Light-emitting element transfer device and method for transferring light-emitting elements

Abstract

Disclosed are a light-emitting element transfer apparatus and a method for transferring a light-emitting element. The light-emitting element transfer apparatus includes: a first transfer head; the second transfer head is arranged below the first transfer head; the impression is arranged below the second transfer head; a tilt adjusting member for adjusting the tilt of the second transfer head; and an air supply member for forming an air layer by injecting air downward from one surface of the second transfer head.

Description

[0001] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2024-0124523, filed on September 12, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to a transfer device for a light-emitting element and a method for transferring a light-emitting element using the device. Background Technology

[0003] The importance of display devices has increased with the development of multimedia. In response, various types of display devices, such as organic light-emitting diode ("OLED") and liquid crystal display ("LCD"), are being used.

[0004] Devices that display images, including display panels such as light-emitting display panels or liquid crystal display panels, as display devices. Among these display panels, light-emitting display panels may include light-emitting diodes (“LEDs”), and as light-emitting diodes, they include organic light-emitting diodes that use organic materials as fluorescent materials or inorganic light-emitting diodes that use inorganic materials as fluorescent materials. Summary of the Invention

[0005] When manufacturing display panels that use inorganic light-emitting diodes as light-emitting diodes, it is desirable to develop a manufacturing apparatus for arranging micro-LEDs on the substrate of the display panel.

[0006] However, the features of the disclosure are not limited to those set forth herein. The above and other features of the disclosure will become more apparent to a person skilled in the art upon which it pertains by referring to the detailed description of the disclosure given below.

[0007] In the disclosed embodiments, the light-emitting element transfer device includes: a first transfer head; a second transfer head disposed below the first transfer head; an impression mold disposed below the second transfer head; a tilt adjustment member for adjusting the tilt of the second transfer head; and an air supply member for forming an air layer by spraying air downward from a surface of the second transfer head.

[0008] In one embodiment, the air supply component includes: an air supply section for supplying air; a nozzle disposed on the surface of the second transfer head and having an orifice through which air is ejected; and an ejection line penetrating the second transfer head and connecting the air supply section and the nozzle.

[0009] In the embodiments, the pore is at least one of a single-pore type and a multi-pore type.

[0010] In this embodiment, the air supply unit is an air pump.

[0011] In one embodiment, the first transfer head has a cavity with a defined downward opening, and the width of the opening is smaller than the width of the cavity.

[0012] In one embodiment, the second transfer head is divided into a first part disposed inside the cavity, a third part disposed outside the first transfer head, and a second part disposed between the first part and the third part, wherein the width of the second part is narrower than the width of the first part and the third part.

[0013] In one embodiment, the tilt adjustment member includes: a first permanent magnet disposed on the first transfer head; and a second permanent magnet disposed on a first portion of the second transfer head, facing the first permanent magnet and having a repulsive force with the first permanent magnet.

[0014] In one embodiment, the second transfer head has a chuck on one side and uses the chuck to pick up the impression.

[0015] In one embodiment, the second transfer head is divided into a first part disposed inside the cavity, a third part disposed outside the first transfer head, a second part disposed between the first part and the third part, and an inclined portion disposed between the first part and the second part, wherein the width of the second part is narrower than the width of the first part and the width of the third part.

[0016] In one embodiment, the tilt adjustment member includes: a plurality of second permanent magnets disposed on the first portion and the tilt portion; and a plurality of first permanent magnets disposed on the first transfer head corresponding to the plurality of second permanent magnets.

[0017] In one embodiment, the light-emitting element transfer device further includes a pressure member disposed within the cavity of the first transfer head between the first transfer head and the second transfer head, which presses the second transfer head downward.

[0018] In this embodiment, the pressure-applying component is a spring.

[0019] In one embodiment, the pressurizing component includes: an elastic membrane disposed in the cavity of the first transfer head on the second transfer head; a gas tube connected between the elastic membrane and the cavity; and a gas supply component for supplying gas to the gas tube.

[0020] In this embodiment, the first transfer head, the second transfer head, and the tilt adjustment member are pneumatic gyroscopes.

[0021] In this embodiment, multiple nozzles are provided, and the multiple nozzles are discontinuously arranged around the printing mold.

[0022] In one embodiment, a single nozzle is provided, and the nozzles are arranged continuously around the printing mold.

[0023] In a disclosed embodiment, a method for transferring a light-emitting element includes: setting the aforementioned transfer device on a substrate; lowering the transfer device and forming an air layer between a second transfer head and the substrate via an air supply member, wherein the thickness of the air layer is greater than the sum of the height of the mold and the height of the light-emitting element; adjusting the flatness of the transfer device to the flatness of the substrate; and lowering the second transfer head downward to pressurize the air layer so that the light-emitting element contacts the substrate and the light-emitting element is transferred to the substrate, wherein the thickness of the air layer is equal to the sum of the height of the mold and the height of the light-emitting element.

[0024] In one embodiment, during the step of setting the transfer device on the substrate, the light-emitting element set on the mold is aligned on the substrate based on a first alignment key set on one side of the mold and a second alignment key set on the substrate.

[0025] In one embodiment, in the step of adjusting the flatness of the transfer device to match the flatness of the substrate, the tilt adjustment member adjusts the second transfer head to match the flatness of the substrate while the second transfer head is not in contact with the first transfer head.

[0026] In an embodiment, during the step of lowering the transfer device and forming an air layer between the second transfer head and the substrate via an air supply member, the air supply unit supplies air to the nozzle along the spray line, causing the nozzle to spray air in a downward direction to form an air layer.

[0027] The advantages and features of the disclosed embodiments are that they provide a light-emitting element transfer device capable of effectively transferring light-emitting elements and a transfer method using the light-emitting element transfer device.

[0028] By means of embodiments of the method for manufacturing a display panel, high-precision alignment can be performed by ensuring the relative flatness of the light-emitting element and the substrate without the light-emitting element contacting the substrate. Therefore, the product quality of the display panel can be improved, and the yield can be increased by reducing defects in the light-emitting element. Specifically, the effect can be excellent on large-area substrates.

[0029] However, the effects disclosed are not limited to those mentioned above, and various other effects are included in the specification. Attached Figure Description

[0030] The above and other embodiments, advantages and features of this disclosure will become more apparent from the more detailed description of the embodiments of this disclosure with reference to the accompanying drawings.

[0031] Figure 1 This is a layout diagram illustrating an embodiment of the display device.

[0032] Figure 2 It is shown Figure 1 A diagram of an embodiment of pixels.

[0033] Figure 3 It is shown Figure 1 A diagram of another embodiment of the pixels.

[0034] Figure 4 It shows along Figure 2 A cross-sectional view of an embodiment of a display panel cut along line A-A'.

[0035] Figure 5 This is a schematic diagram illustrating an embodiment of the light-emitting element transfer device.

[0036] Figure 6 This is a schematic diagram illustrating an embodiment of the transfer device.

[0037] Figure 7 This is a plan view of an embodiment of the nozzle.

[0038] Figure 8 It is used to show Figure 7 A diagram illustrating an embodiment of the operation of the air injection component.

[0039] Figures 9 to 12 It is a plan view used to show the number and shape of the nozzles.

[0040] Figure 13A This diagram illustrates the operation of a light-emitting element transfer device without a tilt adjustment member and an air injection member. Figure 13B yes Figure 13A Enlarged view of the dotted and dashed part.

[0041] Figure 14 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0042] Figure 15 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0043] Figure 16 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0044] Figure 17 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0045] Figure 18 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0046] Figure 19 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0047] Figure 20This is a flowchart illustrating the method for transferring light-emitting elements.

[0048] Figures 21 to 25 This is a cross-sectional view used to illustrate the method of transferring light-emitting elements.

[0049] Figure 26 This is a perspective view of a smartwatch, including its display device.

[0050] Figure 27 and Figure 28 It is a perspective view of a virtual reality (“VR”) device, including a display device.

[0051] Figure 29 It is a perspective view of a VR device, including the display device.

[0052] Figure 30 It is a perspective view showing the vehicle's instrument cluster and central dashboard, including the display unit.

