Light-emitting element transfer device and light-emitting element transfer method

Abstract

The invention relates to a light-emitting element transfer device and a method for transferring a light-emitting element. The light-emitting element transfer device includes: a vacuum chamber for generating or removing a vacuum atmosphere therein; the alignment table is arranged in the vacuum chamber and can move on three axes; a coupling table provided in the vacuum chamber and capable of moving up and down; a portable chuck having a built-in heater and selectively connectable to the alignment table and the coupling table; and a chuck holder coupled with the portable chuck and movable within the vacuum chamber between the alignment table and the bonding table, where the portable chuck engages with the chuck holder to clamp the first substrate on a top surface of the portable chuck and is separated from the chuck holder to not clamp the first substrate on the top surface.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0125559, filed on September 13, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates to a light-emitting element transfer apparatus and a light-emitting element transfer method. Background Technology

[0004] With the development of multimedia, the importance of display devices is increasing. Therefore, various types of display devices are being used, such as organic light-emitting diode (OLED) displays and liquid crystal displays (LCDs).

[0005] Devices that display images as display devices, including display panels such as light-emitting display panels or liquid crystal display panels. Among them, light-emitting display panels may include light-emitting diodes (LEDs), and as light-emitting diodes, they include organic light-emitting diodes that use organic materials as fluorescent materials or inorganic light-emitting diodes that use inorganic materials as fluorescent materials.

[0006] When manufacturing display panels that use inorganic light-emitting diodes as light-emitting diodes, it is necessary to develop transfer equipment for transferring micro-LED devices onto the substrate of the display panel. Summary of the Invention

[0007] The aspects and features of the embodiments of this disclosure are that a light-emitting element transfer apparatus is provided that enables precise alignment and bonding processes to be performed in the same chamber.

[0008] However, the aspects of this disclosure are not limited to those set forth herein. These and other aspects of the disclosure will become more apparent to those skilled in the art upon reference to the following detailed description of the disclosure.

[0009] According to an embodiment, the light-emitting element transfer device includes: a vacuum chamber for generating or removing a vacuum atmosphere inside; an alignment stage disposed inside the vacuum chamber and movable along three axes; a bonding stage disposed inside the vacuum chamber and movable vertically; a portable chuck having a built-in heater and selectively connected to the alignment stage and the bonding stage; and a chuck holder connected to the portable chuck and movable between the alignment stage and the bonding stage inside the vacuum chamber, wherein the portable chuck engages with the chuck holder to clamp a first substrate onto the top surface of the portable chuck, and separates from the chuck holder so that the first substrate is not clamped onto the top surface.

[0010] Portable chucks may also include male connectors for engaging with alignment stages and coupling stages.

[0011] The male connector may include an insertion portion formed such that a portion of the built-in fastening member therein protrudes outward, and the alignment stage and the mating stage may each have a slot-shaped female connector formed on the top surface of the alignment stage and the mating stage at a position corresponding to the male connector and engaging with the male connector.

[0012] The male connector can be a pneumatic clamp, and the female connector can be a positioning ring corresponding to the pneumatic clamp.

[0013] The first transfer head has a cavity with a downward-facing opening, and the width of the opening is less than the width of the cavity.

[0014] The portable chuck may include a mating protrusion, and the chuck retainer may define a mating groove, into which the mating protrusion is inserted and engaged, and the mating protrusion and the mating groove may be electrically connected by engagement.

[0015] The chuck retainer can support at least a portion of the side surface of the portable chuck, thereby exposing the top surface of the portable chuck.

[0016] The light-emitting element transfer device may also include an upper chuck, a second substrate on which the light-emitting element is disposed is attached to the upper chuck, and the upper chuck may be configured to overlap with the alignment stage in a plan view.

[0017] The upper chuck can clamp the second substrate and can move up and down.

[0018] The light-emitting element transfer device may also include a visual component for capturing the position of the first substrate and the second substrate.

[0019] The light-emitting element transfer device may further include: a pressure member disposed on a bonding stage, which applies pressure to a first substrate bonded to a second substrate disposed on the bonding stage and transmits laser light; and a laser member that emits laser light from above the pressure member onto the first substrate bonded to the second substrate disposed on the bonding stage.

[0020] A chuck retainer allows a portable chuck to be inverted.

[0021] The vacuum chamber may include a door located on one side of the vacuum chamber, and a first substrate or a second substrate may enter and exit the vacuum chamber through the door.

[0022] According to an embodiment, a method for transferring a light-emitting element includes: disposing a first substrate on the top surface of a chuck holder; engaging the chuck holder with a portable chuck such that the portable chuck clamps the first substrate; aligning the first substrate disposed on the portable chuck with a second substrate clamped by an upper chuck via an alignment stage engaged with the portable chuck; separating the second substrate from the upper chuck to bond the first substrate and the second substrate; separating the portable chuck from the alignment stage; transferring the portable chuck to a bonding stage via the chuck holder to bond the portable chuck and the bonding stage; and performing a bonding process between the first substrate and the second substrate.

[0023] Engaging the chuck retainer with the portable chuck may include: inserting the engagement protrusion of the portable chuck into the engagement groove of the chuck retainer, thereby connecting the portable chuck and the chuck retainer to each other, and electrically connecting the engagement protrusion and the engagement groove to generate an electrostatic force in the portable chuck to clamp the first substrate.

[0024] When separating the second substrate from the upper chuck, the upper chuck can stop adsorbing or stop holding the second substrate.

[0025] The method may further include: capturing the positions of the first substrate and the second substrate using a vision component.

[0026] When separating the portable chuck from the alignment stage, the portable chuck can be separated from the alignment stage by disconnecting the male connector of the portable chuck from the female connector of the alignment stage.

[0027] Transferring a portable chuck to a mating table may include: moving the chuck retainer to the mating table along a transfer track while simultaneously engaging the chuck retainer to the portable chuck, and bringing the portable chuck close to the mating table such that the male connector of the portable chuck is engaged with the female connector of the mating table.

[0028] Performing the bonding process may include: pressing a first substrate, which is bonded to a second substrate disposed on a portable chuck, by a pressure member; and supplying power to a heater built into the portable chuck to heat the heater and conduct heat to the portable chuck, such that heat is transferred to the first substrate or the joint between the first and second substrates.

[0029] According to one embodiment of this disclosure, the light-emitting element transfer apparatus can continuously perform alignment and bonding processes in a high vacuum environment without opening the vacuum chamber, thereby improving the production efficiency of the light-emitting element transfer apparatus.

[0030] Furthermore, since the alignment and bonding processes can be performed in a high vacuum environment, the penetration of moisture or oxygen into the light-emitting elements of the target substrate can be minimized. Therefore, the reliability of the elements (i.e., display devices) on the target substrate can be effectively improved.

[0031] However, the effects of this disclosure are not limited to those described above, and various other effects are included in this specification. Attached Figure Description

[0032] Figure 1 This is a layout diagram showing a display device according to one embodiment.

