the Examples and Comparative Examples were prepared according to the mixing ratios listed in Table 3. The compositional materials of the resin compositions were supplied to a heat-resistant and light-shielding container at the weight ratios shown in Table 3, and then Omnirad 819 as a photoinitiator was supplied in an amount of approximately 2 wt% based on 100 wt% of the total (total) amount of the resin composition. Subsequently, the supplied material was stirred at approximately 100 rpm for approximately 1 hour at room temperature using a planetary centrifugal mixer (a product of SHASHIN KAGAKU CO., LTD) to obtain a curable resin composition. The obtained curable resin composition had a viscosity of approximately 13 mPa·s at approximately 25°C. The viscosity of the resin composition was measured at approximately 25°C using a JIS K 2283, and the viscosity of the liquid photocurable resin composition was measured at approximately 10 rpm using a viscometer (TVE-25L, a product of Tokisangyo).

[0204] Table 3

[0205] Abbreviation for materials used as components in resin compositions

[0206] The references to each of the components listed in Table 3 for preparing the resin composition are as follows.

[0207] UF-C051: Kyoisha Chemical Co., Ltd., Polyurethane Acrylates

[0208] UF-C052: Kyoei Chemical Co., Ltd., Polyurethane Acrylates

[0209] UN6304: Negami Chemical Industrial Co., Ltd., Polyurethane Acrylates

[0210] 4-HBA: Osaka Organic Chemical Industry Ltd., 4-Hydroxybutyl acrylate

[0211] 2-EHA: Toagosei Co., LTD., 2-Ethylhexyl acrylate

[0212] THF-A: Kyoei Chemical Co., Ltd., Tetrahydrofurfuryl acrylate

[0213] EHDG-AT: Kyoesha Chemical Co., Ltd., 2-Ethylhexyl-diethylene glycol acrylate

[0214] 2. Manufacturing and evaluation of bonded components

[0215] Create applied pattern

[0216] In the examples and comparative examples, the application pattern for the first application process was created according to the method given in Table 1 previously described and is listed in Table 4, and the application pattern for the second application process was created according to the method given in Table 2 previously described and is listed in Table 5. A monochrome bitmap file of approximately 550 pixels × approximately 25,500 pixels was created on the target substrate, and the application amount for each of the cell regions was set. The resin composition used in each of the first and second application processes corresponds to the resin composition prepared by the preparation of the curable liquid resin composition previously described. The settings for each cell region were determined and executed based on the number of pixels at the boundary portions of the bitmap file. The average application amount for the first cell regions SUA1, SUA2, SUA3, and SUA4 was calculated using Equation 1 previously described and is listed in Table 4. In Tables 4 and 5, 100% application amount refers to approximately 58 grams per square inch (g / inch). 2 ), and 10% application rate refers to approximately 5.8 g / inch. 2 .

[0217] Table 4 lists the application amount to the first region AA1 in the first application process, as well as the application amount and pixel distance value for each of the first unit regions SUA1, SUA2, SUA3, and SUA4. Table 5 lists the application amount to the first region AA1 in the second application process, as well as the application amount and pixel distance value for each of the second unit regions SUB1 and SUB2. As previously described, "pixel distance" refers to the number of pixels included in the width distance of each unit region. The total number of pixels included in the first unit regions SUA1, SUA2, SUA3, and SUA4, divided based on pixel distance, is used for the calculation of Equation 1, thereby deriving the resulting value. The number of pixels in the first region AA1 in the first application process corresponds to the value obtained by subtracting the sum of the number of pixels in the first unit regions SUA1, SUA2, SUA3, and SUA4 from the total number of pixels. The number of pixels in the first region AA1 in the second application process corresponds to the value obtained by subtracting the sum of the number of pixels in the second unit regions SUB1 and SUB2 from the total number of pixels.

[0218] Manufacturing of adhesive components

[0219] To manufacture the adhesive components according to each of the examples and comparative examples, a DevicePrinter-CX (MicroJet Technology Co.,LTD) equipped with a KM1024i (Konica Minolta, Inc) inkjet unit was used. The voltage, pulse drive cycle, and temperature were adjusted under discharge conditions of at least about 5.5 m / s (e.g., or greater) and at most about 6.5 m / s (e.g., or less). The resolution was set to about 360 dots per inch (dpi) × about 5400 dpi, and the application conditions were set to the set application amount using the application patterns in Tables 4 and 5. Application was then performed on a PET film (SK Chemicals SH86) washed using an atmospheric pressure plasma treatment machine.

[0220] Table 4

[0221] Table 5

[0222] Evaluation of the shape of the coating on the bonded component

[0223] The shape of the coating on the bonded components after curing according to Examples 1 to 3 and Comparative Examples 1 to 3 was evaluated, and the results are listed in Table 6. The shape of the coating on the bonded components according to Examples 1 to 3 and Comparative Examples 1 to 3 was evaluated as follows.