[0053] Figure 31 It is a perspective view of a transparent display device, including the display device. Detailed Implementation

[0054] Embodiments will now be described more fully below with reference to the accompanying drawings. However, embodiments may be provided in different forms and should not be construed as limiting. Throughout the disclosure, the same reference numerals denote the same components. In the drawings, the thickness of layers and regions may be exaggerated for clarity.

[0055] In order to describe the disclosed embodiments, some parts that are not related to the description may be omitted.

[0056] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on said other layer or substrate, or an intermediary layer may be present. Conversely, when an element is referred to as being "directly on" another element, an intermediary element may not be present.

[0057] Furthermore, the phrase "in a plan view" means when viewing a portion of the object from above, and the phrase "in a schematic sectional view" means when viewing a schematic section taken by vertically cutting a portion of the object from the side. The terms "overlapping with" or "overlapping" mean that the first object may be above, below, or to the side of the second object, or vice versa. Additionally, the term "overlapping with" can include layering, stacking, facing or oriented, extending over, covering or partially covering, or any other suitable term as would be understood and appreciated by one of ordinary skill in the art. The expression "not overlapping" can include meanings such as "separated," "offset," or "deviation," and any other suitable equivalent as would be understood and appreciated by one of ordinary skill in the art. The terms "facing" and "oriented" can mean that the first object may be directly or indirectly opposite the second object. In the case where a third object is located between the first and second objects, the first and second objects, although still facing each other, can be understood as being indirectly opposite each other.

[0058] For ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or component and another, as shown in the accompanying drawings. It will be understood that, in addition to the orientation depicted in the drawings, spatial relative terms are also intended to encompass different orientations of the device during use or operation. For example, in the case where the device shown in the drawings is flipped, a device positioned “below” or “under” another device may be placed “above” another device. Therefore, the descriptive term “below” can include both lower and upper positions. The device may also be oriented in other directions, and thus spatial relative terms can be interpreted differently depending on the orientation.

[0059] When an element is referred to as being "connected" or "joined" to another element, the element may be "directly connected" or "directly joined" to the other element, or "electrically connected" or "electrically joined" to the other element, and one or more intermediary elements may be placed between the element and the other element. It will also be understood that when the terms "comprising," "including," "having," and / or variations thereof are used, they may indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not preclude the presence or addition of other features, integrals, steps, operations, elements, components, and / or any combinations thereof.

[0060] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another, or to facilitate their description and explanation. For example, without departing from the teaching herein, when discussing “first element” in a description, “first element” may be referred to as “second element” or “third element,” and “second element” and “third element” may be named in a similar manner.

[0061] As used herein, the terms “about” or “approximately” include the stated value and mean: within an acceptable deviation of the specific value, as determined by one of ordinary skill in the art, taking into account the measurement being discussed and errors associated with the measurement of the specific quantity (e.g., limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0062] In the specification and claims, the term "and / or" is intended, for the purposes of its meaning and interpretation, to include any combination of the terms "and" and "or". For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in a conjunctional or disjunctive sense and can be understood as equivalent to "and / or". In the specification and claims, the phrase "at least one of..." is intended, for the purposes of its meaning and interpretation, to include "at least one selected from the group of...". For example, "at least one of A and B" can be understood to mean "A, B, or A and B".

[0063] Unless otherwise defined or implied, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense unless clearly defined in the specification.

[0064] In the following description, illustrative embodiments will be described with reference to the accompanying drawings.

[0065] Figure 1 This is a layout diagram illustrating an embodiment of the display device. Figure 2 It is shown Figure 1 A diagram of an embodiment of pixels. Figure 3 It is shown Figure 1 A diagram of another embodiment of the pixels.

[0066] Reference Figures 1 to 3 The display device 10 is a device for displaying video or still images, such as mobile phones, smartphones, tablet personal computers (“PCs”) and portable electronic devices (such as smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (“PMPs”), navigation and ultra-mobile PCs (“UMPCs”) and displays for various products (such as televisions, laptops, monitors, billboards and Internet of Things (“IoT”) devices).

[0067] The display panel 100 can be formed as a quadrilateral plane (e.g., a rectangular plane having a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1). The corner where the long side in the first direction DR1 and the short side in the second direction DR2 intersect can be rounded to have a predetermined curvature or formed as a right angle. The planar shape of the display panel 100 is not limited to a rectangle and can be formed in other polygonal, circular, or elliptical shapes. The display panel 100 can be formed as flat, but is not limited to this. In an embodiment, the display panel 100 is formed at the left and right ends and can include curved portions with constant or varying curvature. In addition, the display panel 100 can be flexible (e.g., capable of being bent, folded, rolled up).

[0068] The display panel 100 may further include pixels PX for displaying images, scan lines extending in a first direction DR1, and data lines extending in a second direction DR2. The pixels PX may be arranged in a matrix in the first direction DR1 and the second direction DR2.

[0069] Each of the pixels PX can include, for example Figure 2 and Figure 3 The diagram shows multiple sub-pixels RP, GP, and BP. Figure 2 and Figure 3 In this embodiment, each of the pixels PX includes three sub-pixels RP, GP, and BP (that is, the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP), but the disclosed embodiments are not limited thereto.

[0070] The first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be connected to one of the data lines and at least one of the scan lines.

[0071] Each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a rectangular, square, or rhomboid planar shape. In an embodiment, for example, as shown... Figure 2As shown, each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a planar shape with a short side in the first direction DR1 and a long side in the second direction DR2. In an alternative embodiment, as... Figure 3 As shown, each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a planar shape including a square or a rhombus with sides of the same length in the first direction DR1 and the second direction DR2.

[0072] like Figure 2 As shown, the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be set on the first direction DR1. In an alternative embodiment, one of the second sub-pixel GP and the third sub-pixel BP and the first sub-pixel RP can be set on the first direction DR1, and the remaining (other) one of the second sub-pixel GP and the third sub-pixel BP and the first sub-pixel RP can be set on the second direction DR2. In embodiments, for example, as... Figure 3 As shown, the first sub-pixel RP and the second sub-pixel GP can be set on the first direction DR1, and the first sub-pixel RP and the third sub-pixel BP can be set on the second direction DR2.

[0073] In an alternative embodiment, one of the first sub-pixel RP and the third sub-pixel BP, and the second sub-pixel GP, can be set on the first direction DR1, and the remaining (another) one of the first sub-pixel RP and the third sub-pixel BP, and the second sub-pixel GP, can be set on the second direction DR2. In another alternative embodiment, one of the first sub-pixel RP and the second sub-pixel GP, and the third sub-pixel BP, can be set on the first direction DR1, and the remaining one of the first sub-pixel RP and the second sub-pixel GP, and the third sub-pixel BP, can be set on the second direction DR2.

[0074] The first sub-pixel RP may include a first light-emitting element that emits a first light, the second sub-pixel GP may include a second light-emitting element that emits a second light, and the third sub-pixel BP may include a third light-emitting element that emits a third light. Here, the first light may be light in the red band, the second light may be light in the green band, and the third light may be light in the blue band. The red band may be a band of about 600 nm to 750 nm, the green band may be a band of about 480 nm to 560 nm, and the blue band may be a band of about 370 nm to 460 nm, but the disclosed embodiments are not limited thereto.

[0075] Each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP may include an inorganic light-emitting element having inorganic semiconductors as a light-emitting element. In embodiments, the inorganic light-emitting element may be, for example, a flip-chip type microlight-emitting diode (“LED”), but the disclosed embodiments are not limited thereto.

[0076] like Figure 2 and Figure 3 As shown, the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be substantially the same, but the disclosed embodiments are not limited thereto. At least one of the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be different from the others. In an alternative embodiment, any two of the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be substantially the same, and the remaining one can be different from the two. In an alternative embodiment, the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be different from each other.

[0077] Figure 4 It shows along Figure 2 A cross-sectional view of an embodiment of a display panel cut along line A-A'.

[0078] Reference Figure 4 The display panel 100 may include a thin-film transistor layer (TFTL) and a light-emitting element (LE) disposed on a substrate SUB. The TFTL may be a layer on which thin-film transistors (TFTs) are formed.

[0079] The thin-film transistor layer (TFTL) may include an active layer (ACT), a first gate layer (GTL1), a second gate layer (GTL2), a first data metal layer (DTL1), a second data metal layer (DTL2), a third data metal layer (DTL3), and a fourth data metal layer (DTL4). Furthermore, the TFTL includes a buffer film (BF), a gate insulating film (130), a first intermediate insulating film (141), a second intermediate insulating film (142), a first planarization film (160), a first insulating film (161), a second planarization film (180), a second insulating film (181), and a third planarization film (190).

