Photoelectric coupler manufacturing method and photoelectric coupler

Abstract

The invention provides a photoelectric coupler manufacturing method and a photoelectric coupler, and belongs to the technical field of photoelectric coupler manufacturing, in the photoelectric coupler manufacturing method, a light emitting device is packaged through a first packaging adhesive to form a transmitting module, and a light emitting surface is formed on the surface of the transmitting module; a receiving device is packaged through a second packaging adhesive to form a receiving module, and a light incident surface is formed on the surface of the receiving module; the transmitting module and the receiving module are overlapped, so that the light emitting surface is opposite to the light incident surface, and the transmitting module and the receiving module are fixedly connected to form the photoelectric coupler, so that a lamination step is not involved in a manufacturing process any more; the problem that the quality of the photoelectric coupler is poor due to the fact that parts are easily touched due to lamination operation is avoided, and the yield of manufacturing of the photoelectric coupler is improved.

Description

Technical Field

[0001] This application relates to the field of optocoupler manufacturing technology, specifically to an optocoupler manufacturing method and an optocoupler. Background Technology

[0002] An optocoupler, also known as an optical coupler or opto-isolator, is a device that uses light as a medium to transmit electrical signals. Its structure mainly consists of two parts: a transmitter and a receiver. The transmitter has a light-emitting device, and the receiver has a receiving device. At the transmitter, the light-emitting device converts the electronic signal into light of a specific wavelength. At the receiver, the receiving device receives the light and converts it into current, allowing the signal to travel from the transmitter to the receiver in the form of light within the optocoupler. For through-beam optocouplers, one manufacturing process is molding encapsulation. Specifically, the light-emitting and receiving devices are stacked and then molded with white and black adhesive. First, the light-transmitting white adhesive encapsulates the light-emitting and receiving devices to form an internal encapsulation structure. Then, the light-blocking black adhesive completely encapsulates the internal encapsulation structure, forming an opaque outer shell for the optocoupler product. During the stacking process, because the light-emitting device, receiving device, and components such as the crystal wires are exposed, they are easily touched, which can lead to quality problems in the manufactured optocoupler products. Summary of the Invention

[0003] This application provides a method for manufacturing an optocoupler to solve the technical problem that optocouplers in the prior art are prone to quality problems due to contact with components during manufacturing; this application also provides an optocoupler.

[0004] In a first aspect, this application provides a method for manufacturing an optocoupler, comprising: A light-emitting module is formed by encapsulating a light-emitting device with a first encapsulating adhesive, and a light-emitting surface is formed on the surface of the light-emitting module. A receiving module is formed by encapsulating the receiving device with a second encapsulating adhesive, and a light incident surface is formed on the surface of the receiving module. The transmitting module and the receiving module are stacked together so that the light-emitting surface and the light-incident surface face each other, and the transmitting module and the receiving module are fixedly connected.

[0005] In one embodiment, the step of encapsulating a light-emitting device with a first encapsulating adhesive to form an emitting module, and forming a light-emitting surface on the surface of the emitting module, includes: the first encapsulating adhesive includes a first light-transmitting adhesive and a first light-shielding adhesive; the light-emitting device is encapsulated with the first light-transmitting adhesive, and then the first light-shielding adhesive is encapsulated on the outside of the first encapsulating adhesive, with the first light-transmitting adhesive partially exposed to form the light-emitting surface; and / or, the step of encapsulating a receiving device with a second encapsulating adhesive to form a receiving module, and forming a light-incident surface on the surface of the receiving module, includes: the second encapsulating adhesive includes a second light-transmitting adhesive and a second light-shielding adhesive; the receiving device is encapsulated with the second light-transmitting adhesive, and then the second light-shielding adhesive is encapsulated on the outside of the second encapsulating adhesive, with the second light-transmitting adhesive partially exposed to form the light-incident surface.

[0006] In one embodiment, encapsulating the light-emitting device with a first encapsulating adhesive to form an emitting module, and forming a light-emitting surface on the surface of the emitting module, includes: the first encapsulating adhesive is a first light-transmitting adhesive, and the light-emitting device is encapsulated with the first light-transmitting adhesive; encapsulating the receiving device with a second encapsulating adhesive to form a receiving module, and forming a light-incident surface on the surface of the receiving module, includes: the second encapsulating adhesive is a second light-transmitting adhesive, and the receiving device is encapsulated with the second light-transmitting adhesive; fixing the emitting module and the receiving module together includes: stacking the emitting module and the receiving module to form a module, and then encapsulating the module with a light-shielding adhesive.

