Control driving module based on microcircuit assembly technology

Abstract

The invention discloses a control driving module based on a microcircuit assembly process. The control driving module comprises a first substrate, a power unit, a second substrate, a driving unit, a third substrate, a control unit, bamboo joint copper columns, nail head copper columns and riveting columns, the first substrate is installed on the metal base, the four riveting columns are distributed at the four corners of the first substrate, and the riveting columns sequentially penetrate through the second substrate and the third substrate from bottom to top to provide structural support for the three layers of substrates, so that the three substrates are distributed in parallel in a vertical space; the control unit is arranged on the third substrate, the driving unit is arranged on the second substrate, and the power unit is arranged on the first substrate; the bottom ends of a plurality of bamboo joint copper columns are distributed and installed on the first substrate, the bamboo joint copper columns upwards penetrate through the second substrate and the third substrate in sequence, electrical signals are transmitted among the three substrates, and meanwhile the second substrate and the third substrate are fixed and supported through auxiliary riveting columns. The plurality of nail head copper columns are installed between the first substrate and the second substrate and between the second substrate and the third substrate to transmit electrical signals between the adjacent substrates.

Description

Technical Field

[0001] This invention relates to a control drive module based on microcircuit assembly technology, belonging to the field of motor control driver technology. Background Technology

[0002] To improve power density, control and drive modules typically employ SiP (System-in-Package) design methods. These methods integrate heterogeneous components such as sensors, logic chips, and memory chips into a single package through processes like potting, dicing, surface gold plating, and laser engraving to achieve system-level functionality. However, this approach suffers from drawbacks such as complex design and demanding manufacturing requirements. Furthermore, modules using gold-plated SiP packaging are susceptible to breakage under harsh thermal environments due to inconsistent coefficients of thermal expansion, failing to meet the needs of next-generation, easily manufactured, and highly reliable control and drive modules.

[0003] Patent CN117639612A discloses a SiP (Silicon-in-Package) integrated power module. This invention integrates a SiC three-phase bridge module, an isolation drive module, a drive power supply module, a bus acquisition unit, and a current acquisition unit using SiP technology. It achieves device miniaturization by using a multilayer silicon-nitride copper-clad substrate for metal encapsulation of the power module. However, this invention does not integrate a programmable controller and still requires a digital processor circuit for system integration, increasing the system's design complexity. Furthermore, the use of SiP technology exposes the invention to the risk of thermal failure.

[0004] Patent CN202411611832.7 discloses a power semiconductor module and control device with integrated drive control. This invention provides a programmable control drive module with an industrial Ethernet interface. However, its manufacturing process is complex. The control unit, drive unit, and multilayer substrate are all connected using bonding wires. It is necessary to first assemble the control substrate and power substrate using a support structure, and then connect them using gold wire bonding technology. The electrical interconnection between the components is completed by stacking bonding wires to form a chip. The process is difficult and complex. Once the production design is completed, maintenance is also difficult. Summary of the Invention

[0005] The technical problem solved by the present invention is to overcome the shortcomings of the prior art and provide a control drive module based on microcircuit assembly technology, which solves the problems of existing drive modules not integrating control chips and complex manufacturing processes, and achieves the requirements of simple production process and high reliability.

[0006] The technical solution of this invention is:

[0007] A control and drive module based on microcircuit assembly technology, comprising:

[0008] First substrate, power unit, second substrate, drive unit, third substrate, control unit, bamboo-shaped copper pillar, nail-head copper pillar, rivet pillar;

[0009] The first substrate is mounted on a metal base. Four rivets are distributed at the four corners of the first substrate. The rivets pass through the second and third substrates from bottom to top, providing structural support for the three substrates and making the three substrates parallel in vertical space.

[0010] The control unit is mounted on the third base plate. It receives control signals sent by the host computer, parses and generates chopper drive signals and sends them to the drive unit. At the same time, it receives load current information fed back by the drive unit, collects electrical signals from external sensors, and outputs the above information to the host computer through the CAN communication interface.