[0080] The substrate SUB can be a base substrate or base component used to support a display device. The substrate SUB can be a rigid substrate comprising or composed of glass, but the disclosed embodiments are not limited thereto. The substrate SUB can be a flexible substrate capable of being bent, folded, rolled, etc. In this case, the substrate SUB can include an insulating material such as a polymer resin (such as polyimide (“PI”)).

[0081] A buffer membrane (BF) can be disposed on one surface of the substrate (SUB). The buffer membrane (BF) can be a membrane used to prevent the penetration of air or moisture. The buffer membrane (BF) can comprise or consist of multiple inorganic membranes stacked alternately. In embodiments, the buffer membrane (BF) can be formed as a multilayer of one or more of the following inorganic membranes: silicon nitride layer, silicon oxynitride layer, silicon oxide layer, titanium oxide layer, and aluminum oxide layer. The buffer membrane (BF) may be omitted.

[0082] The active layer ACT can be disposed on the buffer film BF. The active layer ACT can include silicon semiconductors such as polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, and amorphous silicon, or it can include oxide semiconductors.

[0083] The active layer ACT may include a channel TCH of a thin-film transistor (TFT), a first electrode TS1, and a second electrode TD. The channel TCH of the TFT may be a region on a third-direction DR3, which is the thickness direction of the substrate SUB, stacked with the gate electrode TG of the TFT. The first electrode TS1 of the TFT may be disposed on one side of the channel TCH, and the second electrode TD may be disposed on the opposite side of the channel TCH. The first electrode TS1 and the second electrode TD of the TFT may be regions on the third-direction DR3 that are not stacked with the gate electrode TG. The first electrode TS1 and the second electrode TD of the TFT may be regions in which ions are doped in silicon semiconductor or oxide semiconductor to achieve conductivity.

[0084] The gate insulating film 130 may be disposed on the active layer ACT. The gate insulating film 130 may include or be composed of inorganic films, such as silicon nitride layer, silicon oxynitride layer, silicon oxide layer, titanium oxide layer or aluminum oxide layer.

[0085] The first gate layer GTL1 may be disposed on the gate insulating film 130. The first gate layer GTL1 may include the gate electrode TG of the thin-film transistor TFT and the first capacitor electrode CAE1. The first gate layer GTL1 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or any alloy thereof.

[0086] The first intermediate insulating film 141 may be disposed on the first gate layer GTL1. The first intermediate insulating film 141 may include an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, or may be composed of an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0087] The second gate layer GTL2 can be disposed on the first intermediate insulating film 141. The second gate layer GTL2 may include a second capacitor electrode CAE2. The second gate layer GTL2 can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or any alloy thereof. The capacitor Cst is formed by the first capacitor electrode CAE1 and the second capacitor electrode CAE2.

[0088] The second intermediate insulating film 142 may be disposed on the second gate layer GTL2. The second intermediate insulating film 142 may include an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, or may be composed of an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0089] A first data metal layer DTL1, including a first connecting electrode CE1, a first sub-pad (also referred to as a "solder pad"), and a data line, can be disposed on the second intermediate insulating film 142. The data line can be integrally formed with the first sub-pad, but the disclosed embodiments are not limited thereto. The first data metal layer DTL1 can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or any alloy thereof.

[0090] The first connection electrode CE1 can be connected to the first electrode TS1 or the second electrode TD of the thin-film transistor TFT through the first contact hole CT1 that penetrates the gate insulating film 130, the first intermediate insulating film 141, and the second intermediate insulating film 142.

[0091] A first planarization film 160 may be disposed on a first data metal layer DTL1 to planarize the steps caused by the active layer ACT, the first gate layer GTL1, the second gate layer GTL2, and the first data metal layer DTL1. The first planarization film 160 may be formed of an organic film such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, or a polyimide resin layer.

[0092] The second data metal layer DTL2 can be disposed on the first planarization film 160. The second data metal layer DTL2 may include a second connection electrode CE2 and a second sub-pad. The second connection electrode CE2 can be connected to the first connection electrode CE1 through a second contact hole CT2 penetrating the first insulating film 161 and the first planarization film 160. The second data metal layer DTL2 can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or any alloy thereof.

[0093] The second planarization film 180 may be disposed on the second data metal layer DTL2. The second planarization film 180 may include an organic film such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, a polyimide resin layer, etc., or be composed of an organic film such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, a polyimide resin layer, etc.

[0094] A third data metal layer DTL3 may be disposed on the second planarization film 180. The third data metal layer DTL3 may include a third connection electrode CE3 and a third sub-pad. The third connection electrode CE3 may be connected to the second connection electrode CE2 through a third contact hole CT3 penetrating the second insulating film 181 and the second planarization film 180. The third data metal layer DTL3 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or any alloy thereof.

[0095] The third planarization film 190 may be disposed on the third data metal layer DTL3. The third planarization film 190 may include an organic film such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, or a polyimide resin layer, or be composed of an organic film such as an acrylic resin layer, an epoxy resin layer, a phenolic resin layer, a polyamide resin layer, or a polyimide resin layer.

[0096] A fourth data metal layer, DTL4, may be disposed on the third planarization film 190. The fourth data metal layer, DTL4, may include an anode pad electrode, APD, a cathode pad electrode, and a fourth sub-pad. The anode pad electrode, APD, may be connected to the third connection electrode, CE3, via a fourth contact hole, CT4, penetrating the third planarization film 190. The cathode pad electrode, CPD, may be supplied with a first power supply voltage as a relatively low potential voltage. The fourth data metal layer, DTL4, may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or any alloy thereof.

[0097] The light-emitting element LE is shown as a flip-chip microLED in which the first contact electrode CTE1 and the second contact electrode CTE2 are configured to face the anode pad electrode APD and the cathode pad electrode CPD, but is not limited thereto. The light-emitting element LE can be an inorganic light-emitting element comprising an inorganic material such as GaN or composed of an inorganic material such as GaN. The light-emitting element LE can have lengths of several micrometers (μm) to several hundred micrometers (μm) in a first direction DR1, a length in a second direction DR2, and a length in a third direction DR3, respectively. In an embodiment, the light-emitting element LE can have lengths of approximately 100 μm or less in the first direction DR1, the second direction DR2, and the third direction DR3, respectively.

[0098] Light-emitting elements (LEs) can be grown and formed on a semiconductor substrate such as a silicon wafer. Each LE can be directly transferred from the silicon wafer to the anode pad electrode (APD) and cathode pad electrode (CPD) of the substrate SUB. In this case, the first contact electrode (CTE1) and the anode pad electrode (APD) can be bonded to each other via a bonding process. Furthermore, the second contact electrode (CTE2) and the cathode pad electrode (CPD) can be bonded to each other via a bonding process. The first contact electrode (CTE1) and the anode pad electrode (APD) can be electrically connected to each other via a bonding electrode (23). Furthermore, the second contact electrode (CTE2) and the cathode pad electrode (CPD) can be electrically connected to each other via the bonding electrode (23).

[0099] In an embodiment, the bonding electrode 23 may be disposed on one side of the light-emitting element LE. The bonding electrode 23 may be a bonding product obtained by pressure fusion bonding using a laser. Here, pressure fusion bonding refers to a state in which the bonding electrode 23 is heated and melted, and the light-emitting element LE, the anode pad electrode APD, and the cathode pad electrode CPD melt and mix, and then cool and solidify when the laser supply is terminated. Since the light-emitting element LE, the anode pad electrode APD, and the cathode pad electrode CPD maintain conductivity while cooling and solidifying in a molten and mixed state, the anode pad electrode APD, the cathode pad electrode CPD, and the light-emitting element LE can be electrically connected and physically connected, respectively. Therefore, the bonding electrode 23 may be disposed on the first contact electrode CTE1 and the second contact electrode CTE2 of the light-emitting element LE.

[0100] The bonding electrode 23 may include, for example, Au, AuSn, PdIn, InSn, NiSn, Au-Au, AgIn, AgSn, Al, Ag, or carbon nanotubes (CNTs). Each of these may be used alone or in combination of two or more.