[0224] The shape of the coating of the photocurable resin composition applied to a PET film was measured using a Keyence laser microscope (VK-X3000). The distance in the horizontal direction from the edge of the formed adhesive member to the peak portion on the boundary of the adhesive member was measured, and the distances are listed in Table 6. The results obtained from measuring the distance in the horizontal direction were rounded to the first decimal place, and the "edge-peak distance" was measured.

[0225] Table 6

[0226] Referring to the results listed in Table 6, it can be seen that the edge-to-peak distance values ​​measured according to Examples 1 to 3 are at most about 600 micrometers (μm) (e.g., or less). In contrast, according to Comparative Examples 1 to 3, the edge-to-peak distance values ​​are greater than about 600 μm. Comparing Examples 1 and 2 with Comparative Examples 1 and 2, it can be seen that the edge-to-peak distance values ​​of Comparative Examples 1 and 2 are significantly increased compared to the edge-to-peak distance values ​​of Examples 1 and 2. In Comparative Example 1, unlike Example 1, the second application process is not included, and in Comparative Example 2, unlike Example 2, the second application process is not included. Without the second application process, as in Comparative Examples 1 and 2, the region with increased thickness around the boundary of the adhesive member is formed more inward, such that the length of the slope (the horizontal distance from the edge of the adhesive member to the peak portion) may increase. In inkjet processes, the film thickness can gradually decrease towards the boundary of the ink discharge region, and the thickness can increase again due to the dispersion of the solution around the boundary, thereby forming a region of increased thickness. Therefore, the resulting thickness increase region can correspond to the peak portion. As in Comparative Examples 1 and 2, when the thickness increase region is formed more inward, the curved slope of the adhesive member can be seen from the outside of the display device, resulting in a deterioration in film quality. In contrast, according to the example, since two application processes are performed in the process of applying the resin composition by inkjet printing, and the amount of resin composition to be applied is controlled or selected according to the region, the length of the slope formed on the edge portion of the adhesive layer can be reduced, thereby improving the durability and reliability of the display device.

[0227] Comparing Examples 1 to 3 with Comparative Example 3, it can be seen that the "edge-peak distance" value of Comparative Example 3 is increased compared to the "edge-peak distance" values ​​of Examples 1 to 3. Comparative Example 3 corresponds to the case where the resin composition is applied to the first region AA1 only in both the first and second application processes. In Comparative Example 3, because the amount applied around the boundary of the substrate is relatively small in both application processes, the "edge-peak distance" value can be reduced compared to Comparative Examples 1 and 2, which do not include the second application process. However, even if the resin composition is applied to the central portion of the substrate instead of the portion around the boundary of the substrate, it is insufficient to control the flow of the resin composition, and therefore, it can be seen that the "edge-peak distance" value of Comparative Example 3 is increased compared to the "edge-peak distance" values ​​of Examples 1 to 3.

[0228] The liquid resin composition applied to the substrate can be dispersed on the substrate and can form a film thickness. Therefore, the resin composition supplied to the target substrate also flows from the boundary portion of the substrate toward the outside of the substrate, which may cause the thickness at the boundary portion of the substrate to become uneven, and the boundary shape of the adhesive member may become unclear. According to this disclosure, because two application processes are performed in the process of applying the resin composition by inkjet printing, and the amount of resin composition to be supplied is controlled or selected according to the region, the adhesive member can have a good or suitable film thickness distribution at the boundary portion of the target substrate. In some embodiments, the thickness shape of the adhesive member at the boundary portion can be easily controlled or selected without using additional structures, thereby improving process efficiency.

[0229] In a method for manufacturing a display device according to one or more embodiments, a thin film having a good or suitable film thickness distribution around the boundary of a target substrate can be formed.

[0230] An electronic device according to one or more embodiments may include an adhesive member in which the shape of the shape around a boundary is controlled or selected, thereby exhibiting excellent or suitable adhesive reliability.

[0231] In the foregoing description, reference has been made to one or more embodiments of the present disclosure. However, it will be understood by those skilled in the art or those of ordinary skill in the art that one or more appropriate modifications and changes may be made to the present disclosure, provided that such modifications and changes do not depart from the spirit and technical scope of the present disclosure as set forth in the appended claims.

[0232] In the context of this application and unless otherwise specified, the terms “use,” “using,” and “used” may be considered synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively.

[0233] In view of the entire contents of this disclosure, those skilled in the art will understand that each suitable feature of one or more suitable embodiments of this disclosure may be combined in part or in whole, or combined with each other, and may be technically interlocked and operated in one or more suitable ways, and each embodiment may be implemented independently of each other or in combination with each other in any suitable way, unless otherwise stated or implied.