[0033] Figure 2 It is shown Figure 1 An exemplary diagram showing examples of pixels.

[0034] Figure 3 It is shown Figure 1 Another example of a diagram showing pixels.

[0035] Figure 4 It shows along Figure 2 A cross-sectional view of an example display panel cut along line A-A'.

[0036] Figure 5 This is a schematic plan view of a light-emitting element transfer device according to one embodiment.

[0037] Figure 6 This is a schematic side view of a light-emitting element transfer device according to one embodiment.

[0038] Figure 7 and Figure 8 It is based on Figure 5 and Figure 6 Enlarged view of the portable chuck, chuck holder, and alignment stage according to the embodiment.

[0039] Figure 9 and Figure 10 It is based on Figure 5 and Figure 6 Enlarged view of the portable chuck, chuck holder, and coupling stage according to the embodiment.

[0040] Figure 11 This is a view showing the inverted state of a portable chuck according to another embodiment.

[0041] Figure 12 This is a flowchart illustrating a light-emitting element transfer method using a light-emitting element transfer device according to one embodiment.

[0042] Figures 13 to 21 This is a schematic diagram of a light-emitting element transfer device, illustrating a light-emitting element transfer method according to one embodiment. Detailed Implementation

[0043] Embodiments will now be described more fully below with reference to the accompanying drawings. However, embodiments may be provided in different forms and should not be construed as limiting. Throughout this disclosure, the same reference numerals denote the same parts. In the drawings, the thickness of layers and regions may be exaggerated for clarity.

[0044] In order to describe embodiments of this disclosure, some parts that are not related to the specification may not be provided.

[0045] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or there may be an intervening layer. Conversely, when an element is referred to as being "directly" on another element, there may be no intervening element.

[0046] Furthermore, the phrase "in a plan view" means when viewed from above (i.e., in a third-direction DR3, which is the thickness direction of the substrate SUB) and the phrase "in a schematic cross-sectional view" means when viewed from the side as a schematic cross-section obtained by vertically cutting the object portion. The terms "overlapping" or "overlapping" mean that the first object may be above or below the second object, or on one side of the second object, and that the second object may be above or below the first object, or on one side of the first object. Additionally, the term "overlapping" can include stacking, overlapping, facing or oriented, extending over, covering or partially covering, or may be any other suitable term as will be understood and appreciated by those skilled in the art. The expression "not overlapping" can include terms such as "separated from," "set beside," or "offset from," and any other suitable equivalent as will be understood and appreciated by those skilled in the art. The terms "facing" and "oriented" can mean that the first object may be directly or indirectly opposite the second object. When a third object is inserted between the first and second objects, the first and second objects can be understood as being indirectly opposite each other, but still facing each other.

[0047] For ease of description, the spatial relative terms “below,” “under,” “down,” “above,” “up,” etc., are used herein to describe the relationship between one element or component and another element or component as shown in the figures. It will be understood that, in addition to the orientation depicted in the figures, the spatial relative terms are intended to include different orientations of the device in use or operation. For example, in the case where the device shown in the figures is flipped, a device positioned “below” or “under” another device can be placed “above” another device. Therefore, the descriptive term “below” can include both a lower position and an upper position. The device may also be oriented in other directions, and therefore the spatial relative terms can be interpreted differently depending on the orientation.

[0048] When an element is referred to as being “connected” or “linked” to another element, the element may be “directly connected” or “directly linked” to the other element, or “electrically connected” or “electrically linked” to the other element with one or more intervening elements inserted between them. It will also be understood that when the terms “comprises,” “comprising,” “has,” “have,” “having,” “includes,” and / or “including” are used, they may specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of other features, integrals, steps, operations, elements, components, and / or any combination thereof.

[0049] It will be understood that although the terms “first,” “second,” “third,” etc., are used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another, or to facilitate its description and explanation. For example, without departing from the teachings herein, when a “first element” is discussed in the specification, it may be referred to as a “second element” or a “third element,” and “second element” and “third element” may be named in a similar manner.

[0050] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), the terms “about” or “approximately” as used herein include the value and mean within an acceptable deviation of the particular value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value.

[0051] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. For example, “an element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. In the specification and claims, for the purposes of their meaning and interpretation, the term “and / or” is intended to include any combination of the terms “and” and “or.” For example, “A and / or B” can be understood to mean “A, B, or A and B.” The terms “and” and “or” can be used in the sense of conjunctions or antonymous conjunctions and can be understood to be equivalent to “and / or.” In the specification and claims, for the purposes of their meaning and interpretation, the phrase “at least one of…” is intended to include the meaning of “at least one selected from the group consisting of….” For example, “at least one of A and B” can be understood to mean “A, B, or A and B.”

[0052] Unless otherwise specified or implied, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and shall not be interpreted as having an idealized or overly formal meaning unless expressly defined in this specification.

[0053] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0054] Figure 1 This is a layout diagram showing a display device according to one embodiment. Figure 2 It is shown Figure 1 An exemplary diagram showing examples of pixels. Figure 3 It is shown Figure 1 Another example of a diagram showing pixels.

[0055] refer to Figures 1 to 3 The display device 100 is a device for displaying video or still images, such as mobile phones, smartphones, tablet computers, and portable electronic devices such as smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigators, and ultra-mobile personal computers (UMPCs), as well as displays for various products such as televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices.

[0056] The display device 100 can be formed as a rectangular plane having a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1. The corner where the long side in the first direction DR1 and the short side in the second direction DR2 intersect can be rounded to have a predetermined curvature or formed as a right angle. The planar shape of the display device 100 is not limited to a rectangle and can be formed as other polygonal, circular, or elliptical shapes. The display device 100 can be flat, but is not limited thereto. For another example, the display device 100 may include curved portions with constant or varying curvature formed at the left and right ends. In addition, the display device 100 can be formed as flexible so that it can be bent, curved, folded, or rolled.

[0057] The display device 100 may further include pixels PX for displaying images, scan lines extending in a first direction DR1, and data lines extending in a second direction DR2. The pixels PX may be arranged in a matrix in the first direction DR1 and the second direction DR2.

[0058] like Figure 2 and Figure 3 As shown, each pixel PX can include multiple subpixels RP, GP, and BP. Figure 2 and Figure 3 In this embodiment, each pixel PX includes three sub-pixels RP, GP, and BP, namely the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP, but the embodiments disclosed herein are not limited thereto.

[0059] The first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be connected to one of the data lines and at least one of the scan lines.

[0060] Each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a rectangular, square, or rhomboid planar shape. For example, as shown... Figure 2 As shown, each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a rectangular planar shape, with a short side in the first direction DR1 and a long side in the second direction DR2. Optionally, as... Figure 3 As shown, each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can have a square or rhomboid planar shape, which includes sides of the same length in the first direction DR1 and the second direction DR2.