[0011] The drive unit is mounted on the second substrate. It receives the chopper drive signal from the control unit, amplifies the signal through the MOSFET drive circuit on the second substrate, generates a load drive signal, and sends it to the power unit. At the same time, it receives the load information fed back by the power unit, performs circuit conditioning, generates a level signal acceptable to the core processing chip of the control unit, and sends it to the control unit.

[0012] The power unit is mounted on the first substrate, receives the load drive signal sent by the drive unit, outputs it to the external load, and monitors the external load information and feeds it back to the drive unit.

[0013] Multiple bamboo-shaped copper pillars are distributed and installed on the first substrate at their bottom ends, and pass through the second and third substrates in sequence to transmit electrical signals between the three substrates. At the same time, the auxiliary rivet pillars fix and support the second and third substrates.

[0014] Multiple pinhead copper pillars are installed between the first substrate and the second substrate, as well as between the second substrate and the third substrate, to transmit electrical signals between adjacent substrates.

[0015] Preferably, the control unit includes: an external connector, a programmable digital processor, a dual-channel isolated CAN interface circuit, and necessary feedback signal processing circuitry; wherein:

[0016] The external connector receives control signals sent by the host computer, processes them through a dual-channel isolated CAN interface circuit to generate a level signal acceptable to the programmable digital processor, and transmits it to the programmable digital processor through electrical traces arranged on the third substrate. At the same time, the external connector supplies power to external sensors and provides an electrical signal path for feedback from external sensors.

[0017] The isolated CAN interface circuit is an important interface circuit. It needs to realize the CAN communication level conversion between the programmable digital processor and the host computer network, so as to realize bidirectional communication between the two.

[0018] The programmable digital processor is the core processing circuit. It needs to acquire the instruction signals from the host computer and upload the real-time information of the module through the CAN bus. It also processes the received feedback signals, performs calculations according to the predetermined control algorithm, and outputs chopping control signals to the drive unit through the bamboo-joint copper columns arranged in different positions.

[0019] The feedback signal processing circuit receives current acquisition signals and bus voltage acquisition signals from the drive unit via copper pins arranged at different positions. Simultaneously, different processing modules within the feedback signal processing circuit can acquire electrical signals from external sensors returned from the external connector. The conditioned electrical signals are then transmitted to the programmable digital processor.

[0020] Preferably, the driving unit includes: a gate driving circuit, an isolated power supply module, a current acquisition circuit, a voltage acquisition circuit, and an overcurrent protection circuit; wherein:

[0021] The gate drive circuit receives the chopper drive signal transmitted from the third substrate through the dedicated pinhead copper pillar, amplifies it to generate the gate drive signal of the switching transistor, and sends it to the power circuit through the dedicated pinhead copper pillar.

[0022] The isolated power supply receives external power supply voltage through bamboo-joint copper pillars to supply power to the power unit, drive unit, and control unit;

[0023] The current acquisition circuit receives the load current signal collected by the power unit and outputs it to the control unit through the feedback signal processing circuit from the dedicated bamboo-joint copper column.

[0024] The voltage acquisition circuit acquires the bus voltage of the load and outputs it to the feedback signal processing circuit of the control unit through a dedicated pin-head copper column.

[0025] The overcurrent protection circuit receives the load current signal collected by the power unit and determines whether overcurrent protection is required for the power circuit of the power unit. If overcurrent protection is required, it sends a stop signal to the gate drive circuit to stop driving the power circuit and turn off the MOSFET of the power unit, thereby reducing the load current.

[0026] Preferably, the power unit includes: a power circuit and a sensor acquisition circuit, wherein:

[0027] The power circuit includes multiple power switching transistors (MOSFETs) soldered on the first substrate. It receives the gate drive signal of the switching transistors from the gate drive circuit, amplifies it, and outputs it to the load.

[0028] The sensor acquisition circuit monitors the current signal of the load and feeds it back to the current acquisition circuit of the drive unit through a dedicated pin-head copper post.

[0029] Preferably, the control drive module also includes a plastic housing, the bottom of which is bonded to the metal base with black adhesive, and a through hole at the top for the bamboo-shaped copper pillar and the rivet pillar to pass through. A potting hole is reserved on the housing, through which thermally conductive sealant is poured to seal the internal components.