[0101] Each of the light-emitting elements (LE) can be a light-emitting structure comprising a substrate (SPUB), an n-type semiconductor (NSEM), an active layer (MQW), a p-type semiconductor (PSEM), a first contact electrode (CTE1), and a second contact electrode (CTE2).

[0102] The substrate SPUB can be a sapphire substrate, but the disclosed embodiments are not limited to this.

[0103] An n-type semiconductor NSEM can be disposed on one surface of a substrate SPUB. In an embodiment, for example, the n-type semiconductor NSEM can be disposed on the bottom surface of the substrate SPUB. The n-type semiconductor NSEM can include GaN doped with n-type conductive dopants such as Si, Ge, Sn, etc., or can be composed of GaN doped with n-type conductive dopants such as Si, Ge, Sn, etc.

[0104] The active quantum well (MQW) layer can be disposed on a portion of the surface of an n-type semiconductor NSEM. The MQW layer can comprise materials having a single quantum well structure or a multiple quantum well structure. When the MQW layer comprises a material with a multiple quantum well structure, it can have a structure in which multiple well layers and multiple barrier layers are alternately stacked. In this case, the well layers can comprise or be composed of InGaN, and the barrier layers can comprise or be composed of GaN or AlGaN, but are not limited thereto. In alternative embodiments, the MQW layer can have a structure in which semiconductor materials with relatively large band gaps and semiconductor materials with relatively small band gaps are alternately stacked, and can comprise different group III to group V semiconductor materials depending on the wavelength of the emitted light.

[0105] In the disclosed embodiments, a flip-chip type light-emitting element has been described, but it is not limited thereto, and a vertical type light-emitting element can also be used.

[0106] Figure 5 This is a schematic diagram illustrating an embodiment of a light-emitting element transfer device LTD.

[0107] The light-emitting element transfer device LTD in the embodiment is a device for transferring light-emitting elements.

[0108] like Figure 5 As shown, the light-emitting element transfer device LTD has a drive device DU, a transfer device TDU, a platform STG, and a controller CTU.

[0109] The drive unit DU enables the transfer unit TDU to move up, down, left, and right. The drive unit DU may include an XY drive unit DU-1 and a Z drive unit DU-2.

[0110] The XY drive unit DU-1 moves the transfer device TDU, on which the light-emitting element LE is placed, above the platform STG.

[0111] The Z-drive unit DU-2 lowers the transfer device TDU so that the picked-up light-emitting element LE is brought close to the substrate TS at a predetermined distance.

[0112] The transfer unit (TDU) is a device used to pick up light-emitting elements (LEs).

[0113] For example, the transfer device TDU may include one of an electrostatic chuck, an adhesive chuck, a vacuum chuck, and a porous vacuum chuck. The transfer device TDU can lift the light-emitting element (LE) by using the chuck to pick up the light-emitting element (LE). In the embodiment, an example of transferring the light-emitting element (LE) to the substrate TS is shown, but it is not limited to this and can be applied to SOI flip-chip mounting in which flip chips are attached to bumps arranged in an array on the substrate TS, and can also be applied to so-called die bonding in which the light-emitting element (LE) is bonded to the substrate TS.

[0114] Reference Figure 6 Describe the structure of the transfer unit (TDU) in detail.

[0115] The platform STG supports the substrate TS. The platform STG can be mounted at the center of the XY drive unit DU-1 based on the substrate. The platform STG can be mounted to be movable in the Y direction, but is not limited to this.

[0116] The controller CTU is connected to the drive unit DU and the transfer unit TDU, and performs the transfer process by controlling the operation of these components. For example, the controller CTU is provided with an interface (not shown) for sending and receiving signals between the aforementioned components such as the drive unit DU and the transfer unit TDU. The controller CTU provides feedback on the process for the aforementioned joining based on detection results from a camera or sensor, etc. In an embodiment, for example, the controller CTU identifies the alignment key between the light-emitting element LE and the substrate TS based on an image captured by a camera, detects the position, and controls the XY drive unit DU-1 and the Z drive unit DU-2 based on the detection results to perform control related to the transfer operation of aligning the position of the light-emitting element LE.

[0117] Next, the structure of the aforementioned transfer device TDU will be described.

[0118] Figure 6 This is a schematic diagram illustrating an embodiment of the transfer device. Figure 7 This is a plan view of the nozzle. Figure 8 It is used to show Figure 7 A diagram illustrating the operation of the air injection component.

[0119] Reference Figure 6The transfer device TDU may include a first transfer head 210, a second transfer head 220, an impression 230, a tilt adjustment member 240, and an air injection member (also known as an air supply member) 250.

[0120] The first transfer head 210 is connected to the Z drive unit DU-2 and is intended to support the second transfer head 220.

[0121] The first transfer head 210 has a cavity with a defined downward opening. The width of the opening may be smaller than the width of the cavity.

[0122] The second transfer head 220 can be positioned below the first transfer head 210.

[0123] The second transfer head 220 can be divided into a first part 220-a, a second part 220-b, and a third part 220-c. The first part 220-a is disposed within the cavity of the first transfer head 210, the third part 220-c is disposed outside the first transfer head 210, and the second part 220-b is disposed between the first part 220-a and the third part 220-c. The second part 220-b can be disposed at the opening of the cavity.

[0124] The second portion 220-b may be narrower than the first portion 220-a and the third portion 220-c, such that the first portion 220-a can be fitted into the cavity of the first transfer head 210. The first portion 220-a may have a shape that conforms to the shape of the cavity of the first transfer head 210. In embodiments, for example, when the cavity is quadrilateral (e.g., rectangular), the first portion 220-a may also have a quadrilateral shape (e.g., rectangular shape).

[0125] The second transfer head 220 may include a chuck 221 on one side, which is one of an electrostatic chuck, an adhesive chuck, a vacuum chuck, and a porous vacuum chuck. In an embodiment, for example, the chuck 221 may be disposed on one side of the third portion 220-c. The impression 230 can be adsorbed onto one side of the second transfer head 220 via the chuck 221.

[0126] The impression 230 can be set on the lower part of the second transfer head 220.

[0127] The impression 230 may include multiple layers. In an embodiment, for example, the impression 230 may include a substrate layer and an impression layer.

[0128] The substrate layer can support the impression layer. The substrate layer may include, for example, polyethylene terephthalate (“PET”), polyurethane (PU), polyimide (“PI”), polycarbonate (“PC”), polyethylene (“PE”), polypropylene (“PP”), polysulfone (“PSF”), polymethyl methacrylate (“PMMA”), cellulose triacetate (“TAC”), cyclic olefin polymer (“COP”), etc., or be composed of, for example, polyethylene terephthalate (“PET”), polyurethane (PU), polyimide (“PI”), polycarbonate (“PC”), polyethylene (“PE”), polypropylene (“PP”), polysulfone (“PSF”), polymethyl methacrylate (“PMMA”), cellulose triacetate (“TAC”), cyclic olefin polymer (“COP”), etc.

[0129] An impression layer is disposed on one side of the substrate layer. The impression layer includes multiple protrusions 230-d and can adhere to or bond the light-emitting element LE. The impression layer may include or be composed of adhesives or bonding materials, including, for example, optically clear adhesives (“OCA”), pressure-sensitive adhesives (“PSA”), etc., and the adhesive material may include, for example, acrylic, urethane, or silicone adhesives. One end of the multiple protrusions 230-d is flat, and the shape of the protrusions 230-d may be a polygonal prism or a cylinder.

[0130] The tilt adjustment member 240 can adjust the relative flatness between the impression 230 and the substrate TS by adjusting the tilt of the second transfer head 220.

[0131] The tilt adjustment member 240 may include a plurality of permanent magnets. The tilt adjustment member 240 is formed of multiple pairs of permanent magnets. Each pair of permanent magnets may include a plurality of first permanent magnets 241 and a plurality of second permanent magnets 242. The plurality of first permanent magnets 241 may be attached to a first transfer head 210. The plurality of second permanent magnets 242 may be attached to a second transfer head 220. In an embodiment, for example, the plurality of second permanent magnets 242 may be attached to a first surface 220-a1, a second surface 220-a2, a third surface 220-a3, and a fourth surface 220a-4 of a first portion 220-a of the second transfer head 220. The plurality of first permanent magnets 241 may be configured to face the plurality of second permanent magnets 242 within the cavity of the first transfer head 210. The number of first permanent magnets 241 is the same as the number of second permanent magnets 242.