[0061] like Figure 2 As shown, the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be set on the first direction DR1. Optionally, one of the second sub-pixel GP and the third sub-pixel BP can be set on the first direction DR1 along with the first sub-pixel RP, and the other can be set on the second direction DR2 along with the first sub-pixel RP. For example, as... Figure 3 As shown, the first sub-pixel RP and the second sub-pixel GP can be set on the first direction DR1, and the first sub-pixel RP and the third sub-pixel BP can be set on the second direction DR2.

[0062] Optionally, one of the first sub-pixel RP and the third sub-pixel BP can be set along with the second sub-pixel GP in the first direction DR1, and the other can be set along with the second sub-pixel GP in the second direction DR2. Alternatively, one of the first sub-pixel RP and the second sub-pixel GP can be set along with the third sub-pixel BP in the first direction DR1, and the remaining one can be set along with the third sub-pixel BP in the second direction DR2.

[0063] The first sub-pixel RP may include a first light-emitting element that emits a first light, the second sub-pixel GP may include a second light-emitting element that emits a second light, and the third sub-pixel BP may include a third light-emitting element that emits a third light. Here, the first light may be light in the red wavelength band, the second light may be light in the green wavelength band, and the third light may be light in the blue wavelength band. The red wavelength band may be a wavelength band of about 600 nanometers (nm) to 750 nm, the green wavelength band may be a wavelength band of about 480 nm to 560 nm, and the blue wavelength band may be a wavelength band of about 370 nm to 460 nm, but the embodiments of this disclosure are not limited thereto.

[0064] Each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP may include an inorganic light-emitting element having an inorganic semiconductor as the light-emitting element. For example, the inorganic light-emitting element may be a flip-chip type microLED (light-emitting diode), but embodiments of this disclosure are not limited thereto.

[0065] like Figure 2 and Figure 3 As shown, the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be substantially the same, but the embodiments of this disclosure are not limited thereto. At least one of the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be different from the others. Optionally, at least two of the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be substantially the same, and the remaining one can be different from the two. Optionally, the areas of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP can be different from each other.

[0066] Figure 4 It shows along Figure 2 A cross-sectional view of an example display panel cut along line A-A'.

[0067] refer to Figure 4 The display device 100 may include a thin-film transistor layer (TFTL) and a light-emitting element (LE) disposed on a substrate SUB. The TFTL may be a layer in which thin-film transistors (TFTs) are formed.

[0068] The thin-film transistor layer (TFTL) may include an active layer (ACT), a first gate layer (GTL1), a second gate layer (GTL2), a first data metal layer (DTL1), a second data metal layer (DTL2), a third data metal layer (DTL3), and a fourth data metal layer (DTL4). Furthermore, the TFTL includes a buffer film (BF), a gate insulating film (130), a first interlayer insulating film (141), a second interlayer insulating film (142), a first planarization film (160), a first insulating film (161), a second planarization film (180), a second insulating film (181), and a third planarization film (190).

[0069] The substrate SUB can be a base substrate or base component used to support other components of the display device 100. The substrate SUB can be a rigid substrate made of glass, but embodiments of this disclosure are not limited thereto. The substrate SUB can be a flexible substrate capable of being bent, folded, rolled, etc. In this case, the substrate SUB can include an insulating material, such as a polymer resin (e.g., polyimide (PI)).

[0070] A buffer film (BF) can be disposed on one surface of the substrate (SUB). The buffer film (BF) can be a membrane used to prevent the penetration of air or moisture. The buffer film (BF) can be formed from multiple alternating layers of inorganic films. For example, the buffer film (BF) can be formed as a multilayer of alternatingly stacked inorganic films, including one or more of silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide layers. The buffer film (BF) can be omitted.

[0071] The active layer ACT can be disposed on the buffer film BF. The active layer ACT may include silicon semiconductors (such as polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon and amorphous silicon), or may include oxide semiconductors.

[0072] The active layer ACT may include a channel TCH of a thin-film transistor (TFT), a first electrode TTS, and a second electrode TD. The channel TCH of the TFT may be a region on a third-direction DR3 that overlaps with the gate electrode TG of the TFT, where DR3 is the thickness direction of the substrate SUB. The first electrode TTS of the TFT may be disposed on one side of the channel TCH, and the second electrode TD may be disposed on the other side of the channel TCH. The first electrode TTS and the second electrode TD of the TFT may be regions on the third-direction DR3 that do not overlap with the gate electrode TG. The first electrode TTS and the second electrode TD of the TFT may be regions doped with ions in silicon semiconductor or oxide semiconductor to achieve conductivity.

[0073] The gate insulating film 130 can be disposed on the active layer ACT. The gate insulating film 130 can be formed of an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0074] The first gate layer GTL1 can be disposed on the gate insulating film 130. The first gate layer GTL1 may include the gate electrode TG of the thin-film transistor TFT and the first capacitor electrode CAE1 of the capacitor Cst. The first gate layer GTL1 can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0075] The first interlayer insulating film 141 may be disposed on the first gate layer GTL1. The first interlayer insulating film 141 may be formed of an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0076] The second gate layer GTL2 can be disposed on the first interlayer insulating film 141. The second gate layer GTL2 may include the second capacitor electrode CAE2 of the capacitor Cst. The second gate layer GTL2 can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0077] The second interlayer insulating film 142 can be disposed on the second gate layer GTL2. The second interlayer insulating film 142 can be formed of an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0078] A first data metal layer DTL1, including a first connecting electrode CE1, a first sub-pad, and a data line, can be disposed on the second interlayer insulating film 142. The data line can be integrally formed with the first sub-pad, but the embodiments of this disclosure are not limited thereto. The first data metal layer DTL1 can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0079] The first connection electrode CE1 can be connected to the first electrode TTS or the second electrode TD of the thin-film transistor TFT through the first contact hole CT1 passing through the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142.