[0030] Preferably, the spacing between adjacent bamboo-joint copper pillars is ≥2mm to avoid stress concentration caused by differences in thermal expansion;

[0031] The bamboo-shaped copper pillars are fixed to the three-layer substrate by welding.

[0032] The positions of the bamboo-joint copper pillars and nail-head copper pillars are arranged according to the information exchange needs between each unit.

[0033] Preferably, the first substrate is vacuum eutectic welded to the metal base;

[0034] The bottom of the rivet is brazed onto the first substrate.

[0035] Preferably, the first substrate is a silicon nitride copper-clad substrate;

[0036] The second substrate is a 6-layer PCB substrate, made of substrate material with a glass transition temperature of not less than 170℃.

[0037] Preferably, the bottom of the control drive module has multiple flanges, which allow the invention to be installed inside the actuator or mounting compartment.

[0038] Compared with the prior art, the present invention has the following advantages:

[0039] (1) This invention achieves a lightweight module with brushless motor drive closed-loop control, overcurrent protection, current sampling, analog signal acquisition, dual CAN interfaces, and a three-layer substrate connection through a rivet copper column layout and a plastic shell potting method; the power density reaches 9.878W / cm3, and the external interface is simple, with a digital processor. It does not require additional external circuit configuration and can be directly integrated into existing industrial solution designs, which can meet the application needs of complex industrial environments.

[0040] (2) This invention achieves stacked multilayer substrate connection by arranging rivet pillars and bamboo-joint copper pillars. Compared with the gold wire bonding process, this method greatly simplifies the manufacturing process. The copper pillar welding and disassembly process is simple and has reworkability. Without occupying too much space, it improves the integration and power density of traditional semiconductor power modules, simplifies the process and manufacturing difficulty, and enhances the reliability of the system. Compared with the packaging process using gold wire bonding, surface gold plating, and laser engraving technology, the present invention has great advantages in production yield and efficiency.

[0041] (3) The present invention improves the heat dissipation efficiency of components and accelerates the heat dissipation performance of the module by welding MOSFETs onto silicon nitride substrate and encapsulating the module with thermally conductive adhesive.

[0042] (4) The electrical connection between the substrates of this invention is achieved through bamboo-joint copper pillars, avoiding the connection of electrical signals through fragile bonding or gold plating layers, thus avoiding the risk of gold plating / bonding breakage in thermal shock experiments and adapting to thermal shock environments. Compared with power drive modules using SIP technology, control drive modules of the same level and size using SIP technology have the risk of occasional failures at high temperatures. This invention has been verified by testing to be able to operate for a long time at a high temperature of 125℃ without damage, greatly improving the high reliability and environmental adaptability of the control drive module. Moreover, through reasonable layout design, it can achieve the same size as the controller module using SIP packaging technology. Compared with the controller module using SIP technology, it is more adaptable to thermal shock environments and has higher reliability. Attached Figure Description

[0043] Figure 1 This is a schematic cross-sectional view of the module of the present invention;

[0044] Figure 2 This is a three-dimensional schematic diagram of the module of the present invention;

[0045] Figure 3 This is a top view of the module of the present invention.

[0046] Attached image labels:

[0047] First substrate 3, power circuit 7, sensor acquisition circuit 8; second substrate 5, gate drive circuit 9, isolated power supply module 10, current acquisition circuit 11, voltage acquisition circuit 12, overcurrent protection circuit 13; third substrate 6, programmable digital processor 14, dual-channel isolated CAN interface circuit 15, feedback signal processing circuit 16, external connector 17; nail head copper pillar 1, bamboo joint copper pillar 2, metal base 4, four corner rivet pillars 18, plastic shell 19, flange 21. Detailed Implementation