[0007] In one embodiment, the first light-emitting device is encapsulated by molding; and / or, the second light-transmitting device is encapsulated by molding.

[0008] In one embodiment, the transmitting module is divided into at least two levels according to its radiated power, and / or the receiving module is divided into at least two levels according to its received intensity. When the transmitting module and the receiving module are stacked, different levels of the optocouplers are obtained by connecting the transmitting modules and the receiving modules of different levels in a stacked manner.

[0009] In one embodiment, a first limiting connection structure is formed on the transmitting module, and a second limiting connection structure is formed on the receiving module. The first limiting connection structure and the second limiting connection structure cooperate to align the light-emitting surface with the light-incident surface and connect the transmitting module and the receiving module.

[0010] Secondly, this application provides an optocoupler, comprising: An emitting module, comprising a light-emitting device and a first encapsulating adhesive for encapsulating the light-emitting device, wherein the surface of the emitting module has a light-emitting surface; A receiving module, the receiving module including a receiving device and a second encapsulating adhesive for encapsulating the receiving device, the surface of the receiving module having a light incident surface; The transmitting module and the receiving module are stacked opposite each other on the light-emitting surface and the light-incident surface and are fixedly connected by a connecting structure.

[0011] In one embodiment, the first encapsulating adhesive includes a first light-transmitting adhesive and a first light-shielding adhesive. The first light-transmitting adhesive encapsulates the light-emitting device, and the first light-shielding adhesive is encapsulated outside the first light-transmitting adhesive, with the first light-transmitting adhesive partially exposed to form the light-emitting surface; and / or, the second encapsulating adhesive includes a second light-transmitting adhesive and a second light-shielding adhesive. The second light-transmitting adhesive encapsulates the receiving device, and the second light-shielding adhesive is encapsulated outside the second light-transmitting adhesive, with the second light-transmitting adhesive partially exposed to form the light-incident surface.

[0012] In one embodiment, the first encapsulating adhesive includes a first light-transmitting adhesive, which encapsulates the light-emitting device to form the emitting module. The second encapsulating adhesive includes a second light-transmitting adhesive, which encapsulates the receiving device to form the receiving module. The emitting module and the receiving module form a module. The optocoupler also includes a light-shielding adhesive that encapsulates and covers the outside of the module. The light-shielding adhesive also forms the connection structure that fixes the emitting module and the receiving module together.

[0013] In one embodiment, the transmitting module includes a first limiting connection structure, and the receiving module includes a second limiting connection structure. The first limiting connection structure and the second limiting connection structure constitute the connection structure. Through the cooperation of the first limiting connection structure and the second limiting connection structure, the light-emitting surface is aligned with the light-incident surface, and the transmitting module and the receiving module are fixedly connected.

[0014] According to the optocoupler manufacturing method and optocoupler in the above embodiments, the optocoupler is formed by stacking a transmitting module and a receiving module. In the manufacturing process of the optocoupler, the transmitting module and the receiving module are manufactured separately. When manufacturing the transmitting module, the light-emitting device is encapsulated with a first encapsulating adhesive. When manufacturing the receiving module, the receiving device is encapsulated with a second encapsulating adhesive. The optocoupler is obtained by stacking and connecting the transmitting module and the receiving module. In this way, the production process of the optocoupler no longer involves the stacking operation of the light-emitting device and the receiving device, avoiding the easy contact of parts due to the stacking operation, which could lead to quality problems in the optocoupler and improve the yield rate of optocoupler manufacturing.

[0015] Furthermore, since the transmitting and receiving modules are already packaged, they can both be used independently as photosensitive modules, further expanding the applications of the optocoupler. Attached Figure Description

[0016] Figure 1 This is a cross-sectional view of the optocoupler in some embodiments of this application. The cross-sections of the first light-transmitting adhesive, the second light-transmitting adhesive, the transmitting bracket, and the receiving bracket are not shown in the figure. Figure 2 This is a cross-sectional view of the emitting module of the optocoupler in some embodiments of this application. The cross-sections of the first light-transmitting adhesive and the emitting bracket are not shown in the figure. Figure 3 This is a cross-sectional view of the receiving module of the optocoupler in some embodiments of this application. The cross-sections of the second light-transmitting adhesive and the receiving bracket are not shown in the figure. Figure 4 This is a cross-sectional view of the optocoupler in some other embodiments of this application. The cross-sections of the first light-transmitting adhesive, the second light-transmitting adhesive, the transmitting bracket, and the receiving bracket are not shown in the figure. Figure 5 This is a flowchart of an optocoupler manufacturing method in some embodiments of this application; Figure 6 This is a schematic diagram of the structure of the whole plate launcher in some embodiments of this application; Figure 7 This is a schematic diagram of the structure of the whole plate receiving bracket in some embodiments of this application; Figure 8 This is a schematic diagram showing that, in some embodiments of this application, the transmitting and receiving modules of the optocoupler are separated and used as a photosensor, and the sensing area is not blocked by the target being measured. Figure 9 This is a schematic diagram showing the sensing area being blocked by the target object when the transmitting and receiving modules of the optocoupler are separated and used as a photosensor in some embodiments of this application.