[0080] A first planarization film 160 may be disposed on a first data metal layer DTL1 to planarize the steps caused by the active layer ACT, the first gate layer GTL1, the second gate layer GTL2, and the first data metal layer DTL1. The first planarization film 160 may be formed of an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0081] A first insulating film 161 may be disposed on a first planarization film 160, and a second data metal layer DTL2 may be disposed on the first insulating film 161. The second data metal layer DTL2 may include a second connection electrode CE2 and a second sub-pad. The second connection electrode CE2 may be connected to the first connection electrode CE1 through a second contact hole CT2 passing through the first insulating film 161 and the first planarization film 160. The second data metal layer DTL2 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0082] The second planarization film 180 can be disposed on the second data metal layer DTL2. The second planarization film 180 can be formed of an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0083] The second insulating film 181 can be disposed on the second planarization film 180, and the third data metal layer DTL3 can be disposed on the second insulating film 181. The third data metal layer DTL3 may include a third connection electrode CE3 and a third sub-pad. The third connection electrode CE3 can be connected to the second connection electrode CE2 through a third contact hole CT3 passing through the second insulating film 181 and the second planarization film 180. The third data metal layer DTL3 can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0084] The third planarization film 190 can be disposed on the third data metal layer DTL3. The third planarization film 190 can be formed of an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0085] A fourth data metal layer, DTL4, can be disposed on the third planarization film 190. The fourth data metal layer, DTL4, may include an anode pad electrode (APD), a cathode pad electrode (CPD), and a fourth sub-pad. The anode pad electrode (APD) can be connected to the third connection electrode (CE3) through a fourth contact hole (CT4) passing through the third planarization film 190. A first power supply voltage, representing a low potential voltage, can be provided to the cathode pad electrode (CPD). The fourth data metal layer, DTL4, can be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0086] The light-emitting element LE is exemplified as a flip-chip microLED, wherein the first contact electrode CTE1 and the second contact electrode CTE2 are arranged facing the anode pad electrode APD and the cathode pad electrode CPD, but are not limited thereto. The light-emitting element LE can be an inorganic light-emitting element made of an inorganic material such as GaN. The light-emitting element LE can have lengths of several micrometers (μm) to hundreds of micrometers in a first direction DR1, a length in a second direction DR2, and a length in a third direction DR3, respectively. For example, the light-emitting element LE can have lengths of about 100 μm or less in the first direction DR1, the second direction DR2, and the third direction DR3, respectively.

[0087] Light-emitting elements (LEs) can be grown and formed on a semiconductor substrate (such as a silicon wafer). Each LE can be directly transferred from the silicon wafer to an anode pad electrode (APD) and a cathode pad electrode (CPD) disposed on a substrate (SUB). In this case, the first contact electrode (CTE1) and the anode pad electrode (APD) can be bonded to each other through a bonding process. Furthermore, the second contact electrode (CTE2) and the cathode pad electrode (CPD) can be bonded to each other through a bonding process. The first contact electrode (CTE1) and the anode pad electrode (APD) can be electrically connected to each other through a bonding electrode (23). Furthermore, the second contact electrode (CTE2) and the cathode pad electrode (CPD) can be electrically connected to each other through the bonding electrode (23).

[0088] In one example, the bonding electrode 23 can be disposed on one side of the light-emitting element LE. The bonding electrode 23 can be a bonding product obtained by pressure melting bonding using a laser. Here, pressure melting bonding refers to a state in which the bonding electrode 23 is heated and melted, and the light-emitting element LE, the anode pad electrode APD, and the cathode pad electrode CPD are melted and mixed, and then cooled and solidified when the laser supply is terminated. Since the light-emitting element LE, the anode pad electrode APD, and the cathode pad electrode CPD maintain conductivity while being cooled and solidified in a molten and mixed state, the anode pad electrode APD, the cathode pad electrode CPD, and the light-emitting element LE can be electrically connected and physically connected, respectively. Therefore, the bonding electrode 23 can be disposed on the first contact electrode CTE1 and the second contact electrode CTE2 of the light-emitting element LE.

[0089] For example, the bonding electrode 23 may include Au, AuSn, PdIn, InSn, NiSn, AgIn, AgSn, Al, Ag, or carbon nanotubes (CNTs). Each of these may be used alone or in combination of two or more.

[0090] Each of the light-emitting elements (LEs) can be a light-emitting structure, which includes a base substrate SPUB, an n-type semiconductor NSEM, an active layer MQW, a p-type semiconductor PSEM, a first contact electrode CTE1, and a second contact electrode CTE2.

[0091] The base substrate SPUB can be a sapphire substrate, but the embodiments disclosed herein are not limited to this.

[0092] An n-type semiconductor NSEM can be disposed on one surface of a base substrate SPUB. For example, an n-type semiconductor NSEM can be disposed on the bottom surface of the base substrate SPUB. The n-type semiconductor NSEM can be made of GaN doped with n-type conductive dopants (such as Si, Ge, Sn, etc.).

[0093] The active quantum well (MQW) layer can be disposed on a portion of a surface of an n-type semiconductor NSEM. The active MQW layer can comprise materials having a single quantum well or multiple quantum well structure. When the active MQW layer comprises a material with a multiple quantum well structure, it can have a structure with multiple well layers and barrier layers alternately stacked. In this case, the well layers can be formed of InGaN, and the barrier layers can be formed of GaN or AlGaN, but are not limited thereto. Optionally, the active MQW layer can have a structure with alternating stacks of semiconductor materials with large band gaps and semiconductor materials with small band gaps, and can include different Group III to Group V semiconductor materials depending on the wavelength of the emitted light.

[0094] In one embodiment of this disclosure, a flip-chip type light-emitting element has been described as an example, but it is not limited thereto, and in another embodiment, a vertical type light-emitting element can be used.

[0095] Figure 5 This is a schematic plan view of a light-emitting element transfer device according to one embodiment. Figure 6 This is a schematic side view of a light-emitting element transfer device according to one embodiment.

[0096] refer to Figure 5 and Figure 6 According to one embodiment, the light-emitting element transfer device can align and combine a first substrate TS and a second substrate DS on which a light-emitting element is disposed, thereby combining the light-emitting element to the first substrate TS.

[0097] The first substrate TS described in this specification is the processing target of the light-emitting element transfer device, and is the substrate on which the light-emitting element is transferred. The first substrate TS in the following description will be primarily based on its being as follows: Figure 4 The case of the substrate SUB of the display device 100 shown will be described.

[0098] The second substrate DS is the processing target of the light-emitting element transfer device, and is a substrate on which a light-emitting element is disposed, and provides the light-emitting element to the first substrate TS.

[0099] Specifically, the light-emitting element transfer device may include a vacuum chamber VC, and a portable chuck 200, a chuck holder 250, an alignment portion 300 and a coupling portion 400 disposed in the vacuum chamber VC.

[0100] A vacuum chamber (VC) provides an internal processing space in which manufacturing processes such as alignment, lamination, bonding, laser irradiation, and movement are performed. A vacuum chamber (VC) provides processing space for vacuum, heating, sound insulation, cooling, vibration-free operation, and waterproofing, and may further include vacuum devices, air extraction devices, purification devices, heating devices, cooling devices, etc.

[0101] For example, a vacuum chamber VC can be maintained in a vacuum state using a vacuum device including a vacuum pump and vacuum valves. For example, the vacuum chamber VC may include a gate valve and a door VCD. The gate valve and door VCD can be located on one side of the vacuum chamber VC. The gate valve can control the opening and closing of the door VCD located on one side of the vacuum chamber VC. A first substrate TS and a second substrate DS can be supplied to the vacuum chamber VC through the door VCD under the control of the gate valve. That is, the gate valve and door VCD provide a path for the first substrate TS and the second substrate DS to enter and exit the vacuum chamber VC. When the bonding process is complete, the vacuum atmosphere in the vacuum chamber VC can be interrupted.