[0048] This invention includes various semiconductor devices required for brushless motor driving and a programmable digital signal processor. For example... Figure 1As shown, the control drive module is externally housed in a plastic casing 19, and internally consists of three substrates: a first substrate 3, a second substrate 5, and a third substrate 6. The first substrate 3 contains the necessary three-phase inverter bridge components, using a silicon nitride copper-clad substrate to weld MOSFETs and conductive support bamboo-joint copper pillars 2. The power and three-phase interfaces are extended out of the casing via the bamboo-joint copper pillars 2. All bamboo-joint copper pillars 2 are welded to the power circuit 7 in a single assembly. The second substrate 5 contains the necessary isolated power supply module 10, gate drive circuit 9, current acquisition circuit 11, etc., which receives the chopping drive signal from the control substrate (third substrate 6). The second substrate 5 converts the chopping signal into an electrical signal to drive the power MOSFET inverter components and collects the current signal to feed back to the third substrate 6. The third substrate 6 contains an external connector 17, a programmable digital processor 14, a dual-channel isolated CAN interface circuit 15, and a necessary feedback signal processing circuit 16. This circuit receives and feeds back communication commands via a bus, and implements closed-loop control based on the commands and the collected feedback signals. It parses and generates chopping control signals for the drive circuit using a predetermined algorithm.

[0049] The layout relationship between the rivet post 18 and the nail head copper post 1 is as follows: Figure 2 As shown, the rivet post 18 provides the structural support required for the three-layer substrate, the nail head copper post 1 connects the electrical signals between the second substrate 5 and the third substrate, and the bamboo joint copper post 2, as shown... Figure 1 The electrical signals connecting the three-layer substrate are shown. After thermal stress distribution simulation, the spacing between the bamboo-joint copper pillars 2 is set to ≥2mm to avoid stress concentration caused by thermal expansion differences. Each bamboo-joint copper pillar 2 is stepped, and different bamboo-joint copper pillars 2 are arranged according to requirements for electrical connection. The good spacing setting facilitates rework, and the connection between the bamboo-joint copper pillars 2 and each substrate can be completed using common soldering tools such as soldering irons. The electrical connection copper pillars on the power silicon nitride copper-clad substrate are soldered to the second substrate 5. At the same time, the four corners of the substrate are fixed with four corner rivets 18 for support. The second substrate 5 and the third substrate 6 are placed on the bamboo-joint copper pillars 2 and soldered in sequence to achieve support connection in the vertical direction of space. The design position of the bamboo-joint copper pillars 2 and the diameter of the same bamboo-joint copper pillar 2 are different. The distribution of copper pillars is optimized by mechanical finite element simulation to ensure that each copper pillar has both mechanical and electrical properties at the same time. The housing avoids the external connector 17 area of ​​the third substrate 6 and the lead-out areas of the bamboo-joint copper pillar 2 and the rivet pillar 18. After assembling the plastic housing 19 with the module, thermally conductive sealant is injected through the pre-reserved potting holes on the housing to achieve a tight connection between the various components of the module.

[0050] Specific implementation examples:

[0051] Figure 1The internal layout of the control driver module is shown. Internally, nail-head copper pillars 1 and bamboo-joint copper pillars 2 are used to achieve electrical connections between multi-layer boards. Nail-head copper pillars 1 and bamboo-joint copper pillars 2, together with riveting pillars 18, serve to fix the multi-layer boards, integrating the power unit, drive unit, and control unit. The power unit is fixed to the metal base 4 via a solder layer to the first substrate 3. The drive unit is stacked on the second substrate 5 vertically above the power unit, and the control unit is stacked on the third substrate 6 vertically above the drive unit. The power unit includes a power circuit 7, a sensor acquisition circuit 8, and nail-head copper pillars 1 on the upper surface of the first substrate 3. The drive unit includes a drive circuit 9, an isolated power supply module 10, a current acquisition circuit 11, a voltage acquisition circuit 12, and an overcurrent protection circuit 13 on both sides of the second substrate 5. The control unit includes a programmable digital processor 14, a dual-channel isolated CAN interface circuit 15, a feedback signal processing circuit 16, and an external connector 17, all located on the third substrate 6.