[0017] List of feature names corresponding to the labels in the figure: 10. Emitting module; 101. Light-emitting device; 102. First encapsulating adhesive; 1021. First light-transmitting adhesive; 1022. First light-shielding adhesive; 103. Light-emitting surface; 104. Emitting bracket; 105. First crystal wire; 106. Silicone; 107. First limiting connection structure; 1071. First limiting post; 1072. First limiting hole; 20. Receiving module; 201. Receiving device; 202. Second encapsulating adhesive; 2021. Second light-transmitting adhesive; 2022. Second light-shielding adhesive; 203. Light-incident surface; 204. Receiving bracket; 205. Second crystal wire; 206. Second limiting connection structure; 2061. Second limiting post; 2062. Second limiting hole; 30. Light-blocking adhesive; 40. Target being tested. Detailed Implementation

[0018] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0019] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments, and the operational steps involved in each embodiment can also be rearranged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for clearly describing a particular embodiment and do not imply that they represent the necessary components and / or order.

[0020] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0021] This application provides an optocoupler; please refer to [reference needed]. Figure 1 The optocoupler includes a transmitting module 10 and a receiving module 20. The transmitting module 10 can convert electricity into light and emit it, while the receiving module 20 can receive the light emitted by the transmitting module 20 and convert the light back into electricity for transmission.

[0022] For the structure of the transmitting module 10, please refer to [reference needed]. Figure 2 The emitting module 10 includes a light-emitting device 101 and a first encapsulating adhesive 102 for encapsulating the light-emitting device 101. The light-emitting device 101 can emit light when powered. In some embodiments, the light-emitting device 101 is a chip capable of emitting infrared light. In other embodiments, the light-emitting device 101 can also be, but is not limited to, a light-emitting diode (LED), a laser diode, a vertical-cavity surface-emitting laser, etc. As those skilled in the art can understand, the light-emitting device 101 can be any light-emitting element in the prior art or future art that can be applied to an optocoupler.

[0023] In some embodiments, the first encapsulating adhesive 102 includes a first light-transmitting adhesive 1021 and a first light-shielding adhesive 1022. The first light-transmitting adhesive 1021 encapsulates the light-emitting device 101 and has light-transmitting capability. The first light-shielding adhesive 1022 is encapsulated outside the first light-transmitting adhesive 1021, and the first light-shielding adhesive 1022 blocks light and forms an opaque outer shell of the emitting module 10. The first light-shielding adhesive 1022 does not completely cover the first light-transmitting adhesive 1021. The portion of the first light-transmitting adhesive 1021 not covered by the first light-shielding adhesive 1022 constitutes the light-emitting surface 103 of the emitting module 10, through which the light emitted by the light-emitting device 101 can be emitted.

[0024] In some embodiments, please refer to Figure 2 The first light-transmitting adhesive 1021 forms a portion of the light-emitting surface 103 that is planar and flush with the end plane of the outer shell formed by the first light-shielding adhesive 1022. In some other embodiments, the light-emitting surface 103 may be recessed within the outer shell or protrude from it. In some embodiments, the first light-transmitting adhesive 1021 is a white adhesive containing silicon powder, and the first light-shielding adhesive 1022 is a black adhesive. The material composition of the first light-transmitting adhesive 1021 and the first light-shielding adhesive 1022 is prior art. Those skilled in the art will understand that the first light-transmitting adhesive 1021 and the first light-shielding adhesive 1022 can be any material suitable for optocouplers in the prior art or future art, and will not be elaborated further here.

[0025] The emitting module 10 also includes an emitting bracket 104 corresponding to the light-emitting device 101. The emitting bracket 104 is a conductive component, partly located inside the shell formed by the first light-shielding adhesive 1022, and partly passing through the shell formed by the first light-shielding adhesive 1022 and located outside the first light-shielding adhesive 1022. The outer part constitutes the pins for connecting the optocoupler to the external circuit. The structure and material of the emitting bracket 104 are also existing technologies and will not be described in detail here.