[0102] The portable chuck 200, chuck holder 250, alignment portion 300, and bonding portion 400 can be disposed within the vacuum chamber VC. A portion of the alignment portion 300 and a portion of the bonding portion 400 can be disposed outside the vacuum chamber VC, but the alignment and bonding processes are performed within the same vacuum atmosphere in the vacuum chamber VC. Therefore, problems such as air being trapped between the first substrate TS and the second substrate DS during the alignment and bonding processes, thereby reducing the alignment accuracy or interfering with the transfer of applied pressure, are avoided.

[0103] A portable chuck 200 is disposed within a vacuum chamber VC and can be selectively engaged with an alignment stage 310 and a mating stage 410. The portable chuck 200 is coupled to a chuck holder 250 and can move between the alignment portion 300 and the mating portion 400. For example, the chuck holder 250 can move along a transfer track R disposed within the vacuum chamber VC.

[0104] The first substrate TS, lifted by a transfer component 600 such as a robotic arm, can be loaded onto a portable chuck 200.

[0105] One side of the portable chuck 200 has a wider area than one side of the first substrate TS. One side of the portable chuck 200 may cover the entire first substrate TS. For example, the diameter of the first substrate TS may be about 300 nm, and the diameter of the portable chuck 200 may be from about 350 nm to 650 nm, but is not limited thereto.

[0106] The portable chuck 200 is a clamping device that fixes the first substrate TS to one side, and can be, for example, an electrostatic chuck. The electrostatic chuck is attached to the first substrate TS by electrostatic force. When a potential "+" or "-" is applied to the electrostatic chuck, the object is charged with an opposite potential "+" or "-", and the first substrate TS is attached to and fixed to the electrostatic chuck by utilizing the principle that the charged potential generates an attractive force between them.

[0107] The portable chuck 200 can be equipped with a built-in heater 200-h (see...) Figure 7 The built-in heater 200-h is configured to generate heat, for example, via an electric heater. The heater conducts heat through the portable chuck 200 and heats the first substrate TS supported on the portable chuck 200. The temperature of the first substrate TS or its bonding surface can be adjusted by controlling the amount of heat generated by the heater.

[0108] The chuck retainer 250 supports the portable chuck 200, exposing the top surface of the portable chuck 200. For example, the chuck retainer 250 may support / retain the side surfaces of the portable chuck 200 (e.g., opposite ends or edges). Optionally, the chuck retainer 250 may define an opening in its center.

[0109] The chuck retainer 250 and the portable chuck 200 can be connected.

[0110] For example, the chuck retainer 250 defines a mating groove 250-A, and the portable chuck 200 has a mating protrusion 200-A. The mating protrusions 200-A can be inserted into the mating groove 250-A and are connected to each other. When the mating groove 250-A is engaged with the mating protrusion 200-A, the mating protrusion 200-A can be electrically connected to the mating groove 250-A. Both the mating protrusion 200-A and the mating groove 250-A may include conductive material.

[0111] Power can be supplied to the portable chuck 200 by supplying power to the chuck holder 250. Therefore, when the chuck holder 250 and the portable chuck 200 are connected, the chuck function of the portable chuck 200 is activated, and the portable chuck 200 can be clamped to the first substrate TS. Conversely, when the chuck holder 250 and the portable chuck 200 are separated, the chuck function is deactivated, allowing the portable chuck 200 to be unclamped to the first substrate TS.

[0112] The portable chuck 200 may include a male connector 200-C at the lower portion (see...). Figure 7 The male connector 200-C can be coupled with the alignment stage 310 and the mating stage 410.

[0113] Because the portable chuck 200 can move from the alignment stage 310 to the bonding stage 410 while supporting the first substrate TS bonded to the second substrate DS, deflection occurs at the central portion of the first substrate TS bonded to the second substrate DS as it moves along the same path. This deflection increases with the size of the first substrate TS bonded to the second substrate DS. This deflection can cause the first substrate TS bonded to the second substrate DS to become misaligned with the second substrate DS. To prevent this, a carrier is sometimes used to lift the first substrate TS bonded to the second substrate DS on the carrier. In this case, the carrier may deform and flatten due to heat during the bonding process. This makes the carrier difficult to reuse. Furthermore, due to the deformed carrier, the first substrate TS bonded to the second substrate DS may become misaligned with the second substrate DS.

[0114] Alignment section 300 is a means for aligning and bonding a first substrate TS and a second substrate DS, and may include an alignment stage 310, an upper chuck 350, and a vision member 380. Furthermore, alignment section 300 may also include a lifting member 360 and a driving member 370 for driving the upper chuck 350. For this purpose, the first substrate TS and the second substrate DS may include alignment marks.

[0115] The upper chuck 350 is disposed on the ceiling of the vacuum chamber VC and overlaps with the alignment stage 310. During the alignment process, the upper chuck 350 adsorbs or adheres to the rear surface of the second substrate DS to support the second substrate DS above the first substrate TS. The upper chuck 350 may include a holding mechanism such as a vacuum adsorption method, a mechanical chuck, or an electrostatic chuck. For example, the upper chuck 350 may be an electrostatic chuck, but is not limited thereto.

[0116] Alignment stage 310 can be a high-precision stage (also known as a UVW stage) as the alignment stage. The UVW stage can control the position in three directions: U-axis, V-axis, and W-axis. The UVW stage includes linear motors mounted on each of the U-axis, V-axis, and W-axis directions, and the position can be precisely controlled by individually controlling each linear motor. In one embodiment, a UVW stage is proposed that controls the position in three directions: U-axis, V-axis, and W-axis; however, the UVW stage is a concept that includes an alignment stage that can control the desired position by mounting linear motors on each of the desired position control directions (such as the XYθ direction and the XY direction).

[0117] A linear motor is a type of rotary motor that cuts along the axial direction and generates linear motion force directly through the attractive and repulsive forces between the electromagnetic field of the mover and the permanent magnets (N / S poles) that make up the stator. Compared to traditional ball screws, linear motors have the advantages of low noise and low wear, and can move with precision.

[0118] In this way, the alignment stage 310 achieves high accuracy in position alignment. However, the UVW stage may not be able to withstand high pressing pressure compared to a conventional stage. Therefore, the bonding process is performed on a separate bonding stage 410, rather than performing the bonding process with high pressure applied to the UVW stage.

[0119] The top surface of the alignment stage 310 is plate-shaped and can be engaged with the portable chuck 200 as described above.

[0120] The portable chuck 200 can engage with the alignment stage 310, allowing the first substrate TS supported on the top surface of the portable chuck 200 and the second substrate DS attached to the upper chuck 350 to be precisely aligned. Once aligned, the upper chuck 350 can separate the second substrate DS and attach it to the first substrate TS.

[0121] The lifting component 360 can be mounted on the upper chuck 350, and can raise and lower the upper chuck 350. The lifting component 360 may include lifting and lowering cylinders, etc.

