Graphene film, graphene film module and electronic equipment

Abstract

According to the graphene film, the graphene film module and the electronic equipment carrying the graphene film or the graphene film module, the graphene film or the graphene film module can emit heat in a power-on state and dissipate heat in a power-off state, and the graphene film or the graphene film module can emit heat in a power-off state; therefore, the heating requirement of the electronic equipment when the electronic equipment is used in a low-temperature environment and the heat dissipation requirement of the electronic equipment when the electronic equipment is used with high power consumption are met.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, and in particular to a graphene film, a graphene module, and an electronic device. Background Technology

[0002] Modern electronic products primarily use lithium batteries. Lithium batteries typically operate within a temperature range of -20°C to 60°C, but their optimal operating temperature is generally 0-40°C. Data analysis shows that the capacity of a typical lithium battery decreases by 20% at 0°C, and may be reduced to about half at -10°C. This is because in low-temperature environments, the electrolyte resistance increases, the chemical reaction rate decreases, and the generated current is relatively reduced, resulting in less usable power. In cold winters, when an electronic product detects low battery capacity, coupled with the low ambient temperature and reduced current, the temperature protection circuit in the battery's built-in protection board automatically activates, causing the electronic product to shut down automatically, severely impacting user experience.

[0003] Meanwhile, with technological advancements, the processors in electronic products need to handle more data and tasks, leading to increased heat generation during operation. Overheating can cause devices to run slowly or become unresponsive, and may also negatively impact battery life, accelerating battery aging and shortening its lifespan. Summary of the Invention

[0004] For the reasons mentioned above, this application provides a graphene film, a graphene film module, and an electronic device to solve the problem of user experience being affected by excessively low or high temperatures during the use of electronic devices.

[0005] In a first aspect, a graphene film is provided, comprising: The first region and the second region are connected in series, and the heating power of the first region is greater than that of the second region.

[0006] According to the embodiments of this application, the use of graphene film simultaneously solves the heat generation problem required for electronic devices to operate in low-temperature environments and the heat dissipation problem required to operate in high-power environments. Graphene film has high electrical conductivity; when electricity is applied to the graphene film in a low-temperature environment, the carbon atoms inside can rapidly conduct current, generating heat. Graphene film also has high thermal conductivity; in high-temperature environments, heat can be rapidly transferred through the graphene material, effectively transferring heat from the heat source area to the low-heat area. The graphene film consists of a first region and a second region connected in series. Specifically, the heating power of the first region is 90% to 100% (inclusive of 90% but not exclusive of 100%) of the heating power of the graphene film, and the heating power of the second region is 0% to 10% (inclusive of 10% but not exclusive of 0%) of the heating power of the graphene film. When graphene films are used for heating applications, the first region has a higher heating power and can be attached to parts of electronic devices that require auxiliary heating, such as batteries, to mainly provide heating. The second region has a lower heating power and can be attached to parts of electronic devices that can generate their own heat, such as chips, to mainly provide temperature equalization.

[0007] The heating power of the second region is only 0% to 10% (including 10% but not including 0%) of the heating power of the graphene film. This is because if the parts of the electronic device that can generate heat are further heated, the temperature may become too high, resulting in slow operation or untimely response of the device.

[0008] Typical, but not limiting, graphene films used in the embodiments of this application include graphene films obtained by redox methods, CVD methods, and molecular self-assembly methods.

[0009] As an embodiment of the first aspect of this application, the first region and / or the second region is a whole formed by connecting graphene films divided into small pieces.

[0010] As an embodiment of the first aspect of this application, the first region and the second region are integrally cut from a single piece of graphene film. There are no connection points between the first region and the second region. When the graphene film is used as a heating film, the overall resistance of the film material is more stable. At the same time, there is no gap between the first region and the second region, and the heat transfer path between the graphene films is not blocked. When used as a heat dissipation film, the heat dissipated from the heat source area can be conducted to the low heat area through the graphene film as a whole, resulting in higher heat dissipation efficiency.

[0011] As an embodiment of the first aspect of this application, the resistance value of the first region is greater than the resistance value of the second region. For a series circuit, the current in each part of the circuit is equal, according to the heating power calculation formula P=I... 2By controlling the resistance value of the first region to be greater than that of the second region, the heating power of the first region can be greater than that of the second region. In this application, the resistance value can be adjusted by changing the thickness of the graphene film in the first and second regions, or by adjusting the resistivity of the graphene film in the first and second regions, etc., and this application does not impose any limitations on this.