[0026] The light-emitting device 101 is placed on one end of the emitting bracket 104 located inside the first light-shielding adhesive 1022, and the light-emitting device 101 is electrically connected to the emitting bracket 104 through the first crystal wire 105. Silicone (also called silicone) 106 is encapsulated between the light-emitting device 101 and the emitting bracket 104. The silicone 106 is located between the first light-transmitting adhesive 1021 and the light-emitting device 101. The silicone 106 has a certain degree of softness and can protect the fragile light-emitting device 101.

[0027] Please refer to Figure 3The receiving module 20 includes a receiving device 201 and a second encapsulating adhesive 202 for encapsulating the receiving device 201. The receiving device 201 is capable of receiving light and converting the light into electricity. In some embodiments, the receiving device 201 is a receiving chip. In other embodiments, the receiving device 201 may also be, but is not limited to, a photoresistor, a photodiode, a phototransistor, etc. As those skilled in the art will understand, the receiving device 201 can be any component in the prior art or future art that can be used in an optocoupler to convert light into electricity.

[0028] In some embodiments, the second encapsulating adhesive 202 includes a second light-transmitting adhesive 2021 and a second light-shielding adhesive 2022. The second light-transmitting adhesive 2021 encapsulates the receiving device 201 and has light-transmitting capability. The second light-shielding adhesive 2022 is encapsulated outside the second light-transmitting adhesive 2021, and the second light-shielding adhesive 2022 blocks light and forms an opaque outer shell of the receiving module 20. The second light-shielding adhesive 2022 does not completely cover the second light-transmitting adhesive 2021. The portion of the second light-transmitting adhesive 2021 not covered by the second light-shielding adhesive 2022 constitutes the light-incident surface 203 of the receiving module 20, through which light emitted by the light-emitting device 101 can enter the receiving module 20.

[0029] In some embodiments, please refer to Figure 3 The second light-transmitting adhesive 2021 forms a portion of the light-incident surface 203 that is planar and flush with the end plane of the outer shell formed by the second light-shielding adhesive 2022. In some other embodiments, the light-incident surface 203 may be recessed within the outer shell or protrude from it. In some embodiments, the second light-transmitting adhesive 2021 is a white adhesive containing silicon powder, and the second light-shielding adhesive 2022 is a black adhesive. The materials of the second light-transmitting adhesive 2021 and the second light-shielding adhesive 2022 are prior art. Those skilled in the art will understand that the second light-transmitting adhesive 2021 and the second light-shielding adhesive 2022 can be any material suitable for optocouplers in the prior art or future art, and will not be elaborated further here.

[0030] The receiving module 20 also includes a receiving bracket 204 corresponding to the receiving device 201. The receiving bracket 204 is a conductive component, partly located inside the outer shell formed by the second light-shielding adhesive 2022, and partly passing through the outer shell formed by the second light-shielding adhesive 2022 and located outside the second light-shielding adhesive 2022. The outer part constitutes the pins for connecting the optocoupler to the external circuit. The structure and material of the receiving bracket 204 are also existing technologies and will not be described in detail here.

[0031] The receiving device 201 is placed on one end of the receiving bracket 204 located inside the second light-shielding adhesive 2022, and the receiving device 201 is electrically connected to the receiving bracket 204 through the second crystal wire 205.

[0032] The transmitting module 10 and the receiving module 20 can be manufactured separately. During assembly, the light-emitting surface 103 of the transmitting module 10 and the light-incident surface 203 of the receiving module 20 are aligned, and then the transmitting module 10 and the receiving module 20 are fixedly connected by a connecting structure to form an optocoupler.

[0033] Regarding the connection structure, please refer to [reference needed] in some embodiments. Figure 1 , Figure 2 and Figure 3 The connection structure includes a first limiting connection structure 107 located on the transmitting module 10 and a second limiting connection structure 206 located on the receiving module 20.