[0234] Therefore, the technical scope of this disclosure is not limited to what is stated in the detailed description of the specification, but should be determined by the claims and their equivalents.

Claims

1. A method for manufacturing a display device, comprising: A substrate is applied on a stage, the substrate comprising a first region and a second region surrounding the first region; as well as An adhesive member is formed on the substrate. The adhesive component comprises: The first resin composition is applied to the substrate to overlap with the first region and the second region; Provide first light to cure the first resin composition; Apply the second resin composition onto the cured first resin composition to overlap with the second region; and Provide a second light to cure the second resin composition. Each of the first resin composition and the second resin composition has a viscosity of at least 10 mPa·s and at most 30 mPa·s at 25°C.

2. The method according to claim 1, wherein, When the first resin composition is applied The first amount of the first resin composition to be applied to the first region is greater than the second amount of the first resin composition to be applied to the second region.

3. The method according to claim 1, wherein, The second region is divided into at least two first unit regions, each having a different amount of the first resin composition applied.

4. The method according to claim 3, wherein, The second region is divided into: The first-1 unit region is adjacent to and surrounds the first region; and The first-second unit region is spaced apart from the first region and surrounds the first-first unit region. Wherein, the first-1 unit region is located between the first region and the first-2 unit region, and The amount of the first resin composition to be applied to the first unit region is less than the amount of the first resin composition to be applied to the first unit region.

5. The method according to claim 3, wherein, Before applying the first resin composition, forming the adhesive member further includes: The substrate is formed as a bitmap comprising m pixels in a first direction and g pixels in a second direction intersecting the first direction, wherein m and g are positive integers; Divide the second region into at least two first unit regions on the bitmap; and The amount of the first resin composition applied to each of the first region and the first unit region is set. The average amount of the first resin composition applied to the first unit region is calculated using Formula 1, and is at least 50 and at most 85: Formula 1 [(X1×A1)+···(Xn×An)]÷(A1+···An) In Equation 1, X1 to Xn are each independently the amount of the first resin composition applied to the first unit region to the nth first unit region when the amount of the first resin composition to be applied to the first region is 100, and A1 to An are each independently the number of pixels in the first first unit region to the nth first unit region, and n is an integer of 2 or greater.

6. The method according to claim 1, wherein, Before applying the second resin composition, forming the adhesive member further includes: The substrate is formed as a bitmap comprising p pixels in a first direction and q pixels in a second direction intersecting the first direction, wherein p and q are positive integers; Divide the second region into at least two second unit regions on the bitmap; and The amount of the second resin composition applied to each of the second unit regions is set.

7. The method according to claim 6, wherein, Each second unit region includes: The second-1 unit region is adjacent to and surrounds the first region; and The second-2nd unit region is spaced apart from the first region and surrounds the second-1st unit region. Wherein, the second-1st unit region is located between the first region and the second-2nd unit region, and The amount of the second resin composition to be applied to the second-1 unit region is different from the amount of the second resin composition to be applied to the second-2 unit region.

8. The method according to claim 7, wherein, The amount of the second resin composition to be applied to the second-1 unit region is greater than the amount of the second resin composition to be applied to the second-2 unit region.

9. The method according to claim 1, wherein, The adhesive member includes a peak portion overlapping the second region, and in the thickness direction, the height from the lower surface to the upper surface of the adhesive member is greatest at the peak portion. The horizontal distance from the edge of the adhesive member to the peak portion is at least 300 μm and at most 600 μm.

10. The method according to claim 1, wherein, When forming the adhesive member, the temperature at the stage is at least 20°C and at most 30°C.

11. The method according to claim 1, wherein, The first resin composition and the second resin composition are applied by inkjet printing.

12. The method according to claim 1, wherein, The second region has a width of up to 3 mm.

13. The method according to claim 1, wherein, When the second resin composition is applied, the second resin composition applied to the substrate does not overlap with the first region.

14. An electronic device comprising: The display panel includes a first area and a second area surrounding the first area; Window, on the display panel; as well as An adhesive component is provided between the display panel and the window, and comprises a resin composition having a viscosity of at least 10 mPa·s and at most 30 mPa·s at 25°C. The adhesive member includes a peak portion overlapping the second region, and in the thickness direction, the height from the lower surface to the upper surface of the adhesive member is greatest at the peak portion. The horizontal distance from the edge of the adhesive member to the peak portion is at least 300 μm and at most 600 μm.

15. The electronic device according to claim 14, wherein, The electronic device is selected from large-scale display devices and small-to-medium-scale display devices. The large-scale display devices include televisions, monitors, and outdoor billboards, while the small-to-medium-scale display devices include personal computers, laptop computers, personal digital assistants, display devices for vehicles, game consoles, portable electronic devices, cameras, and combinations thereof.

16. The electronic device according to claim 14, wherein, The electronic device also includes at least one of a processor, a memory, and a power module.

Images