[0132] Therefore, the first permanent magnet 241 and the second permanent magnet 242 are arranged to face each other. Furthermore, the first permanent magnet 241 and the second permanent magnet 242 are arranged to face each other with the same polarity. In an embodiment, for example, the S pole of the first permanent magnet 241 and the S pole of the second permanent magnet 242 face each other. The magnetic balance between the opposing magnetic poles of the first permanent magnet 241 and the second permanent magnet 242 prevents them from contacting each other, and the second transfer head 220 is suspended.

[0133] exist Figure 6 In total, there are five pairs of first permanent magnets 241 and second permanent magnets 242, but the number or position of the first permanent magnets 241 and second permanent magnets 242 is not limited to this.

[0134] In addition, the magnetic force between the first permanent magnet 241 and the second permanent magnet 242 serves to return the second transfer head 220 to its original position even when the second transfer head 220 is tilted due to an external force, when the external force is removed.

[0135] Since the second transfer head 220 is suspended by the repulsive force of the first permanent magnet 241 and the second permanent magnet 242, the first transfer head 210 will not tilt even when the second transfer head 220 is tilted. Instead, the second transfer head 220 can tilt according to the flatness of the substrate TS below.

[0136] The air injection component 250 forms an air layer by injecting air downwards from one side of the second transfer head 220.

[0137] In an embodiment, for example, the air jetting component 250 may include a nozzle 251, a jetting line 252, and an air supply unit (also referred to as an air supply section) 253, and air injected from the air supply unit 253 may be discharged through the nozzle 251 along the jetting line 252.

[0138] The nozzle 251 can be disposed around the impression 230 on one side of the second transfer head 220. Since air is discharged downward from the nozzle 251 (e.g., toward the substrate TS), an air layer can be formed between the nozzle 251 and the substrate TS. The thickness of the air layer can be adjusted by the air discharge rate of the air supply unit 253, and can be formed to a thickness such that the light-emitting element LE attached to the impression 230 does not contact the substrate TS.

[0139] The nozzle 251 can be formed into an orifice shape to ensure uniform air spraying, but is not limited thereto. As an embodiment of the orifice structure, it can be formed as follows: Figure 7 The single hole 251-1 shown in (a) can be formed as follows: Figure 7The porous type shown in (b) has multiple holes 251-2 on a predetermined plane, which allows gas to be uniformly injected throughout the entire plane. The shape of the holes in the plan view can include circles, squares, etc., but is not limited thereto.

[0140] In this specification, "in a plan view" is defined as a plan view parallel to a plane defined by a first direction DR1 (or X direction) and a second direction DR2 (or Y direction). In this specification, "in a cross-section" is defined as the state viewed from the first direction DR1 (or X direction) or the second direction DR2 (or Y direction).

[0141] Alternatively, the nozzle 251 can be configured to narrow downwards in cross-section to improve the efficiency of downward air jetting. In an alternative embodiment, the nozzle 251 can be configured to widen downwards.

[0142] The jet line 252 is a tube that supplies gas to the nozzle 251 and can penetrate a portion of the second transfer head 220.

[0143] like Figure 8 As shown, the air supply unit 253 continuously sprays air from the nozzle 251 through the spray line 252 for a predetermined duration. The duration can be the time until the light-emitting element LE, which is disposed on one side of the impression 230, is transferred to the substrate TS.

[0144] When air is ejected downwards from nozzle 251, the second transfer head 220 is pushed upwards in the opposite direction to the air's movement due to the pressure of the ejected air. As a result, the second transfer head 220 can be in a floating state separated from the substrate TS by a first distance ht. The first distance ht can be, for example, the sum of the height h1 of the impression 230 in the Z direction and the height h2 of the light-emitting element LE in the Z direction.

[0145] Air supply unit 253 can supply air. In embodiments, air supply unit 253 can be, for example, an air pump, but is not limited thereto. In embodiments, air supply unit 253 can supply inert or chemically inert gases such as nitrogen (N2), helium (He), neon (Ne), argon (Ar), carbon dioxide (CO2), or any combination thereof.

[0146] The air supply unit 253 may also include a reservoir for storing air (or gas) and a valve for controlling the flow of air (or gas). Furthermore, the air supply unit 253 can inject air into the nozzle 251 via the injection line 252.

[0147] Figures 9 to 12 It is a plan view used to show the number and shape of the nozzles.

[0148] As from Figures 9 to 12 As can be seen, the number and shape of the nozzles 251 can be modified in various ways.

[0149] Reference Figures 9 to 12 The impression 230 may follow the shape of the second transfer head 220 in a plan view. In an embodiment, when the second transfer head 220 has a square shape in a plan view, the shape of the impression 230 in the plan view may also be, for example, a square, but is not limited thereto. In an embodiment, for example, the second transfer head 220 and the impression 230 may be circular. In this specification, "in a plan view" is based on a plan view parallel to the plane defined by the first direction DR1 (or the X direction) and the second direction DR2 (or the Y direction). In this specification, "in a cross section" is defined as the state viewed from the first direction DR1 (or the X direction) or the second direction DR2 (or the Y direction).

[0150] The nozzle 251 can be positioned on one side of the second transfer head 220 around the impression 230. In the plan view, the nozzle 251 is not overlapped with the impression 230.

[0151] Reference Figure 9 and Figure 10 Multiple nozzles 251 can be circular.

[0152] In the embodiments, reference is made to Figure 9 For example, in (a), multiple nozzles 251 may be positioned at each of the four corners of the second transfer head 220.

[0153] Additionally, refer to Figure 9 (b) Multiple nozzles 251 may be positioned at the center of each side of the second transfer head 220.

[0154] In addition, refer to Figure 10 (a) Multiple nozzles 251 may be positioned at each of the four corners of the second transfer head 220 and at the center of each side.

[0155] Additionally, refer to Figure 10 (b) Multiple nozzles 251 may be disposed on each side of the second transfer head 220 except for the four corners of the second transfer head 220. In an embodiment, for example, three nozzles 251 may be disposed on each side, but the number of nozzles 251 is not limited thereto.

[0156] In addition, refer to Figure 10 (c) Multiple nozzles 251 may be arranged at the four corners of the second transfer head 220 and on each side of the second transfer head 220. Each nozzle 251 may be spaced apart from each other at the same interval, but is not limited thereto.

[0157] Reference Figure 11 Multiple nozzles 251 can be polygons with corners.

[0158] Reference Figure 11 (a) Multiple nozzles 251 may be positioned at the four corners of the second transfer head 220 to surround the corners of the impression 230 without overlapping with the impression 230 and spaced apart from the impression 230. In an embodiment, for example, the nozzles 251 may have “ "or" "shape.

[0159] Reference Figure 11 (b) Multiple nozzles 251 may be arranged in a rectangular shape at the center of each side of the second transfer head 220.

[0160] Reference Figure 11 (c) The plurality of nozzles 251 may have different shapes. In an embodiment, for example, the plurality of nozzles 251 may be disposed at the four corners of the second transfer head 220 to surround the corners of the impression 230, and may also be disposed at the center of each side of the square shape of the second transfer head 220.

[0161] Reference Figures 9 to 11 The nozzle 251 can be discontinuously arranged around the impression 230.

[0162] Reference Figure 12 The nozzle 251 can be continuously arranged around the mold 230. In an embodiment, for example, the nozzle 251 can be a single square shape surrounding the mold 230 in the second transfer head 220.

[0163] As from Figures 9 to 12 As can be seen, the number and shape of the nozzles 251 can be modified in various ways.

[0164] Figure 13A This diagram illustrates the operation of a light-emitting element transfer device without a tilt adjustment member and an air injection member. Figure 13B yes Figure 13A Enlarged view of the dotted and dashed part.

[0165] Excluding tilt adjustment components ( Figure 6 240) and air injection components ( Figure 6In the case of the light-emitting element transfer device (250), the light-emitting element LE attached to the impression 230 rotates after touching the surface of the substrate TS due to bending or tilting of the substrate TS. Therefore, due to the rotation of the impression 230, a change occurs in the planar position of the light-emitting element LE. In an embodiment, for example, when the height decreases from one end of the substrate TS to the opposite end, the light-emitting element LE first contacts the end of the substrate TS with the higher height. There is a concern that the light-emitting element LE, which first touches the surface of the substrate TS, may tip over or become misaligned due to the force applied in the planar direction caused by the surface of the substrate TS. This problem is particularly severe in the case of a large-area substrate TS because bending or tilting of the substrate TS occurs frequently.