[0034] The first limiting connection structure 107 includes a plurality of first limiting posts 1071 and a plurality of first limiting holes 1072 formed on the end face of the first light-shielding adhesive 1022. Here, the end face refers to the end face of the first light-shielding adhesive 1022 facing the receiving module 20. The second limiting connection structure 206 includes a plurality of second limiting posts 2061 and a plurality of second limiting holes 2062 formed on the end face of the second light-shielding adhesive 2022. Here, the end face refers to the end face of the second light-shielding adhesive 2022 facing the transmitting module 10. During stacking assembly, the first limiting posts 1071 and the second limiting holes 2062 are aligned, and the second limiting posts 2061 and the first limiting holes 1072 are aligned. Through the mating and alignment of the limiting posts and limiting holes, the light-emitting surface 103 and the light-incident surface 203 can be aligned, while also achieving a fixed connection between the transmitting module 10 and the receiving module 20. Those skilled in the art will understand that, for this connection to be achieved, the limiting posts and limiting holes should be an interference fit.

[0035] In some other embodiments, the first limiting connection structure 107 can be an annular rib formed on the end face of the first light-shielding adhesive 1022, and the second limiting connection structure 206 can be an annular groove formed on the end face of the second light-shielding adhesive 2022.

[0036] By controlling the dimensional accuracy of the transmitting module 10 and the receiving module 20, it can be ensured that the junction of the transmitting module 10 and the receiving module 20 is free from light leakage and interference from external light. Of course, in other embodiments, to more reliably ensure that the junction of the transmitting module 10 and the receiving module 20 is free from light leakage, after the transmitting module 10 and the receiving module 20 are stacked and connected, the junction of the transmitting module 10 and the receiving module 20 can be sealed with an adhesive that has light-shielding ability.

[0037] In some other embodiments, the connection structure may only serve a connection function without limiting the position. In this case, the connection structure between the transmitting module 10 and the receiving module 20 may be a connecting adhesive layer with different materials on the inner and outer parts. The part corresponding to the light-emitting surface 103 and the light-incident surface 203 has light transmission capability, and the part corresponding to the first light-shielding adhesive 1022 and the second light-shielding adhesive 2022 can block light.

[0038] In other embodiments, the optocoupler may also have other structures; please refer to [reference needed]. Figure 4 The first encapsulating adhesive 102 includes a first light-transmitting adhesive 1021, which encapsulates the light-emitting device 101 to form an emitting module 10. The second encapsulating adhesive 202 includes a second light-transmitting adhesive 2021, which encapsulates the receiving device 201 to form a receiving module 20. The emitting module 10 and the receiving module 20 form a module. The optocoupler also includes a light-shielding adhesive 30 encapsulated outside the module. During the manufacturing of the optocoupler, the emitting module 10 and the receiving module 20 are stacked to form a module, and then the light-shielding adhesive 30 is encapsulated and covered outside the module. The light-shielding adhesive 30 cures to form a light-shielding shell, which not only serves to shield light but also acts as a connecting structure to fix the emitting module 10 and the receiving module 20 together.

[0039] This application also provides a method for manufacturing an optocoupler, which enables the manufacture of an optocoupler with the above-described structure.

[0040] Please refer to Figures 1-5 The optocoupler manufacturing method includes encapsulating a light-emitting device 101 with a first encapsulating adhesive 102 to form an emitting module 10, and forming a light-emitting surface 103 on the surface of the emitting module 10. It also includes encapsulating a receiving device 201 with a second encapsulating adhesive 202 to form a receiving module 20, and forming a light-incident surface 203 on the surface of the receiving module 20. The emitting module 10 and the receiving module 20 are manufactured separately, eliminating the need for stacking operations of the light-emitting device 101 and the receiving device 201 during the optocoupler manufacturing process, thus reducing the risk of quality problems in the optocoupler product.

[0041] After fabricating the transmitting module 10 and the receiving module 20, the transmitting module 10 and the receiving module 20 are stacked together so that the light-emitting surface 103 and the light-incident surface 203 are facing each other, and the transmitting module 10 and the receiving module 20 are fixedly connected to obtain an optocoupler.

[0042] For the manufacturing of the transmitting module 10, please refer to some embodiments. Figure 2The first encapsulating adhesive 102 includes a first light-transmitting adhesive 1021 and a first light-shielding adhesive 1022. In the process of encapsulating the light-emitting device 101 with the first encapsulating adhesive 102 to form the emitting module 10, the light-emitting device 101 is first encapsulated with the first light-transmitting adhesive 1021 by molding, and then the first light-shielding adhesive 1022 is encapsulated outside the first light-transmitting adhesive 1021. The first light-shielding adhesive 1022 does not completely cover the first light-transmitting adhesive 1021. The exposed part of the first light-transmitting adhesive 1021 constitutes the light-emitting surface 103 of the emitting module 10.