[0122] The drive member 370 is disposed on the top side of the lifting member 360 and can move or rotate the upper chuck 350 upward, downward, left and right in a plane.

[0123] The vision component 380 can identify alignment marks disposed on the first substrate TS and the second substrate DS. For example, the vision component 380 may include at least one camera module. The vision component 380, the lifting component 360, and the driving component 370 are shown disposed outside the vacuum chamber VC, but are not limited thereto. For another example, the vision component 380 may be disposed inside the vacuum chamber VC.

[0124] The bonding portion 400 can apply heat and pressure to the first substrate TS and the second substrate DS transferred in the bonding state, and irradiate with a laser to transfer the light-emitting element disposed on the second substrate DS to the first substrate TS.

[0125] The mating part 400 may include a mating platform 410, a pressure member 440, and a laser member 450.

[0126] The mating table 410 can be mated to and support the portable chuck 200 during the mating process. The mating table 410 can move up and down. The mating table 410 may include drive components, such as lifting and lowering cylinders. The mating table 410 can withstand greater pressure than the alignment table 310.

[0127] The portable chuck 200, mounted on the mating stage 410, generates heat through a built-in heater 200-h to heat the first substrate TS.

[0128] Pressure member 440 is disposed on the ceiling of vacuum chamber VC and overlaps with mating stage 410. Pressure member 440 can pressurize first substrate TS and second substrate DS sequentially disposed on portable chuck 200.

[0129] At least a portion of the pressure member 440 may be made of a transparent material. Therefore, light emitted from the laser member 450 can penetrate the transparent material of the pressure member 440.

[0130] Preferably, glass or ceramic materials are used as transparent materials. Transparent materials are not necessarily intended to be transparent to the naked eye, but rather to consist of materials through which only light emitted by a light source can pass.

[0131] The laser component 450 may include a drive system that can move up, down, left, and right on one side. The laser component 450 may be disposed on top of the pressure component 440 to irradiate the first substrate TS and the second substrate DS with a laser.

[0132] The laser component 450 can be configured in various forms, such as continuous irradiation of a specific area or scanning.

[0133] The transfer member 600 can be a robot or the like, and can load the first substrate TS or the second substrate DS, which is placed in a box CS outside the vacuum chamber VC, onto a portable chuck 200 inside the vacuum chamber VC, or unload the first substrate TS, which is combined with the second substrate DS, inside the vacuum chamber VC.

[0134] Figure 7 and Figure 8 It is based on Figure 5 and Figure 6 Enlarged view of the portable chuck, chuck holder, and alignment stage according to the embodiment. Figure 7 This diagram shows the portable chuck 200 and the alignment stage 310 separated. Figure 8 This diagram shows the portable chuck 200 and the alignment stage 310 in their combined state.

[0135] refer to Figure 7The portable chuck 200 is connected to the chuck holder 250. Therefore, the portable chuck 200 engages with the chuck holder 250 and receives electricity to clamp the first substrate TS.

[0136] The portable chuck 200 can be connected to the alignment stage 310.

[0137] The portable chuck 200 may include a male connector 200-C for engagement, and the alignment stage 310 may include a female connector 300-C, but is not limited thereto. In another embodiment, the portable chuck 200 may include a female connector 300-C, and the alignment stage 310 may include a male connector 200-C.

[0138] In one embodiment, the male connector 200-C may be an air clamp, and the female connector 300-C may be a positioning ring. Therefore, one of the male connector 200-C and the female connector 300-C is configured to be supplied with air and can be switched to a clamped state, connecting and securing them to each other, depending on whether air is supplied. The following assumptions are for ease of description only, and this disclosure is not limited thereto.

[0139] In one embodiment, a fastening member may be formed in an air clamp corresponding to the male connector 200-C, and a fastening groove may be defined in a locating ring corresponding to the female connector 300-C.

[0140] When a fastening member is formed in the male connector 200-C, an air path can be formed in the male connector 200-C, thereby allowing air to be supplied to the male connector 200-C. Therefore, each male connector 200-C can be connected to a pneumatic control unit via the air path. Thus, depending on the air supplied from the pneumatic control unit, a specific level or higher air pressure can be applied to the male connector 200-C.

[0141] When the male connector 200-C is formed in the portable chuck 200, the air path connected to the male connector 200-C can be formed at the point of the portable chuck 200 corresponding to the male connector 200-C.

[0142] Simultaneously, when the male connector 200-C is formed in the portable chuck 200, the female connector 300-C can be formed in the alignment stage 310 connected to the portable chuck 200 at a position corresponding to each male connector 200-C. When the portable chuck 200 and the alignment stage 310 are closer to each other, the insertion portion C1 of each male connector 200-C formed in each portable chuck 200 can be inserted into the insertion slot C2 defined in the alignment stage 310 of each female connector 300-C according to the movement.

[0143] When the air supplied to the male connector 200-C along the air path is blocked and the applied air pressure is reduced to below a certain level, the male connector 200-C (i.e., the blocking member that prevents the fastening member embedded in the insertion portion C1 of the air clamp from protruding outward) can be moved by the elastic force of the elastic body connected to the blocking member. Then, depending on the movement of the blocking member, the fastening member can be moved to a position corresponding to the through hole defined in the insertion portion C1, and a portion of the fastening member can protrude to the outside through the through hole.

[0144] Then, as described above, when the insertion portion C1 of the male connector 200-C is inserted into the insertion groove C2 of the female connector 300-C (i.e., the positioning ring), the insertion portion C1 and the insertion groove C2 can be connected to each other, and at the same time, the outwardly protruding portion of the fastening member is locked in the fastening groove formed in the insertion groove C2, thereby placing the male connector 200-C and the female connector 300-C in a clamped state where the male connector 200-C and the female connector 300-C are connected and fixed.

[0145] When air is applied to the male connector 200-C again along the air path and the air pressure applied to the male connector 200-C increases to a certain level or higher, the blocking member built into the insertion portion C1 of the male connector 200-C can move to its initial position according to the applied air pressure. The blocking member can then push the fastening member. Therefore, the fastening member can move inward. Since the fastening member is subsequently fully embedded inside the male connector 200-C, the fastening caused by engagement with the fastening groove is released, and the connection between the insertion portion C1 and the insertion groove C2 can be released. In other words, the clamped state in which the male connector 200-C and the female connector 300-C are connected and fixed can be released.

[0146] In this way, the air clamp uses the characteristic of changing to a clamping state or a de-clamping state when air is supplied from the pneumatic control unit or when the air supply is cut off, so that in one embodiment, the portable chuck 200 and the alignment stage 310 can be coupled and fixed, or the coupling state between the coupled portable chuck 200 and the alignment stage 310 can be released.

[0147] In this way, a separate pneumatic control unit can be provided for connecting and securing the portable chuck 200 and the alignment stage 310, or for disconnecting the portable chuck 200 and the alignment stage 310.