[0166] Figure 14 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0167] Reference Figure 14 ,and Figure 6 The difference lies in the inclusion of a pressure member 270 between the first transfer head 210 and the second transfer head 220, replacing a pair of permanent magnets. (Refer to above) Figures 6 to 12 The given description can be applied equally to constructions other than the pressure member 270, and the following description will focus on the pressure member 270.

[0168] The pressurizing member 270 is disposed in the cavity of the first transfer head 210 and between the first transfer head 210 and the second transfer head 220, so that the second transfer head 220 can be pressurized while maintaining the space between the first transfer head 210 and the second transfer head 220.

[0169] Additionally, for example, the pressure member 270 may include a spring, but is not limited thereto. When the pressure member 270 is formed as a spring, it can prevent sudden pressure transfer when pressure is applied from the top to the bottom of the first transfer head 210.

[0170] In one embodiment, a pressure member 270 is shown disposed between the first transfer head 210 and the second transfer head 220, but the number of pressure members 270 is not limited. In another embodiment, multiple springs may be disposed between the first transfer head 210 and the second transfer head 220.

[0171] Figure 15 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0172] Reference Figure 15 ,and Figure 6 The difference lies in the inclusion of a pressurizing member 270 between the first transfer head 210 and the second transfer head 220. (Refer to above) Figures 6 to 12The given description can be applied equally to constructions other than the pressure member 270, and the following description will focus on the pressure member 270.

[0173] In an embodiment, the pressurizing member 270 may include an elastic membrane 271, a gas pipe 272, and a gas supply member 273.

[0174] The elastic membrane 271 comprises or is composed of an elastic material such as an elastomer. The elastic membrane 271 may be disposed within the cavity of the first transfer head 210 and between the first transfer head 210 and the second transfer head 220, such that a space S can be formed between the elastic membrane 271 and the first transfer head 210. The pressure member 270 can maintain the space between the first transfer head 210 and the second transfer head 220.

[0175] Gas tube 272 can supply gas into the space S between elastic membrane 271 and first transfer head 210, causing elastic membrane 271 to expand downward. When elastic membrane 271 expands, second transfer head 220 is pressurized.

[0176] Gas supply component 273 supplies gas to space S through gas pipe 272. Gas supply component 273 controls the expansion force of elastic membrane 271, thereby ultimately controlling the pressure applied to second transfer head 220.

[0177] Gas supply component 273 can supply inert gases or gases with very low chemical reactivity (such as nitrogen (N2), helium (He), neon (Ne), argon (Ar), carbon dioxide (CO2), or any combination thereof) to the internal space. In the following text, such inert gases or gases with very low chemical reactivity are collectively referred to as neutral gases.

[0178] Figure 16 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0179] Reference Figure 16 The second transfer head 220 and Figure 6 The difference lies in that an inclined portion 220-ab is also included between the first portion 220-a and the second portion 220-b, and... Figure 6 In comparison, the number of tilt adjustment components 240 is smaller.

[0180] An inclined portion 220-ab is disposed between a first portion 220-a having a first width Wa and a second portion 220-b having a second width Wb, and connects one end of the first portion 220-a and one end of the second portion 220-b, and has an inclined angle with the side parallel to the first surface 220-a1 of the first portion 220-a.

[0181] The tilt adjustment member 240 may be disposed on the first surface 220-a1 and the tilt portion 220-ab of the second transfer head 220, and may include a total of three pairs of permanent magnets. Each pair of permanent magnets may include a plurality of first permanent magnets 241 and a plurality of second permanent magnets 242.

[0182] Multiple first permanent magnets 241 can be attached to a first transfer head 210. Multiple second permanent magnets 242 can be attached to a second transfer head 220. In an embodiment, for example, the multiple second permanent magnets 242 can be attached to a first surface 220-a1 of a first portion 220-a of the second transfer head 220, the surface of an inclined portion 220-ab of the second transfer head 220, and the surface of an inclined portion 220-ab of the second transfer head 220. The multiple first permanent magnets 241 can be configured to face the multiple second permanent magnets 242 within the cavity of the first transfer head 210. The number of first permanent magnets 241 and the number of second permanent magnets 242 can be equal.

[0183] Figure 17 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0184] Reference Figure 17 ,and Figure 16 The difference lies in the inclusion of a pressure member 270 between the first transfer head 210 and the second transfer head 220, replacing a pair of permanent magnets. (The above is in...) Figure 16 The description described herein can be applied in the same way to constructions other than pressure member 270, and the following description will focus on pressure member 270.

[0185] The pressurizing member 270 can be disposed within the cavity of the first transfer head 210, and can also be disposed between the first transfer head 210 and the second transfer head 220. In an embodiment, for example, the pressurizing member 270 can be disposed within the cavity of the first transfer head 210 between the first surface 220-a1 of the first portion 220-a of the second transfer head 220 and the first transfer head 210. Therefore, the second transfer head 220 can be pressurized while maintaining the space between the first transfer head 210 and the second transfer head 220.

[0186] Additionally, for example, the pressure member 270 may include a spring, but is not limited thereto. When the pressure member 270 is formed as a spring and pressure is applied from the top side to the bottom side of the first transfer head 210, sudden pressure transfer can be prevented.

[0187] In one embodiment, a pressure member 270 is shown disposed between the first transfer head 210 and the second transfer head 220, but the number of pressure members 270 is not limited. In another embodiment, for example, multiple springs may be disposed between the first transfer head 210 and the second transfer head 220.

[0188] Figure 18 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0189] Reference Figure 18 ,and Figure 16 The difference lies in the inclusion of a pressure member 270 between the first transfer head 210 and the second transfer head 220, replacing a pair of permanent magnets. (The above is in...) Figure 16 The description described herein can be applied in the same way to constructions other than pressure member 270, and the following description will focus on pressure member 270.

[0190] In an embodiment, the pressurizing member 270 may include an elastic membrane 271, a gas pipe 272, and a gas supply member 273.

[0191] The elastic membrane 271 comprises or is composed of an elastic material such as an elastomer. The elastic membrane 271 may be disposed within the cavity of the first transfer head 210 and between the first transfer head 210 and the second transfer head 220, such that a space S can be formed between the elastic membrane 271 and the first transfer head 210. The pressure member 270 can maintain the space between the first transfer head 210 and the second transfer head 220.

[0192] Gas tube 272 can supply gas into the space S between elastic membrane 271 and first transfer head 210, causing elastic membrane 271 to expand downward. When elastic membrane 271 expands, second transfer head 220 is pressurized.

[0193] Gas supply component 273 supplies gas to space S through gas pipe 272.

[0194] Gas supply component 273 can supply inert gases or gases with very low chemical reactivity (such as nitrogen (N2), helium (He), neon (Ne), argon (Ar), carbon dioxide (CO2), or any combination thereof) to the internal space. In the following text, such inert gases or gases with very low chemical reactivity are collectively referred to as neutral gases.

[0195] Figure 19 This is a schematic diagram illustrating another embodiment of the light-emitting element transfer device.

[0196] Reference Figure 19 The first transfer head 210, the second transfer head 220, and the tilt adjustment member 240 include or are composed of a pneumatic gyroscope AG, and are connected with... Figure 6 The difference lies in the fact that they do not include permanent magnets.

[0197] The pneumatic gyroscope AG can adjust the relative flatness between the impression 230 and the base TS, instead of... Figure 6 The permanent magnet. The relative flatness between the impression 230 and the substrate TS can be adjusted more precisely by using a pneumatic gyroscope AG.

[0198] Figure 20 This is a flowchart illustrating the method for transferring light-emitting elements. Figures 21 to 25 This is a cross-sectional view used to illustrate the method of transferring light-emitting elements. Figures 20 to 25 A cross-sectional view of the structure of the transfer device according to the transfer sequence of the light-emitting elements is shown. Figures 21 to 25 The main components shown are the transfer device TDU and the light-emitting element LE. Figures 21 to 25 They can usually be compared with references. Figures 6 to 12 The sectional view or plan view of the transfer device TDU described corresponds to this. In the following text, it will be combined with... Figure 20 describe Figures 21 to 25 The light-emitting element transfer method is shown in the figure.