[0043] For the manufacturing of the receiving module 20, please refer to some embodiments. Figure 2 The second encapsulating adhesive 202 includes a second light-transmitting adhesive 2021 and a second light-shielding adhesive 2022. In the process of forming the receiving module 20 by encapsulating the receiving device 201 with the second encapsulating adhesive 202, the receiving device 201 is first encapsulated by the second light-transmitting adhesive 2021 by molding, and then the second light-shielding adhesive 2022 is encapsulated outside the second light-transmitting adhesive 2021. The second light-shielding adhesive 2022 does not completely cover the second light-transmitting adhesive 2021. The exposed part of the second light-transmitting adhesive 2021 constitutes the light-incident surface 203 of the receiving module 20.

[0044] When manufacturing the transmitting module 10, a first limiting connection structure 107 is formed on the transmitting module 10, and a second limiting connection structure 206 is formed on the receiving module 20. The first limiting connection structure 107 and the second limiting connection structure 206 cooperate to align the light-emitting surface 103 with the light-incident surface 203 and connect the transmitting module 10 and the receiving module 20.

[0045] In some embodiments, when forming the first limiting connection structure 107, a first limiting post 1071 and a first limiting hole 1072 are formed on the end face of the first light-shielding adhesive 1022. Here, the end face refers to the end face of the first light-shielding adhesive 1022 facing the receiving module 20. When forming the second limiting connection structure 206, a second limiting post 2061 and a second limiting hole 2062 are formed on the end face of the second light-shielding adhesive 2022. Here, the end face refers to the end face of the second light-shielding adhesive 2022 facing the transmitting module 10. During the stacking assembly, the first limiting post 1071 and the second limiting hole 2062 are aligned, and the second limiting post 2061 and the first limiting hole 1072 are aligned. By fitting and limiting the aligned limiting post and the limiting hole, the light-emitting surface 103 and the light-incident surface 203 can be aligned, and the transmitting module 10 and the receiving module 20 can also be fixedly connected. Those skilled in the art will understand that, in order to achieve the connection, the limiting post and the limiting hole should be an interference fit.

[0046] This optocoupler manufacturing method, employing separate molding—with the transmitting module 10 and receiving module 20 molded separately—avoids defects such as wire collapse and bracket deformation caused by stacking the light-emitting device 101, receiving device 201, and crystal wires in an exposed environment, thus improving yield. Furthermore, the use of a limiting design on each module effectively solves the problem of precise positioning of each unit on each bracket in traditional optocoupler processes. This significantly improves the alignment accuracy of the optocoupler after stacking, ensuring the efficiency and stability of optical signal transmission and enhancing the current conversion ratio (CTR) compliance during optocoupler production.

[0047] In other embodiments, please refer to Figure 4 The first encapsulating adhesive 102 is the first light-transmitting adhesive 1021, and the second encapsulating adhesive 202 is the second light-transmitting adhesive 2021. The light-emitting device 101 is encapsulated by the first light-transmitting adhesive 1021 to form the emitting module 10, and the receiving device 201 is encapsulated by the second light-transmitting adhesive 2021 to form the receiving module 20. The emitting module 10 and the receiving module 20 are stacked to form a module. The module is then encapsulated by covering the outside of the module with light-shielding adhesive 30. While the light-shielding adhesive 30 is cured to form a light-shielding shell, it also realizes the fixed connection between the emitting module 10 and the receiving module 20.

[0048] In some embodiments, to produce optocouplers of different levels, before stacking, the transmitting module 10 is divided into at least two levels according to the radiation power, and the receiving module 20 is divided into at least two levels according to the receiving intensity. When the transmitting module 10 and the receiving module 20 are stacked, different levels of optocouplers are obtained by connecting the transmitting module 10 and the receiving module 20 of different levels.

[0049] In some embodiments, before stacking, the radiated power of the transmitting module 10 can be tested, and based on the test results, the mass-produced transmitting modules 10 can be divided into three transmission levels: Ea, Eb, and Ec. Correspondingly, the receiving module 20 can be tested for receiving strength, and based on the test results, the mass-produced receiving modules 20 can be divided into three receiving levels: Ra, Rb, and Rc. This allows for flexible pairing to obtain optocouplers with different current conversion ratios (CTR) to meet different customer needs. If a customer requires an optocoupler of a specific level, pairing can be performed according to that level, greatly improving pairing flexibility. The pairing results are as follows: The Ea-level transmitting module 10 and the Ra-level receiving module 20 form an L-level optocoupler; The Ea-level transmitting module 10 and the Rb-level receiving module 20 form an A-level optocoupler; The Ea-level transmitting module 10 and the Rc-level receiving module 20 form a B-level optocoupler; The Eb-class transmitting module 10 and the Ra-class receiving module 20 together form a Class A optocoupler; The Eb-level transmitting module 10 and the Rb-level receiving module 20 form a Class B optocoupler; The Eb-class transmitting module 10 and the Rc-class receiving module 20 form a C-class optocoupler; The Ec-class transmitting module 10 and the Ra-class receiving module 20 form a Class B optocoupler; The Ec-class transmitting module 10 and the Rb-class receiving module 20 form a C-class optocoupler; The Ec-class transmitting module 10 and the Rc-class receiving module 20 together form a D-class optocoupler.