[0012] As an embodiment of the first aspect of this application, when the first region and the second region are integrally cut from a single piece of graphene film, the resistance value can be controlled by controlling the length and / or width of the graphene film in the first and second regions. According to the resistance calculation formula R = ρL / Wh, where R represents the resistance value, ρ represents the resistivity, L represents the length of the resistor, W represents the width of the resistor, and h represents the thickness of the resistor. Based on the resistance calculation formula, it can be seen that, with consistent resistivity and thickness, by controlling the length of the graphene film in the first region to be greater than the length of the graphene film in the second region, and / or the width of the graphene film in the first region to be less than the width of the graphene film in the second region, the heating power of the first region can be greater than the heating power of the second region.

[0013] As an embodiment of the first aspect of this application, the width of the graphene film in the first region is ≥2 mm. Because the resistivity of the graphene film is low, typically around 1×10⁻⁶ mm, this is beneficial. -8 ~3×10 -6 The resistivity of heating wires is typically within the range of Ω·m, while commonly used heating wire materials such as nickel-chromium alloys or iron-chromium-aluminum alloys have a resistivity of 0.01~0.1 Ω·m. Electronic devices typically have a relatively low and constant heating power setting, calculated using the resistance formula R=ρL / Wh and the heating power formula P=U. 2 The applicant discovered that, to avoid excessive heat generation, the graphene film needs to be made as long as possible and / or as narrow as possible. To ensure the uniformity of heat generation and dissipation, the graphene film is designed in a serpentine, meandering shape, allowing it to bend and coil around the component requiring heat generation or dissipation. However, the applicant also found that the heat dissipation efficiency of the graphene film is proportional to its width; if the width of the graphene film decreases, its heat transfer path will also decrease accordingly. Therefore, the width of the graphene film in the first region must be minimized while maintaining a width ≥ 2mm to balance heat generation and dissipation efficiency.

[0014] As an embodiment of the first aspect of this application, a heat-conducting component is connected to one side of the graphene film in the thickness direction. Firstly, the graphene heating film is designed with a serpentine, meandering structure; the gaps between the traces can affect its heating uniformity. Connecting a heat-conducting component to one side of the graphene film in the thickness direction can assist in heat equalization. Secondly, the reserved gaps for heat dissipation / heat generation components in electronic devices are typically 50μm to 200μm. Therefore, when the graphene film is used as a heat dissipation / heat generation component, it also needs to reach a preset thickness to prevent excessive air medium in the reserved gaps from affecting heat transfer. When the graphene film cannot reach the preset thickness to ensure heating power, a heat-conducting component is connected to one side of its thickness direction: when the graphene film is used as a heating film, the heat-conducting component serves a dual purpose of assisting in heat equalization and filling gaps; when the graphene film is used as a heat dissipation film, the heat-conducting component serves a dual purpose of assisting in heat dissipation and filling gaps.

[0015] The thermally conductive component can be adhered to one side of the graphene film using thermally conductive adhesive. The specific connection method is not limited in this application. As one embodiment of the first aspect of this application, the thermally conductive component has a cutout at the position corresponding to the orthographic projection of the conductive connector. When the graphene film is energized, the adhesive layer at the location of the conductive connector is prone to electrical breakdown, causing the thermally conductive component to connect with the graphene film, thereby changing the overall film resistance and causing failure. The cutout design at the position corresponding to the orthographic projection of the thermally conductive component and the conductive connector avoids this failure risk.

[0016] As an embodiment of the first aspect of this application, the heat-conducting component is any one or more of graphene thermal conductive film, artificial graphite film, VC heat spreader, and graphene superconducting film. The graphene superconducting film refers to a film material obtained by immersing a graphene oxide film in a reducing reaction solution to create pores, followed by sequential carbonization, graphitization, and calendering.

[0017] Secondly, this application also discloses a graphene film module, including a graphene film according to the first aspect of this application, a conductive connector connected to the graphene film, and an encapsulation layer for encapsulating the graphene film.

[0018] As an embodiment of the second aspect of this application, the conductive connector includes any one of FPC cable, silver paste electrode, riveting wire, and metal electrode sheet.

[0019] As an embodiment of the second aspect of this application, the encapsulation layer is any one of PET film and PI film. The encapsulation layer serves to insulate and encapsulate the graphene film.