[0052] Rivets 18, used solely for fixing, are located between the first substrate 3, the second substrate 5, and the third substrate 6. These rivets 18 are brazed to the metal base 4. Simultaneously, bamboo-joint copper pillars 2, providing electrical connection between the three substrates, also serve to fix the substrates. The module housing includes the metal base 4 and a plastic shell 19. The plastic shell 19 encloses the power unit, drive unit, and control unit within the metal base 4. The module is based on the metal base 4. The first substrate 3 is soldered to the base via a solder layer using vacuum eutectic bonding. Due to the substrate's extremely high thermal conductivity (≥80W / mK), welding it to the silicon nitride copper-clad substrate improves the heat dissipation efficiency of the components. The four corner rivets 18 are fixed to the metal base 4 using brazing. The main function of the four corner rivets 18 is to fix the second substrate 5 and the third substrate 6 and to form the basic shape of the product. The four corner rivets 18 fix the substrates by welding. The diameter of the rivets 18 has three values ​​depending on the height. The substrate is placed on the rivets 18 and firmly fixed to them with solder. The first substrate 3 is a silicon nitride copper-clad substrate, which has excellent electrical and thermal conductivity, greatly improving the heat dissipation performance of power devices. The second substrate 5 is a 6-layer PCB substrate, using a substrate material with a high Tg (glass transition temperature) of 170℃.

[0053] The external connector 17 on the third substrate 6 connects to external CAN communication signals, 28V control power supply signals, sensor feedback signals, and other functions. The external 28V control power supply is input to the module through the external connector 17, and within the module, the 28V control power is transmitted to the isolated power supply module 10 of the second substrate 5 via the pin-head copper pillars 1. The programmable digital processor 14 on the first substrate 3 performs current closed-loop and position closed-loop calculations, converting the calculations into chopper drive signals that are transmitted to the second substrate 5, achieving high-precision motor drive control through closed-loop calculations. The second substrate 5 feeds back the secondary power supply after secondary power conversion, phase current acquisition signals, and overcurrent protection signals to the first substrate 3 via the bamboo-joint copper pillars 2. Simultaneously, the generated MOSFET drive signals and phase current acquisition signals are transmitted between the second substrate 5 and the third substrate 6 through the differently arranged pin-head copper pillars 1.

[0054] The drive circuit generates a drive signal based on the control signal; the isolated power supply module 10 is used to supply power to different units of the module; the current acquisition circuit 11 processes and outputs the acquisition signal to the control unit based on the sensor acquisition circuit; the voltage acquisition circuit 12 is used to acquire the load bus voltage and output the acquisition signal to the control unit; the overcurrent protection circuit 13 realizes overcurrent protection based on the power circuit current sampling signal.

[0055] The programmable digital processor 14 is used to receive and receive communication commands via a bus, and perform closed-loop calculations based on the commands and the acquired feedback signals using a predetermined algorithm to output chopper control signals; the dual-channel isolated CAN interface circuit 15 is used to convert the external communication level into a communication signal acceptable to the control drive module, thereby realizing bidirectional communication between the control drive module and the external host computer; the feedback signal processing circuit is used to process the acquired signals fed back to the control unit; the external connector 17 is used to connect external input signals to the module.

[0056] The power circuit 7 amplifies and drives the signal and current to control the motor's operation. The power circuit 7 mainly consists of MOSFET power switches. The sensor acquisition circuit 8 mainly consists of a sensor chip, which senses and outputs the current signals of the two phases of the load to the current acquisition circuit 11. The drive circuit 9 mainly consists of a drive chip and diodes. The drive chip is used to amplify the current of the control signal and drive the gate of the high-side MOSFET. The isolated power supply module 10 supplies power to the integrated circuits in each part of the module and isolates different functional circuits. The current acquisition circuit 11 mainly consists of an isolated acquisition chip, which amplifies and isolates the current sampling signal from the power circuit before outputting it to the control circuit. The voltage acquisition circuit 12 mainly consists of an isolated acquisition chip, which acquires the load bus voltage signal based on a resistor divider and amplifies it before outputting it to the feedback signal processing circuit 16 of the control unit. The overcurrent protection circuit 13 mainly consists of an operational amplifier and a comparator. It amplifies the current sampling signal and compares it with a reference value. When the load current is too high, the gate drive circuit 9 controls the chopping of the drive signal for the high-side power switch in the power circuit 7. The gate drive circuit 9 sends a stop signal to stop the power circuit 7 from driving, turning off the MOSFET and thus reducing the load current. The programmable digital processor 14 communicates with the network via a CAN bus and implements the motor control and drive function according to the user-designed control algorithm and processing logic.