[0050] In some other embodiments, the transmitting module 10 and the receiving module 20 can be divided into more levels, such as four, five, or more levels. Of course, it can also be divided into fewer than three levels, such as two levels. The number of levels in the transmitting module 10 and the receiving module 20 can also be different; for example, the transmitting module 10 can be divided into three levels, and the receiving module 20 into two or four levels. Alternatively, only one of the transmitting module 10 and the receiving module 20 can be divided into levels.

[0051] The optocoupler manufacturing method in this application employs a molding process, where a first encapsulating adhesive 102 encapsulates a light-emitting device 101 and a transmitting bracket 104 to form a transmitting module 10, and a second encapsulating adhesive 202 encapsulates a receiving device 201 and a receiving bracket 204 to form a receiving module 20. Therefore, the transmitting module 10 and the receiving module 20 can be mass-produced. Please refer to [reference needed]. Figure 6 It can produce a complete board of transmitter brackets 104, which includes multiple transmitter brackets 104 arranged in an array. Multiple transmitter modules 10 can be molded from this complete board of transmitter brackets 104 in a single process. Similarly, please refer to... Figure 7 It can produce a whole board of receiver brackets 204, which includes multiple receiver brackets 204 arranged in an array. Based on the whole board of receiver brackets 204, multiple receiver modules 20 can be produced in one molding process. This enables mass production of optocouplers.

[0052] Additionally, please refer to Figure 2 , Figure 3 , Figure 8 and Figure 9Based on the structure where the outer surface of the first light-transmitting adhesive 1021 of the transmitting module 10 is encapsulated and covered by the first light-shielding adhesive 1022, and the outer surface of the second light-transmitting adhesive 2021 of the receiving module 20 is encapsulated and covered by the second light-shielding adhesive 2022, the transmitting module 10 has a specific light-emitting direction, the receiving module 20 has a specific light-incident direction, and the transmitting module 10 and the receiving module 20 are structurally independent. This allows the transmitting module 10 and the receiving module 20 of this application to not only be combined together to realize the traditional optocoupler function, but also to be separated into independent light sensors as needed.

[0053] Please refer to Figure 8 and Figure 9 When used as a photosensor, the transmitting module 10 and the receiving module 20 are arranged at intervals on both sides of the channel through which the target 40 passes, with the light-emitting surface 103 and the light-incident surface 203 facing each other, forming a sensing area between the light-emitting surface 103 and the light-incident surface 203. When the target 40 is not in the sensing area, please refer to... Figure 8 The receiving module 20 can receive the optical signal emitted by the transmitting module 10 and convert it into an electrical signal for output. When the target 40 is in the sensing area, please refer to... Figure 9 When the light signal is blocked by the target 40, the receiving module 20 cannot receive the light signal emitted by the transmitting module 10, and the receiving module 20 has no electrical signal output. Utilizing this characteristic, a photosensor can be constructed to detect the presence or absence of the target 40. This can be applied to office equipment (such as printers) to detect the presence or absence of paper, or to industrial control (such as motors) to monitor motor speed and product counting on production lines, greatly expanding the product's uses and application areas.

[0054] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A method for manufacturing an optocoupler, characterized in that, include: A light-emitting module is formed by encapsulating a light-emitting device with a first encapsulating adhesive, and a light-emitting surface is formed on the surface of the light-emitting module. A receiving module is formed by encapsulating the receiving device with a second encapsulating adhesive, and a light incident surface is formed on the surface of the receiving module. The transmitting module and the receiving module are stacked together so that the light-emitting surface and the light-incident surface face each other, and the transmitting module and the receiving module are fixedly connected.