[0020] According to the embodiments of this application, the graphene module can be connected to the motherboard of an electronic device through a conductive connector. The power supply of the graphene module is controlled by a temperature monitoring mechanism on the motherboard of the electronic device. Specifically, when the temperature of the electronic device is at a low temperature (e.g., below 0°C is defined as a low temperature state), the graphene film module is powered on and used as a heat-generating component. When the electronic device is in a normal or high temperature state (e.g., above 0°C is defined as a normal temperature state, and above 40°C is defined as a high temperature state), the graphene film module is powered off and used as a heat dissipation component.

[0021] Thirdly, this application discloses an electronic device including the graphene film of the first aspect embodiment.

[0022] Fourthly, this application discloses an electronic device including the graphene film module of the second aspect embodiment. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a structural diagram of the graphene film provided in Embodiment 1 of this application. Figure 2 This is a structural diagram of the graphene film provided in Embodiment 2 of this application. Figure 3 This is an exploded view of the graphene film provided in Embodiment 3 of this application. Figure 4 This is an exploded view of the graphene film module provided in Embodiment 5 of this application. Figure 5 This is a structural diagram of the graphene film module provided in Embodiment 6 of this application. Figure 6 This is an exploded view of the graphene film module provided in Embodiment 7 of this application. Figure 7 This is an exploded view of the graphene film module provided in Embodiment 8 of this application. Figure 8 This is a structural diagram of the electronic device provided in Embodiment 9 of this application. Figure 9 This is a thermal image of a set of graphene film modules provided in Experimental Example 1 of this application. Figure 10 This is a thermal image of a set of graphene film modules provided in Experimental Example 1 of this application. Figure 11 This is the thermal simulation diagram of the blank control group provided in Experimental Example 2 of this application. Figure 12This is a thermal simulation diagram of a set of graphene film modules provided in Experimental Example 2 of this application. Figure 13 This is a thermal simulation diagram of a set of graphene film modules provided in Experimental Example 2 of this application. 1-Graphene film; 11-First region; 12-Second region 2-Heat-conducting components 3-Double-sided tape 4-Conductive connectors 5-Encapsulation layer 6-Battery Area 7-Motherboard Area Detailed Implementation

[0025] The following detailed description of exemplary embodiments of this application refers to the accompanying drawings, which form part of the description, illustrating exemplary embodiments in which this application may be implemented. The more detailed description of embodiments of this application below is not intended to limit the scope of the claimed application, but is merely illustrative and does not limit the description of the features and characteristics of this application, in order to suggest the best mode for carrying out this application and sufficient to enable those skilled in the art to implement it. However, it should be understood that various modifications and variations can be made without departing from the scope of this application as defined by the appended claims. The detailed description and drawings should be considered illustrative only and not restrictive, and any such modifications and variations shall fall within the scope of this application described herein. Furthermore, the background art is intended to illustrate the current state of research and development and significance of the technology, and is not intended to limit this application or its application areas.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] It should be understood that in this application, "connection" and "connected" can both refer to a mechanical or physical connection relationship. For example, "connected to B" or "connected to B" can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0028] Unless otherwise specified in the examples, the procedures should be performed under standard conditions or conditions recommended by the manufacturer. Reagents or instruments whose manufacturers are not specified are all commercially available products.

[0029] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0030] The technology provided in this application is applicable to electronic devices with heat dissipation and / or heat generation requirements, such as mobile phones, tablets, laptops, smartwatches, and smart glasses. In specific applications, when the electronic device detects that the ambient temperature is too low and will reduce the available battery power, the graphene film or graphene film module provided in this application embodiment is powered on to act as a heat-generating component to assist in raising the battery temperature of the electronic device; when the electronic device detects that the operating temperature is not too low, the graphene film or graphene film module provided in this application embodiment is powered off to act as a heat dissipation component to assist in heat dissipation of the electronic device. Example 1

[0031] like Figure 1 As shown, the graphene film 1 provided in this embodiment is divided into a first region 11 and a second region 12 by a dashed line for easy understanding. The first region 11 and the second region 12 are connected in series, wherein the heating power of the first region is greater than that of the second region.

[0032] The graphene film provided in this embodiment is used as a heat dissipation film under normal and high-temperature environments, with both the first and second regions serving to dissipate heat and equalize temperature. Under low-temperature environments, the graphene film provided in this embodiment is used as a heating film when energized. The first region has a larger heating power and can be attached to the parts of the electronic device that require auxiliary heating, mainly serving to generate heat. The second region has a smaller heating power and can be attached to the parts of the electronic device that can generate heat on their own, mainly serving to equalize temperature.