[0148] Figure 8The first substrate TS is shown in a clamped state, and the insertion portion C1 of the air clamp (which is the male connector 200-C of the portable chuck 200) is inserted into the insertion slot C2 of the positioning ring (which is the female connector 300-C of the alignment stage 310) and changed to a clamped state, so that the portable chuck 200 and the alignment stage 310 can be connected.

[0149] Therefore, the portable chuck 200 and the first substrate TS on the portable chuck 200 can also be moved in the same manner according to the movement for alignment of the alignment stage 310.

[0150] Figure 9 and Figure 10 It is based on Figure 5 and Figure 6 Enlarged view of the portable chuck, chuck holder, and coupling stage according to the embodiment. Figure 9 This diagram shows the portable chuck 200 and the coupling table 410 separated. Figure 10 This diagram shows the portable chuck 200 and the coupling table 410 in a coupled state.

[0151] refer to Figure 9 and Figure 10 The portable chuck 200 is connected to the chuck holder 250. Therefore, the portable chuck 200 engages with the chuck holder 250 and receives electricity to clamp the first substrate TS.

[0152] The portable chuck 200 can be engaged with the mating table 410.

[0153] The portable chuck 200 may include a male connector 200-C for engagement, and the engagement platform 410 may include a female connector 400-C, but is not limited thereto. In another embodiment, the portable chuck 200 may include a female connector 400-C, and the engagement platform 410 may include a male connector 200-C.

[0154] In one embodiment, the male connector 200-C may be an air clamp, and the female connector 400-C may be a locating ring. Therefore, the male connector 200-C or the female connector 400-C may be configured to supply air and may transition to a clamped state, connecting and securing them to each other, depending on whether air is supplied. The following assumptions are for ease of description only, and this disclosure is not limited thereto.

[0155] In one embodiment, a fastening member may be formed in an air clamp corresponding to the male connector 200-C, and a fastening groove may be formed in a positioning ring corresponding to the female connector 400-C.

[0156] When the male connector 200-C is formed in the portable chuck 200, the female connector 400-C can be formed in the mating platform 410 connected to the portable chuck 200 at a position corresponding to each male connector 200-C. When the portable chuck 200 and the mating platform 410 are closer to each other, the insertion portion C1 of each male connector 200-C formed in each portable chuck 200 can be inserted into the insertion slot C2 of each female connector 400-C formed in the mating platform 410 according to the movement.

[0157] For reference Figure 7 and Figure 8 As described, the air clamp can switch to a clamping state or a de-clamping state when air is supplied from the pneumatic control unit or when the air supply is cut off. By utilizing this feature, the portable chuck 200 and the coupling table 410 can be connected and secured, or the connected portable chuck 200 and the coupling table 410 can be released.

[0158] In this way, a pneumatic control unit can be set up separately for connecting and fixing the portable chuck 200 and the coupling table 410, or disconnecting the portable chuck 200 and the coupling table 410.

[0159] Figure 10 The first substrate TS is shown in a clamped state, and the insertion portion C1 of the air clamp (which is the male connector 200-C of the portable chuck 200) is inserted into the insertion slot C2 of the positioning ring (which is the female connector 400-C of the mating stage 410) and changes to a clamped state, so that the portable chuck 200 and the mating stage 410 can be connected.

[0160] During the bonding process, the bonding stage 410 can support the first substrate TS bonded to the second substrate DS, while applying pressure to the first substrate TS bonded to the second substrate DS disposed on the portable chuck 200.

[0161] Figure 11 This is a view showing the inverted state of a portable chuck according to another embodiment.

[0162] refer to Figure 11 The portable chuck 200 can be coupled to the chuck holder 250 as described above to clamp the first substrate TS disposed on one side (or the first substrate TS coupled to the second substrate DS).

[0163] The chuck retainer 250 can flip / invert the portable chuck 200. In one embodiment, the portable chuck 200 can be flipped so that the front side (i.e., top surface) of the portable chuck 200 faces down and the rear side (i.e., bottom surface) of the portable chuck 200 faces up.

[0164] In this way, even if the portable chuck 200 is flipped over, the first substrate TS can be fixed to one side (i.e., the front side) of the portable chuck 200 due to the clamping state of the portable chuck 200.

[0165] Figure 12 This is a flowchart illustrating a light-emitting element transfer method using a light-emitting element transfer device according to one embodiment. Figures 13 to 21 This is a schematic diagram of a light-emitting element transfer device, illustrating a light-emitting element transfer method according to one embodiment. Figures 13 to 20 This can be used as a reference. Figures 5 to 10 A light-emitting element transfer device.

[0166] First, the first substrate TS is placed on the top surface of the chuck holder 250. Figure 12 (S110 in the middle).

[0167] refer to Figure 13 and Figure 14 The first substrate TS is positioned on the chuck holder 250 by a transfer member 600, such as a robot. The chuck holder 250 supports at least a portion of the edge of the first substrate TS. When the chuck holder 250 supports at least a portion of the edge of the first substrate TS, the center of the first substrate TS may bend downwards due to its own weight.

[0168] refer to Figure 15 The first substrate TS is placed on the top surface of the portable chuck 200. The portable chuck 200 is connected to the alignment stage 310.

[0169] refer to Figure 16 The portable chuck 200 and the chuck holder 250 are combined. The engagement groove 250-A of the chuck holder 250 and the engagement protrusion 200-A of the portable chuck 200 can be connected to each other. As a result, the portable chuck 200 can clamp the first substrate TS.

[0170] Second, align the first substrate TS and the second substrate DS, and combine the first substrate TS and the second substrate DS together. Figure 12 (S120 in the middle).

[0171] refer to Figure 16 The first substrate TS and the second substrate DS are aligned. For example, the upper chuck 350 secures the rear surface of the second substrate DS. The light-emitting element disposed on the second substrate DS can be positioned facing the first substrate TS.

[0172] Using visual components ( Figure 6(380) Check the alignment marks of the first substrate TS and the second substrate DS, and move the alignment stage 310 based on the alignment marks to align the first substrate TS and the second substrate DS.

[0173] Subsequently, refer to Figure 17 The first substrate TS and the second substrate DS are joined together. For example, the upper chuck 350 is not clamped to release the fixation of the second substrate DS, thereby separating the second substrate DS from the upper chuck 350 to allow the first substrate TS and the second substrate DS to join together.

[0174] Third, move the portable chuck 200 to the mating table 410 ( Figure 12 (S130 in the middle).

[0175] For example, refer to Figure 18 The portable chuck 200 releases the alignment stage 310 and the gas clamp from engagement and separates from each other. The portable chuck 200 remains connected to the chuck holder 250. In this way, the portable chuck 200 can maintain the first substrate TS in a fixed state.

[0176] refer to Figure 19 The portable chuck 200 moves along the transfer track R to position the first substrate TS above the bonding stage 410 in the same chamber.