[0057] Above the metal base 4 is a protective plastic shell 19, which is bonded to the metal base 4 with black adhesive. The plastic shell 19 serves to encapsulate all the unit circuits and provide potting compound, maintaining the shape while significantly improving thermal conductivity, accelerating external heat conduction of the internal heating circuit units, and providing a certain degree of insulation. Testing shows that the module of this invention weighs approximately 310g and has a power density of 9.878W / cm³. The module can be mechanically fixed to the outside via flange 21. Control electrical, communication signals, and feedback signals can be directly connected to the connectors on the control board. The external interface is simple, containing only a 28V control electrical interface, a CAN communication interface, a sensor acquisition interface, a 28V power interface, and a power motor interface. No additional circuitry is required to connect to an industrial network equipped with CAN. By programming the digital processor 14, the motor drive requirements can be met.

[0058] The bottom of the control drive module has multiple flanges 21. The weight of the present invention after potting is only 300g, and its size is small. The present invention can be conveniently installed inside the actuator or installation chamber through the flanges.

[0059] In summary, this invention utilizes microcircuit assembly technology, employs a structure of riveted pillars and bamboo-joint copper pillars to connect the three-layer substrate inside the module, and adds a plastic shell and thermally conductive adhesive potting process to form a lightweight, small-sized, and highly reliable control drive module.

[0060] By integrating a control board with a digital processor into the control driver module, a brushless DC motor drive module with a digital processor was realized.

[0061] This invention improves the heat dissipation efficiency of components, accelerates the heat conduction and dissipation performance of the module, and increases the power density of the product by welding MOSFETs to a silicon nitride substrate and encapsulating the entire module with thermally conductive adhesive.

[0062] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

Claims

1. A control and drive module based on microcircuit assembly technology, characterized in that... include: First substrate (3), power unit, second substrate (5), drive unit, third substrate (6), control unit, bamboo joint copper column (2), nail head copper column (1), rivet column (18); The first substrate (3) is mounted on a metal base. Four rivets are distributed at the four corners of the first substrate (3). The rivets pass through the second substrate (5) and the third substrate (6) from bottom to top, providing structural support for the three substrates and making the three substrates parallel in vertical space. The control unit is set on the third base plate (6), receives the control signal sent by the host computer, parses and generates the chopper drive signal and sends it to the drive unit; at the same time, it receives the load current information fed back by the drive unit, collects the electrical signals of the external sensors, and outputs them to the host computer. The drive unit is set on the second substrate (5), receives the chopper drive signal from the control unit, amplifies the signal and generates a load drive signal to send to the power unit; at the same time, it receives the load information fed back by the power unit, performs circuit conditioning and generates a level signal that the control unit can accept, and sends it to the control unit. The power unit is disposed on the first substrate (3), receives the load drive signal sent by the drive unit, and outputs it to the external load; at the same time, it monitors the external load information and feeds it back to the drive unit. Multiple bamboo-joint copper pillars (2) are distributed and installed on the first substrate (3) at their bottom ends, and pass through the second substrate (5) and the third substrate (6) in sequence to transmit electrical signals between the three substrates. At the same time, the auxiliary rivet pillars fix and support the second substrate (5) and the third substrate (6). Multiple pinhead copper pillars (1) are installed between the first substrate (3) and the second substrate (5), and between the second substrate (5) and the third substrate (6) for transmitting electrical signals between adjacent substrates.