[0033] In this embodiment, the graphene film is integrally cut from a single piece of graphene film. The integral cutting method includes, but is not limited to, die cutting and vibratory knife cutting. In this embodiment, the integral cutting method is vibratory knife cutting. There are no connection points between the first region 11 and the second region 12 formed by integral cutting, resulting in stable resistance and good heat dissipation.

[0034] In this embodiment, the heating power of each part in a series circuit is calculated using the formula P=I. 2 R, by adjusting the resistance value of the first region to be greater than that of the second region, the heating power of the first region 11 is greater than that of the second region 12.

[0035] According to the formula for calculating resistance, R = ρL / Wh, where R represents resistance, ρ represents resistivity, L represents resistance length, W represents resistance width, and h represents resistance thickness, it can be seen that the resistance can be adjusted by changing any one or more of the resistivity, resistance length, resistance width, and resistance thickness.

[0036] In this embodiment, as Figure 1As shown, the technical objective of making the resistance value of the first region 11 greater than the resistance value of the second region 12 is achieved by making the resistance length of the first region 11 greater than the resistance length of the second region 12, and the resistance width of the first region 11 less than the resistance width of the second region 12.

[0037] Because of the low resistivity of graphene films, typically around 1×10⁻⁶. -8 ~3×10 -6 Within the Ω·m range (common heating wire materials such as nickel-chromium alloy or iron-chromium-aluminum alloy have resistivity of 0.01~0.1Ω·m), and electronic devices are used with relatively low and constant heating power, according to the resistance calculation formula R=ρL / Wh and the heating power calculation formula P=U 2 The applicant found that, to avoid excessive heat generation, the graphene film needs to be made as long as possible and / or as narrow as possible. Furthermore, to balance heat generation power and uniformity of heat or heat dissipation, the graphene film is designed in a serpentine, meandering shape, allowing it to bend and coil around the component requiring heat generation or heat dissipation. However, the applicant also found that the heat dissipation efficiency of the graphene film is directly proportional to its width; if the width of the graphene film decreases, its heat transfer path will also decrease accordingly. Therefore, the width of the graphene film in the first region must be as small as possible while ensuring it is ≥2mm, thereby balancing heat generation power and heat dissipation efficiency. Typical, but not limited, resistivity widths in the first region are 2mm, 2.3mm, 2.5mm, 3mm, 4.76mm, 5mm, 6mm, 7mm, 8.37mm, 9mm, and 10mm.

[0038] In this embodiment, the voltage across the graphene film is 3.5V, the heating power is 5W, and the resistivity of the graphene film is 1.102 × 10⁻⁶. -6 Ω·m. The first region 11 has a resistance length of 761mm, a resistance width of 4.76mm, and a thickness of 80μm. The resistance value of the first region 11 is 2.20Ω, and the heating power is 4.5W. The second region 12 has an irregular shape, but its overall resistance width is greater than that of the first region, while its resistance length is less than that of the first region. The resistance value of the second region 11 is 0.25Ω, and the heating power is 0.5W. Example 2

[0039] like Figure 2 As shown, unlike Example 1, in this embodiment, the graphene film 1 is a whole composed of three small graphene films spliced ​​together. The splicing methods of the small graphene films include, but are not limited to, conductive adhesive bonding and wire connection. In this embodiment, the splicing method between two graphene films is conductive adhesive bonding.

[0040] The other structures in this embodiment are the same as those in Embodiment 1, and will not be described again here. Example 3

[0041] Figure 3 This is an exploded view of the graphene film provided in Example 3. Figure 3 As shown, unlike Example 1, the graphene film thickness, resistance length and width of the first region are different in this example. In addition, based on Example 1, a heat-conducting component 2 is connected to one side of the graphene film in the thickness direction.

[0042] First, the graphene heating film is designed with a serpentine, meandering structure. Due to the influence of wiring gaps, its heating uniformity is relatively poor. Connecting a heat-conducting component to one side of the graphene film's thickness direction can help achieve a uniform heat distribution. Second, the reserved gaps for heat dissipation / heat generation components in electronic devices are 50μm~200μm. Therefore, when the graphene film is used as a heat dissipation / heat generation component, it also needs to reach the preset thickness to prevent excessive air medium in the reserved gaps from affecting heat transfer. When the graphene film cannot reach the preset thickness to ensure heating power, a heat-conducting component is connected to one side of its thickness direction: when the graphene film is used as a heating film, the heat-conducting component serves the dual purpose of uniform heat distribution and gap filling; when the graphene film is used as a heat dissipation film, the heat-conducting component serves the dual purpose of assisting heat dissipation and gap filling.