[0177] Fourth, connect the portable chuck 200 and the mating table 410, and perform the mating process. Figure 12 (S140 in the middle).

[0178] refer to Figure 20 When the portable chuck 200 is positioned close to the top surface of the mating table 410, the male connector 200-C of the portable chuck 200 can be mated to the female connector 400-C of the mating table 410.

[0179] Afterward, a bonding process can be performed. For example, the pressure member 440 can pressurize the first substrate TS and the second substrate DS, which are sequentially disposed on the portable chuck 200.

[0180] Power can be supplied to the built-in heater 200-h embedded in the portable chuck 200 to heat up the built-in heater 200-h, thereby conducting heat to the portable chuck 200, and thus transferring heat to the first substrate TS or the connection between the first substrate TS and the second substrate DS.

[0181] In one embodiment, the laser component 450 can irradiate a first substrate TS or a boundary between a second substrate DS and a first substrate TS bonded to the second substrate DS on top of the pressure component 440. The laser beam emitted from the laser component 450 can penetrate through the pressure component 440 to irradiate either the first substrate TS bonded to the second substrate DS or the boundary between the second substrate DS and the first substrate TS.

[0182] The laser component 450 can be implemented using various laser irradiation methods, such as continuous irradiation of a specific area or scanning.

[0183] refer to Figure 20 During the bonding process, the bonding table 410 can securely support the portable chuck 200.

[0184] Then, refer to Figure 21 When the bonding process is complete, the portable chuck 200 is released from the bonding stage 410, and the vacuum chamber VC can be devastated.

[0185] The first substrate TS, which is combined with the second substrate DS, can be transferred while being placed on the portable chuck 200. Therefore, the portable chuck 200 can also be used as a carrier or tray.

[0186] Although embodiments of the present disclosure have been described above with reference to the accompanying drawings, those skilled in the art will understand that the present disclosure may be implemented in other specific forms without altering its technical concept or essential characteristics. Therefore, the embodiments described above should be understood in all respects as illustrative rather than restrictive.

Claims

1. A light-emitting element transfer device, comprising: A vacuum chamber is used to create or remove a vacuum atmosphere inside. An alignment stage is located within the vacuum chamber and is movable along three axes; A bonding stage is disposed within the vacuum chamber and is capable of vertical movement. A portable chuck with a built-in heater and capable of selectively connecting to the alignment stage and the coupling stage; as well as A chuck holder, coupled to the portable chuck and movable within the vacuum chamber between the alignment stage and the coupling stage. The portable chuck engages with the chuck holder to clamp the first substrate onto the top surface of the portable chuck, and separates from the chuck holder so that the first substrate is not clamped onto the top surface.

2. The light-emitting element transfer device according to claim 1, wherein, The portable chuck also includes a male connector for engaging with the alignment stage and the coupling stage.

3. The light-emitting element transfer device according to claim 2, wherein, The male connector includes an insertion portion formed such that a portion of its built-in fastening member protrudes outward. The alignment stage and the mating stage each have a groove-shaped female connector, which is formed on the top surface of the alignment stage and the mating stage at a position corresponding to the male connector and engages with the male connector.

4. The light-emitting element transfer device according to claim 3, wherein, The male connector is a pneumatic clamp. The female connector is a positioning ring corresponding to the air clamp.

5. The light-emitting element transfer device according to claim 1, wherein, The portable chuck is an electrostatic chuck.

6. The light-emitting element transfer device according to claim 1, wherein, The portable chuck includes a coupling protrusion. The chuck retainer defines a mating groove, and the mating protrusion is inserted into and engages within the mating groove. The connecting protrusion and the connecting groove are electrically connected by engagement.

7. The light-emitting element transfer device according to claim 1, wherein, The chuck retainer supports at least a portion of the side surface of the portable chuck, thereby exposing the top surface of the portable chuck.

8. The light-emitting element transfer device according to claim 1 further includes an upper chuck, a second substrate on which a light-emitting element is disposed is attached to the upper chuck, and the upper chuck is configured to overlap with the alignment stage in a plan view.

9. The light-emitting element transfer device according to claim 8, wherein, The upper chuck clamps the second substrate and can move up and down.

10. The light-emitting element transfer device according to claim 8, further comprising a visual component for capturing the positions of the first substrate and the second substrate.

11. The light-emitting element transfer device according to claim 8, further comprising: A pressure member is disposed on the bonding platform to apply pressure to the first substrate, which is bonded to the second substrate disposed on the bonding platform, and to transmit laser light. as well as A laser component that emits laser light from above the pressure component onto the first substrate which is bonded to the second substrate disposed on the bonding stage.

12. The light-emitting element transfer device according to claim 1, wherein, The chuck retainer inverts the portable chuck.

13. The light-emitting element transfer device according to claim 8, wherein, The vacuum chamber includes a door located on one side of the vacuum chamber. The first substrate or the second substrate enters and exits the vacuum chamber through the chamber door.

14. A method for transferring a light-emitting element, comprising: The first substrate is placed on the top surface of the chuck holder; Engage the chuck holder with the portable chuck so that the portable chuck clamps the first substrate; The first substrate disposed on the portable chuck is aligned with the second substrate clamped by the upper chuck using an alignment stage that engages with the portable chuck. Separate the second substrate from the upper chuck to combine the first substrate and the second substrate; Separate the portable chuck from the alignment stage; The portable chuck is transferred to the mating stage via the chuck retainer to engage the portable chuck and the mating stage; as well as Perform the bonding process between the first substrate and the second substrate.

15. The method according to claim 14, wherein, Engaging the chuck retainer to the portable chuck includes: The engaging protrusion of the portable chuck is inserted into the engaging groove of the chuck retainer, thereby connecting the portable chuck and the chuck retainer to each other. The connecting protrusion and the connecting groove are electrically connected, thereby generating an electrostatic force in the portable chuck to clamp the first substrate.

16. The method of claim 14, wherein, When separating the second substrate from the upper chuck The upper chuck stops adsorbing or stops holding the second substrate.

17. The method of claim 16, further comprising: The positions of the first substrate and the second substrate are captured by a vision component.

18. The method according to claim 14, wherein, When separating the portable chuck from the alignment stage The portable chuck is separated from the alignment stage by separating the male connector of the portable chuck from the female connector of the alignment stage.

19. The method according to claim 18, wherein, Transferring the portable chuck to the mating stage includes: While connecting the chuck retainer to the portable chuck, the chuck retainer is moved along the transfer track to the mating stage, and Bring the portable chuck close to the mating table, such that the male connector of the portable chuck is connected to the female connector of the mating table.

20. The method according to claim 19, wherein, Performing the bonding process includes: The first substrate, which is bonded to the second substrate disposed on the portable chuck, is pressed by a pressure member, and Power is supplied to the heater built into the portable chuck to heat the heater and conduct the heat to the portable chuck, such that the heat is transferred to the first substrate or the junction between the first substrate and the second substrate.

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