[0199] First, a transfer device TDU (Turning Unit) is installed on the substrate TS. Figure 20 (S110 in the middle).

[0200] Reference Figure 21 The light-emitting element LE and the first alignment key AM1 can be attached to the imprint 230 of the transfer device TDU.

[0201] The second alignment key AM2 can be set on the base TS.

[0202] The first alignment bond AM1 and the second alignment bond AM2 can be formed by photolithography.

[0203] As in Figure 5 As described, the transfer device TDU can be set at the desired position by the XY drive unit DU-1 and Z drive unit DU-2 of the light-emitting element transfer device LTD.

[0204] In one embodiment, for example, the transfer device TDU can place the mold 230 onto the substrate TS by checking the relative positions of the first alignment key AM1 and the second alignment key AM2 disposed on the mold 230. In another embodiment, for example, two second alignment keys AM2 are disposed on the substrate TS, and the mold 230 is disposed on the substrate TS such that the first alignment key AM1 faces the second alignment key AM2. By adjusting the position of the transfer device TDU so that the first alignment key AM1 is positioned between the plurality of second alignment keys AM2, the light-emitting element LE can be disposed at a desired position on the substrate TS.

[0205] Second, the air injection component 250 injects air and lowers the transfer device TDU ( Figure 20 (S120 in the middle).

[0206] In an embodiment, for example, such as Figure 22 As shown, air is ejected from a nozzle 251 comprising a single orifice 251-1 and a multi-orifice 251-2, and the transfer device TDU is pressurized downwards.

[0207] Air supply unit 253 supplies air to nozzle 251 along injection line 252, causing nozzle 251 to spray air in a downward direction (e.g., toward substrate TS). As air is ejected from nozzle 251, an air layer can be formed below nozzle 251. The force that pushes substrate TS with second transfer head 220 can be generated by this air layer. When the force of air injection is balanced with the pressing force of transfer device TDU, a constant distance can be maintained between substrate TS and light-emitting element LE. The constant distance can be adjusted by the amount of air injected by air supply unit 253. In addition, when the constant distance is greater than the sum of the height of light-emitting element LE and the height of impression 230, light-emitting element LE may not directly contact substrate TS. Second transfer head 220 is in a non-contact state with substrate TS, but the force of air injection can support second transfer head 220.

[0208] As described above, a magnetic force is generated between the first transfer head 210 and the second transfer head 220 by the tilt adjustment member 240. That is, even when a constant pressing force is applied from above, the second transfer head 220 can be kept in a floating state by the magnetic force of the tilt adjustment member 240 and the injection volume of the air injection member 250.

[0209] Third, the flatness of the second transfer head 220 is adjusted to the flatness of the base TS by the tilt adjustment member 240. Figure 20 (S130).

[0210] In an embodiment, such as Figure 23 As shown, for example, the second transfer head 220 is floated and supported by an air layer formed below the nozzle 251, and the light-emitting element LE is in a non-contact state with the substrate TS, and the movement of the second transfer head 220 can be adjusted such that the flatness of the second transfer head 220 is, for example, the same as the flatness of the substrate TS.

[0211] Therefore, while adjusting the relative flatness of the second transfer head 220 and the substrate TS, the alignment of the light-emitting element LE will not be interfered with.

[0212] Fourth, pressure is applied to the second transfer head 220 to transfer the light-emitting element LE ( Figure 20 (S140 in the middle).

[0213] In an embodiment, such as Figure 24As shown, for example, the second transfer head 220 can be further lowered to pressurize the air layer, thereby bringing the light-emitting element LE into contact with the substrate TS. As a result, the thickness of the air layer can be reduced, allowing the light-emitting element LE to contact the substrate TS. At this time, the thickness (or height) ht of the air layer can be equal to the sum of the height h2 of the light-emitting element LE in the Z direction and the height h1 of the impression 230 in the Z direction.

[0214] The air jet component 250 can control the jet amount to limit the descent position of the light-emitting element LE. In an embodiment, for example, the air jet component 250 can prevent excessive descent of the second transfer head 220 by limiting the minimum jet amount. Since the descent position is limited by the air jet component 250, damage to the light-emitting element LE can be avoided.

[0215] Next, refer to Figure 25 The transfer device TDU can be raised to separate the light-emitting element LE from the mold 230.

[0216] Conventional, known techniques, such as laser irradiation, can be used to separate the impression 230 and the light-emitting element LE.

[0217] Figure 26 This is a perspective view of a smartwatch, including its display device.

[0218] Reference Figure 26 The display device 10_1 in the embodiment can be applied to a smartwatch 1000_1, which is a smart device.

[0219] Figure 27 and Figure 28 It is a perspective view of a virtual reality (“VR”) device, including a display device.

[0220] Reference Figure 27 and Figure 28 The head-mounted display device 1000_2 in the embodiment includes a first display device 10_2, a second display device 10_3, a display device housing 1100, a housing cover 1200, a first eyepiece 1210, a second eyepiece 1220, a headband 1300, a middle frame 1400, a first optical component 1510, a second optical component 1520, and a control circuit board 1600.

[0221] The first display device 10_2 provides an image to the user's left eye, and the second display device 10_3 provides an image to the user's right eye. Each of the first display device 10_2 and the second display device 10_3 is associated with a reference... Figure 1 and Figure 2 The described display devices 10 are substantially the same. Therefore, the description of the first display device 10_2 and the second display device 10_3 will be omitted.

[0222] The first optical component 1510 may be disposed between the first display device 10_2 and the first eyepiece 1210. The second optical component 1520 may be disposed between the second display device 10_3 and the second eyepiece 1220. Each of the first optical component 1510 and the second optical component 1520 may include at least one convex lens.

[0223] The intermediate frame 1400 can be disposed between the first display device 10_2 and the control circuit board 1600, and can also be disposed between the second display device 10_3 and the control circuit board 1600. The intermediate frame 1400 supports and fixes the first display device 10_2, the second display device 10_3, and the control circuit board 1600.

[0224] The control circuit board 1600 can be disposed between the intermediate frame 1400 and the display device housing 1100. The control circuit board 1600 can be connected to the first display device 10_2 and the second display device 10_3 via connectors. The control circuit board 1600 can convert image sources received from the outside into digital video data and transmit the digital video data to the first display device 10_2 and the second display device 10_3 via connectors.

[0225] The control circuit board 1600 can send digital video data corresponding to a left-side image optimized for the user's left eye to a first display device 10_2, and digital video data corresponding to a right-side image optimized for the user's right eye to a second display device 10_3. In an alternative embodiment, the control circuit board 1600 can send the same digital video data to both the first display device 10_2 and the second display device 10_3.

[0226] The display device housing 1100 houses a first display device 10_2, a second display device 10_3, a middle frame 1400, a first optical component 1510, a second optical component 1520, and a control circuit board 1600. A housing cover 1200 is positioned to cover the opening surface of the display device housing 1100. The housing cover 1200 may include a first eyepiece 1210 for the user's left eye and a second eyepiece 1220 for the user's right eye. Although the first eyepiece 1210 and the second eyepiece 1220 are... Figure 27 and Figure 28 The first eyepiece 1210 and the second eyepiece 1220 are set separately, but the embodiments in the instruction manual are not limited to this. The first eyepiece 1210 and the second eyepiece 1220 can also be combined into one.

[0227] The first eyepiece 1210 can be aligned with the first display device 10_2 and the first optical component 1510, and the second eyepiece 1220 can be aligned with the second display device 10_3 and the second optical component 1520. Therefore, the user can view the image of the first display device 10_2 magnified into a virtual image by the first optical component 1510 through the first eyepiece 1210, and can view the image of the second display device 10_3 magnified into a virtual image by the second optical component 1520 through the second eyepiece 1220.

[0228] The headband 1300 secures the display device housing 1100 to the user's head, such that the first eyepiece 1210 and the second eyepiece 1220 of the housing cover 1200 are respectively positioned over the user's left and right eyes. When the display device housing 1100 is made lightweight and compact, the head-mounted display device 1000_2 may include, for example... Figure 29 The eyeglasses frame shown is not the headband 1300.