[0043] The heat-conducting component 2 can be any one or more of graphene heat-conducting film, artificial graphite film, VC heat spreader, and graphene superconducting film. In this embodiment, the heat-conducting component 2 is a 55μm thick graphene heat-conducting film.

[0044] In this embodiment, the heat-conducting component 2 is attached to one side of the graphene film using double-sided adhesive 3.

[0045] The heat-conducting element 2 may or may not have the same outline shape as the graphene film 1. In this embodiment, the heat-conducting element 2 has the same outline shape as the graphene film 1.

[0046] In this embodiment, the voltage across the graphene film is 3.5V, the heating power is 5W, and the resistivity of the graphene film is 1.102 × 10⁻⁶. -6 Ω·m. The first region 11 has a resistance length of 458.20 mm, a resistance width of 8.37 mm, and a thickness of 25 μm. The resistance of the first region is 2.41 Ω, and its heating power is 4.92 W. The second region 12 has an irregular shape, but its overall resistance width is greater than that of the first region, while its resistance length is less. The resistance of the second region 11 is 0.04 Ω, and its heating power is 0.08 W.

[0047] Example 4 Unlike Example 3, in this example, the heat-conducting element is a 55μm thick artificial graphite film. The other structures in this example are the same as in Example 3, and will not be described again here. Example 5

[0048] Figure 4 An exploded view of the graphene film module provided in Example 5, as shown below. Figure 4 As shown, it includes the graphene film 1 provided in Example 1, the conductive connector 4 connected to the graphene film 1, and the encapsulation layer 5 encapsulating the graphene film 1.

[0049] In other embodiments, the conductive connector 4 can be any one of FPC cable, silver paste electrode, riveting wire, or metal electrode sheet. In this embodiment, the conductive connector 4 is a metal electrode sheet, specifically a copper foil electrode sheet. When the graphene film module is used, the conductive connector connects the graphene film 1 to the motherboard of the electronic device. The power supply of the graphene module is controlled by the conductive connector and the temperature monitoring mechanism on the motherboard of the electronic device. Specifically, when the temperature of the electronic device is low, the graphene film module is powered on to generate heat; when the temperature of the electronic device is normal or high, the graphene film module is powered off to dissipate heat.

[0050] In other embodiments, the encapsulation layer 5 can be any one of PET film and PI film. In this embodiment, the encapsulation layer 5 is a PET film, which serves as an insulating encapsulation for the graphene film. Example 6

[0051] like Figure 5 As shown, this embodiment provides a graphene film module, which includes the graphene film 1 provided in Embodiment 1, a conductive connector 4 connected to the graphene film 1, and an encapsulation layer 5 encapsulating the graphene film 1.

[0052] In this embodiment, the conductive connector 4 is an FPC cable, and the encapsulation layer 5 is a PI film. Example 7

[0053] Figure 6 An exploded view of the graphene film module provided in Example 7, as shown below. Figure 7 As shown, it includes the graphene film 1 with the thermal conductive element 2 attached as provided in Example 3, the conductive connector 4 connected to the graphene film 1, and the encapsulation layer 5 encapsulating the graphene film 1.

[0054] In this embodiment, the conductive connector 4 is a metal electrode sheet, specifically a copper foil electrode sheet, and the encapsulation layer 5 is a PET film. Example 8

[0055] Figure 7The exploded view of the graphene film module provided in Example 8 differs from that in Example 7 in that the heat-conducting component 2 has a hollowed-out portion, which is consistent with the orthographic projection position of the conductive connector 4 on the heat-conducting component 2.

[0056] The other structures in this embodiment are the same as those in Embodiment 7, and will not be described again here. Example 9

[0057] like Figure 8 As shown, this embodiment provides an electronic device, which includes the graphene film module provided in Embodiment 5. The graphene film module is attached to the space enclosed by the frame and back cover of the electronic device. The first region 11 is attached to the battery region 6 of the electronic device, and the second region 12 is attached to the motherboard region 7 of the electronic device. In low-temperature environments, the functional components on the motherboard of the electronic device can generate heat themselves, and their need for auxiliary heating is low. However, the battery's own heating capacity is insufficient, and its need for auxiliary heating is high. For these reasons, the first region has a larger heating power and mainly plays a role in heating, while the second region has a smaller heating power and mainly plays a role in temperature equalization.