2. The method for manufacturing an optocoupler as described in claim 1, characterized in that, The step of encapsulating a light-emitting device with a first encapsulating adhesive to form an emitting module, and forming a light-emitting surface on the surface of the emitting module, includes: the first encapsulating adhesive includes a first light-transmitting adhesive and a first light-shielding adhesive; the light-emitting device is encapsulated with the first light-transmitting adhesive, and then the first light-shielding adhesive is encapsulated on the outside of the first encapsulating adhesive, with the first light-transmitting adhesive partially exposed to form the light-emitting surface; and / or, the step of encapsulating a receiving device with a second encapsulating adhesive to form a receiving module, and forming a light-incident surface on the surface of the receiving module, includes: the second encapsulating adhesive includes a second light-transmitting adhesive and a second light-shielding adhesive; the receiving device is encapsulated with the second light-transmitting adhesive, and then the second light-shielding adhesive is encapsulated on the outside of the second encapsulating adhesive, with the second light-transmitting adhesive partially exposed to form the light-incident surface.

3. The method for manufacturing an optocoupler as described in claim 1, characterized in that, The step of encapsulating the light-emitting device with a first encapsulating adhesive to form an emitting module, and forming a light-emitting surface on the surface of the emitting module, includes: the first encapsulating adhesive is a first light-transmitting adhesive, and the light-emitting device is encapsulated with the first light-transmitting adhesive; the step of encapsulating the receiving device with a second encapsulating adhesive to form a receiving module, and forming a light-incident surface on the surface of the receiving module, includes: the second encapsulating adhesive is a second light-transmitting adhesive, and the receiving device is encapsulated with the second light-transmitting adhesive; the step of fixing the emitting module and the receiving module together includes: stacking the emitting module and the receiving module to form a module, and then encapsulating the module with a light-shielding adhesive.

4. The method for manufacturing an optocoupler as described in claim 2 or 3, characterized in that, The first light-emitting device is encapsulated by molding; and / or the second light-emitting device is encapsulated by molding.

5. The method for manufacturing an optocoupler as described in any one of claims 1-3, characterized in that, The transmitting module is divided into at least two levels according to its radiated power, and / or the receiving module is divided into at least two levels according to its received intensity. When the transmitting module and the receiving module are stacked, different levels of the optocouplers are obtained by connecting the transmitting module and the receiving module of different levels in a stacked manner.

6. The method for manufacturing an optocoupler as described in any one of claims 1-3, characterized in that, A first limiting connection structure is formed on the transmitting module, and a second limiting connection structure is formed on the receiving module. The first limiting connection structure and the second limiting connection structure cooperate to align the light-emitting surface with the light-incident surface and connect the transmitting module and the receiving module.

7. An optocoupler, characterized in that, include: An emitting module, comprising a light-emitting device and a first encapsulating adhesive for encapsulating the light-emitting device, wherein the surface of the emitting module has a light-emitting surface; A receiving module, the receiving module including a receiving device and a second encapsulating adhesive for encapsulating the receiving device, the surface of the receiving module having a light incident surface; The transmitting module and the receiving module are stacked opposite each other on the light-emitting surface and the light-incident surface and are fixedly connected by a connecting structure.

8. The optocoupler as described in claim 7, characterized in that, The first encapsulating adhesive includes a first light-transmitting adhesive and a first light-shielding adhesive. The first light-transmitting adhesive encapsulates the light-emitting device, and the first light-shielding adhesive is encapsulated outside the first light-transmitting adhesive, with the first light-transmitting adhesive partially exposed to form the light-emitting surface; and / or, the second encapsulating adhesive includes a second light-transmitting adhesive and a second light-shielding adhesive. The second light-transmitting adhesive encapsulates the receiving device, and the second light-shielding adhesive is encapsulated outside the second light-transmitting adhesive, with the second light-transmitting adhesive partially exposed to form the light-incident surface.

9. The optocoupler as described in claim 7, characterized in that, The first encapsulating adhesive includes a first light-transmitting adhesive, which encapsulates the light-emitting device to form the emitting module. The second encapsulating adhesive includes a second light-transmitting adhesive, which encapsulates the receiving device to form the receiving module. The emitting module and the receiving module form a module. The optocoupler also includes a light-shielding adhesive that encapsulates and covers the outside of the module. The light-shielding adhesive also forms the connection structure to fix the emitting module and the receiving module together.

10. The optocoupler as described in claim 7 or 8, characterized in that, The transmitting module includes a first limiting connection structure, and the receiving module includes a second limiting connection structure. The first limiting connection structure and the second limiting connection structure constitute the connection structure. Through the cooperation of the first limiting connection structure and the second limiting connection structure, the light-emitting surface is aligned with the light-incident surface, and the transmitting module and the receiving module are fixedly connected.

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