[0229] Additionally, the head-mounted display device 1000_2 may also include a battery for power supply, an external memory slot for accommodating external memory, and an external connection port and a wireless communication module for receiving image sources. The external connection port may be a Universal Serial Bus (“USB”) terminal, a display port, or a High Definition Multimedia Interface (“HDMI”) terminal, and the wireless communication module may be a 5G communication module, a 4G communication module, a Wi-Fi module, or a Bluetooth module.

[0230] Figure 29 It is a perspective view of a VR device, including the display device. Figure 29 The VR device 1000_3, which has been applied to the display device 10_4 in the embodiment, is shown.

[0231] Reference Figure 29 The VR device 1000_3 in the embodiment can be a glasses-like device. The VR device 1000_3 in the embodiment may include a display device 10_4, a left lens 10a, a right lens 10b, a support frame 20, glasses frame temples 30a and 30b, a reflective member 40, and a display device housing 50.

[0232] exist Figure 29 The example shown illustrates a case where the VR device 1000_3 is an eyeglass-type display device including eyeglass temples 30a and 30b. That is, the VR device 1000_3 in the embodiment is not limited to... Figure 29 The VR device shown in the image can be applied to a variety of other electronic devices in various forms.

[0233] The display device housing 50 can accommodate the display device 10_4 and the reflective member 40. The image displayed on the display device 10_4 can be reflected by the reflective member 40 and provided to the user's right eye through the right lens 10b. Therefore, the user can view the VR image displayed on the display device 10_4 through their right eye.

[0234] Despite Figure 29 The display device housing 50 is located at the right end of the support frame 20, but the embodiments described in the specification are not limited thereto. In one embodiment, for example, the display device housing 50 may be located at the left end of the support frame 20. In this case, the image displayed on the display device 10_4 can be reflected by the reflective member 40 and provided to the user's left eye through the left lens 10a. Therefore, the user can view the VR image displayed on the display device 10_4 through their left eye. In an alternative embodiment, the display device housing 50 may be located at both the right and left ends of the support frame 20. In this case, the user can view the VR image displayed on the display device 10_4 through both their left and right eyes.

[0235] Figure 30 It is a perspective view showing the vehicle's instrument cluster and central dashboard, including the display unit. Figure 30 The display devices 10_a to 10_e in the embodiments are shown in the vehicles in which they have been applied.

[0236] Reference Figure 30 The display devices 10_a to 10_c in the embodiments can be applied to the vehicle's instrument cluster, the vehicle's central instrument panel, or a central information display ("CID") mounted on the vehicle's dashboard. Additionally, the display devices 10_d and 10_e in the embodiments can be applied to interior mirror displays that replace the vehicle's side mirrors.

[0237] Figure 31 It is a perspective view of a transparent display device, including the display device.

[0238] Reference Figure 31 The display device 10_5 in this embodiment can be applied to a transparent display device. A transparent display device can transmit light while displaying an image IM. Therefore, a user located in front of the transparent display device can view not only the image IM displayed on the display device 10_5, but also the object RS or background located behind the transparent display device. When the display device 10_5 is applied to a transparent display device, the substrate of the display device 10_5 may include a light-transmitting portion, or may include or be composed of a light-transmitting material.

[0239] In summarizing the detailed description, those skilled in the art will understand that many variations and modifications can be made to the embodiments without substantially departing from the principles disclosed. Therefore, the disclosed embodiments are used in a general and descriptive sense only and not for limiting purposes.

Claims

1. A light-emitting element transfer device, the light-emitting element transfer device comprising: First transfer head; The second transfer head is positioned below the first transfer head; The impression is positioned below the second transfer head; A tilt adjustment component adjusts the tilt of the second transfer head; as well as An air supply component forms an air layer by spraying air downwards from the surface of the second transfer head.

2. The light-emitting element transfer device according to claim 1, wherein, The air supply component includes: Air supply department, supplies air; A nozzle, disposed on the surface of the second transfer head and having holes through which air is ejected; and The jet line penetrates the second transfer head and connects the air supply unit and the nozzle.

3. The light-emitting element transfer device according to claim 2, wherein, The pore is at least one of a single-pore type and a multi-pore type.

4. The light-emitting element transfer device according to claim 2, wherein, The air supply unit is an air pump.

5. The light-emitting element transfer device according to claim 1, wherein, The first transfer head has a cavity with a defined downward opening, and the width of the opening is smaller than the width of the cavity.

6. The light-emitting element transfer device according to claim 5, wherein, The second transfer head is divided into a first part disposed inside the cavity, a third part disposed outside the first transfer head, and a second part disposed between the first part and the third part, wherein the width of the second part is narrower than the width of the first part and the width of the third part.

7. The light-emitting element transfer device according to claim 6, wherein, The tilt adjustment component includes: a first permanent magnet disposed on the first transfer head; and a second permanent magnet disposed on the first portion of the second transfer head, facing the first permanent magnet, and having a repulsive force with the first permanent magnet.

8. The light-emitting element transfer device according to claim 1, wherein, The second transfer head has a chuck on one side and uses the chuck to hold the impression.

9. The light-emitting element transfer device according to claim 5, wherein, The second transfer head is divided into a first part disposed inside the cavity, a third part disposed outside the first transfer head, a second part disposed between the first part and the third part, and an inclined portion disposed between the first part and the second part. The width of the second part is narrower than the width of the first part and the width of the third part.

10. The light-emitting element transfer device according to claim 9, wherein, The tilt adjustment component includes: a plurality of second permanent magnets disposed on the first part and the tilted part; and a plurality of first permanent magnets disposed on the first transfer head corresponding to the plurality of second permanent magnets.

11. The light-emitting element transfer device according to claim 1, wherein the light-emitting element transfer device further comprises: A pressure-applying component is disposed within the cavity of the first transfer head between the first transfer head and the second transfer head, and presses the second transfer head downward.

12. The light-emitting element transfer device according to claim 11, wherein, The pressure-applying component is a spring.

13. The light-emitting element transfer device according to claim 11, in, The pressurizing component includes: an elastic membrane disposed on the second transfer head within the cavity of the first transfer head; a gas tube connected between the elastic membrane and the cavity; and a gas supply component for supplying gas to the gas tube.

14. The light-emitting element transfer device according to claim 1, wherein, The first transfer head, the second transfer head, and the tilt adjustment component are pneumatic gyroscopes.

15. The light-emitting element transfer device according to claim 2, wherein, The nozzles are configured in multiple ways, and the nozzles are configured discontinuously around the printing mold.

16. The light-emitting element transfer device according to claim 2, wherein, The nozzle is configured as one, and the nozzles are continuously configured to surround the printing mold.

17. A method for transferring a light-emitting element, the method comprising: A transfer device is provided on a substrate, the transfer device comprising: a first transfer head; a second transfer head disposed below the first transfer head; an impression mold disposed below the second transfer head; a tilt adjustment member for adjusting the tilt of the second transfer head; and an air supply member for forming an air layer by spraying air downward from the surface of the second transfer head; The transfer device is lowered and an air layer is formed between the second transfer head and the substrate by the air supply member, wherein the thickness of the air layer is greater than the sum of the height of the mold and the height of the light-emitting element; Adjust the flatness of the transfer device to match the flatness of the substrate; and The second transfer head is lowered downward to pressurize the air layer so that the light-emitting element contacts the substrate and is transferred onto the substrate, wherein the thickness of the air layer is equal to the sum of the height of the mold and the height of the light-emitting element.

18. The method of claim 17, wherein in the step of disposing the transfer device on the substrate, in, The light-emitting element disposed on the mold is aligned on the substrate based on a first alignment key disposed on one side of the mold and a second alignment key disposed on the substrate.

19. The method of claim 17, wherein in the step of adjusting the flatness of the transfer device to the flatness of the substrate, in, The tilt adjustment member adjusts the second transfer head to adjust the second transfer head to the flatness of the substrate while the second transfer head is not in contact with the first transfer head.

20. The method of claim 17, wherein, In the step of lowering the transfer device and forming the air layer between the second transfer head and the substrate by the air supply member, the air supply unit supplies air to the nozzle along the spray line, so that the nozzle sprays air in a downward direction to form the air layer.

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