2. The control and drive module based on microcircuit assembly technology according to claim 1, characterized in that: The control unit includes: an external connector (17), a programmable digital processor (14), a dual-channel isolated CAN interface circuit (15), and necessary feedback signal processing circuitry (16); wherein: The external connector (17) receives the control signal sent by the host computer, and after processing by the dual-channel isolated CAN interface circuit (15), it generates a level signal acceptable to the programmable digital processor (14), which is then transmitted to the programmable digital processor (14) through the electrical wiring arranged on the third substrate (6); at the same time, the external connector (17) supplies power to the external sensor and provides an electrical signal path for feedback from the external sensor. The CAN interface circuit (15) is isolated to realize the CAN communication level conversion between the programmable digital processor (14) and the host computer network, thereby realizing bidirectional communication between the two. The programmable digital processor (14) collects the instruction signals from the host computer and uploads the real-time information of the module through the CAN bus. It processes the received feedback signals, performs calculations according to the predetermined control algorithm, and outputs chopping control signals to the drive unit through the bamboo-joint copper columns (2) arranged in different positions. The feedback signal processing circuit (16) receives the current acquisition signal and bus voltage acquisition signal fed back by the drive unit through the pinhead copper pillars (1) arranged at different positions; at the same time, different processing circuit modules inside the feedback signal processing circuit (16) can acquire the external sensor electrical signals returned from the external connector (17) and transmit the conditioned electrical signals to the programmable digital processor (14).

3. The control and drive module based on microcircuit assembly technology according to claim 2, characterized in that: The driving unit includes: a gate driving circuit (9), an isolated power supply module (10), a current acquisition circuit (11), a voltage acquisition circuit (12), and an overcurrent protection circuit (13); wherein: The gate drive circuit (9) receives the chopper drive signal transmitted from the third substrate (6) through the dedicated nail head copper pillar (1), amplifies it to generate the gate drive signal of the switching transistor, and sends it to the power circuit (7) through the dedicated nail head copper pillar (1). The isolated power supply (10) receives external power supply voltage through the bamboo joint copper column (2) to supply power to the power unit, drive unit and control unit; The current acquisition circuit (11) receives the load current signal acquired by the power unit and outputs it to the feedback signal processing circuit (16) of the control unit through the dedicated pin copper column (1). The voltage acquisition circuit (12) acquires the bus voltage of the load and outputs it from the dedicated pin copper column (1) to the feedback signal processing circuit (16) of the control unit. The overcurrent protection circuit (13) receives the load current signal collected by the power unit and determines whether the power circuit (7) of the power unit needs to be overcurrent protected. If overcurrent protection is required, it sends a stop working signal to the gate drive circuit (9) to stop the power circuit (7) from driving and turn off the MOSFET of the power unit, thereby reducing the load current.

4. The control and drive module based on microcircuit assembly technology according to claim 3, characterized in that: The power unit includes: a power circuit (7) and a sensor acquisition circuit (8), wherein: The power circuit (7) includes multiple power switching transistors (MOSFETs), which are soldered onto the first substrate (3). It receives the switching transistor gate drive signal from the gate drive circuit (9), amplifies it, and outputs it to the load. The sensor acquisition circuit (8) monitors the current signal of the load and feeds it back to the current acquisition circuit (11) of the drive unit through a dedicated pinhead copper post (1).

5. The control and drive module based on microcircuit assembly technology according to claim 1, characterized in that: The control drive module also includes a plastic housing (19), the bottom of which is bonded to the metal base with black glue, and a through hole at the top for the bamboo-joint copper pillar (2) and the rivet pillar (18) to pass through. A potting hole is reserved on the housing, through which thermally conductive sealant is injected to seal the internal components.

6. The control and drive module based on microcircuit assembly technology according to claim 1, characterized in that: The spacing between adjacent bamboo-joint copper columns (2) is ≥2mm to avoid stress concentration caused by thermal expansion differences; The bamboo-joint copper column (2) is fixed to the three-layer substrate by welding; The positions of the bamboo-joint copper pillar (2) and the nail-head copper pillar (1) are arranged according to the information exchange needs between the units.

7. The control and drive module based on microcircuit assembly technology according to claim 1, characterized in that: The first substrate (3) is welded to the metal base by vacuum eutectic bonding; The bottom of the rivet (18) is brazed onto the first substrate (3).

8. The control and drive module based on microcircuit assembly technology according to claim 1, characterized in that: The first substrate (3) is a silicon nitride copper-clad substrate; The second substrate (5) is a 6-layer PCB substrate, and the substrate material has a glass transition temperature of not less than 170°C.

9. A control and drive module based on microcircuit assembly technology according to claim 1, characterized in that: The bottom of the control drive module has multiple flanges (21), through which the control drive module is placed inside the actuator or mounting compartment.

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