[0058] In some other embodiments, the first region of the graphene film may not be correspondingly located in the battery region of the electronic device, and the second region may not be correspondingly located in the motherboard region of the electronic device. The positions of the first and second regions can be changed according to the actual layout inside the electronic device, and this application does not limit them. Example 10

[0059] This embodiment provides an electronic device, which includes the graphene film module provided in Embodiment 7. The graphene film module is attached to the space enclosed by the frame and back cover of the electronic device. The specific attachment position of the graphene film module is the same as in Embodiment 8, and will not be repeated here. Experimental Example 1

[0060] The graphene film modules provided in Examples 5 and 7 were powered on to test their heat generation. Specifically, the graphene film modules provided in Examples 5 and 7 were heated to a power of 5W, and their heat generation was observed using a thermal imager. The experimental results are as follows: Figure 8 , Figure 9 As shown.

[0061] like Figure 9 As shown, the highest heating temperature of the graphene film module provided in Example 5 is 57.9°C, which is higher than that of Example 7, and the heating is mainly concentrated in the first region.

[0062] like Figure 10As shown, the graphene film module provided in Example 7 has a maximum heating temperature of 44.0°C. Due to the presence of the heat-conducting component 2, the overall heating is more uniform compared to the graphene heating module in Example 5. Experiment Example 2

[0063] Thermal simulation tests were conducted on the graphene film modules provided in Examples 5 and 7, as well as a blank control group without a graphene film module. The graphene film modules were not powered on to test their heat dissipation. The experimental results are as follows: Figure 11-13 As shown.

[0064] Figure 11 The thermal simulation results are shown for the blank control group without graphene film module. The temperature of the back cover of the electronic device is about 47~49℃ in the motherboard area and about 36~39.5℃ in the battery area. Figure 12 The thermal simulation results of the graphene film module of Example 5 are shown. The temperature of the back cover of the electronic device in the motherboard area is about 38~39°C, and the highest temperature in the battery area is 33~36°C. Figure 13 The diagram shows the thermal simulation results of the graphene film module of Example 7. The temperature of the back cover of the electronic device in the motherboard area is about 38~39°C, and the highest temperature in the battery area is 33~36°C.

[0065] Therefore, it can be seen that the graphene film modules provided in Examples 5 and 7 both have good heat dissipation effects.

[0066] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A graphene film, characterized in that, include: A first region and a second region are connected in series, wherein the heating power of the first region is greater than the heating power of the second region; Specifically, the heating power of the first region is [90%, 100%) of the heating power of the graphene film, and the heating power of the second region is (0%, 10%) of the heating power of the graphene film.

2. A graphene film as described in claim 1, characterized in that, The resistance value of the first region is greater than the resistance value of the second region.

3. A graphene film as described in claim 1, characterized in that, The first and second regions are integrally cut from a single piece of graphene film.

4. A graphene film as described in claim 3, characterized in that, The length of the graphene film in the first region is greater than the length of the graphene film in the second region, and / or the width of the graphene film in the first region is less than the width of the graphene film in the second region.

5. A graphene film as described in claim 1, characterized in that, The width of the graphene film in the first region is ≥2mm.

6. A graphene film as described in claim 1, characterized in that, A heat-conducting component is connected to one side of the graphene film along its thickness direction.

7. A graphene film as described in claim 6, characterized in that, The heat-conducting component is any one or more of the following: graphene heat-conducting film, artificial graphite film, VC heat spreader, and graphene superconducting film.

8. A graphene film module, characterized in that, include: The graphene film according to any one of claims 1-7; Conductive connectors attached to graphene films; An encapsulation layer that encapsulates the graphene film.

9. A graphene film module as described in claim 8, characterized in that, The conductive connector includes any one of FPC cable, silver paste electrode, riveting wire, and metal electrode sheet.

10. A graphene film module as described in claim 8, characterized in that, The encapsulation layer is either a PET film or a PI film.

11. An electronic device, characterized in that, Includes the graphene film according to any one of claims 1-7 or the graphene film module according to any one of claims 8-10.

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